JP2019046831A - Wafer storage cassette - Google Patents

Abstract

To provide a wafer storage cassette capable of suppressing a fear of breaking a wafer and a carrying means of a machining device.SOLUTION: A wafer storage cassette 1 is equipped with a cassette body 10 and a detection mechanism 30. The cassette body 10 is equipped with a first side wall 11 formed with a plurality of first storage shelves 21 for storing a wafer 100; a second side wall 12 which opposes to the first side wall 11 and is equipped with a plurality of second storage shelves 22 having the same height as the first storage shelves 21; a bottom plate 13 and a top plate 14 coupling the first side wall 11 and the second side wall 12; and an opening portion 16 which puts in/takes out the wafer 100. The detection mechanism 30 is equipped with a plurality of sensors 31 installed at positions corresponding to respective stages of the first storage shelves 21 and the second storage shelves 22; and a battery 32 which drives the sensor 31, so as to detect whether the wafer 100 is placed on the first storage shelves 21 and the second storage shelves 22.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a wafer storage cassette that stores a wafer or an annular frame that holds the wafer.

  A processing apparatus that performs various types of processing such as cutting on a wafer takes out a wafer before processing from a wafer storage cassette that stores a plurality of wafers, and stores the processed wafer in the wafer storage cassette. In the wafer storage cassette, a wafer is inserted by an operator and a plurality of wafers are stored (see, for example, Patent Document 1).

JP 2012-104580 A

  However, when an operator stores a wafer in the wafer storage cassette shown in Patent Document 1, there is a problem that the wafer is easily inserted by mistake across the storage shelves on the left and right side walls. When the wafer is stored on the left and right side walls and straddling the different storage shelves, the processing device or the like collides with the transfer means such as the transfer robot and the wafer when the wafer is unloaded, and at least one of the wafer and the transfer means is The problem of being damaged arises.

  The present invention has been made in view of these points, and an object of the present invention is to provide a wafer storage cassette capable of suppressing the risk of damaging the wafer and the conveying means of the processing apparatus. It is.

  In order to solve the above-described problems and achieve the object, the wafer storage cassette of the present invention is a wafer storage cassette that can store a plurality of annular frames that are bonded to a wafer or an adhesive tape and integrated with the wafer. A first side wall on which a plurality of first storage shelves for receiving the wafer are formed, and a plurality of second storage shelves facing the first side wall and having the same height as the first storage shelf. A first side wall, a connecting part for connecting the first side wall and the second side wall, and an opening for taking a wafer into and out of the first storage shelf and the second storage shelf. Corresponding to each stage of the first storage shelf and the second storage shelf to detect whether the wafer is placed on the cassette main body, the first storage shelf, and the second storage shelf A plurality of sensors installed at a position to be operated and a battery for driving the sensors Characterized in that it comprises a detection mechanism comprising, when.

  Further, in the wafer storage cassette, the detection mechanism corresponds to a plurality of first lamps installed at positions corresponding to the respective steps of the first storage shelf and the respective steps of the second storage shelf. You may further provide the some 2nd lamp installed in the position, and the control part which controls light emission of this 1st lamp and this 2nd lamp based on the information from this sensor.

  In the wafer housing cassette, the detection mechanism may be configured to be removable from the cassette body.

  The present invention has an effect that the risk of damaging the wafer and the conveying means of the processing apparatus can be suppressed.

FIG. 1 is a perspective view showing a cutting apparatus which is an example of a processing apparatus in which the wafer storage cassette according to the first embodiment is used. FIG. 2 is a perspective view of the wafer accommodated in the wafer accommodation cassette according to the first embodiment. FIG. 3 is a perspective view illustrating a configuration example of the wafer storage cassette according to the first embodiment. FIG. 4 is a plan view of the bottom plate of the wafer storage cassette shown in FIG. 3 as viewed from the lower surface side. FIG. 5 is a block diagram showing the configuration of the wafer storage cassette shown in FIG. FIG. 6 is a front view for explaining the operation of accommodating the annular frame in which the wafers of the wafer accommodation cassette shown in FIG. 3 are integrated. FIG. 7 is a front view for explaining the operation of accommodating the annular frame in which the wafers of the wafer accommodation cassette according to the second embodiment are integrated. FIG. 8 is a perspective view illustrating a configuration example of the wafer storage cassette according to the third embodiment. FIG. 9 is an exploded perspective view of the cassette body of the wafer storage cassette shown in FIG. FIG. 10 is a perspective view showing a main part of the detection mechanism of the wafer containing cassette shown in FIG. FIG. 11 is a front view for explaining the operation of accommodating the annular frame in which the wafers of the wafer accommodation cassette shown in FIG. 8 are integrated.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
A wafer accommodation cassette according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a cutting apparatus which is an example of a processing apparatus in which the wafer storage cassette according to the first embodiment is used. FIG. 2 is a perspective view of the wafer accommodated in the wafer accommodation cassette according to the first embodiment. FIG. 3 is a perspective view illustrating a configuration example of the wafer storage cassette according to the first embodiment. FIG. 4 is a plan view of the bottom plate of the wafer storage cassette shown in FIG. 3 as viewed from the lower surface side. FIG. 5 is a block diagram showing the configuration of the wafer storage cassette shown in FIG. FIG. 6 is a front view for explaining the operation of accommodating the annular frame in which the wafers of the wafer accommodation cassette shown in FIG. 3 are integrated.

  As shown in FIGS. 1 and 2, the wafer storage cassette 1 according to the first embodiment is a wafer storage cassette that can store a plurality of annular frames 102 attached to an adhesive tape 101 and integrated with the wafer 100. Thus, it is used in various processing apparatuses that process a plurality of wafers 100 used in a semiconductor manufacturing process or the like. The processing apparatus is, for example, the cutting apparatus 200 shown in FIG. 1 for cutting the wafer 100, the grinding apparatus for grinding the wafer 100, the polishing apparatus for polishing the wafer 100, or the laser processing apparatus for laser processing the wafer 100.

  The wafer 100 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer whose base material is silicon, sapphire, gallium or the like. In the wafer 100, devices are formed in a plurality of regions partitioned by lattice-shaped division lines (not shown) on the surface 110. In the first embodiment, the wafer 100 is formed with an orientation flat 111 indicating the crystal orientation on the outer edge. In the wafer 100, the adhesive tape 101 is attached to the back surface 112 on the back side of the front surface 110, and the outer edge portion of the adhesive tape 101 is attached to the annular frame 102 and is held in the opening 103 of the annular frame 102. A plurality of wafers 100 are stored in the wafer storage cassette 1 while being held in the opening 103 of the annular frame 102, and the wafer storage cassette 1 is installed in the processing apparatus, and various processing is performed by the processing apparatus.

  As shown in FIG. 1, a cutting apparatus 200 as an example of a processing apparatus holds a wafer 100 on a chuck table 210 that can be sucked and held by a holding surface 211 and can be rotated around an axis by a rotation driving source. A cutting unit 220 that cuts (processes) the wafer 100 with a cutting blade 221; an X-axis moving unit (not shown) that moves the chuck table 210 in the X-axis direction; and a Y (not shown) that moves the cutting unit 220 in the Y-axis direction. An axis movement unit and a Z axis movement unit (not shown) for moving the cutting unit 220 in the Z axis direction are provided. The cutting apparatus 200 also has a cleaning unit 250 that cleans the wafer 100 after cutting, and a wafer storage cassette 1 that stores the wafer 100 before and after cutting, and a cassette elevator that raises and lowers the wafer storage cassette 1 in the Z-axis direction. 260, a transport unit 270 that is a transport unit, and a control unit 280 that is a computer that controls each component.

  The transport unit 270 transports the wafer 100 between at least the chuck table 210 that holds the wafer 100 to be cut by the cutting unit 220 and the wafer storage cassette 1 placed in the cassette elevator 260. The transport unit 270 includes a temporary placement unit 271 for taking in and out the wafer 100 from the wafer storage cassette 1 and a wafer transport unit 274.

  The temporary placement unit 271 takes out one wafer 100 before cutting from the wafer storage cassette 1 placed on the cassette elevator 260 and stores the wafer 100 after cutting in the wafer storage cassette 1. The temporary placement unit 271 temporarily places the carry-in / out unit 272 for taking out the wafer 100 before cutting from the wafer storage cassette 1 and inserting the wafer 100 after cutting into the wafer storage cassette 1 and the wafer 100 before and after cutting. And a pair of rails 273.

  The carry-in / out unit 272 grips the annular frame 102 and moves in the direction away from the wafer storage cassette 1 along the Y-axis direction. Placed on. The carry-in / out unit 272 grips the annular frame 102 holding the wafer 100 temporarily placed on the rail 273 after cutting and moves in the direction approaching the wafer storage cassette 1 along the Y-axis direction. The wafer 100 is inserted into the wafer storage cassette 1. The wafer transport unit 274 transports the wafer 100 among the rail 273, the chuck table 210, and the cleaning unit 250.

  The control unit 280 controls the above-described components of the cutting apparatus 200 to cause the cutting apparatus 200 to perform a processing operation on the wafer 100. The control unit 280 is a computer. The control unit 280 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a read only memory (ROM) or a random access memory (RAM), and an input / output interface device. And a communication unit. The arithmetic processing device of the control unit 280 performs arithmetic processing in accordance with a computer program stored in the storage device, and sends a control signal for controlling the cutting device 200 to the above-mentioned of the cutting device 200 via the input / output interface device. Output to the specified component. The communication unit is communicably connected to another computer by at least one of wireless and wired. In addition, the control unit 280 is connected to a display unit (not shown) configured by a liquid crystal display device or the like that displays a processing operation state or an image and an input unit (not shown) used when an operator registers processing content information. ing. The input unit includes at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

  The cutting apparatus 200 is configured to divide the chuck table 210 and the cutting unit 220 into the X-axis moving unit, the rotation drive source, the Y-axis moving unit, and the Z-axis moving unit while supplying cutting water from the cutting unit 220 to the wafer 100. The cutting lines 221 that are rotated by the spindle 222 of the cutting unit 220 while being relatively moved are cut along the line to be divided of the wafer 100. When cutting all the planned division lines of the wafer 100, the cutting apparatus 200 cleans the wafer 100 with the cleaning unit 250 and then stores it in the wafer storage cassette 1. Further, the cutting device 200 is provided with a wireless power transmission coil 262 that transmits power to the wafer housing cassette 1 on the upper surface 261 on which the wafer housing cassette 1 of the cassette elevator 260 is placed. The wireless power transmission coil 262 can transmit power by an electromagnetic induction method, a magnetic field resonance method, or other methods.

  As shown in FIG. 3, the wafer housing cassette 1 includes a cassette body 10 and a detection mechanism 30.

  As shown in FIG. 3, the cassette body 10 includes a first side wall 11, a second side wall 12 that faces the first side wall 11, a bottom plate 13, a top plate 14, and an opening 16. The first side wall 11, the second side wall 12, the bottom plate 13, the top plate 14, and the back plate 15 are formed in a flat plate shape. When the wafer storage cassette 1 is placed on the cassette elevator 260, the first side wall 11 and the second side wall 12 face each other along the X-axis direction that is the left-right direction. The first side wall 11 and the second side wall 12 have the wafer 100 taken in and out along the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction, and in the cassette body 10 between them. The wafer 100 is accommodated.

  The bottom plate 13 connects the lower end of the first side wall 11 and the lower end of the second side wall 12, and the top plate 14 connects the upper end of the first side wall 11 and the upper end of the second side wall 12. . The top plate 14 is provided with a handle 17 so that an operator or the like of various processing apparatuses can grip and transport the wafer storage cassette 1. The bottom plate 13 and the top plate 14 are connecting portions that connect the first side wall 11 and the second side wall 12. In the first embodiment, the side walls 11 and 12, the bottom plate 13, and the top plate 14 of the cassette body 10 are connected to each other on the back side in FIG.

  A plurality of first storage shelves 21 are formed on the first side wall 11. That is, the first side wall 11 includes a plurality of first storage shelves 21. The first storage shelves 21 are formed in a convex shape from the first side wall 11 toward the second side wall 12 and are arranged at intervals in the Z-axis direction that is the vertical direction. Each first accommodation shelf 21 accommodates the wafer 100 in the cassette body 10 with the annular frame 102 holding the wafer 100 placed on the upper surface 23.

  The second side wall 12 includes a plurality of second storage shelves 22. That is, a plurality of second storage shelves 22 are formed on the second side wall 12. The second storage shelves 22 are formed so as to protrude from the second side wall 12 toward the first side wall 11 and are arranged at intervals in the Z-axis direction. In each of the second storage shelves 22, the annular frame 102 holding the wafer 100 is placed on the upper surface 23, and the wafer 100 is stored in the cassette body 10.

  The first storage shelf 21 and the second storage shelf 22 correspond to each other on a one-to-one basis. Corresponding first storage shelves 21 and second storage shelves 22 are arranged at the same height in the Z-axis direction. The corresponding first storage shelves 21 and second storage shelves 22 have the same height in the Z-axis direction when the wafer storage cassette 1 is placed on the cassette elevator 260. Each of the storage shelves 21 and 22 extends linearly along the Y-axis direction that moves when the wafer 100 is moved in and out of the wafer storage cassette 1. The first storage shelf 21 and the second storage shelf 22 corresponding to each other are hereinafter referred to as a pair of storage shelves 21 and 22. For this purpose, the cassette body 10 includes a plurality of pairs of storage shelves 21 and 22.

  The opening 16 is formed by being surrounded by the front ends of the side walls 11, 12, the bottom plate 13, and the top plate 14 in FIG. 3, and communicates the inside and outside of the cassette body 10 through which the wafer 100 can pass. It is an opening. The opening 16 allows the wafer 100 to pass in and out of the upper surface 23 (that is, the cassette body 10) of the first storage shelf 21 and the second storage shelf 22 by passing the wafer 100 inside.

  The detection mechanism 30 includes a plurality of sensors 31, a battery 32, a plurality of first lamps 33, a plurality of second lamps 34, and a control device 35 that is a control unit.

  The sensor 31 is a sensor 31 for detecting whether or not the annular frame 102 in which the wafer 100 is integrated is placed on the upper surface 23 of each of the first storage shelf 21 and the second storage shelf 22. As shown in FIG. 3, the sensor 31 is installed at a position corresponding to each stage of the first storage shelf 21 and the second storage shelf 22. That is, the sensor 31 is installed at a position corresponding to each of the storage shelves 21 and 22 to be detected as to whether or not the annular frame 102 holding the wafer 100 is placed. FIG. 3 illustrates only the sensor 31 installed on the second storage shelf 22, but the wafer storage cassette 1 according to the first embodiment is similar to the second storage shelf 22. A sensor 31 is installed at a position corresponding to the storage shelf 21. In the first embodiment, the sensor 31 detects whether or not the annular frame 102 holding the wafer 100 is placed at a position corresponding to each stage of the first storage shelf 21 and the second storage shelf 22. A central portion in the Y-axis direction of the upper surface 23 of each of the target storage shelves 21 and 22, and a central portion in the Y-axis direction of the lower surface 24 of the storage shelves 21 and 22 on the detection target storage shelves 21 and 22. However, in the present invention, the position where the sensor 31 is installed is not limited to the position of the first embodiment.

  The sensor 31 includes a light emitting element provided on one of the upper surface 23 of each of the storage shelves 21 and 22 to be detected and the lower surface 24 of the upper one of the storage shelves 21 and 22 described above, and is provided on the other side. A light emitting element and a light receiving element corresponding to the Z-axis direction are provided. The light emitting element emits light, and the light receiving element receives light from the light emitting element. The sensor 31 is connected to the control device 35, and when the light receiving element stops receiving the light from the light emitting element or when the amount of received light decreases, the upper surface 23 of each of the storage shelves 21 and 22 to be detected described above. It is detected that the annular frame 102 holding the wafer 100 is placed on the surface. Further, in the sensor 31, when the light receiving element receives the light of the light emitting element, the annular frame 102 holding the wafer 100 is not placed on the upper surface 23 of each of the storage shelves 21 and 22 to be detected. Detect. Each sensor 31 outputs a detection result to the control device 35. In the first embodiment, the sensor 31 is embedded in the upper surface 23 and the lower surface 24 of the storage shelves 21 and 22 of the cassette body 10 and is disposed flush with the upper surface 23 or below the upper surface 23, and the lower surface 24. It is arranged flush with or above the lower surface 24.

  The battery 32 is detachably attached to the cassette body 10 and supplies electric power for driving the sensors 31, the lamps 33, 34 and the control device 35 to the sensors 31, the lamps 33, 34 and the control device 35. In the first embodiment, the battery 32 is a secondary battery, and is attached to the lower surface 131 of the bottom plate 13 so as to be exposed on the lower surface 131 side of the bottom plate 13 as shown in FIG. When the wafer housing cassette 1 is placed on the upper surface 261 of the cassette elevator 260, the battery 32 can charge the power transmitted from the wireless power transmission coil 262 via the wireless power reception coil 36 shown in FIG. The wireless power receiving coil 36 is attached to the lower surface 131 of the bottom plate 13 so as to be exposed on the lower surface 131 side of the bottom plate 13. When the wafer storage cassette 1 is placed on the upper surface 261 of the cassette elevator 260, wireless power transmission is performed. The power transmitted by the wireless power transmission coil 262 can be received by the electromagnetic induction method, the magnetic field resonance method, or other methods by facing the coil 262 with a space therebetween. In the first embodiment, the battery 32 and the wireless power receiving coil 36 do not protrude below the lower surface 131.

  The plurality of first lamps 33 are installed at positions corresponding to the respective stages of the first storage shelf 21. In Embodiment 1, the 1st lamp | ramp 33 is arrange | positioned at the edge of the side which surrounds the opening part 16 of the 1st side wall 11 mutually spaced in the Z-axis direction. The first lamp 33 has a one-to-one correspondence with the first storage shelf 21. In the first embodiment, the first lamp 33 is disposed at a position aligned with the upper surface 23 of the corresponding first storage shelf 21 in the X-axis direction as a position corresponding to each stage of the first storage shelf 21. However, in the present invention, the position where the first lamp 33 is disposed is not limited to the position of the first embodiment.

  The plurality of second lamps 34 are installed at positions corresponding to the respective stages of the second storage shelf 22. In Embodiment 1, the 2nd lamp | ramp 34 is mutually arrange | positioned at the edge of the side surrounding the opening part 16 of the 2nd side wall 12 at intervals in the Z-axis direction. The second lamp 34 has a one-to-one correspondence with the second storage shelf 22. In Embodiment 1, the 2nd lamp | ramp 34 is arrange | positioned as a position corresponding to each step | level of the 2nd storage shelf 22 in the position aligned with the upper surface 23 of a corresponding 2nd storage shelf 22 in the X-axis direction. However, in the present invention, the position where the second lamp 34 is arranged is not limited to the position of the first embodiment.

  The first lamp 33 and the second lamp 34 are LEDs (Light Emitting Diodes) that can continuously emit light, blink, and extinguish with electric power supplied from the battery 32. In the present invention, the lamps 33 and 34 are It is not limited to LED. In this specification, continuous light emission is simply referred to as “light emission”, and the first lamp 33 and the second lamp 34 are collectively referred to as light emission, blinking, and light extinction. This is referred to as a lighting mode of the lamp 33 and the second lamp 34.

  As shown in FIG. 5, the control device 35 is connected to each sensor 31, each first lamp 33, and each second lamp 34 to emit light from the first lamp 33 and the second lamp 34. It controls based on the detection result which is the information from 31. FIG. As shown in FIG. 5, the control device 35 is a computer connected to each sensor 31, each first lamp 33, and second lamp 34.

  As shown in FIG. 5, the control device 35 includes a storage device 351, an arithmetic processing device 352, an input device 353 that receives an operator's operation, a display device 354 that displays various information, and a cutting device that is a processing device. 200, a control unit 280 of 200, or a personal digital assistant which is a computer carried by an operator, and a communication device 355 that is communicably connected by at least one of wireless and wired.

  The storage device 351 stores the storage shelves 21 and 22 on which the annular frame 102 in which the wafer 100 is integrated is placed on the upper surface 23 of the plurality of pairs of storage shelves 21 and 22. That is, in the first embodiment, in the wafer storage cassette 1, the annular frame 102 may be placed on the upper surfaces 23 of all pairs of storage shelves 21, 22, and the upper surfaces 23 of some pairs of storage shelves 21, 22. An annular frame 102 may be placed on the frame. In the first embodiment, when the annular frame 102 is placed on the upper surface 23 of a part of the pair of accommodation shelves 21, 22, the wafer accommodation cassette 1 is a pair of the annular frame 102 placed on the upper surface 23. The positions in the Z-axis direction of the storage shelves 21 and 22 are stored in the storage device 351 and set in advance. The storage device 351 is configured such that the wafer 100 is integrated with the upper surface 23 of the plurality of pairs of storage shelves 21 and 22 by the operator's operation of the input device 353, reception of information from the control unit 280 or reception of information from the portable information terminal. The positions in the Z-axis direction of the storage shelves 21 and 22 on which the annular frame 102 is placed are written and stored. The storage device 351 stores a computer program for operating the wafer storage cassette 1.

  The arithmetic processing unit 352 performs arithmetic processing according to a computer program stored in the storage device 351 and outputs a control signal for controlling the wafer accommodating cassette 1 to the lamps 33 and 34. Further, the arithmetic processing unit 352 confirms the charge amount of the battery 32 (so-called remaining amount of the battery 32) when the wafer storage cassette 1 is placed on the upper surface 261 of the cassette elevator 260 of the cutting apparatus 200 which is a processing apparatus. If the charge amount is below a predetermined value, information indicating that power supply is started is transmitted to the control unit 280 via the communication device 355.

  When the control unit 280 receives information indicating that power supply to the control device 35 of the wafer storage cassette 1 is started, the control unit 280 transmits power to the wireless power receiving coil 36 via the wireless power transmitting coil 262 and charges the battery 32. When the wafer storage cassette 1 is removed from the upper surface 261 of the cassette elevator 260 of the cutting apparatus 200, which is a processing apparatus, the arithmetic processing unit 352 is set to a second predetermined value (described above) in which the charge amount of the battery 32 is set in advance. When the value exceeds a predetermined value), the control unit 280 is transmitted with information indicating that power feeding is to be terminated. When the control unit 280 receives information indicating that the power supply of the control device 35 of the wafer storage cassette 1 is to be ended, the control unit 280 ends the power transmission of the wireless power transmission coil 262.

  The arithmetic processing unit 352 is configured by a microprocessor such as a CPU (central processing unit). The storage device 351 includes a memory such as a ROM (read only memory) or a RAM (random access memory). The display device 354 includes a liquid crystal display device that displays various types of information. The input device 353 includes a touch panel provided on the display device 354 and the like.

  Next, an operation of accommodating the annular frame 102 in which the wafer 100 is integrated in the wafer accommodation cassette 1 according to the first embodiment will be described. When the input device 353 receives an operation for starting the operation of housing the annular frame 102 in the wafer housing cassette 1 from the operator, the arithmetic processing device 352 of the control device 35 receives all the first lamps 33 and the second lamps 34. As shown by the black circle in FIG. Then, the operator inserts the annular frame 102 into the cassette body 10 through the opening 16 and places the annular frame 102 on the upper surface 23 of each pair of storage shelves 21 and 22.

  When the arithmetic processing unit 352 of the control device 35 detects that the annular frame 102 is placed on the upper surface 23 of the storage shelves 21 and 22 when the sensors 31 installed on the corresponding storage shelves 21 and 22 correspond to each other in FIG. As indicated by the solid line, it is determined that the annular frame 102 is placed on the upper surfaces 23 of the storage shelves 21 and 22 corresponding to each other. When the arithmetic processing unit 352 of the control device 35 determines that the annular frame 102 is placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22, the lamps corresponding to the storage shelves 21 and 22 on which the annular frame 102 is placed. 33 and 34 emit light as indicated by white circles in FIG.

  If the arithmetic processing unit 352 of the control device 35 does not detect that the sensors 31 installed on the corresponding storage shelves 21 and 22 have placed the annular frame 102 on the upper surface 23 of the storage shelves 21 and 22, FIG. As indicated by the dotted line, it is determined that the annular frame 102 is placed on the upper surface 23 of the storage shelves 21 and 22 that do not correspond to each other. That is, the arithmetic processing unit 352 of the control device 35 determines that the annular frame 102 inserted into the cassette body 10 has been placed on the upper surface 23 of the storage shelves 21 and 22 that are different in level. The arithmetic processing unit 352 of the control device 35 causes the lamps 33 and 34 corresponding to one of the storage shelves 21 and 22 on which the annular frame 102 is placed to blink as indicated by the parallel diagonal lines in FIG. The user is prompted to insert the frame 102 again. Thus, the wafer storage cassette 1 includes the plurality of first lamps 33 and the plurality of second lamps 34, and the annular frame 102 is placed on the upper surface 23 of the storage shelves 21 and 22 that do not correspond to each other. To the operator.

  Then, the operator takes out the annular frame 102 inserted in a different stage from the cassette body 10 and then inserts the annular frame 102 into the cassette body 10 again, and the upper surfaces 23 of the storage shelves 21 and 22 corresponding to the blinking lamps 33 and 34. Placed on. When the sensor 31 detects that the annular frame 102 re-inserted by the operator is placed on the upper surface 23 of the storage shelves 21 and 22 corresponding to the blinking lamps 33 and 34, the arithmetic processing unit 352 of the control device 35. The lamps 33 and 34 corresponding to the storage shelves 21 and 22 on which the annular frame 102 is placed are switched from blinking to light emission.

  When the operator places the annular frame 102 on the upper surface 23 of each pair of accommodation shelves 21 and 22 that are set to be placed, the operator inputs an operation to end the operation of accommodating the annular frame 102 in the wafer accommodation cassette 1. Input to the device 353. When the input device 353 accepts an operation for finishing the operation of housing the annular frame 102 in the wafer housing cassette 1 from the operator, the arithmetic processing device 352 of the control device 35 receives all the first lamps 33 and the second lamps 34. The light is turned off, and the operation for accommodating the annular frame 102 is completed. As described above, in the first embodiment, the lighting modes of the lamps 33 and 34 of the wafer storage cassette 1 are switched depending on whether or not the annular frame 102 is placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22. .

  The wafer storage cassette 1 according to the first embodiment is installed at a position corresponding to each of the storage shelves 21 and 22, and a sensor 31 that detects that the annular frame 102 is placed on the upper surface 23 of each of the storage shelves 21 and 22. It has. Therefore, the wafer storage cassette 1 can grasp whether or not the annular frame 102 inserted into the cassette body 10 is placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22 based on the detection result of the sensor 31. it can. As a result, the wafer storage cassette 1 can suppress the storage of the wafer 100 across the storage shelves 21 and 22 at different levels, and the carry-in / out unit 272 of the transport unit 270 of the cutting apparatus 200 which is an example of the wafer 100 and the processing apparatus. Can be prevented from being damaged.

  The wafer storage cassette 1 according to the first embodiment stores the lamps 33 and 34 whose lighting modes are switched depending on whether or not the annular frame 102 is placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22. It is installed at a position corresponding to the shelves 21 and 22. For this reason, the wafer storage cassette 1 allows the operator to easily recognize whether or not the annular frames 102 inserted into the cassette body 10 are placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22.

  Further, in the wafer storage cassette 1 according to the first embodiment, when the annular frames 102 are placed on the upper surfaces 23 of the storage shelves 21 and 22 corresponding to each other, the lamps 33 and 34 are lit, and the annular frames 102 are stored corresponding to each other. If not placed on the top surface 23 of the shelves 21 and 22, the lamps 33 and 34 blink. Therefore, the wafer storage cassette 1 includes an annular frame 102 placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22 and an annular frame not mounted on the upper surfaces 23 of the corresponding storage shelves 21 and 22. 102 can be easily recognized by the operator.

  Further, the wafer storage cassette 1 according to the first embodiment is configured such that the annular frame 102 of the plurality of pairs of storage shelves 21 and 22 is placed on the upper surface 23 by the input device 353 of the control device 35, the input unit of the cutting device 200, or the portable information terminal. The storage shelves 21 and 22 to be placed on can be set. For this reason, the wafer storage cassette 1 can accommodate the annular frame 102 in a so-called stepped-off state in which the annular frame 102 is not accommodated in all the storage shelves 21 and 22 in the cassette body 10. It can respond to flexible use.

  Further, since the wafer storage cassette 1 according to the first embodiment includes the wireless power receiving coil 36 that receives power from the wireless power transmitting coil 262 of the cutting device 200 and charges the battery 32, the operator leaves the cutting device 200. In this case, the battery 32 is appropriately charged, so that it can be used while the operator is away from the cutting apparatus 200 and performing other work.

[Embodiment 2]
A wafer accommodating cassette according to Embodiment 2 of the present invention will be described with reference to the drawings. FIG. 7 is a front view for explaining the operation of accommodating the annular frame in which the wafers of the wafer accommodation cassette according to the second embodiment are integrated. In FIG. 7, the same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  The wafer housing cassette 1-2 according to the second embodiment has the same configuration as that of the first embodiment except that the operation of housing the annular frame 102 in which the wafer 100 is integrated is different from that of the first embodiment.

  When the arithmetic processing unit 352 of the control device 35 of the wafer storage cassette 1-2 according to the second embodiment receives an operation of the input device 353 from the operator to start the operation of storing the annular frame 102 in the wafer storage cassette 1-2, The storage shelves 21 and 22 on which the annular frame 102 in which the wafer 100 is integrated with the upper surface 23 are placed from the storage device 351 are read. The arithmetic processing device 352 of the control device 35 of the wafer storage cassette 1-2 corresponds to the storage shelves 21 and 22 on which the annular frame 102 integrated with the wafer 100 is placed on the upper surface 23 read from the storage device 351. The first lamp 33 and the second lamp 34 emit light as shown by white circles in FIG. Then, the operator inserts the annular frame 102 into the cassette body 10 through the opening 16 and places the annular frame 102 on the upper surface 23 of each pair of storage shelves 21 and 22.

  The arithmetic processing unit 352 of the control device 35 of the wafer storage cassette 1-2 is configured such that the sensors 31 installed on the corresponding storage shelves 21 and 22 are mounted on the upper surface 23 of the storage shelves 21 and 22. Is detected, it is determined that the annular frame 102 is placed on the upper surfaces 23 of the storage shelves 21 and 22 corresponding to each other, as indicated by the solid line in FIG. When the arithmetic processing unit 352 of the control device 35 determines that the annular frame 102 is placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22, the lamps corresponding to the storage shelves 21 and 22 on which the annular frame 102 is placed. The lights 33 and 34 are turned off as indicated by black circles in FIG.

  The arithmetic processing unit 352 of the control device 35 of the wafer storage cassette 1-2 is configured such that the sensors 31 installed on the corresponding storage shelves 21 and 22 are mounted on the upper surface 23 of the storage shelves 21 and 22. If it is not detected, it is determined that the annular frame 102 is placed on the upper surface 23 of the storage shelves 21 and 22 that do not correspond to each other, as shown by the dotted line in FIG. 7, that is, the annular frame inserted into the cassette body 10 It is determined that the frame 102 has been placed on the upper surface 23 of the storage shelves 21 and 22 having different levels. The arithmetic processing unit 352 of the control device 35 causes the lamps 33 and 34 corresponding to the storage shelves 21 and 22 on which the annular frame 102 is placed to blink as indicated by the parallel diagonal lines in FIG. Encourage them to rework.

  Then, the operator takes out the annular frame 102 inserted in a different step from the cassette body 10, inserts it again into the cassette body 10, and places it on the upper surfaces 23 of the storage shelves 21 and 22 corresponding to each other. When the sensor 31 detects that the annular frame 102 reinserted by the operator is placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22, the arithmetic processing unit 352 of the control device 35 detects the annular frame on the upper surface 23. Lamps 33 and 34 corresponding to the storage shelves 21 and 22 on which 102 is placed are turned off as indicated by black circles in FIG. 7, and the sensor 31 has not detected that the annular frame 102 has been placed on the upper surface 23. The lamps 33 and 34 corresponding to the storage shelves 21 and 22 are caused to emit light.

  When the operator places the annular frame 102 on the upper surfaces 23 of all the pair of storage shelves 21 and 22 corresponding to the emitted lamps 33 and 34, the arithmetic processing unit 352 of the control device 35 causes all the lamps 33 and 34 to be placed. It will be turned off. Then, the operator places the annular frame 102 on the upper surfaces 23 of all the pair of accommodation shelves 21 and 22 corresponding to the emitted lamps 33 and 34, and then accommodates the annular frame 102 in the wafer accommodation cassette 1-2. An operation for ending is input to the input device 353. When the input device 353 receives an operation from the operator to end the operation of storing the annular frame 102 in the wafer storage cassette 1-2, the arithmetic processing unit 352 of the control device 35 ends the operation of storing the annular frame 102. As described above, in the second embodiment, as in the first embodiment, whether the lamps 33 and 34 of the wafer storage cassette 1-2 are mounted on the upper surfaces 23 of the storage shelves 21 and 22 corresponding to each other. The lighting mode is switched.

  The wafer storage cassette 1-2 according to the second embodiment is installed at a position corresponding to each of the storage shelves 21 and 22 and detects that the annular frame 102 is placed on the upper surface 23 of each of the storage shelves 21 and 22. A sensor 31 is provided. Therefore, the wafer storage cassette 1-2 grasps whether or not the annular frames 102 inserted into the cassette body 10 are placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22 as in the first embodiment. It is possible to suppress the possibility of damaging the wafer 100 and the carry-in / out unit 272 of the transport unit 270 of the cutting apparatus 200 which is an example of a processing apparatus.

  In addition, when the control device 35 receives an operation for starting the operation of housing the annular frame 102 in the wafer housing cassette 1-2, the wafer housing cassette 1-2 according to the second embodiment receives the annular frame 102 read from the storage device 351. The first lamp 33 and the second lamp 34 corresponding to the storage shelves 21 and 22 on which are mounted. The wafer storage cassette 1-2 turns off the lamps 33 and 34 when the annular frame 102 is placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22. For this reason, the wafer storage cassette 1-2 can suppress the annular frame 102 from being placed on the surface other than the upper surfaces 23 of the storage shelves 21 and 22 that are set to store the wafer 100.

  Further, in the wafer storage cassette 1-2 according to the second embodiment, the lamps 33 and 34 blink when the annular frame 102 is not placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22. For this reason, the wafer storage cassette 1-2 is not mounted on the annular frame 102 mounted on the upper surfaces 23 of the corresponding storage shelves 21 and 22 and the upper surface 23 of the corresponding storage shelves 21 and 22. The operator can easily recognize the annular frame 102.

  Further, as in the first embodiment, the wafer storage cassette 1-2 according to the second embodiment includes a plurality of pairs of storage shelves 21 and 22 by the input device 353 of the control device 35, the input unit of the cutting device 200, or the portable information terminal. The storage shelves 21 and 22 on which the annular frame 102 is placed on the upper surface 23 can be set. For this reason, the wafer accommodating cassette 1-2 can accommodate the annular frame 102 in a so-called stepped-out state in which the annular frame 102 is not accommodated in all the accommodating shelves 21 and 22 in the cassette body 10, as in the first embodiment. Thus, it is possible to cope with flexible use in each processing apparatus.

[Embodiment 3]
A wafer accommodation cassette according to Embodiment 3 of the present invention will be described with reference to the drawings. FIG. 8 is a perspective view illustrating a configuration example of the wafer storage cassette according to the third embodiment. FIG. 9 is an exploded perspective view of the cassette body of the wafer storage cassette shown in FIG. FIG. 10 is a perspective view showing a main part of the detection mechanism of the wafer containing cassette shown in FIG. FIG. 11 is a front view for explaining the operation of accommodating the annular frame in which the wafers of the wafer accommodation cassette shown in FIG. 8 are integrated. 8 to 11, the same parts as those of the first embodiment are denoted by the same reference numerals and the description thereof is omitted.

  The wafer housing cassette 1-3 according to the third embodiment has the same configuration as that of the first embodiment except that the detection mechanism 30 is configured to be removable from the cassette body 10.

  As shown in FIGS. 8 and 9, the plurality of first lamps 33 of the detection mechanism 30 of the wafer storage cassette 1-3 according to the third embodiment are arranged at the end on the side surrounding the opening 16 of the first side wall 11. The first rod member 18 is detachable. The plurality of second lamps 34 of the detection mechanism 30 of the wafer cassette 1-3 are provided on the second rod member 19 detachably attached to the end of the second side wall 12 surrounding the opening 16.

  The positions in the Z-axis direction of the first lamp 33 and the second lamp 34 of the wafer storage cassette 1-3 according to the third embodiment are the same positions as in the first embodiment. In the wafer storage cassette 1-3 according to the third embodiment, the lamps 33 and 34 correspond to the respective stages of the storage shelves 21 and 22 because the positions of the lamps 33 and 34 in the Z-axis direction are the same as those in the first embodiment. It is installed at the position to be. In the third embodiment, the rod members 18 and 19 are detachably attached to the side walls 11 and 12 at both ends in the Z-axis direction by screws 41 shown in FIG. 9, but in the present invention, the lamps 33 and 34 are attached to the cassette body 10. The configuration for making it detachable is not limited to that of the third embodiment.

  In the wafer housing cassette 1-3 according to the third embodiment, the back plate 15 is detachably provided on the side walls 11 and 12, the bottom plate 13, and the top plate 14 of the cassette body 10, and the sensor 31 of the detection mechanism 30, the battery 32, and the control device. 35 is provided on the back plate 15. In the third embodiment, the back plate 15 is detachably attached to the side walls 11 and 12 by screws 42 shown in FIG. 9, but in the present invention, the back plate 15, that is, the sensor 31, the battery 32, and the control device 35 are placed in the cassette. The configuration for making the main body 10 detachable is not limited to that of the third embodiment. In the wafer storage cassette 1-3 according to the third embodiment, the rod members 18 and 19 and the back plate 15 are detachable, so that the lamps 33 and 34, the sensor 31, the battery 32, and the control device 35 are attached to the cassette body 10. It is configured to be removable.

  As shown in FIGS. 8, 9, and 10, the back plate 15 is provided with a plurality of detection storage shelves 39 on the inner surface facing the opening 16. The detection storage shelves 39 are spaced from each other in the Z-axis direction and extend linearly in the X-axis direction. The detection storage shelves 39 correspond one-to-one with the pair of storage shelves 21 and 22. The detection storage shelves 39 are arranged at positions where the corresponding pair of storage shelves 21 and 22 have the same height in the Z-axis direction. That is, the detection storage shelves 39 have the same height in the Z-axis direction when the corresponding pair of storage shelves 21 and 22 and the wafer storage cassette 1-3 are placed on the cassette elevator 260. The detection storage rack 39 is mounted with the annular frame 102 mounted on the corresponding pair of storage racks 21 and 22.

  The sensor 31 of the wafer storage cassette 1-3 according to the third embodiment includes both ends in the X-axis direction of the upper surface 37 of the detection storage shelf 39 having the same height as the respective detection storage shelves 21 and 22 described above. It is provided at both ends in the X-axis direction of the lower surface 38 of the detection storage shelf 39 having the same height as the upper storage shelves 21 and 22. The sensors 31 of the wafer storage cassette 1-3 are provided at both ends of the upper surface 37 of the detection storage shelf 39 in the X-axis direction and at both ends of the lower surface 38 of the detection storage shelf 39 in the X-axis direction. It is installed at a position corresponding to each stage of the storage shelves 21 and 22.

  The sensor 31 of the wafer storage cassette 1-3 according to the third embodiment is similar to the first embodiment in that the X axis of the upper surface 37 of the detection storage shelf 39 having the same height as the respective detection target storage shelves 21 and 22 described above. Light-emitting elements provided at one of both ends in the direction and both ends in the X-axis direction of the lower surface 38 of the detection storage shelf 39 having the same height as the above-described one storage shelf 21, 22, And a provided light receiving element. The sensor 31 of the wafer storage cassette 1-3 according to the third embodiment has the same function as that of the first embodiment.

  The battery 32 and the control device 35 of the wafer storage cassette 1-3 according to the third embodiment are attached to the outer surface of the back plate 15 as shown in FIGS. 8, 9, and 10. The positions of the battery 32 and the control device 35 are not limited to the positions of the third embodiment. In addition, when the bar members 18 and 19 and the back plate 15 are attached, the wafer storage cassette 1-3 according to the third embodiment connects the wireless power receiving coil 36, the battery 32, the lamps 33 and 34, the sensor 31, and the control device 35 to each other. A power supply conductive member (not shown) that can be electrically connected to supply power between them is provided in the cassette body 10. Further, when the bar members 18 and 19 and the back plate 15 are attached, the wafer storage cassette 1-3 according to the third embodiment electrically connects the lamps 33 and 34, the sensor 31, and the control device 35 to each other. A signal conductive member (not shown) that can transmit and receive signals is provided in the cassette body 10.

  In the wafer storage cassette 1-3 according to the third embodiment, when the annular frame 102 is accommodated, the operation processing device 352 of the control device 35 starts an operation of starting the operation of accommodating the annular frame 102 in the wafer accommodation cassette 1-3. When accepted, as in the first embodiment, all the first lamps 33 and the second lamps 34 are turned off as indicated by the black circles in FIG. The arithmetic processing unit 352 of the control unit 35 of the wafer storage cassette 1-3 includes an annular frame 102 having two sensors 31 installed on the upper surface 37 of the detection storage shelf 39 having the same height as the corresponding storage shelves 21 and 22. When it is detected that the annular frame 102 is placed, it is determined that the annular frame 102 is placed on the upper surfaces 23 of the storage shelves 21 and 22 corresponding to each other, as indicated by the solid line in FIG. The lamps 33 and 34 corresponding to the storage shelves 21 and 22 emit light as shown by white circles in FIG.

  The arithmetic processing device 352 of the control device 35 of the wafer storage cassette 1-3 according to the third embodiment has two sensors installed on the upper surface 37 of the detection storage shelf 39 having the same height as the corresponding storage shelves 21 and 22. If any one of 31 does not detect that the annular frame 102 is placed, the annular frame 102 is placed on the upper surfaces 23 of the storage shelves 21 and 22 that do not correspond to each other, as indicated by the dotted lines in FIG. In the same manner as in the first embodiment, the lamps 33 and 34 corresponding to one of the storage shelves 21 and 22 on which the annular frame 102 is placed blink as shown by the parallel diagonal lines in FIG. Prompts the user to reinsert the annular frame 102.

  The arithmetic processing device 352 of the control device 35 of the wafer storage cassette 1-3 according to the third embodiment has the same height as the storage shelves 21 and 22 corresponding to the lamps 33 and 34 in which the annular frame 102 reinserted by the operator blinks. When the two sensors 31 detect that they are placed on the upper surface 37 of the storage rack 39, the lamps 33 and 34 corresponding to the storage racks 21 and 22 on which the annular frame 102 is placed are changed from flashing to light emission. Switch. When the arithmetic processing device 352 of the control device 35 of the wafer storage cassette 1-3 according to the third embodiment receives an operation to end the operation of storing the annular frame 102 in the wafer storage cassette 1-3, all the first lamps are received. 33 and the 2nd lamp | ramp 34 are extinguished, and the operation | movement which accommodates the cyclic | annular flame | frame 102 is complete | finished. Thus, in the third embodiment, the lamps 33 and 34 of the wafer storage cassette 1-3 are detected at the same height as the upper surface 23 of the storage shelves 21 and 22 to which the annular frames 102 correspond, as in the first embodiment. Although the lighting mode is switched depending on whether or not it is placed on the upper surface 37 of the storage shelf 39, in the present invention, the lighting mode may be switched as in the second embodiment.

  The wafer storage cassette 1-3 according to the third embodiment is installed at a position corresponding to each of the storage shelves 21, 22 and has an annular frame on the upper surface 37 of the detection storage shelf 39 having the same height as each of the storage shelves 21, 22. A sensor 31 is provided for detecting that 102 is placed. For this reason, the wafer storage cassette 1-3 grasps whether or not the annular frame 102 inserted into the cassette body 10 is placed on the upper surfaces 23 of the corresponding storage shelves 21 and 22 as in the third embodiment. It is possible to suppress the possibility of damaging the wafer 100 and the carry-in / out unit 272 of the transport unit 270 of the cutting apparatus 200 which is an example of a processing apparatus.

  Further, since the wafer storage cassette 1-3 according to the third embodiment is configured such that the detection mechanism 30 is detachable from the cassette body 10, the detection mechanism 30 is provided by removing the detection mechanism 30 from the cassette body 10. It can also be used for a processing apparatus that cannot handle the wafer housing cassette 1-3.

  The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the scope of the present invention. In the embodiment described above, the wafer housing cassettes 1, 1-2, 1-3 can accommodate a plurality of annular frames 102 in which the wafer 100 is integrated. However, in the present invention, the wafer storage cassette may be capable of storing a plurality of wafers 100 that are not integrated with the annular frame 102. That is, in the present invention, the wafer 100 or the annular frame 102 is placed on the upper surface 23 of the first storage shelf 21, and the wafer 100 or the annular frame 102 is placed on the upper surface 23 of the second storage shelf 22. . In the present invention, the sensor 31 detects whether the wafer 100 or the annular frame 102 is placed on the upper surface 23 of the storage shelves 21 and 22.

  In the embodiment described above, the wafer storage cassettes 1, 1-2, 1-3 include the plurality of first lamps 33 and the plurality of second lamps 34, and the storage shelves 21, The fact that the annular frame 102 is placed on the upper surface 23 of 22 is informed. However, according to the present invention, the wafer storage cassette is provided with notification means for notifying the operator by emitting sound or light, and when the annular frame 102 is placed on the upper surface 23 of the storage shelves 21 and 22 that are not supported. In addition, the notification means may emit a sound or light for notification.

1, 1-2, 1-3 Wafer housing cassette 10 Cassette body 11 First side wall 12 Second side wall 13 Bottom plate (connecting portion)
14 Top plate (connection part)
16 Opening 21 First Storage Shelf 22 Second Storage Shelf 30 Detection Mechanism 31 Sensor 32 Battery 33 First Lamp 34 Second Lamp 35 Control Device (Control Unit)
100 Wafer 101 Adhesive Tape 102 Ring Frame

Claims (3)

A wafer storage cassette capable of storing a plurality of annular frames attached to a wafer or an adhesive tape and integrated with the wafer,
A first side wall formed with a plurality of first storage shelves for accommodating a wafer;
A second side wall comprising a plurality of second storage shelves facing the first side wall and aligned with the first storage shelves;
A connecting portion connecting the first side wall and the second side wall;
A cassette main body having an opening for taking a wafer into and out of the first storage shelf and the second storage shelf;
In order to detect whether wafers are placed on the first storage shelf and the second storage shelf, they are installed at positions corresponding to the respective stages of the first storage shelf and the second storage shelf. A plurality of sensors,
A detection mechanism comprising a battery for driving the sensor;
Wafer storage cassette. The detection mechanism is:
A plurality of first lamps installed at positions corresponding to each stage of the first storage shelf;
A plurality of second lamps installed at positions corresponding to the respective steps of the second storage shelf;
A controller that controls light emission of the first lamp and the second lamp based on information from the sensor,
The wafer accommodation cassette according to claim 1. The detection mechanism is configured to be removable from the cassette body,
The wafer storage cassette according to claim 1 or 2.

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