JP2019043011A - End material separation method - Google Patents

End material separation method Download PDF

Info

Publication number
JP2019043011A
JP2019043011A JP2017167526A JP2017167526A JP2019043011A JP 2019043011 A JP2019043011 A JP 2019043011A JP 2017167526 A JP2017167526 A JP 2017167526A JP 2017167526 A JP2017167526 A JP 2017167526A JP 2019043011 A JP2019043011 A JP 2019043011A
Authority
JP
Japan
Prior art keywords
scribe line
contour
auxiliary
substrate
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017167526A
Other languages
Japanese (ja)
Inventor
智子 中川
Tomoko Nakagawa
智子 中川
亮 森
Akira Mori
亮 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2017167526A priority Critical patent/JP2019043011A/en
Priority to TW107124407A priority patent/TW201912355A/en
Priority to KR1020180083347A priority patent/KR20190024657A/en
Priority to CN201810970466.2A priority patent/CN109421164A/en
Publication of JP2019043011A publication Critical patent/JP2019043011A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/018—Holding the work by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • B28D7/046—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being of the vacuum type
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

To prevent a functional area from fragmenting when parting a product substrate including the functional area from a brittle material substrate by a scribe line for contour.SOLUTION: A scribe line 11 for contour of a closed curve and an auxiliary scribe line 12 which comes close to the scribe line 11 for contour from an outer peripheral section are formed on a surface of a brittle material substrate 10. For parting, a part of the scribe line 11 for contour which comes close to the auxiliary scribe line 12 is broken, an end material is opened from the auxiliary scribe line 12 to the outside and cracks are developed, and thereby the end material 10B is separated from the brittle material substrate 10. As a result, a product substrate 10A can be taken out without damage.SELECTED DRAWING: Figure 6

Description

本発明は閉曲線で囲まれた領域を分断し端材を分離して脆性材料基板の製品部分を取り出す端材分離方法に関するものである。   The present invention relates to a method for separating an end material from which a product portion of a brittle material substrate is taken out by dividing an area surrounded by a closed curve and separating the end material.

脆性材料基板をスクライブする場合には主として直線に沿って行われ、このスクライブラインに沿って曲げモーメントを与えることによってブレイクするようにしていた。しかし切断すべき形状が円形や楕円形状等の場合には、切断すべき形状に沿って閉曲面を形成する必要があり、その場合にスクライブラインに沿ってブレイクすることが難しいという問題点があった。   In the case of scribing a brittle material substrate, it is mainly performed along a straight line, and breaking is performed by applying a bending moment along the scribing line. However, if the shape to be cut is a circle or an oval, etc., it is necessary to form a closed surface along the shape to be cut, in which case there is a problem that it is difficult to break along the scribe line. The

特許文献１には、基板から製品基板を切り出すため円形の閉曲線で形成される輪郭用スクライブラインを形成し、更にそのスクライブラインの周囲からスクライブラインに接触することなく接線方向に向けた補助スクライブラインを形成することが示されている。   In Patent Document 1, a contoured scribe line formed by a circular closed curve is formed to cut out a product substrate from a substrate, and an auxiliary scribe line directed tangentially without contacting the scribe line from the periphery of the scribe line. It has been shown to form

又特許文献２にも輪郭用スクライブラインと外周の補助スクライブラインとを直交させることなく斜め方向に補助スクライブラインを形成することにより、輪郭用スクライブラインの内側にまで亀裂が達するのを防止するスクライブ方法が示されている。   Also in the patent document 2, a scribe line is formed in an oblique direction without making the contour scribe line and the auxiliary scribe line on the outer periphery orthogonal, thereby preventing the crack from reaching the inside of the contour scribe line. The method is shown.

特許第５１７１５２２号Patent No. 5171522 特開２０１４−２１７９８２号公報Unexamined-Japanese-Patent No. 2014-217982

このように補助スクライブラインを脆性材料基板に形成する場合に、補助スクライブラインの数が多ければ製品の取り出しが容易になるが、切断すべき輪郭用スクライブラインの内側にも亀裂が達してしまうなど、補助スクライブラインやその延長線と輪郭用スクライブラインが接続する部分では製品の損傷や品質の低下が生じることがあった。   As described above, when the auxiliary scribing line is formed on the brittle material substrate, if the number of the auxiliary scribing line is large, the product can be easily taken out, but a crack also reaches the inside of the contour scribing line to be cut, etc. The product may be damaged or the quality may be deteriorated at the portion where the auxiliary scribe line or the extension and the contour scribe line are connected.

又特許文献２に示されるように補助スクライブラインを輪郭用スクライブラインに対して傾けるように形成すると、基板への輪郭用スクライブラインの配置によっては、輪郭用スクライブラインに沿ってブレイクすることが難しい場合があった。   Also, as shown in Patent Document 2, when the auxiliary scribe line is formed to be inclined with respect to the contour scribe line, it is difficult to break along the contour scribe line depending on the arrangement of the contour scribe line on the substrate. There was a case.

本発明はこのような従来の欠点を解消するものであり、補助スクライブラインの本数を最小限として補助スクライブラインを用いて分断時に損傷なく周囲の端材を除去し、製品基板を分離できるようにすることを目的とする。   The present invention solves the above-mentioned conventional drawbacks, so that the number of auxiliary scribe lines can be minimized and auxiliary scribe lines can be used to remove surrounding scraps without damage at the time of division and to separate product substrates. The purpose is to

この課題を解決するために、本発明の端材分離方法は、脆性材料基板に形成された閉曲線からなり内側に製品基板を含む輪郭用スクライブラインと、前記輪郭用スクライブラインの外側より前記輪郭用スクライブラインに近接する位置まで形成された補助スクライブラインと、を有する脆性材料基板から製品部分を除いた端材を分離する端材分離方法であって、前記脆性材料基板を折り曲げることにより、前記補助スクライブラインに近接する前記輪郭用スクライブラインの一部をブレイクし、前記補助スクライブラインをブレイクし、端材を前記補助スクライブラインに沿って前記製品部分から離れる方向に開き、亀裂を進展させることにより前記輪郭用スクライブラインに沿って端材を分離するものである。   In order to solve this problem, in the method of separating scrap material according to the present invention, a contour scribing line comprising a closed surface formed of a closed curve formed on a brittle material substrate and including a product substrate inside, and the contour for scribing A method of separating scraps from a brittle material substrate having an auxiliary scribing line formed to a position close to a scribing line, the scraps being separated from the product portion, wherein the auxiliary material is bent by bending the brittle material substrate. By breaking a part of the contour scribing line adjacent to the scribing line, breaking the auxiliary scribing line, opening a scrap along the auxiliary scribing line in a direction away from the product portion, and developing a crack. The scraps are separated along the contour scribe line.

ここで前記輪郭用スクライブラインの一部のブレイクの前に、前記輪郭用スクライブラインの内側の前記製品基板を吸着固定するステップを更に有するようにしてもよい。   Here, the method may further include a step of suction-fixing the product substrate inside the contour scribe line before breaking a part of the contour scribe line.

ここで前記製品基板を吸着固定するステップでは、前記製品基板の形状に対応した形状を有するテーブルによって前記製品基板を吸着固定するようにしてもよい。   Here, in the step of suction-fixing the product substrate, the product substrate may be suction-fixed by a table having a shape corresponding to the shape of the product substrate.

このような特徴を有する本発明によれば、脆性材料基板に閉曲線の輪郭用スクライブラインを形成し、その周囲に補助スクライブラインを形成している。そして輪郭用スクライブラインの一部を先に分離することによって補助スクライブラインから分断を開始して閉曲線に囲まれた製品基板を取り出す際に、製品基板に割れ等が生じることなく、所望の形状に分断することができるという効果が得られる。   According to the present invention having such a feature, a scribing line for contour of a closed curve is formed on a brittle material substrate, and an auxiliary scribing line is formed on the periphery thereof. When part of the contour scribe line is separated first to start dividing from the auxiliary scribe line and the product substrate surrounded by the closed curve is taken out, the product substrate is not broken and the desired shape is obtained. The effect of being able to divide can be obtained.

図１は本発明の実施の形態による端材分離方法に用いられる脆性材料基板に形成されたスクライブラインを示す平面図である。FIG. 1 is a plan view showing a scribe line formed on a brittle material substrate used in a method of separating scrap material according to an embodiment of the present invention. 図２はスクライブラインが形成された脆性材料基板とテーブルを示す平面図である。FIG. 2 is a plan view showing a brittle material substrate on which a scribe line is formed and a table. 図３はスクライブラインが形成された脆性材料基板とテーブルを示す斜視図である。FIG. 3 is a perspective view showing a brittle material substrate on which a scribe line is formed and a table. 図４は本実施の形態による端材分離方法の第１ステップを示す斜視図である。FIG. 4 is a perspective view showing a first step of the method of separating scrap material according to the present embodiment. 図５は本実施の形態による端材分離方法の第２ステップを示す斜視図である。FIG. 5 is a perspective view showing a second step of the method of separating scrap material according to the present embodiment. 図６は本実施の形態による端材分離方法の第３ステップを示す斜視図である。FIG. 6 is a perspective view showing a third step of the method of separating scrap material according to the present embodiment. 図７は本実施の形態による端材分離方法の第４ステップを示す斜視図である。FIG. 7 is a perspective view showing a fourth step of the method of separating scrap material according to the present embodiment.

本発明の端材分離方法の第１の実施の形態について説明する。本実施の形態では図１に示すように脆性材料基板１０を１枚の単板の基板とする。図１に示すようにまず脆性材料基板１０の中央部分に、四隅を円弧状の曲線とし、それらの間に直線部分を有した機能領域を含むほぼ長方形の製品基板１０Ａを切り出すため、輪郭用の閉曲線となるスクライブライン１１を形成する。   A first embodiment of the method of separating scrap material of the present invention will be described. In this embodiment, as shown in FIG. 1, the brittle material substrate 10 is used as a single plate substrate. As shown in FIG. 1, first of all, a substantially rectangular product substrate 10A including a functional area having arc-shaped curves at its four corners in the central portion of the brittle material substrate 10 is cut out for contouring A scribe line 11 which forms a closed curve is formed.

次いで脆性材料基板１０を輪郭用スクライブライン１１の内側の製品基板１０Ａと外側の端材１０Ｂとに分断するために、周囲に１本の補助スクライブライン１２を形成する。補助スクライブライン１２は輪郭用スクライブライン１１に接することなく、しかも近接する輪郭用スクライブライン１１に対して垂直に脆性材料基板１０の外周部近傍からスクライブライン１１の１つの辺に近接する位置まで形成されている。輪郭用スクライブライン１１と補助スクライブライン１２の距離は、例えば０．５〜３ｍｍとされている。この実施の形態では補助スクライブライン１２は外周部とは接しない内切りとしているが、外周部と接する外切りであってもよい。   Next, in order to divide the brittle material substrate 10 into the product substrate 10A inside the contour scribe line 11 and the outer end material 10B, one auxiliary scribe line 12 is formed around the periphery. The auxiliary scribe line 12 is formed from the vicinity of the outer peripheral portion of the brittle material substrate 10 to a position close to one side of the scribe line 11 without contacting the contour scribe line 11 and perpendicular to the adjacent contour scribe line 11. It is done. The distance between the contour scribe line 11 and the auxiliary scribe line 12 is, for example, 0.5 to 3 mm. In this embodiment, the auxiliary scribe line 12 is an inner cut not in contact with the outer peripheral portion, but it may be an outer cut in contact with the outer peripheral portion.

次にこの脆性材料基板１０から端材を分離して製品基板を取り出す端材分離方法について図２〜図７を用いて説明する。まず図２に示すように脆性材料基板１０をテーブル２０上に保持する。ここで輪郭用スクライブライン１１に囲まれた製品基板１０Ａのみを吸着等によってテーブル２０に固定する。又補助スクライブライン１２が形成された外周部分はテーブル２０の外側となるように配置する。   Next, a method of separating an end material from the brittle material substrate 10 and taking out a product substrate will be described with reference to FIGS. First, as shown in FIG. 2, the brittle material substrate 10 is held on the table 20. Here, only the product substrate 10A surrounded by the contour scribe line 11 is fixed to the table 20 by suction or the like. Also, the outer peripheral portion where the auxiliary scribe line 12 is formed is disposed outside the table 20.

次いで図３に示すように補助スクライブライン１２が形成された部分を矢印Ａに示すようにわずかに持ち上げる。そうすればテーブル２０に吸着されていない部分が上向きに湾曲し、補助スクライブライン１２に近い輪郭用スクライブライン１１の一部分がブレイクされる。図４ではブレイクされた部分１３を太い線で示している。ブレイクされた部分１３は、補助スクライブライン１２の延長線との交点を含むように設定され、その長さは例えば５〜１５ｍｍである。   Then, as shown in FIG. 3, the portion where the auxiliary scribe line 12 is formed is slightly lifted as shown by arrow A. Then, the portion not attracted to the table 20 is curved upward, and a part of the contour scribing line 11 near the auxiliary scribing line 12 is broken. In FIG. 4, the broken part 13 is shown by a thick line. The broken portion 13 is set to include an intersection point with the extension line of the auxiliary scribe line 12, and its length is, for example, 5 to 15 mm.

更に図５に示すように補助スクライブライン１２の左右の２箇所の部分を持ち上げ、矢印Ｂ，Ｃに示すように左右を互いに逆方向、即ち谷折りの方向に力を加える。こうすれば脆性材料基板１０の外周部は補助スクライブライン１２に沿ってブレイクされることとなる。ここで補助スクライブライン１２に沿って伸展した亀裂は輪郭用のスクライブライン１１に到達するが、そのとき輪郭用スクライブライン１１の補助スクライブライン１２の延長線との交点近傍は既にブレイクされたブレイク部分１３であるため、亀裂がブレイク部分１３を越えて製品基板１０Ａの内側まで破断されてしまうことはない。   Further, as shown in FIG. 5, the left and right two portions of the auxiliary scribe line 12 are lifted, and as shown by arrows B and C, forces are applied in opposite directions to each other, that is, in the direction of valley fold. In this case, the outer peripheral portion of the brittle material substrate 10 is broken along the auxiliary scribe line 12. Here, the crack extended along the auxiliary scribe line 12 reaches the scribe line 11 for contour, but at that time, the break portion already broken in the vicinity of the point of intersection with the extension line of the auxiliary scribe line 12 of the contour scribe line 11 Since it is 13, the crack does not break beyond the break portion 13 to the inside of the product substrate 10A.

更に図６に示すように補助スクライブライン１２の左右の２箇所の部分を更に徐々に製品部分から離れるよう上方に持ち上げつつ外方に押し開いて輪郭用スクライブライン１１に沿って亀裂を進展させていく。そして輪郭用スクライブライン１１の両側より進展した亀裂がつながれば、図７に示すように周囲の端材１０Ｂを分離することができ、製品基板１０Ａを容易に取り出すことができる。   Further, as shown in FIG. 6, the left and right two portions of the auxiliary scribe line 12 are further lifted upward gradually away from the product portion and pushed outward to develop a crack along the contour scribe line 11 Go. Then, if the cracks extending from both sides of the contour scribe line 11 are connected, the peripheral scraps 10B can be separated as shown in FIG. 7, and the product substrate 10A can be easily taken out.

このようにしてスクライブしておけば、少ない本数の補助スクライブラインを形成しても輪郭に沿って分断を進めることができ、損傷なく製品基板１０Ａを分断することができる。   If scribing is performed in this manner, division can proceed along the contour even if a small number of auxiliary scribe lines are formed, and the product substrate 10A can be divided without damage.

又前述した実施の形態では製品基板の形状を四隅が円弧形状であるほぼ長方形状としているが、円や楕円といった曲線からなる任意の形状としてもよく、角部が曲線により連続した形状であれば、製品基板の内方へくぼんだ凹部を有していてもよい。テーブル２０は製品基板よりも大きな長方形状のものを用いているが、製品基板の形状に合わせた少し小さな形状のテーブルを用いて製品基板のみを吸着固定するようにしてもよい。この場合の分離の手順については前述した実施の形態と同様であるが、テーブルが端材の下にないため、外周端材を製品基板に対して押し下げることによりブレイクを行ってもよい。   In the embodiment described above, although the product substrate has a substantially rectangular shape in which the four corners are arcs, the shape of the product substrate may be any shape consisting of a curve such as a circle or an ellipse. And the recessed part inward of the product substrate may be included. The table 20 uses a rectangular shape that is larger than the product substrate, but a table with a slightly smaller shape that matches the shape of the product substrate may be used to adsorb and fix only the product substrate. The separation procedure in this case is the same as that of the embodiment described above, but since the table is not under the end material, the break may be performed by pressing the outer peripheral end material against the product substrate.

尚前述した実施の形態では補助スクライブラインは輪郭用スクライブラインに対して垂直に形成しているが、必ずしも垂直とする必要はなく、１つの輪郭用スクライブラインに対して近接する位置まで形成されたものであれば足りる。   In the embodiment described above, the auxiliary scribe line is formed perpendicular to the contour scribe line, but it is not necessary to be perpendicular, and it is formed up to a position close to one contour scribe line. It is enough if it is a thing.

本発明は閉曲線を輪郭とするスクライブラインを形成し、外周部の端材を除去する場合において損傷なく製品基板を分断することができ、基板の分断に広く利用することができる。   The present invention forms a scribe line having a closed curve as a contour, and can remove a product substrate without damage when removing the end material of the outer peripheral portion, and can be widely used for the separation of the substrate.

１０ 脆性材料基板
１０Ａ 製品基板
１０Ｂ 端材
１１ 輪郭用スクライブライン
１２ 補助スクライブライン
１３ ブレイク部分
２０ テーブル 10 brittle material substrate 10A product substrate 10B offcut 11 contour scribing line 12 auxiliary scribing line 13 break portion 20 table

Claims (3)

脆性材料基板に形成された閉曲線からなり内側に製品基板を含む輪郭用スクライブラインと、
前記輪郭用スクライブラインの外側より前記輪郭用スクライブラインに近接する位置まで形成された補助スクライブラインと、を有する脆性材料基板から製品基板を除いた端材を分離する端材分離方法であって、
前記脆性材料基板を折り曲げることにより、前記補助スクライブラインに近接する前記輪郭用スクライブラインの一部をブレイクし、
前記補助スクライブラインをブレイクし、端材を前記補助スクライブラインに沿って前記製品部分から離れるように開き、亀裂を進展させることにより前記輪郭用スクライブラインに沿って端材を分離する端材分離方法。 A contoured scribe line comprising a closed surface consisting of a closed curve formed on a brittle material substrate and including a product substrate,
And an auxiliary scribing line formed from the outside of the contour scribing line to a position close to the contour scribing line.
By bending the brittle material substrate, a part of the contour scribe line adjacent to the auxiliary scribe line is broken;
A scrap separation method for separating scraps along the contour scribing line by breaking the auxiliary scribing line, opening scraps away from the product along the auxiliary scribing line, and developing a crack. . 前記輪郭用スクライブラインの一部のブレイクの前に、前記輪郭用スクライブラインの内側の前記製品基板を吸着固定するステップを更に有する請求項１記載の端材分離方法。   The method according to claim 1, further comprising the step of suction-fixing the product substrate inside the contour scribe line before breaking of a portion of the contour scribe line. 前記製品基板を吸着固定するステップでは、前記製品基板の形状に対応した形状を有するテーブルによって前記製品基板を吸着固定する請求項２記載の端材分離方法。   3. The method according to claim 2, wherein in the step of suction-fixing the product substrate, the product substrate is suction-fixed by a table having a shape corresponding to the shape of the product substrate.
JP2017167526A 2017-08-31 2017-08-31 End material separation method Pending JP2019043011A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017167526A JP2019043011A (en) 2017-08-31 2017-08-31 End material separation method
TW107124407A TW201912355A (en) 2017-08-31 2018-07-16 End material separation method
KR1020180083347A KR20190024657A (en) 2017-08-31 2018-07-18 Method for dividing edged material
CN201810970466.2A CN109421164A (en) 2017-08-31 2018-08-23 Hold material separation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017167526A JP2019043011A (en) 2017-08-31 2017-08-31 End material separation method

Publications (1)

Publication Number Publication Date
JP2019043011A true JP2019043011A (en) 2019-03-22

Family

ID=65514714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017167526A Pending JP2019043011A (en) 2017-08-31 2017-08-31 End material separation method

Country Status (4)

Country Link
JP (1) JP2019043011A (en)
KR (1) KR20190024657A (en)
CN (1) CN109421164A (en)
TW (1) TW201912355A (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61172131U (en) * 1985-04-11 1986-10-25
JPH0519331U (en) * 1991-08-29 1993-03-09 セントラル硝子株式会社 Breaker for glass plates with closed curves
JPH0640734A (en) * 1992-07-21 1994-02-15 Kazuo Sato Method for cutting brittle sheet material
US20060081673A1 (en) * 2004-10-15 2006-04-20 Bystronic Maschinen Ag Device and method for breaking glass panes
JP2009190905A (en) * 2008-02-12 2009-08-27 Mitsuboshi Diamond Industrial Co Ltd System and method for processing brittle material annular processed goods
JP2012254927A (en) * 2012-07-27 2012-12-27 Mitsuboshi Diamond Industrial Co Ltd Substrate processing apparatus
JP2013049606A (en) * 2011-08-31 2013-03-14 Asahi Glass Co Ltd Method and device for taking out tempered glass panel
JP2014217983A (en) * 2013-05-07 2014-11-20 三星ダイヤモンド工業株式会社 Break device and break method
US20150183133A1 (en) * 2013-12-26 2015-07-02 Huping Jia Gripping mechanism, cutting device and cutting method for liquid crystal panel

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5171522A (en) 1974-12-18 1976-06-21 Kawasaki Steel Co Sendan oyobi mageteikoseio sonaeta shinshukutsugite
JP5171522B2 (en) * 2008-09-30 2013-03-27 三星ダイヤモンド工業株式会社 Method for scribing a brittle material substrate
JP2014217982A (en) 2013-05-07 2014-11-20 三星ダイヤモンド工業株式会社 Scribe device and scribe method
KR20160022798A (en) * 2013-06-27 2016-03-02 니폰 덴키 가라스 가부시키가이샤 Method for scribing tempered glass sheet
FR3031102B1 (en) * 2014-12-31 2017-01-27 Saint Gobain PROCESS FOR RIPPING AN INNER SHAPE IN A GLASS SHEET
CN205387544U (en) * 2016-03-17 2016-07-20 日本电气硝子株式会社 Device for cutting sheet glass

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61172131U (en) * 1985-04-11 1986-10-25
JPH0519331U (en) * 1991-08-29 1993-03-09 セントラル硝子株式会社 Breaker for glass plates with closed curves
JPH0640734A (en) * 1992-07-21 1994-02-15 Kazuo Sato Method for cutting brittle sheet material
US20060081673A1 (en) * 2004-10-15 2006-04-20 Bystronic Maschinen Ag Device and method for breaking glass panes
JP2009190905A (en) * 2008-02-12 2009-08-27 Mitsuboshi Diamond Industrial Co Ltd System and method for processing brittle material annular processed goods
JP2013049606A (en) * 2011-08-31 2013-03-14 Asahi Glass Co Ltd Method and device for taking out tempered glass panel
JP2012254927A (en) * 2012-07-27 2012-12-27 Mitsuboshi Diamond Industrial Co Ltd Substrate processing apparatus
JP2014217983A (en) * 2013-05-07 2014-11-20 三星ダイヤモンド工業株式会社 Break device and break method
US20150183133A1 (en) * 2013-12-26 2015-07-02 Huping Jia Gripping mechanism, cutting device and cutting method for liquid crystal panel

Also Published As

Publication number Publication date
TW201912355A (en) 2019-04-01
KR20190024657A (en) 2019-03-08
CN109421164A (en) 2019-03-05

Similar Documents

Publication Publication Date Title
JP5171522B2 (en) Method for scribing a brittle material substrate
WO2018025619A1 (en) Blade die, film punching method using blade die, and punching device equipped with blade die
US8640518B1 (en) Burring apparatus with scrap removing capability
WO2015098598A1 (en) Method for processing brittle plate, and device for processing brittle plate
KR102355278B1 (en) Method for manufacturing a glass plate
JP2019043011A (en) End material separation method
JP2019043010A (en) End material separation method
TW201622041A (en) Substrate parting method and parting apparatus
TWI478881B (en) Method of manufacturing a touch panel
JP2006182644A5 (en) Glass plate
US20160280578A1 (en) Brittle plate processing method and brittle plate processing apparatus
JP5416381B2 (en) Method for dividing brittle material substrate
JP2015174804A (en) End material part removing method
EP3288079A1 (en) Array substrate and preparation method therefor, display panel, and display device
TWI588002B (en) Splitting jig and cutting method for brittle substrate
JP2021031357A (en) Dividing method and dividing device
TWI389857B (en) And a method of forming a through hole in a brittle material substrate
TWI403399B (en) Method for cutting prepreg
JP6175156B2 (en) Substrate cutting device
JPH0538936U (en) Assembly board
JP2015174203A (en) Scribe method and scribe device
TW201332730A (en) Cutting blade for flexible material
JP4442964B2 (en) Ceramic substrate for electronic parts
JP3082836U (en) CD with safety removal structure
TWM569338U (en) Glass cutter wheel

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200716

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20210525

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20210601

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20211207