JP2020141020A - Light emitting device and luminaire - Google Patents

Abstract

To provide a light emitting device which can perform color matching and is miniaturized.SOLUTION: A light emitting device 10 includes a substrate 11, two or more first light emitting element arrays 12a each having a plurality of first light emitting elements 12a1 arranged along a first direction on the substrate 11, two or more second light emitting element arrays 12b each having a plurality of second light emitting elements 12b1 arranged along a second direction on the substrate 11, a first metal wire 19a connecting the first light emitting elements 12a1, a second metal wire 19b connecting the second light emitting elements 12b1, a translucent wall portion 16b that stands among the substrate 11, the first metal wire 19a, and the second metal wire 19b, a first sealing member 13 arranged in a first region 11a which is configured to be surrounded by the two first metal wires 19a and the two second metal wires 19b in a plan view of the substrate 11, and a second sealing member 14 which is arranged in a second region 11b different from the first region 11a in a plan view, and is different from the first sealing member 13.SELECTED DRAWING: Figure 3

Description

The present invention relates to a light emitting device having a configuration in which a plurality of light emitting elements are arranged on a substrate, and a lighting device including the light emitting device.

Light emitting elements such as light emitting diodes (LEDs: Light Emitting Diodes) are widely used as highly efficient and space-saving light sources in various lighting devices such as lighting applications or display applications. Patent Document 1 discloses a color-adjustable light-emitting device in which a plurality of light-emitting elements are sealed with two types of sealing resins (sealing members) containing different wavelength conversion materials.

Japanese Unexamined Patent Publication No. 2014-086694

However, when two types of sealing members are formed by a dispenser or the like in order to have a color matching function as in the light emitting device of Patent Document 1, there is a problem that the light emitting device becomes large in size.

Therefore, the present invention provides a light emitting device and a lighting device that can be toned and are miniaturized.

The light emitting device according to one aspect of the present invention includes a substrate, two or more first light emitting element trains each having a plurality of first light emitting elements arranged along the first direction on the substrate, and the light emitting device on the substrate. In each of the two or more second light emitting element trains each having a plurality of second light emitting elements arranged along the second direction intersecting the first direction, and the two or more first light emitting element trains. A first metal wire that electrically connects the first light emitting elements, a second metal wire that electrically connects the second light emitting elements in each of the two or more second light emitting element rows, and the substrate. A translucent wall portion erected between the first metal wire and the second metal wire, and two first metal wires and two first metal wires in a plan view of the substrate. The first sealing member arranged in the first region surrounded by the two metal wires and the second sealing member arranged in the second region different from the first region in the plan view and different from the first sealing member. A second sealing member is provided.

The lighting device according to one aspect of the present invention includes the above-mentioned light emitting device and a lighting device that supplies electric power to the light emitting device to light the light emitting device.

According to one aspect of the present invention, it is possible to provide a light emitting device and a lighting device that are capable of color matching and are miniaturized.

FIG. 1 is an external perspective view of the light emitting device according to the first embodiment. FIG. 2 is a plan view showing an arrangement of light emitting elements in the light emitting device according to the first embodiment. FIG. 3 is a plan view showing a first example of the arrangement of the first region and the second region in the light emitting device according to the first embodiment. FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG. FIG. 5 is a cross-sectional view taken along the line VV of FIG. FIG. 6 is an enlarged view of an upper surface portion for explaining a translucent film included in the light emitting device according to the first embodiment. FIG. 7A is a cross-sectional view taken along the line VIa-VIa of FIG. FIG. 7B is a cross-sectional view taken along the line VIb-VIb of FIG. FIG. 8 is a plan view showing a second example of the arrangement of the first region and the second region in the light emitting device according to the first embodiment. FIG. 9 is a plan view showing a third example of the arrangement of the first region and the second region in the light emitting device according to the first embodiment. FIG. 10 is a flowchart showing a method of manufacturing the light emitting device according to the first embodiment. FIG. 11 is a cross-sectional view of the light emitting device according to the first modification of the first embodiment, which corresponds to the VV line of FIG. FIG. 12 is a cross-sectional view of the light emitting device according to the second modification of the first embodiment, which corresponds to the IV-IV line of FIG. FIG. 13 is a cross-sectional view of the lighting device according to the second embodiment. FIG. 14 is an external perspective view of the lighting device and its peripheral members according to the second embodiment.

Hereinafter, the light emitting device and the lighting device according to the embodiment will be described with reference to the drawings. It should be noted that all of the embodiments described below show comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement positions of the components, connection forms, steps, and the order of the steps shown in the following embodiments are examples, and are not intended to limit the present invention. Further, among the components in the following embodiments, the components not described in the independent claims will be described as arbitrary components.

It should be noted that each figure is a schematic view and is not necessarily exactly illustrated. Further, in each figure, substantially the same configuration is designated by the same reference numerals, and duplicate description may be omitted or simplified.

Further, in the present specification and drawings, the X-axis, the Y-axis, and the Z-axis represent the three axes of the three-dimensional Cartesian coordinate system. The X-axis and the Y-axis are orthogonal to each other and both are orthogonal to the Z-axis. The Z-axis direction is a direction parallel to the optical axis of the light emitting device. In the following embodiments, "planar view" means, for example, viewing from the Z-axis direction.

Further, in the present specification, terms indicating relationships between elements such as parallel and equal, terms indicating the shape of elements such as quadrangles and circles, numerical values, and numerical ranges have only strict meanings. It is not an expression that expresses, but an expression that means that a substantially equivalent range, for example, a difference of about several percent is included.

(Embodiment 1)
Hereinafter, the light emitting device 10 according to the present embodiment will be described with reference to FIGS. 1 to 10.

[1-1. Configuration of light emitting device]
First, the configuration of the light emitting device 10 according to the present embodiment will be described with reference to FIGS. 1 to 9. FIG. 1 is an external perspective view of the light emitting device 10 according to the present embodiment. FIG. 2 is a plan view showing an arrangement of light emitting elements in the light emitting device 10 according to the present embodiment. FIG. 3 is a plan view showing a first example of the arrangement of the first region 11a and the second region 11b in the light emitting device 10 according to the present embodiment. Note that FIG. 2 shows the light emitting device 10 before the sealing member is arranged. FIG. 3 shows a light emitting device 10 in which the first sealing member 13 and the second sealing member 14 are arranged from the state of FIG.

As shown in FIGS. 1 to 3, the light emitting device 10 includes a substrate 11, a plurality of first light emitting elements 12a1, a plurality of second light emitting elements 12b1, a first sealing member 13, and a second sealing member. 14, the third sealing member 15, the translucent film 16, the frame body 17, the electrode lands 18a1, 18a2, 18b1, and 18b2, the first metal wire 19a, and the second metal wire 19b. Be prepared. An external commercial power source or the like (not shown) is connected to the electrode lands 18a1, 18a2, 18b1 and 18b2, and power is supplied from the external commercial power source or the like, so that the light emitting device 10 emits light. In FIG. 1 and the like, the wiring for connecting the electrode lands 18a1, 18a2, 18b1 and 18b2 to the first metal wire 19a and the second metal wire 19b is not shown. In the following, when the first light emitting element 12a1 and the second light emitting element 12b1 are not distinguished, they are also simply referred to as the light emitting element 12. Further, in the following, when the first metal wire 19a and the second metal wire 19b are not distinguished, it is also simply described as the metal wire 19. Further, in the following, when the electrode lands 18a1, 18a2, 18b1 and 18b2 are not distinguished, they are also simply referred to as electrode lands 18.

The light emitting device 10 is an LED module having a so-called COB (Chip On Board) structure in which a plurality of light emitting elements 12 are directly mounted on a substrate 11, and emits white light. Further, as shown in FIG. 2, on the substrate 11, five rows (5 straight and 5 average) of first light emitting element rows 12a in which five first light emitting elements 12a1 are connected in series are arranged, and six of them are arranged. The second light emitting element rows 12b in which the second light emitting elements 12b1 of the above are connected in series are arranged in 6 rows (5 straights and 6 averages). The power supply to the first light emitting element row 12a of the fifth row is performed via the electrode lands 18a1 and 18a2. Further, power is supplied to the second light emitting element row 12b of the 6th row via the electrode lands 18b1 and 18b2. That is, the power supply to the first light emitting element row 12a and the second light emitting element row 12b is performed independently. The number of the first light emitting elements 12a1 included in the first light emitting element row 12a and the number of the second light emitting elements 12b1 included in the second light emitting element row 12b are not particularly limited as long as they are 2 or more. Further, the number of light emitting elements included in the light emitting element row may be different for each first light emitting element row 12a and for each second light emitting element row 12b. Further, the number of each of the first light emitting element row 12a and the second light emitting element row 12b is not particularly limited as long as it is 2 or more.

[1-1-1. substrate]
First, the configuration of the substrate 11 will be described. The substrate 11 is a base on which a plurality of light emitting elements 12 are arranged. The substrate 11 is, for example, a metal-based substrate or a ceramic substrate. Further, the substrate 11 may be a resin substrate using a resin as a base material.

As the ceramic substrate, an alumina substrate made of aluminum oxide (alumina), an aluminum nitride substrate made of aluminum nitride, or the like is adopted. Further, as the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate, or the like having an insulating film formed on the surface thereof is adopted. As the resin substrate, for example, a glass epoxy substrate made of glass fiber and an epoxy resin is adopted.

As the substrate 11, for example, a substrate having a high light reflectance (for example, a light reflectance of 90% or more) may be adopted. By adopting a substrate having a high light reflectance as the substrate 11, the light emitted by the light emitting element 12 can be reflected on the surface of the substrate 11. As a result, the light extraction efficiency of the light emitting device 10 is improved. Examples of such a substrate include a white ceramic substrate using alumina as a base material.

Further, as the substrate 11, a translucent substrate having a high light transmittance may be adopted. Examples of such a substrate include a translucent ceramic substrate made of polycrystalline alumina or aluminum nitride, a transparent glass substrate made of glass, a crystal substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin substrate made of a transparent resin material. Illustrated. The substrate 11 shown in FIG. 1 is a quadrangle (rectangle), but may be a polygon such as a circle or a hexagon.

Further, as shown in FIG. 3, the main surface of the substrate 11 (the surface on which the plurality of light emitting elements 12 are mounted, and the surface on the Z-axis plus side in the present embodiment) is the first region 11a and the first surface. It has two regions 11b. The first region 11a is a region of the dot-shaped hatching having a high dot density, and the second region 11b is a region of the dot-shaped hatching having a lower dot density than the first region 11a. A plurality of the first region 11a and the second region 11b are arranged on the main surface of the substrate 11. Each of the first region 11a and the second region 11b is, for example, a region surrounded by two first light emitting element rows 12a and two second light emitting element rows 12b in a plan view of the substrate 11, that is, two first regions. It is an area surrounded by a metal wire 19a and two second metal wires 19b. Although details will be described later, a translucent film 16 is formed between the first metal wire 19a and the substrate 11 and the second light emitting element 12b1 and between the second metal wire 19b and the substrate 11. ing. The first region 11a and the second region 11b are partitioned by a translucent film 16 or the like. Further, at least a part of the plurality of light emitting elements 12 is arranged at the boundary between the first region 11a and the second region 11b, for example.

[1-1-2. Light emitting element]
The light emitting element 12 is a light source of the light emitting device 10 and is a light emitting element that emits light. The light emitting element 12 is, for example, a blue LED (Light Emitting Diode) chip that emits blue light. As the light emitting element 12, for example, a gallium nitride based LED chip having a center wavelength (peak wavelength of the emission spectrum) of 430 nm or more and 480 nm or less, which is made of an InGaN-based material, is adopted.

On the substrate 11, two or more first light emitting element trains 12a each having a plurality of first light emitting elements 12a1 arranged along the first direction, and along a second direction intersecting the first direction. There are two or more second light emitting element rows 12b, each of which has a plurality of second light emitting elements 12b1 arranged therein. The first light emitting element row 12a is provided so as to extend along the Y-axis direction (an example of the first direction). In other words, the plurality of first light emitting elements 12a1 are arranged along the Y-axis direction. In the present embodiment, the second light emitting element row 12b is provided so as to extend along a direction (X-axis direction, which is an example of the second direction) orthogonal to the first light emitting element row 12a in a plan view. .. In other words, the plurality of second light emitting elements 12b1 are arranged along the X-axis direction.

As described above, the light emitting device 10 includes two or more first light emitting element rows 12a and two or more second light emitting element rows 12b extending in different directions from each other. Further, the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1 are arranged at positions that are 180 ° rotationally symmetric with respect to the center in the plan view of the substrate 11, for example.

In the example of FIG. 2, the first light emitting element row 12a is configured by arranging a plurality of first light emitting elements 12a1 in a straight line, but the arrangement position of the plurality of first light emitting elements 12a1 is limited to this. Not done. The plurality of first light emitting elements 12a1 constituting the first light emitting element row 12a may be arranged in a zigzag shape, for example, as long as they are connected in series. The same applies to the plurality of second light emitting elements 12b1 constituting the second light emitting element row 12b.

As shown in FIG. 2, at least one second light emitting element 12b1 among the plurality of second light emitting elements 12b1 is adjacent to each other among the plurality of first light emitting elements 12a1 constituting the first light emitting element train 12a. It may be arranged between the two first light emitting elements 12a1. In this case, the second light emitting element 12b1 and the first metal wire 19a are not electrically connected. In the present embodiment, the first metal wire 19a is arranged so as to straddle the second light emitting element 12b1 (see FIG. 4 described later). The translucent film 16 is also provided upright between the second light emitting element 12b1 and the first metal wire 19a.

The shapes of the first light emitting element 12a1 and the second light emitting element 12b1 in a plan view are, for example, long. In each of the plurality of first light emitting elements 12a1, one of the longitudinal direction and the lateral direction of the first light emitting element 12a1 is arranged along the first direction. Further, in each of the plurality of second light emitting elements 12b1, one of the longitudinal direction and the lateral direction of the second light emitting element 12b1 is arranged along the second direction. In the present embodiment, each of the plurality of first light emitting elements 12a1 is arranged so that the longitudinal direction is along the Y-axis direction, and each of the plurality of second light emitting elements 12b1 has an X-axis in the longitudinal direction. It is arranged along the direction. That is, the first light emitting element 12a1 and the second light emitting element 12b1 are arranged so that the longitudinal direction of the first light emitting element 12a1 and the longitudinal direction of the second light emitting element 12b1 are orthogonal to each other.

The shapes of the first light emitting element 12a1 and the second light emitting element 12b1 in a plan view are not limited to a long shape, and may be, for example, a square shape.

[1-1-3. Metal wire, etc.]
The first metal wire 19a and the second metal wire 19b are wirings for power supply provided to supply electric power (current) to the first light emitting element 12a1 and the second light emitting element 12b1.

The first metal wire 19a is a bonding wire that electrically and physically connects the first light emitting elements 12a1 to each other in each of the two or more first light emitting element rows 12a. The first metal wire 19a electrically connects a plurality of first light emitting elements 12a1 included in the first light emitting element row 12a, for example, by Chip-to-Chip.

The second metal wire 19b is a bonding wire that electrically and physically connects the second light emitting elements 12b1 to each other in each of the two or more second light emitting element rows 12b. The second metal wire 19b electrically connects a plurality of second light emitting elements 12b1 included in the second light emitting element row 12b, for example, by Chip-to-Chip.

The metal wire 19 is formed of, for example, gold, but may be formed of other metals such as silver or copper. The first metal wire 19a and the second metal wire 19b are not electrically connected.

The electrode lands 18a1 and 18a2 are electrically connected to the first metal wire 19a and the first light emitting element 12a1 via wiring (not shown). The electrode lands 18b1 and 18b2 are electrically connected to the second metal wire 19b and the second light emitting element 12b1 via wiring (not shown). For example, the electrode lands 18a1 and 18b1 are high-voltage side (plus side) electrode lands, and the electrode lands 18a2 and 18b2 are low-voltage side (minus side) electrode lands. The electrode lands and the wiring (not shown) are formed of, for example, gold, but may be formed of other metals such as silver or copper.

[1-1-4. Sealing member]
The first sealing member 13 to the third sealing member 15 will be further described with reference to FIGS. 4 and 5. FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG.

As shown in FIG. 3, the first sealing member 13 is arranged in a first region 11a configured to be surrounded by two first metal wires 19a and two second metal wires 19b in a plan view. One area 11a is covered. The first region 11a is, for example, a partition wall 20 (see, for example, FIG. 4) formed for each first light emitting element row 12a, and a plurality of first light emitting elements 12a1 constituting the first light emitting element row 12a. A partition wall 20 composed of the translucent film 16 and a partition wall 20 formed for each second light emitting element row 12b, and a plurality of second light emitting elements 12b1 constituting the second light emitting element row 12b. It is a region surrounded by a partition wall 20 composed of the translucent film 16 and the translucent film 16. The first sealing member 13 is formed into a plan view shape corresponding to the region by being dammed by the partition wall 20 surrounding the region.

As shown in FIG. 3, the second sealing member 14 is arranged in a second region 11b different from the first region 11a in a plan view, and covers the second region 11b. The second sealing member 14 is arranged in a region surrounded by the partition wall 20 and in which the first sealing member 13 is not arranged. The second sealing member 14 is formed into a plan view shape corresponding to the region by being dammed by the partition wall 20 surrounding the region.

At least one of the first sealing member 13 and the second sealing member 14 is also arranged in the region surrounded by the partition wall 20 and the frame body 17. The partition wall 20 is formed between the cut surface cut in the YZ plane (see, for example, FIG. 4) and the cut surface cut in the XZ plane, sandwiched between the frame bodies 17. Further, in the present embodiment, since the plurality of first light emitting elements 12a1 and the second light emitting element 12b1 arranged at the boundary between the first region 11a and the second region 11b are arranged linearly, the partition wall 20 is formed. It is formed in a straight line.

The third sealing member 15 is a sealing member that covers the plurality of light emitting elements 12, the first sealing member 13, the second sealing member 14, the translucent film 16, and the metal wire 19. The third sealing member 15 is formed in a rectangular shape by being dammed by an annular (for example, rectangular annular) frame 17 in a plan view. The third sealing member 15 may not be provided.

The first sealing member 13 to the third sealing member 15 are different members. Specifically, the first sealing member 13 to the third sealing member 15 are members containing different materials. In the present embodiment, the type of the phosphor contained in the first sealing member 13 and the second sealing member 14 is different. Further, the third sealing member 15 does not contain a phosphor. The first sealing member 13 to the third sealing member 15 will be further described with reference to FIG. FIG. 5 is a cross-sectional view taken along the line VV of FIG.

As shown in FIG. 5, the first sealing member 13 is, for example, a translucent resin material containing a plurality of phosphors that convert the wavelength of light emitted by at least one of the first light emitting element 12a1 and the second light emitting element 12b1. It is composed of (base material). In the present embodiment, the first sealing member 13 is transparent including a plurality of phosphors 13r (fluorescent particles) that convert the wavelength of light emitted by the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1. It is composed of a light resin material. For the base material of the first sealing member 13, for example, a silicone resin is used, but an epoxy resin, a urea resin, or the like may be used. The phosphor 13r fluoresces using the light emitted by the first light emitting element 12a1 and the second light emitting element 12b1 as excitation light. The phosphor 13r is, for example, a red phosphor such as CaAlSiN ₃ : Eu ²⁺ phosphor having an emission peak wavelength of 610 nm or more and 620 nm or less, or (Sr, Ca) AlSiN ₃ : Eu ²⁺ phosphor. The phosphor 13r is an example of the first wavelength conversion material.

The second sealing member 14 is made of, for example, a translucent resin material (base material) containing a plurality of phosphors that convert the wavelength of light emitted by at least one of the first light emitting element 12a1 and the second light emitting element 12b1. In the present embodiment, the second sealing member 14 is transparent including a plurality of phosphors 14y (fluorescent particles) that convert the wavelength of light emitted by the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1. It is composed of a light resin material. For the base material of the second sealing member 14, for example, a silicone resin is used, but an epoxy resin, a urea resin, or the like may be used. Further, the phosphor 14y emits fluorescence different from that of the phosphor 13r by using the light emitted by the first light emitting element 12a1 and the second light emitting element 12b1 as excitation light. The phosphor 14y is, for example, an yttrium aluminum garnet (YAG) -based yellow phosphor having an emission peak wavelength of 550 nm or more and 570 nm or less. The phosphor 14y is an example of a second wavelength conversion material.

The third sealing member 15 is made of, for example, a translucent resin material (base material) that does not contain a plurality of phosphors (fluorescent particles) that convert the wavelength of light emitted by the light emitting element 12. That is, the third sealing member 15 arranged directly above the first region 11a and the second region 11b does not have to contain a phosphor. In this case, the third sealing member 15 is transparent. Therefore, the light emitted from the light emitting element 12 and directly incident on the third sealing member 15 (for example, blue light) is emitted without wavelength conversion.

For the base material of the third sealing member 15, for example, a silicone resin is used, but an epoxy resin, a urea resin, or the like may be used. Further, when the third sealing member 15 does not contain a phosphor, it may contain a light diffusing material 15b (fine particles) such as silica or calcium carbonate.

When the plurality of first light emitting elements 12a1 and the second light emitting element 12b1 emit blue light, a part of the emitted blue light is wavelength-converted to red light by the phosphor 13r contained in the first sealing member 13. .. Further, a part of the emitted blue light is wavelength-converted to yellow light by the phosphor 14y contained in the second sealing member 14. Then, the blue light not absorbed by the phosphor 13r and the phosphor 14y, the yellow light wavelength-converted by the phosphor 14y, and the red light wavelength-converted by the phosphor 13r are contained in the third sealing member 15. Is diffused and mixed with. As a result, white light is emitted from the third sealing member 15.

The phosphor contained in the first sealing member 13 and the second sealing member 14 is not limited to the above. The first sealing member 13 and the second sealing member 14 may contain a phosphor that is excited by the light emitted by the light emitting element 12 and emits fluorescence. Further, at least one of the first sealing member 13 and the second sealing member 14 may contain a filler. In the present embodiment, the fillers 13b and 14b are included in the first sealing member 13 and the second sealing member 14. The fillers 13b and 14b are, for example, silica having a particle size of about 10 nm. Due to the inclusion of the fillers 13b and 14b, the fillers 13b and 14b serve as resistance and the phosphors 13r and 14y are less likely to settle. Therefore, the phosphors 13r and 14y can be uniformly dispersed and arranged in the first sealing member 13 and the second sealing member 14.

The third sealing member 15 may include a plurality of phosphors (fluorescent particles) that convert the wavelength of light emitted by at least one of the first light emitting element 12a1 and the second light emitting element 12b1. The third sealing member 15 may include, for example, at least one of the phosphors 13r and 14y. Further, the third sealing member 15 is, for example, a plurality of phosphors (fluorescent particles) that convert the wavelength of the light emitted by the first light emitting element 12a1 and the second light emitting element 12b1 into a wavelength different from that of the phosphors 13r and 14y. May include. The phosphor emits fluorescence different from that of the phosphors 13r and 14y by using the light emitted by at least one of the first light emitting element 12a1 and the second light emitting element 12b1 as excitation light. Examples of such a phosphor include a green phosphor such as Lu ₃ Al ₅ O ₁₂ : Ce ^{3 +} phosphor having an emission peak wavelength of 540 nm or more and 550 nm or less. Such a phosphor is an example of a third wavelength conversion material. When the third sealing member 15 contains a phosphor, the third sealing member 15 may also contain a filler. The third sealing member 15 also has a function of protecting the light emitting element 12 and the metal wire 19 from dust, moisture, external force, and the like.

The fact that the first sealing member 13 to the third sealing member 15 are different members is not limited to the above. The type of resin used for the first sealing member 13 to the third sealing member 15 may be different, or the content of the contained phosphor may be different. For example, each of the first sealing member 13 and the second sealing member 14 contains a red phosphor and a green phosphor, and their content ratios may be different. Further, at least one of the first sealing member 13 to the third sealing member 15 may contain a plurality of phosphors. For example, the second sealing member 14 may contain a red phosphor and a green phosphor.

At least two of the first sealing member 13 to the third sealing member 15 may be the same member. For example, the first sealing member 13 may include the phosphor 13r, the second sealing member 14 may include the phosphor 14y, and the third sealing member 15 may include one of the phosphors 13r and 14y.

The height (length in the Z-axis direction) of the first sealing member 13 and the second sealing member 14 is, for example, equal to or less than the height of the plurality of light emitting elements 12. FIG. 5 shows an example in which the heights of the first sealing member 13 and the second sealing member 14 are equal to the heights of the plurality of first light emitting elements 12a1. In this case, the first sealing member 13 and the second sealing member 14 do not come into contact with each other. Further, a part of the metal wire 19 (the first metal wire 19a in FIG. 5) is exposed from the first sealing member 13 and the second sealing member 14. The third sealing member 15 covers the exposed portion of the metal wire 19. At least a part of each of the first sealing member 13 to the third sealing member 15 comes into contact with the translucent film 16.

The light emitting element 12 emits light not only in the positive direction of the Z axis but also in a direction orthogonal to the Z axis (for example, a direction parallel to the main surface of the substrate 11). For example, the light emitting element 12 emits stronger light in the direction orthogonal to the Z axis than in the positive direction of the Z axis and the direction orthogonal to the Z axis. Therefore, it is preferable that a sealing member containing a phosphor (for example, the first sealing member 13 and the second sealing member 14) is arranged on the side of the light emitting element 12.

[1-1-5. Frame]
The frame body 17 is a member for surrounding the plurality of light emitting elements 12 in a plan view and damming the third sealing member 15 before being cured. In other words, the frame body 17 is a dam material, and is adjacent to the third sealing member 15 as shown in FIGS. 1 and 4.

For the frame body 17, for example, a thermosetting resin having an insulating property, a thermoplastic resin, or the like is used. More specifically, a silicone resin, a phenol resin, an epoxy resin, a bismaleimide triazine resin, a polyphthalamide (PPA) resin, or the like is used for the frame body 17.

It is desirable that the frame body 17 has light reflectivity in order to increase the light extraction efficiency of the light emitting device 10. For the frame body 17, for example, a white resin containing a white pigment or the like may be used. Further, in order to enhance the light reflectivity of the frame body 17, particles such as TiO ₂ , Al ₂ O ₃ , ZrO ₂ , and MgO may be contained in the frame body 17. The material of the frame body 17 is not limited to resin, and for example, a material such as ceramic may be used.

In the light emitting device 10, the frame body 17 is formed in a square shape (for example, a square shape) so as to surround the plurality of light emitting elements 12 when viewed in a plan view. Thereby, the light extraction efficiency of the light emitting device 10 can be improved. The frame body 17 may have a shape that surrounds the plurality of light emitting elements 12 in a plan view, and may be formed in an annular shape or the like, for example.

Further, the height (thickness) of the frame body 17 with respect to the substrate 11 is higher than the height (distance to the metal wire 19) of the metal wire 19 with respect to the substrate 11. The height of the frame body 17 is, for example, 0.6 mm.

The frame body 17 may be formed of a black resin. Since the frame body 17 formed of the black resin absorbs light, it is effective when the reflection of the light by the frame body 17 becomes unnecessary light (stray light). The black resin is formed by adding carbon powder to a base material such as silicone.

[1-1-6. Translucent film]
Next, the translucent film 16 will be described with reference to FIGS. 6 to 7B. FIG. 6 is an enlarged view of an upper surface portion for explaining the translucent film 16 included in the light emitting device 10 according to the present embodiment. FIG. 7A is a cross-sectional view taken along the line VIa-VIa of FIG. FIG. 7B is a cross-sectional view taken along the line VIb-VIb of FIG. In FIG. 6, the first sealing member 13 to the third sealing member 15 are not shown for the sake of explanation.

As shown in FIGS. 6 to 7B, the translucent film 16 is formed so as to cover the first metal wire 19a. Further, although not shown, the translucent film 16 is formed so as to cover the second metal wire 19b. The translucent film 16 is a translucent resin material that covers the first metal wire 19a and the second metal wire 19b. In the following, the first metal wire 19a will be described as an example, but the same can be said for the second metal wire 19b.

As shown in FIGS. 7A and 7B, the translucent film 16 covers, for example, the entire circumference of the first metal wire 19a in the circumferential direction. Further, the translucent film 16 has a translucent wall portion 16b that stands between the first metal wire 19a and the substrate 11 and the second light emitting element 12b1. In the present embodiment, as shown in FIGS. 4, 7A and 7B, the translucent film 16 is located between the first metal wire 19a and the substrate 11 and the second light emitting element 12b1, and the substrate 11 and the second light emitting element 12b1 are located. It has a wall portion 16b erected from the second light emitting element 12b1 to the first metal wire 19a, and a layered layer portion 16c covering at least a part of the surfaces of the substrate 11 and the second light emitting element 12b1. Further, the wall portion 16b of the translucent film 16 is along the extending direction of the first metal wire 19a (in the first metal wire 19a shown in FIG. 4, the Y-axis direction) when the substrate 11 is viewed in a plan view. It is continuously formed so as to cover the first metal wire 19a.

The wall portion 16b rises from the substrate 11 and the second light emitting element 12b1 toward the first metal wire 19a, and is formed so as to support the first metal wire 19a from below. The wall portion 16b has a shape that spreads like a curtain between the first metal wire 19a and the substrate 11 and the second light emitting element 12b1. In the case of the first metal wire 19a shown in FIG. 4, the wall portion 16b of the translucent film 16 has a curtain shape extending in a YZ plane between the first metal wire 19a and the substrate 11 and the second light emitting element 12b1. The first metal wire 19a extends in the extending direction.

Further, a part of the wall portion 16b may be thinner than the first metal wire 19a in a direction orthogonal to the extending direction of the first metal wire 19a in a plan view. In the case of the first metal wire 19a shown in FIGS. 7A and 7B, for example, the width of the wall portion 16b in the direction parallel to the substrate 11 and orthogonal to the extending direction of the first metal wire 19a (FIG. 7A). And in the first metal wire 19a shown in FIG. 7B, a part of the width in the X-axis direction) is thinner than the diameter of the first metal wire 19a.

The layer portion 16c continuously covers the upper surface of the substrate 11 and the upper surface and side surfaces of the light emitting element 12. Further, as shown in FIG. 4, the translucent film 16 covers a part of the frame body 17. Specifically, the layer portion 16c of the translucent film 16 continuously covers the inner surface 17a of the frame body 17 from the substrate 11 and the like. The thickness of the translucent film 16 is preferably thicker than the thickness t2 of the portion covering the frame body 17 with the thickness t1 of the portion covering the light emitting element 12. Further, as shown in FIGS. 4, 7A and 7B, the translucent film 16 covering the first metal wire 19a located on the side opposite to the substrate 11 in the normal direction (Z-axis direction) of the substrate 11. The thickness t3 is preferably 50 μm or less.

The hardness of the translucent film 16 is preferably harder than that of the first sealing member 13 to the third sealing member 15. The hardness is, for example, a type A durometer hardness, and the durometer hardness here is a type A durometer hardness defined in JIS K 6253-3. The hardness may be compared based on Vickers hardness or the like. For example, as the material of the translucent film 16, a material having a higher crosslink density and less thermal expansion than the materials used for the first sealing member 13 to the third sealing member 15 is adopted.

Here, when the metal wire 19 is arranged in contact with two or more types of resin materials, the reliability under severe conditions such as a heat cycle is caused by the difference in the coefficient of linear expansion of the two or more types of resin materials. In the test, the metal wire 19 may be damaged (for example, broken) or deformed. In the present embodiment, the wall portion 16b of the translucent film 16 supports the metal wire 19. Therefore, the metal wire 19 is less likely to be deformed by expansion and contraction due to heat of the first sealing member 13 to the third sealing member 15. As a result, breakage or deformation of the metal wire 19 due to expansion and contraction of the first sealing member 13 to the third sealing member 15 is suppressed. By adopting the following materials for the translucent film 16, not only can the light emitting device 10 be miniaturized as described above, but also the durability (for example, heat cycle property) of the light emitting device 10 is effectively improved. ..

The translucent film 16 is, for example, a glass material (specifically, a so-called glass-like material). Alternatively, the material of the translucent film 16 may be a fluorine-based material containing fluorine. Alternatively, the material of the translucent film 16 may be a nitrogen-based material containing nitrogen.

Specifically, the main components of the translucent film 16 are, for example, a copolymer of a SiH group-containing (meth) acrylic acid ester, a SiH group-containing (meth) acrylic acid ester, and an acrylic acid ester and methacrylic acid. It contains at least one copolymer selected from the group consisting of acid esters. The (meth) acrylic acid ester includes an acrylic acid ester and a methacrylic acid ester.

As the acrylic acid ester, known acrylic acid esters can be adopted, for example, methyl acrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, isopentyl acrylate, n-hexyl acrylate, isooctyl acrylate, acrylic. Examples thereof include 2-ethylhexyl acid acid, n-octyl acrylate, isononyl acrylate, n-decyl acrylate, and isodecyl acrylate.

As the methacrylic acid ester, a known methacrylic acid ester can be adopted, for example, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, isopentyl methacrylate, n-hexyl methacrylate, methacrylic acid. Examples thereof include isooctyl, -2-ethylhexyl methacrylate, n-octyl methacrylate, isononyl methacrylate, n-decyl methacrylate, and isodecyl methacrylate.

Further, for example, the main component of the translucent film 16 may include an acrylic acid ester containing a Si vinyl group and not containing a SiH group, or an acrylic resin containing at least one of a methacrylic acid ester.

As the acrylic resin, a known acrylic resin can be adopted, and a homopolymer of an acrylic acid ester containing one or more Si vinyl groups in one molecule, and a methacrylic containing one or more Si vinyl groups in one molecule. A homopolymer of an acid ester, a copolymer of an acrylic acid ester containing one or more Si vinyl groups in one molecule and a methacrylic acid ester containing one or more Si vinyl groups in one molecule, one molecule A copolymer of an acrylic acid ester containing one or more Si vinyl groups and an acrylic acid ester different from the acrylic acid ester, and a methacrylic acid ester containing one or more Si vinyl groups in one molecule. Examples thereof include a copolymer with a methacrylic acid ester different from the methacrylic acid ester.

Further, for example, the main component of the translucent film 16 may contain a reaction product of a (poly) silazane compound. The (poly) silazane compound includes a silazane compound having one silazane bond or a polysilazane compound.

As the (poly) silazane compound, a known (poly) silazane compound can be adopted, for example, R'2Si (NR) 2/2 units and / or R'Si (NR) 3/2 units (here, R). Is the same as above, and R'has a monovalent organic group).

(Poly) silazane compounds generate hydrogen and ammonia when producing reaction products. Here, the reaction product is a substance produced when the translucent film 16 is formed, and is, for example, SiO ₂ .

Further, for example, the main component of the translucent film 16 includes an acrylic resin containing at least one of a (poly) silazane compound and a SiH group-containing acrylic acid ester, or a methacrylic acid ester.

Further, for example, the main component of the translucent film 16 contains a methacrylic acid ester, a (meth) acrylic acid ester, and a fluorine-containing monomer.

As the fluorine-containing monomer, a known fluorine-containing monomer is adopted, and examples thereof include perfluorohexyl ethyl (meth) acrylate and perfluorobutyl ethyl (meth) acrylate.

The main component of the translucent film 16 may further contain a carboxy-containing monomer.

As the carboxyl group-containing monomer, a known carboxyl group-containing monomer is adopted, and for example, methacrylic acid, 2-methacryloyloxyphthalic acid, 2-methacryloxyethyl-succinic acid, 2-methacryloyloxyethyl hexahydrophthalic acid. , Acrylic acid, 2-acryloyloxyphthalic acid, 2-acryloxyethyl-succinic acid, 2-acryloyloxyethyl hexahydrophthalic acid and the like.

Further, the main component of the translucent film 16 may further contain an isocyanurate compound.

The isocyanurate compound is a compound having an isocyanurate skeleton and an alkoxysilyl group, and the translucent film 16 contains a methacrylate ester, a (meth) acrylic acid ester, a fluorine-containing monomer, a carboxy-containing monomer, and the like. Further, a material containing a known isocyanurate compound as a main component may be adopted.

In the above, the light emitting device 10 has described that the first sealing member 13 and the second sealing member 14 are painted separately by the partition wall 20, but the present invention is not limited to this. In the light emitting device 10, at least the first sealing member 13 and the second sealing member 14 may be painted separately by the wall portion 16b.

The translucent film 16 is further located between the second metal wire 19b and the substrate 11, and the wall portion 16b standing from the substrate 11 to the second metal wire 19b, and the substrate 11 and the second. It has a layered layer portion 16c that covers at least a part of the surface of the light emitting element 12b1.

[1-2. 1st area and 2nd area]
Next, the arrangement of the first region 11a and the second region 11b, that is, the arrangement of the first sealing member 13 and the second sealing member 14 will be described with reference to FIGS. 8 and 9 in addition to FIG. ..

As shown in FIG. 3, in the plan view of the substrate 11, the first region 11a and the second region 11b are arranged alternately and so as to surround each other. Specifically, in a plan view of the substrate 11, a second region 11b in which two regions separated by a partition wall 20 are arranged is arranged at the center of the substrate 11, and a frame shape is formed so as to surround the second region 11b. The first region 11a is arranged, the frame-shaped second region 11b is further arranged so as to surround the first region 11a, and the frame-shaped first region 11a is further arranged so as to surround the second region 11b. There is.

The first region 11a and the second region 11b are not limited to being arranged alternately, and for example, the first region 11a may be a region surrounding the second region 11b. Further, the first region 11a and the second region 11b are arranged at positions that are 180 ° rotationally symmetric with respect to the center in the plan view of the substrate 11, for example.

Here, when the first light emitting element row 12a and the first metal wire 19a are used as the first circuit and the second light emitting element row 12b and the second metal wire 19b are used as the second circuit, the first circuit and the second circuit The areas of the light emitting elements 12 arranged in the first region 11a and the second region 11b in each will be described. The area here is the area of the light emitting element 12 when the substrate 11 is viewed in a plan view.

As shown in FIG. 3, in the first circuit, the total area of the first light emitting element 12a1 included in the first region 11a is 12 pieces of the area of the first light emitting element 12a1 and is included in the second region 11b. The total area of the first light emitting element 12a1 is 13 pieces of the area of the first light emitting element 12a1. In the first circuit, it can be said that 12 first light emitting elements 12a1 are arranged in the first region 11a, and 13 first light emitting elements 12a1 are arranged in the second region 11b.

Further, in the second circuit, the total area of the second light emitting element 12b1 included in the first region 11a is 17 pieces of the area of the second light emitting element 12b1, and the second light emitting element included in the second region 11b. The total area of 12b1 is 13 pieces of the area of the second light emitting element 12b1. In the second circuit, it can be said that 17 second light emitting elements 12b1 are arranged in the first region 11a, and 13 second light emitting elements 12b1 are arranged in the second region 11b.

As described above, one of the first circuit and the second circuit has a large number of light emitting elements arranged in one of the first region 11a and the second region 11b, and the other of the first circuit and the second circuit has a large number of light emitting elements. The number of light emitting elements arranged on the other side of the first region 11a and the second region 11b may be large.

For example, the number of the first light emitting elements 12a1 arranged in the first region 11a among the plurality of first light emitting elements 12a1 is smaller than the number of the first light emitting elements 12a1 arranged in the second region 11b, and the plurality of first light emitting elements 12a1 is arranged. The number of the second light emitting elements 12b1 arranged in the first region 11a of the two light emitting elements 12b1 may be larger than the number of the second light emitting elements 12b1 arranged in the second region 11b.

When power is supplied only to the first circuit among the first circuit and the second circuit, the light from the second region 11b is emitted relatively strongly. Further, when power is supplied only to the second circuit of the first circuit and the second circuit, the light from the first region 11a is emitted relatively strongly. Assuming that the color temperatures of these two white lights are the first color temperature and the second color temperature, the power supply to the first circuit and the second circuit is adjusted to be between the first color temperature and the second color temperature. Then, the color of the light can be adjusted. In this way, the light emitting device 10 can adjust the color by controlling the ratio of the electric power (current) supplied to the first circuit and the second circuit.

Next, another example of the arrangement of the first region 11a and the second region 11b will be described with reference to FIG. FIG. 8 is a plan view showing a second example of the arrangement of the first region 11a and the second region 11b in the light emitting device 10 according to the present embodiment.

As shown in FIG. 8, the first region 11a is in a plan view.
It is a cross-shaped area. Specifically, the first region 11a is provided so as to divide the region surrounded by the frame body 17 into four small regions in a plan view. The first region 11a may be provided, for example, so that the areas of the four small regions are equal to each other. The cross shape is formed by two regions extending in different directions in a plan view, and the two regions intersect with each other.

The first region 11a is a region surrounded by a second metal wire 19b and a frame 17 that connect the second light emitting elements 12b1 to each other in each of the two second light emitting element rows 12b, and two first light emitting element rows. Each of the 12a is composed of a region surrounded by a first metal wire 19a connecting the first light emitting elements 12a1 to each other and a frame body 17. For example, the two second light emitting element rows 12b are the second light emitting element rows 12b arranged adjacent to each other, and the two first light emitting element rows 12a are the two first light emitting element rows 12a that are not adjacent to each other. .. The first region 11a may be provided, for example, on the diagonal line of the rectangular frame body 17.

The second region 11b is a region other than the first region 11a, and is four small regions divided by the first region 11a. The second region 11b is a region surrounded by the first region 11a and the frame body 17 in a plan view. The second region 11b is, for example, a rectangular region in a plan view.

Further, in the first circuit, the total area of the first light emitting elements 12a1 arranged in the first region 11a is 12.5 of the area of the first light emitting elements 12a1, and the first light emitting element 12a1 is arranged in the second region 11b. The number of one light emitting element 12a1 is 12.5 of the area of the first light emitting element 12a1. Further, in the second circuit, the total area of the second light emitting element 12b1 arranged in the first region 11a is 16.5 of the area of the second light emitting element 12b1, and is arranged in the second region 11b. The total area of the second light emitting element 12b1 is 13.5 of the area of the second light emitting element 12b1.

As described above, one of the first circuit and the second circuit may have the same number of light emitting elements arranged in the first region 11a and the second region 11b.

When power is supplied only to the first circuit of the first circuit and the second circuit, the light from the first region 11a and the second region 11b is evenly emitted. Further, when power is supplied only to the second circuit of the first circuit and the second circuit, the light from the first region 11a is emitted relatively strongly. Assuming that the color temperatures of these two white lights are the first color temperature and the second color temperature, the power supply to the first circuit and the second circuit is adjusted to be between the first color temperature and the second color temperature. Then, the color of the light can be adjusted.

Next, still another example of the arrangement of the first region 11a and the second region 11b will be described with reference to FIG. FIG. 9 is a plan view showing a third example of the arrangement of the first region 11a and the second region 11b in the light emitting device 10 according to the present embodiment.

As shown in FIG. 9, the first region 11a includes a first sub-region 11a1 configured to be surrounded by two first metal wires 19a and two second metal wires 19b that are not arranged adjacent to each other. A second sub-region 11a2 surrounded by two first metal wires 19a and two second metal wires 19b arranged adjacent to each other, and a second sub-region arranged adjacent to the first sub-region 11a1. 11a2 is a third sub-region 11a3 surrounded by two first metal wires 19a and two second metal wires 19b arranged adjacent to each other, and is separated from the first sub-region 11a1 and the second sub-region 11a2. It has a third sub-region 11a3 arranged therein.

The first sub-region 11a1 is located at the center of the substrate 11 in a plan view, and is a second metal wire 19b that connects the second light emitting elements 12b1 to each other in two non-adjacent second light emitting element rows 12b, and It is a rectangular region surrounded by a first metal wire 19a that connects the first light emitting elements 12a1 to each other in each of the two non-adjacent first light emitting element rows 12a. The second sub-region 11a2 and the third sub-region 11a3 are square regions and are arranged on the outer peripheral side of the substrate 11 from the first sub-region 11a1. Further, the third sub-region 11a3 is arranged apart from the first sub-region 11a1 and the second sub-region 11a2. In other words, the second region 11b is arranged between the third sub-region 11a3 and the first sub-region 11a1 and the second sub-region 11a2. Further, the area of the first sub-region 11a1 in the plan view and the areas of the second sub-region 11a2 and the third sub-region 11a3 in the plan view may be equal to each other.

As described above, in the first region 11a, the second metal wire 19b connecting the second light emitting elements 12b1 to each other in each of the second light emitting element rows 12b and the first light emitting elements 12a1 in each of the first light emitting element rows 12a are connected to each other. It is composed of a region surrounded by the first metal wire 19a to be connected. That is, the first region 11a is a region of the metal wire 19 and the frame 17 that is surrounded only by the metal wire 19.

The second region 11b is a region other than the first region 11a and surrounds the first region 11a. Specifically, the second region 11b is a region surrounding each of the first sub-region 11a1, the second sub-region 11a2, and the third sub-region 11a3. Further, the second region 11b is a region surrounded by the first region 11a and the frame body 17 in a plan view. The second region 11b is, for example, a frame-shaped region in a plan view.

Further, in the first circuit, the total area of the first light emitting element 12a1 included in the first region 11a is 12 of the area of the first light emitting element 12a1, and the first light emitting element included in the second region 11b. The total area of 12a1 is 13 pieces of the area of the first light emitting element 12a1. Further, in the second circuit, the total area of the second light emitting element 12b1 included in the first region 11a is 12 pieces of the area of the second light emitting element 12b1, and the second light emitting element included in the second region 11b. The total area of 12b1 is 18 pieces of the area of the second light emitting element 12b1.

As described above, both the first circuit and the second circuit have a large number of light emitting elements arranged in one of the first region 11a and the second region 11b, and the first region 11a and the first circuit in the first circuit and the second circuit are the first. The number of light emitting elements arranged on one side may be different from that of the light emitting elements arranged on the other side of the two regions 11b.

When power is supplied only to the first circuit of the first circuit and the second circuit, the light from the first region 11a is strongly emitted. Further, when the electric power is supplied only to the second circuit among the first circuit and the second circuit, the light from the first region 11a is emitted more strongly than when the electric power is supplied only to the first circuit. Assuming that the color temperatures of these two white lights are the first color temperature and the second color temperature, the power supply to the first circuit and the second circuit is adjusted to be between the first color temperature and the second color temperature. Then, the color of the light can be adjusted.

The arrangement and number of the first region 11a and the second region 11b are not limited to FIGS. 3, 8 and 9 above. It is appropriately determined according to the color temperature range for toning.

[1-3. Manufacturing method of light emitting device]
Next, a method of manufacturing the light emitting device 10 according to the present embodiment will be described with reference to FIG. FIG. 10 is a flowchart showing a manufacturing method of the light emitting device 10 according to the present embodiment. The steps S60 and S70 shown in FIG. 10 are steps for forming the translucent film 16. Further, in FIG. 10, the step of forming the third sealing member 15 is omitted. The step of forming the third sealing member 15 is performed after step S80.

As shown in FIG. 10, first, a plurality of first light emitting elements 12a1 are mounted on the substrate 11 in the first direction (for example, the Y-axis direction) (S10), and the second direction (for example, X) intersecting the first direction. A plurality of second light emitting elements 12b1 are mounted in the axial direction (S20). The first light emitting element row 12a is formed in step S10, and the second light emitting element row 12b is formed in step S20.

The first region 11a and the second region 11b formed on the substrate 11 are determined according to the arrangement positions of the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1. In other words, the shapes of the first region 11a and the second region 11b can be arbitrarily set depending on the arrangement positions of the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1. The arrangement positions of the first light emitting element 12a1 and the second light emitting element 12b1 are determined so that desired light is emitted from, for example, the light emitting device 10. The plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1 are mounted on the substrate 11 by using, for example, a conductive adhesive such as silver paste or solder. Further, the electrode land 18 is formed in advance on the main surface of the substrate 11.

Next, the plurality of first light emitting elements 12a1 of the first light emitting element row 12a are electrically connected by the first metal wire 19a (S20), and the plurality of second light emitting element rows 12b are electrically connected by the second metal wire 19b. The light emitting element 12b1 is electrically connected (S40). When both the first light emitting element 12a1 and the second light emitting element 12b1 have a single-sided electrode structure, the p-side electrode and the n-side electrode are on the upper surface (for example, the Z-axis plus side surface) of the semiconductor layer formed on the sapphire substrate. It is a configuration in which both electrodes are formed. The plurality of first light emitting elements 12a1 are electrically connected by continuously wire-bonding the two electrodes (p-side electrode and n-side electrode) on the upper surface with the first metal wire 19a. As a result, the first light emitting element train 12a is formed in which the first light emitting elements 12a1 are connected to each other by a chip-to-chip. Further, the plurality of second light emitting elements 12b1 are electrically connected by continuously wire-bonding the two electrodes (p-side electrode and n-side electrode) on the upper surface with the second metal wire 19b. As a result, a second light emitting element row 12b is formed in which the second light emitting elements 12b1 are connected to each other by a chip-to-chip.

Next, a frame body 17 surrounding the plurality of light emitting elements 12 is formed (S50). In step S50, for example, a frame body 17 that surrounds a region in which a plurality of light emitting elements 12 and a plurality of metal wires 19 are arranged is formed from the outside of the region. The frame body 17 is formed, for example, by arranging the resin in a predetermined shape by discharging with a dispenser and heating and curing the resin.

Next, the space formed by the substrate 11 and the frame 17 is filled with a solution in which the material of the translucent film 16 is diluted (S60). The solution for forming the translucent film 16 is filled in the frame 17 (that is, inside the frame 17). In step S60, for example, in a state where the light emitting element 12, the frame body 17, and the metal wire 19 are arranged on the substrate 11, a liquid solution serving as a solvent is formed in the space formed by the substrate 11 and the frame body 17. A solution obtained by diluting the material of the translucent film 16 (specifically, the solid substance which is the main component of the translucent film 16) of about 5% is poured into the diluent.

The solvent is not limited as long as it is an organic solvent obtained by dissolving a solid substance as a main component of the translucent film 16 and obtained as a uniform solution, and a known organic solvent can be used. Examples of the solvent include aromatic hydrocarbon solvents such as xylene, toluene and benzene, aliphatic hydrocarbon solvents such as heptane and hexane, halogenated hydrocarbon solvents such as trichloroethylene, perchloroethylene and methylene chloride, and acetic acid. Examples thereof include ester solvents such as ethyl, ketone solvents such as methyl isobutyl ketone and methyl ethyl ketone, alcohol solvents such as ethanol, isopropanol and butanol, ligroin, cyclohexanone, diethyl ether, rubber volatile oil and silicone solvents. The translucent film 16 may be formed at a desired position, for example, around the metal wire 19, by using a dispenser or the like.

Next, the solution filled in step S60 is dried (S70). Specifically, in step S70, the diluent contained in the solution volatilizes. As a result, a translucent film having a layer portion 16c that covers the surfaces of the substrate 11, the light emitting element 12, and the metal wire 19, and a wall portion 16b that erects the substrate 11 and the second light emitting element 12b1 to the metal wire 19. 16 is formed. In step S70, for example, the solution is dried by heating. As a result, a plurality of small regions separated by the partition wall 20 are formed on the substrate 11.

Next, the first sealing member 13 and the second sealing member 14 are formed (S80). Specifically, the first sealing member 13 is formed by applying a resin material constituting the first sealing member 13 to the first region 11a and curing the resin material. The second sealing member 14 is formed by applying a resin material constituting the second sealing member 14 to the second region 11b and curing the resin material. At this time, the resin material applied to the first region 11a is suppressed from flowing into the second region 11b by the partition wall 20. Further, the resin material applied to the second region 11b is prevented from flowing into the first region 11a by the partition wall 20. That is, the partition wall 20 functions as a wall for separately painting the first sealing member 13 and the second sealing member 14. As a result, the first sealing member 13 that covers the first region 11a and the second sealing member 14 that covers the second region 11b are formed on the main surface of the substrate 11. The first sealing member 13 and the second sealing member 14 are partitioned by, for example, a partition wall 20. As the resin material constituting the first sealing member 13 and the second sealing member 14, a material having a lower thixo property than the resin material constituting the frame body 17 can be used.

[1-4. Effect etc.]
As described above, the light emitting device 10 has two or more first light emitting elements 12a1 each having a substrate 11 and a plurality of first light emitting elements 12a1 arranged on the substrate 11 along the Y-axis direction (an example of the first direction). Two or more second light emitting elements each having one light emitting element row 12a and a plurality of second light emitting elements 12b1 arranged on the substrate 11 along the X-axis direction (an example of the second direction) intersecting the Y-axis direction. In the element row 12b and each of the two or more first light emitting element rows 12a, in each of the first metal wire 19a that electrically connects the first light emitting elements 12a1 to each other and the two or more second light emitting element rows 12b, the first The second metal wire 19b that electrically connects the two light emitting elements 12b1 to each other, and the translucent wall portion 16b that stands between the substrate 11 and each of the first metal wire 19a and the second metal wire 19b. In the plan view of the substrate 11, the first sealing member 13 arranged in the first region 11a surrounded by the two first metal wires 19a and the two second metal wires 19b, and in the plan view It is arranged in a second region 11b different from the first region 11a, and includes a second sealing member 14 different from the first sealing member 13.

For example, as in the conventional case, when two semi-cylindrical sealing members are separately coated by a dispenser in order to have a toning function, the material is adjusted (for example, the viscosity for making the semi-cylindrical shape and the viscosity and the like. Due to the influence of (adjustment of viscosity) and the like, the width of the semicircular sealing member (for example, in a plan view, the direction orthogonal to the light emitting element array composed of the plurality of light emitting elements 12 (for example, the length in the X-axis direction)) It is difficult to reduce the size. That is, in the conventional light emitting device, there are restrictions on the mounting layout of the light emitting element, and it is difficult to reduce the size when the toning function is provided.

On the other hand, in the light emitting device 10 according to the present embodiment, when the first sealing member 13 and the second sealing member 14 are formed, the wall portion 16b is formed of the first sealing member 13 and the second sealing member 14. It functions as a wall for damming the resin material to be formed, that is, for coating the first sealing member 13 and the second sealing member 14 separately. In the light emitting device 10, the first sealing member 13 and the second sealing member 14 can be finely painted as compared with the conventional light emitting device by arranging the wall portion 16b, that is, the arrangement of the light emitting element 12.

Further, since the first light emitting element row 12a and the second light emitting element row 12b are arranged along different directions, only one of the first light emitting element row 12a and the second light emitting element row 12b is arranged. Compared with the case, the first region 11a can be set more finely.

Further, since it is not necessary to make the shapes of the first sealing member 13 and the second sealing member 14 into a semi-cylindrical shape, the first sealing member 13 and the second sealing member 14 are large due to the influence of material adjustment and the like. That is, it is possible to prevent the first region 11a and the second region 11b from becoming larger.

Further, by arranging different sealing members from each other in the first region 11a and the second region 11b, it is possible to adjust the color. For example, it is possible to adjust the color by adjusting the ratio of the electric power supplied to the first light emitting element row 12a and the second light emitting element row 12b.

Therefore, according to the light emitting device 10, it is possible to realize a light emitting device that is capable of color matching and is miniaturized.

Further, the first region 11a may be a region surrounding the second region 11b. Further, the first region 11a may be a cross-shaped region in the plan view of the substrate 11. Further, the first region 11a is arranged adjacent to each other with the first sub-region 11a1 surrounded by two first metal wires 19a and two second metal wires 19b that are not arranged adjacent to each other. The second sub-region 11a2 surrounded by the two first metal wires 19a and the two second metal wires 19b, which are adjacent to the second sub-region 11a2 arranged adjacent to the first sub-region 11a1. A third sub-region 11a3 surrounded by two first metal wires 19a and two second metal wires 19b arranged together, which are arranged apart from the first sub-region 11a1 and the second sub-region 11a2. It has 3 sub-regions 11a3. The second region 11b may be a region surrounding the first sub-region 11a1 and the second sub-region 11a2 and the third sub-region 11a3, respectively.

As a result, by arranging the first region 11a and the second region 11b as described above, it is possible to realize the light emitting device 10 with improved color mixing.

Further, the number of the first light emitting elements 12a1 arranged in the first region 11a among the plurality of first light emitting elements 12a1 is larger than the number of the first light emitting elements 12a1 arranged in the second region 11b, and a plurality of first light emitting elements 12a1 are arranged. The number of the second light emitting elements 12b1 arranged in the second region 11b of the second light emitting elements 12b1 is smaller than the number of the second light emitting elements 12b1 arranged in the first region 11a.

As a result, the range of color temperatures that can be adjusted in the light emitting device 10 can be widened. Therefore, it is possible to realize the light emitting device 10 having a further improved toning function.

Further, at least one second light emitting element 12b1 among the plurality of second light emitting elements 12b1 is between adjacent first light emitting elements 12a1 among the plurality of first light emitting elements 12a1 constituting the first light emitting element row 12a. Is located in. The first metal wire 19a is arranged so as to straddle at least one second optical element 12b1. The wall portion 16b is further erected between at least one second light emitting element 12b1 and the first metal wire 19a.

As a result, even when the second light emitting element 12b1 is arranged between the adjacent first light emitting elements 12a1 among the plurality of first light emitting elements 12a1 constituting the first light emitting element row 12a, the second light emitting element 12b1 is second. The first region 11a and the second region 11b can be separated by the wall portion 16b between the light emitting element 12b1 and the first metal wire 19a. Therefore, it is possible to realize a light emitting device 10 capable of color matching and miniaturized regardless of the arrangement position of the first light emitting element 12a1 and the second light emitting element 12b1.

Further, each of the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1 has a long shape in a plan view. In each of the plurality of first light emitting elements 12a1, one of the longitudinal direction and the lateral direction of the first light emitting element 12a1 is arranged along the Y-axis direction. In each of the plurality of second light emitting elements 12b1, one of the longitudinal direction and the lateral direction of the second light emitting element 12b1 is arranged along the X-axis direction.

As a result, the first light emitting elements 12a1 and the second light emitting elements 12b1 can be easily wired with the metal wire 19. Therefore, the light emitting device 10 can be easily manufactured.

Further, the heights of the first sealing member 13 and the second sealing member 14 are equal to or less than the heights of the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1.

As a result, at the boundary between the first region 11a and the second region 11b, a region where the first sealing member 13 and the second sealing member 14 are mixed is not formed. Therefore, the light emitting device 10 can be miniaturized even when it is not desired to form a region in which the first sealing member 13 and the second sealing member 14 coexist in order to obtain desired optical characteristics.

Further, the first sealing member 13 includes a phosphor 13r (an example of a first wavelength conversion material) that converts the wavelength of light emitted by the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1. The second sealing member 14 is an example of a phosphor 14y (an example of a second wavelength conversion material) that converts the wavelength of light emitted by the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1 into a wavelength different from that of the phosphor 13r. )including.

As a result, the first sealing member 13 and the second sealing member 14 having different phosphors are simply painted on the wall portion 16b (or the partition wall 20), and the light emitting device is miniaturized while supporting color matching. 10 can be realized.

Further, a third sealing member 15 that covers the first sealing member 13 and the second sealing member 14 is further provided. The third sealing member 15 may be transparent.

As a result, the plurality of light emitting elements 12 and the plurality of metal wires 19 can be protected from dust, moisture, external force, and the like.

Further, a third sealing member 15 that covers the first sealing member 13 and the second sealing member 14 is further provided. Then, the third sealing member 15 may include at least one of the phosphors 13r and 14y. Further, the third sealing member 15 may include a phosphor (an example of a third wavelength conversion material) that converts a wavelength different from that of the phosphors 13r and 14y.

As a result, the color temperature of the light emitted from the light emitting device 10 can be further adjusted by the third sealing member 15. Therefore, it is possible to realize a light emitting device 10 having further improved color mixing and color rendering properties.

Further, in the plan view of the substrate 11, a frame body 17 surrounding the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1 is further provided.

As a result, the wall portion 16b is formed by using, for example, a solution obtained by diluting the material of the translucent film 16 (wall portion 16b) with a liquid diluent as a solvent. Therefore, since the light emitting device 10 includes the frame body 17, the wall portion 16b can be easily formed.

(Modification 1 of Embodiment 1)
Hereinafter, the light emitting device 10a according to this modification will be described with reference to FIG. FIG. 11 is a cross-sectional view of the light emitting device 10a according to the present modification corresponding to the VV line of FIG. In this modification, the differences from the first embodiment will be mainly described, and the description of the same configuration as that of the first embodiment may be omitted.

As shown in FIG. 11, in this modification, the heights (lengths in the Z-axis direction) of the first sealing member 13 and the second sealing member 14 are a plurality of light emitting elements 12 (in FIG. 11, the first It is higher than the height of the light emitting element 12a1). The heights (lengths in the Z-axis direction) of the first sealing member 13 and the second sealing member 14 are, for example, the heights of the plurality of light emitting elements 12 and the thickness of the layer portion 16c formed on the light emitting elements 12. Higher than the sum of.

In this case, when the first sealing member 13 and the second sealing member 14 are formed in step S80 shown in FIG. 10, a part of the first sealing member 13 coated on the first region 11a emits light. Above the element 12, it flows into the second region 11b side. Further, a part of the second sealing member 14 coated on the second region 11b flows into the first region 11a side above the light emitting element 12. Therefore, the first sealing member 13 and the second sealing member 14 are mixed above the light emitting element 12. Specifically, as shown in FIG. 11, a region in which the phosphors 13r and 14y coexist is formed above the light emitting element 12. The region where the phosphors 13r and 14y coexist is not limited to the upper part of the light emitting element 12, and may be formed on the side of the light emitting element 12. Further, in this case, since the first sealing member 13 and the second sealing member 14 cover the light emitting element 12, the light emitting element 12 has a function of protecting the light emitting element 12 from dust, moisture, external force and the like.

Further, in FIG. 11, a part of the metal wire 19 is located higher than the first sealing member 13 and the second sealing member 14, that is, a part of the metal wire 19 is in contact with the third sealing member 15. The example is illustrated, but is not limited to this. The first sealing member 13 and the second sealing member 14 may be formed up to a position higher than the metal wire 19. That is, the first sealing member 13 and the second sealing member 14 may be formed so as to cover the metal wire 19. In this case, the third sealing member 15 does not come into contact with the metal wire 19. Further, in this case, even if the third sealing member 15 is not formed, the first sealing member 13 and the second sealing member 14 cause the light emitting element 12 and the metal wire 19 to be separated from dust, moisture, and external force. It can be protected from such things. That is, the first sealing member 13 and the second sealing member 14 have a function of protecting the light emitting element 12 and the metal wire 19 from dust, moisture, external force, and the like.

The method of manufacturing the light emitting device 10a is manufactured by the flowchart shown in FIG. 10 of the first embodiment. The light emitting device 10a is manufactured, for example, by adjusting the coating amounts of the first sealing member 13 and the second sealing member 14 in step S80.

As described above, the heights of the first sealing member 13 and the second sealing member 14 are higher than the heights of the plurality of first light emitting elements 12a1 and the plurality of second light emitting elements 12b1.

As a result, at the boundary between the first region 11a and the second region 11b, a region where the first sealing member 13 and the second sealing member 14 are mixed is formed. Therefore, even when it is desired to form a region in which the first sealing member 13 and the second sealing member 14 coexist in order to obtain desired light, the light emitting device 10a can be miniaturized. Further, since the region where the first sealing member 13 and the second sealing member 14 are mixed is formed, the color mixing property of the light emitted from the light emitting device 10a is improved. That is, the color mixing efficiency of the light emitting device 10a is improved.

(Modification 2 of Embodiment 1)
Hereinafter, the light emitting device 10b according to this modification will be described with reference to FIG. FIG. 12 is a cross-sectional view of the light emitting device 10b according to the present modification corresponding to the IV-IV line of FIG. The substrate 11 has one or more pattern wirings 21. In this modification, the differences from the first embodiment will be mainly described, and the description of the same configuration as that of the first embodiment may be omitted. Further, although the first light emitting element 12a1 will be described below, the same can be said for the second light emitting element 12b1.

As shown in FIG. 12, the two first light emitting elements 12a1 mounted on the substrate 11 may be electrically connected via the pattern wiring 21 formed on the substrate 11. Specifically, the first metal wire 19a electrically connects the pattern wiring 21 and the first metal wire 19a1 that electrically connects one first light emitting element 12a1 and the pattern wiring 21 and the other first light emitting element 12a1. It has a first metal wire 19a2 connected to. That is, the adjacent first light emitting elements 12a1 are not limited to the case where they are connected by Chip-to-Chip, but may be connected by wire bonding via the pattern wiring 21.

The wall portion 16b rises from the substrate 11 toward the first metal wires 19a1 and 19a2, and is formed so as to support the first metal wires 19a1 and 19a2 from below. In other words, the wall portion 16b of the translucent film 16 has a curtain shape extending in the YZ plane between the first metal wires 19a1 and 19a2 and the substrate 11, and the first metal wires 19a1 and 19a2 extend. It extends in the direction (for example, the Y-axis direction). Further, the partition wall 20 is formed including the wall portion 16b rising from the substrate 11 toward the first metal wires 19a1 and 19a2.

The pattern wiring 21 is a metal wiring provided on the main surface of the substrate 11. In the light emitting device 10b, the surface of the pattern wiring 21 is covered with at least one of the first sealing member 13 and the second sealing member 14. The pattern wiring 21 has conductivity, and the pattern is formed by a conductive member. The pattern wiring 21 is formed of, for example, gold, but may be formed of other metals such as silver or copper. The pattern wiring 21 may be formed of the same material as the electrode land 18. Further, the height of the pattern wiring 21 is lower than the height of the light emitting element 12.

(Embodiment 2)
[2-1. Lighting device configuration]
Next, the lighting device 100 according to the present embodiment will be described with reference to FIGS. 13 and 14. FIG. 13 is a cross-sectional view of the lighting device 100 according to the present embodiment. FIG. 14 is an external perspective view of the lighting device 100 and its peripheral members according to the present embodiment. The peripheral member is a member connected to the lighting device 100, and is, for example, a lighting device and a terminal block.

As shown in FIGS. 13 and 14, the lighting device 100 according to the present embodiment is, for example, a downlight or the like that illuminates light downward (corridor, wall, etc.) by being embedded in the ceiling of a house or the like. It is an embedded lighting device.

The lighting device 100 includes a light emitting device 10. The lighting device 100 further includes a substantially bottomed tubular fixture body formed by connecting the base 110 and the frame body 120, and a reflector 130 and a translucent panel 140 arranged on the fixture body.

The base 110 is a mounting base on which the light emitting device 10 and the like are mounted, and is a heat sink that dissipates heat generated by the light emitting device 10. The base 110 is formed in a columnar shape using a metal material, and is made of die-cast aluminum in the present embodiment.

A plurality of heat radiating fins 111 projecting upward are provided on the upper portion (ceiling side portion) of the base 110 at regular intervals along one direction. As a result, the heat generated by the light emitting device 10 or the like can be efficiently dissipated.

The frame body portion 120 has a cylindrical cone portion 121 having a reflective surface on the inner surface, and a frame body main body portion 122 to which the cone portion 121 is attached. The cone portion 121 is molded using a metal material, and can be manufactured, for example, by drawing or press molding an aluminum alloy or the like. The frame body portion 122 is formed of a hard resin material or a metal material. The frame body portion 120 is fixed by attaching the frame body portion 122 to the base portion 110.

The reflector 130 is an annular frame-shaped (funnel-shaped) reflecting member having an internal reflection function. The reflector 130 can be formed by using a metal material such as aluminum. The reflector 130 may be formed of a hard white resin material instead of a metal material.

The translucent panel 140 is a translucent member having light diffusivity and translucency. The translucent panel 140 is a flat plate plate arranged between the reflector 130 and the frame body 120, and is attached to the reflector 130. The translucent panel 140 is formed in a disk shape by a transparent resin material such as acrylic or polycarbonate.

The lighting device 100 does not have to include the translucent panel 140. By not providing the translucent panel 140, the luminous flux of the light emitted from the lighting device 100 can be improved.

Further, as shown in FIG. 14, the lighting device 100 relays the lighting device 150 that supplies the light emitting device 10 with power for lighting the light emitting device 10 and the AC power from the commercial power source to the lighting device 150. The terminal block 160 is connected. Specifically, the lighting device 150 converts the AC power relayed from the terminal block 160 into DC power and outputs the AC power to the light emitting device 10. Further, the lighting device 150 has a control unit that independently controls the DC power supplied to the plurality of light emitting element rows (for example, the first light emitting element row 12a in the fifth row and the second light emitting element row 12b in the sixth row). Have. The lighting device 150 controls color matching by, for example, changing the ratio of the current supplied to each of the two light emitting element trains by direct current drive. The control unit is realized by a microcomputer, a processor, a dedicated circuit, or the like.

The lighting device 150 and the terminal block 160 are mounted and fixed to a mounting plate 170 provided separately from the fixture main body. The mounting plate 170 is formed by bending a rectangular plate-shaped member made of a metal material, and the lighting device 150 is mounted and fixed to the lower surface of one end portion in the longitudinal direction thereof, and the terminal block 160 is mounted and fixed to the lower surface of the other end portion. Is attached and fixed. The mounting plate 170 is connected to each other with the top plate 180 mounted and fixed to the upper part of the base 110 of the instrument body.

[2-2. Effect etc.]
As described above, the lighting device 100 includes a light emitting device 10 and a lighting device 150 that supplies electric power to the light emitting device 10 to light the light emitting device 10.

In such a lighting device 100, a light emitting device 10 capable of color matching and miniaturized can be applied. For example, it leads to miniaturization and high performance of the lighting device 100 (specifically, the main body of the fixture). Further, when the size of the light emitting device 10 is about the same as that of the conventional light emitting device, the number of light emitting elements that can be arranged in the light emitting device 10 can be increased, so that the output of the lighting device 100 is improved. The lighting device 100 may include any of the light emitting devices 10a and 10b instead of the light emitting device 10.

In the second embodiment, a downlight is exemplified as a lighting device, but the present invention may be realized as another lighting device such as a spotlight or a ceiling light.

(Other embodiments)
Although the light emitting device and the lighting device according to the embodiment and the like have been described above, the present invention is not limited to the above embodiment and the like.

For example, in the above-described embodiment and the like, an LED chip is exemplified as a light emitting element used in a light emitting device. However, a semiconductor light emitting device such as a semiconductor laser, or another type of solid light emitting device such as an EL element such as an organic EL (Electro Luminescence) or an inorganic EL may be adopted as the light emitting element.

Further, in the light emitting device of the above-described embodiment or the like, two or more types of light emitting elements having different light emitting colors may be used. For example, the light emitting device may include an LED chip that emits red light in addition to an LED chip that emits blue light for the purpose of enhancing color rendering.

Further, in the above-described embodiment and the like, an example in which the light emitting element has a single-sided electrode structure having an anode and a cathode on the upper surface (for example, the surface on the plus side of the Z axis) of the semiconductor layer formed on the substrate has been described. It may have a double-sided electrode structure having a back-facing anode and a cathode. If each of the light emitting elements has a single-sided electrode structure, there is an advantage that each light emitting element can be easily mounted on the substrate.

Further, in the above-described embodiment and the like, an example in which the translucent film covers the inner surface of the frame has been described, but the present invention is not limited to this. When the cross section orthogonal to the substrate is viewed, the layer portion of the translucent film may be continuously covered up to the outer surface which is the surface opposite to the inner surface on the light emitting element side of the frame. That is, the frame may be covered with a translucent film. Further, although the example in which the translucent film covers the metal wire has been described, it is not necessary to cover the metal wire as long as it is provided between the metal wire and the substrate.

Further, the number of the first region and the second region included in the substrate in the above-described embodiment and the like is not particularly limited. The substrate may have at least one first region and a second region. Further, the number of regions possessed by the substrate is not limited to two (for example, two regions, a first region and a second region). The substrate may have three or more regions. When the substrate has three or more regions, the arrangement is not particularly limited. Further, when the substrate has a first region, a second region, and a third region, the sealing members arranged in the respective regions are different from each other. For example, the color temperatures of the light emitted from the first region, the second region, and the third region are different from each other.

Further, in the above-described embodiment and the like, an example in which the frame body is formed by a dispenser has been described, but the present invention is not limited to this. The frame may be formed by, for example, screen printing. In this case, the frame is formed before the light emitting element is mounted on the substrate.

Further, the order of each step in the method for manufacturing the light emitting device described in the above-described embodiment and the like is an example, and the present invention is not limited to this. The order of each step may be changed, or a part of each step may not be performed. For example, the step of forming the frame may not be performed.

In addition, each step in the method for manufacturing a light emitting device described in the above-described embodiment or the like may be carried out in one step or in separate steps. It should be noted that the term "implemented in one step" means that each step is carried out using one device, each step is carried out continuously, or each step is carried out in the same place. Is. In addition, separate steps mean that each step is carried out using a different device, each step is carried out at a different time (for example, a different day), or each step is carried out at a different place. It is intended to include.

In addition, it is realized by subjecting various modifications to the embodiments and the like that can be conceived by those skilled in the art, or by arbitrarily combining the components and functions of the embodiments without departing from the spirit of the present invention. The form is also included in the present invention.

10, 10a, 10b Light emitting device 11 Substrate 11a First region 11a1 First sub region 11a2 Second sub region 11a3 Third sub region 11b Second region 12a First light emitting element row 12a1 First light emitting element 12b Second light emitting element row 12b1 2nd light emitting element 13 1st sealing member 13r Fluorescent material (1st wavelength conversion material)
14 Second sealing member 14y Fluorescent material (second wavelength conversion material)
15 Third sealing member 16b Wall 17 Frames 19a, 19a1, 19a2 First metal wire 19b Second metal wire 100 Lighting device 150 Lighting device

Claims (15)

With the board
A row of two or more first light emitting elements, each of which has a plurality of first light emitting elements arranged along the first direction on the substrate.
A row of two or more second light emitting elements, each of which has a plurality of second light emitting elements arranged along the second direction intersecting the first direction on the substrate.
In each of the two or more first light emitting element rows, the first metal wire that electrically connects the first light emitting elements and the first metal wire
In each of the two or more second light emitting element rows, a second metal wire for electrically connecting the second light emitting elements and a second metal wire
A translucent wall portion erected between the substrate, the first metal wire, and each of the second metal wire, and
In a plan view of the substrate, the two first metal wires and the first sealing member arranged in the first region surrounded by the two second metal wires,
A light emitting device including a second sealing member which is arranged in a second region different from the first region in the plan view and is different from the first sealing member. The light emitting device according to claim 1, wherein the first region is a region surrounding the second region. The light emitting device according to claim 1, wherein the first region is a cross-shaped region in the plan view. The first region includes two first metal wires that are not arranged next to each other and a first sub-region that is surrounded by the two second metal wires, and two that are arranged next to each other. The second sub-region surrounded by the first metal wire and the two second metal wires, which are arranged adjacent to each other with the second sub-region arranged adjacent to the first sub-region. A third sub-region surrounded by the two first metal wires and the two second metal wires, the first sub-region and the third sub-region arranged apart from the second sub-region. And
The light emitting device according to claim 1, wherein the second region is a region surrounding each of the first sub region, the second sub region, and the third sub region. Among the plurality of first light emitting elements, the number of the first light emitting elements arranged in the first region is larger than the number of the first light emitting elements arranged in the second region, and the plurality of second light emitting elements are arranged. The light emitting device according to any one of claims 1 to 4, wherein the number of the second light emitting elements arranged in the second region is smaller than the number of the second light emitting elements arranged in the first region. At least one second light emitting element among the plurality of second light emitting elements is arranged between adjacent first light emitting elements among the plurality of first light emitting elements constituting the first light emitting element row. ,
The first metal wire is arranged so as to straddle the at least one second light emitting element.
The light emitting device according to any one of claims 1 to 5, wherein the wall portion is further erected between the at least one second light emitting element and the first metal wire. The shapes of the plurality of first light emitting elements and the plurality of second light emitting elements are elongated in the plan view.
In each of the plurality of first light emitting elements, one of the longitudinal direction and the lateral direction of the first light emitting element is arranged along the first direction.
The invention according to any one of claims 1 to 6, wherein each of the plurality of second light emitting elements has one of the longitudinal direction and the lateral direction of the second light emitting element arranged along the second direction. Light emitting device. The height of the first sealing member and the second sealing member is equal to or less than the height of the plurality of first light emitting elements and the plurality of second light emitting elements according to any one of claims 1 to 7. The light emitting device described. The one according to any one of claims 1 to 7, wherein the heights of the first sealing member and the second sealing member are higher than the heights of the plurality of first light emitting elements and the plurality of second light emitting elements. Light emitting device. The first sealing member includes the plurality of first light emitting elements and a first wavelength conversion material that converts the wavelength of light emitted by the plurality of second light emitting elements.
The second sealing member includes a plurality of first light emitting elements and a second wavelength conversion material that converts the wavelength of light emitted by the plurality of second light emitting elements into a wavelength different from that of the first wavelength conversion material. Item 8. The light emitting device according to any one of Items 1 to 9. A third sealing member covering the first sealing member and the second sealing member is further provided.
The light emitting device according to any one of claims 1 to 10, wherein the third sealing material is transparent. A third sealing member covering the first sealing member and the second sealing member is further provided.
The light emitting device according to claim 10, wherein the third sealing member includes at least one of the first wavelength conversion material and the second wavelength conversion material. A third sealing member covering the first sealing member and the second sealing member is further provided.
The light emitting device according to claim 10, wherein the third sealing member includes the first wavelength conversion material and a third wavelength conversion material that converts a wavelength different from that of the second wavelength conversion material. The light emitting device according to any one of claims 1 to 13, further comprising a plurality of first light emitting elements and a frame surrounding the plurality of second light emitting elements in the plan view. The light emitting device according to any one of claims 1 to 14,
A lighting device including a lighting device that supplies electric power for lighting the light emitting device to the light emitting device.

Images