JP2019093078A - Optical sensor device - Google Patents

Abstract

To provide an optical sensor device capable of adjusting an irradiation position.SOLUTION: An optical sensor device 1 includes a substrate 2, a first light emitting element 11, a second light emitting element 12, a light receiving element 13, and a transparent substrate 3. The substrate 2 has a first opening 21, a second opening 22, and a third opening 23. The third opening 23 is positioned at intervals between the first opening 21 and the second opening 22. The first light emitting element 11 is positioned on a bottom surface of the first opening 21. The second light emitting device 12 is positioned on a bottom surface of the second opening 22. The light receiving element 13 is positioned on the bottom surface of the third opening 23. The transparent substrate 3 is positioned on an upper surface of the substrate 2, closes respective openings, and is joined to the substrate 2. The bottom surface of the first opening 21 has a first inclined plane 31 inclined toward the third opening 23. The first light emitting element 11 is positioned on the first inclined plane 31. The bottom surface of the second opening 22 has a second inclined plane 32 inclined toward the third opening 23. The second light emitting element 12 is positioned on the second inclined plane 32.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an optical sensor device.

  There is a need for an optical sensor device such as a measurement sensor capable of measuring biological information such as blood flow easily and at high speed. For example, blood flow can be measured using the Doppler effect of light. When the light is irradiated to the blood, the light is scattered by blood cells such as red blood cells. The moving velocity of blood cells is calculated from the frequency of the irradiation light and the frequency of the scattered light.

  An optical sensor device capable of measuring blood flow and the like is described, for example, in Patent Document 1 as an electronic device equipped with an opto device, and on a substrate, a light emitting element for irradiating light to an object such as blood and signal light A light receiving element for receiving light is disposed, and a lens is located above the light emitting element.

JP, 2009-10157, A

  In an optical sensor device used for blood flow measurement or the like, high accuracy measurement can be performed by increasing the amount of light received by the light receiving unit. However, in the technique disclosed in Patent Document 1, there is a possibility that the adjustment of the light collection state such as the adjustment of the light collection position and the securing of the light collection amount may be difficult.

  An optical sensor device according to an embodiment of the present invention includes a substrate, a first light emitting element, a second light emitting element, a light receiving element, and a transparent substrate. The substrate is located between the first opening, the second opening located between the first opening and the second opening, and the first opening and the second opening, and the substrate is located between the first opening and the second opening. It has a third opening spaced apart from the opening. The first light emitting element is located at the bottom of the first opening. The second light emitting element is located on the bottom of the second opening. The light receiving element is located at the bottom of the third opening. The transparent substrate is located on the top surface of the substrate and is joined to the substrate by closing the first opening and the second opening. The bottom surface of the first opening has a first inclined surface that is inclined toward the third opening. The first light emitting element is located on the first inclined surface. The bottom surface of the second opening has a second inclined surface which is inclined toward the third opening. The second light emitting element is located on the second inclined surface.

  According to the optical sensor device according to the embodiment of the present invention, the irradiation position can be adjusted.

It is a perspective view showing an optical sensor device concerning an embodiment of the present invention. It is a top view showing the optical sensor device concerning the embodiment of the present invention. It is a perspective view at the time of excluding a transparent substrate among optical sensor devices concerning an embodiment of the present invention. It is a top view at the time of excluding a transparent substrate among optical sensor devices concerning an embodiment of the present invention. It is sectional drawing which shows the optical sensor apparatus which concerns on one Embodiment of this invention cut | disconnected by the AA of FIG. It is sectional drawing which shows the optical sensor apparatus which concerns on other embodiment of this invention cut | disconnected by the AA of FIG. It is sectional drawing which shows the optical sensor apparatus which concerns on other embodiment of this invention cut | disconnected by the AA of FIG. FIG. 5 is a cross-sectional view of the optical sensor device according to the embodiment of the present invention cut along the line B-B in FIG. 4 from which the transparent substrate is removed. It is sectional drawing which shows the optical sensor apparatus which concerns on other embodiment of this invention.

  FIG. 1 is a perspective view showing an optical sensor device according to an embodiment of the present invention. FIG. 2 is a top view showing an optical sensor device according to an embodiment of the present invention. FIG. 3 is a perspective view of the optical sensor device according to the embodiment of the present invention from which the transparent substrate is removed. FIG. 4 is a top view of the optical sensor device according to the embodiment of the present invention from which the transparent substrate is removed. FIG. 5 is a cross-sectional view showing an optical sensor device according to an embodiment of the present invention cut along line A-A of FIG. FIG. 6 is a cross-sectional view showing an optical sensor device according to another embodiment of the present invention cut along line A-A of FIG. 7 is a cross-sectional view showing an optical sensor device according to another embodiment of the present invention cut along the line AA of FIG. FIG. 8 is a cross-sectional view of the optical sensor device according to the embodiment of the present invention taken along line B-B in FIG. 4 from which the transparent substrate is removed. FIG. 9 is a cross-sectional view showing an optical sensor device according to another embodiment of the present invention. In these figures, the optical sensor device 1 includes a substrate 2, a first light emitting element 11, a second light emitting element 12, a light receiving element 13, and a transparent substrate 3.

  The substrate 2 may be rectangular in plan view, and may be formed by laminating a plurality of dielectric layers. For example, the substrate 2 has a size of 0.5 mm to 5 mm and a thickness of 0.5 mm to 5 mm in a plan view. The substrate 2 may be, for example, an organic wiring substrate in which the dielectric layer is made of a ceramic material, and the dielectric layer is made of a resin insulating material.

  When the substrate 2 is a wiring substrate made of a ceramic material, conductors such as connection pads, internal wires, and signal wires are formed on a dielectric layer made of a ceramic material. The ceramic wiring substrate includes a plurality of ceramic dielectric layers.

  As a ceramic material used for the ceramic wiring substrate, for example, aluminum oxide sintered body, mullite sintered body, silicon carbide sintered body, aluminum nitride sintered body, silicon nitride sintered body or glass ceramic sintered body A body etc. are mentioned.

  When the substrate 2 is an organic wiring substrate, a wiring conductor such as a signal wiring to be described later is formed on an insulating layer made of an organic material. The organic wiring substrate is formed of a plurality of organic dielectric layers. The organic wiring board may be, for example, a printed wiring board, a buildup wiring board, a flexible wiring board, or the like as long as the dielectric layer is made of an organic material. As an organic material used by an organic wiring board, an epoxy resin, a polyimide resin, polyester resin, an acrylic resin, a phenol resin, or a fluorine resin etc. are mentioned, for example.

  Further, the substrate 2 is provided with concave portions to be at least three openings, and both ends of the three concave portions are respectively a first opening 21 for housing the first light emitting element 11 and a second light emitting element 12. And the middle of three concave portions is a third opening 23 for receiving the light receiving element. That is, three openings are located in a line, and the middle is the third opening 23. The first opening 21, the second opening 22 and the third opening 23 are provided so as to open in the same main surface of the substrate 2 (the first surface of the substrate 2).

The optical sensor device 1 according to the embodiment of the present invention is suitably used as a measurement sensor that measures the flow of fluid such as blood flow using the Doppler effect of light. In order to use the Doppler effect of light, the measurement sensor includes a light emitting element for irradiating the object with light and a light receiving element for receiving the light scattered by the object. In particular, in the case of measuring blood flow, for example, a part of the body such as a finger is irradiated with light from the outside, and light scattered by blood cells contained in blood flowing in a blood vessel under the skin is received. Measure blood flow from changes in Therefore, in the optical sensor device 1, the first light emitting element 11 and the light receiving element 13, and the second light emitting element 12 and the light receiving element 13 are arranged at predetermined intervals based on the positional relationship between the irradiation light and the scattered light. The first opening 21, the second opening 22 and the third opening 23 are provided according to the positional relationship with the first light emitting element 11, the second light emitting element 12 and the light receiving element 13.

  The size of the first opening 21, the size of the second opening 22, and the size of the third opening 23 are the sizes of the first light emitting element 11, the second light emitting element 12, and the light receiving element 13 to be accommodated. For example, in the case of using a vertical cavity surface emitting laser element (VCSEL) as the first light emitting element 11 and the second light emitting element 12, the first opening 21 and the second opening 22 may be set appropriately. The shape of the opening may be, for example, rectangular or square, and the size thereof may be, for example, 0.3 mm to 2.0 mm in the longitudinal direction and 0.3 mm to 2 in the lateral direction. The depth is 0.3 mm to 1.0 mm. Also, it may be an LED (Light Emitting Diode). When a surface incidence photodiode is used as the light receiving element 13, the shape of the opening of the third opening 23 may be, for example, rectangular or square, and the size thereof is, for example, the vertical direction. The length is 0.3 mm to 2.0 mm, the lateral length is 0.3 mm to 2.0 mm, and the depth is 0.4 mm to 1.5 mm. The distance between the first opening 21 and the third opening 23 (between the first light emitting element 11 and the light receiving element 13) is such that the light emitted by the first light emitting element 11 is not directly incident on the light receiving element 13 It should just be. Similarly, between the second opening 22 and the third opening 23 (between the second light emitting element 12 and the light receiving element 13), the light emitted by the second light emitting element 12 is not directly incident on the light receiving element 13. You should be away from. Further, between the first opening 21 and the third opening 23 and between the second opening 22 and the third opening 23 (between the first light emitting element 11 and the light receiving element 13 and the second light emitting element 12 Between the first opening 21 and the third opening 23 and between the second opening 22 and the third opening 23 by providing a light-shielding wall between the The distances between the first light emitting element 11 and the light receiving element 13 and between the second light emitting element 12 and the light receiving element 13 can be reduced. This makes it easy to reduce the size of the substrate 2 in plan view.

  The first opening 21, the second opening 22, and the third opening 23 may have, for example, a circular shape, a square shape, a rectangular shape, or any other shape. Also, the first opening 21, the second opening 22 and the third opening 23 may have a uniform cross section in the depth direction, but the cross section parallel to the main surface of the substrate 2 may have the same shape. In the depth of the depth, the cross-sectional shape may be the same and uniform as the opening shape, and after the predetermined depth, the recessed portion may be stepped with the cross-sectional shape becoming smaller and uniform to the bottom. In the case of the recessed portion having a step as in the embodiment of the present invention, a mounting area for mounting the first light emitting element 11 is provided on the bottom of the first opening 21, and the bottom of the second opening 22. A mounting area for mounting the second light emitting element 12 is provided. In addition, a mounting area for mounting the light receiving element 13 is provided on the bottom surface of the third opening 23. Further, on the surface of the step, connection pads for electrically connecting to the first light emitting element 11, the second light emitting element 12 or the light receiving element 13 are provided.

  Among the mounting areas described above, the bottom surface of the first opening 11 and the bottom surface of the second opening 12 respectively have a first inclined surface 31 and a second inclined surface 32 which are inclined. That is, the first light emitting element 11 is located on the first inclined surface 31. The second light emitting element 12 is located on the second inclined surface 32. At this time, the first inclined surface 31 and the second inclined surface 32 are inclined toward the third opening 23. At this time, for example, the inclination angle θ1 of the first inclined surface 31 is 5 ° to 50 ° with respect to the bottom surface of the substrate 2 and the inclination angle θ2 of the second inclined surface 32 is with respect to the bottom surface of the substrate 2 , 5 ° to 50 °. By this, the irradiation position of the light which strikes to-be-measured object can be closely approached.

  Further, the substrate 2 is electrically connected to the first light emitting element 11, the second light emitting element 12 or the light receiving element 13, and an electrical signal input to the first light emitting element 11 or the second light emitting element 12 is transmitted. There may be a signal wiring through which the electrical signal output from the light receiving element 13 is transmitted. The signal wiring is electrically connected to a bonding wire which is a connection member connected to the first light emitting element 11, the second light emitting element 12 or the light receiving element 13, a connection pad to which the bonding wire is connected, and a connection pad. The via conductor may extend from immediately below the connection pad to the lower surface of the substrate 2 (the second surface of the substrate 2), and an external connection terminal electrically connected to the via conductor. The external connection terminal is provided on the lower surface of the substrate 2 and is electrically connected to the connection terminal of the external mounting substrate on which the measurement sensor including the optical sensor device 1 is mounted by a terminal connection material such as solder.

  The external connection terminal is preferably improved in wettability with a bonding material such as solder and corrosion resistance. For this purpose, for example, a nickel layer having a thickness of 0.5 μm to 10 μm and a gold layer having a thickness of 0.5 μm to 5 μm may be sequentially deposited by plating.

  The transparent substrate 3 covers the upper surface of the substrate 2 (the first surface of the substrate 2), and is bonded to the first surface of the substrate 2 by a bonding material. The first opening 21, the second opening 12 and the third opening 23 in which the first light emitting element 11, the second light emitting element 12 and the light receiving element 13 are accommodated are closed and sealed by the transparent substrate 3. . The transparent substrate 3 is a plate-like member made of an insulating material, and light emitted from the first light emitting element 11 accommodated in the first opening 21 and the second light emitting element 12 accommodated in the second opening 22 is It may be made of a light transmitting material that transmits light and light that is received by the light receiving element 13 accommodated in the third opening 23 is transmitted.

  The first light emitting element 11 and the second light emitting element 12 can use semiconductor laser elements such as VCSELs, and the light receiving element 13 can be various photodiodes such as silicon photodiodes, GaAs photodiodes, InGaAs photodiodes, germanium photodiodes, etc. Can be used. The first light emitting element 11 and the light receiving element 13 may be appropriately selected according to the type of the object to be measured, the type of the parameter to be measured, and the like.

  In the case of measuring blood flow, for example, in order to measure using the Doppler effect of light, laser light having a wavelength of 850 nm can be emitted as the VCSELs that are the first light emitting element 11 and the second light emitting element 12. I hope there is. In the case of performing other measurements, the first light emitting element 11 and the second light emitting element 12 that emit laser light of a wavelength according to the purpose of measurement may be selected. The light receiving element 13 may be any one as long as it can receive the light emitted from the first light emitting element 11 when there is no change in wavelength from the laser light emitted from the first light emitting element 11 and the second light emitting element 12 If there is a change in wavelength, it may be any one that can receive light of the changed wavelength.

  The first light emitting element 11, the second light emitting element 12, the light receiving element 13 and the connection pad are electrically connected by, for example, a bonding wire 32 in this embodiment, but flip chip connection, bump connection, anisotropy Other connection methods such as connection using a conductive film may be used.

  In addition, the transparent substrate 3 needs to transmit the irradiation light and the scattered light to the object to be measured. Since the characteristics of the irradiation light and the scattered light are determined by the light emitting element to be mounted, at least the light emitted from the light emitting element to be mounted may be configured to be transmitted. The transparent substrate 3 may be made of an insulating material having a transmittance of 70% or more, preferably 90% or more, to the wavelength of light emitted from the light emitting element.

For the transparent substrate 3, for example, a transparent ceramic material such as sapphire, a glass material, a resin material or the like can be used as the insulating material. As the glass material, borosilicate glass, crystallized glass, quartz, soda glass or the like can be used. As the resin material, polycarbonate resin, unsaturated polyester resin, epoxy resin or the like can be used. The transparent substrate 3 is, for example, rectangular in plan view, and has a size of 0.5 mm × 1 mm to 5 mm × 5 mm. Moreover, thickness is 0.5 mm-5 mm.

  Further, the bonding material bonds the substrate 2 and the transparent substrate 3. More specifically, the upper surface of the substrate 2 and the lower surface of the transparent substrate 3 are bonded at the outer peripheral portion. The bonding material is annularly provided along the upper surface of the substrate 2 and is for securing the airtightness and water tightness in the first opening 21, the second opening 22 and the third opening 23 of the substrate 2. It is a sealing material. All of the first light emitting element 11, the second light emitting element 12 and the light receiving element 13 accommodated in the first opening 21, the second opening 22 and the second opening 23 are weak to moisture and the like, In order to prevent entry, the bonding material is provided in a continuous annular shape.

  Furthermore, the bonding material may have a light shielding property. Since the bonding material has a light shielding property, light from the outside passes between the substrate 2 and the transparent substrate 3 and is in the first opening 21, in the second opening 22, and in the third opening 23. Entry can be reduced. In addition, it can be reduced that the light emitted from each light emitting element is dispersed and emitted in various directions.

  The light shielding property of the bonding material is preferably a light shielding property by absorption of light. From the viewpoint of preventing the entry of light from the outside, it may be light shielding by reflection, but stray light generated inside the measurement sensor may be reflected by the bonding material and further received by the light receiving element. . If the bonding material absorbs light, it can absorb light from the outside to prevent entry and can also absorb stray light generated inside.

  The bonding material is configured to include a material having a light shielding property by such absorption of light. The bonding material is obtained, for example, by dispersing a light absorbing material in a resin adhesive such as an epoxy resin having a bonding property between the substrate 2 and the transparent substrate 3 and a conductive silicon resin. As a light absorption material, an inorganic pigment can be used, for example. As the inorganic pigment, for example, carbon based pigments such as carbon black, nitride based pigments such as titanium black, Cr-Fe-Co based, Cu-Co-Mn based, Fe-Co-Mn based, Fe-Co-Ni -A metal oxide pigment such as Cr can be used. The conductive bonding agent 41 may be made of a metal material such as solder. For example, brazing materials such as Sn-Ag, Sn-Ag-Cu, Au-Sn, Au-Sn-Ag, and Au-Si can be used.

  The optical sensor device 1 is mounted on an external mounting substrate and used. On the external mounting substrate, for example, a control element that controls light emission of the first light emitting element 11 and the second light emitting element 12 and an arithmetic element that calculates the blood flow velocity and the like from the output signal of the light receiving element 13 are also mounted.

  In the case of measurement, the light emitting element control current is input to the optical sensor device 1 from the external mounting substrate through the external connection terminal in a state where the finger tip of the finger is brought into contact with the surface of the transparent substrate 3 as an object to be measured. Light for measurement is emitted from the first light emitting element 11 and the second light emitting element 12 after being input to the first light emitting element 11 and the second light emitting element 12 through the conductor, the connection pad and the like. When the emitted light passes through the transparent substrate 3 and is irradiated to the fingertip, the blood cells in the blood are scattered. When the scattered light transmitted through the transparent substrate 3 is received by the light receiving element 13, an electrical signal corresponding to the amount of received light is output from the light receiving element 13. The output signal passes through the connection pad and the via conductor, and is output from the optical sensor device 1 to the external mounting substrate through the external connection terminal. In the external mounting substrate, the signal output from the optical sensor device 1 is input to the arithmetic element, and for example, the blood flow velocity is calculated by analyzing the intensity of the scattered light received by the light receiving element 13 for each frequency. Can. In particular, when more accurate biological information and the like are obtained using a plurality of light emitting elements, if the light emitting elements are on different substrates (parts separated from each other), the portions irradiated with the light of the object to be measured are different. Measurement accuracy tends to decrease. On the other hand, by locating a plurality of light emitting elements in the same substrate and further inclining them in the same direction, it is possible to acquire information of a closer part of the object to be measured. In addition, the irradiation amount to the object to be measured and the light receiving element can be increased.

  In the optical sensor device 1 according to the embodiment of the present invention, the substrate 2 has the first inclined surface 31 and the second inclined surface 32, and the first inclined surface 31 and the second inclined surface 32 have the third opening. It is inclined towards 23. By this, the irradiation position of the light which strikes to-be-measured object can be closely approached.

<Method of Manufacturing Optical Sensor Device>
A method of manufacturing the optical sensor device 1 will be described. First, the substrate 2 is manufactured in the same manner as the method for manufacturing a multilayer wiring substrate. When the substrate 2 is a ceramic wiring substrate and the ceramic material is alumina, first suitable as a raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. An organic solvent and a solvent are added and mixed to form a slurry, which is formed into a sheet by a doctor blade method, a calender roll method or the like to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched into a predetermined shape, and an organic solvent and a solvent are added to and mixed with tungsten (W) and raw material powder such as glass material to form a metal paste, which is printed on the surface of the green sheet Print the pattern with At this time, a portion to be an inclined surface is stamped and processed. Moreover, a via conductor provides a through-hole in a green sheet, and makes metal paste fill a through-hole by screen printing etc. Further, the metallized layer to be the ground conductor layer is formed on the outermost surface by metal paste. A plurality of green sheets obtained in this manner are stacked, and co-fired at a temperature of about 1600 ° C. to produce a substrate 2.

  On the other hand, a transparent substrate 3 is prepared by cutting a glass material into a predetermined shape by cutting, cutting or the like. A light shielding film 5 described later is formed on the lower surface of the transparent substrate 3 by vapor deposition, sputtering, baking or the like.

  In the above description, the via conductors are formed in a straight line in the vertical direction in the substrate 2, but if electrically connected from the upper surface of the substrate 2 to the external connection terminals on the lower surface, they are in a straight line. Instead, they may be formed to be deviated by the inner layer wiring, the internal ground conductor layer or the like in the substrate 2.

Another Embodiment of Optical Sensor Device
The optical sensor device 1 according to another embodiment of the present invention may have a light shielding film on the lower surface of the transparent substrate 3. The light shielding film is formed of, for example, a metal material such as Cr, Ti, Al, Cu, Co, Ag, Au, Pd, Pt, Ru, Sn, Ta, Fe, In, Ni or W or a metal material such as an alloy thereof. , Sputtering, baking or the like. The thickness of the light shielding film is, for example, 50 nm to 400 nm. It is preferable that the light shielding film is not provided at a location where at least the light emitted by the first light emitting element 11 and the second light emitting element 12 and the reflected light reaching the light receiving element 13 pass.

  The first inclined surface 31 and the second inclined surface 32 may have the same inclination angle. In the case of the same inclination angle as the first inclined surface 31 and the second inclined surface 32, the amount of light irradiated to the object to be measured can be easily made to be the same as the left and right. At this time, in top view, the distance between the center of the first light emitting element 11 and the center of the light receiving element 13 may be the same as the distance between the center of the second light emitting element 12 and the center of the light receiving element 13 . This makes it possible to make the amount of light irradiated to the object to be measured the same as the left and right.

  Further, the second inclined surface 32 may have a larger inclination angle than the first inclined surface 31. In such a case, the distance between the center of the second light emitting element 12 and the center of the light receiving element 13 is larger than the distance between the center of the first light emitting element 11 and the center of the light receiving element 13 in top view Good. In addition, the first inclined surface 31 may have a larger inclination angle than the second inclined surface 32. In such a case, the distance between the center of the first light emitting element 11 and the center of the light receiving element 13 is larger than the distance between the center of the second light emitting element 12 and the center of the light receiving element 13 in top view Good. That is, even if the distance to the light receiving element 13 is different, the angle of light incident on the object to be measured can be easily made to be the same as the left and right by controlling the inclination angle.

  In addition, in the optical sensor device 1 according to another embodiment of the present invention, the first lens 41 may be attached to the upper surface of the transparent substrate 3. At this time, the first lens 41 is positioned to overlap the first opening 21 in a plan view. The thickness of the first lens 41 is 0.5 mm to 2 mm. The first lens 41 is made of, for example, a glass material such as quartz glass or borosilicate glass, or a resin material such as acryl, polycarbonate, styrene, or polyolefin. The first lens 41 preferably has transparency for transmitting the light emitted by the first light emitting element 11. Further, as the first lens 41, it is preferable to use one having a light-condensing property, such as a convex lens, having a property of refracting light in the optical axis direction. Since the first lens 41 is provided, the diffused light emitted by the first light emitting element 11 can be refracted, and the condensed light and the collimated light can be improved to improve the light condensing property.

  In addition, in the optical sensor device 1 according to another embodiment of the present invention, a lens (second lens 42) may be attached to a position overlapping the second opening 22 on the upper surface of the transparent substrate 3. The thickness of the second lens 42 is 0.5 mm to 2 mm. The second lens 42 is made of, for example, a glass material such as quartz glass or borosilicate glass, or a resin material such as acryl, polycarbonate, styrene, or polyolefin. The second lens 42 may be transmissive to the light emitted by the second light emitting element 12. Further, as the second lens 42, it is preferable to use one having a light-condensing property, such as a convex lens, having a property of refracting light in the optical axis direction. The presence of the second lens 42 allows the diffused light emitted by the second light emitting element 12 to be refracted to be focused light or collimated light, thereby improving the light condensing property.

  The present invention is not limited to the examples of the embodiments described above, and various modifications such as numerical values are possible. Further, the mounting method of each element in the present embodiment is not specified. Moreover, each embodiment according to the present invention can be combined in all, as long as no contradiction occurs in the contents. The optical sensor device according to the embodiment of the present invention has been described as a pulse wave blood flow sensor device, but other devices operated by a pair of sensor elements of a light emitting element and a light receiving element, such as proximity illumination integrated type The present invention can be applied to a sensor device, a proximity sensor device, a distance measurement sensor device, and the like.

Reference Signs List 1 optical sensor device 2 substrate 3 transparent substrate 11 first light emitting element 12 second light emitting element 13 light receiving element 21 first opening 22 second opening 23 third opening 31 first inclined surface 32 second inclined surface 41 lens 42 Second lens

Claims (7)

A first opening, a second opening spaced apart from the first opening, a position between the first opening and the second opening, and the first opening and the second opening. A substrate having a third opening spaced apart from the second opening;
A first light emitting element located on a bottom surface of the first opening;
A second light emitting element located on the bottom of the second opening;
A light receiving element located at the bottom of the third opening;
A transparent substrate located on the top surface of the substrate and closing the first opening and the second opening to be bonded to the substrate;
The bottom surface of the first opening has a first inclined surface inclined toward the third opening, and the first light emitting element is located on the first inclined surface, and the second opening An optical sensor device characterized in that the bottom surface of the light emitting device has a second inclined surface inclined toward the third opening, and the second light emitting element is located on the second inclined surface.   The optical sensor device according to claim 1, wherein the inclination angles of the first inclined surface and the second inclined surface are the same.   In a top view, the distance between the center of the first light emitting element and the center of the light receiving element is the same as the distance between the center of the second light emitting element and the center of the light receiving element. Optical sensor device according to claim 1.   The optical sensor device according to claim 1, wherein the second inclined surface has a larger inclination angle than the first inclined surface.   The top view WHEREIN: The distance of the center of a said 2nd light emitting element and the center of the said light receiving element is larger than the distance of the center of a said 1st light emitting element, and the center of the said light receiving element. Optical sensor device as described.   The optical sensor device according to any one of claims 1 to 5, wherein a first lens is positioned above the transparent substrate at a position overlapping the first opening.   The optical sensor device according to any one of claims 1 to 6, wherein a second lens is positioned above the transparent substrate at a position overlapping the second opening.