JP2016051902A - Holding member for semiconductor light-emitting device, and light source device and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-cost and high-quality light source device, a holding member capable of achieving the same, and a method for manufacturing the light source device.SOLUTION: A holding member 10 for a semiconductor light-emitting device includes a first principal surface 10a, and a second principal surface 10b which is an opposite surface of the first principal surface 10a. A thin film part 11 and a thick film part 12 adjacent to the thin film part 11 are arranged on the first principal surface 10a, and a plurality of openings 13 for housing the semiconductor light-emitting device formed covering from the thin film part 11 to the thick film part 12 and a groove 15 coupling between the adjacent openings 13 are arranged on the second principal surface 10b. A through hole 14 for exposing terminals of the semiconductor light-emitting device formed in the thin film part 11 is arranged in the opening 13.SELECTED DRAWING: Figure 1A

Description

  The present invention relates to a holding member for a semiconductor light emitting device, a light source device, and a manufacturing method thereof.

2. Description of the Related Art Conventionally, light source devices including light emitting diodes or laser diodes have been developed in place of discharge lamps in devices that require a high-luminance light source.
For example, a light source device including a plurality of semiconductor laser devices has been proposed as a projector application (for example, Patent Document 1).
In this light source device, the semiconductor laser device is positioned by providing the holding member of the semiconductor laser device with a protrusion corresponding to the notch of the semiconductor laser device.

JP 2012-242633 A

Processing the holding member of the semiconductor laser device into a complicated shape complicates a mold and a cutting process when the holding member is manufactured, and causes an increase in manufacturing cost of the holding member. There is a need for a technique that can perform positioning of the above with high accuracy.
The present disclosure has been made in view of the above problems, and an object thereof is to provide a low-cost and high-precision light source device, a holding member that realizes the light source device, and a method of manufacturing the light source device.

  The holding member of the semiconductor light emitting device of the present disclosure is a holding member of the semiconductor light emitting device, and the holding member has a first main surface and a second main surface opposite to the first main surface, The first main surface includes a thin film portion and a thick film portion adjacent to the thin film portion, and the second main surface is formed from the thin film portion to the thick film portion, and a plurality of arranged semiconductor light emitting elements An opening for housing the device and a groove for connecting the adjacent openings are disposed, and a through hole for exposing a terminal of the semiconductor light emitting device formed in the thin film portion is disposed in the opening. It is characterized by being.

  The light source device of the present disclosure is a light source device including a semiconductor light emitting device and the above-described holding member. The semiconductor light emitting device has a semiconductor light emitting element and the semiconductor light emitting element mounted thereon, and a pair on the outer periphery. A base including the notch, the holding member accommodates the base of the semiconductor light emitting device in the opening of the second main surface, and the semiconductor light emitting device has the notch facing the groove. And it is fixed to the holding member.

  Furthermore, a method of manufacturing a light source device according to the present disclosure includes a semiconductor light emitting device that includes the holding member described above, a semiconductor light emitting element, and a base body on which the semiconductor light emitting element is mounted and includes a pair of notches on the outer periphery. Prepare a positioning jig having a width smaller than the width of the groove of the holding member, house the semiconductor light emitting device in the opening of the holding member, and insert the positioning jig into the groove and the notch of the holding member The position of the notch of the semiconductor light emitting device with respect to the holding member is adjusted.

  In addition, the other holding member of the present disclosure is a holding member of a semiconductor light emitting device, and the holding member has a first main surface and a second main surface opposite to the first main surface, The first main surface includes a thin film portion and a thick film portion adjacent to the thin film portion, and the second main surface is formed from the thin film portion to the thick film portion, and a plurality of arranged semiconductor light emitting elements An opening for housing the device is arranged, and the opening becomes wider as it approaches the second main surface, and a through hole for exposing a terminal of the semiconductor light emitting device formed in the thin film portion is arranged in the opening. It is characterized by being.

  According to the embodiment of the present invention, it is possible to provide a low-cost and highly accurate light source device, a holding member that realizes the light source device, and a method for manufacturing the light source device.

It is a perspective view of one embodiment of a holding member of the present invention. It is a top view of the holding member of FIG. 1A. It is a B-B 'line sectional view of the holding member of Drawing 1B. It is a bottom view of the holding member of FIG. 1A. It is the C-C 'line sectional view of the holding member of Drawing 1D. It is sectional drawing corresponding to FIG. 1C which shows the modification of the holding member of FIG. 1A. It is sectional drawing corresponding to FIG. 1E which shows the modification of the holding member of FIG. 1A. It is a perspective view of another embodiment of the holding member of the present invention. It is a perspective view which shows one Embodiment of the light source device of this invention. It is a top view of the light source device of FIG. 3A. It is a bottom view of the light source device of FIG. 3A. It is a side view including a partial transmission figure of the semiconductor light-emitting device used for the light source device of this invention. FIG. 4B is a bottom view of the semiconductor light emitting device of FIG. 4A. FIG. 4B is a cross-sectional view of the semiconductor light emitting device of FIG. 4A. It is a perspective view of the light source device etc. for demonstrating the manufacturing method of the light source device of FIG. 3A. It is a combination perspective view with the light source device for demonstrating the positioning jig used with the manufacturing method of a light source device. FIG. 6B is a plan view of FIG. 6A. It is a combination perspective view with the light source device for demonstrating the positioning jig which abbreviate | omitted and represented except the pin of the positioning jig in FIG. 6A. It is a top view of Drawing 6C. It is a combination perspective view with the light source device for demonstrating another positioning jig (except for pins) used with the manufacturing method of a light source device. FIG. 7B is a plan view of FIG. 7A. It is a combination perspective view with the light source device for demonstrating another positioning jig (except for pins) used with the manufacturing method of a light source device. It is a top view of FIG. 8A. It is a top view which shows another embodiment of the holding member of this invention. FIG. 9B is a cross-sectional view of the holding member of FIG. 9A taken along line B-B ′. It is a top view which shows another embodiment of the light source device of this invention.

  Embodiments of the invention will be described below with reference to the drawings as appropriate. However, the holding member and the light source device described below are for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. In addition, the contents described in one embodiment and example are applicable to other embodiments and examples. In addition, the size, positional relationship, and the like of members illustrated in each drawing may be exaggerated for clarity of explanation.

Embodiment 1: Holding member 10
For example, as shown in FIGS. 1A to 1E, the holding member 10 of this embodiment includes a first main surface 10 a and a second main surface 10 b on the opposite side of the first main surface 10 a.
A thin film portion 11 and a thick film portion 12 adjacent to the thin film portion 11 are disposed on the first main surface 10a.
On the second main surface 10b, a plurality of arranged semiconductor light emitting device housing openings 13 formed from the thin film portion 11 to the thick film portion 12 and grooves 15 connecting the adjacent opening portions 13 are arranged. ing.
A through hole 14 for exposing a terminal of the semiconductor light emitting device formed in the thin film portion 11 is disposed in the opening 13.

The holding member is a member for holding the semiconductor light emitting device, and can hold one or a plurality of semiconductor light emitting devices. The shape is not particularly limited, and may be any of plate shape, block shape, box shape, cylinder shape, L shape, T shape, and the like. Further, fins may be formed on these outer surfaces. Especially, as shown to FIG. 1A-1E, it is preferable that the holding member 10 is a square with a long planar shape (surface shape) or a shape close | similar to this. The general shape is preferably a rectangular parallelepiped and / or a shape close thereto. The long left and right side surfaces are preferably flat. With such a shape, a plurality of holding members, and thus the light source device can be stacked or arranged adjacent to each other in a short direction.
In the holding member 10 shown in FIGS. 1A to 1E, for example, it is 60 mm × 20 mm × 12.4 mm (maximum thickness).

  The holding member 10 is preferably made of a material having good thermal conductivity, and more preferably made of an integrally formed material. For example, metal (aluminum or aluminum alloy, copper or copper alloy, stainless steel (austenite, ferrite, martensite), steel materials (carbon steel for mechanical structure, rolled steel for general structure), super invar, kovar, etc.) , Ceramics (aluminum oxide, aluminum nitride, silicon carbide, etc.), resins (polycarbonate resin, acrylic resin, polyamide resin, epoxy resin, ABS, ASA, PBT, etc.), fillers (magnesium oxide, aluminum oxide, nitridation) for these resins Aluminum, silicon carbide, graphite, titanium oxide, etc.) are added. Of these, aluminum and aluminum alloys are preferred because they are lightweight and inexpensive. By forming the holding member itself integrally, the contact thermal resistance can be reduced and the heat dissipation effect can be improved as compared with the case where a plurality of layers are connected. Moreover, since the process of forming individual layers and the process of laminating these layers are not required, the manufacturing process can be simplified. Furthermore, since the number of parts is small, assembly can be performed easily.

  The holding member 10 has a first main surface 10a and a second main surface 10b that is the opposite surface of the first main surface 10a. As for this holding member 10, the 2nd main surface 10b turns into a light-projection surface.

(Thin film part 11 and thick film part 12)
A thin film portion 11 and a thick film portion 12 adjacent to the thin film portion 11 are disposed on the first main surface 10 a of the holding member 10. In other words, by forming a recess in the first main surface 10a, a thin film portion is provided as a region corresponding to the bottom surface of the recess, and a thick film portion is provided as a region adjacent to the thin film portion.
In the holding member 10 shown in FIGS. 1A to 1E, the thin film portions 11 and the thick film portions 12 are alternately arranged in a stripe shape. The thin film portion 11 and the thick film portion 12 extend to both end portions in the longitudinal direction on the first main surface 10 a of the holding member 10. In this case, the alternating arrangement may be such that the striped arrangement starts from either the thin film portion or the thick film portion. That is, it includes both a thin film portion-thick film portion-thin film portion and a thick film portion-thin film portion-thick film portion.
In the first main surface 10a, it is preferable that a plurality of stripe-shaped concave portions are arranged as the thin film portion 11 apart from each other. In other words, the first main surface 10a is preferably arranged parallel to each other. The thick film portion 12 can be arranged in an arbitrary shape. For example, the thin film portions adjacent to each other or the thick film portions adjacent to each other may be partially connected.

  The width of the thin film portion 11 may be constant over the entire length or may vary. The width of the thick film portion 12 may be constant over the entire length or may vary. The plurality of thin film portions 11 may have different widths or the same width. The plurality of thick film portions 12 may have different widths or the same width. The plurality of thin film portions 11 and thick film portions 12 may have different widths from each other, may be partially different in width, or may all have the same width. Especially, it is preferable that the thin film part 11 is the same width | variety mutually, and the thick film part 12 is the mutually same width | variety, and a thin film part and a thick film part have a different width | variety. With such an arrangement, it is possible to improve heat dissipation more efficiently in a limited plane area. A part of the thin film part and the thick film part may be wider than others, and the other part may be narrower than others.

  For example, the width of the thick film portion 12 of the holding member 10 is preferably larger than the width of the thin film portion 11. The difference in width here is not particularly limited and can be appropriately adjusted depending on the size of the semiconductor light emitting device to be mounted, the position of the terminal and mounting body, the size of the holding member, and the like. For example, the width of the thick film portion 12 is preferably about 1% to 30% and about 15% to 25% larger than the width of the thin film portion 11. With such an arrangement, it is possible to improve heat dissipation more efficiently in a limited plane area.

When the thin film portions 11 are arranged in two rows and are alternately arranged with the thick film portions 12, the width of the thick film portion 12 disposed on the outermost side of the holding member 10 is larger than the width of the thin film portion 11. Is also preferably large. Thereby, the heat dissipation effect can be exhibited more effectively.
Specifically, the width of the thin film portion 11 can be appropriately adjusted depending on the size, output, number, etc. of the semiconductor light emitting device to be mounted, but is preferably smaller than the diameter of the semiconductor light emitting device. It is preferably larger than the width of the terminal of the device. For example, about 20 to 100% of the diameter of the semiconductor light emitting device can be mentioned. Specifically, the width of the thin film portion is 2.5 mm to 3.9 mm, and the width of the thick film portion is 4.0 mm to 6.6 mm.

  In the holding member 10 shown in FIGS. 1A to 1E, the thin film portion 11 has a width of 3.6 mm and a maximum width of 6.0 mm, and the thick film portion 12 has a width of 5.0 mm (inside) and 4.5 mm (outside). . With such an arrangement, it is possible to improve heat dissipation more efficiently in a limited plane area. In the holding member 10, there is a portion where the thin film portion 11 is partly wider than the thick film portion. Thus, the terminal of the semiconductor light emitting device can be reliably pulled out while ensuring heat dissipation.

The thick film portion 12 preferably occupies 50% or more of the area of the first major surface 10a of the holding member 10, more preferably 60% or more, and even more preferably 65% or more.
In the holding member 10 shown in FIGS.

The thicknesses of the thin film portion 11 and the thick film portion 12 are not particularly limited, and can be appropriately adjusted depending on the size, output, number, and the like of the semiconductor light emitting device to be mounted. For example, the thickness of the thick film portion 12 is preferably thicker than the entire length including the terminals of the semiconductor light emitting device. As a result, the semiconductor light-emitting device can be securely held by the holding member and sufficient heat dissipation can be ensured. The thickness of the thin film portion 11 is preferably thicker than the height not including the terminal of the semiconductor light emitting device.
As for the thickness of the thin film part 11 and the thick film part 12, about 6 mm-14 mm and about 12-18 mm are mentioned, respectively.
In the holding member 10 shown in FIGS. 1A to 1E, the thickness of the thin film portion 11 is 8.2 mm, and the thickness of the thick film portion 12 is 12.4 mm.

(Opening 13)
An opening 13 extending from the thin film portion 11 to the thick film portion 12 is disposed on the second main surface 10b. The opening is a recess for housing the semiconductor light emitting device. Although only one opening 13 may be arranged, it is preferably arranged in a row, and as shown in FIGS. 1A to 1E, it is preferably arranged in at least a pair of rows. For example, the number of openings 13 arranged in a row is preferably about 2 to 10, more preferably about 2 to 5, and more preferably 4 or 5. The number of columns is preferably 1 column or a pair (2 columns) or more, for example, 2 to 4 columns, 2 or 3 columns, and more preferably 2 columns. The arrangement of the openings 13 is preferably arranged in the matrix direction at regular intervals. The interval between the openings 13 is, for example, 0. Several mm to 5 mm or 1 mm to several mm can be mentioned.

  The shape of the opening 13 corresponds to the planar shape of the semiconductor light emitting device to be mounted, and examples thereof include a polygon such as a circle, an ellipse, and a quadrangle, or a planar shape that approximates this. In particular, those slightly larger than the planar shape of the semiconductor light emitting device are preferable. Specifically, the diameter (width) of the opening is 9.0 mm to 9.2 mm.

Further, the depth of the opening 13 may be shallower than the height not including the terminal of the semiconductor light emitting device to be mounted, may be the same, or may be slightly deeper. In the case where the depth of the opening is deep, a semiconductor light emitting device to be described later can be arranged flush with the surface of the holding member and inside the one surface. Accordingly, the semiconductor light emitting device can be protected from an unintended external force without protruding from the holding member. As a result, it is possible to effectively prevent deviation of the optical axis of emitted light (for example, laser light). Alternatively, the holding member 10 may have a thickness such that the upper surface of the semiconductor light emitting device is disposed flush with one surface of the holding member 10 or outside thereof. Thereby, size reduction of a light source device is realizable.
In the holding member 10 shown in FIGS. 1A to 1C, the opening 13 has a circular planar shape, a depth of 4.9 mm, and a diameter of 9.1 mm. The distance between adjacent openings is 2 mm. As shown in FIG. 1E, the side surface of the opening 13 is perpendicular to the first main surface 10a and the second main surface 10b in the depth direction. That is, the opening 13 has a constant diameter in the depth direction.

(Groove 15)
A groove 15 connected to the opening is disposed on the second main surface. The groove 15 may be a groove connected to only one opening, but is preferably a groove connecting adjacent openings. The adjacent openings in this case may be adjacent to any two-dimensional direction, or may be adjacent to all directions, but along the longitudinal direction of the holding member. Those adjacent to the column direction are preferable.
Although only one groove 15 may be disposed on the holding member, a plurality of grooves 15 are preferably disposed according to the number of openings. In particular, it is preferable that two grooves 15 are connected to one opening 13. Either or both of the two grooves may be a groove connected to only one opening. For example, when the opening is arranged at the end of the holding member, the groove on the holding member end side of the opening becomes a groove connected to only one opening, but such a groove is arranged In addition, the semiconductor light emitting device can be accurately aligned even at the opening disposed at the end of the holding member.

The position of the groove 15 with respect to the opening is not particularly limited, and is preferably matched with the position of a notch (described later) in the outer shape of the semiconductor light emitting device to be accommodated in the opening. In particular, in consideration of accurate alignment of the semiconductor light emitting device, the grooves 15 are preferably disposed at positions facing each other through one opening, particularly at a position where the distance between the grooves 15 is the longest. In other words, it is arranged symmetrically with respect to the center of the opening.
From another point of view, the position of the groove 15 with respect to the adjacent openings is preferably, for example, a position where the two openings are closest.
When the openings 13 are arranged in a row, the grooves 15 are preferably arranged on a straight line passing through the centers of the plurality of openings 13 in parallel to the row direction. With such an arrangement, accurate alignment of a plurality of semiconductor light emitting devices can be performed reliably. The plurality of semiconductor light emitting devices are a plurality of semiconductor lasers, and the deflection directions of light emitted from the semiconductor lasers can be made the same.

The planar shape of the groove is not particularly limited, and examples thereof include a circular shape, an elliptical shape, a polygonal shape such as a quadrangle, or a shape similar to these.
The length, width and depth of the groove connecting the openings are appropriately set according to the size, shape, position, etc. of the notch formed on the outer periphery of the semiconductor light emitting device to be mounted. be able to. The length of the groove connecting the openings is 0. Several mm-5 mm, 1 mm-several mm are mentioned. For example, the width is preferably smaller than the maximum distance between the surfaces constituting the cutout portion on the outer periphery of the semiconductor light emitting device. Several mm-5 mm, 1 mm-several mm are mentioned. The depth may be the same as the depth of the opening or may be shallower than the opening. However, when the semiconductor light emitting device is accommodated in the opening, the distance (depth direction) that reaches the notch It is preferable that it is deeper than the distance. Specifically, about 50% to 95% of the depth of the opening is mentioned, and about 60% to 90% is preferable.

  In the holding member 10 shown in FIGS. 1A to 1E, the groove has a rectangular shape in plan view having a length of 52 mm, a width of 2.0 mm, and a depth of 4.1 mm.

(First through hole 14)
The thin film portion 11 includes at least one first through hole 14 for exposing a terminal of the semiconductor light emitting device in one opening portion 13. In other words, the opening 13 has the first through hole 14 disposed on the bottom surface, and a part of the bottom surface of the opening penetrates.
The first through hole 14 may correspond to each of the pair of terminals of the semiconductor light emitting device, but is preferably a single hole for pulling out the pair of terminals together.
The size and the planar shape of the first through hole 14 are not particularly limited as long as the terminal and the shape of the semiconductor light emitting device can be drawn out, and are smaller than the opening 13 and further from the width of the thin film portion 11. Is preferably small. The planar shape may be any of a circle, an ellipse, a polygon, and the like.

The first through hole 14 may be formed at the center of the opening 13, or may be unevenly distributed on the outside or the inside of the holding member 10 in the opening 13. When unevenly distributed, it is preferable to unevenly distribute inside the holding member. This is to ensure heat dissipation as will be described later.
In the holding member 10 shown in FIGS. 1A to 1E, the first through hole has an oval shape in plan view with a depth of 3.3 mm and a size and shape of 5.0 mm × 2.5 mm.

(Other holes)
The holding member 10 has a recess, a through hole, a protrusion, and the like on the first main surface, the side surface, and / or the second main surface, in addition to the opening 13, the groove 15, and the first through hole 14 described above. Also good. The surface area of the holding member 10 can be increased by using these recesses, through holes, protrusions, etc., and the heat dissipation can be improved. Moreover, the holding member 10 can be fixed to an external member, a heat radiating member, or the like. Furthermore, it can utilize for the positioning at the time of attachment of components to a holding member, or attachment of holding member itself. Moreover, it can utilize also for fixation at the time of parallel / stacking holding members mutually vertically and horizontally. The through hole can be a counterbore. Thereby, the head of the screw can be hidden inside the holding member. In addition, the heat dissipation can be improved by increasing the surface area of the holding member.

  In the holding member 10 shown in FIG. 1A, a through hole 16 for inserting a reference pin for positioning, a through hole 17 for fixing other components, and a through hole 18 for fixing the holding member 10 with screws are respectively provided. A pair is formed.

The holding member 10 usually has exposed surfaces, that is, a first main surface, a second main surface, side surfaces adjacent to these main surfaces, an inner surface of the opening, an inner surface of the first through hole, and optionally the recesses and the through holes described above. The surface including the protrusions is covered with a plating film. The plating film can be formed of tin, gold, palladium, or the like using a method known in the art. The holding member 10 can improve the wettability of a joining member described later, for example, solder, by forming a plating film on the surface thereof.
The method for forming the plating film is not particularly limited, and any ordinary film formation method can be used.

Since the holding member has such a configuration, an increase in the number of components due to the shape can be suppressed while ensuring heat dissipation by making the first main surface uneven, thereby efficiently manufacturing. can do. As a result, the manufacturing process can be simplified and the cost can be reduced.
In addition, the number of parts can be reduced by soldering, and the cost can be further reduced.

Modification 1
As shown in FIGS. 1F and 1G, the holding member has the same circular shape as the opening 33. However, the holding member is the same as the holding member 10 of Embodiment 1 except that the opening 33 becomes wider as it approaches the second main surface 10b. It is the composition.
The opening 33 is adjacent to the bottom and has a vertical portion 33A whose side surfaces are perpendicular to the first main surface 10a and the second main surface 10b, and a vertical portion 33A adjacent to the second main surface 10b. And a taber portion 33B that is wide. 1F and 1G, the total depth of the opening 33 is 4.9 mm, and the vertical portion 33A has a depth of about 10 to 30%, specifically about 10 mm. From another viewpoint, the vertical portion 33A is preferably equal to the thickness of the substrate in the semiconductor light emitting device described later. The spread may be, for example, an inclination of about 1 to 1.5 degrees from the first main surface 10a in the cross section.

The opening 33 does not have the vertical portion 33A and may be only the taber portion 33B. However, the opening 33 includes a vertical portion 33A and a tapered portion 33B which is adjacent to the vertical portion 33A and becomes wider toward the second main surface. Is preferred.
By providing the vertical portion 33A in this way, the semiconductor light emitting device can stably hold the base body with high accuracy, for example, and thereby a sufficient heat radiation path can be secured. Moreover, when inserting a semiconductor light-emitting device in a holding member, it can insert easily by the taper part 33B, and an assembly defect can be prevented.

  It is preferable that the groove 15 reaches the vertical portion 33A. Thereby, it becomes possible to manufacture the light source device using a positioning jig described later with high accuracy.

Embodiment 2: Holding member 20
In the holding member 20 of this embodiment, as shown in FIG. 2, the holding of the first embodiment is substantially the same as that of the first embodiment except that the depth of the groove 25 arranged on the second main surface 20 b is the same as the depth of the opening 23. It has the same configuration as the member 10.
Therefore, the same effect as the holding member 10 is produced.

Embodiment 3: Light source device 30
The light source device 30 of this embodiment includes a holding member 10 and a semiconductor light emitting device 40 as shown in FIGS. The semiconductor light emitting device 40 can correspond to the number of openings in the holding member 10 and may be one, but it is preferable to provide a plurality. The plurality of semiconductor light emitting devices 40 may have partially or entirely different emission wavelengths, or may be the same.

  For example, as shown in FIGS. 4A to 4C, the semiconductor light emitting device 40 includes a semiconductor light emitting element 41 and a base 44. The semiconductor light emitting device 40 preferably further includes a mounting body 43 on which the semiconductor light emitting element 41 is mounted, a pair of terminals 46, and a cap 47.

  The semiconductor light emitting element 41 is formed of a nitride-based semiconductor material or the like known in the field, and examples thereof include a semiconductor laser and an LED. Especially, in the light source device of this embodiment, it is preferable to use a laser element, in particular, a multimode (transverse mode multi) element.

It is also called a base 44, a stem or an eyelet, on which the semiconductor light emitting element 41 is placed. The base 44 can be formed of, for example, iron, copper, silver, gold, aluminum, brass, and alloys thereof. Of these, a copper alloy coated with a gold plating film is preferable.
The shape of the base body 44 is not particularly limited, but is usually a columnar shape, preferably a cylindrical column, a polygonal column such as a rectangular parallelepiped or a cube. 4A to 4C, it has a cylindrical shape.

  The base body 44 is provided with a notch 48 on the outer periphery thereof. Although the number of the notch parts 48 may be one, it is preferable that it is a pair (two) or more.

  Although the shape of the notch 48 is not particularly limited, it may be any shape as long as it is connected to the upper surface of the base body 44 on the side surface of the base body 44, and is preferably connected to the lower surface from the upper surface. The planar shape of the notch 48 when viewed from the upper surface of the base body 44 may be a polygon such as a circle, an ellipse, or a rectangle, or a part of a shape similar to these. In particular, the notch 48 is preferably a shape having two planes and a curved surface, an edge or a corner that connects the two planes, and extends inward from the outer periphery of the base body 44 and is notched in a columnar shape by two planes connected to each other. The shape is more preferable. Specifically, the notch formed by cutting the outer periphery of the base body 4 into a shape in which the corners of the isosceles triangle are rounded when viewed from the top face of the base body 44 through the top face to the bottom face. Part is preferred.

  In the semiconductor light emitting device 40 shown in FIGS. 4A to 4C, the width (W in FIG. 4B) is 1.2 mm, the depth (D in FIG. 4B) is 0.5 mm, and the height (FIG. 4A) on the outer periphery of the base 44. Among them, a substantially isosceles triangular column with a height of 1.5 mm is cut out, and two cutout portions 48 are formed at positions facing each other.

The semiconductor light emitting element 41 is normally mounted on the mounting body 43 and mounted on the base body 44 together with the mounting body 43.
The mounting body 43 is also called a heat sink, and is preferably formed of copper, silver, gold, aluminum, an alloy thereof, or the like. Of these, a copper alloy coated with a gold plating film is preferable.
The mounting form of the semiconductor light emitting element 41 on the mounting body 43 is not particularly limited. For example, in consideration of the light emission direction such as end surface light emission or surface light emission of the semiconductor light emitting element 41, On the other hand, the semiconductor light emitting element 41 can be mounted horizontally or vertically with an intervening body 42 (so-called submount) interposed. The semiconductor light emitting element 41 is preferably bonded to the intervening body 42 using solder or silver paste. The position of the semiconductor light emitting element 41 on the mounting body 43 is not particularly limited, but in the present embodiment, for example, in consideration of mounting the mounting body 43 on the base body 44, it is unevenly distributed at one end. It is preferable to set it to the position.

  A pair of terminals 46 electrically connected to the semiconductor light emitting element 41 by wires 45 are drawn out to the other side of the base 44. The pair of terminals 46 may protrude from the center of the base body 44, but are preferably unevenly distributed in the outer circumferential direction.

  The semiconductor light emitting device 40 is usually mounted on a base 44 and hermetically sealed by a cap having a light extraction window on the light emitting side of the semiconductor light emitting element 41. The cap is made of stainless steel and has, for example, a cylindrical shape with a diameter of 6.85 mm. The lower end of the cap is provided with a hook-shaped portion, and the hook-shaped portion is welded to the upper surface of the base body 44. The light extraction window is made of glass and is arranged on the top of the cap.

The semiconductor light emitting device 40 is accommodated in the opening 13 of the holding member 10. In other words, the base 44 of the semiconductor light emitting device 40 is accommodated so as to directly or indirectly contact the bottom surface of the opening 13. Further, in the semiconductor light emitting device, the cutout portion 48 faces the groove 15 of the holding member 10 and is fixed to the holding member.
In the light source device 30 shown in FIGS. 3A to 3C, the semiconductor light emitting device 40 includes two cutout portions 48 at the farthest distance on the outer periphery (side surface) of the base body 44. The grooves 15 of the holding member 10 face each other and are accommodated and fixed in the openings 13 in a row.

By arranging the notch 48 so as to face the groove 15, particularly, by arranging the notch 48 so as to face the groove 15 at two farthest distances, the alignment accuracy of the semiconductor light emitting device 40 can be improved. Can be reliably improved.
That is, in the plurality of semiconductor light emitting devices fixed to the holding member, the deflection directions of the light emitted from all the semiconductor lasers can be made the same.

The terminal 46 of the semiconductor light emitting device 40 is disposed in the first through hole 14. The tip of the terminal 46 is preferably disposed on the inner side of the second main surface 10 b of the holding member 10. Such an arrangement can prevent the terminal from being damaged due to an unintended external force.
Or the front-end | tip of the terminal 46 may be arrange | positioned outside the 1st main surface 10a of the holding member 10. FIG. With such an arrangement, the distance from the external space or the external heat radiating portion is shortened, so that heat dissipation can be improved.

It is preferable that the semiconductor light emitting device 40 is accommodated in the opening 13 such that a mounting body 43 that is unevenly distributed at one end of the semiconductor light emitting device 40 is disposed in the thick film portion 12.
Moreover, when fixing the semiconductor light-emitting device 40 to the holding member 10, although press-fitting may be sufficient, it is preferable that it is fixed by the joining member. Examples of the joining member include solders such as tin-bismuth, tin-copper, tin-silver, and gold-tin, conductive pastes such as silver, gold, and palladium, and brazing materials such as low melting point metals. Can be mentioned. Among these, it is preferable to use solder. As a result, the heat generated in the semiconductor light emitting device 40, that is, the laser element is first dissipated through the mounting body 43 and the base body 44 in the semiconductor light emitting device 40. Subsequently, it is further diffused to the holding member 10 through contact with the opening 13 and the thick film portion 12 of the holding member 10 over a wide area by solder. As a result, a heat dissipation effect can be reliably obtained. In particular, compared to the case where the mounting body 43 is disposed on the thin film portion 11 of the holding member 10, a large heat dissipation effect is exhibited.

  In particular, in the case where the vertical portion 33A adjacent to the bottom of the opening 33 is arranged as in the holding member shown in FIGS. 1F and 1G, the semiconductor light emitting device can be used both in press-fitting and in fixing using a joining member. The base 44 can be easily brought into contact with the vertical portion 33A. Therefore, the heat dissipation path can be more reliably ensured. In the case of using a bonding member, the base 44 of the semiconductor light emitting device can be brought into contact with the bottom surface of the vertical portion 33A and the opening 33, which is more advantageous.

Since the opening 13 corresponds to the shape and size of the semiconductor light emitting device 40, when the semiconductor light emitting device 40 is placed on the holding member 10, it is not necessary to perform excessive pressing or press fitting. The resulting damage can be avoided.
In addition, it is possible to appropriately secure an arrangement space for the fixing / connecting member used for fixing. Therefore, the semiconductor light emitting device 40 can be fixed / connected to the holding member 10 efficiently and effectively.
Furthermore, it is possible to compensate for expansion when each member constituting the semiconductor light emitting device 40 is thermally expanded due to heat generated by the semiconductor light emitting element, thereby preventing misalignment of the semiconductor light emitting device 40, deviation of the optical axis of the laser light, and the like. be able to. In addition, since the periphery of the semiconductor light emitting device 40 can be appropriately surrounded by the holding member 10, the generated heat can be more effectively released to the holding member 10.

Embodiment 4: Method for Manufacturing Light Source Device The light source device 30 described above can be manufactured by the following method.
(1) First, the holding member 10 and the semiconductor light emitting device 40 described above are prepared.
(2) Next, a positioning jig having a width smaller than the width of the groove 15 of the holding member 10 is prepared.

The positioning jig is a jig used to face the groove 15 of the holding member 10 and the notch 48 in the semiconductor light emitting device 40 as shown in FIGS. 5 and 6A to 6D, for example. This positioning jig can be easily faced by inserting both into the groove 15 of the holding member 10 and the notch 48 in the semiconductor light emitting device 40 at the same time. Thereby, the position in the opening 13 of the semiconductor light emitting device 40 can be avoided and the position thereof can be specified.
For this purpose, the positioning jig has the form of a pin. As shown in FIGS. 5, 6 </ b> A, and 6 </ b> B, the positioning jig 60 is preferably a member that includes two or more pins 61 arranged at predetermined positions.
In the following description, a member including one or more pins 61 may be used as the positioning jig 60, but the pins themselves may be described as positioning jigs.

The size and shape of the pin 61 can be appropriately set depending on the size and shape of the groove of the holding member 10 to be used, the shape of the semiconductor light emitting device, the size and shape of the notch, and the like.
For example, the pin 61 is preferably cylindrical or columnar. By adopting such a shape, it can be easily and simultaneously inserted into the notch 48 of the semiconductor light emitting device 40 accommodated in the opening 13 and the groove of the holding member 10. The pin 61 has only to be inserted into the groove of the holding member 10 and has a diameter of about 1.5 mm, for example.
The pin 61 is preferably smaller than the width of the groove 15 and smaller than the width at the outer periphery of the notch 48. Further, as described above, when the notch 48 is a portion that extends inward from the outer periphery of the base body 44 and is notched in a columnar shape by two planes connected to each other, the plan view has a circular shape that contacts the two planes. Or it is more preferable that it is an elliptical cylinder or columnar shape. That is, it is more preferable that it is the same diameter as the inscribed circle of the two planes constituting the notch 48 or a cylinder or columnar shape smaller than the diameter.

When a plurality of pins 61 are arranged as the positioning jig 60, the interval and position thereof are appropriately set depending on the size and shape of the groove of the holding member 10 to be used, the shape of the semiconductor light emitting device, the size and shape of the notch, and the like. can do.
For example, it is preferable that a plurality of pins 61 are arranged at equal intervals in rows at positions corresponding to the grooves 15 formed on both sides of the opening 13. The distance is, for example, about several mm to several tens mm, preferably 5 mm to 20 mm, and more preferably 8 mm to 15 mm.

  The positioning jig 60 preferably includes a through hole, a recess, a protrusion, and the like corresponding to the holding member 10 to be used in addition to the pin 61. For example, a through hole or protrusion having a size, shape, and position corresponding to the through hole 62 and through holes 16 to 17 corresponding to the opening 13 into which the semiconductor light emitting device 40 is inserted (in FIGS. 6C and 6D). 63). Using these through holes, recesses, protrusions, etc., positioning, fixing, fitting and the like can be performed easily and simply.

(3) The semiconductor light emitting device 40 is accommodated in the opening 13 of the holding member 10. At that time, a bonding member (for example, solder) for fixing the semiconductor light emitting device 40 to the holding member 10 is installed together in the opening. If the solder is solid, it can be placed on the bottom surface of the opening 13 using a collet or tweezers. If it is pasty, it can be applied to the bottom surface using a dispenser or the like.
The holding member 10 is preferably accommodated in the opening 13 by pressing the semiconductor laser device 100 appropriately.

(4) As shown in FIGS. 5 and 6A to 6D, the pin 61 constituting the positioning jig 60 is inserted into the groove 15 of the holding member 10 and the notch 48 of the semiconductor light emitting device 40 in the opening 13. 6C and 6D show a state in which only the pin 61 and the protrusion 63 are inserted into the groove 15 of the holding member 10 and the notch 48 of the semiconductor light emitting device 40 for convenience of explanation. At this time, one pin 61 is inserted into the groove 15 of the holding member 10 and the two notches 48 of the two semiconductor light emitting devices 40 accommodated on both sides of the groove 15 at the same time. It is necessary to appropriately combine the shape, size, and position of the groove 15 with the shape, size, and position of the groove 15 and the shape, size, and position of the notch 48 in the semiconductor light emitting device 40.
The positioning jig of this embodiment may be configured by only a plurality of pins 61 as shown in FIGS. 6C and 6D, but in consideration of positioning efficiency, the flat plate shown in FIGS. 5, 6A and 6B For example, the plurality of pins 61 are preferably fixed in advance.

  Thereby, the position of the notch 48 of the semiconductor light emitting device 40 with respect to the holding member 10 can be easily and simply adjusted. That is, all the semiconductor light emitting devices 40 can be easily and easily positioned with respect to the holding member 10 so as to be in the same direction with high accuracy. As a result, it is possible to make the deflection direction of the light emitted from the semiconductor laser of the semiconductor light emitting device 40 in the light source device 30 the same.

(5) Thereafter, the semiconductor light emitting device 40 is accommodated and the holding member 10 that has been aligned is heated by a heating device or the like and then cooled, so that the solder is softened and then solidified. It can be fixed to the holding member 10.
By such a method, the alignment of the semiconductor light emitting device to the holding member can be performed simply and easily with high accuracy. As a result, it is possible to easily and easily align the beams for a plurality of semiconductor light emitting devices. In other words, the light emitted from the semiconductor light-emitting device has linear polarization, but by accurately realizing the alignment of the semiconductor light-emitting device, the semiconductor light-emitting device is not rotated, and thus the polarization is not rotated. The deflection direction of light emitted from the semiconductor laser can be made the same. As a result, it is possible to apply the beam characteristic to a purpose of use. Specifically, the light emitted from the light source device can be used effectively without loss in subsequent optical components by aligning the longitudinal direction and the short direction of the laser light. Further, by aligning the polarization direction, for example, light can be used effectively when the liquid crystal element is passed after the light source device.

Embodiment 5: Method for Manufacturing Light Source Device In the method for manufacturing a light source device according to this embodiment, instead of using the positioning jig 60 shown in FIGS. 6A and 6B, two pins 71 are used as shown in FIGS. 7A and 7B. May be used as a positioning jig.
Manufacturing methods other than those described above are substantially the same as those in the fourth embodiment, and have the same effects as in the fourth embodiment.

Modification: Method for Manufacturing Light Source Device In the method for manufacturing a light source device according to this embodiment, a single pin 81 is positioned as shown in FIGS. 8A and 8B instead of the positioning jig 60 shown in FIGS. 6A and 6B. A jig may be used. Here, one pin 81 is arranged corresponding to the groove near the outside of the holding member of the opening 13 arranged at the outermost end, but the groove inside the opening 13 arranged at the outermost end. It may be arranged at a position corresponding to, or may be arranged at a position corresponding to a groove on either side of any opening 13 in the holding member 10.
Manufacturing methods other than those described above are substantially the same as those in the fourth embodiment, and have substantially the same effects as those in the fourth embodiment.

Embodiment 6: Holding Member The holding member 10B of this embodiment has substantially the same configuration as the holding member of Embodiment 1 except that no groove is formed. That is, as shown in FIGS. 9A and 9B, this holding member has a first main surface 10a and a second main surface 10b on the opposite side of the first main surface 10a.
A thin film portion 11 and a thick film portion 12 adjacent to the thin film portion 11 are disposed on the first main surface 10a.
In the second main surface 10b, a plurality of arrayed openings 33 for housing semiconductor light emitting devices are disposed, which are formed from the thin film portion 11 to the thick film portion 12.
The opening 33 becomes wider as it approaches the second main surface 10 b, and the through hole 14 for exposing the terminal of the semiconductor light emitting device formed in the thin film portion 11 is disposed in the opening 33.
The shape and the like of the opening 33 are as described in the first modification of the holding member.

Embodiment 7: Manufacturing Method of Light Source Device The light source device 50 shown in FIG. 9C can be manufactured by, for example, bonding the semiconductor light emitting device 40 to the holding member 10B as follows.
First, solder is installed on the bottom surface of the opening 33 of the holding member 10B. If the solder is solid, it can be installed using a collet, tweezers or the like, and if it is a paste, it can be applied using a dispenser or the like.
Next, the semiconductor light emitting device 40 is placed on the installed solder. At this time, the solder material can be uniformly disposed on the bottom surface and the side surface of the opening 33 by appropriately pressing the semiconductor light emitting device 40.
Finally, it is heated by a heating device or the like and then cooled. Thereby, the solder is softened and then solidified, and the semiconductor light emitting device 40 can be bonded to the holding member 10B.
Such a semiconductor light emitting device can be easily introduced into the opening 33 of the holding member 10B, can be brought into close contact with the base 44 of the semiconductor light emitting device 40 by the vertical portion 33A of the opening 33, and a heat dissipation path can be secured. Become.

  The light source device of the present invention is used for various light sources such as projectors, illumination light sources, various indicator light sources, in-vehicle light sources, display light sources, liquid crystal backlight light sources, traffic lights, in-vehicle components, and signboard channel letters. be able to.

10, 10A, 20 Holding member 10a, 20a First main surface 10b, 20b Second main surface 11, 21 Thin film portion 12, 22 Thick film portion 13, 23, 33 Opening portion 14, 24 Through hole 15, 25 Groove 16, 17, 18 Through hole 30, 50 Light source device 33A Vertical portion 33B Tapered portion 40 Semiconductor light emitting device 41 Semiconductor light emitting element 42 Intervening body 43 Mounting body 44 Base body 45 Wire 46 Terminal 47 Cap 48 Notch portion 60 Positioning jig 61, 71, 81 Pin (positioning jig)
62 holes

Claims (15)

A holding member of a semiconductor light emitting device,
The holding member has a first main surface and a second main surface opposite to the first main surface. The thin film portion and the thick film portion adjacent to the thin film portion are formed on the first main surface. Is placed,
The second main surface is formed with a plurality of arrayed openings for housing a semiconductor light emitting device formed from the thin film portion to the thick film portion, and a groove connecting between the adjacent openings.
A holding member for a semiconductor light emitting device, wherein a through hole for exposing a terminal of the semiconductor light emitting device formed in the thin film portion is disposed in the opening.   The holding member according to claim 1, wherein the groove is shallower than the opening.   The holding member according to claim 1, wherein the holding member has a portion where a plurality of thin film portions and thick film portions are alternately arranged in a stripe shape.   The holding member according to claim 3, wherein a width of the thick film portion is larger than a width of the thin film portion in the opening.   The holding member according to any one of claims 1 to 4, wherein the holding member is made of an integrally formed metal.   The holding member according to claim 1, wherein the opening is wider as it approaches the second main surface. A light source device comprising a semiconductor light emitting device and the holding member according to any one of claims 1 to 6,
The semiconductor light emitting device comprises:
A semiconductor light emitting device;
A substrate on which the semiconductor light-emitting element is mounted and provided with a pair of notches on the outer periphery;
The holding member houses the base of the semiconductor light emitting device in the opening of the second main surface, and the semiconductor light emitting device has the cutout portion fixed to the holding member so as to face the groove. A light source device characterized by that. A plurality of the semiconductor light emitting devices are respectively accommodated in the plurality of openings;
The light source device according to claim 7, wherein the adjacent semiconductor light emitting device has the cutout portion facing through the groove.   9. The light source device according to claim 7, wherein the base body of the semiconductor light emitting device has a cylindrical shape, and includes a notch portion that extends inward from an outer periphery of the base body and is notched in a column shape by two planes connected to each other.   The light source device according to claim 7, wherein the semiconductor light emitting device is fixed to the holding member with solder.   The light source according to any one of claims 7 to 10, wherein the plurality of semiconductor light emitting devices held by the holding member are a plurality of semiconductor lasers, and the deflection directions of light emitted from the semiconductor lasers are the same. apparatus. Preparing the holding member according to any one of claims 1 to 6,
Preparing a semiconductor light-emitting device comprising a semiconductor light-emitting element and a base body on which the semiconductor light-emitting element is mounted and having a pair of notches on the outer periphery;
Preparing a positioning jig having a width smaller than the width of the groove of the holding member;
The semiconductor light emitting device is accommodated in the opening of the holding member,
A method of manufacturing a light source device, wherein the positioning jig is inserted into a groove and a cutout portion of the holding member to adjust a position of the cutout portion of the semiconductor light emitting device with respect to the holding member. The width at the outer periphery of the notch is smaller than the width of the groove,
The method of manufacturing a light source device according to claim 12, wherein the positioning jig is a cylindrical or cylindrical pin having a diameter equal to or smaller than an inscribed circle of the notch portion.   The method of manufacturing a light source device according to claim 12 or 13, wherein the positioning jig is a plurality of cylindrical or columnar pins arranged at equal intervals.   The at least one positioning jig is inserted into a groove of the holding member and two notches of the two semiconductor light emitting devices housed on both sides of the groove. Manufacturing method of the light source device.