JP2018129491A - Pressure-sensitive adhesive sheet, and method of manufacturing semiconductor chip or semiconductor component using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet which prevents a pressure-sensitive adhesive from attaching to a chip after dicing and which is excellent in chip peelability, in a peeling process where a jig is pressed against a substrate film back face of the pressure-sensitive adhesive sheet formed in a chip to be moved back and forth.SOLUTION: There is provided a pressure-sensitive adhesive sheet excellent in chip peelability or the like, which is formed by laminating an ultraviolet-curable pressure-sensitive adhesive layer on one surface of a substrate film. The pressure-sensitive adhesive sheet is characterized in that the ultraviolet-curable pressure-sensitive adhesive layer contains 100 pts.mass of a (meth)acrylic acid ester copolymer, 40-150 pts.mass of a photopolymerizable compound, 0.1-10 pts.mass of a polyfunctional isocyanate hardener, and 0.1-10 pts.mass of a photoinitiator, the other surface of the substrate film has a dynamic friction coefficient of 0.1-0.8, and the pressure-sensitive adhesive sheet has a Shore D hardness of 25-45.SELECTED DRAWING: Figure 1

Description

The present invention relates to an adhesive sheet and a method for manufacturing a semiconductor chip or a semiconductor component using the adhesive sheet.

The semiconductor wafer or substrate is usually manufactured through the following steps. After sticking the adhesive sheet to the wafer, after cutting the chip (dicing), stretching the adhesive sheet (expanding), irradiating active rays such as ultraviolet rays and / or electron beams, and curing the adhesive layer of the adhesive sheet, Manufactured through various steps such as chip peeling (pickup) from the adhesive sheet. As the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet used in these steps, it has transparency to actinic rays and can be formed into a three-dimensional network by a polymerization curing reaction with ultraviolet rays or the like, and has a photopolymerizable unsaturated double bond in the molecule. Materials containing compounds (polyfunctional oligomers) have been disclosed (Patent Document 1 and Patent Document 2).
By using such a material, it is possible to obtain an adhesive sheet that has sufficient adhesive force when shearing the chip in the dicing process, but has an adhesive force that is reduced to the extent that no adhesive residue remains in the pickup process.

JP 2006-049509 A JP 2007-246633 A

However, recent semiconductor wafers or substrates often have bumps of several μm to several hundred μm, and chip skipping may occur during dicing if the adhesive sheet has poor bump followability. In addition, the pickup is usually obtained by pushing up the semiconductor wafer or substrate one by one from the back side (lower surface) side of the base film using a pin (pickup needle), and peeling the semiconductor wafer or substrate from the adhesive sheet. This method is not efficient because it is performed for each semiconductor wafer.
Moreover, when irradiating actinic rays, such as an ultraviolet-ray, and hardening the adhesive layer of an adhesive sheet, it has become a subject that an odor generate | occur | produces from an adhesive sheet.

The present invention has been made in view of the above-mentioned problems, and its purpose is that the adhesive sheet has good bump followability to a semiconductor wafer or substrate, has low odor when irradiated with actinic rays such as ultraviolet rays, and the like. An object of the present invention is to provide a pressure-sensitive adhesive sheet that can be achieved by rubbing with a jig or the like from the lower surface side of a base film, and a method for manufacturing a semiconductor chip or a semiconductor component using the same.

The present invention employs the following means in order to solve the above problems.
(1) An adhesive sheet obtained by laminating an ultraviolet curable adhesive layer on one surface of a substrate film,
The UV-curable pressure-sensitive adhesive layer is composed of 100 parts by weight of a (meth) acrylic acid ester copolymer, 40 to 150 parts by weight of a photopolymerizable compound, 0.1 to 10 parts by weight of a polyfunctional isocyanate curing agent, and a photopolymerization initiator 0. 1 to 10 parts by weight,
The pressure-sensitive adhesive sheet is characterized in that the other surface of the base film has a coefficient of dynamic friction of 0.1 to 0.8 and the pressure-sensitive adhesive sheet has a Shore D hardness of 25 to 45.
(2) The pressure-sensitive adhesive according to (1), characterized in that an odor value after irradiation of 150 mJ / cm ^{2 of} ultraviolet light and 10 minutes after irradiation is 1,000 or less from the lower surface of the base film of the pressure-sensitive adhesive sheet. Sheet.
(3) The adhesive sheet is a dicing tape,
(A) An attaching step of attaching the semiconductor wafer or substrate and the ring frame with the adhesive sheet according to (1) or (2),
(B) a dicing process in which a semiconductor wafer or substrate is diced to be processed into a semiconductor chip or a semiconductor component;
(C) an ultraviolet irradiation step of irradiating the base film surface of the adhesive sheet with ultraviolet rays;
(D) a peeling step of peeling the semiconductor chip or the semiconductor component by rubbing the lower surface of the base film of the pressure-sensitive adhesive sheet;
A method for manufacturing a semiconductor chip or a semiconductor component.

The present invention has good bump followability to the conductive wafer or substrate of the pressure-sensitive adhesive sheet, has less odor when irradiated with actinic rays such as ultraviolet rays, and can be achieved by rubbing the pickup from the lower surface side of the base film with a jig or the like. , A pressure-sensitive adhesive sheet, and a method of manufacturing a semiconductor chip or a semiconductor component using the same can be provided.

It is a figure explaining the process of peeling the semiconductor chip or semiconductor component which concerns on embodiment of this invention.

Hereinafter, preferred embodiments for carrying out the present invention will be described. The present invention is a pressure-sensitive adhesive sheet obtained by laminating an ultraviolet curable pressure-sensitive adhesive layer on a base film, wherein the dynamic friction coefficient of the base film surface is 0.1 to 0.8, and the Shore D hardness of the pressure-sensitive adhesive sheet Is 25 to 45.

<Adhesive sheet>
The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet obtained by laminating an ultraviolet curable pressure-sensitive adhesive layer on a base film, and has a Shore D hardness of 25 or more and 45 or less, preferably 30 to 40. When the Shore D hardness is less than 25, a paste residue with the base film and the adhesive attached is generated. When the Shore D hardness exceeds 45, the followability with respect to the bump decreases.

<Base film>
The base film of the present invention is made of polyvinyl chloride, ethylene-vinyl acetate copolymer, ethylene-acrylic acid-acrylic ester film, ethylene-ethyl acrylate copolymer, polyethylene, polypropylene, propylene-based copolymer, ethylene- Examples thereof include an acrylic acid copolymer and an ionomer resin obtained by crosslinking an ethylene- (meth) acrylic acid copolymer or an ethylene- (meth) acrylic acid- (meth) acrylic acid ester copolymer with a metal ion. The base film may be a mixture or copolymer of these resins, and may be a laminate of films or sheets made of these resins. The dynamic friction coefficient of the base film is 0.1 or more and 0.8 or less, preferably 0.2 or more and 0.4 or less. If it is this range, it can peel favorably, when rubbing the base film lower surface of an adhesive sheet and peeling a semiconductor chip or the said semiconductor component.
When the dynamic friction coefficient of the base film is less than 0.1, winding deviation tends to occur when the pressure-sensitive adhesive sheet is wound in a roll shape, and it is difficult to attach the adhesive sheet to a semiconductor wafer or substrate, and the bump followability may be deteriorated. Moreover, if the dynamic friction coefficient of a base film exceeds 0.8, peelability will fall.

It is preferable to use an ionomer resin for the base film. Among ionomer resins, if an ionomer resin obtained by crosslinking a copolymer having an ethylene unit, a methacrylic acid unit, and a (meth) acrylic acid alkyl ester unit with a metal ion such as Na ⁺ , K ⁺ , or Zn ²⁺ is used, cutting is performed. The dust suppressing effect is remarkable and is preferably used.

The thickness of the base film is preferably 50 to 200 μm, more preferably 70 to 150 μm.

The base film is preferably subjected to an antistatic treatment. As the antistatic treatment, there are a treatment of adding an antistatic agent to the base film and a treatment of applying the antistatic agent to the surface of the base film.

As the antistatic agent, for example, a quaternary amine salt monomer can be used. Examples of the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, methylethylaminoethyl (meth) acrylate quaternary chloride, p-dimethyl. Examples include aminostyrene quaternary chloride and p-diethylaminostyrene quaternary chloride. Of these, dimethylaminoethyl methacrylate quaternary chloride is preferred.

An ultraviolet curable pressure-sensitive adhesive can be laminated on one side of the base film, and the other side can be an embossed surface having an average surface roughness (Ra) of 0.1 to 1.5 μm. By having the embossed surface, the base film can be easily expanded in the expanding step.

In order to improve the expandability, a slip agent can be applied to the base film, or a slip agent can be kneaded into the base film.

The slip agent is not particularly limited as long as it is a substance that reduces the friction coefficient of the pressure-sensitive adhesive sheet and the expanding device. For example, silicone compounds such as silicone resins and (modified) silicone oils, fluororesins, hexagonal boron nitride, carbon black, And molybdenum disulfide. These friction reducing agents may mix a plurality of components. Since manufacture of an electronic component is performed in a clean room, it is preferable to use a silicone compound or a fluororesin. Among silicone compounds, a copolymer having a silicone macromonomer unit is particularly preferred because it has good compatibility with the antistatic layer and can achieve a balance between antistatic properties and expandability.

<UV curable adhesive layer>
The UV-curable pressure-sensitive adhesive layer contains a (meth) acrylic acid ester copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent and a photopolymerization initiator, diluted with an organic solvent, applied to a substrate film, and dried. Obtained.
((Meth) acrylic acid ester copolymer)
The (meth) acrylic acid ester copolymer used in the present invention is a polymer obtained by polymerizing acrylic acid, methacrylic acid and ester monomers thereof, and an unsaturated monomer copolymerizable with these monomers (for example, vinyl acetate). , Styrene, and acrylonitrile). The ultraviolet curable pressure-sensitive adhesive constituting the ultraviolet curable pressure-sensitive adhesive layer of the present invention is preferably an acrylic polymer that easily adjusts the adhesive strength, and the adhesive strength can be adjusted more precisely by containing a curing agent. .

Examples of the main monomer of the (meth) acrylic polymer of the present invention include n-butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, and octyl. (Meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl Examples include (meth) acrylic monomers such as (meth) acrylate, myristyl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, and benzyl (meth) acrylate.

As this (meth) acrylic monomer, one having a monomer containing a functional group at least in part is particularly preferable. The monomer containing this functional group is preferably a hydroxyl group, a carboxyl group, an epoxy group, an amide group, an amino group, a methylol group, a sulfonic acid group, a sulfamic acid group, or a phosphite group. Of these, vinyl compounds having these functional groups are particularly preferable, and vinyl compounds having hydroxyl groups are particularly preferable. The vinyl compound here includes acrylate.

Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate.

Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.

Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.

Examples of the monomer having an amide group include (meth) acrylamide, N, N-dimethylaminoethyl (meth) acrylate and the like.

Examples of the monomer having a methylol group include N-methylolacrylamide.

(Photopolymerizable compound)
Examples of the photopolymerizable compound include trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diester. Examples include acrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, cyanuric acid triethyl acrylate, and commercially available oligoester acrylate.

As the photopolymerizable compound, a urethane acrylate oligomer can be used in addition to the acrylate compound. The urethane acrylate oligomer is obtained by reacting a (meth) acrylate having a hydroxyl group with a terminal isocyanate urethane prepolymer obtained by reacting a polyol compound such as polyester type or polyether type with a polyvalent isocyanate compound.

Examples of the polyvalent isocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane 4,4-diisocyanate, and trimethylhexamethylene diisocyanate. , Hexamethylene diisocyanate, isophorone diisocyanate and the like can be used. Examples of the (meth) acrylate having a hydroxy group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, polyethylene glycol (meth) acrylate, pentaerythritol triacrylate, and glycidol di (meth). Acrylate, dipentaerythritol pentaacrylate and the like are used.

As the photopolymerizable compound, a urethane acrylate oligomer having 4 or more carbon-carbon double bonds is preferable in that the adhesive is cured after irradiation with ultraviolet rays or the like.

The compounding quantity of a photopolymerizable compound is 40 to 150 mass parts with respect to 100 mass parts of (meth) acrylic acid ester copolymers, Preferably 60 to 110 mass parts is good. When the blending amount of the photopolymerizable compound is less than 40 parts by mass, the peelability of the pressure-sensitive adhesive sheet after UV irradiation is lowered, and when it exceeds 150 parts by mass, adhesive residue is generated on the side surface of the chip.

(Multifunctional isocyanate curing agent)
The blend of the polyfunctional isocyanate curing agent of the present invention is 0.1 parts by mass or more and 10 parts by mass or less, and preferably 2 parts by mass or more and 7 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic polymer. When the blending ratio of the curing agent is less than 0.1 parts by mass, adhesive residue is generated on the side surface of the chip, and when it exceeds 10 parts by mass, the followability to the bumps decreases.

Examples of the polyfunctional isocyanate curing agent include an aromatic polyisocyanate curing agent, an aliphatic polyisocyanate curing agent, a polyfunctional epoxy curing agent, and an alicyclic polyisocyanate curing agent. In addition, an aliphatic polyisocyanate curing agent, particularly a xamethylene diisocyanate curing agent among them is preferable. The reason why this isocyanate curing agent is good is that it can impart flexibility to the pressure-sensitive adhesive and is also effective for an adherend having irregularities.

The aromatic polyisocyanate is not particularly limited, and for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2 , 6-tolylene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4 ', 4 "-triphenylmethane triisocyanate, ω, ω'-diisocyanate-1,3-dimethylbenzene, ω, ω'-diisocyanate-1,4-dimethylbenzene, ω, ω'-diisocyanate-1,4- Diethyl Benzene, 1,4-tetramethylxylylene diisocyanate, and 1,3-tetramethylxylylene diisocyanate and the like.

The aliphatic polyisocyanate is not particularly limited. For example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene. Examples thereof include diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.

The alicyclic polyisocyanate is not particularly limited. For example, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl -2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanatomethyl) cyclohexane, and 1,4-bis (isocyanatomethyl) cyclohexane There is.

Among polyisocyanates, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate 4,4'-toluidine diisocyanate and hexamethylene diisocyanate are preferably used.

The polyfunctional epoxy curing agent mainly refers to a compound having two or more epoxy groups and one or more tertiary nitrogen atoms, such as N.N-glycidylaniline, N.N-glycidyltoluidine, mN.N-N-. Glycidylaminophenyl glycidyl ether, pN · N-glycidylaminophenyl glycidyl ether, triglycidyl isocyanurate, N · N · N '· N'-tetraglycidyldiaminodiphenylmethane, N · N · N' · N'-tetraglycidyl -M-xylylenediamine, N · N · N ′ · N ′ · N ″ -pentaglycidyldiethylenetriamine and the like.

(Photopolymerization initiator)
As the photopolymerization initiator, benzoin, benzoin alkyl ethers, acetophenones, anthraquinones, thioxanthones, ketals, benzophenones or xanthones are used.

Examples of benzoin include benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin propyl ether.
Examples of the acetophenones include benzoin alkyl ethers, acetophenone, 2,2-dimethoxy-2-acetophenone, 2,2-diethoxy-2-acetophenone, 1,1-dichloroacetophenone, 2-hydroxy-1- {4- [ 4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone and the like.
Anthraquinones include 2-methylanthraquinone, 2-ethylanthraquinone, 2-tertiarybutylanthraquinone, 1-chloroanthraquinone and the like.
Examples of thioxanthones include 2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone.
Examples of ketals include acetophenone dimethyl ketal, benzyldimethylmethal, benzyldiphenylsulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, and β-chloranthraquinone.

The compounding quantity of a photoinitiator is 0.00 with respect to 100 mass parts of (meth) acrylic acid ester copolymers, 40-150 mass parts of photopolymerizable compounds, and 0.1-10 mass parts of polyfunctional isocyanate hardening | curing agents. 1 to 10 parts by mass. By adjusting this blending and the Shore D hardness of the pressure-sensitive adhesive sheet to be 25 to 45, the peelability of the pressure-sensitive adhesive sheet after ultraviolet irradiation can be improved, and the odor of the pressure-sensitive adhesive sheet after ultraviolet irradiation can be kept below a certain level. it can. If it is less than 0.1 parts by mass, the peelability of the pressure-sensitive adhesive sheet after irradiation with ultraviolet rays is reduced, and if it exceeds 10 parts by mass, the odor after ultraviolet curing becomes high.

In the photopolymerization initiator, conventionally known photopolymerization accelerators may be used alone or in combination of two or more as required. A benzoic acid type | system | group, a tertiary amine, etc. can be used for a photoinitiator. Examples of the tertiary amine include triethylamine, tetraethylpentamine, dimethylamino ether and the like.

Various additives such as a tackifier resin, a softener, an anti-aging agent, a filler, a conductive agent, an ultraviolet absorber, and a light stabilizer may be added to the composition of the ultraviolet curable pressure-sensitive adhesive layer. .

The thickness of the ultraviolet curable pressure-sensitive adhesive layer is preferably from 1 μm to 50 μm, particularly preferably from 5 μm to 35 μm. If the ultraviolet curable pressure-sensitive adhesive layer is too thick, the adhesive strength becomes too high and the pick-up property is lowered. On the other hand, if the ultraviolet curable pressure-sensitive adhesive layer is too thin, the adhesive force becomes too low, the chip retention during dicing is lowered, and peeling may occur between the ring frame and the sheet.

<Manufacture of adhesive sheet>
As a method for forming an ultraviolet curable pressure-sensitive adhesive layer on a base film to form an adhesive sheet, for example, an ultraviolet curable adhesive is applied on the base film with a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater. There are a method of directly applying an agent, and a method of applying an adhesive to a release film and affixing it to a substrate film after drying. The adhesive may be printed on the base film by convex plate printing, concave plate printing, flat plate printing, flexographic printing, offset printing, screen printing, or the like.

<Manufacturing method of semiconductor chip or semiconductor component>
Specific steps of the electronic component manufacturing method according to the present invention will be described in order.

(1) Affixing process In the affixing process, the adhesive sheet is affixed to the substrate (or semiconductor wafer) and the ring frame. The substrate may be a general-purpose substrate such as a package substrate in which a chip is sealed with a resin or an LED package substrate. The semiconductor wafer may be a conventional wafer such as a silicon wafer and a gallium nitride wafer, a silicon carbide wafer, or a sapphire wafer.

(2) Dicing process In the dicing process, the package substrate or the like is diced and processed into a semiconductor chip or a semiconductor component.

(3) Ultraviolet irradiation step In the ultraviolet irradiation step, an actinic ray such as ultraviolet rays is applied to the ultraviolet curable pressure-sensitive adhesive layer from the base film side. As the ultraviolet light source, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high pressure mercury lamp, or a metal halide lamp can be used. In addition, an electron beam may be used instead of ultraviolet rays, and α-rays, β-rays, and γ-rays can be used as a light source for the electron beams.

The ultraviolet curable pressure-sensitive adhesive layer is three-dimensionally reticulated and cured by ultraviolet rays, and the adhesive strength of the ultraviolet curable pressure-sensitive adhesive layer is reduced. At this time, as described above, since the pressure-sensitive adhesive sheet according to the present invention does not excessively adhere to a wafer or the like even when heated, a sufficient decrease in adhesive force can be obtained by irradiation with ultraviolet rays or the like.

(4) Peeling process The peeling jig 4 is pressed against the lower surface of the base film 1 of the pressure-sensitive adhesive sheet as shown in FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail by way of example. However, the materials, blending amounts, and the like described in this example are merely illustrative examples, and are not intended to limit the scope of the present invention only to those unless otherwise specified.

<Example>
Adhesive sheets were prepared according to the formulations shown in Tables 1 and 2. The UV-curable pressure-sensitive adhesive layer has a thickness of the UV-curable pressure-sensitive adhesive layer after drying an ultraviolet-curable pressure-sensitive adhesive obtained by mixing a (meth) acrylic acid ester copolymer on a polyethylene terephthalate separator film. It obtained by coating so that it might be set to 20 micrometers. This ultraviolet curable pressure-sensitive adhesive layer was laminated on a base film and aged at 40 ° C. for 7 days to obtain a pressure-sensitive adhesive sheet.

[UV curable adhesive]
((Meth) acrylic acid ester copolymer)
A-1: Acrylic rubber AR53L manufactured by Nippon Zeon Co., Ltd .; a copolymer of ethyl acrylate 54%, butyl acrylate 19%, methoxyethyl acrylate 24%, obtained by emulsion polymerization.
A-2: SK dyne 1496 manufactured by Soken Chemical Co., Ltd .; a copolymer of 96% 2-ethylhexyl acrylate and 4% 2-hydroxyethyl acrylate, obtained by solution polymerization.
(Photopolymerizable compound)
B-1: UN-3320HS manufactured by Negami Kogyo Co., Ltd .; isocyanate skeleton: isophorone diisocyanate trimer, (meth) acrylate: photopolymerized compound obtained by reacting pentaerythritol pentaacrylate, weight average molecular weight 5,000, carbon-carbon Number of double bonds: 15.
B-2: UN-904M manufactured by Negami Kogyo Co., Ltd .; isocyanate skeleton: hexamethylene diisocyanate, (meth) acrylate: photopolymerized compound obtained by reacting pentaerythritol pentaacrylate, weight average molecular weight 4,900, carbon-carbon double Number of bonds: 10.
(Multifunctional isocyanate curing agent)
C-1: Coronate L-45E manufactured by Nippon Polyurethane Co .; Trimethylolpropane adduct of 2,4-tolylene diisocyanate.
(Photopolymerization initiator)
D-1: IRGACURE651 manufactured by BASF Japan Ltd .; benzyldimethyl ketal.
D-2: IRGACURE127 manufactured by BASF Japan Ltd .; 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one D- 3: IRSFACURE 184 manufactured by BASF Japan; 1-hydroxy-cyclohexyl-phenyl-ketone [base film]
The base film was obtained by depositing an ionomer resin (manufactured by Mitsui DuPont Polychemical Co., Ltd., product number: HM1855) to 150 μm by T-die extrusion. The surface roughness (Ra) of the base film is determined by measuring the lower surface of the base film with a surface roughness meter (Handy Surf E-30A, manufactured by Tokyo Seimitsu) at a length measurement of 4 mm and a speed of 0.6 mm / s. ,Obtained.
E-1: Surface roughness Ra on the lower surface side of the base film is 1.0 μm
E-2: Surface roughness Ra on the lower surface side of the base film is 1.3 μm
E-3: Surface roughness Ra on the lower surface side of the base film is 0.5 μm
E-4: Surface roughness Ra on the lower surface side of the base film is 1.5 μm
E-5: Surface roughness Ra on the lower surface side of the base film is 0.2 μm

Various evaluations were performed as follows.
(1) Method for measuring the dynamic friction coefficient of the base film surface Adjust the pressure-sensitive adhesive sheet according to the following procedure, and conform to JIS K7125 “Plastic-Film and Sheet-Friction Coefficient Test Method”. -2), the dynamic friction coefficient of the base film with SUS304 was measured.
1) An adhesive sheet is laid on a test stand, and a SUS304 plate (200 g, 63 mm × 63 mm) is placed thereon.
2) The adhesive sheet is moved at a pulling speed of 100 mm / min.
3) The dynamic friction coefficient was calculated from the measured data.

(2) Measuring method of Shore D hardness of pressure-sensitive adhesive sheet The pressure-sensitive adhesive sheet is adjusted according to the following procedure, and in accordance with JIS K 7215 “Plastic Durometer Hardness Test Method”, a constant pressure loader (CL-150 manufactured by Kobunshi Keiki Co., Ltd.) ), The Shore D hardness of the adhesive sheet was measured.
1) About several pressure-sensitive adhesive sheets are laminated to prepare a test piece having a thickness of 10 mm.
2) The tip of the indenter was pressed from the lower surface of the base film of the pressure-sensitive adhesive sheet, and the value after 3 seconds was taken as Shore D hardness.

(3) Evaluation method of followability of pressure-sensitive adhesive sheet A pressure-sensitive adhesive layer surface of a pressure-sensitive adhesive sheet with a cylinder pressure of 0.4 MPa is placed on a substrate (bump height of 100 μm) having 1 mm vertical and 50 mm horizontal bumps arranged at equal intervals of 46 mm in the horizontal direction. After being bonded with a roller and allowed to completely follow, the followability of the pressure sensitive adhesive sheet was evaluated by measuring the distance at which the pressure sensitive adhesive sheet was peeled off from the end of the bump after 5 minutes.
◎ (excellent): When the distance peeled from the edge of the bump is less than 400 μm ○ (Good): When the distance peeled from the edge of the bump is 400 μm or more and less than 600 μm × (impossible): From the edge of the bump When the peeled distance is 600 μm or more

(4) Evaluation method of peelability and chip side adhesive residue Dicing of the pressure-sensitive adhesive sheet on which the substrate was bonded in the above (3) was performed under the following conditions.
Dicing machine: DAD341 manufactured by DISCO
Dicing blade: P1A861SDC240N75BR597 manufactured by DISCO
Dicing blade shape: outer diameter 56mm, blade width 300μm, inner diameter 40mm
Dicing blade rotation speed: 30,000 rpm
Dicing blade feed speed: 25 mm / sec. Dicing size: 2.0 mm square cutting depth: 70 μm
Cutting water temperature: 25 ° C
Cutting water volume: 1.0 l / min

(4-1) Evaluation Method of Semiconductor Chip Peelability After irradiating UV (wavelength 365 nm) with 150 mJ / cm ² from the lower surface of the base film of the pressure-sensitive adhesive sheet formed into a chip, the peeling jig is loaded at a load of 0.15 MPa at an angle of 90 degrees. The chip was peeled off by rubbing at 0.3 m / s, and the rate at which the chip could be peeled was evaluated. The jig used for peeling was 30 mm wide, 60 mm long, 3 mm thick, and the material was SUS304.
◎ (excellent): The percentage of chips that can be peeled is 95% or more ○ (good): The percentage of chips that can be peeled 85% or more and less than 95% x (not possible): The percentage of chips that can be peeled is less than 85%

(4-2) Evaluation Method of Chip Side Adhesive Residue As for the adhesive residue on the chip side, any 50 peeled chips are selected, the side of the chip is observed with a 500 × microscope, and the adhesive adhered to the chip side The presence or absence of was evaluated according to the following criteria.
◎ (Excellent): Adhesive adherence on chip side less than 3% ○ (Good): Adhesive adherence on chip side less than 3% and less than 5% x (Not possible): Adhesive adherence on chip side that's all

(5) Odor Value odor value of the pressure-sensitive adhesive sheet, by adjusting the separator-attached pressure-sensitive adhesive sheet to a size 8 inch, after 150 mJ / cm ² ultraviolet rays (wavelength 365 nm) from the substrate film surface, immediately after the separator peeling width Maximum value when sucked at a rate of 500 mL / min with an odor measuring device (Calmore Co., Ltd., KALMOR-Σ) at 23 ° C. after placing in a chuck type bag of 340 mm and length of 480 mm for 10 minutes. Obtained from. When the numerical value of the odor measuring device is 1,000 or less, it is considered good. When the numerical value is over 1,000 and 1,300 or less, the odor is slightly felt but not uncomfortable, and the numerical value exceeds 1,300. In some cases, discomfort due to odor is not possible.

From the results of Tables 1 and 2, the pressure-sensitive adhesive sheets of the examples of the present invention have less odor when irradiated with actinic rays such as ultraviolet rays, and prevent adhesive residue on the chip side surface during dicing, as well as bump followability, It was found that in the peeling step of rubbing the bottom surface of the base film of the pressure-sensitive adhesive sheet made into a chip with a jig, the chip peelability is excellent.
<Comparative Example 1>
Since the blending amount of the photopolymerizable compound is small, it is considered that the crosslink density of the ultraviolet curable pressure-sensitive adhesive after the ultraviolet irradiation is low, resulting in poor peelability.
<Comparative example 2>
It is thought that a defect occurred in the adhesive residue on the side surface of the chip because the amount of the photopolymerization compound was large.
<Comparative Example 3>
Since the blending amount of the polyfunctional isocyanate curing agent is small, it is considered that the crosslink density of the ultraviolet curable pressure-sensitive adhesive is low, and the adhesive residue on the side surface of the chip is defective.
<Comparative example 4>
Since the compounding amount of the polyfunctional isocyanate curing agent is large, the crosslinking density of the ultraviolet curable pressure-sensitive adhesive is high, and it is considered that the followability is poor.
<Comparative Examples 5, 7, 9>
Since the blending amount of the photopolymerization initiator is small, it is considered that the crosslink density of the ultraviolet curable pressure-sensitive adhesive after irradiation with ultraviolet rays is low, resulting in poor peelability.
<Comparative Examples 6, 8, 10>
Since the blending amount of the photopolymerization initiator is large, the odor after ultraviolet irradiation is high, and it is considered that the odor is defective.
<Comparative Example 11>
Since the dynamic friction coefficient of the base film is low, it is considered that the adhesive sheet is difficult to affix and the followability to the bumps is reduced.
<Comparative Example 12>
Since the dynamic friction coefficient of the base film is high, it is considered that the pressure-sensitive adhesive sheet is difficult to slip and the peelability is lowered.
<Comparative Example 13>
Since the Shore D hardness of the pressure-sensitive adhesive sheet is low, it is considered that an adhesive residue was generated on the side surface of the chip.
<Comparative example 14>
Since the Shore D hardness of the pressure-sensitive adhesive sheet is high, it is considered that the followability to the bumps is lowered.

DESCRIPTION OF SYMBOLS 1 ... Base film 2 ... Ultraviolet curable adhesive layer 3 ... Dicing semiconductor wafer or substrate 4 ... Peeling jig

Claims (3)

A pressure-sensitive adhesive sheet obtained by laminating an ultraviolet curable pressure-sensitive adhesive layer on one surface of a base film,
The UV-curable pressure-sensitive adhesive layer is composed of 100 parts by weight of a (meth) acrylic acid ester copolymer, 40 to 150 parts by weight of a photopolymerizable compound, 0.1 to 10 parts by weight of a polyfunctional isocyanate curing agent, and a photopolymerization initiator 0. 1 to 10 parts by weight,
The pressure-sensitive adhesive sheet is characterized in that the other surface of the base film has a coefficient of dynamic friction of 0.1 to 0.8 and the pressure-sensitive adhesive sheet has a Shore D hardness of 25 to 45. 2. The pressure-sensitive adhesive sheet according to claim 1, wherein an odor value after irradiation with UV rays of 150 mJ / cm ² and 10 minutes after irradiation is 1,000 or less from the base film surface of the pressure-sensitive adhesive sheet. The adhesive sheet is a dicing tape,
(A) an attaching step of attaching the semiconductor wafer or substrate and the ring frame with the adhesive sheet according to claim 1,
(B) a dicing process in which a semiconductor wafer or substrate is diced to be processed into a semiconductor chip or a semiconductor component;
(C) an ultraviolet irradiation step of irradiating the base film surface of the adhesive sheet with ultraviolet rays;
(D) a peeling step of peeling the semiconductor chip or the semiconductor component by rubbing the lower surface of the base film of the pressure-sensitive adhesive sheet;
A method for manufacturing a semiconductor chip or a semiconductor component.