JP2019139243A - Optical detector - Google Patents

Abstract

To provide an optical detector that can be downsized.SOLUTION: A spectral sensor 1 comprises a wiring board 2, a thermistor 7, a photodetector 3, two spacers 4A, 4B, and a Fabry-Perot interference filter 10. The spacers 4A, 4B support the Fabry-Perot interference filter 10 in a peripheral area R1 of a light transmission area 11. The spacers 4A, 4B are arranged to hold a peripheral area R1 therebetween when viewed from a transmission direction of light in the light transmission area 11, and form two openings A1, A1 communicating with the inside and the outside of the peripheral area R1. The photodetector 3 and the thermistor 7 are arranged in an area held between the two spacers 4A, 4B on a principal surface of the wiring board 2. The photodetector 3 is connected to a wire 8 passing through one opening A1. The thermistor 7 is connected to a wire 8 passing through the other opening A1.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a light detection device including a Fabry-Perot interference filter.

  As a conventional photodetection device, for example, Patent Document 1 discloses a device in which a light receiving element is disposed on a support substrate and a Fabry-Perot interference filter is bonded to the light receiving element via an adhesive layer. In such a light detection element, a bonding pad for electrical connection of the light receiving element is disposed on the upper surface of the light receiving element. The Fabry-Perot interference filter is disposed away from the bonding pad on the upper surface of the light receiving element when viewed from the light transmission direction of the Fabry-Perot interference filter.

JP 2012-173347 A

  However, in the light detection element as described above, it is necessary to dispose the bonding pad outside the Fabry-Perot interference filter as viewed from the direction of light transmission in the Fabry-Perot interference filter. There is a fear.

  Therefore, an object of the present invention is to provide a photodetection device that can be miniaturized.

  A photodetector according to an embodiment of the present invention includes a wiring board having a main surface, a thermistor disposed on the main surface of the wiring board, and disposed on the main surface of the wiring board and electrically connected to the wiring board. A photodetector, a support member disposed around the photodetector and the thermistor on the main surface of the wiring board, a light transmission region, and disposed on the main surface of the wiring board via the support member. And the support member supports the Fabry-Perot interference filter in a peripheral region of the light transmission region, and the support member has a surrounding when viewed from the light transmission direction in the light transmission region. A first opening and a second opening that communicate with the inside of the surrounding area and the outside of the surrounding area are formed, and the Fabry-Perot interference filter is fixed to the board and the board. A first mirror; A first mirror and a second mirror that is movable with respect to the first mirror, and the photodetector and the thermistor are sandwiched between a plurality of support members on the main surface of the wiring board A wire passing through the first opening is connected to the photodetector, and a wire passing through the second opening is connected to the thermistor.

  In the above-described photodetecting device, the support member may have a rod shape, and the number of support members may be two.

  In the above photodetector, the Fabry-Perot interference filter may have a bonding pad, and the support member may be disposed at a position corresponding to the bonding pad of the Fabry-Perot interference filter when viewed from the transmission direction.

  In the above-described light detection device, the support member may be separated from the light transmission region of the Fabry-Perot interference filter when viewed from the transmission direction.

  ADVANTAGE OF THE INVENTION According to this invention, the photodetector which can be reduced in size can be provided.

It is a disassembled perspective view of the photon detection apparatus which concerns on embodiment. It is sectional drawing of a Fabry-Perot interference filter. It is a top view which shows the manufacturing process of a photon detection apparatus. FIG. 4 is a plan view illustrating a manufacturing process of the photodetection device following FIG. 3. FIG. 5 is a plan view illustrating a manufacturing process of the photodetection device following FIG. 4. FIG. 6 is a side view corresponding to FIG. It is the figure which expands and shows the VII-VII sectional view taken on the line in FIG.5 (B), and its part. It is a top view which shows the manufacturing process of the photon detection apparatus following FIG. It is a top view which shows the modification of a photon detection apparatus. It is a top view which shows the modification of a photon detection apparatus.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or equivalent part, and the overlapping part is abbreviate | omitted.

[First Embodiment]
[Spectral sensor]
As shown in FIG. 1, the spectroscopic sensor (light detection device) 1 includes a wiring board 2, a light detector 3, a plurality of spacers (support members) 4, and a Fabry-Perot interference filter 10. . The wiring board 2 has a main surface 2A. On the main surface 2A of the wiring board 2, there is a mounting portion 2a on which the photodetector 3 is mounted, a plurality of electrode pads (bonding pads) 2b, and a mounting portion 2c on which a temperature compensation element such as a thermistor is mounted. Is provided. One of the electrode pads 2b is electrically connected to the mounting portion 2a by a wiring 2d. Other electrode pads 2b are electrically connected to the mounting portion 2c by the wiring 2d, and are used to electrically connect the thermistor and the like mounted on the mounting portion 2c to the outside of the spectroscopic sensor 1. The photodetector 3 is, for example, an infrared detector, and is a quantum type sensor using InGaAs or the like, or a thermal type sensor using a thermopile or a bolometer. Note that a silicon photodiode or the like can be used as the photodetector 3 when detecting each region of ultraviolet (UV), visible, and near infrared.

  The plurality of spacers 4 are fixed on the main surface 2 </ b> A of the wiring board 2, and the Fabry-Perot interference filter 10 is fixed on the plurality of spacers 4. In this way, the plurality of spacers 4 support the Fabry-Perot interference filter 10, and the Fabry-Perot interference filter 10 is disposed on the main surface 2 </ b> A of the wiring board 2. At this time, in order to suppress the influence of thermal distortion on the Fabry-Perot interference filter 10, the plurality of spacers 4 and the Fabry-Perot interference filter 10 are preferably fixed by an adhesive portion made of a flexible resin material. . As the resin material constituting the bonding portion, for example, various resin materials such as silicone, urethane, epoxy, acrylic, and hybrid can be used. Preferably, as the resin material, a material having an elastic modulus (or Young's modulus) of 0.1 GPa or less is used. Further, the resin material is preferably selected from those cured at room temperature or cured at low temperature.

  Moreover, as a material of the plurality of spacers 4, for example, silicon, ceramic, quartz, glass, plastic, or the like can be used. In particular, in order to alleviate the difference in thermal expansion coefficient between the Fabry-Perot interference filter 10 and the portion in contact with the plurality of spacers 4 in particular, the material of the plurality of spacers 4 is less than that of the material of the Fabry-Perot interference filter 10. It is preferable that the materials have the same or a small expansion coefficient. As an example, when the Fabry-Perot interference filter 10 is formed on a silicon substrate, the plurality of spacers 4 are preferably formed of a material having a low thermal expansion coefficient such as quartz or silicon. Instead of the configuration in which the wiring substrate 2 and the spacer 4 are formed separately as described above, a configuration in which a portion to be the spacer 4 is integrally formed on the surface of the wiring substrate 2 may be employed. The photodetector 3 is opposed to the light transmission region 11 of the Fabry-Perot interference filter 10 between the wiring board 2 and the Fabry-Perot interference filter 10, and detects light transmitted through the Fabry-Perot interference filter 10. A temperature sensor such as a thermistor may be installed on the wiring board 2.

  As will be described later, the wiring board 2, the photodetector 3, the plurality of spacers 4, and the Fabry-Perot interference filter 10 are configured such that the wiring board 2 is fixed on the stem and the light transmission region 11 of the Fabry-Perot interference filter 10 is the cap light. It is accommodated in the CAN package in a state facing the transmission window. The electrode pad 2b of the wiring board 2 and the terminals 12 and 13 of the Fabry-Perot interference filter 10 are electrically connected to each of the lead pins that penetrate the stem by wire bonding. Input / output of an electrical signal to / from the photodetector 3 is performed via the lead pin, the electrode pad 2b, and the mounting portion 2a. A voltage is applied to the Fabry-Perot interference filter 10 through lead pins and terminals 12 and 13.

  Hereinafter, the arrangement of the spacers 4 will be described. When viewed from the light transmission direction of the light transmission region 11 of the Fabry-Perot interference filter 10, the spacer 4 is a region surrounding the light transmission region 11 (a region not including the light transmission region 11, the light transmission region 11 being It is arranged so as to have an opening that communicates the inside of the surrounding area) and the outside of the surrounding area. Here, in this specification, an element (for example, the spacer 4) has an opening means that the element (for example, the light transmission region 11) does not have an annular shape surrounding the region (for example, the light transmission region 11) without a gap, and is broken at least at one place. It means that it has. The length relationship between the element and the opening is not particularly limited. For example, if the spacer 4 is provided on a part of the circumference of a figure such as a circle or a polygon surrounding the light transmission region 11 and the spacer 4 is not provided on the whole, the spacer 4 has an opening. Suppose you are. In order to stably install the Fabry-Perot interference filter 10, the spacers 4 are preferably disposed at least on both sides of the light transmission region 11 when viewed from the light transmission direction. As a specific example of the spacer 4 having an opening, when two linearly extending spacers 4 are arranged in parallel to each other (see FIG. 4A), a columnar spacer 4 is provided at each of four vertices of a square. This includes the case where the spacer 4 is arranged (see FIG. 9), the case where the spacer 4 is arranged in a U-shape (see FIG. 10A), and the like.

  In the spectroscopic sensor 1 of the present embodiment, two linear spacers 4A and 4B arranged in parallel to each other are used as the spacer 4. These spacers 4A and 4B have an opening A1 indicated by a two-dot chain line between end portions on the same side of each of the spacers 4A and 4B. In other words, a square surrounding the light transmission region 11 is formed by the spacers 4A and 4B and the two openings A1 and A1. Spacers 4A and 4B are provided on two sides of the quadrangle, and spacers 4A and 4B are not provided on the other two sides, and openings A1 and A1 are formed.

  In the spectroscopic sensor 1, the electrode pad 2 b connected to the mounting portion 2 a is disposed in the peripheral region R 1 of the light transmission region 11 on the main surface 2 A of the wiring board 2. The electrode pad 2b may be entirely disposed in the surrounding region R1, or only a part of the electrode pad 2b may be disposed in the surrounding region R1.

  In the spectroscopic sensor 1 configured as described above, when measurement light is incident, light having a predetermined wavelength passes through the Fabry-Perot interference filter 10 in accordance with the voltage applied to the Fabry-Perot interference filter 10. The light transmitted through the Fabry-Perot interference filter 10 is detected by the photodetector 3. In the spectroscopic sensor 1, a spectral spectrum can be obtained by detecting the light transmitted through the Fabry-Perot interference filter 10 with the photodetector 3 while changing the voltage applied to the Fabry-Perot interference filter 10.

[Fabry-Perot interference filter]
As shown in FIG. 2, the Fabry-Perot interference filter 10 includes a substrate 14. On the light incident side surface 14 a of the substrate 14, the antireflection layer 15, the first stacked body 30, the sacrificial layer 16, and the second stacked body 40 are stacked in this order. A gap (air gap) S is formed by the frame-shaped sacrificial layer 16 between the first stacked body 30 and the second stacked body 40. In the Fabry-Perot interference filter 10, measurement light is incident on the second stacked body 40 from the opposite side of the substrate 14, and light having a predetermined wavelength is transmitted through a light that is defined at the center of the Fabry-Perot interference filter 10. The region 11 is transmitted. The substrate 14 is made of, for example, silicon, quartz, glass or the like. When the substrate 14 is made of silicon, the antireflection layer 15 and the sacrificial layer 16 are made of, for example, silicon oxide. The thickness of the sacrificial layer 16 is 200 nm to 10 μm. The thickness of the sacrificial layer 16 is preferably an integral multiple of 1/2 of the central transmission wavelength (that is, the wavelength that is the center of the variable range of wavelengths transmitted by the Fabry-Perot interference filter 10).

  A portion corresponding to the light transmission region 11 in the first stacked body 30 functions as the first mirror 31. The first stacked body 30 is configured by alternately stacking a plurality of polysilicon layers and a plurality of silicon nitride layers one by one. The optical thickness of each of the polysilicon layer and the silicon nitride layer constituting the first mirror 31 is preferably an integral multiple of 1/4 of the center transmission wavelength (center wavelength in the variable wavelength range).

  A portion of the second stacked body 40 corresponding to the light transmission region 11 functions as a second mirror 41 that faces the first mirror 31 with the gap S therebetween. Similar to the first stacked body 30, the second stacked body 40 is configured by alternately stacking a plurality of polysilicon layers and a plurality of silicon nitride layers one by one. The optical thickness of each of the polysilicon layer and the silicon nitride layer constituting the second mirror 41 is preferably an integral multiple of 1/4 of the center transmission wavelength (center wavelength in the variable wavelength range).

  A plurality of through holes 40b extending from the surface 40a of the second stacked body 40 to the space S are uniformly distributed in a portion corresponding to the space S in the second stacked body 40. The through hole 40b is formed to such an extent that the function of the second mirror 41 is not substantially affected. The diameter of the through hole 40 b is 100 nm to 5 μm, and the opening area of the through hole 40 b occupies 0.01 to 10% of the area of the second mirror 41.

  In the Fabry-Perot interference filter 10, the first mirror 31 and the second mirror 41 are supported by the substrate 14. The first mirror 31 is disposed on the light incident side of the substrate 14, and the second mirror 41 is disposed on the light incident side of the first mirror 31 via the gap S.

  A first electrode 17 is formed on the first mirror 31 so as to surround the light transmission region 11. The first electrode 17 is formed by doping a polysilicon layer with an impurity to reduce the resistance.

  A second electrode 18 is formed on the first mirror 31 so as to include the light transmission region 11. The second electrode 18 is formed by doping the polysilicon layer with impurities to reduce the resistance. In the polysilicon layer, the size of the second electrode 18 is preferably a size including the entire light transmission region 11, and may be substantially the same as the size of the light transmission region 11.

  A third electrode 19 is formed on the second mirror 41 so as to face the first electrode 17 and the second electrode 18. The third electrode 19 is formed by doping the polysilicon layer with impurities to reduce the resistance.

  In the Fabry-Perot interference filter 10, the second electrode 18 is located on the opposite side of the third electrode 19 with respect to the first electrode 17 in the facing direction D in which the first mirror 31 and the second mirror 41 face each other. Yes. That is, the first electrode 17 and the second electrode 18 are not arranged on the same plane in the first mirror 31, and the second electrode 18 is farther from the third electrode 19 than the first electrode 17.

  As shown in FIGS. 1 and 2, a pair of terminals 12 for applying a voltage to the Fabry-Perot interference filter 10 are provided so as to face each other with the light transmission region 11 interposed therebetween. Each terminal 12 is disposed in a through hole extending from the surface 40 a of the second stacked body 40 to the first stacked body 30, and is electrically connected to the first electrode 17 via the wiring 21.

  As shown in FIGS. 1 and 2, a pair of terminals 13 for applying a voltage to the Fabry-Perot interference filter 10 are provided so as to face each other with the light transmission region 11 in between. The direction in which the pair of terminals 12 face each other and the direction in which the pair of terminals 13 face each other are orthogonal. Each terminal 13 is electrically connected to the third electrode 19 via the wiring 22. The third electrode 19 is also electrically connected to the second electrode 18 through the wiring 23.

  As shown in FIG. 2, on the surface 30 a of the first stacked body 30, the trench 26 extending in an annular shape so as to surround the wiring 23 extending from the terminal 13 along the facing direction D, and the inner edge of the first electrode 17. A trench 27 extending in a ring shape is provided. The trench 26 electrically insulates the first electrode 17 and the wiring 23. The trench 27 electrically insulates the first electrode 17 and a region inside the first electrode 17. The region in each of the trenches 26 and 27 may be an insulating material or a gap.

  A trench 28 extending in an annular shape so as to surround the terminal 12 is provided on the surface 40 a of the second stacked body 40. The bottom surface of the trench 28 reaches the sacrificial layer 16. The trench 28 electrically insulates the terminal 12 and the third electrode 19. The region in the trench 28 may be an insulating material or a gap.

  An antireflection layer 51, a third stacked body 52, an intermediate layer 53, and a fourth stacked body 54 are stacked in this order on the surface 14 b on the light emitting side of the substrate 14. The antireflection layer 51 and the intermediate layer 53 have the same configuration as the antireflection layer 15 and the sacrificial layer 16, respectively. The third stacked body 52 and the fourth stacked body 54 have a stacked structure that is symmetrical to the first stacked body 30 and the second stacked body 40, respectively, with respect to the substrate 14. The antireflection layer 51, the third stacked body 52, the intermediate layer 53, and the fourth stacked body 54 constitute a stress adjusting layer 50. The substrate 14 and the stress adjustment layer 50 constitute a support. The substrate 14 alone may be used as a support. The stress adjustment layer 50 is disposed on the light emission side of the substrate 14 and has a function of suppressing warpage of the substrate 14. An opening 50 a is provided in the stress adjustment layer 50 so as to include the light transmission region 11. A light shielding layer 29 is formed on the light emitting surface 50 b of the stress adjustment layer 50. The light shielding layer 29 is made of aluminum or the like and has a function of shielding measurement light.

  In the Fabry-Perot interference filter 10 configured as described above, when a voltage is applied between the first electrode 17 and the third electrode 19 via the terminals 12 and 13, an electrostatic force corresponding to the voltage is generated. Occurs between the first electrode 17 and the third electrode 19. Accordingly, the second mirror 41 is driven so as to be attracted to the first mirror 31 fixed to the substrate 14, and the distance between the first mirror 31 and the second mirror 41 is adjusted. Since the wavelength of the light transmitted through the Fabry-Perot interference filter 10 depends on the distance between the first mirror 31 and the second mirror 41 in the light transmission region 11, it is applied between the first electrode 17 and the third electrode 19. By adjusting the voltage, the wavelength of transmitted light can be appropriately selected. At this time, since the second electrode 18 has the same potential as the electrically connected third electrode 19, the second electrode 18 functions as a compensation electrode for keeping the first mirror 31 and the second mirror 41 flat in the light transmission region 11. To do.

[Manufacturing process of spectroscopic sensor]
Next, with reference to FIGS. 3-8, the manufacturing process of the spectroscopic sensor which concerns on this embodiment is demonstrated. 3-5 and FIG. 8 are plan views for illustrating the manufacturing process, FIG. 6 is a side view corresponding to FIG. 5 (B), and FIG. 7 is a line VII-VII in FIG. 5 (B). It is sectional drawing and its one part enlarged view. As shown in FIG. 3A, first, the stem 6 is prepared. The stem 6 is, for example, a TO-CAN stem. The stem 6 has a configuration in which a conductive lead pin 6b passes through a disk-shaped base 6a.

  Next, as shown in FIG. 3B, the wiring board 2 is disposed on the base 6a of the stem 6, and the base 6a and the wiring board 2 are bonded with resin. On the wiring board 2, a mounting portion 2a for fixing the photodetector 3, a plurality of electrode pads 2b (bonding pads), and a mounting portion 2c for disposing the thermistor 7 are disposed. . The mounting portions 2a and 2c are electrically connected to separate electrode pads 2b and wirings 2d, respectively.

  Next, as shown in FIG. 4A, the photodetector 3 and the thermistor 7 are disposed on the mounting portions 2a and 2c of the wiring board 2, respectively. In addition, spacers 4A and 4B, which are two rod-shaped members, are arranged on the wiring board 2 so as to extend in parallel with each other. The spacer 4 is provided so as to have two openings A1 and A1 when viewed from the light transmission direction (direction perpendicular to the paper surface) in the light transmission region 11 of the Fabry-Perot interference filter 10. The openings A1 and A1 communicate the inner side of the surrounding region R1 of the light transmission region 11 and the outer side of the surrounding region R1. The electrode pad 2b electrically connected to the mounting portion 2a on which the photodetector 3 is mounted is disposed in the peripheral region R1 of the light transmission region 11 on the main surface 2A of the wiring board 2.

  The two spacers 4 </ b> A and 4 </ b> B are arranged in a peripheral region of the light transmission region 11 when viewed from the light transmission direction in the light transmission region 11 of the Fabry-Perot interference filter 10. That is, the spacers 4 </ b> A and 4 </ b> B are arranged apart from the light transmission region 11 when viewed from the light transmission direction in the light transmission region 11. The thermistor 7 may be omitted.

  Next, as shown in FIG. 4B, the photodetector 3, the thermistor 7, the electrode pad 2 b and the lead pin 6 b of the stem 6 are electrically connected using wire 8 by wire bonding. The material of the wire 8 is, for example, gold (Au).

  Here, the electrode pad 2 b electrically connected to the photodetector 3 is disposed in the peripheral region R 1 of the light transmission region 11 on the main surface 2 A of the wiring substrate 2. The wire 8 connected to the electrode pad 2b electrically connected to the photodetector 3 is connected to the lead pin 6b of the stem 6 via the opening A1 formed between the spacers 4A and 4B. ing.

  Next, as shown in FIG. 5A, a die bond resin 5 (adhesive portion) is applied to the spacer 4. Here, when viewed from the light transmission direction in the light transmission region 11, the die bond resin 5 has an opening that communicates the inside of the peripheral region of the light transmission region 11 and the outside of the peripheral region. Provided. Here, the fact that the die bond resin 5 has an opening means that the die bond resin 5 is not in a continuous annular shape, and includes the same shape as exemplified for the spacer 4 previously. Specifically, the die bond resin 5 is applied so as to be disposed only on both sides of the Fabry-Perot interference filter 10 when viewed from the light transmission direction in the light transmission region 11 of the Fabry-Perot interference filter 10. . In the example shown in FIG. 5A, the die bond resin 5 is applied over substantially the entire length of the upper surfaces of the spacers 4A and 4B.

  Next, as shown in FIG. 5B, the Fabry-Perot interference filter 10 is disposed on the spacer 4. As a result, the Fabry-Perot interference filter 10 is fixed on the spacer 4 via the die bond resin 5 (the Fabry-Perot interference filter 10 is disposed apart from the photodetector 3). At this time, the Fabry-Perot interference filter 10 is disposed such that the spacer 4 is disposed at a position corresponding to the terminals 12 and 13 as bonding pads of the Fabry-Perot interference filter 10. Further, the terminals 12 and 13 of the Fabry-Perot interference filter 10 and the lead pin 6 b of the stem 6 are electrically connected by the wire 8. The material of the wire 8 is, for example, gold (Au).

  A side view corresponding to FIG. 5B is shown in FIG. The Fabry-Perot interference filter 10 and the spacers 4A and 4B are bonded by a die bond resin 5.

  Further, a sectional view taken along line VII-VII in FIG. 5 is shown in FIG. An enlarged view corresponding to a portion surrounded by an ellipse EB in FIG. 7A is shown in FIG.

  The spacers 4 </ b> A and 4 </ b> B are separated from the light transmission region 11 of the Fabry-Perot interference filter 10. Further, spacers 4A and 4B are located at positions corresponding to the terminals 12 and 13 of the Fabry-Perot interference filter 10, specifically, directly below the terminals 12 and 13, respectively. The Fabry-Perot interference filter 10 is bonded to the upper surfaces of the spacers 4A and 4B so that the upper surfaces of the spacers 4A and 4B are in contact with the light shielding layer 29 of the Fabry-Perot interference filter 10. Further, as shown in FIG. 7B, the outer surface 4 </ b> Aa of the spacer 4 </ b> A is slightly outside the outer surface 10 a of the Fabry-Perot interference filter 10.

  The process following FIG. 5B is shown in FIG. As shown in FIG. 8, a cap 9 made of metal is attached on the base 6a of the stem 6 to seal the Fabry-Perot interference filter 10, the photodetector 3, and the like. The cap 9 has a substantially cylindrical shape and includes a circular transmission window 9a on the upper surface thereof. The transmission window 9a may be a transmission window using a material such as glass, silicon, germanium, or the like corresponding to the applicable wavelength range of the spectroscopic sensor 1. Further, the transmission window 9a may be a window with an antireflection film or a band-pass filter that limits the applicable wavelength range. The spectroscopic sensor 1 is obtained by the manufacturing process described above with reference to FIGS.

  In the spectroscopic sensor 1 of this embodiment, openings A1 and A1 that connect the inside of the surrounding region R1 of the light transmission region 11 and the outside of the surrounding region R1 are provided in the spacers 4A and 4B. For this reason, even when the electrode pad 2b electrically connected to the photodetector 3 is disposed inside the region surrounded by the spacers 4A and 4B in the peripheral region of the light transmission region 11, this electrode pad By providing the wire 8 for electrically connecting 2b and another element so as to pass through the opening A1 of the spacers 4A and 4B, the electrical connection to the photodetector 3 can be ensured. . Therefore, when viewed from the light transmission direction in the Fabry-Perot interference filter 10, it is not necessary to dispose the electrode pad 2 b electrically connected to the photodetector 3 outside the Fabry-Perot interference filter 10. Therefore, the size of the spectroscopic sensor 1 can be made substantially equal to the size of the Fabry-Perot interference filter 10, and the spectroscopic sensor 1 can be miniaturized.

  Further, since the spacers 4A and 4B have the openings A1 and A1, a sealed space is not formed by the Fabry-Perot interference filter 10, the spacer 4, and the die bond resin 5. Therefore, the air surrounded by the Fabry-Perot interference filter 10, the spacer 4, and the die bond resin 5 is not thermally expanded during the thermosetting of the die bond resin 5 at the time of manufacturing the spectroscopic sensor 1 and the die bond resin 5 is not ruptured. As a result, it is possible to prevent the Fabry-Perot interference filter 10 from being misaligned and the optical characteristics from being deteriorated. Furthermore, when an element having a membrane structure such as a thermopile is used as the photodetector 3, it is possible to prevent the membrane structure of the photodetector 3 from being damaged by the thermal expansion of air.

  Further, the electrode pad 2 b electrically connected to the photodetector 3 is disposed inside the area surrounded by the spacers 4 </ b> A and 4 </ b> B in the peripheral area R <b> 1 of the light transmission area 11. For this reason, by providing a wiring for electrically connecting the electrode pad 2b and another element so as to pass through the opening A1 of the spacers 4A and 4B, the electrical connection to the photodetector 3 can be achieved. Can be secured. Therefore, compared with the case where the electrode pad 2b is arranged outside the region surrounded by the spacers 4A and 4B, a space for arranging the electrode pad 2b is not required, and the spectral sensor 1 can be downsized. .

  The Fabry-Perot interference filter 10 has terminals 12 and 13, and the spacers 4 </ b> A and 4 </ b> B correspond to the terminals 12 and 13 of the Fabry-Perot interference filter 10 when viewed from the light transmission direction in the Fabry-Perot interference filter 10. It is arranged at the position to do. For this reason, since the terminals 12 and 13 of the Fabry-Perot interference filter 10 are supported by the spacers 4A and 4B provided at the positions corresponding to the terminals 12 and 13 in the wire bonding step when the spectroscopic sensor 1 is manufactured, the wires Bondability can be improved.

  The Fabry-Perot interference filter 10 has a light transmission region 11, and the spacers 4 </ b> A and 4 </ b> B are separated from the light transmission region 11 of the Fabry-Perot interference filter 10 when viewed from the light transmission direction in the Fabry-Perot interference filter 10. doing. Therefore, since the spacers 4A and 4B and the light transmission region 11 are separated from each other, the die bond resin 5 is prevented from entering the light transmission region 11 even when the die bond resin 5 protrudes when the spectroscopic sensor 1 is manufactured. can do. Even if the die bond resin 5 is applied excessively, the excess die bond resin 5 is transmitted to the lower side of the spacers 4A and 4B, thereby preventing the die bond resin 5 from being transmitted to the light transmitting region 11. You can also

  7B, the outer surface of the spacer 4A is located slightly outside the outer surface of the Fabry-Perot interference filter 10, so that the resin fillet of the die bond resin 5 is formed. Since it is formed, adhesion is ensured.

[Modification]
Various arrangements of the spacer 4 described with reference to FIG. 4B and the die bond resin 5 described with reference to FIG. 5A can be modified. For example, as shown in FIG. 9, columnar spacers 4C are arranged in the vicinity of each of the four apexes of the rectangular wiring board 2, and the die bond resin 5 is formed in a dot shape on the upper surface of each of the four spacers 4C. It may be applied.

  Further, as shown in FIG. 10A, a U-shaped spacer 4D may be fixed on the wiring board 2, and the die bond resin 5 may be applied over substantially the entire upper surface of the U-shaped spacer 4D. .

  Further, as shown in FIG. 10B, L-shaped spacers 4E are fixed to two vertices located on the diagonal line of the wiring board 2 among the four vertices of the wiring board 2, and the spacer 4E The die bond resin 5 may be applied over the upper surface.

  In the above embodiment, as illustrated in FIG. 2, the light transmission region 11 is described as a region narrower than the opening 50 a, but the present invention is not limited to such a form. In the case where light having a narrowed width is introduced as incident light, the light transmission region 11 becomes narrower than the opening 50a as shown in FIG. However, for example, when light having a width wider than the opening 50 a is introduced as incident light, the opening 50 a defines the light transmission region 11. The present invention is also applicable to such a form.

  Further, for example, the photodetection device includes a wiring board having a main surface, a photodetector disposed on the main surface of the wiring board and electrically connected to the wiring board, and light detection on the main surface of the wiring board. And a Fabry-Perot interference filter having a light transmission region and disposed on the main surface of the wiring board via the support member, the support member having a light transmission region. The Fabry-Perot interference filter is supported in the surrounding region, and the support member has an opening that communicates the inside of the surrounding region and the outside of the surrounding region when viewed from the light transmission direction in the light transmitting region.

  In this photodetection device, the opening is provided in the support member. For this reason, even when the bonding pad electrically connected to the photodetector is disposed in the peripheral region of the light transmission region, wiring for electrically connecting the bonding pad and other elements is provided. By providing the support member so as to pass through the opening of the support member, electrical connection to the photodetector can be ensured. Therefore, when viewed from the direction of light transmission in the Fabry-Perot interference filter, there is no need to dispose the bonding pad outside the Fabry-Perot interference filter. Therefore, the size of the photodetection device can be made substantially equal to the size of the Fabry-Perot interference filter, and the photodetection device can be miniaturized.

  Here, in the light detection device of the present invention, at least a part of the bonding pads electrically connected to the light detector may be arranged in the surrounding region. According to this configuration, by providing wiring for electrically connecting the bonding pad and other elements so as to pass through the opening of the support member, electrical connection to the photodetector can be ensured. Can do. Therefore, as compared with the case where the bonding pad is disposed outside the region surrounded by the support member, a space for disposing the bonding pad becomes unnecessary, and the photodetection device can be downsized.

  Further, for example, the photodetector includes a mounting substrate having a main surface, a photodetector disposed on the main surface of the mounting substrate, and a support member provided around the photodetector on the main surface of the mounting substrate. A Fabry-Perot interference filter having a light transmission region and disposed on the main surface of the mounting substrate via a support member, the support member supporting the Fabry-Perot interference filter in a peripheral region of the light transmission region The support member forms an opening that communicates the inside of the surrounding region and the outside of the surrounding region when viewed from the light transmission direction in the light transmitting region, and the Fabry-Perot interference filter includes the support, A first mirror fixed to the support, and a second mirror that is opposed to the first mirror via a gap and is movable with respect to the first mirror, the support member and the Fabry-Perot interference filter, Made of resin material Are secured together by a bonding portion, the thickness of the air gap in the direction in which the first mirror and the second mirror faces is less than the thickness of the support of the Fabry-Perot interference filter.

  In the light detection device, the Fabry-Perot interference filter may have a bonding pad, and the support member may be disposed at a position corresponding to the bonding pad of the Fabry-Perot interference filter when viewed from the transmission direction. According to this configuration, since the bonding pad of the Fabry-Perot interference filter is supported by the support member provided at the position corresponding to the bonding pad in the wire bonding process at the time of manufacturing the photodetector, the wire bonding property is improved. Can be improved.

  In the light detection device, the support member may be separated from the light transmission region of the Fabry-Perot interference filter when viewed from the transmission direction. According to this configuration, since the support member and the light transmission region are separated from each other, even when a material such as a resin used for the bonding portion protrudes from the bonding portion at the time of manufacturing the photodetector, the resin or the like The material can be prevented from entering the light transmission region.

  DESCRIPTION OF SYMBOLS 1 ... Spectral sensor (light detection apparatus), 2 ... Wiring board, 2A ... Main surface, 2b ... Electrode pad (bonding pad), 3 ... Photo detector, 4, 4A-4E ... Spacer (support member), 10 ... Fabry Perot interference filter, 11... Light transmission region, 12, 13... Terminal (bonding pad), A1.

Claims (4)

A wiring board having a main surface;
A thermistor disposed on the main surface of the wiring board;
A photodetector disposed on the main surface of the wiring board and electrically connected to the wiring board;
A support member disposed around the photodetector and the thermistor on the main surface of the wiring board;
A Fabry-Perot interference filter having a light transmission region and disposed on the main surface of the wiring board via the support member,
The support member supports the Fabry-Perot interference filter in a peripheral region of the light transmission region;
The support member is disposed so as to sandwich the surrounding area when viewed from the light transmission direction in the light transmission area, and communicates the inside of the surrounding area and the outside of the surrounding area. Forming a second portion and a second opening,
The Fabry-Perot interference filter includes a substrate, a first mirror fixed to the substrate, and a second mirror that faces the first mirror through a gap and is movable with respect to the first mirror. And
The photodetector and the thermistor are arranged in a region sandwiched between the plurality of support members on the main surface of the wiring board,
A wire passing through the first opening is connected to the photodetector.
A light detection device, wherein a wire passing through the second opening is connected to the thermistor. The support member is rod-shaped,
The photodetection device according to claim 1, wherein the number of the support members is two. The Fabry-Perot interference filter has a bonding pad,
The photodetecting device according to claim 1, wherein the support member is disposed at a position corresponding to a bonding pad of the Fabry-Perot interference filter when viewed from the transmission direction. The photodetecting device according to claim 1, wherein the support member is separated from the light transmission region of the Fabry-Perot interference filter when viewed from the transmission direction.

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