JP2020071968A - Flexible organic el display manufacturing method - Google Patents

Abstract

To provide a flexible organic EL display manufacturing method in which the quality of a resin layer separated from a glass layer is less likely to deteriorate.SOLUTION: A flexible organic EL display manufacturing method includes a cutting step of cutting out a unit laminated substrate 70 of a predetermined size from a laminated substrate 60 in which a glass layer 61 and a resin layer 62 are laminated. In the cutting step, the glass layer 61 of the unit laminated substrate 70 is cut such that a cut surface 66 of the glass layer 61 is located outside a cut surface 67 of the resin layer 62.SELECTED DRAWING: Figure 14

Description

  The present invention relates to a method for manufacturing a flexible organic EL display.

  An organic EL (electro luminescence) display includes a light emitting device in which a light emitting layer, electrodes, and a substrate are laminated. In a flexible organic EL display, a flexible substrate is used as the substrate. In a manufacturing process of a flexible organic EL display, a resin layer is formed on a glass layer, and a light emitting layer and the like are formed on the resin layer (for example, Patent Document 1).

Republished Patent WO2011 / 030716

  In the manufacturing process of the flexible organic EL display, the resin layer on which the light emitting layer and the like are formed and the glass layer are separated from each other. The peeling means is, for example, laser lift-off. The state of laser irradiation on the irradiation target may affect the quality of the resin layer to be peeled off.

  An object of the present invention is to provide a method for manufacturing a flexible organic EL display in which the quality of the resin layer separated from the glass layer is less likely to deteriorate.

The method for manufacturing a flexible organic EL display according to the present invention includes a cutting step of cutting out a unit laminated substrate having a predetermined size from a laminated substrate in which a glass layer and a resin layer are laminated, and in the cutting step, the glass of the unit laminated substrate The glass layer is cut so that the cut surface of the layer is located outside the cut surface of the resin layer.
In this manufacturing method, the laser is applied to the resin layer without being affected by the cut surface of the glass layer. Since the resin layer is appropriately irradiated with the laser, the quality of the resin layer separated from the glass layer does not easily deteriorate.

In an example of the method for manufacturing the flexible organic EL display, the glass layer includes a first plane on which the resin layer is formed, and a second plane that forms a pair with the first plane, and in the cutting step, The glass layer is cut so that a cut surface is formed in which the width of the glass layer becomes narrower from the second plane toward the first plane.
Even when the glass layer is cut to form a cut surface parallel to the vertical surface, the cut surface may be inclined with respect to the vertical surface due to manufacturing error. Accurate management of the formation of such a cut surface is difficult. In the above manufacturing method, the glass layer is cut with the intention of forming an inclined cut surface, so that even if the influence of manufacturing error is taken into consideration, it is difficult to form a cut surface inclined in a direction different from the intended direction.

In an example of the method for manufacturing the flexible organic EL display, in the cutting step, the glass layer is scribed so that a scribe line is formed in which the width of the glass layer becomes narrower from the second plane toward the first plane. Then, the scribed glass layer is broken.
In this manufacturing method, the cut surface of the glass layer located outside the cut surface of the resin layer can be efficiently formed.

In an example of the method for manufacturing the flexible organic EL display, in the cutting step, the glass layer is scribed using a scribing wheel having a blade edge portion having an asymmetric shape with respect to a rotation center plane.
In this manufacturing method, the shape of the cut surface of the glass layer that is inclined with respect to the vertical surface is defined by the shape of the cutting edge portion, and the glass layer can be easily cut.

An example of the method for manufacturing the flexible organic EL display further includes a peeling step of peeling the glass layer and the resin layer of the unit laminated substrate by laser lift-off.
According to this manufacturing method, the resin layer and the glass layer can be efficiently separated.

In one example of the method for manufacturing the flexible organic EL display, in the cutting step, a plurality of the laminated substrates are provided, and the plurality of laminated substrates are a first laminated substrate in which a first glass layer and a first resin layer are laminated, And a unit laminated substrate including a second laminated substrate in which a second glass layer and a second resin layer are laminated, in which the first resin layer and the second resin layer are laminated so as to face each other. Cut out.
In this manufacturing method, even when the laminated substrate from which the unit laminated substrate is cut out is a multilayer laminated substrate, the resin layer is irradiated with the laser without being affected by the cut surface of the glass layer, and is peeled from the glass layer. The quality of the resin layer does not easily deteriorate.

  According to the present invention, the quality of the resin layer separated from the glass layer is less likely to deteriorate.

Sectional drawing of the multilayer laminated substrate regarding the manufacturing method of 1st Embodiment. The top view of the multilayer laminated substrate of FIG. The schematic diagram which shows the structure of a laser processing apparatus. The schematic diagram which shows the structure of a scribe processing apparatus. Sectional drawing of a scribing wheel. 3 is a flowchart showing the manufacturing method of the first embodiment. The figure which shows the relationship between the processing order and processing type of a latter-stage processing process. The schematic diagram which shows the structure of a laser processing apparatus. Sectional drawing of an example of a unit laminated substrate. The figure which shows an example of a peeling process. Sectional drawing of the multilayer laminated substrate regarding the manufacturing method of 2nd Embodiment. The flowchart which shows the manufacturing method of 2nd Embodiment. The figure which shows the relationship between the processing order of a cutting process, and a processing type. The figure which shows an example of a peeling process. Sectional drawing of the multilayer laminated substrate regarding the manufacturing method of a modification.

(First embodiment)
A method for manufacturing a flexible organic EL display will be described with reference to the drawings. Flexible organic EL displays are used in stationary devices, mobile devices, and the like. An example of a stationary device is a personal computer and a television receiver. Examples of mobile devices are personal digital assistants, wearable computers, and notebook personal computers. Examples of mobile information terminals are smartphones, tablets, and mobile game consoles. Examples of wearable computers are head mounted displays and smart watches.

  The flexible organic EL display has a light emitting device in which a light emitting layer, an electrode, and a substrate are laminated, a first protective film that covers the light emitting device from one side, and a second protective film that covers the light emitting device from the other side. PET (polyethylene terephthalate) is used for the first protective film and the second protective film, respectively. One of the first protective film and the second protective film may be omitted. In the manufacturing process of the light emitting device, a plurality of light emitting devices are manufactured from the single multilayer laminated substrate 10 shown in FIG.

  The multilayer laminated substrate 10 is manufactured at an intermediate stage of manufacturing a flexible organic EL display. The multilayer laminated substrate 10 includes a first laminated substrate 11 in which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 in which a second glass layer 12A and a second resin layer 12B are laminated. Have and. The multilayer laminated substrate 10 is configured by laminating the first laminated substrate 11 and the second laminated substrate 12 such that the first resin layer 11B and the second resin layer 12B face each other. The multilayer laminated substrate 10 further includes a conductive layer 13. The conductive layer 13 is formed on the first resin layer 11B of the first laminated substrate 11, for example. The conductive layer 13 is sandwiched between the first resin layer 11B and the second resin layer 12B. The conductive layer 13 is formed with an electronic device member such as an OLED (Organic Light Diode) or a TFT (Thin Film Transistor). The first resin layer 11B, the conductive layer 13, and the second resin layer 12B form a light emitting device.

  The first glass layer 11A of the first laminated substrate 11 and the second glass layer 12A of the second laminated substrate 12 are made of the same material and have the same size. The composition of the first glass layer 11A and the second glass layer 12A is not particularly limited, but glass having various compositions such as glass containing an alkali metal oxide or non-alkali glass can be used. An example of glass containing an alkali metal oxide is soda lime glass. In this embodiment, non-alkali glass is used for the first glass layer 11A and the second glass layer 12A. The thickness of each of the first glass layer 11A and the second glass layer 12A is not particularly limited, but is preferably about 0.5 mm, for example. The first glass layer 11A has a first flat surface 14A on which the first resin layer 11B is formed, and a second flat surface 14B paired with the first flat surface 14A. The second glass layer 12A has a first flat surface 15A on which the second resin layer 12B is formed, and a second flat surface 15B paired with the first flat surface 15A.

  The first resin layer 11B of the first laminated substrate 11 and the second resin layer 12B of the second laminated substrate 12 are made of the same material and have the same size. The compositions of the first resin layer 11B and the second resin layer 12B are not particularly limited, but polyimide (PI) can be used, for example. The thickness of each of the first resin layer 11B and the second resin layer 12B is not particularly limited, but is preferably in the range of 10 μm or more and 30 μm or less, for example.

FIG. 2 is a plan view of the multilayer laminated substrate 10.
A unit laminated substrate 20 is formed by cutting the multilayer laminated substrate 10 in a lattice shape along the planned cutting portions 16 and 17 indicated by broken lines in FIG. The size of the unit laminated substrate 20 in plan view corresponds to the predetermined size of the light emitting device in plan view.

  At least one of a laser processing device and a scribing device is used to cut the multilayer laminated substrate 10. FIG. 3 is an example of the configuration of the laser processing apparatus, and FIG. 4 is an example of the configuration of the scribing apparatus. 3 and 4, the X-axis direction, the Y-axis direction, and the Z-axis direction are defined as shown in FIGS. 3 and 4. A dicing machine (not shown) may be used to cut the first laminated substrate 11 and the second laminated substrate 12.

  As shown in FIG. 3, the laser processing apparatus 30 includes a laser device 31 for cutting the multilayer laminated substrate 10, a mechanical drive system 32 for moving the multilayer laminated substrate 10 with respect to the laser device 31, and a laser. A first control unit 33 that controls the device 31 and the mechanical drive system 32.

The laser device 31 can process at least one of the first resin layer 11B and the second resin layer 12B and the first glass layer 11A and the second glass layer 12A in the multilayer laminated substrate 10. The laser device 31 has a laser oscillator 34 for irradiating the multilayer laminated substrate 10 with laser light, and a transmission optical system 35 for transmitting the laser light to the mechanical drive system 32. The laser oscillator 34 is, for example, a UV (Ultra Violet) laser or a CO ₂ laser. When the laser processing device 30 processes the first resin layer 11B and the second resin layer 12B, the laser oscillator 34 is a UV laser. When the laser processing device 30 processes the first glass layer 11A and the second glass layer 12A, the laser oscillator 34 is a CO ₂ laser or a UV laser. The transmission optical system 35 includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. Further, the transmission optical system 35 has an X-axis direction moving mechanism for moving the laser irradiation head in which the laser oscillator 34 is incorporated, for example, in the X-axis direction. The laser light emitted from the laser oscillator 34 is emitted toward the multilayer laminated substrate 10 via the transmission optical system 35.

  The mechanical drive system 32 is arranged to face the laser device 31 in the Z-axis direction. The mechanical drive system 32 includes a bed 36, a processing table 37, and a moving device 38. The multilayer laminated substrate 10 is placed on the processing table 37. The moving device 38 moves the processing table 37 in the horizontal direction (X-axis direction and Y-axis direction) with respect to the bed 36. The moving device 38 is a known mechanism having a guide rail, a moving table, a motor, and the like.

  The first controller 33 has an arithmetic processing unit that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The first control unit 33 may include one or more microcomputers. The first control unit 33 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit has, for example, a non-volatile memory and a volatile memory. The first control unit 33 may be provided in the laser device 31, may be provided in the mechanical drive system 32, or may be provided separately from the laser device 31 and the mechanical drive system 32. When the first control unit 33 is provided separately from the laser device 31 and the mechanical drive system 32, the arrangement position of the first control unit 33 can be set arbitrarily.

  As shown in FIG. 4, in the scribing apparatus 40, the scribing wheel 50 and the multilayer laminated substrate 10 are relatively moved in the X-axis direction and the Y-axis direction, whereby the multilayer laminated substrate 10 is moved in the X-axis direction and the Y-axis direction. Form a scribe line along the direction. The scribing processing device 40 includes a processing device 41 for processing the multilayer laminated substrate 10, a transport device 42 for transporting the multilayer laminated substrate 10, and a second controller 43 for controlling the processing device 41 and the transport device 42. Equipped with.

  The transfer device 42 includes a pair of rails 44, a table 45, a linear drive device 46, a rotation device 47, and the like. The pair of rails 44 extend along the Y-axis direction. In the scribing device 40 of FIG. 4, a pair of rails 44 are arranged on the base (not shown) of the scribing device 40, and the linear drive device 46 causes the table 45 to reciprocate along the pair of rails 44, and the rotating device 47. This causes the table 45 to rotate about the central axis C. The multilayer laminated substrate 10 is placed on the table 45. An example of the linear drive device 46 has a feed screw device. The rotating device 47 has a motor that serves as a drive source.

  The processing device 41 includes a lateral drive device 48, a vertical drive device 49, a scribing wheel 50, and the like. The scribing wheel 50 is attached to a holder unit for holding the scribing wheel 50. The holder unit is attached to a scribing head for holding the holder unit. The scribing head is moved in the X-axis direction by the lateral drive device 48, and is moved in the Z-axis direction by the vertical drive device 49. By moving the scribing wheel 50 in the X-axis direction, a scribe line is formed in the multilayer laminated substrate 10 along the X-axis direction.

  The scribing wheel 50 is rotatably supported by a pin (not shown) attached to the holder unit. Examples of the material forming the scribing wheel 50 are sintered diamond (Poly Crystalline Diamond), cemented carbide, single crystal diamond, and polycrystalline diamond. As the scribing wheel 50, for example, one of the scribing wheel 50A having the shape shown in FIG. 5A and the scribing wheel 50B having the shape shown in FIG. 5B can be used.

  The scribing wheel 50A shown in FIG. 5A is composed of a disk-shaped main body 51 and a blade edge 52 having a V-shaped cross section. The V-shaped cross section is a shape that tapers toward the outer peripheral edge of the scribing wheel 50A in a cross section obtained by cutting the scribing wheel 50A along a plane along the thickness direction of the scribing wheel 50A (hereinafter referred to as "thickness direction DT"). ..

An insertion hole 53 that penetrates the body 51 in the thickness direction DT is formed in the center of the body 51. A pin is inserted into the insertion hole 53.
The blade edge portion 52 has a first slope 52A and a second slope 52B, which are two slopes forming a V-shaped cross section. The first slope 52A and the second slope 52B are the centers of the scribing wheel 50A in the thickness direction DT and are symmetrical with respect to the rotation center plane RC orthogonal to the thickness direction DT.

  The scribing wheel 50B shown in FIG. 5 (b) is different from the scribing wheel 50A in the shape of the cutting edge portion 52. The first slope 52A and the second slope 52B in the cutting edge portion 52 of the scribing wheel 50B are asymmetric with respect to the rotation center plane RC. More specifically, in the cross section of the scribing wheel 50B along the thickness direction, the first angle θ1 formed by the line segment L1 parallel to the radial direction of the scribing wheel 50B and the first slope surface 52A is the line segment L1 and the second slope surface. It is larger than the second angle θ2 formed by 52B. The first angle θ1 may be equal to the second angle θ2 as long as the position of the tip of the cutting edge portion 52 is displaced with respect to the rotation center plane RC in the direction along the line segment L1.

  The second control unit 43 has an arithmetic processing unit that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU or MPU. The second control unit 43 may have one or more microcomputers. The second control unit 43 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit has, for example, a non-volatile memory and a volatile memory. The second controller 43 may be provided in the processing device 41, may be provided in the transport device 42, or may be provided separately from the processing device 41 and the transport device 42. When the second control unit 43 is provided separately from the processing device 41 and the transfer device 42, the arrangement position of the second control unit 43 can be set arbitrarily.

[Method for manufacturing flexible organic EL display]
Next, details of the method for manufacturing the flexible organic EL display will be described. FIG. 6 shows an example of steps of a method for manufacturing a flexible organic EL display.

  In the method of manufacturing a flexible organic EL display, after the first laminated substrate 11 and the second laminated substrate 12 are bonded to each other to produce the multilayer laminated substrate 10, the multilayer laminated substrate 10 is cut into a predetermined size to produce the unit laminated substrate 20. .. Next, the light emitting device is manufactured by removing the first glass layer 11A and the second glass layer 12A from the unit laminated substrate 20. Then, the first protective film and the second protective film are attached to the first resin layer 11B and the second resin layer 12B. Thereby, a flexible organic EL display is manufactured.

  As shown in FIG. 6, in the method for manufacturing a flexible organic EL display, a first step, which is a step prior to the step of laminating the first laminated substrate 11 and the second laminated substrate 12, a first laminated substrate 11 and a second laminated substrate 11 It is divided into a subsequent step, which is a step after the step of stacking the two-layered substrate 12. The pre-stage process includes a pre-stage lamination process. The pre-stage laminating step is a step of manufacturing the first laminated substrate 11 and the second laminated substrate 12. The post-stage process includes a post-stage laminating process, a post-stage processing process, and a peeling process. The latter-stage laminating step is a step of laminating the first laminated substrate 11 and the second laminated substrate 12 to manufacture the multilayer laminated substrate 10. In the latter-stage processing step, the unit laminated board 20 is manufactured by cutting the multilayer laminated board 10 along the planned cutting portions 16 and 17 of the multilayer laminated board 10, that is, by cutting the multilayer laminated board 10 into a predetermined size. It is a process. The peeling step is a step of peeling the first glass layer 11A and the first resin layer 11B and peeling the second glass layer 12A and the second resin layer 12B by laser lift off (LLO). The details of each step will be described below.

  In the first-stage laminating step, the first laminated substrate 11 is manufactured by forming the first resin layer 11B over the entire first plane 14A of the first glass layer 11A, and over the entire first plane 15A of the second glass layer 12A. The second laminated substrate 12 is manufactured by forming the second resin layer 12B. The method for forming the first resin layer 11B on the first flat surface 14A of the first glass layer 11A and the method for forming the second resin layer 12B on the first flat surface 15A of the second glass layer 12A are respectively the resin for the glass layer. A method of applying a layer or a method of laminating a resin layer on a glass layer via an adhesive layer can be selected. As a method for fixing the resin layer to the glass layer, heat curing treatment or heating and pressure treatment by a pressing method can be selected.

  In the latter-stage laminating step, the first laminated substrate 11 not cut into a predetermined size and the second laminated substrate 12 not cut into a predetermined size are laminated. In one example, the first laminated substrate 11 and the second laminated substrate 12 are attached to each other via, for example, the adhesive layer SD. Thereby, the multilayer laminated substrate 10 is manufactured.

  The post-processing step includes a post-cutting step of cutting the first laminated substrate 11 and the second laminated substrate 12, respectively. In the post-cutting step of the post-processing step, as shown in FIGS. 7A and 7B, for example, the order in which the multilayer laminated substrate 10 is cut and the processing type can be arbitrarily selected. The table of FIG. 7A shows an example of the relationship between the processing order and processing type of each layer when the first laminated substrate 11 and the second laminated substrate 12 are cut in this order. FIG. 7B shows an example of the relationship between the processing order and processing type of each layer when the second laminated substrate 12 and the first laminated substrate 11 are cut in this order. As shown in FIGS. 7A and 7B, when the first resin layer 11B is cut or scribed before the first glass layer 11A, and when the second resin layer 12B is before the second glass layer 12A. In the case of cutting or scribing, the scribe processing device 40 cannot be used for processing the first resin layer 11B and the second resin layer 12B. When cutting the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B with a laser, for example, the following first method and second method can be selected. The first method is to scribe the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B with a laser, and then the first glass layer 11A, the second glass layer 12A, The first resin layer 11B and the second resin layer 12B are broken. The second method cuts the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B with a laser. In the second-stage cutting process of the first-stage processing example, in the second-stage cutting process, the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B are cut into layers and Any of the layers to be broken after scribing can be arbitrarily selected.

  When the first resin layer 11B or the second resin layer 12B is cut with a laser, generation of a gas having a laser output during laser irradiation of the first resin layer 11B or the second resin layer 12B above a predetermined temperature is suppressed. It is preferable to set the output to less than the predetermined output and irradiate the first resin layer 11B or the second resin layer 12B with the laser multiple times. Since the gas generated when the first resin layer 11B or the second resin layer 12B is processed by the laser is cooled with the passage of time, it is possible to suppress an increase in the volume of the gas inside the multilayer laminated substrate 10.

  When the second resin layer 12B is cut or the second resin layer 12B is scribed by the laser after the first glass layer 11A is scribed by the laser or the scribing wheel 50, it is preferable to irradiate the laser from the second glass layer 12A side. .. When the second resin layer 12B is cut by the laser, the first resin layer 11B may be cut or the first resin layer 11B may be scribed by the laser in the same irradiation direction after cutting the second resin layer 12B. When the first resin layer 11B is cut or the first resin layer 11B is scribed by the laser after the second glass layer 12A is scribed by the laser or the scribing wheel 50, it is preferable to irradiate the laser from the first glass layer 11A side. .. When the first resin layer 11B is cut by the laser, the second resin layer 12B may be cut or the second resin layer 12B may be scribed by the laser in the same irradiation direction after cutting the first resin layer 11B.

  When cutting each of the glass layer and the resin layer with a laser or scribing each of the glass layer and the resin layer, a laser processing apparatus 30A shown in FIG. 8 is used instead of the laser processing apparatus 30 shown in FIG. The laser processing device 30A is different from the laser processing device 30 in the configuration of the laser device. Hereinafter, a different configuration of the laser processing device 30A will be described.

The laser device 31A of the laser processing device 30A has a first laser oscillator 34A and a second laser oscillator 34B. The first laser oscillator 34A is a UV laser and the second laser oscillator 34B is a CO ₂ laser. The laser light emitted from the first laser oscillator 34A and the laser light emitted from the second laser oscillator 34B are emitted to the multilayer laminated substrate 10 via the transmission optical system 35. The transmission optical system 35 may be provided with a transmission optical system corresponding to the first laser oscillator 34A and a transmission optical system corresponding to the second laser oscillator 34B separately.

  The first control unit 33 selects the first laser oscillator 34A and the second laser oscillator 34B according to the type (glass layer or resin layer) of the processing target for the multilayer laminated substrate 10. For example, the first control unit 33 determines the processing order of the glass layer and the resin layer, which are the types of processing targets, according to a control program stored in advance, and the first laser oscillator 34A and the second laser oscillator according to the determined processing order. Select 34B.

  FIG. 9 shows an example of the unit laminated substrate 20 manufactured in the latter cutting process. The unit laminated substrate 20 shown in FIG. 9 is manufactured by scribing the first glass layer 11A and the second glass layer 12A by the scribing wheel 50B shown in FIG. 5B and then breaking them. In the cross section of the unit laminated substrate 20 shown in FIG. 9, the direction orthogonal to the thickness direction T of the unit laminated substrate 20 is defined as the width direction W. In the cross section of the unit laminated substrate 20, the side toward the center of the unit laminated substrate 20 in the width direction W is the inside, and the direction toward the end in the width direction W is the outside.

  In the latter-stage cutting step, the first glass layer 11A is cut such that the cut surface 23A of the first glass layer 11A of the unit laminated substrate 20 is located outside the cut surface 23B of the first resin layer 11B. The second glass layer 12A is cut such that the cut surface 24A of the second glass layer 12A of the unit laminated substrate 20 is located outside the cut surface 24B of the second resin layer 12B. More specifically, the first glass layer 11A is cut such that a cutting surface 23A is formed in which the width WD1 of the first glass layer 11A becomes narrower from the second plane 14B of the first glass layer 11A toward the first plane 14A. Has been done. The second glass layer 12A is cut so as to form a cut surface 24A in which the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B of the second glass layer 12A toward the first plane 15A. Since the first glass layer 11A and the second glass layer 12A are scribed by the scribing wheel 50B, the scribing apparatus 40 moves from the second plane 14B of the first glass layer 11A to the first plane 14A in the cross-sectional view shown in FIG. As a result, the first glass layer 11A is scribed so that a scribe line (crack) that narrows the width WD1 of the first glass layer 11A is formed. Next, the scribed first glass layer 11A is broken. In the scribing apparatus 40, a scribe line (crack) is formed in which the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B of the second glass layer 12A toward the first plane 15A in the cross-sectional view shown in FIG. So that the second glass layer 12A is scribed. Next, the scribed second glass layer 12A is broken. Instead of the scribing wheel 50B, the cut surface 23A of the first glass layer 11A and the cut surface 24A of the second glass layer 12A shown in FIG. 9 may be formed by the laser of the laser processing device 30.

  A laser lift-off device (not shown) is used in the peeling process. In this embodiment, a UV laser is used as the laser of the laser lift-off device. As shown in FIG. 10A, the first resin layer 11B and the first glass layer 11A are separated by irradiating the first resin layer 11B with a laser from the first glass layer 11A side. When peeling off the first resin layer 11B and the first glass layer 11A, the laser is applied so as to be orthogonal to the second plane 14B of the first glass layer 11A. Next, as shown in FIG. 10B, the second resin layer 12B and the second glass layer 12A are separated by irradiating the second resin layer 12B with a laser from the second glass layer 12A side. When peeling off the second resin layer 12B and the second glass layer 12A, the laser is applied so as to be orthogonal to the second plane 15B of the second glass layer 12A. The order of peeling the first glass layer 11A and the second glass layer 12A can be arbitrarily changed. For example, after peeling the second resin layer 12B and the second glass layer 12A, the first resin layer 11B and the first glass layer 11A may be peeled.

  After the first glass layer 11A and the second glass layer 12A are removed from the multilayer laminated substrate 10 (see FIG. 10C), the first protective film is attached so as to cover the first resin layer 11B, and the second resin The flexible organic EL display is manufactured by attaching the second protective film so as to cover the layer 12B.

  In the unit laminated substrate 20 shown in FIG. 9, the second flat surface 14B of the first glass layer 11A is formed up to the edge of the first resin layer 11B in the width direction W, and the edge of the second resin layer 12B in the width direction W is formed. The second plane 15B of the second glass layer 12A is formed up to. That is, in the thickness direction T, the edge in the width direction W of the first resin layer 11B and the cut surface 23A of the first glass layer 11A do not overlap each other, and the edge in the width direction W of the second resin layer 12B and the edge 2 The cut surface 24A of the glass layer 12A does not overlap. Therefore, when the laser of the laser lift-off device is irradiated to the widthwise W edge of the first resin layer 11B and the widthwise W edge of the second resin layer 12B, the laser cuts the first glass layer 11A. It does not pass through the surface 23A and the cut surface 24A of the second glass layer 12A.

The effects of this embodiment will be described.
(1-1) The cut surface 23A of the first glass layer 11A of the unit laminated substrate 20 is positioned outside the cut surface 23B of the first resin layer 11B in the width direction W, and the cut surface 24A of the second glass layer 12A is It is located outside the cut surface 24B of the second resin layer 12B in the width direction W. According to this manufacturing method, the laser is applied to the first resin layer 11B and the second resin layer 12B without being affected by the cut surface 23A of the first glass layer 11A and the cut surface 24A of the second glass layer 12A. .. Since the first resin layer 11B and the second resin layer 12B are appropriately irradiated with the laser, respectively, the quality of the first resin layer 11B separated from the first glass layer 11A and the quality of the first resin layer 11B separated from the second glass layer 12A. The quality of the second resin layer 12B does not easily deteriorate.

  (1-2) In the second-stage cutting step, the first glass layer 11A is cut so that the cutting surface 23A in which the width WD1 of the first glass layer 11A becomes narrower from the second flat surface 14B toward the first flat surface 14A is formed. .. The second glass layer 12A is cut so that a cutting surface 24A is formed in which the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B toward the first plane 15A. In this manufacturing method, since the first glass layer 11A and the second glass layer 12A are cut with the intention of forming the inclined cut surfaces 23A and 24A, even if the influence of the manufacturing error is taken into consideration, a direction different from the intended direction. It is difficult to form an inclined cut surface.

  (1-3) In the subsequent cutting step, the first glass layer 11A is formed so that scribe lines (cracks) are formed in which the width WD1 of the first glass layer 11A becomes narrower from the second plane 14B toward the first plane 14A. Scribe and break the scribed first glass layer 11A. The second glass layer 12A is scribed so as to form scribe lines (cracks) in which the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B toward the first plane 15A, and the scribed second glass layer Break 12A. In this manufacturing method, the cut surface 23A of the first glass layer 11A located outside the cut surface 23B of the first resin layer 11B can be efficiently formed, and the cut surface 24B of the second resin layer 12B is cut outside. It is possible to efficiently form the cut surface 24A of the second glass layer 12A located at the position.

  (1-4) In the latter-stage cutting step, the first glass layer 11A and the second glass layer are formed by using the scribing wheel 50B having the cutting edge portion 52 having an asymmetric shape with respect to the rotation center plane RC shown in FIG. 5B. Scribe 12A. In this manufacturing method, the shape of the cutting surface 23A of the first glass layer 11A inclined with respect to the second plane 14B and the shape of the cutting surface 24A of the second glass layer 12A inclined with respect to the second plane 15B are the cutting edge portions. It is defined by the shape of 52, and the first glass layer 11A and the second glass layer 12A can be easily cut.

  (1-5) A peeling step of peeling the first glass layer 11A and the first resin layer 11B and peeling the second glass layer 12A and the second resin layer 12B by laser lift-off is further included. In this manufacturing method, the first glass layer 11A and the first resin layer 11B can be efficiently peeled off, and the second glass layer 12A and the second resin layer 12B can be efficiently peeled off.

  (1-6) In the method for manufacturing a flexible organic EL display, the multilayer laminated substrate 10 is cut into a predetermined size in a subsequent step that is a step after the step of laminating the first laminated substrate 11 and the second laminated substrate 12. In this manufacturing method, since the first laminated substrate 11 and the second laminated substrate 12 are cut in the laminated multilayer laminated substrate 10, the laminating operation is simplified. Therefore, the manufacturing efficiency of the flexible organic EL display is unlikely to decrease.

  (1-7) In the latter cutting step of the latter processing step, the first glass layer 11A and the second glass layer 12A are first cut, and then the first resin layer 11B and the second resin layer 12B are cut. In this manufacturing method, the first glass layer 11A and the second glass layer 12A are cut first, so in the step of cutting the first resin layer 11B and the second resin layer 12B, the first glass layer in the first resin layer 11B is cut. The portion not covered with 11A and the portion of the second resin layer 12B not covered with the second glass layer 12A can be cut. For example, in the case of cutting the first resin layer 11B and the second resin layer 12B with a laser, the gas generated by the irradiation of the laser on the first resin layer 11B and the second resin layer 12B is the cut portion of the first glass layer 11A and It is discharged from the cut portion of the second glass layer 12A. For this reason, the gas is less likely to affect the quality of the first resin layer 11B and the second resin layer 12B.

  (1-8) In the latter-stage cutting step, the first resin layer 11B and the second resin layer 12B are cut with a laser. Therefore, as compared with, for example, the cutting using the scribing wheel 50, the amount of heat generated when cutting the first resin layer 11B and the second resin layer 12B is small, and the quality of the first resin layer 11B and the second resin layer 12B is low. Hard to drop.

  (1-9) In the latter-stage cutting step, the laser output per laser irradiation to the first resin layer 11B and the second resin layer 12B is made less than a predetermined output that suppresses the generation of gas at a predetermined temperature or higher. Set. According to this manufacturing method, high-temperature gas is unlikely to be generated when the first resin layer 11B and the second resin layer 12B are irradiated with laser, and the first glass layer 11A and the second glass layer 12A are affected by the gas. The risk that the quality of the first resin layer 11B and the second resin layer 12B will deteriorate is reduced.

(Second embodiment)
A method for manufacturing the flexible organic EL display of the second embodiment will be described with reference to FIGS. 11 to 14. The present embodiment is different from the first embodiment in that a laminated substrate 60 is manufactured instead of the multilayer laminated substrate 10.

  As shown in FIG. 11, the laminated substrate 60 is configured by laminating a glass layer 61 and a resin layer 62. The glass layer 61 has a first flat surface 63A on which the resin layer 62 is formed and a second flat surface 63B paired with the first flat surface 63A. The laminated substrate 60 further includes a conductive layer 68. The conductive layer 68 is the same as the conductive layer 13 of the first embodiment. The resin layer 62 and the conductive layer 68 form a light emitting device. The composition of the glass layer 61 is the same as that of the first glass layer 11A or the second glass layer 12A of the first embodiment, for example. The composition of the resin layer 62 is, for example, the same as the composition of the first resin layer 11B or the second resin layer 12B of the first embodiment.

  As shown in FIG. 12, the method for manufacturing a flexible organic EL display includes a laminating step, a cutting step, and a peeling step. The laminating step is a step of manufacturing the laminated substrate 60 by laminating the resin layer 62 on the glass layer 61. The cutting step is a step of cutting a unit laminated substrate 70 (see FIG. 14A) of a predetermined size from the laminated substrate 60. The peeling step is a step of peeling the resin layer 62 and the glass layer 61 of the unit laminated substrate 70 by laser lift-off. The details of each step will be described below.

  In the laminating process, the laminated substrate 60 is manufactured by forming the resin layer 62 over the entire first plane 63A of the glass layer 61. As a method of forming the resin layer 62 on the first plane 63A of the glass layer 61, a method of applying the resin layer 62 to the glass layer 61 or a method of laminating the resin layer 62 on the glass layer 61 via an adhesive layer is selected. it can. Further, as a method of fixing the resin layer 62 to the glass layer 61, heat curing treatment or heating and pressure treatment by a pressing method can be selected.

  In the cutting step, the glass layer 61 and the resin layer 62 are respectively cut along the planned cutting portion 64A of the glass layer 61 and the planned cutting portion 64B of the resin layer 62 shown in FIG. The planned cutting portions 64A and 64B are cutting portions for cutting the laminated substrate 60 into a predetermined size. As shown in FIG. 13, in the cutting step, the order of cutting the laminated substrate 60 and the processing type can be arbitrarily selected. The laminated substrate 60 may be cut in the order of the resin layer 62 and the glass layer 61, or may be cut in the order of the glass layer 61 and the resin layer 62. For cutting the glass layer 61 and the resin layer 62, either the laser processing device 30 or the scribe processing device 40 may be used. Regarding the cutting of the glass layer 61 and the resin layer 62, the laser processing device 30 or the scribing device 40 may scribe and then break, or the laser processing device 30 may cut.

  In the cutting step, when scribing or cutting each of the planned cutting portion 64A of the glass layer 61 and the planned cutting portion 64B of the resin layer 62 by laser, instead of the laser processing device 30 shown in FIG. 3, it is shown in FIG. The laser processing device 30A is used.

  FIG. 14A shows a unit laminated substrate 70 which is a laminated substrate 60 of a predetermined size when the glass layer 61 is scribed and broken by the scribing wheel 50B shown in FIG. 5B in the cutting step. In the cross section of the unit laminated substrate 70 shown in FIG. 14A, the direction orthogonal to the thickness direction T of the unit laminated substrate 70 is defined as the width direction W. In the cross section of the unit laminated substrate 70, the side facing the center of the unit laminated substrate 70 in the width direction W is the inner side, and the direction toward the end portion in the width direction W is the outer side.

  In the cutting step, the planned cutting portion 64A (see FIG. 11) of the glass layer 61 is cut so that the cutting surface 66 of the glass layer 61 of the unit laminated substrate 70 is located outside the cutting surface 67 of the resin layer 62. More specifically, in the cutting step, the planned cutting portion 64A of the glass layer 61 is formed so that the cutting surface 66 in which the width WD of the glass layer 61 becomes narrower from the second plane 63B of the glass layer 61 toward the first plane 63A. Has been disconnected. Since the scribing wheel 50B scribes the glass layer 61, in the cutting step, the scribing apparatus 40 moves the glass layer 61 from the second plane 63B of the glass layer 61 toward the first plane 63A in the cross-sectional view of FIG. The to-be-cut portion 64A of the glass layer 61 is scribed so that a scribe line (crack) having a narrow width WD is formed. Next, the planned cutting portion 64A of the scribed glass layer 61 is broken. Instead of the scribing wheel 50B, the cut surface 66 of the glass layer 61 shown in FIG. 14A may be formed by the laser of the laser processing device 30.

  In the peeling step, the laser lift-off device (not shown) similar to that of the first embodiment is used to irradiate the resin layer 62 with a laser beam from the glass layer 61 as shown in FIG. 14A. The glass layer 61 is peeled off.

  After the glass layer 61 is removed from the multilayer laminated substrate 10 (see FIG. 14B), the first protective film is attached so as to cover one side in the thickness direction T of the resin layer 62, and the thickness of the resin layer 62. The flexible organic EL display is manufactured by attaching the second protective film so as to cover the other side in the direction T.

  In the unit laminated substrate 70 shown in FIG. 14A, the second plane 63B of the glass layer 61 is formed up to the edge of the resin layer 62 in the width direction W. That is, in the thickness direction T, the edge of the resin layer 62 in the width direction W and the cut surface 66 of the glass layer 61 do not overlap. Therefore, when the edge of the resin layer 62 in the width direction W is irradiated with the laser of the laser lift-off device, the laser does not pass through the cut surface 66 of the glass layer 61.

The effects of this embodiment will be described.
(2-1) The cut surface 66 of the glass layer 61 of the unit laminated substrate 70 is located outside the cut surface 67 of the resin layer 62 in the width direction W. According to this manufacturing method, the laser of the laser lift-off device irradiates the resin layer 62 without being affected by the cut surface 66 of the glass layer 61 and the cut surface 67 of the glass layer 61. Since the resin layer 62 is appropriately irradiated with the laser of the laser lift-off device, the quality of the resin layer 62 separated from the glass layer 61 is unlikely to deteriorate.

  (2-2) In the cutting step, the glass layer 61 is cut so that the cutting surface 66 is formed in which the width WD of the glass layer 61 becomes narrower from the second plane 63B toward the first plane 63A. In this manufacturing method, since the glass layer 61 is cut with the intention of forming the inclined cut surface 66, even if the influence of the manufacturing error is taken into consideration, it is difficult to form a cut surface inclined in a direction different from the intended direction.

  (2-3) In the cutting step, the glass layer 61 is scribed and scribed so that scribe lines (cracks) are formed in which the width WD of the glass layer 61 becomes narrower from the second plane 63B toward the first plane 63A. The broken glass layer 61 is broken. With this manufacturing method, the cut surface 66 of the glass layer 61 located outside the cut surface 67 of the resin layer 62 can be efficiently formed.

  (2-4) The glass layer 61 is scribed using the scribing wheel 50B having the blade edge portion 52 having an asymmetric shape with respect to the rotation center plane RC shown in FIG. 5 (b). In this manufacturing method, the shape of the cutting surface 66 of the glass layer 61 that is inclined with respect to the second plane 63B is defined by the shape of the cutting edge portion 52, and the glass layer 61 can be easily cut.

  (2-5) The method for manufacturing a flexible organic EL display further includes a peeling step of peeling the glass layer 61 and the resin layer 62 by laser lift-off. In this manufacturing method, the glass layer 61 and the resin layer 62 can be efficiently separated.

(Modification)
Each of the above embodiments is an example of a form that the method for manufacturing a flexible organic EL display according to the present disclosure can take, and is not intended to limit the form. The method of manufacturing the flexible organic EL display according to the present disclosure may take a form different from the form exemplified in each embodiment. An example thereof is a form in which a part of the configuration of each embodiment is replaced, changed, or omitted, or a configuration in which a new configuration is added to each embodiment. In the following modified examples, the same parts as those of the embodiments are designated by the same reference numerals, and the description thereof will be omitted.

  In the first embodiment, in the latter cutting step, when the first resin layer 11B and the second resin layer 12B are cut, the gas generated due to the laser irradiation to the first resin layer 11B and the second resin layer 12B is sucked. A suction mechanism 80 may be provided. As shown in FIG. 15, the suction mechanism 80 is configured to suck gas through the peripheral surface 10A of the multilayer laminated substrate 10. An example of the suction mechanism 80 has an intake fan. The suction mechanism 80 sucks air on the peripheral surface 10A of the multilayer laminated substrate 10 by driving the suction fan. In this case, the gas generated in the multilayer laminated substrate 10 is discharged to the outside of the multilayer laminated substrate 10 via the peripheral surface 10A.

  -In 1st Embodiment, when cutting the 1st resin layer 11B and the 2nd resin layer 12B by irradiation of the laser of multiple times, in place of or in addition to setting a laser to less than predetermined output, fixed time Alternatively, the first resin layer 11B and the second resin layer 12B may be cut by irradiating the first resin layer 11B and the second resin layer 12B with a laser a plurality of times. In this manufacturing method, one of the first resin layer 11B and the second resin layer 12B is irradiated with a laser, the irradiation of the laser is temporarily interrupted, and after a certain period of time elapses, the first resin layer 11B and the second resin layer 11B are again formed. One of the resin layers 12B is irradiated with the laser, and the irradiation of these lasers and the temporary interruption of the irradiation are repeated a plurality of times. The same applies when the other of the first resin layer 11B and the second resin layer 12B is irradiated with laser. The gas generated by the laser irradiation to the first resin layer 11B and the second resin layer 12B is cooled when the laser irradiation is temporarily stopped, and the first glass layer 11A and the second glass layer 11A The risk that the quality of the glass layer 12A, the first resin layer 11B, and the second resin layer 12B will deteriorate is reduced.

  In the first embodiment, the unit laminated substrate 20 is manufactured by bonding the first unit laminated substrate which is the first laminated substrate 11 having the predetermined size and the second unit laminated substrate which is the second laminated substrate 12 having the predetermined size. You may. That is, the pre-stage process includes a first cutting process for cutting the first laminated substrate 11 into a predetermined size and a second cutting process for cutting the second laminated substrate 12 into a predetermined size. In the latter-stage laminating step, the first unit laminated substrate and the second unit laminated substrate are laminated. In this case, the cut surface 23A is formed on the first glass layer 11A of the first unit laminated substrate, and the cut surface 24A is formed on the second glass layer 12A of the second unit laminated substrate.

  In the first embodiment, after bonding the first unit laminated board which is the first laminated board 11 having a predetermined size and the second laminated board 12 which has not been cut into the predetermined size, the second laminated board 12 is formed. The unit laminated substrate 20 may be manufactured by cutting into a predetermined size. Also, after bonding the second unit laminated board, which is the second laminated board 12 of a predetermined size, and the first laminated board 11 before being cut into a predetermined size, the first laminated board 11 is cut into a predetermined size. The unit laminated substrate 20 may be manufactured. That is, the former step includes one of a first cutting step of cutting the first laminated substrate 11 into a predetermined size and a second cutting step of cutting the second laminated substrate 12 into a predetermined size. The latter step includes the other of the first cutting step of cutting the first laminated substrate 11 into a predetermined size and the second cutting step of cutting the second laminated substrate 12 into a predetermined size. In this case, the unit laminated substrate 20 shown in FIG. 9 is manufactured after the subsequent processing step.

  In the first embodiment, in addition to forming the conductive layer 13 on the first laminated substrate 11 or in addition to forming the conductive layer 13 on the first laminated substrate 11, the conductive layer 13 is formed on the second laminated substrate 12. The conductive layer 13 may be formed.

10: multilayer laminated substrate 11: first laminated substrate 11A: first glass layer 11B: first resin layer 12: second laminated substrate 12A: second glass layer 12B: second resin layer 14A: first plane 14B: second Plane 15A: First plane 15B: Second plane 20: Unit laminated substrate 23A: Cutting surface 23B: Cutting surface 24A: Cutting surface 24B: Cutting surfaces 50, 50A, 50B: Scribing wheel 52: Blade edge portion 60: Laminated substrate 61: Glass layer 62: Resin layer 63A: First plane 63B: Second plane 66: Cutting plane 67: Cutting plane 70: Unit laminated substrate RC: Rotation center plane

Claims (6)

Including a cutting step of cutting out a unit laminated substrate of a predetermined size from a laminated substrate in which a glass layer and a resin layer are laminated,
In the cutting step, the glass layer is cut such that the cut surface of the glass layer of the unit laminated substrate is located outside the cut surface of the resin layer. The glass layer includes a first plane on which the resin layer is formed, and a second plane that forms a pair with the first plane,
The flexible organic EL display according to claim 1, wherein in the cutting step, the glass layer is cut so that a cutting surface in which the width of the glass layer becomes narrower from the second plane toward the first plane is formed. Production method. In the cutting step, the glass layer is scribed so as to form a scribe line in which the width of the glass layer becomes narrower from the second plane toward the first plane, and the scribed glass layer is broken. Item 3. A method for manufacturing a flexible organic EL display according to item 2. The method of manufacturing a flexible organic EL display according to claim 3, wherein in the cutting step, the glass layer is scribed using a scribing wheel having a blade edge portion having an asymmetric shape with respect to a rotation center plane. The method for manufacturing a flexible organic EL display according to claim 1, further comprising a peeling step of peeling off the glass layer and the resin layer of the unit laminated substrate by laser lift-off. In the cutting step, a plurality of laminated substrates are provided, the plurality of laminated substrates are a first laminated substrate in which a first glass layer and a first resin layer are laminated, and a second glass layer and a second resin layer. The unit laminated substrate is cut out from a multilayer laminated substrate including a second laminated substrate in which is laminated so that the first resin layer and the second resin layer are laminated so as to face each other. A method for manufacturing a flexible organic EL display according to item 1.