JP2017120203A - Magnetic sensor module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic sensor module with which it is possible to reduce the thickness of the module.SOLUTION: Provided is a magnetic sensor module A1 comprising a hall element 1, a continuity support member 2 for supporting the hall element 1 and constituting a continuity path connected to the hall element 1, a wire 3 connected to the hall element 1 and the continuity support member 2, and an encapsulation resin 4 for covering the hall element 1, wherein the continuity support member 2 has an element placement plane 2A on which the hall element 1 is placed and which is perpendicular to a direction z, a wire bonding plane 2B to which the wire 3 is connected and which is located on one side from the element placement plane 2A to which the element placement plane 2A faces in the direction z, and a packaging terminal plane 2D facing the other side that is opposite the one side in the direction z, continuous to the wire bonding plane 2B, and included in the continuity path.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a magnetic sensor module incorporating a Hall element.

  Patent Document 1 discloses an example of a conventional magnetic sensor module. The magnetic sensor module described in the document includes a Hall element, a lead, and a sealing resin. The Hall element is mounted on the surface of the lead. The Hall element and a part of the lead are covered with the sealing resin. A portion of the lead exposed from the sealing resin is a mounting terminal. The mounting terminal is constituted by a portion of the lead that is bent downward.

  Since the magnetic sensor module is used in electronic devices and the like, there is a strong demand for downsizing. In particular, it is required to reduce the thickness by reducing the height of the magnetic sensor module.

JP 2014-0777730 A

  The present invention has been conceived under the circumstances described above, and an object thereof is to provide a magnetic sensor module that can be thinned.

  The magnetic sensor module provided by the present invention includes a Hall element, a conduction support member that supports the Hall element and forms a conduction path connected to the Hall element, and a wire connected to the Hall element and the conduction support member. And a sealing resin that covers the Hall element, wherein the conduction support member has the element mounting surface on which the Hall element is mounted and is perpendicular to the first direction, and the wire is connected to the magnetic sensor module. And a wire bonding surface located on one side of the element mounting surface facing the element mounting surface in the first direction and a wire bonding surface facing the other side opposite to the one side in the first direction. And a mounting terminal surface included in the conduction path.

  In a preferred embodiment of the present invention, the conduction support member includes a first lead constituting the element mounting surface and made of metal and a second lead constituting the wire bonding surface and made of metal.

  In a preferred embodiment of the present invention, the first lead has a first main surface facing the one side and a first back surface facing the other side.

  In a preferred embodiment of the present invention, the first lead is recessed from the first main surface to the other side and has a concave bottom surface that faces the one side, and a concave side surface that connects the concave bottom surface and the first main surface. The recess bottom surface constitutes the element mounting surface.

  In a preferred embodiment of the present invention, the recess is filled with the sealing resin.

  In a preferred embodiment of the present invention, the recess is included in the first main surface when viewed in the first direction.

  In a preferred embodiment of the present invention, the recess defines the first main surface when viewed in the first direction.

  In a preferred embodiment of the present invention, the side surface of the recess is inclined with respect to the first direction.

  In a preferred embodiment of the present invention, the first main surface constitutes the element mounting surface.

  In a preferred embodiment of the present invention, the first back surface is exposed from the sealing resin.

  In a preferred embodiment of the present invention, the first back surface and the mounting terminal surface are aligned in the first direction.

  In a preferred embodiment of the present invention, the second lead has a second main surface facing the one side and a second back surface facing the other side.

  In a preferred embodiment of the present invention, the second main surface constitutes the wire bonding surface.

  In a preferred embodiment of the present invention, the second back surface constitutes the mounting terminal surface.

  In a preferred embodiment of the present invention, the second main surface and the second back surface overlap each other when viewed in the first direction.

  In a preferred embodiment of the present invention, the second main surface and the second back surface coincide with each other in the first direction view.

  In a preferred embodiment of the present invention, four second leads and four wires are provided, and the first lead is disposed so as to be surrounded by the four second leads.

  In a preferred embodiment of the present invention, the first lead is not included in the conduction path.

  In a preferred embodiment of the present invention, the conduction support member includes a base material made of an insulating material and having the first direction as a thickness direction, and a wiring pattern formed on the base material and constituting the conduction path. .

  In a preferred embodiment of the present invention, the wiring pattern is made of metal.

  In a preferred embodiment of the present invention, the substrate has a substrate main surface facing the one side, a substrate back surface facing the other side, and a substrate through-hole penetrating in the first direction. The Hall element is included in the base material through hole as viewed in the first direction.

  In a preferred embodiment of the present invention, the base material through-hole is filled with the sealing resin.

  In a preferred embodiment of the present invention, at least a part of the hall element is accommodated in the base material through hole in the first direction.

  In a preferred embodiment of the present invention, the base material through hole has a rectangular shape in the first direction view.

  In a preferred embodiment of the present invention, the wiring pattern has a through hole blocking portion that closes the base material through hole from the other side, and a surface facing the one side of the through hole blocking portion is The element mounting surface is configured.

  In a preferred embodiment of the present invention, a part of the through hole blocking part is formed on the back surface of the base material.

  In a preferred embodiment of the present invention, the through hole blocking portion is not included in the conduction path.

  In a preferred embodiment of the present invention, the wiring pattern has a main surface pad portion formed on the main surface of the base material and connected to the wire, and the one side of the main surface pad portion is connected to the main surface pad portion. The facing surface constitutes the wire bonding surface.

  In a preferred embodiment of the present invention, the wiring pattern has a back electrode portion formed on the back surface of the substrate, and a surface facing the other side of the back electrode portion is the mounting terminal surface. It is composed.

  In a preferred embodiment of the present invention, the main surface pad portion and the back surface electrode portion overlap in the first direction view.

  In a preferred embodiment of the present invention, the wiring pattern has a through conduction portion that penetrates the base material in the first direction and conducts the main surface pad portion and the back electrode portion.

  In a preferred embodiment of the present invention, the wiring pattern includes a side surface conductive portion that is provided on a side surface of the base material and that electrically connects the main surface pad portion and the back surface electrode portion.

  In a preferred embodiment of the present invention, four main surface pad portions and four wires are provided, and the base material through hole is disposed so as to be surrounded by the four main surface pad portions. Yes.

  According to the present invention, the Hall element is mounted on the element mounting surface located on the other side in the first direction with respect to the wire bonding surface in the first direction. That is, a part of the Hall element is located on the mounting terminal surface side from the end portion of the wire connected to the wire bonding surface. Thereby, thickness reduction of the said magnetic sensor module can be achieved.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a principal part top view which shows the magnetic sensor module based on 1st Embodiment of this invention. It is a bottom view which shows the magnetic sensor module based on 1st Embodiment of this invention. It is sectional drawing which follows the III-III line of FIG. It is a principal part top view which shows the modification of the magnetic sensor module based on 1st Embodiment of this invention. It is a bottom view which shows the modification of the magnetic sensor module based on 1st Embodiment of this invention. It is a principal part top view which shows the modification of the magnetic sensor module based on 1st Embodiment of this invention. It is a bottom view which shows the modification of the magnetic sensor module based on 1st Embodiment of this invention. It is a principal part top view which shows the magnetic sensor module based on 2nd Embodiment of this invention. It is a principal part top view which shows the magnetic sensor module based on 3rd Embodiment of this invention. It is sectional drawing which follows the XX line of FIG. It is a principal part top view which shows the magnetic sensor module based on 4th Embodiment of this invention. It is a bottom view which shows the magnetic sensor module based on 4th Embodiment of this invention. It is sectional drawing which follows the XIII-XIII line | wire of FIG. It is a principal part top view which shows the modification of the magnetic sensor module based on 4th Embodiment of this invention. It is sectional drawing which follows the XV-XV line | wire of FIG.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 3 show a magnetic sensor module according to a first embodiment of the present invention. The magnetic sensor module A1 of this embodiment includes a hall element 1, a conduction support member 2, four wires 3, and a sealing resin 4. The magnetic sensor module A1 is a sensor module that is mounted on an electronic device or the like and used for magnetic detection. The use of the magnetic sensor module according to the present invention is not particularly limited as long as it is a sensor module that performs detection using the Hall element 1.

  FIG. 1 is a main part plan view showing the magnetic sensor module A1. FIG. 2 is a bottom view showing the magnetic sensor module A1. 3 is a cross-sectional view taken along line III-III in FIG. In FIG. 1, the sealing resin 4 is indicated by an imaginary line for convenience of understanding.

  The Hall element 1 is a sensor element using the Hall effect, and detects an electromotive force generated when a magnetic field is applied to an object through which a current flows. The Hall element 1 has an element body 11 and four element electrodes 12. The element body 11 has a portion made of, for example, GaAs or InSb as a detection portion through which a current flows. The four element electrodes 12 are electrodes used for energizing the element body 11 and detecting an electromotive force.

  The conduction support member 2 constitutes a conduction path that supports the Hall element 1 and is connected to the four element electrodes 12 of the Hall element 1. In the present embodiment, the conduction support member 2 includes a first lead 21 and four second leads 22. Both the first lead 21 and the four second leads 22 are made of metal. The metal which comprises the 1st lead 21 and the 2nd lead 22 is not specifically limited, For example, Cu, Fe, Ni etc. and these alloys are mentioned. A plating layer may be formed on the surfaces of the first lead 21 and the second lead 22.

  The first lead 21 has a first main surface 211, a first back surface 212, and a recess 213. In the present embodiment, the first lead 21 has a rectangular shape when viewed in the z direction.

  The first major surface 211 is a surface facing one side in the z direction, which is the thickness direction. The first back surface 212 is a surface facing the other side in the z direction. The first main surface 211 and the first back surface 212 are parallel to each other. The first back surface 212 constitutes the element-side back surface island 2C.

  The recess 213 is recessed from the first main surface 211 to the other side in the z direction. In the present embodiment, the recess 213 has a rectangular shape when viewed in the z direction. The recess 213 has a recess bottom surface 214 and a recess side surface 215. The recess bottom surface 214 faces one side in the z direction and is parallel to the first main surface 211. In this embodiment, the recess bottom surface 214 has a rectangular shape when viewed in the z direction. The concave side surface 215 connects the concave bottom surface 214 and the first main surface 211. In the present embodiment, the concave side surface 215 is inclined with respect to the z direction. The size of the cross section perpendicular to the z direction of the recess 213 increases from the recess bottom surface 214 toward the recess side surface 215.

  The recess 213 is included in the first main surface 211 when viewed in the z direction. The first main surface 211 of the present embodiment has a rectangular ring shape when viewed in the z direction.

  In the present embodiment, the Hall element 1 is mounted on the bottom surface 214 of the recess. Thereby, the element mounting surface 2 </ b> A is configured by the recess bottom surface 214. The element body 11 of the Hall element 1 and the bottom surface 214 of the recess are bonded by a bonding material (not shown). On the other hand, the element electrode 12 of the Hall element 1 and the first lead 21 are not conductive. That is, the first lead 21 is not included in the conduction path of the Hall element 1. The Hall element 1 is included in the bottom surface 214 of the recess when viewed in the z direction. In the z direction, a part of the hall element 1 is accommodated in the recess 213, and the other part protrudes from the recess 213.

  Each of the four second leads 22 has a second main surface 221, a second back surface 222, a first side surface 223, and a second side surface 224.

  The first major surface 211 is a surface facing one side in the z direction, which is the thickness direction. The first back surface 212 is a surface facing the other side in the z direction. The first main surface 211 and the first back surface 212 are parallel to each other. The first main surface 211 and the first back surface 212 are electrically connected to each other. The first main surface 211 and the first back surface 212 overlap when viewed in the z direction, and in the present embodiment, coincide with each other.

  The first main surface 211 constitutes the wire bonding surface 2B. The first back surface 212 constitutes the mounting terminal surface 2D. The second main surface 221 (wire bonding surface 2B) is located on one side in the z direction with respect to the recess bottom surface 214 (element mounting surface 2A) of the first lead 21. The second back surface 222 (mounting terminal surface 2D) is located on the other side in the z direction with respect to the recess bottom surface 214 (element mounting surface 2A).

  The first lead 21 is surrounded by four second leads 22 when viewed in the z direction.

  The four wires 3 conduct the Hall element 1 and the four second leads 22 and are included in the conduction path. One end of the wire 3 is bonded to the element electrode 12, and the other end of the wire 3 is bonded to the second main surface 221 (wire bonding surface 2B).

  The first side surface 223 and the second side surface 224 connect the second main surface 221 and the second back surface 222, and are parallel to the z direction. The first side surface 223 faces outward in the x direction. The second side surface 224 faces outward in the y direction.

  The sealing resin 4 covers the Hall element 1, the four wires 3, and part of the first lead 21 and the second lead 22. The sealing resin 4 is made of an insulating resin such as an epoxy resin. The sealing resin 4 has a sealing resin main surface 41, a sealing resin back surface 42, two sealing resin first side surfaces 43, and two sealing resin second side surfaces 44. The sealing resin 4 is filled in the recess 213.

  The sealing resin main surface 41 is a surface facing one side in the z direction. The sealing resin back surface 42 is a surface facing the other side in the z direction. The two sealing resin first side surfaces 43 connect the sealing resin main surface 41 and the sealing resin back surface 42 and face the x direction. The two sealing resin second side surfaces 44 connect the sealing resin main surface 41 and the sealing resin back surface 42 and face the y direction.

  None of the Hall element 1, the first lead 21, the four second leads 22, and the four wires 3 are exposed from the sealing resin main surface 41.

  From the sealing resin back surface 42, the first back surface 212 of the first lead 21 and the second side surfaces 224 of the four second leads 22 are exposed. The sealing resin back surface 42, the first back surface 212 of the first lead 21, and the second side surfaces 224 of the four second leads 22 are flush with each other.

  From the first side surface 43 of the sealing resin, the first side surfaces 223 of the two second leads 22 are exposed. The first side surface 43 of the sealing resin and the first side surfaces 223 of the two second leads 22 are flush with each other.

  The side surface of the first lead 21 is exposed from the second side surface 44 of the sealing resin. The sealing resin second side surface 44 and the side surface of the first lead 21 are flush with each other.

  Next, the operation of the magnetic sensor module A1 will be described.

  According to the present embodiment, the Hall element 1 is mounted on the concave bottom surface 214 (element mounting surface 2A) located on the other side in the z direction with respect to the second main surface 221 (wire bonding surface 2B) in the z direction. That is, a part of the Hall element 1 is located on the second back surface 222 (mounting terminal surface 2D) side of the end of the wire 3 connected to the first main surface 211 (wire bonding surface 2B). Thereby, thickness reduction of magnetic sensor module A1 can be achieved.

  The first lead 21 and the second lead 22 can appropriately perform the functions of supporting the Hall element 1 and configuring the conduction path of the Hall element 1.

  Since the first lead 21 has the recess 213, it is possible to suppress the rigidity of the first lead 21 from being lowered while the element mounting surface 2A is configured by the recess bottom surface 214.

  Since the second back surface 222 (mounting terminal surface 2D) and the first back surface 212 (element-side back surface island 2C) are flush with each other, the magnetic sensor module A1 is configured using the second back surface 222 (mounting terminal surface 2D). When mounting on a circuit board (not shown) or the like, the first back surface 212 (element-side back surface island portion 2C) can be bonded to the circuit board. Thereby, heat from the Hall element 1 can be radiated to the substrate via the first lead 21.

  4 to 15 show modifications and other embodiments of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  4 and 5 show a modification of the magnetic sensor module A1. In this modification, the second side surface 224 of the second lead 22 is exposed from the sealing resin second side surface 44 of the sealing resin 4. The second side surface 224 and the sealing resin second side surface 44 are flush with each other. The first side surface 223 of the second lead 22 is covered with the sealing resin 4.

  Also according to this modification, the magnetic sensor module A1 can be thinned.

  6 and 7 show another modification of the magnetic sensor module A1. In this modification, the first side surface 223 of the second lead 22 is exposed from the sealing resin first side surface 43 of the sealing resin 4, and the second side surface 224 is exposed from the sealing resin second side surface 44. Yes. The first side surface 223 and the sealing resin first side surface 43 are flush with each other. The first side surface 223, the second side surface 224, and the sealing resin second side surface 44 are flush with each other.

  Also according to this modification, the magnetic sensor module A1 can be thinned.

  FIG. 8 shows a magnetic sensor module according to the second embodiment of the present invention. In the magnetic sensor module A2 of the present embodiment, the configuration of the concave portion 213 of the first lead 21 is different from the magnetic sensor module A1 described above. The cross section of the magnetic sensor module A2 in the zx plane is the same as that in FIG.

  In the present embodiment, the first main surface 211 is partitioned by the recess 213 when viewed in the z direction. The recess 213 has a groove shape that crosses the first lead 21 in the y direction.

  According to such an embodiment, the magnetic sensor module A2 can be thinned.

  9 and 10 show a magnetic sensor module according to a third embodiment of the present invention. FIG. 9 is a main part plan view showing the magnetic sensor module A3 of the present embodiment, and FIG. 10 is a cross-sectional view taken along the line XX of FIG.

  In the present embodiment, the first lead 21 has a first main surface 211 and a first back surface 212 and does not have the above-described recess 213. In the present embodiment, the Hall element 1 is mounted on the first main surface 211, and the first main surface 211 constitutes the element mounting surface 2A. The first main surface 211 (element mounting surface 2A) is located on the other side in the z direction with respect to the second main surface 221 (wire bonding surface 2B).

  Even in such an embodiment, the magnetic sensor module A3 can be thinned.

  11 to 13 show a magnetic sensor module according to a fourth embodiment of the present invention. In the magnetic sensor module A4 of the present embodiment, the conduction support member 2 has a base material 23 and a wiring pattern 24.

  FIG. 11 is a plan view of an essential part showing the magnetic sensor module A4. FIG. 12 is a bottom view showing the magnetic sensor module A4. 13 is a cross-sectional view taken along line XIII-XIII in FIG.

  The base material 23 is a plate-like member made of an insulating material. The material of the base material 23 is not specifically limited, For example, a glass epoxy resin is mentioned. The substrate 23 has a substrate main surface 231, a substrate back surface 232, and a substrate through hole 233.

  The substrate main surface 231 is a surface facing one side in the z direction. The substrate main surface 231 is a surface facing the other side in the z direction. The substrate main surface 231 and the substrate back surface 232 are parallel to each other. The base material through-hole 233 penetrates the base material 23 in the z direction. The base material through hole 233 has, for example, a rectangular shape when viewed in the z direction. The base material through hole 233 is filled with the sealing resin 4.

  When viewed in the z direction, the Hall element 1 is included in the base material through hole 233. In addition, a part of the hall element 1 is accommodated in the substrate through-hole 233 in the z direction.

  The wiring pattern 24 is formed on the base material 23 and includes a plating layer made of, for example, Cu, Ni, Au or the like. The wiring pattern 24 includes a through hole blocking portion 241, four main surface pad portions 242, four back surface electrode portions 243, and four through conduction portions 244.

  The through hole blocking portion 241 blocks the base material through hole 233 of the base material 23 from the other side in the z direction. A part of the through hole blocking portion 241 is formed on the base material back surface 232 of the base material 23. The Hall element 1 is mounted on the surface of the through hole blocking portion 241 facing the one side in the z direction. Thereby, in this embodiment, the surface which faces the z direction one side of the through-hole sealing part 241 comprises 2 A of element mounting surfaces. In addition, the surface facing the other side in the z direction of the through hole blocking portion 241 constitutes the element side back surface island portion 2C.

  The four main surface pad portions 242 are formed on the base material main surface 231 of the base material 23. The four main surface pad portions 242 are arranged so as to surround the substrate through-hole 233 (Hall element 1) in the z-direction view. One end of the wire 3 is connected to the main surface pad portion 242. Thereby, in this embodiment, the surface which faces the z direction one side among main surface pad parts 242 constitutes wire bonding surface 2B.

  The four back electrode portions 243 are formed on the base material back surface 232 of the base material 23. The surface of the substrate back surface 232 facing the other side in the z direction constitutes the mounting terminal surface 2D. When viewed in the z direction, the main surface pad portion 242 and the back surface electrode portion 243 overlap each other and may coincide with each other.

  Each of the four through conduction portions 244 passes through the base material 23 in the z direction. The through conduction part 244 conducts the main surface pad part 242 and the back electrode part 243.

  The surface (wire bonding surface 2B) facing the one side in the z direction of the main surface pad portion 242 is located on one side in the z direction with respect to the surface facing the one side in the z direction (element mounting surface 2A) of the through hole blocking portion 241. Yes. The surface (mounting terminal surface 2D) facing the other side in the z direction of the back surface electrode portion 243 is located on the other side in the z direction with respect to the surface facing the one side in the z direction (element mounting surface 2A) of the through hole blocking portion 241. . The surface of the through-hole blocking portion 241 facing the other side in the z direction (element-side back surface island portion 2C) coincides with the surface facing the other side of the back surface electrode portion 243 in the z direction (mounting terminal surface 2D) in the z direction. ing.

  Even in such an embodiment, the magnetic sensor module A4 can be thinned. The distance between the element mounting surface 2A and the mounting terminal surface 2D in the z direction is about the thickness of the wiring pattern 24. Thereby, thickness reduction of magnetic sensor module A4 can further be accelerated | stimulated.

  14 and 15 show a magnetic sensor module according to a fifth embodiment of the present invention. In the magnetic sensor module A5 of this embodiment, the wiring pattern 24 of the conduction support member 2 has four side surface conduction parts 245 instead of the four through conduction parts 244 described above.

  The side surface conductive portions 245 are formed on the side surfaces located at both ends of the base material 23 in the x direction. The side surface conduction part 245 conducts the main surface pad part 242 and the back electrode part 243. Of the side surfaces located at both ends in the x direction of the base material 23, the portions where the side surface conducting portions 245 are formed are recessed inward in the x direction.

  Even in such an embodiment, the magnetic sensor module A5 can be thinned.

  The magnetic sensor module according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the magnetic sensor module according to the present invention can be modified in various ways.

A1 to A5: Magnetic sensor module 1: Hall element 2: Conduction support member 2A: Element mounting surface 2B: Wire bonding surface 2C: Element side rear surface island 2D: Mounting terminal surface 3: Wire 4: Sealing resin 11: Element body 12: Element electrode 21: First lead 22: Second lead 23: Substrate 24: Wiring pattern 41: Sealing resin main surface 42: Sealing resin back surface 43: Sealing resin first side surface 44: Sealing resin second Side surface 211: first main surface 212: first back surface 213: concave portion 214: concave bottom surface 215: concave side surface 221: second main surface 222: second back surface 223: first side surface 224: second side surface 231: base material main surface 232: Substrate back surface 233: Substrate through hole 241: Through hole blocking portion 242: Main surface pad portion 243: Back electrode portion 244: Through conduction portion 245: Side surface conduction portion

Claims (33)

A Hall element;
A conduction support member that supports the Hall element and constitutes a conduction path connected to the Hall element;
A wire connected to the Hall element and the conductive support member;
A magnetic sensor module comprising a sealing resin that covers the Hall element,
The conduction support member includes an element mounting surface on which the Hall element is mounted and perpendicular to the first direction, the wire is connected, and the element mounting surface faces the element mounting surface in the first direction. A wire bonding surface positioned on the side, facing the other side opposite to the one side in the first direction, and being electrically connected to the wire bonding surface and having a mounting terminal surface included in the conduction path. , Magnetic sensor module.   2. The magnetic sensor module according to claim 1, wherein the conduction support member includes a first lead constituting the element mounting surface and made of metal and a second lead constituting the wire bonding surface and made of metal.   The magnetic sensor module according to claim 2, wherein the first lead has a first main surface facing the one side and a first back surface facing the other side. The first lead has a recess having a recess bottom surface that is recessed from the first main surface to the other side and faces the one side, and a recess side surface that connects the recess bottom surface and the first main surface,
The magnetic sensor module according to claim 3, wherein the bottom surface of the recess constitutes the element mounting surface.   The magnetic sensor module according to claim 4, wherein the recess is filled with the sealing resin.   The magnetic sensor module according to claim 5, wherein the recess is included in the first main surface when viewed in the first direction.   The magnetic sensor module according to claim 5, wherein the recess defines the first main surface when viewed in the first direction.   The magnetic sensor module according to claim 6, wherein the side surface of the recess is inclined with respect to the first direction.   The magnetic sensor module according to claim 3, wherein the first main surface constitutes the element mounting surface.   The magnetic sensor module according to claim 3, wherein the first back surface is exposed from the sealing resin.   The magnetic sensor module according to claim 10, wherein the first back surface and the mounting terminal surface coincide with each other in the first direction.   The magnetic sensor module according to claim 2, wherein the second lead has a second main surface facing the one side and a second back surface facing the other side.   The magnetic sensor module according to claim 12, wherein the second main surface constitutes the wire bonding surface.   The magnetic sensor module according to claim 13, wherein the second back surface constitutes the mounting terminal surface.   The magnetic sensor module according to claim 14, wherein the second main surface and the second back surface overlap each other when viewed in the first direction.   The magnetic sensor module according to claim 15, wherein the second main surface and the second back surface coincide with each other when viewed in the first direction. Including the four second leads and the four wires;
The magnetic sensor module according to claim 2, wherein the first lead is disposed so as to be surrounded by the four second leads.   The magnetic sensor module according to claim 2, wherein the first lead is not included in the conduction path.   The magnetic sensor module according to claim 1, wherein the conduction support member includes a base material made of an insulating material and having a thickness direction in the first direction and a wiring pattern formed on the base material and constituting the conduction path. .   The magnetic sensor module according to claim 19, wherein the wiring pattern is made of metal. The substrate has a substrate main surface facing the one side, a substrate back surface facing the other side, and a substrate through hole penetrating in the first direction;
The magnetic sensor module according to claim 20, wherein the Hall element is included in the base material through hole when viewed in the first direction.   The magnetic sensor module according to claim 21, wherein the base material through hole is filled with the sealing resin.   The magnetic sensor module according to claim 22, wherein at least a part of the hall element is accommodated in the base material through hole in the first direction.   The magnetic sensor module according to claim 23, wherein the base material through hole has a rectangular shape when viewed in the first direction. The wiring pattern has a through hole blocking portion that closes the base material through hole from the other side,
The magnetic sensor module according to claim 23 or 24, wherein a surface of the through hole sealing portion that faces the one side constitutes the element mounting surface.   The magnetic sensor module according to claim 25, wherein a part of the through-hole blocking part is formed on the back surface of the base material.   27. The magnetic sensor module according to claim 26, wherein the through hole blocking portion is not included in the conduction path. The wiring pattern has a main surface pad portion formed on the base material main surface and connected to the wire,
28. The magnetic sensor module according to claim 27, wherein a surface facing the one side of the main surface pad portion constitutes the wire bonding surface. The wiring pattern has a back electrode portion formed on the back surface of the base material,
29. The magnetic sensor module according to claim 28, wherein a surface facing the other side of the back electrode portion constitutes the mounting terminal surface.   30. The magnetic sensor module according to claim 29, wherein the main surface pad portion and the back electrode portion overlap each other when viewed in the first direction.   31. The magnetic sensor module according to claim 30, wherein the wiring pattern has a through conduction portion that penetrates the base material in the first direction and conducts the main surface pad portion and the back electrode portion.   31. The magnetic sensor module according to claim 30, wherein the wiring pattern includes a side surface conductive portion that is provided on a side surface of the base material and that electrically connects the main surface pad portion and the back surface electrode portion. Four main surface pad portions and four wires;
The magnetic sensor module according to any one of claims 29 to 32, wherein the base material through-hole is disposed so as to be surrounded by the four main surface pad portions.

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