JP2017116871A - Detergent composition for resin mask peeling - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a detergent composition for resin mask peeling that is effective in removing a resin mask and can suppress metal corrosion and discoloration.SOLUTION: This invention relates to a detergent composition for resin mask peeling comprising a compound represented by formula (I)(component A), a compound represented by formula (II)(component B), a carboxylic acid having carbon atoms of one or more and five or less or a salt thereof (component C), a compound represented by formula (III)(component D), a compound represented by formula (IV)(component E), and water (component F). R-O-(CHCHO)-H (III).SELECTED DRAWING: None

Description

  The present disclosure relates to a cleaning composition for removing a resin mask, a cleaning method for a resin mask using the cleaning composition, and a manufacturing method for an electronic component.

  In recent years, in personal computers and various electronic devices, low power consumption, high processing speed, and miniaturization have progressed, and wirings such as package substrates mounted thereon have been miniaturized year by year. The metal mask method has been mainly used to form such fine wiring and connection terminals such as pillars and bumps. However, it is difficult to respond to miniaturization of wiring etc. because of its low versatility. To other new methods.

  As one of new methods, a method of using a dry film resist as a thick film resin mask instead of a metal mask is known. The resin mask is finally peeled and removed, and an alkaline peeling cleaning agent is used at that time. As such a cleaning agent for peeling, for example, Patent Document 1 contains 0.5 to 3.0 parts by mass of quaternary ammonium hydroxide in 100 parts by mass of the cleaning composition, Containing 3.0 parts by weight or more and 10.0 parts by weight or less of an acidic amine, 0.3 parts by weight or more and 2.5 parts by weight or less of an acid or ammonium salt thereof, and 50.0 parts by weight or more and 95.0 parts by weight of water. The cleaning composition for resin mask layers used for manufacture of the circuit board containing below mass part is described.

  Patent Document 2 includes 0.1 wt% to 40.0 wt% organic quaternary ammonium base, 0.01 wt% to 5 wt% alkali or alkaline earth metal base, and 0 wt% to 80 wt%. Weight percent solvent and / or amine, 0 weight percent to 5 weight percent surfactant, 0 weight percent to 10 weight percent chelator / passivator, 0 weight percent to 98 weight percent water. Cleaning compositions useful for removing SARC and photoresist containing are described.

  US Pat. No. 6,057,049 includes about 2 to 55% by weight of the total weight of the composition of at least one alkanolamine, at least one morpholine, or a mixture thereof, and about 20 to 94 weight of the total weight of the composition. A composition for removing a film resist is described, comprising:% of at least one organic solvent and about 0.5-60% by weight of water of the total weight of the composition.

  Patent Document 4 describes a photoresist remover containing an ammonium salt, a water-soluble organic amine, and water.

  Patent Document 5 relates to a resist stripping process after forming a wiring pattern in the manufacture of electronic components such as printed circuit boards and module boards, and electronic components such as lead frames, and a method for suppressing deterioration of a resist stripping solution containing an organic alkali compound. And a resist stripping method and system.

  Furthermore, in resist stripping, imidazole compounds, saccharides, sugar alcohols, azole compounds and the like are described in Patent Documents 6 to 8 as anticorrosives for copper and aluminum and solder plating mainly used for fine wiring. .

JP-A-2015-79244 Special table 2007-526523 JP 2014-78009 A Taiwan published patent TW200700937 JP 2013-183080 A JP-A-64-81295 Japanese Patent Laid-Open No. 11-84686 Japanese Patent Laid-Open No. 2002-62668

  When forming fine wiring on printed circuit boards, etc., not only residual resin masks such as dry film resists, but also reduction of residuals such as auxiliaries contained in solder and plating solution used for fine wiring and bump formation Therefore, a high cleaning property is required for the cleaning composition. In particular, since a heat-treated resin mask is difficult to peel off, a high resin mask removability is required for the cleaning composition. Furthermore, since corrosion and discoloration of metals such as copper used for many wiring and connection terminals lead to deterioration of the quality and value of the package substrate, the cleaning composition is required to have high corrosion and discoloration prevention performance. ing. However, in the method described in the patent document, it is difficult to achieve both cleanability and prevention of corrosion and discoloration.

  Accordingly, the present disclosure provides a cleaning composition for removing a resin mask that has excellent resin mask removability and can suppress metal corrosion and discoloration, a cleaning method for a resin mask using the cleaning composition, and a method for manufacturing a substrate. provide.

  The present disclosure relates to a compound represented by the following formula (I) (component A), a compound represented by the following formula (II) (component B), a carboxylic acid having 1 to 5 carbon atoms or a salt thereof (component C). And a cleaning composition for removing a resin mask, comprising a compound represented by the following formula (III) (component D), a compound represented by the following formula (IV) (component E), and water (component F): .

In the above formula (I), R ₁ is at least one selected from a hydrogen atom, a methyl group, an ethyl group, and an aminoethyl group, and R ₂ is a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group, and At least one selected from an ethyl group, and R ₃ is at least one selected from a hydroxyethyl group and a hydroxypropyl group.

In the above formula (II), R ₄ , R ₅ , R ₆ and R ₇ are the same or different and represent at least one selected from a methyl group and an ethyl group.

R ₈ —O— (CH ₂ CH ₂ O) _n —H (III)

In the above formula (III), R ₈ is a hydrocarbon group having 3 to 7 carbon atoms, and n is an added mole number and an integer of 1 to 5.

In the above formula (IV), R ₉ , R ₁₀ , R ₁₁ and R ₁₃ are the same or different and are at least one selected from a hydrogen atom, an alkyl group having 1 to 7 carbon atoms, and an aromatic substituent. , R ₉ and R ₁₀ are at least one aromatic substituent, and R ₁₂ is at least one selected from a hydrogen atom and an aromatic substituent.

  The present disclosure relates to a method for cleaning a resin mask, including a step of cleaning an object to be cleaned to which a resin mask is attached with the cleaning composition according to the present disclosure.

  The present disclosure includes a step of performing at least one of soldering and plating using a resin mask on at least one electronic component selected from a printed circuit board, a wafer, and a metal plate; and The present invention relates to an electronic component manufacturing method including a step of cleaning by a cleaning method according to the present disclosure.

  According to the present disclosure, it is possible to provide a cleaning composition for removing a resin mask, which has excellent resin mask removability and can suppress corrosion and discoloration of a metal. And by using the cleaning composition according to the present disclosure, a high-quality electronic component can be obtained with a high yield.

  The present disclosure relates to a compound represented by the above formula (I) (component A), a compound represented by the above formula (II) (component B), a carboxylic acid having 1 to 5 carbon atoms or a salt thereof (component C). By using a cleaning composition containing a compound represented by the above formula (III) (component D), a compound represented by the above formula (IV) (component E) and water (component F), a dry film This is based on the knowledge that a resin mask such as a resist can be efficiently removed, and further, corrosion and discoloration of a metal can be suppressed.

  That is, the present disclosure relates to a compound represented by the above formula (I) (component A), a compound represented by the above formula (II) (component B), a carboxylic acid having 1 to 5 carbon atoms or a salt thereof (component). A cleaning composition for removing a resin mask, comprising C), a compound represented by the above formula (III) (component D), a compound represented by the above formula (IV) (component E), and water (component F). Related to things.

  Although the details of the action mechanism of the effect in the cleaning composition according to the present disclosure are unclear, it is estimated as follows. Alkaline component A and component B cut the bond between the acid component contained in the solder paste and the flux component and the resin in the resin mask that has been polymerized by heating to lower the molecular weight. Then, it is considered that the resin mask can be removed by allowing the component A and water (component F) to penetrate into the resin mask having a low molecular weight and dissolve the resin mask. Further, tin, which is the main component of the solder metal, dissolves in the strong alkaline aqueous solution, but the surface is protected by adsorption of carboxylic acid having 1 to 5 carbon atoms or a salt thereof (component C), and the alkaline components A and B are used. It is estimated that the dissolution reaction is suppressed. Furthermore, it is presumed that the corrosion and discoloration of the metal such as the fine wiring can be simultaneously suppressed by the component D and the component E, and it is considered that a fine circuit can be formed on the substrate. However, the present disclosure is not limited to this mechanism.

[Component A: amino alcohol]
Component A in the cleaning composition according to the present disclosure is a compound represented by the following formula (I).

In the above formula (I), R ₁ is at least one selected from a hydrogen atom, a methyl group, an ethyl group, and an aminoethyl group, and R ₂ is a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group, and At least one selected from an ethyl group, and R ₃ is at least one selected from a hydroxyethyl group and a hydroxypropyl group.

  Examples of component A include alkanolamines such as monoethanolamine and diethanolamine, and alkylated products and aminoalkylated products thereof. Specific examples of component A include monoethanolamine, monoisopropanolamine, N-methylmonoethanolamine, N-methylmonoisopropanolamine, N-ethylmonoethanolamine, and N-ethylmonoisopropanolamine from the viewpoint of improving detergency. , Diethanolamine, diisopropanolamine, N-dimethylmonoethanolamine, N-dimethylmonoisopropanolamine, N-methyldiethanolamine, N-methyldiisopropanolamine, N-diethylmonoethanolamine, N-diethylmonoisopropanolamine, N-ethyl Diethanolamine, N-ethyldiisopropanolamine, N- (β-aminoethyl) monoethanolamine, N- (β-aminoethyl) monoisopropanolamine, N- (β At least one selected from aminoethyl) diethanolamine and N- (β-aminoethyl) diisopropanolamine is preferable, and monoethanolamine, monoisopropanolamine, diethanolamine, N-methylmonoethanolamine, N-dimethylmonoethanolamine, N -At least 1 sort (s) chosen from ethyl monoethanolamine and N-((beta) -aminoethyl) monoethanolamine is more preferable, and monoethanolamine and monoisopropanolamine are still more preferable.

  The content of Component A during use of the cleaning composition according to the present disclosure is preferably 1% by mass or more, more preferably 2% by mass or more, and more preferably 2.5% by mass or more from the viewpoint of improving the resin mask removability. More preferably, 3% by mass or more is more preferable, and from the viewpoint of suppressing metal corrosion, 10% by mass or less is preferable, 8% by mass or less is more preferable, 6% by mass or less is more preferable, and 5% by mass or less is more preferable. Further preferred.

  In the present disclosure, “content of each component when using the cleaning composition” refers to the content of each component at the time of cleaning, that is, when the cleaning composition is used for cleaning.

[Component B: Tetraalkylammonium hydroxide]
Component B in the cleaning composition according to the present disclosure is a compound represented by the following formula (II).

In the above formula (II), R ₄ , R ₅ , R ₆ and R ₇ are the same or different and represent at least one selected from a methyl group and an ethyl group.

  Component B includes, for example, a salt composed of a tetraalkylammonium cation having 4 to 8 carbon atoms in the molecule and a hydroxide. Specific examples of component B include at least one selected from tetramethylammonium hydroxide, tetraethylammonium hydroxide, and trimethylethylammonium hydroxide. From the viewpoint of improving resin mask removability, tetramethylammonium hydroxide is preferable.

  The content of Component B during use of the cleaning composition according to the present disclosure is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, from the viewpoint of improving resin mask removability. More preferably 1% by mass or more, more preferably 1% by mass or more, and preferably 3% by mass or less, more preferably 2% by mass or less, further preferably 1.5% by mass or less, from the viewpoint of suppressing metal corrosion. 1.2 mass% or less is still more preferable.

  The ratio A / B between the content of component A and the content of component B in the cleaning composition according to the present disclosure is preferably 0.5 or more, more preferably 1 or more, from the viewpoint of improving the resin mask removability. 2 or more is more preferable, and from the same viewpoint, 50 or less is preferable, 40 or less is more preferable, and 35 or less is more preferable.

[Component C: Carboxylic acid]
Component C in the cleaning composition according to the present disclosure is a carboxylic acid having 1 to 5 carbon atoms or a salt thereof. The number of carbons is the total number of carbons in the carboxylic acid.

  Examples of the carboxylic acid of component C include monocarboxylic acid, dicarboxylic acid and the like from the viewpoint of improving resin mask removability and suppressing metal discoloration. Specifically, formic acid, acetic acid, propionic acid, butyric acid, isobutyric acid, At least one selected from valeric acid, isovaleric acid, succinic acid, malonic acid, succinic acid, glutaric acid, glycolic acid, lactic acid, hydroxybutyric acid, glyceric acid, tartronic acid, malic acid, tartaric acid, glycine and alanine, and formic acid At least one selected from acetic acid, succinic acid and succinic acid is preferred. Examples of these carboxylic acid salts include salts of the carboxylic acid with at least one selected from alkali metals, alkaline earth metals, ammonia, and organic amine compounds.

  The content of Component C during use of the cleaning composition according to the present disclosure is preferably 0.05% by mass or more, more preferably 0.1% by mass or more, and 0.4% by mass from the viewpoint of suppressing metal corrosion. The above is more preferable, 0.6% by mass or more is more preferable, and from the viewpoint of improving the resin mask removability, 2% by mass or less is preferable, 1% by mass or less is more preferable, and 0.5% by mass or less is further preferable. Preferably, 0.1 mass% or less is still more preferable.

[Component D: Glycol ether]
Component D in the cleaning composition according to the present disclosure is a compound represented by the following formula (III).

R ₈ —O— (CH ₂ CH ₂ O) _n —H (III)

In the above formula (III), R ₈ represents a hydrocarbon group having 3 to 7 carbon atoms, and preferably a hydrocarbon group having 4 to 6 carbon atoms from the viewpoint of improving the resin mask removability. The alkyl group is more preferable. n represents the number of added moles, and is an integer of 1 to 5, and is an integer of 1 to 5 and preferably 2 to 4 and preferably 2 to 3 from the viewpoints of improvement in cleaning properties and stability. More preferred.

  Component D includes glycol ethers having a hydrocarbon group having 3 to 7 carbon atoms, such as ethylene glycol monoalkyl ether, diethylene glycol monoalkyl ether, triethylene glycol monoalkyl ether, tetraethylene glycol monoalkyl ether, Pentaethylene glycol monoalkyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, triethylene glycol monophenyl ether, tetraethylene glycol monophenyl ether, pentaethylene glycol monophenyl ether, ethylene glycol monobenzyl ether, diethylene glycol monobenzyl ether, Triethylene glycol monobenzyl ether, tetraethylene Glycol monobenzyl ether and pentaethylene glycol monobenzyl ether. Specific examples of component D include ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, monoethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl from the viewpoint of resin mask removal and metal discoloration suppression. Ether, diethylene glycol monophenyl ether, ethylene glycol monobenzyl ether, diethylene glycol monobenzyl ether are preferred, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, monoethylene glycol monohexyl ether, diethylene glycol monohexyl ether are more preferred, Ethylene glycol monobutyl ether is more preferred.

  The content of Component D during use of the cleaning composition according to the present disclosure is preferably 0.1% by mass or more, and more preferably 0.2% by mass or more from the viewpoint of improving resin mask removability and suppressing metal corrosion. 0.25% by mass or more is more preferable, and from the same viewpoint, 10% by mass or less is preferable, 5% by mass or less is more preferable, 1% by mass or less is further preferable, and 0.5% by mass or less is further more preferable. preferable.

[Component E: Imidazole compound]
Component E in the cleaning composition according to the present disclosure is a compound represented by the following formula (IV).

In the above formula (IV), R ₉ , R ₁₀ , R ₁₁ and R ₁₃ are the same or different and are at least one selected from a hydrogen atom, an alkyl group having 1 to 7 carbon atoms, and an aromatic substituent. , R ₉ and R ₁₀ are at least one aromatic substituent, and R ₁₂ is at least one selected from a hydrogen atom and an aromatic substituent. Examples of the aromatic substituent include aromatic substituents having 6 to 10 carbon atoms, and specifically include at least one selected from a benzyl group, a phenyl group, a phenethyl group, and a naphthyl group. , At least one selected from a benzyl group and a phenyl group is preferable.

  Component E includes imidazole compounds having an aromatic substituent at the 1- or 2-position of the imidazole ring. For example, an aromatic substituent having 6 to 10 carbon atoms is provided at the 1- or 2-position of the imidazole ring. Examples thereof include imidazole compounds. Specific examples of component E include 1-phenylimidazole, 2-phenylimidazole, 1-benzylimidazole, 2-benzylimidazole, 1-phenyl-2-alkylimidazole, 1-benzyl-2-alkylimidazole, 1-alkyl- Examples include 2-phenylimidazole, 1-alkyl-2-benzylimidazole, 1-phenyl-2-phenylimidazole, 1-benzyl-2-benzylimidazole, 2,4,5-triphenylimidazole, and the like. From the viewpoint, 1-phenylimidazole, 2-phenylimidazole, 1-benzylimidazole, 2-benzylimidazole, 1-phenyl-2-methylimidazole, 1-benzyl-2-methylimidazole, 1-methyl-2-phenylimidazole, 1-Me At least one selected from ru-2-benzylimidazole and 2,4,5-triphenylimidazole is preferred, 1-phenylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, and 2,4,4 At least one selected from 5-triphenylimidazole is more preferable, and at least one selected from 1-phenylimidazole and 2-phenylimidazole is more preferable from the viewpoint of suppressing corrosion and discoloration of the metal, and 2-phenylimidazole. Is even more preferable.

  The content of Component E during use of the cleaning composition according to the present disclosure is preferably 0.05% by mass or more, more preferably 0.07% by mass or more, from the viewpoint of inhibiting corrosion and discoloration of the metal. 1% by mass or more is more preferable, and from the same viewpoint, 1% by mass or less is preferable, 0.5% by mass or less is more preferable, 0.3% by mass or less is further preferable, and 0.25% by mass or less is preferable. Even more preferred.

  The ratio E / (A + B) of the content of the component E in the cleaning composition according to the present disclosure and the total amount of the component A and the component B is preferably 0.005 or more from the viewpoint of suppressing metal corrosion. 008 or more is more preferable, 0.01 or more is more preferable, and from the viewpoint of suppressing precipitation of Component E (stability of the cleaning composition), 0.5 or less is preferable, 0.3 or less is more preferable, 0 .1 or less is more preferable.

[Component F: Water]
Component F in the cleaning composition according to the present disclosure is water. As water, ion exchange water, RO water, distilled water, pure water, or ultrapure water can be used. What is necessary is just to set content of water suitably according to the usage condition of the cleaning composition which concerns on this indication.

  The content of Component F during use of the cleaning composition according to the present disclosure is preferably 50% by mass or more, and more preferably 60% by mass or more from the viewpoint of improving the resin mask removability and stabilizing the cleaning composition. 70 mass% or more is more preferable, and from the same viewpoint, 97 mass% or less is preferable, 96 mass% or less is more preferable, and 95.5 mass% or less is more preferable.

  The ratio (D / F) of the mass of component D to the mass of component F (D / F) at the time of use of the cleaning progenitor according to the present disclosure is 0.002 or more from the viewpoint of improving resin mask removability and suppressing metal corrosion. 0.0025 or more is preferable, and from the viewpoint of improving the removability of the resin mask and suppressing metal corrosion, and from the viewpoint of the stability of the cleaning composition, it is 0.1 or less, preferably 0.08 or less, and 0.0. 06 or less is more preferable.

[Other components of cleaning composition]
The cleaning composition according to the present disclosure may contain other components as necessary. The content of other components at the time of use of the cleaning composition according to the present disclosure is preferably 0% by mass or more and 2.0% by mass or less, more preferably 0% by mass or more and 1.5% by mass or less, and 0% by mass. The content is more preferably 1.3% by mass or less and even more preferably 0% by mass or more and 1.0% by mass or less.

  Other components in the cleaning composition according to the present disclosure include, for example, hydrocarbons having 10 to 18 carbon atoms, and specifically include dodecene and tetradecene from the viewpoint of suppressing foaming.

  Furthermore, the cleaning composition according to the present disclosure is, as necessary, such as hydroxyethylaminoacetic acid, hydroxyethyliminodiacetic acid, ethylenediaminetetraacetic acid, and the like, as long as it does not impair the effects of the present disclosure. Compounds with chelating ability such as aminocarboxylates, antiseptics, rust preventives, bactericides, antibacterial agents, silicone antifoaming agents, antioxidants, esters or alcohols such as coconut fatty acid methyl and benzyl acetate, etc. Can be contained.

[Production method of cleaning composition]
The cleaning composition according to the present disclosure can be produced by blending the components A to F and, if necessary, other components by a known method. For example, the cleaning composition according to the present disclosure includes at least the components A to F. Therefore, this indication is related with the manufacturing method of the detergent constituent including the process of blending at least the above-mentioned ingredients AF. In the present disclosure, “compounding” includes mixing the components A to F and other components as necessary at the same time or in any order. In the manufacturing method of the cleaning composition according to the present disclosure, the blending amount of each component may be the same as the content of each component of the cleaning composition according to the present disclosure described above.

  The pH at the time of use of the cleaning composition according to the present disclosure is preferably 10.0 or more, more preferably 10.5 or more from the viewpoint of improving the resin mask removability, and 14 or less from the viewpoint of suppressing metal corrosion. Is preferable, 13.5 or less is more preferable, and 12.0 or less is more preferable. In the present disclosure, if necessary, the pH may be an inorganic acid such as nitric acid or sulfuric acid, an oxycarboxylic acid, a polyvalent carboxylic acid, an aminopolycarboxylic acid, an organic acid other than Component C such as an amino acid, or a metal salt or ammonium salt thereof. It can adjust by mix | blending basic substances other than component A and B, such as ammonia, sodium hydroxide, potassium hydroxide, an amine, in a desired quantity suitably.

  The cleaning composition according to the present disclosure may be prepared as a concentrate in which the amount of water of component F is reduced within a range that does not impair storage stability by causing separation or precipitation. The concentrate of the cleaning composition is preferably a concentrate having a dilution ratio of 3 times or more from the viewpoint of transportation and storage, and is preferably a concentrate having a dilution ratio of 10 times or less from the viewpoint of storage stability. . The concentrate of the cleaning composition can be used by diluting with water so that the components A to F have the above-described content (that is, the content at the time of cleaning) at the time of use. Furthermore, the concentrate of a cleaning composition can also be used by adding each component separately at the time of use. In the present disclosure, “when using” or “when cleaning” the cleaning composition of the concentrated solution refers to a state in which the concentrate of the cleaning composition is diluted.

  When the cleaning composition according to the present disclosure is produced as a concentrate, the concentration can be increased by that amount. When the cleaning composition according to the present disclosure is a concentrate, the content of Component A in the cleaning composition concentrate is preferably 5% by mass or more, and 9% by mass from the viewpoint of improving resin mask removability. The above is more preferable, 15% by mass or more is further preferable, 18% by mass or more is more preferable, and from the viewpoint of suppressing metal corrosion, 30% by mass or less is preferable, 25% by mass or less is more preferable, and 20% by mass or less. Is more preferable, and 15 mass% or less is still more preferable.

  The content of Component B in the concentrate of the cleaning composition according to the present disclosure is preferably 0.3% by mass or more, more preferably 1% by mass or more, and more preferably 2% by mass or more from the viewpoint of improving the resin mask removability. Is more preferably 3% by mass or more, and from the viewpoint of suppressing metal corrosion, 10% by mass or less is preferable, 8% by mass or less is more preferable, 6% by mass or less is further preferable, and 5% by mass or less is preferable. Even more preferred.

  The content of the component C in the concentrate of the cleaning composition according to the present disclosure is preferably 0.2% by mass or more, more preferably 0.5% by mass or more, and more preferably 1% by mass or more from the viewpoint of suppressing metal corrosion. Is more preferable, 2% by mass or more is more preferable, and from the viewpoint of improving the removability of the resin mask, 5% by mass or less is preferable, 3% by mass or less is more preferable, and 2% by mass or less is more preferable. The mass% or less is more preferable.

  The content of the component D in the concentrate of the cleaning composition according to the present disclosure is preferably 0.5% by mass or more, more preferably 0.8% by mass or more from the viewpoint of improving resin mask removability and suppressing metal corrosion. Preferably, 1% by mass or more is more preferable, and from the same viewpoint, 30% by mass or less is preferable, 20% by mass or less is more preferable, 10% by mass or less is further preferable, and 5% by mass or less is more preferable.

  The content of the component E in the concentrate of the cleaning composition according to the present disclosure is preferably 0.1% by mass or more, more preferably 0.2% by mass or more from the viewpoint of metal corrosion inhibition and discoloration inhibition. 0.3 mass% or more is more preferable, and from the same viewpoint, 5 mass% or less is preferable, 3 mass% or less is more preferable, 2 mass% or less is more preferable, and 1 mass% or less is more preferable.

  The content of the component F in the concentrate of the cleaning composition according to the present disclosure is preferably 50% by mass or more and more preferably 60% by mass or more from the viewpoint of improving the resin mask removability and stabilizing the cleaning composition. Preferably, 70% by mass or more is more preferable, and from the same viewpoint, 90% by mass or less is preferable, 85% by mass or less is more preferable, and 80% by mass or less is more preferable.

  The pH of the concentrate of the cleaning composition according to the present disclosure is preferably 10.0 or more, more preferably 10.5 or more, and more preferably 10.5 or more from the viewpoint of improving the cleaning property after dilution and the resin mask removal property. From the viewpoint of detergency and suppression of metal corrosion, it is preferably 14 or less, more preferably 13.5 or less, and even more preferably 12.0 or less.

[To be cleaned]
The cleaning composition according to the present disclosure is used for cleaning an object to be cleaned to which a resin mask such as a dry film resist is attached. Examples of the objects to be cleaned include electronic components and production intermediates thereof. Examples of the electronic component include a printed board, a substrate such as a wafer, and a metal plate such as a copper plate and an aluminum plate. The said manufacturing intermediate is an intermediate product in the manufacturing process of an electronic component, Comprising: The intermediate product after a resin mask process is included. As a specific example of an object to be cleaned to which a resin mask is attached, for example, through a process of performing a soldering or plating process (copper plating, nickel plating, etc.) using a resin mask such as a dry film resist, Examples thereof include electronic components in which wiring, connection terminals, and the like are formed on the surface of the substrate.

[Resin mask cleaning method]
The present disclosure relates to a method for cleaning a resin mask, which includes bringing an object to be cleaned attached to the resin mask into contact with the cleaning composition according to the present disclosure (hereinafter also referred to as a cleaning method according to the present disclosure). The cleaning method according to the present disclosure includes a step of cleaning an object to be cleaned to which a resin mask is attached with the cleaning composition according to the present disclosure. Examples of a method of bringing the cleaning composition according to the present disclosure into contact with an object to be cleaned or a method of cleaning the object to be cleaned with the cleaning composition according to the present disclosure include, for example, in a cleaning bath containing the cleaning composition Examples include a method of contacting by dipping, a method of injecting a cleaning composition into a spray form (shower method), an ultrasonic cleaning method of irradiating ultrasonically during immersion, and the like. The cleaning composition according to the present disclosure can be used for cleaning as it is without being diluted. The cleaning method according to the present disclosure preferably includes a step of bringing an object to be cleaned into contact with the cleaning composition, rinsing with water, and drying. With the cleaning method according to the present disclosure, a resin mask such as a dry film resist can be efficiently removed. In the cleaning method according to the present disclosure, it is preferable to irradiate ultrasonic waves when the cleaning composition according to the present disclosure and the object to be cleaned are in contact with each other because the cleaning power of the cleaning composition according to the present disclosure is easily exhibited. More preferably, the ultrasonic waves are relatively strong. From the same viewpoint, the ultrasonic irradiation conditions are preferably 26 to 72 Hz and 80 to 1500 W, and more preferably 36 to 72 Hz and 80 to 1500 W, for example.

[Method of manufacturing electronic parts]
A method of manufacturing an electronic component according to the present disclosure includes performing at least one of soldering and plating using a resin mask on at least one electronic component selected from a printed circuit board, a wafer, and a metal plate; and The electronic component to which the resin mask is attached includes a step of cleaning by the cleaning method according to the present disclosure. The manufacturing method of the electronic component according to the present disclosure can effectively remove the resin mask attached to the electronic component while suppressing the corrosion and discoloration of the metal by performing the cleaning method according to the present disclosure. High electronic parts can be manufactured. Further, by performing the cleaning method according to the present disclosure, it becomes easy to remove the resin mask attached to the electronic component, so that the cleaning time can be shortened and the manufacturing efficiency of the electronic component can be improved.

[kit]
The present disclosure is a kit for use in the cleaning method according to the present disclosure and / or the method for manufacturing an electronic component according to the present disclosure, and among the components A to F constituting the cleaning composition according to the present disclosure. And at least one component of the kit is stored in an unmixed state with other components.

  As a kit according to the present disclosure, for example, a solution containing the component A (first liquid) and a solution containing the components B to F (second liquid) are stored in a state where they are not mixed with each other. And a kit (two-component detergent composition) in which these are mixed at the time of use. The first liquid and the second liquid may each contain an optional component as necessary. Examples of the optional component include a thickener, a dispersant, a rust inhibitor, a basic substance, a surfactant, a polymer compound, a solubilizer, an antioxidant, an antiseptic, an antifoaming agent, and an antibacterial agent. Can be mentioned.

  EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.

1. Preparation of cleaning composition (Examples 1-16 and Comparative Examples 1-13)
In a 500 mL glass beaker, 48 g of monoethanolamine (component A), 13 g of tetramethylammonium hydroxide (component B), 5.7 g of formic acid (component C), 9 g of diethylene glycol monobutyl ether (component D), 2-phenylimidazole A concentrate of the cleaning composition of Example 1 was prepared by adding 1.5 g of (Component E) and 223.8 g of water (Component F), and stirring and mixing them uniformly. And the concentrate of the cleaning composition of Examples 2-16 and Comparative Examples 1-13 was prepared by the method similar to Example 1 by the composition shown in Table 1. Table 1 shows the content (% by mass) of each component in the concentrate of each cleaning composition.
Next, the cleaning composition used for each following evaluation was obtained by diluting the concentrate of the cleaning composition of Examples 1-16 and Comparative Examples 1-13 4 times with water. The pH of each cleaning composition (after 4-fold dilution) is shown in Table 1. The pH is the pH of the cleaning composition at 25 ° C., measured with a pH meter (Awakogyo Kogyo Co., Ltd., HM-30G), and the value after 40 minutes after the electrode is immersed in the cleaning composition. is there.

The following were used as components of the cleaning composition.
・ Monoethanolamine (component A) (Nippon Shokubai Co., Ltd.)
・ Monoisopropanolamine (component A) (Mitsui Chemicals Fine Co., Ltd.)
・ Triethanolamine (non-component A) (manufactured by Nippon Shokubai Co., Ltd.)
Tetramethylammonium hydroxide (component B) (manufactured by Showa Denko KK, TMAH (25%))
Formic acid (component C) (manufactured by Asahi Chemical Industry Co., Ltd., formic acid 88%)
・ Acetic acid (component C) (Kanto Chemical Co., Ltd., deer grade 1)
・ Succinic acid (component C) (manufactured by Kanto Chemical Co., Inc., oxalic acid (anhydrous), deer grade 1)
・ Isophthalic acid (non-component C) (Wako Pure Chemical Industries, Wako first grade)
・ Diethylene glycol monobutyl ether (component D) (Nippon Emulsifier Co., Ltd., Butyl Diglycol (BDG))
Tripropylene glycol monomethyl ether (non-component D) (manufactured by Nippon Emulsifier Co., Ltd., methyl propylene triglycol (MFTG))
・ 1-Phenylimidazole (component E) (manufactured by Tokyo Chemical Industry Co., Ltd.)
2-phenylimidazole (component E) (manufactured by Shikoku Kasei Co., Ltd., 2PZ)
2,4,5-triphenylimidazole (component E) (manufactured by Tokyo Chemical Industry Co., Ltd.)
・ 1-Benzyl-2-methylimidazole (component E) (manufactured by Tokyo Chemical Industry Co., Ltd.)
・ 4-Phenylimidazole (non-component E) (Wako Pure Chemical Industries, Ltd., Wako first grade)
2-phenyl-4-methylimidazole (non-component E) (manufactured by Shikoku Kasei Co., Ltd., 2E4MZ)
・ 4,5-diphenylimidazole (non-component E) (manufactured by Wako Pure Chemical Industries, Ltd.)
2-methylimidazole (non-component E) (manufactured by Shikoku Kasei Co., Ltd., 2MZ-H)
2-mercaptobenzimidazole (non-component E) (manufactured by Tokyo Chemical Industry Co., Ltd.)
Water (component F) (pure water of 1 μS / cm or less produced with a pure water apparatus G-10DSTSET manufactured by Organo Corporation)

2. Evaluation of cleaning composition The resin mask removability and metal corrosivity of the cleaning compositions prepared in Examples 1 to 16 and Comparative Examples 1 to 13 (after 4-fold dilution) were evaluated.

[Production of test pieces]
A thick film resist-forming photosensitive film (manufactured by Hitachi Chemical Co., Ltd., Photec HM-4075, 45 mm × 60 mm × 15 μm) is laminated on the surface of a copper plate (manufactured by Dazai Equipment Co., Ltd., C1100P, 55 mm × 75 mm × 1 mm) under the following conditions. Then, a test piece cured by exposure treatment is produced.
Lamination: Using a clean roller (Rayon Industries, Ltd., RY-505Z) and a vacuum applicator (Rohm & Haas, VA7024 / HP5) at a roller temperature of 50 ° C., a roller pressure of 1.4 Bar, and a processing time of 30 seconds. went.
-Exposure process: It exposed with the exposure amount of 150 mJ / cm < ² > using the direct drawing apparatus for printed circuit boards (The product made by SCREEN Graphic and Precision Solutions, Mercurex LI-9500).

[Resin mask removability evaluation]
In the state where each cleaning composition heated to 50 ° C. is stirred to such an extent that the entire liquid moves, the test piece is immersed, the state of peeling of the resin mask is visually observed, and the resin mask is completely peeled off. The time required was measured as the peeling time. Table 1 shows the measurement results. It shows that the removal property of a resin mask is so high that peeling time is short.

[Evaluation of corrosion and discoloration of metals]
A copper plate (C1100P, 50 mm × 20 mm × 0.8 mm, manufactured by Dazai Equipment Co., Ltd.) is immersed in 50 mL of each cleaning composition heated to 50 ° C., and stirred for 1 hour so that the entire liquid moves. Measure the amount of copper dissolved in the product. The measurement results are shown in Table 1. The higher the amount of copper dissolved, the higher the corrosion. Furthermore, the surface of the copper plate after a process was observed visually, the presence or absence of discoloration of a metal was evaluated, and the result is shown in Table 1.

<Measurement of copper dissolution>
The amount of copper dissolved in the cleaning composition is measured as follows. First, 1 g of the detergent composition was precisely weighed in a 20 mL test tube (manufactured by PP), dissolved by adding 0.4 g of 6N hydrochloric acid, and made up to 10 g with pure water to prepare a measurement sample. And the density | concentration of the copper in a measurement sample was measured using the ICP emission spectrometer (The Perkin-Elmer company make, Optima5300).

  As shown in Table 1 above, the cleaning compositions of Examples 1 to 16 are excellent in resin mask removability as compared with Comparative Examples 1 to 13 that do not contain any of components A to E, and metal. Corrosion and discoloration were suppressed.

  By using the present disclosure, the resin mask can be efficiently removed while suppressing corrosion and discoloration of the metal. Therefore, the cleaning composition of the present disclosure is useful as a cleaning composition used in the manufacturing process of an electronic component, shortening the cleaning process of the electronic component to which the resin mask is adhered, and the performance of the manufactured electronic component. Reliability can be improved and productivity of the semiconductor device can be improved.

Claims (7)

A compound represented by the following formula (I) (component A), a compound represented by the following formula (II) (component B), a carboxylic acid having 1 to 5 carbon atoms or a salt thereof (component C), the following formula ( The cleaning composition for resin mask peeling containing the compound (component D) represented by III), the compound (component E) represented by following formula (IV), and water (component F).

In the above formula (I), R ₁ is at least one selected from a hydrogen atom, a methyl group, an ethyl group, and an aminoethyl group, and R ₂ is a hydrogen atom, a hydroxyethyl group, a hydroxypropyl group, a methyl group, and At least one selected from an ethyl group, and R ₃ is at least one selected from a hydroxyethyl group and a hydroxypropyl group.

In the above formula (II), R ₄ , R ₅ , R ₆ and R ₇ are the same or different and represent at least one selected from a methyl group and an ethyl group.
R ₈ —O— (CH ₂ CH ₂ O) _n —H (III)
In the above formula (III), R ₈ is a hydrocarbon group having 3 to 7 carbon atoms, and n is an added mole number and an integer of 1 to 5.

In the above formula (IV), R ₉ , R ₁₀ , R ₁₁ and R ₁₃ are the same or different and are at least one selected from a hydrogen atom, an alkyl group having 1 to 7 carbon atoms, and an aromatic substituent. , R ₉ and R ₁₀ are at least one aromatic substituent, and R ₁₂ is at least one selected from a hydrogen atom and an aromatic substituent.   The cleaning composition for removing a resin mask according to claim 1, wherein the ratio (D / F) of the mass of component D to the mass of component F in use is 0.002 or more and 0.1 or less.   At least the compound (component A), the compound (component B), the carboxylic acid or a salt thereof (component C), the compound (component D), the compound (component E), and the water (component F) are blended. The cleaning composition for peeling a resin mask according to claim 1 or 2.   A method for cleaning a resin mask, comprising a step of cleaning an object to be cleaned to which the resin mask is adhered with the cleaning composition according to any one of claims 1 to 3.   The cleaning method according to claim 4, wherein the object to be cleaned is an electronic component manufacturing intermediate.   5. A step of performing at least one of soldering and plating using a resin mask on at least one electronic component selected from a printed circuit board, a wafer, and a metal plate, and the electronic component according to claim 4 or A method for producing an electronic component, comprising a step of washing by the washing method according to claim 5.   Use of the cleaning composition according to any one of claims 1 to 3 for producing an electronic component.