JP2019046954A5 - - Google Patents

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Publication number
JP2019046954A5
JP2019046954A5 JP2017168179A JP2017168179A JP2019046954A5 JP 2019046954 A5 JP2019046954 A5 JP 2019046954A5 JP 2017168179 A JP2017168179 A JP 2017168179A JP 2017168179 A JP2017168179 A JP 2017168179A JP 2019046954 A5 JP2019046954 A5 JP 2019046954A5
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JP
Japan
Prior art keywords
view
heat dissipation
dissipation board
showing
manufacturing process
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Pending
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JP2017168179A
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Japanese (ja)
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JP2019046954A (en
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Priority to JP2017168179A priority Critical patent/JP2019046954A/en
Priority claimed from JP2017168179A external-priority patent/JP2019046954A/en
Publication of JP2019046954A publication Critical patent/JP2019046954A/en
Publication of JP2019046954A5 publication Critical patent/JP2019046954A5/ja
Pending legal-status Critical Current

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本発明の放熱基板の側断面図Side cross-sectional view of the heat dissipation board of the present invention 放熱基板の製造工程を示す側断面図Side sectional view showing the manufacturing process of the heat dissipation board 放熱基板の製造工程を示す側断面図Side sectional view showing the manufacturing process of the heat dissipation board 放熱基板の製造工程を示す側断面図Side sectional view showing the manufacturing process of the heat dissipation board 放熱基板の製造工程を示す側断面図Side sectional view showing the manufacturing process of the heat dissipation board 放熱基板の製造工程を示す側断面図Side sectional view showing the manufacturing process of the heat dissipation board 放熱基板の製造工程を示す側断面図Side sectional view showing the manufacturing process of the heat dissipation board 放熱基板の製造工程を示す側断面図Side sectional view showing the manufacturing process of the heat dissipation board 放熱基板の製造工程を示す側断面図Side sectional view showing the manufacturing process of the heat dissipation board 放熱基板の使用例を示す側断面図Side sectional view showing an example of use of the heat dissipation board 変形例の放熱基板の側断面図Side cross-sectional view of the heat dissipation board of the modified example

JP2017168179A 2017-09-01 2017-09-01 Heat dissipation substrate and manufacturing method thereof Pending JP2019046954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017168179A JP2019046954A (en) 2017-09-01 2017-09-01 Heat dissipation substrate and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017168179A JP2019046954A (en) 2017-09-01 2017-09-01 Heat dissipation substrate and manufacturing method thereof

Publications (2)

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JP2019046954A JP2019046954A (en) 2019-03-22
JP2019046954A5 true JP2019046954A5 (en) 2019-05-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017168179A Pending JP2019046954A (en) 2017-09-01 2017-09-01 Heat dissipation substrate and manufacturing method thereof

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JP (1) JP2019046954A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3716321A1 (en) * 2019-03-29 2020-09-30 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with embedded semiconductor component and embedded highly conductive block which are mutually coupled

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