JP2016021442A - Imprint device and method of manufacturing imprint device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce positional deviation of a mold in a holding section for holding the mold.SOLUTION: An imprint device for patterning on a substrate by molding an imprint material on the substrate has a holding section for holding the mold, a plurality of contact parts that can come into contact with the side face of the mold held by the holding section, a plurality of actuators for giving force to the side face via the contact part in contact with the side face by moving each of contact parts, a plurality of measurement sections for moving each of contact parts by the plurality of actuators, and measuring the travels of the plurality of contact parts from respective reference positions until coming into contact the side face, and a control section for moving the mold held by the holding section via the contact parts by each of actuators, based on the travels measured by the plurality of measurement sections.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an imprint apparatus and an article manufacturing method.

  In recent years, miniaturization of semiconductor devices has progressed, and as a technique for manufacturing such semiconductor devices, an imprint technique for curing a resin in a state where a mold and a resin on a substrate are in contact with each other is used. There are several resin curing methods in imprint technology, and one of them is a photocuring method. In an imprint apparatus that employs a photocuring method, for example, an ultraviolet ray is irradiated in a state where a transparent mold is in contact with an ultraviolet curable resin, the resin is cured on the substrate, and then the mold is pulled away to remove the resin on the substrate The pattern is formed.

  When filling the mold pattern with resin by bringing the mold into contact with the resin, helium or the like from around the mold is used to reduce the defects in the pattern formed on the substrate by suppressing air bubbles mixed in the resin. It is good to supply the gas. Therefore, the imprint apparatus generally includes a gas supply mechanism that supplies a gas such as helium in the vicinity of the mold.

  In general, the imprint apparatus also includes a magnification correction mechanism that deforms a mold (pattern thereof) in order to correct a magnification error of a pattern on a substrate generated in a semiconductor process. The magnification correction mechanism includes an actuator, an elastic hinge (link mechanism), and the like, and is arranged at a plurality of locations so as to surround the outer periphery of the mold. The magnification correction mechanism deforms the mold itself by applying an external force to the mold by an actuator, and corrects the shape of the mold pattern. The magnification correction mechanism can change the shape of the mold pattern to match the shape of the pattern on the substrate. The shape of the mold pattern affects the overlay accuracy of the mold pattern and the pattern on the substrate. Therefore, in order to cope with the recent miniaturization of semiconductor devices, the magnification correction mechanism needs to correct the mold pattern with an accuracy of several nanometers or less.

  On the other hand, a change in the position of the mold (positional deviation) in a mold holding portion such as a chuck that holds the mold also affects the overlay accuracy between the mold pattern and the pattern on the substrate. Therefore, it is necessary to measure the misalignment of the mold in the mold holding part at the time of replacing the mold and correct the misalignment. Therefore, for example, a technique for measuring the amount of displacement of the side surface of the mold and correcting the magnification of the mold pattern has been proposed (see Patent Document 1). In such a technique, it is possible to measure and correct the position of the mold by measuring the side surface of the mold.

JP 2012-23092 A

  In the conventional imprint apparatus, for example, 16 magnification correctors are arranged so as to surround the side surface (outer peripheral part) of the mold. However, when a wide range of shape correction of the mold pattern is required, it is necessary to increase the size of the actuator and increase the rigidity (enlargement) of the elastic hinge. In addition to such a magnification correction mechanism, in the imprint apparatus, the gas supply mechanism must be arranged at a plurality of locations on the side surface of the mold, and the arrangement space is limited, so the amount of gas supplied from the gas supply mechanism May be insufficient. Therefore, it is very difficult to arrange the sensor for measuring the side surface of the mold in the space on the outer peripheral portion of the mold. Moreover, if the sensor which measures the side surface of a mold is provided in the inside of the member which contacts (presses) a mold like patent document 1, the rigidity of this member will be reduced.

  The present invention has been made in view of the problems of the prior art as described above, and an object of the present invention is to provide an imprint apparatus that is advantageous in reducing the positional deviation of the mold in the holding portion that holds the mold.

  In order to achieve the above object, an imprint apparatus according to one aspect of the present invention is an imprint apparatus for forming a pattern on the substrate by forming an imprint material on the substrate with a mold. The holding part, the plurality of contact parts that can contact the side surface of the mold held by the holding part, and the contact parts that are in contact with the side surface by moving each of the plurality of contact parts. A plurality of actuators that apply a force to the side surface, and a plurality of contact portions are moved by the plurality of actuators, and the amount of movement of each of the plurality of contact portions from the reference position until contacting the side surface is measured. A plurality of measuring units for performing the contact by each of the plurality of actuators based on the movement amounts measured by the plurality of measuring units. And having a control unit for moving the mold held by the holding portion by applying a force to the side via.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to reduce the misalignment of the mold in the holding unit that holds the mold.

It is the schematic which shows the structure of the imprint apparatus as 1 side surface of this invention. It is a figure which shows the structure of the mold holding part of the imprint apparatus shown in FIG. FIG. 2 is a schematic diagram illustrating an example of a configuration of a magnification correction unit of the imprint apparatus illustrated in FIG. 1. FIG. 2 is a schematic diagram illustrating an example of a configuration of a magnification correction unit of the imprint apparatus illustrated in FIG. 1. FIG. 2 is a schematic diagram illustrating an example of a configuration of a magnification correction unit of the imprint apparatus illustrated in FIG. 1. FIG. 2 is a schematic diagram illustrating an example of a configuration of a magnification correction unit of the imprint apparatus illustrated in FIG. 1. 3 is a flowchart for explaining imprint processing in the imprint apparatus shown in FIG. 1. FIG. 2 is a schematic diagram illustrating an example of a configuration of a magnification correction unit of the imprint apparatus illustrated in FIG. 1. FIG. 2 is a schematic diagram illustrating an example of a configuration of a magnification correction unit of the imprint apparatus illustrated in FIG. 1.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

<First Embodiment>
FIG. 1 is a schematic diagram showing a configuration of an imprint apparatus 1 as one aspect of the present invention. The imprint apparatus 1 is a lithography apparatus used in a semiconductor device manufacturing process, and performs an imprint process in which an imprint material on a substrate is formed with a mold to form a pattern on the substrate. In this embodiment, the imprint apparatus 1 employs a photocuring method and uses an ultraviolet curable resin that is cured by irradiation with ultraviolet rays as an imprint material. However, the imprint apparatus 1 may adopt a thermosetting method.

  The imprint apparatus 1 includes an irradiation unit 2, a mold holding unit 4, a substrate stage 6, a resin supply unit 7, a mold transport unit 8, and a control unit 9. In the following, the direction parallel to the irradiation axis of the ultraviolet rays applied to the resin on the substrate is defined as the Z axis, and the direction in which the substrate moves relative to the mold chuck in a plane perpendicular to the Z axis is defined as the X axis. The direction orthogonal to is the Y axis.

  The irradiation unit 2 irradiates the resin on the substrate with ultraviolet rays 10 through the mold 3 during the imprint process. The irradiation unit 2 includes a light source and a plurality of optical elements for adjusting ultraviolet rays emitted from the light source to ultraviolet rays 10 suitable for imprint processing.

  The mold 3 has a rectangular outer peripheral shape and is a mold in which a pattern to be formed on the substrate 5 such as a circuit pattern is formed on a surface (pattern surface) facing the substrate 5. The pattern surface of the mold 3 is processed with high flatness in order to maintain adhesion with the surface of the substrate 5. The mold 3 is made of a material that can transmit ultraviolet rays 10, for example, quartz.

  The mold holding unit 4 is a holding device for holding and fixing the mold 3. The mold holding unit 4 includes a magnification correction unit 11 and a mold chuck 12. The magnification correction unit 11 corrects the pattern of the mold 3 to a predetermined shape by applying a force (compression force) to the side surface of the mold 3 to deform the pattern of the mold 3. The mold chuck 12 holds the mold 3 by an adsorption force or an electrostatic force. The mold holding unit 4 has a mold drive system (not shown) that drives (moves) the mold chuck 12. Specifically, the mold driving system is for bringing the mold 3 into contact with the resin on the substrate (stamping operation) or for separating the mold chuck 12 of the mold 3 from the resin on the substrate (mold releasing operation). Drive in the Z-axis direction. The actuator that can be employed in the mold drive mechanism is not particularly limited as long as it can be driven at least in the Z-axis direction, and examples thereof include a linear motor and an air cylinder. The mold drive mechanism may be composed of a plurality of drive systems such as a coarse drive system and a fine drive system in order to position the mold 3 with high accuracy.

  The stamping operation and the releasing operation may be realized by moving the mold 3 in the Z-axis direction as in this embodiment, but it is realized by moving the substrate 5 (substrate stage 6) in the Z-axis direction. May be. Further, the stamping operation and the releasing operation may be realized by relatively moving both the mold 3 and the substrate 5 in the Z-axis direction.

  The substrate 5 includes, for example, a single crystal silicon substrate or an SOI (Silicon on Insulator) substrate. The substrate 5 is supplied (coated) with an ultraviolet curable resin.

  The substrate stage 6 is a stage device that holds the substrate 5 by vacuum suction and can freely move in the XY plane. An actuator that can be used for the substrate stage 6 includes, for example, a linear motor, but is not particularly limited.

  The resin supply unit 7 (dispenser) supplies (applies) uncured resin to the substrate 5. As described above, the resin supplied from the resin supply unit 7 is an ultraviolet curable resin that is cured by the irradiation of the ultraviolet rays 10 and is appropriately selected according to various conditions such as a device manufacturing process.

  The mold transport unit 8 transports the mold 3 between the stocker that accommodates the mold 3 and the mold holding unit 4. The mold transport unit 8 has a function of installing (holding) the mold 3 with respect to the mold chuck 12.

  The control unit 9 is configured by a computer including a CPU, a memory, and the like, for example, and controls the entire imprint apparatus 1 (operation and adjustment of each unit). The control unit 9 is connected to each unit of the imprint apparatus 1 via a line, and controls each unit according to a program or the like. The control unit 9 controls imprint processing and related processing. For example, in the present embodiment, the control unit 9 controls the holding force of the mold chuck 12 with respect to the mold 3 and also controls the operation of the magnification correction unit 11. The control unit 9 may be configured integrally with the imprint apparatus 1 as in the present embodiment, or may be configured separately from the imprint apparatus 1 and controlled remotely.

  With reference to FIG. 2, the structure of the mold holding part 4 is demonstrated. FIG. 2 is an XY plan view showing the configuration of the mold holding unit 4 as viewed from the substrate side. The mold holding unit 4 includes a plurality of magnification correction units 11 and a plurality of gas pipes 13 so as to face the periphery of the mold 3, specifically, each of the four side surfaces of the mold 3. The plurality of gas pipes 13 are provided in the same row as the magnification correction unit 11 and are pipes for supplying and collecting gas around the mold 3, that is, in a region adjacent to the side surface of the mold 3. When the resin on the substrate is filled in the pattern of the mold 3, the gas pipe 13 suppresses bubbles mixed in the resin and reduces a pattern defect formed on the substrate, for example, helium. Supply and collect.

  In the present embodiment, as shown in FIG. 2, four magnification correction units 11 are provided for each side surface of the mold 3, that is, 16 magnification correction units 11 are provided around the mold 3. Similarly, five gas pipes 13 are provided on each side surface of the mold 3, that is, twenty gas pipes 13 are provided around the mold 3. The gas pipe 13 is provided on each side surface of the mold 3 so as to sandwich the magnification correction unit 11. However, the arrangement and number of magnification correction units 11 may be appropriately changed according to the pattern shape and accuracy of the mold 3. Further, the arrangement and number of the gas pipes 13 may be appropriately changed as long as a sufficient amount of gas can be supplied and recovered.

  As described above, the gas pipe 13 supplies a necessary amount of gas such as helium from the gas supply device to the periphery of the mold 3. However, the leakage of the gas supplied to the periphery of the mold 3 is arranged in the vicinity of the substrate stage 6 and causes a measurement error of a length measuring device such as an interferometer that measures the position of the substrate stage 6. Accordingly, the gas pipe 13 needs to collect (exhaust) a sufficient amount of gas in order to prevent gas leakage. Each of the gas pipes 13 arranged around the mold 3 may be provided with both a supply port and a recovery port, or may be provided with only one of the supply port and the recovery port.

  The configuration of the magnification correction unit 11 will be described with reference to FIG. FIG. 3 is a schematic diagram illustrating an example of the configuration of the magnification correction unit 11. As illustrated in FIG. 3, the magnification correction unit 11 includes a support member 20 constituting a main body, and a contact unit 21 and an actuator 22 provided on the support member 20.

  The support member 20 is fixed to the side surface of the mold chuck 12. The contact portion 21 is provided so as to be able to contact the side surface of the mold 3 held by the mold chuck 12. Specifically, the contact portion 21 includes a contact surface 21a that can contact a region in the side surface of the mold 3, and the X-axis direction so as to apply a force (compression force) to the side surface of the mold 3 through the contact surface 21a. It is a movable member. The shape of the contact portion 21 may be a solid shape, and the contact portion 21 may be a cube, a cone, a frustum, or the like. The actuator 22 is provided, for example, coaxially with the moving axis of the contact portion 21. The actuator 22 expands and contracts itself, thereby moving the contact portion 21 and applying a force to the side surface of the mold 3 via the contact surface 21a contacting the side surface of the mold 3 (that is, transmitting the force to the contact portion 21). To do). As the actuator 22, for example, a piezo element, a pneumatic actuator, a linear motion motor, or the like can be used.

  Further, the arrangement (relative position) of the contact portion 21 and the actuator 22 is arbitrary as shown in FIGS. 4, 5, and 6. For example, if the elastic hinge 20 a is provided between the contact portion 21 and the actuator 22, the actuator 22 may not be provided coaxially with the moving axis of the contact portion 21. The elastic hinge 20a expands the displacement of the actuator 22 by utilizing the action of the lever by the deformation of the thin portion TWP.

  The magnification correction unit 11 illustrated in FIG. 3 includes a position sensor 23 a for detecting the position of the contact unit 21. On the other hand, the magnification correction unit 11 shown in FIGS. 4, 5 and 6 has a position sensor 23b for detecting the position of the elastic hinge 20a. The detection targets of the position sensor 23a and the position sensor 23b are structures provided near the side surface of the mold 3, as shown in FIGS. 3 to 6, in the present embodiment, the contact portion 21 and the elastic hinge 20a. However, the detection target of the position sensor 23a or the position sensor 23b may be a location that is displaced (moved) by driving the actuator 22 when a force is applied to the side surface of the mold 3, and the position is not specified. As the position sensors 23a and 23b, sensors of optical type, eddy current type, electrostatic capacity type and the like can be used. Further, the position sensors 23a and 23b are non-contact type sensors in the present embodiment, but may be contact type sensors.

  Each of the position sensors 23 a and 23 b is held by a sensor holding member 25 supported by the support member 20. As shown in FIG. 3, the position sensor 23a is not substantially in contact with the contact portion 21, and the contact portion 21 is movable without being in contact with the position sensor 23a. Similarly, as shown in FIGS. 4 to 6, the position sensor 23b does not substantially contact the elastic hinge 20a, and the elastic hinge 20a can move without contacting the position sensor 23b.

  In the present embodiment, as shown in FIGS. 3 to 6, the entire contact surface 21 a is in contact with the side surface of the mold 3. For example, a part of the contact surface 21 a is in contact with the side surface of the mold 3. Also good. Further, the position sensor 23a may be arranged so that the relative position between the mold 3 and the contact portion 21 can be detected.

  In the present embodiment, for example, when the imprint apparatus 1 is adjusted or assembled, the correlation between the detection value of the position sensor 23a (or 23b) and the movement amount (displacement amount) of the contact portion 21 driven by the actuator 22 is calculated in advance. By acquiring, it becomes possible to obtain the amount of movement of the contact portion 21. In addition, the position sensor 23 a can be used to determine the distance (clearance) between the side surface of the mold 3 and the initial position (reference position) of the contact portion 21 when the mold 3 is held by the mold chuck 12. is there. Specifically, based on the detection value of the position sensor 23a before the contact portion 21 is moved by the actuator 22, and the detection value of the position sensor 23a when the contact surface 21a is brought into contact with the side surface of the mold 3 by the actuator 22. Ask for clearance. Here, the clearance corresponds to the amount of movement from the reference position of the contact portion 21 until the contact surface 21 a contacts the side surface of the mold 3. Thus, the position sensor 23 a functions as a measurement unit for measuring the amount of movement from the reference position of the contact part 21 until the contact surface 21 a contacts the side surface of the mold 3. Therefore, the position (position shift) of the mold 3 in the mold chuck 12 can be obtained based on the amount of movement of each contact portion 21 of the plurality of magnification correction portions 11 provided around the mold 3. That the contact surface 21a of the contact part 21 has contacted the side surface of the mold 3 can be detected from, for example, a transition point of linearity between a command value to the actuator 22 and a detection value of the position sensor 23a.

  Hereinafter, the imprint process in the imprint apparatus 1 will be described with reference to FIG. As described above, the imprint process is performed by the control unit 9 controlling the respective units of the imprint apparatus 1 in an integrated manner. Here, the configuration of the magnification correction unit 11 shown in FIG. 3 will be described as an example.

  In step S <b> 101, the mold 3 is carried into the imprint apparatus 1 by the mold conveyance unit 8, and the mold 3 is held by the mold chuck 12.

  In S <b> 102, the contact portion 21 is moved by the actuator 22 to bring the contact surface 21 a into contact with the side surface of the mold 3. At this time, the position sensor 23 a detects the position of the contact portion 21 before the contact portion 21 is moved by the actuator 22 and the position of the contact portion 21 when the contact surface 21 a is brought into contact with the side surface of the mold 3. As described above, the contact of the contact surface 21a with the side surface of the mold 3 is detected from the transition point of linearity between the command value to the actuator 22 and the detection value of the position sensor 23a. Here, it is not necessary to drive the actuators 22 for all of the plurality of magnification correction units 11 provided around the mold 3, and it is sufficient to drive the actuators 22 of at least five magnification correction units 11 among them. However, if the outer dimensions of the mold 3 are known, at least three actuators 22 of the magnification correction unit 11 may be driven.

  In S 103, the clearance between the position of the contact portion 21 detected in S 102 and the initial position of the side surface of the mold 3 and the contact portion 21, that is, the contact portion 21 until the contact surface 21 a contacts the side surface of the mold 3. The amount of movement from the reference position is obtained. Specifically, as described above, the detection value of the position sensor 23 a before the contact portion 21 is moved by the actuator 22 and the detection value of the position sensor 23 a when the contact surface 21 a is brought into contact with the side surface of the mold 3. Based on this, the amount of movement of the contact portion 21 from the reference position is obtained.

  In S104, it is determined whether or not the movement amount from the reference position of the contact portion 21 obtained in S103 is within an allowable range. Here, the allowable range is the contact portion 21 until the contact surface 21 a comes into contact with the side surface of the mold 3 when the position of the mold 3 in the mold chuck 12 is not displaced (that is, the position displacement of the mold 3 is zero). The amount of movement is set as a reference. When the amount of movement of the contact portion 21 from the reference position is within the allowable range, that is, when the displacement of the mold 3 in the mold chuck 12 is allowable, the process proceeds to S106. On the other hand, if the amount of movement of the contact portion 21 from the reference position is not within the allowable range, that is, if the displacement of the mold 3 in the mold chuck 12 cannot be permitted, the process proceeds to S105.

  In S105, the position of the mold 3 in the mold chuck 12 is adjusted based on the amount of movement of the contact portion 21 from the reference position obtained in S103. Specifically, the actuator 3 moves the mold 3 held by the mold chuck 12 by applying a force to the side surface of the mold 3 via the contact surface 21a so that the displacement of the mold 3 in the mold chuck 12 is reduced. Let At this time, the movement amount from the reference position of the contact portion 21 obtained from the detection value of the position sensor 23a is held by the mold chuck 12 by the actuator 22 so that the movement amount is within a predetermined movement amount range (within an allowable range). The mold 3 is moved. When the position of the mold 3 in the mold chuck 12 is adjusted, the process proceeds to S102.

  When the mold 3 held on the mold chuck 12 by the actuator 22 is moved in S105, the holding force of the mold 3 by the mold chuck 12 may be reduced to the extent that the mold 3 does not fall. For example, the holding force of the mold 3 by the mold chuck 12 when moving the mold 3 held by the actuator 22 by the actuator 22 is greater than the holding force of the mold 3 by the mold chuck 12 when molding the resin by the mold 3. make low. As a result, the driving force of the actuator 22 can be reduced, and heat generated by driving the actuator 22 can be suppressed. Further, the holding force of the mold 3 by the mold chuck 12 may be reduced not only when adjusting the position of the mold 3 in the mold chuck 12 but also when correcting the magnification of the pattern of the mold 3. However, when the holding force of the mold 3 by the mold chuck 12 is reduced, the holding force of the mold 3 by the mold chuck 12 must be returned so that the position of the mold 3 in the mold chuck 12 does not shift. Specifically, at least when the mold 3 is pulled away from the cured resin on the substrate, it is necessary to return the holding force of the mold 3 by the mold chuck 12. For example, the holding force of the mold 3 by the mold chuck 12 is returned before the curing of the resin on the substrate is started or during the curing of the resin on the substrate.

  In S106, the magnification correction of the pattern of the mold 3 is performed so that the pattern of the mold 3 has a predetermined shape. Specifically, the actuator 22 applies a force to the side surface of the mold 3 via the contact surface 21a so that the pattern shape on the substrate matches the pattern shape of the mold 3 and is held by the mold chuck 12. The mold 3 is deformed. At this time, the alignment mark formed on the substrate and the alignment mark formed on the mold 3 may be detected by a scope (detector), and the shape may be matched using the detection result. Thus, the magnification correction unit 11 appropriately deforms the pattern of the mold 3 by pressing the contact portion 21 against the mold 3. At this time, the pattern of the mold 3 may be deformed by driving the actuator 22 so that the detection value of the position sensor 23a becomes the target value. Further, the actuator 22 may be driven using a sensor different from the position sensor 23a. Furthermore, a measurement unit that measures the shape of the pattern of the mold 3 may be provided, and the actuator 22 may be driven based on the measurement result of the measurement unit.

  In step S <b> 107, the substrate stage 6 is moved so that the substrate 5 is positioned below the resin supply unit 7 (resin supply position), and the resin supply unit 7 supplies the resin to the target shot area of the substrate 5. Here, the target shot area is a shot area to be subjected to imprint processing.

  In S108, the substrate stage 6 is moved so that the substrate 5 is located under the mold 3 (imprinting position), and the mold chuck 12 is driven to bring the mold 3 into contact with the resin on the substrate (imprinting operation). By bringing the mold 3 and the resin on the substrate into contact, the pattern of the mold 3 is filled with the resin.

  In S109, in a state where the mold 3 and the resin on the substrate are in contact with each other, the irradiation unit 2 irradiates the resin filled in the pattern of the mold 3 with ultraviolet rays to cure the resin.

  In S110, the mold chuck 12 is driven to separate the mold 3 from the cured resin on the substrate (mold release operation).

  In S111, it is determined whether or not the imprint process has been performed on all shot areas of the substrate 5. When the imprint process is not performed on all the shot areas of the substrate 5, that is, when there is a shot area where the imprint process is not performed, the process proceeds to S106. On the other hand, when the imprint process is performed on all the shot areas of the substrate 5, the process is terminated.

  In this embodiment, instead of directly detecting the side surface of the mold 3, the mold in the mold chuck 12 is based on the amount of movement from the reference position of the contact portion 21 obtained by detecting the location displaced by driving the actuator 22. 3 is reduced. Thereby, the position of the mold 3 in the mold chuck 12 can be adjusted with high accuracy without reducing the rigidity of the contact portion 21 that contacts the side surface of the mold 3.

  In the present embodiment, a plurality of gas pipes 13 are provided around the mold 3, but the present invention is not limited to this. For example, the magnification correction unit 11 may be configured by the actuator 22 and the position sensor 23 a without providing the gas pipe 13, and the magnification correction unit 11 may be provided around the mold 3.

  In this embodiment, the position sensor 23a is used to detect that the contact surface 21a is in contact with the side surface of the mold 3, but as shown in FIGS. 8A and 8B, the contact surface 21a is contacted. You may provide the detection part 26 which detects that the surface 21a contacted the side surface of the mold 3 separately. 8A and 8B are schematic diagrams illustrating an example of the configuration of the magnification correction unit 11 including the detection unit 26. FIG. The detection unit 26 includes, for example, a force sensor that detects a force generated when the actuator 22 is driven, specifically, a force generated when the contact surface 21 a contacts the side surface of the mold 3. In the magnification correction unit 11 shown in FIG. 8A, a detection unit 26 is provided between the support member 20 and the actuator 22, and in the magnification correction unit 11 shown in FIG. 8B, the elastic hinge 20a and the actuator 22 are provided. A detection unit 26 is provided between the two. However, the detection part 26 should just provide in the position which can detect the force produced when the contact surface 21a contacts the side surface of the mold 3, and does not specify the position. As a force sensor constituting the detection unit 26, a sensor such as a strain measurement method or a piezoelectric measurement method can be used.

  In the present embodiment, the magnification correction of the pattern of the mold 3 is performed before the mold 3 and the resin on the substrate are brought into contact with each other. However, the magnification correction of the pattern of the mold 3 may be performed after bringing the mold 3 into contact with the resin on the substrate. The magnification correction of the pattern of the mold 3 is generally performed in a state where the mold 3 is held on the mold chuck 12. Accordingly, when the actuator 22 is driven, a frictional force is generated between the mold 3 and the mold chuck 12, so that the driving force required for the actuator 22 is increased. Therefore, the magnification correction of the pattern of the mold 3 may be performed during a period from when the mold 3 is brought into contact with the resin on the substrate until the resin is cured. Thereby, when the magnification correction of the pattern of the mold 3 is performed, the mold 3 is in contact with the resin on the substrate, so that the holding force of the mold 3 by the mold chuck 12 can be reduced. Thus, if the actuator 22 is driven in a state where the holding force of the mold 3 by the mold chuck 12 is reduced, the driving force required for the actuator 22 can be reduced, and the heat generated by driving the actuator 22 can be reduced. Can be suppressed. After correcting the magnification of the pattern of the mold 3, the holding force of the mold 3 by the mold chuck 12 is returned so that the position of the mold 3 in the mold chuck 12 does not shift.

<Second Embodiment>
With reference to FIG. 9A and FIG. 9B, the configuration of the magnification correction unit 11 using the distortion detection method will be described. FIGS. 9A and 9B are schematic diagrams illustrating an example of the configuration of the magnification correction unit 11. The magnification correction unit 11 shown in FIGS. 9A and 9B is provided on the support member 20 and the support member 20 constituting the main body, similarly to the magnification correction unit 11 shown in FIGS. 3 to 6. A contact portion 21 and an actuator 22.

  The magnification correction unit 11 illustrated in FIG. 9A includes a strain sensor 24 a that detects strain of the actuator 22 when the actuator 22 is driven. On the other hand, the magnification correction unit 11 shown in FIG. 9B has a strain sensor 24b for detecting the strain of the elastic hinge 20a when the actuator 22 is driven. As shown in FIGS. 9A and 9B, each of the strain sensors 24a and 24b is provided on a structure provided near the side surface of the mold 3, in the present embodiment, on the actuator 22 and the elastic hinge 20a. Is provided. The detection target of the strain sensor 24a or the strain sensor 24b may be a location where strain is generated by driving the actuator 22, and does not specify the position. As the strain sensors 24a and 24b, sensors such as a resistance strain gauge method, a crystal diffraction method, and a thermoelastic method can be used.

  Also in the present embodiment, the movement amount of the contact portion 21 is obtained by acquiring in advance a correlation between the detection value of the strain sensor 24a (or 24b) and the movement amount (displacement amount) of the contact portion 21 by driving the actuator 22. It can be obtained. Further, it is possible to obtain the distance (clearance) between the side surface of the mold 3 and the initial position (reference position) of the contact portion 21 when the mold 3 is held by the mold chuck 12 using the strain sensor 24a. is there. Specifically, based on the detection value of the strain sensor 24a before the contact portion 21 is moved by the actuator 22, and the detection value of the strain sensor 24a when the contact surface 21a is brought into contact with the side surface of the mold 3 by the actuator 22. Ask for clearance. Thus, the strain sensor 24a functions as a measurement unit for measuring the amount of movement from the reference position of the contact part 21 until the contact surface 21a contacts the side surface of the mold 3. Therefore, the position (position shift) of the mold 3 in the mold chuck 12 can be obtained based on the amount of movement of each contact portion 21 of the plurality of magnification correction portions 11 provided around the mold 3.

<Third Embodiment>
A method for manufacturing a device (semiconductor device, magnetic storage medium, liquid crystal display element, etc.) as an article will be described. Such a manufacturing method includes a step of forming a pattern on a substrate (a wafer, a glass plate, a film-like substrate, etc.) using the imprint apparatus 1. The manufacturing method further includes a step of processing the substrate on which the pattern is formed. The processing step may include a step of removing the remaining film of the pattern. Further, it may include other known steps such as a step of etching the substrate using the pattern as a mask. The method for manufacturing an article in the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

DESCRIPTION OF SYMBOLS 1: Imprint apparatus 3: Mold 4: Mold holding part 5: Board | substrate 9: Control part 12: Mold chuck 11: Magnification correction | amendment part 21: Contact part 21a: Contact surface 22: Actuator 23a, 23b: Position sensor

Claims (12)

An imprint apparatus for forming a pattern on the substrate by forming an imprint material on the substrate with a mold,
A holding part for holding the mold;
A plurality of contact parts capable of contacting the side surface of the mold held by the holding part;
A plurality of actuators for applying a force to the side surface via the contact portion that has moved each of the plurality of contact portions and contacted the side surface;
A plurality of measuring units for measuring the amount of movement from each reference position of each of the plurality of contact parts until each of the plurality of contact parts is moved by the plurality of actuators and comes into contact with the side surface;
A control unit that moves the mold held by the holding unit by applying a force to the side surface via the contact unit by each of the plurality of actuators based on the movement amounts measured by the plurality of measuring units. When,
An imprint apparatus comprising:   The control unit has a holding force of the mold by the holding unit when the mold held by the holding unit is moved by each of the plurality of actuators, and the imprint material is formed by the mold. The imprinting apparatus according to claim 1, wherein the imprinting apparatus has a lower holding force than the holding force of the mold.   The control unit moves the mold held by the holding unit by each of the plurality of actuators so that the movement amount measured by the plurality of measurement units is within a predetermined movement amount range. The imprint apparatus according to claim 1, wherein: Each of the plurality of measuring units is
A sensor for detecting the position of the contact portion;
The detection value of the sensor before each of the plurality of contact portions is moved by the plurality of actuators, and the sensor when each of the plurality of contact portions is moved by the plurality of actuators to contact the side surface 4. The imprint apparatus according to claim 1, wherein the movement amount is obtained based on a detected value. A plurality of elastic hinges provided between each of the plurality of contact portions and each of the plurality of actuators;
Each of the plurality of actuators moves each of the plurality of contact portions by moving each of the plurality of elastic hinges,
Each of the plurality of measuring units is
A sensor for detecting the position of the elastic hinge;
The detection value of the sensor before each of the plurality of contact portions is moved by the plurality of actuators, and the sensor when each of the plurality of contact portions is moved by the plurality of actuators to contact the side surface 4. The imprint apparatus according to claim 1, wherein the movement amount is obtained based on a detected value. Each of the plurality of measuring units is
Including a strain sensor for detecting strain of the actuator;
The detection value of the sensor before each of the plurality of contact portions is moved by the plurality of actuators, and the sensor when each of the plurality of contact portions is moved by the plurality of actuators to contact the side surface 4. The imprint apparatus according to claim 1, wherein the movement amount is obtained based on a detected value. A plurality of elastic hinges provided between each of the plurality of contact portions and each of the plurality of actuators;
Each of the plurality of actuators moves each of the plurality of contact portions by moving each of the plurality of elastic hinges,
Each of the plurality of measuring units is
Including a strain sensor for detecting strain of the elastic hinge;
The detection value of the sensor before each of the plurality of contact portions is moved by the plurality of actuators, and the sensor when each of the plurality of contact portions is moved by the plurality of actuators to contact the side surface 4. The imprint apparatus according to claim 1, wherein the movement amount is obtained based on a detected value.   The imprint apparatus according to any one of claims 1 to 7, further comprising a detection unit that detects that each of the plurality of contact units has contacted the side surface.   The imprint apparatus according to claim 8, wherein the detection unit includes a force sensor that detects a force generated when each of the plurality of contact units contacts the side surface.   The control unit is configured to reduce the positional deviation of the mold in the holding unit, and then to adjust the shape of the pattern on the substrate and the shape of the pattern of the mold by each of the plurality of actuators. The imprint apparatus according to claim 1, wherein the mold held by the holding portion is deformed by applying a force to the side surface via the imprinting device. A gas pipe for supplying and collecting gas around the mold;
The imprint apparatus according to any one of claims 1 to 10, wherein the gas pipe is provided on each side surface around the mold so as to sandwich the actuator. Forming a pattern on a substrate using the imprint apparatus according to any one of claims 1 to 11,
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article comprising:

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