JP2019050514A - Structure - Google Patents

Abstract

To make a frequency characteristic of a structure closer to a design value according to an embodiment of the present invention.SOLUTION: A structure as one embodiment hereof comprises: a dielectric substrate; a conductor substrate; conductor plates; through-hole vias; a conductor face; and conductor pieces. The dielectric substrate has: a first face; a second face on a side opposite to the first face; and a third face crossing the first face. The conductor substrate is in contact with the dielectric substrate at the first face. The conductor plates are arranged on the second face with a gap provided thereamong. The through-hole vias are provided for the conductor plates respectively, which extend through the dielectric substrate, connecting one conductor plate to the conductor substrate. The conductor face is opposed to the third face, and connected to the conductor substrate. The conductor pieces are disposed between the conductor face and the first conductor plate of the plurality of conductor plates, which is disposed at an end on a side of the third face, and connected to the conductor face.SELECTED DRAWING: Figure 1

Description

  Embodiments of the present invention relate to structures.

  It is known to suppress noise due to electromagnetic waves by using a structure having an electromagnetic band gap (EBG: Electromagnetic Band Gap) structure that blocks electromagnetic waves in a specific frequency band. The EBG structure is formed of a plurality of conductor plates (patches) or the like arranged in a lattice form with gaps (gaps) therebetween. The frequency characteristics of the EBG structure, such as the cut-off frequency band and the cut-off amount, are determined by the size of the patches, the size of the gap between the patches, and the like.

  However, in practice, it is difficult to obtain the calculated amount of interruption, and simply by increasing the number of patches, the desired frequency characteristics can not be obtained.

JP, 2009-218966, A

  An embodiment of the present invention aims to bring the frequency characteristic of a structure close to a design value.

  A structure according to an aspect of the present invention includes a dielectric substrate, a conductor substrate, a conductor plate, a through hole via, a conductor surface, and a conductor piece. The dielectric substrate has a first surface, a second surface opposite to the first surface, and a third surface intersecting the first surface. The conductor substrate is in contact with the dielectric substrate at the first surface. The conductor plates are arranged with a gap on the second surface. Through-hole vias are provided for each of the conductor plates, and penetrate the dielectric substrate to connect one of the conductor plates to the conductor substrate. The conductor surface faces the third surface and is connected to the conductor substrate. The conductor piece is disposed between the first conductor plate disposed at the end on the third surface side of the plurality of conductor plates and the conductor surface, and is connected to the conductor surface.

BRIEF DESCRIPTION OF THE DRAWINGS The perspective view explaining the structure which concerns on one Embodiment of this invention. The top perspective view explaining the structure concerning one embodiment of the present invention. The figure which shows the frequency characteristic of the structure which is not one Embodiment of this invention. The figure explaining the EBG structure of the structure which concerns on one Embodiment of this invention. The figure which shows the result of the change of the frequency characteristic of the structure which concerns on one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(One embodiment of the present invention)
FIG. 1 is a perspective view for explaining a structure according to an embodiment of the present invention. A structure according to an embodiment of the present invention includes a dielectric substrate 1, a conductor substrate 2, a plurality of conductor plates (patches) 3, a plurality of through hole vias 4, a housing 5, and conductor pieces 6. And. The dielectric substrate 1 is shown in the form of a transparent rectangular solid whose outer frame is a dotted line for convenience of explanation.

  The dielectric substrate 1 is in contact with the conductor substrate 2 at a certain surface. In the present description, the surface in contact with the conductor substrate 2 is referred to as a reference surface (first surface). The dielectric substrate 1 is in contact with the plurality of patches 3 on the surface opposite to the reference surface. In the present description, the surface in contact with the patch 3 is referred to as a patch surface (second surface). In FIG. 1, assuming that the positive direction of the Z axis of the coordinate axes in FIG. 1 is the upper side, the upper surface of the dielectric substrate 1 is a patch surface, and the lower surface is a reference surface.

  The dielectric constant of the dielectric substrate 1 is not particularly limited, and may be determined based on the desired characteristics of the structure and the like.

  The conductor substrate 2 is used as a reference of potential. The conductor substrate 2 and the ground may be connected, and the potential of the conductor substrate 2 may be set to the ground potential.

  As shown in FIG. 1, the patches 3 are arranged in a lattice on the patch surface with a gap therebetween. A capacitance component is generated in the gap. In addition, a capacitance component is also generated between the patch 3 and the conductor substrate 2. In addition, an inductance component is generated in the patch 3 itself.

  The through hole vias 4 correspond to one patch 3 respectively, and penetrate the dielectric substrate 1 to connect the patch 3 and the conductor substrate 2. Thereby, an inductance component is generated in the through hole via 4. In the present description, a combination of one patch 3 and the through hole via 4 accompanying it is described as a unit.

  The above-mentioned inductance component and capacitance component cut off electromagnetic waves in a specific frequency band. That is, the structure shown in FIG. 1 can be said to be an EBG structure, and the structure of this embodiment can be said to be an EBG structure having an EBG structure. The EBG structure of the present embodiment is referred to as a mushroom structure.

  The dielectric substrate 1, the conductor substrate 2 and the housing 5 extend outside the range shown in FIG. 1, and the patch 3 and the through hole via 4 may be further present. For example, m (n is an integer of 2 or more) patches 3 are arranged in the X direction of the coordinate axes in FIG. 1, and n (n is an integer of 2 or more) patches 3 are arranged in the Y direction. It may be arranged in a shape.

  FIG. 2 is a top perspective view illustrating a structure according to an embodiment of the present invention. The dielectric substrate 1 is omitted. In the example of FIG. 2, the case of 5 × 4 matrix is shown. A portion of the structure shown in FIG. 1 corresponds to a portion of the 3 × 2 matrix of this m × n matrix.

  The housing 5 is hollow as shown in FIG. 2, and the inner wall 51 of the housing 5 surrounds the side surface (third surface) of the dielectric substrate 1. The side surface of the dielectric substrate 1 is a surface intersecting the reference surface and the patch surface. Therefore, the inner wall 51 of the housing 5 is opposed to the side surface of the dielectric substrate 1.

  At least a part of the inner wall 51 of the housing 5 has conductivity, and is connected to the conductor substrate 2. For example, the housing 5 may be configured of one or more conductors, or the inner wall 51 may be covered with metal. The conductive portion of the inner wall 51 can be said to be a conductor surface. Therefore, it can be said that the housing 5 has a conductor surface facing the side surface of the dielectric substrate 1 and connected to the conductor substrate 2.

  In addition, in FIG. 2, although the housing | casing 5 is a shape of a square pole, it may be cylindrical. That is, the conductor surface may be curved.

  The frame 71 shown by the dotted line in FIG. 2 is formed by joining together an edge opposed to the inner wall 51 of the patch 3 (first conductive plate) disposed at an end of the plurality of patches 3. The area between the frame 71 and the inner wall 51, in other words, the area outside the frame 71 and the inside of the housing 5 is referred to as a buffer area 72.

  The dielectric substrate 1 may protrude outside the frame 71. Also, the end of the dielectric substrate 1 may be in contact with the inner wall 51.

  The conductor pieces 6 are arranged in the buffer area 72. Also, the conductor piece 6 is connected to the conductive portion of the inner wall 51. As a result, the conductor piece 6 capacitively couples with the patch 3 disposed at one end of the plurality of patches 3 disposed in a lattice. Thereby, the frequency characteristic of the structure of this embodiment differs from the frequency characteristic of the EBG structure without the conductor piece 6.

  The EBG structure is used as an application for blocking electromagnetic waves in unnecessary frequency bands. For example, by installing the EBG structure in the housing of the power amplifier, it is possible to suppress the noise oscillated from the circuit of the power amplifier. Hereinafter, the frequency band cut off by the EBG structure is referred to as a stop band.

  The frequency characteristics of the EBG structure such as the stop band are determined by the size of the patch 3, the size of the gap between the patches 3, the number of units, and the like. For example, it is conceivable to increase the cutoff amount by increasing the number of units arranged in a matrix, or to change the cutoff band by adjusting the arrangement interval of the units.

  However, even if the EBG structure is manufactured based on theoretical design values, the actual blocking amount of the EBG structure is lower than the design value. FIG. 3 is a diagram showing frequency characteristics of a structure which is not an embodiment of the present invention. The frequency characteristic by the EBG structure which is not equipped with the conductor piece 6 is shown. Design values are shown by dotted lines and actual values are shown by solid lines. As can be seen from FIG. 3, it can be seen that the designed cutoff amount is not obtained in the designed cutoff zone.

  Usually, the frequency characteristics of the EBG structure are calculated based on the assumption that patch 3 always intervenes between other patches 3. However, in practice there are patches 3 which are located at the end and do not intervene between the other patches 3. Therefore, as shown in FIG. 3, in the design stop band, the design cut-off amount can not be obtained.

  However, in the structure of the present embodiment, the patch 3 disposed at the end also performs capacitive coupling with the conductor piece 6. Therefore, it is possible to approach the cutoff amount in design.

  FIG. 4 is a view for explaining an EBG structure of a structure according to an embodiment of the present invention. In addition, the alphabet of the subscript of a code | symbol is attached | subjected for distinction of each individual | organism | solid of the same code | symbol.

  As described above, the patch 3 and the through hole via 4 have an inductance component. In addition, capacitance components are generated in the gaps between the adjacent patches 3 and between the patches 3 and the conductor substrate 2. An equivalent circuit based on these inductance components and capacitance components is shown in FIG. As shown in FIG. 4, the equivalent circuit is a combined right / left handed line in which the right handed line and the left handed line are combined. The stopband is determined by the dispersion characteristics of the right / left handed composite line.

Symbol L in FIG. 4 indicates an inductance component, and symbol C indicates a capacitance component. Also, the index R indicates that it is a component of a right-handed line, and the index L indicates that it is a component of a left-handed line. The inductance component generated in the patch 3 is indicated as L _R because it is an inductance component of the right-handed line. Capacitance component generated between the patch 3 and the conductor substrate 2 are the capacitance component of the right-handed transmission line, shown as C _R. The inductance component of the through hole via 4 is indicated as L _L because it is an inductance component of the left-handed line. Capacitance component generated in a gap between adjacent patches 3 to each other, since the capacitance component of the left-handed transmission line, shown as C _L. When the size of the patch 3, the size of the gap between the patches 3, and the size of the through hole via 4 are uniform, the value of each component is the same.

When the conductor piece 6 as in this embodiment is disposed, a capacitance component is generated between the patch 3A disposed at the end on which the conductor surface is located and the conductor piece 6. In addition, an inductance component is generated in the conductor piece 6 itself. Also, a capacitance component is generated between the conductor piece 6 and the conductor substrate 2. That is, the inductance component L ' _{R of} the right-handed line, the capacitance component C' _{R of} the right-handed line, and the capacitance component C ' _L of the left-handed line are generated as shown in the dotted frame of FIG. Thus, capacitive coupling between the conductor piece 6 and the patch 3A disposed at the end forms a combined right-hand / left-handed transmission path by the plurality of patches 3 and the conductor piece 6. As a result, the patch 3A disposed at the end is not at the end of the combined right / left handed line.

  On the other hand, without the conductor piece 6, there is no right-hand / left-hand composite line in the portion enclosed by the dotted frame in FIG. 4, so the patch 3A disposed at the end becomes the end of the right-hand / left-hand composite line The blocking amount is smaller than the design value calculated assuming that 3 always intervenes between the other patches 3.

  The shape, position, and size of the conductor piece 6 can be adjusted, but the Q value of the combined right / left handed transmission line based on the conductor piece 6 and the patch 3A disposed at the end is the patch 3 adjacent to each other. It is preferable to match the Q value of the combined right / left handed transmission line based on the above.

  FIG. 5 is a diagram showing the results of changes in the frequency characteristics of the structure according to an embodiment of the present invention. The graph 81 of the interruption | blocking amount in the structure which concerns on this embodiment, and the graph 91 of the interruption | blocking amount of the structure except the conductor piece 6 are shown by the continuous line. Further, a graph 82 of the reflection amount (the amount of reflected electromagnetic wave) of the structure according to the present embodiment and a graph 92 of the reflection amount of the structure excluding the conductor piece 6 are shown by dotted lines.

  According to FIG. 5, it can be seen that the blocking amount of the structure of this embodiment is increased by about 10 dB in the vicinity of the frequency band 10.25 although the reflection amounts of both structures are almost the same. Thus, by providing the conductor pieces 6 arranged as in the present embodiment, it is possible to bring the actual measurement value close to the design value.

  As described above, the structure of the present embodiment includes the dielectric substrate, the conductor substrate, the conductor plate, the through hole via, the conductor surface, and the conductor piece. The dielectric substrate has a reference surface, a patch surface opposite to the reference surface, and a surface intersecting the reference surface. According to the structure of the present embodiment, the conductor substrate is in contact with the dielectric substrate at the reference surface, and the conductor plate is arranged in a lattice form with a gap on the patch surface. Through-hole vias are provided for each of the conductor plates, and penetrate through the dielectric substrate to connect one of the conductor plates to the conductor substrate. The conductor surface faces the surface intersecting with the reference surface, and is connected to the conductor substrate. The conductor piece is disposed between the conductor surface and the first conductor plate disposed at the end on the side where the conductor surface is located among the plurality of conductor plates, and is connected to the conductor surface. Such an arrangement capacitively couples the patch 3 disposed at the end with the conductor piece 6. Thereby, the frequency characteristic of the structure can be brought close to the design value.

  The installation destination of the structure of the present embodiment is not particularly limited. By installing the structure of this embodiment near an apparatus that emits or receives an electromagnetic wave such as a communication device, an antenna, or a circuit, an electromagnetic wave in an unnecessary frequency band can be prevented. For example, the structure of this embodiment may be provided in a housing that covers a substrate on which a digital circuit, an analog circuit, a digital / analog mixed circuit, an RF (Radio Frequency) circuit, an antenna circuit, or the like is mounted. Alternatively, the structure of the present embodiment may be provided in a device incorporating a superconducting system, SOC (Synatem Chip), and pseudo SOC.

  Further, the structure of the present embodiment may be configured by combining several structures. For example, this embodiment is implemented by combining an EBG structure having a mushroom structure, a cylindrical casing 5 having an inner wall 51 at least a part of which is a conductive surface, and a lid on which a conductor piece 6 is installed at the edge of the surface. Forms of construction may be manufactured. The housing 5 is placed on the conductor substrate 2 of the EBG structure so that the EBG structure is surrounded by the inner wall 51. Then, the cover is put on the housing 5 so that the conductor piece 6 is in contact with the conductive surface, with the surface on which the conductor piece 6 exists facing the EBG structure. If the end of the conductor piece 6 exists between the patch 3 disposed at the end of the mushroom structure and the inner edge of the housing 5 with the lid covered, the end of the conductor piece 6 is a buffer area As a result, the same arrangement as the structure of this embodiment is obtained.

  While one embodiment of the invention has been described above, these embodiments have been presented by way of example only and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and the gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

Reference Signs List 1 dielectric substrate 2 conductor substrate 3, 3A, 3B, 3C conductor plate (patch)
4 through-hole via 5 case 51 inner wall 6 conductor piece 71 frame 72 buffer area 81 91 graph of blocking quantity 82, 92 graph of reflection quantity

Claims (4)

A dielectric substrate having a first surface, a second surface opposite to the first surface, and a third surface intersecting the first surface;
A conductor substrate in contact with the dielectric substrate on the first surface;
On the second surface, a plurality of conductor plates arranged with a gap therebetween;
A plurality of through-hole vias provided for each of the plurality of conductor plates, which penetrate the dielectric substrate and connect one of the plurality of conductor plates to the conductor substrate;
A conductor surface facing the third surface and connected to the conductor substrate;
A first conductor plate disposed at an end of the plurality of conductor plates on which the conductor surface is located, and a conductor piece disposed between the conductor surface and connected to the conductor surface;
A structure comprising 2. The structure according to claim 1, wherein a capacitive coupling between the conductor piece and the first conductor plate forms a combined right / left handed transmission line by the plurality of conductor plates and the conductor pieces. The Q value of the right-hand / left-handed composite transmission line based on the conductor piece and the first conductor plate is the Q value of the right-hand / left-handed composite transmission line based on adjacent conductor plates of the plurality of conductor plates A structure according to claim 2 which matches. The structure according to any one of claims 1 to 3, wherein the conductor surface is at least a part of an inner wall of a hollow casing surrounding the dielectric substrate.

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