JP2020155608A - Wiring board and manufacturing method of the wiring board - Google Patents

Abstract

To adjust an elongation of a wiring board in accordance with a location.SOLUTION: A wiring board 10 comprises a wiring 52 which contains a first region 31 and a second region 32 which are opposite while having a gap in a first direction D1; an intermediate region 33 containing a first end 331 connected to the first region 31 and a second end 332 connected to the second region 32, and contains: a base material 20 having an elastic property; a first part 61 positioned in the first region 31; a second part 62 positioned at the second region 32; and an intermediate part 63 positioned in the intermediate region 33, and connected to the first part 61 and the second part 62. The intermediate region 33 of the base material 20 includes a plurality of telescopic structure parts 34 arranged between the first region 31 and the second region 32. Each of the telescopic structure parts 34 contains a first element and a second element which are extended to a direction crossed to the first direction and is opposite to the first direction D1; and a connection element connecting the first and second elements.SELECTED DRAWING: Figure 1

Description

An embodiment of the present disclosure relates to a wiring board including a stretchable base material and wiring, and a method for manufacturing the same.

In recent years, research has been conducted on wiring boards having deformability such as elasticity. For example, there are known ones in which elastic silver wiring is formed on an elastic base material and one in which horseshoe-shaped wiring is formed on an elastic base material (see, for example, Patent Document 1). However, these types of wiring boards have a problem that the resistance value of the wiring easily changes as the base material expands and contracts.

As another type of wiring board, for example, Patent Document 2 discloses a wiring board having a base material and wiring provided on the base material and having elasticity. Patent Document 2 employs a manufacturing method in which a circuit is provided on a pre-stretched base material, and the base material is relaxed after the circuit is formed. Patent Document 2 intends to operate the thin film transistor on the substrate satisfactorily in both the extended state and the relaxed state of the substrate.

Japanese Unexamined Patent Publication No. 2013-187308 JP-A-2007-281406

When the base material is in a relaxed state, the wiring provided on the base material has a bellows-shaped portion in which peaks and valleys repeatedly appear along the in-plane direction of the base material. In this case, when the base material is stretched, the wiring can follow the stretch of the base material by expanding the bellows-shaped portion in the in-plane direction. Therefore, according to the type of wiring board having the bellows-shaped portion, it is possible to suppress the change in the resistance value of the wiring as the base material expands and contracts.

By the way, the extensibility required for a wiring board may differ depending on the location. For example, a part of the wiring board is required to have a first extensibility, but another part of the wiring board may be required to have a second extensibility lower than the first extensibility. For example, when the wiring board is attached to a human arm, the portion of the wiring board that overlaps the elbow is required to have higher extensibility than the other portions. On the other hand, in a type of wiring board having a bellows-shaped portion, the extensibility of the wiring board is mainly determined based on the elongation rate of the base material in the manufacturing process of the wiring board. In this case, if a part of the wiring board is to have the first extensibility, the entire base material is elongated at an elongation rate corresponding to the first extensibility in the manufacturing process of the wiring board. As a result, the first extensibility is imparted to the portion of the wiring board where only the second extensibility is required.

An object of the present disclosure is to provide a wiring board and a method for manufacturing a wiring board that can effectively solve such a problem.

In one embodiment of the present disclosure, a first region and a second region facing each other at intervals in the first direction, and a first end connected to the first region and a second region connected to the second region are connected. An intermediate region including two ends, a stretchable substrate, a first portion located in the first region, a second portion located in the second region, and an intermediate region located in the intermediate region. A plurality of wirings including the first portion and an intermediate portion connected to the second portion are provided, and the intermediate region of the base material is arranged between the first region and the second region. The telescopic structure portion extends in a direction intersecting the first direction and faces the first element and the second element in the first direction, and the first element and the second element. A wiring board that includes a connecting element that connects to and.

In the wiring board according to the embodiment of the present disclosure, the minimum value of the distance between the first element and the second element may be smaller than 0.4 times the arrangement period of the plurality of the telescopic structure portions. ..

In the wiring board according to the embodiment of the present disclosure, the minimum value of the distance between the first element and the second element may be smaller than 0.3 times the arrangement period of the plurality of the telescopic structure portions. ..

In the wiring board according to the embodiment of the present disclosure, the maximum value of the distance between the first element and the second element may be larger than 0.3 times the arrangement period of the plurality of the telescopic structure portions. ..

In the wiring board according to the embodiment of the present disclosure, the wiring may have a bellows-shaped portion including a plurality of peaks and valleys arranged in a direction in which the wiring extends.

In the wiring board according to the embodiment of the present disclosure, the wiring is located on the first surface side of the base material, and the bellows shape of the wiring among the surfaces of the wiring board on the first surface side of the base material. The amplitude of the peaks and valleys appearing in the overlapping portions is applied to the bellows-shaped portion of the wiring among the surfaces of the wiring board on the side of the second surface located on the opposite side of the first surface of the base material. It may be larger than the amplitude of the peaks and valleys appearing in the overlapping portions.

In the wiring board according to the embodiment of the present disclosure, the wiring is located on the first surface side of the base material, and the bellows shape of the wiring among the surfaces of the wiring board on the first surface side of the base material. The period of the peaks and valleys appearing in the overlapping portions is formed on the bellows-shaped portion of the wiring among the surfaces of the wiring board on the side of the second surface located on the opposite side of the first surface of the base material. It may be smaller than the period of the peaks and valleys appearing in the overlapping portion.

In the wiring board according to the embodiment of the present disclosure, the wiring is located on the first surface side of the base material, and the bellows shape of the wiring among the surfaces of the wiring board on the first surface side of the base material. The positions of the peaks and valleys appearing in the overlapping portions are located on the bellows-shaped portion of the wiring among the surfaces of the wiring board on the side of the second surface located on the opposite side of the first surface of the base material. It may deviate from the positions of the peaks and valleys that appear in the overlapping portions.

In the wiring board according to the embodiment of the present disclosure, the wiring is located on the first surface side of the base material, the wiring board is located on the first surface side of the base material, and has a lower elastic modulus than the wiring. An adjustment layer having a coefficient may be provided.

In the wiring substrate according to the embodiment of the present disclosure, the base material may contain a thermoplastic elastomer, silicone rubber, urethane gel or silicon gel.

The wiring board according to the embodiment of the present disclosure may further include a support board.

In the wiring board according to the embodiment of the present disclosure, the support substrate may have a higher elastic modulus than the base material and may support the wiring.

In the wiring board according to the embodiment of the present disclosure, the support board may contain polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, or polyethylene terephthalate.

The wiring board according to one embodiment of the present disclosure may further include electronic components that are electrically connected to the wiring in at least one of the first region and the second region of the base material.

One embodiment of the present disclosure is a method for manufacturing a wiring substrate, in which tension is applied to a stretchable base material in at least one of the in-plane directions of the first surface of the base material. A stretching step of extending the base material, a wiring forming step of providing wiring on the first surface side of the base material stretched by the stretching step, and a partial cutting of the base material to form the base. The material includes a first region and a second region facing each other at intervals in the first direction, a first end connected to the first region, and a second end connected to the second region. The wiring comprises an intermediate region and a cutting step for partitioning into, and the wiring reaches the second region from the first region of the base material through the intermediate region, and the intermediate region of the base material is: It has a plurality of telescopic structure portions arranged between the first region and the second region, and the telescopic structure portion extends in a direction intersecting the first direction and faces the first element in the first direction. A method for manufacturing a wiring board, which includes a second element and a connecting element that connects the first element and the second element.

The method for manufacturing a wiring board according to an embodiment of the present disclosure may include a shrinkage step of removing the tension from the base material after the cutting step.

In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the wiring forming step includes a step of forming wiring on the support board and a step of attaching the support board to the first surface side of the stretched base material. , May have.

The method for manufacturing a wiring board according to an embodiment of the present disclosure may include a shrinkage step of removing the tension from the base material after the wiring formation step and before the cutting step.

According to the embodiment of the present disclosure, the extensibility of the wiring board can be adjusted according to the location.

It is a top view which shows the wiring board which concerns on one Embodiment. This is an example of a cross-sectional view taken along the line AA of the wiring board of FIG. It is another example of the cross-sectional view along the line AA of the wiring board of FIG. It is a top view which shows the example of the intermediate region of a base material enlarged. It is a top view which shows the other example of the intermediate region of a base material enlarged. It is a top view which shows the other example of the intermediate region of a base material enlarged. It is a top view which shows the other example of the intermediate region of a base material enlarged. It is sectional drawing which shows the example of the bellows-shaped part generated in the wiring board enlarged. It is an enlarged plan view which shows an example of the bellows-shaped part generated in a wiring board. It is sectional drawing which shows the other example of the bellows-shaped part generated in the wiring board enlarged. It is sectional drawing which shows the other example of the bellows-shaped part generated in the wiring board enlarged. It is a top view for demonstrating an example of the manufacturing method of a wiring board. It is sectional drawing for demonstrating an example of the manufacturing method of a wiring board. It is a figure which shows a part of the wiring board in the state which is attached to the object. It is a figure which shows a part of the wiring board in the state which is attached to the object. It is sectional drawing which shows the wiring board which concerns on 1st modification. It is sectional drawing which shows the example of the bellows-shaped part generated in the wiring board enlarged. It is sectional drawing which shows the wiring board which concerns on the 2nd modification. It is sectional drawing which shows the wiring board of FIG. 17 enlarged. It is a figure for demonstrating the manufacturing method of the wiring board which concerns on the 2nd modification.

Hereinafter, the configuration of the wiring board and the manufacturing method thereof according to the embodiment of the present disclosure will be described in detail with reference to the drawings. The embodiments shown below are examples of the embodiments of the present disclosure, and the present disclosure is not construed as being limited to these embodiments. Further, in the present specification, terms such as "board", "base material", "sheet" and "film" are not distinguished from each other based only on the difference in names. For example, "substrate" is a concept that includes a base material, a member that can be called a sheet or a film. Furthermore, as used herein, terms such as "parallel" and "orthogonal" and values of length and angle that specify the shape and geometric conditions and their degrees are bound by strict meaning. Instead, the interpretation will include the range in which similar functions can be expected. Further, in the drawings referred to in the present embodiment, the same parts or parts having similar functions are designated by the same reference numerals or similar reference numerals, and the repeated description thereof may be omitted. In addition, the dimensional ratio of the drawing may differ from the actual ratio for convenience of explanation, or a part of the configuration may be omitted from the drawing.

Hereinafter, an embodiment of the present disclosure will be described with reference to FIGS. 1 to 14.

(Wiring board)
First, the wiring board 10 according to the present embodiment will be described. FIG. 1 is a plan view showing the wiring board 10. FIG. 2 is an example of a cross-sectional view taken along the line AA of the wiring board of FIG. The wiring board 10 includes at least a base material 20 and a wiring 52. The wiring board 10 may include an electronic component 51. Hereinafter, each component of the wiring board 10 will be described.

〔Base material〕
The base material 20 is a member configured to have elasticity in at least one direction. The base material 20 includes a first surface 21 located on the wiring 52 side and a second surface 22 located on the opposite side of the first surface 21. Further, when viewed along the normal direction of the first surface 21 of the base material 20, the base material 20 has the first region 31 and the second region 32 facing each other at intervals in the first direction D1 and the first Includes an intermediate region 33 located between the region 31 and the second region 32. The first region 31, the second region 32, and the intermediate region 33 may be integrally configured. For example, the first region 31, the second region 32, and the intermediate region 33 may be formed by cutting a single base material with a laser or the like. The first direction D1 is one direction in the in-plane direction of the first surface 21 of the base material 20. In the following description, viewing the wiring board 10 or the components of the wiring board 10 along the normal direction of the first surface 21 is also simply referred to as "planar view".

In the present embodiment, the base material 20 has elasticity at least in the first direction D1. The base material 20 may have elasticity in a direction other than the first direction D1. For example, the base material 20 may have elasticity in the first direction D1 and the second direction D2 orthogonal to the second direction D2.

The thickness of the base material 20 is, for example, 10 μm or more and 10 mm or less, and more preferably 20 μm or more and 3 mm or less. By setting the thickness of the base material 20 to 10 μm or more, the durability of the base material 20 can be ensured. Further, by reducing the thickness of the base material 20 to 10 mm or less, the mounting comfort of the wiring board 10 can be ensured. If the thickness of the base material 20 is made too small, the elasticity of the base material 20 may be impaired.

The elasticity of the base material 20 means that the base material 20 can expand and contract, that is, it can be expanded from a normal non-extended state and can be restored when released from this extended state. The property that can be done. The non-extended state is the state of the base material 20 when no tensile stress is applied. In the present embodiment, the stretchable substrate can preferably be stretched by 1% or more from the non-stretched state without being destroyed, more preferably 20% or more, and further preferably 75%. It can be extended as described above. By using the base material 20 having such an ability, the wiring board 10 can have elasticity as a whole. Further, the wiring board 10 can be used in products and applications that require high expansion and contraction, such as being attached to a part of the body such as a human arm. It is generally said that a product mounted under the armpit of a person needs to have an elasticity of 72% in the vertical direction and 27% in the horizontal direction. In addition, it is said that products attached to human knees, elbows, buttocks, ankles, and armpits need to have elasticity of 26% or more and 42% or less in the vertical direction. It is also said that products that are attached to other parts of the human body need to have less than 20% elasticity.

Further, it is preferable that the difference between the shape of the base material 20 in the non-stretched state and the shape of the base material 20 when the base material 20 is stretched from the non-stretched state and then returned to the non-stretched state is small. This difference is also referred to as a shape change in the following description. The shape change of the base material 20 is, for example, 20% or less, more preferably 10% or less, still more preferably 5% or less in terms of area ratio. By using the base material 20 having a small shape change, it becomes easy to form peaks and valleys, which will be described later.

An example of a parameter representing the elasticity of the base material 20 is the elastic modulus of the base material 20. The elastic modulus of the base material 20 is, for example, 10 MPa or less, more preferably 1 MPa or less. By using the base material 20 having such an elastic modulus, the entire wiring board 10 can be made elastic. In the following description, the elastic modulus of the base material 20 is also referred to as a first elastic modulus. The first elastic modulus of the base material 20 may be 1 kPa or more.

As a method for calculating the first elastic modulus of the base material 20, a method of carrying out a tensile test in accordance with JIS K6251 using a sample of the base material 20 can be adopted. It is also possible to adopt a method in which the elastic modulus of the sample of the base material 20 is measured by the nanoindentation method in accordance with ISO14577. A nanoindenter can be used as the measuring instrument used in the nanoindentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 10 as a sample and a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample can be considered. Be done. In addition, as a method of calculating the first elastic modulus of the base material 20, the materials constituting the base material 20 are analyzed, and the first elastic modulus of the base material 20 is calculated based on the existing database of the materials. It is also possible to adopt the method. The elastic modulus in the present application is an elastic modulus in an environment of 25 ° C.

Another example of a parameter representing the elasticity of the base material 20 is the flexural rigidity of the base material 20. The flexural rigidity is the product of the moment of inertia of area of the target member and the elastic modulus of the material constituting the target member, and the unit is N · m ² or Pa · m ⁴ . The moment of inertia of area of the base material 20 is calculated based on the cross section when the portion of the base material 20 that overlaps with the wiring 52 is cut by a plane orthogonal to the expansion / contraction direction of the wiring board 10.

Examples of the material constituting the base material 20 include an elastomer. Further, as the material of the base material 20, for example, a cloth such as a woven fabric, a knitted fabric, or a non-woven fabric can be used. As the elastomer, general thermoplastic elastomers and thermosetting elastomers can be used, and specifically, polyurethane-based elastomers, styrene-based elastomers, nitrile-based elastomers, olefin-based elastomers, vinyl chloride-based elastomers, ester-based elastomers, etc. Amid-based elastomers, 1,2-BR-based elastomers, fluoroelastomers, silicone rubbers, urethane rubbers, fluororubbers, polybutadienes, polyisobutylenes, polystyrene butadienes, polychloroprenes and the like can be used. Considering mechanical strength and abrasion resistance, it is preferable to use a urethane-based elastomer. Further, the base material 20 may contain silicone such as polydimethylsiloxane. Silicone is excellent in heat resistance, chemical resistance, and flame retardancy, and is preferable as a material for the base material 20.

The shapes of the first region 31, the second region 32, and the intermediate region 33 will be described. As shown in FIG. 1, the first region 31 and the second region 32 have a quadrangular shape including a pair of sides extending in the first direction D1 and a pair of sides extending in the second direction D2 in a plan view. You may be.

FIG. 4 is an enlarged plan view showing an example of the intermediate region 33 of the base material 20. As shown in FIGS. 1 and 4, the intermediate region 33 includes a first end 331 connected to the first region 31 and a second end 332 connected to the second region 32. Further, the intermediate region 33 has a plurality of elastic structure portions 34 arranged between the first region 31 and the second region 32. The direction in which the plurality of telescopic structure portions 34 are arranged may be parallel to the first direction D1.

The telescopic structure portion 34 is configured to be deformed so as to increase the dimension in the first direction D1 when a force in a direction for widening the distance between the first region 31 and the second region 32 is applied to the base material 20. Has been done. For example, as shown in FIG. 4, the telescopic structure portion 34 extends in a direction intersecting the first direction D1 and faces the first element 35 and the second element 36 in the first direction D1, and the first element 35 and the second. Includes a connection element 37 that connects the element 36. As described above, the telescopic structure portion 34 has a so-called zigzag shape.

In FIG. 4, the first element 35 and the second element 36 extend at least partially linearly in the second direction D2 orthogonal to the first direction D1, and the connecting element 37 extends at least partially in the first direction D1. An example of extending linearly is shown in. Although not shown, the first element 35 and the second element 36 may extend in a direction intersecting both the first direction D1 and the second direction D2.

In FIG. 4, reference numeral K1 represents an arrangement period of the plurality of telescopic structure portions 34. The arrangement period is calculated, for example, by measuring the distance between the center points of the stretchable structure portions 34 over a certain range in the direction in which the stretchable structure portions 34 are arranged and calculating the average thereof. The center point of the telescopic structure portion 34 is an intermediate point in the first direction D1 between the first element 35 and the second element 36.

Further, the reference numeral K2 represents the minimum value of the interval between the first element 35 and the second element 36. In the example shown in FIG. 4, the distance between the first element 35 and the second element 36 is constant regardless of the position in the second direction D2.

The minimum value K2 of the distance between the first element 35 and the second element 36 may be smaller than 0.4 times the arrangement period K1 of the plurality of elastic structure portions 34, and may be smaller than 0.3 times. It may be smaller than 0.2 times, and may be smaller than 0.1 times.

FIG. 5 is a plan view showing another example of the intermediate region 33 of the base material 20. As shown in FIG. 5, the contour of the base material 20 may be curved at the portion where the first element 35 and the connecting element 37 are connected. As a result, it is possible to prevent stress from concentrating on the portion where the first element 35 and the connecting element 37 are connected when the telescopic structure portion 34 is deformed. The contour of the base material 20 may be curved even in the portion where the second element 36 and the connecting element 37 are connected.

FIG. 6A is a plan view showing another example of the intermediate region 33 of the base material 20. As shown in FIG. 6A, the telescopic structure portion 34 may have a horseshoe shape. In this case, the first element 35, the second element 36 and the connecting element 37 are at least partially curved. The distance between the first element 35 and the second element 36 shows the minimum value K2 at a position opposite to the connecting element 37 in the second direction D2. Further, the distance between the first element 35 and the second element 36 is between the telescopic structure portion 34 and the position where the distance between the first element 35 and the second element 36 shows the minimum value K2. The maximum value K3 is shown.

In the example shown in FIG. 6A, the minimum value K2 of the distance between the first element 35 and the second element 36 may be smaller than 0.2 times the arrangement period K1 of the plurality of telescopic structure portions 34, and is 0. It may be smaller than .15 times and less than 0.1 times. Further, the maximum value K3 of the distance between the first element 35 and the second element 36 may be larger than 0.3 times the arrangement period K1 of the plurality of elastic structure portions 34, and may be larger than 0.4 times. It may be larger, greater than 0.5 times, or greater than 0.6 times.

FIG. 6B is a plan view showing another example of the telescopic structure portion 34 having a horseshoe shape and the intermediate portion 63 of the wiring 52. In the example shown in FIG. 6B, the straight line with the reference numeral C is a center line extending through the center of the telescopic structure portion 34 in the second direction D2 and extending in the first direction D1. In the example shown in FIG. 6B, the telescopic structure portion 34 is located on one side in the second direction from the center line C, and has an arc Q1 that is open at the center line C and a second direction from the center line C. It has a shape in which an arc Q2 located on the other side, opened at the center line C, and connected to the arc Q1 is periodically arranged in the first direction D1. The same applies to the intermediate portion 63 of the wiring 52. By adopting such a shape, it is possible to increase the resistance of the intermediate portion 63 of the telescopic structure portion 34 and the wiring 52 to elongation.

In FIG. 6B, the reference numeral θ represents the inscribed angle of the arcs Q1 and Q2, and the reference numeral R represents the radius of the arcs Q1 and Q2. Further, the reference numeral W represents the width of the intermediate portion 63 of the wiring 52. The inscribed angle θ of the arcs Q1 and Q2 is preferably 180 ° or more and 270 ° or less. In the example shown in FIG. 6B, θ is 270 °. The value (= R / W) obtained by dividing the radius R of the arcs Q1 and Q2 by the width W of the intermediate portion 63 of the wiring 52 is preferably 15 or more.

[Adhesive layer]
FIG. 3 is an example of a cross-sectional view taken along the line AA of the wiring board 10 of FIG. As shown in FIG. 3, the adhesive layer 71 may be provided on the second surface 22 side of the base material 20. The adhesive layer 71 contains an adhesive for attaching the wiring board 10 to an object such as a human arm. As shown in FIG. 3, the wiring board 10 may include a protective sheet 73 that covers the adhesive layer 71. The protective sheet 73 is peeled off when the wiring board 10 is attached to the object.

As shown in FIG. 3, the adhesive layer 71 may include a plurality of adhesive portions 72 arranged in the in-plane direction of the second surface 22 of the base material 20. The plurality of adhesive portions 72 are arranged at intervals. As a result, the wiring board 10 can be provided with a portion that is not fixed to the object via the adhesive layer 71.

〔wiring〕
The wiring 52 is a member that has conductivity and has an elongated shape in a plan view. In the present embodiment, the wiring 52 is located on the first surface 21 side of the base material 20. As shown in FIG. 2, the wiring 52 may be in contact with the first surface 21 of the base material 20. Although not shown, other members may be interposed between the first surface 21 of the base material 20 and the wiring 52.

The wiring 52 is located in the first portion 61 located in the first region 31 of the base material 20, the second portion 62 located in the second region 32, and the intermediate region 33, and is located in the first portion 61 and the second portion 62. Includes an intermediate portion 63, which is connected to. In the examples shown in FIGS. 1 and 2, the first portion 61 and the second portion 62 extend in the first direction D1.

The intermediate portion 63 of the wiring 52 extends along the intermediate region 33 of the substrate 20. For example, the intermediate portion 63 has a zigzag shape in a plan view like the intermediate region 33. The intermediate region 63 follows the intermediate region 33 so as to increase the dimensions in the first direction D1 when a force in the direction of increasing the distance between the first region 31 and the second region 32 is applied to the base material 20. Can be transformed.

As the material of the wiring 52, a material capable of following the elongation and contraction of the base material 20 by utilizing the elimination and formation of the bellows-shaped portion described later is used. The material of the wiring 52 may or may not have elasticity by itself.
Examples of the material that can be used for the wiring 52 and does not have elasticity by itself include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. When the material of the wiring 52 itself does not have elasticity, a metal film can be used as the wiring 52.
When the material itself used for the wiring 52 has elasticity, the elasticity of the material is similar to, for example, the elasticity of the base material 20. Examples of the material that can be used for the wiring 52 and has elasticity by itself include a conductive composition containing conductive particles and an elastomer. The conductive particles may be any particles that can be used for wiring, and examples thereof include particles of gold, silver, copper, nickel, palladium, platinum, carbon and the like. Of these, silver particles are preferably used.

Preferably, the wiring 52 has a structure that is resistant to deformation. For example, the wiring 52 has a base material and a plurality of conductive particles dispersed in the base material. In this case, by using a deformable material such as resin as the base material, the wiring 52 can also be deformed according to the expansion and contraction of the base material 20. Further, the conductivity of the wiring 52 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when the deformation occurs. ..

As a material constituting the base material of the wiring 52, general thermoplastic elastomers and thermocurable elastomers can be used. For example, styrene-based elastomers, acrylic-based elastomers, olefin-based elastomers, urethane-based elastomers, silicone rubbers, etc. Elastomer rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene and the like can be used. Among them, resins and rubbers containing urethane-based and silicone-based structures are preferably used in terms of their elasticity and durability. Further, as a material constituting the conductive particles of the wiring 52, for example, particles such as silver, copper, gold, nickel, palladium, platinum, and carbon can be used. Of these, silver particles are preferably used.

The thickness of the wiring 52 may be a thickness that can withstand the expansion and contraction of the base material 20, and is appropriately selected depending on the material of the wiring 52 and the like.
For example, when the material of the wiring 52 does not have elasticity, the thickness of the wiring 52 can be in the range of 25 nm or more and 100 μm or less, preferably in the range of 50 nm or more and 50 μm or less, and preferably 100 nm or more and 5 μm. It is more preferably within the following range.
When the material of the wiring 52 has elasticity, the thickness of the wiring 52 can be in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and 20 μm or more and 40 μm or less. It is more preferable that it is within the range.
The width of the wiring 52 is, for example, 50 μm or more and 10 mm or less.

The width of the wiring 52 is appropriately selected according to the electric resistance value required for the wiring 52. The width of the wiring 52 is, for example, 1 μm or more, preferably 50 μm or more. The width of the wiring 52 is, for example, 10 mm or less, preferably 1 mm or less.

The method for forming the wiring 52 is appropriately selected depending on the material and the like. For example, a method of forming a metal film on a base material 20 or a support substrate 80 described later by a vapor deposition method, a sputtering method, a plating method, laminating of metal foils, or the like, and then patterning the metal film by a photolithography method can be mentioned. When the metal foil is laminated on the base material 20 or the support substrate 80 described later, an adhesive layer or the like may be interposed between the base material 20 or the support substrate 80 and the metal foil. When the material of the wiring 52 itself has elasticity, for example, the conductive composition containing the above-mentioned conductive particles and elastomer is patterned on the base material 20 or the support substrate 80 by a general printing method. There is a method of printing. Of these methods, a printing method that has high material efficiency and can be manufactured at low cost can be preferably used.

[Electronic components]
The electronic component 51 is electrically connected to the wiring 52 on the first surface 21 side of the base material 20. The wiring board 10 may be distributed or used in a state where the electronic component 51 is not mounted. In this case, the wiring board 10 is configured so that the electronic component 51 can be mounted.

The electronic component 51 may have an electrode connected to the wiring 52. In this case, the wiring board 10 has a connecting portion that is in contact with the electrodes of the electronic component 51 and is electrically connected to the wiring 52. The connection is, for example, a pad.

Further, the electronic component 51 does not have to have an electrode connected to the wiring 52. For example, the electronic component 51 may include a member integrated with at least one component of the plurality of components of the wiring board 10. Examples of such an electronic component 51 include those including a conductive layer integrated with the conductive layer constituting the wiring 52 of the wiring board 10, and a conductive layer located in a layer different from the conductive layer constituting the wiring 52. Examples include those that include. For example, the electronic component 51 may be a pad made of a conductive layer having a wider width in a plan view than the conductive layer forming the wiring 52. A probe for inspection, a terminal for rewriting software, etc. are connected to the pad. Further, the electronic component 51 may have a wiring pattern formed by spirally extending the conductive layer in a plan view. In this way, the portion where the conductive layer is patterned and given a predetermined function can also be the electronic component 51.

The electronic component 51 may be an active component, a passive component, or a mechanical component. Examples of electronic components 51 include transistors, LSI (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), relays, light emitting elements such as LEDs, OLEDs, and LCDs, sound components such as sensors and buzzers, and vibrations that generate vibrations. Examples thereof include parts, cold and heat-generating parts such as Perche elements and heating wires that control cooling heat generation, resistors, capacitors, inductors, piezoelectric elements, switches, and connectors. Of the above examples of the electronic component 51, the sensor is preferably used. Examples of sensors include temperature sensors, pressure sensors, optical sensors, photoelectric sensors, proximity sensors, shear force sensors, biosensors, laser sensors, microwave sensors, humidity sensors, strain sensors, gyro sensors, acceleration sensors, displacement sensors, etc. Examples thereof include magnetic sensors, gas sensors, GPS sensors, ultrasonic sensors, odor sensors, brain wave sensors, current sensors, vibration sensors, pulse wave sensors, electrocardiographic sensors, and photometric sensors. Of these sensors, biosensors are particularly preferred. The biosensor can measure biometric information such as heartbeat, pulse, electrocardiogram, blood pressure, body temperature, and blood oxygen concentration.

Next, the use of the electronic component 51 having no electrode will be described. For example, the pad described above can function as a portion to which a probe for inspection, a terminal for software rewriting, and the like are connected. Further, the wiring pattern formed by extending in a spiral shape can function as an antenna or the like.

Next, the cross-sectional shape of the wiring board 10 will be described in detail. FIG. 4 is an enlarged view showing a portion of the wiring board 10 including the wiring 52.

As will be described later, the wiring 52 is provided on the base material 20 in a state of being stretched by the first stretching amount under tension. In this case, when the tension is removed from the base material 20 and the base material 20 contracts, the wiring 52 is deformed into a bellows shape to have the bellows-shaped portion 55 as shown in FIG. 7.

The bellows-shaped portion 55 of the wiring 52 includes a plurality of mountain portions 53 arranged along the first direction D1 in which the wiring 52 extends. The mountain portion 53 is a portion of the surface of the wiring 52 that is raised in the normal direction of the first surface 21. As shown in FIG. 7, a valley portion 54 may exist between two mountain portions 53 adjacent to each other in the direction in which the wiring 52 extends.

The peaks 53 and 54 of the wiring 52 and the peaks 23 and 24 of the first surface 21 of the base material 20 are arranged in the direction in which the wiring 52 extends. However, the wiring 52 is not limited to this, and although not shown, the direction in which the peaks 53 and 54 of the wiring 52 and the peaks 23 and 24 of the first surface 21 of the base material 20 are lined up and the wiring 52 It does not have to match the extending direction. Further, in FIG. 7, a plurality of peaks 53 and valleys 54 of the bellows-shaped portion 55 are arranged at regular intervals, but the present invention is not limited to this. Although not shown, the plurality of peaks 53 and valleys 54 of the bellows-shaped portion 55 may be arranged irregularly. For example, the distance between two adjacent mountain portions 53 does not have to be constant.

In FIG. 7, reference numeral S1 represents the amplitudes of the peaks and valleys appearing on the surface of the wiring board 10 on the first surface 21 side that overlaps the bellows-shaped portion 55 of the wiring 52. In the example shown in FIG. 7, since the wiring 52 is located on the surface of the wiring board 10, the amplitude S1 is the amplitude of the peak portion 53 and the valley portion 54 of the wiring 52. The amplitude S1 is, for example, 1 μm or more, more preferably 10 μm or more. By setting the amplitude S1 to 10 μm or more, the wiring 52 is easily deformed following the elongation of the base material 20. Further, the amplitude S1 may be, for example, 500 μm or less.

The amplitude of the peaks and valleys is measured, for example, by measuring the distance between the adjacent peaks and valleys in the normal direction of the base material 20 over a certain range in the direction in which the peaks and valleys are lined up. It is calculated by calculating the average of them. The "certain range in the direction in which the peaks and valleys are lined up" is, for example, 10 mm. As the measuring instrument for measuring the distance between the adjacent peaks and valleys, a non-contact measuring instrument using a laser microscope or the like may be used, or a contact measuring instrument may be used. Further, the distance between the adjacent peaks and valleys may be measured based on an image such as a cross-sectional photograph.

In FIG. 7, reference numeral F1 represents a period of peaks and valleys appearing on a portion of the surface of the wiring board 10 on the first surface 21 side that overlaps the bellows-shaped portion 55 of the wiring 52. In the example shown in FIG. 7, since the wiring 52 is located on the surface of the wiring board 10, the period F1 is the period of the peaks 53 and the valleys 54 of the wiring 52. The period F1 is, for example, 10 μm or more, more preferably 100 μm or more. The period F1 is, for example, 100 mm or less, more preferably 10 mm or less. The period F1 of the peaks and valleys is calculated by measuring the intervals between the plurality of peaks over a certain range in the direction in which the peaks and valleys are lined up and calculating the average of them.

In FIG. 7, reference numeral S2 represents the amplitude of the peak portion 23 and the valley portion 24 appearing on the first surface 21 of the base material 20 at the portion overlapping the bellows-shaped portion 55 of the wiring 52. When the wiring 52 is located on the first surface 21 of the base material 20 as shown in FIG. 7, the amplitude S2 of the peaks 23 and the valleys 24 of the first surface 21 of the base material 20 is the bellows of the wiring 52. It is equal to the amplitude S1 of the shape portion 55.

As shown in FIG. 7, a plurality of peaks 25 and valleys 26 arranged along the direction in which the wiring 52 extends may also appear on the surface of the wiring board 10 on the second surface 22 side of the base material 20. In the example shown in FIG. 7, the mountain portion 25 on the second surface 22 side appears at a position overlapping the valley portion 54 of the bellows-shaped portion 55 of the wiring 52, and the valley portion 26 on the second surface 22 side is the bellows portion of the wiring 52. It appears at a position overlapping the mountain portion 53 of the shape portion 55.

In FIG. 7, reference numeral S3 is a second of the base material 20 of a plurality of peaks 25 and valleys 26 arranged along the direction in which the wiring 52 extends on the surface of the wiring board 10 on the second surface 22 side of the base material 20. Represents the amplitude of the surface 22 in the normal direction. The amplitude S3 of the peak 25 and the valley 26 on the second surface 22 side may be the same as or different from the amplitude S1 of the peak 53 and the valley 54 on the first surface 21 side. For example, the amplitude S3 of the peak 25 and the valley 26 on the second surface 22 side may be smaller than the amplitude S1 of the peak 53 and the valley 54 on the first surface 21 side. For example, the amplitude S3 may be 0.9 times or less, 0.8 times or less, or 0.6 times or less the amplitude S1. Further, the amplitude S3 may be 0.1 times or more, or 0.2 times or more, the amplitude S1. In addition, "the amplitude S3 of the mountain portion 25 and the valley portion 26 on the second surface 22 side is smaller than the amplitude S1 of the mountain portion 53 and the valley portion 54 on the first surface 21 side" is said on the second surface 22 side. This is a concept including a case where peaks and valleys do not appear on the surface of the wiring board 10.

In FIG. 7, reference numeral F3 represents a period of a plurality of peaks 25 and valleys 26 arranged along the direction in which the wiring 52 extends on the surface of the wiring board 10 on the second surface 22 side of the base material 20. As shown in FIG. 7, the period F3 of the mountain portion 25 and the valley portion 26 on the second surface 22 side may be the same as the period F1 of the mountain portion 53 and the valley portion 54 on the first surface 21 side.

FIG. 8 is an enlarged plan view showing an example of the bellows-shaped portion 55 generated on the wiring board 10. As shown in FIG. 8, the bellows-shaped portion 55 including the plurality of peak portions 53 may be formed in the first portion 61 located in the first region 31 of 20 of the wiring 52. Although not shown, the bellows-shaped portion 55 may be formed in the second portion 62 of the wiring 52 located in the second region 32 of the base material 20. Further, as shown in FIG. 8, the bellows-shaped portion 55 may be formed in the intermediate region 33 of the wiring 52 located in the intermediate region 33 of the base material 20.

As shown in FIG. 8, the bellows-shaped portion 55 generated in the portion having a zigzag shape such as the intermediate portion 63 may include a plurality of mountain portions 53 arranged in the direction in which the wiring 52 extends. Such a bellows-shaped portion 55 is formed, for example, by providing a zigzag-shaped intermediate portion 63 on the base material 20 in a state where the base material 20 is extended in two different directions, and then shrinking the base material 20. obtain. The two different directions are, for example, the first direction D1 and the second direction D2.

In FIG. 8, reference numeral F11 represents a period of peaks and valleys appearing on a portion of the surface of the wiring board 10 on the first surface 21 side that overlaps the bellows-shaped portion 55 of the first portion 61 of the wiring 52. Further, reference numeral F12 represents a period of peaks and valleys appearing on the surface of the wiring board 10 on the first surface 21 side, which overlaps the bellows-shaped portion 55 of the intermediate portion 63 of the wiring 52. The period F12 may be the same as or different from the period F11. For example, the period F12 may be larger or smaller than the period F11.

When the period F12 is larger than the period F11, the period F12 may be 1.1 times or more, 1.2 times or more, or 1.5 times or more the period F11. , 2.0 times or more.

When the period F12 is smaller than the period F11, the period F12 may be 0.9 times or less of the period F11, 0.8 times or less, or 0.7 times or less. , 0.5 times or less.

Further, the amplitudes (hereinafter, also referred to as amplitude S12) of the peaks and valleys appearing on the surface of the wiring substrate 10 on the first surface 21 side that overlaps the bellows-shaped portion 55 of the intermediate portion 63 of the wiring 52 are the first. It may be the same as the amplitude (hereinafter, also referred to as amplitude S11) of the peaks and valleys appearing on the surface of the wiring substrate 10 on the surface 21 side that overlaps the bellows-shaped portion 55 of the first portion 61 of the wiring 52. , May be different. For example, the amplitude S12 may be larger or smaller than the amplitude S11.

When the amplitude S12 is larger than the amplitude S11, the amplitude S12 may be 1.1 times or more, 1.2 times or more, or 1.5 times or more the amplitude S11. , 2.0 times or more.

When the amplitude S12 is smaller than the amplitude S11, the amplitude S12 may be 0.9 times or less, 0.8 times or less, or 0.7 times or less the amplitude S11. , 0.5 times or less.

FIG. 9 shows another example of a cross-sectional view of the wiring board 10. As shown in FIG. 9, the period F3 of the mountain portion 25 and the valley portion 26 on the second surface 22 side may be larger than the period F1 of the mountain portion 53 and the valley portion 54 on the first surface 21 side. For example, the period F3 may be 1.1 times or more, 1.2 times or more, 1.5 times or more, or 2.0 times or more the period F1. May be good. It should be noted that "the period F3 of the mountain portion 25 and the valley portion 26 on the second surface 22 side is larger than the period F1 of the mountain portion 53 and the valley portion 54 on the first surface 21 side" is said on the second surface 22 side. This is a concept including a case where peaks and valleys do not appear on the surface of the wiring board 10.

FIG. 10 shows another example of a cross-sectional view of the wiring board 10. As shown in FIG. 10, the positions of the mountain portions 25 and the valley portions 26 on the second surface 22 side may be deviated by J from the positions of the valley portions 54 and the valley portions 53 on the first surface 21 side. The deviation amount J is, for example, 0.1 × F1 or more, and may be 0.2 × F1 or more.

(Manufacturing method of wiring board)
Next, a method of manufacturing the wiring board 10 will be described with reference to FIGS. 11 (a) to 11 (c) and FIGS. 12 (a) to 12 (c). 11 (a) to 11 (c) are plan views for explaining an example of a method of manufacturing the wiring board 10. 12 (a) to 12 (c) are cross-sectional views taken along the line BB of the wiring board 10 of FIGS. 11 (a) to 11 (c).

First, as shown in FIGS. 11 (a) and 12 (a), a base material preparation step of preparing a rectangular base material 20 having elasticity including the first surface 21 and the second surface 22 is carried out. .. Reference numeral L0 in FIG. 12A represents the dimensions of the base material 20 in the untensioned state in the first direction D1.

Subsequently, as shown in FIGS. 11B and 12B, a first stretching step of applying a first tension T1 to the base material 20 in the first direction D1 to stretch the base material 20 to the dimension L1 is performed. carry out. The elongation rate (= (L1-L0) × 100 / L0) of the base material 20 in the first direction D1 is, for example, 10% or more and 200% or less. The stretching step may be carried out in a state where the base material 20 is heated, or may be carried out at room temperature. When the base material 20 is heated, the temperature of the base material 20 is, for example, 50 ° C. or higher and 100 ° C. or lower. As shown in FIG. 11B, the first tension T1 may be applied to the base material 20 in the second direction D2 to extend the base material 20 in the second direction D2.

Subsequently, as shown in FIGS. 11 (b) and 12 (b), a wiring forming step of providing the wiring 52 on the first surface 21 of the base material 20 in a state of being stretched by the first tension T1 in the first stretching step is performed. carry out. For example, a conductive paste containing a base material and conductive particles is printed on the first surface 21 of the base material 20. The wiring 52 includes a first portion 61, a second portion 62, and an intermediate portion 63. The intermediate portion 63 includes a plurality of telescopic structure portions 64 arranged in the first direction D1. The intermediate portion 63 including the plurality of elastic structure portions 64 has a shape similar to that of the elastic structure portion 34 of the above-mentioned base material 20 in a plan view. For example, the intermediate portion 63 has a zigzag shape as shown in FIG. 11 (b).

Then, the first shrinkage step of removing the first tension T1 from the base material 20 is carried out. As a result, as shown by the arrow C in FIGS. 11 (c) and 12 (c), the base material 20 contracts in the first direction D1, and the wiring 52 provided on the base material 20 is also deformed. The deformation of the wiring 52 can occur as the bellows-shaped portion 55 as described above. In this way, the wiring board 10 in which the bellows-shaped portion appears can be obtained. When the base material 20 is also stretched in the second direction D2 in the first stretching step described above, the base material 20 contracts in the second direction D2 as well, and the bellows having a plurality of peaks arranged in the second direction D2. The shape portion 55 is generated.

After that, a cutting step of partially cutting the base material 20 is performed. In the cutting step, the base material 20 is connected to the above-mentioned first region 31 and the second region 32, which face each other at intervals in the first direction D1, and the first end 331 and the second region 31 connected to the first region 31. It is partitioned into an intermediate region 33 including a second end 332 connected to the end 332. As a method for cutting the base material 20, for example, laser processing can be used. For example, the base material 20 is irradiated with a laser so as to remove a portion between the first region 31 and the second region 32 of the base material 20 other than the portion around the intermediate portion 63 of the wiring 52. In this way, the wiring board 10 shown in FIG. 1 can be obtained.

(How to use the wiring board)
Next, an example of how to use the wiring board 10 will be described. FIG. 13 is a diagram showing a part of the wiring board 10 in a state of being attached to the object 100 such as a human arm. Here, a case will be described in which the portions of the wiring board 10 corresponding to the first region 31, the intermediate region 33, and the second region 32 of the base material 20 are attached to the forearm, elbow, and upper arm of the human arm, respectively. To do.

In FIG. 13, the adhesive portion 72 is represented by a dotted line. As shown in FIG. 13, in the portion of the wiring board 10 corresponding to the intermediate region 33 of the base material 20, the adhesive portion 72 may be provided on a part of the first element 35 and the second element 36. In this case, the portion of the intermediate region 33 of the base material 20 located between the two adjacent adhesive portions 72 is not attached to the elbow. The adhesive portion 72 is preferably provided at a position overlapping the center line C. As a result, when the wiring board 10 expands and contracts, the stress applied to the curved portion and the bent portion of the zigzag intermediate region 33 can be reduced.

When the arm is moved or bent, the skin of the arm is displaced or stretched, and the base material 20 of the wiring board 10 may be stretched accordingly. Here, according to the present embodiment, the wiring 52 of the wiring board 10 has a bellows-shaped portion 55. Therefore, when the base material 20 of the wiring board 10 is stretched, the wiring 52 is deformed so as to reduce the undulations of the bellows-shaped portion 55, that is, by eliminating the bellows shape, the base material 20 is stretched. Can follow. Therefore, it is possible to prevent the total length of the wiring 52 from increasing and the cross-sectional area of the wiring 52 from decreasing as the base material 20 extends. As a result, it is possible to suppress an increase in the resistance value of the wiring 52 due to the extension of the wiring board 10. Further, it is possible to prevent the wiring 52 from being damaged such as a crack.

By the way, the degree of skin stretch that occurs in the elbow is larger than the degree of skin stretch that occurs in the forearm and upper arm. Therefore, in the intermediate region 33 of the base material 20 and the intermediate portion 63 of the wiring 52 located in the intermediate region 33, the first portion 61 of the wiring 52 located in the first region 31 and the first region 31 of the base material 20 In addition, greater extensibility is required than the second region 32 of the base material 20 and the second portion 62 of the wiring 52 located in the second region 32.

Here, according to the present embodiment, the intermediate region 33 of the base material 20 has a plurality of elastic structure portions 34. Further, the intermediate portion 63 of the wiring 52 includes the telescopic structure portion 64 extending along the telescopic structure portion 34. Therefore, when a force in a direction for widening the distance between the first region 31 and the second region 32 is applied to the base material 20, the stretchable structure portion 34 has the first element 35 and the first element 35 as shown in FIG. By tilting the second element 36, the distance between the first element 35 and the second element 36 can be increased. As described above, according to the present embodiment, in addition to eliminating the bellows shape, the intermediate region 33 of the base material 20 can be extended by utilizing the change in the shape of the stretchable structure portion 34. Thereby, the extensibility of the intermediate region 33 can be made higher than the extensibility of the first region 31 and the second region 32. This makes it easier to deal with the object 100 including a locally greatly deformed portion such as an elbow. For example, it is possible to suppress an increase in the resistance value of the wiring 52 due to the extension of the wiring board 10. Further, it is possible to prevent the wiring 52 from being damaged such as a crack.

When tension is applied to the base material 20, it is not particularly limited whether the bellows shape is eliminated or the shape of the stretchable structure portion 34 is changed first in the intermediate region 33 of the base material 20. For example, when tension is applied to the base material 20, first, in the intermediate region 33, the intermediate region 33 is stretched due to the change in the shape of the stretchable structure portion 34, followed by the first region 31 and the second region. In 32 and the intermediate region 33, the base material 20 may be stretched due to the elimination of the bellows shape. Alternatively, first, in the first region 31, the second region 32, and the intermediate region 33, the base material 20 is stretched due to the elimination of the bellows shape, and then in the intermediate region 33, the shape of the stretchable structure portion 34 is changed. The extension of the intermediate region 33 due to the above may occur. Alternatively, both the elimination of the bellows shape and the change in the shape of the telescopic structure portion 34 may occur simultaneously in the intermediate region 33.

An example of the effect on the electric resistance value of the wiring 52 obtained in the present embodiment will be described. Here, the electric resistance value of the wiring 52 in the first state in which tension is not applied to the base material 20 is referred to as a first electric resistance value. Further, the resistance value of the wiring 52 in the second state in which tension is applied to the base material 20 to extend the base material 20 by 50% as compared with the first state is referred to as a second electrical resistance value. Further, the resistance value of the wiring 52 in the third state in which tension is applied to the base material 20 to extend the base material 20 by 80% as compared with the first state is referred to as a third electrical resistance value.

According to the present embodiment, by forming the bellows-shaped portion 55 in the first portion 61 of the wiring 52 in the first region 31 of the base material 20, the first electrical resistance value and the second electrical resistance value with respect to the first electrical resistance value are formed. The ratio of the absolute values of the differences in electrical resistance values can be 20% or less, more preferably 10% or less, and even more preferably 5% or less. That is, the first portion 61 of the wiring 52 located in the first region 31 of the base material 20 can be made resistant to 50% elongation. The same applies to the second portion 62 of the wiring 52 located in the second region 32 of the base material 20.

Further, according to the present embodiment, the difference between the first electric resistance value and the second electric resistance value with respect to the first electric resistance value generated in the intermediate portion 63 of the wiring 52 located in the intermediate region 33 of the base material 20. The ratio of the absolute values can be made smaller than that of the first portion 61 of the wiring 52. Further, the ratio of the absolute value of the difference between the first electric resistance value and the third electric resistance value to the first electric resistance value generated in the intermediate portion 63 of the wiring 52 located in the intermediate region 33 of the base material 20 is 20%. It can be less than or equal to, more preferably less than 10%, even more preferably less than or equal to 5%. That is, the intermediate portion 63 of the wiring 52 located in the intermediate region 33 of the base material 20 can be made resistant to 80% elongation.

Here, for comparison, a case where the entire wiring board 10 is made to withstand 80% elongation will be considered. In this case, in the above-mentioned first stretching step, it is necessary to stretch the entire base material 20 by, for example, 80% or more. As a result, the size of the wiring board 10 after shrinkage becomes small, and the productivity of the wiring board 10 decreases. Further, since the entire wiring 52 of the wiring board 10 has a bellows-shaped portion 55 corresponding to the elongation of the base material 20 of 80% or more, the reliability of the wiring 52 tends to decrease.

On the other hand, in the present embodiment, the wiring located in the intermediate region 33 of the base material 20 while maintaining the elongation rate of the base material 20 in the first stretching step is lower than 80%, for example, 50%. The intermediate portion 63 of 52 can be made resistant to 80% elongation. Therefore, it is possible to prevent the size of the wiring board 10 from becoming smaller after shrinkage, and it is possible to maintain the productivity of the wiring board 10. In addition, it is possible to prevent the reliability of the wiring 52 from being lowered.

Preferably, as described above, the portion of the wiring board 10 corresponding to the intermediate region 33 of the base material 20 is attached to the object 100 by a plurality of adhesive portions 72 arranged at intervals. In this case, the portion of the intermediate region 33 located between the two adjacent adhesive portions 72 is easily deformed freely without being bound by the object 100. This can also contribute to increasing the extensibility of the intermediate region 33 and increasing the reliability of the wiring 52. The reason will be described below.

Deformation or elongation of the object 100 and the wiring board 10 attached to the object 100 may occur locally in a part of the object 100. For example, in a part of the intermediate region 33 of the base material 20 of the wiring board 10 attached to the elbow of a person, a large extension may occur locally due to the structure of joints or the like. When the entire area of the intermediate region 33 of the base material 20 is firmly attached to the elbow via the adhesive layer 71, each portion of the intermediate region 33 and the intermediate portion 63 can withstand the maximum elongation that can occur locally. Is required.

On the other hand, as shown in FIGS. 13 and 14, when the intermediate region 33 of the wiring board 10 is attached to the object 100 by a plurality of adhesive portions 72 arranged at intervals, the intermediate region 33 is included in the intermediate region 33. The portion located between the two adjacent adhesive portions 72 extends uniformly as the object 100 extends. For example, consider a case where a large extension occurs in a part (hereinafter, also referred to as a maximum extension portion) located between two adjacent adhesive portions 72 of the object 100. The intermediate region 33 is not attached to the maximum extension portion of the object 100. Therefore, the maximum extension portion can be dealt with by deforming the portion located between the two adjacent adhesive portions 72 by the amount corresponding to the extension of the maximum extension portion. Therefore, the degree of extensibility required for the intermediate region 33 can be reduced as compared with the case where only the portion of the intermediate region 33 that is attached to the maximum extension portion is dealt with.

Applications of the wiring board 10 include healthcare field, medical field, nursing care field, electronics field, sports / fitness field, beauty field, mobility field, livestock / pet field, amusement field, fashion / apparel field, security field, and military field. , Distribution field, education field, building materials / furniture / decoration field, environmental energy field, agriculture, forestry and fisheries field, robot field, etc. For example, a product to be attached to a part of the body such as a human arm is configured by using the wiring board 10 according to the present embodiment. Since the wiring board 10 can be extended, for example, by attaching the wiring board 10 to the body in an extended state, the wiring board 10 can be brought into close contact with a part of the body. Therefore, a good wearing feeling can be realized. Further, since it is possible to suppress a decrease in the electric resistance value of the wiring 52 when the wiring board 10 is extended, it is possible to realize good electrical characteristics of the wiring board 10. In addition, since the wiring board 10 can be extended, it can be installed or incorporated along a curved surface or a three-dimensional shape, not limited to a living body such as a human being. Examples of these products include vital sensors, masks, hearing aids, toothbrushes, plasters, wet cloths, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, chemical packs, bandages, disposable bioelectrodes, diapers, rehabilitation equipment, home appliances. Products, displays, signage, personal computers, mobile phones, mice, speakers, sportswear, wristbands, earmuffs, gloves, swimwear, supporters, balls, gloves, rackets, clubs, bats, fishing rods, relay batons and jewelry. In addition, its grips, physical training equipment, floats, tents, swimwear, bibs, goal nets, goal tapes, chemical penetration beauty masks, electrical stimulation diet supplies, pocket furnaces, claws, tattoos, automobiles, airplanes, trains, ships, bicycles , Strollers, drones, wheelchairs, etc. Seats, instrument panels, tires, interiors, exteriors, saddles, handles, roads, rails, bridges, tunnels, gas and water pipes, wires, tetrapods, rope collars, leads, harnesses, animals Tags, bracelets, belts, game equipment, haptics devices such as controllers, luncheon mats, tickets, dolls, stuffed animals, cheering goods, hats, clothes, glasses, shoes, insoles, socks, stockings, slippers, innerwear, Mufflers, earmuffs, bags, accessories, rings, watches, ties, personal ID recognition devices, helmets, packages, IC tags, PET bottles, stationery, books, pens, carpets, sofas, bedding, lighting, doorknobs, handrails, vases, Beds, mattresses, cushions, curtains, doors, windows, ceilings, walls, floors, wireless power antennas, batteries, vinyl houses, nets, robot hands, robot exteriors.

It is possible to make various changes to the above-described embodiment. Hereinafter, a modified example will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding portions in the above-described embodiment will be used for the portions that can be configured in the same manner as in the above-described embodiment. Duplicate description is omitted. Further, when it is clear that the action and effect obtained in the above-described embodiment can be obtained in the modified example, the description thereof may be omitted.

(First modification)
In this modification, an example will be described in which the wiring board 10 includes an adjustment layer 41 for adjusting the period and amplitude of the bellows-shaped portion 55 generated in the wiring 52.

FIG. 15 is a cross-sectional view showing the wiring board 10 according to the first modification. As shown in FIG. 15, the wiring board 10 may include an adjusting layer 41 located on the first surface 21 side of the base material 20. In the example shown in FIG. 15, the adjusting layer 41 is arranged so as to overlap the wiring 52. The adjusting layer 41 may be provided on the first surface 21 side of the base material 20 at a position where it does not overlap with the wiring 52.

[Adjustment layer]
The adjusting layer 41 is a layer provided on the first surface 21 side of the base material 20 in order to control the expansion and contraction of the base material 20. The adjusting layer 41 is provided over a wide area of the base material 20. For example, the adjusting layer 41 has a higher occupancy rate than the wiring 52 on the first surface 21 side of the base material 20. Therefore, as compared with the case where the adjusting layer 41 is not provided, it is possible to suppress the local stress concentration on a part of the wiring board 10 when the wiring board 10 is expanded and contracted. For example, when the difference between the elastic modulus of the base material 20 and the elastic modulus of the wiring 52 is large and the occupancy of the wiring 52 is low, stress tends to concentrate on the wiring 52 when the wiring substrate 10 is expanded and contracted. On the other hand, according to the present embodiment, by providing the adjusting layer 41 on the base material 20, it is possible to suppress the concentration of stress on the wiring 52. As a result, it is possible to prevent the deformation such as bending and bending that occurs in the wiring board 10 from becoming large locally. Therefore, it is possible to prevent the wiring 52 from being damaged such as a crack. Further, it is possible to prevent the electric resistance value of the wiring 52 from increasing when the wiring board 10 is repeatedly expanded and contracted.

The "occupancy rate of the adjusting layer" is the normal direction of the first surface 21 of the base material 20 with respect to the area of the entire wiring board 10 when viewed along the normal direction of the first surface 21 of the base material 20. It is the ratio of the area of all the adjustment layers 41 located on the first surface 21 side when viewed along. Similarly, the “wiring occupancy” is the normal of the first surface 21 of the base material 20 with respect to the area of the entire wiring substrate 10 when viewed along the normal direction of the first surface 21 of the base material 20. It is the ratio of the area of all the wirings 52 located on the first surface 21 side when viewed along the direction.

The adjusting layer 41 may have a higher elastic modulus than the first elastic modulus of the base material 20. Further, the elastic modulus of the adjusting layer 41 may be lower than the elastic modulus of the wiring 52. The elastic modulus of the adjusting layer 41 is, for example, 10 GPa or more and 500 GPa or less, and more preferably 1 GPa or more and 300 GPa or less. If the elastic modulus of the adjusting layer 41 is too low, the elongation of the base material 20 may not be suppressed. Further, if the elastic modulus of the adjusting layer 41 is too high, when the base material 20 expands and contracts, structural destruction such as cracks and cracks may occur in the adjusting layer 41. The elastic modulus of the adjusting layer 41 may be 1.1 times or more and 5000 times or less of the first elastic modulus of the base material 20, and more preferably 10 times or more and 3000 times or less. In the following description, the elastic modulus of the adjusting layer 41 is also referred to as a second elastic modulus.

The material of the adjusting layer 41 may or may not have elasticity. Above all, it is preferable that the material of the adjusting layer has elasticity. This is because when the adjusting layer 41 contains a stretchable material, it can have resistance to deformation.

Examples of the non-stretchable material used for the adjusting layer 41 include resin. As the resin, a general resin can be used, and for example, any of a thermoplastic resin, a thermosetting resin, a photocurable resin and the like can be used. When the adjusting layer 41 contains a resin or an elastomer, a resin base material can be used as the adjusting layer.

The stretchability of the stretchable material used for the adjusting layer 41 can be the same as the stretchability of the base material 20.
As the stretchable material used for the adjusting layer 41, for example, an elastomer can be mentioned. As the elastomer, general thermoplastic elastomers and thermocurable elastomers can be used, and specifically, styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, amide-based elastomers, silicone rubbers, urethane rubbers, and fluororubbers. , Polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene and the like. When the material constituting the adjusting layer 41 is these resins, the adjusting layer 41 may have transparency. Further, the adjusting layer may have a light-shielding property, for example, a property of shielding ultraviolet rays. For example, the adjusting layer 41 may be black. Further, the color of the adjusting layer and the color of the substrate may be the same. The adjusting layer 41 may have a design and have a role of decoration.

Further, the adjusting layer 41 may have an insulating property. As the material of the adjusting layer 41 having an insulating property, a resin or an elastomer can be used.

The method for calculating the second elastic modulus of the adjusting layer 41 is appropriately determined according to the form of the adjusting layer 41. For example, the method of calculating the second elastic modulus of the adjusting layer 41 may be the same as or different from the method of calculating the elastic modulus of the base material 20 described above. The elastic modulus of the support substrate 80 described later is also the same. For example, as a method of calculating the elastic modulus of the adjusting layer 41 or the supporting substrate 80, a method of performing a tensile test in accordance with ASTM D882 using a sample of the adjusting layer 41 or the supporting substrate 80 can be adopted. ..

The thickness of the adjusting layer 41 may be any thickness that can withstand expansion and contraction, and is appropriately selected depending on the material of the adjusting layer 41 and the like. The thickness of the adjusting layer 41 can be, for example, 0.1 μm or more, and may be 1 μm or more, or 10 μm or more. Further, the thickness of the adjusting layer 41 can be, for example, 5 mm or less, may be 1 mm or less, may be 500 μm or less, or may be 100 μm or less. If the adjusting layer 41 is too thin, the effect of reducing stress concentration may not be sufficiently obtained. Further, if the adjusting layer 41 is too thick, even if the elastic modulus of the adjusting layer 41 satisfies the above relationship, the bending rigidity of the adjusting layer 41 becomes large, and it may be difficult to reduce the stress concentration.

The characteristic of the adjusting layer 41 may be expressed by flexural rigidity instead of the elastic modulus. The moment of inertia of area of the adjusting layer 41 is calculated based on the cross section when the adjusting layer 41 is cut by a plane orthogonal to the direction in which the wiring 52 extends. The bending rigidity of the adjusting layer 41 may be 1.1 times or more, more preferably 2 times or more, and further preferably 10 times or more the bending rigidity of the base material 20. The flexural rigidity is the product of the moment of inertia of area of the target member and the elastic modulus of the material constituting the target member, and the unit is N · m ² or Pa · m ⁴ .

The method for forming the adjusting layer 41 is appropriately selected depending on the material and the like. For example, after forming the wiring 52 on the base material 20 or the support substrate 80 described later, a method of printing the material constituting the adjusting layer 41 on the base material 20 by a printing method can be mentioned. A member such as a metal foil or a resin film constituting the adjusting layer 41 may be attached to the base material 20 via an adhesive layer or the like.

FIG. 16 is an enlarged cross-sectional view showing an example of a bellows-shaped portion generated on the wiring board. Similar to the wiring 52, the adjusting layer 41 is also provided on the base material 20 in a state of being stretched by applying tension. For example, in the step of providing the wiring 52 on the base material 20 stretched by the first elongation amount, the adjusting layer 41 is also provided on the base material 20. In this case, when the tension is removed from the base material 20 and the base material 20 contracts, the adjusting layer 41 is deformed into a bellows shape to have a bellows-shaped portion 45 as shown in FIG. The bellows-shaped portion 45 of the adjusting layer 41 includes a plurality of peak portions 43 and valley portions 44 arranged along the first direction D1 direction.

In FIG. 16, reference numeral S4 represents the amplitudes of the peaks 43 and valleys 44 appearing in the adjustment layer 41. The amplitude S4 is, for example, 1 μm or more, more preferably 10 μm or more. Further, the amplitude S4 may be, for example, 500 μm or less.

The amplitude S4 in the bellows-shaped portion 45 of the adjusting layer 41 may be the same as or different from the amplitude S1 in the bellows-shaped portion 55 of the wiring 52. For example, the amplitude S4 in the bellows-shaped portion 45 of the adjusting layer 41 may be larger than the amplitude S1 in the bellows-shaped portion 55 of the wiring 52, or may be smaller than the amplitude S1.

In FIG. 16, reference numeral F4 represents the period of the peak portion 43 and the valley portion 44 of the bellows-shaped portion 45 of the adjustment layer 41. The period F4 of the bellows-shaped portion 45 of the adjusting layer 41 may be the same as or different from the period F1 of the bellows-shaped portion 55 of the wiring 52. For example, the period F4 of the bellows-shaped portion 45 of the adjustment layer 41 may be larger than the period F1 of the bellows-shaped portion 55 of the wiring 52, or may be smaller than the period F1.

(Second modification)
In the above-described embodiment, the wiring 52 is provided on the first surface 21 of the base material 20, but the present invention is not limited to this. In this modification, an example in which the wiring 52 is supported by the support substrate is shown.

FIG. 17 is a cross-sectional view of a portion of the wiring board 10 according to the second modification including the wiring 52, which corresponds to FIG. 2 in the above-described embodiment. The wiring board 10 includes at least a base material 20, a support board 80, and a wiring 52. The wiring board 10 may include an electronic component 51 mounted on the support board 80 so as to be electrically connected to the wiring 52.

[Support board]
The support substrate 80 is a member configured to have lower elasticity than the substrate 20. The support substrate 80 includes a second surface 82 located on the substrate 20 side and a first surface 81 located on the opposite side of the second surface 82. In the example shown in FIG. 17, the support substrate 80 supports the wiring 52 on the first surface 81 side thereof. Further, the support substrate 80 is joined to the first surface 21 of the base material 20 on the second surface 82 side thereof. For example, an adhesive layer 85 containing an adhesive may be provided between the base material 20 and the support substrate 80. As the material constituting the adhesive layer 85, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer 85 is, for example, 5 μm or more and 200 μm or less.

FIG. 18 is an enlarged cross-sectional view of the wiring board 10 of FIG. In this modification, when the tension is removed from the base material 20 bonded to the support substrate 80 and the base material 20 contracts, the peaks and valleys similar to the peaks 53 and valleys 54 of the wiring 52 are supported. It also appears on the substrate 80. The characteristics and dimensions of the support substrate 80 are set so that such peaks and valleys are easily formed. For example, the support substrate 80 has an elastic modulus larger than the first elastic modulus of the substrate 20. In the following description, the elastic modulus of the support substrate 80 is also referred to as a third elastic modulus.

Although not shown, the support substrate 80 may support the wiring 52 on the second surface 82 side thereof.

The third elastic modulus of the support substrate 80 is, for example, 100 MPa or more, more preferably 1 GPa or more. Further, the third elastic modulus of the support substrate 80 may be 100 times or more and 50,000 times or less, preferably 1000 times or more and 10000 times or less of the first elastic modulus of the base material 20. By setting the third elastic modulus of the support substrate 80 in this way, it is possible to prevent the period F1 of the peak portion 53 and the valley portion 54 from becoming too small. In addition, it is possible to suppress the occurrence of local bending in the mountain portion 53 and the valley portion 54.
If the elastic modulus of the support substrate 80 is too low, the support substrate 80 is likely to be deformed during the process of forming the wiring 52, and as a result, it becomes difficult to align the wiring 52 with respect to the support substrate 80. Further, if the elastic modulus of the support substrate 80 is too high, it becomes difficult to restore the base material 20 at the time of relaxation, and the base material 20 is likely to be cracked or broken.

The thickness of the support substrate 80 is, for example, 500 nm or more and 10 μm or less, more preferably 1 μm or more and 5 μm or less. If the thickness of the support substrate 80 is too small, it becomes difficult to handle the support substrate 80 in the manufacturing process of the support substrate 80 and the process of forming a member such as a wiring 52 on the support substrate 80. If the thickness of the support substrate 80 is too large, it becomes difficult to restore the base material 20 at the time of relaxation, and the target base material 20 cannot be expanded or contracted.

As the material constituting the support substrate 80, for example, polyethylene naphthalate, polyimide, polyethylene terephthalate, polycarbonate, acrylic resin and the like can be used. Among them, polyethylene naphthalate or polyimide having good durability and heat resistance can be preferably used.

The third elastic modulus of the support substrate 80 may be 100 times or less of the first elastic modulus of the base material 20. The method of calculating the third elastic modulus of the support substrate 80 is the same as that of the base material 20 or the adjusting layer 41.

(Manufacturing method of wiring board)
Next, a method of manufacturing the wiring board 10 according to this modification will be described with reference to FIGS. 19 (a) to 19 (c).

First, the support substrate 80 is prepared. Subsequently, the wiring 52 is provided on the first surface 81 of the support substrate 80. For example, first, a metal layer such as a copper layer is formed on the first surface 81 of the support substrate 80 by a vapor deposition method, a plating method, or the like. Subsequently, the metal layer is processed by using a photolithography method and an etching method. As a result, the wiring 52 can be obtained on the first surface 81.

Subsequently, as shown in FIG. 19B, a first stretching step of applying a first tension T1 to the base material 20 in the first direction D1 to stretch the base material 20 to the dimension L1 is carried out. Subsequently, a wiring forming step of providing the wiring 52 on the first surface 21 of the base material 20 in a state of being stretched by the first tension T1 in the first stretching step is carried out. In the wiring forming step of this modification, as shown in FIG. 19B, the second surface 82 of the support substrate 80 provided with the wiring 52 is joined to the first surface 21 of the base material 20. At this time, the adhesive layer 85 may be provided between the base material 20 and the support substrate 80.

Then, the first shrinkage step of removing the first tension T1 from the base material 20 is carried out. As a result, as shown by an arrow C in FIG. 19C, the base material 20 contracts in the first direction D1, and the support substrate 80 and the wiring 52 provided on the base material 20 are also deformed. Deformation of the support substrate 80 and the wiring 52 can occur as a bellows-shaped portion as described above.

After that, a cutting step of partially cutting the base material 20 and the support substrate 80 is performed. In the cutting step, as in the case of the above-described embodiment, the base material 20 is placed in the first region 31 and the second region 32 and the first region 31 facing each other at intervals in the first direction D1. It is divided into an intermediate region 33 including a first end 331 connected and a second end 332 connected to the second end 332. Further, the support substrate 80 is partitioned in the same manner as the substrate 20. As a method for cutting the base material 20 and the support substrate 80, laser processing can be used as in the case of the above-described embodiment. For example, the laser is used to remove the portion between the first region 31 and the second region 32 of the base material 20 other than the portion around the intermediate portion 63 of the wiring 52 and the portion of the corresponding support substrate 80. Irradiate the base material 20 and the support substrate 80. In this way, a wiring board 10 including a base material 20 having an intermediate region 33 including a plurality of stretchable structure portions 34 and a support substrate 80 including a portion having the same contour as the intermediate region 33 in a plan view is obtained. be able to.

In addition, in FIGS. 17 to 19, an example in which the support substrate 80 is bonded to the base material 20 via the adhesive layer 85 is shown. However, the present invention is not limited to this, and the support substrate 80 may be bonded to the base material 20 by a method such as molecularly modifying the non-adhesive surface to bond the molecules. In this case, the adhesive layer may not be provided between the base material 20 and the support substrate 80.

Although some modifications to the above-described embodiments have been described, it is naturally possible to apply a plurality of modifications in combination as appropriate.

10 Wiring board 20 Base material 21 First surface 22 Second surface 23 Mountain part 24 Valley part 25 Mountain part 26 Valley part 31 First area 32 Second area 33 Intermediate area 331 First end 332 Second end 34 Telescopic structure part 35 1st element 36 2nd element 37 Connection element 41 Adjustment layer 43 Mountain part 44 Valley part 45 Bellows shape part 51 Electronic component 52 Wiring 53 Mountain part 54 Valley part 55 Bellows shape part 61 1st part 62 2nd part 63 Intermediate part 71 Adhesive layer 72 Adhesive part 73 Protective sheet 80 Support substrate 81 First surface 82 Second surface 85 Adhesive layer 100 Object

Claims (18)

An intermediate region including a first region and a second region facing each other at intervals in the first direction, a first end connected to the first region, and a second end connected to the second region. With a stretchable substrate, including
A first portion located in the first region, a second portion located in the second region, and an intermediate portion located in the intermediate region and connected to the first portion and the second portion. With wiring, including
The intermediate region of the base material has a plurality of stretchable structural portions arranged between the first region and the second region.
The telescopic structure portion extends in a direction intersecting the first direction and faces the first element and the second element in the first direction, and a connecting element connecting the first element and the second element. Including the wiring board. The wiring board according to claim 1, wherein the minimum value of the distance between the first element and the second element is smaller than 0.4 times the arrangement period of the plurality of elastic structure portions. The wiring board according to claim 1, wherein the minimum value of the distance between the first element and the second element is smaller than 0.2 times the arrangement period of the plurality of telescopic structures. The maximum value of the distance between the first element and the second element is larger than 0.3 times the arrangement period of the plurality of elastic structure portions, according to any one of claims 1 to 3. Wiring board. The wiring board according to any one of claims 1 to 4, wherein the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged in a direction in which the wiring extends. The wiring is located on the first surface side of the base material and is located on the first surface side.
The amplitudes of the peaks and valleys appearing on the surface of the wiring board on the first surface side of the base material that overlaps the bellows-shaped portion of the wiring are on the opposite side of the first surface of the base material. The wiring board according to claim 5, which is larger than the amplitude of the peaks and valleys appearing on the surface of the wiring board on the side of the second surface where the wiring is located, which overlaps with the bellows-shaped portion of the wiring. The wiring is located on the first surface side of the base material and is located on the first surface side.
The period of the peaks and valleys appearing on the surface of the wiring board on the first surface side of the base material that overlaps the bellows-shaped portion of the wiring is on the opposite side of the first surface of the base material. The wiring board according to claim 5 or 6, which is smaller than the period of the peaks and valleys appearing on the surface of the wiring board on the side of the second surface where the wiring is located, which overlaps with the bellows-shaped portion of the wiring. The wiring is located on the first surface side of the base material and is located on the first surface side.
The positions of the peaks and valleys appearing on the surface of the wiring board on the first surface side of the base material that overlaps the bellows-shaped portion of the wiring are on the opposite side of the first surface of the base material. According to any one of claims 5 to 7, the positions of the peaks and valleys appearing on the surface of the wiring board on the side of the second surface where the wirings are located overlap with the bellows-shaped portion of the wirings. The wiring board described. The wiring is located on the first surface side of the base material and is located on the first surface side.
The wiring board according to any one of claims 1 to 8, wherein the wiring board is located on the first surface side of the base material and includes an adjusting layer having an elastic modulus lower than that of the wiring. The wiring substrate according to any one of claims 1 to 9, wherein the base material contains a thermoplastic elastomer, silicone rubber, urethane gel, or silicon gel. The wiring board according to any one of claims 1 to 10, further comprising a support board. The wiring board according to claim 11, wherein the support substrate has a higher elastic modulus than the base material and supports the wiring. The wiring board according to claim 11 or 12, wherein the support substrate contains polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, or polyethylene terephthalate. The wiring board according to any one of claims 1 to 13, further comprising an electronic component electrically connected to the wiring in at least one of the first region and the second region of the base material. It is a method of manufacturing a wiring board.
An extension step of applying tension to a stretchable base material in at least one of the in-plane directions of the first surface of the base material to extend the base material.
A wiring forming step of providing wiring on the first surface side of the base material in a state of being stretched by the stretching step, and a wiring forming step.
The base material is partially cut so that the base material is spaced apart from each other in the first direction to face the first and second regions, the first end connected to the first region, and the said. The intermediate region including the second end connected to the second region and the cutting step for partitioning into the second region are provided.
The wiring reaches the second region from the first region of the base material through the intermediate region.
The intermediate region of the base material has a plurality of stretchable structural portions arranged between the first region and the second region.
The telescopic structure portion extends in a direction intersecting the first direction and faces the first element and the second element in the first direction, and a connecting element connecting the first element and the second element. A method of manufacturing a wiring board, including. The method for manufacturing a wiring board according to claim 15, further comprising a shrinking step of removing the tension from the base material after the cutting step. The production of the wiring board according to claim 15, wherein the wiring forming step includes a step of forming wiring on the support substrate and a step of attaching the support substrate to the first surface side of the stretched base material. Method. The method for manufacturing a wiring board according to claim 17, further comprising a shrinking step of removing the tension from the base material after the wiring forming step and before the cutting step.