JP2018136241A - Sensor sheet, capacitance-type sensor, and method for manufacturing sensor sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor sheet, a capacitance-type sensor, and a method for manufacturing the sensor sheet in which a wiring layer has a high degree of freedom.SOLUTION: A sensor sheet 1 includes a dielectric layer 2 and a pair of electrode units 3 and 4. At least one of the pair of electrode units 3 and 4 is a stereoscopic wiring unit 3 or 4. The stereoscopic wiring unit 3 includes: inner jumper wiring layers 1bu to 5bu arranged outside the direction in which the electrode layers 1U to 5U are laminated and electrically connected to the electrode layers 1U to 5U; and outer jumper wiring layers 1au to 5au arranged outside the direction in which the inner jumper wiring layers 1bu to 5bu are laminated and are electrically connected to the inner jumper wiring layers 1bu to 5bu.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a sensor sheet, a capacitive sensor including a sensor body obtained from the sensor sheet, and a method for manufacturing the sensor sheet.

  As shown in Patent Document 1, the capacitive sensor includes a dielectric layer, a front electrode unit, and a back electrode unit. The dielectric layer is interposed between the front side electrode unit and the back side electrode unit. The front electrode unit includes a strip-shaped electrode layer and a wiring layer. The electrode layer and the wiring layer are arranged side by side in the plane direction. The wiring layer is connected to one end in the longitudinal direction of the electrode layer. The configuration of the back electrode unit is the same as that of the front electrode unit.

  A detection unit is set in a portion where the electrode layer of the front side electrode unit and the electrode layer of the back side electrode unit overlap each other when viewed from the front and back direction (stacking direction). When the dielectric layer contracts due to the load from the front side, the inter-electrode distance (the distance between the electrode layer of the front-side electrode unit and the electrode layer of the back-side electrode unit) in the detection unit decreases. For this reason, an electrostatic capacitance increases. Thus, the capacitance type sensor detects the load based on the change in capacitance.

JP 2010-43881 A

  However, in the case of a conventional capacitive sensor, the electrode layer and the wiring layer are arranged side by side in the plane direction. For this reason, the freedom degree of arrangement | positioning of a wiring layer is low. Then, an object of this invention is to provide the manufacturing method of a sensor sheet | seat with high freedom degree of arrangement | positioning of a wiring layer, an electrostatic capacitance type sensor, and a sensor sheet | seat.

  In order to solve the above problems, a sensor sheet of the present invention includes a dielectric layer and a pair of electrode units that are disposed on both sides of the dielectric layer in the stacking direction and each have an electrode layer. A sensor sheet in which a detection unit is set in a portion where the electrode layers overlap, and at least one of the pair of electrode units is disposed on the outer side in the stacking direction of the electrode layers and is electrically connected to the electrode layers. A three-dimensional wiring unit having an inner jumper wiring layer that is electrically connected and an outer jumper wiring layer that is disposed outside the inner jumper wiring layer in the stacking direction and is electrically connected to the inner jumper wiring layer It is characterized by.

  In order to solve the above-mentioned problem, the capacitance type sensor of the present invention is the sensor object of the sensor sheet and the use object detection that is electrically connected to the take-out portion and the sensor body is partially cut. A control unit that corrects the amount of electricity of the use target detection unit. Here, “amount of electricity” includes capacitance, voltage, current, and the like.

  In order to solve the above-mentioned problems, the method for producing a sensor sheet of the present invention includes an outer laminating step of printing the outer jumper wiring layer on a substrate and printing the outer insulating layer thereon, and the outer insulating layer on the outer insulating layer. And an inner lamination step of printing an inner jumper wiring layer and printing the inner insulating layer thereon.

  The sensor sheet of the present invention includes a three-dimensional wiring unit. In the three-dimensional wiring unit, when viewed from the stacking direction, at least two of the inner jumper wiring layer, the outer jumper wiring layer, and the electrode layer can be arranged in an overlapping manner. For this reason, it is possible to increase the degree of freedom of arrangement of at least one of the inner jumper wiring layer and the outer jumper wiring layer.

  The sensor body of the capacitive sensor of the present invention is produced by cutting a sensor sheet. Here, “cutting” includes “a form in which the sensor body is cut (separated) from the sensor sheet”. That is, a form in which the area of the sensor body after cutting is smaller than the area of the sensor sheet before cutting is included. Further, “cutting” includes “a form in which a slit is formed in the sensor sheet (a form in which the sensor body is not cut (not separated) from the sensor sheet”), that is, the area of the sensor sheet before cutting and the sensor after cutting. For example, “cutting” includes cutting the sensor sheet into a plurality of parts and slitting the sensor sheet.

  The sensor body includes a use target detection unit and an extraction unit for the use target detection unit. For this reason, a sensor body having an arbitrary shape, that is, a capacitive sensor can be produced from a sensor sheet having a predetermined shape. Therefore, even when a plurality of capacitive sensors having different shapes or the like are necessary, depending on the desired shape or the like of the capacitive sensor, a member dedicated to the capacitive sensor (for example, There is no need to design and produce a printing plate when producing a capacitive sensor by printing, and a molding die when producing a capacitive sensor by molding. That is, it is only necessary to produce a sensor body from a sensor sheet in accordance with a desired capacitance type sensor shape or the like. For this reason, the manufacturing cost of a capacitive sensor can be reduced. In particular, when manufacturing a small quantity of various types of capacitive sensors, or when manufacturing a prototype of a capacitive sensor, the manufacturing cost can be reduced.

  In the case of the sensor sheet of the present invention, the inner jumper wiring layer is electrically connected to the electrode layer through the inner through portion. Further, the outer jumper wiring layer is electrically connected to the inner jumper wiring layer through the outer through portion. For this reason, in the sensor body after manufacture, the detection part which cannot be detected does not occur easily. Therefore, the degree of freedom of the shape of the sensor body can be increased.

  In addition, the control unit of the capacitance type sensor of the present invention can correct the amount of electricity related to the capacitance of the use target detection unit that is partially cut. For this reason, the detection accuracy of the capacitive sensor can be increased.

  The manufacturing method of the sensor sheet of this invention has an outer side lamination process and an inner side lamination process. In the outer lamination step, the outer jumper wiring layer and the outer insulating layer are printed by printing. For this reason, the formation accuracy (shape accuracy, position accuracy, etc.) of the outer jumper wiring layer and the outer insulating layer can be increased. Similarly, in the inner lamination process, the inner jumper wiring layer and the inner insulating layer are printed by printing. For this reason, the formation accuracy of the inner jumper wiring layer and the inner insulating layer can be increased.

It is a permeation | transmission top view of the sensor sheet of 1st embodiment. FIG. 3 is an exploded perspective view of the sensor sheet. It is a disassembled perspective view of the front side electrode unit of the sensor sheet. (A) is a perspective view of the front side outside wiring layer group of the same front side electrode unit. (B) is a perspective view of the front side inner side wiring layer group of the same front side electrode unit. It is a disassembled perspective view of the back side electrode unit of the sensor sheet. (A) is a perspective view of the back side outside wiring layer group of the back side electrode unit. (B) is a perspective view of the back side inner wiring layer group of the back side electrode unit. It is a permeation | transmission top view of the same front side electrode unit. (A)-(e) is the permeation | transmission top view of the front side electrode unit which emphasized the conduction | electrical_connection path | route of a front side electrode layer. It is a permeation | transmission top view of the back side electrode unit. (A)-(d) is the permeation | transmission top view of the back side electrode unit which emphasized the conduction | electrical_connection path | route of a back side electrode layer. FIG. 10 is a cross-sectional view in the XI-XI direction of FIGS. 7 and 9. It is a permeation | transmission perspective view of the detection part A (1, 4) vicinity shown in FIG. 1 of the front side electrode unit of the sensor sheet. (A)-(d) is a permeation | transmission top view of a capacitive type sensor (the 1-the 4) provided with the sensor body produced from the sensor sheet | seat. It is a permeation | transmission top view of the front side electrode unit of the sensor sheet of 2nd embodiment.

  Hereinafter, embodiments of a sensor sheet, a capacitive sensor, and a method for manufacturing the sensor sheet of the present invention will be described. In the following drawings, the vertical direction corresponds to the “stacking direction” and “front and back direction” of the present invention. Further, the direction toward the upper side or the lower side with respect to the dielectric layer corresponds to the “outside of the stacking direction” of the present invention. The horizontal direction (front / rear / left / right direction) corresponds to the “surface direction” of the present invention.

<First embodiment>
[Outline of sensor sheet]
First, the outline | summary of the sensor sheet | seat of this embodiment is demonstrated. In FIG. 1, the permeation | transmission top view of the sensor sheet | seat of this embodiment is shown. FIG. 2 shows an exploded transparent perspective view of the sensor sheet. In FIG. 1, the front electrode layer is indicated by a solid line, and the back electrode layer is indicated by a dotted line. Moreover, in FIG. 2, a front side electrode layer and a back side electrode layer are shown with a dotted line.

  As shown in FIGS. 1 and 2, the sensor sheet 1 includes a dielectric layer 2, a front electrode unit 3, and a back electrode unit 4. The front-side electrode unit 3 and the back-side electrode unit 4 are included in the concept of “electrode unit” and “three-dimensional wiring unit” of the present invention. The front-side electrode unit 3 is disposed on the upper side (outside in the stacking direction) of the dielectric layer 2. The front side electrode unit 3 includes five front side electrode layers 1U to 5U. The back-side electrode unit 4 is disposed below the dielectric layer 2 (outside in the stacking direction). The back electrode unit 4 includes four back electrode layers 1D to 4D.

  As shown in FIG. 1, when viewed from the upper side or the lower side (stacking direction), the front electrode layers 1U to 5U and the back electrode layers 1D to 4D are arranged in a lattice pattern. As shown by hatching in FIG. 1, a total of 20 detection portions A (1,1) to A (5,4) are set in the overlapping portion of the front side electrode layers 1U to 5U and the back side electrode layers 1D to 4D. Has been. Of the reference symbols A (◯, Δ) of the detection unit, “◯” corresponds to the front electrode layers 1U to 5U, and “Δ” corresponds to the back electrode layers 1D to 4D.

  As shown in FIG. 1, areas where all the front-side electrode layers 1U to 5U and the back-side electrode layers 1D to 4D are arranged (all detection portions A (1,1) to A (5,4) are arranged. Area) is a pressure sensitive area D in which a load can be detected. On the other hand, areas where the front-side electrode layers 1U to 5U and the back-side electrode layers 1D to 4D are not arranged (an area where an extraction portion and an extraction position described later are arranged) are insensitive areas E where the load cannot be detected. . The dead area E surrounds the pressure sensitive area D in a frame shape from the outside in the horizontal direction.

[Configuration of sensor sheet]
Next, the configuration of the sensor sheet of this embodiment will be described. FIG. 3 shows an exploded perspective view of the front electrode unit of the sensor sheet of the present embodiment. FIG. 4A shows a perspective view of the front outer wiring layer group of the front electrode unit. FIG. 4B shows a perspective view of the front side inner wiring layer group of the front side electrode unit.

(Configuration of dielectric layer 2 and front electrode unit 3)
The dielectric layer 2 is made of urethane foam and has a sheet shape. The front side electrode unit 3 includes a front side base material 30, a front side outer wiring layer group 31, a front side outer insulating layer 32, a front side inner wiring layer group 33, a front side inner insulating layer 34, and front side electrode layers 1U to 5U. A front protective layer 35.

  The front side base material 30 is included in the concept of the “base material” of the present invention. The front side outer insulating layer 32 is included in the concept of the “outer insulating layer” of the present invention. The front side inner insulating layer 34 is included in the concept of the “inner insulating layer” of the present invention. The front-side electrode layers 1U to 5U are included in the concept of the “electrode layer” of the present invention. Front side outer jumper wiring layers 1 au to 5 au described later are included in the concept of the “outer jumper wiring layer” of the present invention. Front side inner jumper wiring layers 1bu to 5bu described later are included in the concept of the “inner jumper wiring layer” of the present invention. The below-described front shield layer 36 is included in the concept of the “shield layer” of the present invention. The constituent members of the back electrode unit 4 corresponding to these constituent members (specifically, constituent members of the back electrode unit 4 having names obtained by replacing “front side” with “back side” in the names of these constituent members) The same is true.

(Front side base material 30)
As shown in FIG. 3, the front-side base material 30 is made of polyethylene terephthalate (PET) and has a sheet shape. On the lower side of the front-side substrate 30, from the upper side (outside in the stacking direction) to the lower side (inner side in the stacking direction), the front-side outer wiring layer group 31, the front-side outer insulating layer 32, the front-side inner wiring layer group 33, the front-side inner side An insulating layer 34, front side electrode layers 1U to 5U, and a front side protective layer 35 are disposed.

(Front side outer wiring layer group 31)
As shown in FIGS. 3 and 4A, the front side outer wiring layer group 31 includes four groups of front side outer jumper wiring layer groups 1Au to 4Au, five groups of front side first extraction wiring layer groups 1Eu to 5Eu, 5 groups of front side second extraction wiring layer groups 1Fu to 5Fu. The front side outer jumper wiring layer groups 1Au to 4Au, the front side first outgoing wiring layer group 1Eu to 5Eu, and the front side second outgoing wiring layer group 1Fu to 5Fu are electrically insulated by a front side outer insulating layer 32 described later. ing. The front side outer jumper wiring layer groups 1Au to 4Au, the front side first extraction wiring layer groups 1Eu to 5Eu, and the front side second extraction wiring layer groups 1Fu to 5Fu are arranged adjacent to each other in the horizontal direction (in the same layer). As will be described later, the front side outer jumper wiring layer groups 1Au to 4Au, the front side first extraction wiring layer group 1Eu to 5Eu, and the front side second extraction wiring layer group 1Fu to 5Fu are respectively an outer wiring layer, an inner wiring layer, It has. The outer wiring layer is formed on the lower surface of the front side base material 30. The outer wiring layer contains acrylic rubber and silver powder. The inner wiring layer is formed on the lower surface of the outer wiring layer. The inner wiring layer includes acrylic rubber and conductive carbon black.

  When viewed from the upper side or the lower side, the four front outer jumper wiring layer groups 1Au to 4Au (excluding the left end portion (surface direction outer end portion) and the right end portion (surface direction outer end portion)) will be described later. It overlaps with the back side electrode layers 1D to 4D of the book. Each of the four groups of front side outer jumper wiring layers 1Au to 4Au includes five front side outer jumper wiring layers 1au to 5au. The front side outer jumper wiring layers 1au to 5au extend in the left-right direction. The front side outer jumper wiring layers 1au to 5au are juxtaposed in the front-rear direction. At the left end (surface direction outer end) and the right end (surface direction outer end) of the front side outer jumper wiring layers 1au to 5au, an extraction portion yu is disposed.

  When viewed from the upper side or the lower side, the five front side first extraction wiring layer groups 1Eu to 5Eu (excluding the rear end portion (inner end portion in the plane direction)) include five front electrode layers 1U to 5U, and It arrange | positions without overlapping in four back side electrode layers 1D-4D mentioned later. The five front-side first extraction wiring layer groups 1Eu to 5Eu are arranged in front of the four front-side outer jumper wiring layer groups 1Au to 4Au. Each of the five front side first extraction wiring layer groups 1Eu to 5Eu includes five front side first extraction wiring layers 1eu to 5eu. The front side first extraction wiring layers 1eu to 5eu extend in the front-rear direction. The front side first extraction wiring layers 1eu to 5eu are juxtaposed in the left-right direction. An extraction portion xu is arranged at the front end portion (surface direction outer end portion) of the front side first extraction wiring layers 1eu to 5eu.

  When viewed from the upper side or the lower side, the five front side second extraction wiring layer groups 1Fu to 5Fu (excluding the front end portion (inner end portion in the plane direction)) include five front electrode layers 1U to 5U, and will be described later. The four back side electrode layers 1D to 4D are arranged without overlapping. The five groups of front-side second extraction wiring layer groups 1Fu to 5Fu are arranged behind the four groups of front-side outer jumper wiring layer groups 1Au to 4Au. Each of the five front side second extraction wiring layer groups 1Fu to 5Fu includes five front side second extraction wiring layers 1fu to 5fu. The front side second extraction wiring layers 1fu to 5fu extend in the front-rear direction. The front side second extraction wiring layers 1fu to 5fu are juxtaposed in the left-right direction. An extraction portion xu is arranged at the rear end portion (surface direction outer end portion) of the front side second extraction wiring layers 1fu to 5fu.

(Front side outer insulating layer 32)
As shown in FIG. 3, the front outer insulating layer 32 has a sheet shape. The front side outer insulating layer 32 includes urethane rubber and titanium oxide particles as an antiblocking agent. A plurality of front side outer through holes 320 are formed in the front side outer insulating layer 32. The front side outer through hole 320 is included in the concept of the “outer through portion” of the present invention. When viewed from the upper side or the lower side, the plurality of front side outer through-holes 320 are overlapped with the detection units A (1, 1) to A (5, 4) shown in FIG.

(Front side inner wiring layer group 33)
As shown in FIGS. 3 and 4B, the front side inner wiring layer group 33 includes five front side inner jumper wiring layer groups 1Bu to 5Bu and a front side shield layer 36. The front side inner jumper wiring layer groups 1Bu to 5Bu and the front side shield layer 36 are electrically insulated by a front side inner insulating layer 34 described later. The front side inner jumper wiring layer groups 1Bu to 5Bu and the front side shield layer 36 are arranged adjacent to each other in the horizontal direction (in the same layer). As will be described later, the front-side inner jumper wiring layer groups 1Bu to 5Bu and the front-side shield layer 36 each include an outer wiring layer and an inner wiring layer. The outer wiring layer is formed on the lower surface of the front outer insulating layer 32. The outer wiring layer contains acrylic rubber and silver powder. The inner wiring layer is formed on the lower surface of the outer wiring layer. The inner wiring layer includes acrylic rubber and conductive carbon black.

  When viewed from the upper side or the lower side, the five front side inner jumper wiring layer groups 1Bu to 5Bu are disposed to overlap the five front side electrode layers 1U to 5U. The five groups of front inner jumper wiring layers 1Bu to 5Bu each include five front inner jumper wiring layers 1bu to 5bu. The front side inner jumper wiring layers 1bu to 5bu extend in the front-rear direction. The front side inner jumper wiring layers 1bu to 5bu are juxtaposed in the left-right direction. When viewed from the upper side or the lower side, front end portions (surface direction outer end portions) of the front side inner jumper wiring layers 1bu to 5bu are arranged at rear end portions (surface direction inner end portions) of the front side first extraction wiring layers 1eu to 5eu. It is arranged in duplicate. When viewed from the upper side or the lower side, the rear end portions (surface direction outer end portions) of the front side inner jumper wiring layers 1bu to 5bu are located at the front end portions (surface direction inner end portions) of the front side second extraction wiring layers 1fu to 5fu. It is arranged in duplicate.

  When viewed from the upper side or the lower side, the front shield layer 36 is disposed so as not to overlap the five front electrode layers 1U to 5U and the detectors A (1,1) to A (5,4). The front shield layer 36 is electrically grounded. The front shield layer 36 is arranged in a frame shape on the outer side in the horizontal direction of the five groups of front inner jumper wiring layer groups 1Bu to 5Bu. The front-side shield layer 36 partitions a pair of front-side inner jumper wiring layer groups 1Bu to 5Bu that are adjacent in the left-right direction.

(Front side inner insulating layer 34)
As shown in FIG. 3, the front side inner insulating layer 34 has a sheet shape. The front side inner insulating layer 34 includes urethane rubber and titanium oxide particles as an antiblocking agent. A plurality of front side inner through holes 340 are formed in the front side inner insulating layer 34. The front side inner through hole 340 is included in the concept of the “inner through portion” of the present invention. When viewed from the upper side or the lower side, the plurality of front side inner through-holes 340 are overlapped with the detection units A (1, 1) to A (5, 4) shown in FIG.

(Front side electrode layers 1U to 5U)
As shown in FIG. 3, the five front side electrode layers 1 </ b> U to 5 </ b> U are disposed on the lower surface of the front side inner insulating layer 34. The front side electrode layers 1U to 5U each contain acrylic rubber and conductive carbon black. The front electrode layers 1U to 5U each have a strip shape extending in the front-rear direction. The front electrode layers 1U to 5U are arranged in parallel to each other with a predetermined interval in the left-right direction. The front side outer jumper wiring layers 1 au to 5 au shown in FIG. 4A and the front side inner jumper wiring layers 1 bu to 5 bu shown in FIG. 4B are electrically connected via the front side outer through holes 320 shown in FIG. It is connected to the. The front side inner jumper wiring layers 1bu to 5bu shown in FIG. 4B and the front side electrode layers 1U to 5U shown in FIG. 3 are electrically connected through the front side inner through-hole 340 shown in FIG. .

(Front side protective layer 35)
As shown in FIG. 3, the front side protective layer 35 covers the front side electrode layers 1U to 5U and the front side inner insulating layer 34 from the lower side. The front side protective layer 35 is made of urethane rubber and has a sheet shape. The front side protective layer 35 protects the front side electrode layers 1U to 5U. The front side protective layer 35 is interposed between the front side electrode layers 1U to 5U and the dielectric layer 2 shown in FIG.

(Configuration of back side electrode unit 4)
In FIG. 5, the disassembled perspective view of the back side electrode unit of the sensor sheet | seat of this embodiment is shown. FIG. 6A shows a perspective view of the back side outer wiring layer group of the back side electrode unit. FIG. 6B shows a perspective view of the back side inner wiring layer group of the back side electrode unit.

  As shown in FIG. 2, the back electrode unit 4 is disposed below the dielectric layer 2. The configuration of the back electrode unit 4 is the same as that of the front electrode unit 3. That is, as shown in FIG. 5, the back-side electrode unit 4 includes a back-side base material 40, a back-side outside wiring layer group 41, a back-side outside insulating layer 42, a back-side inside wiring layer group 43, and a back-side inside insulating layer 44. The back side electrode layers 1D to 4D and the back side protective layer 45 are provided.

  Back side base material 40 and front side base material 30, back side outside wiring layer group 41 and front side outside wiring layer group 31, back side outside insulating layer 42 and front side outside insulating layer 32, back side inside wiring layer group 43 and front side inside wiring layer group 33, The back side inner insulating layer 44 and the front side inner insulating layer 34, the back side electrode layers 1D to 4D and the front side electrode layers 1U to 5U, the back side protective layer 45 and the front side protective layer 35 are made of the same material. Similarly to the front shield layer 36, the back shield layer 46 is electrically grounded.

  As shown in FIGS. 3 and 5, the laminated structure (vertical arrangement) of the back electrode unit 4 is vertically symmetrical with the laminated structure of the front electrode unit 3. That is, as shown in FIG. 5, on the upper side of the back-side base material 40, from the lower side (outside in the stacking direction) to the upper side (inner side in the stacking direction), the back-side outer wiring layer group 41, the back-side outer insulating layer 42, and the back side The inner wiring layer group 43, the back side inner insulating layer 44, the back side electrode layers 1D to 4D, and the back side protective layer 45 are arranged. The back side protective layer 45 is interposed between the back side electrode layers 1D to 4D and the dielectric layer 2 shown in FIG.

  As shown in FIG. 5, a plurality of backside outer through-holes 420 are formed in the backside outer insulating layer 42, and a plurality of backside inner through-holes 440 are formed in the backside inner insulating layer 44. The back side outer through hole 420 is included in the concept of the “outer through portion” of the present invention. The back side inner through hole 440 is included in the concept of the “inner through portion” of the present invention. When viewed from above or below, the plurality of back-side outer through-holes 420 and the plurality of back-side inner through-holes 440 are arranged overlappingly in the detection units A (1, 1) to A (5, 4) shown in FIG. Has been.

  As shown in FIG. 5 and FIG. 6A, the back side outside wiring layer group 41 includes 5 groups of back side outside jumper wiring layer groups 1Ad to 5Ad, 4 groups of back side first extraction wiring layer groups 1Ed to 4Ed, 4 groups of backside second extraction wiring layer groups 1Fd to 4Fd.

  5 groups of backside outer jumper wiring layer groups 1Ad to 5Ad (excluding the front end portion (outer end portion in the surface direction) and the rear end portion (outer end portion in the surface direction)) as viewed from above or below The front side electrode layers 1U to 5U are overlapped. Each of the five back side outer jumper wiring layer groups 1Ad to 5Ad includes four back side outer jumper wiring layers 1ad to 4ad. The back side outer jumper wiring layers 1ad to 4ad extend in the front-rear direction. The back side outer jumper wiring layers 1ad to 4ad are juxtaposed in the left-right direction. An extraction portion xd is disposed at the front end portion (surface direction outer end portion) and rear end portion (surface direction outer end portion) of the back side outer jumper wiring layers 1ad to 4ad.

  When viewed from the upper side or the lower side, the four back side first extraction wiring layer groups 1Ed to 4Ed (excluding the right end portion (inner end portion in the plane direction)) include five front electrode layers 1U to 5U and 4 It arrange | positions without overlapping in back side electrode layer 1D-4D of a book. The four groups of back side first extraction wiring layer groups 1Ed to 4Ed are arranged on the left side of the five groups of back side outer jumper wiring layer groups 1Ad to 5Ad. Each of the four back side first extraction wiring layer groups 1Ed to 4Ed includes four back side first extraction wiring layers 1ed to 4ed. The back side first extraction wiring layers 1ed to 4ed extend in the left-right direction. The back side first extraction wiring layers 1ed to 4ed are juxtaposed in the front-rear direction. An extraction portion yd is disposed at the left end (surface direction outer end) of the back side first extraction wiring layers 1ed to 4ed.

  When viewed from the upper side or the lower side, the four back side second extraction wiring layer groups 1Fd to 4Fd (excluding the left end portion (inner end portion in the surface direction)) include five front electrode layers 1U to 5U and 4 It arrange | positions without overlapping in back side electrode layer 1D-4D of a book. The four groups of second rear extraction wiring layer groups 1Fd to 4Fd are disposed on the right side of the five groups of rear outer jumper wiring layer groups 1Ad to 5Ad. Each of the four back side second extraction wiring layer groups 1Fd to 4Fd includes four back side second extraction wiring layer 1fd to 4fd. The back side second extraction wiring layers 1fd to 4fd extend in the left-right direction. The back side second extraction wiring layers 1fd to 4fd are juxtaposed in the front-rear direction. An extraction part yd is arranged at the right end (surface direction outer end) of the back side second extraction wiring layers 1fd to 4fd.

  As shown in FIGS. 5 and 6B, the back side inner wiring layer group 43 includes four groups of back side inner jumper wiring layer groups 1 </ b> Bd to 4 </ b> Bd and a back side shield layer 46. When viewed from the upper side or the lower side, the four back side inner jumper wiring layer groups 1Bd to 4Bd are arranged to overlap the four back side electrode layers 1D to 4D. Each of the four back side inner jumper wiring layer groups 1Bd to 4Bd includes four back side inner jumper wiring layers 1bd to 4bd. The back side inner jumper wiring layers 1bd to 4bd extend in the left-right direction. The back side inner jumper wiring layers 1bd to 4bd are juxtaposed in the front-rear direction. When viewed from the upper side or the lower side, the left end portion (surface direction outer end portion) of the back side inner jumper wiring layers 1bd to 4bd overlaps the right end portion (surface direction inner end portion) of the back side first extraction wiring layers 1ed to 4ed. Are arranged. When viewed from the upper side or the lower side, the right end (surface direction outer end) of the back side inner jumper wiring layers 1bd to 4bd overlaps with the left end (surface direction inner end) of the back side second extraction wiring layers 1fd to 4fd. Are arranged.

  When viewed from the upper side or the lower side, the back shield layer 46 is disposed on the four back electrode layers 1D to 4D and the detection units A (1, 1) to A (5, 4) without overlapping. The back side shield layer 46 is arranged in a frame shape on the outside in the horizontal direction of the four groups of back side inner jumper wiring layer groups 1Bd to 4Bd. The back side shield layer 46 partitions a pair of back side inner jumper wiring layer groups 1Bd to 4Bd adjacent in the front-rear direction.

(Number of layers constituting the front side outer wiring layer group 31, front side inner wiring layer group 33, back side outer wiring layer group 41, back side inner wiring layer group 43, arrangement direction)
Next, the front side outer wiring layer group 31 shown in FIG. 4A, the front side inner wiring layer group 33 shown in FIG. 4B, the back side outer wiring layer group 41 shown in FIG. 6A, FIG. 6B. The number and the arrangement direction of each layer constituting the back side inner wiring layer group 43 shown in FIG. The arrangement number of the front side electrode layers 1U to 5U is N, the arrangement number of the back side electrode layers 1D to 4D is M, the extending direction (front-rear direction) of the front side electrode layers 1U to 5U is the X direction, and the extension of the back side electrode layers 1D to 4D The current direction (left-right direction) is defined as the Y direction.

  In the front-side electrode unit 3, the number of arrangement of the front-side outer jumper wiring layer groups 1Au to 4Au is M. Number of front side outer jumper wiring layers 1au to 5au, number of front side first outgoing wiring layer groups 1Eu to 5Eu, number of front side first outgoing wiring layers 1eu to 5eu, front side second outgoing wiring layer groups 1Fu to 5Fu The number of arrangement, the number of arrangement of the front side second extraction wiring layers 1fu to 5fu, the number of arrangement of the front side inner jumper wiring layer groups 1Bu to 5Bu, and the arrangement number of the front side inner jumper wiring layers 1bu to 5bu are N, respectively.

  The extending direction of the front side outer jumper wiring layers 1au to 5au is the Y direction. The extending direction of the front side first extraction wiring layers 1eu to 5eu, the extending direction of the front side second extraction wiring layers 1fu to 5fu, and the extending direction of the front side inner jumper wiring layers 1bu to 5bu are each in the X direction.

  In the back side electrode unit 4, the number of back side outside jumper wiring layer groups 1 Ad to 5 Ad arranged is N. Number of rear side outer jumper wiring layers 1ad to 4ad, number of rear side first extraction wiring layer groups 1Ed to 4Ed, number of rear side first extraction wiring layers 1ed to 4ed, number of rear side second extraction wiring layer groups 1Fd to 4Fd The number of arrangement, the number of arrangement of the back side second extraction wiring layers 1fd to 4fd, the number of arrangement of the back side inner jumper wiring layer groups 1Bd to 4Bd, and the number of arrangement of the back side inner jumper wiring layers 1bd to 4bd are each M.

  The extending direction of the back side outer jumper wiring layers 1ad to 4ad is the X direction. The extending direction of the back side first extraction wiring layers 1ed to 4ed, the extending direction of the back side second extraction wiring layers 1fd to 4fd, and the extending direction of the back side inner jumper wiring layers 1bd to 4bd are each the Y direction.

(Three-dimensional wiring structure of sensor sheet 1)
Next, the three-dimensional wiring structure of the sensor sheet of this embodiment will be described. In FIG. 7, the permeation | transmission top view of the front side electrode unit of the sensor sheet | seat of this embodiment is shown. FIGS. 8A to 8E are transmission top views of the front electrode unit in which the conduction path of the front electrode layer is emphasized. FIG. 9 shows a transparent top view of the back electrode unit of the sensor sheet. 10A to 10D are transparent top views of the back side electrode unit in which the conduction path of the back side electrode layer is emphasized. FIG. 11 shows a cross-sectional view in the XI-XI direction of FIGS. 7 and 9. FIG. 12 shows a transparent perspective view of the front electrode unit of the sensor sheet in the vicinity of the detection portion A (1, 4) (left front corner portion) shown in FIG.

  7 to 10, the outer contact P1 is indicated by a small black circle, and the common contact P3 is indicated by a large black circle. 7 and 8, the front-side outer wiring layer group 31 is indicated by a solid line, and the front-side inner wiring layer group 33 (the front-side shield layer 36 is omitted) is indicated by a dotted line (see FIG. 4). 9 and 10, the back side outer wiring layer group 41 is indicated by a solid line, and the back side inner wiring layer group 43 (the back side shield layer 46 is omitted) is indicated by a dotted line (see FIG. 6). Further, in FIG. 8, the front side outer wiring layer group 31 and the front side inner wiring layer group 33 are indicated by “line drawing” (see FIG. 4). Further, in FIG. 10, the back side outside wiring layer group 41 and the back side inside wiring layer group 43 are indicated by “line drawing” (see FIG. 6). In FIG. 12, for convenience of explanation, the thicknesses in the vertical direction of the front side outer insulating layer 32 and the front side inner insulating layer 34 are highlighted. Moreover, in FIG. 12, the front side base material 30 is abbreviate | omitted and shown.

  First, the three-dimensional wiring structure of the front electrode unit 3 will be described. As shown in FIGS. 7, 11, and 12, the outer contact P <b> 1 is a contact portion between the front side inner jumper wiring layers 1 bu to 5 bu and the front side outer jumper wiring layers 1 au to 5 au. The outer contact P1 is a contact portion between the front side inner jumper wiring layers 1bu to 5bu and the front side first extraction wiring layers 1eu to 5eu. The outer contact P1 is a contact portion between the front-side inner jumper wiring layers 1bu to 5bu and the front-side second extraction wiring layers 1fu to 5fu. When viewed from the upper side or the lower side, the outer contact P <b> 1 is disposed inside the front-side outer through hole 320. The common contact P3 is a contact portion between the front electrode layers 1U to 5U, the front inner jumper wiring layers 1bu to 5bu, and the front outer jumper wiring layers 1au to 5au. When viewed from the upper side or the lower side, the common contact P3 is disposed inside the front side inner through hole 340 and the front side outer through hole 320. When viewed from above or below, the front side inner jumper wiring layers 1bu to 5bu, the portion of the front side outer insulating layer 32 excluding the front side outer through-hole 320, and the front side outer jumper wiring layers 1au to 5au overlap. The “outer insulation area” is arranged.

  As shown in FIGS. 8A to 8E, when viewed from the upper side or the lower side, the conduction paths L1u to L5u of the front electrode layers 1U to 5U are arranged in a grid pattern. Specifically, as shown by a thick line in FIG. 8A, the sensor sheet 1 is provided with a conduction path L1u for the front electrode layer 1U. As shown in FIG. 7, the conduction path L1u includes a front side inner jumper wiring layer 1bu, a front side outer jumper wiring layer 1au, a front side first extraction wiring layer 1eu, and a front side second extraction wiring layer 1fu. .

  As shown by a thick line in FIG. 8B, the sensor sheet 1 is provided with a conduction path L2u for the front electrode layer 2U. As shown in FIG. 7, the conduction path L2u includes a front side inner jumper wiring layer 2bu, a front side outer jumper wiring layer 2au, a front side first extraction wiring layer 2eu, and a front side second extraction wiring layer 2fu. .

  As shown by a thick line in FIG. 8C, the sensor sheet 1 is provided with a conduction path L3u for the front electrode layer 3U. As shown in FIG. 7, the conduction path L3u includes a front side inner jumper wiring layer 3bu, a front side outer jumper wiring layer 3au, a front side first extraction wiring layer 3eu, and a front side second extraction wiring layer 3fu. .

  As indicated by a thick line in FIG. 8D, the sensor sheet 1 is provided with a conduction path L4u for the front electrode layer 4U. As shown in FIG. 7, the conduction path L4u includes a front side inner jumper wiring layer 4bu, a front side outer jumper wiring layer 4au, a front side first extraction wiring layer 4eu, and a front side second extraction wiring layer 4fu. .

  As indicated by a thick line in FIG. 8E, the sensor sheet 1 is provided with a conduction path L5u for the front electrode layer 5U. As shown in FIG. 7, the conduction path L5u includes a front side inner jumper wiring layer 5bu, a front side outer jumper wiring layer 5au, a front side first extraction wiring layer 5eu, and a front side second extraction wiring layer 5fu. .

  Thus, conduction paths L1u to L5u, front side electrode layers 1U to 5U, front side inner jumper wiring layers 1bu to 5bu, front side outer jumper wiring layers 1au to 5au, front side first extraction wiring layers 1eu to 5eu, front side second extraction wiring Among the layers 1fu to 5fu, the layers having the same numeral portion in the reference numerals are electrically connected by the outer contact P1 and the common contact P3. The same applies to the three-dimensional wiring structure of the back side electrode unit 4 to be described later.

  As shown in FIG. 7, 10 groups (5 groups at the front edge and 5 groups at the rear edge) of extraction positions Xu are arranged on the front and rear outer edges of the sensor sheet 1. The extraction position Xu includes five extraction parts xu. The five extraction portions xu are electrically connected to the front-side electrode layers 1U to 5U through conduction paths L1u to L5u. Eight groups (four groups on the left edge and four groups on the right edge) take-out positions Yu are arranged on the left and right outer edges of the sensor sheet 1. The take-out position Yu has five take-out portions yu. The five extraction portions yu are electrically connected to the front-side electrode layers 1U to 5U through conduction paths L1u to L5u. In this way, any single extraction position Xu, Yu is electrically connected to all the front electrode layers 1U to 5U.

  Next, the three-dimensional wiring structure of the back electrode unit 4 will be described. As illustrated in FIGS. 9 and 11, the outer contact P <b> 1 is a contact portion between the back-side inner jumper wiring layers 1 bd to 4 bd and the back-side outer jumper wiring layers 1 ad to 4 ad. The outer contact P1 is a contact portion between the back side inner jumper wiring layers 1bd to 4bd and the back side first extraction wiring layers 1ed to 4ed. The outer contact P1 is a contact portion between the back side inner jumper wiring layers 1bd to 4bd and the back side second extraction wiring layers 1fd to 4fd. When viewed from the upper side or the lower side, the outer contact P <b> 1 is disposed inside the back-side outer through-hole 420. The common contact P3 is a contact portion between the back electrode layers 1D to 4D, the back inner jumper wiring layers 1bd to 4bd, and the back outer jumper wiring layers 1ad to 4ad. When viewed from the upper side or the lower side, the common contact P3 is disposed inside the back-side inner through hole 440 and the back-side outer through hole 420.

  As shown in FIGS. 10A to 10D, the conduction paths L1d to L4d of the back-side electrode layers 1D to 4D are arranged in a lattice shape when viewed from the upper side or the lower side. Specifically, as shown by a thick line in FIG. 10A, the sensor sheet 1 is provided with a conduction path L1d for the back electrode layer 1D. As shown in FIG. 9, the conduction path L1d includes a back side inner jumper wiring layer 1bd, a back side outer jumper wiring layer 1ad, a back side first extraction wiring layer 1ed, and a back side second extraction wiring layer 1fd. .

  As indicated by a thick line in FIG. 10B, the sensor sheet 1 is provided with a conduction path L2d for the back electrode layer 2D. As shown in FIG. 9, the conduction path L2d includes a back side inner jumper wiring layer 2bd, a back side outer jumper wiring layer 2ad, a back side first extraction wiring layer 2ed, and a back side second extraction wiring layer 2fd. .

  As indicated by a thick line in FIG. 10C, the sensor sheet 1 is provided with a conduction path L3d for the back electrode layer 3D. As shown in FIG. 9, the conduction path L3d includes a back side inner jumper wiring layer 3bd, a back side outer jumper wiring layer 3ad, a back side first extraction wiring layer 3ed, and a back side second extraction wiring layer 3fd. .

  As indicated by a thick line in FIG. 10D, the sensor sheet 1 is provided with a conduction path L4d for the back electrode layer 4D. As shown in FIG. 9, the conduction path L4d includes a back-side inner jumper wiring layer 4bd, a back-side outer jumper wiring layer 4ad, a back-side first extraction wiring layer 4ed, and a back-side second extraction wiring layer 4fd. .

  As shown in FIG. 9, 10 groups (5 groups at the front edge and 5 groups at the rear edge) take-out positions Xd are arranged on the front and rear outer edges of the sensor sheet 1. The extraction position Xd includes four extraction portions xd. The four extraction parts xd are electrically connected to the back-side electrode layers 1D to 4D. Eight groups (four groups on the left edge and four groups on the right edge) take-out positions Yd are arranged on the left and right outer edges of the sensor sheet 1. The extraction position Yd includes four extraction portions yd. The four extraction portions yd are electrically connected to the back-side electrode layers 1D to 4D. Thus, arbitrary single extraction positions Xd and Yd are electrically connected to all the back side electrode layers 1D to 4D.

  As shown in FIGS. 7 and 9, the take-out position Xd and the take-out position Xu are overlapped when viewed from the upper side or the lower side. Further, when viewed from the upper side or the lower side, the extraction position Yd and the extraction position Yu are overlapped. In these overlapping portions, a common extraction position Xud (overlap portion between the extraction position Xd and the extraction position Xu) and Yud (overlap portion between the extraction position Yd and the extraction position Yu) are arranged. All the front side electrode layers 1U to 5U and all the back side electrode layers 1D to 4D are electrically connected to the common extraction positions Xud and Yud. For this reason, the amount of electricity (for example, capacitance, voltage, current, etc.) relating to the capacitance of all the detection units A (1, 1) to A (5, 4) is obtained via the common extraction positions Xud, Yud. Can be taken out from the outside.

[Method for manufacturing sensor sheet]
Next, the manufacturing method of the sensor sheet of this embodiment is demonstrated. The manufacturing method of the sensor sheet of this embodiment has a front side electrode unit manufacturing process, a back side electrode unit manufacturing process, and a uniting process.

  A screen printer is used in the front electrode unit manufacturing process. The front-side electrode unit manufacturing process includes an outer lamination process, an inner lamination process, and an electrode lamination process. In the outer lamination step, first, the front outer wiring layer group 31 is printed on the upper surface of the front substrate 30 (the inner surface in the lamination direction; the lower surface shown in FIG. 11). Specifically, first, the outer wiring layer 37au and then the inner wiring layer 38au are printed. Next, the front side outer insulating layer 32 is printed from above (from the inside in the stacking direction). By the printing, the inside of the front side outer through hole 320 is filled with a part of the inner wiring layer 38au among the front side outer jumper wiring layers 1au to 5au.

  In the inner lamination step, first, the front inner wiring layer group 33 is printed on the upper surface of the front outer insulating layer 32 (the inner surface in the lamination direction, the lower surface shown in FIG. 11). Specifically, the outer wiring layer 37bu is printed first, and then the inner wiring layer 38bu is printed. Next, the front side inner insulating layer 34 is printed from above (from the inside in the stacking direction). By the printing, a part of the inner wiring layer 38bu among the front side inner jumper wiring layers 1bu to 5bu is filled in the front side inner through hole 340.

  In the electrode stacking step, first, the front electrode layers 1U to 5U are printed on the upper surface of the front inner insulating layer 34 (the inner surface in the stacking direction; the lower surface shown in FIG. 11). Next, the front side protective layer 35 is printed from above (from the inside in the stacking direction). In this way, the front electrode unit 3 is produced. The back side electrode unit manufacturing process is the same as the front side electrode unit manufacturing process.

  In the coalescing step, the front side electrode unit 3 is turned upside down (in the state shown in FIG. 11), and the front side protective layer 35 of the front side electrode unit 3 is placed through a front side adhesive layer (not shown, eg, double-sided tape). The lower surface is attached to the upper surface of the dielectric layer 2 that has been prepared in advance. Similarly, the upper surface of the back-side protective layer 45 of the back-side electrode unit 4 is attached to the lower surface of the dielectric layer 2 via a back-side adhesion layer (not shown). In this way, the sensor sheet 1 is produced.

[Configuration and movement of capacitive sensor]
Next, the configuration and movement of the capacitive sensor of this embodiment will be described. The permeation | transmission top view of the capacitive type sensor (the 1-the 4) provided with the sensor body produced from the sensor sheet | seat of this embodiment to Fig.13 (a)-(d) is shown. 13A to 13D, the front electrode layer is indicated by a solid line, and the back electrode layer is indicated by a dotted line. FIGS. 13A to 13D correspond to FIG.

  As shown in FIGS. 13A to 13D, the capacitance type sensor 8 includes a sensor body F, a control unit 6, and a connector 7. The sensor body F and the control unit 6 are electrically connected via a connector 7. The detection units indicated by hatching in FIGS. 13A to 13D are included in the concept of the “use target detection unit” of the present invention.

  As shown in FIG. 13A, the sensor body F of the first capacitive sensor 8 includes a plurality of detection units. The quantity of electricity related to the capacitance of the plurality of detection units is transmitted to the control unit 6 via the connector 7 connected to a single common extraction position Xud (see FIGS. 7 and 9).

  Hereinafter, the movement of the first capacitive sensor 8 will be briefly described with reference to FIG. It is assumed that a load is applied to the detection unit A (1, 4) shown in FIGS. When a load is applied to the detection unit A (1, 4), the detection unit A (1, 4) is compressed in the vertical direction. When the dielectric layer 2 of the detection unit A (1, 4) is compressed, the distance between the front electrode layer 1U and the back electrode layer 4D (that is, between the electrodes) facing each other in the vertical direction across the dielectric layer 2 (Distance) becomes smaller. For this reason, the electrostatic capacitance of detection part A (1, 4) becomes large.

  The amount of electricity related to the capacitance (for example, capacitance, voltage, current, etc.) is detected from the detection unit A (1, 4) through the conduction path L1u for the front electrode layer 1U shown in FIG. It is transmitted to the control unit 6 via the connector 7 shown in a). In addition, the amount of electricity related to the capacitance is detected from the detection unit A (1, 4) through the conduction path L4d for the back-side electrode layer 4D shown in FIG. 10 (d) and the connector 7 shown in FIG. 13 (a). It is transmitted to the control unit 6. Based on the amount of electricity, the control unit 6 detects the load of the detection unit A (1, 4). In this way, the control unit 6 detects the load distribution of the sensor body F.

  As shown in FIG. 13B, the sensor body F of the second capacitive sensor 8 includes a plurality of detection units. Some detection parts are partially cut. The operator inputs the partially cut area of the detection unit (corresponding to the electrode area of the capacitor) to the control unit 6. The control unit 6 corrects the electric quantity of the detection unit that is partially cut according to the input area.

  As shown in FIG. 13 (c), the sensor body F of the third capacitive sensor 8 has a frame shape (endless ring shape). The amount of electricity related to the capacitance of the plurality of detection units is transmitted to the control unit 6 via the connector 7 connected to a single common extraction position Yud.

  As shown in FIG. 13D, the sensor body F of the fourth capacitance type sensor 8 is produced by making a slit S in the sensor sheet 1 shown in FIG. The slits S cut all four front side outer jumper wiring layer groups 1Au to 4Au shown in FIG. In addition, the slits S cut all four back side inner jumper wiring layer groups 1Bd to 4Bd shown in FIG. For this reason, the lattice-like conduction paths L1u to L5u and L1d to L4d shown in FIGS. 8A to 8E and 10A to 10D are respectively two left and right portions across the slit S. It is divided into two. Therefore, it is not possible to extract the amount of electricity of all the detection units from a single common extraction position Xud, Yud. Therefore, two connectors 7 are arranged on the sensor body F. The two connectors 7 are independently arranged on both the left and right sides with the slit S interposed therebetween. The amount of electricity of all the detection units is transmitted to the control unit 6 via the two connectors 7.

  Thus, the sensor sheet 1 has a grid-like three-dimensional wiring structure (see FIGS. 7 and 9). For this reason, the electric quantity of a detection part can be taken out from all the common taking-out positions Xud and Yud irrespective of the shape etc. of the capacitive sensor 8 produced from the sensor sheet 1.

[Function and effect]
Next, the effect of the sensor sheet of this embodiment, a capacitive sensor, and the manufacturing method of a sensor sheet is demonstrated. As shown in FIG. 3, the sensor sheet 1 of the present embodiment includes a front electrode unit 3. As shown in FIG. 7, in the front side electrode unit 3, when viewed from the upper side or the lower side, among the front side inner jumper wiring layers 1bu to 5bu, the front side outer jumper wiring layers 1au to 5au, and the front side electrode layers 1U to 5U, At least two can be arranged in duplicate. For this reason, it is possible to increase the degree of freedom of arrangement of at least one of the front side inner jumper wiring layers 1bu to 5bu and the front side outer jumper wiring layers 1au to 5au. The same applies to the back electrode unit 4. Moreover, the ratio (area ratio) of the insensitive area E in the entire sensor sheet 1 shown in FIG. 1 can be reduced. That is, as shown in FIGS. 13A to 13D, the ratio of the insensitive area E to the entire sensor body F after fabrication can be reduced.

  As shown in FIGS. 13A to 13D, the sensor body F of the capacitive sensor 8 of the present embodiment is produced by cutting the sensor sheet 1. The sensor body F includes a use target detection unit (hatched portion) and common extraction positions Xud and Yud (extraction units xu, yu, xd, yd) for the use target detection unit. Therefore, a sensor body F having an arbitrary shape, that is, a capacitive sensor 8 can be produced from the sensor sheet 1 having a predetermined shape. Therefore, even when a plurality of capacitance type sensors 8 having different shapes and the like are necessary, members dedicated to the capacitance type sensors 8 one by one depending on the shape or the like of the desired capacitance type sensor 8. There is no need to design and produce a printing plate (for example, when the capacitive sensor 8 is produced by printing, and a molding die when the capacitive sensor 8 is produced by molding). That is, it is only necessary to produce the sensor body F from the sensor sheet 1 according to the desired shape or the like of the capacitive sensor 8. For this reason, the manufacturing cost of the capacitive sensor 8 can be reduced. In particular, when manufacturing a small quantity of various types of capacitive sensors 8, or when manufacturing a prototype of the capacitive sensor 8, the manufacturing cost can be reduced.

  As shown in FIG. 12, according to the front electrode unit 3 of the sensor sheet 1 of the present embodiment, the front inner jumper wiring layers 1bu to 5bu are electrically connected to the front electrode layers 1U to 5U via the front inner through holes 340. It is connected to the. Further, the front side outer jumper wiring layers 1 au to 5 au are electrically connected to the front side inner jumper wiring layers 1 bu to 5 bu through the front side outer through holes 320. The same applies to the back electrode unit 4. For this reason, in the sensor body F after manufacture, the detection part which cannot be detected does not occur easily. Therefore, the degree of freedom of the shape of the sensor body F can be increased.

  As shown in FIG. 13B, the control unit 6 of the capacitance type sensor 8 of the present embodiment can correct the electric quantity related to the capacitance of the use target detection unit that is partially cut. . For this reason, the detection accuracy of the capacitive sensor 8 can be increased.

  As shown in FIGS. 7 and 9, a plurality of common extraction positions Xud and Yud are arranged on the front, rear, left and right outer edges of the sensor sheet 1. All the front side electrode layers 1U to 5U and all the back side electrode layers 1D to 4D are electrically connected to any single common extraction position Xud, Yud. For this reason, the electric quantity regarding the electrostatic capacitance of all the detection parts A (1, 1) to A (5, 4) can be taken out from the outside via any single common extraction position Xud, Yud. . Therefore, as shown in FIGS. 13A to 13D, the wiring path between the sensor body F and the control unit 6 can be simplified.

  As shown in FIG. 11, the front electrode unit 3 includes a front shield layer 36. The front shield layer 36 is interposed between the front electrode layers 1U to 5U and the front outer jumper wiring layers 1au to 5au. The front shield layer 36 is electrically insulated from the front electrode layers 1U to 5U, the front inner jumper wiring layers 1bu to 5bu, and the front outer jumper wiring layers 1au to 5au. The front shield layer 36 is electrically grounded. Therefore, the front side outer jumper wiring layers 1au to 5au of the front side electrode unit 3 and the conductive layers of the back side electrode unit 4 (back side electrode layers 1D to 4D, back side inner jumper wiring layers 1bd to 4bd, back side outer jumper wiring layers 1ad to 4ad It is possible to prevent stray capacitance from being generated between the backside first extraction wiring layers 1ed to 4ed and the backside second extraction wiring layers 1fd to 4fd. The same applies to the back shield layer 46 of the back electrode unit 4.

  As shown in FIG. 4B, in the front side outer wiring layer group 31, the front side shield layer 36 is arranged next to the front side inner jumper wiring layers 1bu to 5bu in the horizontal direction. That is, the front side shield layer 36 and the front side inner jumper wiring layers 1bu to 5bu are arranged in the same layer. For this reason, the number of layers of the sensor sheet 1 can be reduced compared with the case where the front side shield layer 36 and the front side inner jumper wiring layers 1bu to 5bu are arranged in different layers. That is, the thickness of the sensor sheet 1 in the vertical direction can be reduced.

  As shown in FIGS. 1, 7, and 9, when viewed from the upper side or the lower side, the detection portions A (1, 1) to A (5, 4), the outer contact point P1, and the common contact point P3 are overlapped. ing. That is, when viewed from the upper side or the lower side, the outer contact P1 and the common contact P3 are arranged in the areas of the detection units A (1, 1) to A (5, 4). For this reason, it is easy to cut | disconnect parts other than the detection part A (1, 1) -A (5, 4) in the sensor sheet 1.

  As shown in FIGS. 8A to 8E, when viewed from the upper side or the lower side, conduction paths L1u to L5u for arbitrary front side electrode layers 1U to 5U of the front side electrode unit 3 (that is, front side inner jumper wiring layers) 1bu to 5bu, front outer jumper wiring layers 1au to 5au) are arranged in a lattice shape extending in the front-rear and left-right directions. For this reason, it is easy to ensure the conduction | electrical_connection of conduction | electrical_connection path L1u-L5u irrespective of the cutting location of the sensor sheet | seat 1. FIG. Therefore, it is easy to extract the amount of electricity from the detection units A (1, 1) to A (5, 4) of the sensor body F. Moreover, the cutting location of the sensor sheet 1 and the degree of freedom of the cutting shape, that is, the degree of freedom of the shape of the sensor body F can be increased. The same applies to the back electrode unit 4.

  The dielectric layer 2 is made of urethane foam. The front side base material 30 and the back side base material 40 are each made of PET. The front side outer insulating layer 32, the front side inner insulating layer 34, the back side outer insulating layer 42, and the back side inner insulating layer 44 each include urethane rubber. The front side outer wiring layer group 31, the front side inner wiring layer group 33, the back side outer wiring layer group 41, the back side inner wiring layer group 43, the front side electrode layers 1U to 5U, and the back side electrode layers 1D to 4D each include acrylic rubber. Yes. The front side protective layer 35 and the back side protective layer 45 are made of urethane rubber. Thus, the member which comprises the sensor sheet | seat 1 can be manufactured with the material containing an elastomer as a foam, an elastomer, and a base material. For this reason, the sensor sheet 1 is flexible. Therefore, the sensor sheet 1 can be easily cut with a cutter (cutter, scissors, cutting tool, etc.).

  The manufacturing method of the sensor sheet 1 of this embodiment has a front side electrode unit manufacturing process, a back side electrode unit manufacturing process, and a uniting process. The front-side electrode unit manufacturing process includes an outer lamination process, an inner lamination process, and an electrode lamination process. In the outer lamination step, the front side outer wiring layer group 31 and the front side outer insulating layer 32 are printed by screen printing. For this reason, the formation accuracy (shape accuracy, position accuracy, etc.) of the front side outer wiring layer group 31 and the front side outer insulating layer 32 can be increased. Therefore, a part of the front side outer jumper wiring layers 1 au to 5 au can be easily arranged inside the front side outer through hole 320. Therefore, the front side outer jumper wiring layers 1au to 5au and the front side inner jumper wiring layers 1bu to 5bu can be easily electrically connected. Further, as shown in FIG. 11, the outer wiring layer 37au and the inner wiring layer 38au can be stacked with high accuracy. Further, as shown in FIG. 4A, the front side outer jumper wiring layers 1au to 5au, the front side first extraction wiring layers 1eu to 5eu, and the front side second extraction wiring layers 1fu to 5fu are electrically insulated from each other. In a state, it can arrange with high precision. The same applies to the back side electrode unit manufacturing process.

  Similarly, in the inner lamination step, the front side inner wiring layer group 33 and the front side inner insulating layer 34 are printed by screen printing. For this reason, the formation accuracy of the front side inner wiring layer group 33 and the front side inner insulating layer 34 can be increased. Therefore, a part of the front side inner jumper wiring layers 1bu to 5bu can be easily arranged inside the front side inner through hole 340. Therefore, the front side inner jumper wiring layers 1bu to 5bu and the front side electrode layers 1U to 5U can be easily electrically connected. Further, as shown in FIG. 11, the outer wiring layer 37bu and the inner wiring layer 38bu can be stacked with high accuracy. Moreover, as shown in FIG.4 (b), the front side inner jumper wiring layers 1bu-5bu and the front side shield layer 36 can each be arrange | positioned with sufficient precision in the state electrically insulated. The same applies to the back side electrode unit manufacturing process.

<Second embodiment>
The three-dimensional wiring structure differs between the sensor sheet, the capacitive sensor, and the sensor sheet manufacturing method of the present embodiment, and the sensor sheet, the capacitive sensor, and the sensor sheet manufacturing method of the first embodiment. Here, only differences will be described.

  In FIG. 14, the permeation | transmission top view of the front side electrode unit of the sensor sheet | seat of this embodiment is shown. In addition, about the site | part corresponding to FIG. 7, it shows with the same code | symbol. The front outer jumper wiring layers 1au to 8au are indicated by solid lines, and the front inner jumper wiring layers 1bu to 8bu are indicated by dotted lines. Further, the belt-like front side outer jumper wiring layers 1 au to 8 au and the front side inner jumper wiring layers 1 bu to 8 bu are indicated by “line drawings”. Further, for convenience of explanation, the back electrode layers 1D to 4D are indicated by alternate long and short dash lines. In addition, a total of 32 detection units are hatched. Further, the inner contact P2 is indicated by x.

  As shown in FIG. 14, the inner contact P2 is a contact portion between the front electrode layers 1U to 8U and the front inner jumper wiring layers 1bu to 8bu. When viewed from the upper side or the lower side, any single front-side electrode layer 1U to 8U and four front-side inner jumper wiring layers 1bu to 8bu are arranged in an overlapping manner. For example, the front-side electrode layer 1U and the front-side inner jumper wiring layers 1bu, 6bu, 3bu, and 8bu are arranged in an overlapping manner.

  When viewed from the upper side or the lower side, the front side inner jumper wiring layers 1bu to 8bu, the portion of the front side outer insulating layer 32 excluding the front side outer through-hole 320 (see FIG. 12), the front side outer jumper wiring layers 1au to 8au, An “outer insulating area” is arranged in the overlapping portion. As seen from above or below, the front side electrode layers 1U to 8U, the portion of the front side inner insulating layer 34 excluding the front side inner through-hole 340 (see FIG. 12), the front side inner jumper wiring layers 1bu to 8bu, An “inner insulation area” is arranged in the overlapping portion.

  When viewed from the upper side or the lower side, any single back-side electrode layers 1D to 4D and four front-side outer jumper wiring layers 1au to 8au are arranged in an overlapping manner. For example, the back side electrode layer 1D and the front side outer jumper wiring layers 1au to 4au are arranged in an overlapping manner.

  The front electrode unit 3 does not include a front shield layer. At the left end portion (surface direction outer end portion) and right end portion (surface direction outer end portion) of the front side outer jumper wiring layers 1 au to 8 au, extraction portions yu are arranged. Further, an extraction portion xu is arranged at the front end portion (surface direction outer end portion) and the rear end portion (surface direction outer end portion) of the front side inner jumper wiring layers 1bu to 8bu. In addition, common extraction positions Xud and Yud are arranged on the outer edge of the sensor sheet, one for each of the two electrode layers (front-side electrode layers 1U to 8U, back-side electrode layers 1D to 4D).

  As an example, as shown by a thick line in FIG. 14, the sensor sheet 1 is provided with a conduction path L1u for the front electrode layer 1U. The conduction path L1u includes a front side inner jumper wiring layer 1bu and a front side outer jumper wiring layer 1au.

  The sensor sheet, the capacitive sensor, and the sensor sheet manufacturing method of the present embodiment, and the sensor sheet, the capacitive sensor, and the sensor sheet manufacturing method of the first embodiment have the same configuration. It has the same effect.

  Like the front electrode unit 3 of the sensor sheet of the present embodiment, all eight front inner jumper wiring layers 1bu to 8bu are overlapped with respect to any single front electrode layer 1U to 8U. It does not have to be. Further, all the eight front side outer jumper wiring layers 1au to 8au may not be overlapped with respect to any single back side electrode layer 1D to 4D.

<Others>
The embodiments of the sensor sheet, the capacitive sensor, and the sensor sheet manufacturing method of the present invention have been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

  The sensor sheet 1 shown in FIG. 1 may be used as the capacitive sensor 8 as it is without being cut. The direction in which the slit S shown in FIG. 13D is inserted is not particularly limited. The slits S may be inserted in the horizontal direction (front-rear direction, left-right direction, front-rear direction, and direction intersecting the left-right direction). The slit S does not have to be opened at the outer edge of the sensor sheet 1. Further, the slits S may be provided in a direction intersecting the vertical direction, the vertical direction, and the horizontal direction. Further, the slits S may be disposed on the upper surface and the lower surface of the sensor sheet 1. That is, a groove-shaped (notch-shaped) slit S extending in the vertical direction may be disposed in the sensor sheet 1. Thus, when the arrangement target of the capacitive sensor 8 has a corner (for example, when the arrangement target is a three-dimensional object), the sensor body F can be easily bent (or easily folded) along the corner. .

  Constituent members of the sensor sheet 1 (for example, front side electrode layers 1U to 5U, front side outer jumper wiring layers 1au to 5au, front side first extraction wiring layers 1eu to 5eu, front side second extraction wiring layers 1fu to 5fu, front side inner jumper wiring layers 1bu to 5bu, front side shield layer 36, back side electrode layers 1D to 4D, back side outside jumper wiring layers 1ad to 4ad, back side first extraction wiring layers 1ed to 4ed, back side second extraction wiring layers 1fd to 4fd, back side inside jumper wiring layers 1bd to 4bd, the back shield layer 46, etc.) are not particularly limited in shape, position, and number of arrangements.

  For example, the arrangement number of the front side electrode layers 1U to 5U shown in FIG. 1 and the arrangement number of the back side electrode layers 1D to 4D may be the same. The shape and area of the front electrode layers 1U to 5U may differ from the shape and area of the back electrode layers 1D to 4D. The crossing direction of the front electrode layers 1U to 5U and the back electrode layers 1D to 4D is not particularly limited.

  The number of layers in the vertical direction of the front side jumper wiring layers (front side outer jumper wiring layers 1au to 5au, front side inner jumper wiring layers 1bu to 5bu) is not particularly limited. You may arrange | position a front side jumper wiring layer over three or more layers (an insulating layer with a penetration part is arranged between layers). The same applies to the back side jumper wiring layers (back side outside jumper wiring layers 1ad to 4ad, back side inside jumper wiring layers 1bd to 4bd).

  In addition, the number, shape, area, and the like of the detection units A (1, 1) to A (5, 4) illustrated in FIG. 1 are not particularly limited. You may arrange | position the tear line which shows the shape of the sensor body F which can be cut | disconnected (refer FIG. 13 (a)-(d)) on the surface and the back surface of the sensor sheet | seat 1. FIG. A cutting trace may remain on the outer edge of the sensor body F after cutting. By observing the cutting trace, it can be confirmed that the sensor body F has been cut from the sensor sheet 1.

  The number, shape, area, and the like of the outer contact P1, the inner contact P2, and the common contact P3 shown in FIGS. 7, 9, and 14 are not particularly limited. For example, the outer contact P1 (outer penetration portion), the inner contact P2 (inner penetration portion), and the common contact P3 may be dot-like, linear, or planar (circular, polygonal, etc.). The extending shapes of the conduction paths L1u to L5u and L1d to L4d shown in FIGS. 8A to 8E and 10A to 10D are not particularly limited. The conduction paths L1u to L5u and L1d to L4d may not be disposed over the entire surface of the sensor sheet 1. When the cutting location of the sensor sheet 1 is determined in advance (see FIGS. 13A to 13D), the conduction paths L1u to L5u and L1d to L4d may be arranged avoiding the cutting location.

  Layers constituting front side outer wiring layer group 31, front side inner wiring layer group 33, back side outer wiring layer group 41, back side inner wiring layer group 43 (outer wiring layer 37au, inner wiring layer 38au, outer wiring layer 37bu, inner wiring layer The number of 38bu) is not particularly limited. A single layer or three or more layers may be used.

  The front-side electrode unit 3 or the back-side electrode unit 4 may not be a three-dimensional wiring unit. At least one of the front side base material 30, the back side base material 40, the front side protective layer 35, the back side protective layer 45, the front side shield layer 36, the back side shield layer 46, the front side adhesion layer, and the back side adhesion layer is disposed on the sensor sheet 1. You don't have to.

  Further, at least one of the outer insulating layer (front side outer insulating layer 32, back side outer insulating layer 42) and inner insulating layer (front side inner insulating layer 34, back side inner insulating layer 44) is not disposed on the sensor sheet 1. May be. For example, what is necessary is just to comprise a front side jumper wiring layer and a back side jumper wiring layer by the conducting wire (an electric wire, a wire, a cable, etc.) with an insulating film. In addition, what is necessary is just to set the outer side contact P1, the inner side contact P2, and the common contact P3 by exposing a conducting wire to the exterior suitably (peeling an insulating film). In addition, the dielectric layer 2, the outer insulating layer, and the inner insulating layer may be gas (air, nitrogen, etc.), liquid (oil, etc.) and the like. For example, as the dielectric layer 2, the outer insulating layer, and the inner insulating layer, bags filled with gas or liquid may be disposed. Further, the dielectric layer 2, the outer insulating layer, and the inner insulating layer may be set by a support column extending in the stacking direction and arranged in a plane direction (in other words, by a gas layer secured by the support column). This eliminates the need for the “solid” dielectric layer 2, the outer insulating layer, and the inner insulating layer.

  In the front side electrode unit 3 shown in FIG. 11, the front side outer through-hole 320 accommodates at least one of a part of the front side outer jumper wiring layers 1au to 8au and a part of the front side inner jumper wiring layers 1bu to 8bu. If it is. For example, only a part of the front side inner jumper wiring layers 1 bu to 8 bu may be accommodated in the front side outer through hole 320. Further, a part of the front side outer jumper wiring layers 1au to 8au and a part of the front side inner jumper wiring layers 1bu to 8bu may be accommodated in the front side outer through hole 320. The same applies to the back electrode unit 4.

  Similarly, the front side inner through-hole 340 may be accommodated in at least one of a part of the front side inner jumper wiring layers 1bu to 8bu and a part of the front side electrode layers 1U to 8U. For example, only a part of the front-side electrode layers 1U to 8U may be accommodated in the front-side inner through hole 340. Further, a part of the front side inner jumper wiring layers 1bu to 8bu and a part of the front side electrode layers 1U to 8U may be accommodated in the front side inner through hole 340. The same applies to the back electrode unit 4.

  The shapes of the outer through portion (front side outer through hole 320, back side outer through hole 420) and inner through portion (front side inner through hole 340, back side inner through hole 440) are not particularly limited. The outer insulating layer (front-side outer insulating layer 32, the back-side outer insulating layer 42), the inner insulating layer (front-side inner insulating layer 34, the back-side inner insulating layer 44) has a notch shape that is recessed inward in the surface direction from the outer edge. Also good. The outer penetrating portion may penetrate the outer insulating layer, and the inner penetrating portion may penetrate the inner insulating layer in the vertical direction.

  The manufacturing method (laminating method of each layer) of the sensor sheet 1 is not particularly limited. In the outer lamination process and the inner lamination process, various printing methods (for example, screen printing, inkjet printing, flexographic printing, gravure printing, pad printing, lithography, transfer method, etc.) can be used.

  The front side electrode layers 1U to 5U, the front side outer wiring layer group 31, the front side inner wiring layer group 33, the back side electrode layers 1D to 4D, the back side outer wiring layer group 41, and the back side inner wiring layer group 43 are flexible and have elasticity. From the viewpoint, it is preferable to include an elastomer and a conductive material. Elastomers include urethane rubber, acrylic rubber, silicone rubber, ethylene-propylene copolymer rubber, natural rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber (nitrile rubber), epichlorohydrin rubber, and chlorosulfonated polyethylene. Chlorinated polyethylene is preferred. Examples of the conductive material include silver, gold, copper, nickel, rhodium, palladium, chromium, titanium, platinum, iron, metal particles made of these alloys, metal oxide particles made of zinc oxide, titanium oxide, etc., titanium carbonate A metal carbide particle composed of silver, gold, copper, platinum, nickel, etc., a conductive carbon material such as conductive carbon black, carbon nanotube, graphite, and graphene may be appropriately selected. .

  As the front-side base material 30 and the back-side base material 40, resin films such as PET, polyethylene naphthalate (PEN), polyimide, and polyethylene, elastomer sheets, stretchable cloths, and the like are suitable. As the front side protective layer 35 and the back side protective layer 45, urethane rubber, acrylic rubber, silicone rubber, ethylene-propylene copolymer rubber, natural rubber, styrene-butadiene copolymer rubber, nitrile rubber, hydrogenated nitrile rubber, epichlorohydrin rubber Chlorosulfonated polyethylene, chlorinated polyethylene and the like are suitable.

  The material of the front side adhesive layer and the back side adhesive layer is not particularly limited. The flexibility necessary for the deformation of the sensor sheet 1 may be prevented. For example, double-sided tapes such as DCX-1018 manufactured by 3M Japan Co., Ltd. and GA5905 manufactured by Nitto Denko Corporation may be used as the front side adhesive layer and the back side adhesive layer. Alternatively, an adhesive polymer having a Young's modulus of 100 MPa or less may be used as the front side adhesive layer and the back side adhesive layer. The reason why the pressure is set to 100 MPa or less is to ensure flexibility necessary for deformation of the sensor sheet 1.

  As the dielectric layer 2, it is preferable to use an elastomer or a resin having a relatively high relative dielectric constant (including a foam). For example, those having a relative dielectric constant of 5 or more (measurement frequency 100 Hz) are suitable. Examples of such elastomers include urethane rubber, silicone rubber, nitrile rubber, hydrogenated nitrile rubber, acrylic rubber, natural rubber, isoprene rubber, ethylene-propylene copolymer rubber, butyl rubber, styrene-butadiene rubber, fluorine rubber, epichlorohydrin rubber, Examples include chloroprene rubber, chlorinated polyethylene, and chlorosulfonated polyethylene. Examples of the resin include polyethylene, polypropylene, polyurethane, polystyrene (including crosslinked expanded polystyrene), polyvinyl chloride, vinylidene chloride copolymer, ethylene-vinyl acetate copolymer, ethylene-vinyl acetate-acrylic ester copolymer. Etc. The same applies to the materials of the outer insulating layer (front side outer insulating layer 32, back side outer insulating layer 42) and inner insulating layer (front side inner insulating layer 34, back side inner insulating layer 44).

  Applications of the sensor sheet and the capacitive sensor of the present invention are not particularly limited. For example, the load distribution of the wound part can be measured by winding it around a desired part (arm part or the like) of the robot. Moreover, the load distribution of the sole can be measured by laying on the shoe sole as an insole sensor.

  1: Sensor sheet, 1Ad to 5Ad: Back side outer jumper wiring layer group, 1Au to 4Au: Front side outer jumper wiring layer group, 1Bd to 4Bd: Back side inner jumper wiring layer group, 1Bu to 5Bu: Front side inner jumper wiring layer group, 1D -4D: Back side electrode layer (electrode layer), 1Ed-4Ed: Back side first extraction wiring layer group, 1Eu-5Eu: Front side first extraction wiring layer group, 1Fd-4Fd: Back side second extraction wiring layer group, 1Fu-5Fu : Front side second extraction wiring layer group, 1U to 8U: Front side electrode layer (electrode layer), 1ad to 4ad: Back side outer jumper wiring layer (outer jumper wiring layer), 1au to 8au: Front side outer jumper wiring layer (outer jumper wiring) Layer), 1bd-4bd: back inner jumper wiring layer (inner jumper wiring layer), 1bu-8bu: front inner jumper wiring layer (inner jumper) Wiring layer), 1ed to 4ed: back side first extraction wiring layer, 1eu to 5eu: front side first extraction wiring layer, 1fd to 4fd: back side second extraction wiring layer, 1fu to 5fu: front side second extraction wiring layer, 2: Dielectric layer, 3: front side electrode unit (electrode unit, three-dimensional wiring unit), 4: back side electrode unit (electrode unit, three-dimensional wiring unit), 6: control unit, 7: connector, 8: capacitance sensor, 30: Front side base material (base material), 31: front side outer wiring layer group, 32: front side outer insulating layer (outer insulating layer), 33: front side inner wiring layer group, 34: front side inner insulating layer (inner insulating layer), 35: Front side protective layer, 36: Front side shield layer (shield layer), 37au: Outer wiring layer, 37bu: Outer wiring layer, 38au: Inner wiring layer, 38bu: Inner wiring layer, 40: Back side base material (base material), 41: Back side outer wiring layer group, 42 Back side outside insulating layer (outside insulating layer), 43: Back side inside wiring layer group, 44: Back side inside insulating layer (inside insulating layer), 45: Back side protective layer, 46: Back side shield layer (shield layer), 320: Front side outside Through hole (outside through portion), 340: front side inside through hole (inside through portion), 420: back side outside through hole (outside through portion), 440: back side inside through hole (inside through portion), A (1, 1) A (5, 4): detection unit, D: pressure sensitive area, E: dead area, F: sensor body, L1d to L4d: conduction path, L1u to L5u: conduction path, P1: outer contact, P2: inner contact , P3: common contact, S: slit, Xd: extraction position, Xu: extraction position, Xud: common extraction position, Yd: extraction position, Yu: extraction position, Yud: common extraction position, xd: extraction part, xu: extraction Part, yd: extraction part, yu: extraction part

Claims (11)

A dielectric layer;
A pair of electrode units disposed on both sides of the dielectric layer in the stacking direction, each having an electrode layer;
With
A sensor sheet in which a detection unit is set in a portion where the pair of electrode layers overlap when viewed from the stacking direction,
At least one of the pair of electrode units is
An inner jumper wiring layer disposed outside the electrode layer in the stacking direction and electrically connected to the electrode layer;
An outer jumper wiring layer disposed outside the inner jumper wiring layer in the stacking direction and electrically connected to the inner jumper wiring layer;
A three-dimensional wiring unit having a sensor sheet. As seen from the stacking direction, the three-dimensional wiring unit is
An inner insulating area where the electrode layer and the inner jumper wiring layer are electrically insulated;
An inner contact where the electrode layer and the inner jumper wiring layer are electrically connected;
An outer insulating area in which the inner jumper wiring layer and the outer jumper wiring layer are electrically insulated; and
An outer contact to which the inner jumper wiring layer and the outer jumper wiring layer are electrically connected;
The sensor sheet according to claim 1. The three-dimensional wiring unit is
An inner insulating layer interposed between the electrode layer and the inner jumper wiring layer and having an inner through portion penetrating itself in the front-back direction;
An outer insulating layer interposed between the inner jumper wiring layer and the outer jumper wiring layer and having an outer through portion penetrating itself in the front-back direction;
Have
Seen from the stacking direction
The inner insulating area is disposed in a portion where the electrode layer, the portion of the inner insulating layer excluding the inner penetrating portion, and the inner jumper wiring layer overlap,
The inner contact is disposed at a portion where the electrode layer, the inner through portion, and the inner jumper wiring layer overlap,
The outer insulating area is disposed in a portion where the inner jumper wiring layer, a portion of the outer insulating layer excluding the outer through portion, and the outer jumper wiring layer overlap,
The sensor sheet according to claim 2, wherein the outer contact point is disposed at a portion where the inner jumper wiring layer, the outer through portion, and the outer jumper wiring layer overlap. As seen from the stacking direction, the three-dimensional wiring unit is
The electrode layer, the inner jumper wiring layer and the outer jumper wiring layer have a common contact to be electrically connected,
4. The sensor sheet according to claim 2, wherein at least one of the inner contact, the outer contact, and the common contact and the detection unit are overlapped when viewed from the stacking direction.   The three-dimensional wiring unit is interposed between the electrode layer and the outer jumper wiring layer, electrically insulated from the electrode layer, the inner jumper wiring layer, and the outer jumper wiring layer, and electrically grounded. The sensor sheet according to any one of claims 1 to 4, further comprising a shield layer. The shield layer is arranged adjacent to the surface direction of the inner jumper wiring layer,
When viewed from the stacking direction, the inner jumper wiring layer is disposed overlapping the electrode layer,
The sensor sheet according to claim 5, wherein the shield layer is disposed so as not to overlap the electrode layer when viewed from the stacking direction.   The inner jumper wiring layer and the outer jumper wiring layer that are electrically connected to any of the electrode layers as viewed from the stacking direction are arranged in a lattice pattern. Sensor sheet. A pressure-sensitive area in which a plurality of the detection units are set;
It is arranged next to the pressure sensitive area in the surface direction, and the amount of electricity related to the capacitance of the plurality of detection units can be extracted from the outside via at least one of the inner jumper wiring layer and the outer jumper wiring layer. Insensitive area having a plurality of extraction parts,
A sensor sheet according to claim 1, comprising: Among the plurality of detection units, the detection unit that is an extraction target of the electric quantity is a use target detection unit,
Of the sensor sheet, a part having the use target detection unit and the extraction unit for the use target detection unit is used as a sensor body.
The sensor sheet according to claim 8, wherein the sensor sheet can be cut while securing the sensor body. The sensor body of the sensor sheet according to claim 9,
When electrically connected to the take-out unit and the sensor body has the use target detection unit partially cut, a control unit that corrects the amount of electricity of the use target detection unit;
A capacitive sensor comprising: It is a manufacturing method of the sensor sheet according to claim 3,
Printing the outer jumper wiring layer on a substrate, and printing the outer insulating layer from the outer lamination step;
Printing the inner jumper wiring layer on the outer insulating layer, and printing the inner insulating layer thereon;
A method for producing a sensor sheet having

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