JP2015170502A - Manufacturing method for display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture simultaneously a plurality of display devices having a structure in which additional members are attached to light emission faces of display device main bodies without covering terminal portions of the display device main bodies.SOLUTION: The manufacturing method for display devices performs: a step of preparing base structures for main bodies including a plurality of scheduled main body parts arrayed; a step of preparing base structures for additional members including a plurality of scheduled additional member parts 30P arrayed and holding parts 131; a step of overlapping and jointing the base structures for main bodies and the base structures for additional members to prepare jointed structures 200 including a plurality of scheduled display device parts 100P arrayed; and a step of cutting the jointed structures 200 so that the plurality of scheduled display device parts 100P are separated from each other to make a plurality of display devices. The holding parts 131 have notch parts 132 formed at positions corresponding to a plurality of terminal parts 90 of the plurality of scheduled main body parts in the base structures for main bodies.

Description

  The present invention relates to a display device manufacturing method for manufacturing a plurality of display devices simultaneously.

  In recent years, flat panel display devices such as liquid crystal display devices and organic EL (Electro Luminescence) display devices are large displays used for televisions and small displays used for mobile phones, personal computers, smartphones, and the like. First, it is used as various displays. Among these, the organic EL display device has many advantages such as being thin and light, fast response, and high contrast.

  The organic EL display device has a plurality of pixels arranged in a matrix. In an organic EL display device capable of color display, one pixel includes, for example, three sub-pixels corresponding to each color of red (R), green (G), and blue (B). Hereinafter, an organic EL display device capable of color display using the active matrix method will be described. Each sub-pixel has an organic EL element and a drive circuit that drives the organic EL element. The organic EL element includes a light emitting layer made of an organic EL material, and an anode and a cathode sandwiching the light emitting layer. The drive circuit includes a thin film transistor (hereinafter referred to as TFT).

  An organic EL display device is generally manufactured as follows. First, a circuit unit including a plurality of driving circuits corresponding to a plurality of subpixels is formed on a base substrate made of glass, for example. Next, a plurality of anodes corresponding to the plurality of subpixels are formed. Next, a light emitting layer and a common electrode constituting a cathode of a plurality of subpixels are formed in order. Finally, hermetic sealing is performed with a sealing portion made of a glass substrate different from the base substrate, a multilayer thin film, or the like. By forming the base substrate and the sealing portion in the organic EL display device with a flexible material such as a resin, a flexible organic EL display device can be realized.

  The structure of the organic EL display device includes a bottom emission structure and a top emission structure. In the bottom emission structure, light generated in the light emitting layer is extracted from the base substrate side. In the top emission structure, light generated in the light emitting layer is extracted from the sealing portion side. Each structure has advantages and disadvantages. That is, in the bottom emission structure, the aperture ratio of the pixel is smaller than in the top emission structure, but the manufacture of the organic EL display device is facilitated. On the contrary, in the top emission structure, the aperture ratio of the pixel is larger than that in the bottom emission structure, but it is difficult to manufacture the organic EL display device.

  On the other hand, main methods for realizing an organic EL display device capable of color display include a three-color light emission method (three-color coating method) and a color filter method. In the three-color light emitting method, for example, three types of light emitting layers that generate light of each color of red (R), green (G), and blue (B) are provided as the light emitting layer. These three types of light emitting layers are formed by separately coating the light emitting materials of the respective colors. Specifically, the light emitting layer corresponding to each color is formed by evaporating a light emitting material of each color using a shadow mask corresponding thereto. In the three-color light emitting method, the production of the shadow mask is very difficult and expensive, so that the production cost of the organic EL display device is high, and the shadow mask is used, so that the high definition of the organic EL display device is high. There is a problem that it is difficult to increase the size and size.

  The color filter method is a method in which light generated in the light emitting layer is emitted through the color filter. In the color filter method, for example, a light emitting layer that generates white light can be used. This makes it possible to solve the above-described problem of the three-color light emission method.

  Hereinafter, a method for manufacturing an organic EL display device having a top emission structure including a color filter will be considered. As a method of manufacturing this organic EL display device, in general, a display device body that is a portion that does not include a color filter in the organic EL display device and a color filter are separately manufactured, and light in the display device body is produced. A method in which a color filter is bonded to the emission surface is used. The color filter is manufactured by forming a plurality of transmission portions that transmit different colors of light on a support layer formed of glass or the like. Generally, the display device body has a terminal portion arranged outside the light emitting surface when viewed from a direction perpendicular to the light emitting surface. The color filter is bonded to the light emitting surface without covering the terminal portion. In the case of manufacturing a flexible organic EL display device, the display device body and the color filter are both flexible.

  Further, as a method of manufacturing a top emission structure organic EL display device provided with a color filter, the following manufacturing method can be considered. The manufacturing method includes: a first substrate including a plurality of arrayed main body portions each scheduled to be a display device main body; and a plurality of arrayed color filter planned portions each scheduled to be a color filter Is bonded to the second substrate including the substrate, and a bonded structure is produced. The bonded structure is cut to simultaneously manufacture a plurality of organic EL display devices.

  According to the above manufacturing method, the productivity of the organic EL display device can be improved. However, in this manufacturing method, how to realize a structure in which the color filter does not cover the terminal portion of the display device body is a problem.

  Patent Document 1 describes a manufacturing method of a liquid crystal display element as follows. In this manufacturing method, first, a first substrate and a second substrate are bonded to each other through a sealing material to produce a structure including portions that are to be a plurality of liquid crystal display elements. The first substrate includes a plurality of terminal portions corresponding to the plurality of liquid crystal display elements, but the second substrate does not include a plurality of terminal portions. The sealing material is disposed so as to surround a region to be a display portion. Next, a liquid crystal material is sealed in a region surrounded by the seal material to form a display portion. Next, the dicing device forms first and second cuts in the structure at the positions of both ends of the material removal portion that is a part of the second substrate facing the terminal portion. The first notch penetrates the second substrate and the second notch does not penetrate the second substrate. Next, the first substrate is bent and removed by causing a material removal portion to be broken off. Next, the structure is divided for each liquid crystal display element.

  Patent Document 2 describes a method of removing the material removal portion of the first substrate by a method similar to the method described in Patent Document 1. In this method, the material removal portion is cut in a state where the material removal portion is curved without forming the second cut in the structure.

JP 2001-255518 A International Publication No. 2013/001771

  As described above, in the method of manufacturing an organic EL display device that simultaneously manufactures a plurality of organic EL display devices having a top emission structure including a color filter, the color filter covers the terminal portion of the display device body. The challenge is to achieve a structure that does not exist. In order to solve this problem, after applying a method described in Patent Literatures 1 and 2 to a method for manufacturing an organic EL display device to produce a bonded structure, the display device main body of the second substrate is manufactured. It is conceivable to remove a portion corresponding to the terminal portion (hereinafter referred to as an unnecessary portion). However, this has various problems as follows.

  First, the first problem will be described. When the methods described in Patent Documents 1 and 2 are applied to the method of manufacturing the organic EL display device, the first substrate and the second substrate are greatly deformed when an unnecessary portion of the second substrate is removed. Become. Due to the deformation of the first substrate and the second substrate, there is a possibility that the plurality of main body planned portions included in the first substrate and the plurality of color filter planned portions included in the second substrate may be damaged. This is the first problem.

  Next, the second problem will be described. In the methods described in Patent Documents 1 and 2, the sealing material for bonding the first substrate and the second substrate is disposed so as to surround a region to be a display portion. This is because a liquid crystal material is sealed in a region surrounded by the seal material to form a display portion. When the method described in Patent Documents 1 and 2 is applied to the method of manufacturing the organic EL display device, the adhesive layer for joining the display device body and the color filter exists only at the peripheral portion of the light emitting surface. Become. In this case, the bonding strength between the display device body and the color filter and the bending resistance of the organic EL display device are reduced. This is the second problem.

  Next, the third problem will be described. In the organic EL display device, in order to increase the bonding strength between the display device body and the color filter and the bending resistance of the organic EL display device, the adhesive layer for bonding the display device body and the color filter is formed on the entire surface of the light emitting surface. It is preferable to intervene between the color filter and the color filter. Therefore, in a manufacturing method for simultaneously manufacturing a plurality of organic EL display devices, when a bonded structure is manufactured by bonding a first substrate and a second substrate, a gap between the first substrate and the second substrate is formed. It is conceivable that an adhesive is interposed in the entire region. However, in this case, an unnecessary portion of the second substrate is bonded to the first substrate, so that the unnecessary portion cannot be removed. This is the third problem.

  Up to this point, various problems in the case where a plurality of organic EL display devices having a structure in which the color filter is bonded to the light emitting surface of the display device body without covering the terminal portion of the display device body are manufactured at the same time. I have explained. However, the above-mentioned various problems are that a plurality of display devices having a structure in which some additional member, not limited to a color filter, is bonded to the light emitting surface of the display device main body without covering the terminal portion of the display device main body are manufactured simultaneously. This is the case. Examples of the additional member other than the color filter include a touch panel and a circularly polarizing plate for preventing reflection of external light by the display device.

  The present invention has been made in view of such problems, and an object thereof is to provide a plurality of display devices having a structure in which the additional member is bonded to the light emitting surface of the display device body without covering the terminal portion of the display device body. An object of the present invention is to provide a method for manufacturing a display device that can be manufactured simultaneously.

  The display device manufacturing method of the present invention is a method of manufacturing a plurality of display devices. Each of the plurality of display devices manufactured by this manufacturing method includes a display device body and an additional member. The display device main body includes a plurality of pixels each emitting light, an outermost layer including a light emission surface for emitting light emitted from the plurality of pixels toward the outside of the display device main body, and a perpendicular to the light emission surface And a terminal portion disposed outside the light emitting surface when viewed from the direction. The additional member is bonded to the light emitting surface without covering the terminal portion.

The manufacturing method of the display device of the present invention includes:
A step of producing a main body base structure including a plurality of arranged main body planned portions, each of which is to be a display device main body;
A plurality of arranged additional member scheduled portions each of which is to be an additional member, and a holding portion that is positioned around the plurality of additional member planned portions and integrally holds the plurality of additional member planned portions Producing a base structure for the additional member;
A step of producing a joint structure including a plurality of arranged display device planned portions, each of which is to be a display device, by superimposing and joining the base structure for the main body and the base structure for the additional member,
And a step of cutting the joint structure so that the plurality of display device scheduled portions are separated from each other to become a plurality of display devices.

  In the manufacturing method of the display device of the present invention, the holding portion of the base structure for the additional member is attached to the plurality of terminal portions of the plurality of planned main body portions when the base structure for the main body and the base structure for the additional member are overlapped. It has a notch formed at a corresponding position.

  In the method for manufacturing a display device of the present invention, the step of producing the additional member foundation structure is an initial addition member foundation structure including a portion to be removed that is to be a notch portion by being removed later. Including a step of producing a foundation structure for an initial addition member that becomes a foundation structure for an additional member by removing the planned portion, and a step of removing a planned removal portion of the foundation structure for the initial addition member Good.

  In the display device manufacturing method of the present invention, both the display device body and the additional member may have flexibility.

  In the display device manufacturing method of the present invention, each of the plurality of display devices may further include an adhesive layer interposed between the entire surface of the light emitting surface and the additional member. In this case, in the step of producing the joint structure, after the step of joining the base structure for the main body and the base structure for the additional member using the adhesive and cutting the joint structure, a part of the adhesive is formed. It becomes an adhesive layer.

  In the method for manufacturing a display device of the present invention, the additional member may be a color filter.

  In the display device manufacturing method of the present invention, each of the plurality of display devices further includes an adhesive layer interposed between the entire surface of the light emitting surface and the additional member, and the additional member is a color filter. Also good. In this case, each of the plurality of pixels may include a plurality of subpixels corresponding to different colors. Each of the plurality of subpixels emits light. The light emitted from the plurality of sub-pixels passes through the outermost layer and is emitted from the light emission surface toward the outside of the display device body. The color filter includes a support layer having a first surface and a second surface facing away from each other, and a plurality of pixels arranged to correspond to the plurality of pixels on the first surface of the support layer. And a corresponding portion. Each of the plurality of pixel corresponding portions may include a plurality of sub pixel corresponding portions arranged to correspond to the plurality of sub pixels. The plurality of sub-pixel corresponding portions include a plurality of transmission portions that transmit light of different colors. The 2nd surface and light-projection surface of the support layer are bonded together through the contact bonding layer. Further, when viewed from a direction perpendicular to the first surface and the second surface, each outer edge of the plurality of subpixels may include a plurality of sides. The total thickness of the outermost layer, the adhesive layer, and the support layer between the plurality of pixels and the plurality of pixel corresponding portions is 1 of the shortest side length among all the sides included in the plurality of outer edges of the plurality of subpixels. It may be in the range of / 50 to 1/2.

  The support layer of the color filter may be made of resin. The resin constituting the support layer may be polyimide. The polyimide may be a fluorine-containing polyimide. Moreover, the polyimide may have a structural unit represented by the following general formula (1) or (2).

  The support layer may have a transmittance of 70% or more for light in the wavelength region of 440 to 780 nm. Moreover, the support layer may have a linear thermal expansion coefficient of 25 ppm / K or less. The support layer may have a glass transition temperature of 300 ° C. or higher.

  Further, the color filter may further include a rigid functional layer having a function of increasing the rigidity of the entire color filter. In this case, the plurality of pixel corresponding portions are arranged between the support layer and the rigid functional layer. The rigid functional layer may include at least one of a barrier layer, a touch panel, a circularly polarizing plate, and a protective layer.

  The color filter may further include a black matrix that separates a plurality of transmission portions from each other.

  Each of the plurality of subpixels may include an organic EL element. The organic EL element includes a light emitting layer made of an organic EL material. In this case, the display device body may further include a base substrate, and the plurality of pixels may be disposed between the base substrate and the outermost layer. The light emitting layer may generate white light.

  The additional member substructure may include a substrate that becomes a plurality of support layers by being cut later, and this substrate may be made of a resin. In this case, the step of manufacturing the additional member foundation structure is a step of arranging the resin layer on the support and forming the additional member foundation structure on the resin layer so that the resin layer and the substrate are in contact with each other. And a step of separating the support and the resin layer from the additional member basic structure at the boundary between the resin layer and the substrate. In this case, the adhesive strength between the resin layer and the substrate may be in the range of 1 to 500 N / m. Further, the arithmetic average roughness of the surface of the substrate in contact with the resin layer may be 100 nm or less.

  According to the display device manufacturing method of the present invention, it is possible to simultaneously manufacture a plurality of display devices having a structure in which the additional member is bonded to the light emitting surface of the display device body without covering the terminal portion of the display device body. There is an effect.

It is sectional drawing which shows the structure of the outline of the display apparatus manufactured by the manufacturing method which concerns on the 1st Embodiment of this invention. It is a top view of the display apparatus main body shown in FIG. It is a top view of the color filter shown in FIG. It is a schematic diagram which shows a partial cross section of the display apparatus shown in FIG. FIG. 5 is a schematic diagram illustrating a partial cross section of the display device main body illustrated in FIG. 4. FIG. 5 is a schematic diagram illustrating a partial cross section of the color filter illustrated in FIG. 4. It is a schematic diagram which shows the specific example of a structure of the color filter shown in FIG. FIG. 6 is an explanatory diagram showing a plurality of subpixels in the display device main body shown in FIG. 5. It is explanatory drawing which shows the some subpixel corresponding | compatible part in the color filter shown in FIG. FIG. 5 is an explanatory diagram for explaining an effect of the display device illustrated in FIG. 4. It is explanatory drawing for demonstrating the process of producing the substructure for main bodies in the 1st Embodiment of this invention. It is explanatory drawing for demonstrating the process of producing the foundation structure for initial stage additional members in the 1st Embodiment of this invention. It is explanatory drawing for demonstrating the process of removing the removal plan part of the foundation structure for initial addition members shown in FIG. It is explanatory drawing for demonstrating the process of producing the joining structure in the 1st Embodiment of this invention. It is explanatory drawing for demonstrating the process of cut | disconnecting the joining structure in the 1st Embodiment of this invention. It is explanatory drawing for demonstrating in detail the process of producing the substructure for main bodies in the 1st Embodiment of this invention. It is explanatory drawing for demonstrating in detail the process of producing the foundation structure for additional members in the 1st Embodiment of this invention. It is explanatory drawing for demonstrating in detail the process of producing the joining structure in the 1st Embodiment of this invention. It is explanatory drawing for demonstrating in detail the process of cut | disconnecting the joining structure in the 1st Embodiment of this invention. It is a schematic diagram which shows a partial cross section of the display apparatus manufactured by the manufacturing method which concerns on the 2nd Embodiment of this invention.

[First Embodiment]
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, a schematic configuration of a display device manufactured by the manufacturing method according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 3. The display device in the present embodiment is particularly an organic EL display device having a top emission structure.

  FIG. 1 is a cross-sectional view illustrating a schematic configuration of a display device according to the present embodiment. As shown in FIG. 1, the display device 100 according to the present embodiment includes a display device body 1 and an additional member. In the present embodiment, the additional member is in particular the color filter 30.

  FIG. 2 is a plan view of the display device main body 1 shown in FIG. The display device main body 1 includes a plurality of pixels each emitting light, an outermost layer including a light emission surface 1a for emitting light emitted from the plurality of pixels toward the outside of the display device main body 1, and a light emission And a terminal portion 90 disposed outside the light emitting surface 1a when viewed from a direction perpendicular to the surface 1a. The plurality of pixels and the outermost layer are not shown in FIGS. The plurality of pixels and the outermost layer will be described in detail later. As shown in FIG. 1, the display device body 1 further includes a base substrate 2 that holds a plurality of pixels and a terminal unit 90. The terminal unit 90 includes a plurality of terminals for electrically connecting a circuit provided in the display device body 1 and an external device. FIG. 1 shows an example in which the flexible wiring board 110 is connected to the terminal portion 90.

  FIG. 3 is a plan view of the color filter 30 shown in FIG. The color filter 30 is bonded to the light emitting surface 1 a without covering the terminal portion 90. The outer shape of the color filter 30 when viewed from the direction perpendicular to the light emitting surface 1a matches the outer shape of the light emitting surface 1a. Therefore, the outer shape of the color filter 30 when viewed from the direction perpendicular to the light emitting surface 1a is smaller than the outer shape of the display device body 1 when viewed from the direction perpendicular to the light emitting surface 1a. In FIG. 3, the broken line represents a part of the display device main body 1 located outside the color filter 30 when the display device 100 is viewed from the color filter 30 side. As shown in FIG. 1, the display device 100 further includes an adhesive layer 40 interposed between the entire light emitting surface 1 a and the color filter 30.

  Next, the configuration of the display device 100 shown in FIG. 1 will be described in detail with reference to FIGS. 4 to 6. FIG. 4 is a schematic diagram illustrating a partial cross section of the display device 100 illustrated in FIG. 1. FIG. 5 is a schematic diagram showing a cross section of a part of the display device body 1 shown in FIG. FIG. 6 is a schematic diagram illustrating a partial cross section of the color filter 30 illustrated in FIG. 4.

  As shown in FIGS. 4 and 5, the base substrate 2 of the display device body 1 described above has an upper surface 2 a and a lower surface 2 b that face away from each other. The terminal portion 90 is disposed on the upper surface 2 a of the base substrate 2.

  The display device body 1 includes a plurality of pixels 3 arranged on the upper surface 2a of the base substrate 2 and an outermost layer 14 including the light emitting surface 1a. Each of the plurality of pixels 3 emits light. The light emitting surface 1 a is a surface for emitting the light emitted from the plurality of pixels 3 toward the outside of the display device body 1. The plurality of pixels 3 are disposed between the base substrate 2 and the outermost layer 14. The light emitting surface 1 a is the upper surface of the outermost layer 14. The lower surface 2b and the light emitting surface 1a of the base substrate 2 face opposite to each other. In the present embodiment, the outermost layer 14 is particularly a sealing layer, and is constituted by, for example, a transparent multilayer thin film. In this multilayer thin film, the film constituting the surface (light emitting surface 1a) on which the color filter 30 is bonded may be a barrier film made of a transparent inorganic material film. This barrier film protects a light emitting layer made of an organic EL material, which will be described later, from entry of moisture and oxygen from the outside. When the layer including the light emitting surface 1a is a layer that realizes one function by a multilayer thin film like the sealing layer, the outermost layer in the present invention is a multilayer thin film that realizes one function. Is not the outermost film of the film, but the entire multilayer thin film that realizes one function. Both the display device body 1 and the color filter 30 may have flexibility. In this case, the display device 100 is also flexible.

  The base substrate 2 includes, for example, a base layer 21 made of resin and a barrier layer 22 laminated on the base layer 21. In this case, the upper surface 2 a is formed by the barrier layer 22, and the lower surface 2 b is formed by the base layer 21.

  Each of the plurality of pixels 3 includes a plurality of sub-pixels corresponding to different colors. Particularly in the present embodiment, one pixel 3 includes a sub-pixel 4R corresponding to red (R), a sub-pixel 4G corresponding to green (G), and a sub-pixel 4B corresponding to blue (B). It is out. Hereinafter, arbitrary sub-pixels are denoted by reference numeral 4. 4 and 5, the boundary between two adjacent sub-pixels 4 is indicated by a broken line. Note that one pixel 3 is not limited to including only the sub-pixels 4R, 4G, and 4B. For example, one pixel 3 may include a subpixel corresponding to yellow (Ye) and a subpixel corresponding to white (W) in addition to the subpixels 4R, 4G, and 4B.

  In the present embodiment, the display device body 1 has an active matrix structure. In this case, each of the plurality of subpixels 4 includes an organic EL element 5 and a drive circuit that drives the organic EL element 5. The organic EL element 5 includes a light emitting layer made of an organic EL material, and an anode 6 and a cathode sandwiching the light emitting layer.

  In the present embodiment, the light emitting layers of all the organic EL elements 5 generate white light. Moreover, in this Embodiment, the light emitting layer of all the organic EL elements 5 is not isolate | separated from each other. That is, the display device body 1 includes one white light emitting layer 7 disposed over all the organic EL elements 5, and each portion of the white light emitting layer 7 corresponding to each organic EL element 5 corresponds to each organic EL element 5. A light emitting layer is formed. The white light emitting layer 7 is made of an organic EL material that generates white light.

  Moreover, in this Embodiment, the cathode of all the organic EL elements 5 is not isolate | separated from each other. That is, the display device body 1 includes one common electrode 8 disposed over all the organic EL elements 5, and each portion of the common electrode 8 corresponding to each organic EL element 5 serves as a cathode of each organic EL element 5. It is composed.

  The drive circuit includes a TFT. In addition, the display device body 1 includes a plurality of signal lines for controlling a plurality of drive circuits of the plurality of subpixels 4. In the present embodiment, a portion where a plurality of driving circuits and a plurality of signal lines are combined is referred to as a circuit portion 10. The circuit unit 10 is connected to the terminal unit 90.

  The circuit unit 10 is disposed on the upper surface 2 a of the base substrate 2. The display device body 1 includes planarization layers 11 and 12 made of an insulating material. The planarization layer 11 is disposed around the circuit unit 10 on the upper surface 2 a of the base substrate 2. The planarization layer 12 covers the circuit unit 10 and the planarization layer 11. The upper surface of the planarization layer 12 is planarized. The plurality of anodes 6 of the plurality of subpixels 4 are disposed on the upper surface of the planarization layer 12. The plurality of anodes 6 are formed of a conductive material having light reflection characteristics. The display device body 1 further includes an insulating layer 13 disposed around the plurality of anodes 6 on the upper surface of the planarizing layer 12.

  The white light emitting layer 7 is disposed on the plurality of anodes 6 and the insulating layer 13. The common electrode 8 is disposed on the white light emitting layer 7. The common electrode 8 is formed of a transparent conductive material such as ITO (Indium Tin Oxide). The plurality of anodes 6 and the common electrode 8 are electrically connected to the circuit unit 10 through through holes or the like (not shown). The outermost layer (sealing layer) 14 is formed so as to cover all the organic EL elements 5.

  The barrier layer 22 of the base substrate 2 prevents moisture and oxygen from entering the display device body 1 in order to prevent moisture and oxygen from entering the white light emitting layer 7 and degrading the characteristics of the white light emitting layer 7. It is a layer for preventing. The barrier layer 22 is made of an inorganic material such as silicon oxide, aluminum oxide, silicon carbide, silicon oxide carbide, silicon carbonitride, silicon nitride, or silicon nitride oxide by, for example, chemical vapor deposition (hereinafter referred to as CVD). It can be obtained by forming a film. The barrier layer 22 may contain only one type of inorganic material as described above, or may contain two or more types.

  Each of the plurality of subpixels 4 emits light generated in the light emitting layer (white light emitting layer 7) toward the outermost layer 14. The display device main body 1 has a top emission structure in which light emitted from the plurality of subpixels 4 is emitted from the light emitting surface 1 a toward the outside of the display device main body 1 through the outermost layer 14.

  As shown in FIGS. 4 and 6, the color filter 30 includes a support layer 31 having a first surface (upper surface) 31 a and a second surface (lower surface) 31 b facing opposite to each other, and the support layer 31. And a plurality of pixel corresponding portions 33 arranged to correspond to the plurality of pixels 3 on the first surface 31a. The support layer 31 is made of a transparent material. As a material constituting the support layer 31, for example, a resin is used. The second surface 31b is a surface bonded to the light emitting surface 1a.

  Each of the plurality of pixel corresponding portions 33 includes a plurality of sub pixel corresponding portions arranged so as to correspond to the plurality of sub pixels 4. In the present embodiment, since one pixel 3 includes three subpixels 4R, 4G, and 4B, one pixel corresponding unit 33 includes three subpixel corresponding units 34R, 34G, and 34B. . Hereinafter, an arbitrary subpixel corresponding portion is denoted by reference numeral 34. 4 and 6, the boundary between two adjacent sub-pixel corresponding portions 34 is indicated by a broken line. The plurality of sub-pixel corresponding units 34 include a plurality of transmission units 35 that transmit different colors of light. The transmissive part 35 of the subpixel corresponding part 34R selectively transmits red (R) light, and the transmissive part 35 of the subpixel corresponding part 34G selectively transmits green (G) light. The transmission part 35 of 34B selectively transmits blue (B) light.

  The color filter 30 further includes a black matrix 36 that separates the plurality of transmission portions 35 from each other. The black matrix 36 is a portion that does not transmit light. The boundary between two adjacent subpixel corresponding portions 34 is located in the black matrix 36.

  The color filter 30 further includes a rigid functional layer 38 and an adhesive layer 37 that adheres the rigid functional layer 38 to the plurality of pixel corresponding portions 33. The rigidity functional layer 38 has a function of increasing the rigidity of the entire color filter 30. The plurality of pixel corresponding portions 33 are disposed between the support layer 31 and the rigid functional layer 38. The rigid functional layer 38 may include at least one of a barrier layer, a touch panel, a circularly polarizing plate, and a protective layer. In the present embodiment, the upper surface of the rigid functional layer 38 constitutes the surface 30 a of the color filter 30.

  FIG. 7 is a schematic diagram illustrating a specific example of the configuration of the color filter 30 illustrated in FIG. 6. In the color filter 30 illustrated in FIG. 7, the rigid functional layer 38 includes a barrier layer 38A, a circularly polarizing plate 38B, a touch panel 38C, and a protective layer 38D that are sequentially stacked from the bottom.

  The barrier layer 38A prevents moisture and oxygen from entering the plurality of transmission parts 35 in order to prevent moisture and oxygen from entering the plurality of transmission parts 35 and deteriorating the characteristics of the plurality of transmission parts 35. It is a layer for. The material and formation method of the barrier layer 38A are the same as those of the barrier layer 22.

  The circularly polarizing plate 38B includes a laminated polarizing plate and a quarter wavelength plate. The circularly polarizing plate 38 </ b> B has a function of preventing external light from being reflected by the display device 100. That is, when external light incident on the color filter 30 from the upper surface of the rigid functional layer 38 passes through the circularly polarizing plate 38B and is reflected in the display device 100 to generate reflected light, the circularly polarizing plate 38B The passage of this reflected light is blocked.

  The touch panel 38C is a device that outputs information on a touched position. As the touch panel 38C, various types such as a capacitance type and a resistance film type can be used.

  The protective layer 38D is a layer for protecting the constituent elements of the display device 100 located below the protective layer 38D. The touch panel 38C may also serve as the protective layer 38D. Further, the positions of the circularly polarizing plate 38B and the touch panel 38C may be opposite to the example shown in FIG.

  Next, the arrangement of the plurality of subpixels 4 and the plurality of subpixel corresponding portions 34 will be described with reference to FIGS. 8 and 9. FIG. 8 is an explanatory diagram showing a plurality of sub-pixels 4 in the display device body 1 shown in FIG. FIG. 8 particularly shows a plurality of subpixels 4 when viewed from a direction perpendicular to the first surface 31 a and the second surface 31 b of the support layer 31 of the color filter 30. FIG. 9 is an explanatory diagram showing a plurality of subpixel corresponding portions 34 in the color filter 30 shown in FIG. FIG. 9 particularly shows a plurality of subpixel corresponding portions 34 when viewed from a direction perpendicular to the first surface 31 a and the second surface 31 b of the support layer 31 of the color filter 30.

  As shown in FIG. 8, when viewed from a direction perpendicular to the first surface 31a and the second surface 31b, each outer edge of the plurality of subpixels 4 includes a plurality of sides. Particularly in the present embodiment, the shape of the outer edge of each sub-pixel 4 is a rectangle. Therefore, this outer edge includes two short sides and two long sides. The shapes of the three outer edges of the sub-pixels 4R, 4G, and 4B may all be the same or may be all different, or two may be the same and the other one may be different from them. FIG. 8 illustrates an example in which the shapes of the three outer edges of the subpixels 4R, 4G, and 4B are all the same. In FIG. 8, symbol LS represents the length of the long side included in each outer edge of the subpixels 4R, 4G, and 4B. Symbols SSr, SSg, and SSb represent the lengths of the short sides included in the outer edges of the subpixels 4R, 4G, and 4B, respectively. In the example shown in FIG. 8, the lengths SSr, SSg, SSb of the short sides are equal to each other.

  As shown in FIG. 9, when viewed from the direction perpendicular to the first surface 31 a and the second surface 31 b, the plurality of subpixel corresponding portions 34 are respectively arranged at positions that overlap with the corresponding subpixel 4. Has been. The shapes of the outer edges of the subpixel corresponding portions 34R, 34G, and 34B when viewed from the direction perpendicular to the first surface 31a and the second surface 31b are the same as those of the subpixels 4R, 4G, and 4B, respectively. That is, the outer edge of each of the sub-pixel corresponding portions 34R, 34G, and 34B is rectangular and includes two short sides and two long sides. The length of the long side included in each outer edge of the subpixel corresponding portions 34R, 34G, 34B is LS, and the length of the short side included in each outer edge of the subpixel corresponding portions 34R, 34G, 34B is SSr, respectively. , SSg, SSb.

  In the present embodiment, the total thickness of the outermost layer 14, the adhesive layer 40, and the support layer 31 between the plurality of pixels 3 and the plurality of pixel corresponding portions 33 is all included in the plurality of outer edges of the plurality of subpixels 4. Is within the range of 1/50 to 1/2 of the length of the shortest side. Further, the thickness of the support layer 31 is in the range of 1/100 to 1/4 of the length of the shortest side among all the sides included in the plurality of outer edges of the plurality of subpixel corresponding portions 34. These requirements will be described in detail later. The length of the shortest side among all the sides included in the plurality of outer edges of the plurality of subpixels 4 and the length of the shortest side among all the sides included in the plurality of outer edges of the plurality of subpixel corresponding portions 34 are equal. Hereinafter, these lengths are represented by the symbol Pmin. In the example shown in FIGS. 8 and 9, the length Pmin is equal to the lengths SSr, SSg, SSb.

  As shown in FIG. 4, in the display device 100, the second surface 31 b of the support layer 31 and the light emitting surface 1 a are bonded together via the adhesive layer 40, and the display device main body 1 and the color filter 30 are combined. Configured.

  In the display device 100 according to the present embodiment, the light emitted from the plurality of subpixels 4 in the display device body 1 passes through the outermost layer 14, passes through the color filter 30, and exits from the surface 30 a of the color filter 30. The top emission structure. The white light generated in the light emitting layer of the sub-pixel 4R is transmitted through the transmission part 35 in the sub-pixel corresponding part 34R corresponding to the sub-pixel 4R, and is emitted from the surface 30a of the color filter 30 as red light. . Similarly, the white light generated in the light emitting layer of the sub-pixel 4G is transmitted through the transmission part 35 in the sub-pixel corresponding part 34G corresponding to the sub-pixel 4G, and becomes green light from the surface 30a of the color filter 30. Emitted. Further, the white light generated in the light emitting layer of the sub-pixel 4B is transmitted through the transmission part 35 in the sub-pixel corresponding part 34B corresponding to the sub-pixel 4B, and is emitted from the surface 30a of the color filter 30 as blue light. Is done.

  In the display device 100, the outermost layer 14, the adhesive layer 40, and the support layer 31 exist between the plurality of pixels 3 of the display device body 1 and the plurality of pixel corresponding portions 33 of the color filter 30. When the total thickness of the outermost layer 14, the adhesive layer 40, and the support layer 31 is too large, light emitted from a certain subpixel 4 passes through a transmission part 35 other than the transmission part 35 corresponding to the subpixel 4. Color mixing occurs.

  Therefore, in the present embodiment, the total thickness of the outermost layer 14, the adhesive layer 40, and the support layer 31 between the plurality of pixels 3 and the plurality of pixel corresponding portions 33 is included in the plurality of outer edges of the plurality of subpixels 4. Among all the sides, the shortest side length Pmin is in the range of 1/50 to 1/2. Hereinafter, the effect of this requirement will be described in detail with reference to FIG.

  FIG. 10 is an explanatory diagram for explaining the effect of the display device 100. In FIG. 10, the total thickness of the outermost layer 14, the adhesive layer 40, and the support layer 31 between the plurality of pixels 3 and the plurality of pixel corresponding portions 33 is represented by a symbol d. Further, an angle formed by a direction in which the screen of the display device 100 (the surface 30a of the color filter 30) is viewed with respect to a direction perpendicular to the screen is represented by a symbol θ. When θ is other than 0 °, the transmission unit corresponding to the sub-pixel 4 in the color filter 30 out of the total amount of light emitted from the sub-pixel 4 of the display device body 1 as the value of d / Pmin decreases. The amount of light passing through 35 increases.

  Here, the ratio of the area of the sub-pixel 4 effective for display to the total area of the sub-pixel 4 when viewed from the direction perpendicular to the screen of the display device 100 is the sub-pixel 4. Is defined as the aperture ratio. Further, the ratio of the area of the transmissive part 35 of the subpixel corresponding part 34 to the total area of the subpixel corresponding part 34 when viewed from the direction perpendicular to the screen of the display device 100 is defined as the subpixel corresponding part. An aperture ratio of 34 is defined. When the value of d / Pmin is 1/2 and θ is 45 °, if both the aperture ratio of the subpixel 4 and the aperture ratio of the subpixel corresponding portion 34 are 100%, the subpixel 4 in the display device main body 1 is provided. Out of the total amount of light emitted from the color filter 30, the amount of light passing through the transmission part 35 corresponding to the sub-pixel 4 and the amount of light passing through the transmission part 35 adjacent to the transmission part 35 in the color filter 30 are Will be equal. However, in actuality, at least the aperture ratio of the subpixel corresponding portion 34 is less than 100%. Therefore, when the value of d / Pmin is ½ and θ is 45 °, in actuality, out of the total amount of light emitted from a certain subpixel 4, it is adjacent to the transmission portion 35 corresponding to the subpixel 4. The amount of light passing through the transmission part 35 is very small. Therefore, by setting the value of d / Pmin to ½ or less, that is, d to ½ or less of Pmin, color mixing when θ is 45 ° or less can be suppressed. Further, by setting the value of d / Pmin to a smaller value less than 1/2, it is possible to suppress color mixing when θ is greater than 45 °.

  As described above, in order to suppress color mixing, the smaller the d / Pmin value is, the better it can be theoretically set to 1/50 or more. Therefore, in this embodiment, the value of d / Pmin is set to 1/50 or more, that is, d is set to 1/50 or more of Pmin.

  Naturally, the thickness of the support layer 31 is smaller than the total thickness d of the outermost layer 14, the adhesive layer 40, and the support layer 31. In the present embodiment, the thickness of the support layer 31 is not less than 1/100 and less than 1/2 of the shortest side length Pmin among all the sides included in the plurality of outer edges of the plurality of subpixel corresponding portions 34, preferably Is in the range of 1/100 to 1/4.

  If the thickness of the support layer 31 is too small, it is difficult to form the support layer 31 and the support layer 31 may be damaged in the process of manufacturing the color filter 30. Therefore, the thickness of the support layer 31 is preferably 1 μm or more.

  Now consider the generally conceivable magnitudes of d and Pmin. For example, when the thickness of the outermost layer 14 is 2 μm, the thickness of the adhesive layer 40 is 1 μm, and the thickness of the support layer 31 is 1 μm, d is 4 μm. On the other hand, in a general flat panel display device having a definition of 300 to 400 ppi, Pmin is about 21 to 28 μm. Assuming that the high-definition display device 100 is used and Pmin is 20 μm, when d is 4 μm, the value of d / Pmin is 1/5. Therefore, considering the ease of manufacturing the display device 100, the value of d / Pmin is preferably in the range of 1/5 to 1/2.

  Hereinafter, a method for manufacturing the display device 100 according to the present embodiment will be described. The method for manufacturing display device 100 according to the present embodiment is a method for manufacturing a plurality of display devices 100 simultaneously. First, an outline of a method for manufacturing the display device 100 will be described with reference to FIGS.

  The manufacturing method of the display device 100 includes a step of producing the main body substructure 101 shown in FIG. As shown in FIG. 11, the main body substructure 101 includes a plurality of arranged main body planned portions 1 </ b> P, each of which is to be the display device main body 1. Each main body planned portion 1 </ b> P includes all the components of the display device main body 1. The substructure 101 for the main body is manufactured by forming a plurality of sets of constituent elements of the display device main body 1 other than the base substrate 2 on the substrate 2P to be a plurality of base substrates 2 by being cut later. Is done.

  The manufacturing method of the display device 100 further includes a step of manufacturing the additional member substructure. The steps of producing the additional member foundation structure include the steps of producing the initial addition member foundation structure 130P shown in FIG. 12, and the additional member foundation structure 130P shown in FIG. A step of removing a planned removal portion of the basic structure for initial addition member 130P so as to become the object 130.

  As shown in FIG. 13, the additional member substructure 130 includes a plurality of arranged additional member planned portions 30P and a plurality of additional member planned portions 30P, each of which is to be an additional member (color filter 30). And a holding portion 131 that integrally holds a plurality of additional member planned portions 30P. The additional member planned portion 30 </ b> P includes all the components of the color filter 30. The holding portion 131 corresponds to the plurality of terminal portions 90 of the plurality of planned main body portions 1P when the main body basic structure 101 shown in FIG. 11 and the additional member basic structure 130 shown in FIG. 13 are overlapped. It has the some notch part 132 formed in the position. One notch 132 has a shape that is long in one direction, and is formed at a position corresponding to a plurality of terminal portions 90 arranged in a row.

  The initial additional member substructure 130P shown in FIG. 12 includes a plurality of planned removal portions 132P that become a plurality of cutout portions 132 when removed later, and a plurality of planned removal portions 132P are removed. It becomes the substructure 130 for additional members. Accordingly, the initial additional member foundation structure 130P includes a plurality of additional member planned portions 30P arranged in the same manner as the additional member foundation structure 130 shown in FIG. In FIG. 12, the plurality of scheduled removal portions 132P are indicated by broken lines. By forming a plurality of sets of constituent elements of the color filter 30 other than the support layer 31 on the substrate 31P to be a plurality of support layers 31 by being cut later, the initial additional member substructure 130P is formed. Produced. In the region other than the plurality of additional member planned portions 30P on the substrate 31P, a material for forming the components of the color filter 30 other than the support layer 31 in the additional member planned portion 30P may be deposited.

  In the process shown in FIG. 13, the plurality of scheduled removal portions 132P of the initial addition member substructure 130P are removed. As a result, a plurality of notches 132 are formed in the portion from which the plurality of to-be-removed portions 132P have been removed, and the initial additional member foundation structure 130P becomes the additional member foundation structure 130. The removal of the plurality of scheduled removal portions 132P is performed, for example, by cutting the initial additional member foundation structure 130P along the outer edges of the plurality of scheduled removal portions 132P with a cutter or the like. The holding part 131 of the additional member substructure 130 includes at least a part of the substrate 31P.

  In the manufacturing method of the display device 100, the main body basic structure 101 shown in FIG. 11 and the additional member basic structure 130 shown in FIG. The process of producing the joining structure 200 containing the several display apparatus plan part 100P of this arranged is provided. FIG. 14 shows the joint structure 200. In this step, an adhesive (not shown) is interposed between the plurality of light emitting surfaces 1a of the plurality of main body planned portions 1P in the main body foundation structure 101 and the substrate 31P of the additional member foundation structure 130. The substructure 101 for main body and the substructure 130 for additional members are joined by an adhesive. In addition, an adhesive agent does not cover the several terminal part 90 of the several main body planned part 1P in the basic structure 101 for main bodies.

  As shown in FIG. 15, the manufacturing method of the display device 100 further includes a step of cutting the joint structure 200 so that the plurality of display device scheduled portions 100 </ b> P are separated from each other to become the plurality of display devices 100. ing. After this step, a part of the adhesive used in the step of manufacturing the bonded structure 200 becomes the adhesive layer 40. The joining structure 200 is cut using, for example, a dicing apparatus.

  Next, a method for manufacturing the display device 100 will be described in detail with reference to FIGS. First, with reference to FIG. 16, an example of a process for manufacturing the main body substructure 101 will be described. Here, an example in which the base substrate 2 includes a base layer 21 and a barrier layer 22 will be described. As shown in FIG. 16, in the process of manufacturing the main body substructure 101, first, the resin layer 51 and the substrate 2 </ b> P are sequentially laminated on the support 50. The substrate 2P includes a base layer 21P and a barrier layer 22P stacked on the base layer 21P. The base layer 21P and the barrier layer 22P are cut later to form a plurality of sets of the base layer 21 and the barrier layer 22. The support body 50 is a glass substrate, for example. Next, by forming a plurality of sets of constituent elements of the display device main body 1 other than the base substrate 2 on the substrate 2P, the main body substructure 101 including the plurality of pre-arranged main body portions 1P is arranged. Make it.

  In the process of manufacturing the main body substructure 101 shown in FIG. 16, first, the resin layer 51 and the base layer 21 </ b> P are sequentially laminated on the support 50. The method for laminating the resin layer 51 and the base layer 21P may be any of the following first to third methods. The first method is a method in which a laminated body of the resin layer 51 and the base layer 21P is formed in advance, and this laminated body is pasted on the support body 50. The second method is to apply a polyamic acid resin solution to be the resin layer 51 on the support 50 and imidize it to form the resin layer 51. Next, the base layer is formed on the resin layer 51. In this method, a base layer 21P is formed by applying a polyamic acid resin solution to be the layer 21P and imidizing it. The third method is to apply a film-like resin layer 51 on the support 50, and then apply a polyamic acid resin solution to be the base layer 21P on the resin layer 51 to imidize it. This is a method of forming the base layer 21P.

  In the step of producing the main body substructure 101 shown in FIG. 16, after the resin layer 51 and the base layer 21P are sequentially laminated on the support 50, the barrier layer 22P is formed on the base layer 21P.

  If the difference in coefficient of linear thermal expansion between the base layer 21P made of resin and the barrier layer 22P made of an inorganic material is large, the substrate 2P warps, the dimensional stability of the substrate 2P deteriorates, and in some cases the substrate 2P There is a risk of cracks. In particular, when the substrate 2P having a large area is formed, the problem of warping of the substrate 2P becomes more prominent. Therefore, the difference in coefficient of linear thermal expansion between the base layers 21P and 21 and the barrier layers 22P and 22 is preferably 10 ppm / K or less. Therefore, the linear thermal expansion coefficients of the base layers 21P and 21 are preferably 25 ppm / K or less, and more preferably 10 ppm / K or less.

  Hereinafter, the process of manufacturing the main body substructure 101 shown in FIG. 16 will be further described with a focus on one main body planned portion 1P. In this step, after the substrate 2P is formed, the circuit portion 10 and the terminal portion 90 are formed on the upper surface of the substrate 2P. The circuit unit 10 includes a plurality of TFTs. TFTs are roughly classified into amorphous silicon TFTs and polysilicon TFTs. As for the polysilicon TFT, a low-temperature polysilicon TFT capable of lowering the process temperature is mainly used. For example, low-temperature polysilicon TFTs are used as the plurality of TFTs of the circuit unit 10. Alternatively, an oxide semiconductor TFT may be used as the plurality of TFTs of the circuit unit 10.

  In the formation process of the circuit unit 10, a film to be a gate oxide film, a gate electrode, a wiring, or the like is formed on the barrier layer 22P by a CVD method, a sputtering method, or the like, and a mask is formed thereon using photolithography. Then, the film is etched using this mask to pattern the film into a predetermined shape.

  In the step of manufacturing the main body basic structure 101 shown in FIG. 16, next, the planarization layers 11 and 12 are formed, and the upper surface of the planarization layer 12 is planarized. Next, the plurality of anodes 6 and the insulating layer 13 of the plurality of subpixels 4 are formed on the upper surface of the planarization layer 12. Next, the white light emitting layer 7 is formed on the plurality of anodes 6 and the insulating layer 13. The white light emitting layer 7 is formed, for example, by vapor deposition in a vacuum environment chamber. Next, the common electrode 8 is formed on the white light emitting layer 7. Next, the outermost layer 14 is formed to complete the main body substructure 101 shown in FIG.

  In the step of manufacturing the main body substructure 101 shown in FIG. 16, the two surfaces of the resin layer 51 and the base layer 21P that are in contact with each other are in a state that can be easily peeled later. Therefore, the adhesive strength between the resin layer 51 and the base layer 21P is preferably in the range of 1 to 500 N / m.

  In addition, the process of producing the main body substructure 101 is not limited to the example described above. The step of manufacturing the main body substructure 101 includes, for example, forming a plurality of sets of constituent elements of the display device main body 1 other than the base substrate 2 on the substrate 2P without using the support body 50. The main structure 101 for the main body may be completed. In this case, after forming a plurality of sets of constituent elements of the display device main body 1 other than the base substrate 2 on the glass substrate, the glass substrate is thinned by polishing or etching the lower surface of the glass substrate. A thin glass substrate may be used as the substrate 2P.

  Next, with reference to FIG. 17, an example of the process of producing the additional member substructure 130 will be described. Here, an example in which the support layer 31 and the substrate 31P are made of resin will be described. In this example, as shown in FIG. 17, the step of manufacturing the additional member substructure 130 includes a resin layer 61 disposed on the support 60, and the resin layer 61 and the substrate 31 </ b> P are in contact with each other. The step of forming the additional member substructure 130 on the layer 61, and the step of separating the support 60, the resin layer 61, and the additional member substructure 130 at the boundary between the resin layer 61 and the substrate 31P. Including. The support body 60 is, for example, a glass substrate.

  The step of forming the additional member basic structure 130 on the resin layer 61 includes the step of forming the initial additional member basic structure 130P on the resin layer 61 and the initial additional member basic structure 130P shown in FIG. And removing the planned removal portion 132P of the initial additional member foundation structure 130P so as to be the additional member foundation structure 130 shown in FIG.

  Hereinafter, with reference to one additional member planned portion 30P, a process of manufacturing the additional member substructure 130 shown in FIG. 17 will be further described. In this step, after the resin layer 61 and the substrate 31P are sequentially laminated on the support 60, the plurality of pixel corresponding portions 33 are formed, and then the rigid functional layer 38 is further formed. The rigid functional layer 38 is bonded to the plurality of pixel corresponding portions 33 by the adhesive layer 37. The method for laminating the resin layer 61 and the substrate 31P is the same as the method for laminating the resin layer 51 and the base layer 21P.

  Similar to the base layer 21P, the substrate 31P is desired to have good shape stability. Therefore, the linear thermal expansion coefficients of the substrate 31P and the support layer 31 are preferably 25 ppm / K or less, and more preferably 10 ppm / K or less.

  In addition, in the step of manufacturing the additional member substructure 130 shown in FIG. 17, the two surfaces of the resin layer 61 and the substrate 31P that are in contact with each other are in a state that can be easily peeled later. Therefore, the adhesive strength between the resin layer 61 and the substrate 31P is preferably in the range of 1 to 500 N / m.

  In addition, the surface roughness of the surface of the substrate 31P in contact with the resin layer 61 is preferably small so as not to deteriorate the characteristics such as the visibility of the display device 100. Specifically, the arithmetic average roughness of the surface of the substrate 31P in contact with the resin layer 61 is preferably 100 nm or less.

  Hereinafter, the resin layer 51 and the base layer 21P suitable for the process of manufacturing the main body foundation structure 101 shown in FIG. 16 and the process of manufacturing the additional member foundation structure 130 shown in FIG. The material of the resin layer 61 and the substrate 31P will be described. The material of the base layer 21 is the same as the material of the base layer 21P, and the material of the support layer 31 is the same as the material of the substrate 31P. Therefore, the following description of the material of the base layer 21P and the material of the substrate 31P also applies to the material of the base layer 21 and the material of the support layer 31.

  The two surfaces of the resin layer 51 and the base layer 21P that are in contact with each other in the step shown in FIG. 16 are made easily peelable later, and the two surfaces of the resin layer 61 and the substrate 31P that are in contact with each other in the step shown in FIG. In order to make it easily peelable later, polyimide having a specific chemical structure is used as at least one material of the resin layer 51 and the base layer 21P and at least one material of the resin layer 61 and the substrate 31P. Also good. Generally, a polyimide is obtained by polymerizing a raw acid anhydride and a diamine, and can be represented by the following general formula (3).

In Formula (3), Ar ₁ represents a tetravalent organic group that is an acid anhydride residue, and Ar ₂ represents a divalent organic group that is a diamine residue. From the viewpoint of heat resistance, it is desirable that at least one of Ar ₁ and Ar ₂ is an aromatic residue.

  As one of polyimides suitably used as at least one material of the resin layer 51 and the base layer 21P and at least one material of the resin layer 61 and the substrate 31P, a repeating structure represented by the following general formula (4) A polyimide having a unit may be mentioned. In particular, it is preferable that the resin layer 51 and the resin layer 61 have this repeating structural unit.

  The polyimide used as at least one material of the resin layer 51 and the base layer 21P and at least one material of the resin layer 61 and the substrate 31P has a repeating structural unit represented by the following general formula (5). It is more preferable.

  In the TFT formation process, heat treatment is performed at a temperature of about 450 ° C. in the case of a low-temperature polysilicon TFT, and heat treatment is performed at a temperature of about 300 ° C. in the case of an oxide semiconductor TFT. For this reason, the resin layer 51 and the base layer 21P need to be able to withstand such heat treatment. By using a polyimide having a repeating structural unit represented by the above formula (4) or (5) as the material of the resin layer 51 and the base layer 21P, it can withstand the heat treatment as described above and has good dimensional stability. The resin layer 51 and the base layer 21P can be realized.

  In addition, the resin layer 61 and the substrate 31 </ b> P need to be able to withstand the heat generated in the process of forming the plurality of transmission portions 35. By using polyimide having a repeating structural unit represented by the above formula (4) or (5) as the material of the resin layer 61 and the substrate 31P, the resin layer 61 and the substrate 31P can withstand the heat generated in the formation process of the plurality of transmission portions 35. At the same time, the resin layer 61 and the substrate 31P having good dimensional stability can be realized.

From the viewpoint of improving the peelability of the base layer 21P from the resin layer 51, the transparency of the substrate 31P and the peelability from the resin layer 61, the polyimide used as the material of the base layer 21P and the substrate 31P is a fluorine-containing polyimide. Preferably there is. Here, the fluorine-containing polyimide refers to a polyimide having a fluorine atom in the polyimide structure, and specifically has a fluorine-containing group in at least one component of an acid anhydride and a diamine which are polyimide raw materials. As such a fluorine-containing polyimide, for example, among those represented by the general formula (3), Ar _{1 in} the formula is a tetravalent organic group, and Ar ₂ is represented by the following general formula (6) or ( And those represented by a divalent organic group represented by 7).

R _{1 to} R ₈ in the general formula (6) or (7) are each independently a hydrogen atom, a fluorine atom, an alkyl group or an alkoxy group having 1 to 5 carbon atoms, or a fluorine-substituted hydrocarbon group. In the general formula (6), at least one of R _{1 to} R ₄ is a fluorine atom or a fluorine-substituted hydrocarbon group. In the general formula (7), at least one of R _{1 to} R ₈ is a fluorine atom or a fluorine-substituted hydrocarbon group. Among these, preferred specific examples of R _{1 to} R ₈ include —H, —CH ₃ , —OCH ₃ , —F, —CF _{3, and the} like. In the formula (6) or (7), it is preferable that at least one substituent is —F or —CF ₃ .

Specific examples of Ar ₁ in the general formula (3) when forming the fluorine-containing polyimide include the following tetravalent acid anhydride residues.

Further, in consideration of improving the peelability of the base layer 21P with respect to the resin layer 51, the transparency of the substrate 31P and the peelability with respect to the resin layer 61, etc., the general formula (3 The following are preferable as specific diamine residues that give Ar ₂ in).

  By forming at least a portion of the base layer 21P in contact with the resin layer 51 with the fluorine-containing polyimide formed using the diamine residue, the base layer 21P has a structure other than the fluorine-containing polyimide. Good releasability can be exhibited even with respect to the resin layer 51 made of polyimide. Similarly, by forming at least a part of the substrate 31P in contact with the resin layer 61 with the fluorine-containing polyimide formed using the diamine residue, the substrate 31P has a structure other than the fluorine-containing polyimide. The resin layer 61 made of polyimide can also have good peelability. Specifically, this allows the adhesive strength between the resin layer 51 and the base layer 21P and the adhesive strength between the resin layer 61 and the substrate 31P to be within a range of 1 to 500 N / m, preferably within a range of 5 to 300 N / m. More preferably, it can be in the range of 10 to 200 N / m. The adhesive strength within such a range is such a size that the resin layer 51 and the base layer 21P, and the resin layer 61 and the substrate 31P can be easily peeled by a human hand.

  In addition to at least a part of the base layer 21P in contact with the resin layer 51, at least a part of the resin layer 51 in contact with the base layer 21P is made of fluorine-containing polyimide formed using the diamine residue. May be. Similarly, in addition to at least a part of the substrate 31P that contacts the resin layer 61, at least a part of the resin layer 61 that contacts the substrate 31P is constituted by the fluorine-containing polyimide formed using the diamine residue. May be. Thereby, the peelability of the base layer 21P with respect to the resin layer 51 and the peelability of the substrate 31P with respect to the resin layer 61 can be further improved.

  In such a fluorine-containing polyimide, having one of the structural units represented by the following general formula (1) or (2) at a ratio of 80 mol% or more is not only transparency and peelability but also heat. It is more preferable because it has low expandability and excellent dimensional stability. That is, according to the fluorine-containing polyimide having the structural unit represented by the following general formula (1) or (2), the resin layer 51 having a linear thermal expansion coefficient of 25 ppm / K or less, preferably 10 ppm / K or less. The base layer 21P, the resin layer 61, and the substrate 31P can be formed. Further, the fluorine-containing polyimide having such a structural unit has a glass transition temperature of 300 ° C. or more, and is 70% or more, preferably 80% or more with respect to light in a wavelength region of 440 to 780 nm. Since it has transmittance, it is more suitable for manufacturing the display device 100 according to the present embodiment.

  The fluorine-containing polyimide having either one of the structural units represented by the above general formula (1) or (2) at a ratio of 80 mol% or more is 20 mol of the other polyimide having no such structural unit. It may be added at a ratio of less than%. The other added polyimide is not particularly limited, and can be obtained by using a general acid anhydride and diamine. Among general acid anhydrides, acid anhydrides preferably used include pyromellitic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, and 1,4-cyclohexane. Examples include dicarboxylic acid, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 2,2′-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride, and the like. On the other hand, diamines include 4,4'-diaminodiphenylsulfone, trans-1,4-diaminocyclohexane, 4,4'-diaminocyclohexylmethane, 2,2'-bis (4-aminocyclohexyl) -hexafluoro. Examples include propane and 2,2′-bis (trifluoromethyl) -4,4′-diaminobicyclohexane.

  Various polyimides as described above can be obtained by imidizing polyamic acid. Here, the polyamic acid resin solution is preferably obtained by using substantially equal moles of diamine and acid dianhydride as raw materials and reacting them in an organic solvent. More specifically, the polyamic acid resin solution is prepared by dissolving diamine in an organic polar solvent such as N, N-dimethylacetamide under a nitrogen stream, and then adding tetracarboxylic dianhydride, and then at room temperature for 5 hours. It can be obtained by reacting to some extent. From the viewpoint of uniform film thickness during coating and the mechanical strength of the resulting polyimide film, the polyamic acid obtained preferably has a weight average molecular weight of 10,000 to 300,000. The preferred molecular weight range of the polyimide layer thus obtained is also the same as the preferred molecular weight range of the polyamic acid.

  Next, an example of a process for producing the bonded structure 200 will be described with reference to FIG. In this example, as shown in FIG. 18, the main body basic structure 101 is disposed on the resin layer 51 supported by the support body 50, and the plurality of main body planned portions 1 </ b> P in the main body basic structure 101 is disposed. An adhesive 140 is interposed between the plurality of light emitting surfaces 1a and the substrate 31P of the additional member basic structure 130, and the main structure 101 and the additional member basic structure are formed by the adhesive 140. 130 is joined. FIG. 18 shows an example in which the adhesive 140 is disposed on the lower surface of the substrate 31P of the base structure for additional member 130 before the base structure for main body 101 and the base structure for additional member 130 are joined. . However, before bonding the main body foundation structure 101 and the additional member foundation structure 130 to each other, the adhesive 140 is applied to the plurality of light emitting surfaces 1a of the plurality of main body planned portions 1P in the main body foundation structure 101. You may arrange in. As the adhesive 140, for example, an acrylic transparent adhesive is used.

  In the step of manufacturing the joint structure 200, the base structure for additional member 130 is supported using an auxiliary support, and the base structure for main body 101 and the base structure for additional member 130 are joined as follows. May be. In the step shown in FIG. 17, the auxiliary support is attached on the additional member foundation structure 130 after the additional member foundation structure 130 is formed on the resin layer 61. The auxiliary support is made of, for example, a resin film. Further, the auxiliary support is attached to the additional member substructure 130 so as to be easily peelable. The step of separating the support 60, the resin layer 61, and the additional member basic structure 130 at the boundary between the resin layer 61 and the substrate 31P is a state in which the auxiliary support is attached to the additional member basic structure 130. Done in And in the process of producing the joining structure 200, the base structure 130 for additional members is supported by the auxiliary support body, and the base structure 101 for main bodies and the foundation structure 130 for additional members are joined. Thereafter, the auxiliary support is peeled from the additional member substructure 130. As described above, by using the auxiliary support, even if the rigidity of the additional member foundation structure 130 is small, the handling of the additional member foundation structure 130 in the process of manufacturing the bonded structure 200 is facilitated.

  Next, an example of a process of cutting the bonded structure 200 will be described with reference to FIG. The step of cutting the bonded structure 200 may be performed after the bonded structure 200 is separated from the support 50 and the resin layer 51, or the bonded structure 200 is placed on the resin layer 51 supported by the support 50. You may carry out with arrange | positioning. Here, the latter example will be described. In this example, the plurality of display device planned portions 100P are separated from each other and become the plurality of display devices 100, for example, while the bonding structure 200 is disposed on the resin layer 51 supported by the support body 50. The joining structure 200 is cut using a dicing apparatus. Thereafter, as shown in FIG. 19, the individual display devices 100 are separated from the support 50 and the resin layer 51. Thereby, a plurality of display devices 100 are completed.

  After cutting the bonded structure 200, the flexible wiring board 110 is connected to the terminal portion 90 of each display device 100, and then the individual display device 100 and the flexible wiring board 110 are separated from the support 50 and the resin layer 51. May be.

  Hereinafter, effects of the method for manufacturing the display device 100 according to the present embodiment will be described. According to the present embodiment, the plurality of display devices 100 having a structure in which the color filter 30 as an additional member is bonded to the light emitting surface 1 a of the display device body 1 without covering the terminal portion 90 of the display device body 1. Can be manufactured at the same time. Therefore, according to the present embodiment, the productivity of the display device 100 can be improved.

  In the present embodiment, before joining the main body foundation structure 101 and the additional member foundation structure 130, the additional member foundation structure 130 includes a plurality of planned main body portions in the main body foundation structure 101. It has a plurality of notches 132 formed at positions corresponding to a plurality of terminal portions 90 of 1P. Therefore, in this embodiment, there is no process of removing unnecessary portions of one substrate by largely deforming the two substrates after bonding the two substrates. Therefore, according to the present embodiment, the plurality of planned main body portions 1P included in the main body foundation structure 101 and the plurality of additional member planned portions 30P included in the additional member foundation structure 130 are not damaged. .

  Moreover, in this Embodiment, in the process of producing the joining structure 200, the multiple light emitting surfaces 1a of the multiple main body planned portions 1P in the basic structure for main body 101, and the substrate 31P of the additional member basic structure 130. The main body foundation structure 101 and the additional member foundation structure 130 are joined by the adhesive 140 with the adhesive 140 interposed therebetween. In the step of cutting the bonded structure 200, a part of the adhesive 140 becomes the adhesive layer 40 interposed between the entire light emitting surface 1 a and the color filter 30. Thereby, according to this Embodiment, the joint strength of the display apparatus main body 1 and the color filter 30, and the bending tolerance of the display apparatus 100 can be enlarged.

  In the present embodiment, the additional member foundation structure 130 has a plurality of notches 132 before the main body foundation structure 101 and the additional member foundation structure 130 are joined. Therefore, according to the present embodiment, as described above, the adhesive 140 for joining the main body foundation structure 101 and the additional member foundation structure 130 is provided with a plurality of main bodies in the main body foundation structure 101. By interposing between the plurality of light emitting surfaces 1a of the planned portion 1P and the substrate 31P of the additional member foundation structure 130, the adhesive 140 is used to form a plurality of the plurality of scheduled body portions 1P in the main body foundation structure 101. It is possible to prevent the terminal portion 90 from being covered.

  Moreover, in this Embodiment, the joining structure 200 is affixed by affixing the board | substrate 31P of the foundation structure 130 for additional members on the several light-projection surface 1a of the some main body planned part 1P in the foundation structure 101 for main bodies. Can be produced. In the step of manufacturing the bonded structure 200, the additional member basic structure 130 is inverted so that the upper and lower positional relationships of the substrate 31 </ b> P and the plurality of transmission portions 35 are opposite, and held from the substrate 31 </ b> P side. Therefore, it is not necessary to move the base structure 101 for the main body. Therefore, according to the present embodiment, even if the thickness of the substrate 31P is small, the handling of the additional member basic structure 130 in the process of manufacturing the bonded structure 200 is facilitated.

  In the present embodiment, the color filter 30 includes the rigid functional layer 38. Thereby, the rigidity of the color filter 30 as a whole and the rigidity of the additional member foundation structure 130 as a whole can be increased, and even if the thickness of the substrate 31P is small, the additional member foundation structure in the process of manufacturing the bonded structure 200. The handling of the object 130 becomes easier.

  Moreover, according to this Embodiment, the thickness of the support layer 31 of the color filter 30 can be made small. As a result, according to the present embodiment, the thickness of the entire display device 100 can be reduced, and the attenuation of light in the support layer 31 can be reduced.

  In addition, according to the method for manufacturing the additional member substructure 130 described with reference to FIG. 17, the color filter 30 including the support layer 31 having a small thickness can be easily manufactured.

  Moreover, in this Embodiment, the cutting | disconnection of the joining structure 200 is stabilized by cut | disconnecting the joining structure 200, with the joining structure 200 arrange | positioned on the resin layer 51 supported by the support body 50. FIG. Can be performed.

  Further, in the present embodiment, after the bonding structure 200 is cut while the bonding structure 200 is disposed on the resin layer 51 supported by the support body 50, the terminal portion 90 in each display device 100 is flexible. The wiring substrate 110 can be connected, and then the individual display device 100 and the flexible wiring substrate 110 can be separated from the support 50 and the resin layer 51. In this case, the following effects can be obtained.

  As a method for connecting the flexible wiring board 110 to the terminal portion 90, a method of thermocompression bonding using an anisotropic conductive film is generally used. In the display device 100, when viewed from a direction perpendicular to the light emitting surface 1a, the portion including the terminal portion 90 has the smallest thickness and is mechanically weak. By performing the operation of connecting the flexible wiring board 110 to the terminal portion 90 while the display device 100 is disposed on the resin layer 51 supported by the support body 50, the portion including the terminal portion 90 can be seen during this operation. Reinforced by the support 50 and the resin layer 51. Thus, this operation can be performed stably, and the portion including the terminal portion 90 can be prevented from being damaged during the operation. The damage to the portion including the terminal portion 90 includes at least one of the damage received by the terminal portion 90 and the damage received by a part of the base substrate 2 located under the terminal portion 90.

  Further, when the display device 100 is separated from the support 50 and the resin layer 51 after connecting the flexible wiring board 110 to the terminal portion 90, when the display device 100 is separated from the support 50 and the resin layer 51, A portion including the terminal portion 90 in the display device 100 is reinforced by the flexible wiring board 110. Thereby, the operation | work which isolate | separates the display apparatus 100 from the support body 50 and the resin layer 51 can be performed stably, and it can prevent that the part containing the terminal part 90 receives damage during this operation | work.

[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 20 is a schematic diagram showing a partial cross section of the display device 100 manufactured by the manufacturing method according to the present embodiment. In the display device 100 according to the present embodiment, the display device body 1 uses, for example, red (R), green (G), and blue (B) light instead of the white light-emitting layer 7 according to the first embodiment. Are provided with three types of light emitting layers 7R, 7G, and 7B and a separating layer 15 that separates adjacent light emitting layers from each other. The organic EL element 5 of the subpixel 4R includes a light emitting layer 7R, the organic EL element 5 of the subpixel 4G includes a light emitting layer 7G, and the organic EL element 5 of the subpixel 4B includes a light emitting layer 7B. The light emitting layers 7R, 7G, and 7B are formed of an organic EL material that generates red light, green light, and blue light, respectively.

  In the present embodiment, the light generated in the light emitting layer 7R of the sub-pixel 4R is transmitted through the transmission part 35 in the sub-pixel corresponding part 34R corresponding to the sub-pixel 4R, and the surface of the color filter 30 as red light. It is emitted from 30a. Similarly, the light generated in the light emitting layer 7G of the sub-pixel 4G is transmitted through the transmission part 35 in the sub-pixel corresponding part 34G corresponding to the sub-pixel 4G, and is emitted from the surface 30a of the color filter 30 as green light. Is done. Further, the light generated in the light emitting layer 7B of the subpixel 4B is transmitted through the transmission part 35 in the subpixel corresponding part 34B corresponding to the subpixel 4B, and is emitted from the surface 30a of the color filter 30 as blue light. The According to this embodiment, the color purity of each color can be increased.

  Other configurations, operations, and effects in the present embodiment and a method for manufacturing the display device 100 are the same as those in the first embodiment.

  In addition, this invention is not limited to said each embodiment, A various change is possible. For example, the additional member in the present invention is not limited to the color filter, and may be any member that is bonded to the light emitting surface 1a without covering the terminal portion 90. Examples of the additional member other than the color filter include a touch panel and a circularly polarizing plate. The display device according to the present invention may be configured by, for example, a display device body capable of color display, such as the display device body 1 in the second embodiment, and an additional member other than the color filter. .

  Further, the display device main body of the present invention may have a passive matrix structure in which each sub-pixel does not include a driver circuit (TFT).

  Further, the display device main body in the present invention is not limited to the one constituting the organic EL display device, and may be a liquid crystal panel including a backlight and a liquid crystal shutter, for example.

  DESCRIPTION OF SYMBOLS 1 ... Display apparatus main body, 1a ... Light emission surface, 2 ... Base substrate, 3 ... Pixel, 4, 4R, 4G, 4B ... Subpixel, 5 ... Organic EL element, 6 ... Anode, 7 ... White light emitting layer, 8 ... Common electrode, 21 ... base layer, 22 ... barrier layer, 30 ... color filter, 31 ... support layer, 33 ... pixel corresponding part, 34, 34R, 34G, 34B ... sub-pixel corresponding part, 35 ... transmission part, 36 ... black Matrix, 38 ... rigid functional layer, 40 ... adhesive layer, 90 ... terminal portion, 100 ... display device, 101 ... substructure for main body, 130 ... substructure for additional member, 140 ... adhesive, 200 ... bonding structure .

Claims (22)

A manufacturing method for manufacturing a plurality of display devices, wherein each of the plurality of display devices includes a display device main body and an additional member, and the display device main body includes a plurality of pixels each emitting light, and the plurality of display devices. An outermost layer including a light emitting surface for emitting light emitted by the pixels toward the outside of the display device main body, and disposed outside the light emitting surface when viewed from a direction perpendicular to the light emitting surface. The additional member is bonded to the light emitting surface without covering the terminal portion,
The manufacturing method includes:
Producing a substructure for a main body including a plurality of preliminarily arranged main body portions, each of which is to be the display device main body;
A plurality of arranged additional member planned portions, each of which is to be the additional member, and a holding portion that is positioned around the plurality of additional member planned portions and integrally holds the plurality of additional member planned portions. Producing a substructure for an additional member including:
A process of producing a joint structure including a plurality of arranged display device planned portions, each of which is to be the display device, by superimposing and joining the base structure for the main body and the base structure for the additional member. When,
Cutting the joint structure so that the plurality of display device scheduled portions are separated from each other to become a plurality of display devices,
The holding portion of the additional member foundation structure is formed at a position corresponding to a plurality of terminal portions of the plurality of main body scheduled portions when the main body foundation structure and the additional member foundation structure are overlapped. A manufacturing method of a display device, comprising a cutout portion. The step of producing the substructure for the additional member,
An initial additional member base structure including a planned removal portion that becomes the cutout portion by being removed later, and becomes the basic structure for the additional member when the planned removal portion is removed A process of producing a foundation structure for use,
The method for manufacturing a display device according to claim 1, further comprising a step of removing the portion to be removed of the basic structure for the initial addition member.   The method for manufacturing a display device according to claim 1, wherein the display device main body and the additional member are both flexible. Each of the plurality of display devices further includes an adhesive layer interposed between the entire surface of the light emitting surface and the additional member,
In the step of producing the joint structure, the base structure for the main body and the base structure for the additional member are joined using an adhesive,
The method for manufacturing a display device according to claim 1, wherein a part of the adhesive becomes the adhesive layer after the step of cutting the joint structure.   The display device manufacturing method according to claim 1, wherein the additional member is a color filter. Each of the plurality of display devices further includes an adhesive layer interposed between the entire surface of the light emitting surface and the additional member,
The additional member is a color filter,
Each of the plurality of pixels includes a plurality of subpixels corresponding to different colors,
The plurality of sub-pixels each emit light,
The light emitted from the plurality of subpixels is emitted from the light exit surface toward the outside of the display device body through the outermost layer,
The color filter includes a support layer having a first surface and a second surface facing away from each other, and a plurality of color filters arranged to correspond to the plurality of pixels on the first surface of the support layer With a pixel corresponding part,
Each of the plurality of pixel corresponding portions includes a plurality of sub pixel corresponding portions arranged to correspond to the plurality of sub pixels,
The plurality of subpixel corresponding portions include a plurality of transmission portions that transmit light of different colors,
The second surface of the support layer and the light emitting surface are bonded through the adhesive layer,
When viewed from a direction perpendicular to the first surface and the second surface, each outer edge of the plurality of subpixels includes a plurality of sides,
The total thickness of the outermost layer, the adhesive layer, and the support layer between the plurality of pixels and the plurality of pixel corresponding portions is the shortest of all sides included in the plurality of outer edges of the plurality of subpixels. 4. The method for manufacturing a display device according to claim 1, wherein the length is within a range of 1/50 to 1/2 of a side length.   The method for manufacturing a display device according to claim 6, wherein the support layer is made of a resin.   The method for manufacturing a display device according to claim 7, wherein the resin constituting the support layer is polyimide.   The method for manufacturing a display device according to claim 8, wherein the polyimide is a fluorine-containing polyimide. The method for manufacturing a display device according to claim 8 or 9, wherein the polyimide has a structural unit represented by the following general formula (1) or (2).

  The method for manufacturing a display device according to claim 7, wherein the support layer has a transmittance of 70% or more with respect to light in a wavelength region of 440 to 780 nm.   12. The method for manufacturing a display device according to claim 7, wherein the support layer has a linear thermal expansion coefficient of 25 ppm / K or less.   The method for manufacturing a display device according to claim 7, wherein the support layer has a glass transition temperature of 300 ° C. or higher. The color filter further includes a rigid functional layer having a function of increasing the rigidity of the entire color filter,
The method for manufacturing a display device according to claim 6, wherein the plurality of pixel corresponding portions are arranged between the support layer and the rigid functional layer.   The method of manufacturing a display device according to claim 14, wherein the rigid functional layer includes at least one of a barrier layer, a touch panel, a circularly polarizing plate, and a protective layer.   The method for manufacturing a display device according to claim 6, wherein the color filter further includes a black matrix that separates the plurality of transmission parts from each other.   The display device according to claim 6, wherein each of the plurality of subpixels includes an organic EL element, and the organic EL element includes a light emitting layer made of an organic EL material. Production method. The display device body further includes a base substrate,
The method of manufacturing a display device according to claim 17, wherein the plurality of pixels are arranged between the base substrate and the outermost layer.   19. The method for manufacturing a display device according to claim 17, wherein the light emitting layer generates white light. The additional member substructure includes a substrate that becomes a plurality of support layers by being cut later, and the substrate is made of a resin,
The step of producing the substructure for the additional member,
Forming a resin layer on a support and forming the additional member substructure on the resin layer so that the resin layer and the substrate are in contact with each other;
20. The method according to claim 6, further comprising a step of separating the support, the resin layer, and the additional member basic structure at a boundary between the resin layer and the substrate. Method of manufacturing the display device.   21. The method of manufacturing a display device according to claim 20, wherein an adhesive strength between the resin layer and the substrate is in a range of 1 to 500 N / m.   The method of manufacturing a display device according to claim 20 or 21, wherein the arithmetic average roughness of the surface of the substrate in contact with the resin layer is 100 nm or less.

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