JP2017092352A - Light-receiving/emitting device and manufacturing method of light-receiving/emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-receiving/emitting device capable of attaining thinning, and a manufacturing method of the light-receiving/emitting device.SOLUTION: The present invention relates to a light-receiving/emitting device A1 comprising: a substrate 1 including a base material 2 that has a principal surface 21 and a rear surface 22, and a wiring pattern 3; a light-emitting element 4 and a light-receiving element 5 that are loaded on the substrate 1; and a translucent resin 6 which covers the light-emitting element 4 and the light-receiving element 5 at a side of the principal surface 21 and permeates a light from the light-emitting element 4 and a light that should be received by the light-receiving element 5. The base material 2 includes a light-emitting-side through-hole 231 and a light-receiving-side through-hole 232 which penetrate in a thickness direction. The light-emitting element 4 is at least partially housed in the light-emitting-side through-hole 231, and the light-receiving element 5 is at least partially housed in the light-receiving-side through-hole 232.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting / receiving device and a method for manufacturing the light emitting / receiving device.

  Patent Document 1 discloses an example of a conventional light emitting and receiving device. The light emitting / receiving device includes a substrate, a light emitting element and a light receiving element mounted on the substrate. The light-emitting / receiving device includes a light-transmitting resin that covers the light-emitting element and the light-receiving element, and a light-blocking resin that partially covers the light-transmitting resin. The light emitted from the light emitting element is received by the light receiving element when reflected by the object to be detected. Thereby, it can be detected that the detection target exists at a position facing the light emitting / receiving device.

  However, there is a strong demand for downsizing of such a light receiving and emitting device. In particular, it is desired to reduce the size of the light emitting / receiving device in the thickness direction of the substrate.

JP 2010-341889 A

  The present invention has been conceived under the circumstances described above, and it is an object of the present invention to provide a light emitting / receiving device and a method of manufacturing the light receiving / emitting device that can be reduced in thickness.

  The light receiving and emitting device provided by the first aspect of the present invention includes a substrate having a main surface and a back surface and a wiring pattern, a light emitting element and a light receiving element mounted on the substrate, the light emitting element, A light-receiving / emitting device comprising: a light-transmitting resin that covers the light-receiving element on the main surface side and transmits light from the light-emitting element and light to be received by the light-receiving element; A light-emitting side through-hole and a light-receiving side through-hole penetrating in the vertical direction, wherein at least part of the light-emitting element is accommodated in the light-emitting side through-hole, and at least part of the light-receiving element is It is characterized by being housed in the light receiving side through hole.

  In a preferred embodiment of the present invention, a part of the light emitting element protrudes from the light emitting side through hole to the main surface side.

  In a preferred embodiment of the present invention, a part of the light receiving element protrudes from the light receiving side through hole toward the main surface.

  In a preferred embodiment of the present invention, the wiring pattern has a light emitting side blocked back surface portion that closes the light emitting side through hole from the back surface side, and the light emitting element is supported by the light emitting side blocked back surface portion. Has been.

  In a preferred embodiment of the present invention, the wiring pattern has a light receiving side blocking back surface portion that closes the light receiving side through hole from the back surface side, and the light receiving element is supported by the light receiving side blocking back surface portion. Has been.

  In a preferred embodiment of the present invention, the translucent resin is interposed between the light emitting side through hole and the light emitting element.

  In a preferred embodiment of the present invention, the translucent resin is interposed between the light receiving side through hole and the light receiving element.

  In a preferred embodiment of the present invention, the wiring pattern has a light emitting side through hole side portion covering an inner surface of the light emitting side through hole.

  In a preferred embodiment of the present invention, the wiring pattern has a light emitting side through hole bottom portion that is connected to the light emitting side through hole side portion and covers the light emitting side blocking back surface portion from the main surface side, The light emitting element is supported on the light emitting side blocking back surface portion through the light emitting side through hole bottom.

  In a preferred embodiment of the present invention, the wiring pattern has a light emitting side through hole peripheral portion that is connected to the light emitting side through hole side portion and surrounds the light emitting side through hole on the main surface.

  In a preferred embodiment of the present invention, the wiring pattern has a light receiving side through hole side portion covering an inner surface of the light receiving side through hole.

  In a preferred embodiment of the present invention, the wiring pattern has a light receiving side through hole bottom portion that is connected to the light receiving side through hole side portion and covers the light receiving side blocking back surface portion from the main surface side, The light receiving element is supported by the light receiving side blocking back surface portion through the light receiving side through hole bottom.

  In a preferred embodiment of the present invention, the wiring pattern has a light receiving side through hole peripheral portion that is connected to the light receiving side through hole side portion and surrounds the light receiving side through hole on the main surface.

  In a preferred embodiment of the present invention, the inner surface of the light emitting side through hole and the light transmitting resin are in contact with each other.

  In a preferred embodiment of the present invention, the inner surface of the light receiving side through hole and the light transmitting resin are in contact with each other.

  In a preferred embodiment of the present invention, the light emitting side through-hole has a uniform cross-sectional area perpendicular to the thickness direction in the thickness direction.

  In a preferred embodiment of the present invention, the light-receiving side through hole has a uniform cross-sectional area perpendicular to the thickness direction in the thickness direction.

  In a preferred embodiment of the present invention, the light-emitting side through-hole has a cross-sectional area that is perpendicular to the thickness direction so that the cross-sectional area increases from the back surface to the main surface in the thickness direction.

  In a preferred embodiment of the present invention, the light-receiving side through hole has a cross-sectional area that is perpendicular to the thickness direction, and increases in the thickness direction from the back surface to the main surface.

  In a preferred embodiment of the present invention, the wiring pattern has a light emitting side wire bonding portion formed on the main surface, and the light emitting side bonded to the light emitting element and the light emitting side wire bonding portion. With wires.

  In a preferred embodiment of the present invention, the wiring pattern emits light that penetrates the light emitting side back electrode part and the base material formed on the back surface and is connected to the light emitting side wire bonding part and the light emitting side back electrode part. It has a side through-hole part.

  In a preferred embodiment of the present invention, the wiring pattern has a light receiving side wire bonding portion formed on the main surface, and the light receiving side bonded to the light receiving element and the light receiving side wire bonding portion. With wires.

  In a preferred embodiment of the present invention, the wiring pattern penetrates the light receiving side back surface electrode portion and the base material formed on the back surface and is connected to the light receiving side wire bonding portion and the light receiving side back electrode portion. It has a side through-hole part.

  In a preferred embodiment of the present invention, the light from the light emitting element, which crosses the main surface in a direction intersecting with the direction in which the light emitting element and the light receiving element are separated from each other and partitions the translucent resin, and The light receiving element includes a light shielding resin made of a material that blocks light to be received.

  In a preferred embodiment of the present invention, the light shielding resin has an exposed portion exposed from the translucent resin to the side where the main surface faces.

  In a preferred embodiment of the present invention, the light shielding resin is made of a material having a smaller elastic modulus than the light transmitting resin.

  In a preferred embodiment of the present invention, the light shielding resin is made of a silicone resin.

  In a preferred embodiment of the present invention, the exposed portion has a bulging shape that is convex toward the side to which the main surface faces.

  In preferable embodiment of this invention, the said exposed part protrudes in the side in which the said main surface turns rather than the said translucent resin.

  In preferable embodiment of this invention, the area | region which contact | connects the said light shielding resin among the said main surfaces, and the area | region adjacent to the said area | region are flat.

  In a preferred embodiment of the present invention, the substrate has a groove that is recessed from the main surface and buried in the light shielding resin.

  In a preferred embodiment of the present invention, the exposed portion is flush with the translucent resin.

  The manufacturing method of the light receiving and emitting device provided by the second aspect of the present invention includes a substrate and a wiring pattern having a light emitting side through hole and a light receiving side through hole penetrating in the thickness direction in the main surface and the back surface. A step of preparing a substrate; and the light emitting element and the light receiving element so that at least a part of the light emitting element is accommodated in the light emitting side through hole and a part of the light receiving element is accommodated in the light receiving side through hole. Mounting on the substrate so as to be spaced apart in the first direction, forming a light shielding resin that crosses the main surface in a second direction intersecting the first direction, and facing the main surface of the mold By making the surface to be in contact with the light shielding resin, the light transmitting resin material is cured after filling the space with the light transmitting resin material in a state where the space is maintained between the main surface and the mold. To form a translucent resin Is characterized by comprising the steps, a.

  In a preferred embodiment of the present invention, the light shielding resin is made of a material having a smaller elastic modulus than the light transmitting resin.

  In a preferred embodiment of the present invention, the light shielding resin is made of a silicone resin.

  In preferable embodiment of this invention, in the process of forming the said translucent resin, the said light shielding resin is compressed with the said metal mold | die.

  In a preferred embodiment of the present invention, in the step of forming the light shielding resin, a light shielding resin material is applied to the main surface.

  The method for manufacturing a light receiving and emitting device provided by the third aspect of the present invention includes a substrate and a wiring pattern having a light emitting side through hole and a light receiving side through hole penetrating in the thickness direction in the main surface and the back surface. A step of preparing a substrate; and the light emitting element and the light receiving element so that at least a part of the light emitting element is accommodated in the light emitting side through hole and a part of the light receiving element is accommodated in the light receiving side through hole. Mounting on the substrate so as to be spaced apart in the first direction, forming a translucent resin covering the light emitting element and the light receiving element on the main surface side, and in a second direction intersecting the first direction Forming a slit crossing the translucent resin and a groove portion that crosses the main surface in the second direction and coincides with the slit in the thickness direction view, and the slit and the groove portion A step of forming a light-blocking resin that covers the light-transmitting resin, and a step of removing the light-transmitting resin and the light-blocking resin in a lump until the light-transmitting resin is exposed from the light-blocking resin. It is characterized by.

  According to the present invention, at least a part of the light emitting element is accommodated in the light emitting side through hole, and at least a part of the light receiving element is accommodated in the light receiving side through hole. The light emitting side through hole and the light receiving side through hole penetrate the base material. Thereby, it is possible to reduce the thickness of the translucent resin that covers the light emitting element and the light receiving element, and the light receiving and emitting device can be thinned.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a top view which shows the light emitting / receiving device based on 1st Embodiment of this invention. It is a principal part top view which shows the light emitting / receiving apparatus of FIG. It is sectional drawing which follows the III-III line of FIG. It is a principal part expanded sectional view which shows the light emitting / receiving apparatus of FIG. It is sectional drawing which shows an example of the manufacturing method of the light emitting / receiving apparatus of FIG. It is sectional drawing which shows an example of the manufacturing method of the light emitting / receiving apparatus of FIG. It is sectional drawing which shows an example of the manufacturing method of the light emitting / receiving apparatus of FIG. It is sectional drawing which shows an example of the manufacturing method of the light emitting / receiving apparatus of FIG. FIG. 3 is an enlarged cross-sectional view of a main part illustrating an example of a method for manufacturing the light emitting / receiving device of FIG. It is sectional drawing which shows an example of the manufacturing method of the light emitting / receiving apparatus of FIG. It is sectional drawing which shows the light emitting / receiving apparatus based on 2nd Embodiment of this invention. It is sectional drawing which shows the light emitting / receiving apparatus based on 3rd Embodiment of this invention. It is sectional drawing which shows an example of the manufacturing method of the light emitting / receiving apparatus of FIG. It is sectional drawing which shows an example of the manufacturing method of the light emitting / receiving apparatus of FIG. It is sectional drawing which shows an example of the manufacturing method of the light emitting / receiving apparatus of FIG. It is sectional drawing which shows an example of the manufacturing method of the light emitting / receiving apparatus of FIG. It is sectional drawing which shows the light emitting / receiving apparatus based on 4th Embodiment of this invention.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 4 show a light emitting and receiving device according to a first embodiment of the present invention. The light emitting / receiving device A1 of this embodiment includes a substrate 1, a light emitting element 4, a light receiving element 5, a light transmitting resin 6, and a light shielding resin 7. The light emitting / receiving device A1 is configured as a so-called photo reflector.

  FIG. 1 is a plan view showing the light emitting / receiving device A1. FIG. 2 is a main part plan view showing the light receiving and emitting device A1, and the translucent resin 6 is omitted for the sake of understanding. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is an enlarged cross-sectional view of a main part showing the light emitting / receiving device A1.

  The substrate 1 includes a base material 2 and a wiring pattern 3. In the present embodiment, the substrate 1 has a rectangular shape in plan view.

  The base material 2 consists of insulating materials, such as a glass epoxy resin, for example. The substrate 2 has a main surface 21 and a back surface 22. The main surface 21 and the back surface 22 are spaced apart from each other in the thickness direction of the base material 2 and face opposite sides.

  The substrate 2 has a light emitting side through hole 231 and a light receiving side through hole 232. The light emitting side through hole 231 and the light receiving side through hole 232 both penetrate the base material 2 and open to the main surface 21 and the back surface 22. The light emitting side through hole 231 and the light receiving side through hole 232 are separated from each other in plan view. In the present embodiment, the light emitting side through hole 231 and the light receiving side through hole 232 are separated from each other in the longitudinal direction of the base material 2 having a long rectangular shape. The planar view shapes of the light emitting side through hole 231 and the light receiving side through hole 232 are not particularly limited, and in the present embodiment, for example, a rectangular shape. In the present embodiment, the light emitting side through hole 231 and the light receiving side through hole 232 have a uniform cross-sectional area perpendicular to the thickness direction of the substrate 2 in the thickness direction.

  The wiring pattern 3 is formed on the base material 2 and forms a conduction path connected to the light emitting element 4 and the light receiving element 5. The wiring pattern 3 is made of, for example, a single type or a plurality of types of metals such as Cu, Ni, Ti, and Au. The wiring pattern 3 is formed by plating, for example.

  In the present embodiment, the wiring pattern 3 includes a light emitting side sealed back surface part 311, a light receiving side sealed back surface part 312, a light emitting side wire bonding part 321, a light receiving side wire bonding part 322, a light emitting side through hole part 331, and a light receiving side through hole. Part 332, light emitting side back electrode part 341, light receiving side back electrode part 342, light emitting side through hole side part 351, light receiving side through hole side part 352, light emitting side through hole bottom part 361, light receiving side through hole bottom part 362, light emitting side through hole It has a hole peripheral portion 371 and a light receiving side through hole peripheral portion 372.

  The light emission side blocking back surface portion 311 closes the light emission side through hole 231 of the base material 2 from the back surface 22 side. The light receiving side blocking back surface portion 312 blocks the light receiving side through hole 232 of the base material 2 from the back surface 22 side.

  The light emitting side through hole side portion 351 covers the inner surface of the light emitting side through hole 231. The light emitting side through hole bottom 361 is connected to the light emitting side through hole side 351 and covers the light emitting side blocked back surface part 311 from the main surface 21 side. The light-emitting side through-hole peripheral part 371 is connected to the light-emitting side through-hole side part 351 and surrounds the light-emitting side through-hole 231 on the main surface 21.

  The light receiving side through hole side portion 352 covers the inner surface of the light receiving side through hole 232. The light receiving side through hole bottom 362 is connected to the light receiving side through hole side 352 and covers the light receiving side blocking back surface 312 from the main surface 21 side. The light receiving side through hole peripheral portion 372 is connected to the light receiving side through hole side portion 352 and surrounds the light receiving side through hole 232 in the main surface 21.

  The light emitting side wire bonding part 321 is formed on the main surface 21 and is adjacent to the light emitting side through hole 231. The light emission side back surface electrode part 341 is formed in the back surface 22, and is located on the opposite side of the light emission side wire bonding part 321 in this embodiment. The light emission side through-hole part 331 penetrates the base material 2 and is connected to the light emission side wire bonding part 321 and the light emission side back electrode part 341.

  The light receiving side wire bonding portion 322 is formed on the main surface 21 and is adjacent to the light receiving side through hole 232. The light receiving side back surface electrode part 342 is formed on the back surface 22 and is located on the opposite side of the light receiving side wire bonding part 322 in this embodiment. The light receiving side through-hole portion 332 penetrates the base material 2 and is connected to the light receiving side wire bonding portion 322 and the light receiving side back surface electrode portion 342.

  The light emitting element 4 is a light source of the light receiving and emitting device A1, for example, an LED chip that emits infrared light. The light emitting element 4 is mounted on the substrate 1. At least a part of the light emitting element 4 is accommodated in the light emitting side through hole 231. In the present embodiment, a part of the light emitting element 4 is accommodated in the light emitting side through hole 231, and the other part of the light emitting element 4 protrudes from the light emitting side through hole 231. Note that all of the light emitting elements 4 may be accommodated in the light emitting side through hole 231.

  The light emitting element 4 is conductively joined to the light emitting side through hole bottom 361 and supported by the light emitting side blocking back surface part 311 through the light emitting side through hole bottom 361. The light emitting element 4 and the light emitting side wire bonding part 321 are connected by a light emitting side wire 49. The light emitting side wire 49 is made of, for example, Au. One end of the light emitting side wire 49 is bonded to the light emitting side wire bonding portion 321.

  The light receiving element 5 receives the reflected light when the light from the light emitting element 4 is reflected by the detection target. The light receiving element 5 is a phototransistor, a photodiode, or a photo IC having a photoelectric conversion function. The light receiving element 5 is mounted on the substrate 1. At least a part of the light receiving element 5 is accommodated in the light receiving side through hole 232. In the present embodiment, a part of the light receiving element 5 is accommodated in the light receiving side through hole 232 and the other part of the light receiving element 5 protrudes from the light receiving side through hole 232. Note that all of the light receiving elements 5 may be accommodated in the light receiving side through hole 232.

  The light receiving element 5 is conductively joined to the light receiving side through hole bottom 362 and supported by the light receiving side blocking back surface 312 through the light receiving side through hole bottom 362. The light receiving element 5 and the light receiving side wire bonding part 322 are connected by a light receiving side wire 59. The light receiving side wire 59 is made of, for example, Au. One end of the light receiving side wire 59 is bonded to the light receiving side wire bonding portion 322.

  The translucent resin 6 covers the light emitting element 4 and the light receiving element 5 on the main surface 21 side of the substrate 2. The translucent resin 6 is made of a material that transmits light emitted from the light emitting element 4 and light to be received by the light receiving element 5. In the present embodiment, the translucent resin 6 is made of, for example, a black epoxy resin that transmits infrared light. In the present embodiment, the translucent resin 6 covers the entire main surface 21. Further, the translucent resin 6 is interposed between the light emitting side through hole 231 and the light emitting element 4. Further, the translucent resin 6 is interposed between the light receiving element 5 and the light receiving side through hole 232.

  The light shielding resin 7 crosses the main surface 21 in a direction intersecting with the direction in which the light emitting element 4 and the light receiving element 5 are separated from each other, and partitions the light transmitting resin 6. The light shielding resin 7 is made of a material that shields light from the light emitting element 4 and light to be received by the light receiving element 5. The light shielding resin 7 is made of a material having a smaller elastic modulus than that of the translucent resin 6, and is made of, for example, a silicone resin in the present embodiment.

  The light shielding resin 7 has an exposed portion 71. The exposed portion 71 is a portion exposed from the translucent resin 6 to the side where the main surface 21 faces. In the present embodiment, the exposed portion 71 has a bulging shape that is convex toward the side on which the main surface 21 faces. As shown in FIG. 4, in the present embodiment, the exposed portion 71 slightly protrudes to the side where the main surface 21 faces than the translucent resin 6. The exposed portion 71 may not protrude from the translucent resin 6. Moreover, in this embodiment, the area | region which touches the light shielding resin 7 among the main surfaces 21 and the area | region adjacent to the said area | region are flat.

  Next, an example of a method for manufacturing the light emitting / receiving device A1 will be described below with reference to FIGS.

  First, a substrate material 10 is prepared as shown in FIG. The substrate material 10 is a material capable of manufacturing a plurality of substrates 1. In the following, a case where a plurality of light emitting / receiving devices A1 are manufactured collectively will be described as an example, but a method of individually manufacturing the light receiving / emitting devices A1 may be used.

  The substrate material 10 includes a base material 2 and a wiring pattern 3. The substrate 2 has the main surface 21, the back surface 22, the light emitting side through hole 231 and the light receiving side through hole 232 described above. The wiring pattern 3 includes the above-described light-emitting side blocking back surface part 311, the light-receiving side blocking back surface part 312, the light-emitting side wire bonding part 321, the light-receiving side wire bonding part 322, the light-emitting side through-hole part 331, the light-receiving side through-hole part 332, and the light emission. Side back electrode part 341, light receiving side back electrode part 342, light emitting side through hole side part 351, light receiving side through hole side part 352, light emitting side through hole bottom part 361, light receiving side through hole bottom part 362, light emitting side through hole peripheral part 371 And a light-receiving side through-hole peripheral portion 372.

  Next, as shown in FIG. 6, the light emitting element 4 and the light receiving element 5 are mounted on the substrate material 10. The light-emitting element 4 is mounted by bonding the light-emitting element 4 to the light-emitting side through-hole bottom 361 with, for example, a conductive bonding material (not shown). The light receiving element 5 is mounted by bonding the light receiving element 5 to the light receiving side through hole bottom 362 with a conductive bonding material (not shown). Further, one end of the light emitting side wire 49 is bonded to the light emitting element 4 and the other end is bonded to the light emitting side wire bonding part 321. Also, one end of the light receiving side wire 59 is bonded to the light receiving element 5 and the other end is bonded to the light receiving side wire bonding portion 322.

  Next, as shown in FIG. 7, a light shielding resin material 70 is formed. The light shielding resin 7 is formed by, for example, applying a light shielding resin material such as a silicone resin material to the main surface 21 in a linear manner from a nozzle or the like. In this application, a light shielding resin material is applied so as to partition the light emitting element 4 (light emitting side through hole 231) and the light receiving element 5 (light receiving side through hole 232). The light shielding resin material 70 is obtained by curing the light shielding resin material. Such a light shielding resin material 70 tends to have a bulging shape that is convex toward the side on which the main surface 21 faces.

  Next, a mold 81 is prepared as shown in FIG. Then, the surface of the mold 81 that faces the main surface 21 is brought into contact with the light shielding resin material 70. Thereby, a space is maintained between the main surface 21 and the mold 81. At this time, as shown in FIG. 9, the uppermost portion of the light shielding resin material 70 is slightly compressed by the mold 81.

  Next, a light-transmitting resin material such as an epoxy resin is filled between the main surface 21 and the mold 81, and the light-transmitting resin material is cured. Thereby, as shown in FIG. 10, the translucent resin material 60 is obtained. The translucent resin material 60 is partitioned by the light-shielding resin material 70 and covers the entire main surface 21. Further, the translucent resin material 60 fills the light-emitting side through-hole 231 and the light-receiving side through-hole 232. Thereafter, the substrate material 10, the translucent resin material 60, and the light-shielding resin material 70 are collectively cut to obtain a plurality of light receiving and emitting devices A1.

  Next, the operation of the light emitting / receiving device A1 and the manufacturing method thereof will be described.

  According to the present embodiment, at least a part of the light emitting element 4 is accommodated in the light emitting side through hole 231, and at least a part of the light receiving element 5 is accommodated in the light receiving side through hole 232. The light emitting side through hole 231 and the light receiving side through hole 232 penetrate the base material 2. Thereby, the thickness of the translucent resin 6 covering the light emitting element 4 and the light receiving element 5 can be reduced, and the light receiving / emitting device A1 can be thinned.

  By having the light emission side blocking back surface portion 311 and the light receiving side blocking back surface portion 312, it is possible to prevent the material of the translucent resin 6 from leaking to the back surface 22 side. Moreover, the light emitting element 4 and the light receiving element 5 can be supported at the position of the back surface 22 in the thickness direction.

  By having a light emitting side through hole side portion 351, a light receiving side through hole side portion 352, a light emitting side through hole bottom portion 361, a light receiving side through hole bottom portion 362, a light emitting side through hole surrounding portion 371 and a light receiving side through hole surrounding portion 372, The light emitting side through hole 231 and the light receiving side through hole 232 can be more reliably sealed.

  By having the light emitting side through hole portion 331 and the light receiving side through hole portion 332, a conduction path from the main surface 21 side to the back surface 22 side can be appropriately formed.

  As shown in FIG. 9, in forming the translucent resin 6 (translucent resin material 60), the light shielding resin 7 (light shielding resin material 70) and the mold 81 are brought into contact with each other. By forming the translucent resin material 60 in this state, the translucent resin 6 (the translucent resin material 60) can be reliably partitioned by the light-shielding resin 7 (the light-shielding resin material 70). This is preferable in order to avoid that the light from the light emitting element 4 unduly reaches the light receiving element 5 through the translucent resin 6.

  The light shielding resin 7 (light shielding resin material 70) is made of a material having an elastic modulus smaller than that of the light transmitting resin 6 (light transmitting resin material 60), so that the mold 81 and the light shielding resin material 70 can be more reliably routed. Can do. Silicone resin is suitable as the material of the light shielding resin material 70.

  11 to 17 show another embodiment of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  FIG. 11 shows a light emitting / receiving device according to the second embodiment of the present invention. The light emitting / receiving device A2 of the present embodiment is different from the light receiving / emitting device A1 described above in the specific configuration of the light emitting side through hole 231 and the light receiving side through hole 232. In the present embodiment, the light-emitting side through-hole 231 and the light-receiving side through-hole 232 have a cross-sectional area that is perpendicular to the thickness direction of the base material 2 and increases in the thickness direction from the back surface 22 to the main surface 21. It is.

  Also according to such an embodiment, the light receiving / emitting device A2 can be thinned. Further, since the light emitting side through hole 231 has the above-described shape, the light directed from the light emitting element 4 to the side can be reflected by the light emitting side through hole side portion 351 to be directed to the side on which the main surface 21 faces. it can. Further, the light traveling toward the periphery of the light receiving element 5 can be directed to the light receiving element 5 by being reflected by the light receiving side through hole side portion 352. Thus, the detection accuracy of the light emitting / receiving device A2 can be increased.

  FIG. 12 shows a light emitting / receiving device according to the third embodiment of the present invention. The light emitting / receiving device A3 of the present embodiment is mainly different from the above-described embodiment in the specific configuration of the light shielding resin 7. Further, a groove portion 25 is formed in the base material 2. The groove 25 is recessed from the main surface 21 and partitions the light emitting side through hole 231 and the light receiving side through hole 232. The light shielding resin 7 fills the groove 25. Further, the exposed portion 71 of the light shielding resin 7 is flush with the upper surface of the translucent resin 6 in the drawing. Such a light shielding resin 7 is made of a material harder than the above-described silicone resin, for example, and is made of, for example, an epoxy resin that shields infrared rays.

  Next, an example of a method for manufacturing the light emitting / receiving device A3 will be described below with reference to FIGS.

  First, as shown in FIG. 13, the light emitting element 4 and the light receiving element 5 are mounted on the substrate material 10. Next, a predetermined space is maintained between the mold 81 and the main surface 21.

  Next, a space between the mold 81 and the main surface 21 is filled with a translucent resin material such as an epoxy resin. The translucent resin material 60 shown in FIG. 14 is obtained by curing the translucent resin material.

  Next, the light transmitting resin material 60 and the base material 2 are partially deleted, for example, by cutting or the like, thereby forming slits 61 in the light transmitting resin material 60 and forming the groove portions 25 in the base material 2.

  Next, as shown in FIG. 16, a light shielding resin material such as an epoxy resin is disposed by coating or the like so as to fill the slit 61 and the groove portion 25 and cover the light transmitting resin material 60. Then, the light shielding resin material 70 is obtained by curing the light shielding resin material. Next, the light shielding resin material 70 and the translucent resin material 60 are partially deleted by cutting or the like. This processing is performed until the cutting surface Cs is exposed as an outer surface. As a result, the light shielding resin material 70 that partitions the light transmitting resin material 60 is obtained. Thereafter, the substrate material 10, the translucent resin material 60, and the light-shielding resin material 70 are collectively cut to obtain a plurality of light receiving and emitting devices A3.

  Also according to such an embodiment, the light receiving / emitting device A3 can be thinned.

  FIG. 17 shows a light emitting / receiving device according to the fourth embodiment of the present invention. The light emitting / receiving device A3 of this embodiment is different from the above-described embodiment in the configuration of the wiring pattern 3. In the present embodiment, the wiring pattern 3 has the light emitting side blocking back surface portion 311 and the light receiving side blocking back surface portion 312, but exposes the light emitting side through hole 231 and the light receiving side through hole 232 of the substrate 2. For this reason, the translucent resin 6 is in contact with the light emitting side through hole 231 and the light receiving side through hole 232.

  Even in such an embodiment, the light receiving and emitting device A4 can be thinned.

  The light emitting / receiving device and the method for manufacturing the light emitting / receiving device according to the present invention are not limited to the above-described embodiments. The specific configuration of the light emitting / receiving device and the method for manufacturing the light emitting / receiving device according to the present invention can be varied in design in various ways.

A1 to A4: Light receiving / emitting device 1: Substrate 2: Base material 3: Wiring pattern 4: Light emitting element 5: Light receiving element 6: Translucent resin 7: Light shielding resin 10: Substrate material 21: Main surface 22: Back surface 25: Groove portion 49 : Light emitting side wire 59: Light receiving side wire 60: Translucent resin material 61: Slit 70: Light shielding resin material 71: Exposed portion 81: Mold 231: Light emitting side through hole 232: Light receiving side through hole 311: Light emitting side sealed back surface portion 312: Light-receiving side blocking back surface part 321: Light-emitting side wire bonding part 322: Light-receiving side wire bonding part 331: Light-emitting side through-hole part 332: Light-receiving side through-hole part 341: Light-emitting side back-side electrode part 342: Light-receiving side back-side electrode part 351 : Light emitting side through hole side 352: Light receiving side through hole side 361: Light emitting side through hole bottom 362: Light receiving side through hole bottom 371: Light emitting side through hole peripheral part 372: Light-receiving side through-hole peripheral part Cs: Cutting surface

Claims (38)

A substrate having a base and a wiring pattern having a main surface and a back surface;
A light emitting element and a light receiving element mounted on the substrate;
A light-receiving / emitting device comprising: a light-transmitting resin that covers the light-emitting element and the light-receiving element on the main surface side, and transmits light from the light-emitting element and light to be received by the light-receiving element;
The substrate has a light emitting side through hole and a light receiving side through hole penetrating in the thickness direction,
At least a part of the light emitting element is accommodated in the light emitting side through hole;
At least a part of the light receiving element is accommodated in the light receiving side through hole.   The light emitting and receiving device according to claim 1, wherein a part of the light emitting element protrudes from the light emitting side through hole toward the main surface.   The light receiving and emitting device according to claim 2, wherein a part of the light receiving element protrudes from the light receiving side through hole toward the main surface. The wiring pattern has a light emitting side blocking back surface portion that closes the light emitting side through hole from the back surface side,
The light emitting / receiving device according to any one of claims 1 to 3, wherein the light emitting element is supported by the light emitting side blocking back surface portion. The wiring pattern has a light receiving side blocking back surface portion that closes the light receiving side through hole from the back surface side,
The light receiving / emitting device according to claim 4, wherein the light receiving element is supported by the light receiving side blocking back surface portion.   The light emitting / receiving device according to claim 5, wherein the translucent resin is interposed between the light emitting side through hole and the light emitting element.   The light receiving and emitting device according to claim 6, wherein the translucent resin is interposed between the light receiving side through hole and the light receiving element.   The light receiving and emitting device according to claim 7, wherein the wiring pattern has a light emitting side through hole side portion covering an inner surface of the light emitting side through hole. The wiring pattern has a light emitting side through hole bottom portion that is connected to the light emitting side through hole side portion and covers the light emitting side blocking back surface portion from the main surface side,
The light emitting / receiving device according to claim 8, wherein the light emitting element is supported by the light emitting side blocking back surface portion through the light emitting side through hole bottom.   The light receiving and emitting device according to claim 9, wherein the wiring pattern has a light emitting side through hole peripheral portion that is connected to the light emitting side through hole side portion and surrounds the light emitting side through hole on the main surface.   The light receiving / emitting device according to claim 8, wherein the wiring pattern has a light receiving side through hole side portion covering an inner surface of the light receiving side through hole. The wiring pattern has a light receiving side through hole bottom portion that is connected to the light receiving side through hole side portion and covers the light receiving side blocking back surface portion from the main surface side,
The light receiving / emitting device according to claim 11, wherein the light receiving element is supported by the light receiving side blocking back surface portion through the light receiving side through hole bottom.   The light receiving / emitting device according to claim 12, wherein the wiring pattern has a light receiving side through hole peripheral portion that is connected to the light receiving side through hole side portion and surrounds the light receiving side through hole on the main surface.   The light emitting / receiving device according to claim 7, wherein an inner surface of the light emitting side through hole and the translucent resin are in contact with each other.   The light receiving and emitting device according to claim 14, wherein an inner surface of the light receiving side through hole and the translucent resin are in contact with each other.   The light emitting / receiving device according to claim 8, wherein the light emitting side through hole has a uniform cross-sectional area perpendicular to the thickness direction in the thickness direction.   The light-receiving / emitting device according to claim 16, wherein the light-receiving side through hole has a uniform cross-sectional area perpendicular to the thickness direction in the thickness direction.   The receiving portion according to any one of claims 8 to 15, wherein the light-emitting side through hole has a cross-sectional area perpendicular to the thickness direction that increases in a direction from the back surface to the main surface in the thickness direction. Light emitting device.   The light receiving / emitting device according to claim 18, wherein the light receiving side through-hole has a cross-sectional area perpendicular to the thickness direction that increases in a direction from the back surface to the main surface in the thickness direction. The wiring pattern has a light emitting side wire bonding part formed on the main surface,
The light emitting / receiving device according to claim 1, further comprising a light emitting side wire bonded to the light emitting element and the light emitting side wire bonding portion.   The wiring pattern has a light emitting side through-hole portion that penetrates the light emitting side back surface electrode portion formed on the back surface and the base material and is connected to the light emitting side wire bonding portion and the light emitting side back surface electrode portion. The light emitting / receiving device according to 1. The wiring pattern has a light receiving side wire bonding portion formed on the main surface,
The light receiving / emitting device according to claim 20 or 21, comprising a light receiving side wire bonded to the light receiving element and the light receiving side wire bonding portion.   The wiring pattern has a light receiving side through-hole portion that penetrates the light receiving side back surface electrode portion formed on the back surface and the base material and is connected to the light receiving side wire bonding portion and the light receiving side back surface electrode portion. The light emitting / receiving device according to 1.   The main surface is crossed in a direction intersecting with the direction in which the light emitting element and the light receiving element are separated from each other, and the light from the light emitting element and the light to be received by the light receiving element are shielded to partition the translucent resin. The light emitting / receiving device according to claim 1, comprising a light shielding resin made of a material.   The light-receiving / emitting device according to claim 24, wherein the light-shielding resin has an exposed portion that is exposed from the light-transmitting resin to a side of the main surface.   26. The light receiving and emitting device according to claim 25, wherein the light shielding resin is made of a material having a smaller elastic modulus than the light transmitting resin.   27. The light receiving and emitting device according to claim 26, wherein the light shielding resin is made of a silicone resin.   28. The light emitting / receiving device according to claim 25, wherein the exposed portion has a bulging shape that is convex toward the side to which the main surface faces.   29. The light receiving and emitting device according to claim 28, wherein the exposed portion protrudes toward the side of the main surface facing the translucent resin.   30. The light emitting / receiving device according to claim 26, wherein a region of the main surface that is in contact with the light shielding resin and a region adjacent to the region are flat.   26. The light receiving and emitting device according to claim 25, wherein the base has a groove that is recessed from the main surface and buried in the light shielding resin.   32. The light receiving and emitting device according to claim 31, wherein the exposed portion is flush with the translucent resin. A step of preparing a substrate having a substrate and a wiring pattern having a light emitting side through hole and a light receiving side through hole penetrating in the thickness direction in the main surface and the back surface; and
The light emitting element and the light receiving element are separated from each other in the first direction so that at least a part of the light emitting element is accommodated in the light emitting side through hole and a part of the light receiving element is accommodated in the light receiving side through hole. Mounting on the substrate;
Forming a light shielding resin that crosses the main surface in a second direction intersecting the first direction;
The surface opposite to the main surface of the mold is brought into contact with the light shielding resin, so that the space is filled with the light-transmitting resin material in a state where the space is maintained between the main surface and the mold. Later, by curing the translucent resin material, forming a translucent resin;
A method of manufacturing a light emitting / receiving device, comprising:   34. The method for manufacturing a light receiving and emitting device according to claim 33, wherein the light shielding resin is made of a material having a smaller elastic modulus than the light transmitting resin.   The method for manufacturing a light emitting / receiving device according to claim 34, wherein the light shielding resin is made of a silicone resin.   36. The method for manufacturing a light receiving and emitting device according to claim 34 or 35, wherein in the step of forming the light transmitting resin, the light shielding resin is compressed by the mold.   37. The method for manufacturing a light receiving and emitting device according to claim 33, wherein in the step of forming the light shielding resin, a light shielding resin material is applied to the main surface. A step of preparing a substrate having a substrate and a wiring pattern having a light emitting side through hole and a light receiving side through hole penetrating in the thickness direction in the main surface and the back surface; and
The light emitting element and the light receiving element are separated from each other in the first direction so that at least a part of the light emitting element is accommodated in the light emitting side through hole and a part of the light receiving element is accommodated in the light receiving side through hole. Mounting on the substrate;
Forming a translucent resin covering the light emitting element and the light receiving element on the main surface side;
A slit that crosses the translucent resin in a second direction that intersects the first direction and a groove that crosses the main surface in the second direction and coincides with the slit in the thickness direction view are formed in the substrate. Process,
Filling the slit and the groove, and forming a light-shielding resin that covers the light-transmitting resin;
Removing the light-transmitting resin and the light-shielding resin together until the light-transmitting resin is exposed from the light-shielding resin;
A method of manufacturing a light emitting / receiving device, comprising: