JP2014213410A - Shot-peening apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make one apparatus efficiently perform the treatment for one surface of a tabular spring and the treatment for the other surface of the tabular spring.SOLUTION: A shot-peening apparatus 10 comprises: a projection chamber; holding parts (36a, 36b) that can hold a tabular spring in the projection chamber; projection devices 18a, 18b that keep the projection speed adjustable and project a projection material to the tabular spring W held by the holding parts in the projection chamber; and a position adjustment mechanism 30 that can adjust the positional relation between the holding parts and the projection devices to the first positional relation where the projection material from the projection devices is projected to one surface 52 of the tabular spring W held by the holding parts and the second positional relation where the projection material from the projection devices is projected to the other surface 54 of the tabular spring W held by the holding parts.

Description

  The technology disclosed in this specification relates to a shot peening apparatus.

  In order to improve the mechanical properties (for example, fatigue strength) of the workpiece, a shot peening process may be performed on the surface of the workpiece. Patent Document 1 discloses an example of a conventional shot peening apparatus.

Japanese Patent Laid-Open No. 4-304956

  For example, some plate-like springs have a tensile stress acting on one surface and a compressive stress acting on the other surface in use. In such a plate-like spring, shot peening for improving fatigue strength is performed on the surface on which tensile stress acts. On the other hand, instead of improving the fatigue strength, a scale removal process (a kind of shot peening process) for removing scale (oxide film) formed on the surface by heat treatment or the like is performed on the surface on which the compressive stress acts. Both shot peening and scale removal can be performed by projecting the projection material onto the surface of the plate-like spring, but the projection speed of the projection material is different. That is, in the shot peening process, the projection speed of the projection material is fast, and in the scale removal process, the projection speed of the projection material is slow. Moreover, in the conventional shot peening apparatus, the position of the projection apparatus is fixed with respect to the workpiece. For this reason, in order to project a projection material on both surfaces of a plate-shaped spring, after processing one surface of a plate-shaped spring, the plate-shaped spring is processed so that the other surface of a plate-shaped spring is processed. Must be re-set on the shot peening machine. For this reason, conventionally, a shot peening apparatus for performing shot peening treatment on one surface of a plate spring and a shot peening apparatus for performing scale removal processing on the other surface of the plate spring are separately provided. It was provided.

  The present specification discloses a shot peening apparatus capable of efficiently performing a process performed on one surface of a plate-shaped spring and a process performed on the other surface of the plate-shaped spring with a single apparatus. To do.

  The shot peening apparatus disclosed in this specification is an apparatus that performs shot peening on the surface of a plate-shaped spring, and includes a projection chamber, a holding unit, a projection apparatus, and a position adjustment mechanism. The holding part can hold a plate-like spring in the projection chamber. The projection device can adjust the projection speed, and projects the projection material onto a plate-like spring held by the holding unit in the projection chamber. The position adjustment mechanism includes a first positional relationship in which the projection material from the projection device is projected onto one surface of the plate-like spring held by the holding unit, and the other of the plate-like spring held by the holding unit. The positional relationship between the holding unit and the projection device can be adjusted to the second positional relationship in which the projection material from the projection device is projected onto the surface.

  In this shot peening apparatus, processing is performed by projecting a projection material onto a plate-like spring held by a holding unit in a projection chamber. Here, the shot peening apparatus includes a position adjustment mechanism that can adjust the positional relationship between the holding unit that holds the plate-like spring and the projection apparatus. Moreover, the projection apparatus can adjust the projection speed of the projection material. For this reason, first, the projection material is projected onto the one surface of the plate-like spring at a first speed, and then the position adjustment mechanism is driven to project the projection material on the other surface of the plate-like spring. Can be projected at a second speed onto the other surface of the plate-like spring by adjusting the positional relationship between the holding unit and the projection device. For this reason, even if it does not reset a plate-shaped spring, a projection material can be projected by different projection speed on both surfaces of a plate-shaped spring with one apparatus.

The figure which shows the leaf | plate spring processed with the shot peening apparatus of an Example. The top view which shows typically schematic structure of the shot peening apparatus of an Example. The block diagram which shows the structure of the control system of the shot peening apparatus of an Example. The flowchart which shows the procedure of the process implemented using the shot peening apparatus of an Example. The figure which shows typically the leaf | plate spring hold | maintained at the holding | maintenance part, and the stress provision mechanism which provides a stress to the leaf | plate spring. The figure which shows typically the state which projects a projection material on the surface where the tensile stress of a leaf | plate spring acts. The figure which shows typically the state which projects a projection material on the surface where the compressive stress of a leaf | plate spring acts. The figure which shows typically the other structure of the holding | maintenance part holding a leaf | plate spring.

  The main features of the embodiments described below are listed. The technical elements described below are independent technical elements and exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Absent.

(Characteristic 1) In said shot peening apparatus, the projection apparatus may be fixed with respect to the projection chamber. In this case, the position adjustment mechanism may change the position of the holding unit with respect to the projection device. According to such a configuration, the device configuration can be simplified.

(Characteristic 2) In said shot peening apparatus, the position adjustment mechanism may be equipped with the rotation mechanism which rotates a holding | maintenance part with respect to a rotating shaft. And the state where the projection material from the projection device is projected onto one surface of the plate-like spring held by the holding unit by rotating the holding unit with respect to the rotation shaft, and the plate held by the holding unit You may switch to the state by which the projection material from a projection apparatus is projected on the other surface of a shaped spring. By using the rotation mechanism, it is possible to easily switch between a state in which the projection material is projected on one surface of the plate-like spring and a state in which the projection material is projected on the other surface.

(Characteristic 3) In said shot peening apparatus, the holding | maintenance part may be provided with the 1st part holding one end of a plate-shaped spring, and the 2nd part holding the other end of a plate-shaped spring. And when a plate-shaped spring is hold | maintained at a 1st part and a 2nd part, you may make it be in the state which a plate-shaped spring is extended in the up-down direction. According to such a configuration, an area necessary for installing the shot peening apparatus can be reduced.

(Characteristic 4) In the above shot peening apparatus, the holding unit switches the stress applied to the plate-like springs held by the first part and the second part between a state where stress is applied and a state where no stress is applied. A mechanism may be further provided. According to such a configuration, the apparatus configuration can be simplified as compared with a case where a stress applying mechanism is provided separately. Here, “applying stress” means applying stress to the workpiece in a direction acting during use. For example, in the case where one surface of a plate-like spring is shot peened, when a tensile stress acts on one surface during use, this means that a tensile stress is applied to the one surface.

(Characteristic 5) In the above shot peening apparatus, an input chamber for loading a work into the shot peening apparatus, a carry-out chamber for unloading the work from the shot peening apparatus, a holding unit being transferred from the input chamber to the projection chamber, There may be further provided a transport device for transporting the holding unit transported to the carry-out chamber from the projection chamber. In a state where the holding unit is transported to the input chamber and the unloading chamber, the workpiece may be detachable from the holding unit. According to such a configuration, a plate-like spring (work) is attached to the holding portion in the charging chamber, and the plate-like spring is conveyed while being held by the holding portion. The plate-like spring processed in the projection chamber can be removed from the holding portion in the carry-out chamber.

(Characteristic 6) In the above shot peening apparatus, the input chamber and the carry-out chamber may be the same. Further, the transport device may include a turntable to which the holding unit is attached and a drive source that rotationally drives the turntable. And by rotating a turntable, the workpiece | work hold | maintained at the holding | maintenance part and the holding | maintenance part may be made to be conveyed from an injection chamber to a carry-out chamber while being conveyed to a projection chamber. According to such a configuration, the plate-like spring can be loaded and unloaded into the shot peening apparatus at the same position, so that an operator or a robot for loading and unloading may be arranged at one place. Moreover, space saving can be realized by using a turntable.

  Hereinafter, a shot peening apparatus 10 according to an embodiment will be described with reference to the drawings. The shot peening apparatus 10 is an apparatus for treating the surface of a leaf spring used in a leaf type suspension installed in an automobile or the like. First, the leaf spring W to be processed will be briefly described. As shown in FIG. 1, the leaf spring W is a plate-like spring, and is curved so as to be convex toward one surface 52 (upper surface in FIG. 1). That is, one surface 52 (upper surface in FIG. 1) of the leaf spring W is a convex surface, and the other surface 54 (lower surface in FIG. 1) is a concave surface. Eyeballs 56 are formed at both ends of the leaf spring W. When the leaf spring W is mounted on the automobile, a support shaft (bibot or shackle) on the vehicle body side is attached to the eyeball 56. When the leaf spring W is attached to the vehicle body, a force acts on the leaf spring W in the direction of the arrow 58. As a result, compressive stress acts on one surface 52 of the leaf spring W, and tensile stress acts on the other surface 54. For this reason, the other surface 54 of the leaf spring W needs to be shot peened for improving durability, and the one surface 52 of the leaf spring W is subjected to a scale removal treatment for removing scale (oxide film). Is required. In addition, a leaf type suspension is usually used by superposing a plurality of leaf springs (however, only one leaf spring is used). In the case of using a laminated leaf spring in which a plurality of leaf springs are overlapped, the centerpiece is formed only in some leaf springs (one or two leaf springs (so-called parent springs)), and the others No eyeball is formed on the leaf spring. In addition, in order to superimpose the plurality of leaf springs, an assembly step of assembling the plurality of leaf springs is performed before being installed in the automobile.

  Next, the shot peening apparatus 10 of the present embodiment will be described. As shown in FIG. 2, the shot peening apparatus 10 includes a housing 12 and a turntable 14 accommodated in the housing 12.

  The housing 12 is formed in a cylindrical shape with its upper end and lower end closed. An opening 12 a is formed on the side surface of the housing 12. The opening 12 a is used to carry the leaf spring W into or out of the housing 12. The leaf spring W (the leaf spring shown on the right side of FIG. 2) carried in from the opening 12a is held by a holding jig 36 attached to the turntable 14 as will be described later. Loading and unloading of the leaf spring W can be performed by an operator or a robot. Projectors 18 a and 18 b are attached to the side surface of the housing 12. The projection devices 18 a and 18 b are arranged at intervals in the circumferential direction, and are arranged on the side opposite to the opening 12 a when viewed from the center of the housing 12. The projection ports of the projection devices 18a and 18b are opposed to a leaf spring W (a leaf spring W shown on the left side in FIG. 2) held at the projection position.

  The projection devices 18a and 18b project a projection material by rotationally driving an impeller (not shown). The rotation speed of the impeller can be adjusted by a control device 20 (see FIG. 3) described later. By adjusting the rotation speed of the impeller, the projection speed of the projection material can be adjusted. In the present embodiment, the rotation shaft of the impeller extends in the horizontal direction, and the projection material projected from the projection devices 18a and 18b spreads in the vertical direction. As will be described later, when the leaf spring W is held by the holding jig 36 attached to the turntable 14, the longitudinal direction of the leaf spring W coincides with the vertical direction, and the projection material is projected in this state. Since the projection material projected from the projection devices 18a and 18b spreads in the vertical direction, the projection material can be efficiently projected onto the leaf spring W. Projection devices 18a and 18b are arranged at intervals in the circumferential direction, and the projection material is projected onto the leaf spring W from different directions. As a result, the projection material is projected onto the entire surface of the leaf spring W. Instead of arranging the projection device at intervals in the circumferential direction, the surface of the leaf spring is moved by moving the leaf spring (for example, swinging around its axis) when projecting the projection material from the projection device. You may make it project a projection material on the whole.

  The projection devices 18a and 18b are connected to a hopper (not shown) that stores the projection material. The hopper is disposed above the projection devices 18a and 18b, and the blast material recovered from the housing 12 is loaded into the hopper and stored therein. Then, the projection material stored in the hopper is supplied to the projection devices 18a and 18b.

  The turntable 14 is supported by the housing 12 and is rotatable around the axis of the housing 12. A table rotating mechanism 40 (see FIG. 3) is connected to the turntable 14. The table rotation mechanism 40 includes a motor (not shown). When the table rotating mechanism 40 is driven by the motor, the turntable 14 is driven to rotate within the housing 12.

  The turntable 14 includes a floor plate 13a, a partition plate 16, and a ceiling plate 13b (see FIGS. 5 to 7). The floor plate 13 a is a disk-shaped plate material and is disposed on the lower end side of the housing 12. A partition plate 16 projects from the upper surface of the floor plate 13a. The partition plate 16 is provided on a diameter passing through the center of the floor plate 13a, and extends perpendicular to the floor plate 13a. The partition table 16 divides the turntable 14 into two regions 15a and 15b. A ceiling plate 13b is fixed to the upper end of the partition plate 16 (see FIGS. 5 to 7). The ceiling board 13b is a disk-like board | plate material similarly to the floor board 13a, and is arrange | positioned in parallel with respect to the floor board 13a (namely, it is orthogonal to the partition plate 16). The ceiling plate 13 b is disposed on the upper end side of the housing 12.

  As shown in FIG. 2, each of the regions 15 a and 15 b partitioned by the partition plate 16 has a communication position that communicates with the opening 12 a of the housing 12 and the opening of the housing 12 by the partition plate 16 when the turntable 14 rotates. It can move to the isolation position isolated from 12a. In the state shown in FIG. 2, the region 15a is in the communication position, and the region 15b is in the isolation position. If each area | region 15a, 15b is located in a communicating position, the leaf | plate spring W can be thrown in or out in each area | region 15a, 15b. That is, when each area | region 15a, 15b exists in a communicating position, it can be said that each area | region 15a, 15b is located in an input chamber (= carry-out chamber). Further, when each of the regions 15a and 15b is located at the isolation position, the leaf spring W held in the region and the projection devices 18a and 18b face each other, and the projection material from the projection devices 18a and 18b is projected onto the leaf spring W. It becomes possible. That is, it can be said that when the areas 15a and 15b are in the isolation positions, the areas 15a and 15b are located in the projection chamber. As described above, in this embodiment, the projection chamber (the space where the region 15b is located in FIG. 2) and the input chamber (= the unloading chamber) (the space where the region 15a is located in FIG. 2) are formed in the housing 12. It can be said that In the present embodiment, the input chamber and the carry-out chamber are the same and are shared.

  5-7, in each area | region 15a, 15b formed in the turntable 14, the holding jig 36 (37, 38a, 38b) holding the leaf | plate spring W and the jig rotation which rotates the holding jig 36 are carried out. A mechanism 30 and a stress applying mechanism 22 that applies stress to the leaf spring W held by the holding jig 36 are provided. 5 to 7 show the mechanisms 22, 30, and 36 provided in the region 15b, the same mechanism is also provided in the region 15a.

  The holding jig 36 includes a hanger 37, a lower end receiving portion 38 a and an upper end receiving portion 38 b attached to the hanger 37. The upper end of the hanger 37 is hooked on the hook 34, and the lower end of the hanger 37 is rotatably supported by the floor board 13a. An upper end receiving portion 38 b is provided in the vicinity of the upper end portion of the hanger 37, and a lower end receiving portion 38 a is provided in the vicinity of the lower end portion of the hanger 37. The central portion of the hanger 37 is shifted in the radial direction from the rotation axis of the hanger 37, and the leaf spring W held by the upper end receiving portion 38b and the lower end receiving portion 38a is positioned in the vicinity of the rotation axis. .

  The lower end receiving portion 38a includes a recess opened upward, and the lower end (eyeball 56) of the leaf spring W can be held in the recess. The recess of the lower end receiving portion 38a has a shape that follows the lower end of the leaf spring W. The upper end receiving portion 38b has a recess opened downward, and the upper end (eyeball 56) of the leaf spring W can be held in the recess. The recess of the upper end receiving portion 38b has a shape that follows the upper end of the leaf spring W. The interval between the lower end receiving portion 38a and the upper end receiving portion 38b is set according to the free length of the leaf spring W (the length from the upper end to the lower end of the leaf spring W when no load is applied). Specifically, in a state where no load is applied to the leaf spring W, the corresponding end portions of the leaf spring W are received by the lower end receiving portion 38a and the upper end receiving portion 38b, and one of the receiving portions 38a or 38b It is set so that a gap is formed between the bottom surface of the recess and the leaf spring W. Therefore, when the leaf spring W is set on the lower end receiving portion 38a and the upper end receiving portion 38b, the plate spring W is not subjected to stress from the stress applying mechanism 22 (the state shown in FIGS. 5 and 7). A relatively large gap is formed between the spring W and the bottom surface of the recess of the upper end receiving portion 38b. On the other hand, in a state where the stress is applied to the leaf spring W from the stress applying mechanism 22 (state shown in FIG. 6), only a relatively small gap is formed between the leaf spring W and the bottom surface of the recess of the upper end receiving portion 38b. It has not been. In the present embodiment, the deformation of the leaf spring W by the stress applying mechanism 22 is absorbed using a gap formed between the upper end of the leaf spring W and the upper end receiving portion 38b.

  The jig rotation mechanism 30 includes a motor 32 and an output shaft that transmits the rotation of the motor 32 to the hook 34. The motor 32 is disposed above the ceiling board 13b and is connected to a power source (not shown). The motor 32 is driven by electric power supplied from a power source. When the motor 32 rotates, the hook 34 rotates together with the output shaft, whereby the hanger 37 hooked on the hook 34 rotates. As a result, the leaf spring W held by the holding jig 36 also rotates around the output shaft of the motor 32. Accordingly, the leaf spring W held by the holding jig 36 has a first state (a state shown in FIG. 7) in which one surface 52 faces the projection devices 18a and 18b, and the other surface 54 in the projection devices 18a and 18b. It is switched to the second state (the state shown in FIGS. 5 and 6) facing each other. In the first state, the projection material projected from the projection devices 18 a and 18 b is projected onto one surface 52 of the leaf spring W. On the other hand, in the second state, the projection material projected from the projection devices 18 a and 18 b is projected onto the other surface 54 of the leaf spring W. Therefore, the jig rotating mechanism 30 switches between a state in which the projection material is projected onto one surface 52 of the leaf spring W and a state in which the projection material is projected onto the other surface 54 of the leaf spring W.

  The stress applying mechanism 22 includes a column 22 fixed to the ceiling board 13 b and a pressing device (24, 26) attached to the lower end of the column 22. The column 22 has an upper end fixed to the ceiling plate 13 b, and a lower end thereof is positioned substantially at the center in the height direction of the leaf spring W held by the holding jig 36 and is attached to the lower end of the column 22. The tip of the device (24, 26) is adjusted to a position where it contacts the inner peripheral surface of the leaf spring W. The pressing device (24, 26) includes a pressing rod 26 and a drive mechanism 24 that drives the pressing rod 26. The drive mechanism 24 is attached to the lower end of the column 22 and moves the pressing rod 26 forward and backward. The state in which the tip of the pressure rod 26 presses the center of the leaf spring W (the state shown in FIG. 6) and the state in which the tip of the pressure rod 26 does not press the leaf spring W by moving the pressure rod 26 back and forth (FIG. 5). , 7). When the tip of the pressing rod 26 presses the center of the leaf spring W, the leaf spring W is curved so as to be convex outward.

  As shown in FIG. 3, the shot peening apparatus 10 includes a control device 20 that controls the mechanisms 22, 30, and 40 and the projection devices 18 a and 18 b described above. The control device 20 is configured by a computer including a CPU, a ROM, a RAM, and the like. The control device 20 controls the mechanisms 22, 30, 40 and the projection devices 18a, 18b by executing a program stored in the ROM. As a result, a shot peening process is performed on the surface 54 of the leaf spring W, while a scale removal process is performed on the surface 52 of the leaf spring W.

  A procedure for performing shot peening processing and scale removal processing on the leaf spring W using the above-described shot peening apparatus 10 will be described. As shown in FIG. 4, first, the leaf spring W to be processed is introduced through the opening 12a of the housing 12 (S10). Specifically, the worker or the robot sets the leaf spring W on the holding jig 36 in the region 15a or 15b located on the opening 12a side. That is, the eyeball 56 at one end of the leaf spring W is fitted into the lower end receiving portion 38a, and the eyeball 56 at the other end is fitted into the upper end receiving portion 38b. In a state where the leaf spring W is set in the lower end receiving portion 38a and the upper end receiving portion 36b, as shown in FIG. 5, the leaf spring W is set so that the surface 54 (concave surface) faces outward. Further, the stress applying mechanism 22 is not driven, the pressing rod 26 is in a retracted position, and the leaf spring W is not pressed. Further, as described above, a relatively large gap is formed between the upper end of the leaf spring W and the bottom surface of the recess of the upper end receiving portion 38b.

  When the leaf spring W is set on the holding jig 36, the control device 20 drives the table rotating mechanism 40 to rotate the turntable 14 (S12). Accordingly, the leaf spring W held by the holding jig 36 is conveyed to a position facing the projection devices 18a and 18b. In this state, the region 15 a or 15 b where the leaf spring W is disposed is isolated from the opening 12 a by the partition plate 16.

  Next, the control device 20 drives the stress applying mechanism 22 to press the leaf spring W, thereby applying stress to the leaf spring W (S14). That is, as shown in FIG. 6, the control device 20 extends the pressing rod 26 of the stress applying mechanism 22. When the pressing rod 26 extends, the tip of the pressing rod 26 comes into contact with the central portion of the leaf spring W, and the leaf spring W is deformed so as to be convex toward the projection devices 18a and 18b. (State shown in FIG. 6). As a result, a tensile stress is generated on the surface 54 of the leaf spring W. A gap formed between the upper end of the leaf spring W and the bottom surface of the recess of the upper end receiving portion 38b becomes smaller as the leaf spring W is deformed.

  Next, the control device 20 projects a projection material from the projection devices 18a and 18b toward the surface 54 of the leaf spring W (S16). In S16, the projection speed of the projection material is set to a relatively high projection speed (for example, about 70 m / s) so that sufficient compressive residual stress is applied to the surface 54 of the leaf spring W. Thereby, a shot peening process for improving the fatigue strength is performed on the surface 54 of the leaf spring W. Note that the space in which the projection devices 18a and 18b project the projection material (the space in which the region 15b is located in FIG. 2) is isolated from the opening 12a by the partition plate 16. For this reason, the projection material projected from the projection devices 18 a and 18 b does not jump out of the housing 12.

  When the projection of the projection material by the projection devices 18a and 18b is finished, the control device 20 then drives the stress applying mechanism 22 to retract the pressing rod 26 (S18). By the retraction of the pressing rod 26, the pressing force acting on the leaf spring W is removed. For this reason, the leaf | plate spring W will be in the state shown in FIG. 5 from the state shown in FIG.

  Next, the control device 20 drives the jig rotation mechanism 30 to rotate the leaf spring W held by the holding jig 36 around the output shaft of the motor 32 (S20). Thus, the surface 52 of the leaf spring W is in a state of facing the projection devices 18a and 18b (state shown in FIG. 7). Next, the control device 20 projects the projection material from the projection devices 18a and 18b toward the surface 52 of the leaf spring W (S22: state shown in FIG. 7). In S22, the projection speed of the projection material is set to a relatively low projection speed (for example, about 30 m / s) so that the scale (oxide film) formed on the surface 52 of the leaf spring W is removed. As a result, the scale formed on the surface 52 of the leaf spring W is removed.

  When the projection of the projection material by the projection devices 18a and 18b is completed, the control device 20 then drives the table rotation mechanism 40 to rotate the turntable 14 (S24). As a result, the leaf spring W held by the holding jig 36 is conveyed to the space on the opening 12a side in the housing 12 (the space where the region 15a is located in FIG. 2). Thereafter, the operator removes the leaf spring W from the holding jig 36 and carries the leaf spring W out of the housing 12 through the opening 12a of the housing 12 (S26). As a result, the surface 54 of the leaf spring W is subjected to shot peening, and the surface 52 of the leaf spring W is subjected to scale removal. Thereafter, by repeating the same operation, the shot peening process and the scale removal process can be executed on the surfaces 52 and 54 of the leaf spring W.

  As is clear from the above description, in the shot peening apparatus 10 according to the present embodiment, the projection material is projected from the projection devices 18a and 18b onto the leaf spring W held by the holding jig 36 in the housing 12 for processing. The leaf spring W held by the holding jig 36 drives the jig rotation mechanism 30 so that the projection material is projected onto the surface 52 of the leaf spring W and the projection material is projected onto the surface 54 of the leaf spring W. It can be switched to the state. Moreover, the projection speed of the projection material projected from the projection devices 18a and 18b can be adjusted. For this reason, in the shot peening apparatus 10 of the present embodiment, if the leaf spring W is set on the holding jig 36, the shot peening process on the surface 52 of the leaf spring W and the scale removal process on the surface 54 of the leaf spring W are performed. Can be executed continuously without resetting the leaf spring W.

  Finally, the correspondence between the examples and the claims will be described. The holding jig 36 is an example of a “holding unit”, the jig rotating mechanism 30 is an example of a “position adjusting mechanism”, and the table rotating mechanism 40 is an example of a “conveying device”.

  As mentioned above, although the specific example of the technique disclosed by this specification was demonstrated in detail, these are only illustrations and do not limit a claim. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

  For example, in the above-described embodiment, the deformation of the leaf spring W by the stress applying mechanism 22 is absorbed by the depths of the recesses of the upper end receiving portion 38b and the lower end receiving portion 38a. It is not limited to examples. For example, as shown in FIG. 8, the lower end receiving portion 136a may be attached to the floor plate 13a via the shaft member 134a, and the upper end receiving portion 136b may be attached to the ceiling plate 13b via the shaft member 134b. At this time, the shaft members 134a and 134b can be extended in the axial direction and can be rotated around the axis, and the shaft members 134a and 134b are urged in the extending direction by a spring (not shown). When the shaft members 134a and 134b are extended, the distance between the lower end receiving portion 136a and the upper end receiving portion 136b is slightly shorter than the free length of the leaf spring W. According to such a configuration, when the leaf spring W is set between the lower end receiving portion 136a and the upper end receiving portion 136b, the force of the spring that urges the shaft members 134a and 134b causes the lower end receiving portion 136a and the upper end receiving portion 136b to move. The leaf spring W is held between them. Further, when applying stress to the leaf spring W, the deformation of the leaf spring W can be absorbed by the expansion and contraction of the shaft members 134a and 134b. In the example shown in FIG. 8, the motor 132 is disposed below the floor board 13a, and the output shaft 133 of the motor 132 is connected to the shaft member 134a. Therefore, when the motor 132 is rotated, the output shaft 133 and the shaft member 134a are rotated, whereby the leaf spring W can also be rotated around the rotation shafts of the shaft members 134a and 134b.

  In the above-described embodiment, the plate spring W is held by the holding jig 36 so that the axis of the plate spring W is in the vertical direction, but the plate spring W is held so that the axis of the plate spring W is in the horizontal direction. May be. In this case, the shot peening apparatus can be configured with the same configuration as in the above-described embodiment by arranging the axis of the cylindrical housing so as to extend in the horizontal direction.

  Further, in the embodiment described above, the inside of the housing 12 is divided into two spaces (a space for loading and unloading the leaf spring W and a space for projecting the projection material onto the leaf spring W). Absent. For example, the inside of the housing 12 is divided into four spaces, a workpiece is thrown in the first space, the first projection material is projected onto the workpiece in the second space, and the second projection material is projected in the third space. You may make it wait for a projection, project the 2nd projection material in 4th space, and finally carry out a workpiece | work in 1st space. It can be appropriately determined according to the time required for loading or unloading the workpiece, the projection time of the first projection material, and the projection time of the second projection material.

  The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

10: Shot peening device 12: Housing 18a, 18b: Projection device 20: Stress applying mechanism 30: Jig rotating mechanism 40: Table rotating mechanism

Claims (7)

It is a device for shot peening the surface of a plate spring,
A projection chamber;
A holding part capable of holding a plate-like spring in the projection chamber;
A projection device capable of adjusting a projection speed, and projecting a projection material onto a plate-like spring held by a holding unit in the projection chamber;
The first positional relationship in which the projection material from the projection device is projected onto one surface of the plate-like spring held by the holding unit, and the other surface of the plate-like spring held by the holding unit from the projection device A shot peening apparatus comprising: a position adjustment mechanism capable of adjusting a positional relationship between the holding unit and the projection device to a second positional relationship on which the projection material is projected. The projection device is fixed with respect to the projection chamber,
The shot peening apparatus according to claim 1, wherein the position adjustment mechanism changes the position of the holding unit with respect to the projection apparatus. The position adjustment mechanism includes a rotation mechanism that rotates the holding unit with respect to the rotation axis.
By rotating the holding unit with respect to the rotation axis, the projection material from the projection device is projected on one surface of the plate-like spring held by the holding unit, and the plate-like shape held by the holding unit The shot peening apparatus according to claim 2, wherein the shot peening apparatus is switched to a state in which the projection material from the projection apparatus is projected onto the other surface of the spring. The holding portion includes a first portion that holds one end of the plate-like spring and a second portion that holds the other end of the plate-like spring,
The shot peening apparatus according to any one of claims 1 to 3, wherein when the plate-like springs are held in the first part and the second part, the plate-like springs are extended in the vertical direction.   The holding unit further includes a stress applying mechanism that switches between a state in which stress is applied to the plate-like springs held in the first part and the second part and a state in which no stress is applied. The shot peening apparatus as described. A loading chamber for loading workpieces into the shot peening machine;
An unloading chamber for unloading workpieces from the shot peening device;
A transport device that transports the holding unit from the input chamber to the projection chamber and also transports the holding unit transported to the projection chamber from the projection chamber to the carry-out chamber,
The shot peening apparatus according to any one of claims 1 to 5, wherein a workpiece can be attached to and detached from the holding portion in a state where the holding portion is conveyed to the input chamber and the carry-out chamber. The input room and the carry-out room are the same,
The transport device includes a turntable to which a holding unit is attached, and a drive source that rotationally drives the turntable.
The shot peening apparatus according to claim 6, wherein the turntable rotates to convey the holding unit and the work held by the holding unit from the input chamber to the projection chamber and from the projection chamber to the carry-out chamber. .

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