JP2018085299A - Planar heater - Google Patents
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- JP2018085299A JP2018085299A JP2016229143A JP2016229143A JP2018085299A JP 2018085299 A JP2018085299 A JP 2018085299A JP 2016229143 A JP2016229143 A JP 2016229143A JP 2016229143 A JP2016229143 A JP 2016229143A JP 2018085299 A JP2018085299 A JP 2018085299A
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 238000010438 heat treatment Methods 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000002313 adhesive film Substances 0.000 claims abstract description 25
- 238000007772 electroless plating Methods 0.000 claims abstract description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 23
- 238000009413 insulation Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract 5
- 238000000576 coating method Methods 0.000 abstract 5
- 239000002585 base Substances 0.000 description 54
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 15
- 239000003054 catalyst Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 239000012190 activator Substances 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 230000003750 conditioning effect Effects 0.000 description 7
- 229910052763 palladium Inorganic materials 0.000 description 7
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 description 1
- 229910000342 sodium bisulfate Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本件発明は、面状ヒータに関する。 The present invention relates to a planar heater.
従来、道路や鉄道等で交通整理等の目的で用いられる信号機の光源として、白熱電球が用いられてきたが、近年、消費電力が少なく寿命が長いＬＥＤ素子等のＬＥＤ光源に置き換えられつつある。 Conventionally, incandescent light bulbs have been used as light sources for traffic lights used for traffic control purposes on roads and railways, but in recent years, LED light sources such as LED elements that consume less power and have a long life are being replaced.
ＬＥＤ素子は、複数の素子を用いたとしても白熱電球と比較して発熱量が少ないため、寒冷地に設置されている信号機では、ＬＥＤ素子の前方に設けられているレンズの表面に氷や雪が付着してＬＥＤ素子からの光が遮られ、信号の色を識別するのが困難になるという問題がある。そのため、ＬＥＤ素子を用いた信号機では、氷雪付着の防止対策が望まれている。 LED elements generate less heat than incandescent bulbs even when multiple elements are used, so in traffic lights installed in cold regions, ice or snow is present on the surface of the lens provided in front of the LED elements. There is a problem that the light from the LED element adheres and is blocked, and it becomes difficult to identify the color of the signal. For this reason, in traffic lights using LED elements, measures to prevent the adhesion of ice and snow are desired.
そこで、信号機に付着した氷雪を融解させるために、信号機のレンズの前面に面状ヒータを設置することが考えられる。このような面状ヒータとして、透明基材の表面に刻設された蛇行状の溝部に、直径０．０３〜１ｍｍの円形断面を有する銅ニッケル線、ニクロム線、ステンレス線等の発熱線抵抗体を埋設した面状ヒータが提案されている（例えば、特許文献１参照）。 Therefore, in order to melt the ice and snow adhering to the traffic light, it is conceivable to install a planar heater in front of the lens of the traffic light. As such a planar heater, heating wire resistors such as copper nickel wire, nichrome wire, stainless steel wire having a circular cross section with a diameter of 0.03 to 1 mm in meandering grooves engraved on the surface of a transparent substrate Has been proposed (for example, see Patent Document 1).
しかしながら、レンズの前方に位置する発熱抵抗体によってＬＥＤ素子からの光が遮られ、信号を識別しづらくなるという不都合がある。 However, there is an inconvenience that the light from the LED element is blocked by the heating resistor located in front of the lens, making it difficult to identify the signal.
本発明の課題は、透光性を備える面状ヒータを提供することを目的とする。 The subject of this invention aims at providing the planar heater provided with translucency.
本件発明の面状ヒータは、絶縁基材と発熱抵抗体とを備える面状ヒータであって、当該絶縁基材は、透光性を有し、当該発熱抵抗体は、当該絶縁基材の表面を被覆する金属皮膜からなり、当該金属皮膜が透光性を有することを特徴とする。 The planar heater of the present invention is a planar heater including an insulating base and a heating resistor, the insulating base having translucency, and the heating resistor is a surface of the insulating base. It is characterized in that the metal film has translucency.
本件発明の面状ヒータにおいて、前記金属皮膜は、膜厚が３０〜２００ｎｍであることが好ましい。 In the planar heater of the present invention, the metal film preferably has a film thickness of 30 to 200 nm.
本件発明の面状ヒータにおいて、前記金属皮膜は、無電解めっき処理によって成膜された無電解ニッケルめっき皮膜であることが好ましい。 In the planar heater of the present invention, the metal film is preferably an electroless nickel plating film formed by an electroless plating process.
本件発明の面状ヒータは、さらに、前記金属皮膜の前記絶縁基材とは反対側の面に積層された接着フィルム又は粘着フィルムを備え、当該接着フィルム又は粘着フィルムが透光性を有することが好ましい。 The planar heater of the present invention further includes an adhesive film or an adhesive film laminated on a surface of the metal film opposite to the insulating base, and the adhesive film or the adhesive film may have a light-transmitting property. preferable.
本件発明の面状ヒータは、絶縁基材が透光性を有すると共に、発熱抵抗体を構成する金属皮膜が透光性を有するので、優れた透光性を得ることができる。 In the planar heater of the present invention, the insulating base material has translucency, and the metal film constituting the heating resistor has translucency, so that excellent translucency can be obtained.
図１を参照して、本件発明に係る面状ヒータの実施の形態を説明する。図１に示すように、本実施形態の面状ヒータ１は、絶縁基材２と、絶縁基材２の片面に設けられた発熱抵抗体３とを備える。発熱抵抗対３の絶縁基材２とは反対側の面には、接着フィルム４が貼付されている。発熱抵抗体３は、電源（図示せず）に接続して電圧を印加可能である。
An embodiment of a planar heater according to the present invention will be described with reference to FIG. As shown in FIG. 1, the
絶縁基材２は、板状体又はフィルム状であって、透光性を有する樹脂基材又はガラス基材からなる。絶縁基材２は、屋外での利用を考えると、防水性を備えることが好ましい。樹脂基材として、アクリロニトリル−ブタジエン−スチレン（ＡＢＳ）樹脂、ポリプロピレン（ＰＰ）樹脂、ポリカーボネート（ＰＣ）樹脂、シクロオレフィンポリマー（ＣＯＰ）樹脂、ポリエチレンテレフタレート（ＰＥＴ）樹脂、アクリル樹脂等を好適に用いることができる。 The insulating base material 2 is a plate-like body or a film, and is made of a light-transmitting resin base material or glass base material. It is preferable that the insulating base material 2 has waterproofness in consideration of outdoor use. As the resin base material, acrylonitrile-butadiene-styrene (ABS) resin, polypropylene (PP) resin, polycarbonate (PC) resin, cycloolefin polymer (COP) resin, polyethylene terephthalate (PET) resin, acrylic resin, etc. are preferably used. Can do.
絶縁基材２の線膨張係数は、面状ヒータ１として使用したときに発熱抵抗体３の熱膨張変形に追随させるために、発熱抵抗体３を構成する金属の線膨張係数に対して１．０１倍以上であることが好ましい。しかしながら、絶縁基材２の線膨張係数が発熱抵抗体３を構成する金属の線膨張係数に対して１．０１倍未満である場合には、絶縁基材２の発熱抵抗体３を設ける側の面に下地層（図示せず）を設けることが好ましい。
The linear expansion coefficient of the insulating base material 2 is 1. to the linear expansion coefficient of the metal constituting the heating resistor 3 in order to follow the thermal expansion deformation of the heating resistor 3 when used as the
下地層としては、親水性樹脂材料を用いることが好ましく、例えば、非水溶性ポリエステル樹脂（例えば、ＷＯ２００８／０９６６７１参照）、水酸基を有する樹脂及びイソシアネート系化合物、水酸基を含有してなる親水性及び水溶性樹脂（例えば、ＷＯ２００７／１０８３５１参照）等を用いることができる。これらの下地層を用いることにより、絶縁基材２の線膨張係数を発熱抵抗体３を構成する金属の線膨張係数に対して１．０１倍以上に調整し、絶縁基材２を発熱抵抗体３の熱膨張変形に追随させることが可能になる。このような親水性樹脂材料を用いて形成した下地層は、非水溶性であることがより好ましい。発熱抵抗体３を構成する金属皮膜を後述するように無電解めっき法を用いて形成する場合に、下地層が無電解めっき液等に溶出するのを防止するためである。 As the underlayer, a hydrophilic resin material is preferably used. For example, a water-insoluble polyester resin (see, for example, WO2008 / 096671), a hydroxyl group-containing resin and an isocyanate compound, a hydroxyl group-containing hydrophilic and water-soluble layer. Resin (for example, refer WO2007 / 108351) etc. can be used. By using these base layers, the linear expansion coefficient of the insulating base material 2 is adjusted to 1.01 times or more with respect to the linear expansion coefficient of the metal constituting the heating resistor 3, and the insulating base material 2 is adjusted to the heating resistor. 3 can follow the thermal expansion deformation. The base layer formed using such a hydrophilic resin material is more preferably water-insoluble. This is to prevent the base layer from eluting into the electroless plating solution or the like when the metal film constituting the heating resistor 3 is formed using an electroless plating method as will be described later.
発熱抵抗体３は、絶縁基材２の片面を被覆する金属皮膜からなり、当該金属皮膜は透光性を有している。この金属皮膜は、スパッタリング、真空蒸着法、無電解めっき法等を用いて形成することができる。真空蒸着法では、樹脂基材上に直接金属皮膜を形成できるが、無電解めっき法では、樹脂基材を表面改質、活性化及び触媒化した後、無電解めっきを行って金属皮膜を形成する。 The heating resistor 3 is made of a metal film that covers one surface of the insulating base 2, and the metal film has translucency. This metal film can be formed by sputtering, vacuum deposition, electroless plating, or the like. In the vacuum deposition method, a metal film can be formed directly on the resin substrate. However, in the electroless plating method, the resin substrate is surface-modified, activated and catalyzed, and then electroless plating is performed to form a metal film. To do.
金属皮膜を構成する金属は、電気抵抗が大きく発熱量を確保することができるニッケル、ニッケル合金等が好ましい。 The metal constituting the metal film is preferably nickel, a nickel alloy, or the like that has a large electric resistance and can secure a calorific value.
金属皮膜は、膜厚が５０〜２００ｎｍ、好ましくは５０〜１００ｎｍであることにより、優れた透光性と発熱量とを両立して確保することができる。金属皮膜の膜厚が５０ｎｍ未満では、所望の発熱量を得られなかったり、所望の膜厚に成膜するのが困難なことがある。金属皮膜の膜厚が２００ｎｍを超えると、所望の透光性を得られないことがある。 The metal film has a film thickness of 50 to 200 nm, preferably 50 to 100 nm, thereby ensuring both excellent translucency and heat generation. If the film thickness of the metal film is less than 50 nm, a desired calorific value cannot be obtained, or it may be difficult to form a film with a desired film thickness. If the film thickness of the metal film exceeds 200 nm, desired translucency may not be obtained.
接着フィルム４は、透光性を有するフィルムの両面に接着剤が塗布されたものであってもよく、透光性を有する接着剤組成物がフィルム状となったものでもよい。接着フィルム４は、発熱抵抗体３の表面に貼付されるため、発熱抵抗体３の発熱温度以上の耐熱性を備える必要がある。接着フィルム４として、例えば、既存のアクリル系、ウレタン系、アクリルウレタン系、オレフィン系、エポキシ系等を用いることができる。接着フィルム４は、発熱抵抗体３の表面全体に設けてもよく、発熱抵抗体３の外周縁部のみに設けてもよい。接着フィルム４に代えて粘着フィルムを用いてもよい。 The adhesive film 4 may be one in which an adhesive is applied to both surfaces of a light-transmitting film, or may be a film in which a light-transmitting adhesive composition is formed. Since the adhesive film 4 is affixed to the surface of the heating resistor 3, it is necessary to have heat resistance equal to or higher than the heating temperature of the heating resistor 3. As the adhesive film 4, for example, an existing acrylic type, urethane type, acrylic urethane type, olefin type, epoxy type, or the like can be used. The adhesive film 4 may be provided on the entire surface of the heating resistor 3 or may be provided only on the outer peripheral edge of the heating resistor 3. An adhesive film may be used instead of the adhesive film 4.
次に、本実施形態の面状ヒータ１の製造方法について説明する。ここでは、無電解めっき法を用いて形成する方法について説明するが、スパッタリング、真空蒸着法によって形成してもよい。
Next, the manufacturing method of the
本実施形態では、例えば、以下のキャタライザー工程と、アクセレータ工程と、アクチベータ工程と、無電解めっき工程とを備え、各工程を行うことにより絶縁基材２の表面に金属を析出させて、金属皮膜を成膜する。以下、工程毎に説明する。 In this embodiment, for example, the following catalyzer process, an accelerator process, an activator process, and an electroless plating process are provided. By performing each process, a metal is deposited on the surface of the insulating base material 2 to form a metal film. Is deposited. Hereinafter, it demonstrates for every process.
キャタライザー工程： キャタライザー工程は、絶縁基材２の表面と、パラジウム及びスズのコロイド触媒（キャタライザー）とを接触させることにより、絶縁基材２の表面に触媒としてのパラジウム金属を吸着若しくは付着させる工程である。このとき、少量のスズが２価又は４価のスズ塩として絶縁基材の表面に、吸着若しくは付着する。但し、絶縁基材２に触媒を付与する際に、前処理として酸／アルカリ洗浄等の脱脂処理等の清浄化処理を行うことが好ましい。その他、必要に応じて、前処理として、市販の薬液を用いて、コンディショニング処理、プレディップ処理等を行ってよいのは勿論である。 Catalyzer process: The catalyzer process is a process of adsorbing or adhering palladium metal as a catalyst to the surface of the insulating base 2 by bringing the surface of the insulating base 2 into contact with a colloidal catalyst (catalyzer) of palladium and tin. is there. At this time, a small amount of tin is adsorbed or adhered to the surface of the insulating substrate as a divalent or tetravalent tin salt. However, when the catalyst is applied to the insulating substrate 2, it is preferable to perform a cleaning treatment such as a degreasing treatment such as acid / alkali washing as a pretreatment. In addition, as a pretreatment, it is needless to say that a conditioning treatment, a pre-dip treatment, or the like may be performed as a pretreatment using a commercially available chemical solution.
絶縁基材２の表面が平滑であり、触媒がうまく付着しない場合には、機械的処理、化学的処理又は光学的処理（ＵＶ処理、プラズマ処理等）等によって、絶縁基材２の表面を粗面化する等の前処理を行ってもよい。また、絶縁基材２の触媒付着能を向上するために、上述した親水性樹脂材料を用いて形成した下地層を設けてもよい。当該下地層を設けることにより、絶縁基材２を発熱抵抗体の熱膨張変形に追随させることが可能になると共に、当該下地層を触媒付着層として機能させることができ、触媒を良好に付与することができる。 If the surface of the insulating base 2 is smooth and the catalyst does not adhere well, the surface of the insulating base 2 is roughened by mechanical treatment, chemical treatment or optical treatment (UV treatment, plasma treatment, etc.). Pre-processing such as surface conversion may be performed. Moreover, in order to improve the catalyst adhesion ability of the insulating base material 2, you may provide the base layer formed using the hydrophilic resin material mentioned above. By providing the base layer, the insulating base 2 can be made to follow the thermal expansion deformation of the heating resistor, and the base layer can be made to function as a catalyst adhesion layer, thereby providing a good catalyst. be able to.
当該工程で用いるコロイド触媒は、例えば、スズの水和物とパラジウムの水和物とを水に溶解させ、その後界面活性剤を加えて十分に撹拌を行いながら、ここに還元剤を添加する方法等、従来既知の方法により調整することができる。また、一般にキャタライザーとして市販されているものを用いることもできる。或いは、コロイド触媒に代えて、スズ水溶液に絶縁基材を浸漬後、パラジウム水溶液に絶縁基材２を浸漬してもよい。 The colloidal catalyst used in this step is, for example, a method in which a hydrate of tin and a hydrate of palladium are dissolved in water, and then a reducing agent is added thereto while adding a surfactant and stirring sufficiently. It can be adjusted by a conventionally known method. Moreover, what is generally marketed as a catalyzer can also be used. Alternatively, instead of the colloidal catalyst, the insulating substrate 2 may be immersed in an aqueous palladium solution after the insulating substrate is immersed in an aqueous tin solution.
アクセレータ工程： アクセレータ工程では、濃度が０．１％〜１０％程度の硫酸又は０．１ｇ／ｌ〜４００ｇ／ｌ程度の硫酸水素ナトリウム溶液からなる促進剤（アクセラレータ）と絶縁基材２の表面とを接触させることにより、絶縁基材２（又は下地層）の表面に付着しているスズを酸化させて、Ｐｄを還元し、事後的に行う無電解めっき反応を促進化するための工程である。 Accelerator step: In the accelerator step, an accelerator (accelerator) made of sulfuric acid having a concentration of about 0.1% to 10% or a sodium hydrogen sulfate solution having a concentration of about 0.1 g / l to 400 g / l, and the surface of the insulating base 2 Is a step for oxidizing the tin adhering to the surface of the insulating base material 2 (or the underlayer) to reduce Pd and promoting an electroless plating reaction performed afterwards. .
アクチベータ工程： アクチベータ工程は、必須の工程ではないが、０．１ｇ／ｌ程度〜１ｇ／ｌの塩化パラジウム溶液と、絶縁基材２の表面とを接触させることにより、めっき初期析出をより均一的に反応させる為に行ってもよい。 Activator process: The activator process is not an essential process, but by bringing the palladium chloride solution of about 0.1 g / l to 1 g / l into contact with the surface of the insulating base 2, the initial plating deposition is made more uniform. It may be performed to react with.
以上のように、本件発明では、キャタライザー工程後に、アクセレータ工程とアクチベータ工程とを順に行うことにより、金属を析出させるための触媒金属核を、絶縁基材２（又は下地層）の表面に均一に吸着させることができる。 As described above, in the present invention, after the catalyzer process, the catalyst metal nucleus for depositing metal is uniformly formed on the surface of the insulating base material 2 (or the base layer) by sequentially performing the accelerator process and the activator process. Can be adsorbed.
無電解めっき工程： 次に、無電解めっき法により、絶縁基材２の表面に金属皮膜を析出形成する。当該工程では、金属皮膜を構成する金属を含む従来既知のめっき浴を構成する無電解めっき液と、上述の絶縁基材２とを接触させることにより、絶縁基材２の表面に付着したパラジウム金属を触媒として、絶縁基材２の表面に金属を析出させて、金属皮膜を成膜する。このときに用いる無電解めっき液が含有する金属成分の種類に応じた金属が適宜析出する。このとき、金属皮膜の膜厚を５０〜２００ｎｍとすることにより、透光性を得ることができる。以上により、絶縁基材２の片面に発熱抵抗体３が設けられた図１に示す面状ヒータ１を形成することができる。
Electroless plating step: Next, a metal film is deposited on the surface of the insulating substrate 2 by electroless plating. In this step, the palladium metal adhered to the surface of the insulating base 2 by bringing the above-mentioned insulating base 2 into contact with an electroless plating solution that constitutes a conventionally known plating bath containing the metal constituting the metal film. As a catalyst, a metal is deposited on the surface of the insulating substrate 2 to form a metal film. A metal corresponding to the type of metal component contained in the electroless plating solution used at this time is appropriately deposited. At this time, translucency can be obtained by setting the film thickness of the metal film to 50 to 200 nm. As described above, the
面状ヒータ１の発熱抵抗体３の絶縁基材２とは反対側の面に接着フィルム４を貼付することにより、接着フィルム４を介して面状ヒータ１を信号機のレンズ等に取り付け可能とすることができる。
By attaching the adhesive film 4 to the surface of the heating heater 3 opposite to the insulating substrate 2 of the
本実施形態の面状ヒータ１は、絶縁基材２、発熱抵抗体３を構成する金属皮膜、及び、接着フィルム４のそれぞれがいずれも透光性を備えることから、優れた透光性を得ることができる。そのため、面状ヒータ１の一方の側に可視光光源を配置し、可視光光源から面状ヒータ１へ向けて可視光を出射したとき、当該可視光は面状ヒータ１を透過して他方の側へ出射することができ、面状ヒータ１の他方の側から当該可視光を視認することができる。
The
発熱抵抗体３を構成する金属皮膜は、絶縁基材２の表面全体を被覆するように設けてもよいし、十分な発熱量を得られるのであれば、絶縁基材２の表面の一部のみを被覆するように設けて絶縁基材２を露出させてもよい。発熱抵抗体３から絶縁基材２を露出させる場合には、金属皮膜を例えばハート型形状や格子状、水玉状等に未析出又はエッチング除去してもよい。発熱抵抗体３と絶縁基材２との光透過率の差によって、発熱抵抗体３の形状を視認させることができ、面状ヒータ１にデザイン性を持たせることができる。さらに、面状ヒータ１全体における光透過率を向上させることができる。
The metal film constituting the heating resistor 3 may be provided so as to cover the entire surface of the insulating base material 2, or only a part of the surface of the insulating base material 2 if a sufficient amount of heat generation can be obtained. The insulating base material 2 may be exposed by being provided so as to cover. When the insulating substrate 2 is exposed from the heating resistor 3, the metal film may be undeposited or etched away in a heart shape, a lattice shape, a polka dot shape, or the like. Due to the difference in light transmittance between the heating resistor 3 and the insulating substrate 2, the shape of the heating resistor 3 can be visually recognized, and the
本実施形態の面状ヒータ１は、例えば次のように利用することができる。寒冷地に設置されたＬＥＤ式信号機のレンズの前面に、接着フィルム４を介して面状ヒータ１を取り付け、発熱抵抗体３を電源（図示せず）に接続する。電圧が印加されると発熱抵抗体３が発熱し、その熱量によってレンズ表面に付着した氷雪を融解させることができる。このとき、面状ヒータ１は優れた透光性を有するので、ＬＥＤ素子からの光、すなわち信号の色をレンズ表面側から確実に視認することができる。
The
本実施形態の面状ヒータ１は、ＬＥＤ式信号機以外にも、投光器、自動車、電車等の前照灯や尾灯、門灯、街灯等、ＬＥＤ光源を用いる種々の機器に適用することができる。さらに、面状ヒータ１は、ＬＥＤ光源以外の光源を用いる場合にも適用可能である。例えば、面状ヒータ１を自動車、電車等のフロント・リアガラスに設けて、当該フロント・リアガラス表面に付着した氷雪を融解させたり、家屋の窓ガラスに設けて、結露を防止することができる。
The
以下、実施例を挙げて、本件発明をより具体的に説明するが、下記実施例に本件発明が限定されるものではないのは勿論である。 Hereinafter, the present invention will be described more specifically with reference to examples. However, it is needless to say that the present invention is not limited to the following examples.
本実施例では、絶縁基材として、ＣＯＰ樹脂からなり透光性を有する絶縁フィルム（ＺＦ−１６、日本ゼオン株式会社、厚さ５０μｍ）を用意し、直径１５０ｍｍの円盤状に裁断した。 In this example, an insulating film made of COP resin and having translucency (ZF-16, Nippon Zeon Co., Ltd., thickness 50 μm) was prepared as an insulating substrate, and was cut into a disk shape having a diameter of 150 mm.
続いて、円盤状の絶縁基材に対して、以下のＵＶ照射工程、コンディショニング工程、キャタライザー工程、アクセレータ工程、アクチベータ工程及び無電解めっき工程を順に行った。 Subsequently, the following UV irradiation process, conditioning process, catalyzer process, accelerator process, activator process, and electroless plating process were sequentially performed on the disk-shaped insulating base material.
（ａ）ＵＶ照射工程
低圧水銀灯ＵＶ装置（江東電気株式会社）を用い、波長１８５ｎｍ及び２５４ｎｍの混成波長の紫外線を絶縁基材に６０秒間照射することにより、当該絶縁基材を表面改質して親水化させた。
(A) UV irradiation process Using a low-pressure mercury lamp UV device (Koto Electric Co., Ltd.), the insulating base material is surface-modified by irradiating the insulating base material with ultraviolet rays having a wavelength of 185 nm and 254 nm for 60 seconds. Hydrophilized.
（ｂ）コンディショニング工程
次工程の触媒処理における触媒吸着性を向上させる目的で、ＵＶ照射工程を経た絶縁基材を、４５℃のコンディショニング溶液（ＣＣ−２３１、ロームアンドハース社）に６０秒間浸漬した。
(B) Conditioning step For the purpose of improving the catalyst adsorptivity in the catalyst treatment of the next step, the insulating base material that has undergone the UV irradiation step was immersed in a conditioning solution (CC-231, Rohm and Haas) at 45 ° C for 60 seconds. .
（ｃ）キャタライザー工程
コンディショニング工程を経た絶縁基材を、４５℃のパラジウム及びスズのコロイド触媒液（キャタライザー；ロームアンドハース社）に６０秒間浸漬した。
(C) Catalyzer process The insulating base material which passed through the conditioning process was immersed in the colloidal catalyst liquid of 45 degreeC palladium and tin (Catalyzer; Rohm and Haas) for 60 seconds.
（ｄ）アクセレータ工程
キャタライザー工程を経た絶縁基材を、４５℃の１０％硫酸（和光純薬工業株式会社）に３０秒間浸漬した。
(D) Accelerator process The insulating base material which passed through the catalyzer process was immersed in 45 degreeC 10% sulfuric acid (Wako Pure Chemical Industries Ltd.) for 30 second.
（ｅ）アクチベータ工程
アクセレータ工程を経た絶縁基材を、４５℃の塩化パラジウム溶液（０．３ｇ／ｌ）に３０秒間浸漬した。
(E) Activator process The insulating base material which passed through the accelerator process was immersed in the 45 degreeC palladium chloride solution (0.3g / l) for 30 second.
（ｆ）無電解めっき工程
そして、上述のＵＶ照射工程、コンディショニング工程、キャタライザー工程、アクセレータ工程、アクチベータ工程を経て、表面に触媒としてのパラジウム金属が吸着された絶縁基材を、以下の組成の４５℃のニッケルめっき浴に３０秒間浸漬し、絶縁基材にニッケルが析出した金属皮膜を得た。金属皮膜は、絶縁基材の表面全体を被覆し、膜厚は８０ｎｍであった。
ＮｉＳＯ４・６Ｈ２Ｏ ２６ｇ／ｄｍ３
Ｃ６Ｈ８Ｏ７ １９ｇ／ｄｍ３
Ｈ２ＮＣＨ２ＣＯＯＨ ８ｇ／ｄｍ３
（ＮＨ４）２ＳＯ４ ２６ｇ／ｄｍ３
ＮａＨ２ＰＯ２・Ｈ２Ｏ ２１ｇ／ｄｍ３
Ｎａ２Ｓ２Ｏ３ ２ｐｐｍ
Ｂｉ １ｐｐｍ
ｐＨ（Ｈ２ＳＯ４／ＮａＯＨ） ８．０
(F) Electroless plating step And, through the above-mentioned UV irradiation step, conditioning step, catalyzer step, accelerator step, activator step, an insulating substrate having palladium metal as a catalyst adsorbed on its surface is converted into 45 of the following composition: It was immersed in a nickel plating bath at 0 ° C. for 30 seconds to obtain a metal film in which nickel was deposited on the insulating substrate. The metal film covered the entire surface of the insulating substrate, and the film thickness was 80 nm.
NiSO 4 · 6H 2 O 26g / dm 3
C 6 H 8 O 7 19 g / dm 3
H 2 NCH 2 COOH 8 g / dm 3
(NH 4 ) 2 SO 4 26 g / dm 3
NaH 2 PO 2 · H 2 O 21g / dm 3
Na 2 S 2 O 3 2 ppm
Bi 1ppm
pH (H 2 SO 4 / NaOH) 8.0
以上により、絶縁基材と、当該絶縁基材の表面を被覆する金属皮膜からなる発熱抵抗体とを備える面状ヒータを形成した。その後、面状ヒータの発熱抵抗体の表面に、接着フィルムとして日本ゼオン株式会社製ＬＳシート（Ｌ３−ＰＳ、厚さ５０μｍ）を貼付した。 As described above, a planar heater provided with an insulating base and a heating resistor made of a metal film covering the surface of the insulating base was formed. Thereafter, an LS sheet (L3-PS, thickness 50 μm) manufactured by Nippon Zeon Co., Ltd. was attached as an adhesive film to the surface of the heating resistor of the planar heater.
本実施例では、絶縁機材としてＰＥＴ樹脂からなり透光性を有する絶縁フィルム（Ｔ−６０、東レ株式会社、厚さ２５μｍ）を用いた以外は、実施例１と同様にして、円盤状の絶縁基材を用意した。 In this example, a disk-shaped insulation was made in the same manner as in Example 1 except that an insulating film made of PET resin and having translucency (T-60, Toray Industries, Inc., thickness 25 μm) was used as the insulating material. A substrate was prepared.
続いて、円盤状の絶縁基材に対して、ＵＶ照射工程に代えて５分間の酸素プラズマ処理を行った後、実施例１と同様に、コンディショニング工程、キャタライザー工程、アクセレータ工程、アクチベータ工程及び無電解めっき工程を行った。 Subsequently, after performing oxygen plasma treatment for 5 minutes on the disc-shaped insulating base material instead of the UV irradiation step, as in Example 1, the conditioning step, the catalyzer step, the accelerator step, the activator step, and the An electrolytic plating process was performed.
以上により、絶縁基材と、当該絶縁基材の表面を被覆する金属皮膜からなる発熱抵抗体とを備える面状ヒータを形成した。その後、面状ヒータの発熱抵抗体の表面に、接着フィルムとしてアクリル系粘着シート（プロセーブ、株式会社きもと、厚さ５０μｍ）を貼付した。 As described above, a planar heater provided with an insulating base and a heating resistor made of a metal film covering the surface of the insulating base was formed. Thereafter, an acrylic pressure-sensitive adhesive sheet (Prosave, Kimoto Co., Ltd., thickness 50 μm) was attached as an adhesive film to the surface of the heating resistor of the planar heater.
＜評価＞
実施例１及び実施例２で得られた面状ヒータを、接着フィルムを介してＬＥＤ式灯光機のレンズに取り付けた。発熱抵抗体を電源に接続し、１２Ｖの電圧を印加した。電圧を印加して２分間経過した時点で面状ヒータ表面の温度を測定したところ、６７℃であった。このことから、実施例１及び実施例２の面状ヒータは、寒冷地に設置されたＬＥＤ式信号機に取り付けた際に、レンズに付着した氷雪を融解できるのに十分な発熱量を得られることが確認できた。
<Evaluation>
The planar heater obtained in Example 1 and Example 2 was attached to a lens of an LED type lamp through an adhesive film. The heating resistor was connected to a power source and a voltage of 12V was applied. When the voltage was applied and the temperature of the surface heater surface was measured after 2 minutes, it was 67 ° C. From this, when the planar heaters of Example 1 and Example 2 are attached to an LED traffic light installed in a cold region, a calorific value sufficient to melt the ice and snow attached to the lens can be obtained. Was confirmed.
次に、実施例１及び実施例２の面状ヒータが取り付けられたＬＥＤ式灯光機を、１００ｍ離れた地点から観察したところ、目視によってＬＥＤが発する光の色を識別できた。これは、面状ヒータの発熱抵抗体を構成する金属皮膜が優れた透光性を備えることによるものである。 Next, when the LED type lamps to which the planar heaters of Example 1 and Example 2 were attached were observed from a point 100 m away, the color of light emitted from the LEDs could be identified by visual observation. This is because the metal film constituting the heating resistor of the planar heater has excellent translucency.
本件発明の面状ヒータは、優れた透光性を備えるため、透光性が必要とされる種々の用途に用いることができ、ＬＥＤ式信号機以外にも、投光器、自動車、電車等の前照灯、尾灯やフロントガラス、家屋の門灯や窓、街灯等に適用できる。 Since the planar heater of the present invention has excellent translucency, it can be used for various applications where translucency is required. In addition to LED traffic lights, the head heater for projectors, automobiles, trains, etc. It can be applied to lights, taillights, windshields, gates and windows of houses, street lights, etc.
１…面状ヒータ
２…絶縁基材
３…発熱抵抗体
４…接着フィルム
DESCRIPTION OF
Claims (4)
当該絶縁基材は、透光性を有し、
当該発熱抵抗体は、当該絶縁基材の表面を被覆する金属皮膜からなり、当該金属皮膜が透光性を有することを特徴とする面状ヒータ。 A planar heater comprising an insulating substrate and a heating resistor,
The insulating substrate has translucency,
The said heating resistor consists of a metal film which coat | covers the surface of the said insulation base material, The said metal film has translucency, The planar heater characterized by the above-mentioned.
当該接着フィルム又は粘着フィルムが透光性を有する請求項１〜請求項３のいずれか一項に記載の面状ヒータ。
An adhesive film or an adhesive film laminated on the surface of the metal film opposite to the insulating base;
The planar heater as described in any one of Claims 1-3 in which the said adhesive film or adhesive film has translucency.
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| JPH0888077A (en) * | 1994-09-19 | 1996-04-02 | Mitsui Toatsu Chem Inc | Transparent flat heater and its manufacture |
| JPH08138841A (en) * | 1994-11-01 | 1996-05-31 | Mitsui Toatsu Chem Inc | Transparent conductive film and transparent sheet-like heater using it |
| JPH08293379A (en) * | 1995-04-20 | 1996-11-05 | Asahi Glass Co Ltd | Transparent laminated body |
| JPH0963754A (en) * | 1995-06-15 | 1997-03-07 | Mitsui Toatsu Chem Inc | Durable transparent plate heater and its manufacture |
| JPH09306647A (en) * | 1996-05-17 | 1997-11-28 | Mitsui Toatsu Chem Inc | Transparent surface heater, electromagnetic wave shield, and liquid crystal device |
| JP2002528642A (en) * | 1998-10-22 | 2002-09-03 | アルキャン・インターナショナル・リミテッド | Container body for decorative processing beverage |
| JP2010517231A (en) * | 2007-01-26 | 2010-05-20 | テーザ・ソシエタス・ヨーロピア | Heating element and heatable glass plate with this heating element |
| US20150327334A1 (en) * | 2013-02-22 | 2015-11-12 | Lg Chem, Ltd. | Heating element and method for manufacturing same |
| US20160249413A1 (en) * | 2015-02-23 | 2016-08-25 | Electronics And Telecommunications Research Institute | Transparent planar heater |
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2016
- 2016-11-25 JP JP2016229143A patent/JP2018085299A/en active Pending
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| JPH04123096U (en) * | 1991-04-22 | 1992-11-06 | 帝人株式会社 | Transparent sheet heater |
| JPH07114979A (en) * | 1993-10-15 | 1995-05-02 | Mitsui Toatsu Chem Inc | Transparent flat heater and manufacture thereof |
| JPH07153559A (en) * | 1993-12-02 | 1995-06-16 | Toyobo Co Ltd | Transparent sheet heater |
| JPH0888077A (en) * | 1994-09-19 | 1996-04-02 | Mitsui Toatsu Chem Inc | Transparent flat heater and its manufacture |
| JPH08138841A (en) * | 1994-11-01 | 1996-05-31 | Mitsui Toatsu Chem Inc | Transparent conductive film and transparent sheet-like heater using it |
| JPH08293379A (en) * | 1995-04-20 | 1996-11-05 | Asahi Glass Co Ltd | Transparent laminated body |
| JPH0963754A (en) * | 1995-06-15 | 1997-03-07 | Mitsui Toatsu Chem Inc | Durable transparent plate heater and its manufacture |
| JPH09306647A (en) * | 1996-05-17 | 1997-11-28 | Mitsui Toatsu Chem Inc | Transparent surface heater, electromagnetic wave shield, and liquid crystal device |
| JP2002528642A (en) * | 1998-10-22 | 2002-09-03 | アルキャン・インターナショナル・リミテッド | Container body for decorative processing beverage |
| JP2010517231A (en) * | 2007-01-26 | 2010-05-20 | テーザ・ソシエタス・ヨーロピア | Heating element and heatable glass plate with this heating element |
| US20150327334A1 (en) * | 2013-02-22 | 2015-11-12 | Lg Chem, Ltd. | Heating element and method for manufacturing same |
| US20160249413A1 (en) * | 2015-02-23 | 2016-08-25 | Electronics And Telecommunications Research Institute | Transparent planar heater |
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