JP2015015438A

JP2015015438A - Method for manufacturing lighting device and lighting device

Info

Publication number: JP2015015438A
Application number: JP2013142755A
Authority: JP
Inventors: 恵一江高; Keiichi Etaka; 昇一郎東; Shoichiro Azuma
Original assignee: Funai Electric Co Ltd
Current assignee: Funai Electric Co Ltd
Priority date: 2013-07-08
Filing date: 2013-07-08
Publication date: 2015-01-22

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a lighting device capable of suppressing a decrease in positional accuracy between a position in which a joint material is formed and a position in which a wall member is formed.SOLUTION: A method for manufacturing an LED bulb (lighting device) 100 comprises the steps of: arranging a transfer member 8 for forming a joint material 44 and a wall member 42 on a substrate 5 near the substrate 5; and forming the joint member 44 for fixing an LED 41 in a predetermined arrangement position 5a on a surface of the substrate 5 in which the LED 41 is scheduled to be arranged using the transmember 8, and at the same time forming the wall member 42 so as to surround the predetermined arrangement position 5a.

Description

この発明は、照明装置の製造方法および照明装置に関し、特に、基板に発光素子を固定させるための接合材を形成する工程と、基板に発光素子を取り囲むように壁部材を形成する工程とを備えた、照明装置の製造方法および照明装置に関する。 The present invention relates to a method for manufacturing a lighting device and a lighting device, and in particular, includes a step of forming a bonding material for fixing a light emitting element to a substrate, and a step of forming a wall member so as to surround the light emitting element on the substrate. In addition, the present invention relates to a method for manufacturing a lighting device and a lighting device.

従来、基板に発光素子を固定させるための接合材を形成する工程と、基板に発光素子を取り囲むように壁部材を形成する工程とを備えた、照明装置の製造方法が知られている（たとえば、特許文献１参照）。 2. Description of the Related Art Conventionally, there is known a method for manufacturing a lighting device including a step of forming a bonding material for fixing a light emitting element to a substrate and a step of forming a wall member so as to surround the light emitting element on the substrate (for example, , See Patent Document 1).

上記特許文献１には、配線基板上の導電部にＬＥＤ素子（発光素子）を固定させるための接合材を形成する工程と、ＬＥＤ素子を取り囲むように環状に設けられた第１の樹脂体（壁部材）を形成する工程と、第１の樹脂体の内側に充填された第２の樹脂体（封止材）を形成する工程とを備えた、ＬＥＤ装置の製造方法（照明装置の製造方法）が開示されている。上記特許文献１では、接合材を形成して、配線基板上の導電部にＬＥＤ素子の電極を直接ボンディングするように構成されている。また、第１の樹脂体（壁部材）を形成する工程は、樹脂吐出ノズル等を用いて線引き塗布することによって行われている。また、第２の樹脂体は、第１の樹脂体の内側の領域で配線基板の表面に対して凸状に盛り上がるように形成されている。この特許文献１によるＬＥＤ装置の製造方法では、接合材を形成するＬＥＤ素子の電極および配線基板導電部に対して直接ボンディングするための装置と、樹脂吐出ノズル等を用いて線引き塗布して第１の樹脂体を形成するための装置とは、それぞれ異なる装置であると考えられるので、接合材を形成する工程と、第１の樹脂体（壁部材）を形成する工程とは、それぞれ別工程で行われていると考えられる。 In Patent Document 1, a step of forming a bonding material for fixing an LED element (light emitting element) to a conductive portion on a wiring board, and a first resin body (annularly provided so as to surround the LED element) LED device manufacturing method (illuminating device manufacturing method), comprising: a step of forming a wall member) and a step of forming a second resin body (sealing material) filled inside the first resin body ) Is disclosed. In Patent Document 1, a bonding material is formed, and an electrode of an LED element is directly bonded to a conductive portion on a wiring board. In addition, the step of forming the first resin body (wall member) is performed by drawing with a resin discharge nozzle or the like. The second resin body is formed so as to protrude in a convex shape with respect to the surface of the wiring board in the region inside the first resin body. In the manufacturing method of the LED device according to Patent Document 1, the device for directly bonding the electrode of the LED element forming the bonding material and the wiring board conductive portion, and the resin-drawing nozzle or the like are used to draw and apply the first. Since the device for forming the resin body is considered to be a different device, the step of forming the bonding material and the step of forming the first resin body (wall member) are respectively separate steps. It is thought that it is done.

特開２００６−３２４５８９号公報JP 2006-324589 A

しかしながら、上記特許文献１に開示されたＬＥＤ装置の製造方法では、接合材を形成する工程と、第１の樹脂体（壁部材）を形成する工程とは、それぞれ別工程で行われていると考えられるので、その分、製造工程数が増加し、その結果、製造工程を簡略化するのが困難であるという問題点がある。また、接合材を形成する工程と、第１の樹脂体（壁部材）を形成する工程との、各々の工程毎に、接合材または第１の樹脂体を形成するための位置調整が別々に行われていると考えられるため、接合材が形成される位置と第１の樹脂体（壁部材）が形成される位置との間の相対的な位置の精度が低くなるという問題点もあると考えられる。 However, in the LED device manufacturing method disclosed in Patent Document 1, the step of forming the bonding material and the step of forming the first resin body (wall member) are performed in separate steps. Therefore, there is a problem that the number of manufacturing steps increases correspondingly, and as a result, it is difficult to simplify the manufacturing steps. In addition, the position adjustment for forming the bonding material or the first resin body is separately performed for each step of the step of forming the bonding material and the step of forming the first resin body (wall member). Since it is thought that it is performed, there is a problem that the accuracy of the relative position between the position where the bonding material is formed and the position where the first resin body (wall member) is formed is low. Conceivable.

この発明は、上記のような課題を解決するためになされたものであり、この発明の１つの目的は、発光素子を固定するための接合材の形成工程と、壁部材を形成する工程とを含む製造プロセスを簡略化することが可能で、かつ、接合材と壁部材との間の相対的な位置の精度を向上させることが可能な照明装置の製造方法を提供することである。 The present invention has been made to solve the above-described problems, and one object of the present invention is to form a bonding material forming step for fixing a light emitting element and a wall member forming step. It is an object of the present invention to provide a method for manufacturing an illuminating device that can simplify the manufacturing process including the above and can improve the accuracy of the relative position between the bonding material and the wall member.

上記目的を達成するために、この発明の第１の局面による照明装置の製造方法は、基板に対して接合材および壁部材を形成するための接合材壁部材形成装置を基板の近傍に配置する工程と、接合材壁部材形成装置を用いて、発光素子が配置される予定の基板の表面の配置予定位置に、発光素子を固定させるための接合材を形成するのと同時に、配置予定位置を取り囲むように壁部材を形成する接合材壁部材形成工程とを備える。 In order to achieve the above object, a manufacturing method of a lighting device according to a first aspect of the present invention arranges a bonding material wall member forming device for forming a bonding material and a wall member on a substrate in the vicinity of the substrate. Using the process and the bonding material wall member forming apparatus, at the same time as forming the bonding material for fixing the light emitting element on the planned arrangement position on the surface of the substrate on which the light emitting element is to be arranged, A bonding material wall member forming step of forming a wall member so as to surround it.

この発明の第１の局面による照明装置の製造方法では、上記のように、発光素子が配置される予定の基板の表面の配置予定位置に、発光素子を固定させるための接合材を形成するのと同時に、配置予定位置を取り囲むように壁部材を形成することによって、接合材を形成する工程と、壁部材を形成する工程とが別工程で行われる場合と異なり、工程数を減少させることができるので、その分、製造プロセスを簡略化することができる。また、接合材および壁部材を同時に形成することによって、接合材と壁部材との間の相対的な位置の調整を同時に行うことができるので、接合材を形成する位置と壁部材を形成する位置との間の相対的な位置の精度を向上することができる。したがって、発光素子を固定するための接合材の形成工程と、壁部材を形成する工程とを含む製造プロセスを簡略化することが可能で、かつ、接合材と壁部材との間の相対的な位置の精度を向上させることが可能な照明装置の製造方法を提供することができる。 In the manufacturing method of the lighting device according to the first aspect of the present invention, as described above, the bonding material for fixing the light emitting element is formed at the planned arrangement position on the surface of the substrate on which the light emitting element is to be arranged. At the same time, by forming the wall member so as to surround the planned arrangement position, the number of steps can be reduced, unlike the case where the step of forming the bonding material and the step of forming the wall member are performed in separate steps. Therefore, the manufacturing process can be simplified accordingly. Moreover, since the relative position between the bonding material and the wall member can be adjusted simultaneously by forming the bonding material and the wall member at the same time, the position where the bonding material is formed and the position where the wall member is formed The accuracy of the relative position between the two can be improved. Therefore, it is possible to simplify the manufacturing process including the bonding material forming step for fixing the light emitting element and the wall member forming step, and the relative relationship between the bonding material and the wall member can be simplified. The manufacturing method of the illuminating device which can improve the precision of a position can be provided.

上記第１の局面による照明装置の製造方法において、好ましくは、接合材壁部材形成工程は、接合材と壁部材とを、同じ材料で形成する工程を含む。このように構成すれば、接合材と壁部材とを、別々の材料で形成する場合と異なり、接合材の材料と壁部材の材料を別々に準備する必要がなくなるので、照明装置の製造プロセスおよび製造装置を簡略化することができる。 In the manufacturing method of the lighting device according to the first aspect, preferably, the bonding material wall member forming step includes a step of forming the bonding material and the wall member with the same material. With this configuration, unlike the case where the bonding material and the wall member are formed of different materials, it is not necessary to prepare the material of the bonding material and the material of the wall member separately. The manufacturing apparatus can be simplified.

この場合、好ましくは、接合材壁部材形成工程は、接合材と壁部材とを、互いに同じ無機フィラーを含有するとともに、無機フィラーの含有率が等しい同じ材料で形成する工程を含む。このように構成すれば、互いに異なる無機フィラーを含有する場合と異なり、接合材および壁部材の材料において、別々に無機フィラーを含有させる必要がなくなるので、照明装置の製造プロセスおよび製造装置をより簡略化することができる。 In this case, preferably, the bonding material wall member forming step includes a step of forming the bonding material and the wall member with the same material containing the same inorganic filler and having the same inorganic filler content. If comprised in this way, unlike the case where different inorganic fillers are contained, it is not necessary to separately contain the inorganic filler in the material of the bonding material and the wall member, so that the manufacturing process and manufacturing device of the lighting device can be simplified. Can be

上記第１の局面による照明装置の製造方法において、好ましくは、接合材壁部材形成工程は、基板の表面に設けた発光素子へ電力を供給するための導電部の位置を基準にして、発光素子を固定させるための接合材及び壁部材を同時に形成する工程を含み、導電部の位置を基準にして接合材の発光素子の配置予定位置に発光素子を配置する発光素子配置工程をさらに備える。このように構成すれば、接合材および壁部材の形成と、発光素子の配置とを、別々の位置を基準にして行う場合と異なり、接合材および壁部材の形成と、発光素子の配置とが、同一の位置基準に基づいて行われるので、発光素子の配置位置と壁部材を形成する位置との間の相対的な位置の精度を向上させることができる。その結果、壁部材の内側の領域で基板の表面に対して凸状に盛り上がるように封止体を形成した場合、発光素子と封止材を形成する位置との位置精度も向上させることができるので、封止材を介して発光される光の色度がばらつくのを効果的に抑制することができる。 In the manufacturing method of the lighting device according to the first aspect, preferably, the bonding material wall member forming step uses the position of the conductive portion for supplying power to the light emitting element provided on the surface of the substrate as a reference. Including a step of simultaneously forming a bonding material and a wall member for fixing the light emitting element, and further including a light emitting element arrangement step of arranging the light emitting element at a planned arrangement position of the light emitting element of the bonding material with reference to the position of the conductive portion. If comprised in this way, unlike the case where formation of a joining material and a wall member, and arrangement | positioning of a light emitting element are performed on the basis of a separate position, formation of a joining material and a wall member, and arrangement | positioning of a light emitting element are carried out. Since it is performed based on the same position reference, it is possible to improve the accuracy of the relative position between the arrangement position of the light emitting element and the position where the wall member is formed. As a result, when the sealing body is formed so as to protrude in a convex shape with respect to the surface of the substrate in the region inside the wall member, the positional accuracy between the light emitting element and the position where the sealing material is formed can also be improved. Therefore, it is possible to effectively suppress variations in chromaticity of light emitted through the sealing material.

上記第１の局面による照明装置の製造方法において、好ましくは、接合材壁部材形成工程は、配置予定位置に発光素子が配置された場合に、発光素子の上面の基板の表面に対する高さよりも、壁部材の上端部の基板の表面に対する高さが低くなるように壁部材を形成する工程を含む。このように構成すれば、発光素子の上面の基板の表面に対する高さよりも、壁部材の上端部の基板の表面に対する高さが高くなるように壁部材を形成する場合と異なり、壁部材の上端部の基板の表面に対する高さが低く形成される分、壁部材の材料を少なくすることができる。 In the manufacturing method of the lighting device according to the first aspect, preferably, in the bonding material wall member forming step, when the light emitting element is arranged at the planned arrangement position, the height of the upper surface of the light emitting element with respect to the surface of the substrate, A step of forming the wall member such that the height of the upper end portion of the wall member with respect to the surface of the substrate is reduced. With this configuration, unlike the case where the wall member is formed such that the height of the upper end portion of the wall member relative to the surface of the substrate is higher than the height of the upper surface of the light emitting element relative to the surface of the substrate, the upper end of the wall member is increased. Since the height of the portion with respect to the surface of the substrate is formed low, the material of the wall member can be reduced.

上記第１の局面による照明装置の製造方法において、好ましくは、接合材壁部材形成装置は、転写部材を含み、接合材壁部材形成工程は、転写部材を用いて接合材と壁部材とを基板の表面に同時に転写することによって、接合材と壁部材とを同時に基板の表面に形成する工程を含む。このように構成すれば、容易に、発光素子が配置される予定の基板の表面の配置予定位置に、発光素子を固定させるための接合材を形成するのと同時に、配置予定位置を取り囲むように壁部材を形成することができる。 In the lighting device manufacturing method according to the first aspect, preferably, the bonding material wall member forming apparatus includes a transfer member, and the bonding material wall member forming step uses the transfer member to substrate the bonding material and the wall member as a substrate. And simultaneously forming the bonding material and the wall member on the surface of the substrate by transferring them onto the surface of the substrate. With this configuration, it is easy to form a bonding material for fixing the light emitting element at the planned placement position on the surface of the substrate on which the light emitting element is to be placed, and at the same time surround the planned placement position. A wall member can be formed.

この発明の第２の局面による照明装置は、発光素子と、発光素子が実装された基板と、発光素子を基板に固定するための接合材と、基板の表面において発光素子を取り囲むように設けられた壁部材とを備え、接合材と壁部材とを、同じ材料で形成する。 A lighting device according to a second aspect of the present invention is provided so as to surround a light emitting element on a surface of the substrate, a light emitting element, a substrate on which the light emitting element is mounted, a bonding material for fixing the light emitting element to the substrate, and the substrate. The joining material and the wall member are formed of the same material.

この発明の第２の局面による照明装置では、上記のように、接合材と壁部材とを、同じ材料で形成することによって、接合材と壁部材とを、発光素子を配置される予定の基板の表面の配置予定位置に、発光素子を固定させるための接合材を形成するのと同時に、配置予定位置を取り囲むように壁部材を形成することができる。その結果、接合材を形成する工程と、壁部材を形成する工程とが別工程で行われる場合と異なり、工程数を減少させることができるので、その分、製造プロセスを簡略化することができる。また、接合材および壁部材を同時に形成することによって、接合材と壁部材との間の相対的な位置の調整を同時に行うことができるので、接合材を形成する位置と壁部材を形成する位置との間の相対的な位置精度を向上することができる。したがって、発光素子を固定するための接合材の形成工程と、壁部材を形成する工程とを含む製造プロセスを簡略化することが可能で、かつ、接合材と壁部材との間の相対的な位置の精度を向上させることが可能な照明装置を提供することができる。 In the lighting device according to the second aspect of the present invention, as described above, the bonding material and the wall member are formed of the same material, whereby the bonding material and the wall member are arranged on the substrate on which the light emitting element is to be arranged. At the same time as forming the bonding material for fixing the light emitting element at the planned placement position on the surface, a wall member can be formed so as to surround the planned placement position. As a result, unlike the case where the step of forming the bonding material and the step of forming the wall member are performed in separate steps, the number of steps can be reduced, so that the manufacturing process can be simplified accordingly. . Moreover, since the relative position between the bonding material and the wall member can be adjusted simultaneously by forming the bonding material and the wall member at the same time, the position where the bonding material is formed and the position where the wall member is formed The relative positional accuracy between the two can be improved. Therefore, it is possible to simplify the manufacturing process including the bonding material forming step for fixing the light emitting element and the wall member forming step, and the relative relationship between the bonding material and the wall member can be simplified. It is possible to provide a lighting device that can improve the accuracy of the position.

また、接合材と壁部材とを、同じ材料で形成することによって、接合材と壁部材とを、別々の材料で形成する場合と異なり、接合材および壁部材に使用する材料の種類を少なくすることができるので、照明装置の構成を簡略化することができる。 Also, by forming the bonding material and the wall member from the same material, unlike the case where the bonding material and the wall member are formed from different materials, the types of materials used for the bonding material and the wall member are reduced. Therefore, the configuration of the lighting device can be simplified.

上記第２の局面による照明装置において、好ましくは、接合材と壁部材とは、互いに同じ無機フィラーを含有するとともに、無機フィラーの含有率が等しい同じ材料により形成されている。このように構成すれば、互いに異なる無機フィラーを含有する場合とは異なり、接合材および壁部材に使用するための、材料の種類を少なくすることができるので、照明装置の構成をより簡略化することができる。 In the lighting device according to the second aspect, preferably, the bonding material and the wall member are formed of the same material containing the same inorganic filler and the same content of the inorganic filler. If comprised in this way, since the kind of material for using for a joining material and a wall member can be reduced unlike the case where it contains mutually different inorganic filler, the structure of an illuminating device is simplified more. be able to.

本発明によれば、上記のように、発光素子を固定するための接合材の形成工程と、壁部材を形成する工程とを含む製造プロセスを簡略化することが可能で、かつ、接合材と壁部材との間の相対的な位置の精度を向上させることが可能な照明装置の製造方法を提供することができる。 According to the present invention, as described above, it is possible to simplify the manufacturing process including the step of forming the bonding material for fixing the light emitting element and the step of forming the wall member. The manufacturing method of the illuminating device which can improve the precision of the relative position between wall members can be provided.

本発明の第１実施形態によるＬＥＤ電球の全体構成を示した斜視図である。It is the perspective view which showed the whole structure of the LED bulb by 1st Embodiment of this invention. 図１に示したＬＥＤ電球の分解斜視図である。It is a disassembled perspective view of the LED bulb shown in FIG. 本発明の第１実施形態によるＬＥＤ電球の基板の平面図である。It is a top view of the board | substrate of the LED bulb by 1st Embodiment of this invention. 本発明の第１実施形態による光源の断面図であり、図１３の２００−２００線に沿った断面図である。It is sectional drawing of the light source by 1st Embodiment of this invention, and is sectional drawing along the 200-200 line | wire of FIG. 本発明の第１実施形態によるＬＥＤ電球の製造方法における接合材と壁部材とを形成する前の平面図である。It is a top view before forming the joining material and wall member in the manufacturing method of the LED bulb by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ電球の製造方法における接合材と壁部材とを形成した後の平面図である。It is a top view after forming the joining material and wall member in the manufacturing method of the LED bulb by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ電球の製造方法における転写部材を用いて接合材と壁部材とを形成している状態を示す図である。It is a figure which shows the state which has formed the joining material and the wall member using the transfer member in the manufacturing method of the LED bulb by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ電球の製造方法における接合材と壁部材とを形成する工程において使用される転写部材の側面図である。It is a side view of the transfer member used in the process of forming the bonding | jointing material and wall member in the manufacturing method of the LED bulb by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ電球の製造方法における接合材と壁部材とを形成する工程において使用される転写部材の平面図である。It is a top view of the transfer member used in the process of forming the bonding | jointing material and wall member in the manufacturing method of the LED bulb by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ電球の製造方法における接合材と壁部材とを形成する工程において使用される転写部材の斜視図である。It is a perspective view of the transfer member used in the process of forming the bonding | jointing material and wall member in the manufacturing method of the LED bulb by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ電球の製造方法における発光素子を設置する工程を説明するための平面図である。It is a top view for demonstrating the process of installing the light emitting element in the manufacturing method of the LED bulb by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ電球の製造方法における発光素子配置装置を用いて発光素子を配置する状態を示す図である。It is a figure which shows the state which arrange | positions a light emitting element using the light emitting element arrangement | positioning apparatus in the manufacturing method of the LED bulb by 1st Embodiment of this invention. 本発明の第１実施形態によるＬＥＤ電球の製造方法における封止材を形成する工程を説明するための平面図である。It is a top view for demonstrating the process of forming the sealing material in the manufacturing method of the LED bulb by 1st Embodiment of this invention. 本発明の第２実施形態によるＬＥＤ電球の製造方法における接合材と壁部材とを形成する工程を説明するための平面図である。It is a top view for demonstrating the process of forming the joining material and wall member in the manufacturing method of the LED bulb by 2nd Embodiment of this invention. 本発明の第３実施形態によるＬＥＤ電球の製造方法における接合材と壁部材とを形成する工程において使用される樹脂滴下装置の斜視図である。It is a perspective view of the resin dripping apparatus used in the process of forming the bonding | jointing material and wall member in the manufacturing method of the LED bulb by 3rd Embodiment of this invention.

以下、本発明の実施形態を図面に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

（第１実施形態）
まず、図１〜図４を参照して、第１実施形態によるＬＥＤ電球（電球型照明装置）１００の構成について説明する。なお、ＬＥＤ電球１００は、本発明の「照明装置」の一例である。 (First embodiment)
First, with reference to FIGS. 1-4, the structure of the LED light bulb (bulb-type illuminating device) 100 by 1st Embodiment is demonstrated. The LED bulb 100 is an example of the “lighting device” in the present invention.

図１および図２に示すように、ＬＥＤ電球１００は、本体部１と、本体部１に取り付けられた半球状のカバーレンズ２とを備えている。このカバーレンズ２は、本体部１とカバーレンズ２との間に配置された後述する基板５（図２参照）を円周状に取り囲むとともに基板５の表面（矢印Ｚ１方向側の面）を覆うように設けられている。 As shown in FIGS. 1 and 2, the LED bulb 100 includes a main body 1 and a hemispherical cover lens 2 attached to the main body 1. The cover lens 2 circumferentially surrounds a later-described substrate 5 (see FIG. 2) disposed between the main body 1 and the cover lens 2 and covers the surface of the substrate 5 (the surface on the arrow Z1 direction side). It is provided as follows.

図２に示すように、本体部１は、内部に電源基板３が収容されたケース部１１と、ケース部１１のカバーレンズ２とは反対側（矢印Ｚ２方向側）の端部に設けられ、ＬＥＤ電球１００をソケット（図示せず）に取り付けるための金属製の取付部１２とを含む。なお、取付部１２の外周面には、ソケット（図示せず）の内周面に形成された雌ネジ（図示せず）に螺合する雄ネジ部１２ａが設けられている。 As shown in FIG. 2, the main body 1 is provided at the end of the case 11 in which the power supply substrate 3 is accommodated and the end of the case 11 opposite to the cover lens 2 (arrow Z2 direction side) And a metal attachment portion 12 for attaching the LED bulb 100 to a socket (not shown). Note that a male screw portion 12a is provided on the outer peripheral surface of the attachment portion 12 to be screwed into a female screw (not shown) formed on the inner peripheral surface of a socket (not shown).

また、図２に示すように、本体部１とカバーレンズ２との間には、表面（矢印Ｚ１方向側の面）に複数（１６個）の光源４が実装された基板５と、基板５の裏面側（矢印Ｚ２方向側）に配置された放熱プレート６と、基板５の表面に配置され、光源４からの光をカバーレンズ２側に反射する反射シート７とが設けられている。基板５は、ガラスエポキシ樹脂を含み、基板５に直接素子を取り付け、回路パターンと接続することが可能なＣＯＢ（ＣｈｉｐＯｎＢｏａｒｄ）基板により構成されている。放熱プレート６は、アルミニウムなどの金属により構成されている。また、反射シート７は、ＰＥＴ（ポリエチレンテレフタラート）などの樹脂により構成されている。なお、反射シート７には、基板５の表面に配置された光源４を露出させるための開口部７ａが設けられている。 Further, as shown in FIG. 2, between the main body 1 and the cover lens 2, a substrate 5 having a plurality (16) of light sources 4 mounted on the surface (surface on the arrow Z1 direction side), and the substrate 5 A heat radiating plate 6 disposed on the back surface side (arrow Z2 direction side) and a reflection sheet 7 disposed on the surface of the substrate 5 and reflecting light from the light source 4 toward the cover lens 2 are provided. The substrate 5 includes a glass epoxy resin, and is configured by a COB (Chip On Board) substrate that can be directly attached to the substrate 5 and connected to a circuit pattern. The heat dissipation plate 6 is made of a metal such as aluminum. The reflection sheet 7 is made of a resin such as PET (polyethylene terephthalate). The reflection sheet 7 is provided with an opening 7a for exposing the light source 4 disposed on the surface of the substrate 5.

図２および図３に示すように、基板５は、平面視において（矢印Ｚ１方向側から見て）左右方向（Ｘ方向）に長い略長方形形状を有する。また、放熱プレート６は、基板５の対角線よりも長い直径を有する略真円形状を有する。また、反射シート７は、基板５の対角線と略同じ長さの直径を有する略真円形状を有する。 As shown in FIGS. 2 and 3, the substrate 5 has a substantially rectangular shape that is long in the left-right direction (X direction) in a plan view (viewed from the arrow Z1 direction side). The heat radiating plate 6 has a substantially perfect circular shape having a diameter longer than the diagonal line of the substrate 5. Further, the reflection sheet 7 has a substantially perfect circle shape having a diameter that is approximately the same length as the diagonal line of the substrate 5.

図３に示すように、基板５の表面（矢印Ｚ１方向側の面）に実装された光源４は、それぞれ、青色を発光ピーク波長とするＬＥＤ４１と、ＬＥＤ４１を基板５の表面（矢印Ｚ１方向側の面）に固定するために設けられた樹脂製の接合材４４と、基板５の表面（矢印Ｚ１方向側の面）においてＬＥＤ４１の周囲を円周状に取り囲むように設けられた樹脂製の円環状の壁部材４２と、円環状の壁部材４２に囲まれた空間内に充填された樹脂製の封止材４３（図７および図８参照）と、基板５の表面（矢印Ｚ１方向側の面）においてＬＥＤ４１と壁部材４２との間に設けられ、ＬＥＤ４１に電力を供給するための金属製の導電部４５および金属製のワイヤ４６により構成されている。なお、ＬＥＤ４１は、本発明の「発光素子」の一例である。また、図３では、説明の便宜上、封止材４３の図示を省略している。 As shown in FIG. 3, the light source 4 mounted on the surface of the substrate 5 (surface on the arrow Z1 direction side) includes an LED 41 having a blue emission peak wavelength and the LED 41 on the surface of the substrate 5 (arrow Z1 direction side). The resin bonding material 44 provided for fixing to the surface) and the resin circle provided to surround the periphery of the LED 41 on the surface of the substrate 5 (surface on the arrow Z1 direction side). An annular wall member 42, a resin sealing material 43 (see FIGS. 7 and 8) filled in a space surrounded by the annular wall member 42, and the surface of the substrate 5 (in the direction of the arrow Z1) Surface) between the LED 41 and the wall member 42, and includes a metal conductive portion 45 and a metal wire 46 for supplying power to the LED 41. The LED 41 is an example of the “light emitting element” in the present invention. Moreover, in FIG. 3, illustration of the sealing material 43 is abbreviate | omitted for convenience of explanation.

また、図４に示すように、封止材４３は、壁部材４２の内側に、ＬＥＤ４１と、接合材４４と、ワイヤ４６とを隙間なく覆うように充填され、壁部材４２は、壁部材４２の外側に封止材４３がはみ出すのを塞き止めるように構成されている。また、基板５の表面上の接合材４４に対応する部分の裏側（矢印Ｚ２方向側の面）および壁部材４２に対応する部分の裏面（矢印Ｚ２方向側の面）に接触するように、放熱プレート６が配置されている。ここで、第１実施形態では、樹脂製の接合材４４および樹脂製の壁部材４２は、シリコーン樹脂にＬＥＤ４１から発せられた光を反射するための反射材として、酸化フィラーの一種である酸化亜鉛を約６５％含有させた同じ材料により構成されている。また、封止材４３は、シリコーン樹脂に黄色が蛍光ピーク波長となる蛍光材および拡散材を含めたものにより構成されている。これにより、ＬＥＤ４１から発せられた青色の光と、蛍光材の黄色の光の混合によって、白色光を作り出すことが可能となる。また、壁部材４２のＬＥＤ４１側の表面は、直線状に傾斜する傾斜面４２ａを含む。これにより、傾斜面４２ａによって、ＬＥＤ４１から横方向（Ｙ方向）に出射された光が上方向（矢印Ｚ１方向）に反射される。 As shown in FIG. 4, the sealing material 43 is filled inside the wall member 42 so as to cover the LED 41, the bonding material 44, and the wire 46 without any gaps. The sealing material 43 is configured to be blocked from protruding outside. Further, heat is dissipated so as to come into contact with the back side (surface on the arrow Z2 direction side) of the portion corresponding to the bonding material 44 on the surface of the substrate 5 and the back surface (surface on the arrow Z2 direction side) of the portion corresponding to the wall member 42. A plate 6 is arranged. Here, in the first embodiment, the resin bonding material 44 and the resin wall member 42 are zinc oxide, which is a kind of oxide filler, as a reflective material for reflecting the light emitted from the LED 41 to the silicone resin. Is made of the same material containing about 65%. The sealing material 43 is made of a silicone resin including a fluorescent material and a diffusing material whose yellow has a fluorescent peak wavelength. Thereby, it becomes possible to produce white light by mixing the blue light emitted from the LED 41 and the yellow light of the fluorescent material. Further, the surface of the wall member 42 on the LED 41 side includes an inclined surface 42a that is inclined linearly. Thereby, the light emitted in the lateral direction (Y direction) from the LED 41 is reflected upward (in the direction of the arrow Z1) by the inclined surface 42a.

次に、図１〜図１３を参照して、第１実施形態によるＬＥＤ電球１００の製造工程について説明する。 Next, with reference to FIGS. 1-13, the manufacturing process of the LED bulb 100 by 1st Embodiment is demonstrated.

まず、図５に示すように、基板５は、基板５の表面（矢印Ｚ１方向側の面）においてＬＥＤ４１に電力を供給するための金属製の導電部４５を備えている。なお、基板５はガラスエポキシ樹脂を含み、基板に直接素子を取り付け、回路パターンと接続することが可能なＣＯＢ（ＣｈｉｐＯｎＢｏａｒｄ）基板により構成されている。また、ＬＥＤ４１は青色を発光ピーク波長とするＬＥＤにより構成されている。 First, as illustrated in FIG. 5, the substrate 5 includes a metal conductive portion 45 for supplying power to the LED 41 on the surface of the substrate 5 (the surface on the arrow Z1 direction side). The substrate 5 includes a glass epoxy resin, and is configured by a COB (Chip On Board) substrate that can be directly attached to the substrate and connected to a circuit pattern. Moreover, LED41 is comprised by LED which makes blue light emission peak wavelength.

次に、図６および図７に示すように、転写部材８を、皿（図示せず）の上に準備された接合材４４および壁部材４２の材料である酸化亜鉛を約６５％含有したシリコーン樹脂に浸すことにより、転写部材８の接合材転写部８１と壁部材転写部８２とに、材料を付着させる。次に、基板５の表面（矢印Ｚ１方向側の面）においてＬＥＤ４１と壁部材４２の間に設けられ、ＬＥＤ４１に電力を供給するための金属製の導電部４５の位置をカメラ８ａにより構成される位置認識装置で認識する。ここで、第１実施形態では、位置認識装置による認識により得られた導電部４５の位置情報を基準にして、予め基準からの位置が指定されているＬＥＤ４１の配置予定位置５ａに接合材４４が形成されるように、基板５に対して接合材４４および壁部材４２を形成するための転写部材８を基板５の近傍に配置する（転写部材８を移動させ、転写部材８を基板５に接近または接触させる）ことによって、基板５に接合材４４および壁部材４２の材料を塗布（転写）し、接合材４４および壁部材４２を同時に形成する。なお、転写部材８は、本発明の「接合材壁部材形成装置」の一例である。 Next, as shown in FIGS. 6 and 7, the transfer member 8 is a silicone containing about 65% of zinc oxide, which is a material of the bonding material 44 and the wall member 42 prepared on a dish (not shown). By dipping in the resin, the material is adhered to the bonding material transfer portion 81 and the wall member transfer portion 82 of the transfer member 8. Next, the position of a metal conductive portion 45 provided between the LED 41 and the wall member 42 on the surface of the substrate 5 (the surface on the arrow Z1 direction side) for supplying power to the LED 41 is configured by the camera 8a. Recognize with position recognition device. Here, in the first embodiment, the bonding material 44 is disposed at the planned arrangement position 5a of the LED 41 in which the position from the reference is designated in advance, based on the position information of the conductive portion 45 obtained by recognition by the position recognition device. The transfer member 8 for forming the bonding material 44 and the wall member 42 with respect to the substrate 5 is disposed in the vicinity of the substrate 5 so as to be formed (the transfer member 8 is moved and the transfer member 8 is moved closer to the substrate 5). In other words, the bonding material 44 and the wall member 42 are applied (transferred) to the substrate 5 to form the bonding material 44 and the wall member 42 at the same time. The transfer member 8 is an example of the “joining material wall member forming apparatus” in the present invention.

なお、図８〜図１０に示すように、転写部材８は、接合材転写部８１と、壁部材転写部８２と、転写部材保持部８３とを備え、タングステンなどの金属により構成されている。また、壁部材転写部８２は、平面視において、円筒形状に形成されている。また、接合材転写部８１は、平面視において、壁部材転写部８２の中央部近傍に、惰円形状に形成されているとともに、柱状を有する。転写部材保持部８３は、円柱形状を有している。 As shown in FIGS. 8 to 10, the transfer member 8 includes a bonding material transfer portion 81, a wall member transfer portion 82, and a transfer member holding portion 83, and is made of a metal such as tungsten. Further, the wall member transfer portion 82 is formed in a cylindrical shape in plan view. The bonding material transfer portion 81 is formed in an ellipse shape in the vicinity of the center portion of the wall member transfer portion 82 in a plan view and has a column shape. The transfer member holding part 83 has a cylindrical shape.

そして、第１実施形態では、図１１および図１２に示すように、カメラ８ａにより構成される位置認識装置による認識により得られた位置情報を基準として、予め基準からの位置が指定されているＬＥＤ４１の配置予定位置５ａに吸着ノズル８ｂにより構成される発光素子配置装置を用いてＬＥＤ４１を配置する。その後、基板５を１５０℃の雰囲気中に４時間放置し、接合材４４および壁部材４２を硬化させる。そして、金属製のワイヤ４６をＬＥＤ４１と導電部４５の間に接着する。 In the first embodiment, as shown in FIGS. 11 and 12, the LED 41 whose position from the reference is designated in advance with reference to the position information obtained by the recognition by the position recognition device constituted by the camera 8a. The LED 41 is arranged at the planned arrangement position 5a using a light emitting element arrangement device constituted by the suction nozzle 8b. Thereafter, the substrate 5 is left in an atmosphere of 150 ° C. for 4 hours to cure the bonding material 44 and the wall member 42. Then, a metal wire 46 is bonded between the LED 41 and the conductive portion 45.

そして、図１３に示すように、黄色の蛍光ピーク波長の蛍光体と拡散体とを含むシリコーン樹脂をディスペンサー等により構成される封止樹脂滴下装置（図示せず）により壁部材４２の内側の領域の基板５の表面に対して凸状に盛り上がるように封止材４３を塗布する。その後、基板５を１５０℃の雰囲気中に５時間放置し、封止材４３を硬化させる。 And as shown in FIG. 13, the area | region inside the wall member 42 by the sealing resin dripping apparatus (not shown) comprised by the dispenser etc. about the silicone resin containing the fluorescent substance and diffuser of yellow fluorescence peak wavelength. The sealing material 43 is applied so as to rise in a convex shape with respect to the surface of the substrate 5. Thereafter, the substrate 5 is left in an atmosphere of 150 ° C. for 5 hours to cure the sealing material 43.

また、図４に示すように、第１実施形態では、基板５の表面に対する壁部材４２の突出高さ（Ｚ方向の高さ）Ｈ１は、基板５の表面に対するＬＥＤ４１の上面の高さＨ２よりも低くなるように構成されている。また、基板５の表面に対するＬＥＤ４１の上面の高さＨ２は、封止材４３の頂部４３ａの突出高さＨ３よりも低くなるように構成されている。すなわち、Ｈ１とＨ２とＨ３との関係は、Ｈ１＜Ｈ２＜Ｈ３となるように形成する。 As shown in FIG. 4, in the first embodiment, the protruding height (height in the Z direction) H <b> 1 of the wall member 42 with respect to the surface of the substrate 5 is higher than the height H <b> 2 of the upper surface of the LED 41 with respect to the surface of the substrate 5. Is also configured to be low. The height H2 of the upper surface of the LED 41 with respect to the surface of the substrate 5 is configured to be lower than the protruding height H3 of the top portion 43a of the sealing material 43. That is, the relationship between H1, H2, and H3 is formed so that H1 <H2 <H3.

そして、図１〜図３に示すように、ＰＥＴ（ポリエチレンテレフタラート）などの樹脂により構成されている反射シート７と、アルミニウムなどの金属により構成されている放熱プレート６と、表面（矢印Ｚ１方向側の面）に複数（１６個）の光源４が実装された基板５とを、本体部１に取り付けるとともに、半球状のカバーレンズ２を、本体部１を覆うように取り付け、ＬＥＤ電球１００が完成する。 And as shown in FIGS. 1-3, the reflective sheet 7 comprised by resin, such as PET (polyethylene terephthalate), the thermal radiation plate 6 comprised by metals, such as aluminum, and the surface (arrow Z1 direction) A plurality of (16) light sources 4 mounted on the side surface) are attached to the main body 1, and a hemispherical cover lens 2 is attached so as to cover the main body 1. Complete.

第１実施形態では、上記のように、基板５に対して接合材４４および壁部材４２を形成するための転写部材８を基板５の近傍に配置する工程と、転写部材８を用いて、ＬＥＤ４１を配置する予定の基板５の表面の配置予定位置５ａに、ＬＥＤ４１を固定させるための接合材４４を形成するのと同時に、配置予定位置５ａを取り囲むように壁部材４２を形成する工程とを備える。これにより、工程数を減少させることができるので、その分、製造プロセスを簡略化することができる。また、接合材４４と壁部材４２との間の相対的な位置の調整を同時に行うことができるので、接合材４４を形成する位置と壁部材４２を形成する位置との間の相対的な位置の精度を向上することができる。 In the first embodiment, as described above, the step of arranging the transfer member 8 for forming the bonding material 44 and the wall member 42 with respect to the substrate 5 in the vicinity of the substrate 5, and the transfer member 8, the LED 41 is used. Forming the bonding material 44 for fixing the LED 41 at the planned placement position 5a on the surface of the substrate 5 to be placed, and simultaneously forming the wall member 42 so as to surround the planned placement position 5a. . Thereby, since the number of steps can be reduced, the manufacturing process can be simplified correspondingly. Further, since the relative position between the bonding material 44 and the wall member 42 can be adjusted simultaneously, the relative position between the position where the bonding material 44 is formed and the position where the wall member 42 is formed. Accuracy can be improved.

また、第１実施形態では、上記のように、接合材４４と壁部材４２とを、同じ材料で形成する工程を含む。これにより、接合材４４の材料と壁部材４２の材料とを別々に準備する必要がなくなるので、ＬＥＤ電球１００の製造方法を簡略化することができる。 Moreover, in 1st Embodiment, the process of forming the joining material 44 and the wall member 42 with the same material as mentioned above is included. Thereby, since it becomes unnecessary to prepare the material of the joining material 44 and the material of the wall member 42 separately, the manufacturing method of the LED bulb 100 can be simplified.

また、第１実施形態では、上記のように、接合材４４と壁部材４２とを、互いに同じ無機フィラーを含有するとともに、無機フィラーの含有率が等しい同じ材料で形成する工程を含む。これにより、別々に無機フィラーを含有させる必要がなくなるので、ＬＥＤ電球１００の製造方法をより簡略化することができる。 In the first embodiment, as described above, the bonding material 44 and the wall member 42 include a step of forming the same material with the same inorganic filler and the same content of the inorganic filler. Thereby, since it becomes unnecessary to contain an inorganic filler separately, the manufacturing method of the LED bulb 100 can be simplified more.

また、第１実施形態では、上記のように、基板５の表面に設けたＬＥＤ４１へ電力を供給するための導電部４５の位置を基準にして、ＬＥＤ４１を固定させるための接合材４４および壁部材４２を同時に形成する工程を含み、導電部４５の位置を基準にして接合材４４を配置されたＬＥＤ４１の配置予定位置５ａにＬＥＤ４１を配置する工程を備える。これにより、接合材４４および壁部材４２の形成と、ＬＥＤ４１の配置予定位置５ａにＬＥＤ４１を配置することとが、同一の位置基準に基づいて行われるので、ＬＥＤ４１の配置位置と壁部材を形成する位置との間の相対的な位置の精度を向上させることができる。その結果、ＬＥＤ４１と壁部材４２の内側の領域で基板５の表面に対して凸状に盛り上がるように形成される封止材４３との位置の精度も向上させることができるので、封止材４３を介して発光される光の色度がばらつくのを効果的に抑制することができる。 In the first embodiment, as described above, the bonding material 44 and the wall member for fixing the LED 41 on the basis of the position of the conductive portion 45 for supplying power to the LED 41 provided on the surface of the substrate 5. Including the step of forming the LEDs 42 at the same time, including the step of arranging the LEDs 41 at the planned arrangement positions 5a of the LEDs 41 where the bonding material 44 is arranged with reference to the positions of the conductive portions 45. Accordingly, the formation of the bonding material 44 and the wall member 42 and the placement of the LED 41 at the planned placement position 5a of the LED 41 are performed based on the same position reference, so that the placement position of the LED 41 and the wall member are formed. The accuracy of the relative position between the positions can be improved. As a result, the position accuracy between the LED 41 and the sealing material 43 formed so as to rise in a convex shape with respect to the surface of the substrate 5 in the region inside the wall member 42 can be improved. It is possible to effectively suppress variation in chromaticity of light emitted through the light source.

また、第１実施形態では、上記のように、ＬＥＤ４１の上面の基板５の表面に対する高さよりも、壁部材４２の上端部の基板５の表面に対する高さが低くなるように壁部材４２を形成する（Ｈ１＜Ｈ２となるように形成する）。これにより、壁部材４２の上端部の基板５の表面に対する高さが低く形成される分、壁部材４２の材料を少なくすることができる。 In the first embodiment, as described above, the wall member 42 is formed such that the height of the upper end portion of the wall member 42 with respect to the surface of the substrate 5 is lower than the height of the upper surface of the LED 41 with respect to the surface of the substrate 5. (H1 <H2 is formed). Accordingly, the material of the wall member 42 can be reduced by the amount that the height of the upper end portion of the wall member 42 with respect to the surface of the substrate 5 is formed low.

また、第１実施形態では、上記のように、転写部材８を用いて接合材４４と壁部材４２とを基板５の表面に同時に転写することによって、接合材４４と壁部材４２とを同時に基板５の表面に形成する。これにより、転写部材８は、容易に、ＬＥＤ４１が配置される予定の基板５の表面の配置予定位置５ａに、ＬＥＤ４１を固定させるための接合材４４を形成するのと同時に、配置予定位置５ａを取り囲むように壁部材４２を形成することができる。 In the first embodiment, as described above, the bonding material 44 and the wall member 42 are simultaneously transferred to the surface of the substrate 5 by using the transfer member 8, so that the bonding material 44 and the wall member 42 are simultaneously transferred to the substrate. 5 is formed on the surface. As a result, the transfer member 8 easily forms the bonding planned position 5a at the same time as the bonding material 44 for fixing the LED 41 is formed at the planned layout position 5a on the surface of the substrate 5 on which the LED 41 is to be disposed. The wall member 42 can be formed so as to surround it.

（第２実施形態）
次に、図１４を参照して、第２実施形態によるＬＥＤ電球（電球型照明装置）１０１の構成について説明する。第２実施形態では、１つの壁部材中に１つの接合材を形成し、１つの接合材上に１つの発光素子を配置する第１実施形態によるＬＥＤ電球（電球型照明装置）１００と異なり、１つの壁部材中に２つの接合材を形成し、２つの接合材上に、各々１つずつ発光素子を配置する。 (Second Embodiment)
Next, with reference to FIG. 14, the structure of the LED bulb (bulb-type lighting device) 101 according to the second embodiment will be described. In the second embodiment, unlike the LED bulb (bulb-type lighting device) 100 according to the first embodiment in which one bonding material is formed in one wall member and one light emitting element is arranged on one bonding material, Two bonding materials are formed in one wall member, and one light emitting element is arranged on each of the two bonding materials.

図１４に示すように、基板５の表面（矢印Ｚ１方向側の面）に実装された光源４ａは、２つのＬＥＤ４１（図１４では図示せず）と、２つのＬＥＤ４１を基板５の表面（矢印Ｚ１方向側の面）に固定するために設けられた樹脂製の２つの接合材４４と、基板５の表面（矢印Ｚ１方向側の面）において２つのＬＥＤ４１の周囲を円周状に取り囲むように設けられた樹脂製の１つの円環状の壁部材４２とにより構成されている。また、第２実施形態によるＬＥＤ電球（電球型照明装置）１０１のその他の構成は、上記第１実施形態と同様である。なお、第２実施形態では、１つ壁部材４２と、２つの接合材４４とを同時に形成できるように、転写部材は、２つの接合材転写部と、１つの壁部材転写部と、１つの転写部材保持部とを備えている。 As shown in FIG. 14, the light source 4a mounted on the surface of the substrate 5 (surface on the arrow Z1 direction side) includes two LEDs 41 (not shown in FIG. 14) and two LEDs 41 on the surface of the substrate 5 (arrows). The two resin-made bonding materials 44 provided for fixing to the Z1 direction side surface and the periphery of the two LEDs 41 on the surface of the substrate 5 (the surface on the arrow Z1 direction side) are circumferentially surrounded. It is constituted by one annular wall member 42 made of resin. The other configuration of the LED bulb (bulb-type lighting device) 101 according to the second embodiment is the same as that of the first embodiment. In the second embodiment, the transfer member includes two bonding material transfer portions, one wall member transfer portion, and one piece so that one wall member 42 and two bonding materials 44 can be formed simultaneously. And a transfer member holding part.

このように、第２実施形態による光源４ａでは、上記第１実施形態の光源４とは異なり、１つの円環状の壁部材４２内に、２つのＬＥＤ４１を配置して構成するので、１つの光源あたりの光強度を大きくすることができる。また、第２実施形態によるＬＥＤ電球（電球型照明装置）１０１のその他の効果は、上記第１実施形態と同様である。また、第２実施形態によるＬＥＤ電球（電球型照明装置）１０１の製造工程は、２つの接合材４４および２つのＬＥＤ４１を配置する点以外は、基本的に、上記第１実施形態によるＬＥＤ電球（電球型照明装置）１００の製造工程と同様である。 As described above, in the light source 4a according to the second embodiment, unlike the light source 4 of the first embodiment, two LEDs 41 are arranged in one annular wall member 42. Therefore, one light source The light intensity per hit can be increased. The other effects of the LED bulb (bulb-type lighting device) 101 according to the second embodiment are the same as those of the first embodiment. In addition, the manufacturing process of the LED bulb (bulb-type lighting device) 101 according to the second embodiment is basically the LED bulb (first embodiment) except that the two bonding materials 44 and the two LEDs 41 are arranged. This is the same as the manufacturing process of the light bulb type lighting device 100.

（第３実施形態）
次に、図１５を参照して、第３実施形態による樹脂滴下装置９について説明する。第３実施形態では、転写部材８を用いて接合材４４と壁部材４２とを基板５の表面に同時に転写することによって、接合材４４と壁部材４２とを同時に基板５の表面に形成していた、第１実施形態によるＬＥＤ電球（電球型照明装置）１００の製造工程と異なり、樹脂滴下装置９を用いて接合材４４と壁部材４２とを基板５の表面に同時に塗布することによって、接合材４４と壁部材４２とを同時に基板５の表面に形成する。なお、樹脂滴下装置９は、本発明の「接合材壁部材形成装置」の一例である。 (Third embodiment)
Next, with reference to FIG. 15, the resin dripping apparatus 9 by 3rd Embodiment is demonstrated. In the third embodiment, the bonding material 44 and the wall member 42 are simultaneously formed on the surface of the substrate 5 by simultaneously transferring the bonding material 44 and the wall member 42 to the surface of the substrate 5 using the transfer member 8. Further, unlike the manufacturing process of the LED bulb (bulb-type lighting device) 100 according to the first embodiment, the bonding material 44 and the wall member 42 are simultaneously applied to the surface of the substrate 5 by using the resin dropping device 9. The material 44 and the wall member 42 are simultaneously formed on the surface of the substrate 5. The resin dropping device 9 is an example of the “bonding material wall member forming device” in the present invention.

上記、樹脂滴下装置９は、図１５に示すように、接合材樹脂滴下部９１と、壁部材樹脂滴下部９２と、樹脂滴下装置保持部９３とを備える。壁部材樹脂滴下部９２は、平面視において、円筒形状に形成されており、壁部材樹脂滴下部９２の先端には、樹脂を滴下するための複数の円形状の壁部材樹脂滴下穴９５が所定の回転角度間隔で円状に設けられている。また、接合材樹脂滴下部９１は、平面視において、壁部材樹脂滴下部９２の中央部近傍に配置されるとともに、惰円形状に形成されている。また、接合材樹脂滴下部９１は、柱状を有する。接合材樹脂滴下部９１の先端には、樹脂を滴下するための楕円形状の接合材樹脂滴下穴９４が設けられている。 As shown in FIG. 15, the resin dropping device 9 includes a bonding material resin dropping portion 91, a wall member resin dropping portion 92, and a resin dropping device holding portion 93. The wall member resin dripping portion 92 is formed in a cylindrical shape in plan view, and a plurality of circular wall member resin dripping holes 95 for dripping the resin are predetermined at the tip of the wall member resin dripping portion 92. Are provided in a circular shape at intervals of the rotation angle. The bonding material resin dropping portion 91 is disposed in the vicinity of the center portion of the wall member resin dropping portion 92 in a plan view and is formed in an ellipse shape. Further, the bonding material resin dropping portion 91 has a column shape. An elliptical bonding material resin dropping hole 94 for dropping resin is provided at the tip of the bonding material resin dropping portion 91.

第３実施形態による、接合材４４および壁部材４２を同時に形成する工程では、まず、基板５の表面（矢印Ｚ１方向側の面）においてＬＥＤ４１と壁部材４２との間に設けられ、ＬＥＤ４１に電力を供給するための金属製の導電部４５の位置をカメラ８ａにより構成される位置認識装置で認識する。次に、位置認識装置による認識により得られた導電部４５の位置情報を基準にして、予め基準からの位置が指定されているＬＥＤ４１の配置予定位置５ａに接合材４４が形成されるように、基板５に対して接合材４４および壁部材４２を形成するための樹脂滴下装置９を基板５の近傍に配置し、樹脂滴下装置９から基板５の表面（矢印Ｚ１方向側の面）に接合材４４および壁部材４２の材料を滴下させることによって、接合材４４および壁部材４２を同時に形成する。このように、樹脂滴下装置９では、上記第１実施形態の転写部材８とは異なり、樹脂滴下装置９に材料を付着させる工程を行う必要がないので、工程数を減らすことが可能である。 In the step of simultaneously forming the bonding material 44 and the wall member 42 according to the third embodiment, first, the surface of the substrate 5 (the surface on the arrow Z1 direction side) is provided between the LED 41 and the wall member 42, and the LED 41 is supplied with power. The position of the metal conductive portion 45 for supplying the battery is recognized by a position recognition device constituted by the camera 8a. Next, on the basis of the position information of the conductive portion 45 obtained by recognition by the position recognition device, the bonding material 44 is formed at the planned placement position 5a of the LED 41 in which the position from the reference is designated in advance. A resin dropping device 9 for forming the bonding material 44 and the wall member 42 with respect to the substrate 5 is disposed in the vicinity of the substrate 5, and the bonding material is provided from the resin dropping device 9 to the surface of the substrate 5 (surface on the arrow Z1 direction side). By dripping the material of 44 and the wall member 42, the joining material 44 and the wall member 42 are formed simultaneously. Thus, unlike the transfer member 8 of the first embodiment, the resin dripping device 9 does not require a step of attaching a material to the resin dripping device 9, and thus the number of steps can be reduced.

なお、今回開示された実施形態および実施例は、すべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した実施形態の説明ではなく特許請求の範囲によって示され、さらに特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 The embodiments and examples disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

たとえば、上記第１〜第３実施形態では、本発明を照明装置の一例としてのＬＥＤ電球（電球型照明装置）に適用する例を示したが、本発明はこれに限らない。本発明は、電球型照明装置以外の照明装置にも適用可能である。たとえば、天井に設置するシーリングライトや、直管型照明装置にも適用可能である。 For example, in the first to third embodiments, an example in which the present invention is applied to an LED bulb (bulb-type lighting device) as an example of a lighting device has been shown, but the present invention is not limited to this. The present invention is also applicable to lighting devices other than the bulb-type lighting device. For example, the present invention can also be applied to a ceiling light installed on a ceiling and a straight tube illumination device.

また、上記第１〜第３実施形態では、発光素子の例として、ＬＥＤを用いる例を示したが、本発明はこれに限らない。本発明では、ＬＥＤ以外の発光素子を用いてもよい。 Moreover, in the said 1st-3rd embodiment, although the example using LED was shown as an example of a light emitting element, this invention is not restricted to this. In this invention, you may use light emitting elements other than LED.

また、上記第１〜第３実施形態では、基板の構成として、ガラスエポキシ樹脂製のＣＯＢ（ＣｈｉｐＯｎＢｏａｒｄ）基板を用いる例を示したが、本発明はこれに限らない。本発明では、ガラスエポキシ樹脂製のＣＯＢ（ＣｈｉｐＯｎＢｏａｒｄ）基板以外の基板を用いることも可能である。たとえば、セラミック製基板や、テフロン（登録商標）製基板を用いることも可能であり、ＤＩＰ（Ｄｕａｌ−ｉｎ−ｌｉｎｅｐａｃｋａｇｅ）基板、ＳＭＤ（ＳｕｒｆａｃｅＭｏｕｎｔＤｅｖｉｃｅ）基板を用いてもよい。 In the first to third embodiments, an example in which a COB (Chip On Board) substrate made of glass epoxy resin is used as the configuration of the substrate is shown, but the present invention is not limited to this. In the present invention, it is also possible to use a substrate other than a COB (Chip On Board) substrate made of glass epoxy resin. For example, a ceramic substrate, a Teflon (registered trademark) substrate, or a DIP (Dual-in-line package) substrate or an SMD (Surface Mount Device) substrate may be used.

また、上記第１〜第３実施形態では、接合材および壁部材に含有する無機フィラーの例として、酸化亜鉛を約６５％含有する例を示したが、本発明はこれに限らない。本発明では、接合材および壁部材に含有する無機フィラーとして、酸化亜鉛以外の無機フィラーを含有してもよい。たとえば、酸化チタン等でもよい。また、無機フィラーの含有率も６５％よりも大きくしてもよいし、６５％未満にしてもよい。 Moreover, in the said 1st-3rd embodiment, although the example which contains about 65% of zinc oxide was shown as an example of the inorganic filler contained in a joining material and a wall member, this invention is not limited to this. In this invention, you may contain inorganic fillers other than a zinc oxide as an inorganic filler contained in a joining material and a wall member. For example, titanium oxide may be used. Further, the content of the inorganic filler may be larger than 65% or smaller than 65%.

また、上記第１〜第３実施形態では、導電部が、長円形状を有するように構成する例を示したが、本発明はこれに限らない。本発明では、導電部は、長円形状以外の形状を有するように構成してもよい。たとえば、導電部が多角形状を有するように構成してもよい。 Moreover, in the said 1st-3rd embodiment, although the electroconductive part showed the example comprised so that it might have an ellipse shape, this invention is not limited to this. In the present invention, the conductive portion may be configured to have a shape other than an oval shape. For example, the conductive part may be configured to have a polygonal shape.

また、上記第１〜第３実施形態では、基板５に、２つの導電部が配置されている例を示したが、本発明はこれに限らない。本発明では、基板５に、導電部を２つ以外の数配置してもよい。たとえば、導電部の数を１つまたは、３つ以上にしてもよい。 Moreover, in the said 1st-3rd embodiment, although the example in which two electroconductive parts are arrange | positioned at the board | substrate 5 was shown, this invention is not limited to this. In the present invention, a number other than two conductive portions may be arranged on the substrate 5. For example, the number of conductive parts may be one or three or more.

また、上記第１〜第３実施形態では、１つの壁部材中に１つの接合材を形成し、１つの発光素子を設置する例と、１つの壁部材中に２つの接合材を形成し、２つの発光素子を設置する例とを示したが、本発明はこれに限らない。本発明では、１つの壁部材中に３つ以上の接合材を形成してもよいし、各々の接合材に２つ以上の発光素子を設置してもよい。 Moreover, in the said 1st-3rd embodiment, one joining material is formed in one wall member, the example which installs one light emitting element, and two joining materials are formed in one wall member, Although an example in which two light emitting elements are installed is shown, the present invention is not limited to this. In the present invention, three or more bonding materials may be formed in one wall member, or two or more light emitting elements may be installed in each bonding material.

また、上記第１〜第３実施形態では、１つまたは２つの接合材と１つの壁部材とを、同時に形成することができる転写部材（樹脂滴下装置）の例を示したが、本発明はこれに限らない。本発明では、２つ以上の壁部材および３つ以上の接合材を同時に形成することができるように転写部材（樹脂滴下装置）を構成してもよい。たとえば、照明装置に１６個の光源を備えている場合、１６個の接合材および壁部材を同時に形成できるような構造の転写部材（樹脂滴下装置）を用いてもよい。 In the first to third embodiments, an example of a transfer member (resin dripping device) capable of simultaneously forming one or two bonding materials and one wall member has been shown. Not limited to this. In this invention, you may comprise a transfer member (resin dripping apparatus) so that two or more wall members and three or more joining materials can be formed simultaneously. For example, when the lighting device includes 16 light sources, a transfer member (resin dropping device) having a structure capable of simultaneously forming 16 bonding materials and wall members may be used.

また、上記第１〜第３実施形態では、樹脂を１５０℃の雰囲気中で硬化させる工程の例を示したが、本発明はこれに限らない。本発明では、樹脂を硬化させる温度を１５０℃にしなくてもよいし、硬化させなくてもよい。 Moreover, in the said 1st-3rd embodiment, although the example of the process of hardening resin in 150 degreeC atmosphere was shown, this invention is not limited to this. In the present invention, the temperature at which the resin is cured does not have to be 150 ° C., or does not have to be cured.

また、上記第１〜第３実施形態では、黄色が蛍光ピーク波長となる蛍光材を含んだ封止材と、青色が発光ピーク波長となるＬＥＤとにより、白色光を作り出す例を示したが、本発明はこれに限らない。本発明では、蛍光ピーク波長が黄色以外となる蛍光材を含んだ封止材と、青発光ピーク波長が青色以外となるＬＥＤとにより、白色光を作り出してもよい。たとえば、青色が蛍光ピーク波長となる蛍光材と、緑色が蛍光ピーク波長となる蛍光材と、赤色が蛍光ピーク波長となる蛍光材とを含んだ封止材と、紫外色が発光ピーク波長となるＬＥＤとにより、白色光を作り出してもよい。 In the first to third embodiments, an example in which white light is generated by a sealing material including a fluorescent material whose yellow has a fluorescence peak wavelength and an LED whose blue has an emission peak wavelength has been described. The present invention is not limited to this. In the present invention, white light may be produced by a sealing material including a fluorescent material having a fluorescence peak wavelength other than yellow and an LED having a blue emission peak wavelength other than blue. For example, a sealing material containing a fluorescent material with blue having a fluorescent peak wavelength, a fluorescent material with green having a fluorescent peak wavelength, a fluorescent material having red with a fluorescent peak wavelength, and an ultraviolet color having an emission peak wavelength. White light may be produced by the LED.

５基板
５ａ配置予定位置
８転写部材（接合材壁部材形成装置）
９樹脂滴下装置（接合材壁部材形成装置）
４１ＬＥＤ（発光素子）
４２壁部材
４４接合材
４５導電部
１００、１０１ＬＥＤ電球（照明装置） 5 Substrate 5a Arrangement position 8 Transfer member (bonding material wall member forming device)
9 Resin dripping device (joining material wall member forming device)
41 LED (light emitting element)
42 Wall member 44 Bonding material 45 Conductive part 100, 101 LED bulb (lighting device)

Claims

Arranging a bonding material wall member forming device for forming a bonding material and a wall member on the substrate in the vicinity of the substrate;
At the same time as forming the bonding material for fixing the light emitting element at the planned arrangement position on the surface of the substrate on which the light emitting element is to be arranged, using the bonding material wall member forming apparatus The manufacturing method of the illuminating device provided with the joining material wall member formation process which forms a wall member so that it may surround.

The said joining material wall member formation process is a manufacturing method of the illuminating device of Claim 1 including the process of forming the said joining material and the said wall member with the same material.

The said joining material wall member formation process includes the process of forming the said joining material and the said wall member with the same material with the same content rate of the said inorganic filler while containing the mutually same inorganic filler. Method of manufacturing a lighting device.

In the bonding material wall member forming step, the bonding material and the wall for fixing the light emitting element on the basis of the position of a conductive portion for supplying electric power to the light emitting element provided on the surface of the substrate Including simultaneously forming members;
The light emitting element arrangement | positioning process which arrange | positions the said light emitting element in the said arrangement | positioning planned position of the said light emitting element by which the said bonding material is arrange | positioned on the basis of the position of the said electroconductive part is provided in any one of Claims 1-3. The manufacturing method of the illuminating device of description.

In the bonding material wall member forming step, the surface of the substrate at the upper end portion of the wall member is higher than the height of the upper surface of the light emitting element with respect to the surface of the substrate when the light emitting element is disposed at the planned placement position. The manufacturing method of the illuminating device of any one of Claims 1-4 including the process of forming the said wall member so that the height with respect to may become low.

The bonding material wall member forming apparatus includes a transfer member,
In the bonding material wall member forming step, the bonding material and the wall member are simultaneously transferred onto the surface of the substrate by using the transfer member to simultaneously transfer the bonding material and the wall member onto the surface of the substrate. The manufacturing method of the illuminating device of any one of Claims 1-5 including the process to form.

A light emitting element;
A substrate on which the light emitting element is mounted;
A bonding material for fixing the light emitting element to the substrate;
A wall member provided to surround the light emitting element on the surface of the substrate,
The said joining material and the said wall member are lighting apparatuses currently formed with the same material.

The lighting device according to claim 7, wherein the bonding material and the wall member are made of the same material containing the same inorganic filler and having the same content of the inorganic filler.