JP2018206815A - Mold, imprint apparatus, and manufacturing method of article - Google Patents

Abstract

To provide a mold capable of suppressing the manufacturing cost of a mold and improving the overlay accuracy of a pattern.SOLUTION: There is provided a mold 201 that is used in an imprint apparatus 101 and in which a chip portion having a concavo-convex pattern 203 is formed and a support portion that supports the chip portion are joined together, and the material of the support portion has a smaller Young's modulus than the material of the chip portion.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a mold, an imprint apparatus, and an article manufacturing method.

  The mold used in the imprint apparatus is required to have a higher accuracy than the reticle used in the conventional semiconductor exposure apparatus. This is because the imprint apparatus does not perform transfer by reduction projection, but performs transfer at an equal magnification by pressing the mold directly onto the imprint material applied to the substrate. Therefore, the mold to be used tends to be expensive because high-precision processing is required. Furthermore, since the mold used in the imprint apparatus is generally made of high-purity quartz glass, the price of the material of the quartz glass itself is a factor that makes the mold expensive.

  Cavity machining is one of the most difficult places in mold machining. A cavity is a recess (indentation) provided on the opposite side of the surface on which the concave / convex pattern is formed. Pressing the space of the cavity and applying pressure to the surface with the concave portion causes the pattern surface to face the substrate. Can be deformed into a convex shape. By deforming the pattern surface into a convex shape, the imprint material can be filled into the concave portion of the concave / convex pattern at the time of stamping, and assists the peeling of the concave / convex pattern and the imprint material at the time of release. Since the cavity engraves most of the thickness direction of the mold, the area where the pattern is formed is thin, so high-precision processing is required. If the processing accuracy of the cavities is low, it leads to uneven thickness of the pattern formed on the substrate, so that there is a concern that the deformation amount varies and the overlay accuracy is lowered.

  Therefore, in Patent Document 1, a substrate used for a mold is formed by joining at least two base materials including a base material in which a hole having a predetermined shape is formed. The mold of Patent Document 1 is a base material different from the base material in which a hole having a predetermined shape becomes a concave portion (cavity) by joining two base materials, and the concave portion is formed. A concavo-convex pattern is formed on the surface opposite to the surface on which it is present. In this way, a technique for reducing the process load of processing is disclosed because a concave portion for facilitating mold release (peeling) of a mold that is difficult to process can be formed with high accuracy.

JP 2014-179630 A

  There is an imprint apparatus that can deform the entire mold by pressing the side surface of the mold and change the shape of the region where the concave / convex pattern of the mold is formed.

  In the joining type mold of Patent Document 1, silicon is used for two substrates. Since silicon has a higher Young's modulus than quartz glass, the mold of Patent Document 1 is less likely to be deformed by external force than a mold made entirely of quartz glass. Therefore, when the entire mold is deformed by pressing the side surface of the mold of Patent Document 1, the output of the pressing actuator must be increased. When the mold is difficult to deform, even if the output of the actuator is maximized, the maximum deformation amount of the region where the uneven pattern is formed becomes small. Since the deformation range of the region where the concavo-convex pattern is formed becomes narrow, the effect of the shape correction is lowered, and the overlay accuracy may be lowered.

  An object of this invention is to provide the joining type | mold type | mold which can improve the superimposition precision of a pattern.

  The mold according to the present invention is a mold used in an imprint apparatus in which a chip part on which a concavo-convex pattern is formed and a support part that supports the chip part are joined, and the material of the support part is the chip part The Young's modulus is smaller than that of the material.

  By applying the present invention, it is possible to provide a mold and an imprint apparatus that can reduce the manufacturing cost of the mold and improve the pattern overlay accuracy.

It is a figure which shows the imprint apparatus which concerns on 1st Embodiment. It is a figure which shows the type | mold which concerns on 1st Embodiment. It is a figure which shows the state which mounted the type | mold which concerns on 2nd Embodiment in the imprint apparatus. It is a figure for demonstrating the manufacturing method of articles | goods.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

(First embodiment)
(About imprint equipment)
FIG. 1 shows a mold (mold) according to the first embodiment mounted on an imprint apparatus 101 for use. The configuration of the imprint apparatus 101 will be described with reference to FIG. Here, each axis is determined as shown in FIG. 1, assuming that the surface on which the substrate 111 is disposed is the XY plane and the direction orthogonal to the XY plane is the Z direction. The imprint apparatus 101 brings the imprint material supplied on the substrate into contact with the mold (mold), and gives curing energy to the imprint material, thereby forming a pattern of the cured product to which the uneven pattern of the mold is transferred. It is an apparatus to form. The imprint apparatus 101 in FIG. 1 is used for manufacturing a device such as a semiconductor device as an article. Here, the imprint apparatus 101 employing the photocuring method will be described.

  The imprint apparatus 101 includes a light irradiation unit 102, a mold holding unit 103, a substrate holding unit 104, a coating unit 105, a control unit 106, a measuring unit 122, and a housing 123. Further, the imprint apparatus 101 is provided with a mold deformation mechanism 130 for deforming the mold 201. The mold deformation mechanism 130 can change the shape of the mold 201 by applying a force to the side surface of the mold 201 to displace the side surface. Further, the imprint apparatus 101 includes a mold transport mechanism (not shown) that transports the mold 201 to the mold holder 103 and a substrate transport mechanism (not shown) that transports the substrate 111 to the substrate holder 104.

  The light irradiation unit 102 irradiates ultraviolet rays 108 for curing the imprint material. The light irradiation unit 102 includes a light source 109 that emits ultraviolet light 108 and an optical element 110 that corrects the ultraviolet light 108 emitted from the light source 109 to light suitable for imprinting. In the first embodiment, the light irradiation unit 102 is installed in order to employ the photocuring method. However, for example, when the thermosetting method is employed, the imprint material is cured instead of the light irradiation unit 102. The heat source part for making it install will be installed.

  The mold holding unit 103 includes a chuck 115 that attracts and holds the mold 201 by an attractive force or an electrostatic force, and a driving mechanism 116 that holds the chuck 115 and moves the mold 201 held by the chuck 115 together with the chuck. The mold 201 includes a pattern portion 203 having a rectangular outer periphery and having a concavo-convex pattern transferred to an imprint material such as a circuit pattern on the surface of the substrate 111. The chuck 115 and the drive mechanism 116 have an opening region 117 (opening) at the center of each so that the substrate 111 is irradiated with the ultraviolet rays 108 irradiated from the light source 109 of the light irradiation unit 102. The drive mechanism 116 moves the mold 201 in the Z-axis direction so that the mold 201 and the imprint material 114 on the substrate 111 are brought into contact (push mold) or separated (release). As an actuator that can be employed in the drive mechanism 116, for example, there is a linear motor or an air cylinder. Further, the drive mechanism 116 may be composed of a plurality of drive systems such as a coarse motion drive system and a fine motion drive system in order to cope with high-precision positioning of the mold 201. Furthermore, you may move not only in the Z-axis direction but also in the X-axis direction and the Y-axis direction. Further, it may have a position correction function in the θ direction that is the rotation direction around the Z axis, a tilt function for correcting the tilt of the mold 201 (rotation directions around the X axis and the Y axis), and the like.

  The substrate holding unit 104 includes a substrate chuck 119 that attracts and holds the substrate 111 by vacuum suction, a substrate stage that holds the substrate chuck 119 by mechanical means, and moves the substrate 111 held by the substrate chuck 119 in the XY plane. 120. The substrate holding unit 104 performs alignment between the mold 201 and the substrate 111 when the mold 201 contacts the imprint material 114 on the substrate 111. On the surface of the substrate chuck 119, there is a stage reference mark 121 used when the mold 201 is aligned. The stage reference mark 121 may be provided on the substrate stage 120. As an actuator that can be used for the substrate stage 120 (substrate driving mechanism), for example, there is a linear motor. Further, the substrate stage 120 may be composed of a plurality of drive systems such as a coarse motion drive system and a fine motion drive system with respect to the X-axis direction and the Y-axis direction. Furthermore, it has a drive system for correcting the position of the substrate 111 in the Z-axis direction, a position correction function for the θ direction (rotation direction around the Z axis) of the substrate 111, a tilt function for correcting the tilt of the substrate 111, and the like. You may do it.

  Note that the pressing and releasing operations in the imprint apparatus 101 may be realized by moving the substrate 111 in the Z-axis direction by the substrate holding unit 104. In addition, the mold 201 and the substrate 111 may be moved relative to each other. You may implement | achieve by moving.

  The application unit 105 is a supply device that supplies an uncured imprint material 114 onto the substrate 111. A plurality of discharge ports (nozzles) are formed in the application unit 105, and droplets of the imprint material are supplied onto the substrate 111 from the discharge ports. The application unit 105 of the first embodiment employs a method of pushing out the imprint material 114 from the discharge port using the piezoelectric effect of the piezo element. The control unit 106, which will be described later, creates a drive signal for driving the piezo element, and drives the piezo element to be deformed into a shape suitable for ejection. A plurality of discharge ports of the application unit 105 are provided, and each can be controlled independently. The amount of imprint material 114 supplied from the discharge port of the application unit 105 onto the substrate 111 and the distribution of droplets are the pattern thickness of the imprint material formed on the substrate 111, the density of the pattern to be formed, etc. As appropriate.

  For the imprint material 114, a curable composition (also referred to as an uncured resin) that cures when given energy for curing is used. As the energy for curing, electromagnetic waves, heat, or the like is used. The electromagnetic wave is, for example, light such as infrared light, visible light, or ultraviolet light whose wavelength is selected from a range of 10 nm to 1 mm.

  A curable composition is a composition which hardens | cures by irradiation of light or by heating. Among these, the photocurable composition cured by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

  The imprint material 114 is applied in a film form on the substrate by a spin coater or a slit coater. Alternatively, the liquid ejecting head may be applied to the substrate in the form of droplets, or in the form of islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 ° C.) is, for example, 1 mPa · s or more and 100 mPa · s or less.

  The substrate 111 is made of glass, ceramics, metal, semiconductor, resin, or the like, and a member made of a material different from the substrate may be formed on the surface thereof as necessary. Specific examples of the substrate include a silicon wafer, a compound semiconductor wafer, and quartz glass.

  The measuring means 122 includes an alignment detector 127 and an imprint material observation means 128 as typical measuring instruments. The alignment detector 127 can detect the alignment mark formed on the substrate 111 and the alignment mark formed on the mold 201. The imprint material observation unit 128 is an imaging device such as a CCD camera, for example, and can image the contact state between the imprint material 114 supplied to the substrate 111 and the mold 201. The imprint material observation means 128 can observe the state of the pressing process and the releasing process.

  The control unit 106 can control the operation and correction of each component of the imprint apparatus 101. The control unit 106 is configured by a computer or the like, for example, is connected to each component of the imprint apparatus 101 via a line, and can control each component according to a program or the like. The control unit 106 controls each operation of the mold holding unit 103, the substrate holding unit 104, and the coating unit 105 based on the measurement result of the measuring unit 122. The control unit 106 can measure the relative position between the mold 201 and the substrate 111 based on the detection result of the alignment detector 127. For example, the positional deviation between the alignment mark of the mold 201 and the alignment mark of the substrate 111 in the X-axis direction and the Y-axis direction is measured. Further, the control unit 106 can determine whether or not the pressing process and the releasing process are good based on the imaging result of the imprint material observation unit 128.

  The control unit 106 may be configured integrally with the imprint apparatus 101 or may be configured separately from the imprint apparatus 101. Moreover, you may be comprised with several computers instead of one computer.

  The housing 123 includes a base surface plate 124 on which the substrate holding unit 104 is placed, a bridge surface plate 125 that fixes the mold holding unit 103, and a column 126 that supports the bridge surface plate 125.

(About imprint method)
Next, an imprint method for forming an imprint material pattern on the substrate 111 using the imprint apparatus 101 will be described.

  The control unit 106 places and holds the substrate 111 loaded into the imprint apparatus 101 on the substrate chuck 119 of the substrate stage 120 by the substrate transport mechanism. The substrate holding unit 104 holding the substrate 111 moves to the application position of the application unit 105. Then, the application unit 105 applies the imprint material 114 to a predetermined pattern formation area (shot area) on the substrate 111 (application process).

  Next, the control unit 106 moves the substrate holding unit 104 so that the pattern formation region on which the imprint material is applied on the substrate 111 is located immediately below the pattern unit 203 formed on the mold 201. The control unit 106 drives the drive mechanism 116 to bring the imprint material 114 on the substrate 111 into contact with the pattern unit 203 of the mold 201 (a pressing process). At this time, the imprint apparatus 101 aligns the mold 201 and the substrate 111 based on the detection result of the alignment mark on the mold 201 and the substrate 111 detected by the alignment detector 127. Furthermore, the mold deformation mechanism 130 can deform the mold 201 based on the detection result of the alignment mark.

  By this stamping process, the imprint material 114 is filled into the concavo-convex portion formed in the pattern portion 203 of the mold 201. In a state where the imprint material 114 is filled in the pattern, the control unit 106 irradiates the light irradiation unit 102 with ultraviolet rays 108 from the upper surface of the mold 201. The imprint material 114 is cured by the ultraviolet light 108 transmitted through the mold 201 (curing process). Then, after the imprint material 114 is cured, the control unit 106 drives the drive mechanism 116 to separate the mold 201 from the cured imprint material 114 (mold release step).

  As a result, a pattern of the imprint material 114 having a three-dimensional shape in which the concavo-convex portion formed in the pattern portion 203 of the mold 201 is inverted is formed in the pattern formation region on the substrate 111. In this way, a series of imprint operations from the coating process to the mold release process are performed a plurality of times while changing the pattern formation region by driving the substrate holding unit 104, so that a plurality of imprints are formed on one substrate 111. A pattern of material 114 can be formed.

(About type)
Next, the mold 201 according to the first embodiment will be described with reference to FIG. FIG. 2A shows a state in which the chip part 202 and the support part 204 constituting the mold 201 of the first embodiment are separated. In FIG. 2, as in FIG. 1, each surface is determined as shown in FIG. 2, where the surface on which the substrate 111 is disposed is the XY plane and the direction perpendicular to the XY plane is the Z direction.

  The chip portion 202 has a convex mesa portion formed on the substrate 111 side, and a pattern portion 203 is formed on the mesa portion. Further, the support part 204 is provided with a cavity 205. Further, the support portion 204 is provided with a cavity 205 (core-out). In the mold 201 of FIG. 2, the cavity 205 is formed by bonding the chip part 202 and the support part 204 together. FIG. 2B shows a state of the mold 201 after the chip portion 202 and the support portion 204 are bonded together. The cavity 205 has a circular planar shape, and the depth is appropriately set depending on the size and material of the support portion 204. The circular planar shape of the cavity 205 is larger than the area of the pattern part 203 and smaller than the outer shape of the chip part 202. As shown in FIG. 1, a light transmitting member 113 having a space 112 surrounded by a part of the opening region 117 and the cavity 205 as a sealed space is installed in the opening region 117 in the mold holding unit 103. The pressure in the cavity 205) can be adjusted.

  For example, when the pattern part 203 of the mold 201 and the imprint material 114 on the substrate 111 are brought into contact with each other, the pressure in the space 112 is set higher than that outside. By doing so, the pattern part 203 bends in a convex shape with respect to the substrate 111, and comes into contact with the imprint material 114 from the center part of the pattern part 203. Thereby, it can suppress that gas (air) is confined between the recessed part of the pattern part 203, and the imprint material 114. FIG. For this reason, the imprint material 114 can be filled to every corner in the concave portion of the pattern portion 203.

  The material used for the chip portion 202 in the mold 201 of the first embodiment will be described as quartz glass, and the material used for the support portion 204 will be described as aluminum. The Young's modulus of quartz glass is approximately 72 to 74 GPa, and the Young's modulus of aluminum is 70 GPa. As described above, the mold 201 according to the first embodiment is characterized in that the Young's modulus of the material used for the support portion 204 is smaller than the Young's modulus of the material used for the tip portion 202.

  The material used for the chip portion 202 is preferably a glass-based material in consideration of light transmission characteristics and the like, and particularly quartz glass is ideal. Quartz glass is the reason for selecting light transmission characteristics and high purity as a material compared to other glass-based materials. This is because the curing light needs to pass through a portion corresponding to the pattern portion 203 of the chip portion 202 in order to cure the imprint material 114 on the substrate. For example, it is necessary to transmit ultraviolet light for curing the imprint material 114 on the substrate 111 or laser light for deforming a pattern formation region formed on the substrate 111 by irradiation heat. Therefore, the chip portion 202 needs to have a size within a range that can sufficiently cover the cavity 205, and a region (contact region) that can be sufficiently bonded to the support portion 204 is necessary. It is desirable to make the chip portion 202 as small as possible after satisfying these conditions. If the chip part 202 can be made small, for example, when the chip part 202 is cut out from a single glass substrate, the number of products produced in a single process increases. Therefore, since the manufacturing cost of the chip part 202 is reduced, the cost of the mold 201 can be reduced.

  As the material used for the support portion 204, a metal-based material and a glass-based material are assumed. For example, a material mainly composed of aluminum, magnesium, or silicon dioxide is used for the support portion 204. The support part 204 is intended to support the chip part 202 and does not need to transmit light unlike the chip part 202, and therefore it is not necessary to use expensive quartz glass. A cavity 205 is formed in the support part 204 of the mold 201. By adjusting the pressure in the cavity 205 to be higher than the surroundings, the pattern part 203 formed on the chip part 202 has a convex shape with respect to the substrate. Deform. The uniformity of deformation of the mold 201 is required with respect to the pressure applied in the cavity 205. Therefore, as the material used for the support portion 204, a material such as a metal or glass that requires a stable Young's modulus is desirable. If the Young's modulus of the material used for the support part 204 is stable, the reproducibility of deformation when a force is applied to the support part can be obtained, so that the deformation of the mold 201 can be controlled with high accuracy. it can.

  Resin material is mentioned as a material which deform | transforms easily with respect to external force. However, the relationship between the stress and strain of the resin material has a characteristic that it is difficult to predict the amount of deformation because there is almost no linear region. In addition, although the resin material is a material that is easily deformed, the amount of deformation may be 10 times or more as compared with quartz glass used for the chip portion 202. Therefore, there is a possibility that the stroke of the mold deformation mechanism 130 increases too much and exceeds the stroke specification.

(About Young's modulus)
The range of the Young's modulus of the material used for the support part 204 will be described. The upper limit value of the Young's modulus of the material used for the support portion 204 only needs to be smaller than the Young's modulus of the material used for the tip portion 202. The lower limit of the Young's modulus of the material used for the support portion 204 is assumed to be about 45 GPa of magnesium having a small Young's modulus among metal materials generally used in industrial products. Therefore, it is desirable to select the Young's modulus of the material used for the support portion 204 of the first embodiment from the range of 45 to 72 GPa. In other words, the material used for the support portion 204 is desirably a material having a Young's modulus of 60% or more and less than 100% of the Young's modulus of the material of the tip portion 202. Since aluminum is 70 GPa, it is a feature within the above-mentioned range.

  Further, it is desirable that the material used for the tip portion 202 and the material used for the support portion 204 have the same linear expansion coefficient. This is because the mold 201 may be placed in a plurality of different environments such as during manufacture, transportation, storage, and in the apparatus, and it is assumed that there are differences in temperature in each different environment. . The amount of thermal deformation of the mold 201 caused by the temperature difference between the different environments varies depending on the linear expansion coefficient of the material used for the mold 201. This difference in the amount of thermal deformation appears in the amount of thermal deformation between the tip portion 202 and the support portion 204, and causes thermal strain in the bonded portion where each is bonded. The influence of this thermal strain not only lowers the alignment accuracy of the pattern part 203 with respect to the shot area, but also may cause the chip part 202 to peel off from the support part 204.

In the first embodiment, the linear expansion coefficient of quartz glass used for the chip portion 202 is 0.5 × 10 ⁻⁶ K ⁻¹ , and the linear expansion coefficient of aluminum used for the support portion 204 is 23 × 10 ^−6. K ⁻¹ , and the difference in linear expansion coefficient is about 46 times. This is an introduction as an example in which the cost of the mold 201 can be reduced, and the ideal of the present invention is to reduce the difference in linear expansion coefficient as much as possible. As an example of making the linear expansion coefficient comparable, if quartz glass is used for the chip portion 202, a glass-based material having a Young's modulus lower than that of quartz glass may be selected for the support portion 204. This is because if the material of the support portion 204 is a glass-based material, the difference in linear expansion coefficient tends to be small because the material characteristics of the tip portion 202 and the support portion 204 are similar.

  The process of bonding the chip part 202 and the support part 204 so as to form the mold 201 shown in FIG. When the chip part 202 and the support part 204 are bonded together, a sufficient adhesive force is required so that the chip part 202 and the support part 204 do not peel off. Even if the pressure applied to the cavity 205 of the mold 201 or the pressing force by the mold deformation mechanism 130 is applied, the chip section 202 must have an adhesive force that does not peel from the support section 204. Further, since it is assumed that the chip part 202 is cut out from a single glass substrate, it is desirable that the chip part 202 be made as small as possible to increase productivity and reduce cost. However, if the chip portion 202 is made too small, the area of the bonding surface with the support portion 204 becomes small, and there is a possibility that sufficient adhesive force cannot be obtained.

  By using aluminum for the support portion 204, the material cost of the mold 201 can be reduced as compared with quartz glass. Further, since aluminum is easier to process than quartz glass, the cost for manufacturing the mold 201 can be reduced. Thus, if the material used for the support portion 204 is inexpensive, the cost for manufacturing the mold 201 can be suppressed. Note that methods for bonding the tip portion 202 and the support portion 204 include a welding (welding) method, an adhesion method, an anodic bonding method, a hydrofluoric acid bonding method, and an optical welding method (optical contact).

  When the mold 201 in which the chip part 202 and the support part 204 are bonded together is deformed by the mold deformation mechanism 130, the hook law σ = E × ε is followed. σ represents stress, E represents Young's modulus, and ε represents strain. That is, when it is desired that the object (mold) has a certain amount of deformation, the necessary stress and the Young's modulus of the object to be deformed are inversely proportional.

  Looking at the configuration of the mold 201, since the volume of the support portion 204 is larger than that of the tip portion 202, the deformation of the mold 201 is dominated by Young's modulus (rigidity), which is a mechanical characteristic of the support portion 204. Therefore, since the Young's modulus of aluminum is 97.2% of the Young's modulus of quartz glass, the output of the mold deformation mechanism 130 is also expected to decrease to the same extent.

  As described above, by forming the imprint material pattern on the substrate using the mold 201 described in the first embodiment, the manufacturing cost of the mold can be suppressed and the output of the mold deformation mechanism can be reduced. Overlay accuracy is improved.

(Second Embodiment)
In the first embodiment, the configuration of the mold 201 has been described. In the second embodiment, a case where the mold 201 described in the first embodiment is mounted on the imprint apparatus 101 will be described. Note that description of the configuration of the mold and the configuration of the imprint apparatus described in the first embodiment is omitted to avoid duplication.

  FIG. 3 shows a state in which the mold 201 is held by the mold holding unit 103 and the mold deformation mechanism 130 is arranged on the side surface of the mold 201. In FIG. 3, as in the first embodiment, each surface is determined as shown in FIG. 3, with the surface on which the substrate 111 is disposed being the XY plane and the direction orthogonal thereto being the Z direction. 3A shows a state where the mold 201 held by the mold holding unit 103 is viewed from the substrate 111 side, and FIG. 3B shows the side surface of the mold 201 held by the mold holding unit 103. FIG. It shows the state as seen.

  The chip part 202 of the mold 201 of the second embodiment is made of quartz glass, and the chip part 202 is provided with a pattern part 203. The support portion 204 of the mold 201 is made of low thermal expansion glass and is provided with a cavity 205. In FIG. 3A, the boundary of the cavity 205 is indicated by a broken line. As explained in the first embodiment, the mold 201 is held by a chuck (not shown), and the side surface of the mold 201 and the mold deformation mechanism 130 are in contact with each other. A plurality of mold deformation mechanisms 130 are provided so as to surround the side surface of the mold 201. As shown in FIG. 3A, each mold deformation mechanism 130 is operated on the support portion 204 to apply a force in the direction of the arrow. The mold deformation mechanism 130 deforms the chip part 202 by applying a force to the support part 204 and deforms the pattern part 203. The place where the mold deformation mechanism 130 is brought into contact is desirably on the side surface of the mold 201 (support portion 204).

  Also in the second embodiment, since the volume of the support portion 204 is larger than that of the tip portion 202, the deformation of the mold 201 by the mold deformation mechanism 130 is dominated by the characteristics of the support portion 204. The Young's modulus of the quartz glass of the chip part 202 is 72 GPa, whereas the Young's modulus of the low thermal expansion glass of the support part 204 is 63 GPa. Thus, since the Young's modulus of the low thermal expansion glass is 87.5% of the Young's modulus of quartz glass, it is likely that the output of the mold deformation mechanism 130 will be reduced to the same extent as that of the conventional mold.

  However, care must be taken so that the amount of deformation does not exceed the specification of the stroke of the mold deformation mechanism 130. In order to deform the pattern portion 203 into an intended shape, a necessary stroke of the mold deformation mechanism 130 can be predicted by structural analysis of the mold 201. Here, structural analysis indicates static deformation analysis using a finite element method.

  As described above, also in the second embodiment, by forming the imprint material pattern on the substrate using the mold 201 described above, it is possible to reduce the manufacturing cost of the mold and reduce the output of the mold deformation mechanism 130. it can. The imprint apparatus according to the second embodiment improves the overlay accuracy because the output of the mold deformation mechanism 130 can be lowered and the output of the mold deformation mechanism can be lowered.

  In the second embodiment, the mold deformation mechanism 130 has been described. The present invention is not limited to the above-described mold deformation mechanism, and an effect of lowering the output of the mold deformation mechanism can be expected as long as it is a mold deformation mechanism that corrects by deforming the pattern of the mold by applying an external force to the support.

(Product manufacturing method)
The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

  Next, a specific method for manufacturing an article will be described. As shown in FIG. 4A, a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared. Subsequently, the substrate 1z is formed on the surface of the workpiece 2z by an inkjet method or the like. A printing material 3z is applied. Here, a state is shown in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate.

  As shown in FIG. 4 (b), the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the concavo-convex pattern is formed facing. As shown in FIG.4 (c), the board | substrate 1 with which the imprint material 3z was provided, and the type | mold 4z are made to contact, and a pressure is applied. The imprint material 3z is filled in a gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated as energy for curing through the mold 4z, the imprint material 3z is cured.

  As shown in FIG. 4D, when the imprint material 3z is cured and then the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. This cured product pattern has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product, and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave / convex pattern of the die 4z is transferred to the imprint material 3z. It will be done.

  As shown in FIG. 4E, when etching is performed using the pattern of the cured product as an anti-etching mask, the portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the grooves 5z and Become. As shown in FIG. 4F, when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, a film for interlayer insulation contained in a semiconductor element or the like, that is, a constituent member of an article without being removed after processing.

  In the case of manufacturing other articles such as optical elements, the manufacturing method may include other processes for processing a patterned substrate instead of etching. The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 101 Imprint apparatus 102 Light irradiation part 103 Type | mold holding mechanism 104 Substrate stage 111 Substrate 114 Imprint material 130 Mold deformation mechanism 201 Type 202 Chip part 203 Pattern part 204 Support part

Claims (10)

The chip part on which the concavo-convex pattern is formed and the support part that supports the chip part are joined, and is a mold used in an imprint apparatus,
The mold characterized in that the material of the support portion has a Young's modulus smaller than that of the material of the tip portion.   2. The mold according to claim 1, wherein a Young's modulus of the material of the support portion is 60% or more and 98% or less of a Young's modulus of the material of the tip portion.   The mold according to claim 1 or 2, wherein a material used for the chip portion is quartz glass.   4. The mold according to claim 1, wherein a material used for the support portion is a material mainly composed of aluminum, magnesium, or silicon dioxide. 5.   The mold according to any one of claims 1 to 3, wherein a linear expansion coefficient of a material of the support part and a linear expansion coefficient of the tip part are approximately the same.   An opening having an outer shape that is larger than an area of the pattern formed in the chip portion and smaller than the outer shape of the chip portion is formed in the support portion, and a recess is formed in the mold from the opening and the chip portion. The mold according to any one of claims 1 to 5, wherein the mold is configured.   The mold according to claim 1, wherein a volume of the support portion is larger than a volume of the tip portion. An imprint apparatus for forming a pattern of an imprint material on a substrate using the mold according to any one of claims 1 to 7,
A mold holding unit for holding the mold;
A mold deformation mechanism for changing the shape of the mold held by the mold holding unit;
An imprint apparatus comprising:   The imprint apparatus according to claim 8, wherein the mold deforming mechanism changes the shape of the tip part by applying a force to a side surface of the support part of the mold held by the mold holding part. Forming an imprint material pattern on the substrate using the imprint apparatus according to claim 8 or 9,
A step of processing the substrate on which the pattern is formed in the step;
A method for producing an article comprising:

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