JP2017132074A - Structure, mems device, liquid injection head and method for bonding film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure that can bond a thin film readily at low cost and suppresses detachment of the film, and to provide MEMS device, a liquid injection head and a method for bonding a film.SOLUTION: The structure includes: a first member 40 having a recess part 42; the film 130 bonded to the first member 40 via a first adhesive agent 140 and formed of a resin material partitioning the recess part 42; and a second member 150 bonded to the first member 40 on an opposite face side to the film 130 via a second adhesive agent 141. The first member 40 and the second member 150 are not metal members.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a structure including a film, a MEMS device including the structure, a liquid jet head including the structure, and a film bonding method.

  As a liquid ejecting head, for example, an ink jet recording head that ejects ink droplets from nozzles using a pressure change of a pressure generating unit is known. An ink jet recording head has been proposed in which a part of a wall of a flow path communicating with a nozzle for ejecting ink droplets is formed of a flexible plate (film) that deforms in response to a change in ink pressure. (For example, refer to Patent Document 1).

  In the ink jet recording head of Patent Document 1, a flow path is formed by laminating a plate made of a metal having recesses or openings formed by laser processing or etching, and flexibility is made of resin or metal on the laminated plate. It is formed by adhering a plate (film) having

JP 2004-106395 A

  However, there is a problem that it is difficult to bond a thin film alone to a member to be bonded. In particular, a high-functional film having a small thickness is expensive, and there is a problem that if a film having a large area is bonded to a small member, there are many useless regions and the cost is increased.

  Moreover, although the film can be adhered to the adherend using an adhesive body in which a film is laminated on a rigid member made of metal, there is a problem that the material cost is increased by using the rigid member. Even if the rigid member is used as it is as a member constituting the flow path as in Patent Document 1, after laminating the film on the rigid member, the excess portion of the rigid member is removed by etching, laser processing, or the like. There is a problem that the manufacturing cost becomes high.

  Furthermore, as in Patent Document 1, when a metal is used as an adherend to which a film is bonded, the adhesive strength at the adhesive interface between the adhesive that bonds the film and the metal is low, and peeling or the like may occur. There is.

  In addition, when a metal plate and a film are bonded as in Patent Document 1, an extra region of the plate must be etched after the film is laminated on the plate, which increases the cost.

  In view of such circumstances, an object of the present invention is to provide a structure, a MEMS device, a liquid ejecting head, and a film bonding method capable of bonding a thin film easily and at low cost and suppressing film peeling. And

An aspect of the present invention that solves the above problems includes a first member having a recess, a film formed of a resin material that is bonded to the first member via a first adhesive, and partitions the recess, A second member bonded to the opposite side of the film from the first member via a second adhesive, and the first member and the second member are members that are not metal. In the featured structure.
In this aspect, in the first member, the film, and the second member, the interface between the metal and the adhesive can be reduced to improve the adhesive strength. Moreover, cost can be reduced by using materials other than a metal as a 1st member and a 2nd member.

  Here, it is preferable that the first member is a resin. According to this, it is possible to form the first member at low cost.

  Moreover, it is preferable that the said 2nd member is resin. According to this, the second member can be formed at low cost.

  In addition, the concave portion of the first member is a flow path, and the first member has an introduction port that opens to the adhesive surface side of the film and communicates with the concave portion, and the second member has A communication passage communicating with the introduction port is provided, and an end surface of the film is covered with at least one of the first adhesive and the second adhesive so as not to be exposed in the introduction port and the communication passage. It is preferable that According to this, the adhesive interface between the film and the adhesive does not come into contact with the liquid, and a decrease in the adhesive strength due to the liquid coming into contact with the adhesive interface can be suppressed.

  Moreover, it is preferable that the opening edge part of the said inlet of the said 1st member is provided with the adhesive agent escape groove | channel over the circumferential direction. According to this, it is possible to suppress the adhesive from flowing into the flow path, and to reduce the generation of foreign matter.

  Moreover, it is preferable that the thickness of the said film is 15 micrometers or less. According to this, it is possible to use a relatively thin film that is more likely to shrink.

  Moreover, it is preferable that the said 1st member and the said 2nd member are formed with the same material. According to this, the difference in the linear expansion coefficient between the first member and the second member is reduced, and the warpage and peeling of the first member and the second member due to the difference in linear expansion coefficient are suppressed, and the film is peeled off more. Can be suppressed.

Furthermore, an aspect of the present invention is a MEMS device including the structure according to the above aspect.
In this aspect, it is possible to realize a MEMS device that reduces cost and suppresses peeling of the film.

According to another aspect of the present invention, there is provided the structure according to the above aspect, wherein the concave portion is a common liquid chamber that communicates in common with a plurality of pressure chambers that communicate with a nozzle that ejects liquid. In the liquid jet head.
In this aspect, it is possible to realize a liquid jet head that reduces cost and suppresses film peeling.

Furthermore, in another aspect of the present invention, there is provided an adhesive body forming step of forming an adhesive body formed by bonding a film having a thickness of 15 μm or less and a base member, After the half-cutting step for half-cutting, the structure-forming step for forming the structure formed by bonding the film of the half-cut adhesive body and the first member having the recesses, and after the structure-forming step, And a peeling step of peeling off the base member from the structure.
In this aspect, a thin film of 15 μm or less can be easily bonded to the first member. In addition, a rigid member formed of metal or the like is not necessary, and the cost can be reduced.

  Here, in the structure forming step, the film and the first member are fixed using an ultraviolet curable adhesive, and a part of the base member remains on the first member without being peeled off. Preferably it is. According to this, since the film can be temporarily fixed to the first member with the ultraviolet curable adhesive, a jig or the like for holding the film is unnecessary, and the manufacturing efficiency can be improved and the cost can be reduced.

  Moreover, it is preferable that the said film adhere | attached on the said structure by the said peeling process is an area below the outer periphery of the said 1st member in the surface where the said film of the said 1st member adhere | attaches. According to this, a film having a relatively small area can be easily and inexpensively bonded to the first member.

FIG. 2 is an exploded perspective view of a recording head according to Embodiment 1 of the invention. FIG. 3 is a plan view of a main part of the recording head according to the first embodiment of the invention. FIG. 3 is a cross-sectional view of the recording head according to the first embodiment of the invention. FIG. 3 is a cross-sectional view of the recording head according to the first embodiment of the invention. FIG. 2 is an enlarged cross-sectional view of a main part of the recording head according to Embodiment 1 of the invention. It is sectional drawing which shows the film adhesion method which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the film adhesion method which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the film adhesion method which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the film adhesion method which concerns on Embodiment 1 of this invention. FIG. 6 is a cross-sectional view of a main part of a recording head according to Embodiment 2 of the invention. FIG. 6 is a cross-sectional view of a main part of a recording head according to Embodiment 3 of the invention. 1 is a schematic diagram of a recording apparatus according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is an exploded perspective view of an ink jet recording head that is an example of a liquid jet head according to Embodiment 1 of the present invention, and FIG. 2 is a plan view of a main part of a flow path forming substrate of the ink jet recording head. 3 is a cross-sectional view taken along the line AA ′ of FIG. 2, FIG. 4 is a cross-sectional view taken along the line BB ′ of FIG. 3, and FIG. 5 is an enlarged view of the main part of FIG. .

  As shown in the figure, the flow path forming substrate 10 constituting the ink jet recording head 1 (hereinafter also simply referred to as the recording head 1) of the present embodiment has a plurality of partition walls by anisotropic etching from one side. The pressure chambers 12 partitioned by the plurality of nozzles 21 are juxtaposed along the direction in which a plurality of nozzles 21 that eject ink are juxtaposed. Hereinafter, this direction is referred to as a parallel direction of the pressure chambers 12 or a first direction X. Further, the flow path forming substrate 10 is provided with a plurality of rows in which the pressure chambers 12 are arranged in parallel in the first direction X, in this embodiment, two rows. An arrangement direction in which a plurality of rows of the pressure chambers 12 are arranged is hereinafter referred to as a second direction Y. Further, a direction orthogonal to both the first direction X and the second direction Y is referred to as a third direction Z. In the third direction Z, the holder 150 side, which will be described in detail later, is a Z1 side, The nozzle 21 side is referred to as the Z2 side. The first direction X, the second direction Y, and the third direction Z are directions orthogonal to each other, but are not particularly limited thereto, and may be directions that intersect at an angle other than orthogonal. .

  On one side of the flow path forming substrate 10 in the third direction Z, the communication plate 15 and the nozzle plate 20 are sequentially stacked.

  The communication plate 15 is provided with a nozzle communication passage 16 that allows the pressure chamber 12 and the nozzle 21 to communicate with each other. The communication plate 15 has a larger area than the flow path forming substrate 10, and the nozzle plate 20 has a smaller area than the flow path forming substrate 10. By providing the communication plate 15 in this manner, the nozzle 21 of the nozzle plate 20 and the pressure chamber 12 can be separated from each other, so that the ink in the pressure chamber 12 is caused by evaporation of moisture in the ink generated in the vicinity of the nozzle 21. Less susceptible to thickening. Further, since the nozzle plate 20 only needs to cover the opening of the nozzle communication path 16 that allows the pressure chamber 12 and the nozzle 21 to communicate with each other, the area of the nozzle plate 20 can be made relatively small, and the cost can be reduced. it can. In the present embodiment, the surface on which the nozzles 21 of the nozzle plate 20 are opened and ink droplets are ejected is referred to as a liquid ejecting surface 20a.

The communication plate 15 is provided with a first manifold portion 17 and a second manifold portion 18 that constitute a part of the manifold 100.
The first manifold portion 17 is provided through the communication plate 15 in the third direction Z.
Further, the second manifold portion 18 is provided to open to the nozzle plate 20 side of the communication plate 15 without penetrating the communication plate 15 in the third direction Z.

  Further, the communication plate 15 is provided with a supply communication passage 19 that communicates with one end portion in the second direction Y of the pressure chamber 12 independently for each of the pressure chambers 12. The supply communication path 19 communicates the second manifold portion 18 and the pressure chamber 12. That is, the supply communication path 19 is arranged in parallel with the manifold 100 in the first direction X.

  In the nozzle plate 20, nozzles 21 communicating with the pressure chambers 12 through the nozzle communication passages 16 are formed. That is, nozzles 21 that eject the same type of liquid (ink) are arranged in parallel in the first direction X, and the row of nozzles 21 arranged in parallel in the first direction X is arranged in the second direction Y. Two rows are formed.

  Further, a cover 49 is joined to a surface of the communication plate 15 where the first manifold portion 17 and the second manifold portion 18 are opened. The openings of the first manifold portion 17 and the second manifold portion 18 are opened by the cover 49. It is blocked.

  On the other hand, a diaphragm 50 is formed on the surface of the flow path forming substrate 10 opposite to the communication plate 15. In the present embodiment, an elastic film 51 made of silicon oxide provided on the flow path forming substrate 10 side and an insulator film 52 made of zirconium oxide provided on the elastic film 51 are provided as the diaphragm 50. I made it. The liquid flow path such as the pressure chamber 12 is formed by anisotropically etching the flow path forming substrate 10 from one side (the side where the nozzle plate 20 is bonded). The direction is defined by the elastic film 51.

  A piezoelectric actuator 300 having a first electrode 60, a piezoelectric layer 70, and a second electrode 80 is provided on the vibration plate 50 of the flow path forming substrate 10. In the present embodiment, the piezoelectric actuator 300 serves as a pressure generating unit that is driven by a drive circuit 121 that is a semiconductor element described later in detail. Here, in the present embodiment, the first electrode 60 is separated for each pressure chamber 12 and constitutes an individual electrode that is independent for each active part described later in detail. The first electrode 60 is formed with a width narrower than the width of the pressure chamber 12 in the first direction X. That is, in the first direction X of the pressure chamber 12, the end portion of the first electrode 60 is located inside the region facing the pressure chamber 12. In the second direction Y, both end portions of the first electrode 60 are extended to the outside of the pressure chamber 12.

  The piezoelectric layer 70 is continuously provided in the first direction X so that the second direction Y has a predetermined width. The width of the piezoelectric layer 70 in the second direction Y is wider than the length of the pressure chamber 12 in the second direction Y. Therefore, the piezoelectric layer 70 is provided to the outside of the pressure chamber 12 in the second direction Y of the pressure chamber 12.

  In the second direction Y of the pressure chamber 12, the end of the piezoelectric layer 70 on the ink supply path side is located outside the end of the first electrode 60. That is, the end portion of the first electrode 60 is covered with the piezoelectric layer 70. The end of the piezoelectric layer 70 on the nozzle 21 side is located on the inner side (the pressure chamber 12 side) of the end of the first electrode 60, and the end of the first electrode 60 on the nozzle 21 side is It is not covered with the piezoelectric layer 70.

The piezoelectric layer 70 is made of a piezoelectric material of the oxide having a polarization structure formed on the first electrode 60, for example, it may consist of a perovskite oxide represented by the general formula ABO _3, lead containing lead For example, a lead-based piezoelectric material or a lead-free piezoelectric material containing no lead can be used.

  In such a piezoelectric layer 70, as shown in FIG. 2, a groove 71 having a concave shape corresponding to each partition wall is formed. The width of the groove 71 in the first direction X is substantially the same as or wider than the width of each partition wall in the first direction X. As a result, the rigidity of the portion of the vibration plate 50 that opposes the end portion of the pressure chamber 12 in the second direction Y (the so-called arm portion of the vibration plate 50) is suppressed, so that the piezoelectric actuator 300 can be displaced favorably. .

  The second electrode 80 is provided on the opposite side of the piezoelectric layer 70 from the first electrode 60 and constitutes a common electrode common to a plurality of active portions. Further, the second electrode 80 may or may not be provided on the inner surface of the groove 71, that is, on the side surface of the groove 71 of the piezoelectric layer 70.

  Such a piezoelectric actuator 300 composed of the first electrode 60, the piezoelectric layer 70, and the second electrode 80 is displaced by applying a voltage between the first electrode 60 and the second electrode 80. That is, by applying a voltage between both electrodes, a piezoelectric strain is generated in the piezoelectric layer 70 sandwiched between the first electrode 60 and the second electrode 80. A portion where piezoelectric distortion occurs in the piezoelectric layer 70 when a voltage is applied to both electrodes is referred to as an active portion. On the other hand, a portion where no piezoelectric distortion occurs in the piezoelectric layer 70 is referred to as an inactive portion. Further, in the active portion where piezoelectric distortion occurs in the piezoelectric layer 70, a portion facing the pressure chamber 12 is referred to as a flexible portion, and a portion outside the pressure chamber 12 is referred to as a non-flexible portion.

  In the present embodiment, in the second direction Y, all of the first electrode 60, the piezoelectric layer 70, and the second electrode 80 are continuously provided to the outside of the pressure chamber 12. That is, the active part is continuously provided to the outside of the pressure chamber 12. For this reason, the part which opposes the pressure chamber 12 of the piezoelectric actuator 300 among active parts becomes a flexible part, and the part outside the pressure chamber 12 becomes a non-flexible part.

  Further, as shown in FIG. 2, individual wires 91 that are lead wires are led out from the first electrode 60 of the piezoelectric actuator 300. The individual wiring 91 is drawn between the two rows of piezoelectric actuators 300. Further, from the second electrode 80, a common wiring 92 that is a lead-out wiring is drawn out.

  A flexible cable 120 is electrically connected to the individual wiring 91 and the common wiring 92. The flexible cable 120 is a flexible wiring board, and in this embodiment, a drive circuit 121 that is a semiconductor element is mounted. An external print control signal is supplied to the drive circuit 121 via the flexible cable 120, and a drive signal from the drive circuit 121 is supplied to the piezoelectric actuator 300 via the flexible cable 120, the individual wiring 91, and the common wiring 92. The

  A protective substrate 30 having substantially the same size as the flow path forming substrate 10 is bonded to the surface of the flow path forming substrate 10 on the piezoelectric actuator 300 side. The protective substrate 30 has a holding portion 31 that is a space for protecting the piezoelectric actuator 300. Two holding portions 31 are formed side by side in the second direction Y between the rows of piezoelectric actuators 300 arranged in parallel in the first direction X. Further, the protective substrate 30 is provided with a through hole 32 penetrating in the third direction Z between two holding portions 31 arranged in parallel in the second direction Y. The ends of the individual wires 91 and the common wires 92 drawn out from the electrodes of the piezoelectric actuator 300 are extended so as to be exposed in the through holes 32, and the individual wires 91 and the common wires 92 and the flexible cable 120 pass through. The holes 32 are electrically connected.

  Further, on the protective substrate 30, a case member 40, which is a first member of the present embodiment that defines the manifold 100 communicating with the plurality of pressure chambers 12 together with the flow path forming substrate 10, is fixed. The case member 40 has substantially the same shape as the communication plate 15 described above in a plan view, and is bonded to the protective substrate 30 and is also bonded to the communication plate 15 described above. Specifically, the case member 40 has a first recess 41 having a depth in which the flow path forming substrate 10 and the protective substrate 30 are accommodated on the protective substrate 30 side. The first recess 41 has an opening area wider than the surface of the protective substrate 30 bonded to the flow path forming substrate 10. The opening surface on the nozzle plate 20 side of the first recess 41 is closed by the communication plate 15 in a state where the flow path forming substrate 10 and the like are accommodated in the first recess 41.

  The case member 40 is formed with a third manifold portion 42 that communicates with the first manifold portion 17 of the communication plate 15. The third manifold portion 42 is provided on the through portion 42a penetrating in the third direction Z and on the Z1 side opposite to the communication plate 15, and widens the width of the through portion 42a in the second direction Y. A widened portion 42b. In the present embodiment, the widened portion 42b is provided so as to protrude toward the piezoelectric actuator 300 in the second direction Y. That is, in the present embodiment, the widened portion 42 b is disposed at a position where a part thereof overlaps the first concave portion 41 when viewed in plan from the third direction Z. Thereby, the opening on the Z1 side of the third manifold portion 42 has a larger area than the Z2 side. The first manifold portion 17 and the second manifold portion 18 provided on the communication plate 15 and the third manifold portion 42 provided on the case member 40 constitute a manifold 100 that is a common liquid chamber of the present embodiment. Has been. The manifold 100 is provided continuously in the first direction X, which is the direction in which the pressure chambers 12 are arranged, and the supply communication passage 19 that communicates each pressure chamber 12 and the manifold 100 is provided in the first direction. X is juxtaposed.

  The case member 40 is provided with a connection hole 43 that communicates with the through hole 32 of the protective substrate 30 and into which the flexible cable 120 is inserted. The connection hole 43 is provided between the two third manifold portions 42 in the second direction Y.

  Examples of such case member 40 include resin, silicon, glass, ceramics, metal, metal oxide, and the like. In particular, by using a resin as the case member 40, it can be formed at low cost by molding. In addition, when a metal is used as the case member 40, it can be formed by cutting, etching, laminating pressed parts, or the like.

  Further, the film 130 is bonded to the surface on the Z1 side where the third manifold portion 42 of the case member 40 is opened via the first adhesive 140, and the opening on the Z1 side of the third manifold portion 42 is the film 130. It is blocked by. That is, in the present embodiment, the case member 40 corresponds to the first member, and the third manifold portion 42 provided in the case member 40 corresponds to the concave portion of the first member. By the way, the “concave portion” of the present invention is not limited as long as a space is formed in the inside, and the one formed in a groove shape without penetrating the first member is formed through the first member. Including.

  Here, the film 130 is made of a flexible resin having a thickness of 15 μm or less. For example, as the film 130, for example, a para-type aromatic polyamide film may be mentioned. The film 130 has an area equal to or smaller than the outer periphery of the surface to which the film 130 on the Z1 side of the case member 40 is bonded. That is, the film 130 is not provided so as to protrude outward from the case member 40. In the present embodiment, the two third manifold portions 42 are continuously provided so as to be closed with one film 130. Of course, the film 130 may be provided independently for each third manifold portion 42.

  Thus, by closing the opening of the third manifold part 42 with the film 130, a part of the wall of the manifold 100 becomes a compliance part 131 that is a flexible part defined by the flexible film 130. ing. In the present embodiment, the area of the compliance portion 131 can be increased by providing the widened portion 42 b to increase the opening area of the third manifold portion 42, and the compliance portion 131 absorbs large pressure fluctuations in the ink in the manifold 100. can do.

  As shown in FIG. 5, an introduction port 44 communicating with the third manifold portion 42 is provided on the surface of the case member 40 to which the film 130 is bonded. In the second direction Y, the introduction port 44 penetrates in a third direction Z through a projecting portion 45 provided to project from one of the walls between the two third manifold portions 42 into the widened portion 42b. Is provided. Further, the film 130 is also bonded to the surface of the protrusion 45 where the introduction port 44 is opened via the first adhesive 140. The film 130 is provided with an opening 132 having an opening larger than the opening of the introduction port 44, and the film 130 is bonded to the protruding portion 45 outside the opening edge of the introduction port 44. .

  Further, on the surface of the projecting portion 45 on the film 130 side, an adhesive relief groove 46 having a concave shape is provided over the circumferential direction of the introduction port 44 at the opening edge portion on the Z1 side of the introduction port 44. That is, the adhesive relief groove 46 communicates with the introduction port 44 and is a hole having a larger inner diameter than the introduction port 44.

  Furthermore, in the third direction Z, the holder 150 as the second member is bonded to the Z1 side of the film 130 opposite to the case member 40 via the second adhesive 141. Examples of the holder 150 include materials other than metal, such as resin, silicon, glass, ceramics, and metal oxide. That is, materials other than metal include metal oxides. In particular, the holder 150 can be formed at low cost by using a resin. Furthermore, the holder 150 is preferably made of a material having a linear expansion coefficient equivalent to that of the case member 40. That is, when a material having a linear expansion coefficient that is significantly different from that of the case member 40 is used as the holder 150, the holder 150 and the case member 40 are warped due to differences in linear expansion coefficient due to heating or cooling. Then, when the holder 150 and the case member 40 are warped, the holder 150 and the case member 40 are peeled off, or the film 130 is peeled off or peeled off. In particular, since the film 130 of this embodiment is as thin as 15 μm or less, deformation stress due to a difference in linear expansion coefficient between the holder 150 and the case member 40 is easily affected. Therefore, the holder 150 and the case member 40 are preferably made of materials having the same linear expansion coefficient, and more preferably the holder 150 and the case member 40 are made of the same material. Thereby, it can suppress that peeling with the holder 150 and the case member 40, and the twist and peeling of the film 130 generate | occur | produce.

  The holder 150 is provided with a second recess 151 that opens in a region of the film 130 that faces the third manifold portion 42, that is, a region that faces the compliance portion 131. The second recess 151 has a depth that does not hinder the deformation of the film 130, and the deformation of the film 130 due to a change in the pressure of the ink in the manifold 100 is allowed by the second recess 151.

  Further, the holder 150 is provided with a communication path 152 communicating with the introduction port 44, and ink supplied from the communication path 152 is supplied into the manifold 100 through the introduction port 44.

  The holder 150 is provided with an insertion hole 153 for inserting the flexible cable 120, and the flexible cable 120 inserted from the insertion hole 153 side of the holder 150 is connected to the connection hole 43 of the case member 40 and the protective substrate. The through-holes 32 of 30 are inserted and electrically connected to the piezoelectric actuator 300 on the flow path forming substrate 10.

  Such a holder 150 is bonded to the Z1 side surface of the film 130 via the second adhesive 141. Moreover, the opening edge part of the opening part 132 of the film 130 is covered over the circumferential direction by the 2nd adhesive agent 141 which adhere | attaches the holder 150 and the film 130. FIG. That is, since the opening 132 of the film 130 has a larger opening than the introduction port 44, the film 130 is adhered to the case member 40 with the first adhesive 140 so as to be outside the introduction port 44. The opening edges of the 130 openings 132 can be covered with the second adhesive 141. Therefore, the end portion of the film 130 is covered with the second adhesive 141 without being exposed in the flow path that is a connection portion between the introduction port 44 and the communication path 152. Further, since the second adhesive 141 covering the end face of the opening 132 of the film 130 is filled in the adhesive relief groove 46, the excess second adhesive 141 is connected to the connection portion between the inlet 44 and the communication path 152. It can suppress flowing out into the flow path. Therefore, generation | occurrence | production of the foreign material by the excess 2nd adhesive agent 141 which flowed out can be suppressed, and the clogging etc. of the nozzle 21 can be suppressed. In the present embodiment, the second adhesive 141 is filled in the adhesive relief groove 46, but the present invention is not limited to this, and the first adhesive 140 that bonds the film 130 to the case member 40 is not limited thereto. Outflow into the flow path can also be suppressed by the adhesive relief groove 46. That is, it is sufficient that at least one of the first adhesive 140 and the second adhesive 141 is filled in the adhesive relief groove 46.

  In such a recording head 1, when ink is ejected, the ink is taken in from the communication path 152 and the flow path is filled with ink from the manifold 100 to the nozzle 21. Thereafter, in accordance with a signal from the drive circuit 121, a voltage is applied to each piezoelectric actuator 300 corresponding to the pressure chamber 12, so that the diaphragm 50 is bent and deformed together with the piezoelectric actuator 300. As a result, the pressure in the pressure chamber 12 increases and ink droplets are ejected from the predetermined nozzle 21. As described above, when the ink is filled into the manifold 100 from the communication path 152, the compliance portion 131 of the film 130 is flexibly deformed to absorb the pressure change of the ink in the manifold 100. Further, the pressure fluctuation of the ink in the manifold 100 that is generated when the ink droplets are ejected from the nozzle 21 is also absorbed by the compliance portion 131 of the film 130 being deformed. Accordingly, it is possible to improve ink supply characteristics and ejection characteristics and perform stable ink droplet ejection. In the present embodiment, by using the film 130 of 15 μm or less, the reactivity with respect to the pressure change of the ink in the manifold 100 is high. Therefore, in the recording head 1 of the present embodiment, it is possible to suppress the deterioration of the ink ejection characteristics even when ejecting ink droplets at a high frequency.

  In the present embodiment, as described above, the film 130 is bonded to the case member 40 made of a material other than metal via the first adhesive 140, and the film 130 is made of a material other than metal on the side opposite to the case member 40. The holder 150 made of the above material was bonded via the second adhesive 141. For this reason, the adhesive interface between the metal material, the first adhesive 140 and the second adhesive 141 can be eliminated at the adhesive interface between the case member 40, the film 130 and the holder 150. Therefore, it is possible to suppress a decrease in the adhesive strength of the case member 40, the film 130, and the holder 150, and to suppress peeling and ink leakage associated therewith. That is, in general, the adhesive strength between a non-metal material and an adhesive is higher than the adhesive strength between a metal material and an adhesive, so the adhesive strength can be reduced by reducing the adhesive portion between the metal material and the adhesive. Can be improved.

  Further, the case member 40 and the holder 150 are made of a material other than metal, in particular, a material having the same linear expansion coefficient, thereby suppressing warping and peeling of the case member 40 and the holder 150 due to the difference in the linear expansion coefficient, and the film. The slight peeling of 130 can be suppressed.

  Furthermore, in this embodiment, peeling of the film 130 is further suppressed by covering the end face of the film 130, that is, the opening edge of the opening 132 with the second adhesive 141 so as not to be exposed in the flow path. it can. That is, if the end face of the film 130 is exposed in the flow path, the ink erodes at the bonding interface between the film 130 and the first adhesive 140 and the second adhesive 141, and the adhesive strength of the film 130 is reduced. The film 130 is easily peeled off. In this embodiment, since the interface between the film 130 and the first adhesive 140 and the second adhesive 141 does not touch the ink directly, the decrease in the adhesive strength at the adhesive interface of the film 130 is suppressed, and the film 130 is peeled off. Can be suppressed.

  Here, the adhesion method of such a film 130 is demonstrated with reference to FIGS. 6-9 is sectional drawing which shows the film adhesion method of this embodiment. In this embodiment, a method for adhering the film 130 to the case member 40 will be described. Of course, the method for adhering the film is not limited to the method for adhering the film in the recording head 1, and the film is widely covered. The present invention can be applied to an adhesion method for adhering to a first member that is an adhesive body.

  Specifically, as shown in FIG. 6, an adhesive body is formed by bonding a film 130 having a thickness of 15 μm or less and a base member 160 as a backing material via a third adhesive 142 (adhesive body formation). Process).

  In this way, by bonding the film 130 to the base member 160 to form an adhesive body, the handling property of the adhesive body can be improved. That is, since the film 130 has a thickness of 15 μm or less, handling properties are poor, and it is substantially difficult to handle the film 130 alone. For this reason, by adhering the film 130 to the base member 160 to form an adhesive body, the handling property of the adhesive body can be improved as compared with the film 130 alone, and the film 130 can be easily handled.

  As the base member 160 for forming such an adhesive body, a material that improves the handling of the adhesive body and easily adheres the adhesive body to the case member 40 in a later step is preferable. It is preferable to use a resin material. The base member 160 is preferably made of a resin material that is harder than the film 130. Thereby, while being able to improve the handleability of an adhesive body, the twist and shrinkage of an adhesive body can be suppressed. Further, the base member 160 is preferably a member thicker than the film 130. This can also improve the handling properties of the bonded body and suppress the twisting and shrinkage of the bonded body. In the present embodiment, polyethylene terephthalate (PET) having a thickness of 100 to 200 μm is used as the base member 160.

  The adhesive film 130 and the base member 160 formed in the adhesive forming step are those having an area larger than the adhesive surface (the outer periphery on the adhesive surface side) of the case member 40 that is an adherend. In the present embodiment, for example, an adhesive body is formed by bonding a roll-shaped base member 160 and a roll-shaped film 130 and cutting them to a certain size. As described above, the use of an adhesive having an area larger than the adhesion surface with the case member 40 can improve the handling property and suppress the occurrence of shrinkage or shrinkage of the adhesive.

  The third adhesive 142 that bonds the film 130 and the base member 160 can be an adhesive that temporarily fixes the film 130 to the base member 160 and can be easily peeled off in a later step. That is, as the third adhesive 142, an adhesive having a weaker adhesive force than the first adhesive 140 is used.

  Next, as shown in FIG. 7, the adhesive body is half-cut from the film 130 side with a half-cutting die 170 (half-cut process). This half-cut is performed from the surface of the film 130 until reaching the middle of the thickness of the base member 160 so that the film 130 is completely cut and the base member 160 is not completely cut.

Next, as shown in FIG. 8, the half-cut adhesive film 130 and the case member 40 are bonded via a first adhesive 140 to form a structure (structure forming step).
The first adhesive 140 may be applied to the film 130 in advance, or may be applied to the case member 40. In the present embodiment, since there is no member protruding to the film 130 side on the surface to which the film 130 on the case member 40 side is bonded, the first adhesive 140 can be easily applied to the case member 40 side.

  Further, in this embodiment, as shown in FIG. 5, the case member 40 is formed with an adhesive escape groove 46, and therefore, the positioning of the film 130 on the case member 40 is based on the adhesive escape groove 46. As can be done. Further, the opening 132 of the film 130 may be formed through the adhesive body in the thickness direction before the adhesive body is bonded to the case member 40. Further, the adhesive body is half-cut so that the opening 132 is formed by the half-cut process, and the opening 132 is formed in the film 130 when the base member 160 is peeled in the subsequent peeling process. May be.

  Next, as shown in FIG. 9, after forming the structure, the base member 160 is peeled from the structure (peeling process). At this time, since the film 130 is cut into a predetermined shape by the half-cut process, only the part of the film 130 bonded to the case member 40 by the first adhesive 140 is left, and the first adhesive is applied to the case member 40. The extra area of film 130 that was not adhered by 140 can be removed simultaneously with the base member 160. The base member 160 may be peeled off in the peeling step after the first adhesive 140 that bonds the film 130 and the case member 40 is cured, before the first adhesive 140 is completely cured. That is, it may be performed in a semi-cured state.

  According to the film bonding method described above, a relatively thin film 130 having a thickness of 15 μm or less can be easily bonded to the case member 40 as the first member. In addition, since the film 130 of 15 μm or less can be bonded only by half-cutting using the base member 160, a fixing member such as stainless steel for bonding the film 130, or a step of etching the fixing member into a predetermined shape Can be eliminated and the cost can be reduced. In particular, since the base member 160 is a backing material, an inexpensive material can be used, and the cost can be reduced.

  After the film 130 is bonded to the case member 40 via the first adhesive 140 by the above-described process, the holder 150 is placed on the opposite side of the film 130 from the case member 40 as shown in FIG. By bonding with the adhesive 141, the recording head 1 of this embodiment can be obtained. Incidentally, when the holder 150 is bonded to the film 130 with the second adhesive 141, the second adhesive 141 is filled in the adhesive relief groove 46 as described above, so that the second adhesive 141 allows the film 130 to be filled. And the end surface of the 1st adhesive agent 140 is covered. In order to fill the adhesive escape groove 46 so that the second adhesive 141 does not flow into the flow path such as the introduction port 44 and the communication path 152, the second adhesive 141 is matched to the viscosity of the second adhesive 141. The amount of the agent 141 and the pressure for pressing the holder 150 may be set as appropriate.

(Embodiment 2)
FIG. 10 is a cross-sectional view of the main part of a recording head according to Embodiment 2 of the present invention. In addition, the same code | symbol is attached | subjected to the member similar to Embodiment 1 mentioned above, and the overlapping description is abbreviate | omitted.
As shown in FIG. 10, the case member 40 is provided with a caulking portion 47 protruding from a surface to which the film 130 is bonded.
The film 130 has a first fixing hole 133 through which the caulking portion 47 is inserted. A base member 160 is formed only around the caulking portion 47 on the opposite side of the film 130 from the case member 40. That is, the base member 160 is provided only around the caulking portion 47, and the base member 160 is provided with a second fixing hole 161 that communicates with the first fixing hole 133 and into which the caulking portion 47 is inserted. Yes. The caulking portion 47 is inserted into the first fixing hole 133 of the film 130 and the second fixing hole 161 of the base member 160, and the tip portion thereof is melted. A part of the member 160 is caulked and fixed.

  The caulking and fixing of the film 130 and the base member 160 by the caulking portion 47 provided in the case member 40 is used as temporary fixing until the first adhesive 140 that adheres the film 130 to the case member 40 is cured. Is done. That is, when the film 130 is bonded to the case member 40 without providing the caulking portion 47, it is necessary to hold the film 130 with a jig or the like until the first adhesive 140 is cured. As described above, in the case of fixing with a jig, when a plurality of structures are manufactured at the same time, a plurality of jigs are required and the cost is increased. In this embodiment, the case member 40 and the film 130 are caulked and fixed by the caulking portion 47, so that a jig for pressing the first adhesive 140 until it hardens becomes unnecessary, and the cost can be reduced. That is, the case member 40 and the film 130 are caulked and fixed by the caulking portion 47, so that the peeling step can be performed before the first adhesive 140 is cured. As a result, even if a plurality of regions of the film 130 used for the recording head 1 are formed in one bonded body, one bonded body can be reused, and the efficiency of the manufacturing process can be improved.

  In addition, the structure of this embodiment can also be formed by the same film adhesion method as Embodiment 1 mentioned above. That is, after the structure forming process for bonding the adhesive body to the case member 40 and before the peeling process for peeling the base member 160 from the film 130, the bonded body is caulked and fixed to the case member 40 by the caulking portion 47. That's fine. Incidentally, in the peeling step, the base member 160 can be left only around the caulking portion 47 by cutting the base member 160 with a laser beam or the like.

  In the present embodiment, the film 130 and the base member 160 are caulked and fixed to the case member 40. However, the present invention is not limited to this. For example, as shown in FIG. 11, the film 130 and the base member 160 may be fixed to the case member 40 with an ultraviolet curable adhesive 143. That is, the base member 160 remains around the ultraviolet curable adhesive 143.

  In this way, even when the ultraviolet curable adhesive 143 is used, a jig for pressing the first adhesive 140 until it is cured becomes unnecessary, and the cost can be reduced. That is, since the ultraviolet curable adhesive 143 is cured by irradiating ultraviolet rays, the ultraviolet curable adhesive 143 can be cured in a time shorter than the curing time of the first adhesive 140. Therefore, the ultraviolet curable adhesive 143 is used. This is because the film 130 and the case member 40 can be temporarily fixed without using a jig.

(Other embodiments)
As mentioned above, although each embodiment of this invention was described, the fundamental structure of this invention is not limited to what was mentioned above.
In each embodiment described above, the adhesive escape groove 46 is provided in the case member 40. However, the present invention is not particularly limited thereto, and the adhesive escape groove 46 may not be provided. Even when the adhesive relief groove 46 is not provided, the opening 132 of the film 130 is made larger than the introduction port 44 so that the end surface which is the opening edge of the opening 132 of the film 130 is first bonded. It is possible to cover at least one of the agent 140 and the second adhesive 141 so that the end face of the film 130 is not exposed in the flow path. Of course, the end surface of the film 130 may be exposed in the flow path. That is, the end surface of the film 130 may not be covered with at least one of the first adhesive 140 and the second adhesive 141.

  Further, in each of the above-described embodiments, the recording head 1 is exemplified as a structure having the film 130 having a thickness of 15 μm or less. However, the recording head 1 has the film 130 having a thickness greater than 15 μm. May be. That is, in the film bonding method described above, the thickness of the film 130 is defined to be 15 μm or less, and the thickness of the film 130 as a structure is not limited to 15 μm or less.

  Further, in each of the above-described embodiments, the opening on the Z2 side of the manifold 100 is closed by the cover 49, but the present invention is not particularly limited thereto, and the same film 130 as that of the above-described first embodiment is bonded instead of the cover 49. May be. Thereby, the area of the compliance part 131 can be increased, and a large pressure fluctuation of the ink in the manifold 100 can be absorbed.

  In the first embodiment described above, the first electrode 60 is an individual electrode of each piezoelectric actuator 300, and the second electrode 80 is a common electrode of a plurality of piezoelectric actuators 300. However, the present invention is not limited to this. 60 may be a common electrode of the plurality of piezoelectric actuators 300, and the second electrode 80 may be an individual electrode of each piezoelectric actuator 300.

  Further, in each of the embodiments described above, the thin film piezoelectric actuator 300 has been described as the pressure generating means for causing the pressure chamber 12 to change in pressure. However, the present invention is not particularly limited thereto, and, for example, a green sheet is attached. For example, a thick film type piezoelectric actuator formed by a method such as the above, a longitudinal vibration type piezoelectric actuator in which piezoelectric materials and electrode forming materials are alternately stacked and expanded and contracted in the axial direction can be used. In addition, as a driving element, a heating element is arranged in the pressure chamber, and droplets are ejected from the nozzle by bubbles generated by the heat generated by the heating element, or static electricity is generated between the diaphragm and the electrode, A so-called electrostatic actuator that deforms the diaphragm by force and ejects droplets from the nozzles can be used.

Such a recording head 1 is mounted on an ink jet recording apparatus I. FIG. 12 is a schematic diagram illustrating an example of an ink jet recording apparatus according to the present embodiment.
In the ink jet recording apparatus I shown in FIG. 12, the recording head 1 is provided with a cartridge 2 constituting a liquid supply means in a detachable manner, and a carriage 3 on which the recording head 1 is mounted is a carriage attached to the apparatus body 4. The shaft 5 is provided so as to be movable in the axial direction.

Then, the driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and a timing belt 7 (not shown), so that the carriage 3 on which the recording head 1 is mounted is moved along the carriage shaft 5. On the other hand, the apparatus main body 4 is provided with a conveyance roller 8 as a conveyance means, and is a recording medium such as paper.
The recording sheet S is conveyed by the conveying roller 8. Note that the conveyance means for conveying the recording sheet S is not limited to the conveyance roller, and may be a belt, a drum, or the like.

  In the above-described example, the ink jet recording apparatus I has a configuration in which the cartridge 2 as the ink supply unit is mounted on the carriage 3. However, the invention is not particularly limited thereto, and for example, a liquid supply unit such as an ink tank is used. The liquid supply means and the recording head 1 may be connected to each other via a supply pipe such as a tube by being fixed to the apparatus main body 4. Further, the liquid supply means may not be mounted on the ink jet recording apparatus.

  Further, in the above-described ink jet recording apparatus I, the recording head 1 is mounted on the carriage 3 and exemplarily moves in the main scanning direction. However, the present invention is not particularly limited thereto. For example, the recording head 1 is fixed, The present invention can also be applied to a so-called line type recording apparatus that performs printing only by moving a recording sheet S such as paper in the sub-scanning direction.

  In addition, the present invention is intended for a wide range of liquid ejecting heads in general, for example, for manufacturing recording heads such as various ink jet recording heads used in image recording apparatuses such as printers, and color filters such as liquid crystal displays. The present invention can also be applied to a coloring material ejecting head, an organic EL display, an electrode material ejecting head used for forming electrodes such as an FED (field emission display), a bioorganic matter ejecting head used for biochip manufacturing, and the like. Further, although the ink jet recording apparatus I has been described as an example of the liquid ejecting apparatus, the liquid ejecting apparatus using the other liquid ejecting heads described above can also be used.

The present invention is widely intended for MEMS devices, and can be applied to MEMS devices other than recording heads. Examples of such a MEMS device include an ultrasonic device, a motor, a pressure sensor, a pyroelectric element, and a ferroelectric element. Further, a completed body using these MEMS devices, for example, a liquid ejecting apparatus using the recording head, an ultrasonic sensor using the ultrasonic device, a robot using the motor as a driving source, the pyroelectric element The MEMS device includes an IR sensor using a ferroelectric layer and a ferroelectric memory using a ferroelectric element.
Furthermore, the present invention is intended for a wide range of structures, and can be applied to structures used for devices other than MEMS devices.

  DESCRIPTION OF SYMBOLS I ... Inkjet recording apparatus (liquid ejecting apparatus), 1 ... Inkjet recording head (liquid ejecting head), 2 ... Cartridge, 10 ... Channel formation substrate, 12 ... Pressure chamber, 20 ... Nozzle plate, 21 ... Nozzle, 30 ... Protective substrate, 40 ... Case member (first member), 41 ... First recess, 42 ... Third manifold part (recess), 43 ... Connection hole, 44 ... Inlet, 45 ... Protrusion, 46 ... Adhesive escape Groove, 47 ... caulking part, 49 ... cover, 50 ... diaphragm, 60 ... first electrode, 70 ... piezoelectric layer, 80 ... second electrode, 91 ... individual wiring, 92 ... common wiring, 100 ... manifold, 120 ... Flexible cable, 120 ... drive circuit, 130 ... film, 131 ... compliance part, 132 ... opening, 133 ... first fixing hole, 140 ... first adhesive, 141 ... second adhesive, 142 Third adhesive, 143 ... UV curable adhesive, 150 ... Holder (second member), 151 ... Second recess, 152 ... Communication path, 153 ... Insertion hole, 160 ... Base member, 161 ... Second fixing hole, 170 ... half-punch type, 300 ... piezoelectric actuator (pressure generating means)

Claims (12)

A first member having a recess;
A film formed of a resin material bonded to the first member via a first adhesive and defining the recess;
A second member bonded via a second adhesive to the opposite side of the film from the first member;
The structure in which the first member and the second member are members that are not metal.   The structure according to claim 1, wherein the first member is a resin.   The structure according to claim 1, wherein the second member is a resin. The concave portion of the first member is a flow path, and the first member has an introduction port that opens to the adhesive surface side of the film and communicates with the concave portion,
The second member is provided with a communication passage communicating with the introduction port,
The end face of the film is covered with at least one of the first adhesive and the second adhesive so as not to be exposed in the introduction port and the communication path. The structure according to claim 1.   The structure according to claim 4, wherein an adhesive escape groove is provided in a circumferential direction at an opening edge of the introduction port of the first member.   The structure according to claim 1, wherein the film has a thickness of 15 μm or less.   The structure according to any one of claims 1 to 6, wherein the first member and the second member are formed of the same material.   A MEMS device comprising the structure according to claim 1. Comprising the structure according to any one of claims 1 to 7,
The liquid ejecting head, wherein the concave portion is a common liquid chamber communicating in common with a plurality of pressure chambers communicating with a nozzle for ejecting liquid. An adhesive body forming step of forming an adhesive body formed by adhering a film having a thickness of 15 μm or less and a base member;
A half-cut step of half-cutting the adhesive body with a half-cut mold from the film side;
A structure forming step of forming a structure formed by bonding the film of the half-cut adhesive body and the first member having a recess;
And a peeling step of peeling the base member from the structure after the structure forming step. In the structure forming step,
The film and the first member are fixed using an ultraviolet curable adhesive,
The film bonding method according to claim 10, wherein a part of the base member remains on the first member without being peeled off.   The said film adhered to the said structure by the said peeling process is an area below the outer periphery of the said 1st member in the surface where the said film of the said 1st member adhere | attaches, The Claim 10 or 11 characterized by the above-mentioned. The film adhesion method described in 1.

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