JP2014075509A - Image pick-up device and inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pick-up device in which a shading board and a sensor board can be arranged at a uniform interval of 50 μm or more.SOLUTION: An image pick-up deice 1 comprises: a sensor board 10 having a sensing region 5 in which a photodiode 13 is arranged; a shading board 40 arranged to face the surface of the sensor board on the side where the sensing region is formed, and on which a shading film 42 having an aperture 43 at a position corresponding to the photodiode is formed; a sealant formed to surround the sensing region and including a first gap material 22 forming a predetermined interval between the sensor board and shading board; and a translucent member 30 covering the sensing region on the inside of the sealant and filling between the sensor board and shading board. The translucent member is arranged in contact with any one of the sensor board and shading board, and includes a translucent pedestal 31 having irregularities on the surface, and a translucent resin 35 filling a space between the pedestal and the sensor board or shading board.

Description

  The present invention relates to an imaging apparatus and an inspection apparatus equipped with the imaging apparatus.

  In order to improve the portability and convenience of electronic devices such as biometric authentication devices and digital cameras, it is important to reduce the size of an image sensor (imaging device) that captures an object. For example, as described in Patent Document 1, a pinhole (light transmission region) is interposed between the microlens and the light receiving element so that the microlens, the light receiving element, and the pinhole correspond one-to-one. An imaging device that has been reduced in size by arranging a plurality of them is known.

In the imaging apparatus of Patent Document 1, a light receiving element is disposed on an optical axis connecting a pinhole and a microlens, and light (inspection light) to be inspected that is collected by the microlens and travels along the optical axis. The light is incident on the light receiving element.
In such an imaging device, when the light shielding substrate with the pinhole formed is inclined with respect to the sensor substrate with the light receiving element formed thereon, the light receiving element is placed on the optical axis connecting the pinhole and the microlens. Is not arranged, and light other than inspection light enters the light receiving element. In order to suppress such a problem, it is necessary to dispose the light shielding substrate and the sensor substrate so as to face each other at a uniform interval.

When the light shielding substrate is arranged close to the sensor substrate, for example, when a pin hole is formed immediately above the light receiving element, in addition to the inspection light traveling along the optical axis, other than the inspection light traveling in the oblique direction with respect to the optical axis Light also enters the light receiving element. On the other hand, if the light shielding substrate and the sensor substrate are separated at an appropriate interval, light in the optical axis direction (inspection light) that has passed through the pinhole is incident on the light receiving element, but is oblique to the optical axis that has passed through the pinhole. Directional light (light other than inspection light) does not enter the light receiving element. Specifically, a light-shielding film formed on the light-shielding substrate is present on the optical path of light other than inspection light traveling toward the light receiving element (light oblique to the optical axis). The light is shielded by the light shielding film, and incidence of light other than inspection light on the light receiving element is suppressed. For this reason, in order to allow the inspection light to selectively enter the light receiving element, it is necessary to separate (arrange) the light shielding substrate and the sensor substrate at an appropriate interval. Specifically, when the interval between the light shielding substrate and the sensor substrate is set to be equal to or greater than the arrangement pitch (approximately 50 μm to 100 μm) where the light receiving elements are arranged, the inspection light is selectively incident on the light receiving elements.
As described above, in the imaging apparatus of Patent Document 1, when the light shielding substrate and the sensor substrate are arranged at a uniform interval of approximately 50 μm or more, light other than the inspection light that becomes detection noise does not enter the light receiving element, and is highly accurate. Detection light can be detected.

Japanese Patent Laid-Open No. 5-100186

  However, for example, arranging a pair of substrates at a uniform interval of about several μm can be easily performed using a known technique such as a liquid crystal display device, but the pair of substrates is uniformly arranged at a large interval of approximately 50 μm or more. There was a problem that it was difficult to arrange.

Specifically, when a sealing material including a gap material of approximately 50 μm or more is formed at the peripheral edge using a known technique and a pair of substrates are arranged to face each other at an interval of approximately 50 μm, the inside of the sealing material is a cavity (air layer). ), The region away from the sealing material is easily deformed, and it is difficult to form a uniform interval over the entire substrate. Furthermore, interface reflection occurs at the boundary between the substrate and the air layer, causing a problem that the inspection light is attenuated. For this reason, it is necessary to fill the inside of the sealing material with a filler. For example, in a method in which a resin material is filled inside a sealing material and the resin material is cured, volume change (curing shrinkage) occurs when the resin material is cured. In a large interval of approximately 50 μm or more, the volume of the resin material filled in the gap is large, and the curing shrinkage of the resin material is also large. Therefore, the influence of the curing shrinkage of the resin material (substrate warpage) is increased, and there is a problem that it is difficult to dispose the light shielding substrate and the sensor substrate to face each other at a uniform interval. Furthermore, when a resin material is sandwiched between the light shielding substrate and the sensor substrate and one of the substrates is pressed against the other substrate, the resin material filled inside is surrounded by a sealing material because the capacity of the resin material is large. There is also a problem that the terminal protrudes outside the area and contaminates the terminals formed outside the sealing material.
As described above, there is a problem that it is difficult to uniformly arrange the light shielding substrate and the sensor substrate at a large interval of approximately 50 μm or more.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An imaging apparatus according to this application example is disposed opposite to a sensor substrate having a sensing region in which a photoelectric conversion element is disposed and a surface of the sensor substrate on which the sensing region is formed. A light-shielding substrate having a light-shielding film having an opening at a position corresponding to the conversion element, and a first space that surrounds the sensing region and forms a predetermined interval between the sensor substrate and the light-shielding substrate A sealing material including a gap material, and a translucent member that covers the sensing region inside the sealing material and is filled between the sensor substrate and the light shielding substrate, the translucent member comprising: A translucent pedestal that is disposed in contact with either the sensor substrate or the light-shielding substrate and has an uneven surface; and between the pedestal and the sensor substrate or the light-shielding substrate, or in front Characterized in that it contains, and the transparent resin filled between, on and between the sensor substrate and the light-shielding substrate pedestal and said sensor substrate or the light-shielding substrate.

  By forming a sealing material including a first gap material that forms a predetermined gap between the light shielding substrate and the sensor substrate around the sensing region, the light shielding substrate and the sensor substrate are arranged around the sensing region. Can be formed. In the sensing region surrounded by the sealing material, a translucent base composed of a translucent base and a translucent resin is filled, and a gap is formed between the sealing material and the translucent member. Has been. Since the said space | gap becomes a storage space of an excess translucent member, it can suppress that an extra translucent member protrudes outside the area | region enclosed with the sealing material. In addition, since the translucent member has a two-layer structure of a pedestal and a translucent resin, the translucent member in the translucent member is compared with the case where the translucent member is formed of only the translucent resin. The volume of the light resin can be reduced. Therefore, the influence of volume change (curing shrinkage) generated in the process of forming (curing) the light-transmitting resin can be reduced. Furthermore, since the surface of the pedestal has irregularities, the flow of the translucent resin in the planar direction can be suppressed, and the sealing material is a translucent resin when the light shielding substrate and the sensor substrate are joined. It becomes possible to reduce the pressure received from the. Accordingly, it is possible to prevent the translucent resin from protruding outside the region surrounded by the sealing material due to damage to the sealing material.

  Application Example 2 An imaging apparatus according to this application example is disposed so as to be opposed to a sensor substrate having a sensing region in which a photoelectric conversion element is disposed, and a surface of the sensor substrate on which the sensing region is formed. A light-shielding substrate having a light-shielding film having an opening at a position corresponding to the conversion element, and covering the sensing region and filled between the sensor substrate and the light-shielding substrate, and the sensor substrate and the light-shielding substrate. A translucent member that forms a predetermined interval therebetween, and the translucent member is disposed in contact with either the sensor substrate or the light-shielding substrate, and has a surface having irregularities on the surface. And between the pedestal and the sensor substrate or the light shielding substrate, or between the pedestal and the sensor substrate or the light shielding substrate, and between the sensor substrate and the light shielding substrate. And Hama been translucent resin, characterized in that it contains.

  Between the light shielding substrate and the sensor substrate, a translucent member made of a translucent pedestal and a translucent resin is filled so as to cover the sensing region. The translucent member has a two-layer structure of a pedestal and a translucent resin, and the pedestal is first processed to have a uniform thickness. The shape is reflected and has a uniform thickness. Furthermore, the volume of the translucent resin can be reduced by the pedestal compared to the case where the translucent member is formed only from the translucent resin, so that the influence of volume change in the process of forming the translucent resin is reduced. it can. Accordingly, since the light-transmitting member having a uniform thickness is filled between the light-shielding substrate and the sensor substrate, the light-shielding substrate and the sensor substrate can be arranged uniformly at a predetermined interval. In addition, since the surface of the pedestal has irregularities, the flow of the translucent resin in the planar direction can be suppressed, and the translucent resin protrudes to the outside when the light shielding substrate and the sensor substrate are joined. This can be prevented.

  Application Example 3 In the imaging device according to the application example described above, it is preferable that the pedestal includes a second gap material having translucency.

  The thickness of the pedestal can be made uniform by the second gap material included in the pedestal, and the flow of the translucent resin in the planar direction is suppressed by the unevenness of the pedestal surface formed by the second gap material. It is possible to prevent the translucent resin from protruding to the outside when the light shielding substrate and the sensor substrate are joined.

  Application Example 4 In the imaging device according to the application example described above, it is preferable that the pedestal is formed such that the outer peripheral side thickness of the sensing region is thicker than the thickness of the central portion.

  Since the thickness of the outer peripheral side of the pedestal is thicker than the central part, it is possible to suppress the flow of the translucent resin in the plane direction, and the translucent resin is placed outside when the light shielding substrate and the sensor substrate are joined. It is possible to prevent the protrusion.

  Application Example 5 In the imaging device according to the application example described above, it is preferable that the base is formed of a plurality of protrusions.

  The unevenness of the pedestal surface by the plurality of protrusions on which the pedestal is formed can suppress the flow of the translucent resin in the planar direction, and the translucent resin is outside when the light shielding substrate and the sensor substrate are joined. It is possible to prevent protrusion.

  Application Example 6 In the imaging device according to the application example described above, the predetermined interval is 50 μm or more, and the volume occupation ratio of the pedestal in the translucent member is 50% or more and 95% or less. preferable.

By separating the sensor substrate and the light-shielding substrate at a predetermined interval (50 μm or more) and arranging the microlens, the opening, and the photoelectric conversion element on the same optical axis, the object to be inspected that advances along the optical axis Light (inspection light) is allowed to enter the photoelectric conversion element, and incidence of light other than inspection light traveling in an oblique direction with respect to the optical axis can be suppressed. As described above, in order to allow the inspection light to selectively enter the photoelectric conversion element, it is preferable that the sensor substrate and the light shielding substrate are uniformly arranged at intervals of 50 μm or more.
For this reason, it is necessary to form a translucent member having a thickness corresponding to the interval between the sensor substrate and the light shielding substrate. The translucent resin constituting the translucent member undergoes volume change (curing shrinkage) during the manufacturing process. In order to form the translucent member with a uniform thickness, the occupancy ratio of the pedestal in the translucent member is increased, the occupancy ratio of the translucent resin is decreased, and the influence of the volume change is decreased. Is preferred. That is, it is preferable that the occupancy ratio of the pedestal in the translucent member is 50% or more and 95% or less, and the occupancy ratio of the translucent resin in the translucent member is reduced. In addition, if the occupation rate of translucent resin is 10% or more, a base surface unevenness | corrugation etc. can be absorbed and a translucent member can be arrange | positioned uniformly.

  Application Example 7 In the imaging device according to the application example, it is preferable that the pedestal is formed on the sensor substrate so as to cover the sensing region.

  A photoelectric conversion element is disposed in the sensing area of the sensor substrate to detect inspection light. By covering the photoelectric conversion element in the sensing region with a pedestal, the photoelectric conversion element can be protected from mechanical shock.

  Application Example 8 In the imaging device according to the application example, the light-shielding substrate includes the light-transmitting substrate on which the light-shielding film is formed, and the refractive index of the light-transmitting substrate and the light-transmitting property are included. The refractive index of the member is preferably equivalent.

  The detection light collected by the microlens sequentially passes through the opening (translucent substrate) and the translucent member of the light shielding substrate and enters the photoelectric conversion element of the sensor substrate. In this case, by making the refractive index of the opening (translucent substrate) equal to the refractive index of the translucent member, interface reflection at the boundary between the opening (translucent substrate) and the translucent member is performed. Can be suppressed. Accordingly, it is possible to suppress the attenuation of inspection light due to interface reflection.

  Application Example 9 In the imaging device according to the application example described above, a light-collecting substrate that is disposed so as to sandwich the light-shielding substrate with the sensor substrate and has a microlens at a position corresponding to the photoelectric conversion element is provided. It is preferable that

  The detection light collected by the microlens sequentially passes through the opening (translucent substrate) and the translucent member of the light shielding substrate and enters the photoelectric conversion element of the sensor substrate, so that the detection light is attenuated. And can efficiently enter the photoelectric conversion element.

  Application Example 10 In the imaging device according to the application example described above, it is preferable that an illumination substrate on which a light emitting element is disposed is disposed between the light shielding substrate and the light collecting substrate.

  Even if an illumination board is placed between the light-shielding board and the condensing board, the light emitted from the illumination board to the sensor board side is shielded by the light-shielding board, so that the detection target can be illuminated without illuminating the sensor board. it can. As a result, the imaging apparatus illuminates the inspection object and detects reflected light from the inspection object, so that it can be stably inspected in a dark place without being affected by external light. Furthermore, by arranging the illumination substrate between the light shielding substrate and the light collecting substrate, an increase in the volume of the imaging device due to the addition of the illumination substrate can be suppressed.

  Application Example 11 The inspection apparatus described in this application example includes the imaging device according to any one of the application examples described above and a control unit that performs inspection according to the detection result of the imaging device. It is characterized by.

  Since the inspection apparatus described in the application example includes the imaging apparatus described in the application example, the detection light can be detected with high accuracy without being affected by external light, and various inspections can be performed by the control unit. . For example, an inspection device capable of detecting necessary information with high accuracy by mounting the inspection device of this application example on a biosensor in a medical or health field such as a pulse meter, a pulse oximeter, or a blood glucose level measuring device. Can be provided. Furthermore, it is possible to provide a biometric authentication device as an inspection device that illuminates a finger with the imaging device of this application example, images a finger vein image with high accuracy, and performs personal authentication from the detection result. Furthermore, the inspection apparatus according to this application example can be applied to an image reading apparatus such as an image scanner, a copying machine, a facsimile, or a barcode reader.

FIG. 2 is an exploded perspective view of the imaging apparatus according to the first embodiment. FIG. 2 is a cross-sectional view of the imaging apparatus along the line A-A ′ in FIG. 1. 3 is a flowchart illustrating a manufacturing method of the imaging apparatus according to the first embodiment in the order of steps. Sectional drawing for every main processes along the A-A 'line of FIG. FIG. 4 is an exploded perspective view illustrating a configuration of an imaging apparatus according to a second embodiment. Sectional drawing along the A-A 'line of FIG. 9 is a flowchart illustrating a method for manufacturing an imaging device according to a second embodiment in the order of steps. Sectional drawing for every main processes along the A-A 'line | wire of FIG. Sectional drawing of the imaging device which shows the modification 1 of a base. Sectional drawing of the imaging device which shows the modification 2 of a base. Schematic which shows the structure of an inspection apparatus.

  Embodiments of the present invention will be described below with reference to the drawings. Such an embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. In each of the following drawings, the scale of each layer or each part is made different from the actual scale so that each layer or each part can be recognized on the drawing.

(Embodiment 1)
FIG. 1 is an exploded perspective view of the imaging apparatus according to the first embodiment. FIG. 2 is a cross-sectional view of the imaging apparatus along the line AA ′ in FIG. First, a schematic configuration of the imaging apparatus 1 according to the present embodiment will be described with reference to FIGS. 1 and 2.

"Overview of imaging device"
The imaging apparatus 1 according to the present embodiment is an image sensor that irradiates an irradiated body (not shown) with light and converts reflected light from the irradiated body into an electrical signal. The imaging device 1 includes a sensing region 5 in which a light emitting element 52 that illuminates an irradiated object, a photodiode 13 as a photoelectric conversion element that detects light (inspection light) reflected from the irradiated object, and the like are arranged. Have. The shape of the sensing region 5 is a square, and is illustrated by a broken line in FIGS.
Hereinafter, the direction along one side of the sensing region 5 close to the terminal 14 is the X axis direction, and the directions along the other two sides that are orthogonal to the one side and face each other are the Y axis direction, the X axis direction, and the Y axis direction. The thickness direction of the imaging device 1 will be described as the Z-axis direction.

  As shown in FIGS. 1 and 2, the imaging apparatus 1 includes a sensor substrate 10 in the Z-axis (+) direction, and a member that forms a predetermined interval between the sensor substrate 10 and the light-shielding substrate 40 (a sealing material 20, a light transmitting material 30), a light shielding substrate 40, an illumination substrate 50, and a microlens array (hereinafter referred to as MLA) substrate 60 are laminated in this order. Further, the light shielding substrate 40 and the illumination substrate 50, and the illumination substrate 50 and the MLA substrate 60 are bonded by a transparent adhesive 63 (FIG. 2), respectively.

  The sensor substrate 10 has a role of converting reflected light from the irradiated body into an electrical signal. The sensor substrate 10 includes a sensor substrate main body 11, a photodiode 13 formed on the Z-axis (+) direction side surface of the sensor substrate main body 11, a circuit unit 12, a terminal 14, and the like. The sensor substrate body 11 may be an insulating substrate, and glass, quartz, resin, ceramic, or the like can be used. The photodiode 13 is composed of, for example, a photoelectric conversion element having a PIN type semiconductor layer as a photoelectric conversion layer, and can detect light in the near infrared region. In the sensing region 5, the photodiodes 13 are arranged at equal intervals in the X-axis direction and the Y-axis direction, and the interval (arrangement pitch) is approximately 100 μm. The circuit unit 12 is configured by a complementary transistor including, for example, an n-channel transistor and a P-channel transistor. The terminal 14 is connected to an external circuit (not shown) and supplies a control signal from the external circuit to the circuit unit 12.

  The sealing material 20 includes a first gap material 22 that forms a predetermined interval (approximately 100 μm) between the sensor substrate 10 and the light shielding substrate 40, and is arranged in a frame shape so as to surround the sensing region 5. With the frame-shaped sealing material 20, the sensor substrate 10 and the light shielding substrate 40 are arranged at an interval of approximately 100 μm.

The translucent member 30 is configured by a pedestal 31 and a translucent resin 35, and is disposed between the sensor substrate 10 and the light shielding substrate 40 so as to cover the sensing region 5. The pedestal 31 is disposed on the sensor substrate 10 side, and the thickness (length in the Z-axis direction) of the pedestal 31 is approximately 70 μm. The pedestal 31 has a configuration in which, for example, a second gap material 38 having a diameter of approximately 70 μm that determines the thickness of the pedestal 31 is included in an ultraviolet curable resin. The surface of the pedestal 31 on the light shielding substrate 40 side is formed in an uneven shape since the ultraviolet curable resin is covered following the outer shape of the second gap member 38. Note that the second gap member 38 is formed of a translucent member. The pedestal 31 has a role of protecting the photodiode 13 disposed in the sensing region 5 of the sensor substrate 10 from mechanical shock. The translucent resin 35 is disposed on the light shielding substrate 40 side (between the base 31 and the light shielding substrate 40), and the thickness of the translucent resin 35 is approximately 30 μm. As described above, since the light-transmitting member 30 having a thickness of 100 μm is disposed (filled) in the sensing region 5 between the sensor substrate 10 and the light shielding substrate 40, the sensor substrate 10 and the light shielding substrate in the sensing region 5 are arranged. 40 can be arranged at a uniform interval (approximately 100 μm).
Further, a gap 39 (see FIG. 2) is formed between the sealing material 20 and the translucent member 30. The gap 39 is a storage space for storing the translucent resin 35 overflowing from the pedestal 31 in the manufacturing process described later, and has a role of suppressing the translucent resin 35 from protruding to the outside of the sealing material 20. ing.
The base 31 may be disposed on the light shielding substrate 40 side, and the translucent resin 35 may be disposed on the sensor substrate 10 side.

The light shielding substrate 40 includes a light shielding substrate main body 41 and a light shielding film 42 disposed on the surface of the light shielding substrate main body 41 on the Z-axis (−) direction side. The light shielding substrate body 41 is a translucent substrate, and glass, quartz, resin, or the like can be used. The light shielding film 42 may be a film having a light shielding property, and for example, a metal film such as Cr can be used. An opening 43 is formed in the light shielding film 42 at a position corresponding to the photodiode 13, and the inspection light reflected from the irradiated object passes through the opening 43 and enters the photodiode 13.
As described above, the translucent member 30 is disposed between the sensor substrate 10 and the light shielding substrate 40, and the inspection light that has passed through the opening 43 passes through the translucent member 30 and enters the photodiode 13. It is supposed to be. The refractive index of the translucent member 30 is substantially equal to the refractive index of the light shielding substrate body 41. As a result, the interface reflection at the boundary between the light shielding substrate main body 41 and the translucent member 30 in the opening 43 is suppressed, so that the attenuation of the inspection light can be suppressed.

  The illumination board 50 includes an illumination board body 51, a light emitting element 52 formed on the surface of the illumination board body 51 on the Z-axis (+) direction side, and the like. The light emitting element 52 is an organic electroluminescence element that emits near-infrared light in the Z-axis (+) direction, and includes an anode (not shown), a light emitting function layer (not shown), and a cathode (not shown). ing. The light emitting elements 52 are arranged in a matrix in the sensing region 5 so as to illuminate the irradiated object uniformly.

  The MLA substrate 60 is an example of a “condensing substrate”, and has a role of condensing the light to be inspected reflected from the irradiated body and guiding it to the photodiode 13. The MLA substrate 60 includes an MLA substrate main body 61, a microlens 62 formed on the surface of the MLA substrate main body 61 on the Z-axis (−) direction side, and the like. The MLA substrate body 61 is a translucent substrate, and glass, quartz, resin, or the like can be used. The microlens 62 is a spherical lens or an aspherical lens formed of transparent resin or glass, and is arranged in a matrix in the sensing region 5. The microlens 62 can be formed using a reflow method, an area gradation mask method, a microlens method, a molding method, or the like.

“Overview of Sensing Area”
Next, an outline of the sensing area 5 (inspection light detection method and the like) will be described.
In the sensing region 5, the photodiodes 13, the openings 43, the light emitting elements 52, the microlenses 62, and the like are arranged in a matrix shape, and each correspond to one to one. 1 and 2 is an imaginary line connecting the center of one of the plurality of microlenses 62a and the center of the opening 43, and is parallel to the Z-axis direction. It has become. In FIG. 2, an arrow with a reference numeral 7 indicates inspection light (hereinafter referred to as inspection light 7) incident on one of the photodiodes 13 arranged in a plurality. The photodiode 13 corresponds to the microlens 62a. The arrow labeled 8 indicates light traveling on the optical path connecting the adjacent microlens 62b and the photodiode 13, that is, other than the inspection light 7 traveling toward the photodiode 13 from the adjacent microlens 62b. Light (hereinafter referred to as unnecessary light 8).

  The microlens 62 a, the opening 43, and the photodiode 13 are disposed on the optical axis 6, and the light emitting element 52 is disposed at a position away from the optical axis 6. As a result, the inspection light 7 collected by the micro lens 62 a is not blocked by the light emitting element 52. Further, a region intersecting with the optical axis 6 of the illumination substrate 50 (a region through which the inspection light 7 passes) has translucency, and the inspection light 7 passes (transmits) through the illumination substrate 50. Yes.

  As shown in FIG. 2, the light condensed by the microlens 62 a and traveling along the optical axis 6 becomes the inspection light 7. That is, the inspection light 7 passes through the micro lens 62 a of the MLA substrate 60, the translucent region of the illumination substrate 50, the light shielding substrate 40, the opening 43, and the translucent member 30, and enters the photodiode 13 of the sensor substrate 10. Incident. In other words, light incident on the microlens 62 a from directly above the microlens 62 a (Z-axis direction) travels along the optical axis 6 and enters the photodiode 13. That is, in the sensing region 5, it is possible to capture image information of a subject that enters the microlens 62a from the Z-axis direction.

  The microlens 62 a is a so-called convex lens, and light (image information on the subject) collected by the microlens 62 a forms an image on the light receiving surface of the photodiode 13. Further, the light shielding substrate 40 is disposed approximately 100 μm away from the sensor substrate 10 by the translucent member 30. The distance between the light shielding substrate 40 and the sensor substrate 10 is equal to the arrangement pitch (approximately 100 μm) of the photodiodes 13 arranged in the sensing region 5 of the sensor substrate 10. With the sensor substrate 10 and the light-shielding substrate 40 facing each other at an interval of approximately 100 μm, the opening size of the opening 43 is the minimum size that allows the inspection light 7 collected by the microlens 62 a to pass through the opening 43. Has been processed. As a result, unnecessary light 8 inserted from the adjacent microlenses 62 b is reflected (light-shielded) by the light-shielding film 42 of the light-shielding substrate 40, and the incidence on the photodiode 13 is suppressed. In addition to the unnecessary light 8, light other than the inspection light 7 exists. All of the light other than the inspection light 7 travels in an oblique direction with respect to the optical axis 6 and is shielded from light by the light shielding film 42 of the light shielding substrate 40 and is prevented from entering the photodiode 13. Since light other than the inspection light 7 becomes detection noise of the photodiode 13, high-precision image information with small detection noise can be captured by the photodiode 13 by shielding light other than the inspection light 7.

As described above, in order to shield the unnecessary light 8 and selectively allow the inspection light 7 to be incident on the photodiode 13, the light shielding substrate 40 and the sensor substrate 10 are arranged at an interval equal to or larger than the arrangement pitch of the photodiodes 13. It is important to arrange them in parallel.
When a region in which the light shielding substrate 40 is disposed obliquely with respect to the sensor substrate 10 is generated due to warpage of the substrate, the photodiode 13 is not disposed on the optical axis 6 in the region, and the inspection light 7 is not incident. This problem occurs. In order to avoid such a problem, it is preferable to form the gap between the light shielding substrate 40 and the sensor substrate 10 with an accuracy of ± 5% or less.
In the present embodiment, the arrangement pitch of the photodiodes 13 is approximately 100 μm, and the light shielding substrate 40 and the sensor substrate 10 are arranged in parallel at a uniform interval of approximately 100 μm. Since the present invention has a suitable manufacturing method for arranging the light shielding substrate 40 and the sensor substrate 10 at a uniform interval, an outline thereof will be described below.

"Outline of manufacturing method that arranges light-shielding substrate and sensor substrate at uniform intervals"
FIG. 3 is a flowchart showing a manufacturing method in which the light-shielding substrate and the sensor substrate are arranged at uniform intervals in the order of steps. FIG. 4 is a cross-sectional view of each main process along the line AA ′ in FIG. In FIG. 4, the sensing region 5 is indicated by a broken line so that the positions of the components formed in each process can be seen. Hereinafter, the outline of the manufacturing method according to the present embodiment will be described with reference to FIGS. 3 and 4.

In the step S1 (FIG. 3), the base precursor 33 is formed by applying a first ultraviolet (hereinafter referred to as UV) cured resin 32 containing the second gap material 38 to the sensor substrate 10 by a dispenser. To do. The first UV curable resin 32 is an example of a “photocurable resin”, and is composed of a UV curable epoxy resin having a viscosity of about 100 to 900 cP (mPa · s), approximately 500 cP (mPa · s) in this example. Is done. The first UV curable resin 32 covers the sensing region 5 and is applied to the periphery of the sensing region 5 to form a pedestal precursor 33.
FIG. 4A shows a state immediately after the application of the first UV curable resin 32. As shown in FIG. 4A, immediately after application of the first UV curable resin 32, a plurality of first UV curable resins 32 applied and formed in a line along the X-axis direction are formed in the Y-axis direction. A pedestal precursor 33 that is arranged and includes the second gap member 38 is formed. For this reason, the surface (surface on the Z-axis (+) direction side) of the base precursor 33 has irregularities, and the thickness (length in the Z-axis direction) changes periodically.

In the step S2 (FIG. 3), the applied first UV curable resin 32 is allowed to stand for a certain period of time, the first UV curable resin 32 is caused to flow, and leveling is performed to make the thickness of the base precursor 33 uniform. To implement. The thickness of the base precursor 33 depends on the application amount of the first UV curable resin 32 and the size of the second gap material 38. In the step of curing the first UV curable resin 32 to be described later, the first UV curable resin 32 shrinks in volume. In consideration of this volume shrinkage, the base precursor 33 is formed so as to be thicker than the thickness of the base 31 (approximately 70 μm). Specifically, the thickness of the pedestal precursor 33 is approximately 74 μm, and the size of the second gap member 38 is approximately φ65 μm.
FIG. 4B shows the state of the pedestal precursor 33 after being leveled. In step S2, the area of the surface of the pedestal precursor 33 is such that the first UV curable resin 32 covers the surface of the second gap member 38 due to the surface tension and its own weight of the first UV curable resin 32. So that the first UV curable resin 32 flows. As a result, the surface of the pedestal precursor 33 forms an uneven surface that follows the surface of the second gap member 38.

  In step S3 (FIG. 3), the base precursor 33 is irradiated with UV light, and the first UV curable resin 32 is cured (solidified) to form the base 31. As a result, the pedestal precursor 33 having the shape shown in FIG. As shown in FIG. 4C, the pedestal 31 has a trapezoidal cross section in which the side on the side in contact with the sensor substrate 10 is long. Moreover, the edge part of the base 31 becomes a taper shape inclined with respect to the Z-axis (+) direction. The base precursor 33 shrinks in volume during curing with UV light, and the thickness of the base 31 is approximately 70 μm.

  The resin material forming the pedestal precursor 33 may be either a thermosetting resin or a resin having thermosetting and photocuring properties. Even when these resins are used, the same leveling treatment is performed so that the surface of the second gap material 38 is covered with the first UV curable resin 32 by the surface tension and weight of the resin, and the pedestal precursor. The first UV curable resin 32 flows so that the surface area of 33 is minimized. As a result, the surface of the pedestal precursor 33 is formed so as to have irregularities that follow the surface of the second gap material 38. Even in the case of using either a thermosetting resin or a resin having thermosetting and photocuring properties, the same volume shrinkage occurs at the time of curing. 70 μm), it is necessary to form the pedestal precursor 33 in anticipation of volume shrinkage.

In step S4 (FIG. 3), the second UV curable resin 21 is applied around the sensing region 5 on the sensor substrate 10 by a dispenser so as to surround the pedestal 31. The second UV curable resin 21 includes a first gap material 22 of 100 μm and is an example of “an adhesive including a first gap material having a predetermined interval”. Specifically, the second UV curable resin 21 is made of a UV curable epoxy resin having a viscosity of about 100,000 to 900,000 cP, and in this example, approximately 600,000 cP. The thickness (the length in the Z-axis direction) of the second UV curable resin 21 is approximately 140 μm, and is pressed and solidified in a process described later to become the sealing material 20 having a thickness of approximately 100 μm.
FIG. 4C is a diagram showing a state after the second UV curable resin 21 is applied. As shown in FIG. 4C, the second UV curable resin 21 is formed in a frame shape surrounding the sensing region 5. The second UV curable resin 21 is a highly viscous resin having a viscosity of about 100,000 to 900,000 cP, approximately 600,000 cP in this example, and has a thickness of 140 μm due to the first gap material 22 dispersed therein. Even if formed, a change in shape (a change in thickness) can be suppressed.

In step S5 (FIG. 3), the thermosetting resin 36 is applied to the surface of the pedestal 31 (the surface on the light shielding substrate 40 side) by a dispenser. The thermosetting resin 36 is an example of a “translucent resin material”. Moreover, the viscosity of the thermosetting resin 36 is about 100 to 900 cP, and is approximately 300 cP in this example.
FIG. 4D is a diagram illustrating a state after application of the thermosetting resin 36. Since the thermosetting resin 36 has a low viscosity (about 100 to 900 cP, approximately 300 cP in this example), the thermosetting resin 36 flows (spreads) on the surface of the base 31 by the surface tension and the own weight of the thermosetting resin 36. As a result, as shown in FIG. 4D, the thermosetting resin 36 is formed so as to cover the surface of the base 31. The application amount (drop amount) of the thermosetting resin 36 will be described later.

  In step S6 (FIG. 3), the light-shielding substrate 40 and the sensor substrate 10 are overlapped and joined at a predetermined position. This superposition process is performed in a state where the external atmosphere is depressurized (depressurized atmosphere), and the light shielding substrate 40 and the sensor substrate are superposed at a predetermined position while being pressed. In the step S <b> 6, a sealed space surrounded by the sensor substrate 10, the light shielding substrate 40, and the second UV curable resin 21 is formed. The sealed space is filled with a thermosetting resin 36.

  In step S7 (FIG. 3), the external atmosphere is changed from a reduced pressure state to an atmospheric pressure, irradiated with UV light, the second UV curable resin 21 is cured (solidified), and the sealing material 20 is formed. To do. Since the sealed space (the space filled with the thermosetting resin 36) formed in the reduced pressure atmosphere in step S6 has a negative pressure compared to the atmospheric pressure, the external atmosphere is reduced from the reduced pressure to the atmospheric pressure. When changed, a large pressure corresponding to the pressure difference between the pressure (negative pressure) in the reduced pressure atmosphere and the atmospheric pressure acts uniformly on the sealed space. That is, when the external atmosphere is changed from the reduced pressure state to the atmospheric pressure, the large force described above acts uniformly between the light shielding substrate 40 and the sensor substrate 10, and the second UV curable resin 21 is The gap material 22 is compressed to a thickness (approximately 100 μm). The compressed second UV curable resin 21 is solidified with UV light, and the sealing material 20 is formed to form a predetermined interval (approximately 100 μm) between the sensor substrate 10 and the light shielding substrate 40.

  FIG. 4E is a diagram illustrating a state after the external atmosphere is changed to atmospheric pressure in the step S7. As described above, a large force acts uniformly between the surface on the Z-axis direction side of the light shielding substrate 40 and the surface on the Z-axis direction side of the sensor substrate 10, and the distance between the light shielding substrate 40 and the sensor substrate 10 is as follows. , Approximately 140 μm to approximately 100 μm. At this time, the distance between the surface of the pedestal 31 and the light shielding substrate 40 is changed from approximately 70 μm to approximately 30 μm, and the thermosetting resin 36 filled between the surface of the pedestal 31 and the light shielding substrate 40 is replaced with the pedestal. It overflows around 31. The thermosetting resin 36 overflowing from the surface of the pedestal 31 accumulates in the gap 39 between the sealing material 20 (second UV curable resin 21) and the pedestal 31, and the sealing material 20 (second UV curable resin). The application amount of the thermosetting resin 36 in step S5 is set so as not to protrude from 21).

  Specifically, the application amount of the thermosetting resin 36 in the step S5 is such that when the sensor substrate 10 and the light-shielding substrate 40 are arranged at a predetermined interval (approximately 100 μm) in the step S7, the sensor substrate 10, the light shielding substrate 40, the sealing material 20, and the base 31 are set to be smaller than the volume of the space. As a result, the thermosetting resin 36 overflowing from the surface of the pedestal 31 accumulates in the gap 39 between the sealing material 20 and the pedestal 31 and does not protrude from the sealing material 20.

  When the thermosetting resin 36 protrudes from the sealing material 20, the terminal 14 is contaminated, and there is a possibility that the electrical connection between the external circuit (not shown) and the terminal 14 is hindered. As described above, in the process of step S5, such a terminal 14 is set by setting the application amount of the thermosetting resin 36 so that the thermosetting resin 36 does not protrude from the sealing material 20. Contamination can be suppressed. In addition, the unevenness formed on the surface of the pedestal 31 suppresses the flow of the thermosetting resin 36 so that the thermosetting resin 36 does not protrude from the sealing material 20. Further, the gap 39 formed between the sealing material 20 and the pedestal 31 has a role of a reservoir for storing the thermosetting resin 36 overflowing from the surface of the pedestal 31 in the step S7. This is an important component for preventing the thermosetting resin 36 from protruding from the sealing material 20. That is, in order to form the gap 39, in the step S4, it is preferable to apply the second UV curable resin 21 that is a precursor of the sealing material 20 apart from the base 31 by about 0.3 mm to 1 mm. .

In step S8 (FIG. 3), heat treatment is performed to cure (solidify) the thermosetting resin 36, and the translucent resin 35 having a thickness of approximately 30 μm is formed between the base 31 and the light shielding substrate 40. Form. The refractive index of the translucent resin 35, the refractive index of the second gap member 38, and the refractive index of the pedestal 31 are substantially the same as the refractive index of the light shielding substrate body 41. Therefore, the boundary (interface) between the light shielding substrate body 41 and the translucent resin 35, the boundary (interface) between the pedestal 31 and the second gap member 38, and the boundary between the translucent resin 35 and the pedestal 31. Thus, interface reflection based on the difference in refractive index can be suppressed. Further, since the thermosetting resin 36 is applied in a reduced-pressure atmosphere, it is possible to suppress the mixing of bubbles into the thermosetting resin 36, that is, the mixing of bubbles into the translucent resin 35. When mixing of bubbles into the translucent resin 35 is suppressed, interface reflection at the boundary between the bubbles and the translucent resin 35 based on the difference in refractive index can be suppressed.
Further, the refractive index of the transparent adhesive 63 disposed in the gap between the MLA substrate 60 and the illumination substrate 50 and the gap between the illumination substrate 50 and the light shielding substrate 40, the refractive index of the MLA substrate body 61, and the illumination substrate body 51 The refractive index and the refractive index of the light-shielding substrate body 41 are substantially equal, and the same interface reflection is suppressed. In addition, since the transparent adhesive 63, the first UV curable resin 32, the second UV curable resin 21, and the thermosetting resin 36 are defoamed in a reduced pressure atmosphere, Contamination is suppressed.

  In the present invention, after the pedestal 31 is formed, the sealing material 20 that forms a predetermined gap is formed, and the filling amount of the thermosetting resin 36 filled between the light shielding substrate 40 (pedestal 31) and the sensor substrate 10 is set. It is small. For this reason, it is possible to reduce the volume shrinkage of the thermosetting resin 36 that occurs when the thermosetting resin 36 is cured in the step S8. As a result, the influence (substrate warpage) due to the volume shrinkage is reduced, and even if the light shielding substrate 40 and the sensor substrate 10 are arranged at a large interval of approximately 100 μm, the warpage of the light shielding substrate 40 or the sensor substrate 10 is small. Therefore, the light shielding substrate 40 and the sensor substrate 10 can be arranged at a uniform interval. Further, since the gap 39 is formed around the thermosetting resin 36, the influence of volume shrinkage generated during the solidification process of the thermosetting resin 36 is also mitigated by the gap 39.

Thus, in order to arrange the light shielding substrate 40 and the sensor substrate 10 at a uniform interval, the base 31 is first formed in the space surrounded by the sensor substrate 10, the light shielding substrate 40, and the sealing material 20, It is important to reduce the filling amount of the thermosetting resin 36 filling the space.
In the process of step S3 (FIG. 3) formed by the pedestal 31, volume shrinkage of the first UV curable resin 32 forming the pedestal 31 occurs, but before the step S6 of forming a predetermined interval. Since the pedestal 31 is formed, the volume shrinkage does not affect the predetermined interval.
Further, in the volume of the space surrounded by the sensor substrate 10, the light shielding substrate 40, and the sealing material 20, that is, the volume of the space in which the translucent member 30 is disposed, the volume occupation ratio of the pedestal 31 is 50% or more. Since the base 31 is formed, the thermosetting resin 36 is filled so that the volume occupation ratio of the thermosetting resin 36 is less than 50%, and the filling amount of the thermosetting resin 36 is small. The influence of volume shrinkage generated during the solidification process of the thermosetting resin 36 is reduced, and the light shielding substrate 40 and the sensor substrate 10 can be arranged at a predetermined interval (approximately 100 μm).

The smaller the volume occupancy of the thermosetting resin 36, the smaller the volume shrinkage in the solidifying process of the thermosetting resin 36. Therefore, the sensor substrate 10 and the light shielding substrate 40 can be arranged at a more uniform interval. Therefore, it is preferable that the volume occupation ratio of the thermosetting resin 36 is smaller and the volume occupation ratio of the base 31 is larger.
Further, the pedestal 31 can be formed with a thickness of 100 μm or more, but the pedestal 31 becomes thicker as the thickness of the pedestal 31 becomes larger due to dripping of the first UV curable resin 32 constituting the pedestal precursor 33. Is difficult to make into a predetermined shape. Considering the manufacturing conditions of the pedestal 31, the thickness of the pedestal 31 is preferably 100 μm or less.

As described above, according to the imaging apparatus 1 according to the present embodiment, the following effects can be obtained.
(1) Since the light shielding substrate 40 and the sensor substrate 10 are arranged at a predetermined interval (approximately 100 μm) suitable for the inspection light 7 to selectively enter the photodiode 13, the inspection light that becomes detection noise Light other than 7 can be suppressed. Therefore, it is possible to provide the imaging device 1 that can perform highly accurate detection with less noise components.

(2) Since a pedestal 31 is formed in the space surrounded by the sensor substrate 10, the light shielding substrate 40, and the sealing material 20, the filling amount of the thermosetting resin 36 filled in the space is small. In addition, the influence of volume shrinkage (substrate warpage) that occurs during the solidification process of the thermosetting resin 36 can be reduced, and the variation in the distance between the light shielding substrate 40 and the sensor substrate 10 (substrate warpage) can be reduced.
(3) Furthermore, since the pedestal 31 is formed in a process prior to the process of forming a predetermined interval between the light shielding substrate 40 and the sensor substrate 10, the volume shrinkage that occurs in the process of forming the pedestal 31 is blocked by the light shielding. It is possible to avoid affecting the distance between the substrate 40 and the sensor substrate 10.

(4) Since the process of superimposing the light shielding substrate 40 and the sensor substrate 10 is performed in a reduced-pressure atmosphere, it is possible to suppress mixing of bubbles into the thermosetting resin 36 (translucent resin 35). it can.
(5) Furthermore, the thermosetting resin 36 is filled, and the sealed space formed by the light shielding substrate 40, the sensor substrate 10, and the sealing material 20 has a negative pressure. When the external atmosphere is changed from the reduced pressure atmosphere to the atmospheric pressure, a large force based on the pressure difference between the negative pressure and the atmospheric pressure acts uniformly on the sealed air space. They can be arranged at predetermined intervals.

  (6) Since the refractive index of the translucent resin 35, the refractive index of the pedestal 31, the refractive index of the second gap member 38, and the light shielding substrate body 41 are substantially equal, the light shielding substrate body 41 and the light transmission substrate 35 are transparent. Suppresses interface reflection based on the difference in refractive index at the boundary (interface) between the light-sensitive resin 35, the boundary between the base 31 and the second gap member 38, and the boundary between the light-transmitting resin 35 and the base 31. be able to.

(7) The application amount of the thermosetting resin 36 is set to be smaller than the space surrounded by the sensor substrate 10, the light shielding substrate 40, the pedestal 31, and the sealing material 20. It is possible to suppress the resin 36 from protruding from the space, that is, the sealing material 20.
Moreover, since the unevenness | corrugation is formed in the surface of the base 31, the flow to the planar direction of the thermosetting resin 36 is suppressed by the unevenness | corrugation, and damage (damage | damage by the thermosetting resin 36 to the sealing material 20 is carried out. ) Can be prevented. This prevents the thermosetting resin 36 from protruding out of the sealing material 20 due to damage to the sealing material 20.
In addition, since the gap 39 is formed between the sealing material 20 and the pedestal 31, the thermosetting resin 36 can be stored in the gap 39 so as not to protrude from the sealing material 20. Further, the void 39 can mitigate the effect of volume shrinkage that occurs during the solidification process of the thermosetting resin 36.

In order to make the sensing region 5 smaller and higher in density, it is necessary to further reduce the arrangement pitch of the photodiodes 13. Specifically, the arrangement pitch of the photodiodes 13 of this embodiment is about 100 μm. However, in order to make the sensing region 5 smaller and higher in density, the arrangement pitch of the photodiodes 13 is reduced to about 50 μm. It is preferable to do. In this case, it is preferable to arrange the light shielding substrate 40 and the sensor substrate 10 at an interval of approximately 50 μm or more. If the manufacturing method of this embodiment is applied, the light shielding substrate 40 and the sensor substrate 10 can be arranged at a uniform interval of approximately 50 μm or more.
Further, even when the light shielding substrate 40 and the sensor substrate 10 are arranged at an interval larger than that of this embodiment (an interval of about 100 μm or more), the light shielding substrate 40 and the sensor substrate 10 are applied by applying the manufacturing method of this embodiment. Can be arranged at uniform intervals.

  Furthermore, the manufacturing method of the present embodiment is a manufacturing method of an electronic device having a pair of substrates formed at a predetermined interval in addition to the imaging device 1 described above, for example, a touch panel as an electro-optical device such as a liquid crystal display device. The present invention can also be applied to a manufacturing method for sticking, a manufacturing method for attaching dustproof glass to an electro-optical device as a light valve in projector use, and the like.

(Embodiment 2)
FIG. 5 is an exploded perspective view showing the configuration of the imaging apparatus 2 according to the second embodiment, and corresponds to FIG. 6 is a cross-sectional view taken along the line AA ′ of FIG. 5 and corresponds to FIG. Hereinafter, with reference to FIGS. 5 and 6, the imaging apparatus 2 according to the present embodiment will be described focusing on differences from the first embodiment. Moreover, about the same component as Embodiment 1, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

"Overview of imaging device"
In the imaging apparatus 1 according to the first embodiment, in order to arrange the sensor substrate 10 and the light shielding substrate 40 at a predetermined interval, the sealing material 20 and the translucent member 30 (pedestal) are provided between the sensor substrate 10 and the light shielding substrate 40. 31, translucent resin 35) was disposed (see FIGS. 1 and 2).

As shown in FIGS. 5 and 6, in the imaging device 2 according to the present embodiment, a translucent member 30 (a pedestal 31 and a translucent resin 35) is disposed between the sensor substrate 10 and the light shielding substrate 40. However, the point which the sealing material 20 in Embodiment 1 is not arrange | positioned differs from Embodiment 1. FIG.
Further, the thickness of the constituent material of the translucent member 30 (the length in the Z-axis direction), that is, the thickness of the base 31 and the thickness of the translucent resin 35 are also different from those of the first embodiment. In the imaging apparatus 1 according to the first embodiment, the thickness of the pedestal 31 is approximately 70 μm, and the thickness of the translucent resin 35 is approximately 30 μm. In the imaging device 2 according to this embodiment, the thickness of the pedestal 31 is approximately 90 μm, and the thickness of the translucent resin 35 is approximately 10 μm. That is, compared with Embodiment 1, the thickness (volume) of the base 31 is large, and the thickness (volume) of the translucent resin 35 is small.

  The pedestal 31 has a configuration in which, for example, a second gap material 38 having a diameter of approximately 90 μm that determines the thickness of the pedestal 31 is included in an ultraviolet curable resin. The surface of the pedestal 31 on the light shielding substrate 40 side is formed in an uneven shape since the ultraviolet curable resin is covered following the outer shape of the second gap member 38. Note that the second gap member 38 is formed of a translucent member.

"Outline of manufacturing method that arranges light-shielding substrate and sensor substrate at uniform intervals"
FIG. 7 is a flowchart showing a manufacturing method in which the light-shielding substrates are arranged at uniform intervals on the sensor substrate in order of steps, and corresponds to FIG. FIG. 8 is a cross-sectional view of each main process along the line AA ′ in FIG. 5 and corresponds to FIG.
In the present embodiment, the step of forming the sealing material 20, that is, the step S4 and the step S7 (see FIG. 3) according to the first embodiment are omitted. Hereinafter, the outline of the manufacturing process of the imaging device 2 according to the present embodiment will be described with reference to FIGS. 7 and 8.

In step S1 (FIG. 7), the first UV curable resin 32 is applied to the sensor substrate 10 by a dispenser to form the base precursor 33. The first UV curable resin 32 used here contains a second gap material 38.
FIG. 8A shows a state immediately after the application of the first UV curable resin 32. As shown in FIG. 8A, immediately after the application of the first UV curable resin 32, a linear first UV curable resin containing the second gap material 38 applied and formed along the X-axis direction. A plurality of 32 are arranged in the Y-axis direction, and a pedestal precursor 33 is formed. The surface of the pedestal precursor 33 (surface on the Z-axis (+) direction side) has irregularities, and the thickness (length in the Z-axis direction) changes periodically.

In step S2 (FIG. 7), the applied first UV curable resin 32 is allowed to stand for a certain period of time, the first UV curable resin 32 is allowed to flow, and leveling is performed to make the thickness of the base precursor 33 uniform. To do.
FIG. 8B is a diagram illustrating a state of the pedestal precursor 33 after leveling. As shown in FIG. 8B, the first UV curable resin 32 flows so that the surface area is minimized by the surface tension and the own weight of the first UV curable resin 32. As a result, the surface of the pedestal precursor 33 forms an uneven surface that follows the surface of the second gap member 38. The thickness of the base precursor 33 is approximately 95 μm, and the size of the second gap member 38 is approximately φ85 μm. The pedestal precursor 33 undergoes volume shrinkage in the step of solidifying the first UV curable resin 32 described later, and becomes a pedestal 31 having a thickness of approximately 90 μm.

  In step S3 (FIG. 7), UV light is irradiated to cure (solidify) the first UV curable resin 32, thereby forming the base 31. As described above, since the volume of the first UV curable resin 32 shrinks during the solidification process, the base precursor 33 having a thickness of approximately 95 μm becomes a base 31 having a thickness of approximately 90 μm.

In step S5 (FIG. 7), a thermosetting resin 36 is applied to the surface of the base 31 by a dispenser. The viscosity of the thermosetting resin 36 is approximately 300 cP.
FIG. 8C shows a state after the thermosetting resin 36 is applied. As shown in FIG. 8C, since the thermosetting resin 36 has a low viscosity (approximately 300 cP), the thermosetting resin 36 applied to the base 31 has a surface tension of the thermosetting resin 36. And it spreads by its own weight and comes to cover the surface of the pedestal 31.

In step S6 (FIG. 7), the light shielding substrate 40 is overlaid (bonded) at a predetermined position on the sensor substrate 10 and pressed, and the distance between the light shielding substrate 40 and the sensor substrate 10 (of the thermosetting resin 36). The thickness is approximately 11 μm. These steps are performed in a reduced pressure atmosphere. When the light shielding substrate 40 and the sensor substrate 10 are pressed, the thermosetting resin 36 protrudes from between the light shielding substrate 40 and the pedestal 31. When the thermosetting resin 36 protruding from between the light shielding substrate 40 and the pedestal 31 reaches the terminal 14, it is difficult to electrically connect to an external circuit (not shown). For this reason, it is necessary to adjust the application quantity of the thermosetting resin 36 in the process of step S5 so that it does not protrude to the terminal 14.
By carrying out the step S6 in a reduced-pressure atmosphere, air bubbles can be prevented from being mixed into the thermosetting resin 36. Further, if the thermosetting resin 36 that has been sufficiently degassed is used, the step S6 may be performed in the atmospheric pressure.

In step S8 (FIG. 7), heat treatment is performed to cure (solidify) the thermosetting resin 36, thereby forming a translucent resin 35 between the base 31 and the light shielding substrate 40. As described above, volume shrinkage occurs during the solidification process of the thermosetting resin 36, so that the thermosetting resin 36 having a thickness of approximately 11 μm becomes a light-transmitting resin 35 having a thickness of approximately 10 μm. .
FIG. 8D is a diagram illustrating a state after the process of step S8 is performed. The translucent resin 35 is formed between the light shielding substrate 40 and the pedestal 31 so as to cover the pedestal 31. The thickness of the translucent member 30 is approximately 100 μm. An interval (approximately 100 μm) between the light shielding substrate 40 and the sensor substrate 10 is formed by a pedestal 31 having a thickness of approximately 90 μm and a translucent resin 35 having a thickness of approximately 10 μm.

In the present embodiment, most of the distance between the light shielding substrate 40 and the sensor substrate 10 is formed by the pedestal 31. Specifically, the thickness of the pedestal 31 is set to be 90% of the interval between the light shielding substrate 40 and the sensor substrate 10. Thus, the pedestal 31 has an important role in order to arrange the light shielding substrate 40 and the sensor substrate 10 at a predetermined interval.
For this reason, in this embodiment, the base precursor 33 can be formed with a uniform thickness by including the second gap material 38 in the base precursor 33 for forming the base 31. Further, in the process of step S1 and the process of step S2, it is important to hold the sensor substrate 10 in a horizontal state, apply the first UV curable resin 32 to the sensor substrate 10, and flow (level) it. . If the sensor substrate 10 is inclined in the oblique direction, the first UV curable resin 32 flows in the inclined direction, so that the thickness of the base precursor 33 becomes nonuniform. By applying the first UV curable resin 32 on the horizontal surface of the sensor substrate 10 and performing leveling, the pedestal 31 (the pedestal precursor 33) has a uniform thickness.

  Since the occupation ratio of the translucent resin 35 in the interval between the light shielding substrate 40 and the sensor substrate 10 is approximately less than 10%, which is smaller than that of the first embodiment, the thickness of the translucent resin 35 varies. The influence of can be reduced. Specifically, volume shrinkage generated in the process of forming the light-transmitting resin 35 by solidifying the thermosetting resin 36 can be reduced. In step S6, the thermosetting resin 36 filled between the surface of the base 31 and the light shielding substrate 40 is pressed to a predetermined thickness. This pressing may be performed mechanically or may be performed by the weight of the light shielding substrate 40. Since the filling amount of the thermosetting resin 36 is small, variation in the thickness of the thermosetting resin 36 due to the pressing process is allowed.

  As described above, in this embodiment, 90% or more (95% or less) of the distance between the light shielding substrate 40 and the sensor substrate 10 is occupied by the pedestal 31 and the pedestal 31 is formed with a uniform thickness, thereby forming the light shielding substrate. The light-shielding substrate 40 and the sensor substrate 10 can be arranged at a predetermined interval by suppressing the fluctuation (variation) in the interval between the sensor 40 and the sensor substrate 10 to 10% or less (± 5% or less). That is, since the pedestal 31 is thicker than that in the first embodiment, the light shielding substrate 40 and the sensor substrate 10 can be arranged at a predetermined interval without forming the sealing material 20 in the first embodiment.

As described above, according to the imaging device 2 according to the present embodiment, in addition to the effects (1), (3), (4), and (6) in the first embodiment, the following effects can be obtained. it can.
(8) The first UV curable resin 32 is applied to the horizontal surface of the sensor substrate 10 while holding the sensor substrate 10 in a horizontal state, and leveled on the horizontal surface, whereby the first UV curable resin 32 is applied. A pedestal precursor 33 having a uniform thickness is formed by the surface tension and the own weight of 32. By irradiating the base precursor 33 with UV light and solidifying, the base 31 having a uniform thickness can be formed. At this time, volume shrinkage occurs in the pedestal 31, but since it is a pre-process for superimposing the sensor substrate 10 and the light shielding substrate 40, the distance between the sensor substrate 10 and the light shielding substrate 40 is not affected.

  (9) Furthermore, the base 31 occupies 90% or more (95% or less) of the translucent member 30, and the translucent resin 35 occupies less than 10% of the translucent member 30. The pedestal 31 is formed thicker than the pedestal 31, and the pedestal 31 is formed to a uniform thickness by the method described above. Therefore, the light shielding substrate 40 and the sensor substrate 10 can be arranged at a predetermined interval (approximately 100 μm) without forming the sealing material 20 in the first embodiment. Moreover, since the unevenness | corrugation is formed in the surface of the base 31, the flow of the thermosetting resin 36 is suppressed and the protrusion of the thermosetting resin 36 out of the base 31 can be decreased. Accordingly, it is possible to provide the imaging device 2 at a lower cost than in the first embodiment.

  Instead of forming the translucent resin 35 using the thermosetting resin 36, the translucent resin 35 is formed using a resin having both UV curable and thermosetting characteristics. You may do it. By imparting UV curability, it can be quickly cured.

  As in the first embodiment, the manufacturing method of this embodiment is a manufacturing method of an electronic device having a pair of substrates formed at a predetermined interval, for example, a manufacturing method of attaching a touch panel to an electro-optical device such as a liquid crystal display device. It can also be applied to a manufacturing method in which dust-proof glass is attached to an electro-optical device as a light valve in projector use.

  Note that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be added to the above-described embodiment. A modification will be described below.

(Modification 1 of imaging device)
In the imaging device 1 of Embodiment 1, the translucent resin 35 is filled between the pedestal 31 and the light shielding film 42 (see FIG. 2). The translucent resin 35 was a transparent solid formed by subjecting the thermosetting resin 36 to heat treatment.
In the imaging device of this modification, a translucent material filled between the pedestal 31 and the light shielding film 42, that is, a material corresponding to the translucent resin 35 in the first embodiment is used as a transparent material having fluidity. It is good.

As the transparent material having fluidity to be filled between the base 31 and the light shielding film 42, for example, organometallic compounds such as metal alkoxides, metal carboxylates, and metal chelates are preferable. Specific examples of the organometallic compound include an aluminum-based metal complex (manufactured by Futaba Electronics Co., Ltd., Auredry). Since such a metal complex has hygroscopicity in addition to translucency, for example, the influence of moisture on the photodiode 13 disposed in the sensing region 5 can be eliminated.
Other suitable examples of the transparent material having fluidity include high-viscosity liquids such as fluid paraffin, silicone oil, and modified silicone oil. When bubbles exist in the transparent liquid, the bubbles can be prevented from moving if they have high viscosity.

As described above, according to the imaging apparatus according to the present modification, in addition to the effects in the first embodiment, the following effects can be obtained.
In the present modification, the translucent material filled between the pedestal 31 and the light shielding film 42 does not undergo a volume change corresponding to the volume shrinkage when the thermosetting resin 36 in the first embodiment is cured. The interval between the light shielding substrate 40 and the sensor substrate 10 can be formed with higher accuracy.

(Modification 1 of base)
Next, the modification 1 of a base is demonstrated. FIG. 9 is a cross-sectional view corresponding to FIG. 2 of the first embodiment described above, illustrating the configuration of the first modification of the pedestal. Hereinafter, with reference to FIG. 9, Modification 1 of the pedestal will be described focusing on differences from the pedestal of the first embodiment. Moreover, about the same component as Embodiment 1, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

  As shown in FIG. 9, in the imaging device 1, a translucent member 30 (a base 31 and a translucent resin 35) is disposed between the sensor substrate 10 and the light shielding substrate 40. The pedestal 31 according to the modified example 1 is formed such that the outer peripheral side thickness of the sensing region 5 is thicker than the thickness of the central portion. That is, the upper surface 31a of the base 31 is formed so as to be concave from the outer peripheral portion toward the central portion. A translucent resin 35 is disposed between the base 31 and the light shielding substrate 40.

  Thus, by making the upper surface 31a of the pedestal 31 concave, when the sensor substrate 10 and the light shielding substrate 40 are joined, the flow resistance of the translucent resin 35 due to the thick outer periphery of the pedestal 31 increases, The translucent resin 35 is less likely to flow toward the outer periphery of the pedestal 31. Thereby, even if the thermosetting resin 36 reaches the sealing material 20, damage (damage) to the sealing material 20 due to the fluid pressure of the thermosetting resin 36 can be suppressed. Therefore, it is possible to prevent the thermosetting resin 36 from protruding out of the sealing material 20 due to damage to the sealing material 20.

(Modification 2 of base)
Next, Modification 2 of the pedestal will be described. FIG. 10 is a cross-sectional view corresponding to FIG. 2 of the above-described first embodiment, showing the configuration of the modification 2 of the base. Hereinafter, with reference to FIG. 10, Modification 2 of the pedestal will be described focusing on differences from the pedestal of the first embodiment. Moreover, about the same component as Embodiment 1, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

  As shown in FIG. 10, in the imaging device 1, a translucent member 30 (a base 31 and a translucent resin 35) is disposed between the sensor substrate 10 and the light shielding substrate 40. The pedestal 31 according to the modified example 2 is configured by arranging a plurality of protrusions 31b. And the base 31 which concerns on the modification 2 has the uneven surface.

  As described above, since the upper surface of the pedestal 31 is uneven, the flow resistance of the translucent resin 35 increases when the sensor substrate 10 and the light-shielding substrate 40 are joined, and the translucent resin 35 is increased. Becomes difficult to flow in the outer peripheral direction of the base 31. Thereby, even if the thermosetting resin 36 reaches the sealing material 20, damage to the sealing material 20 due to the fluid pressure of the thermosetting resin 36 can be suppressed. Therefore, it is possible to prevent the thermosetting resin 36 from protruding out of the sealing material 20 due to damage to the sealing material 20.

<Inspection device>
"Outline of inspection equipment"
Next, an example of an inspection apparatus in which any one of the imaging apparatuses according to the first embodiment, the second embodiment, or the modification 1 described above is mounted will be described.
FIG. 11 is a schematic diagram showing the configuration of the inspection apparatus.
The inspection apparatus 100 is a biometric authentication apparatus that captures a vein image of the finger F and performs personal authentication. As illustrated in FIG. 11, the inspection apparatus 100 includes a detection unit 110, a storage unit 140, a control unit 150, an output unit 160, and the like.

  The detection unit 110 is the imaging device 1 according to the first embodiment, and can irradiate the finger F with the irradiation light IL from the light emitting unit 120 and detect the reflected light RL from the finger F. In addition to the imaging device 1 according to the first embodiment, either the imaging device 2 according to the second embodiment or the imaging device according to the first modification can be used.

  The detection unit 110 includes a light emitting unit 120 (corresponding to the illumination substrate 50 shown in FIG. 1), an MLA substrate 60 (not shown), a light shielding substrate 40 (not shown), and a light receiving unit 130 (of the sensor substrate 10 shown in FIG. 1). Equivalent). The irradiation light IL is near-infrared light emitted from the light emitting unit 120, and has a wavelength of, for example, 750 to 3000 nm (more preferably 800 to 900 nm). When the irradiation light IL reaches the inside of the finger F, it is scattered, and a part thereof is directed to the light receiving unit 130 as reflected light RL.

  The light receiving unit 130 is provided with a photodiode 13 that detects light in the near infrared region. Reduced hemoglobin flowing through the vein has the property of absorbing light in the near infrared region. For this reason, when the finger F is imaged using the photodiode 13 that detects light in the near infrared region, the vein portion under the finger F appears darker than the surrounding tissue. The pattern due to this difference in brightness becomes a vein image. The reflected light RL from the finger F is converted by the light receiving unit 130 into an electric signal (light receiving signal) having a signal level corresponding to the amount of light.

  The storage unit 140 is a non-volatile memory such as a flash memory or a hard disk, and stores a vein image of a finger F registered in advance (for example, the index finger of the right hand) as a master vein image for personal authentication.

The control unit 150 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), and the like, and controls turning on and off of the light emitting unit 120. In addition, the control unit 150 reads the light reception signal from the light reception unit 130 and generates a vein image of the finger F based on the read light reception signal for one frame (for the imaging region). Furthermore, the control unit 150 collates the generated vein image with the master vein image registered in the storage unit 140, and performs personal authentication.
The output unit 160 is, for example, a display unit or a voice notification unit, and notifies the authentication result by display or voice.

  With the above configuration, the inspection apparatus 100 can capture the vein image of the finger F with high accuracy and perform personal authentication.

The part of the living body that is the target of vein authentication may be the palm, the back of the hand, the eye, or the like.
The detection unit 110 described above can be applied to a small biosensor that can be always worn in the medical and health fields. Furthermore, for example, a pulse meter, a pulse oximeter, a blood glucose level measuring device, a fruit sugar meter, etc. in the medical and health fields can be provided as the inspection apparatus 100 equipped with the detection unit 110. Further, the detection unit 110 can provide a personal computer or a mobile phone having a biometric authentication function.

  The detection unit 110 can also be applied to an image reading apparatus such as an image scanner, a copying machine, a facsimile, or a barcode reader. When applied to an image reading apparatus, it is preferable to use visible light instead of near-infrared light as the irradiation light IL and the reflected light RL.

  DESCRIPTION OF SYMBOLS 1, 2 ... Imaging device, 5 ... Sensing area | region, 6 ... Optical axis, 7 ... Inspection light, 8 ... Unnecessary light, 10 ... Sensor board | substrate, 11 ... Sensor board | substrate body, 12 ... Circuit part, 13 ... Photodiode, 14 ... Terminal, 20 ... Sealing material, 21 ... Second UV curable resin, 22 ... First gap material, 30 ... Translucent member, 31 ... Base, 31a ... Top surface of base, 31b ... Projection, 32 ... First 1 UV curable resin, 33 ... pedestal precursor, 35 ... translucent resin, 36 ... thermosetting resin, 38 ... second gap material, 39 ... air gap, 40 ... light shielding substrate, 41 ... light shielding substrate body 42 ... Light-shielding film, 43 ... Opening part, 50 ... Lighting substrate, 51 ... Lighting substrate body, 52 ... Light emitting element, 60 ... MLA substrate as a condensing substrate, 61 ... MLA substrate body, 62 ... Microlens, 63 ... Transparent adhesive, 100 ... Inspection device, 110 ... Detection , 120 ... light-emitting portion 130 ... receiving portion, 140 ... storage unit, 150 ... controller, 160 ... output section.

Claims (11)

A sensor substrate having a sensing region in which a photoelectric conversion element is disposed;
A light-shielding substrate having a light-shielding film disposed opposite to the surface of the sensor substrate on which the sensing region is formed and having an opening at a position corresponding to the photoelectric conversion element;
A sealing material formed around the sensing region and including a first gap material that forms a predetermined interval between the sensor substrate and the light shielding substrate;
A light-transmitting member that covers the sensing region inside the sealing material and is filled between the sensor substrate and the light-shielding substrate;
The translucent member is
A translucent pedestal that is disposed in contact with either the sensor substrate or the light-shielding substrate and has irregularities on the surface;
A translucent resin filled between the pedestal and the sensor substrate or the light shielding substrate, or between the pedestal and the sensor substrate or the light shielding substrate, and between the sensor substrate and the light shielding substrate; ,
An imaging apparatus comprising: A sensor substrate having a sensing region in which a photoelectric conversion element is disposed;
A light-shielding substrate having a light-shielding film disposed opposite to the surface of the sensor substrate on which the sensing region is formed and having an opening at a position corresponding to the photoelectric conversion element;
A translucent member that covers the sensing region, is filled between the sensor substrate and the light shielding substrate, and forms a predetermined interval between the sensor substrate and the light shielding substrate;
The translucent member is
A translucent pedestal arranged in contact with either the sensor substrate or the light-shielding substrate and having irregularities on the surface;
A translucent resin filled between the pedestal and the sensor substrate or the light shielding substrate, or between the pedestal and the sensor substrate or the light shielding substrate, and between the sensor substrate and the light shielding substrate; ,
An imaging apparatus comprising:   The imaging device according to claim 1, wherein the pedestal includes a second gap material having translucency.   The imaging device according to claim 1, wherein the pedestal is formed such that a thickness of an outer peripheral side of the sensing region is thicker than a thickness of a central portion.   The imaging apparatus according to claim 1, wherein the pedestal is formed of a plurality of protrusions.   The said predetermined space | interval is 50 micrometers or more, Comprising: The volume occupation rate of the said base in the said translucent member is 50% or more and 95% or less, The any one of Claim 1 thru | or 5 characterized by the above-mentioned. The imaging device described in 1.   The imaging device according to claim 1, wherein the pedestal is formed on the sensor substrate so as to cover the sensing region. The light shielding substrate has a light transmitting substrate on which the light shielding film is formed,
The imaging apparatus according to claim 1, wherein a refractive index of the translucent substrate is equal to a refractive index of the translucent member.   9. A condensing substrate that is disposed so as to sandwich the light shielding substrate between the sensor substrate and has a microlens at a position corresponding to the photoelectric conversion element. The imaging device according to any one of the above.   10. The imaging apparatus according to claim 1, wherein an illumination substrate on which a light emitting element is disposed is disposed between the light shielding substrate and the light collecting substrate. An imaging device according to any one of claims 1 to 10,
A control unit that performs an inspection according to a detection result of the imaging device.

Images