JP2015138895A - Peeling method in manufacturing process of various flexible devices - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate peeling method having high process adaptability and high productivity at low cost.SOLUTION: The peeling method of peeling a substrate and a layer to be peeled by using light irradiated from a light source in a multilayer body formed of the substrate, a photothermal exchange film, and the layer to be peeled in this order includes: producing the photothermal exchange film derived from a compound having a molecular group having light absorption at a wavelength irradiated from the light source and a silanol group and/or an alkoxy silane group; and peeling the substrate and the layer to be peeled by irradiating the photothermal exchange film with light from the light source, transmitting the substrate.

Description

  The present invention relates to a peeling method for peeling a substrate and a layer to be peeled using light emitted from a light source in a multilayer body including a glass substrate and the layer to be peeled.

A so-called flexible display whose display portion can be deformed flexibly is attracting attention as a thin, light and non-breaking display. Liquid crystal display type flexible displays usually have a structure in which a liquid crystal layer or a light emitting material is sandwiched between organic transparent resin materials such as polyimide resin. Moreover, in the case of an organic EL display, it has organic resin materials, such as a polyimide resin.
In the manufacturing process of a liquid crystal panel as a flexible display, the transparent resin material is formed on a support substrate such as glass, and a TFT substrate, a liquid crystal layer, a CF substrate, and the like are formed thereon. And finally, the process (peeling process) of peeling the said transparent resin material and the said support substrate is needed.

In the conventional manufacturing process of the liquid crystal display, laser light such as excimer laser is used in the peeling process.
For example, in Patent Document 1 below, a first layer made of a material such as Ti is formed on a substrate, a second layer made of a material such as silicon oxide is formed on the first layer, and further a cover is formed thereon. A method is described in which a release layer (resin material) is formed, and a layer to be peeled and the substrate are peeled off by irradiating the substrate with laser light from the substrate side. According to this method, by applying laser light, tensile stress is generated in the first layer, while compressive stress is generated in the second layer, so that the layer to be peeled and the substrate can be peeled off. .

  Further, the techniques described in the following Patent Documents 2 and 3 provide, for example, a separation layer made of amorphous silicon (or polysilicon), pass through the substrate, and irradiate laser light to form amorphous silicon. By releasing hydrogen contained in the substrate, voids are generated to separate the substrate. In addition, Patent Document 4 below uses this technique to describe that a layer to be peeled (referred to as a layer to be transferred in the same document) is attached to a plastic film to complete a liquid crystal display device.

  Further, in Patent Document 5 below, a photothermal conversion layer made of molybdenum is provided between glass as a base material and transparent polyimide as a layer to be peeled, and the molybdenum is heated using a xenon flash lamp, whereby There is a description that the release layer and the substrate can be peeled off.

JP 2006-203219 A Japanese Patent Laid-Open No. 10-125929 Japanese Patent Laid-Open No. 10-125931 Japanese Patent Laid-Open No. 10-125930 JP 2013-145808 A

However, the method of peeling the substrate using the above prior art method has the following problems.
First, in the above-described method using polysilicon, a relatively large laser beam irradiation is required in order to give sufficient energy to pass through the substrate and to release hydrogen contained in amorphous silicon. The peeled layer will be damaged. In addition, in the above method, when an element is manufactured on the separation layer, if high-temperature heat treatment or the like is performed in the element manufacturing process, hydrogen contained in the separation layer is diffused and reduced, and the separation layer is irradiated with laser light. However, there is a risk that peeling will not be performed sufficiently. Therefore, in order to maintain the amount of hydrogen contained in the separation layer, the process after the formation of the separation layer is limited. In addition, when a metal thin film layer such as molybdenum is provided in the photothermal conversion layer, the metal itself is not decomposed and gasified. Therefore, the molybdenum layer is heated by light, and the difference between the thermal expansion coefficients of the polyimide film, glass, and molybdenum is utilized. In order to obtain peeling energy, a large amount of light energy is required. In some cases, the transparent polyimide of the peeled layer may be colored by this heating.

  Second, since the irradiation area of the laser is narrow, it takes time for the peeling process and the manufacturing efficiency is poor. For example, since a general excimer laser irradiates in a line shape of 0.6 mm × 300 mm, a long time is required for the peeling process when the peeling surface is extensive.

  Thirdly, for example, excimer lasers that generate laser light using a mixed gas such as a rare gas or halogen are gas exchange type, so the running cost is high. Become.

  In view of the above problems, the problem to be solved by the present invention is to provide a substrate peeling method that is low in cost, high in productivity, and high in process compatibility.

As a result of intensive studies and experiments conducted to solve such problems, the present inventors have found that the problems can be solved by the following solution means, and have completed the present invention.
That is, the present invention is as follows.

  [1] In a multilayer body in which a substrate, a photothermal exchange film, and a layer to be peeled are formed in this order, a peeling method for peeling the substrate and the layer to be peeled using light irradiated from a light source, The photothermal exchange film is produced from a molecular group having light absorption at a wavelength irradiated from a light source and a compound having a silanol group and / or an alkoxysilane group, and transmits light emitted from the light source through the substrate. And the said peeling method characterized by peeling off this board | substrate and said to-be-peeled layer by irradiating this photothermal exchange film | membrane.

  [2] The molecular group having light absorption at the wavelength irradiated from the light source and the compound having silanol group and / or alkoxysilane group of the compound having light absorption at the wavelength irradiated from the light source is an organic group. The peeling method according to the above [1].

  [3] The molecular group having light absorption at the wavelength irradiated from the light source and the compound having silanol group and / or alkoxysilane group, the molecular group having light absorption at the wavelength irradiated from the light source is an aromatic hydrocarbon group. The peeling method according to the above [1] or [2].

｛式中、Ｒ_１は、水素原子又は炭素数１〜６の一価の脂肪族炭化水素基であり、Ｒ_２は、水素原子又は炭素数１〜６の一価の有機基であり、Ｒ_３は、単結合又は炭素数１〜１０の一価の脂肪族炭化水素基であり、Ｒ_４は、光源から照射される波長に光吸収を持つ分子基を有する炭素数６〜６０の芳香族炭化水素基であり、そしてｎは、１〜３の整数である。｝で表される化合物である、前記［１］〜［３］のいずれかに記載の剥離方法。 [4] A compound having a molecular group having light absorption at a wavelength irradiated from the light source and a silanol group and / or an alkoxysilane group is represented by the following general formula (1):

{In the formula, R ₁ is a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms; R ₂ is a hydrogen atom or a monovalent organic group having 1 to 6 carbon atoms; ₃ is a single bond or a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms, and R ₄ is an aromatic group having 6 to 60 carbon atoms having a molecular group that absorbs light at a wavelength irradiated from a light source. A hydrocarbon group, and n is an integer of 1 to 3. } The peeling method in any one of said [1]-[3] which is a compound represented by.

から選ばれる分子基を構造中に一つ以上含む、前記［４］に記載の剥離方法。 [5] R ₄ in the general formula (1) is the following compound group:

The peeling method according to the above [4], wherein the structure contains one or more molecular groups selected from

  [6] A solution in which a molecular group having light absorption at a wavelength irradiated from the light source and a compound having a silanol group and / or an alkoxysilane group are dissolved in an organic solvent at a concentration of 0.1 wt% to 80 wt%. The peeling method according to any one of [1] to [5], wherein the photothermal exchange film is prepared by spraying or coating the substrate on the substrate and then drying the solvent.

  [7] The peeling method according to any one of [1] to [6], wherein the light source is laser light.

  [8] The peeling method according to any one of [1] to [6], wherein the light source is a flash lamp.

  [9] The peeling method according to any one of [1] to [8], wherein the substrate is a glass substrate.

  [10] The peeling method according to any one of [1] to [9], wherein the layer to be peeled includes a TFT element formed on a polyimide resin.

  [11] A method for producing a flexible liquid crystal display, comprising the peeling method according to any one of [1] to [10] as a part of the process.

  [12] A method for producing a flexible organic EL display, comprising the peeling method according to any one of [1] to [10] as a part of the process.

  According to the peeling method of the present invention, in the photothermal exchange film, the light transmitted through the substrate is efficiently absorbed at the interface between the substrate and the photothermal exchange film, and the light is converted into heat, and itself is thermally decomposed. Since it can be gasified, the energy required for peeling can be efficiently concentrated on the interface. For this reason, it is possible to greatly improve the throughput of the light irradiation peeling step, and peeling can be realized even by using a solid laser having a relatively small output and low running cost. That is, it is possible to realize a substrate peeling method with low cost and high productivity.

(A)-(d) is a figure for demonstrating the manufacturing method of the liquid crystal display which concerns on Embodiment 1. FIG. (A)-(d) is a figure for demonstrating the manufacturing method of the organic electroluminescent display which concerns on Embodiment 2. FIG. 5 is a diagram showing a part of the configuration of an organic EL structure part of an organic EL display according to Embodiment 2. FIG.

An embodiment of the present invention will be described below with reference to the drawings.
[Embodiment 1]
FIG. 1 is a diagram for explaining a method of manufacturing the liquid crystal display 10 according to the first embodiment.
In FIG. 1, 11 is a glass substrate, 12 is a photothermal exchange film, 13 is a transparent resin layer, 14 is a base coat, 15 is a liquid crystal structure, 16 is a base coat, 17 transparent resin layer, 18 is a photothermal exchange film, and 19 is a glass substrate. Is shown.
The glass substrates 11 and 19 are glass substrates having translucency and heat resistance. As the glass substrate 11, a mother glass used for a general display panel can be used.

  Specifically, the photothermal exchange membrane is produced as follows. 0.1% by weight of a compound having a molecular group having light absorption at a wavelength irradiated from a light source and a silanol group and / or an alkoxysilane group (hereinafter also referred to as a silicon coupler having a light absorption group) in an organic solvent, etc. It is dissolved at a concentration of ˜80% by weight, sprayed on a glass substrate, or spread on a glass substrate using various coating methods such as spin coating method and die coating method, and then naturally dried or 200 ° C. or less Dry in the oven. This operation causes a polycondensation reaction between the silanol group on the glass substrate surface and the silanol group and / or the alkoxysilane group contained in the silicon coupler having the light absorbing group, thereby irradiating from a light source that is strongly covalently bonded to the glass. It is possible to form an ultrathin film layer having a molecular group that absorbs light at a wavelength to be emitted.

  The organic solvent used in this step is not particularly limited as long as it is a solvent that dissolves a silicon coupler having a light absorbing group, but is not limited to alcohol solvents, ketone solvents, ester solvents, ether solvents. Solvents and lactone solvents are preferred. Specific examples of the alcohol solvent include methanol, ethanol, isopropanol, and butanol. Examples of the ketone solvent include acetone, methyl ethyl ketone, and butanone. Examples of the ester solvent include tetrahydrofuran, methyl acetate, and acetic acid. Examples include ethyl, propyl acetate, butyl acetate, and ethyl lactate. Ether solvents include cellosolve and propylene glycol, and propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate.

  Among these solvents, a solvent having high volatility at room temperature is preferable from the viewpoint of easy drying, and methanol, ethanol, acetone, tetrahydrofuran, methyl ethyl ketone, and ethyl acetate are preferable from the viewpoint of flatness of the coating film. Ethanol is most preferable from the viewpoint of room temperature storage stability of a silicon coupler having a light absorbing group. Moreover, when water is added in the range of 0.5 wt% to 10 wt% with respect to the solvent, the silanol of the silicon coupler having a light absorbing group undergoes hydrolysis and polycondensation in advance to form an oligomer, and glass It is preferable from the viewpoint of improving the adhesion to the substrate.

The concentration of the silicon coupler having a light absorbing group with respect to the solvent is preferably in the range of 0.1% to 80% by weight. If it is outside this range, there is a risk that the in-plane uniformity of the photothermal exchange film after drying is lowered. More preferably, 0.5 to 30% by weight is preferable from the viewpoint of storage stability of the solution and uniformity of the coating film. A range of 1% to 10% by weight is most preferred.
As a method for applying to the glass substrate, the above solution is used and applied by various methods such as spray coating, spraying, spin coating, bar coating, and die slot coating.

As a drying method, it may be naturally dried by leaving it at room temperature. However, when it is placed in an oven at 90 ° C. to 200 ° C., the silanol group of the silicon coupler having a silanol group and a light absorbing group on the glass can be obtained. Since polycondensation is caused and a strong covalent bond can be formed in a short time, it is preferable. When heating at 200 ° C. or higher, the photothermal exchange membrane is oxidized due to the influence of oxygen in the air, so it is preferable to heat in an inert gas such as nitrogen gas.
Since the silicon coupler having a light absorbing group has a strong covalent bond with glass, it is possible to prevent the photothermal exchange film from being dispersed in the polyimide layer in the subsequent process of forming the transparent polyimide resin of the peeled layer. Moreover, color transfer and coloring to the transparent polyimide film caused by the light absorption layer can be prevented. Further, the present silicon coupler may have a function of improving the adhesion of transparent polyimide to glass, but the essential function of the present silicon coupler is the role of a photothermal exchange film in the light peeling process. .

｛式中、Ｒ_１は、水素原子又は炭素数１〜６の一価の脂肪族炭化水素基であり、Ｒ_２は、水素原子又は炭素数１〜６の一価の有機基であり、Ｒ_３は、単結合又は炭素数１〜１０の一価の脂肪族炭化水素基であり、Ｒ_４は、光源から照射される波長に光吸収を持つ分子基を有する炭素数６〜６０の芳香族炭化水素基であり、そしてｎは、１〜３の整数である。｝で表される構造を有することが好ましい。 As a silicon coupler having a light absorbing group, specifically, a molecular group having light absorption at a wavelength irradiated from a light source is an organic group, compared with an inorganic compound such as a metal thin film or polysilicon, It is preferable from the viewpoint of excellent peelability. Furthermore, it is preferable that this organic group contains an aromatic hydrocarbon group from the viewpoint of excellent light absorption and, as a result, excellent peelability after light irradiation. Furthermore, the following general formula (1):

{In the formula, R ₁ is a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms; R ₂ is a hydrogen atom or a monovalent organic group having 1 to 6 carbon atoms; ₃ is a single bond or a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms, and R ₄ is an aromatic group having 6 to 60 carbon atoms having a molecular group that absorbs light at a wavelength irradiated from a light source. A hydrocarbon group, and n is an integer of 1 to 3. } Is preferable.

から選ばれる分子基を構造中に一つ以上含んでいることが好ましい。 R ₄ in the general formula (1) is preferably a molecular group having light absorption at a wavelength irradiated from a light source and a molecular group having low fluorescence quantum efficiency from the viewpoint of releasability. At the same time, a molecular group having heat resistance at the process temperature of the subsequent polyimide film forming process or TFT element fabrication process is preferred from the viewpoint of releasability and prevention of coloring of the peeled layer.
R ₄ in the general formula (1) represents the following compound group:

It is preferable that the structure contains one or more molecular groups selected from

が剥離性の観点から更に好ましい。 Silicon couplers with light absorbing groups include the following compounds:

Is more preferable from the viewpoint of peelability.

The transparent resin layers 13 and 17 (layer to be peeled) are made of an organic transparent resin material having heat resistance such as polyimide (PI).
As the base coats 14 and 16, for example, SiN or SiO ₂ can be used, and these may be alternately stacked.
The liquid crystal structure 15 is composed of the same constituent members as those constituting a general liquid crystal display, and includes a thin film transistor (TFT), various signal lines (scanning signal lines, data signal lines, etc.), a pixel electrode, a liquid crystal layer, and a common electrode. (Counter electrode), color filter (CF), insulating layer, and the like. A well-known configuration and manufacturing method can be applied to the liquid crystal structure portion 15.

(Manufacturing method of liquid crystal display)
The liquid crystal display 10 according to the first embodiment is a so-called flexible display whose display portion can be flexibly deformed (has flexibility). The manufacturing process of the liquid crystal display 10 includes a TFT substrate (active matrix substrate) manufacturing process, a CF substrate (color filter substrate) manufacturing process, an assembly process in which both substrates are bonded together and filled with liquid crystal, and glass substrates 11 and 19. The peeling process which peels is included.
Hereinafter, a method for manufacturing the liquid crystal display 10 will be described. A well-known manufacturing process can be applied to the TFT substrate manufacturing process, the CF substrate manufacturing process, and the assembly process. An example is given below, but the present invention is not limited to this.

、すなわち、光吸収基を持つシリコンカプラー（ゲレスト社製 ＳＩＴ８１８６．２ ７−トリエトキシシリルプロポキシ―５−ヒドロキシ―フラボン）をメタノールに１重量％溶解し、引き続き、水２重量％を添加した溶液を一晩室温にて撹拌した後、マザーガラス上にスピンコート法にて塗布し、１３０℃のオーブンに２０分投入することで、ガラス基板上に光熱交換膜を得た。尚、化合物（１）は、本発明の実施の形態の一例を示すものであり、これに限られるものではない。 (TFT substrate manufacturing process)
First, the photothermal exchange film 12 is produced on the glass substrate 11 (mother glass). Specifically, for example, the following compound (1):

That is, a silicon coupler having a light absorbing group (SIT 8186.2 7-triethoxysilylpropoxy-5-hydroxy-flavone manufactured by Gerest Co.) was dissolved in 1% by weight in methanol, and then a solution containing 2% by weight of water was added. After stirring overnight at room temperature, it was applied on a mother glass by a spin coating method and placed in an oven at 130 ° C. for 20 minutes to obtain a photothermal exchange film on a glass substrate. In addition, compound (1) shows an example of embodiment of this invention, and is not restricted to this.

Next, a transparent resin material (here, polyamic acid which is a polyimide (PI) precursor is taken as an example) is applied onto the glass substrate 11 on which the photothermal exchange film 12 is formed by spin coating or bar coating. After baking, it is put into an oven at 350 ° C. to dehydrate and cyclize the polyamic acid to obtain a polyimide film insoluble in an organic solvent and having high heat resistance. Thereby, the PI layer 13 having a film thickness of 3 μm to 20 μm is formed.
Next, a base coat 14 such as SiN is formed by a CVD (Chemical Vapor Deposition) method or a sputtering method. At this time, multiple layers of SiO ₂ and SiN may be alternately formed. As a result, a barrier film against moisture and organic components is formed.
Next, a metal film such as titanium is formed on the base coat 14 by a sputtering method, and then patterned by a photolithography method to form scanning signal lines.

Next, an inorganic insulating film such as silicon nitride is formed by CVD on the entire glass substrate 11 on which the scanning signal lines are formed, and the photoresist is removed to form a gate insulating film.
Next, a data signal line and a source electrode / drain electrode of a transistor are formed on the gate insulating film (the entire glass substrate 11) (formation of a metal layer).
Next, an interlayer insulating film (inorganic interlayer insulating film, organic interlayer insulating film) is formed on the entire glass substrate 11 on which data signal lines and the like are formed.
Thereafter, a contact hole is formed in the interlayer insulating film, and the entire glass substrate 11 on the interlayer insulating film in which the contact hole is formed is made of ITO (Indium Tin Oxide), IZO (Indium ZincOxide), zinc oxide, tin oxide or the like. A transparent conductive film is formed by sputtering to form each pixel electrode.
Finally, an alignment film is formed on the entire glass substrate 11 on the pixel electrode. As described above, a TFT substrate can be manufactured.

(CF substrate manufacturing process)
Next, the CF substrate manufacturing process will be described.
First, like the TFT substrate, a photothermal exchange film 18 is formed on a glass substrate 19 (mother glass) by applying a silicon coupler having a light absorbing group. At this time, unnecessary portions may be formed into a mask in accordance with the chamfering of the panel. Thereafter, a marker for bonding is formed. In that case, you may etch according to panel chamfering.
Next, a transparent resin material (PI) is applied on the glass substrate 19 on which the photothermal exchange film 18 is formed, and baking is performed. Thereby, the PI layer 17 having a film thickness of 3 μm to 20 μm is formed.
Next, a base coat 16 such as SiN is formed by CVD or sputtering. As a result, a barrier film against moisture and organic components is formed.

Next, after depositing a chromium thin film or a resin containing a black pigment on the base coat 16, patterning is performed by a photolithography method to form a black matrix. Next, red, green and blue color filter layers are patterned in the gaps of the black matrix using a pigment dispersion method or the like.
Next, a transparent conductive film made of ITO, IZO, zinc oxide, tin oxide or the like is formed on the entire glass substrate 19 on the color filter layer to form a common electrode (counter electrode).
Finally, an alignment film is formed on the entire glass substrate 19 on the common electrode. As described above, a CF substrate can be manufactured.

(Assembly process)
Next, the assembly process will be described.
First, a sealing material made of a thermosetting epoxy resin or the like is applied to one of the TFT substrate and the CF substrate by screen printing in a frame-like pattern lacking the liquid crystal injection port, and the thickness of the liquid crystal layer is applied to the other substrate. A spherical spacer made of plastic or silica is sprayed.
Next, the TFT substrate and the CF substrate are bonded together, and the sealing material is cured.
Finally, after injecting a liquid crystal material into the space surrounded by the TFT substrate, the CF substrate and the sealing material by a decompression method, a thermosetting resin is applied to the liquid crystal injection port, and the liquid crystal material is sealed by heating to form a liquid crystal layer Form. FIG. 1A shows a state at the time when the assembly process is completed.
In addition, the manufacturing process of a liquid crystal display draws a sealing material with a dispenser, and even if it manufactures a cell gap using a resin spacer (what maintains a columnar gap with resin) in a TFT substrate manufacturing process or a CF substrate manufacturing process. Good.

(Peeling process)
Next, the peeling process will be described.
After bonding the TFT substrate and the CF substrate, the glass substrate 11 (mother glass) is peeled off by irradiating light from the TFT substrate side, and the glass substrate 19 (mother glass) is peeled off by irradiating light from the CF substrate side. To do. Since the peeling process on the TFT substrate side and the peeling process on the CF substrate side have the same contents, the peeling process on the CF substrate side will be described below.

  The light used in the peeling process in the manufacturing process of the liquid crystal display 10 may be a laser beam having a specific wavelength range, or a continuous wide wavelength range from the ultraviolet range to the visible light range and the near infrared range. It may be a flash lamp light. As the laser light, laser light having a wavelength that passes through the glass substrate is preferable, and light of 295 nm to 400 nm is desirable. Specifically, the third high and long wave (355 nm) of the solid-state laser Nd: YAG laser, the second high and high wave of the titanium sapphire laser, the XeCl laser (308 nm) and the XeF laser (351 nm) of the excimer laser Etc. are desirable. A solid laser is preferable from the viewpoint of maintainability and low running cost, and an excimer laser is preferable from the viewpoint of high throughput. The flash lamp is preferably a xenon flash lamp.

  In the peeling with the laser beam according to Embodiment 1, the laser light beam spot is as small as a shot area on the order of several mmΦ compared to the glass substrate, and thus the peeling is performed by scanning the glass substrate. At this time, it is necessary to control the scan speed so that the light absorbing group of the photothermal exchange film is excited by the laser beam and is sufficiently decomposed, and as a result, the peeled layer can be peeled from the glass substrate. That is, the exposure amount irradiated per unit area increases by scanning slowly, and the exposure amount irradiated per unit area decreases by scanning quickly.

The exposure amount of the laser beam has an appropriate range depending on the wavelength of the laser beam and the type of the photothermal exchange film to be used. If the exposure amount is insufficient, the photothermal exchange film is not sufficiently decomposed and peeling is insufficient, and if the exposure amount is too large, the laser continues to be irradiated even after the decomposition of the photothermal exchange film is completed. It may damage the transparent resin film and cause coloring.
In order to improve the throughput of the laser peeling process, the number of laser beams may be increased from one to many.

  In this way, by forming the photothermal exchange film layer 18 between the glass substrate 19 and the PI layer 17, the light transmitted through the glass substrate 19 is concentrated on the interface between the glass substrate and the transparent resin to cause absorption. Thus, the energy required for peeling can be obtained by converting into heat and decomposing and gasifying the heat exchange membrane layer itself as an organic group. Thereby, the glass substrate 19 can be peeled from the PI layer 17 using the energy of light irradiation.

By actively providing the photothermal exchange film layer, the peeling efficiency can be improved and the irradiation time can be shortened, so that the peeling process (tact time) can be shortened and the productivity of the liquid crystal display can be improved. .
In addition, an expensive laser is not occupied for a long time in the peeling process, so that the manufacturing cost can be reduced, and a solid laser that has a low output but a low running cost compared to an excimer laser can be used. By enabling peeling, it is possible to produce a liquid crystal display with low cost. Furthermore, according to the manufacturing process described above, since the existing manufacturing process can be applied except for the peeling process, the existing liquid crystal display manufacturing apparatus and manufacturing process can be used as they are.

  In the above-described peeling step, the peelable layer is peeled from the glass substrate 19 and then the support 4 is bonded onto the PI layer 17. This is because the PI layer 17 is as thin as 3 to 20 μm, so that the autonomy is low and the PI layer 17 may break. As a material for the support 4, it is preferable to use a thin organic film. For example, it is possible to use a film having a high gas barrier property that has been mass-produced by each film manufacturer, a film having optical functionality with suppressed haze value, PET (polyethylene terephthalate), PEN (polyethylene naphthalate), acrylic, or the like. . In the liquid crystal display 10, a polarizing plate may be used as the support 4. Further, glass, acrylic, or the like provided for the purpose of preventing damage or protecting the product may also be used as the support 4.

In the peeling step, the other surface (the glass substrate 11 side in FIG. 1C) is similarly performed, and the support 5 is similarly formed. Finally, by cutting at a predetermined position, each flexible liquid crystal display 10 is completed.
The liquid crystal display 10 according to Embodiment 1 may have a function of performing 2D display, 3D display, dual view display, bail view display, and triple view display. That is, the peeling method according to Embodiment 1 can be applied to various liquid crystal display manufacturing methods.

[Embodiment 2]
FIG. 2 is a diagram for explaining a method of manufacturing the organic EL display 20 according to the second embodiment.
In FIG. 2, 21 is a glass substrate, 22 is a photothermal exchange film, 23 is a transparent resin layer, 24 is a base coat, 25 is an organic EL structure part, 26 is a base coat, 27 is a transparent resin layer, 28 is a photothermal exchange film, 29 is A glass substrate is shown.
The glass substrate 21, the photothermal exchange film 22, the transparent resin layer 23, the base coat 24, the base coat 26, the transparent resin layer 27, the photothermal exchange film 28, and the glass substrate 29 are the glass substrate 11 constituting the liquid crystal display 10 according to the first embodiment. The photo heat exchange film 12, the transparent resin layer 13, the base coat 14, the base coat 16, the transparent resin layer 17, the photo heat exchange film 18, and the glass substrate 19 have the same configuration.

  FIG. 3 is a diagram illustrating a part of the configuration of the organic EL structure unit 25. The organic EL structure part 25 is formed on the lower substrate 2a composed of the glass substrate 21, the photothermal exchange film 22, the transparent resin layer 23, and the base coat 24, and is composed of the same constituent members as those constituting a general organic EL display. For example, an organic EL element 250a that emits red light, an organic EL element 250b that emits green light, and an organic EL element 250c that emits blue light are arranged in a matrix as a unit, and a partition (bank) 251 Thus, the light emitting region of each organic EL element is defined. Each organic EL element includes a lower electrode (anode) 252, a hole transport layer 253, a light emitting layer 254, and an upper electrode (cathode) 255. In addition, a plurality of TFTs 256 (a-Si, p-Si, oxide semiconductor) for driving the organic EL elements are provided on the lower substrate 2a.

(Method for manufacturing organic EL display)
The organic EL display 20 according to Embodiment 2 is a so-called flexible display whose display portion can be flexibly deformed (has flexibility). The manufacturing process of the organic EL display 20 includes an organic EL substrate manufacturing process, a sealing substrate manufacturing process, an assembling process for bonding both substrates, and a peeling process for peeling the glass substrates 21 and 29.
A well-known manufacturing process can be applied to the organic EL substrate manufacturing process, the sealing substrate manufacturing process, and the assembly process. One example is given below, but the present invention is not limited to this. Further, the peeling process is the same as the peeling process of the liquid crystal display 10 shown in the first embodiment.

、すなわち、光吸収基を持つシリコンカプラー（自社でベンゾフェノンテトラカルボン酸無水物とアミノプロピルトリエトキシシランを反応させて合成）に１重量％溶解し、引き続き、水２重量％を添加した溶液を一晩室温にて撹拌した後、マザーガラス上にスピンコート法にて塗布し、１３０℃のオーブンに２０分投入することで、ガラス基板上に光熱交換膜を得た。 First, the photothermal exchange film 22 is produced on the glass substrate 21 (mother glass). Specifically, the following compound (2):

That is, 1% by weight is dissolved in a silicon coupler having a light absorbing group (synthesized by reacting benzophenonetetracarboxylic anhydride and aminopropyltriethoxysilane in-house), and then a solution containing 2% by weight of water is added. After stirring at room temperature overnight, it was coated on a mother glass by a spin coating method and placed in an oven at 130 ° C. for 20 minutes to obtain a photothermal exchange film on a glass substrate.

Next, a transparent resin material (here, a polyamic acid which is a polyimide (PI) precursor is taken as an example) is applied on the glass substrate 21 on which the photothermal exchange film 22 is formed by a spin coating method or a bar coating method, After baking, it is put into an oven at 350 ° C. to dehydrate and cyclize the polyamic acid to obtain a polyimide film that is insoluble in an organic solvent and has high heat resistance. Thereby, the PI layer 23 having a film thickness of 3 μm to 20 μm is formed.
Next, a base coat 24 such as SiN is formed by a CVD (Chemical Vapor Deposition) method or a sputtering method. At this time, multiple layers of SiO ₂ and SiN may be alternately formed. As a result, a barrier film against moisture and organic components is formed.
Next, a plurality of TFTs 256 for driving each organic EL element are formed at a predetermined interval on the lower substrate 2a including the glass substrate 21, the photothermal exchange film 22, the transparent resin layer 23, and the base coat 24. Thereafter, a photosensitive acrylic resin is applied to the entire surface of the lower substrate 2a by spin coating, and exposure and development are performed by photolithography to form an interlayer insulating film 258 having a plurality of contact holes 257. Through this contact hole 257, a part of each TFT 256 is exposed.

Next, an ITO film is formed on the entire surface of the lower substrate 2a on which the interlayer insulating film 258 is formed by a sputtering method, exposed and developed by a photolithography method, patterned by an etching method, and paired with each TFT 256. The lower electrode 259 is formed so as to form In each contact hole 257, the lower electrode 252 penetrating the interlayer insulating film 258 and the TFT 256 are electrically connected.
Next, after the partition 251 is formed, the hole transport layer 253 and the light emitting layer 254 are formed in each space partitioned by the partition 251. Further, the upper electrode 255 is formed so as to cover the light emitting layer 254 and the partition 251. An organic EL substrate is produced by the above process.

  Next, an ultraviolet curable resin or a thermosetting resin is applied to the periphery of the sealing substrate 2b in which the glass substrate 29, the photothermal exchange film layer 28, the transparent resin layer 27, and the base coat 26 are formed in this order, and an inert gas is applied. The organic EL element is sealed by adhering the sealing substrate 2b and the organic EL substrate in an atmosphere. Thereby, the hollow part 261 is formed between each organic EL element and the sealing substrate 2b. (A) of FIG. 2 has shown the mode at the time of an assembly process being complete | finished.

Thereafter, the glass substrate 21 (mother glass) is peeled off by irradiating light from the lower substrate 2a side with the third Takamachi wave (355 nm) of the Nd: YAG laser, and light is irradiated from the sealing substrate 2b side. The substrate 29 (mother glass) is peeled off. Then, the supports 6 and 7 are formed on the PI layers 23 and 27 after peeling. Since this peeling process is the same as the peeling process shown in Embodiment Mode 1, description thereof is omitted. Thereby, the flexible organic EL display 20 is completed.
Note that the organic EL display 20 according to Embodiment 2 may have a function of performing 2D display, 3D display, dual view display, bail view display, and triple view display. That is, the peeling method according to Embodiment 2 can be applied to various organic EL display manufacturing methods.

  The peeling method of this invention can be utilized suitably for the manufacturing method of various displays.

DESCRIPTION OF SYMBOLS 4 Support body 5 Support body 6 Support body 7 Support body 10 Liquid crystal display 11 Glass substrate 12 Photothermal exchange film 13 Transparent resin layer 14 Basecoat 15 Liquid crystal structure part 16 Basecoat 17 Transparent resin layer 18 Photothermal exchange film 19 Glass substrate 20 Organic EL display 21 Glass substrate 22 Photothermal exchange film 23 Transparent resin layer 24 Base coat 25 Organic EL structure 26 Base coat 27 Transparent resin layer 28 Photothermal exchange film 29 Glass substrate 2a Lower substrate 2b Sealing substrate 250a Organic EL element 250b emitting red light Organic EL element that emits light 250c Organic EL element that emits blue light 251 Partition (bank)
252 Lower electrode (anode)
253 Hole transport layer 254 Light emitting layer 255 Upper electrode (cathode)
256 TFT (a-Si, p-Si, oxide semiconductor)
257 Contact hole 258 Interlayer insulating film 259 Lower electrode 261 Hollow part

Claims (12)

  In a multilayer body in which a substrate, a photothermal exchange film, and a layer to be peeled are formed in this order, a peeling method for peeling the substrate and the layer to be peeled using light irradiated from a light source, the photothermal exchange The film is made from a molecular group having light absorption at a wavelength irradiated from a light source and a compound having a silanol group and / or an alkoxysilane group, and the light emitted from the light source passes through the substrate and is The said peeling method characterized by peeling a said board | substrate and this to-be-peeled layer by irradiating a photothermal exchange film.   The molecular group having light absorption at the wavelength irradiated from the light source and the molecular group having light absorption at the wavelength irradiated from the light source of the compound having silanol group and / or alkoxysilane group are organic groups. The peeling method as described in.   The molecular group having light absorption at the wavelength irradiated from the light source and the compound having silanol group and / or alkoxysilane group, the molecular group having light absorption at the wavelength irradiated from the light source contains an aromatic hydrocarbon group, The peeling method according to claim 1 or 2. A compound having a molecular group having light absorption at a wavelength irradiated from the light source and a silanol group and / or an alkoxysilane group is represented by the following general formula (1):

{In the formula, R ₁ is a hydrogen atom or a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms; R ₂ is a hydrogen atom or a monovalent organic group having 1 to 6 carbon atoms; ₃ is a single bond or a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms, and R ₄ is an aromatic group having 6 to 60 carbon atoms having a molecular group that absorbs light at a wavelength irradiated from a light source. A hydrocarbon group, and n is an integer of 1 to 3. } The peeling method of any one of Claims 1-3 which is a compound represented by these. In the general formula (1), R ₄ represents the following compound group:

The peeling method according to claim 4, wherein the structure contains one or more molecular groups selected from:   A solution in which a compound having a molecular group having light absorption at a wavelength irradiated from the light source and a compound having a silanol group and / or an alkoxysilane group is dissolved in an organic solvent at a concentration in the range of 0.1 wt% to 80 wt% is formed on the substrate. The peeling method of any one of Claims 1-5 which produces the said photothermal exchange film by drying a solvent after spraying or apply | coating.   The peeling method according to claim 1, wherein the light source is laser light.   The peeling method according to claim 1, wherein the light source is a flash lamp.   The peeling method according to claim 1, wherein the substrate is a glass substrate.   The peeling method of any one of Claims 1-9 in which the said to-be-separated layer contains the TFT element formed on the polyimide resin.   The manufacturing method of the liquid crystal display which has flexibility which includes the peeling method of any one of Claims 1-10 in a part of process.   The manufacturing method of the organic EL display which has flexibility which includes the peeling method of any one of Claims 1-10 in a part of process.

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