JP2014170765A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device that can improve the cooling efficiency and obtain a high power by gathering heat radiators for cooling a heat generation component in a predetermined area and feeding wind from a blow part to the area with efficiency.SOLUTION: An electronic device is configured by: a blow part for cooling the inside of the device; a power supply part arranged below the blow part; and a power amplification part arranged above the blow part. The inside of the electronic device is cooled by passing wind from the blow part through the respective insides of the power supply part, the blow part, and the power amplification part. Each of the power supply part and the power amplification part comprises: a housing; a heat generation component; a heat radiator for cooling the heat generation component; and a partition plate for partitioning the inside of the housing in a vertical direction. The heat generation component and the heat radiator are attached to front and rear faces of the partition plate respectively, and wind from the blow part is flown into the blow part through the heat radiator of the power supply part, and then, discharged to the outside through the heat radiator of the power amplification part.

Description

  The present invention relates to a heat dissipation structure for a heat-generating component, and more particularly to an electronic device having a heat dissipation structure suitable for a device having a power amplifier and housed in a rack or the like.

  Electronic devices such as electronic computers and broadcast systems are circuitized by high-temperature electronic components such as semiconductor devices, FETs (Field Effect Transistors), CPUs (Central Processing Units), and circulators in order to improve performance and obtain high output. A large number of power amplifier units, power supply units, control units, and the like mounted on the circuit board are mounted in a multi-stage by being mounted on the circuit board in a high density.

  Patent Document 1 discloses a fan mounting unit in a rack mounting structure in which a heat generating unit (power amplifier unit) mounted with a heat generating component and a fan unit mounted with a fan for cooling the heat generating unit are mounted adjacent to each other vertically. At least one side of the side and the back of the air intake port, and under the fan unit, another heat generating unit (power supply unit) or non-heat generating unit (control unit) mounted with a heat generating component is attached adjacently Have been disclosed.

JP 2007-81194 A

However, in patent document 1, it has the structure which arrange | positions the fan unit for cooling on the lower side of the power amplifier unit and power supply unit which are heat generating units, respectively, and since two fan units for cooling are required, There are problems that the manufacturing cost increases and maintenance work increases.
Moreover, in patent document 1, it is comprised so that air may be taken in from the inlet provided in the side surface or back surface of a fan unit, and cooling air may be sent toward the upper direction from the downward direction of a heat generating unit with a fan, and it flows in from a horizontal direction. Since the air is changed in the vertical direction and taken into the fan, there is a problem in that the air flow is lost, so that the air blowing route is not efficient.

  The present invention has been made to solve such a problem. A heat radiator for cooling a heat-generating component is collected in a predetermined area, and the air from the air blowing unit is efficiently sent to the area. An object of the present invention is to provide an electronic device with improved cooling efficiency and high output.

  In order to achieve the above object, an electronic device according to the present invention includes a blower that cools the inside of the device, a power supply disposed below the blower, and a power amplifying unit disposed above the blower. In the electronic device in which the wind from the air blowing unit passes through each of the power supply unit, the air blowing unit, and the power amplification unit to cool the inside of the device, the power supply unit and the power amplification unit are respectively A housing, a heat generating component, a radiator that cools the heat generating component, and a partition plate that partitions the interior of the housing in a vertical direction, and the heat generating component and the radiator are provided on each of the front and back surfaces of the partition plate. It is attached, and the wind from the air blowing unit passes through the heat radiator of the power supply unit and flows into the air blowing unit, and then passes through the heat radiator of the power amplification unit and is discharged to the outside. .

  According to the above invention, the radiator for cooling the heat-generating component is gathered in a predetermined area, and the air from the blower is efficiently sent to the area, so that the cooling efficiency is improved and the electronic device is High output can be obtained.

  In order to achieve the above object, an electronic device according to the present invention includes a blower that cools the inside of the device, a power supply disposed below the blower, and a power amplifying unit disposed above the blower. In the electronic device in which the wind from the air blowing unit passes through each of the power source unit, the air blowing unit, and the power amplification unit to cool the inside of the device, the power source unit includes the first housing, A first heat generating component; a first heat radiator that cools the first heat generating component; and a first partition plate that partitions the inside of the first casing in a vertical direction. And the first radiator is attached to each of the front and back surfaces of the first partition plate, the power amplification unit includes a second housing, a second heat generating component, and a third heat generating component, A second radiator for cooling the second heat generating component, and a third radiator for cooling the third heat generating component. And a second partition plate that partitions the inside of the second casing in the vertical direction, the second heat generating component, the third heat generating component, the second heat radiator, and the third heat dissipation. A fan is attached to each of the front and back surfaces of the second partition plate, the air blower has a plurality of fans, and the wind from one of the fans is the first radiator of the power supply unit. Through the second air radiator and the third heat radiator of the power amplifying unit and discharged to the outside, and by the other fans of the plurality of fans The wind flows into the air blowing unit without passing through the first heat radiator of the power supply unit, and then passes through the second heat radiator of the power amplification unit and is discharged to the outside. To do.

According to the above invention, the radiator for cooling the heat-generating component is gathered in a predetermined area, and the air from the blower is efficiently sent to the area, so that the cooling efficiency is improved and the electronic device is High output can be obtained.
In addition, the flow path of the wind from the blower section is divided into a plurality of parts, and a predetermined radiator is arranged on the divided air flow path for cooling, so that the cooling efficiency is improved and the electronic device has a high output. Can be obtained.

  In order to achieve the above object, an electronic device according to the present invention is the above-described electronic device, wherein the power amplifying unit is partitioned by the second partition plate of the second casing. And the longitudinal direction of the second radiator and the third radiator so that the wind from the air blowing unit hits only the second radiator and the third radiator in the area on the third radiator side Two wind control plates are provided so as to sandwich both side surfaces.

According to the above invention, the radiator for cooling the heat-generating component is gathered in a predetermined area, and the air from the blower is efficiently sent to the area, so that the cooling efficiency is improved and the electronic device is High output can be obtained.
In addition, the flow path of the wind from the blower section is divided into a plurality of parts, and a predetermined radiator is arranged on the divided air flow path for cooling, so that the cooling efficiency is improved and the electronic device has a high output. Can be obtained.
In addition, since the wind from the air blowing unit is directly applied to the radiator by the air conditioning plate, the cooling efficiency is improved and the electronic device can obtain a high output.

  In order to achieve the above object, the electronic device according to the present invention is the electronic device according to the above aspect, wherein the air conditioning plate has a width between the two air conditioning plates toward the air intake and exhaust ports of the power amplifying unit. It is characterized by widening.

According to the above invention, the radiator for cooling the heat-generating component is gathered in a predetermined area, and the air from the blower is efficiently sent to the area, so that the cooling efficiency is improved and the electronic device is High output can be obtained.
In addition, the flow path of the wind from the blower section is divided into a plurality of parts, and a predetermined radiator is arranged on the divided air flow path for cooling, so that the cooling efficiency is improved and the electronic device has a high output. Can be obtained.
In addition, since the wind from the air blowing unit is directly applied to the radiator by the air conditioning plate, the cooling efficiency is improved and the electronic device can obtain a high output.

  In order to achieve the above object, an electronic device according to the present invention is the above electronic device, wherein the second radiator and the third radiator have a plurality of heat radiating fins arranged in a horizontal direction. The heat sinks having the same pitch and thickness of the heat dissipating fins, wherein the second heat dissipator and the third heat dissipator are vertically aligned with each other, and the plurality of heat dissipating fins are arranged vertically. It is characterized by being arranged so as to align the positional relationship of directions.

According to the above invention, the radiator for cooling the heat-generating component is gathered in a predetermined area, and the air from the blower is efficiently sent to the area, so that the cooling efficiency is improved and the electronic device is High output can be obtained.
In addition, the flow path of the wind from the blower section is divided into a plurality of parts, and a predetermined radiator is arranged on the divided air flow path for cooling, so that the cooling efficiency is improved and the electronic device has a high output. Can be obtained.
In addition, since the wind from the air blowing unit is directly applied to the radiator by the air conditioning plate, the cooling efficiency is improved and the electronic device can obtain a high output.
In addition, since the pitch, thickness, and arrangement position of the radiating fins of the radiator are made uniform, the cooling efficiency is improved and the electronic device can obtain a high output.

  As described above, according to the present invention, the radiator for cooling the heat generating components is gathered in a predetermined area, and the air from the blower is efficiently sent to the area, so that the cooling efficiency is improved. In addition, the electronic device can obtain a high output.

It is a perspective view which shows an example of the electronic device which concerns on Embodiment 1 to which this invention is applied. It is a figure for demonstrating the component structure per unit of the electronic device which concerns on Embodiment 1 to which this invention is applied. It is the perspective view seen from the back direction with respect to the front view of FIG. It is sectional drawing at the time of cut | disconnecting by the AA surface shown in FIG. It is sectional drawing at the time of cut | disconnecting by the BB surface shown in FIG. It is a top view of the power supply unit 20 at the time of seeing from the S direction shown in FIG. It is sectional drawing at the time of cut | disconnecting by CC plane shown in FIG. It is sectional drawing at the time of cut | disconnecting by the DD plane shown in FIG. FIG. 3 is a bottom view of the power amplifier unit 40 when viewed from the P direction shown in FIG. 2.

<Embodiment 1>
[Configuration of Electronic Device 1]
Hereinafter, an electronic apparatus according to Embodiment 1 to which the present invention is applied will be described in detail with reference to FIG.
FIG. 1 is a perspective view showing an example of an electronic apparatus according to Embodiment 1 to which the present invention is applied.
The electronic apparatus 1 according to the first embodiment to which the present invention is applied will be described as a transmitter for transmitting radio waves for FM broadcasting. However, the electronic apparatus 1 is stored in a rack such as a television transmitter or an electronic computer and used for air cooling. The present invention can be applied to any device as long as it is an electronic device of the type.

As shown in FIG. 1, the electronic device 1 includes a chassis 10, a power supply unit 20, a fan unit 30, and a power amplifier unit 40.
The chassis 10 is used to fix and use the power supply unit 20, the fan unit 30, and the power amplifier unit 40 inside a ready-made rack so as to be detachably accommodated in a ready-made rack (not shown) from the front. .
The power supply unit 20 is for supplying power to the fan unit 30 and the power amplifier unit 40.
The fan unit 30 is for cooling the inside of the power supply unit 20 and the power amplifier unit 40.
The power amplifier unit 40 amplifies radio waves for FM broadcasting and outputs them to a transmission antenna (not shown).

Next, the configuration of each unit will be described in detail with reference to FIGS. FIG. 2 is a diagram for explaining a component configuration per unit of the electronic apparatus according to the first embodiment to which the present invention is applied. Compared to FIG. 1, the chassis 10 is removed, and the power supply unit 20 and the power amplifier unit. It is the figure which removed the right side part of each housing | casing.
FIG. 3 is a perspective view of the front view of FIG. 2 as seen from the back side, and is a view in which the left side portions of the housings of the power supply unit 20, the fan unit 30, and the power amplifier unit 40 are removed.
4 is a cross-sectional view taken along the plane AA shown in FIG.
FIG. 5 is a cross-sectional view taken along the plane BB shown in FIG.
FIG. 6 is a plan view of the power supply unit 20 when viewed from the S direction shown in FIG.
7 is a cross-sectional view taken along the line CC shown in FIG.
FIG. 8 is a cross-sectional view taken along the line DD shown in FIG.
FIG. 9 is a bottom view of the power amplifier unit 40 when viewed from the P direction shown in FIG.

[Configuration of Power Supply Unit 20]
The configuration of the power supply unit 20 will be described in detail with reference to FIGS.
The power supply unit 20 includes a housing 21, two power supply boards 22 on which heat generating components 22 a such as FETs, transformers, and diodes are mounted, and a plurality of fins, and a radiator 23 that cools the heat generating components 22 a of the power supply board 22. Three capacitors 24, a base plate (A) 26 for attaching the power supply substrate 22, a base plate (B) 27 for partitioning the inside of the casing 21 in the left-right direction, and the capacitor 24 so as to cover the casing 21 A base plate (CL) 28a, base plate (CR) 28b for partitioning the interior in the left-right direction, and a partition plate (L) 29a, partition plate (R) for covering the capacitor 24 and partitioning the inside of the housing 21 in the front-rear direction ) 29b.
The housing 21 is provided with an inlet (L) 21a, an inlet (M) 21b, and an inlet (R) 21c for taking in cooling air at the positions shown in FIG. 6 are provided with a discharge port (L) 21d, a discharge port (M) 21e, and a discharge port (R) 21f for discharging cooling air.

[Configuration of Fan Unit 30]
With reference to FIG.2 and FIG.3, the structure of the fan unit 30 is demonstrated in detail.
The fan unit 30 includes a housing 31, three fans 32, and a fan mounting plate 33 for mounting the fans 32.
The fan mounting plate 33 includes partition plates 33 a for partitioning the air flowing into the three fans 32.
Note that an opening 31 a for taking air into the fan 32 is provided on the lower surface of the housing 31, and an upper surface of the housing 31 is not shown for exhausting air discharged from the fan 32. An opening is provided.

[Configuration of Power Amplifier Unit 40]
The configuration of the power amplifier unit 40 will be described in detail with reference to FIGS. 2 to 3 and FIGS. 7 to 9.
The power amplifier unit 40 is provided with a housing 41, a PA substrate 42 on which a FET (Field Effect Transistor) 42a, which is a high heat generation component, is mounted, a circulator 44, a PA substrate 42, and a circulator 44. The base plate 43 for partitioning the inside of the housing 41 in the left-right direction, a plurality of heat radiation fins, a FET heat radiator 45 for cooling the FET 42a of the PA substrate 42, a plurality of heat radiation fins, and cooling the circulator 44 A circulator for the circulator 46 for performing the operation, a duct plate (LL) 47a, a duct plate (LR) 47b, a duct plate (ML) 48a, a duct plate for guiding the air discharged from the fan 32 to the FET radiator 45 (MR) 48b, duct plate (UL) 49a, and duct plate (UR) 49b. These duct plates are installed so as to sandwich the both sides in the vertical direction of the circulator radiator 46 and the FET radiator 45, and have a structure in which wind does not flow into portions other than the radiator.
Further, the housing 41 is provided with a suction port (L) 41a, a suction port (M) 41b, and a suction port (R) 41c for taking in cooling air from the fan 32 at the position shown in FIG. In addition, a discharge port (L) 41d, a discharge port (M) 41e, and a discharge port (R) 41f for discharging cooling air are provided at the positions shown in FIG.
Note that the size of the suction port (L) 41a, the suction port (M) 41b, and the suction port (R) 41c is larger than the mounting width of the three fans 32 in order to allow the wind from the fans 32 to flow efficiently. Wide dimensions. Further, the discharge port (L) 41d, the discharge port (M) 41e, and the discharge port (R) 41f ensure an area equivalent to that of the suction port.

[Cooling structure of power supply unit 20]
Next, the cooling structure inside the power supply unit 20 of the present invention will be described in detail.
As described above, the power supply unit 20 includes the base plate (A) 26, the base plate (B) 27, the base plate (CL) 28a, the base plate (CR) 28b, the partition plate (L) 29a, and the partition plate ( R) 29b separates the component mounting area on which the power supply board 22 and the capacitor 24 are mounted and the ventilation area on which the radiator 23 is mounted.
Moreover, the capacitor | condenser 24 of the power supply unit 20 is arrange | positioned so that it may come to the both sides of the heat sink 23 seeing from the downward direction, as shown in the bottom view of FIG. Further, since the capacitor 24 has a diameter larger than the height of the component mounting area, the height of the ventilation area is low in the portion where the capacitor 24 is mounted. Therefore, the suction port (L) 21a, the suction port (M) 21b, and the suction port (R) 21c of the housing 21 have different sizes (opening areas) at the left and right and the center. In such a state, when air flows in from the three suction ports, the wind speed changes depending on the size of the suction ports, and the wind flow may be disturbed inside to increase the pressure loss. In view of this, the partition plate (L) 29a and the partition plate (R) 29b are provided, and each flow path is made independent so as to suppress wind turbulence and suppress an increase in pressure loss.
Accordingly, the three fans 32 of the fan unit 30 operate, and cooling air flows from the suction port (L) 21a, the suction port (M) 21b, and the suction port (R) 21c of the housing 21. The air flowing in from the suction port (L) 21a is discharged from the discharge port (L) 21d of the housing 21 through the route indicated by R1 in FIG. 2 and flows into the fan 32 on the near side. Further, the air flowing in from the suction port (M) 21b passes through the route indicated by R2 in FIG. 1, cools the radiator 23, and is then discharged from the discharge port (M) 21e of the housing 21 to be a central fan 32. Flow into. The air flowing in from the suction port (R) 21c is discharged from the discharge port (R) 21f of the housing 21 through the route indicated by R3 in FIG. 1 and flows into the fan 32 on the back side.

[Cooling structure of power amplifier unit 40]
Next, the cooling structure inside the power amplifier unit 40 of the present invention will be described in detail.
As described above, the interior of the power amplifier unit 40 includes the component mounting area on which the PA substrate 42, the circulator 44, and the like are mounted by the base plate 43, and the ventilation area in which the FET radiator 45 and the circulator radiator 46 are mounted. And has a separated structure.
In the ventilation area, a duct plate (LL) 47a, a duct plate (ML) 48a and a duct plate (UL) 49a provided in front of the power amplifier unit 40, a duct plate (LR) 47b provided in the rear, a duct The air exhausted from the fan 32 is narrowed down by the plate (MR) and the duct plate (UR) 49b so as to concentrate and flow into the FET radiator 45.
The air that has passed through the FET radiator 45 also flows to the circulator radiator 46. At this time, in order to reduce pressure loss as much as possible, the heat dissipating fins of the FET heat dissipator 45 and the heat dissipating fins of the circulator heat dissipator 46 are selected from heat dissipators having heat dissipating fins having the same fin pitch and thickness. In order to allow the air to flow straight in the vertical direction, it is arranged so that the positions of the radiation fins are aligned in the vertical direction.
In addition, the exhaust port (L) 41d, the exhaust port (M) 41e, and the exhaust port (R) 41f have an area equivalent to that of the intake port for exhausting, so that the duct plate (UL) 49a and the duct plate (UR) ) In 49b, the flow path is enlarged and exhausted smoothly.

[Cooling structure of electronic device 1]
Based on the cooling structure of each unit described above, the cooling structure of the electronic device 1 is summarized as follows.
Usually, when heat-generating components are arranged in series in the same air flow, the temperature rise of the upstream components is increased due to the influence of the rise in the downstream wind temperature, which causes the life of the components to be shortened. Therefore, in the electronic device 1 of the present invention, when the heat generating component 22a of the power supply unit 20, the FET 42a of the power amplifier unit 40 and the circulator 44 are arranged, the FET 42a and the circulator 44 and the heat generating component 22a and the FET 42a do not overlap in the vertical direction. To place. In addition, a highly heat-generating component was arranged as downstream as possible, and the device was devised to cool the component with a relatively cool wind downstream. Furthermore, the temperature derating of the component is improved by arranging the heat generating component having sufficient temperature in the upstream.

As described above, according to the present invention, the cooling efficiency is improved by collecting the radiators for cooling the heat generating parts in a predetermined area and efficiently sending the air from the fan to the area. In addition, the electronic device can obtain a high output.
In addition, the air flow path from the fan is divided into a plurality of parts, and a predetermined radiator is arranged on the divided air flow path for cooling, so that the cooling efficiency is improved and the electronic device has a high output. Can be obtained.
In addition, since the wind from the fan is directly applied to the radiator by the air conditioning plate, the cooling efficiency is improved and the electronic device can obtain a high output.
In addition, since the pitch, thickness, and arrangement position of the radiating fins of the radiator are made uniform, the cooling efficiency is improved and the electronic device can obtain a high output.

(Appendix)
The present invention also includes the following embodiments.

(Additional remark 1) It has a ventilation part which cools the inside of an apparatus, and provides the power supply part in the lower part and the power amplification part in the upper part with the blower part as a boundary, and the cooling wind from the power supply part is in the power amplification part In the electronic device arranged so that the heat sources mounted on the substrate of the power supply unit and the power amplification unit do not overlap each other, the power supply unit and the power amplification unit are radiating fins. An electronic device, wherein a board is divided into a board mounting area having the heat source part and a cooling area having the heat radiating fin, and the heat radiating fin is provided at least directly behind the heat source part.
According to the above-described invention, the power supply unit has a structure that achieves downsizing and weight reduction by providing the radiation fins only on the portion that needs to be cooled (heat source portion), and can efficiently cool the portion that needs to be cooled. It is possible to obtain a high output by improving the cooling efficiency.

(Supplementary note 2) In Supplementary note 1, in the cooling area of the power amplifying unit, air conditioning plates are provided on the left and right sides of the radiation fins so that the cooling air efficiently passes through the radiation fins, and a cooling air flow path is secured. An electronic device, characterized in that the air conditioning plate is directed outward so that the inlet and exhaust ports of the flow path are widened.
According to the said invention, the radiation fin attached to the heat-source part back surface can be efficiently cooled by providing an air conditioning board. Further, by providing the air conditioning plate so that the hems of the intake port and the exhaust port are widened, the cooling air enters and exits smoothly, and the cooling efficiency is improved.

(Additional remark 3) In additional remark 2, the said air conditioning board is spread outside so that it may become the said air intake port wider than the width | variety of the said ventilation part, it narrows along the said heat source, The said exhaust port is made wide again, It is characterized by the above-mentioned. Electronic equipment.
According to the said invention, it can utilize for cooling of a radiation fin, without leaving cooling air from a ventilation part.

(Additional remark 4) In additional remark 1 thru | or additional remark 3, the said radiation fin is set to the same thickness and the same position by the same pitch, The electronic device characterized by the above-mentioned.
According to the said invention, a pressure loss falls because a wind flows evenly and straightly on the heat-source part upper part.

(Supplementary note 5) In the supplementary notes 1 to 4, the power supply unit and the power amplification unit are each provided with a low temperature component downstream and a high temperature component upstream.
According to the above invention, the cooling efficiency is improved by cooling first from the low temperature component.

(Appendix 6) In appendix 1 to appendix 5, a capacitor is provided on both sides of the bottom of the power supply unit, and a wind regulation plate is provided in a portion where the capacitor is not installed in order to divide the flow path between the capacitor installation portion and the other portions. An electronic device characterized by partitioning.
According to the above invention, the cooling efficiency is improved because the cooling air is not applied to a portion that does not require cooling, such as a condenser, and only the heat source portion that needs to be cooled can be cooled.

(Supplementary note 7) In the supplementary notes 1 to 6, the air blowing unit is a fan.

(Appendix 8) An electronic device according to any one of appendices 1 to 7, wherein the width of the air inlet and the air outlet of the air conditioning plate is the same.

  Note that the present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying constituent elements without departing from the scope of the invention in the implementation stage. Moreover, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments. For example, some components may be deleted from all the components shown in each embodiment. Furthermore, you may combine suitably the component covering different embodiment.

1: electronic device, 10: chassis, 20: power supply unit, 21: housing, 21a: suction port (L), 21b: suction port (M), 21c: suction port (R), 21d: discharge port (L) , 21e: discharge port (M), 21f: discharge port (R), 22: power supply board, 22a: heat-generating component, 23: radiator, 24: capacitor, 26: base plate (A), 27: base plate (B ), 28a: base plate (CL), 28b: base plate (CR), 29a: partition plate (L), 29b: partition plate (R), 30: fan unit, 31: housing, 31a: opening, 32 : Fan, 33: Fan mounting plate, 33a: Partition plate, 40: Power amplifier unit, 41: Housing, 41a: Suction port (L), 41b: Suction port (M), 41c: Suction port (R), 41d : Outlet (L), 41e: outlet (M), 41f: outlet ( ), 42: PA substrate, 42a: FET, 43: base plate, 44: circulator, 45: radiator for FET, 46: radiator for circulator, 47a: duct plate (LL), 47b: duct plate (LR), 48a: Duct plate (ML), 48b: Duct plate (MR), 49a: Duct plate (UL), 49b: Duct plate (UR).

Claims (5)

An air blower that cools the inside of the apparatus, a power supply unit disposed below the blower unit, and a power amplifying unit disposed above the blower unit, wherein the wind from the blower unit causes the power supply unit, In the electronic device that cools the inside of the device by passing through the inside of the air blowing unit and the power amplification unit,
The power supply unit and the power amplifying unit each include a housing, a heat generating component, a radiator that cools the heat generating component, and a partition plate that partitions the interior of the housing in a vertical direction, A radiator is attached to each of the front and back surfaces of the partition plate,
The electronic apparatus according to claim 1, wherein wind from the air blowing unit passes through the heat radiator of the power supply unit and flows into the air blowing unit, and then passes through the heat radiator of the power amplification unit and is discharged to the outside. An air blower that cools the inside of the apparatus, a power supply unit disposed below the blower unit, and a power amplifying unit disposed above the blower unit, wherein the wind from the blower unit causes the power supply unit, In the electronic device that cools the inside of the device by passing through the inside of the air blowing unit and the power amplification unit,
The power supply unit includes a first casing, a first heat generating component, a first heat radiator that cools the first heat generating component, and a first partition that vertically partitions the inside of the first casing. A partition plate, the first heat generating component and the first radiator are attached to each of the front and back surfaces of the first partition plate,
The power amplification unit includes a second casing, a second heat generating component, a third heat generating component, a second radiator that cools the second heat generating component, and the third heat generating component. A third radiator for cooling; and a second partition plate for vertically partitioning the inside of the second casing, the second heat generating component, the third heat generating component, and the second heat radiator. And the third radiator is attached to each of the front and back surfaces of the second partition plate,
The air blowing unit includes a plurality of fans, and after wind caused by one of the plurality of fans passes through the first radiator of the power supply unit and flows into the air blowing unit, Passing through the second radiator and the third radiator and being discharged to the outside, and the wind from the other fans of the plurality of fans passes through the first radiator of the power supply unit. After flowing into the air blower, the electronic device passes through the second radiator of the power amplifier and is discharged to the outside.   The electronic device according to claim 2, wherein the power amplifying unit is provided in an area on the second radiator and the third radiator side partitioned by the second partition plate of the second casing. Two air conditioning plates are arranged so as to sandwich both longitudinal side surfaces of the second radiator and the third radiator so that the air blown by the blower unit hits only the second radiator and the third radiator. An electronic device comprising the electronic device.   4. The electronic device according to claim 3, wherein the air conditioning plate increases a width between the two air conditioning plates toward the air intake port and the exhaust port side of the power amplifying unit. 5. 5. The electronic device according to claim 4, wherein the second radiator and the third radiator have a plurality of radiation fins arranged in a horizontal direction, and the plurality of radiation fins have the same pitch and thickness. A radiator,
The second heat radiator and the third heat radiator are arranged side by side vertically in the vertical direction, and are arranged so as to align the vertical positional relationship of the plurality of heat radiation fins. .