JP2015149094A - Capacitance type input device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capacitance type input device capable of preventing erroneous detection by disposing a conductor layer, and improving detecting sensitivity in an input region.SOLUTION: A capacitance type input device 10 includes: a base material 21; a plurality of electrodes 22; wiring 29 connected to the electrodes 22; and a conductor layer 55. An input region 15 for performing an input operation and a non-input region 16 outside the input region 15 are set in the base material 21, and the plurality of electrodes 22 are formed in the input region 15 of the base material 21, and the wiring 29 is formed in the non-input region 16 of the base material 21, and the conductor layer 55 is disposed at a position overlapped with the wiring 29, and a wiring part insulation layer 51 and a bank raising layer 52 are laminated between the conductor layer 55 and the wiring 29.

Description

  The present invention relates to a capacitive input device that detects input position information, and more particularly to a capacitive input device provided with a conductor layer.

  In a display unit of an electronic device such as a mobile device or a smartphone, a translucent capacitive input device is used. Patent Document 1 discloses a capacitive input device that is hardly affected by electromagnetic noise entering from the outside.

  FIG. 12 is a partially enlarged cross-sectional view of a conventional capacitive input device described in Patent Document 1. As shown in FIG. 12, the conventional capacitive input device 110 includes a translucent base material 121, a plurality of first electrodes 122 and a plurality of second electrodes ( In FIG. 12, only a connection portion 128 that connects a plurality of second electrodes is shown). A wiring 129 connected to the first electrode 122 and the plurality of second electrodes is formed in the non-input region 116.

  As illustrated in FIG. 12, a connection portion 128 is disposed between the first electrodes 122 adjacent to each other with a gap therebetween, and the first electrode 122, the second electrode (connection portion 128), and the wiring 129 are overlaid. An insulating layer 154 is provided. Adjacent first electrodes 122 are connected to each other by a bridge portion 127 through a through hole provided in the insulating layer 154. Thus, the first electrode 122 and the second electrode are arranged in the input region 115 so as to form a capacitance between the first electrode 122 and the second electrode. When an object to be detected such as an operator's finger contacts or approaches the input region 115 of the capacitance input device 110, the capacitance between the first electrode 122 and the second electrode changes, Based on this, input position information can be detected.

  Since the detected input position information is drawn out to an external circuit through the wiring 129, when electromagnetic noise enters from the outside and is superimposed on the wiring 129, it is confused with the input position information and erroneous detection occurs. As shown in FIG. 12, in the conventional capacitive input device 110, a conductor layer 155 is formed at a position overlapping the wiring 129 on the insulating layer 154. Thereby, the electromagnetic wave noise which invades from the outside of the input operation side can be shielded. Therefore, it is possible to prevent erroneous detection and detect input position information with high accuracy.

JP 2011-028535 A

  In recent years, in order to realize various input operations, it is required to increase the detection sensitivity in the input region 115. For example, input is performed in a state in which the detection target is approaching without contacting the surface of the capacitive input device 110. It has been studied to improve detection sensitivity so that it can be operated. However, in the conventional capacitance type input device 110, by providing the conductor layer 155 at a position overlapping the wiring 129, a capacitance is formed between the wiring 129 and the conductor layer 155. This capacitance is a parasitic capacitance that does not contribute to the detection of the input position information, and this parasitic capacitance is capacitively coupled with the capacitance formed between the first electrode 122 and the second electrode, The capacitance of the entire capacitive input device 110 increases. For this reason, the change in capacitance when the detection target approaches is relatively small, and there arises a problem that the detection sensitivity in the input region 115 is lowered due to the parasitic capacitance.

  In the case where the conductor layer 155 is not provided, when the detected object approaches the input area 115 during the input operation, a capacitance is also generated between the wiring 129 in the non-input area 116 and the detected object. It is formed. When the detection sensitivity of the input region 115 is improved, the sensitivity of the capacitance generated between the wiring 129 and the detection target in the non-input region 116 is also improved, and the static between the wiring 129 and the detection target is improved. A change in capacitance is detected as a signal by an input operation, and erroneous detection is likely to occur.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described problems and provide a capacitive input device capable of preventing erroneous detection by providing a conductor layer and improving detection sensitivity of an input region.

  The capacitance-type input device of the present invention has a base material, a plurality of electrodes, a wiring connected to the electrode, and a conductor layer, and an input region for performing an input operation on the base material, A non-input area outside the input area is set, the plurality of electrodes are formed in the input area of the base material, and the wiring is formed in the non-input area of the base material, The conductor layer is disposed at a position overlapping with the wiring, and a wiring portion insulating layer and a raised layer are laminated between the conductor layer and the wiring, and the plurality of electrodes include a plurality of translucent electrodes. The first electrode is configured to have a plurality of second electrodes, and the first electrodes are arranged at intervals in a first direction within the base material surface, and adjacent to the first electrodes. The first electrodes are connected to each other by a bridge portion, and the second electrode is connected to the first electrode. The second electrodes adjacent to each other are connected to each other by a connection portion, and an intersection insulating layer is formed so as to cover the connection portion. The bridge portion is formed across the connection portion and the intersection insulating layer so as to intersect the connection portion in plan view, and the distance between the conductor layer and the wiring is It is larger than the distance between the bridge part and the connection part.

  According to this, since the raising layer is laminated in addition to the wiring part insulating layer that insulates between the conductor layer and the wiring, the distance between the conductor layer and the wiring is increased so that the distance between the conductor layer and the wiring is increased. It is possible to reduce the capacitance formed on the substrate. Therefore, by reducing the parasitic capacitance in the non-input region, capacitive coupling between the parasitic capacitance in the non-input region and the electrostatic capacitance in the input region can be reduced, so that the detection sensitivity in the input region can be improved. . Even when the distance between the conductor layer and the wiring is increased, it is possible to suppress the intrusion of electromagnetic noise from the outside and the formation of capacitance between the detected object and the wiring. The occurrence of detection can be prevented.

  Therefore, according to the capacitance type input device of the present invention, it is possible to provide a conductor layer to prevent erroneous detection and to improve the detection sensitivity of the input region.

  Furthermore, even if the total thickness of the wiring part insulation layer and the raised layer is increased to reduce the parasitic capacitance formed between the wiring and the conductor layer, the intersection insulation layer in the input region is formed thicker. Therefore, it is possible to prevent the crossing insulating layer from being visually recognized from the outside and to secure good invisible characteristics.

  In the capacitance-type input device of the present invention, the wiring part insulating layer is formed on the wiring, the raised layer is formed on the wiring part insulating layer, and the conductor layer is the raised layer. It is preferable to be formed so as to cover. According to this, it is possible to shield moisture or the like from entering the raised layer from the outside by the conductor layer, and to improve the environmental resistance (moisture resistance, sebum resistance) of the raised layer covered by the conductor layer. Can do. Moreover, since the material selectivity of the raising layer is expanded, it is easy to form the raising layer thickly, and the manufacturing cost can be reduced.

  In the capacitance-type input device of the present invention, the raised layer is formed on the wiring, and the wiring part insulating layer is formed on the raised layer, and the wiring part insulating layer is the raised layer. It is preferable that it is formed so as to cover. According to this, it is possible to shield moisture and the like from entering the raised layer from the outside by the wiring part insulating layer, and the environmental resistance (moisture resistance, sebum resistance, etc.) of the raised layer covered with the wiring part insulating layer ) Can be improved. Moreover, since the material selectivity of the raising layer is expanded, it is easy to form the raising layer thickly, and the manufacturing cost can be reduced.

  In the capacitance-type input device of the present invention, it is preferable that the intersecting portion insulating layer and the wiring portion insulating layer are formed of the same material. According to this, since the intersection insulating layer and the wiring portion insulating layer can be formed in the same process, the manufacturing process can be reduced and the manufacturing cost can be reduced.

  According to the capacitance type input device of the present invention, it is possible to provide a conductor layer to prevent erroneous detection and to improve the detection sensitivity of the input region.

It is a disassembled perspective view which shows the electrostatic capacitance type input device in the 1st Embodiment of this invention. It is a top view which shows the electrostatic capacitance type sensor part which comprises the electrostatic capacitance type input device of this embodiment, and shows each electrode and wiring which were formed in the base material and the base material. FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 1 and viewed from the direction of the arrow when the capacitive input device shown in FIG. 1 is assembled. It is a partial expanded sectional view which shows the electrostatic capacitance type input device of this embodiment. It is a partial expanded sectional view which shows the 1st modification of this embodiment. It is a partial expanded sectional view which shows the 2nd modification of this embodiment. It is a partial expanded sectional view which shows the 3rd modification of this embodiment. It is a partial expanded sectional view which shows the electrostatic capacitance type input device of 2nd Embodiment. It is a top view which shows the electrostatic capacitance type sensor part which comprises the electrostatic capacitance type input device of 3rd Embodiment, and shows each electrode and wiring which were formed in the base material and the base material. It is the elements on larger scale of an electrostatic capacitance type input device when it cuts in the XX line of Drawing 9, and it sees from an arrow direction. It is a top view which shows the electrostatic capacitance type sensor part in the modification of 3rd Embodiment, and shows each electrode and wiring which were formed in the base material and the base material. It is a partial expanded sectional view which shows the electrostatic capacitance type input device of a prior art example.

  Hereinafter, specific embodiments of the capacitive input device of the present invention will be described with reference to the drawings. In addition, the dimension of each drawing is changed and shown suitably.

<First Embodiment>
FIG. 1 is an exploded perspective view showing the capacitive input device according to the first embodiment. As shown in FIG. 1, the capacitive input device 10 of the present embodiment includes a capacitive sensor unit 20 that detects input position information and a front panel 31. The front panel 31 is disposed on the input operation side (Z1 direction in FIG. 1) with respect to the capacitive sensor unit 20, and the capacitive sensor unit 20 and the front panel 31 are disposed via an adhesive layer 32. It is pasted together.

  The front panel 31 is formed in a flat plate shape using a translucent glass material or a resin material. As shown in FIG. 1, a colored decorative layer 38 is provided on the back surface side (the surface in the Z2 direction in FIG. 1) of the front panel 31, and the decorative layer 38 is provided at the outer periphery of the front panel 31. It is provided in a frame shape. An area divided by the decoration layer 38 and surrounded by the decoration layer 38 is the input area 15 for performing an input operation. Further, the non-input area 16 is an area overlapping with the decoration layer 38 outside the input area 15.

  The surface panel 31 is not limited to a flat plate shape as shown in FIG. 1, and the surface panel 31 may be a three-dimensional surface shape having a curved surface or a part of a housing of an electronic device. Moreover, the decoration layer 38 is the structure directly formed in the surface panel 31, and also the structure which prepares the decoration film in which the decoration layer 38 was provided separately, and affixes this on the surface panel 31. good.

  As shown in FIG. 1, a plurality of first electrodes 22 and a plurality of second electrodes 24 are arranged in the input region 15 of the capacitive sensor unit 20. In addition, a conductor layer 55 (shown by hatching in FIG. 1) is formed in the non-input region 16 of the capacitive sensor unit 20 so as to surround the input region 15. The conductor layer 55 has a shielding function for preventing erroneous detection when electromagnetic noise enters from the outside or when an external object or the like approaches.

  FIG. 2 is a plan view of a capacitance sensor unit constituting the capacitance type input device of the present embodiment, and is a plan view showing a base material, and each electrode and wiring formed on the base material. FIG. 3 is a cross-sectional view of the capacitive input device when the capacitive input device shown in FIG. 1 is assembled and cut at the position of line III-III in FIG. Show.

  As shown in FIG. 2, the capacitive sensor unit 20 includes a base material 21, a plurality of first electrodes 22, a plurality of second electrodes 24, and a plurality of wirings 29 formed on the base material 21. It is configured. In FIG. 2, the conductor layer 55 is omitted in order to make the drawing easier to see. As shown in FIG. 2, the first electrode 22 and the second electrode 24 are formed in the input region 15, and both are rhombic pad-shaped electrodes. The first electrodes 22 are arranged at intervals in the X1-X2 direction, and the first electrodes 22 adjacent in the X1-X2 direction are connected to each other by a bridge portion 27. The plurality of connected first electrodes 22 extend in the X1-X2 direction, and a plurality of first electrodes 22 are arranged at intervals in the Y1-Y2 direction. The second electrodes 24 are arranged at intervals in the Y1-Y2 direction, and the second electrodes 24 adjacent in the Y1-Y2 direction are connected to each other by a narrow connection portion 28. The plurality of connected second electrodes 24 extend in the Y1-Y2 direction, and a plurality of second electrodes 24 are arranged at intervals in the X1-X2 direction.

  As shown in FIG. 2, the plurality of connected first electrodes 22 and the plurality of connected second electrodes 24 are formed so as to cross each other. As shown in FIG. 3, a crossing insulating layer 54 is provided so as to cover the connecting part 28 at a portion where the connecting part 28 and the bridge part 27 intersect, and straddles the connecting part 28 and the crossing insulating layer 54. Accordingly, a bridge portion 27 is formed. As shown in FIG. 3, the first electrodes 22 arranged so as to sandwich the connection portion 28 in the X1-X2 direction are connected by a bridge portion 27. Thus, the first electrode 22 and the second electrode 24 are formed in a state of being insulated from each other.

  In addition, as shown in FIG. 2, a plurality of wirings 29 connected to the first electrode 22 and the second electrode 24 are formed in the non-input region 16 of the base material 21. The plurality of wirings 29 are routed through the non-input area 16 of the base material 21 and connected to the terminal portion 30 for connecting to an external circuit.

In this embodiment, the base material 21 is formed using a film-like resin material, and includes polycarbonate resin (PC), polyethylene terephthalate resin (PET), polyethylene naphthalate resin (PEN), cyclic polyolefin (COP), A translucent resin material such as polymethyl methacrylate resin (PMMA) is used. The first electrode 22, the second electrode 24, and the connection portion 28 are formed using a transparent conductive material such as ITO (Indium Tin Oxide), SnO ₂ , or ZnO, and are formed by a thin film method such as sputtering or vapor deposition. It is formed. Further, the bridge portion 27, a metal material such as Cu, Ag, or Au, an alloy such as CuNi or AgPd, or a conductive oxide material such as ITO can be used. For the wiring 29 and the terminal portion 30, a metal material such as Cu, Ag, or Au, or a conductive oxide material such as ITO can be used.

  The capacitive sensor unit 20 of the present embodiment is arranged so as to form a capacitance between the first electrode 22 and the second electrode 24. When an operator performs an input operation, the first electrode 22 and the second electrode are brought into contact with a detection target such as a finger or the like, without touching the input region 15 on the surface of the front panel 31. The capacitance between the electrode 24 and the capacitance formed between each electrode and the detection object is combined. Input position information is detected based on this capacitance change.

  In recent years, various input operation methods have been used in a state where fingers are not brought into contact with the surface of the surface panel 31 in order to make the input operation more comfortable even if there are dirts due to sebum on the input surface or even when there are artificial nails. Realization is desired. Therefore, improvement in detection sensitivity in the input region 15 is required. In this case, not only the detection sensitivity of the input area 15 but also the detection sensitivity of the wiring 29 is improved. The input position information detected by the capacitance change between the first electrode 22 and the second electrode 24 is output to an external circuit via the wiring 29. In the case where the conductor layer 55 is not provided, false detection may occur if electromagnetic wave noise from the outside is superimposed on a signal propagating through the wiring 29 or if a capacitance is formed between the detected object and the wiring 29. May occur. In the capacitive input device 10 of the present embodiment, a conductor layer 55 is provided at a position overlapping the wiring 29 in the non-input region 16 as shown in FIGS. Thereby, intrusion of electromagnetic wave noise into the wiring 29 and a change in capacitance between the detected object and the wiring 29 are suppressed, thereby preventing erroneous detection. The conductor layer 55 only needs to be provided at least in a position overlapping the wiring 29, and more preferably, if the conductor layer 55 is provided so as to surround the input region 15, erroneous detection is effectively prevented.

  FIG. 4 is a partial enlarged cross-sectional view of the capacitive input device of the present embodiment, and particularly shows a partial enlarged cross-sectional view in the vicinity of the wiring. As shown in FIG. 4, the conductor layer 55 is formed at a position overlapping the wiring 29, and the wiring part insulating layer 51 and the raised layer 52 are laminated between the conductor layer 55 and the wiring 29. . As shown in FIG. 4, in the non-input region 16 of the base material 21, a wiring part insulating layer 51 is formed on the wiring 29, and a raised layer 52 is formed on the wiring part insulating layer 51. The layer 55 is formed so as to cover the raised layer 52.

  In the present embodiment, the conductor layer 55 can be formed using the same material as the bridge portion 27, and the conductor layer 55 and the bridge portion 27 can be formed in the same process. The conductor layer 55 is made of, for example, a metal material such as Cu, Ag, or Au, an alloy such as CuNi or AgPd, or a transparent conductive material such as ITO, and a thin film method such as sputtering or vapor deposition, screen printing, ink jet printing, or the like. The printing method is used.

  The wiring part insulating layer 51 is provided in order to ensure electrical insulation between the wiring 29 and the conductor layer 55. As shown in FIG. 4, the wiring part insulating layer 51 is formed so as to cover the wiring 29. Has been. For the wiring part insulating layer 51, it is preferable to use a material having environment resistance (moisture resistance, heat resistance, sebum resistance) so as not to cause insulation deterioration. In the present embodiment, for example, a mixture of novolac resin and environmental resistant resin such as acrylic resin is used. Further, the raised layer 52 is provided in order to increase the distance between the wiring 29 and the conductor layer 55, and high environmental resistance is not required. For the raised layer 52, a normal resist material, novolak resin, or the like can be used, and the raised layer 52 is formed by a photolithography technique. Alternatively, it can be formed by a printing method such as screen printing or inkjet printing. In this embodiment, the wiring part insulating layer 51 is formed to a thickness of about 1 μm to 2 μm, and the raised layer 52 is formed to a thickness of about 2 μm to 5 μm.

  Thus, in addition to the wiring part insulating layer 51 which insulates between the conductor layer 55 and the wiring 29, since the raising layer 52 is laminated | stacked, a conductor layer compared with the case where only the wiring part insulating layer 51 is formed. The capacitance between the conductor layer 55 and the wiring 29 can be reduced by increasing the distance between the wiring 55 and the wiring 29. Therefore, by reducing the parasitic capacitance in the non-input region 16, the capacitive coupling between the parasitic capacitance in the non-input region 16 and the electrostatic capacitance in the input region 15 can be reduced, so that the detection sensitivity in the input region 15 is improved. Is possible. Further, even when the distance between the conductor layer 55 and the wiring 29 is increased, false detection caused by intrusion of electromagnetic wave noise from the outside or capacitance formed between the detected object and the wiring 29 Can be prevented.

  In this specification, the distance between the wiring 29 and the conductor layer 55 is the distance in the vertical direction (Z1-Z2 direction) between the conductor layer 55 formed on the upper surface 52a of the raised layer 52 and the wiring 29. Show.

  As described above, according to the capacitive input device 10 of the present invention, the conductor layer 55 is provided to prevent erroneous detection, and the parasitic capacitance between the wiring 29 and the conductor layer 55 in the non-input region 16 is reduced. It is possible to reduce and improve the detection sensitivity of the input area 15.

  Further, as shown in FIG. 4, it is preferable that the raised layer 52 is formed thicker than the wiring portion insulating layer 51. By doing so, the distance between the wiring 29 and the conductor layer 55 can be further increased, so that the parasitic capacitance formed between the wiring 29 and the conductor layer 55 can be effectively reduced.

  As shown in FIG. 4, the wiring part insulating layer 51 and the raised layer 52 have a width dimension (a dimension in the X1-X2 direction orthogonal to the direction in which the wiring 29 extends) of the wiring part insulating layer 51. The raised layer 52 is formed so as to have a smaller width dimension. And the conductor layer 55 is formed so that the upper surface 52a and the side surface 52b of the raising layer 52 may be covered.

  By providing the conductor layer 55 in this manner, it is possible to shield moisture and the like from entering the inside of the raised layer 52 from the outside by the conductor layer 55, and the environmental resistance of the raised layer 52 covered with the conductor layer 55. (Moisture resistance and sebum resistance) can be improved. Furthermore, since it is possible to use a water-absorbing resin material or the like as the raised layer 52 and material selectivity is increased, the raised layer 52 is formed by selecting a material that can be formed to a predetermined thickness. It becomes easy to form 52 thickly. It also leads to a reduction in manufacturing costs.

  In the conventional capacitive input device 110 shown in FIG. 12, by forming the insulating layer 154 thick, the distance between the wiring 129 and the conductor layer 155 can be increased to reduce the parasitic capacitance. However, in the capacitance type input device 110 of the conventional example, the insulating layer 154 is formed not only on the wiring 129 but also on the first electrode 122 and the second electrode in the input region 115. When the layer 154 is formed thick, the insulating layer 154 between the bridge portion 127 and the wiring 129 is also thickened. A transparent material is used for the insulating layer 154. However, when the insulating layer 154 is formed thick, a contrast difference between a region where the insulating layer 154 is formed and a region where the insulating layer 154 is not formed is conspicuous, and the insulating layer 154 is externally provided. Will be visually recognized.

  As shown in FIG. 4, the capacitance type input device 10 of the present embodiment is formed such that the distance between the conductor layer 55 and the wiring 29 is larger than the distance between the bridge portion 27 and the connection portion 28. That is, the total thickness of the wiring part insulating layer 51 and the raised layer 52 is formed to be thicker than the thickness of the intersecting part insulating layer 54. Thereby, even when the wiring part insulating layer 51 and the raised layer 52 are provided in the non-input region 16 to reduce the parasitic capacitance, the crossing insulating layer 54 in the input region 15 does not need to be formed thick. The insulating layer 54 is prevented from being visually recognized from the outside, and good invisible characteristics are ensured. Further, even if the raised layer 52 is provided on the wiring part insulating layer 51, the decorative layer 38 is provided in the non-input region 16, so that the conductor layer 55, the raised layer 52, and the like are visible from the outside. There is no.

  The intersection insulating layer 54 and the wiring insulating layer 51 are preferably formed using the same material. By so doing, the crossing insulating layer 54 and the wiring insulating layer 51 can be formed in the same process, so that the manufacturing process of the electrostatic input device 10 can be reduced and the manufacturing cost can be reduced.

  FIG. 5 is a partially enlarged cross-sectional view showing a first modification of the capacitive input device according to the first embodiment. As shown in FIG. 5, the configuration of the conductor layer 55 is different in the capacitive input device 10 of the first modification. In this modification, the conductor layer 55 is formed on the upper surface 52a of the raised layer 52 and is not formed on the side surface 52b. Even in such an aspect, the parasitic capacitance between the wiring 29 and the conductor layer 55 can be reduced, and the detection sensitivity in the input region 15 can be improved.

  Since the structure of the conductor layer 55 and the raised layer 52 in the first modification is relatively simpler than the structure shown in FIG. 4, it is preferable to form the conductor layer 55 and the raised layer 52 by screen printing. . By forming by a printing method such as a screen printing method, it can be manufactured at a low cost, and it is easy to form the raised layer 52 thick.

  FIG. 6 is a partially enlarged cross-sectional view showing a second modification of the capacitive input device according to the first embodiment. As shown in FIG. 6, the first transparent filling layer 35 is provided on the back surface of the front panel 31, and the second transparent filling layer 36 is provided on the input operation side surface of the substrate 21. The first transparent filling layer 35 is formed with a thickness equivalent to the thickness of the decorative layer 38, and a step formed by the front panel 31 and the decorative layer 38 (hereinafter referred to as “decorative step 39”). .) Is formed in the input region 15 of the front panel 31. The second transparent filling layer 36 is formed with a thickness equivalent to the total thickness of the wiring part insulating layer 51, the raised layer 52, and the conductor layer 55. The second transparent filling layer 36 has a step formed by a laminated structure such as the wiring part insulating layer 51, the raised layer 52, and the conductor layer 55 and the base material 21 (hereinafter referred to as “wiring part step 53”). Is formed in the input region 15 of the base material 21.

  For the first transparent filling layer 35 and the second transparent filling layer 36, for example, a light-transmitting resin material such as acrylic resin can be used, and can be formed by ink jet printing or screen printing.

  In this modification, by providing the first transparent filling layer 35 and the second transparent filling layer 36, the step on the front panel 31 side and the step on the base material 21 side to be bonded together by the adhesive layer 32 can be reduced. it can. Thereby, since the dispersion | variation and the local change of the distance of the thickness direction bonded through the adhesion layer 32 are eliminated, the surface panel 31 and the base material 21 are bonded together without the clearance gap by the softness | flexibility of the adhesion layer 32. The Therefore, it is possible to prevent generation of bubbles in the decorative step 39 and the wiring step 53.

  In particular, in the configuration in which the raised layer 52 is formed as in the capacitance-type input device 10 of the present embodiment, the step that must be absorbed by the flexibility of the adhesive layer 32 when the transparent filling layer is not provided. The height of will increase. Therefore, air bubbles are easily generated between the decorative step 39 and the adhesive layer 32 and between the wiring portion step 53 and the adhesive layer 32. Therefore, in this embodiment, providing the first transparent filling layer 35 and the second transparent filling layer 36 is effective in preventing the generation of bubbles.

  FIG. 7 is a partially enlarged cross-sectional view showing a third modification of the capacitive input device according to the first embodiment. In the present modification, the first transparent filling layer 35 is provided on the back surface of the front panel 31, and no transparent filling layer is provided on the substrate 21 side. In the present modification, the first transparent filling layer 35 is formed so as to ride on a part of the lower surface 38 b of the decorative layer 38 and is thicker than the decorative layer 38. That is, as shown in FIG. 7, the first transparent filling layer 35 has a convex shape toward the base material 21 rather than the lower surface 38 b of the decorative layer 38.

  As shown in FIG. 7, by forming the first transparent filling layer 35 in a convex shape, the wiring portion step 53 can be absorbed by the convex shape of the first transparent filling layer 35. Even in such an embodiment, the variation in the distance in the thickness direction and the local change bonded through the adhesive layer 32 can be suppressed. Are pasted together.

<Second Embodiment>
FIG. 8 is a partially enlarged cross-sectional view showing the capacitive input device according to the second embodiment. As shown in FIG. 8, the capacitive input device 11 of the second embodiment is different in the configuration of the wiring part insulating layer 51 and the raised layer 52 provided on the wiring 29, and in the input region 15. Patterns such as the first electrode 22 and the second electrode 24 (only the connection portion 28 is shown in FIG. 8) are the same as those in the first embodiment shown in FIG.

  As shown in FIG. 8, in the capacitive input device 11 of the present embodiment, a raised layer 52 is formed on the wiring 29, and a wiring part insulating layer 51 is formed on the raised layer 52. The conductor layer 55 is formed on the upper surface 51 a of the wiring part insulating layer 51. Further, the wiring part insulating layer 51 is formed so as to cover the raised layer 52 and is formed over the upper surface 52 a and the side surface 52 b of the raised layer 52.

  Also in this embodiment, since the raised layer 52 is formed in addition to the wiring part insulating layer 51, the distance between the wiring 29 and the conductor layer 55 can be increased. Thereby, the electrostatic capacitance formed between the conductor layer 55 and the wiring 29 can be reduced, and the parasitic capacitance in the non-input region 16 is reduced. Therefore, since the capacitive coupling between the parasitic capacitance in the non-input region 16 and the electrostatic capacitance in the input region 15 can be reduced, the detection sensitivity in the input region 15 can be improved. Also in the present embodiment, the provision of the conductor layer 55 prevents intrusion of electromagnetic wave noise from the outside and occurrence of false detection due to the capacitance formed between the detected object and the wiring 29. The

  In addition, since the wiring part insulating layer 51 is formed so as to cover the raised layer 52, the wiring part insulating layer 51 can shield moisture and the like from entering the raised layer 52 from the outside. The environmental resistance (moisture resistance, sebum resistance, etc.) of the raised layer 52 covered with 51 can be improved. That is, even when a resin material having water absorbency is used as the raised layer 52, insulation deterioration can be prevented, and the material selectivity of the raised layer 52 is expanded, leading to a reduction in manufacturing cost, and the raised layer. It becomes easy to form 52 thickly. In FIG. 8, the conductor layer 55 is formed on the upper surface 51a of the wiring part insulating layer 51. However, the conductor layer 55 covers a part of the wiring part insulating layer 51 from the upper surface 51a to the side surface 51b of the wiring part insulating layer 51. It is also possible to form the layer 55.

<Third Embodiment>
FIG. 9 is a plan view showing a base material, and each electrode and wiring formed on the base material in the capacitive input device of the third embodiment. FIG. 10 is a partially enlarged view when the substrate shown in FIG. 9 is bonded to the front panel to form a capacitance-type input device and is cut from the position of line XX in FIG. It is sectional drawing.

  As shown in FIG. 9, the capacitive input device 12 of the present embodiment is different in the structure of each electrode in the input region 15. As shown in FIG. 9, the first electrode 23 is formed such that the width dimension in the Y1-Y2 direction gradually decreases as it goes in the X2 direction. The second electrode 25 is formed such that the width dimension in the Y1-Y2 direction gradually decreases as it goes in the X1 direction. The first electrode 23 and the second electrode 25 are arranged as a set with a space therebetween, and a plurality of sets of the first electrode 23 and the second electrode 25 are arranged in the Y1-Y2 direction. ing. The wiring 29 is connected to each of the first electrode 23 and the second electrode 25 and is routed through the non-input region 16.

  Even in such a pattern, when an object to be detected such as a finger approaches during an input operation, the capacitance between the first electrode 23 and the second electrode 25, each electrode, and the object to be detected The capacitance formed between the body and the body is combined. Input position information is detected based on this capacitance change.

  As shown in FIG. 9, the present invention can be applied even when the patterns of the first electrode 23 and the second electrode 25 that detect input position information are different. As shown in FIG. 10, also in this embodiment, the conductive layer 55 is provided at a position overlapping the wiring 29, and the wiring portion insulating layer 51 and the raised layer 52 are formed between the wiring 29 and the conductive layer 55. Can do. Also in this embodiment, the parasitic capacitance in the non-input area 16 can be reduced and the detection sensitivity in the input area 15 can be improved.

  The configurations, materials, and the like of the conductive layer 55, the wiring portion insulating layer 51, and the raised layer 52 shown in FIG. 10 can be formed in the same manner as in the first embodiment shown in FIG. Moreover, it is also possible to apply the structure shown in another modification and 2nd Embodiment.

  FIG. 11 is a plan view showing a modified example of the capacitance-type input device 12 of the third embodiment, showing the substrate, each electrode and wiring formed on the substrate. As shown in FIG. 11, a plurality of rectangular electrodes 26 are arranged in the input region 15, and the wiring 29 is connected to each of the electrodes 26 and drawn out to the non-input region 16. Note that although the wiring 29 is partially omitted in FIG. 11, each of the wirings 29 is connected to a terminal portion 30 for connection to an external circuit. The capacitance-type input device 12 according to this modification can detect input position information by detecting a change in capacitance between the plurality of electrodes 26 and the detection target.

  In such a pattern, the parasitic capacitance increases because the number of wirings 29 and the entire area of the wiring 29 increase, and the influence of the parasitic capacitance increases when the detection sensitivity of the input region 15 is improved. In this modified example, as in FIG. 10, by providing the conductive layer 55, the wiring part insulating layer 51, and the raised layer 52, the false detection is suppressed and the parasitic capacitance between the wiring 29 and the conductive layer 55 is reduced. It is possible to effectively reduce the detection sensitivity of the input region 15.

  In the capacitance type input devices 10, 11, and 12 of the first to third embodiments, the configuration in which each electrode and wiring are provided on one side of the base material 21 is shown, but the present invention is not limited thereto. Not. A configuration in which the first electrode is formed on one surface of the base material 21 and the second electrode is formed on the other surface of the base material 21, or the first base material on which the first electrode is formed, The present invention can be applied even to a multilayer structure or the like prepared by preparing a second base material on which a second electrode is formed and bonding the first base material and the second base material together. .

10, 11, 12 Capacitive input device 15 Input region 16 Non-input region 20 Capacitive sensor unit 21 Base material 22, 23 First electrode 24, 25 Second electrode 26 Electrode 27 Bridge unit 28 Connection unit DESCRIPTION OF SYMBOLS 29 Wiring 31 Front panel 32 Adhesive layer 35 1st transparent filling layer 36 2nd transparent filling layer 38 Decorating layer 51 Wiring part insulating layer 52 Raised layer 54 Crossing part insulating layer 55 Conductor layer

Claims (4)

A substrate, a plurality of electrodes, wiring connected to the electrodes, and a conductor layer;
In the base material, an input area for performing an input operation and a non-input area outside the input area are set,
A plurality of the electrodes are formed in the input region of the base material, and the wiring is formed in a non-input region of the base material,
The conductor layer is disposed at a position overlapping the wiring,
A wiring part insulating layer and a raised layer are laminated between the conductor layer and the wiring,
The plurality of electrodes includes a plurality of light-transmitting first electrodes and a plurality of second electrodes,
The first electrodes are arranged at intervals in a first direction within the substrate surface, and the adjacent first electrodes are connected by a bridge portion,
The second electrodes are arranged at intervals in a second direction intersecting the first direction, and the adjacent second electrodes are connected by a connecting portion,
An intersection insulating layer is formed so as to cover the connection portion, and the bridge portion is formed across the connection portion and the intersection insulating layer so as to intersect the connection portion in plan view. And
The capacitance-type input device, wherein a distance between the conductor layer and the wiring is larger than a distance between the bridge portion and the connection portion. The wiring part insulating layer is formed on the wiring, and the raised layer is formed on the wiring part insulating layer,
The capacitive input device according to claim 1, wherein the conductor layer is formed so as to cover the raised layer. The raised layer is formed on the wiring, and the wiring part insulating layer is formed on the raised layer,
The capacitive input device according to claim 1, wherein the wiring part insulating layer is formed so as to cover the raised layer.   The capacitive input device according to claim 1, wherein the intersecting portion insulating layer and the wiring portion insulating layer are formed of the same material.

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