JP2019046954A5 - - Google Patents
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- Publication number
- JP2019046954A5 JP2019046954A5 JP2017168179A JP2017168179A JP2019046954A5 JP 2019046954 A5 JP2019046954 A5 JP 2019046954A5 JP 2017168179 A JP2017168179 A JP 2017168179A JP 2017168179 A JP2017168179 A JP 2017168179A JP 2019046954 A5 JP2019046954 A5 JP 2019046954A5
- Authority
- JP
- Japan
- Prior art keywords
- view
- heat dissipation
- dissipation board
- showing
- manufacturing process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 230000017525 heat dissipation Effects 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 8
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Description
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017168179A JP2019046954A (en) | 2017-09-01 | 2017-09-01 | Heat dissipation substrate and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017168179A JP2019046954A (en) | 2017-09-01 | 2017-09-01 | Heat dissipation substrate and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019046954A JP2019046954A (en) | 2019-03-22 |
JP2019046954A5 true JP2019046954A5 (en) | 2019-05-09 |
Family
ID=65816575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017168179A Pending JP2019046954A (en) | 2017-09-01 | 2017-09-01 | Heat dissipation substrate and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2019046954A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3716321A1 (en) * | 2019-03-29 | 2020-09-30 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with embedded semiconductor component and embedded highly conductive block which are mutually coupled |
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2017
- 2017-09-01 JP JP2017168179A patent/JP2019046954A/en active Pending
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