JP2015046391A - Light-emitting device, and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device with little display failure and high reliability, and to provide a light-emitting device in which cracks are less likely to be generated even when held at a high temperature and a high humidity.SOLUTION: A light-emitting device comprises: a first flexible substrate; a transistor provided on the first flexible substrate; an organic insulating layer provided on the transistor; a light-emitting element electrically connected with the transistor and provided on the organic insulating layer; a second flexible substrate provided on the light-emitting element; and a coloring layer overlapped with the light-emitting element and provided between the light-emitting element and the second flexible substrate. The organic insulating layer and the coloring layer contain the same main component.

Description

The present invention relates to an object, a method, and a manufacturing method. The present invention also relates to a process, a machine, a manufacture, and a composition (composition of matter). In particular, one embodiment of the present invention relates to a semiconductor device, a light-emitting device, a display device, an electronic device, and a manufacturing method thereof. In particular, the present invention relates to a light-emitting device, a display device, an electronic device, and methods for manufacturing the light-emitting device using an electroluminescence (hereinafter also referred to as EL) phenomenon.

In recent years, light emitting devices and display devices are expected to be applied to various uses, and diversification is required.

For example, light-emitting devices and display devices for portable device applications are required to be thin, lightweight, or difficult to break.

Light-emitting elements that use the EL phenomenon (also referred to as EL elements) have features such as being easy to reduce the thickness and weight, being able to respond to input signals at high speed, and being able to be driven using a DC low-voltage power supply. However, application to light emitting devices and display devices is being studied.

For example, Patent Document 1 discloses a flexible active matrix light-emitting device including a transistor as a switching element and an organic EL element on a film substrate.

JP 2003-174153 A

When a flexible light-emitting device is held in a high-temperature environment or a high-humidity environment, display defects such as non-light emission in some areas may occur.

An object of one embodiment of the present invention is to provide a novel light-emitting device, display device, or electronic device. Another object of one embodiment of the present invention is to provide a light-emitting device, a display device, or an electronic device that is lightweight. Another object of one embodiment of the present invention is to provide a light-emitting device, a display device, or an electronic device with high reliability. Another object of one embodiment of the present invention is to provide a light-emitting device, a display device, or an electronic device which is not easily damaged. Another object of one embodiment of the present invention is to provide a light-emitting device, a display device, or an electronic device with a small thickness. Another object of one embodiment of the present invention is to provide a light-emitting device, a display device, or an electronic device with high light extraction efficiency. Another object of one embodiment of the present invention is to provide a light-emitting device, a display device, or an electronic device with high luminance. Another object of one embodiment of the present invention is to provide a light-emitting device, a display device, or an electronic device with low power consumption.

Another object of one embodiment of the present invention is to provide a light-emitting device, a display device, or an electronic device in which display defects are unlikely to occur even when kept in a high-temperature and high-humidity environment.

Note that one embodiment of the present invention does not have to solve all of these problems.

One embodiment of the present invention includes a first flexible substrate, a transistor over the first flexible substrate, an organic insulating layer over the transistor, and light emission over the organic insulating layer that is electrically connected to the transistor. An element, a second flexible substrate over the light-emitting element, and a colored layer between the light-emitting element and the second flexible substrate, the colored layer overlapping the light-emitting element, the organic insulating layer, and the colored layer The layer is a light emitting device including the same main component.

Alternatively, according to one embodiment of the present invention, the first flexible substrate, the transistor over the first flexible substrate, the organic insulating layer over the transistor, and the organic insulating layer electrically connected to the transistor are provided. A light emitting element, a second flexible substrate over the light emitting element, a colored layer and a light shielding layer between the light emitting element and the second flexible substrate, the colored layer overlapping the light emitting element, The organic insulating layer, the colored layer, and the light shielding layer are light emitting devices including the same main component.

In the light-emitting device having the above structure, the light-emitting element includes an insulating layer that overlaps with the light-shielding layer, and the light-emitting element includes a layer containing a light-emitting organic compound between the upper electrode and the lower electrode. It is preferable to cover the end of the.

Alternatively, according to one embodiment of the present invention, the first flexible substrate, the first adhesive layer over the first flexible substrate, the first insulating layer over the first adhesive layer, and the first A transistor on the insulating layer, an organic insulating layer on the transistor, a lower electrode on the organic insulating layer electrically connected to the transistor, a second insulating layer covering an end of the lower electrode, a lower electrode, and A layer containing a light-emitting organic compound on the second insulating layer, a top electrode on the layer containing the light-emitting organic compound, a second adhesive layer on the upper electrode, and a color on the second adhesive layer A colored layer, a third insulating layer on the colored layer, a third adhesive layer on the third insulating layer, and a second flexible substrate on the third adhesive layer. Is a light-emitting device that overlaps with the lower electrode, and the organic insulating layer and the colored layer contain the same main component. Further, a light-blocking layer that overlaps with the second insulating layer is provided between the second adhesive layer and the third insulating layer, and the organic insulating layer, the colored layer, and the light-blocking layer include the same main component. preferable.

In the light emitting devices having the above-described configurations, the same main component is preferably an acrylic resin.

An electronic device using the light-emitting device having any of the above structures is also one embodiment of the present invention.

Note that a light-emitting device in this specification includes a display device using a light-emitting element. Further, a connector, for example, an anisotropic conductive film or a TCP (Tape Carrier Package) is attached to the light emitting element, a module in which a printed wiring board is provided at the end of the TCP, or a COG (Chip On Glass) to the light emitting element. It is assumed that the light emitting device also includes all modules on which IC (integrated circuit) is directly mounted by the method. Furthermore, a light emitting device used for a lighting fixture or the like is also included.

In one embodiment of the present invention, a novel light-emitting device, display device, or electronic device can be provided. Alternatively, in one embodiment of the present invention, a light-emitting device, a display device, or an electronic device can be provided. Alternatively, according to one embodiment of the present invention, a highly reliable light-emitting device, display device, or electronic device can be provided. Alternatively, in one embodiment of the present invention, a light-emitting device, a display device, or an electronic device that is not easily damaged can be provided. Alternatively, in one embodiment of the present invention, a light-emitting device, a display device, or an electronic device with a small thickness can be provided. Alternatively, in one embodiment of the present invention, a light-emitting device, a display device, or an electronic device with high light extraction efficiency can be provided. Alternatively, in one embodiment of the present invention, a light-emitting device, a display device, or an electronic device with high luminance can be provided. Alternatively, in one embodiment of the present invention, a light-emitting device, a display device, or an electronic device with low power consumption can be provided.

Alternatively, according to one embodiment of the present invention, a light-emitting device, a display device, or an electronic device in which display defects are unlikely to occur even when kept in a high-temperature and high-humidity environment can be provided.

FIG. 6 illustrates an example of a light-emitting device. FIG. 6 illustrates an example of a light-emitting device. FIG. 6 illustrates an example of a light-emitting device. 4A and 4B illustrate an example of a method for manufacturing a light-emitting device. 4A and 4B illustrate an example of a method for manufacturing a light-emitting device. FIG. 14 illustrates an example of an electronic device. FIG. 14 illustrates an example of an electronic device. FIG. 14 illustrates an example of an electronic device. FIG. 14 illustrates an example of an electronic device. FIG. 14 illustrates an example of an electronic device. The photograph which shows the light-emitting device of an Example. FIG. 6 illustrates an example of a light-emitting device.

Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below.

Note that in structures of the invention described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings, and description thereof is not repeated. In addition, in the case where the same function is indicated, the hatch pattern is the same, and there is a case where no reference numeral is given.

In addition, the position, size, range, and the like of each component illustrated in the drawings and the like may not represent the actual position, size, range, or the like for easy understanding. Therefore, the disclosed invention is not necessarily limited to the position, size, range, or the like disclosed in the drawings and the like.

(Embodiment 1)
In this embodiment, a light-emitting device of one embodiment of the present invention will be described with reference to FIGS.

A light-emitting device of one embodiment of the present invention includes a first flexible substrate, a transistor over the first flexible substrate, an organic insulating layer over the transistor, and an organic insulating layer electrically connected to the transistor The light-emitting element and the second flexible substrate over the light-emitting element, and the colored layer between the light-emitting element and the second flexible substrate, which overlaps with the light-emitting element. The organic insulating layer and the colored layer contain the same material as the main component.

The light-emitting device of one embodiment of the present invention includes an organic insulating layer on the first flexible substrate side and a coloring layer on the second flexible substrate side with respect to the light-emitting element. At this time, if the main components constituting the organic insulating layer and the colored layer are different, the light-emitting device is bent, or the light-emitting device is held in a high-temperature environment or a high-humidity environment, so that the layer constituting the light-emitting device is broken Display cracks (also referred to as cracks) are likely to cause display defects. Therefore, in the light-emitting device of one embodiment of the present invention, the organic insulating layer and the colored layer include the same main component. As a result, the difference in the degree of swelling and the difference in thermal expansion coefficient between the organic insulating layer and the colored layer are reduced. By folding the light emitting device or holding it in a high temperature and high humidity environment, the light emitting device (especially in the light emitting region) The occurrence of cracks can be suppressed. Therefore, a highly reliable light-emitting device with few display defects can be realized.

In addition, the light-emitting device of one embodiment of the present invention includes an organic insulating layer on the first flexible substrate side and a coloring layer and a light-blocking layer on the second flexible substrate side with respect to the light-emitting element. . The colored layer and the light shielding layer may be located on the same plane. At this time, it is preferable that the organic insulating layer, the colored layer, and the light shielding layer contain the same main component. As a result, the difference in the degree of swelling and the difference in coefficient of thermal expansion between the organic insulating layer, the colored layer, and the light-shielding layer are reduced, and cracks are generated in the light-emitting device by bending the light-emitting device or holding it in a high-temperature and high-humidity environment. Occurrence can be suppressed. Therefore, a highly reliable light-emitting device with few display defects can be realized.

For example, it is preferable to use an acrylic resin as the main component of the organic insulating layer, the main component of the colored layer, and the main component of the light shielding layer.

In addition, examples of materials that the organic insulating layer, the colored layer, and the light shielding layer include as main components include organic materials such as polyimide resin, polyamide resin, siloxane resin, epoxy resin, phenol resin, and benzocyclobutene resin.

Note that the main component in the organic insulating layer, the colored layer, or the light-shielding layer refers to a main material constituting the layer, and preferably refers to a material that is contained most in the layer. For example, the organic resin most contained in the layer is one of the main components of the layer. Alternatively, among materials excluding pigments and dyes, the material most contained in the layer is one of the main components of the layer.

<Specific example 1>
FIG. 1A is a plan view of a light-emitting device of one embodiment of the present invention, and FIG. 1B illustrates an example of a cross-sectional view taken along the dashed-dotted line A1-A2 in FIG.

A light-emitting device illustrated in FIG. 1B includes a flexible substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer 157, an insulating layer 207, an organic insulating layer 209, a plurality of light-emitting elements, and an insulating layer 211. , An adhesive layer 213, an overcoat 261, a colored layer 259, a light shielding layer 257, an insulating layer 255, an adhesive layer 105, and a flexible substrate 103.

The conductive layer 157 is electrically connected to the FPC 108 through the connection body 215. Note that FIG. 1B illustrates an example in which the FPC 108 overlaps the flexible substrate 103; however, the present invention is not limited to this. For example, as illustrated in FIG. 12A, in the case where a flexible substrate 103 having a smaller area than the flexible substrate 201 is used, the FPC 108 is placed in a region where the flexible substrate 201 and the flexible substrate 103 do not overlap with each other. They may be provided (that is, the flexible substrate 103 and the connection body 215 do not need to overlap).

The light emitting element 230 includes a lower electrode 231, an EL layer 233, and an upper electrode 235. The lower electrode 231 is electrically connected to the source electrode or the drain electrode of the transistor 240. An end portion of the lower electrode 231 is covered with an insulating layer 211. The light emitting element 230 has a top emission structure. The upper electrode 235 has a light-transmitting property and transmits light emitted from the EL layer 233.

A colored layer 259 is provided at a position overlapping with the light emitting element 230, and a light shielding layer 257 is provided at a position overlapping with the insulating layer 211. The colored layer 259 and the light shielding layer 257 are covered with an overcoat 261. A space between the light emitting element 230 and the overcoat 261 is filled with an adhesive layer 213.

The light-emitting device includes a plurality of transistors such as the transistor 240 in the light extraction unit 104 and the drive circuit unit 106. The transistor 240 is provided over the insulating layer 205. The insulating layer 205 and the flexible substrate 201 are attached to each other with an adhesive layer 203. The insulating layer 255 and the flexible substrate 103 are attached to each other with the adhesive layer 105. It is preferable to use a film with low water permeability for the insulating layer 205 and the insulating layer 255 because impurities such as water can be prevented from entering the light-emitting element 230 and the transistor 240 and reliability of the light-emitting device can be increased.

In Specific Example 1, the insulating layer 205, the transistor 240, and the light-emitting element 230 are manufactured over a manufacturing substrate with high heat resistance, the manufacturing substrate is peeled off, and the insulating layer 205 is formed over the flexible substrate 201 with the use of the adhesive layer 203. In addition, a light-emitting device that can be manufactured by transposing the transistor 240 and the light-emitting element 230 is illustrated. In Specific Example 1, the insulating layer 255, the colored layer 259, and the light-shielding layer 257 are formed over a manufacturing substrate with high heat resistance, the manufacturing substrate is peeled off, and the adhesive layer 105 is used to form the insulating substrate 255 on the flexible substrate 103. A light-emitting device that can be manufactured by transferring an insulating layer 255, a colored layer 259, and a light-blocking layer 257 is shown.

In the case where a material with low heat resistance (such as a resin) is used for the substrate, it is difficult to apply a high temperature to the substrate in the manufacturing process, and thus there are limitations on conditions for forming a transistor or an insulating film over the substrate. In the case where a material with high water permeability (such as a resin) is used for the substrate of the light-emitting device, it is preferable to form a film with low water permeability by applying high temperature between the substrate and the light-emitting element. In the manufacturing method of this embodiment, a transistor or the like can be manufactured over a manufacturing substrate with high heat resistance, so that a highly reliable transistor or an insulating film with sufficiently low water permeability can be formed at high temperatures. . Then, by transferring them to a substrate with low heat resistance, a highly reliable light-emitting device can be manufactured. Accordingly, in one embodiment of the present invention, a light-emitting device that is lightweight or thin and has high reliability can be realized. Details of the manufacturing method will be described later.

For the flexible substrate 103 and the flexible substrate 201, it is preferable to use materials having high toughness. Thereby, it is possible to realize a light emitting device that is excellent in impact resistance and is not easily damaged. For example, when the flexible substrate 103 is an organic resin substrate and the flexible substrate 201 is a substrate using a thin metal material or alloy material, the weight can be reduced as compared with a case where a glass substrate is used as the substrate. And a light-emitting device that is not easily damaged can be realized.

Metal materials and alloy materials are preferable because they have high thermal conductivity and can easily conduct heat to the entire substrate, which can suppress a local temperature increase of the light-emitting device. The thickness of the substrate using a metal material or an alloy material is preferably 10 μm to 200 μm, and more preferably 20 μm to 50 μm.

In addition, when a material having a high thermal emissivity is used for the flexible substrate 201, an increase in the surface temperature of the light-emitting device can be suppressed, and the light-emitting device can be prevented from being broken or reduced in reliability. For example, the flexible substrate 201 may have a stacked structure of a metal substrate and a layer with high thermal emissivity (for example, a metal oxide or a ceramic material can be used).

In the specific example 1, the colored layer 259, the light shielding layer 257, and the organic insulating layer 209 include the same main component. Accordingly, the difference in the degree of swelling and the difference in the coefficient of thermal expansion are reduced in the organic insulating layer 209, the colored layer 259, and the light shielding layer 257, and the light emitting device is bent or held in a high temperature and high humidity environment. It is possible to suppress cracks from occurring. Therefore, a highly reliable light-emitting device with few display defects can be realized.

Further, in the case where the insulating layer 211 is formed using an organic material, the insulating layer 211 preferably includes the same main components as the colored layer 259, the light-blocking layer 257, and the organic insulating layer 209. In particular, when the thickness of the insulating layer 211 is greater than or equal to the thickness of the organic insulating layer 209, the insulating layer 211 and the organic insulating layer 209 preferably include the same main component. Thereby, it can further suppress that a crack generate | occur | produces in a light-emitting device by bending of a light-emitting device or holding | maintenance in a high-temperature, high-humidity environment. Note that a structure in which the organic insulating layer 209 and the coloring layer 259 include the same main component and the insulating layer 211 does not include the same main component is also an embodiment of the present invention.

<Specific example 2>
FIG. 2A illustrates another example of the light extraction portion 104 in the light-emitting device. The light-emitting device in FIG. 2A is a light-emitting device capable of touch operation. In each of the following specific examples, the description of the same configuration as in specific example 1 is omitted.

2A includes a flexible substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 207, an organic insulating layer 209, a plurality of light-emitting elements, an insulating layer 211, and an insulating layer 217. , Adhesive layer 213, overcoat 261, colored layer 259, light shielding layer 257, multiple light receiving elements, conductive layer 281, conductive layer 283, insulating layer 291, insulating layer 293, insulating layer 295, insulating layer 255, adhesive layer 105, And a flexible substrate 103.

In Specific Example 2, the insulating layer 217 is provided over the insulating layer 211. By providing the insulating layer 217, the distance between the flexible substrate 103 and the flexible substrate 201 can be adjusted.

In the case where the insulating layer 217 is formed using an organic material, the insulating layer 217 preferably includes the same main components as the colored layer 259, the light-blocking layer 257, and the organic insulating layer 209. In particular, when the thickness of the insulating layer 217 is greater than or equal to the thickness of the organic insulating layer 209, the insulating layer 217 and the organic insulating layer 209 preferably include the same main component. Thereby, it can further suppress that a crack generate | occur | produces in a light-emitting device by bending of a light-emitting device or holding | maintenance in a high-temperature, high-humidity environment. Note that a structure in which the organic insulating layer 209 and the coloring layer 259 include the same main component and the insulating layer 217 does not include the same main component is also an embodiment of the present invention.

FIG. 2A illustrates an example in which a light-receiving element is provided between the insulating layer 255 and the adhesive layer 213. Since a light receiving element can be placed over a non-light emitting region of a light emitting device (for example, a region where a light emitting element is not provided, such as a region where a transistor or a wiring is provided), an aperture ratio of a pixel (light emitting element) is reduced. A touch sensor can be provided in the light emitting device without being lowered.

As the light receiving element included in the light emitting device, for example, a pn type or pin type photodiode can be used. In this embodiment, a pin photodiode including a p-type semiconductor layer 271, an i-type semiconductor layer 273, and an n-type semiconductor layer 275 is used as a light receiving element.

Note that in the i-type semiconductor layer 273, the impurity imparting p-type and the impurity imparting n-type contained are each at a concentration of 1 × 10 ²⁰ cm ⁻³ or less, and the photoconductivity is 100 with respect to the dark conductivity. It is more than double. The i-type semiconductor layer 273 includes those having an impurity element belonging to Group 13 or Group 15 of the periodic table. That is, since an i-type semiconductor exhibits weak n-type conductivity when an impurity element for the purpose of controlling valence electrons is not intentionally added, the i-type semiconductor layer 273 has an impurity element imparting p-type conductivity. In the category includes those intentionally or unintentionally added during or after film formation.

The light shielding layer 257 is located closer to the flexible substrate 201 than the light receiving element, and overlaps the light receiving element. The light shielding layer 257 positioned between the light receiving element and the adhesive layer 213 can suppress the light emitted from the light emitting element 230 from being applied to the light receiving element.

The conductive layer 281 and the conductive layer 283 are electrically connected to the light receiving element, respectively. As the conductive layer 281, a conductive layer that transmits light incident on the light receiving element is preferably used. As the conductive layer 283, a conductive layer that blocks light incident on the light receiving element is preferably used.

It is preferable that the optical touch sensor be provided between the flexible substrate 103 and the adhesive layer 213 because the optical touch sensor is hardly affected by light emission of the light-emitting element 230 and can improve the S / N ratio.

In the specific example 2, the colored layer 259, the light shielding layer 257, and the organic insulating layer 209 include the same main component. Accordingly, the difference in the degree of swelling and the difference in the coefficient of thermal expansion are reduced in the organic insulating layer 209, the colored layer 259, and the light shielding layer 257, and the light emitting device is bent or held in a high temperature and high humidity environment. It is possible to suppress cracks from occurring. Therefore, a highly reliable light-emitting device with few display defects can be realized.

In Example 2, when an organic insulating layer is used as the insulating layer 291, the insulating layer 293, or the insulating layer 295, the insulating layer 291, the insulating layer 293, or the insulating layer 295 includes the colored layer 259, the light-blocking layer 257, and the organic insulating layer. It is preferable that the same main component as the layer 209 is included. Thereby, in the organic insulating layer which comprises a light-emitting device, the difference in a swelling degree and the difference in a thermal expansion coefficient can be made small.

<Specific example 3>
FIG. 2B illustrates another example of the light extraction portion 104 in the light-emitting device. The light-emitting device in FIG. 2B is a light-emitting device capable of touch operation.

2B includes a flexible substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 207, an organic insulating layer 209a, an organic insulating layer 209b, a plurality of light-emitting elements, and an insulating layer. 211, an insulating layer 217, an adhesive layer 213, a colored layer 259, a light shielding layer 257, a plurality of light receiving elements, a conductive layer 280, a conductive layer 281, an insulating layer 255, an adhesive layer 105, and the flexible substrate 103.

FIG. 2B illustrates an example in which a light receiving element is provided between the insulating layer 205 and the adhesive layer 213. By providing the light receiving element between the insulating layer 205 and the adhesive layer 213, the conductive layer and the light receiving element which are electrically connected to the light receiving element in the same material and in the same process as the conductive layer and the semiconductor layer included in the transistor 240. Can be produced. Therefore, a light-emitting device capable of a touch operation can be manufactured without greatly increasing manufacturing steps.

In the specific example 3, the colored layer 259, the light shielding layer 257, the organic insulating layer 209a, and the organic insulating layer 209b include the same main component. Accordingly, the difference in swelling degree and the difference in thermal expansion coefficient between the organic insulating layer 209a, the organic insulating layer 209b, the colored layer 259, and the light shielding layer 257 are reduced, and the light-emitting device is bent and held in a high-temperature and high-humidity environment. Therefore, it is possible to suppress the occurrence of cracks in the light emitting device. Therefore, a highly reliable light-emitting device with few display defects can be realized.

<Specific Example 4>
FIG. 3A illustrates another example of a light-emitting device. The light-emitting device in FIG. 3A is a light-emitting device capable of touch operation.

A light-emitting device illustrated in FIG. 3A includes a flexible substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer 156, a conductive layer 157, an insulating layer 207, an organic insulating layer 209, and a plurality of light-emitting elements. , Insulating layer 211, insulating layer 217, adhesive layer 213, colored layer 259, light shielding layer 257, insulating layer 255, conductive layer 272, conductive layer 274, insulating layer 276, insulating layer 278, conductive layer 294, conductive layer 296, adhesive A layer 105 and a flexible substrate 103 are included.

FIG. 3A illustrates an example in which a capacitive touch sensor is provided between the insulating layer 255 and the adhesive layer 213. The capacitive touch sensor includes a conductive layer 272 and a conductive layer 274.

The conductive layer 156 and the conductive layer 157 are electrically connected to the FPC 108 through the connection body 215. The conductive layer 294 and the conductive layer 296 are electrically connected to the conductive layer 274 through the conductive particles 292. Therefore, the capacitive touch sensor can be driven via the FPC 108.

In the specific example 4, the colored layer 259, the light shielding layer 257, and the organic insulating layer 209 include the same main component. Accordingly, the difference in the degree of swelling and the difference in the coefficient of thermal expansion are reduced in the organic insulating layer 209, the colored layer 259, and the light shielding layer 257, and the light emitting device is bent or held in a high temperature and high humidity environment. It is possible to suppress cracks from occurring. Therefore, a highly reliable light-emitting device with few display defects can be realized.

In Example 4, when an organic insulating layer is used as the insulating layer 276 or the insulating layer 278, the insulating layer 276 or the insulating layer 278 has the same main components as the colored layer 259, the light-shielding layer 257, and the organic insulating layer 209. It is preferable to include. Thereby, in the organic insulating layer which comprises a light-emitting device, the difference in a swelling degree and the difference in a thermal expansion coefficient can be made small.

<Specific Example 5>
FIG. 3B illustrates another example of a light-emitting device. The light-emitting device in FIG. 3B is a light-emitting device capable of touch operation.

3B includes a flexible substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer 156, a conductive layer 157, an insulating layer 207, an organic insulating layer 209, and a plurality of light-emitting elements. , Insulating layer 211, insulating layer 217, adhesive layer 213, colored layer 259, light shielding layer 257, insulating layer 255, conductive layer 270, conductive layer 272, conductive layer 274, insulating layer 276, insulating layer 278, adhesive layer 105, and A flexible substrate 103 is included.

FIG. 3B illustrates an example in which a capacitive touch sensor is provided between the insulating layer 255 and the adhesive layer 213. The capacitive touch sensor includes a conductive layer 272 and a conductive layer 274. Note that the touch sensor may be provided over the flexible substrate 103 as illustrated in FIG. Note that as in the structure illustrated in FIG. 3B, the insulating layer 255 and the adhesive layer 105 may be provided between the flexible substrate 103 and the conductive layer 272.

The conductive layer 156 and the conductive layer 157 are electrically connected to the FPC 108a through the connection body 215a. The conductive layer 270 is electrically connected to the FPC 108b through the connection body 215b. Therefore, the light emitting element 230 and the transistor 240 can be driven through the FPC 108a, and the capacitive touch sensor can be driven through the FPC 108b.

Preferred configurations of the insulating layer 276, the insulating layer 278, the coloring layer 259, the light-shielding layer 257, and the organic insulating layer 209 are the same as those in the specific example 4.

<Example of material>
Next, materials that can be used for the light-emitting device will be described. In addition, description is abbreviate | omitted about the structure demonstrated previously in this Embodiment.

[Transistor]
There is no particular limitation on the structure of the transistor included in the light-emitting device. For example, a staggered transistor or an inverted staggered transistor may be used. Further, a top-gate or bottom-gate transistor structure may be employed. The semiconductor material used for the transistor is not particularly limited, and examples thereof include silicon and germanium. Alternatively, an oxide semiconductor containing at least one of indium, gallium, and zinc, such as an In—Ga—Zn-based metal oxide, may be used.

There is no particular limitation on the crystallinity of a semiconductor material used for the transistor, and any of an amorphous semiconductor and a semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor partially including a crystal region) is used. May be used. It is preferable to use a crystalline semiconductor because deterioration of transistor characteristics can be suppressed.

[Light emitting element]
As the light-emitting element, an element capable of self-emission can be used, and an element whose luminance is controlled by current or voltage is included in its category. For example, a light emitting diode (LED), an organic EL element, an inorganic EL element, or the like can be used.

The light-emitting element included in the light-emitting device of this embodiment includes a pair of electrodes (a lower electrode 231 and an upper electrode 235) and an EL layer 233 provided between the pair of electrodes. One of the pair of electrodes functions as an anode, and the other functions as a cathode.

The light emitting element included in the light emitting device of this embodiment has a top emission structure. A conductive film that transmits visible light is used for the upper electrode 235 that is an electrode on the light extraction side. In addition, a conductive film that reflects visible light is preferably used for the lower electrode 231 that is an electrode on the side from which light is not extracted. Note that a light-emitting element having a dual emission structure may be used.

The conductive film that transmits visible light can be formed using, for example, indium oxide, indium tin oxide (ITO), indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or the like. In addition, a metal material such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, an alloy including these metal materials, or a nitride of these metal materials (for example, Titanium nitride) can also be used by forming it thin enough to have translucency. In addition, a stacked film of the above materials can be used as the conductive film. For example, it is preferable to use a laminated film of silver and magnesium alloy and ITO because the conductivity can be increased. Further, graphene or the like may be used.

For the conductive film that reflects visible light, for example, a metal material such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or an alloy including these metal materials is used. Can do. In addition, lanthanum, neodymium, germanium, or the like may be added to the metal material or alloy. Also, alloys containing aluminum (aluminum alloys) such as aluminum and titanium alloys, aluminum and nickel alloys, aluminum and neodymium alloys, silver and copper alloys, silver and palladium and copper alloys, and silver and magnesium alloys It can form using the alloy containing silver, such as. An alloy containing silver and copper is preferable because of its high heat resistance. Furthermore, the oxidation of the aluminum alloy film can be suppressed by stacking the metal film or the metal oxide film in contact with the aluminum alloy film. Examples of the material for the metal film and metal oxide film include titanium and titanium oxide. Alternatively, the conductive film that transmits visible light and a film made of a metal material may be stacked. For example, a laminated film of silver and ITO, a laminated film of an alloy of silver and magnesium and ITO, or the like can be used.

The electrodes may be formed using a vapor deposition method or a sputtering method, respectively. In addition, it can be formed using a discharge method such as an inkjet method, a printing method such as a screen printing method, or a plating method.

When a voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 231 and the upper electrode 235, holes are injected into the EL layer 233 from the anode side and electrons are injected from the cathode side. The injected electrons and holes are recombined in the EL layer 233, and the light-emitting substance contained in the EL layer 233 emits light.

The EL layer 233 includes at least a light-emitting layer. The EL layer 233 is a layer other than the light-emitting layer and is a substance having a high hole-injecting property, a substance having a high hole-transporting property, a hole blocking material, a substance having a high electron-transporting property, a substance having a high electron-injecting property, or a bipolar property A layer containing a substance (a substance having a high electron transporting property and a high hole transporting property) or the like may be further included.

Either a low molecular compound or a high molecular compound can be used for the EL layer 233, and an inorganic compound may be included. The layers forming the EL layer 233 can be formed by a method such as a vapor deposition method (including a vacuum vapor deposition method), a transfer method, a printing method, an ink jet method, or a coating method.

The light-emitting element is preferably provided between a pair of insulating films with low water permeability. Thereby, impurities such as water can be prevented from entering the light emitting element, and a decrease in reliability of the light emitting device can be suppressed.

Examples of the low water-permeable insulating film include a film containing nitrogen and silicon such as a silicon nitride film and a silicon nitride oxide film, and a film containing nitrogen and aluminum such as an aluminum nitride film. Alternatively, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

For example, the water vapor transmission rate of an insulating film having low water permeability is 1 × 10 ⁻⁵ [g / m ² · day] or less, preferably 1 × 10 ⁻⁶ [g / m ² · day] or less, more preferably 1 × 10 ⁻⁷ [g / m ² · day] or less, more preferably 1 × 10 ⁻⁸ [g / m ² · day] or less.

[Flexible substrate]
A flexible material is used for the flexible substrate. For example, an organic resin or glass having a thickness enough to be flexible can be used. Further, a material that transmits visible light is used for a substrate from which light emission is extracted in the light-emitting device (the flexible substrate 103 in this embodiment). In the case where the flexible substrate does not need to transmit visible light (such as the flexible substrate 201 in this embodiment), a metal substrate or the like can also be used.

The flexible substrate 103 has a light-transmitting property and transmits at least light emitted from the light-emitting element. The flexible substrate 103 may have flexibility. Further, the refractive index of the flexible substrate 103 is higher than the refractive index of the atmosphere.

Since the specific gravity of an organic resin is smaller than that of glass, it is preferable to use an organic resin as the flexible substrate 103 because the light emitting device can be reduced in weight compared to the case of using glass.

Examples of the material having flexibility and transparency to visible light include, for example, glass having a thickness having flexibility, polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and polyacrylonitrile resin. , Polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyvinyl chloride resin and the like. In particular, it is preferable to use a material having a low coefficient of thermal expansion. For example, polyamideimide resin, polyimide resin, PET, or the like can be suitably used. Further, a substrate in which glass fiber is impregnated with an organic resin, or a substrate in which an inorganic filler is mixed with an organic resin to reduce the thermal expansion coefficient can be used.

In the case where a fibrous body is included in a material having flexibility and translucency, a high-strength fiber of an organic compound or an inorganic compound is used as the fibrous body. The high-strength fiber specifically refers to a fiber having a high tensile modulus or Young's modulus. Typical examples include a polyvinyl alcohol fiber, a polyester fiber, a polyamide fiber, a polyethylene fiber, an aramid fiber, Examples include polyparaphenylene benzobisoxazole fibers, glass fibers, and carbon fibers. Examples of the glass fiber include glass fibers using E glass, S glass, D glass, Q glass, and the like. These may be used in the state of a woven fabric or a non-woven fabric, and a structure obtained by impregnating the fiber body with a resin and curing the resin may be used as the flexible substrate. When a structure made of a fibrous body and a resin is used as the flexible substrate, it is preferable because reliability against breakage due to bending or local pressing is improved.

In order to improve the light extraction efficiency, it is preferable that the refractive index of the material having flexibility and translucency is high. For example, by dispersing an inorganic filler having a high refractive index in an organic resin, a substrate having a higher refractive index than a substrate made of only the organic resin can be realized. In particular, it is preferable to use a small inorganic filler having a particle diameter of 40 nm or less because optical transparency is not lost.

The thickness of the metal substrate is preferably 10 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less in order to obtain flexibility and bendability. Since the metal substrate has high thermal conductivity, heat generated by light emission of the light emitting element can be effectively radiated.

Although there is no limitation in particular as a material which comprises a metal substrate, For example, aluminum, copper, nickel, metal alloys, such as an aluminum alloy or stainless steel, etc. can be used suitably.

As a flexible substrate, a layer using the above material is a hard coat layer (for example, a silicon nitride layer) that protects the surface of the light-emitting device from scratches, or a layer (for example, aramid) that can disperse pressure. It may be configured to be laminated with a resin layer or the like. In addition, in order to suppress a decrease in lifetime of the light-emitting element due to moisture or the like, the above insulating film with low water permeability may be included.

The flexible substrate can be used by stacking a plurality of layers. In particular, when the glass layer is used, the barrier property against water and oxygen can be improved and a highly reliable light-emitting device can be obtained.

For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are stacked from the side close to the light-emitting element can be used. The thickness of the glass layer is 20 μm or more and 200 μm or less, preferably 25 μm or more and 100 μm or less. The glass layer having such a thickness can simultaneously realize a high barrier property and flexibility against water and oxygen. The thickness of the organic resin layer is 10 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By providing such an organic resin layer outside the glass layer, it is possible to suppress breakage and cracking of the glass layer and improve mechanical strength. By applying such a composite material of a glass material and an organic resin to a substrate, a highly reliable flexible light-emitting device can be obtained.

[Adhesive layer]
For the adhesive layer, various curable adhesives such as an ultraviolet curable photocurable adhesive, a reactive curable adhesive, a thermosetting adhesive, and an anaerobic adhesive can be used. Examples of these adhesives include epoxy resins, acrylic resins, silicone resins, phenol resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, EVA (ethylene vinyl acetate) resins, and the like. In particular, a material with low moisture permeability such as an epoxy resin is preferable. Alternatively, a two-component mixed resin may be used. Further, an adhesive sheet or the like may be used.

Further, the resin may contain a desiccant. For example, a substance that adsorbs moisture by chemical adsorption, such as an alkaline earth metal oxide (such as calcium oxide or barium oxide), can be used. Alternatively, a substance that adsorbs moisture by physical adsorption, such as zeolite or silica gel, may be used. It is preferable that a desiccant is contained because impurities such as moisture can be prevented from entering the light emitting element and the reliability of the light emitting device is improved.

The adhesive layer 105 and the adhesive layer 213 have a light-transmitting property and transmit at least light emitted from the light-emitting element.

In addition, it is preferable that light extraction efficiency from the light-emitting element can be improved by mixing a filler (such as titanium oxide) with a high refractive index in the resin. Therefore, the luminance can be increased when compared with the case of the same power consumption. Further, when compared with the same luminance, power consumption can be reduced.

Further, the adhesive layer 105 and the adhesive layer 213 may include a scattering member that scatters light. For example, for the adhesive layer 105 and the adhesive layer 213, a mixture of the resin and particles having a refractive index different from that of the resin can be used. The particles function as a light scattering member.

The resin and particles having a refractive index different from that of the resin preferably have a refractive index difference of 0.1 or more, and more preferably 0.3 or more. Specifically, epoxy resin, acrylic resin, imide resin, silicone, or the like can be used as the resin. As the particles, titanium oxide, barium oxide, zeolite, or the like can be used.

Titanium oxide and barium oxide particles are preferred because of their strong light scattering properties. In addition, when zeolite is used, water contained in a resin or the like can be adsorbed, and the reliability of the light-emitting element can be improved.

[Insulation layer]
An inorganic insulating material can be used for the insulating layer 205 and the insulating layer 255. In particular, the use of the insulating film with low water permeability is preferable because a highly reliable light-emitting device can be realized.

The insulating layer 207 has an effect of suppressing diffusion of impurities into a semiconductor included in the transistor. As the insulating layer 207, an inorganic insulating film such as a silicon oxide film, a silicon oxynitride film, a silicon nitride film, a silicon nitride oxide film, or an aluminum oxide film can be used.

The insulating layer 211 is provided so as to cover the end portion of the lower electrode 231. In order to improve the coverage of the EL layer 233 and the upper electrode 235 formed on the insulating layer 211, the sidewall of the insulating layer 211 is preferably an inclined surface formed with a continuous curvature.

As a material of the insulating layer 211, a resin or an inorganic insulating material can be used. As the resin, for example, polyimide resin, polyamide resin, acrylic resin, siloxane resin, epoxy resin, phenol resin, or the like can be used. In particular, since the insulating layer 211 can be easily manufactured, it is preferable to use a negative photosensitive resin or a positive photosensitive resin.

A method for forming the insulating layer 211 is not particularly limited, and a photolithography method, a sputtering method, a vapor deposition method, a droplet discharge method (inkjet method or the like), a printing method (screen printing, offset printing, or the like) may be used.

The insulating layer 217 can be formed using an inorganic insulating material, an organic insulating material, or the like. For example, as the organic insulating material, a negative or positive photosensitive resin, a non-photosensitive resin, or the like can be used. Further, a conductive layer may be formed instead of the insulating layer 217. For example, it can be formed using a metal material. As the metal material, titanium, aluminum, or the like can be used. By using a conductive layer instead of the insulating layer 217 and electrically connecting the conductive layer and the upper electrode 235, a potential drop due to the resistance of the upper electrode 235 can be suppressed. Further, the insulating layer 217 may have a forward tapered shape or a reverse tapered shape.

The insulating layer 276, the insulating layer 278, the insulating layer 291, the insulating layer 293, and the insulating layer 295 can be formed using an inorganic insulating material or an organic insulating material, respectively. In particular, the insulating layer 278 and the insulating layer 295 are preferably formed using an insulating layer having a planarization function in order to reduce surface unevenness due to the sensor element.

[Conductive layer]
The conductive layer 156, the conductive layer 157, the conductive layer 294, and the conductive layer 296 can be formed using the same material and through the same steps as the conductive layer included in the transistor or the light-emitting element, respectively. The conductive layer 280 can be formed using the same material and the same process as the conductive layer included in the transistor.

For example, the conductive layers are each formed using a single layer or stacked layers using a metal material such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, or scandium, or an alloy material containing these elements. can do. Each of the conductive layers may be formed using a conductive metal oxide. Examples of the conductive metal oxide include indium oxide (In ₂ O ₃ etc.), tin oxide (SnO ₂ etc.), zinc oxide (ZnO), ITO, indium zinc oxide (In ₂ O ₃ —ZnO etc.) or these A metal oxide material containing silicon oxide can be used.

The conductive layers 272 and 274, and the conductive layers 281 and 283 are light-transmitting conductive layers. For example, indium oxide, ITO, indium zinc oxide, zinc oxide, zinc oxide to which gallium is added, or the like can be used. The conductive layer 270 can be formed using the same material and the same process as the conductive layer 272.

As the conductive particles 292, particles obtained by coating the surface of particles such as an organic resin or silica with a metal material are used. It is preferable to use nickel or gold as the metal material because the contact resistance can be reduced. In addition, it is preferable to use particles in which two or more kinds of metal materials are coated in layers, such as further coating nickel with gold.

As the connection body 215, a paste-like or sheet-like material obtained by mixing metal particles with a thermosetting resin and exhibiting anisotropic conductivity by thermocompression bonding can be used. As the metal particles, it is preferable to use particles in which two or more kinds of metals are layered, for example, nickel particles coated with gold.

[Colored layer, light shielding layer, and overcoat]
The colored layer 259 is a colored layer that transmits light in a specific wavelength band. For example, a red (R) color filter that transmits light in the red wavelength band, a green (G) color filter that transmits light in the green wavelength band, and a blue (B) that transmits light in the blue wavelength band A color filter or the like can be used. Each colored layer is formed at a desired position using various materials by a printing method, an inkjet method, an etching method using a photolithography method, or the like.

Further, a light shielding layer 257 is provided between the adjacent colored layers 259. The light shielding layer 257 shields light entering from adjacent light emitting elements, and suppresses color mixing between adjacent pixels. Here, light leakage can be suppressed by providing an end portion of the colored layer 259 so as to overlap the light shielding layer 257. The light-blocking layer 257 can be formed using a material that blocks light emitted from the light-emitting element, and can be formed using a metal material, a resin material containing a pigment or a dye, or the like. Note that as illustrated in FIG. 1B, it is preferable to provide the light-blocking layer 257 in a region other than the light extraction portion 104 such as the driver circuit portion 106 because unintended light leakage due to guided light or the like can be suppressed.

Further, an overcoat 261 that covers the colored layer 259 and the light-blocking layer 257 may be provided. By providing the overcoat, diffusion of impurities and the like contained in the colored layer to the light emitting element can be prevented. The overcoat is made of a material that transmits light emitted from the light emitting element. For example, an inorganic insulating film such as a silicon nitride film or a silicon oxide film, or an organic insulating film containing the same main component as the colored layer or the light shielding layer (for example, An acrylic resin film, a polyimide resin film, or the like can be used, and a stacked structure of an organic insulating film and an inorganic insulating film may be used. The above-described insulating film with low water permeability may be used for the overcoat 261.

In the case where the material for the adhesive layer 213 is applied over the coloring layer 259 and the light-shielding layer 257, it is preferable to use a material that has high wettability with respect to the material for the adhesive layer 213 as the material for the overcoat 261. For example, it is preferable to use an oxide conductive film such as an ITO film or a metal film such as an Ag film that is thin enough to have translucency.

<Example of production method>
Next, a method for manufacturing the light-emitting device is illustrated with reference to FIGS. Here, the light-emitting device having the structure of Specific Example 1 (FIG. 1B) is described as an example.

First, the separation layer 303 is formed over the manufacturing substrate 301 and the insulating layer 205 is formed over the separation layer 303. Next, a plurality of transistors, a conductive layer 157, an insulating layer 207, an organic insulating layer 209, a plurality of light-emitting elements, and an insulating layer 211 are formed over the insulating layer 205. Note that the insulating layer 211, the organic insulating layer 209, and the insulating layer 207 are opened so that the conductive layer 157 is exposed (FIG. 4A).

In addition, the separation layer 307 is formed over the manufacturing substrate 305 and the insulating layer 255 is formed over the separation layer 307. Next, a light-blocking layer 257, a colored layer 259, and an overcoat 261 are formed over the insulating layer 255 (FIG. 4B).

As the manufacturing substrate 301 and the manufacturing substrate 305, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a metal substrate, or the like can be used, respectively.

Moreover, glass materials, such as aluminosilicate glass, alumino borosilicate glass, barium borosilicate glass, can be used for a glass substrate, for example. When the temperature of the subsequent heat treatment is high, a material having a strain point of 730 ° C. or higher is preferably used. A more practical heat-resistant glass can be obtained by containing a large amount of barium oxide (BaO). In addition, crystallized glass or the like can be used.

In the case where a glass substrate is used as the formation substrate, if an insulating film such as a silicon oxide film, a silicon oxynitride film, a silicon nitride film, or a silicon nitride oxide film is formed between the formation substrate and the separation layer, contamination from the glass substrate can be prevented. This is preferable because it can be prevented.

Each of the separation layer 303 and the separation layer 307 includes an element selected from tungsten, molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium, palladium, osmium, iridium, and silicon, and the element. It is a single layer or a laminated layer made of an alloy material or a compound material containing the element. The crystal structure of the layer containing silicon may be any of amorphous, microcrystalline, and polycrystalline.

The release layer can be formed by a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. Note that the coating method includes a spin coating method, a droplet discharge method, and a dispensing method.

In the case where the separation layer has a single-layer structure, a tungsten layer, a molybdenum layer, or a layer containing a mixture of tungsten and molybdenum is preferably formed. Alternatively, a layer containing tungsten oxide or oxynitride, a layer containing molybdenum oxide or oxynitride, or a layer containing an oxide or oxynitride of a mixture of tungsten and molybdenum may be formed. Note that the mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

In the case of forming a stacked structure of a layer containing tungsten and a layer containing tungsten oxide as the peeling layer, a layer containing tungsten is formed, and an insulating film formed of an oxide is formed thereon. Alternatively, the fact that a layer containing an oxide of tungsten is formed at the interface between the tungsten layer and the insulating film may be utilized. Further, the surface of the layer containing tungsten is subjected to thermal oxidation treatment, oxygen plasma treatment, nitrous oxide (N ₂ O) plasma treatment, treatment with a solution having strong oxidizing power such as ozone water, and the like to form tungsten oxide. An included layer may be formed. Plasma treatment and heat treatment may be performed in oxygen, nitrogen, nitrous oxide alone, or a mixed gas atmosphere of the gas and other gases. By changing the surface state of the release layer by the plasma treatment or the heat treatment, adhesion between the release layer and an insulating layer to be formed later can be controlled.

Each insulating layer can be formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, or the like. , A dense and very low water-permeable film can be obtained.

After that, a material to be the adhesive layer 213 is applied to the surface of the manufacturing substrate 305 on which the colored layer 259 or the like is provided or the surface of the manufacturing substrate 301 on which the light emitting element 230 or the like is provided. The manufacturing substrate 301 and the manufacturing substrate 305 are attached to face each other (FIG. 4C).

Then, the manufacturing substrate 301 is peeled, and the exposed insulating layer 205 and the flexible substrate 201 are attached to each other using the adhesive layer 203. Further, the manufacturing substrate 305 is peeled, and the exposed insulating layer 255 and the flexible substrate 103 are attached to each other using the adhesive layer 105. In FIG. 5A, the flexible substrate 103 does not overlap with the conductive layer 157; however, the conductive layer 157 and the flexible substrate 103 may overlap.

Note that various methods can be appropriately used for the peeling step. For example, in the case where a layer including a metal oxide film is formed on the side in contact with the layer to be peeled, the metal oxide film is weakened by crystallization and the layer to be peeled can be peeled from the manufacturing substrate. In the case where an amorphous silicon film containing hydrogen is formed as a separation layer between a manufacturing substrate with high heat resistance and a layer to be separated, the amorphous silicon film is removed by laser light irradiation or etching. The layer to be peeled can be peeled from the manufacturing substrate. In addition, a layer including a metal oxide film is formed on the side in contact with the layer to be peeled as the peeling layer, the metal oxide film is made brittle by crystallization, and a part of the peeling layer is made into a solution, NF ₃ , BrF ₃ , ClF After removal by etching using a fluorination gas such as _3, it can be peeled off in the weakened metal oxide film. Further, a film containing nitrogen, oxygen, hydrogen, or the like (for example, an amorphous silicon film containing hydrogen, a hydrogen-containing alloy film, an oxygen-containing alloy film, or the like) is used as the peeling layer, and the peeling layer is irradiated with laser light. A method may be used in which nitrogen, oxygen, or hydrogen contained in the peeling layer is released as a gas to promote peeling between the layer to be peeled and the substrate. Alternatively, a manufacturing substrate over which the layer to be peeled is formed can be mechanically removed or removed by etching with a solution or a fluoride gas such as NF ₃ , BrF ₃ , or ClF ₃ . In this case, the release layer is not necessarily provided.

Moreover, a peeling process can be more easily performed by combining two or more said peeling methods. In other words, laser beam irradiation, etching of the release layer with gas or solution, mechanical removal with a sharp knife or scalpel, etc. to make the release layer and the release layer easy to peel off, Peeling can also be performed by force (by machine or the like).

Alternatively, the layer to be peeled may be peeled from the manufacturing substrate by infiltrating a liquid into the interface between the peeling layer and the layer to be peeled. Alternatively, the peeling may be performed while a liquid such as water is applied.

As another peeling method, when the peeling layer is formed of tungsten, the peeling may be performed while etching the peeling layer with a mixed solution of ammonia water and hydrogen peroxide water.

Note that in the case where peeling is possible at the interface between the manufacturing substrate and the layer to be peeled, the peeling layer is not necessarily provided. For example, glass is used as a manufacturing substrate, an organic resin such as polyimide, polyester, polyolefin, polyamide, polycarbonate, or acrylic is formed in contact with the glass, and an insulating film, a transistor, or the like is formed over the organic resin. In this case, the organic resin can be peeled at the interface between the manufacturing substrate and the organic resin by heating. Alternatively, a metal layer may be provided between the manufacturing substrate and the organic resin, and current may be supplied to the metal layer to heat the metal layer, and separation may be performed at the interface between the metal layer and the organic resin.

Finally, the conductive layer 157 is exposed by opening the insulating layer 255 and the adhesive layer 213 (FIG. 5B). Note that in the case where the flexible substrate 103 overlaps with the conductive layer 157, the flexible substrate 103 and the adhesive layer 105 are also opened to expose the conductive layer 157 (FIG. 5C). The opening means is not particularly limited, and for example, a laser ablation method, an etching method, an ion beam sputtering method, or the like may be used. Alternatively, the film on the conductive layer 157 may be cut using a sharp blade or the like, and a part of the film may be peeled off by a physical force.

Through the above, a light-emitting device can be manufactured.

As described above, the light-emitting device of this embodiment includes the flexible substrate 103 and the flexible substrate 201. Further, even a configuration including a touch sensor can be configured with two substrates. By minimizing the number of substrates, it is easy to improve light extraction efficiency and display clarity. Therefore, the luminance can be increased when compared with the case of the same power consumption. Further, when compared with the same luminance, power consumption can be reduced.

Note that although a light-emitting device having a light-emitting element is illustrated in this embodiment mode, the present invention is not limited to this. As a device to which the flexible substrate which is a feature of one embodiment of the present invention can be applied, various semiconductor devices and various display devices can be given. For example, a flexible substrate which is a feature of one embodiment of the present invention can be used as a substrate of an element or device described below. For example, EL elements (EL elements including organic and inorganic substances, organic EL elements, inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc.), transistors (transistors that emit light in response to current), electrons Emission element, liquid crystal element, electronic ink, electrophoretic element, grating light valve (GLV), plasma display (PDP), MEMS (micro electro mechanical system), digital micro mirror device (DMD), DMS (digital micro・ Shutter), MIRASOL (registered trademark), IMOD (interference modulation) element, electrowetting element, piezoelectric ceramic display, carbon nanotube, etc. Rate, etc. transmittance include a display medium changes. In addition, a field emission display (FED) or a SED type flat display (SED) which is an example of a display device using an electron-emitting device can be given. Moreover, a liquid crystal display (a transmissive liquid crystal display, a transflective liquid crystal display, a reflective liquid crystal display, a direct-view liquid crystal display, a projection liquid crystal display), which is an example of a display device using a liquid crystal element, can be given. Further, electronic paper which is an example of a display device using electronic ink or an electrophoretic element can be given.

Examples of electronic paper display methods include those displayed by molecules (optical anisotropy, dye molecule orientation, etc.), those displayed by particles (electrophoresis, particle movement, particle rotation, phase change, etc.), film Displayed by moving one end of the molecule, displayed by color development / phase change of molecules, displayed by light absorption of molecules, or displayed by self-emission by combining electrons and holes Can be used. Specifically, examples of electronic paper display methods include microcapsule electrophoresis, horizontal movement electrophoresis, vertical movement electrophoresis, spherical twist ball, magnetic twist ball, cylindrical twist ball system, charged toner, electronic Powdered fluid, magnetophoretic, magnetic thermosensitive, electrowetting, light scattering (transparency / white turbidity change), cholesteric liquid crystal / photoconductive layer, cholesteric liquid crystal, bistable nematic liquid crystal, ferroelectric liquid crystal, dichroic dye There are liquid crystal dispersion type, movable film, color erasing / erasing with leuco dye, photochromic, electrochromic, electrodeposition, flexible organic EL, etc. However, the present invention is not limited to this, and various electronic papers and display methods thereof can be used. Here, aggregation and precipitation of electrophoretic particles can be solved by using microcapsule electrophoresis. The electronic powder fluid has advantages such as high-speed response, high reflectivity, wide viewing angle, low power consumption, and memory properties.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 2)
In this embodiment, electronic devices to which one embodiment of the present invention is applied will be described with reference to FIGS.

The electronic device of this embodiment alternately has a belt-like highly flexible region and a belt-like low-flexible region. The electronic device can be folded by being bent in a highly flexible region. The electronic device of this embodiment is excellent in portability in the folded state, and in the expanded state, it has excellent display listability due to a wide light-emitting region that is seamless.

In the electronic device of this embodiment, a highly flexible region can be folded by either internal bending or external bending.

When the electronic device of this embodiment is not used, it is possible to prevent the light emitting surface from being scratched or soiled by bending the light emitting surface of the light emitting device to the inside.

When using the electronic device of the present embodiment, the entire light emitting area which is seamless can be used by spreading, or the light emitting area can be bent by bending the light emitting surface of the light emitting device to the outside. A part of may be used. By folding the light emitting area that is folded and invisible to the user, the power consumption of the electronic device can be suppressed.

Hereinafter, an electronic device that has two belt-like regions with high flexibility and three belt-like regions with low flexibility and can be folded in three will be described as an example.

FIG. 6A illustrates the electronic device in a developed state. FIG. 6B illustrates an electronic device in a state in which the state is changed from one of a developed state or a folded state to the other. FIG. 6C illustrates the electronic device in a folded state. FIG. 7 is a perspective view illustrating each configuration of the electronic device. 8A is a plan view of the light emitting surface side of the electronic device, and FIG. 8B is a plan view of the surface side facing the light emitting surface of the electronic device. 8C and 8D are examples of side views of the electronic device in FIG. 8A viewed from the direction of the arrows. FIG. 8E is a cross-sectional view taken along the dashed-dotted line AB in FIG.

6A to 6C includes a light-emitting device 11 having flexibility. The light-emitting device of one embodiment of the present invention described in Embodiment 1 can be applied to the light-emitting device 11. The light-emitting device of one embodiment of the present invention can be bent with a curvature radius of 1 mm to 100 mm, for example, and thus can be favorably used for an electronic device that is folded at least once by internal bending or external bending.

The electronic devices illustrated in FIGS. 6A to 6C further include a plurality of support panels 15a and a plurality of support panels 15b. The support panels 15 a and 15 b are less flexible than the light emitting device 11. The plurality of support panels 15a are separated from each other. The plurality of support panels 15b are separated from each other.

As illustrated in FIG. 8A, the electronic device alternately has high-flexibility regions E1 and low-flexibility regions E2. The highly flexible region and the low flexibility region are each formed in a strip shape (striped shape). In this embodiment mode, an example in which a plurality of high-flexibility regions and a plurality of low-flexibility regions are parallel to each other is described, but the regions may not be arranged in parallel.

The highly flexible region E1 in the electronic device only needs to include at least a flexible light-emitting device. A light-emitting device using an organic EL element is preferable because it can be thin and light in addition to high flexibility and impact resistance.

The low-flexibility region E2 in the electronic device only needs to have at least a flexible light-emitting device and a support panel that is less flexible than the light-emitting device.

The support panel should just be provided in at least one of the light emission surface side of a light-emitting device, or the surface side facing a light emission surface.

Like the support panels 15a and 15b shown in FIG. 8C, when the support panels are provided on both the light emitting surface side and the surface side facing the light emitting surface of the light emitting device, the light emitting device can be sandwiched between the pair of support panels. This is preferable because the mechanical strength of the low flexibility region is increased and the electronic device is less likely to be damaged.

Further, instead of the support panels 15a and 15b, the light emitting device 11 may be disposed between the support panels 15 by using the support panel 15 illustrated in FIG.

When the support panel is provided only on the light emitting surface side of the light emitting device or on the surface side facing the light emitting surface, the electronic device can be made thinner or lighter, which is preferable. For example, it is good also as an electronic device which does not use the some support panel 15a but has only the some support panel 15b.

The highly flexible region E1 and the low flexibility region E2 preferably have a light emitting device and a protective layer that is more flexible than the support panel. Thereby, the highly flexible area | region E1 of an electronic device turns into an area | region which has flexibility and high mechanical strength, and can make an electronic device harder to be damaged. Even in a highly flexible region, the electronic device can be configured not to be broken by deformation due to external force or the like.

For example, the thickness of each of the light emitting device, the support panel, and the protective layer is preferably such that the support panel is the thickest and the light emitting device is the thinnest. For example, each of the light emitting device, the support panel, and the protective layer preferably has a configuration in which the support panel has the lowest flexibility and the light emitting device has the highest flexibility. By adopting such a configuration, the difference in flexibility between the highly flexible region and the low flexible region becomes large. By using a configuration in which bending can be reliably performed in a highly flexible region, bending can be suppressed in a region having low flexibility, and the reliability of the electronic device can be improved. Moreover, it can suppress that an electronic device bends in the location which is not intended.

When a protective layer is provided on both the light-emitting surface side and the surface side facing the light-emitting surface of the light-emitting device, the light-emitting device can be sandwiched between the pair of protective layers, which increases the mechanical strength of the electronic device and further damages the electronic device. It becomes difficult and preferable.

For example, as shown in FIG. 8C, in the low-flexibility region E2, the pair of protective layers 13a and 13b are positioned between the pair of support panels 15a and 15b, and a pair of light-emitting devices (not shown) is provided. It is preferable to be located between the protective layers 13a and 13b.

Alternatively, as illustrated in FIG. 8D, in the low-flexibility region E2, the pair of protective layers 13a and 13b are positioned between the support panels 15, and the light-emitting device (not illustrated) includes the pair of protective layers 13a. , 13b.

When the protective layer is provided only on the light emitting surface side of the light emitting device or on the surface side facing the light emitting surface, the electronic device can be made thinner or lighter, which is preferable. For example, it is good also as an electronic device which has only the protective layer 13b, without using the protective layer 13a.

Further, when the protective layer 13a on the light emitting surface side of the light emitting device is a light shielding film, it is possible to suppress external light from being irradiated to the non-light emitting region of the light emitting device. This is preferable because light deterioration of a transistor or the like included in the drive circuit included in the non-light emitting region can be suppressed.

As shown in FIGS. 7 and 8E, the opening of the protective layer 13a provided on the light emitting surface side of the light emitting device 11 overlaps the light emitting region 11a of the light emitting device. The non-light emitting region 11b surrounding the light emitting region 11a in a frame shape and the protective layer 13a are provided so as to overlap each other. The protective layer 13b provided on the surface facing the light emitting surface of the light emitting device 11 overlaps the light emitting region 11a and the non-light emitting region 11b. The protective layer 13b is provided in a wider range, particularly preferably over the entire surface, facing the light emitting surface, so that the light emitting device can be further protected and the reliability of the electronic device can be improved.

The protective layer and the support panel can be formed using plastic, metal, alloy, rubber or the like. Use of plastic, rubber, or the like is preferable because a protective layer and a support panel that are lightweight and hardly damaged are obtained. For example, silicone rubber may be used as the protective layer, and stainless steel or aluminum may be used as the support panel.

Moreover, it is preferable to use a material having high toughness for the protective layer and the support panel. Thereby, it is possible to realize an electronic device that is excellent in impact resistance and is not easily damaged. For example, by using an organic resin, a thin metal material, or an alloy material, an electronic device that is lightweight and hardly damaged can be realized. Note that for the same reason, it is preferable to use a material having high toughness for the substrate included in the light-emitting device.

The protective layer and the support panel positioned on the light emitting surface side may be light-transmitting if they do not overlap with the light emitting region of the light emitting device. When the protective layer or the support panel located on the light emitting surface side overlaps at least a part of the light emitting region, it is preferable to use a material that transmits light emitted from the light emitting device. The light-transmitting properties of the protective layer and the support panel located on the surface facing the light emitting surface are not limited.

When adhering any two of the protective layer, the support panel, and the light emitting device, various adhesives can be used. For example, a resin that cures at room temperature, such as a two-component mixed resin, or a photocurable resin A resin such as a thermosetting resin can be used. A sheet-like adhesive may be used. Alternatively, each component of the electronic device may be fixed using a screw that penetrates any two or more of the protective layer, the support panel, and the light-emitting device, a pin that is sandwiched, a clip, and the like.

In the electronic device of this embodiment, one light emitting device (one light emitting region) can be used by being divided into two or more with a bent portion as a boundary. For example, a region hidden by folding may be made non-light emitting, and only an exposed region may emit light. As a result, it is possible to reduce the power consumed by the area not used by the user.

The electronic device of this embodiment may include a sensor for determining whether or not each highly flexible region is bent. For example, a switch, a MEMS pressure sensor, a pressure sensor, or the like can be used.

In the above, an electronic apparatus having two highly flexible regions has been described as an example, but the present invention is not limited to this. For example, as shown in FIG. 9A, it is sufficient to have at least one highly flexible region E1, and an electronic device that can be folded in four having three highly flexible regions E1 (see FIG. 9A). 9 (B)) and an electronic device (FIG. 9C) that can be folded in five having four highly flexible regions E1 are also one embodiment of the present invention.

This embodiment can be combined with any of the other embodiments as appropriate.

(Embodiment 3)
In this embodiment, electronic devices and lighting devices to which one embodiment of the present invention is applied will be described with reference to FIGS.

An electronic device or a lighting device can be manufactured using the light-emitting device of one embodiment of the present invention, whereby reliability can be improved. In addition, by applying the light-emitting device of one embodiment of the present invention, a highly reliable flexible electronic device or lighting device can be manufactured.

Examples of the electronic device include a television device (also referred to as a television or a television receiver), a monitor for a computer, a digital camera, a digital video camera, a digital photo frame, a mobile phone (also referred to as a mobile phone or a mobile phone device). ), Large game machines such as portable game machines, portable information terminals, sound reproducing devices, and pachinko machines.

In addition, since the light-emitting device of one embodiment of the present invention has flexibility, it can be incorporated along an inner wall or an outer wall of a house or a building, or a curved surface of an interior or exterior of an automobile.

FIG. 10A illustrates an example of a mobile phone. A cellular phone 7100 is provided with a display portion 7102 incorporated in a housing 7101, operation buttons 7103, an external connection port 7104, a speaker 7105, a microphone 7106, a camera 7107, and the like. Note that the cellular phone 7100 is manufactured using the light-emitting device of one embodiment of the present invention for the display portion 7102. According to one embodiment of the present invention, a highly reliable mobile phone including a curved display portion can be provided.

A cellular phone 7100 illustrated in FIG. 10A can input information by touching the display portion 7102 with a finger or the like. Any operation such as making a call or inputting a character can be performed by touching the display portion 7102 with a finger or the like. For example, an application can be started by touching an icon 7108 displayed on the display portion 7102.

Further, by operating the operation button 7103, the power can be turned on and off, and the type of image displayed on the display portion 7102 can be switched. For example, the mail creation screen can be switched to the main menu screen.

FIG. 10B illustrates an example of a wristwatch-type portable information terminal. A portable information terminal 7200 includes a housing 7201, a display portion 7202, a band 7203, a buckle 7204, operation buttons 7205, an input / output terminal 7206, and the like.

The portable information terminal 7200 can execute various applications such as a mobile phone, electronic mail, text browsing and creation, music playback, Internet communication, and computer games.

The display portion 7202 is provided with a curved display surface, and display can be performed along the curved display surface. The display portion 7202 includes a touch sensor and can be operated by touching the screen with a finger, a stylus, or the like. For example, an application can be started by touching an icon 7207 displayed on the display portion 7202.

The operation button 7205 can have various functions such as power on / off operation, wireless communication on / off operation, manner mode execution and release, and power saving mode execution and release, in addition to time setting. . For example, the function of the operation button 7205 can be freely set by an operation system incorporated in the portable information terminal 7200.

In addition, the portable information terminal 7200 can perform short-range wireless communication with a communication standard. For example, it is possible to talk hands-free by communicating with a headset capable of wireless communication.

In addition, the portable information terminal 7200 includes an input / output terminal 7206, and can directly exchange data with other information terminals via a connector. Charging can also be performed through the input / output terminal 7206. Note that the charging operation may be performed by wireless power feeding without using the input / output terminal 7206.

The light-emitting device of one embodiment of the present invention can be applied to the display portion 7202 of the portable information terminal 7200.

FIG. 10C illustrates an example of a portable display device. The display device 7300 includes a housing 7301, a display portion 7302, operation buttons 7303, a drawer member 7304, and a control portion 7305.

The display device 7300 includes a flexible display portion 7102 wound in a roll shape within a cylindrical housing 7301.

Further, the display device 7300 can receive a video signal by the control unit 7305 and can display the received video on the display unit 7302. In addition, the control unit 7305 is provided with a battery. Further, the control unit 7305 may be provided with a terminal unit for connecting a connector, and a video signal and power may be directly supplied from the outside by wire.

An operation button 7303 can be used to perform power ON / OFF operations, switching of displayed images, and the like.

FIG. 10D illustrates the display device 7300 in a state where the display portion 7302 is pulled out by a pull-out member 7304. In this state, an image can be displayed on the display portion 7302. An operation button 7303 arranged on the surface of the housing 7301 can be easily operated with one hand. Further, as shown in FIG. 10C, the operation button 7303 is arranged close to one side instead of the center of the housing 7301, so that it can be easily operated with one hand.

Note that a reinforcing frame may be provided on a side portion of the display portion 7302 so that the display surface of the display portion 7302 is fixed to be flat when the display portion 7302 is pulled out.

In addition to this configuration, a speaker may be provided in the housing, and audio may be output by an audio signal received together with the video signal.

In the display portion 7302, the light-emitting device of one embodiment of the present invention is incorporated. According to one embodiment of the present invention, a light-emitting device that is lightweight and highly reliable can be provided.

This embodiment can be freely combined with any of the other embodiments.

In this example, a result of manufacturing a light-emitting device of one embodiment of the present invention and performing a reliability test in a high-temperature and high-humidity environment will be described.

In this example, a sample a which is a light-emitting device of one embodiment of the present invention and a comparative sample b which is a light-emitting device of a comparative example were manufactured.

The materials used for the sample a and the comparative sample b will be described with reference to FIG.

As the flexible substrate 201 and the flexible substrate 103, a 20 μm-thick plastic film was used.

As the adhesive layer 203, the adhesive layer 213, and the adhesive layer 105, a two-component mixed epoxy resin was used.

As the transistor 240, a bottom-gate / top-contact transistor using an oxide semiconductor film was used.

The light-emitting element 230 has a top emission structure, and the EL layer 233 includes a fluorescent light-emitting unit having a blue light-emitting layer and a phosphorescent light-emitting unit having a green light-emitting layer and a red light-emitting layer. An EL element was used.

A polyimide resin film having a thickness of 1 μm was used as the insulating layer 211 covering the end portion of the lower electrode 231 of the light emitting element 230.

As the light shielding layer 257, a black matrix having a thickness of 0.6 μm containing acrylic resin and carbon black was used. Here, the acrylic resin can be said to be a main component of the light shielding layer 257.

As the colored layer 259, a color filter containing an acrylic resin as a main component was used. Three types of red, green, and blue color filters with different pigments are used. The red color filter has a film thickness of 1.9 μm, the green color filter has a film thickness of 1.5 μm, and the blue color filter film. The thickness was 1.3 μm.

In sample a, an acrylic resin film having a thickness of 2 μm (a film containing acrylic resin as a main component) was used for the organic insulating layer 209 between the transistor 240 and the light emitting element 230. On the other hand, in the comparative sample b, a 2 μm-thick polyimide resin film (a film mainly composed of polyimide resin) was used for the organic insulating layer 209.

In the reliability test, the sample a and the comparative sample b were held in a high-temperature and high-humidity environment (temperature 65 ° C., humidity 90%).

FIG. 11A shows a display state before the reliability test of the sample a. Further, FIG. 11B shows a display state after 1000 hours have passed after holding the sample a in a high-temperature and high-humidity environment. FIG. 11E is a top view of the sample a in a non-display state.

FIG. 11C shows a display state before the reliability test of the comparative sample b. FIG. 11D shows a display state after 48 hours have passed since the comparative sample b was held in a high-temperature and high-humidity environment. FIG. 11F is a top view of the comparative sample b in the non-display state.

In the comparative sample b, a display defect in which a part of the display area did not emit light occurred 48 hours after the start of the reliability test. As shown in FIG. 11F, it was found that cracks were generated in the display region of the comparative sample b by visual observation. Further, when a cross-sectional observation of the display region of the comparative sample b was performed, it was confirmed that cracks were generated in the insulating layer 255 and the light shielding layer 257. It is considered that the occurrence of cracks in the display area makes it easier for moisture to enter the display area, resulting in display defects.

On the other hand, in sample a, no display defect due to the occurrence of cracks was observed 1000 hours after the start of the reliability test.

The major difference between the sample a and the comparative sample b is the material constituting the organic insulating layer 209. In the comparative sample b, the main component of the organic insulating layer 209 is a polyimide resin, which is different from the main component (acrylic resin) of the colored layer 259. Therefore, the organic insulating layer 209 and the colored layer 259 have a large difference in swelling degree and thermal expansion coefficient, and it is considered that cracks occurred in a high temperature and high humidity environment. On the other hand, in sample a, the main component of the organic insulating layer 209 and the main component of the colored layer 259 (and the main component of the light shielding layer 257) are both acrylic resins. Therefore, the difference in the degree of swelling and the thermal expansion coefficient is small between the organic insulating layer 209 and the colored layer 259, and it is considered that the generation of cracks could be suppressed even in a high temperature and high humidity environment.

From the above, it was shown that display defects due to generation of cracks can be suppressed by applying one embodiment of the present invention.

11 Light-emitting device 11a Light-emitting area 11b Non-light-emitting area 13a Protective layer 13b Protective layer 15 Support panel 15a Support panel 15b Support panel 103 Flexible substrate 104 Light extraction part 105 Adhesive layer 106 Drive circuit part 108 FPC
108a FPC
108b FPC
156 conductive layer 157 conductive layer 201 flexible substrate 203 adhesive layer 205 insulating layer 207 insulating layer 209 organic insulating layer 209a organic insulating layer 209b organic insulating layer 211 insulating layer 213 adhesive layer 215 connecting body 215a connecting body 215b connecting body 217 insulating layer 230 Light-Emitting Element 231 Lower Electrode 233 EL Layer 235 Upper Electrode 240 Transistor 255 Insulating Layer 257 Light-shielding Layer 259 Colored Layer 261 Overcoat 270 Conductive Layer 271 p-type Semiconductor Layer 272 Conductive Layer 273 i-type Semiconductor Layer 274 Conductive Layer 275 n-type Semiconductor Layer 276 Insulating layer 278 Insulating layer 280 Conductive layer 281 Conductive layer 283 Conductive layer 291 Insulating layer 292 Conductive particle 293 Insulating layer 294 Conductive layer 295 Insulating layer 296 Conductive layer 301 Fabrication substrate 303 Separation layer 305 Fabrication substrate 307 Separation layer 7100 Mobile phone 7101 Case 7102 Display portion 7103 Operation button 7104 External connection port 7105 Speaker 7106 Microphone 7107 Camera 7108 Icon 7200 Portable information terminal 7201 Case 7202 Display portion 7203 Band 7204 Buckle 7205 Operation button 7206 Input / output terminal 7207 Icon 7300 Display device 7301 Case 7302 Display unit 7303 Operation button 7304 Member 7305 Control unit

Claims (7)

A first flexible substrate;
A transistor on the first flexible substrate;
An organic insulating layer on the transistor;
A light emitting element on the organic insulating layer electrically connected to the transistor;
A second flexible substrate on the light emitting element;
A colored layer between the light emitting element and the second flexible substrate,
The colored layer overlaps the light emitting element;
The organic insulating layer and the colored layer are light emitting devices including the same main component. A first flexible substrate;
A transistor on the first flexible substrate;
An organic insulating layer on the transistor;
A light emitting element on the organic insulating layer electrically connected to the transistor;
A second flexible substrate on the light emitting element;
A colored layer and a light shielding layer between the light emitting element and the second flexible substrate,
The colored layer overlaps the light emitting element;
The organic insulating layer, the colored layer, and the light shielding layer are light emitting devices that include the same main component. In claim 1 or 2,
An insulating layer overlapping the light shielding layer;
The light emitting element has a layer containing a light emitting organic compound between an upper electrode and a lower electrode,
The insulating layer is a light emitting device that covers an end of the lower electrode. A first flexible substrate;
A first adhesive layer on the first flexible substrate;
A first insulating layer on the first adhesive layer;
A transistor on the first insulating layer;
An organic insulating layer on the transistor;
A lower electrode on the organic insulating layer electrically connected to the transistor;
A second insulating layer covering an end of the lower electrode;
A layer containing a light-emitting organic compound on the lower electrode and the second insulating layer;
An upper electrode on the layer containing the luminescent organic compound;
A second adhesive layer on the upper electrode;
A colored layer on the second adhesive layer;
A third insulating layer on the colored layer;
A third adhesive layer on the third insulating layer;
A second flexible substrate on the third adhesive layer,
The colored layer overlaps the lower electrode;
The organic insulating layer and the colored layer are light emitting devices including the same main component. In claim 4,
A light shielding layer overlapping the second insulating layer between the second adhesive layer and the third insulating layer;
The organic insulating layer, the colored layer, and the light shielding layer are the light emitting device including the same main component. In any one of Claims 1 thru | or 5,
The light emitting device in which the same main component is an acrylic resin.   The electronic device which has a light-emitting device as described in any one of Claims 1 thru | or 6 in a display part.