JP2016189011A - Display device and method for manufacturing the same, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display device having improved reliability.SOLUTION: A display device 1 includes: a main substrate unit 11A having a display area 10A including drive wiring; an auxiliary substrate unit 11B integrated with the main substrate unit 11A; lead-out wiring 15 connected to the drive wiring of the main substrate unit 11A and provided in the auxiliary substrate unit 11B; and a cabinet in which the main substrate unit 11A and the auxiliary substrate unit 11B are provided while folded at a border therebetween.SELECTED DRAWING: Figure 3

Description

  The present technology relates to a display device that performs display by inputting an external signal to a drive wiring in a display region, a manufacturing method thereof, and an electronic device including the display device.

  In a flat display device such as a liquid crystal display device or an electrophoretic display device, a wiring board for inputting an external signal is connected to the display panel. This signal is supplied to the drive wiring of the display panel via the wiring board. The display panel is configured to include a substrate and a display layer disposed in a central portion on the substrate, and the wiring substrate is connected to a terminal provided on a peripheral portion of the substrate (for example, Patent Literature 1). For example, an ACF (Anisotropic Conductive Film) is used to electrically connect the wiring board and the terminal by thermocompression bonding.

  Currently, a flexible wiring board (flexible wiring board) is used as the wiring board, and it is made thin and narrowed by bending it along the outer shape of the display panel in the vicinity of the connection portion with the terminal. Yes.

WO2009 / 004894

  However, when thermocompression bonding is performed on a substrate provided with a display layer, the substrate and the display layer may be deteriorated. Further, when the wiring board is bent, a repulsive force (spring back) of the wiring board is generated, and the spring back may cause a disconnection between the terminal (board) and the wiring board, and the reliability of the display device is lowered.

  The present technology has been made in view of such problems, and its purpose is to suppress the deterioration of the substrate and the display layer accompanying the connection process between the substrate and the wiring substrate, and the disconnection between the substrate and the wiring substrate. It is an object of the present invention to provide a display device with improved performance, a method for manufacturing the same, and an electronic device including the display device.

  A display device according to an embodiment of the present technology includes a main substrate unit having a display area including a drive wiring, an auxiliary substrate unit integrated with the main substrate unit, and the drive wiring of the main substrate unit. The drawn wiring, the main board part, and the auxiliary board part are provided with a housing that is accommodated in a state of being bent at the boundary between them.

  In the method for manufacturing a display device according to the present technology, a driving wiring and a lead wiring connected to the driving wiring are formed on a substrate, and a main substrate portion and a leading wiring having a display region provided with the driving wiring from the substrate are provided. The auxiliary substrate portion is integrally formed, bent at the boundary between the main substrate portion and the auxiliary substrate portion, and accommodated in the housing.

  An electronic apparatus according to an embodiment of the present technology includes the display device.

  In the display device of the present technology and the manufacturing method thereof, or the electronic device, the auxiliary substrate unit integrated with the main substrate unit is provided, so that an external signal is supplied to the drive wiring through the lead wiring of the auxiliary substrate unit. Is done.

  According to the display device, the manufacturing method thereof, and the electronic apparatus of the present technology, the auxiliary substrate portion is provided for the main substrate portion having the display area, and the lead-out wiring is provided on the auxiliary substrate portion. Without using it, an external signal can be supplied to the drive wiring through the lead wiring of the auxiliary substrate portion. In other words, the substrate and the display layer are not deteriorated by the connection process between the substrate and the wiring substrate, and there is no disconnection between the substrate and the wiring substrate. Therefore, the reliability of the display device is improved.

3 is a plan view illustrating a partial configuration of a display device according to an embodiment of the present disclosure. FIG. It is sectional drawing showing the structure of the display apparatus shown in FIG. It is a figure for demonstrating the connection of the board | substrate shown in FIG. 1, and a control circuit board. It is a top view showing the structure of the conventional display apparatus. It is a flowchart showing the process of the manufacturing method of the display apparatus shown in FIG. It is a flowchart showing the process of the manufacturing method of the display apparatus shown in FIG. It is a top view showing the structure which concerns on the modification 1 of the board | substrate shown in FIG. It is a top view showing the structure which concerns on the modification 2 of the board | substrate shown in FIG. 14 is a perspective view illustrating an appearance of application example 1. FIG. 12 is a perspective view illustrating an appearance of application example 2. FIG. (A) is a perspective view showing the external appearance seen from the front side of the application example 3, (B) is a perspective view showing the external appearance seen from the back side. 14 is a perspective view illustrating an appearance of application example 4. FIG. 14 is a perspective view illustrating an appearance of application example 5. FIG. (A) is a front view of the application example 6 in an open state, (B) is a side cross section thereof, (C) is a front view in a closed state, (D) is a left side view, and (E) is a right side view, (F) is a top view and (G) is a bottom view.

Hereinafter, embodiments of the present technology will be described in detail with reference to the drawings. The explanation is as follows.
Follow the order below.
1. Embodiment 1. Display device in which an L-shaped auxiliary substrate portion is arranged to protrude from one side of the outer periphery of the main substrate portion. Modification 1
2. A display device in which an L-shaped auxiliary substrate portion is arranged so as to protrude from the outer peripheral corner of the main substrate portion. Modification 2
3. Display device whose outer periphery of the entire substrate is rectangular. Application examples

<Embodiment>
FIG. 1 illustrates a planar configuration of a substrate (substrate 11) of a display device (display device 1) according to an embodiment of the present disclosure. The display device 1 includes a main substrate portion 11A and an auxiliary substrate portion 11B integrated with the main substrate portion 11A. As shown in FIG. 2, the display panel 10 is provided in the display area 10A of the main substrate portion 11A. Has been placed. The display panel 10 includes a substrate 11, a TFT (Thin Film Transistor) layer 12, a display layer 13, and a transparent substrate 14 laminated in this order.

  The substrate 11 is made of, for example, an inorganic material such as glass, quartz, silicon, gallium arsenide, or polyimide, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethersulfone. It consists of plastic materials such as (PES), polyethyl ether ketone (PEEK), and aromatic polyester (liquid crystal polymer). The substrate 11 may be a rigid substrate such as a wafer, or may be a flexible substrate such as a thin glass layer or a film.

  As shown in FIG. 1, the main substrate portion 11A and the auxiliary substrate portion 11B constitute the same substrate (substrate 11). That is, the substrate 11 has a main substrate portion 11A and an auxiliary substrate portion 11A on the same surface. The main substrate portion 11A (display area 10A) has a rectangular shape, and driving wiring (including wiring of the TFT layer 12) is provided on the upper surface thereof. The auxiliary substrate portion 11B is provided, for example, in an L shape so as to protrude from a part of the outer periphery of the main substrate portion 11A. In other words, the entire substrate 11 has a shape in which an L-shaped portion protrudes from a part of a rectangular shape as shown in FIG. The shape of the auxiliary board portion 11B is not limited to the L shape as long as it can be easily connected to the control circuit board 21 (FIG. 3 described later). Moreover, it is preferable that the main substrate portion 11A and the auxiliary substrate portion 11B have a shape that can be integrally formed at the same time by, for example, a die. In the present embodiment, the auxiliary board portion 11B is provided on a part of the long side of the main board portion 11A. A lead wiring 13 from the drive wiring is provided on the auxiliary substrate portion 11B, and an electrode 16 (external terminal) is disposed at the tip of the lead wiring 13. The lead-out wiring 13 is led out from the drive wiring by bending from the orthogonal direction to the parallel direction with respect to the long side of the main substrate portion 11A so as to follow the shape of the L-shaped auxiliary substrate portion 11B. The electrode 16 can be connected to, for example, a commercially available (general-purpose) FPC (Flexible Printed Circuit) or FFC (Flexible Flat Cable), and is arranged in a direction orthogonal to the long side of the main substrate portion 11A. Yes.

  In the display device 1, as shown in FIG. 3, a separate control circuit board 21 is connected to the display panel 10 (substrate 11). Specifically, the electrode 16 of the auxiliary board portion 11B and the connector 22 of the control circuit board 21 are electrically connected. As a result, the control signal supplied from the control circuit board 21 is transmitted to the drive wiring via the lead-out wiring 15, and the pixels of the display panel 10 are modulated. In the display device 1 of the present embodiment, since the auxiliary substrate portion 11B is provided, the control circuit substrate 21 can be connected to the display panel 10 without using a wiring substrate.

  As shown in FIG. 4, in the conventional display device, a wiring board 115B, which is a member different from the board 111, is electrically connected to the terminal 115A at the peripheral edge of the board 111 by, for example, ACF, and further connected to the wiring board 115B. A substrate (not shown) is connected. Here, the corresponding parts of the display device 1 are denoted by reference numerals in the 100s. Since the substrate 111 is not provided with the auxiliary substrate portion 11B (FIG. 1), the wiring substrate 115B is necessary to supply the control circuit substrate signal to the display panel. Due to demands for narrowing and thinning the display device, the flexible wiring board 115B is often folded 180 degrees along the end surface of the substrate 111 and stored in a housing.

  In such a conventional display device, since the terminal 115A and the display layer 113 (display region 110A) are close to each other, the connection process by thermocompression bonding of the substrate 111 and the wiring substrate 115B may deteriorate the substrate 111 and the display layer 113. There is. Further, when the wiring board 115B is bent, a springback occurs in the wiring board 115B, and there is a possibility that the terminal 115A of the board 111 and the wiring board 115B are disconnected. Furthermore, in order to prevent the disconnection between the terminal 115A and the wiring board 115B, it is necessary to avoid bending near the connection portion between the board 111 and the wiring board 115B. There is a limit. A method of connecting the display panel to a driving driver or the like without using the wiring board 115B has also been proposed (for example, WO2008 / 156175). However, the configuration of the connector portion that connects the display panel and the driving driver is proposed. It becomes complicated. Further, since this connector is disposed in the vicinity of the display layer, the problem of deterioration of the display layer occurs as described above. Further, even when a flexible substrate (substrate 111) is used, the flexibility of the entire display device is lowered by the complicated connector portion.

  On the other hand, in the substrate 11 of the present embodiment, since the lead-out wiring 15 and the electrode 16 are provided in the auxiliary substrate portion 11B, the wiring substrate 115B is not necessary, and the control circuit substrate 21 is directly connected to the substrate 11. be able to. Therefore, the step of thermocompression bonding for connecting the substrate 111 and the wiring substrate 115B is not required, and deterioration of the substrate 11 and the display layer 13 can be suppressed. In addition, even if the substrate is bent near the boundary between the main substrate portion 11A and the auxiliary substrate portion 11B, since the single substrate 11 is bent, the possibility of disconnection is lower than bending near the connection portion between different members. Narrowing and thinning of the frame are also possible. That is, the problem regarding the connection between the substrate 111 and the wiring substrate 115B of the conventional display device as described above can be solved. Further, since the display device 1 does not require a complicated connector mechanism, the flexibility can be sufficiently reflected in the entire display device 1 by using the flexible substrate 11.

  The TFT layer 12 has a function as a switching element for selecting a pixel. The TFT layer 12 may be composed of either an inorganic TFT using an inorganic semiconductor layer as a channel layer or an organic TFT using an organic semiconductor layer.

In order to prevent the TFT layer 12 and the display layer 13 from being deteriorated by moisture or organic gas, a barrier layer may be provided between the substrate 11 and the TFT layer 12. Such a barrier layer is formed of, for example, AlO _x N _1-X (where X = 0.01 to 0.2) or silicon nitride (Si ₃ N ₄ ).

  The display layer 13 has, for example, an electrophoretic layer (electrophoretic display body) between the pixel electrode and the common electrode. That is, the display device 1 is an electrophoretic display (so-called electronic paper display) that displays an image (for example, character information) using an electrophoretic phenomenon. The pixel electrode is provided for each pixel on the TFT layer 12 side, and the common electrode is provided over one surface of the transparent substrate 14.

  A material similar to that of the substrate 10 can be used for the transparent substrate 14. A moisture-proof film for preventing moisture from entering the display layer 13 and an optical function film for preventing external light from being reflected on the display surface may be provided on the transparent substrate 14.

  A method for manufacturing the display device 1 will be described with reference to FIG.

  First, for example, the drive wiring (wiring of the TFT layer 12), the lead-out wiring 15 and the electrode 16 are formed in the same process on a multi-sided substrate made of plastic material (step S1). That is, at least a part of the drive wiring, the lead wiring 15 and the electrode 16 is made of the same material. These metal wiring portions are protected with an insulating material such as an overcoat agent. Next, a pixel electrode and an electrophoretic layer are formed on the TFT layer 12, and a transparent substrate 14 provided with a common electrode is bonded thereto. Thereby, the display layer 13 and the transparent substrate 14 are formed (step S2).

  Subsequently, the multi-chamfered substrate formed up to the transparent substrate 14 is divided (cut) into a shape as shown in FIG. 1 using a die, for example, by a press method (step S3). Thus, the main substrate portion 11A and the auxiliary substrate portion 11B can be integrally formed on the substrate 11 at the same time by punching by the press method. Instead of the press method, cutting by a plot method (cutter, roller sword) or laser cutting can also be performed.

  Next, a reinforcing plate is bonded to the surface of the substrate 11 opposite to the surface on which the electrode 16 is provided, that is, the lower surface of the substrate 11 so that the electrode 16 can be connected to the connector 22 of the control circuit substrate 21 (step S4).

  Finally, the connector 22 of the control circuit board 21 is electrically and mechanically connected to the electrode 16 and mounted on the housing (step S5), and the display device 1 is completed.

  On the other hand, in the manufacturing process of the conventional display device, as shown in FIG. 6, in addition to the steps S101, 102, 103 corresponding to the above-described steps S1, S2, S3, the process of forming the wiring board 115B (step S104) and A connection step (step S105) for wiring board 115B is required. The wiring board 115B includes a wiring forming process (step S104-1), an etching process (step S104-2), an insulating layer forming process (step S104-3), a punching process (step S104-4), and a reinforcing plate bonding process (step). S104-5) and a plurality of processes. Therefore, in the display device 1, deterioration of the substrate 111 and the display layer 113 accompanying the connection process of the wiring board 115B can be suppressed, and the manufacturing process can be simplified to reduce the lead time and cost.

  Further, in the connection step of the wiring substrate 115B, misalignment may occur between the substrate 111 and the wiring substrate 115B due to warpage or undulation of the substrate 111 and the wiring substrate 115B, which may reduce the yield. In particular, this problem becomes significant when both the substrate 111 and the wiring substrate 115B are flexible substrates. In the display device 1, such misalignment does not occur, and the yield is improved.

  In the display device 1 of the present embodiment, since the auxiliary substrate unit 11B is provided on the substrate 11, the control signal from the control circuit substrate 21 is supplied to the drive wiring via the lead wiring 15 of the auxiliary substrate unit 11B. The By this signal, each pixel is modulated and an image is displayed on the transparent substrate 14 side.

  As described above, in the display device 1 according to the present embodiment, since the auxiliary substrate portion 11B is provided on the substrate 11, control from the control circuit substrate 21 can be performed without using the wiring substrate (wiring substrate 115B in FIG. 4). A signal can be supplied to the drive wiring via the lead wiring 15 of the auxiliary substrate portion 11B. That is, since the connection step between the substrate 11 and the wiring substrate is not required, the substrate 11 and the display layer 13 are not deteriorated by this step, and the substrate 11 and the wiring substrate are not disconnected. Therefore, the reliability of the display device 1 can be improved.

  Further, if the substrate 11 is a flexible substrate, it can be folded at the boundary between the main substrate portion 11A and the auxiliary substrate portion 11B and housed in the housing, so that a thin and narrow frame can be achieved. Furthermore, since the display device 1 does not require a complicated connector mechanism, the display device 1 that can be bent can be realized. In addition, since the misalignment between the substrate 11 and the wiring substrate does not occur, the yield can be improved.

<Modification 1>
FIG. 7 illustrates a planar configuration of a substrate (substrate 11) according to the first modification of the display device 1 described above. This substrate 11 has a substantially V-shaped auxiliary substrate portion 11B at a corner portion of a substantially rectangular main substrate portion 11A. Except for this point, this display device has the same configuration as the display device 1 of the above-described embodiment, and the operation and effect thereof are also the same.

  The auxiliary substrate portion 11B may be provided at any position on the outer periphery of the main substrate portion 11A, and may be provided on the short side in addition to the long side and the corner portion described above. When the wiring board has to be connected as in the prior art, it is difficult to connect the wiring board to the corners of the board 111 because the possibility of disconnection increases. In the display device 1, the position of the auxiliary substrate portion 11 </ b> B and the shape of the auxiliary substrate portion 11 </ b> B can be freely set, so that the degree of freedom in product design can be increased.

<Modification 2>
FIG. 8 illustrates a planar configuration of a substrate (substrate 11) according to Modification 2 of the display device 1 described above. In this substrate 11, a substantially rectangular auxiliary substrate portion 11 </ b> B having a long side substantially the same length as the short side is disposed on the short side of the substantially rectangular main substrate portion 11 </ b> A. That is, the outer periphery of the entire substrate 11 is substantially rectangular. Except for this point, this display device has the same configuration as the display device 1 of the above-described embodiment, and the operation and effect thereof are also the same.

  The display device 1 can be mounted on the electronic devices shown in the following application examples 1 to 6, for example.

<Application example 1>
9A and 9B illustrate the appearance of an electronic book. This electronic book has, for example, a display unit 210, a non-display unit 220, and an operation unit 230. Although the operation unit 230 is formed on the same surface (front surface) as the display unit 210 as shown in FIG. 9A, the operation unit 230 has a different surface (upper surface) from the display unit 210 as shown in FIG. ) May be formed.

<Application example 2>
FIG. 10 illustrates an appearance of a television device. The television apparatus includes a video display screen unit 300 including a front panel 310 and a filter glass 320, for example.

<Application example 3>
FIG. 11 shows the appearance of a digital still camera. The digital still camera has, for example, a flash light emitting unit 410, a display unit 420, a menu switch 430, and a shutter button 440.

<Application example 4>
FIG. 12 shows the appearance of a notebook personal computer. This notebook personal computer has, for example, a main body 510, a keyboard 520 for inputting characters and the like, and a display unit 530 for displaying an image.

<Application example 5>
FIG. 13 shows the appearance of the video camera. This video camera includes, for example, a main body 610, a subject photographing lens 620 provided on the front side surface of the main body 610, a start / stop switch 630 at the time of photographing, and a display 640.

<Application example 6>
FIG. 14 shows the appearance of a mobile phone. For example, the mobile phone is obtained by connecting an upper housing 710 and a lower housing 720 with a connecting portion (hinge portion) 730, and includes a display 740, a sub-display 750, a picture light 760, and a camera 770. Yes.

  Although the present technology has been described with the embodiment and the modification, the present technology is not limited to the above-described embodiment and the like, and various modifications can be made. For example, in the above-described embodiment and the like, the case where the display layer 13 is configured by an electrophoretic layer has been described, but the display layer 13 may be configured by liquid crystal, organic EL (Electroluminescence), inorganic EL, or the like.

  Further, the material and thickness of each layer described in the above embodiment and the like, or the film formation method and film formation conditions are not limited, and other materials and thicknesses may be used. It is good also as film | membrane conditions.

  Furthermore, in the said embodiment etc., although the structure of the display apparatus 1 was mentioned concretely and demonstrated, it is not necessary to provide all the layers and you may further provide the other layer.

In addition, this technique can also take the following structures.
(1)
A main substrate portion having a display area including drive wiring;
An auxiliary substrate unit integrated with the main substrate unit;
A lead-out line connected to the drive wiring of the main board part and provided in the auxiliary board part;
A display device comprising: a housing that accommodates the main substrate portion and the auxiliary substrate portion in a state of being bent at a boundary between them.
(2)
The display device according to (1), wherein the auxiliary substrate portion and the main substrate portion constitute the same substrate.
(3)
The display device according to (2), wherein the substrate is a flexible substrate.
(4)
The display device according to any one of (1) to (3), wherein the auxiliary substrate portion has an L shape and is disposed on a part of an outer periphery of the substantially rectangular main substrate portion.
(5)
The main board portion is substantially rectangular,
The display device according to any one of (1) to (4), wherein the auxiliary substrate portion is provided on a part of a long side of the main substrate portion.
(6)
The display device according to any one of (1) to (5), wherein the lead-out wiring is connected to a connector for external connection.
(7)
The display device according to any one of (1) to (6), wherein an external terminal is provided at a leading end of the lead-out wiring, and a control circuit board is electrically connected to the external terminal.
(8)
The display device according to any one of (1) to (7), wherein at least part of the drive wiring and the lead-out wiring are made of the same material.
(9)
On the substrate, drive wiring and lead wiring connected to the drive wiring are formed,
A main substrate portion having a display area provided with the drive wiring and an auxiliary substrate portion provided with the lead-out wiring are integrally formed from the substrate,
A method for manufacturing a display device, wherein the display device is folded at a boundary between the main substrate portion and the auxiliary substrate portion and accommodated in a housing.
(10)
The method for manufacturing a display device according to (9), wherein the lead-out wiring is connected to a connector for external connection.
(11)
The method for manufacturing a display device according to (9) or (10), wherein an external terminal is formed at a leading end of the lead-out wiring, and a control circuit board is electrically connected to the external terminal.
(12)
The main substrate portion and the auxiliary substrate portion are integrally formed by performing cutting by a press method, cutting by a plot method, or laser cutting on the substrate. Any one of (9) to (11) The manufacturing method of the display apparatus as described in any one of.
(13)
A display device,
The display device
A main substrate portion having a display area including drive wiring;
An auxiliary substrate unit integrated with the main substrate unit;
A lead-out line connected to the drive wiring of the main board part and provided in the auxiliary board part;
An electronic apparatus comprising: a housing that accommodates the main substrate portion and the auxiliary substrate portion in a state where the main substrate portion and the auxiliary substrate portion are bent at a boundary between them.

DESCRIPTION OF SYMBOLS 1 ... Display apparatus, 10 ... Display panel, 10A ... Display area, 11 ... Substrate, 11A ... Main substrate part, 11B ... Auxiliary substrate part, 12 ... TFT layer, DESCRIPTION OF SYMBOLS 13 ... Display layer, 14 ... Transparent substrate, 15 ... Lead-out wiring, 16 ... Electrode, 21 ... Control circuit board, 22 ... Connector.

Claims (13)

A main substrate portion having a display area including drive wiring;
An auxiliary substrate unit integrated with the main substrate unit;
A lead-out line connected to the drive wiring of the main board part and provided in the auxiliary board part;
A display device comprising: a housing that accommodates the main substrate portion and the auxiliary substrate portion in a state of being bent at a boundary between them. The display device according to claim 1, wherein the auxiliary substrate portion and the main substrate portion constitute the same substrate. The display device according to claim 2, wherein the substrate is a flexible substrate. The display device according to claim 1, wherein the auxiliary substrate portion has an L shape and is disposed on a part of an outer periphery of the substantially rectangular main substrate portion. The main board portion is substantially rectangular,
The display device according to claim 1, wherein the auxiliary substrate portion is provided on a part of a long side of the main substrate portion. The display device according to claim 1, wherein the lead-out wiring is connected to a connector for external connection. The display device according to claim 1, wherein an external terminal is provided at a leading end of the lead-out wiring, and a control circuit board is electrically connected to the external terminal. The display device according to claim 1, wherein at least part of the drive wiring and the lead-out wiring are made of the same material. On the substrate, drive wiring and lead wiring connected to the drive wiring are formed,
A main substrate portion having a display area provided with the drive wiring and an auxiliary substrate portion provided with the lead-out wiring are integrally formed from the substrate,
A method for manufacturing a display device, wherein the display device is folded at a boundary between the main substrate portion and the auxiliary substrate portion and accommodated in a housing. The display device manufacturing method according to claim 9, wherein the lead-out wiring is connected to an external connection connector. The method for manufacturing a display device according to claim 9, wherein an external terminal is formed at a leading end of the lead-out wiring, and a control circuit board is electrically connected to the external terminal. 12. The main substrate portion and the auxiliary substrate portion are integrally formed by performing cutting by a press method, cutting by a plot method, or laser cutting on the substrate. Manufacturing method of display device. A display device,
The display device
A main substrate portion having a display area including drive wiring;
An auxiliary substrate unit integrated with the main substrate unit;
A lead-out line connected to the drive wiring of the main board part and provided in the auxiliary board part;
An electronic apparatus comprising: a housing that accommodates the main substrate portion and the auxiliary substrate portion in a state where the main substrate portion and the auxiliary substrate portion are bent at a boundary between them.

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