JP2019004074A - Imprint device and article manufacturing method - Google Patents

Abstract

To provide a technique advantageous for removing mist while arranging an imprint material at the target position of a board.SOLUTION: An imprint device includes a board drive mechanism for driving a board with respect to first and second axes orthogonal to each other, a mold holding mechanism, a dispenser having a discharge opening for discharging an imprint material so as to be arranged on the board, while the board is being driven in a direction parallel with a first axis by means of the board drive mechanism, and first and second suction ports arranged while spaced apart from each other in a direction parallel with the first axis so that the discharge opening is sandwiched, and sucking gas. The first suction port is arranged on the side of the first direction parallel with the first axis with reference to the second suction port. In a state where the imprint material is discharged from the dispenser while the board is driven in the first direction by means of the board drive mechanism, the suction amount of gas by the first suction port is larger than the suction amount of gas by the second suction port.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an imprint apparatus and an article manufacturing method.

  The imprint apparatus forms a pattern made of a cured product of the imprint material on the substrate by bringing the mold into contact with the imprint material arranged on the substrate and curing the imprint material. As a method of disposing the imprint material on the substrate, there is a method of discharging the imprint material from the discharge port while moving the substrate so that the imprint material is disposed at a target position on the substrate. When the imprint material is discharged from the discharge port, minute droplets called mist can be generated. Mist can solidify into particles.

  Patent Document 1 describes an imprint apparatus including an exhaust unit that removes volatile components and mist from resin droplets discharged from an inkjet head.

Japanese Patent Laid-Open No. 2006-76695

  Inside the imprint apparatus, there can be various flows such as a gas flow from the outlet of the temperature adjusting device and a gas flow generated by driving the substrate by the substrate driving mechanism. When an exhaust part as described in Patent Document 1 is provided, a flow can also be generated by suction of gas by the exhaust part. In the configuration in which the imprint material is disposed on the substrate by discharging the imprint material from the dispenser toward the target position of the substrate, the trajectory of the imprint material discharged from the dispenser can be changed by the gas flow. Accordingly, the position of the imprint material arranged on the substrate can be shifted from the target position. If the amount of this shift is constant, the imprint material can be arranged at the target position on the substrate by correcting the timing of discharging the imprint material from the dispenser. However, if there is a spatial and / or temporal non-uniformity in the gas flow, it is difficult to place the imprint material at the target position on the substrate.

  Therefore, when the structure for sucking mist is mounted on the imprint apparatus, the gas flow generated by driving the substrate by the substrate driving mechanism and the gas flow caused by sucking the mist should be considered.

  An object of the present invention is to provide an advantageous technique for removing mist while placing an imprint material at a target position on a substrate.

  One aspect of the present invention relates to an imprint apparatus that forms a pattern made of a cured product of an imprint material on a substrate using a mold, and the imprint apparatus includes a first axis that is orthogonal to each other and the substrate. A substrate driving mechanism for driving the second axis; a mold holding mechanism for holding the mold; and the substrate driving mechanism driving the substrate in a direction parallel to the first axis. A dispenser having a discharge port for discharging the imprint material so that the imprint material is disposed, and a dispenser that is spaced apart from each other in a direction parallel to the first axis so as to sandwich the discharge port, and sucks the gas. A first suction port and a second suction port, wherein the first suction port is disposed on a side in a first direction parallel to the first axis with respect to the second suction port, and the substrate driving mechanism Therefore, in a state where the substrate is imprinted material is discharged from the dispenser while being driven in the first direction, the suction amount of gas by the first suction port is larger than the suction amount of gas by the second suction port.

  According to the present invention, an advantageous technique is provided for removing mist while placing an imprint material at a target position on a substrate.

The figure which shows the structure of the imprint apparatus of one Embodiment of this invention. The figure which illustrates the structure of the drive of a board | substrate by the board | substrate drive mechanism at the time of arrange | positioning the imprint material with respect to a board | substrate, and the discharge port of a dispenser. The figure which illustrates arrangement | positioning of the imprint material to the board | substrate by a dispenser, and the suction of the gas by a 1st suction port and a 2nd suction port. The figure which illustrates attraction | suction of the gas by the 1st suction port and 2nd suction port in a maintenance mode. The figure which illustrates an article manufacturing method.

  Hereinafter, the present invention will be described through exemplary embodiments thereof with reference to the accompanying drawings.

  FIG. 1 shows the configuration of an imprint apparatus IMP according to one embodiment of the present invention. The imprint apparatus IMP forms a pattern made of a cured product of the imprint material IM on the substrate S using the mold M. As the imprint material, a curable composition (which may be referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, or the like can be used. The electromagnetic wave can be, for example, light having a wavelength selected from a range of 10 nm to 1 mm, for example, infrared rays, visible rays, ultraviolet rays, and the like.

  The curable composition may be a composition that is cured by light irradiation or by heating. Among these, the photocurable composition that is cured by light irradiation contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component. The imprint material can be disposed on the substrate in the form of droplets or in the form of islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 ° C.) can be, for example, 1 mPa · s or more and 100 mPa · s or less.

  As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin, or the like can be used. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

  In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which a direction parallel to the surface of the substrate S is an XY plane. The directions parallel to the X, Y, and Z axes in the XYZ coordinate system are defined as ± X direction, ± Y direction, and ± Z direction, respectively. The + X direction and the −X direction are opposite directions, the + Y direction and the −Y direction are opposite directions, and the + Z direction and the −Z direction are opposite directions. Further, in this specification, the rotation around the X axis, the rotation around the Y axis, and the rotation around the Z axis are θX, θY, and θZ, respectively. The control or drive related to the X axis, Y axis, and Z axis means control or drive related to the direction parallel to the X axis, the direction parallel to the Y axis, and the direction parallel to the Z axis, respectively. The control or drive related to the θX axis, θY axis, and θZ axis relates to rotation around an axis parallel to the X axis, rotation around an axis parallel to the Y axis, and rotation around an axis parallel to the Z axis. Means control or drive. The position is information that can be specified based on the coordinates of the X axis, the Y axis, and the Z axis, and the posture is information that can be specified by the values of the θX axis, the θY axis, and the θZ axis. Positioning means controlling position and / or attitude. The alignment may include control of the position and / or attitude of at least one of the substrate and the mold.

  The imprint apparatus IMP includes a substrate driving mechanism 10 that drives the substrate S with respect to at least the X axis (first axis) and the Y axis (second axis) orthogonal to each other, and a mold holding mechanism 30 that holds the mold M. Yes. The substrate driving mechanism 10 includes a substrate holding unit 11 that holds the substrate S, and a driving mechanism 12 that drives the substrate S at least about the X axis and the Y axis by driving the substrate holding unit 11 at least about the X axis and the Y axis. May be included. The drive mechanism 12 may further include a mechanism that drives the substrate holding unit 11 with respect to at least one of the θZ axis, the Z axis, the θX axis, and the θY axis. The mold holding mechanism 30 moves the mold M into a plurality of axes (for example, three axes of Z axis, θX axis, θY axis, preferably six axes of X axis, Y axis, Z axis, θX axis, θY axis, θZ axis). ). In this case, the mold holding mechanism 30 can be understood as a mold driving mechanism.

  The substrate driving mechanism 10 and the mold holding mechanism 30 may constitute a relative driving mechanism 60 that drives at least one of the substrate S and the mold M so that the relative position between the substrate S and the mold M is adjusted. The adjustment of the relative position by the relative drive mechanism 60 includes a drive for contact of the mold M with the imprint material IM on the substrate S and separation of the mold M from a cured product of the imprint material.

  The imprint apparatus IMP is provided with a dispenser (arrangement mechanism) 20 for arranging the implement material IM on the substrate S. The dispenser 20 includes a discharge port that discharges the imprint material IM. In a state where the substrate S is driven in the direction parallel to the X axis (± X direction) by the substrate driving mechanism 10 so that the imprint material IM is disposed at the target position of the substrate S, the dispenser 20 is discharged from the discharge port. Imprint material IM is discharged.

  The imprint apparatus IMP further includes a first suction port 51 and a second suction port 52 for sucking gas. The first suction port 51 and the second suction port 52 may be provided in a structure integrated with the dispenser 20, or may be provided in a structure separate from the dispenser 20. The first suction port 51 and the second suction port 52 are spaced apart from each other in a direction parallel to the X axis so as to sandwich the dispenser 20 (discharge port). The first suction port 51 is arranged on the first direction (−X direction) side parallel to the X axis with respect to the second suction port 52. The first suction port 51 is connected to a low pressure source (for example, a suction pump, a vacuum source, etc.) 50 via a first flow rate controller 53. The second suction port 52 is connected to the low pressure source 50 via the second flow rate controller 54.

  The imprint apparatus IMP may include a receiving unit 19 that receives the imprint material IM discharged from the dispenser 20. The receiving part 19 receives the imprint material IM discharged from the dispenser 20 in a maintenance mode for maintaining the characteristics of the dispenser 20. For example, the receiving unit 19 may be provided on the substrate holding unit 11, or may be mounted on the substrate holding unit 11 in the maintenance mode, or conveyed by a conveyance mechanism (not shown) immediately below the dispenser 20 in the maintenance mode. May be.

  The imprint apparatus IMP includes a curing unit 40 that cures the imprint material IM by irradiating the imprint material IM between the substrate S and the mold M with energy for curing (for example, light such as ultraviolet light). . Further, the imprint apparatus IMP includes a substrate driving mechanism 10, a mold holding mechanism 30, a dispenser 20, a first flow rate controller 53, a second flow rate controller 54, and a control unit 70 that controls the curing unit 40. The control unit 70 is, for example, PLD (abbreviation of Programmable Logic Device) such as FPGA (abbreviation of Field Programmable Gate Array), or ASIC (abbreviation of Application Specific Integrated Circuit) or an ASIC (abbreviation of Generalized Integrated Circuit). It can be constituted by a computer or a combination of all or part of them.

  Here, a pattern forming operation by the imprint apparatus IMP will be described. First, the imprint material IM is disposed by the dispenser 20 in the shot area to be patterned among the plurality of shot areas of the substrate S. In this operation, the imprint material is discharged from the dispenser 20 while driving the substrate S by the substrate driving mechanism 10 so that the imprint material is arranged at a position specified by the map indicating the arrangement of the imprint material in the shot area. Made by doing. This map is also called a drop recipe.

  Next, the shot area of the pattern formation target of the substrate S and the mold M are aligned by the relative drive mechanism 60 configured by the substrate drive mechanism 10 and the mold holding mechanism 30. Next, the relative position of the substrate S and the mold M is adjusted by the relative drive mechanism 60 so that the imprint material IM on the shot area to be patterned contacts the pattern area of the mold M. Next, while the relative position between the shot area to be patterned and the mold M is measured by an alignment scope (not shown), the relative position of the shot area and the mold M is adjusted by the relative drive mechanism 60. In parallel with this, the imprint material IM is filled into the recesses constituting the pattern arranged in the pattern region of the mold M by capillary action.

  Next, the imprint material IM is cured by the curing unit 40. As a result, a pattern composed of a cured portion of the imprint material IM is formed on the shot region of the substrate. Next, the relative position of the substrate S and the mold M is adjusted by the relative drive mechanism 60 so that the pattern made of the cured portion of the imprint material IM and the mold M are separated. The above operation is performed on a plurality of shot areas of the substrate S.

  FIG. 2 illustrates the configuration of the driving of the substrate S by the substrate driving mechanism 10 and the discharge port of the dispenser 20 when the imprint material IM is disposed on the shot region of the substrate S on which a pattern is to be formed. A shot area to which reference numeral 3 is attached (shot area to which cross-hatching is added) indicates a shot area that has already undergone pattern formation processing. A shot region to which reference numeral 4 is attached (a shot region to which hatching is attached) indicates a shot region to be patterned. A shot area denoted by reference numeral 5 (shot area indicated by a white rectangle) indicates a shot area where a pattern is to be formed thereafter.

  In one example, the imprint material IM can be discharged from the dispenser 20 according to the map while the substrate S is driven in the first direction (−X direction) by the substrate driving mechanism 10. This operation is called a first operation. Thereafter, the imprint material IM is discharged from the dispenser 20 according to the map while the substrate S is driven in the second direction (+ X direction) opposite to the first direction by the substrate driving mechanism 10. This operation is called a second operation. The placement of the imprint material for one shot area of the substrate S can be completed by one first operation and one second operation.

  The dispenser 20 can have a first discharge port array 21 and a second discharge port array 22. The first discharge port array 21 includes a plurality of first discharge ports that discharge the imprint material IM when the substrate S is driven in the first direction (−X direction). The second discharge port array 22 can be configured by a plurality of second discharge ports that discharge the imprint material IM when the substrate S is driven in the second direction (+ X direction). In this example, the plurality of first discharge ports configuring the first discharge port array 21 are arranged in a direction parallel to the Y axis (second axis), and the plurality of second discharge ports configuring the second discharge port array 22. Are arranged in a direction parallel to the Y-axis. The lengths of the first discharge port array 21 and the second discharge port array 22 in the direction parallel to the Y axis are the lengths of the shot areas in the direction parallel to the Y axis (shot areas specified by the specifications of the imprint apparatus IMP). Longer than the maximum length).

  In the example shown in FIG. 2, the first discharge port array 21 is disposed between the second discharge port array 22 and the first suction port 51. Instead of such a configuration, a configuration in which the first discharge port array 21 is disposed between the second discharge port array 22 and the second suction port 52 may be employed.

  Of the plurality of shot regions of the substrate S, the shot region arranged in the direction parallel to the X axis (first axis) is the first region (the −X direction) from the shot region arranged in the second direction (+ X direction). In order), a pattern made of a cured product of the imprint material can be formed. This is advantageous in order to prevent the imprint material IM from adhering onto the pattern in the shot area where the pattern has already been formed.

  FIG. 3A schematically shows a first operation, that is, an operation in which the imprint material is discharged from the dispenser 20 while the substrate S is driven in the first direction (−X direction) by the substrate driving mechanism 10. Has been. FIG. 3A schematically shows the amount of gas sucked by the first suction port 51 and the second suction port 52. Typically, the imprint material can be discharged from the dispenser 20 while the substrate S is driven in the first direction (−X direction) DIR1 by the substrate driving mechanism 10 at a constant speed. A main droplet D1 is discharged from the discharge port of the dispenser 20 as the imprint material IM. At this time, a mist D2 of the imprint material IM may be generated. As the substrate holding part 11 holding the substrate S moves in the first direction (−X direction), a gas flow F1 along the first direction DIR1 is generated on the substrate S.

  Therefore, in a state where the imprint material IM is being discharged from the dispenser 20 while the substrate S is being driven in the first direction by the substrate driving mechanism 10, the first suction port 51 and the second suction port 51 are arranged so as not to disturb the gas flow F1. The amount of gas sucked by the suction port 52 can be controlled. Specifically, the first flow rate controller 53 and the second flow rate controller 54 are controlled by the control unit 70 so that the amount of gas sucked by the first suction port 51 is larger than the amount of gas sucked by the second suction port 52. Can be controlled. Such an operation also has an aspect of assisting the gas flow F <b> 1 formed by driving the substrate S by the substrate driving mechanism 10.

  Here, in the first operation, gas can also be sucked by the second suction port 52. That is, the amount of gas sucked by the second suction port 52 in the first operation can be set larger than zero. Therefore, in a state where the imprint material IM is discharged from the dispenser 20, the gas can be sucked by both the first suction port 51 and the second suction port 52. This is effective for preventing the mist and / or particles captured by the second suction port 52 from dropping from the second suction port 52.

  As described above, in the first operation, in the state where the substrate S is driven in the first direction by the substrate driving mechanism 10, the amount of gas sucked by the first suction port 51 is set so as not to hinder the gas flow F1. The amount of gas sucked by the second suction port 52 is increased. Thereby, in the first operation, the influence of the imprint material discharged from the dispenser 20 from the gas flow is kept constant. Therefore, the position of the imprint material arranged on the substrate S can be accurately controlled. For example, if the imprint material placement error (shift amount with respect to the target position) caused by the gas flow F1 is ΔX, the timing of imprint material ejection from the dispenser 20 may be corrected based on ΔX.

  In the state where the substrate S is driven in the first direction by the substrate driving mechanism 10, if the gas suction amount by the first suction port 51 is less than the gas suction amount by the second suction port 52, gas stagnation and Turbulence can occur. In this case, it is difficult to keep the influence that the imprint material receives from the gas flow constant.

  FIG. 3B schematically shows a second operation, that is, an operation in which the imprint material is discharged from the dispenser 20 while the substrate S is driven in the second direction (+ X direction) by the substrate driving mechanism 10. ing. FIG. 3B schematically shows the amount of gas sucked by the first suction port 51 and the second suction port 52. Typically, the imprint material can be discharged from the dispenser 20 while the substrate S is driven in the second direction (+ X direction) DIR2 by the substrate driving mechanism 10 at a constant speed. As described above, the main droplet D1 is discharged from the discharge port of the dispenser 20 as the imprint material IM. At this time, a mist D2 of the imprint material IM may be generated. As the substrate holding part 11 holding the substrate S moves in the second direction (+ X direction), a gas flow F2 along the second direction DIR2 is generated on the substrate S.

  Therefore, in a state where the imprint material IM is being discharged from the dispenser 20 while the substrate S is being driven in the second direction by the substrate driving mechanism 10, the first suction port 51 and the second suction port 51 are arranged so as not to hinder the gas flow F2. The amount of gas sucked by the suction port 52 can be controlled. Specifically, the first flow controller 53 and the second flow controller 54 are controlled by the controller 70 so that the amount of gas sucked by the second suction port 52 is larger than the amount of gas sucked by the first suction port 51. Can be controlled. Such an operation also has an aspect of assisting the gas flow F <b> 2 formed by driving the substrate S by the substrate driving mechanism 10.

  Here, in the second operation, gas can also be sucked by the first suction port 51. That is, the amount of gas sucked by the first suction port 51 in the second operation can be set to be greater than zero. Therefore, in a state where the imprint material IM is discharged from the dispenser 20, the gas can be sucked by both the first suction port 51 and the second suction port 52. This is effective for preventing the mist and / or particles captured by the first suction port 51 from dropping from the first suction port 51.

  As described above, in the second operation, in the state in which the substrate S is driven in the second direction by the substrate driving mechanism 10, the amount of gas sucked by the second suction port 52 is set so as not to hinder the gas flow F2. The amount of gas sucked by the first suction port 51 is increased. Thereby, in the second operation, the influence of the imprint material discharged from the dispenser 20 from the gas flow is kept constant. Therefore, the position of the imprint material arranged on the substrate S can be accurately controlled. For example, if the imprint material placement error (shift amount with respect to the target position) caused by the gas flow F2 is ΔX, the timing of discharging the imprint material from the dispenser 20 may be corrected based on ΔX.

  In the state where the substrate S is driven in the second direction by the substrate driving mechanism 10, if the gas suction amount by the second suction port 52 is less than the gas suction amount by the second suction port 51, gas stagnation and Turbulence can occur. In this case, it is difficult to keep the influence that the imprint material receives from the gas flow constant.

  The gas suction amount by the first suction port 51 and the gas suction amount by the second suction port 52 can be changed in a period different from the period in which the imprint material IM is discharged from the dispenser 20 while the substrate S is driven. . Specifically, first, the first flow rate controller 53 and the second flow rate controller 54 are controlled by the control unit so that the gas suction amount by the first suction port 51 is larger than the gas suction amount by the second suction port 52. 70 can be controlled. A first operation may then be performed. Next, the first flow rate controller 53 and the second flow rate controller 54 can be controlled by the control unit 70 so that the amount of gas sucked by the second suction port 52 is larger than the amount of gas sucked by the first suction port 51. . A second operation may then be performed.

  FIG. 4 schematically shows the operation in the maintenance mode. In the maintenance mode, the imprint material IM is discharged from the dispenser 20 in a state where the receiving portion 19 is disposed immediately below the dispenser 20. In the maintenance mode, the substrate holding unit 11 holding the substrate S is stationary. As described above, the main droplet D1 is discharged from the discharge port of the dispenser 20 as the imprint material IM. At this time, a mist D2 of the imprint material may be generated. In the maintenance mode, the substrate holding unit 11 holding the substrate S is stationary, so that no gas flow is generated by the movement of the substrate holding unit 11.

  Therefore, in the maintenance mode, the amount of gas sucked by the first suction port 51 and the second suction port 52 can be controlled so as not to cause a gas flow. Specifically, the ratio of the gas suction amount by the second suction port 52 to the gas suction amount by the first suction port 51 is 0.8 or more and 1.2 or less, preferably 0.95 or more and The first flow rate controller 53 and the second flow rate controller 54 can be controlled by the control unit 70 so as to be 1.05 or less, more preferably 1.

  The amount of gas suction by the first suction port 51 and the second suction port 52 in the maintenance mode is smaller than the amount of gas suction by the first suction port 51 in the first operation, and the amount of gas by the second suction port 52 in the first operation is smaller. It can be set larger than the suction amount. Alternatively, the amount of gas sucked by the first suction port 51 and the second suction port 52 in the maintenance mode is smaller than the amount of gas sucked by the second suction port 52 in the second operation, and by the first suction port 51 in the second operation. It can be set larger than the amount of gas suction. The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

  Next, an article manufacturing method will be described in which a pattern is formed on a substrate by an imprint apparatus, the substrate on which the pattern is formed is processed, and an article is manufactured from the processed substrate. As shown in FIG. 5A, a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared. Subsequently, the substrate 1z is formed on the surface of the workpiece 2z by an inkjet method or the like. A printing material 3z is applied. Here, a state is shown in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate.

  As shown in FIG. 5 (b), the imprint mold 4z is made to face the imprint material 3z on the substrate with the side on which the concave / convex pattern is formed facing. As shown in FIG.5 (c), the board | substrate 1 with which the imprint material 3z was provided, and the type | mold 4z are made to contact, and a pressure is applied. The imprint material 3z is filled in a gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated as energy for curing through the mold 4z, the imprint material 3z is cured.

  As shown in FIG. 5D, after the imprint material 3z is cured, when the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. This cured product pattern has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product, and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave / convex pattern of the die 4z is transferred to the imprint material 3z. It will be done.

  As shown in FIG. 5 (e), when etching is performed using the pattern of the cured product as an etching resistant mask, a portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the grooves 5z and Become. As shown in FIG. 5 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, a film for interlayer insulation contained in a semiconductor element or the like, that is, a constituent member of an article without being removed after processing.

IMP: imprint apparatus, S: substrate, M: mold, 10: substrate drive mechanism, 11: substrate holding unit, 12: drive mechanism, 19: receiving unit, 20: dispenser, 21: first discharge port array, 22: Second discharge port array, 30: mold holding mechanism, 40: curing unit, 50: low pressure source, 51: first suction port, 52: second suction port, 53: first flow rate controller, 54: second flow rate control 70, control unit

Claims (12)

An imprint apparatus that forms a pattern made of a cured product of an imprint material on a substrate using a mold,
A substrate driving mechanism for driving the substrate with respect to a first axis and a second axis orthogonal to each other;
A mold holding mechanism for holding the mold;
A dispenser having a discharge port for discharging an imprint material so that the imprint material is disposed on the substrate in a state where the substrate is driven in a direction parallel to the first axis by the substrate drive mechanism; ,
A first suction port and a second suction port that are arranged apart from each other in a direction parallel to the first axis so as to sandwich the discharge port, and suck a gas;
The first suction port is disposed on a first direction side parallel to the first axis with respect to the second suction port,
In the state where the imprint material is discharged from the dispenser while the substrate is driven in the first direction by the substrate driving mechanism, the amount of gas sucked by the first suction port is the amount of gas sucked by the second suction port. More than quantity,
An imprint apparatus characterized by that. In the state where the imprint material is discharged from the dispenser while the substrate is driven in the second direction opposite to the first direction while being parallel to the first axis by the substrate driving mechanism, the second suction port The gas suction amount is larger than the gas suction amount by the first suction port,
The imprint apparatus according to claim 1. The arrangement of the imprint material with respect to one shot region of the substrate includes a first operation in which the imprint material is discharged from the dispenser while the substrate is driven in the first direction by the substrate driving mechanism, The substrate is driven by the second operation in which the imprint material is discharged from the dispenser while the substrate is driven in the second direction by the substrate driving mechanism.
The imprint apparatus according to claim 2. The dispenser includes, as a plurality of discharge ports including the discharge port, a first discharge port array including a plurality of first discharge ports that discharge an imprint material when the substrate is driven in the first direction; A second discharge port array including a plurality of second discharge ports that discharge the imprint material when the substrate is driven in the second direction;
The imprint apparatus according to claim 2, wherein the imprint apparatus according to claim 2. The plurality of first discharge ports constituting the first discharge port array are arranged in a direction parallel to the second axis, and the plurality of second discharge ports configuring the second discharge port array are the second Lined up in a direction parallel to the axis,
The imprint apparatus according to claim 4. The lengths of the first discharge port array and the second discharge port array in the direction parallel to the second axis are longer than the length of the shot region of the substrate in the direction parallel to the second axis,
The imprint apparatus according to claim 5. The first discharge port array is disposed between the second discharge port array and the first suction port.
The imprint apparatus according to claim 5 or 6, wherein The first discharge port array is disposed between the second discharge port array and the second suction port.
The imprint apparatus according to claim 5 or 6, wherein In a state where the imprint material is discharged from the dispenser, gas is sucked by both the first suction port and the second suction port.
The imprint apparatus according to claim 1, wherein the apparatus is an imprint apparatus. Further comprising a receiving part for receiving the imprint material discharged from the dispenser,
In a state where the imprint material is discharged from the dispenser toward the receiving portion, the ratio of the gas suction amount by the second suction port to the gas suction amount by the first suction port is 0.8 or more and 1.2 or less,
The imprint apparatus according to claim 1, wherein the apparatus is an imprint apparatus. Of the plurality of shot regions of the substrate, a shot region arranged in a direction parallel to the first axis is from a shot region arranged in a second direction parallel to the first axis and opposite to the first direction. In order, a pattern made of a cured product of the imprint material is formed.
The imprint apparatus according to claim 1, wherein the imprint apparatus is any one of claims 1 to 10. Forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 11,
Processing the substrate on which the pattern is formed in the step;
An article manufacturing method comprising manufacturing an article from a substrate that has been subjected to the treatment.

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