JP2019041482A - Power conversion equipment - Google Patents

Abstract

To provide power conversion equipment which is easy to improve heat dissipation of a capacitor module.SOLUTION: Power conversion equipment has a capacitor module 2 and an equipment case 3. The capacitor module 2 has: a capacitor element 21; and sealing resin 22 which seals the capacitor element 21. The equipment case 3 accommodates a power conversion circuit. A principal plane of the capacitor module 2 constitutes a supported principal plane 24 which is supported by the equipment case 3. The supported principal plane 24 is constituted of a front face of the sealing resin 22.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a power conversion device.

  Patent Document 1 discloses a power conversion device including a capacitor module. The capacitor module described in Patent Document 1 is formed by resin molding a capacitor element in a capacitor case. On the bottom wall of the capacitor case, a fixing hole for fixing the capacitor module is formed in the device case that houses the power conversion circuit. The capacitor module is fixed to the device case in the fixing hole of the capacitor case.

JP 2007-143272 A

  However, in the power conversion device described in Patent Document 1, the capacitor case is interposed between the capacitor element and the device case, and it is difficult to improve heat dissipation from the capacitor element to the capacitor case.

  This invention is made | formed in view of this subject, and it is going to provide the power converter device which is easy to improve the heat dissipation of a capacitor | condenser module.

An aspect of the present invention includes a capacitor element (21) and a capacitor module (2) having a sealing resin (22) for sealing the capacitor element;
A device case (3) for accommodating the power conversion circuit (11),
The main surface of the capacitor module constitutes a supported main surface (24) supported by the device case,
The supported main surface is in the power conversion device (1) configured by the surface of the sealing resin.

  In the power conversion device, the capacitor module is supported by the device case on the supported main surface constituted by the surface of the sealing resin. Therefore, the heat of the capacitor element is radiated directly from the surface of the sealing resin to the device case. Thereby, it is easy to improve the heat dissipation of the capacitor module.

  The supported main surface is constituted by the main surface of the capacitor module. Therefore, the heat of the capacitor module can be efficiently radiated from the supported main surface to the device case.

As mentioned above, according to the said aspect, the power converter device which is easy to improve the heat dissipation of a capacitor module can be provided.
In addition, the code | symbol in the parenthesis described in the means to solve a claim and a subject shows the correspondence with the specific means as described in embodiment mentioned later, and limits the technical scope of this invention. It is not a thing.

The perspective view which shows the case cover part and capacitor | condenser module of an apparatus case in Embodiment 1. FIG. Sectional drawing which shows the case cover part in Embodiment 1, a capacitor module, a discharge resistance board | substrate, a reactor, a semiconductor module, and a cooler. FIG. 3 is a perspective view of the capacitor module and the discharge resistance substrate in the first embodiment. FIG. 3 is a bottom view of the capacitor module according to the first embodiment. FIG. 3 is a perspective view of the capacitor module in Embodiment 1 from which a sealing resin is omitted. The side view of the capacitor module which omitted the sealing resin in Embodiment 1. FIG. 2 is a circuit diagram showing a power conversion circuit in the first embodiment.

(Embodiment 1)
An embodiment of a power conversion device will be described with reference to FIGS.
The power converter 1 of this embodiment has the capacitor | condenser module 2 and the apparatus case 3 as shown in FIG. 1, FIG. As shown in FIGS. 2 and 4, the capacitor module 2 includes a capacitor element 21 and a sealing resin 22 that seals the capacitor element 21. The device case 3 accommodates the power conversion circuit 11 (see FIG. 7). The main surface of the capacitor module 2 constitutes a supported main surface 24 supported by the device case 3. The supported main surface 24 is constituted by the surface of the sealing resin 22. Hereinafter, the power conversion device 1 of the present embodiment will be described in detail.

Hereinafter, the longitudinal direction of the capacitor module 2 is referred to as the X direction, and the short direction is referred to as the Y direction. A direction orthogonal to both the X direction and the Y direction is referred to as a Z direction.
One side in the X direction is referred to as the X1 side, and the other side is referred to as the X2 side. One side in the Y direction is referred to as the Y1 side, and the other side is referred to as the Y2 side. One side in the Z direction is referred to as the Z1 side, and the other side is referred to as the Z2 side.

  The power conversion device 1 is a vehicle-mounted power conversion device 1 mounted on a vehicle such as an electric vehicle or a hybrid vehicle. As shown in FIG. 7, the power conversion device 1 is arranged between the DC power supply 12 and an AC load (not shown). The power converter 1 removes noise included in the DC voltage of the DC power supply 12 by the filter capacitor 13 and boosts the DC voltage by the boost converter 14. Then, the boosted voltage is smoothed by the smoothing capacitor 15, and the smoothed DC voltage is converted to an AC voltage by the switching circuit 16. The AC voltage thus obtained is applied to an AC load.

  The capacitor module 2 integrally constitutes both the smoothing capacitor 15 and the filter capacitor 13. As shown in FIG. 4, the capacitor module 2 includes a plurality of capacitor elements 21. Each capacitor element 21 is a film capacitor formed by winding a metallized film. The plurality of capacitor elements 21 are arranged in such a posture that the directions in which the winding axes extend are the same as each other.

  The plurality of capacitor elements 21 include a smoothing capacitor element 211 that is the capacitor element 21 that constitutes the smoothing capacitor 15, and a filter capacitor element 212 that is the capacitor element 21 that constitutes the filter capacitor 13. The plurality of smoothing capacitor elements 211 are connected in parallel to each other. Similarly, the plurality of filter capacitor elements 212 are connected in parallel to each other.

  The smoothing capacitor element 211 has a substantially elliptical shape that is long in the X direction when viewed from the Z direction. The smoothing capacitor elements 211 are arranged side by side in a total of nine rows, three rows in the X direction and three rows in the Y direction.

  The filter capacitor element 212 has a substantially elliptical shape that is long in the Y direction when viewed from the Z direction. Two filter capacitor elements 212 are arranged side by side in the Y direction. The two filter capacitor elements 212 are arranged on the X1 side in the nine smoothing capacitor elements 211.

  As shown in FIG. 2, the capacitor element 21 includes a positive electrode surface 25P and a negative electrode surface 25N. The negative electrode surface 25N is arranged to face the supported main surface 24 side of the capacitor module 2. In the present embodiment, the negative electrode surface 25N is parallel to the supported main surface 24.

  As shown in FIGS. 5 and 6, the capacitor module 2 includes a connection member 26 for connecting the capacitor element 21 to other components in the device case 3. The connecting member 26 includes a filter bus bar 261 connected to the positive electrode surface 25P of the filter capacitor element 212, a smoothing bus bar 262 connected to the positive electrode surface 25P of the smoothing capacitor element 211, and a negative side of the filter capacitor element 212. A negative electrode bus bar 263 connected to the electrode surface 25N and the negative electrode surface 25N of the smoothing capacitor element 211. In addition, illustration of the connection member 26 is abbreviate | omitted in FIG.

  As shown in FIG. 6, the filter bus bar 261 has a filter facing portion 261a facing the positive electrode surface 25P of the filter capacitor element 212 in the Z direction. Further, the filter bus bar 261 has a parallel portion 261 b formed in parallel with a surface continuously formed with the supported main surface 24 on the surface of the capacitor module 2. In the present embodiment, the parallel portion 261b is formed in parallel with the surface of the capacitor module 2 on the X1 side. The parallel part 261b is long in the X direction. The parallel portion 261b is formed in substantially the entire region from one end to the other end of the plurality of capacitor elements 21 in the X direction.

  As shown in FIGS. 5 and 6, the filter bus bar 261 includes a positive side DDC connection portion 261c, a positive side boost converter connection portion 261d, and a positive side battery connection portion 261e extending from the parallel portion 261b. The positive side DDC connecting portion 261c is for connecting the filter bus bar 261 to a DC-DC converter (not shown). The positive side boost converter connection 261 d is for connecting the filter bus bar 261 to the boost converter 14. The positive battery connection part 261e is for connecting the filter bus bar 261 to the battery. The positive side DDC connection part 261c extends from one end of the parallel part 261b, and the positive side battery connection part 261e extends from the other end of the parallel part 261b. And the positive side boost converter connection part 261d is extended from the approximate center part of the parallel part 261b in the X direction.

  As shown in FIG. 6, the smoothing bus bar 262 includes a smoothing facing part 262a facing the positive electrode surface 25P of the smoothing capacitor element 211 in the Z direction, a smoothing facing part 262a, and a positive side for connecting to the inverter. And an inverter connection portion 262b. The positive inverter connection portion 262b is formed on the Y1 side of the smooth facing portion 262a.

  As shown in FIGS. 5 and 6, the negative electrode bus bar 263 has a negative-side facing portion 263 a that faces the negative-side electrode surface 25 </ b> N of the plurality of capacitor elements 21 in the Z direction. Moreover, from the negative side opposing part 263a of the negative electrode bus bar 263, the negative side DDC connection part 263b for connecting the negative electrode bus bar 263 to the DC-DC converter, and the negative side inverter connection part for connecting the negative electrode bus bar 263 to the inverter. 263c and a negative battery connecting portion 263d for connecting negative bus bar 263 to the battery. The negative side DDC connection portion 263b is disposed adjacent to the positive side DDC connection portion 261c in the X direction. In the present embodiment, a part of the negative inverter connection part 263c and a part of the positive inverter connection part 262b are opposed to each other in the Z direction via the insulating sheet 17 in order to reduce the inductance. It is arranged. The positive side battery connection portion 261e extends from the X1 side end portion and the Y1 side end portion of the negative side facing portion 263a.

  As shown in FIG. 4, the plurality of capacitor elements 21 and the connection member 26 connected thereto are embedded inside the sealing resin 22. The sealing resin 22 encloses the smoothing capacitor element 211 and the filter capacitor element 212 together. In addition, the terminal part which connects the capacitor module 2 and other components in the connection member 26 is exposed from the sealing resin 22.

  As shown in FIGS. 3 and 4, the sealing resin 22 has a substantially rectangular parallelepiped shape that is long in the X direction and short in the Y direction. In the present embodiment, the capacitor module 2 does not have a dedicated case, and almost the entire surface of the sealing resin 22 constitutes the entire surface of the capacitor module 2. The capacitor module 2 has a main surface on each of the Z1 side surface and the Z2 side surface. The main surface facing the Z2 side of the sealing resin 22 is the supported main surface 24. The main surface of the capacitor module 2 is a surface facing the thickness direction of the capacitor module 2. In the present embodiment, the main surface of the capacitor module 2 has a larger area than the side surface of the capacitor module.

  As shown in FIG. 2, a convex portion 241 is formed on one side of the device case 3 and the supported main surface 24 of the capacitor module 2, and an engaging portion 311 is formed on the other side. In the present embodiment, an engagement portion 311 is formed on the device case 3, and a convex portion 241 is formed on the supported main surface 24 of the capacitor module 2. The convex part 241 is formed in the pin shape which protrudes in the Z2 side in the to-be-supported main surface 24. FIG. The engaging portion 311 is a hole penetrating in the Z direction in the device case 3. The capacitor module 2 is supported by the device case 3 by the convex portion 241 and the engaging portion 311 being engaged by the convex portion 241 being inserted and fitted into the engaging portion 311. The engaging portion 311 of the device case 3 also serves as a positioning portion that positions the capacitor module 2 with respect to the device case 3. In the present embodiment, the device case 3 includes a case main body (not shown) having an opening on the Z2 side, and a case lid 31 that closes the opening of the case main body. It is supported by the lid part 31.

  As shown in FIG. 4, when viewed from the normal direction (that is, the Z direction) of the supported main surface 24, the supported main surface 24 has a polygonal shape, and the convex portion 241 has a polygonal shape. It is formed in the area | region of the both ends of the longest diagonal (henceforth longest diagonal L) of the to-be-supported main surface 24, respectively. Accordingly, the capacitor module 2 is supported by the device case 3 in the regions at both ends of the longest diagonal line L. In the present embodiment, when viewed from the Z direction, the convex portion 241 does not need to be formed at a position overlapping the longest diagonal line L, but may be formed near both ends of the longest diagonal line L.

  As shown in FIG. 4, the capacitor module 2 is supported by the device case 3 at a position shifted from the capacitor element 21 when viewed from the normal direction of the supported main surface 24. That is, the convex portion 241 is formed at a position that does not overlap the capacitor element 21 in the Z direction.

  The discharge resistance substrate 4 is disposed on a surface opposite to the supported main surface 24 of the capacitor module 2 (hereinafter referred to as an opposite side surface 27 for convenience). The discharge resistance substrate 4 is formed with a through hole, and is fixed to the capacitor module 2 by inserting a protruding portion 271 formed on the opposite side surface 27 into the through hole. In addition, in FIG. 1, illustration of a protrusion part is abbreviate | omitted.

  As shown in FIG. 2, the capacitor module 2 is arranged such that the opposite side surface 27 faces other components in the device case 3. In the present embodiment, the opposite side surface 27 faces the reactor 5, the semiconductor module 6, and the cooler 7 in the Z direction. The reactor 5 constitutes a step-up converter 14, the semiconductor module 6 constitutes a switching circuit 16, and the cooler 7 cools the semiconductor module 6.

Next, the effect of this embodiment is demonstrated.
In the power conversion device 1, the capacitor module 2 is supported by the device case 3 on a supported main surface 24 constituted by the surface of the sealing resin 22. Therefore, the heat of the capacitor element 21 is radiated directly from the surface of the sealing resin 22 to the device case 3. Thereby, it is easy to improve the heat dissipation of the capacitor module 2.

  The supported main surface 24 is constituted by the main surface of the capacitor module 2. Therefore, the heat of the capacitor module 2 can be efficiently radiated from the supported main surface 24 to the device case 3.

  The capacitor module 2 is supported by the device case 3 at a position shifted from the capacitor element 21 when viewed from the normal direction of the supported main surface 24. Therefore, it is possible to suppress the vibration from the device case 3 from being transmitted directly to the capacitor element 21 in the capacitor module 2, and to improve the vibration resistance of the capacitor element 21.

  Further, the capacitor module 2 is supported by the device case 3 in the regions at both ends of the longest diagonal line L of the supported main surface 24. Therefore, even if the number of supporting portions of the capacitor module 2 with respect to the device case 3 is reduced, it is easily fixed firmly to the device case 3. Thereby, the vibration resistance of the capacitor element 21 can be easily improved.

  Further, the device case 3 has a positioning portion (in this embodiment, an engaging portion 311) for positioning the capacitor module 2 with respect to the device case 3. Therefore, it is easy to improve the assembling property of the capacitor module 2 to the device case 3.

  Further, the negative electrode surface 25N of the capacitor element 21 is arranged to face the supported main surface 24 side. Therefore, it is easy to efficiently dissipate the heat of the capacitor element 21 to the device case 3 through the negative electrode surface 25N and the supported main surface 24.

  Further, the connection member 26 has a parallel portion 261 b formed in parallel with a surface continuously formed with the supported main surface 24 on the surface of the capacitor module 2. Therefore, the heat of the capacitor element 21 can be efficiently radiated from the surface continuously formed with the supported main surface 24, that is, other than the supported main surface 24 via the parallel portion 261b.

  Further, the capacitor module 2 is supported by the device case 3 when the convex portion 241 of the capacitor module 2 and the engaging portion 311 of the device case 3 are engaged. Therefore, since the capacitor module 2 can be supported by the device case 3 by engaging the convex portion 241 and the engaging portion 311, it is easy to improve the productivity of the power conversion device 1.

  Further, the capacitor module 2 is arranged so that the surface opposite to the supported main surface 24 faces other components in the device case 3. Therefore, it is easy to reduce the size of the entire power conversion device 1. Further, since the heat of the capacitor module 2 is mainly dissipated from the supported main surface 24 to the device case 3, the surface opposite to the supported main surface 24 of the capacitor module 2 is connected to other components in the device case 3. Even if it arrange | positions so that it may oppose, it is hard to give a thermal influence from the capacitor module 2 to another component.

  As described above, according to the present embodiment, it is possible to provide a power conversion device that can easily improve the heat dissipation of the capacitor module.

  The present invention is not limited to the embodiments described above, and can be applied to various embodiments without departing from the scope of the invention. For example, the supported main surface may be supported by the device case by placing an adhesive between the supported main surface and the wall surface of the device case.

DESCRIPTION OF SYMBOLS 1 Power converter 11 Power converter circuit 2 Capacitor module 21 Capacitor element 22 Sealing resin 24 Supported main surface 3 Device case

Claims (8)

A capacitor module (2) having a capacitor element (21) and a sealing resin (22) for sealing the capacitor element;
A device case (3) for accommodating the power conversion circuit (11),
The main surface of the capacitor module constitutes a supported main surface (24) supported by the device case,
The said to-be-supported main surface is a power converter device (1) comprised by the surface of the said sealing resin.   2. The power conversion device according to claim 1, wherein the capacitor module is supported by the device case at a position shifted from the capacitor element when viewed from the normal direction of the supported main surface.   When viewed from the normal direction of the supported main surface, the supported main surface has a polygonal shape, and the capacitor module has regions at both ends of the longest diagonal line (L) of the polygonal-shaped supported main surface. The power conversion device according to claim 1, wherein the power conversion device is supported by the device case.   The said device case is a power converter device as described in any one of Claims 1-3 which has a positioning part which positions the said capacitor module with respect to the said device case.   The capacitor element includes a positive electrode surface (25P) and a negative electrode surface (25N), and the positive electrode surface or the negative electrode surface is arranged to face the supported main surface. The power converter device as described in any one of Claims 1-4.   The capacitor module further includes a connection member (26) for connecting the capacitor element to other components in the device case, and the connection member is continuous with the supported main surface on the surface of the capacitor module. The power converter device as described in any one of Claims 1-5 which has a parallel part (261b) formed in parallel with the surface formed automatically.   A convex portion (241) is formed on one of the device case and the supported main surface of the capacitor module, and an engaging portion (311) is formed on the other. The capacitor module includes the convex portion and the convex portion. The power converter according to any one of claims 1 to 6, wherein the power converter is supported by the device case by engaging with an engaging portion.   8. The capacitor module according to claim 1, wherein the capacitor module is disposed such that a surface (27) opposite to the supported main surface faces other components (5, 6, 7) in the device case. The power converter device as described in any one.

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