JP2016139712A - Component management system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component management system where processing time in correct/wrong determination of components has been reduced.SOLUTION: A component management system, in which component plates 51 are housed in slots 33 at respective stages in a magazine rack 32 and, when a prescribed component plate 51 is drawn from the slot 33 by a component supply device 18, whether or not the component is appropriate is determined, has: identifying means attached to each of a plurality of component plates; read means 47 for reading the identifying means 53 of the component plate 51 to be drawn from the slot 33; and determination means which performs component determination processing of whether or not the component plate is the component plate 51 provided with a use component according to comparison between identification information of the identifying means acquired by the read means 47 and component information about a predetermined use component. In the system, the determination means performs pre-determination processing to be component determination processing when operating a mounting device; and when a prescribed determination condition is satisfied after operation, post-determination processing to be the component determination processing is performed.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a component management system for determining whether or not a component plate corresponding to production is correctly stored in a component supply device that supplies components to a mounting apparatus.

  In the board production line, the circuit board is sequentially conveyed to various apparatuses, and predetermined components are mounted on the circuit board. Among the multiple devices, in a component mounting device with a die supply device assembled, a predetermined wafer diced from the die supply device is pulled out, and a die as a mounting component is taken out from the wafer and mounted on a circuit board Is done. In such a die supply apparatus, correctness determination is performed to determine whether or not a wafer corresponding to production is correctly stored. The following Patent Document 1 discloses device verification before the start of production. In other words, a pre-registered wafer is mounted on a wafer pallet and stored in a magazine rack, and when the magazine rack is set in a die supply device, the ID of the magazine rack is read by a reader and verified by a device management server. Is done.

JP2013-229212A JP 2006-111445 A

  In the above-described conventional example, verification is performed when the magazine rack is set in the die supply apparatus, but correctness determination is not performed even if a new wafer is added thereafter. However, since it is possible to insert an incorrect wafer, the correctness / incorrectness determination should be performed for the added wafer. In this regard, in Patent Document 2, a wafer pallet with barcodes in a plurality of stages is inserted into the magazine rack, and when the drawer is pulled out from the magazine rack, the part number is read by the barcode reader, Whether or not is picked has been confirmed. Therefore, it is only necessary to carry out such component confirmation even in the magazine rack of Patent Document 1, but if it is performed by the device management server, it takes time for the correct / incorrect determination processing, and the tact time is greatly reduced.

  Accordingly, an object of the present invention is to provide a component management system that shortens the processing time in determining whether a component is correct or not in order to solve such a problem.

  In the component management system according to the present invention, a component plate including components is accommodated in each stage slot in a magazine rack, and a predetermined component is supplied according to a production program so as to supply the component to a mounting apparatus that performs component mounting. A component supply device for pulling out the plate from the slot, and determining the suitability of the component supplied from the component supply device to the mounting device, comprising: a plurality of identification means attached to each of the plurality of component plates; A reading means for reading the identification means of the component plate pulled out from the slot, and a comparison of the identification information of the identification means acquired by the reading means with the component information relating to the predetermined used parts. And a determination unit that executes a component determination process for determining whether the plate is a component plate. The running determination process before a component determination processing, and executes the determination process after a said component determination process if it meets the predetermined judgment condition after operation in.

  Therefore, according to the component management system of the present invention, in addition to the pre-determination performed during the operation of the mounting apparatus, for example, the post-determination is performed on the condition that the door is opened and closed, the same component determination process is repeatedly performed. Therefore, it is possible to shorten the processing time in determining whether a part is correct.

It is the figure which showed notionally the structure of the board | substrate production line. It is the perspective view which showed the internal composition of the component mounting apparatus. It is the side view which showed the structure of the wafer supply apparatus. It is the figure which showed the data transmission process of a device management server and a component mounting apparatus. It is the flowchart which showed the post-determination process by collective determination. It is the flowchart which showed the post-determination process by division determination. It is the figure which showed component determination data. It is an image figure which tabulated after.

  Next, an embodiment of a parts management system according to the present invention will be described below with reference to the drawings. The component management system of the present embodiment is employed in a board production line, and FIG. 1 is a diagram conceptually showing the configuration of the board production line. In the board production line 1, a solder printing apparatus 2, a solder inspection apparatus 3, a component mounting apparatus 4, a board appearance inspection apparatus 5, and a reflow apparatus 6 are arranged in order. Each of the devices 2, 3, 4, 5, 6 is provided with a substrate transfer device 7 for sequentially transferring a circuit board from the upstream solder printing device 2 to the downstream flow device 6. Each device 2, 3, 4, 5, 6 is provided with a device management server 8 for managing various production information, and is connected by a communication cable so that the production information can be transmitted bidirectionally.

  The component management system according to the present embodiment is particularly characterized in component management of the component mounting apparatus 4 among the devices constituting the board production line 1. FIG. 2 is a perspective view showing the internal structure of the component mounting apparatus 4. The component mounting apparatus 4 is installed via a base 20, and a module 10 for mounting electronic components is mounted on the base 20. The module 10 is provided with a component mounting unit 13 that moves a mounting head 15 that sucks and holds electronic components on the XY plane, in addition to a substrate transport unit 11 that delivers a circuit board between adjacent devices 3 and 5. ing. The substrate transport unit 11 corresponds to the substrate transport apparatus 7 shown in FIG.

  The board transport unit 11 is provided with two conveyors 21 and 22 having the same configuration, and the circuit board is transported at two places, and electronic components are mounted on the respective transport paths. The conveyors 21 and 22 are configured such that a pair of guides are installed in parallel according to the width dimension of the circuit board, and the circuit board is moved in the X-axis direction along the guides. Further, the substrate transport unit 11 is provided with a clamp mechanism for positioning the transported circuit board.

  The component mounting unit 13 is provided with an X-axis slider 26 that moves in the left-right width direction (X-axis direction) with respect to the Y-axis slider 25 that moves in the front-rear direction (Y-axis direction) of the apparatus. The two Y-axis rails 27 are disposed above the inside of the device cover 401 and extend in the front-rear direction. A Y-axis slider 25 is slidably attached to the Y-axis rail 27. Although not shown in detail, a ball screw mechanism is assembled to the Y-axis slider 25, and the Y-axis slider 25 moves along the Y-axis rail 25 by the rotation control of the servo motor, and positioning in the Y-axis direction with respect to the mounting head 15 is performed. .

  The Y-axis slider 25 has a block shape that is long in the left-right direction, and an X-axis rail 28 is fixed to the front surface portion thereof. An X-axis slider 26 is slidably attached to the X-axis rail 28. Although not shown in detail here, a ball screw mechanism is assembled to the X-axis slider 26, and the X-axis slider 26 moves along the X-axis rail 28 by the rotation control of the servo motor, so that the positioning in the X-axis direction with respect to the mounting head 15 is performed. Done. The mounting head 15 is provided with a suction nozzle 150 capable of sucking and holding electronic components. The suction nozzle 150 is assembled via an elevating mechanism so that it can move in the vertical direction (Z-axis direction). Further, the mounting head 15 incorporates a rotation mechanism in addition to the lifting mechanism, and the suction nozzle 150 can be lifted and lowered with respect to the mounting head 15.

  In such a component mounting apparatus 4, a device table 16 and a wafer supply apparatus 18 are installed on the front side of the apparatus, that is, on the front side of the module 10 in the drawing. In the wafer supply device 18, a plurality of wafers 50 are stored in a storage box 31, and the wafers 50 are pulled out one by one from the storage box 18 to the module 10 side. The wafer 50 is formed on a wafer pallet 51 by forming dies in a grid pattern by dicing. At that time, the wafer pallet 51 is provided with a circular wafer mounting plate having a dicing sheet that can be expanded and contracted, and the wafer 50 is mounted thereon.

  Here, FIG. 3 is a side view showing the structure of the wafer supply device 18. In the wafer supply device 18, a magazine rack 32 is stored in a storage box 31, and the magazine rack 32 can store a plurality of wafer pallets 51. In particular, the horizontal wafer pallets 51 are arranged in the vertical direction. It is stored. That is, a plurality of slots 33 are formed in the magazine rack 32, and one wafer pallet 51 is inserted into each slot 33. The slot 33 is formed so that the wafer pallet 51 can be taken in and out of the magazine rack 32 from both sides in the front-rear direction of the component mounting apparatus 4 (Y-axis direction in FIG. 1, both left and right directions in FIG. 3).

  The wafer supply device 18 is mounted on a carriage 34 and installed at the front of the component mounting device 4 as shown in FIG. At that time, in the storage box 31, the opening / closing door 35 is located on the front side of the apparatus, and the supply port 36 is located on the opposite module 10 side as shown in FIG. The supply port 36 is for taking in and out a single wafer pallet 51 to and from the module 10 side. Therefore, in the wafer supply device 18, the wafer pallet 51 is set in the magazine rack 32 by opening and closing the opening / closing door 35, and a predetermined wafer pallet 51 is taken in and out of the storage box 31 from the supply port 36 at the timing of component mounting. . Therefore, the wafer supply device 18 has a configuration in which the magazine rack 32 can be moved up and down so that the wafer pallets 51 arranged above and below can be positioned according to the height of the supply port 36.

  The magazine rack 32 is slidably assembled along a vertical guide rail 37 formed on the inner wall surface of the storage box 31, and a ball screw mechanism is provided adjacent to the guide rail 37. That is, the servo motor 38 is fixed to the bottom surface of the storage box 31 with the rotation axis facing upward, and an integral screw shaft 39 extends perpendicularly to the rotation axis and is screwed into a nut (not shown) fixed to the magazine rack 32. ing. Therefore, the magazine rack 32 can be moved up and down in the storage box 31 by the rotation control of the servo motor 38, and the predetermined wafer pallet 51 can be positioned at the height of the supply port 36.

  Next, the wafer supply device 18 is provided with a wafer drawing mechanism outside the supply port 36. In the wafer drawing mechanism, a table 41 on which a wafer pallet 51 is mounted is slidable in the front-rear direction (Y-axis direction) of the component mounting apparatus 4 via a guide rail (not shown), and can be moved by a ball screw mechanism. ing. In other words, the Y-axis direction screw shaft 42 parallel to the guide rail is rotatably supported at one end by the bearing 43 and the other end is connected to the rotation shaft of the servo motor 44. The screw shaft 42 is screwed through a nut (not shown) fixed to the table 41. The table 41 is also provided with hook means (not shown) that can draw out and insert the wafer pallet 51.

  Thus, the wafer pallet 51 withdrawn / inserted from the supply port 36 must have the wafer 50 mounted on the wafer pallet 51 as a correct mounting component. Therefore, a barcode reader 47 is installed in the wafer supply device 18 outside the storage box 31 and above the supply port 36. On the other hand, a bar code 53 for identifying the wafer 50 is attached to the wafer pallet 51 as shown in FIG. The identification information of the wafer 50 indicated by the barcode 53 is associated with the component information used for substrate production and is stored in the device management server 8 in advance as component management data.

  By the way, the board production by the board production line 1 is managed by the device management server 8 that drives and controls each of the devices 2 to 7, and the device management server 8 performs lot production in addition to the above-described component management data. Production plan data such as the order of boards and the number of completed productions are stored in a database in advance. The contents of jobs (board production jobs) executed by the devices 2 to 7 on the board production line 1 are described in advance in the job data and stored in a database. The contents of the job data include circuit board pattern and design data related to electronic parts, work data related to solder printing work and electronic part mounting work, inspection data related to board inspection, and the like. Such production plan data and job data are also stored in the device management server 8.

  Here, FIG. 4 is a diagram showing a part of data transmission processing between the device management server 8 and the component mounting apparatus 4. In the device management server 8, a production job to be executed is determined based on the production plan data, and job data of the corresponding production job is acquired. Then, job data is transmitted from the device management server 8 to the respective devices 2 to 7 (S101), and production jobs of the respective devices 2 to 7 are executed. Accordingly, the devices 2 to 7 of the board production line 1 are operated. However, in the component mounting device 4 having the characteristics of the present embodiment, the component correctness determination processing is executed for all the wafers 50 accommodated in the magazine rack 32. .

  In the wafer supply apparatus 18, the magazine rack 32 is moved up and down by the rotation control of the servo motor 38, and the plurality of slots 33 are sequentially positioned to the height of the supply port 36 one by one from the upper stage to the lower stage. From the positioned slot 33, the wafer pallet 51 is once pulled out of the storage box 31 from the supply port 36 by the hook means of the table 41, and the barcode 53 is read by the barcode reader 47. The read identification data of the wafer 50 is transmitted to the device management server 8 (S102), and correctness determination of the used parts based on the production plan is performed by collating with the job data and the parts management data.

  The collation based on the identification data of the wafers 50 is performed for all the wafers 50 in the magazine rack 32. Then, in the device management server 8, component determination data is created along with this correctness determination process, and is transmitted to the control device 40 (see FIG. 2) of the component mounting apparatus 4 (S103). This component determination data is for enabling the component mounting apparatus 4 to execute the component correctness determination performed by the device management server 8. FIG. 7 shows the component determination data. That is, the magazine rack 32 has five upper and lower slots 33, and the slot names are A, B, C, D, and E in order from the top. Each slot 33 corresponds to the identification data of the wafer 50 attached to the inserted wafer pallet 51 and the mounted component.

  In the present embodiment, the correctness / incorrectness determination of components is performed not only when the operation of the board production line 1 is started but also after that. In particular, the determination after the start of movement is performed not by the device management server 8 but by the component mounting apparatus 4. Accordingly, the correct / incorrect determination performed by the device management server 8 at the start of operation of the board production line 1 is referred to as “pre-determination”, and the correct / incorrect determination performed by the component mounting apparatus 4 after the operation starts is referred to as “post-determination”. As described above, the pre-determination is triggered by the start of the operation of the substrate production line 1, but the post-determination is triggered by opening / closing of the open / close door 35 in the present embodiment. The opening / closing door 35 may be opened when a part (die) is cut with the progress of substrate production and replaced with a new wafer pallet 51. At that time, the driving of the component mounting apparatus 4 is temporarily stopped.

  An opening / closing detection sensor 48 for detecting opening / closing of the opening / closing door 35 is provided in the storage box 31. Therefore, when the wafer pallet 51 is replaced, an open / close detection signal is transmitted from the open / close detection sensor 48 to the control device 40, and a post-determination is performed. 5 and 6 are flowcharts showing the post-determination process programmed as a subroutine in the automatic operation process (main routine) in the component mounting apparatus 4. 5 and 6 both show the process in the post-determination, but are determination methods according to another example, the determination method shown in FIG. 5 is a batch determination process, and the determination method shown in FIG. Is division determination processing. Hereinafter, the post-determination processing in FIGS. 5 and 6 will be described in order.

  First, the control device 40 is provided with a flag register for determining whether or not all the slots 33 have been determined, and before the post-determination process is executed, each of the magazine racks 32 is received by receiving an open / close detection signal. A determination flag “1” corresponding to the slot 33 is set. In the post-determination process, the determination is made for each slot while confirming the determination flag. FIG. 8 is a diagram illustrating such post-judgment as a table. That is, in the post-determination, for the wafers 50 in the slots 33 of A to E, the determination flag is set to “1” when the determination is not processed, and the determination flag is switched to “0” when the determination is processed. The determination result (“OK” or “NG”) is set.

  Therefore, in the collective determination process shown in FIG. 5, first, the opening / closing of the opening / closing door 35 is determined based on the presence / absence of the opening / closing detection signal from the opening / closing detection sensor 48 (S201). When the open / close door 35 is not open (S201: NO), the post-determination process is not performed. On the other hand, when the open / close door 35 is opened (S201: YES), the correctness of the wafer 50 is determined. For this purpose, the wafer pallet 33 is pulled out from the storage box 31, and the barcode 53 is read by the barcode reader 47 (S202). Then, the read identification data of the wafer 50 is not transmitted to the device management server 8, and correct / incorrect determination is performed by collating with the component determination data held by the component mounting apparatus 4 (S203).

  Next, a determination flag is checked as to whether or not all slots 33 have been determined (S204). The correctness / incorrectness determination of the wafer 50 is performed in order from A to E in the slot 33, and steps S202 to S204 are repeated until the correctness / incorrectness determination is completed for all the slots 33 (S204: NO). When the correct / incorrect determination is completed for all slots 33 (S204: YES), the determination result is confirmed (S205). If there is no error as a result of the determination (S205: NO), the post-determination ends. On the other hand, if there is an error as a result of the determination (S205: YES), the result is displayed on the monitor of the component mounting apparatus 4 and further notified by blinking of the signal tower (S206). finish.

  Subsequently, in the division determination process shown in FIG. 6, first, the opening / closing of the open / close door 35 is determined based on the presence / absence of an open / close detection signal from the open / close detection sensor 48 (S301). When the open / close door 35 is not opened (S301: NO), the post-determination process is not performed. On the other hand, when the open / close door 35 is opened / closed (S301: YES), the drawing of the wafer pallet 51 and the flag for determination of the slot 33 corresponding to the drawn wafer pallet 51 are confirmed (S302, S303). . This is because in the division determination process, correctness / incorrectness determination is irregularly performed once for the wafer 50 in each slot 33.

  Therefore, even if the open / close door 35 is opened, the wafer pallet 51 is not pulled out from the slot 33 thereafter (S302: NO), or even if the wafer pallet 51 is pulled out from the slot 33, the correctness of the wafer 50 has already been determined. Is completed (S303: NO), post-determination is not performed. Therefore, in this division determination process, the post-determination is not performed for the wafer 50 that is never pulled out from the slot 33 in the mounting after the opening / closing door 35 is opened. On the other hand, when the wafer 50 of the drawn wafer pallet 51 has not been determined (S302: YES, S303: YES), the barcode 53 is read by the barcode reader 47 (S304).

  The read identification data of the wafer 50 is not transmitted to the device management server 8, and correct / incorrect determination is performed by collating with the component determination data held by the component mounting apparatus 4 (S305). If there is no error as a result of the determination (S306: NO), the correctness / incorrectness determination ends for the wafer 50 in the corresponding slot 33 (any one of A to E) as it is. On the other hand, if there is an error as a result of the determination (S306: YES), the result is displayed on the monitor of the component mounting apparatus 4 and further notified by blinking of the signal tower (S307). The post-determination is completed for the 33 wafers 50.

  Therefore, in the component management system of the present embodiment, since the post-determination is performed in response to the opening / closing of the opening / closing door 35 in addition to the pre-determination, the correct / error determination process is not repeatedly performed on the same wafer 50, and the processing time is reduced. It can be shortened. Further, since the pre-determination is performed by the device management server 8 and the post-determination is performed by the component mounting apparatus 4, it is necessary to transmit the identification data of the wafer 50 read by the barcode reader 47 to the device management server 8 in the post-determination. In this respect, the processing time can be shortened.

  Furthermore, in the post-determination process shown in FIG. 6, the correctness / incorrectness determination is performed only for the wafer 50 extracted in accordance with the mounting process without performing the correctness / incorrectness determination for all the wafers 50. The processing time can be shortened in that the correctness / incorrectness determination is not performed on the wafer pallet 51. Since the opening / closing door 35 is opened and closed as a trigger for the post-determination process, when there is an error in the insertion of the wafer pallet 51, the error can be reliably determined. And since the result is notified to an operator by a monitor display or a signal display, subsequent correction can be performed reliably.

As mentioned above, although embodiment of the components collection | recovery apparatus of this invention was described, this invention is not limited to this, A various change is possible in the range which does not deviate from the meaning.
For example, in the above-described embodiment, the wafer pallet 51 including the diced wafer 50 has been described as an example. However, other component plates including components may be used.
Further, for example, even if the opening / closing door 35 is opened, the wafer pallet 51 may not be replaced. Therefore, when the wafer pallet 51 is replaced, the trigger of the post-determination process is a button input performed by the operator. Also good.

DESCRIPTION OF SYMBOLS 1 ... Board production line 4 ... Component mounting apparatus 8 ... Device management server 18 ... Wafer supply device 31 ... Storage box 32 ... Magazine rack 33 ... Slot 35 ... Open / close door 47 ... Bar code reader 48 ... Open / close detection sensor 50 ... Wafer 51 ... Wafer pallet 53 ... Bar code

Claims (4)

A component supply device for pulling out a predetermined component plate from the slot in accordance with a production program in order to supply components to a mounting device that executes component mounting, in which component plates having components are accommodated in slots of each stage in the magazine rack In a component management system for determining the suitability of components supplied from the component supply device to the mounting device,
A plurality of identifying means attached to each of the component plates;
Reading means for reading the identification means of the component plate drawn out from the slot;
A determination unit that executes a component determination process for determining whether the component plate is a component plate based on a comparison between the identification information of the identification unit acquired by the reading unit and component information relating to a predetermined component used; Have
The determination means executes a pre-determination process that is the component determination process when the mounting apparatus is in operation, and executes a post-determination process that is the component determination process when a predetermined determination condition is satisfied after the operation. Parts management system characterized by being.   The magazine rack is provided with an opening / closing door that opens and closes when a component plate is put in and out, and the determination means executes the post-determination process on the condition that the opening / closing of the opening / closing door is detected. The component management system according to claim 1, wherein the component management system is provided. The determination unit is provided in each of a main management device that controls and manages the mounting device and the mounting device,
The pre-determination process is executed by the main management apparatus having the component information, and the post-determination process is based on the part information transmitted together with the determination result by the main management apparatus during the pre-determination process. The component management system according to claim 1, wherein the component management system is executed by a mounting apparatus. The post-determination process executed by the determination unit is performed once for each of the component plates pulled out from the slot according to a production program after satisfying the determination condition. The parts management system according to claim 3.

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