JP2014082236A - Led light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED light emitting device capable of being easily handled by being reduced in thickness and lightened in weight and capable of improving rendering properties by adjusting an emission color, in an LED light emitting device capable of changing an illumination spot form in a state where emission efficiency is high.SOLUTION: Light emitting sections 5A, 5B including a plurality of LED elements 1a, 1b are formed on a circuit board 2. The light emitting sections 5A, 5B are partitioned by partition members 3a, 3b, and arranged in a concentric circle shape. The light emitting sections 5A, 5B are filled with transparent resins 6a, 6b, and a Fresnel lens 8 is bonded on the upper part of the transparent resins.

Description

  The present invention relates to an LED light-emitting device including an LED element, and more particularly to an LED light-emitting device including a plurality of LED elements mounted on a circuit board and a lens thereon.

  In recent years, since LED elements are semiconductor light emitting elements, they have long life and excellent driving characteristics, and are small in size, have high light emission efficiency, and have bright emission colors. Has come to be widely used.

  Particularly in recent years, an illumination device (LED light emitting device, for example, Patent Document 1) in which a plurality of light emitting portions are provided concentrically and a lens is placed on the upper surface of the light emitting portion to provide a plurality of light distribution (condensing) characteristics has been proposed. Has been.

Hereinafter, a conventional LED light emitting device in which a lens is mounted on the upper surface of a concentric light emitting portion will be described. For ease of understanding, the drawings are partially simplified within the scope not departing from the spirit of the invention, and component names are also included in the present application.
16, 17, and 18 show the configuration of the LED light emitting device 100 disclosed in Patent Document 1, FIG. 16 is a plan view of the LED module 100 a, FIG. 17 is a partial cross-sectional view of the LED module 100 a, and FIG. It is sectional drawing of the LED light-emitting device 100 which incorporated the lens in the module 100a.

  In FIG. 16, the LED module 100a includes a plurality of LED element groups 101A, 101B, and 101C arranged concentrically on the upper surface of the circuit board 102, and a partition provided so as to divide the LED element groups 101A, 101B, and 101C. Members 103a, 103b, and 103c. The LED element group 101A includes a plurality of LED elements 101a. Similarly, the LED element group 101B includes a plurality of LED elements 101b, and the LED element group 101C includes a plurality of LED elements 101c. In Patent Document 1, LED elements 101a, 101b, and 101c are the same LED element.

  The LED elements 101a, 101b, and 101c included in the LED element groups 101A, 101B, and 101C are flip-chip mounted on pattern electrodes (not shown) provided on the circuit board 102 to form individual circuits. The circuit composed of the LED elements 101a, 101b, and 101c is connected to the drive electrodes 102a, 102b, 102c, and 102d via the wiring electrodes 102h, respectively. The drive electrode 102d is a common electrode.

  17 is a cross-sectional view of the LED module 100a shown in FIG. Inside the partition member 103a, an LED element group 101A is formed by a plurality of LED elements 101a. Similarly, the LED element group 101B is formed by the plurality of LED elements 101b between the partition member 103a and the partition member 103b, and the LED element group 101C is formed by the plurality of LED elements 101c between the partition member 103b and the partition member 103c. ing. Further, a phosphor layer 104a is provided inside the partition member 103a so as to cover the LED element group 101A. Similarly, the phosphor layer 104b is provided between the partition member 103a and the partition member 103b so as to cover the LED element group 101B, and the LED element group 101C is covered between the partition member 103b and the partition member 103c. A phosphor layer 104c is provided. The phosphor layers 104a, 104b, and 104c are made of the same material, and the partition members 103a, 103b, and 103c prevent light from leaking laterally from the light emitting portions 105a, 105b, and 105c.

  That is, the first light emitting portion 105a is formed in the partition member 103a by the LED element group 101A and the phosphor layer 104a. Similarly, a second light emitting portion 105b is formed by the LED element group 101B and the phosphor layer 104b between the partition member 103a and the partition member 103b, and the LED element group 101C and the fluorescent light are formed between the cutting member 103b and the partition member 103c. A third light-emitting portion 105c is formed by the body layer 104c. Each light emitting part 105a, 105b, 105c is connected to the drive electrodes 102a, 102b, 102c, 102d via the wiring electrode 102h, and is individually lit and driven by the drive voltage applied to the drive electrodes 102a, 102b, 102c, 102d. Is done.

  As described above, the drive electrode 102d is a common electrode, the drive electrode 102a is connected to the first light emitting unit 105a, the drive electrode 102b is connected to the second light emitting unit 105b, and the drive electrode 102c is connected to the third light emitting unit 105c. Therefore, when a driving voltage is applied between the driving electrode 102a and the driving electrode 102d, the first light-emitting portion 105a is turned on, and when a driving voltage is applied between the driving electrode 102b and the driving electrode 102d, the second light-emitting portion is connected. When the driving voltage is applied between the driving electrode 102c and the driving electrode 102d, the third light emitting unit 105c is turned on.

  FIG. 18 is a cross-sectional view showing a completed state of the LED light emitting device 100. The support frame 106 is assembled to the circuit board 102 of the LED module 100a by screws 10 7, and the first lens 108A and the second lens 108B are attached to the support frame 106.

  Next, the operation of the LED light emitting device 100 will be described. As shown in FIG. 18, by arranging the first lens 108A and the second lens 108B on the upper part of the LED module 100a, the first light emitting unit 105a, the second light emitting unit 105b, and the third light emitting unit of the LED module 100a. The light emitted from 105c is condensed by the first lens 108A and the second lens 108B. Further, in Patent Document 1, the LED light emitting device 100 can illuminate with a narrow small spot by causing only the first light emitting unit 105a to emit light. Similarly, the first light emitting unit 105a and the second light emitting unit 105b can be illuminated to emit light at a medium spot, and the first light emitting unit 105a, the second light emitting unit 105b, and the third light emitting unit 105c are caused to emit light. Thus, illumination can be performed at a large spot. In this way, it is possible to provide an LED light emitting device that can easily change the spot size of illumination as required.

WO2011 / 144597 (FIGS. 1, 4, and 6)

  The LED light-emitting device 100 described in the cited document 1 includes a plurality of light-emitting portions formed concentrically and a lens above the plurality of light-emitting portions, thereby illuminating as necessary with good emission efficiency. The spot size was changed. However, in the LED light emitting device 100, the support frame 6 is attached to the circuit board 102 using screws 107, and the thick first lens 108 </ b> A and second lens 108 </ b> B are incorporated in the support frame 106. As a result, it is not easy to handle because it increases in thickness and weight. There is also a problem that the production effect is insufficient due to the single emission color.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, and in an LED light-emitting device capable of changing the spot shape of illumination with high emission efficiency, it is easy to handle by reducing the thickness and weight, and the emission color. It is providing the LED light-emitting device which can improve stage performance by adjusting.

  In order to achieve the above object, the configuration of the LED light emitting device in the present invention is as follows. In an LED light-emitting device comprising a first and second light-emitting portions that are concentrically formed with a plurality of LED elements on a circuit board, and a lens above the first and second light-emitting portions, A transparent resin layer is provided above the first and second light emitting portions, and a planar lens is bonded to the upper portion of the transparent resin layer.

  According to the said structure, thickness reduction and weight reduction are achieved by formation of a transparent resin layer, and adhesion | attachment of the planar lens with respect to the transparent resin layer, and it becomes easy to handle it. As a result, the incorporation into a lighting fixture is improved.

  It is preferable that the first and second light emitting units have different color light.

  According to the above configuration, the performance is improved by switching the first and second light emitting units or causing them to emit light simultaneously.

The planar lens may be a fullnel lens.

  The plurality of LED elements constituting the first and second light emitting portions are laminated with a phosphor layer and the transparent resin layer, the transparent resin layer is thicker than the phosphor layer, and is flat on the transparent resin layer. A mold lens should be adhered.

  According to the said structure, a transparent resin layer and a planar lens can be firmly fixed by adhere | attaching a planar lens on the fluorescent substance layer laminated | stacked on the upper surface of the LED element, and the transparent resin layer thicker than this fluorescent substance layer. Furthermore, since the transparent resin layer is sufficiently thick, light emitted from the LED element and the phosphor layer can be efficiently collected.

  The phosphor layers included in the first and second light emitting units may have different emission colors.

  The first and second light emitting portions may be separated by a partition member.

  According to the above configuration, since the partition member can block light from spreading from the first and second light emitting units in a direction parallel to the circuit board surface, the spot shape can be made clear.

  The plurality of LED elements included in the first and second light emitting units may constitute an LED package in which a phosphor layer is placed on the upper surface of each LED element.

  According to the said structure, the fluorescent substance layer match | combined with the characteristic of each LED element can be formed for every LED element. As a result, the selection range of the light emission characteristics of the LED package is widened, and management related to uniformization of the light emission color is facilitated.

  The LED package group composed of the plurality of LED packages included in the first or second light emitting unit may include LED packages of different emission colors.

The LED package group included in the first or second light emitting unit includes an LED package having a phosphor layer placed on the upper surface of the LED element and an LED package having no phosphor layer placed on the upper surface of the LED element. May be mixed.

  According to the above configuration, by combining the LED package that is wavelength-converted by the phosphor layer and the LED package that is not wavelength-converted by the phosphor layer, the emission intensity and the emission color can be widened.

  The LED element constituting the LED package may be flip-chip mounted on an electrode provided on the circuit board.

In the LED light emitting device that includes first and second light emitting units having a plurality of LED elements on a circuit board, and includes a lens above the first and second light emitting units, the first and second light emitting units. A LED light emitting device comprising a partition member provided between the two and a planar lens bonded to the upper portion of the partition member.

  According to the said structure, a transparent layer can be made into an air layer by adhere | attaching a planar lens on the upper part of a partition member.

  It is preferable that the first and second light emitting units have different color light.

  As described above, according to the present invention, in an LED light-emitting device that can change the spot shape of illumination with good emission efficiency, it is easy to handle by reducing the thickness and weight, and the rendering can be achieved by adjusting the emission color. An LED light-emitting device that can be improved can be provided.

It is a top view of the LED light-emitting device in 1st Embodiment of this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is a top view of the LED light-emitting device in 2nd Embodiment of this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is a top view of the LED light-emitting device in 3rd Embodiment of this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is sectional drawing of the LED package shown in FIG. It is a top view of the LED light-emitting device in 4th Embodiment of this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is a top view of the LED light-emitting device in 5th Embodiment of this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is a top view of the LED light-emitting device in 6th Embodiment of this invention. It is BB sectional drawing of the LED light-emitting device shown in FIG. It is a top view of the LED light-emitting device in 7th Embodiment of this invention. It is AA sectional drawing of the LED light-emitting device shown in FIG. It is a top view of the LED module in a prior art. It is CC sectional drawing of the LED module shown in FIG. It is sectional drawing of the LED light-emitting device in a prior art.

(First embodiment)
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an LED light emitting device 10 according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the LED light emitting device 10 shown in FIG. In FIG. 1, the LED light emitting device 10 partitions the first LED element group 1A and the second LED element group 1B concentrically disposed on the upper surface of the circuit board 2, and the LED element groups 1A and 1B. Partition members 3a and 3b provided on the surface. In each LED element group 1A, 1B, the LED element group 1A is constituted by a plurality of LED elements 1a, and the LED element group 1B is similarly constituted by a plurality of LED elements 1b. In addition, in this embodiment, although LED element 1a, 1b shows the example using the same LED element, it is not limited to this.

  The LED elements 1a and 1b included in the first and second LED element groups 1A and 1B are flip-chip mounted on a pattern electrode (not shown) provided on the circuit board 2. The circuit composed of the LED elements 1a and 1b is connected to the drive electrodes 2a, 2b and 2d via the wiring electrodes 2h, respectively. The drive electrode 2d is a common electrode.

  2 is a cross-sectional view of the LED light emitting device 10 shown in FIG. Inside the partition member 3a is an LED element group 1A composed of a plurality of LED elements 1a. Similarly, there is an LED element group 1B composed of a plurality of LED elements 1b between the partition members 3a and 3b. A transparent resin layer 6a is provided inside the partition member 3a so as to cover the LED element group 1A. Similarly, a transparent resin layer 6b is provided between the cutting members 3a and 3b so as to cover the LED element group 1B. Further, the planar lens 8 is bonded to the upper surfaces of the transparent resin layers 6a and 6b with a transparent adhesive (not shown). In the present embodiment, a Fresnel lens is used as the planar lens 8. The planar lens is not limited to a Fresnel lens, and may be a TIR (Total Internal Reflection) lens using internal reflection.

  The circuit board 2 is selected from a ceramic substrate, a metal substrate having an insulating film on an aluminum plate, or the like in consideration of heat dissipation. The external shape of the circuit board 2 is 13.5 mm × 13.5 mm × 0.9 mm or 19.0 mm × 19.0 mm × 0.9 mm. The partition members 3a and 3b are obtained by kneading and curing white reflective fine particles such as titanium oxide and alumina in a silicone resin, and have a width of about 1 mm and a height of about 3 mm. The outer diameter of the outer partition member 3b is 11.2 mm or 17.0 mm. The transparent resin layers 6a and 6b use a silicone resin because of heat resistance and light resistance. Similarly, the planar lens 8 is also made of a silicone resin and has a thickness of 0.5 to 1 mm. The mounting form of the LED elements 1a and 1b is not limited to flip chip mounting, but may be face-up mounting using die bonding and wire bonding.

  As described above, the first light emitting portion 5A is formed inside the partition member 3a by the LED element group 1A and the transparent resin layer 6a. Similarly, the second light emitting portion 5B is formed between the partition members 3a and 3b by the LED element group 1B and the transparent resin layer 6b. Each light emitting section 5A, 5B is connected to the drive electrodes 2a, 2b, 2d via the wiring electrodes 2h on the circuit board 2, and is individually lit and driven by the drive voltage applied to the drive electrodes 2a, 2b, 2d. The

  As described above, the drive electrode 2d is a common electrode, the drive electrode 2a is connected to the first light emitting unit 5A, and the drive electrode 2b is connected to the second light emitting unit 5B. At this time, when a drive voltage is applied between the drive electrode 2a and the drive electrode 2d, the first light emitting unit 5A is turned on. Similarly, when a drive voltage is applied between the drive electrode 2b and the drive electrode 2d, the second light emitting unit 5B is turned on. Further, when a driving voltage is applied simultaneously between the driving electrode 2a and the driving electrode 2d and between the driving electrode 2b and the driving electrode 2d, both the first light emitting unit 5A and the second light emitting unit 5B are turned on simultaneously.

  Next, the operation of the LED light emitting device 10 will be described. As shown in FIG. 2, the light emitted from the first light emitting unit 5A or the second light emitting unit 5B is collected by the planar lens 8 adhered to the upper portions of the transparent resin layers 6a and 6b. As a result, luminous efficiency is improved. A smaller spot illumination light can be obtained by causing only the first light emitting portion 5A to emit light. Further, a larger spot of illumination light can be obtained by causing the first light emitting unit 5A and the second light emitting unit 5B to emit light simultaneously. As a result, the spot shape of the illumination can be changed as necessary.

  In the present embodiment, the number of the light emitting units 5A and 5B is two. However, the number of the light emitting units is not limited to this and may be two or more.

(Second Embodiment)
Next, an LED light emitting device according to a second embodiment of the present invention will be described with reference to FIGS. FIG. 3 is a plan view of the LED light emitting device 20 according to the second embodiment of the present invention, and FIG. 4 is a cross-sectional view of the LED light emitting device 20 shown in FIG. The LED light-emitting device 20 in the second embodiment has the same basic configuration as the LED light-emitting device 10 in the first embodiment, and the same elements are denoted by the same reference numerals, and redundant descriptions are omitted.

  The LED light emitting device 20 in the second embodiment shares the circuit board 2, the LED element groups 1A and 1B, the partition members 3a and 3b, and the planar lens 8 with the LED light emitting device 10 in the first embodiment. The difference between the LED light emitting device 20 and the LED light emitting device 10 is that the LED light emitting device 20 is provided with phosphor layers 4a and 4b on the LED element groups 1A and 1B as shown in the sectional view of FIG. That is, the transparent resin layers 6a and 6b are laminated on the body layers 4a and 4b. That is, the first light emitting portion 5A is constituted by the LED element group 1A, the phosphor layer 4a, and the transparent resin layer 6a. Similarly, the second light emitting unit 5B is composed of the LED element group 1B, the phosphor layer 4b, and the transparent resin layer 6b.

  The phosphor layers 4a and 4b are obtained by kneading and curing a phosphor in a silicone resin, and have a thickness of 0.3 to 0.5 mm. The phosphor layer 4a is adjusted to a warm color system, and the phosphor layer 4b is adjusted to a cold color system. As an example of a method for adjusting the emission color, a blue LED is used for the LED elements 1a and 1b, the phosphor included in the phosphor layer 4b is YAG in the second light emitting unit 5B, and the phosphor is used in the first light emitting unit 5A. The phosphor included in the layer 4a may be YAG and CASN of red phosphor. Further, the phosphor layers 4a and 4b may have different thicknesses. By the way, the bulb color is about 3000K, warm white is about 3500K, white is about 4000 to 4500K, day white is about 5000K, and daylight is about 6500K.

  Next, the operation of the LED light emitting device 20 will be described. Similarly to the LED light-emitting device 10, the LED light-emitting device 20 also condenses light emitted from the first light-emitting unit 5A and the second light-emitting unit 5B by the planar lens 8 adhered to the upper portions of the transparent resin layers 6a and 6b. To do. When only the first light emitting unit 5A emits light, small spot illumination light is obtained. At this time, it becomes a warm-colored soft illumination light, so a calm atmosphere can be produced. On the other hand, when the first light emitting unit 5A and the second light emitting unit 5B are caused to emit light at the same time, large spot illumination light is obtained. Since the bright and cold-colored illumination light at this time can be obtained, an active atmosphere can be produced.

(Third embodiment)
Next, an LED light emitting device according to a third embodiment of the present invention will be described with reference to FIGS. 5 is a plan view of an LED light emitting device 30 according to a third embodiment of the present invention, FIG. 6 is a cross sectional view of the LED light emitting device 30 shown in FIG. 5, and FIG. 7 is a cross sectional view of the LED package 11 shown in FIG.

  The basic configuration of the LED light-emitting device 30 in the third embodiment of the present invention shown in FIGS. 5 and 6 is the same as that of the LED light-emitting device 20 in the second embodiment. Description is omitted. The difference between the LED light emitting device 30 and the LED light emitting device 20 is that the phosphor layer is mounted only on the upper surfaces of the plurality of LED elements included in the LED element groups 1A and 1B in the LED light emitting device 30 (hereinafter referred to as LED). A device having a phosphor layer individually provided on the upper surface of the element is called an LED package). Therefore, prior to the description of the LED light emitting device 30, the LED package will be described with reference to FIG.

  FIG. 7 is a cross-sectional view of the LED package 11 and shows a state where the LED package 11 is flip-chip mounted on the mounting substrate 12. The LED package 11 has terminal electrodes 15a and 15b for flip chip mounting on the lower surface, the phosphor layer 14 is mounted on the upper surface of the LED element 1, and the side surface of the LED element 1 is a reflective white resin. 13 is covered. Although not shown, a light emitting layer is provided on the lower surface of the LED element 1, and a reflective layer is provided below the light emitting layer.

  In the LED package 11, the light emitted from the LED element 1 is reflected directly or by the white resin 13 or the reflection layer described above and enters the phosphor layer 14. A part of the light incident on the phosphor layer 14 is wavelength-converted and emitted upward as white light.

  That is, unlike the LED light emitting device 20, the LED light emitting device 30 does not need to be provided with the common phosphor layers 4a and 4b. In general, the emission color varies depending on the element characteristics of the LED element, the thickness of the phosphor layer, and the phosphor concentration. In the LED light emitting device 20, the thickness of the phosphor layers 4a and 4b must be strictly controlled. However, the LED light emitting device 30 can adjust the phosphor layer 11 according to the element characteristics when manufacturing the LED package 11 in advance. As a result, the emission color can be easily managed.

  As shown in FIG. 7, the LED package 11 is flip-chip mounted on the pattern electrodes 12a and 12b provided on the surface of the circuit board 12 via the terminal electrodes 15a and 15b. At this time, the LED package 11 has the phosphor layer 14 placed on the upper surface of the LED element 1 and the side surface is covered with the reflective white resin 13. However, the present invention is not limited to this, and the LED package may be an LED package. The phosphor layer 14 may be placed only on the upper surface of the element 1, and the upper surface and side surfaces of the LED element 1 may be covered with the phosphor layer.

  Next, the overall configuration of the LED light emitting device 30 will be described with reference to FIGS. FIG. 5 is a plan view of the LED light emitting device 30 according to the third embodiment of the present invention, and FIG. 6 is a cross-sectional view taken along line AA of the LED light emitting device 30 shown in FIG.

  As described above, the LED light emitting device 30 in the third embodiment has the same basic configuration as the LED light emitting device 20 in the second embodiment. That is, in the LED light emitting device 30 and the LED light emitting device 20, the circuit board 2, the partition members 3a and 3b, and the planar lens 8 are common. The difference between the LED light emitting device 30 and the LED light emitting device 20 is that, in the LED light emitting device 20, the LED element groups 1A and 1B include the LED elements 1a and 1b and the phosphor layers 4a and 4b covering them. In LED light emitting device 30, LED element groups 1A and 1B are provided with LED packages 11a and 11b. The transparent resin layers 6a and 6b cover the phosphor layers 4a and 4b in the LED light emitting device 20, but the LED packages 11a and 11b in the LED light emitting device 30.

  Further, in the present embodiment, the phosphor layers 14 placed on the LED packages 11a and 11b are made different, a warm-colored phosphor layer 14a is placed on the LED package 11a, and a cold-colored phosphor layer 14b is placed on the LED package 11b. The phosphor layer 14b is placed.

  The LED packages 11a and 11b are provided with the pattern electrodes 12a and 12b shown in FIG. 7 corresponding to the LED packages 11a and 11b on the surface of the circuit board 2, and the LED packages 11a and 11b are provided on the pattern electrodes 12a and 12b. Flip chip mounting. Further, in the LED light emitting device 30, a blue LED is used for the LED element 1 (see FIG. 7), and YAG is contained in the phosphor layer 14 (see FIG. 7) of the LED package 11b constituting the second light emitting unit 5B. The phosphor layer 14 of the LED package 11a constituting the first light emitting unit 5A contains red phosphor CANS and the like together with YAG. As a result, the operation of the LED light emitting device 30 is substantially equal to that of the LED light emitting device 20.

(Fourth embodiment)
Next, an LED light emitting device according to a fourth embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a plan view of the LED light emitting device 40 according to the fourth embodiment of the present invention, and FIG. 9 is a cross-sectional view taken along line AA of the LED light emitting device 40 shown in FIG. The LED light emitting device 40 according to the fourth embodiment has the same basic configuration as the LED light emitting device 30 according to the third embodiment, and the same elements are denoted by the same reference numerals, and redundant descriptions are omitted.

  That is, the LED light emitting device 40 in the fourth embodiment and the LED light emitting device 30 in the third embodiment share the circuit board 2, the LED element groups 1 </ b> A, 1 </ b> B, and the planar lens 8. The LED light emitting device 40 and the LED light emitting device 30 are different from each other in that the LED light emitting device 40 omits the partition member 3a (see FIG. 5), only the partition member 3b, and a common transparent resin layer inside the partition member 3b. 6 is covered.

(Fifth embodiment)
Next, an LED light emitting device according to a fifth embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a plan view of an LED light emitting device 50 according to a fifth embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along line AA of the LED light emitting device 50 shown in FIG. The LED light-emitting device 50 according to the fifth embodiment has the same basic configuration as the LED light-emitting device 40 according to the fourth embodiment, and the same elements are denoted by the same reference numerals and redundant description is omitted.

  That is, the LED light emitting device 50 in the fifth embodiment and the LED light emitting device 40 in the fourth embodiment share the circuit board 2, the LED element groups 1 </ b> A and 1 </ b> B, and the planar lens 8. The difference between the LED light-emitting device 50 and the LED light-emitting device 40 is that the LED light-emitting device 50 omits the partition member 3b and covers the entire display portion with a common transparent resin 6. As a method for coating the transparent resin 6, it is preferable to integrally mold it using a molding die.

(Sixth embodiment)
Next, an LED light emitting device according to a sixth embodiment of the present invention will be described with reference to FIGS. FIG. 12 is a plan view of an LED light emitting device 60 according to a sixth embodiment of the present invention, and FIG. 13 is a cross-sectional view of the LED light emitting device 60 shown in FIG. The LED light-emitting device 60 in the sixth embodiment has the same basic configuration as the LED light-emitting device 50 in the fifth embodiment, and the same elements are denoted by the same reference numerals, and redundant description is omitted.

  The LED light emitting device 60 in the sixth embodiment and the LED light emitting device 50 in the fifth embodiment share the circuit board 2 and the LED element groups 1A and 1B, the transparent resin layer 6, and the planar lens 8. The LED light emitting device 60 and the LED light emitting device 50 are different from each other in the LED package group constituting the LED element group 1B of the LED light emitting device 60, in the LED package 11b in which the phosphor layer 14b is placed on the upper surface of the LED element 1, That is, the LED packages 11 c on which the phosphor layers are not placed are alternately arranged on the upper surface of the LED element 1.

  That is, the LED package group including the LED element group 1B includes the LED package 11b and the LED package 11c. In the present embodiment, the LED package 11c mixed with the LED package 11b has the LED element 1 (see FIG. 7) not covered with the phosphor layer, but the LED element 1 is covered with a transparent resin. It may be configured to emit blue light. Further, the LED package 11a and the LED package 11b may have the same emission color, or instead of the LED package 11c, an LED package having a different emission color from the LED package 11b may be prepared and mixed with the LED package 11b. . The ratio of the number of LED packages 11b and LED packages 11c is not limited to 1: 1, and is adjusted according to a desired emission color.

  Even if LED packages having different emission colors are mixed to form an LED package group as in this embodiment, the emission color of the light emitting unit can be adjusted. In the LED device 60 of the present embodiment, the LED package 11a constituting the first light emitting unit 5A emits light in a warm color. At this time, in the second light emitting unit 5B, in addition to the cold light emission by the LED package 11b, the blue light emission by the LED package 11c is mixed, and further, the bluish cold light emission can be obtained.

(Seventh embodiment)
Next, an LED light emitting device according to a seventh embodiment of the present invention will be described with reference to FIGS. FIG. 14 is a plan view of an LED light emitting device 70 according to a seventh embodiment of the present invention, and FIG. 15 is a cross-sectional view taken along line AA of the LED light emitting device 70 shown in FIG. The LED light-emitting device 70 in the seventh embodiment has the same basic configuration as the LED light-emitting device 30 in the third embodiment, and the same elements are denoted by the same reference numerals and redundant description is omitted.

  The LED light emitting device 70 in the seventh embodiment and the LED light emitting device 30 in the third embodiment share the circuit board 2, the LED element groups 1A and 1B, the partition members 3a and 3b, and the planar lens 8. The difference between the LED light emitting device 70 and the LED light emitting device 30 is that the LED light emitting device 70 does not provide a transparent resin layer between the partition members 3a and 3b, and the planar lens 8 is bonded to the upper surface of the partition members 3a and 3b. That is. That is, an air layer 6 n exists between the LED packages 11 a and 11 b and the flat lens 8.

  According to the said structure, since the difference of the refractive index of the air layer 6n provided in the upper part of LED element group 1A, 1B and the refractive index of the plane lens 8 becomes large, condensing property becomes high. Further, the number of steps for forming the transparent resin layer 6 (see FIG. 6) can be omitted.

1, 1a, 1b, 101a, 101b, 101c LED element 1A, 1B, 101A, 101B, 101C LED element group 2, 12, 102 Circuit board 2a, 2b, 2d Drive electrode 2h, 102h Wiring electrodes 102a, 102b, 102c, 102d Driving electrode 3a, 3b, 103a, 103b, 103c Partition member 4a, 4b, 14, 104a, 104b, 104c Fluorescent resin layer 5A, 105a First light emitting part 5B, 105b Second light emitting part 105c Third light emitting part 6, 6a, 6b Transparent resin layer 6n Air layer 8 Planar lens 10, 20, 30, 40, 50, 60, 70, 100 LED light emitting device 11, 11a, 11b, 11c LED package 12a, 12b Pattern electrode 13 White resin 15a, 15b Terminal electrode 100a LED module 10 Support frame 107 screw 108A first lens 108B second lens

Claims (12)

  In an LED light-emitting device comprising a first and second light-emitting portions that are concentrically formed with a plurality of LED elements on a circuit board, and a lens above the first and second light-emitting portions, 1. An LED light emitting device comprising: a transparent resin layer provided on top of the first and second light emitting portions, and a planar lens adhered to the top of the transparent resin layer. The LED light emitting device according to claim 1, wherein the first and second light emitting units have different colored light. The LED light-emitting device according to claim 1, wherein the planar lens is a fullnel lens.   The plurality of LED elements constituting the first and second light emitting portions are laminated with a phosphor layer and the transparent resin layer, the transparent resin layer is thicker than the phosphor layer, and is flat on the transparent resin layer. The LED light-emitting device according to claim 1, wherein a mold lens is adhered.   The LED light emitting device according to claim 4, wherein the phosphor layers included in the first and second light emitting units have different emission colors.   The LED light-emitting device according to claim 1, wherein the first and second light-emitting portions are separated by a partition member.   7. The plurality of LED elements included in the first and second light emitting units constitute an LED package in which a phosphor layer is placed on the upper surface of each LED element. LED light-emitting device of description. The LED light emitting device according to claim 7, wherein the LED package group including the plurality of LED packages included in the first or second light emitting unit includes LED packages of different light emission colors. The LED package group included in the first and second light emitting units includes an LED package having a phosphor layer placed on the upper surface of the LED element, and an LED package having no phosphor layer placed on the upper surface of the LED element. The LED light-emitting device according to claim 8, wherein the LED light-emitting device is mixed.   10. The LED light-emitting device according to claim 7, wherein the LED element constituting the LED package is flip-chip mounted on an electrode provided on the circuit board. 11.   In the LED light-emitting device, the first and second light-emitting portions having a plurality of LED elements formed concentrically on a circuit board, and a lens above the first and second light-emitting portions, An LED light-emitting device, wherein a partition member is provided between the first and second light-emitting portions, and a planar lens is bonded to the upper portion of the partition member. The LED light-emitting device according to claim 11, wherein the first and second light-emitting portions have different colored light from each other.

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