JP2017505154A - Endoscope head and endoscope - Google Patents

Abstract

The present invention is an endoscope head provided at a deflection end of an endoscope, and includes an MID element 1 in which at least one conductive path 21 to 28 is formed, and at least one conductive path provided in the MID element 1. The present invention relates to an endoscope head including at least one electronic device 3 that is supplied with power by 21 to 28 and a sensor 6. The present invention also relates to an endoscope head provided at the deflection end of an endoscope. The endoscope head main body 1 in which at least one conductive path 21 to 28 is formed; An endoscope provided with at least one electronic device 3 that is provided and can be powered by at least one conductive path 21-28 and at least one traction cable 4 in which a traction cable fixing body 41 is provided in the endoscope head body 1. Related to mirror head. The at least one traction cable 4 is electrically connected to at least one conductive path 21 to 28 of the endoscope head body 1.

Description

  The present invention relates to an endoscope head and an endoscope including the same, and more particularly, the present invention relates to an improved endoscope head that can be used at the tip of a deflection unit in an endoscope.

  Until now, endoscopy has tended to be performed by smaller endoscopes. Accordingly, the endoscope head disposed at the tip of the deflection unit in the endoscope has been further downsized.

  However, it has become more difficult to integrate devices such as LEDs, cameras, and / or working channels used for endoscopy into the endoscope head.

  The present invention provides a novel method that can further reduce the size of an endoscope and an endoscope head by devising the configuration of the endoscope head.

  An object of the present invention is to improve an endoscope head. Furthermore, it aims at improving an endoscope.

  Such a problem of the endoscope head is solved by the endoscope head according to claim 1. In another aspect of the present invention, another endoscope head is provided. The above-described problem of the endoscope is solved by the endoscope according to claim 11. Further advantageous embodiments are described in the dependent claims.

  That is, the present invention is an endoscope head provided at a deflection end of an endoscope, and is provided with an MID element in which a plurality of conductive paths are formed, and provided in the MID element, and is supplied with power by the conductive paths. The present invention relates to an endoscope head including at least one electronic device and a sensor. Such an endoscope head can be manufactured at low cost and can be miniaturized, and is basically configured as a three-dimensional circuit board. This makes it easier for the electronic device to connect to the conductive path of the three-dimensional circuit board. Even if it is small, the function of the endoscope head is guaranteed.

  In this endoscope head, the MID element may include a working channel port and / or at least one cleaning channel port. The MID element may already be configured in the manufacturing stage so that a working channel port and / or at least one cleaning channel port is formed, for example by injection molding. In this case, a subsequent drilling process and a manufacturing process for forming a work channel port and / or a cleaning channel port are not required.

  In the endoscope head, the sensor may be an optical sensor or an acoustic sensor. Various other sensors may be used. The optical sensor may be a camera. The acoustic sensor may be an ultrasonic sensor.

  The endoscope head may further include at least one traction cable in which a traction cable fixing body is provided on the MID element. Accordingly, by operating the traction cable, the MID element can be deflected or bent in different directions.

  In the endoscope head, a gap is provided at a tip of the MID element, and in the gap, the at least one electronic device is provided on a conductive path of the MID element, and a transparent curable molding material is provided in the gap. May be filled. The bottom of the air gap may be a three-dimensional shape having irregularities, and basically constitutes the surface of the three-dimensional circuit board. The molding material protects the conductive path and the surface of the electronic component and electronic device disposed on the conductive path, and thus the three-dimensional circuit board. The molding material is translucent. The molding material is preferably configured so as not to affect signals transmitted to and received from the electronic device.

  The at least one electronic device may be one or two LEDs. At the tip of the MID element, the camera module may be arranged as an optical sensor so as to be adjacent to the gap and shielded from the gap.

  The at least one electronic device may be an ultrasonic irradiation device. The acoustic sensor may be disposed adjacent to the gap at the tip of the MID element and shielded from the gap.

  By shielding in this way, it can be avoided that the sensor directly receives an output signal from the LED or the ultrasonic irradiation device or is affected by the direct signal.

  It is also possible to use three or more electronic devices.

  The covering surface of the transparent curable molding material may extend in a flat shape or be curved inward on the tip side of the MID element. When the covering surface extends in a flat shape, cleaning is easy. When the covering surface is curved inward, the signal can be further shielded directly.

  The present invention also provides an endoscope head provided at a deflection end of an endoscope, the endoscope head main body having at least one conductive path formed thereon, the endoscope head main body, The present invention relates to an endoscope head including at least one electronic device powered by at least one conductive path, and at least one traction cable provided with a traction cable fixing body in the endoscope head body. The at least one traction cable is electrically connected to the at least one conductive path of the endoscope head body.

  As a result, power supply in the endoscope head can be realized at low cost and space saving. This also eliminates the need for power supply cables for electronic devices that require space.

  In the endoscope head, the at least one traction cable may be electrically connected to the at least one conductive path of the endoscope head body by the traction cable fixing body. The traction cable fixing body may be a conductor that electrically connects the conductive path and the traction cable.

  In the endoscope head, four traction cables are fixed to the endoscope head body, and two of the traction cables may be electrically connected to the at least one conductive path of the endoscope head body. Good. Two of the four traction cables may have conductivity. When the deflection operation is controlled by four traction cables, it is functionally similar to a conventional endoscope head. All four traction cables may have conductivity.

  The number of traction cables is not limited to this.

  The endoscope head body may be an MID element.

  The above features in the present invention can be combined as appropriate.

  Therefore, the endoscope head body of the present invention can be manufactured at low cost and in an environmentally friendly manner, and can be formed in various free shapes. Thereby, endoscope head main bodies of all shapes are possible. Further downsizing of the endoscope head can be realized. The number of materials used to manufacture the endoscope head body is kept to a minimum, thereby saving the number of materials and parts. Also, the number of processes during assembly can be reduced. Molding accuracy and thereby the reliability of the endoscope head can be greatly improved. In the endoscope head body, unlike a conventional circuit board, a material that does not cause a problem in disposal is used. The axial length of the endoscope head body can also be reduced.

FIG. 1 shows an endoscope head having a traction cable according to an embodiment of the present invention, FIG. 1 (A) is a schematic perspective view, FIG. 1 (B) is a side view, and FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. 2 shows an endoscope head having a traction cable in the embodiment of FIG. 1, FIG. 2 (A) is a side view, and FIG. 2 (B) is a cross-sectional view taken along line DD in FIG. 2 (A). FIG. FIG. 3 is an endoscope head main body for the endoscope head in the embodiment of FIG. FIG. 4 shows the endoscope head body of FIG. 3 equipped with a traction cable. FIG. 5 shows the endoscope head body of FIG. 4 in which a camera module and an LED chip are inserted.

  Hereinafter, the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows an endoscope head including a traction cable according to an embodiment of the present invention. 1A is a schematic perspective view, FIG. 1B is a side view, and FIG. 1C is a cross-sectional view taken along line AA in FIG. 1B. FIG. 2 shows an endoscope head with a traction cable in the embodiment of FIG. 2A is a side view, and FIG. 2B is a cross-sectional view taken along line DD in FIG. 2A.

  The endoscope according to the present invention includes a deflection section (also not shown) in a catheter section (not shown). The deflection unit extends from an annular element (not shown) on the proximal side of the deflection unit to the endoscope head 102 on the distal side of the deflection unit. That is, the endoscope head 102 is disposed at the deflection end of the endoscope.

  The endoscope head 102 according to the present invention includes an MID (molded interconnected device, molded circuit component) element 1 as an endoscope head body. The MID element 1 is a plastic carrier made of an organic polymer material that can be formed by, for example, injection molding. The MID element 1 is, for example, a thermoplastic material or a thermosetting material. In particular, the MID element 1 includes polypropylene (PP), acrylonitrile butadiene styrene (ABS), polycarbonate (PC), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyamide (PA), polyphenylene sulfide (PPS). , Polysulfone (PSU), polyethersulfone (PES), polyetherimide (PEI) and the like. These are merely examples, and other materials may be used for the MID element 1.

  The MID element 1 is a cylindrical element, and the central axis extends from the proximal end side to the distal end side. On the proximal side, the MID element 1 can be connected to a deflection unit. The distal end side of the MID element 1 constitutes the distal end side of the endoscope head 102.

  The MID element 1 is surrounded by a cap 11 on the distal end side and the side surface. The cap 11 has a hollow cylindrical shape with a bottom, and the bottom of the cap constitutes the distal end side of the endoscope head 102 when mounted on the MID element 1. The inner diameter of the cap 11 is sized so that the cap can easily fit within the outer diameter of the MID element 1. These may be press-fitted. Further, the cap 11 has an inner screw on the inner peripheral surface, and may be screwed to the outer screw of the MID element 1. The cap 11 and the MID element 1 may be attached by other methods.

  On the front face of the front end, the cap 11 includes a front end side opening 31 for outputting a signal of the LED chip 3 to be described later, a front end opening for a camera window 61 for inputting a signal to the camera module 6 to be described later, and a work channel. It has a front end 71 and a cleaning channel front end 81.

  When mounting the cap 11 on the MID element 1, the MID element 1 protrudes from the cap 11 on the base end side. A distal end portion of a tube element (not shown) of the deflecting portion is provided on the outer periphery of the MID element 1 projecting from the cap 11 to the proximal end side. The front end surface of the tube element is brought into contact with the base end surface of the cap 11 so as to be sealed. The front end front surface of the tube element may be bonded to the base end surface of the cap 11.

  FIG. 3 shows the MID element 1 as an endoscope head body for the endoscope head in the embodiment of FIG.

  The MID element 1 is provided with one or a plurality of metal conductive paths 21-28, 110, 111. These conductive paths 21-28, 110, and 111 may be formed on the MID element 1 by composite injection molding, hot stamping, mask irradiation, laser patterning, back injection, or other appropriate methods. Basically, the MID element 1 provided with the conductive paths 21-28, 110, 111 constitutes a three-dimensional circuit board.

  More specifically, in the MID element 1, the conductive paths 21-28 are integrally formed for an LED chip 3 described later, and the conductive paths 110 and 111 are integrally formed for the camera module 6.

  Hereinafter, the conductive path will be described in more detail.

  Referring to FIG. 3, MID element 1 configured as a three-dimensional circuit board has a plurality of surfaces. That is, the first surface is for connecting the traction cable fixing body, the second surface is for connecting the camera, the third surface is for connecting the LED, and the fourth surface is the tip. It is provided as a surface. The first surface and the second surface may be displaced from each other or the same height.

  Apart from the base end face, the MID element 1 has a gap for the pulling cable fixing body 41 described below on the outer peripheral face thereof. Each gap has a size such that a sufficient space is provided in the traction cable fixing body 41 and a support surface area capable of supporting the traction cable fixing body 41 in the proximal direction is provided on the base end side thereof. The support surface region extends in the horizontal direction, that is, parallel to the base end surface of the MID element 1, and is located on the first surface. These gaps have a shape corresponding to the traction cable fixing body 41 and are cylindrical in this embodiment. Therefore, in this embodiment, the MID element 1 has four such support surface regions. Each support surface region has a channel-type groove portion extending toward the base end surface of the MID element 1 near the center, and this groove portion is fixed to the traction cable fixing portion when the traction cable fixing body 41 is inserted into the support surface region. A tow cable 4 connected to the body 41 is received. The diameter of the support surface is in each case larger than the diameter of the traction cable 4. For example, when a rectangular parallelepiped traction cable fixing body is used and the air gap is also rectangular along with this, a rectangular support surface area can be obtained.

  A support surface area having a first conductive path 21 is formed for at least two traction cable fixing bodies (two gaps facing the observer in FIG. 3). First, a second conductive path 22 extending upward in the vertical direction is connected to the conductive path 21, and the second conductive path 22 is integrally formed at the periphery of the gap, and reaches the upper edge of the gap from the gap. As shown in FIG. 3, the third conductive path 23 extends in the horizontal direction and extends upward in the vertical direction. The third conductive path 23 is connected to a conductive path plane portion 24 formed integrally with the third surface of the MID element 1. The conductive path plane part 24 constitutes an anode for the first LED chip 3. The conductive path plane part 25 is adjacent to the conductive path plane part 24 without being in contact with the conductive path plane part 24 and is integrally formed on the third surface of the MID element 1. The conductive path plane portion 25 constitutes the cathode of the first LED chip 3. Referring to FIG. 3, conductive path 21-25 is located on the left side of the camera housing space provided for connecting the camera above the second surface. Further, as shown in FIG. 3, a conductive path structure similar to that on the left side is formed on the right side of the camera housing space. In FIG. 3, a gap for the traction cable fixing body is shown to the right of the second surface for connecting the camera, and is similarly formed with a conductive path such as the first conductive path 21. . This conductive path is connected to the conductive path plane portion 26 on the third surface. The conductive path plane portion 26 constitutes the cathode of the second LED chip 3. The conductive path plane portion 27 is adjacent to the conductive path plane portion 26 without being in contact with the conductive path plane portion 26, and is integrally formed on the third surface of the MID element 1. The conductive path plane portion 27 constitutes the anode of the second LED chip 3. The conductive path plane portion 25 is connected to the conductive path plane portion 26 by a bridge portion 28 as shown in FIG. Although not illustrated in FIG. 3, the conductive path plane portion 27 is connected to the conductive path plane portion 24.

  The conductive path portion 110 is formed on the base end side of the camera housing space, that is, on the second surface of the MID element 1 and communicates with the conductive path plane portion 111 for connecting the camera module 6. The conductive path plane portion 111 is also formed on the second surface of the MID element 1. The conductive path portion 110 is electrically connected to a camera cable terminal (not shown) provided on the base end face of the MID element 1. A power supply cable introduced into the deflection unit is inserted into the camera cable terminal.

  Furthermore, the MID element 1 has, on the fourth surface, for example, a work channel front end port 71 serving as an extension in a work channel element (not shown) for a fine tool, and at least one cleaning channel front end port 81 in at least one cleaning channel. With. In the present embodiment, the MID element 1 includes two cleaning channel tip openings 81 for two cleaning channels. That is, in a region that does not become a camera accommodation space or a conductive path region in the MID element 1, the working channel end and the two cleaning channel ends are provided as through holes in the axial direction, that is, in parallel with the central axis of the MID element 1. As shown in FIG. 1, the working channel end is disposed adjacent to the two wash channel ends. At the front end of the MID element 1, the working channel end has a working channel tip 71, and both cleaning channel ends have a washing channel tip 81, respectively. At this time, the working channel end is provided adjacent to and parallel to the camera housing space. The cleaning channel end is disposed radially outside the working channel end, but the present invention is not limited to this.

  Hereinafter, a further structure of the endoscope head 102 will be described in detail. FIG. 4 shows the endoscope head body of FIG. 3 in which a traction cable is inserted.

  In each of the gaps on the side surface of the MID element 1, the traction cable fixing body 41 has a support surface on the base end side so that the traction force acting in the proximal direction is transmitted from the traction cable fixing body 41 to the support surface region and thus to the MID element 1. It is inserted so as to contact the region. Each traction cable fixing body 41 is fixed to the tip of the traction cable 4 by a known method.

  In the present embodiment, as described above, the conductive paths are provided in the two gaps on the side surface of the MID element 1. A conductive traction cable fixing body 41 having a traction cable 4 is disposed in each gap. In the present embodiment, two of the four support surface regions are aligned with the conductive path portion.

  4, the two traction cable fixing bodies 41 provided in the conductive path portion 2 and the traction cable 4 connected thereto have conductivity. Each conductive path portion 2 provided with the conductive traction cable fixing body 41 performs electrical connection of electronic equipment. As a result, current is supplied to the conductive paths 21 to 28 via the conductive traction cable 4. The electronic device may be supplied with direct current or alternating current. In the embodiment of FIG. 1, the four traction cables 4 on the MID element are fixed, and two of the traction cables 4 are electrically connected to at least one conductive path portion 2 of the MID element 1.

  Such a traction cable fixing body 41 may have other shapes, for example, a barrel nipple, a pair nipple, a ball nipple, or the like.

  In the present embodiment, the MID element 1 has four support surface regions with respect to the four traction cable fixing bodies 41. However, the present invention is not limited to this. The endoscope head 102 may include three or five or more traction cable fixing bodies 41 and a corresponding number of support surface regions on the MID element 1.

  The endoscope head 102 may be rotated in an arbitrary direction by a control member (not shown) on the traction cable 4 by a known method by a traction operation.

  FIG. 5 shows the endoscope head body of FIG. 4 in which the camera module and the LED chip are inserted.

  The first LED chip 3 is disposed on the conductive path plane part 24 (anode) and the conductive path plane part 25 (cathode). The second LED chip 3 is disposed on the conductive path plane portion 26 (cathode) and the conductive path plane portion 27 (anode). In particular, the LED chip 3 is disposed so that the connection terminal thereof faces the conductive path plane portion 24-27 on the base end side. The output surface of the LED chip 3 is on the tip side. The output surface of the LED chip 3 is on a surface that is parallel to and spaced from the tip surface (fourth surface) of the MID element 1. In other words, the tip surface (fourth surface) of the MID element 1 protrudes from the output surface of the LED chip 3 in the tip direction.

  In the camera housing space, the camera module 6 is arranged so that the connection terminal 63 of the camera module 6 is in contact with the conductive path plane portion 111 (see FIG. 2B). In particular, the camera module 6 is arranged so that the connection terminal on the base end side thereof faces the conductive path plane portion 111. A camera window 61 is disposed on the distal end side, from which image information can be taken. The front end of the main body of the camera module 6 extends to the camera window 61 and is surrounded by a cylindrical shield 62.

  The shield 62 extends from the front end surface of the MID element 1 in the front end direction, that is, the shield 62 slightly protrudes from the fourth surface of the MID element 1. Therefore, the shield 62 extends in the distal direction from the horizontal surface of the output surface of the LED chip 3. Thereby, the shield 62 can shield the camera module 6 from the light irradiated from the LED chip 3.

  The thickness of the distal end surface of the cap 11 is set according to the height difference between the fourth surface of the MID element 1 and the distal end side of the shield 62 protruding from the fourth surface of the MID element 1. Thereby, when the cap 11 is disposed on the MID element 1, the proximal inner surface of the distal end surface of the cap 11 abuts on the fourth surface of the MID element 1, and the distal end side of the shield 62 is It is almost in line with the outer surface of the tip.

  Therefore, a gap 12 is formed between the inner surface on the proximal end side of the front end surface of the cap 11 and the third surface of the MID element 1, that is, the LED connection surface. The gap 12 is partitioned by the cap 11 at the top, and opens only in the opening 31 on the distal end side (with the cap 11 attached) (see FIG. 1C). Each of the openings 31 is disposed directly above the LED chip 3.

  The gap 12 may be filled with a molding material that covers the conductive path portion and the LED chip 3 (but it is not always necessary). This molding material is transparent and curable, and has sufficient adhesiveness to adhere to the bottom and walls of the gap 12.

-Manufacturing method of MID element-
The MID element 1 as a three-dimensional circuit board provided with a conductive path can be manufactured by various methods.

  For example, two-stage molding may be employed.

  In this case, first, a plastic carrier is injection-molded as a base of the MID element 1. Subsequently, a conductive path is formed on the substrate by, for example, composite injection molding, hot stamping, mask irradiation, laser patterning, or the like.

  By doing so, the shape can be set almost freely. As the endoscope head main body, the MID element 1 has a cylindrical shape with a small outer diameter so that a sufficient space for the working channel and the cleaning channel can be secured.

(Other embodiments)
In the embodiment of FIGS. 1 to 5, four traction cables 4 are fixed to the MID element 1, and two of the traction cables 4 are electrically connected to at least one conductive path portion 2 of the MID element 1. The However, the present invention can also be applied to the MID element 1 in which the traction cable 4 does not have conductivity. In this case, power is supplied to the conductive path portion 2 by a cable passing through the deflection portion 100.

  In the present embodiment, a cap 11 is fitted on the MID element 1. However, the cap 11 may be omitted. In this case, the outer surface of the MID element 1 and the front surface of the front end have a shape that does not have an undercut, facilitating cleaning.

  In the embodiment of FIGS. 1 to 5, the outer surface of the camera module 6 contacts the inner surface of the cap 11. The MID element 1 may have a shape in which a specific camera recess having a front end opening is provided and the camera module 6 is inserted from the front end side. The side surface of the camera module 6 is surrounded by the MID element 1 except for the tip side. This particular camera recess may be sized so that the camera module 6 fits snugly. The camera shield 62 protruding from the MID element 1 on the distal end side is fixedly attached to the MID element 1 on the proximal end side so that the camera module 6 can be securely fixed to the MID element 1 and easily removed at the same time. . Further, the camera module 6 is firmly formed integrally with the MID element 1 using a molding material.

  When the cap 11 is omitted, the MID element 1 is formed to have a peripheral wall having the same height as the fourth surface. Then, an end surface constituting the distal end surface of the endoscope head is formed by the molding material on the distal end side. The tip surface of the molding material is formed to be curved inward, but in other embodiments, it may be flat, that is, planar. Therefore, the coating surface of the transparent curable molding material on the tip side of the MID element is curved inward or extends in a planar shape. Moreover, the front end surface of the molding material may be curved outward. Thereby, a space such as a gap 12 is also provided at the tip of the MID element 1, and at least one electronic device 3 is provided on the conductive path portion 2 of the MID element 1 in the space, and a transparent curable molding is performed. Material is filled. Also in this case, the shield extends in the distal direction from the distal end surface of the MID element 1 and slightly protrudes from the fourth surface of the MID element 1 on the distal end surface of the molding material.

  In the MID element 1, the working channel part and the two cleaning channel parts extend in parallel and are separated from the central axis of the MID element 1. However, the working channel portion may be installed on the central axis of the MID element 1. More than two cleaning channels may be provided. However, since the structure is small, a configuration with one or two cleaning channels is preferred. Further, the working channel section and / or the cleaning channel may be inclined in the MID element 1.

  In this embodiment, the camera module 6 is arrange | positioned as an optical sensor on the MID element 1, and the LED chip 3 is provided as an optical signal transmitter as an example of an electronic device. In addition, an ultrasonic transmission device may be provided as an electronic device instead of the LED chip 3, and an acoustic sensor may be provided instead of the camera module 6. In this case, the acoustic sensor is shielded against the air gap.

  When the sensor region is used for another type of sensor such as an acoustic sensor, the shielding wall portion protruding from the tip surface of the molding material may be omitted.

DESCRIPTION OF SYMBOLS 1 MID (molded interconnect device, molding circuit component) element 11 Cap 12 Space | gap 21-28, 110, 111 Conductive path 3 LED chip 31 Opening part 4 Pulling cable 41 Pulling cable fixing body 6 Camera module 61 Camera window 62 Camera shield 63 Camera Connection terminal 7 Working channel element 71 Working channel tip 8 Washing channel 81 Washing channel tip 102 Endoscope head 110 Conductive path 111 Conductive path for connecting camera module

Claims (11)

An endoscope head provided at a deflection end of an endoscope,
An MID element (1) in which at least one conductive path (21-28) is formed;
At least one electronic device (3) provided in the MID element (1) and capable of being powered by the at least one conductive path (21-28);
An endoscope head comprising a sensor (6). The endoscope head according to claim 1,
The endoscope head according to claim 1, wherein the MID element (1) includes a working channel tip (71) and / or at least one cleaning channel tip (81). The endoscope head according to claim 1 or 2,
The endoscope head according to claim 1, wherein the sensor (6) is an optical sensor or an acoustic sensor. The endoscope head according to any one of claims 1 to 3,
The endoscope head according to claim 1, wherein the traction cable fixing body (41) further includes at least one traction cable (4) provided in the MID element. In the endoscope head according to any one of claims 1 to 4,
A gap (12) is provided at the tip of the MID element (1), and in the gap, the at least one electronic device (3) is provided on the conductive path (21 to 28) of the MID element (1). The endoscope head is characterized in that the gap (12) is filled with a transparent curable molding material. The endoscope head according to claim 5, wherein
The at least one electronic device (3) is one or two LEDs,
At the tip of the MID element (1), a camera module is arranged as an optical sensor (6) so as to be adjacent to the gap (12) and shielded from the gap (12),
The endoscope head according to claim 1, wherein the coating surface of the transparent curable molding material extends planarly or curves inward at the tip side of the MID element (1). An endoscope head provided at a deflection end of an endoscope,
An endoscope head body (1) in which at least one conductive path (21-28) is formed;
At least one electronic device (3) provided in the endoscope head body (1) and powered by the at least one conductive path (21-28);
The traction cable fixing body (41) includes at least one traction cable (4) provided in the endoscope head body (1);
The endoscope head according to claim 1, wherein the at least one traction cable (4) is electrically connected to the at least one conductive path (21-28) of the endoscope head body (1). The endoscope head according to claim 7,
The at least one traction cable (4) is electrically connected to the at least one conductive path (21-28) of the endoscope head body (1) by the traction cable fixing body (41). Endoscope head characterized by. The endoscope head according to claim 7 or 8,
Four pull cables (4) are fixed to the endoscope head body (1), and two of the pull cables (4) are connected to the at least one conductive path (21 of the endoscope head body (1). To 28), which is electrically connected to the endoscope head. The endoscope head according to any one of claims 7 to 9,
The endoscope head according to claim 1, wherein the endoscope head body is an MID element (1). An endoscope comprising the endoscope head according to any one of claims 1 to 10.

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