JP2019161439A - Flexible substrate and imaging device - Google Patents

Abstract

To provide a flexible substrate suppressed in deformation reaction.SOLUTION: A flexible substrate includes: a first connection part disposed on one end of the flexible substrate and connected to a first substrate; a second connection part disposed on the other end of the flexible substrate and connected to a second substrate movable in a first direction and in a second direction intersecting the first direction with respect to the first substrate; a first portion disposed between the first connection part and the second connection part and bent in a direction opposite to the first direction from the first direction; and a second portion arranged between the first connection part and the second connection part and bent in a direction opposite to the second direction from the second direction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a flexible substrate and an imaging apparatus.

  The conventional flexible printed circuit board is curved in a substantially U shape. When an external force is applied to a curved portion of the flexible printed board, it can be deformed in the bending direction, but is not easily deformed in a direction intersecting the bending direction.

JP 2008-278382 A

  The flexible substrate according to one aspect of the invention disclosed in the present application is disposed at one end of the flexible substrate, and is connected to the first connection portion connected to the first substrate and the other end of the flexible substrate. A second connecting portion disposed and connected to a second substrate movable in a first direction and a second direction intersecting the first direction with respect to the first substrate; the first connecting portion; and the second connecting portion. A first portion that is disposed between the first connection portion and bends in a direction opposite to the first direction from the first direction; and is disposed between the first connection portion and the second connection portion, and the second direction. To a second portion bent in the opposite direction to the second direction.

  An imaging apparatus according to an aspect of the invention disclosed in the present application includes a first substrate including an imaging element, a second substrate disposed to face the first substrate, and one end connected to the first substrate, A flexible substrate having the other end connected to the second substrate, wherein the flexible substrate is a first in-plane of the first substrate between the first substrate and the second substrate. A first portion extending in a direction, and a second portion extending in a second direction intersecting the first direction in a plane of the first substrate.

FIG. 1 is an explanatory diagram illustrating a flexible printed circuit board according to the first embodiment. FIG. 2 is a perspective view illustrating a configuration example of an apparatus on which the flexible substrate according to the first embodiment is mounted. FIG. 3 is a perspective view showing an apparatus mounted with a flexible substrate according to the second embodiment. FIG. 4 is an explanatory diagram showing a flexible printed circuit board according to the third embodiment. FIG. 5 is a perspective view showing a configuration example of an apparatus on which a flexible substrate according to the third embodiment is mounted. FIG. 6 is an explanatory diagram illustrating a flexible printed circuit board according to the fourth embodiment. FIG. 7 is a perspective view showing an apparatus on which a flexible substrate according to the fourth embodiment is mounted. FIG. 8 is an explanatory diagram showing a heat dissipation sheet according to the fifth embodiment. FIG. 9 is a perspective view illustrating a configuration example of an apparatus on which a flexible substrate according to the fifth embodiment is mounted. FIG. 10 is a side sectional view of the vibration isolation mechanism.

(First embodiment)
A flexible substrate and an imaging apparatus according to a first embodiment will be described with reference to the accompanying drawings. Specifically, for example, a flexible substrate such as a so-called flexible printed circuit board or a heat-dissipating flexible sheet and a device on which the flexible substrate is mounted will be described. This apparatus is applied to, for example, an image stabilization mechanism (camera shake correction mechanism) mounted on an electronic apparatus such as an imaging apparatus.

  In the following drawings, the direction is specified using an XYZ coordinate system that defines a three-dimensional space. In the XYZ coordinate system, the X axis, the Y axis, and the Z axis are axes that are orthogonal to each other. The directions indicated by the X-axis, Y-axis, and Z-axis arrows are the + X direction, + Y direction, and + Z direction, and the opposite directions are the -X direction, -Y direction, and -Z direction. It should be noted that when the notation is simply expressed as the X direction, the direction includes the + X direction and the −X direction. The same applies to the Y direction and the Z direction.

<Flexible printed circuit board>
FIG. 1 is an explanatory diagram illustrating a flexible printed circuit board according to the first embodiment. (A) is a plan view of the flexible printed circuit board 100, and (B) is a perspective view of the flexible printed circuit board 100. FIG. In (A), a flexible printed circuit board (Flexible Printed Wired Board or Flexible Printed Circuits) 100 is substantially L-shaped. The flexible printed circuit board 100 is a flexible circuit board that has a thin copper foil wiring pattern on a base made of, for example, polyimide or polyester, and is covered with an insulating film that protects the surface.

  One end 101 of the flexible printed circuit board 100 is directed in the + Y direction, and the other end 102 is directed in the + X direction. The one end 101 and the other end 102 each have a terminal for connecting to a connector to be described later. A region between the one end 101 and the other end 102 is referred to as a first midway portion 103, a second midway portion 104, and a connection portion 105. The first midway part 103 extends in the + Y direction between the connection part 105 and the one end 101, and the second midway part 104 extends in the + X direction between the connection part 105 and the other end 102. The connection unit 105 connects the first midway part 103 and the second midway part 104.

  (B) shows that the one end 101 is bent from the + Y direction to the −Y direction and folded back so that the surface 100a of the flexible printed circuit board 100 is opposed to the first intermediate portion 103, and the other end 102 is from the + X direction to the −X direction. A state in which the back surface 100b of the flexible printed circuit board 100 is bent so as to face each other at the second midway portion 104 is shown.

  The cross section in the Y direction of the first midway portion 103 and the cross section in the X direction of the second midway portion 104 are both substantially U-shaped. In other words, the first midway part 103 constitutes a curved convex part protruding in the + Y direction. The second midway portion 104 constitutes a curved convex portion that protrudes in the + X direction.

<Configuration example of device mounted with flexible substrate>
FIG. 2 is a perspective view illustrating a configuration example of an apparatus on which the flexible substrate according to the first embodiment is mounted. A device 200 on which a flexible board is mounted includes a first circuit board 201, a second circuit board 202, and a flexible printed board 100. The first circuit board 201 is parallel to the XY plane and is movable in the X direction and the Y direction. The first circuit board 201 has a first connector 211 on its surface 201a. The connection surface of the first connector 211 with the one end 101 of the flexible printed circuit board 100 is in the + Y direction, and is connected to the one end 101 of the flexible printed circuit board 100.

  The first circuit board 201 is, for example, a circuit board (imaging unit board) that constitutes an imaging unit together with the imaging element, and the imaging element is mounted thereon. An output signal from the image sensor is transmitted from the first circuit board 201 to the second circuit board 202 via the flexible printed circuit board 100.

  The second circuit board 202 is parallel to the XY plane and faces the first circuit board 201. The second circuit board 202 has a second connector 221 on its surface 202a. The connection surface of the second connector 221 with the other end 102 of the flexible printed circuit board 100 is in the −X direction, and is connected to the other end 102 of the flexible printed circuit board 100. The second circuit board 202 is, for example, a circuit board (main board) on which a main circuit that controls the imaging unit is mounted.

  The transmission path of the signal from the first circuit board 201 starts from one end 101, changes from the + Y direction to the −Y direction at the first midway portion 103, turns from the −Y direction to the + X direction at the connection portion 105, and changes to the second direction. At the midway portion 104, the direction from the + X direction to the −X direction reaches the other end 102. As a result, a signal from the first circuit board 201 is transmitted to the second circuit board 202.

  When an external force in the Y direction is applied to the flexible printed circuit board 100 by, for example, movement of the first circuit board 201 in the Y direction, the first midway portion 103 absorbs the external force, so that the second midway portion 104 twists in the Y direction. Suppresses deformation reaction force caused by. Similarly, when an external force in the X direction is applied to the flexible printed circuit board 100 by, for example, movement of the first circuit board 201 in the X direction, the second intermediate portion 104 absorbs the external force, so that X in the first intermediate portion 103 is absorbed. Suppresses deformation reaction force due to direction twist.

Thus, the deformation reaction force from the flexible printed circuit board 100 can be suppressed in both the X direction and the Y direction. Therefore, it is not necessary to narrow the width or make a notch in order to suppress the deformation reaction force of the flexible printed circuit board 100, and it is possible to suppress a reduction in signal transmission efficiency.

  When the apparatus 200 on which the flexible substrate is mounted is applied to an image stabilization mechanism (camera shake correction mechanism) of an imaging apparatus such as a digital camera, the image stabilization mechanism uses the first circuit board 201 that is an imaging unit substrate as an actuator. To move in the X and Y directions. Since the flexible printed circuit board 100 suppresses the deformation reaction force described above, it is possible to reduce the load when moving the image sensor, and to suppress a decrease in positioning accuracy during the movement.

(Second Embodiment)
Next, a second embodiment will be described. In the second embodiment, in the apparatus on which the flexible substrate of the first embodiment is mounted, a plurality of flexible printed boards are provided in the empty space between the first circuit board 201 and the second circuit board 202. This is an example in which they are arranged in combination in directions orthogonal to each other.

  As described above, by mounting the flexible printed circuit boards 100 and 300 between the first circuit board 201 and the second circuit board 202, the amount of data transfer can be increased while effectively utilizing the empty space. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  First, another flexible printed circuit board 300 will be described with reference to FIG. In FIG. 1A, one end 301 of the flexible printed circuit board 300 is oriented in the −Y direction, and the other end 302 is oriented in the −X direction. Each of the one end 301 and the other end 302 has a terminal for connecting to a connector described later. A region between the one end 301 and the other end 302 is referred to as a first midway portion 303, a second midway portion 304, and a connection portion 305. The first midway part 303 extends in the Y direction between the connection part 305 and one end 301, and the second midway part 304 extends in the X direction between the connection part 305 and the other end 302. The connection unit 305 connects the first midway part 303 and the second midway part 304.

  In FIG. 1B, one end 301 is bent from the −Y direction to the + Y direction and is folded back so that the surface 300a of the flexible printed circuit board 300 is opposed to the first intermediate portion 303, and the other end 302 is the −X direction. In the second intermediate portion 304, the flexible printed circuit board 300 is folded back so that the back surface 300b faces in the second intermediate portion 304.

  The cross section in the X direction of the first midway portion 303 and the cross section in the Y direction of the second midway portion 304 are both substantially U-shaped. In other words, the first midway portion 303 constitutes a curved convex portion protruding in the −Y direction. The second midway portion 304 forms a curved convex portion that protrudes in the + X direction.

  FIG. 3 is a perspective view showing an apparatus mounted with a flexible substrate according to the second embodiment. In FIG. 3, the configuration of the flexible printed circuit board 100 is the same as the configuration shown in FIG. The first circuit board 201 has two first connectors 211 and 212 on the surface thereof. The connection surface of the first connector 212 with the one end 301 of the flexible printed circuit board 300 is in the −Y direction, and is connected to the one end 301 of the flexible printed circuit board 300. The first circuit board 201 is, for example, a circuit board (imaging unit board) that constitutes an imaging unit together with the imaging element, and the imaging element is mounted thereon. An output signal from the image sensor is transmitted from the first circuit board 201 to the second circuit board 202 via the flexible printed boards 100 and 300.

  The second circuit board 202 has two second connectors 221 and 222 on its surface 202a. The connection surface of the second connector 221 with the other end 302 of the flexible printed board 300 faces the + X direction, and is connected to the other end 302 of the flexible printed board 300. In addition, the flexible printed circuit boards 100 and 300 are mounted so that the connection part 105 of the flexible printed circuit board 100 and the connection part 305 of the flexible printed circuit board 300 do not interfere with each other, that is, the connection parts 105 and 305 are spaced apart in the Z direction. It is desirable. Even if the connecting portion 105 and the connecting portion 305 come into contact with each other, the movement of the flexible printed circuit board 100 and the flexible printed circuit board 300 is not hindered if the frictional force generated thereby is extremely small.

  The signal transmission path from the first circuit board 201 starts from one end 301 of the flexible printed circuit board 300, changes from the -Y direction to the + Y direction at the first midway part 303, and turns from the + Y direction at the connection part 305 to turn to the -X direction. The second halfway portion 304 changes from the −X direction to the + X direction and reaches the other end 302. As a result, a signal from the first circuit board 201 is transmitted to the second circuit board 202.

  When an external force in the Y direction is applied to the flexible printed circuit board 100, 300, for example, by moving the first circuit board 201 in the Y direction, the first intermediate parts 103, 303 absorb the external force, so that the second intermediate part 104, The deformation reaction force due to the twist in the Y direction at 304 is suppressed. Similarly, when an external force in the X direction is applied to the flexible printed circuit boards 100 and 300 by, for example, movement of the first circuit board 201 in the X direction, the second intermediate portions 104 and 304 absorb the external force, so The deformation reaction force due to the twist in the X direction in the portions 103 and 303 is suppressed.

  Thus, the deformation reaction force from the flexible printed circuit boards 100 and 300 can be suppressed in both the X direction and the Y direction. Therefore, it is not necessary to narrow the width or make a notch in order to suppress the deformation reaction force of the flexible printed circuit board 100, and it is possible to suppress a reduction in signal transmission efficiency.

  When the apparatus 200 on which the flexible substrate is mounted is applied to, for example, a vibration isolation mechanism of an imaging apparatus such as a digital camera, the vibration isolation mechanism uses the actuator to drive the first circuit board 201 that is an imaging unit board. And move in the Y direction. Since the flexible printed circuit boards 100 and 300 suppress the deformation reaction force described above, it is possible to reduce the load when moving the imaging element, and it is possible to suppress a decrease in positioning accuracy during the movement.

  Further, since the two flexible printed boards 100 and 300 are mounted between the first circuit board 201 and the second circuit board 202, the amount of data transfer can be increased. Further, an output signal from a certain circuit on the first circuit board 201 is output to a certain circuit on the second circuit board 202 via the flexible printed circuit board 100, and output from another circuit on the first circuit board 201. The signals can be independently transmitted in parallel for each of the flexible printed circuit boards 100 and 300, such as being output to another circuit on the second circuit board 202 via the flexible printed circuit board 300.

  Further, since the flexible printed circuit boards 100 and 300 are mounted in the empty space between the first circuit board 201 and the second circuit board 202, the empty space between the first circuit board 201 and the second circuit board 202 is effective. Utilization (space saving) can be achieved, and the electronic device on which the device 200 on which the flexible substrate is mounted can be made compact.

(Third embodiment)
Next, a third embodiment will be described. In the first and second embodiments, the substantially L-shaped flexible printed circuit boards 100 and 300 have been described. In the third embodiment, a substantially T-shaped flexible printed circuit board will be described. By making the flexible printed circuit board substantially T-shaped, the output signal from the circuit of the first circuit board 201 is branched by the substantially T-shaped flexible printed circuit board while suppressing deformation reaction force from the flexible printed circuit board. It can be transmitted to different circuits on the second circuit board 202. In the third embodiment, the same components as those in the first embodiment and 2 are denoted by the same reference numerals, and the description thereof is omitted.

<Flexible printed circuit board>
FIG. 4 is an explanatory diagram showing a flexible printed circuit board according to the third embodiment. (A) is a plan view of the flexible printed circuit board 400, and (B) is a perspective view of the flexible printed circuit board 400. FIG. In (A), the flexible printed circuit board 400 is substantially T-shaped. One end 101 of the flexible printed circuit board 400 is oriented in the + Y direction, the other end 102A is oriented in the + X direction, and the other end 102B is oriented in the -X direction.

  The one end 101 and the other ends 102A and 102B each have a terminal for connecting to a connector described later. A region between the one end 101 and the other ends 102A and 102B is referred to as a first midway portion 103, second midway portions 104A and 104B, and a connection portion 405. The first midway part 103 extends in the + Y direction between the connection part 105 and the one end 101, and the second midway part 104A extends in the + X direction between the connection part 105 and the other end 102A. The midway portion 104B extends in the −X direction between the connection portion 105 and the other end 102B. The connection unit 405 connects the first midway part 103 and the second midway parts 104A and 104B.

  In (B), one end 101 is bent from the + Y direction to the −Y direction and folded back so that the surface 400a of the flexible printed circuit board 400 is opposed to the first intermediate portion 103, and the other end 102A is bent from the + X direction to the −X direction. Then, the back surface 400b of the flexible printed circuit board 400 is folded back in the second intermediate portion 104A, the other end 102B is curved from the −X direction to the + X direction, and the back surface 400b of the flexible printed circuit board 400 is in the second intermediate portion 104B. A state of being folded back so as to face each other is shown.

  The cross section in the X direction of the first midway portion 103 and the cross section in the Y direction of the second midway portions 104A and 104B are both substantially U-shaped. In other words, the first midway part 103 constitutes a curved convex part protruding in the + Y direction. Further, the second intermediate portion 104A constitutes a curved convex portion protruding in the + X direction. The second midway portion 104B constitutes a curved convex portion that protrudes in the −X direction.

<Configuration example of device mounted with flexible substrate>
FIG. 5 is a perspective view showing a configuration example of an apparatus on which a flexible substrate according to the third embodiment is mounted. The device 200 on which a flexible substrate is mounted includes a first circuit board 201, a second circuit board 202, and a flexible printed board 400. The first circuit board 201 is parallel to the XY plane and is movable in the X direction and the Y direction. The first circuit board 201 has a first connector 211 on its surface 201a. The first connector 211 has a connection surface with the one end 101 of the flexible printed circuit board 400 facing the + Y direction, and is connected to the one end 101 of the flexible printed circuit board 400.

  The first circuit board 201 is, for example, a circuit board (imaging unit board) that constitutes an imaging unit together with the imaging element, and the imaging element is mounted thereon. An output signal from the image sensor is transmitted from the first circuit board 201 to the second circuit board 202 via the flexible printed circuit board 400.

  The second circuit board 202 is parallel to the XY plane and faces the first circuit board 201. The second circuit board 202 has two second connectors 221 and 222 on its surface 202a. The connection surface of the second connector 221 with the other end 102 </ b> A of the flexible printed board 400 is in the −X direction, and is connected to the other end 102 </ b> A of the flexible printed board 400. The connection surface of the second connector 222 with the other end 102B of the flexible printed circuit board 400 is in the + X direction, and is connected to the other end 102B of the flexible printed circuit board 400. The second circuit board 202 is, for example, a circuit board (main board) on which a main circuit that controls the imaging unit is mounted.

  The signal transmission path from the first circuit board 201 starts from one end 101, changes from the + Y direction to the -Y direction at the first midway part 103, and turns from the -Y direction at the connection part 405 to the + X direction and the -X direction. Thus, the second intermediate portion 104A changes from the + X direction to the -X direction and the second intermediate portion 104B changes from the -X direction to the + X direction and reaches the other ends 102A and 102B. As a result, a signal from the first circuit board 201 is transmitted to the second circuit board 202.

  For example, when an external force in the Y direction is applied to the flexible printed circuit board 400 by the movement of the first circuit board 201 in the Y direction, the first intermediate part 103 absorbs the external force, and therefore the Y direction in the second intermediate parts 104A and 104B. Suppresses deformation reaction force due to torsion. Similarly, when an external force in the X direction is applied to the flexible printed circuit board 400 by, for example, movement of the first circuit board 201 in the X direction, the second intermediate portions 104A and 104B absorb the external force, and thus the first intermediate portion 103 is absorbed. The deformation reaction force due to the twist in the X direction is suppressed.

  Thus, the deformation reaction force from the flexible printed circuit board 400 can be suppressed in both the X direction and the Y direction. Therefore, it is not necessary to narrow the width or make a notch in order to suppress the deformation reaction force of the flexible printed circuit board 100, and it is possible to suppress a reduction in signal transmission efficiency.

  When the apparatus 200 on which the flexible substrate is mounted is applied to a vibration isolation mechanism of an imaging device such as a digital camera, the vibration isolation mechanism uses the first circuit board 201, which is an imaging unit substrate, as an X direction and Y axis by an actuator. Move in the direction. Since the flexible printed circuit board suppresses the deformation reaction force described above, it is possible to reduce the load when moving the image sensor, and to suppress a decrease in positioning accuracy during the movement.

  In addition, since the flexible printed circuit board has a substantially T-shape, an output signal from the circuit of the first circuit board 201 is transmitted to the substantially T-shaped flexible printed circuit board 400 while suppressing a deformation reaction force from the flexible printed circuit board 400. Can be branched and transmitted to different circuits on the second circuit board 202. Therefore, the transmission efficiency can be improved.

  For example, an output signal from a certain circuit on the first circuit board 201 is transmitted to a certain circuit on the second circuit board 202 connected to the other end 102A, and the second circuit board connected to the other end 102B. Can be transmitted to another circuit on 202. That is, the same output signal can be transmitted to different circuits on the second circuit board 202.

  Further, a part of the output signal from the circuit on the first circuit board 201 is transmitted to a certain circuit on the second circuit board 202 connected to the other end 102A, and from the circuit on the first circuit board 201. The remaining output signal can be transmitted to another circuit on the second circuit board 202 connected to the other end 102B. That is, the signal path can be separated for each transmission destination.

(Fourth embodiment)
The fourth embodiment is an example in which the first intermediate part 103 is elongated in the longitudinal direction in the flexible printed circuit board 400 of the third embodiment. Since the flexible printed circuit board 400 of the third embodiment is substantially T-shaped, it has two curved portions (second intermediate portions 104A and 104B) in the X direction, and one curved portion (first shape in the Y direction). 1 halfway portion 103). In the fourth embodiment, two curved portions are formed in the Y direction between the one end 401 and the connecting portion 405 by making the first intermediate portion 103 longer.

  In this way, the same number of curved portions can be arranged in the X direction and the Y direction, and the suppression of the deformation reaction force due to the twist in the Y direction and the suppression of the deformation reaction force due to the twist in the X direction can be made uniform. it can. Note that in the fourth embodiment, identical symbols are assigned to configurations that are the same as those in the third embodiment and descriptions thereof are omitted.

  FIG. 6 is an explanatory view showing a flexible printed board according to the fourth embodiment, and FIG. 7 is a perspective view showing an apparatus on which the flexible board according to the fourth embodiment is mounted. In FIG. 7, for convenience of explanation, a part of the first circuit board 201 is cut away to show the first connector 611 on the back surface of the first circuit board 201.

  In the flexible printed circuit board 600 of FIG. 6, the first midway part 603 is longer in the Y direction than the first midway part 103 of the flexible printed circuit board 400 of FIG. 4 compared to the flexible printed circuit board 400 of FIG. In FIG. 6, the first midway portion 603 includes a first region 631, a second region 632, and a third region 633. The first region 631 is connected to the one end 101, the second region 632 is connected between the first region 631 and the third region 633, and the third region 633 is connected to the connection portion 405.

  In FIG. 7, the first circuit board 201 has a first connector 611 on the back surface 201b. The first connector 611 has a connection surface with the one end 101 of the flexible printed circuit board 600 facing the −Y direction, and is connected to the one end 101 of the flexible printed circuit board 600.

  The third region 633 is bent from the + Y direction to the −Y direction so that the back surface 600 b of the flexible printed circuit board 600 is opposed to the first intermediate portion 603. The second region 632 extends in the −Y direction from the third region 633. The first region 631 is bent from the −Y direction to the + Y direction so that the surface 600 a of the flexible printed circuit board 600 is opposed to the first intermediate portion 603. Thereby, the one end 101 is connected to the first connector 611.

  As shown in FIG. 7, the deformation reaction force from the flexible printed circuit board can be suppressed in a balanced manner by using the same number of curved portions in the X direction (104A, 104B) and curved portions in the Y direction (631, 633). Therefore, stabilization of the deformation reaction force can be stabilized.

(Fifth embodiment)
The fifth embodiment is an example in which a heat radiating sheet is provided in the apparatus 200 on which the flexible substrate of the first embodiment is mounted. The first circuit board 201 and the circuit mounted on the first circuit board 201 are heat sources, and the amount of heat generation increases as the board area and the number of circuits increase. The heat-dissipating sheet that dissipates the heat generated from the first circuit board 201 is also a flexible substrate, like the flexible printed circuit board 100. For this reason, similarly to the flexible printed circuit board 100, the heat radiating sheet is also formed with curved portions in the X direction and the Y direction. Thereby, it becomes possible to suppress the deformation reaction force from the heat radiation sheet in both the X direction and the Y direction. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

<Heat dissipation sheet>
FIG. 8 is an explanatory diagram showing a heat dissipation sheet according to the fifth embodiment. (A) is a plan view of the heat dissipation sheet 800, and (B) is a perspective view of the heat dissipation sheet 800. In (A), the heat dissipation sheet 800 is substantially L-shaped. The heat dissipation sheet 800 is a flexible sheet having thermal conductivity such as a graphite sheet.

  One end 801 of the heat dissipation sheet 800 is directed in the + X direction, and the other end 802 is directed in the −Y direction. Each of the one end 801 and the other end 802 has a terminal for connecting to a connector described later. A region between the one end 801 and the other end 802 is referred to as a first midway portion 803, a second midway portion 804, and a connection portion 805. The first midway part 803 extends from the connection part 805 in the + X direction, and the second midway part 804 extends from the connection part 805 in the −Y direction. The connection unit 805 connects the first midway part 803 and the second midway part 804.

  (B) shows that one end 801 is bent from the + X direction to the −X direction so that the surface 800a of the heat dissipation sheet 800 is opposed to the first intermediate portion 803, and the other end 802 is from the −Y direction to the + Y direction. A state is shown in which the back surface 800b of the heat dissipation sheet 800 is bent so as to face each other at the second midway portion 804. The cross section in the X direction of the first midway part 803 and the cross section in the Y direction of the second midway part 804 are both substantially U-shaped. In other words, the first intermediate portion 803 constitutes a curved convex portion protruding in the −X direction. The second midway portion 804 forms a curved convex portion that protrudes in the −Y direction.

<Configuration example of device mounted with flexible substrate>
FIG. 9 is a perspective view illustrating a configuration example of an apparatus on which a flexible substrate according to the fifth embodiment is mounted. A device 900 on which a flexible board is mounted includes a first circuit board 201, a second circuit board 202, a metallic board 910, a flexible printed board, and a heat dissipation sheet 800. The metallic substrate 910 is parallel to the XY plane and faces the second circuit substrate 202.

  The second circuit board 202 and the metallic substrate 910 may be in contact with each other or may be spaced apart from each other. The surface 801a side of the one end 801 of the heat dissipation sheet 800 is connected, for example, attached to the surface 201a of the first circuit board 201 serving as a heat source. Similarly, the surface 801a side of the other end 802 of the heat dissipation sheet 800 is connected to, for example, attached to the surface 901a of the metallic substrate 910.

  The flexible printed circuit board 100 and the heat radiation sheet 800 are mounted so that the connection part 105 of the flexible printed circuit board 100 and the connection part 805 of the heat radiation sheet 800 do not interfere with each other, that is, the connection parts 105 and 805 are spaced apart in the Z direction. It is desirable that

  The heat transfer path from the first circuit board 201 starts at one end 801, changes from the + X direction to the −X direction at the first intermediate portion 803, turns from the −X direction to the −Y direction at the connection portion 805, 2 From the -Y direction to the + Y direction at the midway part 804, the other end 802 is reached. As a result, heat from the first circuit board 201 is transmitted to the metallic substrate 910 and is radiated from the metallic substrate 910.

  When an external force in the X direction is applied to the heat dissipation sheet 800 by, for example, movement of the first circuit board 201 in the X direction, the first intermediate portion 803 absorbs the external force, and thus the second intermediate portion 804 is twisted in the X direction. Suppresses deformation reaction force. Similarly, when an external force in the Y direction is applied to the heat dissipation sheet 800 by, for example, movement of the first circuit board 201 in the Y direction, the second intermediate portion 804 absorbs the external force, so that the Y direction in the first intermediate portion 803 Suppresses deformation reaction force due to torsion.

  Thus, the deformation reaction force from the heat dissipation sheet 800 can be suppressed in both the X direction and the Y direction. That is, it is not necessary to narrow the sheet width or make a notch in order to suppress the deformation reaction force of the heat dissipation sheet, and it is possible to suppress a reduction in heat dissipation efficiency.

  When the apparatus 900 on which the flexible substrate is mounted is applied to a vibration isolation mechanism of an imaging apparatus such as a digital camera, the vibration isolation mechanism uses the first circuit board 201, which is an imaging unit substrate, as an X direction and Y axis by an actuator. Move in the direction. Since the heat radiation sheet 800 suppresses the deformation reaction force described above, it is possible to reduce the load when moving the imaging element, and it is possible to suppress a decrease in positioning accuracy during the movement.

  Further, since the flexible printed circuit board 100 and the heat dissipation sheet 800 are mounted in an empty space between the first circuit board 201 and the second circuit board 202, an empty space between the first circuit board 201 and the second circuit board 202 is provided. Can be effectively utilized (space-saving), and the electronic device mounting the apparatus 200 mounted with the flexible substrate can be made compact.

(Sixth embodiment)
The sixth embodiment is an example of an anti-vibration mechanism to which the apparatus 200 on which the flexible substrate according to the first embodiment is mounted is applied. The anti-vibration mechanism is mounted on an electronic device such as an imaging device. In the anti-vibration mechanism according to the sixth embodiment, an example in which the apparatus 200 on which the flexible substrate according to the first embodiment is mounted will be described. The second to fifth embodiments will be described. The devices 200 and 900 on which the flexible substrate is mounted may be applied. In addition, the same code | symbol is attached | subjected to the same structure as 1st Embodiment-5, and the description is abbreviate | omitted.

  FIG. 10 is a side sectional view of the vibration isolation mechanism. The vibration isolation mechanism 1000 includes a device 200 on which a flexible substrate is mounted. Further, the vibration isolation mechanism 1000 is provided in, for example, the imaging apparatus 1020, and includes an imaging element 1001, a bracket 1002, a coil 1003, a magnetic sensor 1004, a front yoke plate 1005, a first magnet 1006, and a back yoke plate 1007. A second magnet 1008, a ball 1009, and a back plate 1010.

  The image sensor 1001 is mounted on the first circuit board 201, images subject light from the −Z direction, and outputs an electrical signal to the first circuit board 201. The first circuit board 201 processes the electrical signal from the image sensor 1001 and outputs the processed signal to the flexible printed board 100.

  The bracket 1002 is a holding plate that holds the first circuit board 201 so as to be movable in the X direction and the Y direction. The bracket 1002 is urged against a back yoke plate 1007 by a spring (not shown), and the height in the Z direction is secured by the ball 1009.

  A coil 1003, a front yoke plate 1005, a magnetic sensor 1004, a first magnet 1006, a back yoke plate 1007, a second magnet 1008, and a ball 1009 are actuators that control the bracket 1002 to be finely driven in the X direction and the Y direction. is there. The magnetic sensor 1004 detects the position of the bracket 1002 on the XY plane. The back plate 1010 is a plate that seals the imaging device 1020 from the back. When applied to the fifth embodiment, the back plate 1010 may be the metallic substrate 910 of FIG.

  As described above, by mounting the apparatus 200 on which the flexible substrate according to the first to fourth embodiments is mounted on the image stabilization mechanism 1000 of the imaging apparatus 1020, the stability of the camera shake correction and the positioning accuracy are achieved. Can be improved. In addition, by mounting the apparatus 900 on which the flexible substrate of the fifth embodiment is mounted on the vibration isolation mechanism 1000 of the imaging apparatus 1020, it is possible to improve the stability of camera shake correction and the positioning accuracy, It is possible to improve heat dissipation efficiency.

  Moreover, in order to suppress the deformation reaction force, it is not necessary to shorten the stroke of the vibration isolation mechanism 1000, and the reduction of the vibration isolation effect can be suppressed. In addition, it is not necessary to increase the driving force of the vibration isolation mechanism 1000 more than necessary, and an increase in size, weight, and power consumption of the vibration isolation mechanism 1000 can be suppressed. Further, even when the vibration isolation mechanism 1000 rotates around the Z axis, the curved convex portion whose protruding direction is orthogonal to the X direction and the Y direction disperses and absorbs the twist, thereby suppressing the deformation reaction force. Can do.

  In the first embodiment to the fourth embodiment, the example in which the flexible printed circuit boards 100, 300, 400, and 600 are used as flexible substrates has been described. However, the flexible printed circuit boards 100, 300, 400, and 600 are described. A heat radiation sheet having the same shape as 600 may be applied. In this case, it is assumed that the other end of the heat dissipation sheet is connected not to the second circuit board 202 but to a metallic substrate.

  As described above, according to the flexible substrate of the present embodiment, the protruding direction has curved convex portions that are orthogonal to the X direction and the Y direction. Accordingly, the torsion of the flexible substrate caused by the external force in the X direction can be absorbed by the convex portion protruding in the X direction so that the deformation reaction force can be suppressed and the external force in the Y direction can be suppressed. Since the generated twist of the flexible substrate can be absorbed by the convex portion projecting in the Y direction, the deformation reaction force can be suppressed. Therefore, it is not necessary to narrow the width or make a notch in order to suppress the deformation reaction force of the flexible substrate, and it is possible to suppress a reduction in the transmission efficiency of the output from the first circuit substrate 201.

  In addition, this invention is not limited to said content, What combined these arbitrarily may be used. In addition, other modes conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention.

100, 300, 400, 600 Flexible printed circuit board, 101, 301 One end, 102, 102A, 102B, 302 The other end, 103, 303, First halfway part, 104, 304, 104A, 104B Second halfway part, 105, 305 , 805 connection unit, 200, 900 device mounted with flexible substrate, 201 first circuit substrate, 202 second circuit substrate, 800 heat dissipation sheet, 910 metallic substrate, 1000 vibration isolation mechanism, 1001 imaging element

Claims (13)

A flexible substrate,
A first connecting part disposed at one end of the flexible substrate and connected to the first substrate;
A second connection portion disposed on the other end of the flexible substrate and connected to a second substrate movable in a first direction and a second direction intersecting the first direction with respect to the first substrate;
A first portion disposed between the first connection portion and the second connection portion and bent in the direction opposite to the first direction from the first direction;
A flexible substrate having a second portion that is disposed between the first connection portion and the second connection portion and bends in a direction opposite to the second direction from the second direction. The flexible substrate according to claim 1,
The first substrate and the second substrate are opposed to each other,
The first direction and the second direction are directions substantially parallel to the second substrate. The flexible substrate according to claim 1 or 2,
A flexible substrate having a third portion that connects the first portion and the second portion while the first substrate and the second substrate face each other. The flexible substrate according to claim 3,
The third portion is a flexible substrate having a substantially L shape. The flexible substrate according to claim 3,
A flexible substrate further comprising: a third connection portion connected to the other end of the first substrate along the first direction; and a fourth portion bent from the third connection portion in the first direction. The flexible substrate according to claim 5,
The fourth portion is a flexible substrate connected to the first portion and the second portion in the third portion. The flexible substrate according to claim 6,
The third portion is a flexible substrate having a substantially T shape. A flexible substrate according to any one of claims 1 to 7,
The flexible substrate is a flexible substrate having electrical wiring for transmitting a signal from the first substrate to the second substrate. A flexible substrate according to any one of claims 1 to 8,
The flexible substrate is a flexible substrate that is a heat conductive substrate that transfers heat from the first substrate to the second substrate. A first substrate comprising an image sensor;
A second substrate disposed opposite the first substrate;
A flexible substrate having one end connected to the first substrate and the other end connected to the second substrate;
The flexible substrate includes a first portion extending in a first direction within the plane of the first substrate between the first substrate and the second substrate, and the first portion within the plane of the first substrate. An imaging device including a second portion extending in a second direction intersecting with one direction. The imaging apparatus according to claim 10,
The first portion of the flexible substrate has a first bent portion bent in a first direction in the plane of the first substrate between the first substrate and the second substrate;
The imaging device, wherein the second portion of the flexible substrate has a second bent portion that is bent in a second direction intersecting the first direction in a plane of the first substrate. The imaging device according to claim 11,
A plurality of the flexible substrates;
An imaging apparatus in which the plurality of flexible substrates are combined and arranged in directions orthogonal to each other. The imaging apparatus according to claim 12, wherein
One of the plurality of flexible substrates has electrical wiring for transmitting a signal from the first substrate to the second substrate;
In addition to the plurality of flexible substrates, a heat conductive substrate that transfers heat from the first substrate to the second substrate.
Imaging device.

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