JP2017010921A - Board-to-board connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board-to-board connector which is capable of realizing low profile and narrow pitch and has high connection strength.SOLUTION: A board-to-board connector 1 includes a header 2 having a plurality of header contacts 4 and a socket 3 having a plurality of socket contacts 6. The header contact 4 has a header side contact portion 4b. The socket contact 6 has an elliptical annular socket side contact portion 6b. The plate-like header side contact portion 4b is press-fitted into the elliptical annular socket side contact portion 6b and engaged by an engagement portion 4d to obtain a strong connection strength. The header 2 and the socket 3 can be attached and detached by turning around a receiving portion 5d of a header body 5 and a side edge 7b of a socket body 7.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an inter-board connector for connecting circuit boards and an electronic device contact including the inter-board connector.

  Conventionally, as a board-to-board connector for electrically connecting circuit boards such as printed boards, a board having a socket having a plurality of socket contacts and a header having a plurality of header contacts respectively connected to the socket contacts. A connector is known (see, for example, Patent Document 1).

  In the inter-board connector disclosed in Patent Document 1, the header contact includes a plurality of columnar insertion portions that protrude toward the socket. Moreover, a socket contact is provided with the 1st-3rd elastic contact spring part each contact | connected to an insertion part from the direction orthogonal to the protrusion direction of an insertion part. And a header and a socket are connected by inserting the insertion part of each header contact between the 1st-3rd elastic contact spring part of each corresponding socket contact.

  When the insertion portion is inserted between the first and third elastic contact spring portions, the first and second elastic contact spring portions are bent in contact with the insertion portion, whereby the third elastic contact spring portion is The spring portion is pressed against the insertion portion and comes into firm contact with the insertion portion. This strong contact provides a good electrical connection between the socket contact and the header contact.

  According to this, the 1st-3rd elastic contact spring part bends in the direction orthogonal to the protrusion direction of the insertion part of a header contact, and contacts an insertion part from this direction. For this reason, the dimensions of the board-to-board connector in the protruding direction of the plug-in part, that is, in the connecting direction of the socket and header, are reduced compared to the case where each elastic spring part is freely bent in the protruding direction of the plug-in part. The low height of the board-to-board connector was realized.

JP 2008-27713 A

  However, with the recent high performance and high density of mobile devices and the like, more advanced low profile and narrow contact pitch are required. In this respect, the inter-board connector of Patent Document 1 has a structure in which the elastic contact spring portion of the socket contact is bent and contacts the insertion portion of the header contact in a direction perpendicular to the protruding direction. This is disadvantageous in increasing the size and reducing the pitch.

Further, in the inter-board connector of Patent Document 1, when the insertion portion of the header contact is inserted between the elastic contact spring portions, the first and second elastic contact spring portions are in contact with the insertion portion and bend. As a result, the third elastic contact spring portion is pressed against the header contact, so that the structure is complicated. For this reason, according to the board-to-board connector of Patent Document 1, it is difficult to further reduce the height and the pitch.
In addition, if the pitch is simply narrowed, the width of each contact is also narrowed, and the rigidity of each contact is lowered, so that there is a disadvantage that the connection strength is lowered.

  An object of the present invention is to provide a board-to-board connector that can easily achieve further reduction in height and pinching pitch in view of the problems of the prior art. Another object of the present invention is to provide a board-to-board connector that can maintain high connection strength even when the pitch is narrowed. Another object of the present invention is to provide an electronic device contact including an inter-board connector that can easily achieve a narrow pitch.

  The present invention includes a header mounted on a circuit board and a socket mounted on another circuit board, and the header and the socket face each other in a predetermined posture and are electrically connected by pressing in a connection direction. The header includes an insulating header body and a plurality of conductive header contacts fixed to the header body and connected to the socket side, and the socket has an insulating property. A socket body, and a plurality of conductive socket contacts fixed to the socket body and connected to the header contact, the header contact protruding toward the socket side and contacting the socket contact; A header-side board connecting portion that protrudes from the header body and is connected to the circuit board. The socket includes a socket-side contact portion that contacts the header-side contact portion, and a socket-side substrate connection portion that protrudes from the socket body and is connected to the other circuit board, and the socket-side contact portion has a through hole. The header side contact portion is inserted into the through hole, and the header side contact portion is elastically contacted with and connected to the through hole.

  In the present invention, the socket contact has a through hole in the socket side contact portion, and the header side contact portion of the header contact is elastically contacted and connected by the through hole. Accordingly, since the socket contact does not require the configuration of the elastic contact spring portion of Patent Document 1, the width of the socket contact can be reduced.

  Moreover, in this invention, the said socket side contact part is plate-shaped, and is formed longer in the axial direction than the width direction of the said socket contact, and it may curve toward the said header side by side view.

  Thus, when the socket side contact portion is curved toward the header side, when the header and the socket are connected, the header side contact portion first comes into contact with the curved portion of the socket side contact portion. When the curved portion is pushed by the header side contact portion, the curved portion expands in an arc shape in the width direction around the uncurved portion of the header side contact portion as viewed in the axial direction of the socket contact. Therefore, since the socket-side contact portion having the shape is easier to spread in the width direction than a flat plate-shaped contact portion, the connection between the header and the socket can be made smooth.

  Further, in the present invention, the socket side contact portion is plate-shaped and is longer in the axial direction than the width direction of the socket contact, and is V-shaped or U-shaped from the center of the through hole as viewed in the axial direction. It may be curved.

  According to this configuration, when the header-side contact portion is inserted into the through hole, first, the portion of the socket-side contact portion that is bent to the header side comes into contact with the header-side contact portion, and is further pushed by the header-side contact portion. The socket contact extends in an arc shape in the width direction from the center of the header side contact portion as viewed in the axial direction. Therefore, since the socket-side contact portion having the shape is easier to spread in the width direction than a flat plate-shaped contact portion, the connection between the header and the socket can be made smooth.

  In the present invention, the socket-side contact portion is plate-shaped and is longer in the axial direction than the width direction of the socket contact, and may be curved toward the width direction of the socket contact in plan view. . According to the said structure, the length of a through-hole can be lengthened compared with the shape where the socket side contact part is not curving. As a result, the connection strength between the socket-side contact portion and the header-side contact portion can also be weakened. Therefore, if the connection strength between the socket contact and the header contact is too high, this can be adjusted to an appropriate connection strength. it can.

  In the present invention, the through hole is a long hole that is long in the axial direction of the socket contact, and the header side contact portion is engaged with the inner peripheral surface of the through hole or the back surface of the socket side contact portion. There may be a joining portion, and the engaging portion may be engaged with the axial end of the through hole.

  According to this configuration, since the through hole is a long hole, the axial end portion of the through hole has higher rigidity than the portion around the other through hole. Therefore, the coupling strength of the header contact and the socket contact can be increased by engaging the engaging portion of the header side contact portion with the axial end portion of the through hole.

  In the above configuration, when the plurality of header contacts are provided in parallel in the longitudinal direction of the header body and are arranged in two rows in the width direction of the header body, the engaging portion is the header body. It is preferable to arrange symmetrically with respect to the center in the width direction.

  According to the said structure, the engaging part of a header side contact part will be in the state which has faced the outer side, or has faced both inside. When the engaging portions are both facing outward, pressing the header against the socket acts to push the two rows of socket-side contact portions outward together. When the engaging portions are both facing inward, pressing the header against the socket acts to press the two rows of socket side contact portions together. That is, since the engaging portions of the headers in the two rows are combined and act as a set of engaging portions, the coupling strength between the header contact and the socket contact can be increased.

  In the present invention, the through hole is a long hole that is long in the axial direction of the socket contact, the header side contact portion is formed thicker than the width of the through hole, and the header side contact portion is formed in the through hole. When inserted, the header-side contact portion may be in contact with both inner peripheral surfaces in the width direction of the through hole. According to the said structure, since a header side contact part is press-fit in the through-hole of a socket side contact part, both joint strength can be raised more.

  Further, in the present invention, when the through hole is a long hole that is long in the axial direction of the socket contact, the header side contact portion is curved in the width direction in a plan view and is inserted into the through hole. In addition, the header side contact portion may be in contact with both inner peripheral surfaces in the width direction of the through hole. According to this configuration, the header side contact portion and the inner peripheral surface of the elongated hole come into contact at a plurality of locations, so that the connection reliability is improved and the connection strength between the socket contact and the header contact is also improved. Can do.

  Further, in the present invention, the socket side contact portion is formed in a plate shape and is longer in the axial direction than the width direction of the socket contact, curved in the width direction of the socket contact in plan view, and the header side contact portion is It may be curved in the same direction as the socket side contact portion in plan view, and when inserted into the through hole, the header side contact portion may contact both inner peripheral surfaces in the width direction of the through hole. . According to the said structure, according to the curvature of a header side contact part and the curvature of a through-hole, it becomes possible to make both contact points into a 3 point contact, or to contact at 4 points or more.

  Further, in the present invention, the header side contact portion is inclined with respect to the axis of the header contact in a plan view, and the through hole is longer in the axial direction of the socket contact than the header side contact portion, It is preferable that the width is narrower than the inclined width of the header side contact portion in plan view.

  Here, the inclination width of the header side contact portion is the length in the width direction connecting the most protruding portions in the width direction of the header side contact portion inclined in plan view. According to the said structure, when the header side contact part is inserted in the through-hole of a socket side contact part, the location which protrudes most in the width direction of a header side contact part first contacts the surface of a socket side contact part. When the header side contact portion is further pushed in that state, the header side contact portion is deformed by elasticity and the inclination is reduced, and the header side contact portion is inserted into the through hole.

  In this state, the header side contact portion generates a force to return to its original state due to elasticity, and therefore the inner peripheral surface of the through hole is always pressed. Therefore, the coupling strength between the header contact and the socket contact can be increased.

  In the above configuration, the header side contact portion has an engagement portion that engages with the inner peripheral surface of the through hole or the back surface of the socket side contact portion, and the engagement portion is an inner portion in the width direction of the through hole. It is preferable to engage with the peripheral surface or the back surface of the socket side contact portion.

  According to the said structure, since the engagement force with an engaging part arises in addition to an elastic force in the state which the header side contact part is inserted in the through-hole, the joint strength of a header contact and a socket contact is raised more. Can do.

  In the above configuration, when a plurality of the header contacts are provided in parallel in the longitudinal direction of the header body, the header side contact portions of adjacent header contacts may be disposed so that the inclinations are opposite to each other. preferable.

  According to the said structure, when the inclined header side contact part is inserted in a through-hole, a bending moment will generate | occur | produce in a socket side contact part and a header side contact part. However, if the slopes of the header side contact portions of the adjacent header contacts are opposite to each other, the bending moments of the adjacent header side contact portion and the socket side contact portion are canceled out. The moment is slight.

  In the present invention, when a plurality of the socket contacts are provided in parallel in the longitudinal direction of the socket body, a concave groove or a through groove is provided between the adjacent socket contacts of the socket body. It is preferable.

  According to the said structure, when a header side contact part is inserted in the through-hole of a socket side contact part, both contact, but it deform | transforms so that a socket side contact part may spread in the width direction in that case. However, since the concave groove or the through groove is provided between the adjacent socket contacts, the deformation of the socket side contact portion is absorbed by the concave groove or the through groove. For this reason, the deformation | transformation as the whole socket body can be suppressed.

  In the present invention, the socket body and the header body as a whole are formed in a rectangular parallelepiped shape, and the header and the socket are attached to and detached from the socket body or the header body by rotating the other body. It is preferable that the receiving part which enables is provided.

  In the conventional board-to-board connector, when the header and the socket are connected and when both are removed, the header and the socket must be moved in parallel. This is because the connector is damaged if the other is rotated with respect to the other to perform connection or removal. However, in practice, it is difficult to move the two in parallel, and even if there is a slight amount, the other is rotated with respect to the other for connection and the connector may be damaged.

  In the present invention, one of the socket body and the header body is provided with a receiving portion capable of rotating the other body, and the connection can be made by rotating the other with respect to the other body. . With this configuration, when connecting and removing the socket and the header, the load of the other body is applied to the receiving portion and pushed to the circuit board side, so the force applied to the header body and the socket body is reduced. Can do. For this reason, the possibility of breakage of the header body and the socket body can be reduced as compared with the conventional connector.

  In the above configuration, one end of the socket body or the header body is provided with a both-end engaging portion that protrudes toward the other body on both sides in the longitudinal direction and engages with the other body. It is preferable that the portion has a chamfered shape that does not interfere with the other body when the header or the socket is rotated to be attached or detached.

  According to the both-end engaging portion, since both end portions in the longitudinal direction of the header body and the socket body are engaged by the both-end engaging portion, the connection strength of the entire connector can be further increased. Further, the both-end engaging portion has a chamfered shape so as not to interfere with other bodies even when the header or socket is rotated and detached, so that the header and the socket can be smoothly attached and detached. .

  Moreover, as an electronic device contact which has a board | substrate connection part, it is preferable that the uneven | corrugated shape is formed in the said board | substrate connection part in the surface facing the said circuit board. As the uneven shape, it is preferable that the surface of the substrate connecting portion facing the circuit board is formed in a V shape in the axial direction or a trapezoidal shape on the circuit board side. Here, the electronic device includes an inter-board connector, and the electronic device contact includes the header contact and the socket contact in the above invention. Moreover, the board | substrate connection part in this invention is a concept containing the header side board | substrate connection part and socket side board | substrate connection part in the said invention.

  According to this configuration, when the board connecting portion is soldered to the pattern of the circuit board, the cream solder is absorbed in the uneven shape and the amount protruding in the width direction is reduced. In addition, even if cream solder is melted in this state, the melted solder is difficult to spread in the width direction, so that bridges between adjacent contacts are unlikely to occur. Therefore, it is particularly effective for the contact of a connector with a narrow pitch, and can be widely used as a contact for many electronic devices soldered to a circuit board.

  Moreover, as an electronic device contact which has a board | substrate connection part, it is preferable that the one or several uneven | corrugated shape is formed in the axial direction in the surface facing the said circuit board of the said board | substrate connection part. In this way, the amount of protrusion of cream solder is further reduced by forming not only a V shape in the axial direction or a narrow trapezoidal shape on the side of the circuit board but also forming one or more uneven shapes in the axial direction. be able to.

  Moreover, in the electronic device contact according to the present invention, it is preferable that the substrate connecting portion is plate-shaped and a communication hole that communicates the front and back is formed. In the electronic device contact according to the present invention, it is preferable that the substrate connecting portion has a plate shape and is formed in an inverted U shape or an inverted V shape as viewed in the axial direction.

  In the case of the board connecting portion having the communication hole, when the board connecting portion is placed on the cream solder applied to the circuit board pattern, the cream solder is pushed out to the surface side of the board connecting portion through the communication hole. . In addition, when the substrate connection portion is formed in an inverted U shape or an inverted V shape in the axial direction view, the substrate connection portion is placed on the cream solder applied to the circuit board pattern. Cream solder is pushed inside the shape of the connection. With these configurations, the amount of cream solder protruding in the width direction of the board connecting portion can be reduced.

The figure which shows a mode that the circuit board was connected by the board-to-board connector which concerns on one Embodiment of this invention. A is a plan view of the header, B is a cross-sectional view taken along line BB of A, C is a side view of A, D is a partially enlarged view of A, and E is a cross-sectional view taken along line EE of D. A is a side view of the header contact, B is a front view of the header contact, C is a plan view of the header contact, and D is a plan view of a modified example of the header contact. A is a plan view of the socket, B is a partially enlarged view of A, C is a cross-sectional view taken along line CC of B, D is a cross-sectional view taken along line DD of B, E is a partial cross-sectional view taken along line EE of A . A is a plan view of the socket contact, B is a side view of the socket contact, and C is a front view of the socket contact. A and B are explanatory drawings showing a process when connecting a header and a socket. A is a diagram showing a state where a socket is placed on a circuit board, B is a diagram showing a state of molten solder, and C and D are diagrams showing a state where a conventional socket is placed on a circuit board. A to D are diagrams showing a first modification of the first embodiment. FIGS. 7A and 7B are diagrams illustrating states of a header contact and a socket contact according to a first modification. FIGS. FIGS. 9A to 9C are diagrams showing socket contacts of a second modified example. FIGS. The figure which shows the state in which the board-to-board connector of 2nd Embodiment was connected. A is a top view of the header of 2nd Embodiment, B is a side view of a header, C is CC sectional view taken on the line C-A. FIGS. 8A to 8C are diagrams showing a first type of header contact according to the second embodiment. FIGS. FIGS. 8A to 8C are views showing a second type header contact of the second embodiment. FIGS. A is a top view of the socket of 2nd Embodiment, B is A BB sectional view taken on the line of A, C is CC sectional view taken on the line C-A. A and B are views showing a socket contact of a second embodiment. A and B are diagrams showing a state in which the socket and the header of the second embodiment are in contact, and C and D are diagrams showing a state in which the socket and the header of the second embodiment are connected. A is a sectional view showing details of a socket body and a socket contact, and B is a view showing a manufacturing process of the socket of A. FIG. FIGS. 14A to 14C are diagrams showing a header contact 14 </ b> A ′ that is a modification of the second embodiment and can be used in place of the header contact 14 </ b> A of FIGS. FIGS. 14A to 14C are diagrams showing a header contact 14 </ b> B ′ that is a modification of the second embodiment and can be used in place of the header contact 14 </ b> B of FIGS. The figure which shows the shape of the header contact which is the principal part of the modification of 2nd Embodiment. The figure which shows the other example of the cross-sectional shape of the board | substrate connection part of a header and a socket. AF is explanatory drawing which shows the header of the connector of 3rd Embodiment. AD is explanatory drawing which shows the socket of the connector of 3rd Embodiment. A and B are explanatory drawings showing the connection state of the header and socket of the third embodiment. AD is explanatory drawing which shows the other shape of the contact for electronic devices.

  The board-to-board connector 1 according to the first embodiment of the present invention is a board-to-board connector for connecting circuit boards S1 and S2, as shown in FIG. The board-to-board connector 1 includes a header 2 and a socket 3. The header 2 includes a metal header contact 4 and a header body 5 made of insulating synthetic resin.

  Similarly, the socket 3 includes a metal socket contact 6 and a socket body 7 made of an insulating synthetic resin. In the state shown in FIG. 1, the header contact 4 and the socket contact 6 are in contact with each other, and the circuit boards S1 and S2 are electrically connected to each other.

  FIG. 2A is a plan view of the header 2. A plurality of header contacts 4 are arranged in parallel in the longitudinal direction of the header body 5. The plurality of header contacts 4 are arranged in two rows in the width direction of the header body 5 (vertical direction in FIG. 2A).

  As shown in FIG. 2E, the header contact 4 includes a header side body 4a embedded and fixed in the header body 5, a header side contact portion 4b protruding from the header side body 4a toward the socket 3, and a header side body. 4a, and a header-side board connecting portion 4c that protrudes to the side of the header body 5.

  As shown in FIG. 2D, the header side contact portion 4b is formed in a flat oval shape in plan view. Further, as shown in FIG. 2E, an engaging portion 4 d is provided on the header side substrate connecting portion 4 c side in the longitudinal direction of the header contact 4.

  As shown in FIGS. 1 and 2E, the header side main body 4a is bent into a substantially crank shape when viewed from the side. The header side main body 4 a is molded integrally with the header body 5 by insert molding, and most of the header side main body 4 a is embedded in the header body 5. As shown in FIG. 3B, the header-side board connecting portion 4c is chamfered 4e on the surface soldered to the circuit board S1, and the surface facing the circuit board S1 has a trapezoidal shape.

  As shown in FIG. 2D, the two rows of header contacts 4 are arranged symmetrically in the width direction of the header body 5 (vertical direction in FIG. 2D). In the first embodiment, the engaging portions 4 d of the two rows of header contacts 4 are arranged in opposite directions toward the outer side in the width direction of the header body 5. Further, the header-side board connecting portion 4 c protrudes outward from both sides of the header body 5.

  The header body 5 is formed of a synthetic resin molded in a substantially rectangular shape. The header body 5 is formed with a recessed portion 5a into which the socket body 7 is inserted, and peripheral walls 5b and 5c that abut against the outer peripheral surface of the socket body 7 are formed therearound.

  The end portions 5c on both sides of the peripheral wall in the length direction of the header body 5 have substantially the same height as the thickness of the socket body 7 of the socket 3 (see FIG. 4d). A portion between both ends in the longitudinal direction of the peripheral wall 5b has a low height. A boundary portion between the peripheral wall 5b and the recessed portion 5a serves as a receiving portion 5d with which a side edge 7b of a socket body 7 to be described later contacts when the socket 3 and the header 2 are connected and detached.

  Further, locking claws 5e which are both end engaging portions of the present invention are formed on both sides of the header body 5 in the longitudinal direction. When the header 2 is attached to the socket 3, the locking claw 5 e is engaged with a locking hole 7 a provided in the socket body 7 to strengthen the coupling between the two. As shown in FIG. 2E, the locking claw 5e is formed with a chamfer 5f whose corners in the width direction are arcuate.

  FIG. 4A is a plan view of the socket 3. A plurality of socket contacts 6 are arranged in parallel in the longitudinal direction of the socket body 7. The plurality of socket contacts 6 are arranged in two rows in the width direction of the socket body 7.

  4C is a cross-sectional view taken along the line CC of FIG. 4B. As shown in FIG. 4C, the socket contact 6 includes a socket-side main body 6a that is embedded and fixed in the socket body 7, and a socket-side contact portion 6b that extends from the socket-side main body 6a along the width direction of the socket body 7. And a socket-side board connecting portion 6c protruding from the socket-side main body 6a to the side of the socket body 7.

  As shown in FIGS. 4B and 5A, the socket-side contact portion 6b is formed in an oval shape in which a long hole 6d, which is a through hole, is provided in the center portion in plan view. Further, as shown in FIG. 4C and the like, the elongated hole 6d of the socket side contact portion 6b is chamfered 6e on the header contact 4 side in a sectional view.

  As shown in FIG. 1, the length of the long hole 6 d is longer than the length of the header side contact portion 4 b of the header contact 4. On the other hand, the width of the long hole 6d is slightly narrower than the width of the header side contact portion 4b. In the first embodiment, the difference between both widths is about 0.03 [mm].

  As shown in FIG. 5C, the socket-side board connecting portion 6c is chamfered 6f on the surface soldered to the circuit board S2 similarly to the header-side board connecting part 4c, and the surface facing the circuit board S2 is trapezoidal. It has become.

  The socket body 7 is formed of a synthetic resin molded into a substantially rectangular shape. The socket body 7 is formed with a locking hole 7a for locking the locking claw 5e of the header body 5. The width of the socket body 7 is formed to be substantially the same as the width of the recessed portion 5 a of the header body 5. Further, the side edge 7b of the socket body 7 is chamfered in an arc shape as shown in FIG. 4C.

As shown in FIG. 4D, V-shaped grooves 7 c are formed on the front and back surfaces of the socket body 7 between the plurality of socket contacts 6 in a cross-sectional view. As shown in FIG. 4B, the V-shaped groove 7c has substantially the same length as the length of the long hole 6d of the socket contact 6 in the axial direction.
Next, with reference to FIGS. 6A and 6B, attachment and removal of the inter-board connector 1 of the first embodiment will be described.

  First, the header 2 and the socket 3 are opposed to each other, and the header 2 is moved to the socket 3 side. At that time, as shown in FIG. 6A, the socket body 7 is moved so that the receiving portion 5 d of the header body 5 is brought into contact with the side edge 7 b of the socket body 7. From this state, when the header 2 is brought close to the socket 3 so as to rotate with the receiving portion 5d as a fulcrum, the header contact 4 and the socket contact 6 located on the left side in FIG. 6A first come into contact with each other.

  At this time, the tip of the engaging portion 4d of the header side contact portion 4b contacts the axial end portion 6g of the long hole 6d of the socket side contact portion 6b, but the tip is long due mainly to the elasticity of the header side contact portion 4b. It gets over the axial end 6g of the hole 6d and engages with the header side contact 4b.

  In this state, when the header 2 is moved closer to the socket 3 so that the receiving portion 5d is rotated as a fulcrum, as shown in FIG. 6B, the header contact 4 and the socket contact 6 located on the right side of the drawing come into contact with each other. Thereafter, the tip of the engaging portion 4d of the header side contact portion 4b gets over the axial end portion 6g of the long hole 6d by elasticity and engages with the header side contact portion 4b.

  When the header 2 is further pressed against the socket 3 from this state, the header side contact portion 4b is inserted into the elongated hole 6d of the socket side contact portion 6b. At this time, the width of the header side contact portion 4b is narrower than that of the long hole 6d because the tip end portion is tapered, but at the position in FIG. 6B, the width of the header side contact portion 4b is smaller than that of the long hole 6d. Is also getting wider.

  For this reason, in the state of FIG. 6B, the socket side contact portion 6b is pushed and expanded in the width direction (left and right direction in FIG. 4B) by the header side contact portion 4b inserted into the long hole 6d. Thus, when the socket side contact part 6b is pushed and expanded in the width direction, the part of the socket body 7 sandwiched between the pair of socket contacts 6 is compressed.

  However, since the V-shaped groove 7c is formed in the socket body 7 between the socket contacts 6, the distortion of the socket body 7 caused by the compression by the socket contact 6 is absorbed by the V-shaped groove 7c. . For this reason, the socket body 7 as a whole is not greatly deformed.

  Since the inter-board connector 1 according to the first embodiment of the present invention has the above-described configuration, when the header 2 and the socket 3 are connected, the header-side contact portion 4b is press-fitted into the long hole 6d of each socket contact 6. Thus, the connection between the two becomes strong.

  Thus, in the first embodiment, the header 2 can be rotated and connected to the socket 3 with the receiving portion 5d of the header body 5 and the side edge 7b of the socket body 7 as fulcrums. According to this, one of the header contacts 4 and the socket contacts 6 in two rows is connected first, and then the other is connected.

  For this reason, the load applied to the header body 5 and the socket body 7 is halved compared to the case where two rows of contacts are connected at once, and the load applied to each body is reduced. Therefore, the inter-board connector 1 of the first embodiment has a high connection strength between the header contacts 4 and the socket contacts 6, but can smoothly connect the header 2 and the socket 3.

  Further, since the corner portion in the width direction of the locking claw 5e is formed with a chamfered chamfer 5f, even when the header 2 or the socket 3 is rotated and connected as described above, the locking claw Since 5e does not interfere with the locking hole 7a, the header 2 and the socket 3 can be connected smoothly.

  In the first embodiment, when the header 2 and the socket 3 are mounted, the engaging portions 4d of the two rows of header contacts 4 are arranged in opposite directions toward the outer side in the width direction of the header body 5. ing. For this reason, a pair of engaging portions 4d in two rows are engaged with the axial ends 6g of the long holes 6d of the pair of socket side contact portions 6b, and the connection strength is increased.

  Next, the operation when removing the header 2 from the socket 3 will be described. In the inter-board connector 1 according to the first embodiment of the present invention, when removing the header 2 from the socket 3, the socket 3 or the header 2 is removed so as to rotate about one side edge 7 b of the socket body 7.

  As shown in FIG. 6B, in the inter-board connector 1 of the first embodiment, the header 2 is moved so that the right side portion in FIG. 6B of the header body 5 moves upward with one side edge 7b of the socket body 7 as a fulcrum. Can be rotated. 6B is pressed against the substrate S2 side by the header body 5, and the header body 5 is also pressed against the substrate S1 side by the reaction force. Thereby, it is possible to prevent the socket contact 6 and the header contact 4 from being peeled off from the respective substrates.

  Further, when removing the header 2 by rotating it, it is removed from one of the header contacts 4 and the socket contacts 6 in the two rows, so that it is possible to reduce the force required for removing both the socket contact 3 and the socket 3 as compared with the case where both are removed at once. And the influence on the header 2 is reduced. Therefore, in the inter-board connector 1 of the first embodiment, damage to the socket 3 and the header 2 can be prevented.

  Furthermore, in 1st Embodiment, it engages with the engaging part 4d of the header side contact part 4b, and the axial direction edge part 6g of the long hole 6d of the socket side contact part 6b. The axial end 6g is close to the socket-side board connecting part 6c. Since the socket-side board connecting portion 6c is soldered to the circuit board S2, it is firmly fixed to the circuit board S2. Therefore, when the engaging portion 4d of the header side contact portion 4b is pulled out from the axial end portion 6g of the socket side contact portion 6b, the load applied to the socket body 7 can be reduced.

  In the first embodiment, the header-side board connecting portion 4c and the socket-side board connecting portion 6c have a trapezoidal shape that is soldered to the circuit board. The header 2 and the socket 3 are soldered to the circuit boards S1 and S2 using cream solder by a reflow method.

  The case where the socket 3 of the first embodiment is mounted on the circuit board S2 will be described. First, the cream solder C is applied to the circuit pattern P of the circuit board S2. The cream solder C is uniformly applied to the surface of the circuit pattern P. In this state, when the socket 3 is placed at a predetermined position on the circuit board S2, the socket-side board connecting part 6c of the socket contact 6 pushes out the cream solder C as shown in FIG. 7A.

  In the socket 3 of the first embodiment, the surface on the circuit board S2 side of the socket-side board connecting portion 6c is formed in a trapezoidal shape by chamfering 6f. As a result, as shown in FIG. 7A, the amount of cream solder C pushed out by the socket side substrate connecting portion 6c is reduced by the amount of the chamfer 6f. In this state, when the circuit board S2 and the socket 3 are heated in a reflow furnace (not shown), the cream solder C is melted to become C 'as shown in FIG. 7B, and the socket side board connecting portion 6c and the circuit pattern are melted. P is connected.

  On the other hand, in the conventional connector 103, as shown in FIG. 7C, since the end surface of the socket side substrate connecting portion 106 is rectangular, the amount of cream solder C pushed out by the socket side substrate connecting portion 106 increases. For this reason, when the circuit board S2 and the socket 106 are heated in the reflow furnace, the adjacent cream solders C 'may be bridged as shown in FIG. 7D.

  In the first embodiment, the amount of protrusion of the cream solder C on the circuit board S2 in the width direction is small, so that it can bridge with the cream solder C ′ of the adjacent socket contact 6 when heated in the reflow furnace. Is prevented. The same applies to the header side substrate connecting portion 4c.

  In the first embodiment, the shape of the header side contact portion 4b of the header contact 4 is formed in a flat oval shape in plan view as shown in FIG. 3C, but not limited to this, as shown in FIG. 3D. Moreover, it is good also as header contact 4 'which has the ellipse-shaped header side contact part 4b' by planar view. Moreover, you may process about the header side contact part 4b so that it may incline by planar view with respect to the axial direction of the header contact 4, like 2nd Embodiment mentioned later.

  Moreover, in the said 1st Embodiment, although the groove | channel 7c provided in the socket body 7 is formed in V shape by sectional view, a shape is not restricted to this, A U-shaped or rectangular groove may be sufficient. Moreover, it is good also as a penetration groove | channel which penetrates the socket body 7. FIG. Moreover, in the said 1st Embodiment, although the engaging part 4d of a pair of header side contact part 1b is arrange | positioned so that it may face outside in the width direction of the header body 5 as shown to FIG. 2D, it is not restricted to this. Instead, they may face inward or may be arranged in the same direction.

  Next, a modification of the first embodiment will be described with reference to FIGS. The first modification is different from the first embodiment in the shape of the socket side contact portion 6b and the shapes of both end portions in the longitudinal direction of the header body 5 and the socket body 7.

  As shown in FIG. 8B, the socket side contact portion 6b 'of the socket contact 6' of the first modified example is bent in a mountain shape in a side view. In the first modification, the socket side contact portion 6b 'is bent in a straight line from side to side with a vertex at the center like an isosceles triangle in a side view.

  By being bent in this manner, a part of the inner peripheral surface of the long hole 6d 'provided in the socket side contact portion 6b' protrudes inside due to deformation of the material due to bending. For this reason, when the header side contact portion 4b is inserted into the long hole 6d ', the header side contact portion 4b is sandwiched by the deformed and protruded portion, so that the connection strength between the header 2 and the socket 3 is improved.

  Further, as shown in FIG. 8C, the end of the header body 5 of the first modified example is a locking claw 5e that locks the locking groove 7a 'provided at the end of the socket body 7 to the left and right peripheral walls 5c. 'Is provided. The locking claw 5e 'is formed with a chamfered portion 5f' so that the end of the socket body 7 can be easily inserted when connected to the socket body 7.

  Next, with reference to FIGS. 9A and 9B, an operation when the header 2 is connected to the socket 3 in the first modification will be described. 9A and 9B show only the header contact 4 and the socket contact 6 ', and the other header body 5 and socket body 7 are not shown.

  As shown in FIG. 9A, when the header contact 4 and the socket contact 6 'approach each other, the leading end of the header side contact portion 4b is inserted into the long hole 6d' of the socket side contact portion 6b '. In this state, only the tip portion of the header side contact portion 4b is close to the top portion 6h of the socket side contact portion 6b '.

  When the header contact 4 further approaches the socket contact 6 ′ from this state, the top of the header side contact portion 4b and the chamfered portion 6e provided in the elongated hole 6d ′ of the socket side contact portion 6b ′ come into contact with each other. The side contact portion 4b is inserted into the socket side contact portion 6b ′ while expanding the socket side contact portion 6b ′.

  At this time, as shown in FIG. 9B, the socket side contact portion 6b 'is in a state in which the top portion 6h is pushed to the left and right. In this state, the distortion of the socket body 7 caused by the deformation of the socket side contact portion 6b 'is absorbed by the V-shaped groove 7c provided in the socket body 7.

  Thus, in the socket contact 6 ′ in the first modified example, the socket side contact portion 6 b ′ is curved toward the header 2 side. For this reason, when viewed from the axial direction of the socket contact 6 ′, when the header side contact portion 4b is inserted into the long hole 6d ′ of the socket side contact portion 6b ′, the top portion 6h of the socket side contact portion 6b ′ has an arc shape. To spread. Thereby, the amount of deformation becomes larger than that of the flat socket-side contact portion 6b, and the insertion of the header-side contact portion 4b is facilitated.

  In the first modified example, the socket-side contact portion 6b ′ has a shape that is linearly bent right and left around the apex as in an isosceles triangle in a side view, but is curved toward the header 2 side. If it does, you may bend in circular arc shape.

  Next, a second modification of the first embodiment will be described with reference to FIGS. The inter-board connector of the second modified example is different from the first embodiment in the shape of the socket side contact portion 6b "of the socket contact 6". Specifically, as shown in FIG. 10C, the socket-side contact portion 6b ″ is bent into a flat V-shape when viewed from the axial direction by pressing.

  In the second modification, the socket side contact portion 6b ″ is processed into the above shape, and the width of the long hole 6d ″ is narrower than that of the flat plate. Other parts are the same as those of the socket contact 6 of the first embodiment.

  Here, due to the narrow pitch of each contact, the width of a punch (not shown) for processing a long hole becomes very narrow, and it may be difficult to maintain the strength of the punch. However, in the case of this second modification, a long hole 6d ″ having a desired width can be formed by processing a long hole using a wide punch and processing it into a V shape. it can.

In the second modification, the flat socket-side contact portion is processed into the above shape, but by further processing into a mountain shape in a side view, a shape like the socket-side contact portion 6b ′ of the first modification is obtained. It can also be.
Next, the board | substrate connector 11 of 2nd Embodiment of this invention is demonstrated with reference to FIGS.

  FIG. 11 shows a state in which the circuit boards are connected by the board-to-board connector according to the second embodiment of the present invention. As shown in FIG. 11, the inter-board connector 11 includes a header 12 mounted on the circuit board S1 and a socket 13 mounted on another circuit board S2. By connecting the header 12 and the socket 13, both circuit boards S1 and S2 are electrically connected.

  12A is a plan view of the header 12, and FIG. 12B is a side view of the header 12. As shown in FIGS. 12A and 12B, the header 12 includes a plurality of conductive first type header contacts 14A and a plurality of second type header contacts 14B arranged in a direction perpendicular to the length direction. An insulating header body 15 that supports the header contacts 14A and 14B is provided.

  Here, the arrangement of the header contacts 14 </ b> A and 14 </ b> B is configured by two rows extending in the length direction of the header 12. Each row is configured by alternately arranging header contacts 14A and 14B at a predetermined pitch P. As the pitch P, for example, 0.35 [mm] is applicable. In addition, the header contacts 14A and 14B in the other row are opposed to the header contacts 14A and 14B in the other row, respectively. Each header contact 14A and 14B is covered with an insulating resin constituting the header body 15 except for a predetermined portion.

  The header body 15 has a substantially plate shape having a predetermined length, width, and thickness (height). The length direction and the width direction of the header body 15 coincide with the length direction of each row of the header contacts 14A and 14B and the direction of the interval between the rows, respectively. Each header contact 14 </ b> A and 14 </ b> B is disposed along the width direction of the header body 15.

  The socket side, which is the side facing the socket 13 of the header body 15, is configured by a recessed portion 15 a that faces the socket 13 when the header 12 and the socket 13 are connected, and peripheral walls 15 b and 15 c that surround the periphery of the recessed portion 15 a. Is done. When the header 12 and the socket 13 are connected, the socket 13 is fitted into a recessed portion 15a formed by the peripheral walls 15b and 15c.

  The peripheral walls 15c on both sides in the length direction of the header body 15 have the same height as the thickness of the socket body 17 of the socket 13 (see FIG. 15B). The intermediate portion of the peripheral wall 15b has a low height, which is convenient for removing the socket 13 fitted in the recess.

  At both ends in the length direction of the recessed portion 15 a, header side engaging portions 15 d for fixing the socket 13 to the header 12 when the header 12 and the socket 13 are connected are provided. The header side engaging portion 15d has a shape in which a cross section perpendicular to the width direction of the header body 15 protrudes in an L shape from the recessed portion 15a of the header body 15, and a socket side engaging portion 17d (FIG. 15) described later. And the socket 13 is fixed to the header 12 by being engaged.

  12C is a cross-sectional view taken along the line CC of FIG. 12A. As shown in FIG. 12C, each of the header contacts 14A and 14B includes a header side substrate connecting portion 14c connected to the circuit pattern of the circuit board S1 (see FIG. 11), and a header side contact portion 14b protruding to the socket side. Is provided. The header contacts 14 </ b> A and 14 </ b> B are covered with the resin of the header body 15 except for the header-side board connecting portion 14 c and a portion adjacent to the header-side substrate connecting portion 14 c and the main portion on the tip side of the header-side contact portion 14 b.

  The header body 15 is formed by insert molding using the header contacts 14A and 14B as an insert material. The header side contact portion 14b and the header side substrate connection portion 14c are covered with gold plating applied after the header body 15 is formed. The header-side board connecting portion 14c protrudes slightly to the circuit board S1 side from the circuit board S1 side face of the header body 15 so that the face on the circuit board S1 side can be connected to the circuit pattern of the circuit board S1. .

  13A is a plan view of the header contact 14A, FIG. 13B is a side view thereof, and FIG. 13C is a front view of the header contact 14c viewed from the header side substrate connecting portion 14c side. As shown in FIG. 13A, the header-side contact portion 14b has a substantially rectangular cross section, and both side surfaces on the long side of the rectangular shape at the tip end side are surfaces that come into contact with the socket contact. The tip side of the header side contact portion 14b is a chamfered portion that is inclined with respect to the insertion direction in order to assist the header side contact portion 14b being inserted inside a socket side contact portion 16b (see FIG. 16A) described later. 14f is formed.

  The header-side contact portion 14b has a tip portion 14g that protrudes from the socket-side contact portion 16b (see FIG. 17C) when inserted into the corresponding socket-side contact portion 16b. The header-side contact portion 14b is configured as a portion of the header contact 14 that is exposed from the header body 15 when the header body 15 is formed by insert molding.

  The header side contact portion 14b has a constricted portion 14h as a narrow portion having a narrow width adjacent to the proximal end side of the portion corresponding to the distal end portion 14g. The constricted portion 14h partially eliminates elastic deformation of the header side contact portion 14b described later when the tip portion 14g protrudes from the socket side contact portion 16b.

  The header-side contact portion 14b has an axis along the thickness direction of the header body 15 with respect to the direction from the header-side board connecting portion 14c side to the tip side of the header contact 14A along the width direction of the header body 15. As a center, it is inclined counterclockwise by a predetermined acute angle θ. The value of the acute angle θ and the inclination of the chamfered portion 14f are determined so that the header side contact portion 14b is appropriately inserted inside the socket side contact portion 16b while causing appropriate elastic deformation.

  14A is a plan view of the header contact 14B, FIG. 14B is a side view thereof, and FIG. 14C is a front view of the header contact 14c viewed from the header side substrate connecting portion 14c side. 14A to 14C, the same elements as those in FIGS. 13A to 13C are denoted by the same reference numerals. The header side contact portion 14b of the header contact 14B has the same configuration as the header side contact portion 14b of the header contact 14.

  However, the header side contact portion 14b of the header contact 14B has a different inclination direction from the header side contact portion 14b of the header contact 14A. That is, the header-side contact portion 14b of the header contact 14B extends in the thickness direction of the header body 15 with respect to the direction from the header-side board connection portion 14c side of the header contact 14B toward the distal end side along the width direction of the header body 15. It is inclined clockwise by a predetermined acute angle θ around the axis along.

  FIG. 15 is a plan view of the socket 13, and FIG. 15B is a cross-sectional view taken along the line BB. As shown in FIGS. 15A and 15B, the socket 13 includes a plurality of conductive socket contacts 16 arranged at the same pitch P as the header contacts 14A and 14B in the length direction, and the socket contacts 16 are connected to each other. And an insulating socket body 17 to be supported.

  The socket contact 16 has a shape corresponding to both the header contacts 14 </ b> A and 14 </ b> B, 20 rows form one row, and two rows are provided on the socket body 17. The orientation of the socket contacts 16 in each row is symmetric. Each socket contact 16 is covered with an insulating resin constituting the socket body 17 except for a predetermined portion.

  The socket body 17 has a substantially plate shape having a predetermined length, width and thickness (height), and is formed so as to be able to fit into the above-described recessed portion 15a. The length direction and the width direction of the socket body 17 coincide with the row direction of the arrangement of the socket contacts 16 and the separation direction of each row, respectively. The socket contact 16 extends along the width direction of the socket body 17.

  At both ends of the socket body 17, socket-side engagement portions 17 d that engage with the header-side engagement portions 15 d of the header 12 are provided to fix the socket 13 to the header 12 when the header 12 and the socket 13 are connected. It is done. Each socket-side engaging portion 17d is different from the header-side engaging portion 15d so that the header-side engaging portion 15d can be engaged with the corresponding header-side engaging portion 15d when the header 12 and the socket 13 are pressed in the connecting direction. It has an L-shaped cross-section with the orientation reversed.

  The socket body 17 is provided with a plurality of openings 17e penetrating in the thickness direction and having a substantially rectangular cross-sectional shape. Each opening 17e is provided at a position corresponding to a later-described plated portion 16f (see FIG. 16A) of each socket contact 16.

  FIG. 15C is a cross-sectional view taken along the line CC of FIG. 15A. As shown in FIG. 15C, the socket contact 16 is covered with the resin of the socket body 17 except for a predetermined portion. The socket body 17 is formed by insert molding using the socket contact 16 as an insert material.

  16A is a plan view of the socket contact 16, and FIG. 16B is a side view thereof. As shown in FIG. 6A, the socket contact 16 extends in the length direction and is parallel to the plate surface of the socket body 17 and has an annular socket-side contact portion 16b and a circuit board S2 (see FIG. 11). And the socket-side board connecting portion 16c connected to the circuit pattern of FIG.

  The socket side contact part 16b has the socket side contact surface 16e corresponding to each header side contact part 14b of the header side contact part 14b of the header contact 14A or 14B inside. That is, a long hole 16d extending in the length direction is provided at the center of the annular socket side contact portion 16b, and inner walls on both sides along the length direction constitute the socket side contact surface 16e. To do.

  The socket contact 16 is covered with the resin of the socket body 17 except for the socket-side board connecting portion 16c and a portion adjacent to the socket-side substrate connecting portion 16c and the plated portion 16f around the long hole 16d. The socket side substrate connecting portion 16c and the plated portion 16f are covered with gold plating after the socket body 17 is formed by insert molding using the socket contact 16 as an insert material.

  As shown in FIG. 11, the socket-side board connecting portion 16c has a circuit board slightly more than the circuit board S2 side surface of the socket body 17 so that the circuit board S2 side surface can be connected to the circuit pattern of the circuit board S2. Projects to the S2 side. The socket side contact portion 16 b is located between both plate surfaces of the socket body 17. The socket contact 16 is bent in a crank shape between the socket side contact portion 16b and the socket side substrate connection portion 16c so that the socket side contact portion 16b is disposed at this position.

  As described above, the header side contact portion 14 b is inclined by a predetermined acute angle θ with respect to the width direction of the header body 15. Therefore, in the posture state immediately before the socket 13 is pressed and connected to the header 12 in the connection direction, each header side contact portion 14b is in the connection direction with respect to the socket side contact surface 16e of the corresponding socket side contact portion 16b. It is in a state where it is inclined by an acute angle θ around the axis line along.

  Each header side contact portion 14b is elastically deformed so that the inclination of the acute angle θ is reduced by the chamfered portion 14f when the socket 13 is pressed against the header 12 in the connecting direction, and is inserted into the corresponding socket side contact portion 16b. Configured to be This elastic deformation is an elastic deformation in which the header side contact portion 14b is twisted around an axis along the connection direction. By insertion with this elastic deformation, the header side contact part 14b contacts the socket side contact surface 16e of the socket side contact part 16b, and the electrical connection of the header 12 and the socket 13 is established.

  In order to absorb the distortion generated in the socket body 17 due to the insertion of the header side contact portion 14b into the socket side contact portion 16b at this time, the portion between the adjacent socket contacts 16 on both plate surfaces of the socket body 17 is not provided. 15B and 18A, a V-shaped groove 17c that is long in the width direction of the socket body 17 is provided.

  The groove 17c prevents the portion of the socket body 17 between the adjacent socket contacts 16 from rising after the header side contact portion 14b is inserted into the socket side contact portion 16b. Instead of the groove 17c, a slit as a through groove penetrating the socket body 17 may be provided, and this slit may perform the same function as the groove 17c.

  FIG. 18A shows an enlarged part of FIG. 15B. As illustrated in FIG. 18A, a gap 17 f is provided between the side surface of the socket side contact portion 16 b of the socket contact 16 and the socket body 17. The gap 17f absorbs deformation of the socket side contact portion 16b when the header side contact portion 14b (see FIGS. 13 and 14) of the header contact 14A or 14B is inserted between the socket side contact surfaces 16e of the socket side contact portion 16b. In addition, the socket body 17 has a function of preventing distortion. The width of the gap 17f can be set to 0.01 [mm], for example.

  In addition, inclined surfaces 16g are provided on both sides of the socket side contact portion 16b in contact with the socket body 17 on both sides in the thickness direction. The inclined surface 16g corresponds to an arc shape in a sectional view or a linear shape. Further, the inclined surface 16g may be a “sag” that is generated when the socket contact 16 is formed by a so-called flat pressing method that is a punching process in which no burr is generated on both surfaces.

  The gap 17f can be formed when the socket body 16 is inserted and the socket body 17 is injection molded. That is, at the time of injection molding, as shown in FIG. 18B, the insert 21 is inserted between the socket side contact surfaces 16e of the socket contacts 16, and the molding material is injected while expanding the socket side contact portions 16b by the gaps 17f on both sides. .

  Then, after the molding material is solidified, the insert 21 is pulled out. At this time, due to the elasticity of the socket contact 16, the socket-side contact portion 16b contracts in the width direction by the gap 17f on both sides. Thereby, the gap 17f is formed. Further, a minute gap is formed between the inner wall of the socket body 17 adjacent to the gap 17f in the thickness direction of the socket body 17 and the corresponding inclined surface 16g.

  Next, an operation when the header 12 and the socket 13 are attached and detached will be described. First, the surface of the header 12 on the side shown in FIG. 12A is opposed to the surface on the side of the socket 13 shown in FIG. 15A, and both ends of the socket body 17 are opposed to the peripheral walls 15 b and 15 c in the header body 15. Fit the parts. Thereby, the tip of the header side contact portion 14b of each header contact 14A and 14B comes into contact with the socket side contact portion 16b of the corresponding socket contact 16 and faces the elongated hole 16d.

  17A and 17B show the positional relationship of the header side contact portion 14b with respect to the socket side contact portion 16b at this time. 17A shows the positional relationship of the socket contact 16 as viewed from the socket-side board connecting portion 16c side, and FIG. 17B shows the positional relationship as viewed from the header-side contact portion 14b side.

  As shown in FIG. 17A, the header-side contact portion 14b is inclined by a predetermined acute angle θ with respect to the socket-side contact surface 16e, and therefore the header-side contact portion 14b has a positional relationship as viewed from the header-side contact portion 14b side. A corner portion of the distal end portion 14g protrudes from the long hole 16d of the socket side contact surface 16e. That is, when this positional relationship is maintained, the header side contact portion 14b cannot be inserted into the long hole 16d.

  Next, the header 12 and the socket 13 are pressed against each other in the thickness direction, that is, in the connection direction. At this time, each chamfered portion 14f of the header side contact portion 14b of each header contact 14A and 14B is an end edge on the header side contact portion 14b side of the long hole 16d (the end on the header side contact portion 14b side of the socket side contact surface 16e). Slide in contact with the edge. As a result, a force that twists in the direction in which the predetermined angle θ is reduced acts on the tip of the header side contact portion 14b, so that the header side contact portion 14b is twisted around the axis along the connection direction. Cause elastic deformation.

  Thereby, the front end part 14g of the header side contact part 14b becomes a posture state in which it can be inserted into the long hole 16d, and is inserted into the long hole 16d. The portion also slides with the corresponding socket-side contact surface 16e.

  In parallel with this, the socket side contact portion 16b is deformed and spreads in the width direction. At that time, since the deformation is absorbed by the gap 17f, distortion of the socket body 17 due to the deformation is suppressed. At this time, since there is a gap 17f between the inclined surface 16g of the socket side contact portion 16b and the inner wall of the socket body 17, the corner portion of the socket side contact portion 16b is hooked on the inner wall and the socket side contact portion. The spread of 16b is not hindered.

  When insertion of the header side contact portion 14b into the long hole 16d proceeds and the plate surface on the header 12 side of the socket body 17 contacts the recessed portion 15a of the header body 15, the tip end portion 14g of the header side contact portion 14b It will be in the state protruded from the socket side contact part 16b. That is, the constricted portion 14h of the header side contact portion 14b reaches the end edge on the connection direction side of the long hole 16d (the end edge on the connection direction side of the socket side contact surface 16e), and the constriction portion 14h on one side of each constricted portion 14h. The end edge comes into contact with the socket side contact surface 16e of the long hole 16d.

  17C and 17D show a state in which the constricted portion 14h is in contact with the socket side contact surface 16e. As shown in FIG. 17C and FIG. 17D, when this state is reached, the elastic deformation is slightly restored and the twist is slightly eliminated. Thereby, each header side contact part 14b becomes difficult to remove | deviate from the long hole 16d of the corresponding socket side contact part 16b, and is reliably fixed to the socket side contact part 16b.

  At the same time as this state is reached, each socket-side engagement portion 17 d of the socket body 17 is engaged with each header-side engagement portion 15 d of the header body 15, and the socket body 17 is fixed to the header body 15.

  Thereby, the electrical connection between the header 12 and the socket 13 is completed. When releasing this connection, it is easy to apply force to the side surface of the socket body 17 corresponding to the portion where the height of the peripheral wall 15b of the header body 15 is lowered, and pull the socket body 17 away from the header body 15. The socket 13 can be separated from the header 12 and the connection can be released.

  As described above, according to the present embodiment, the socket contact 16 has a simple configuration in which the annular socket-side contact portion 16b having the socket-side contact surface 16e and the socket-side substrate connection portion 16c are provided. Have. Further, the header contacts 14A and 14B need only have a simple configuration in which the header side contact portion 14b having the header side contact portion 14b and the chamfered portion 14f and the header side substrate connection portion 14c are provided. Therefore, it is possible to easily achieve a further reduction in height and pitch of the inter-board connector 11.

  Further, the header contacts 14A and 14B and the socket contact 16 are covered with the resin of the header body 15 or the socket body 17 except for main parts. As a result, the support strength of the header contacts 14A and 14B by the header body 15 and the support strength of the socket contacts 16 by the socket body 17 are increased, and the insulation between the adjacent header contacts 14A and 14B and between the socket contacts 16 is well maintained. it can. Therefore, further reduction in height and narrow pitch can be achieved more easily.

  Since the header contacts 14A and 14B and the socket contact 16 are covered with resin except for necessary portions, the header 12 and the socket 13 are mounted with the header 12 or the socket 13 mounted on the circuit boards S1 and S2, respectively. Even if dust enters between them, the insulating property is not impaired.

  Further, in the portion of the socket body 17 between the adjacent socket side contact portions 16b, the header body contact portion 14b of the header contacts 14A and 14B is inserted into the socket side contact portion 16b of the socket contact 16, so that the socket body 17 is obtained. A groove 17c is provided to absorb the distortion of the portion. Thereby, the expansion of the portion of the socket body 17 can be prevented and the insertion can be performed smoothly. Therefore, narrowing of the pitch can be further promoted.

  In addition, since the socket body 17 is formed by insert molding using the socket contact 16 as an insert material, the plated portion 16f of the socket contact 16 is covered by plating, so that a plated coating can be easily applied only to the plated portion 16f. The cost of the plating material can be greatly reduced.

  Similarly, since the header body 15 is formed by insert molding using the header contacts 14A and 14B as an insert material, the header side contact portion 14b and the header side substrate connection portion 14c are plated, so that the same effect can be obtained. Can be obtained.

  Further, the header side contact portion 14b and the socket side contact surface 16e of the socket side contact portion 16b corresponding to the header side contact portion 14b slide to each other when pressed in the connecting direction of the header 12 and the socket 13, and become the header side contact portion 14b. On the other hand, the header side contact portion 14b portion is inserted between the socket side contact surface 16e portion of the socket side contact portion 16b while causing elastic deformation to twist it. By this insertion, the header side contact portion 14b is opposed to and electrically contacts the socket side contact surface 16e. Therefore, the connection between the header 12 and the socket 13 can be established only by pressing the header 12 and the socket 13 in the connection direction. This can be achieved with a very simple configuration while realizing a low profile and a narrow pitch.

  Further, the header side contact portion 14b has a constricted portion 14h that partially eliminates the above-described elastic deformation when the tip end portion 14g of the header side contact portion 14b protrudes from the socket side contact portion 16b. The part 14b can be reliably fixed to the socket side contact part 16b. Therefore, the electrical connection between the header contacts 14A and 14B and the socket contact 16 can be reliably maintained regardless of external vibration or impact.

  In addition, the direction of twisting around the axis due to elastic deformation of the header side contact portion 14b is opposite to each other between the adjacent header contacts 14A and 14B. According to this, the direction of distortion generated around each header contact 14A and 14B due to the force causing elastic deformation of each header side contact portion 14b is opposite in the adjacent header contacts 14A and 14B. Accordingly, since such distortion is locally canceled, it is possible to prevent the header 12 from being largely distorted or displaced. In addition, since the distortion generated around each socket contact 16 is also locally canceled, it is possible to prevent the socket 13 from being largely distorted or displaced.

  Further, since the gap 17f is provided between the side surface of the socket side contact portion 16b and the socket body 17, it is possible to suppress the socket body 17 from being distorted due to the expansion of the socket side contact portion 16b. Moreover, since the inclined surface 16g is provided in the socket side contact part 16b, the expansion of the socket side contact part 16b can be smoothed and the connection between the header 12 and the socket 13 can be performed smoothly.

  Further, when the header side contact portion 14b of the header contact 14A or 14B is inserted between the socket side contact surfaces 16e of the socket side contact portion 16b, the header side contact portion 14b is elastically deformed so as to be twisted, and the socket side contact portion. 16b is elastically deformed so as to spread. For this reason, insertion between the header side contact part 14b between the socket side contact surfaces 16e can be performed smoothly, reducing the angle at which the header side contact part 14b is elastically twisted.

  Further, since the cross section on the circuit pattern P side of the header side board connecting portion 14c of the header contacts 14A and 14B and the socket side board connecting portion 16c of the socket contact 16 is an octagon, it is compared with the case where the cross section is rectangular. The amount of cream solder C that protrudes from the board connection portion can be reduced. Therefore, it is possible to prevent a short circuit from occurring due to the molten solder C ′ of adjacent board connection portions connected in the reflow process.

  Next, a modification of the second embodiment will be described with reference to FIGS. 19A to 19C show a header contact 14A 'that can be used in place of the header contact 14A of FIGS. 13A to 13C. 20A-C show a header contact 14B 'that can be used in place of the header contact 14B of FIGS. 19 and 20, the same reference numerals as those in FIGS. 13 and 14 are assigned to the same elements as those in FIGS. 13 and 14. FIG. 21 is a diagram showing the shape of the header contact which is the main part of the modification.

  As shown in FIG. 19, the header side contact portion 14b ′ in the header contact 14A ′ has a header side contact portion 14b ′ having no constriction like the constricted portion 14h in the header contact 14 in FIG. 13B. Have. That is, as shown in FIG. 19B, the header-side contact portion 14b ′ is narrower at the base end side at the tip end portion 14g, but from the portion, the neck-like constriction Without forming a straight line.

  Also in the case of the header contact 14B 'of FIG. 20, the header side contact portion 14b' is configured similarly to the header contact 14A '. Other points of the header contacts 14A 'and 14B' are the same as those of the header contacts 14A and 14B of FIGS. The header contacts 14A 'and 14B' are connected to the socket contact 16 in the same manner as the header contacts 14A and 14B.

  According to the header contacts 14A ′ and 14B ′, since the constricted portion 14h of the header contacts 14A and 14B does not exist, the return amount of the elastic deformation described above with reference to FIGS. 17A to 17D is larger than that of the header contacts 14A and 14B. There are few. However, since the constricted portion 14h does not exist, the header-side contact portion 14b is more resistant to twisting when inserted between the socket-side contact surfaces 16e of the socket contact 16 than the header contacts 14A and 14B.

  In addition, this invention is not limited to the above-mentioned embodiment. For example, gold plating on a predetermined portion of the header contacts 14A and 14B or the socket contact 16 may be performed before the header body 15 or the socket body 17 is molded.

  Further, the cross-sectional shapes of the header-side board connecting portion 14c and the socket-side board connecting portion 16c are not limited to the octagonal shape, but are substantially V-shaped as shown in FIG. 22A, rhombus-like as shown in FIG. 22B, and as shown in FIG. It may be a heart shape. Further, it may be a hexagonal shape or other polygonal shapes as shown in FIG. 22D. In other words, any shape may be used as long as the cream solder C is held and fastened on the circuit pattern P side of the header side substrate connection portion 14c or the socket side substrate connection portion 16c.

  When the cross-sectional shape of the header-side board connecting portion 14c or the socket-side board connecting portion 16c is V-shaped or heart-shaped, the member portion corresponding to the header-side board connecting portion 14c or the socket-side board connecting portion 16c is set to V By pressing with a letter-shaped mold, it can be easily processed into these shapes.

  Further, the connection between the header side substrate connecting portion 14c or the socket side substrate connecting portion 16c and the circuit pattern P may be performed manually using a soldering iron. Also in this case, if the cross-sectional shape of the header-side board connecting portion 14c or the socket-side board connecting portion 16c has an uneven shape that can hold and fasten the solder as described above, the above reflow method is used. The same short-circuit prevention effect as that for connection can be obtained.

  Further, the header side contact portion 14 b may be configured to be parallel to the width direction of the header body 15, and the socket side contact surface 16 e of the socket side contact portion 16 b may be inclined with respect to the width direction of the socket body 17. .

  That is, when the header-side contact portion 14b and the corresponding socket-side contact surface 16e press the header 12 and the socket 13 in the connection direction, the header-side contact portion 14b and the corresponding socket-side contact surface 16e slide relative to each other. What is necessary is just to be comprised so that it may mutually oppose and electrically contact, producing the elastic deformation | transformation twisted around.

  Next, an inter-board connector according to a third embodiment of the present invention will be described with reference to FIGS. In addition, about the structure similar to the said embodiment, the code | symbol similar to the said embodiment is attached | subjected, and detailed description is abbreviate | omitted. As shown in FIG. 23A, the header contact 24 in the third embodiment includes a header side main body 24a that is embedded and fixed in the header body 5 (see FIG. 1), and a header that protrudes from the header side main body 24a to the socket 3 side. A side contact portion 24b and a header side substrate connection portion 24c protruding from the header side main body 24a to the side of the header body 5 are provided.

  As shown in FIG. 23C, the header side contact portion 24b is curved in the width direction in plan view. This curved shape is formed by pressing when the header contact 24 is punched from the material. Further, as shown in FIG. 23A, an engagement portion 24d is provided on the header side substrate connection portion 24c side in the longitudinal direction of the header contact 24 (left and right direction in FIG. 23A).

  As shown in FIG. 23E, the header-side board connecting portion 24c has a concavo-convex process on the surface to be soldered to the circuit board S1 (see FIG. 1). In the third embodiment, a plurality of wedge-shaped grooves 24e are formed in the axial direction of the header-side substrate connecting portion 24c, and the amount of cream solder accommodated is increased. Further, as shown in FIG. 23F, the wedge-shaped groove 24e may be formed so as to cross the surface of the header side substrate connecting portion 24c.

  Here, the header contact 24 ′ in FIG. 23D is a modification in which the curvature of the arc-shaped portion of the header side contact portion 24 b ′ is formed larger than that of the header contact 24 shown in FIG. 23C. Other configurations of the header contacts 24, 24 'are the same as those of the header contact 4 of the first embodiment.

  As shown in FIGS. 24A to 24D, the socket contact 26 according to the third embodiment includes a socket side main body 26 a that is embedded and fixed in the socket body 7 (see FIG. 1), and the socket side main body 26 a to the socket body 7. A socket-side contact portion 26b extending along the width direction and a socket-side board connecting portion 26c protruding from the socket-side main body 26a to the side of the socket body 7 are provided.

  As shown in FIG. 24A, the socket-side contact portion 26b has an oval shape in which a long hole 26d is provided in the center portion in a plan view, and has a shape curved in the width direction. In the present embodiment, the center 26i of the curved portion has an arc shape, but the socket side contact portion 26b has a shape bent linearly as a whole. Thereby, the long hole 26d of the socket side contact portion 26b is also bent in a straight line except for the central portion.

  As shown in FIG. 24B, the socket-side board connecting portion 26c has a plurality of wedge-shaped grooves 26f formed on the surface to be soldered to the circuit board S2 (see FIG. 1) in the same manner as the header-side board connecting portion 24c. Yes. Further, the long hole 26d of the socket side contact portion 26b is chamfered 26e as shown in FIG. 24A and the like.

  Here, the socket contact 26 ′ in FIG. 24C is a modification in which the curved shape of the socket side contact portion 26b ′ and the long hole 26d ′ is not a bent shape as shown in FIG. 24A but a curved shape in an arc shape. It is. Other configurations of the socket contacts 26 and 26 'are the same as those of the socket contact 6 of the first embodiment.

  Next, in the inter-board connector of the third embodiment, the connection state between the header contacts 24, 24 'and the socket contacts 26, 26' will be described with reference to FIG. FIG. 25A shows a state in which the header contact 24 shown in FIG. 23C and the socket contact 26 shown in FIG. 24A are connected.

  In the example shown in FIG. 25A, the curvature of the arc-shaped portion of the header side contact portion 24b is smaller than the curvature of the long hole 26d of the socket side contact portion 26b. Thus, the left portion of the header side contact portion 24b in FIG. 25A contacts the bent portion of the long hole 26d of the socket contact 26, and the right portion of the header side contact portion 24b in FIG. Is in contact with two locations on the inner peripheral surface of.

  FIG. 25B shows a state in which the header contact 24 ′ shown in FIG. 23D and the socket contact 26 ′ shown in FIG. 24C are connected. In the example shown in FIG. 25B, the curvature of the arc-shaped portion of the header side contact portion 24b 'is larger than the curvature of the long hole 26d' of the socket side contact portion 26b '.

  As a result, the left portion of the header side contact portion 24b ′ in FIG. 25B comes into contact with two locations on the inner peripheral surface of the long hole 26d ′ of the socket contact 26 ′, and the right portion of the header side contact portion 24b ′ in FIG. 25B. Are in contact with two locations on the inner peripheral surface of the long hole 26d ′ of the socket contact 26 ′.

  Thus, in 3rd Embodiment and its modification, since both header side contact part 24b, 24b 'and socket side contact part 26b, 26b' are curving in the width direction, both become a multipoint contact and are conductive. The reliability can be improved and the connection strength can also be improved.

  In the third embodiment, the header contact 24 and the socket contact 26 ′ may be combined, or the header contact 24 ′ and the socket contact 26 may be combined. Further, the header contacts 24 and 24 'of the third embodiment can be combined with the socket contacts 6, 6', 6 "of the first embodiment, and can be combined with the socket contact 16 of the second embodiment. The socket contacts 26 and 26 'of the third embodiment can be combined with the header contact 4 of the first embodiment and the header contact 14 of the second embodiment.

  Also in the third embodiment, as shown in FIGS. 10A to 10C, the socket side contact portions 26b and 26b ′ of the socket contacts 26 and 26 ′ are V-shaped or U-shaped when viewed from the axial direction. It may be curved.

  Next, a modification of the board connecting portion of the connector as the electronic device will be described with reference to FIG. FIG. 26A is a modification 34c of the header-side board connecting portion of the header contact 4 in the first embodiment. The header-side board connecting portion 34c is formed in a plate shape and is pressed into a shallow U shape when viewed in the axial direction. The header-side board connecting portion 34c is formed with a communication hole 34d that communicates the front and back.

  According to the header side substrate connecting portion 34c, when placed on the cream solder (not shown) applied to the circuit pattern of the circuit board, the header side substrate connecting portion 34c has a shallow U shape when viewed in the axial direction. Since it is formed, the amount of cream solder pushed out in the width direction of the header side board connecting portion 34c is reduced. Further, the cream solder in the portion of the communication hole 34d is pushed out from the communication hole 34d to the surface side of the header side substrate connection portion 34c. As a result, the amount of cream solder pushed out in the width direction of the header-side board connecting portion 34c can be reduced, so that even a narrow-pitch connector can prevent solder bridging between contacts.

  FIG. 26B is a modification 36c of the socket-side board connecting portion of the socket contact 6 in the first embodiment. The socket-side board connecting portion 36c is formed in a plate shape and is pressed into a shallow V shape when viewed in the axial direction. The socket-side board connecting portion 36c is formed with a communication hole 36d that communicates the front and back. Similarly to the header-side board connecting portion 34c, the socket-side board connecting portion 36c can also prevent solder bridging between contacts.

  FIG. 26C is a modification 44c of the header-side board connecting portion of the header contact 4 in the first embodiment. The header-side substrate connecting portion 44c is formed in a plate shape and is pressed into an inverted U shape when viewed in the axial direction. FIG. 26D is a modification 46c of the socket-side board connecting portion of the socket contact 6 according to the first embodiment. The socket side substrate connecting portion 46c is formed in a plate shape and is pressed into an inverted V shape when viewed in the axial direction.

  According to the header-side board connecting portion 44c and the socket-side board connecting portion 46c having the above shapes, the surface facing the circuit board is inverted U-shaped when placed on the cream solder applied to the circuit pattern of the circuit board. Or since it is recessed in reverse V shape, cream solder will be pushed in into the inside of the hollow and the amount which protrudes from the width direction of each connection part will decrease. Therefore, even with this configuration, it is possible to prevent solder bridging between the contacts.

  In addition, each shape in the said modification is not restricted to a header contact or a socket contact, What kind of shape may be applied if it is a contact of the electronic device soldered on a printed circuit board. In addition, the bending amount and the angle may be slightly changed for the U-shaped and V-shaped shapes. Further, in the case of the shape having the communication holes 34d and 36d, the header side board connecting portion 34c and the socket side board connecting portion 36c may be flat, and the direction of the bending process is reverse as shown in FIGS. 26C and 26D. It may be.

DESCRIPTION OF SYMBOLS 1,11 ... Board-to-board connector, S1, S2 ... Circuit board, 2, 12 ... Header, 3, 13 ... Socket, 4, 4 ', 14, 24 ... Header contact, 4b, 14b, 24b ... Header side contact part, 4c, 14c, 24c, 34c, 44c ... Header side board connection part, 6, 6 ', 6 "... Socket contact, 6b, 16b, 26b ... Socket side contact part, 6c, 16c, 26c, 36c, 46c ... Socket side Board connection.

An object of the present invention, the conventional view of the problems of the art and to provide a board-to-board connector which can easily achieve further reduction in height and narrower pitch. Another object of the present invention is to provide a board-to-board connector that can maintain high connection strength even when the pitch is narrowed. Another object of the present invention is to provide an electronic device contact including an inter-board connector that can easily achieve a narrow pitch.

The present invention includes a header mounted on a circuit board and a socket mounted on another circuit board, and the header and the socket face each other in a predetermined posture and are electrically connected by pressing in a connection direction. The header includes an insulating header body and a plurality of conductive header contacts fixed to the header body and connected to the socket side, and the socket has an insulating property. A socket body, and a plurality of conductive socket contacts fixed to the socket body and connected to the header contact, the header contact protruding toward the socket side and contacting the socket contact; A header-side board connecting portion that protrudes from the header body and is connected to the circuit board. The socket includes a socket-side contact portion that contacts the header-side contact portion, and a socket-side substrate connection portion that protrudes from the socket body and is connected to the other circuit board, and the socket-side contact portion has a through hole. The header side contact portion is inserted into the through hole, the header side contact portion is elastically contacted and connected to the through hole, and the socket side contact portion is plate-shaped in the width direction of the socket contact. Is long in the axial direction, and is curved toward the header side in a side view .

In the present invention, the socket-side contact portion, than the width direction of the socket contact in the plate are elongated in the axial direction, and is curved toward the header side as viewed from the side.

According to another aspect of the present invention , a header mounted on a circuit board and a socket mounted on another circuit board are provided, the header and the socket are opposed to each other in a predetermined posture and pressed in a connection direction. The header is provided with an insulating header body and a plurality of conductive header contacts fixed to the header body and connected to the socket side; The socket includes an insulating socket body and a plurality of conductive socket contacts fixed to the socket body and connected to the header contact. The header contact protrudes toward the socket side and contacts the socket contact. A header-side contact portion, and a header-side substrate connecting portion that protrudes from the header body and is connected to the circuit board, The socket contact includes a socket side contact portion that contacts the header side contact portion, and a socket side substrate connection portion that protrudes from the socket body and is connected to the other circuit board, and the socket side contact portion is a through hole. The header side contact portion is inserted into the through hole, the header side contact portion is elastically contacted with and connected to the through hole, and the socket side contact portion is plate-shaped and has a width of the socket contact. It is longer in the axial direction than the direction, and is curved in a V shape or a U shape from the center of the through hole as viewed in the axial direction .

According to another aspect of the present invention , a header mounted on a circuit board and a socket mounted on another circuit board are provided, the header and the socket are opposed to each other in a predetermined posture and pressed in a connection direction. The header is provided with an insulating header body and a plurality of conductive header contacts fixed to the header body and connected to the socket side; The socket includes an insulating socket body and a plurality of conductive socket contacts fixed to the socket body and connected to the header contact. The header contact protrudes toward the socket side and contacts the socket contact. A header-side contact portion, and a header-side substrate connecting portion that protrudes from the header body and is connected to the circuit board, The socket contact includes a socket side contact portion that contacts the header side contact portion, and a socket side substrate connection portion that protrudes from the socket body and is connected to the other circuit board, and the socket side contact portion is a through hole. The header side contact portion is inserted into the through hole, the header side contact portion is elastically contacted with and connected to the through hole, and the socket side contact portion is plate-shaped and has a width of the socket contact. It is longer in the axial direction than the direction, and is curved in the width direction of the socket contact in plan view . According to the said structure, the length of a through-hole can be lengthened compared with the shape where the socket side contact part is not curving. As a result, the connection strength between the socket-side contact portion and the header-side contact portion can also be weakened. Therefore, if the connection strength between the socket contact and the header contact is too high, this can be adjusted to an appropriate connection strength. it can.

According to another aspect of the present invention , a header mounted on a circuit board and a socket mounted on another circuit board are provided, the header and the socket are opposed to each other in a predetermined posture and pressed in a connection direction. The header is provided with an insulating header body and a plurality of conductive header contacts fixed to the header body and connected to the socket side; The socket includes an insulating socket body and a plurality of conductive socket contacts fixed to the socket body and connected to the header contact. The header contact protrudes toward the socket side and contacts the socket contact. A header-side contact portion, and a header-side substrate connecting portion that protrudes from the header body and is connected to the circuit board, Serial socket contact includes a socket-side contact portion in contact with said header side contacting portion, and a socket-side board connecting portion to be connected from the socket body to protrude said other circuit board, the through-hole, the socket contact The header-side contact portion is curved in the width direction in plan view, and when inserted into the through-hole, the header-side contact portion is in the width direction of the through-hole. It contacts the both internal peripheral surfaces of this. According to this configuration, the header side contact portion and the inner peripheral surface of the elongated hole come into contact at a plurality of locations, so that the connection reliability is improved and the connection strength between the socket contact and the header contact is also improved. Can do.

According to another aspect of the present invention , a header mounted on a circuit board and a socket mounted on another circuit board are provided, the header and the socket are opposed to each other in a predetermined posture and pressed in a connection direction. The header is provided with an insulating header body and a plurality of conductive header contacts fixed to the header body and connected to the socket side; The socket includes an insulating socket body and a plurality of conductive socket contacts fixed to the socket body and connected to the header contact. The header contact protrudes toward the socket side and contacts the socket contact. A header-side contact portion, and a header-side substrate connecting portion that protrudes from the header body and is connected to the circuit board, Serial socket contact includes a socket-side contact portion in contact with said header contact part, wherein a socket-side board connecting portion to be connected from the socket body to protrude said other circuit board, said header-side contact portion plane The through hole is inclined with respect to the axis of the header contact in a view, and the axial length of the socket contact is longer than the header side contact part, and the width of the through hole is an inclined width of the header side contact part in plan view It is characterized by being narrower than .

Moreover, in this invention, it is preferable that the said socket side board | substrate connection part or the said header side board | substrate connection part is formed in the uneven | corrugated shape in the surface facing the said circuit board. As the uneven shape, it is preferable that the surface of the substrate connecting portion facing the circuit board is formed in a V shape in the axial direction or a trapezoidal shape on the circuit board side .

According to this configuration, when the board connecting portion is soldered to the pattern of the circuit board, the cream solder is absorbed in the uneven shape and the amount protruding in the width direction is reduced. In addition, even if cream solder is melted in this state, the melted solder is difficult to spread in the width direction, so that bridges between adjacent contacts are unlikely to occur. Therefore, it is particularly effective for the contact of a connector with a narrow pitch, and can be used for an inter-board connector soldered to a circuit board.

Moreover, in this invention, it is preferable that the said socket side board | substrate connection part or the said header side board | substrate connection part forms the one or several uneven | corrugated shape in the axial direction in the surface facing the said circuit board. In this way, the amount of protrusion of cream solder is further reduced by forming not only a V shape in the axial direction or a narrow trapezoidal shape on the side of the circuit board but also forming one or more uneven shapes in the axial direction. be able to.

Moreover, in this invention, it is preferable that the said socket side board | substrate connection part or the said header side board | substrate connection part is plate shape, and the communicating hole which connects front and back is formed. Moreover, in this invention, it is preferable that the said socket side board | substrate connection part or the said header side board | substrate connection part is plate shape, and is formed in reverse U shape or reverse V shape by axial direction view.

The case of the socket-side board connecting portion or header-side board connecting portion having a communicating hole, the socket-side board connecting portion or header-side board connecting portion is placed on the solder cream applied to the pattern of the circuit board, cream solder Is extruded to the surface side of the board connecting portion through the communication hole. Further, when the socket side substrate connection portion or the header side substrate connection portion is formed in an inverted U shape or an inverted V shape in the axial direction view, the socket side substrate connection portion or the header side substrate connection portion is a circuit board. When it is placed on the cream solder applied to the pattern, the cream solder is pushed into the shape of the socket side substrate connection part or the header side substrate connection part . With these configurations, it is possible to reduce the amount of cream solder that protrudes in the width direction of the socket-side board connecting portion or the header-side board connecting portion .

As described above, according to the present embodiment, the socket contact 16 has a simple configuration in which the annular socket-side contact portion 16b having the socket-side contact surface 16e and the socket-side substrate connection portion 16c are provided. Have. Further, the header contacts 14A and 14B need only have a simple configuration in which the header side contact portion 14b having the header side contact portion 14b and the chamfered portion 14f and the header side substrate connection portion 14c are provided. Therefore, it is possible to easily achieve further reduction in the height and narrow pitch of the inter-board connector 11.

Further, the header contacts 14A and 14B and the socket contact 16 are covered with the resin of the header body 15 or the socket body 17 except for main parts. As a result, the support strength of the header contacts 14A and 14B by the header body 15 and the support strength of the socket contacts 16 by the socket body 17 are increased, and the insulation between the adjacent header contacts 14A and 14B and between the socket contacts 16 is well maintained. it can. Therefore, further reduction in height and narrowing of the pitch can be achieved more easily.

Further, the header side contact portion 14b and the socket side contact surface 16e of the socket side contact portion 16b corresponding to the header side contact portion 14b slide to each other when pressed in the connecting direction of the header 12 and the socket 13, and become the header side contact portion 14b. On the other hand, the header side contact portion 14b portion is inserted between the socket side contact surface 16e portion of the socket side contact portion 16b while causing elastic deformation to twist it. By this insertion, the header side contact portion 14b is opposed to and electrically contacts the socket side contact surface 16e. Therefore, the connection between the header 12 and the socket 13 can be established only by pressing the header 12 and the socket 13 in the connection direction. This can be achieved with a very simple configuration while realizing a low profile and a narrow pitch.

Claims (20)

A board-to-board connector that includes a header mounted on a circuit board and a socket mounted on another circuit board, and is electrically connected by pressing the header and the socket in a predetermined posture and pressing in a connection direction. Because
The header includes an insulating header body and a plurality of conductive header contacts fixed to the header body and connected to the socket side,
The socket includes an insulating socket body, and a plurality of conductive socket contacts fixed to the socket body and connected to the header contact,
The header contact includes a header side contact portion that protrudes toward the socket side and contacts the socket contact, and a header side substrate connection portion that protrudes from the header body and is connected to the circuit board.
The socket contact includes a socket side contact portion that contacts the header side contact portion, and a socket side substrate connection portion that protrudes from the socket body and is connected to the other circuit board,
The socket side contact portion has a through hole, the header side contact portion is inserted into the through hole, and the header side contact portion is elastically contacted and connected to the through hole. connector. The inter-board connector according to claim 1,
The board-to-board connector is characterized in that the socket-side contact portion is plate-shaped and is longer in the axial direction than the width direction of the socket contact, and is curved toward the header side in a side view. The board-to-board connector according to claim 1 or 2,
The socket side contact portion is formed in a plate shape and is longer in the axial direction than the width direction of the socket contact, and is curved in a V shape or a U shape from the center of the through hole as viewed in the axial direction. A board-to-board connector. The board-to-board connector according to any one of claims 1 to 3,
The socket-side contact portion is formed in a plate shape and is longer in the axial direction than the width direction of the socket contact, and is curved toward the width direction of the socket contact in a plan view. . The board-to-board connector according to any one of claims 1 to 4,
The through hole is a long hole that is long in the axial direction of the socket contact;
The header side contact portion has an engagement portion that engages with the inner peripheral surface of the through hole or the back surface of the socket side contact portion,
The inter-board connector, wherein the engaging portion is engaged with an end portion in the axial direction of the through hole. The board-to-board connector according to claim 5,
The header contacts are provided in parallel in the longitudinal direction of the header body, and are arranged in two rows in the width direction of the header body,
The board-to-board connector, wherein the engaging portions are arranged symmetrically with respect to the center in the width direction of the header body. The board-to-board connector according to any one of claims 1 to 6,
The through hole is a long hole that is long in the axial direction of the socket contact;
The header side contact portion is formed thicker than the width of the through hole,
The board-to-board connector, wherein when the header side contact portion is inserted into the through hole, the header side contact portion contacts both inner peripheral surfaces in the width direction of the through hole. The board-to-board connector according to any one of claims 1 to 6,
The through hole is a long hole that is long in the axial direction of the socket contact;
The header side contact portion is curved in the width direction in a plan view, and when inserted into the through hole, the header side contact portion is in contact with both inner peripheral surfaces in the width direction of the through hole. Characteristic board-to-board connector. The board-to-board connector according to claim 8,
The socket side contact portion is plate-like and formed longer in the axial direction than the width direction of the socket contact, and is curved toward the width direction of the socket contact in a plan view.
The header-side contact portion is curved in the same direction as the socket-side contact portion in plan view, and when inserted into the through-hole, the header-side contact portion has both inner circumferences in the width direction of the through-hole. A board-to-board connector characterized by contacting a surface. The board-to-board connector according to any one of claims 1 to 9,
The header side contact portion is inclined with respect to the axis of the header contact in plan view,
The inter-board connector is characterized in that the through hole has an axial length of the socket contact longer than the header side contact portion and a width smaller than the inclined width of the header side contact portion in plan view. The board-to-board connector according to claim 10,
The inter-board connector, wherein the header side contact portion includes an engagement portion that engages with an inner peripheral surface of the through hole or a back surface of the socket side contact portion. The board-to-board connector according to claim 10 or 11,
A plurality of the header contacts are provided in parallel in the longitudinal direction of the header body, and the header-side contact portions of adjacent header contacts are disposed so that the inclinations thereof are opposite to each other. The board-to-board connector according to any one of claims 1 to 12,
A plurality of the socket contacts are provided in parallel in the longitudinal direction of the socket body;
The inter-board connector, wherein the socket body is provided with a concave groove or a through groove between adjacent socket contacts. The board-to-board connector according to any one of claims 1 to 13,
The socket body and the header body are formed in a rectangular parallelepiped shape as a whole,
A board-to-board connector, wherein one of the socket body and the header body is provided with a receiving portion that allows the header and the socket to be attached and detached by rotating the other body. The board-to-board connector according to claim 14,
One end of the socket body or the header body is provided with both-end engaging portions that protrude toward the other body on both sides in the longitudinal direction and engage with the other body,
The inter-board connector is characterized in that the both end engaging portions have a chamfered shape that does not interfere with the other body when the header or the socket is rotated to be attached or detached. A contact for an electronic device having a board connection portion soldered to a circuit board,
The contact having the concavo-convex shape formed on the surface facing the circuit board. The electronic device contact according to claim 16, comprising:
The contact of the board connecting portion, wherein a surface facing the circuit board is formed in a V shape when viewed in the axial direction or a trapezoidal shape on the circuit board side. The electronic device contact according to claim 16 or 17,
One or more uneven | corrugated shapes are formed in the said board | substrate connection part in the axial direction in the surface facing the said circuit board, The contact characterized by the above-mentioned. The electronic device contact according to claim 16 or 17,
The contact characterized in that the substrate connecting portion is plate-shaped and has a communication hole communicating between the front and back sides. The electronic device contact according to claim 16 or 19,
The contact characterized in that the substrate connecting portion is plate-shaped and formed in an inverted U shape or an inverted V shape as viewed in the axial direction.

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