JP2014032316A - Contact lens with function and method for manufacturing contact lens with function - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact lens with a function which has various conveniences by including a semiconductor element and to provide a method for manufacturing the contact lens with the function.SOLUTION: A contact lens with a function 1 is a contact lens capable of guiding light to a pupil. A semiconductor element 2 is provided in the contact lens. The semiconductor element 2 includes a functional layer functioning with control information, a communication layer capable of communicating with an external apparatus, a control layer controlling the functional layer and the communication layer, and a power supply layer supplying electric power to the functional layer, the communication layer, and the control layer. A diaphragm transparent part 3 is formed at the lens center by the semiconductor element 2.

Description

  The present invention relates to a functional contact lens having various conveniences and a method for manufacturing the functional contact lens.

  As a person ages, the eye focuses on a relatively close object and the natural lens becomes stiff and less adjustable. Such a condition is known as presbyopia, and typically aged patients have various combinations of presbyopia, astigmatism, myopia, and hyperopia, and in particular correct the vision of patients with presbyopia. This is difficult, and various ways to solve this problem have been suggested over the years.

  One known method includes a distance power and a near power portion having a convex surface and a concave surface on the opposite side, and one of the convex surface and the concave surface is alternately arranged, and one or more distance power portions are cylindrical. There is a lens using a contact lens including an ophthalmic lens having a power (Patent Document 1).

  The contact lens is provided with, for example, an electric drive unit in the contact lens, and the electric drive unit and the visual field detector are connected in electronic communication, and the electric drive unit provides at least one focal length for correcting vision. (Patent Document 2).

Special table 2004-507794 gazette Japanese translation of PCT publication No. 2005-535942

  In this way, there is a type that corrects visual acuity using a contact lens. However, by providing a semiconductor element on the contact lens, precise dimensional accuracy, precise position accuracy, and a pinhole with a sharp outline can be obtained. In addition to the correction, various conveniences can be given to the contact lens.

  This invention is made in view of this point, and it aims at providing the manufacturing method of the contact lens with a function which has various convenience by providing a semiconductor element, and a contact lens with a function.

  In order to solve the above-described problems and achieve the object, the present invention is configured as follows.

  The invention according to claim 1 is a contact lens capable of guiding light to a pupil, and a semiconductor element is provided in the contact lens, and the semiconductor element communicates with a functional layer that functions according to control information and an external device. A functional contact lens comprising: a possible communication layer; the functional layer; a control layer that controls the communication layer; and a power layer that supplies power to the functional layer, the communication layer, and the control layer. It is.

According to a second aspect of the present invention, the functional layer includes a shutter that adjusts the amount of light to the pupil;
2. The function according to claim 1, further comprising: a piezo element that drives the shutter, wherein the control layer controls the piezo element and adjusts a light amount to a pupil by driving the shutter. It is a contact lens.

  According to a third aspect of the present invention, the functional layer includes an image pickup device that picks up an image, and the control layer controls the image pickup device and transmits image information obtained by the image pickup device to the external device. It is a contact lens with a function of Claim 1 characterized by the above-mentioned.

  According to a fourth aspect of the present invention, the functional layer includes a laser oscillation element that oscillates a laser and a gyro sensor that obtains position information of a symmetrical object by the oscillated laser, and the control layer includes the gyro sensor. The contact lens with a function according to claim 1, wherein the sensor is controlled and position information obtained by the gyro sensor is transmitted to the external device.

  According to a fifth aspect of the present invention, the power supply layer includes a power generation unit that generates electric power by converting light amount into electricity, and a battery unit that stores electric power obtained by the power generation unit. 1. A contact lens with a function according to 1.

  The invention according to claim 6 is a functional layer that functions according to control information, a communication layer that can communicate with an external device, a control layer that controls the functional layer and the communication layer, the functional layer, the communication layer, and A semiconductor element manufacturing process for manufacturing a semiconductor element including a power supply layer for supplying power to the control layer, a lens molding process for molding a contact lens, and a cover process for providing the semiconductor element on the contact lens and covering the contact lens with a cover material And forming a transparent aperture portion at the center of the lens by the semiconductor element.

  The invention according to claim 7 is a functional layer that functions according to control information, a communication layer that can communicate with an external device, a control layer that controls the functional layer and the communication layer, the functional layer, the communication layer, and A semiconductor element manufacturing process for manufacturing a semiconductor element including a power supply layer for supplying power to the control layer, a lens molding process for molding a pair of split contact lenses, and the semiconductor element is sandwiched between the pair of split contact lenses And a step of forming a transparent transparent portion at the center of the lens by the semiconductor element.

  With the above configuration, the present invention has the following effects.

  The invention according to any one of claims 1 to 7 is a contact lens capable of guiding light to the pupil. The contact lens is provided with a semiconductor element, and the semiconductor element includes a functional layer functioning according to control information, an external element With a communication layer capable of communicating with a device, a control layer that controls the functional layer and the communication layer, and a power supply layer that supplies power to the functional layer, the communication layer, and the control layer, with various functions. Contact lenses can be obtained.

It is a figure which shows use of the contact lens with a function. It is a figure explaining the structure of a semiconductor element. It is a figure explaining control of a piezo element. It is a figure explaining the action | operation of a shutter. It is a figure explaining the structure of a power supply layer. It is a figure which shows use of the contact lens with a function. It is a figure explaining the structure of a semiconductor element. It is a figure explaining the action | operation of a semiconductor element. It is a figure which shows use of the contact lens with a function. It is a figure explaining the structure of a semiconductor element. It is a figure explaining the action | operation of a semiconductor element. It is a figure explaining the manufacturing process of a contact lens with a function. It is a figure explaining a semiconductor element manufacturing process. It is a figure explaining a semiconductor element manufacturing process. It is a figure which shows the state of the wafer in a photolithography process. It is a figure explaining the manufacturing process of a contact lens with a function. It is a figure which shows the contact lens with a function. It is a figure which shows embodiment of the contact lens with a function. It is a figure explaining the manufacturing process of a contact lens with a function. It is a figure explaining the spin-casting method. It is a figure explaining a molding method. It is a figure explaining the race cut method. It is a figure explaining the manufacturing process of a contact lens with a function.

  Embodiments of the contact lens with function and the method for manufacturing the contact lens with function of the present invention will be described below. The embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.

[Contact lenses with functions]
(First embodiment)
This embodiment will be described with reference to FIGS. 1 is a diagram illustrating the use of a functional contact lens, FIG. 2 is a diagram illustrating the configuration of a semiconductor element, FIG. 3 is a diagram illustrating control of a piezo element, FIG. 4 is a diagram illustrating the operation of a shutter, and FIG. FIG. 4 is a diagram illustrating a configuration of a power supply layer.

  The contact lens 1 with a function of this embodiment is a contact lens capable of guiding light to a pupil, and a semiconductor element 2 is provided in the contact lens 1 with a function. The semiconductor element 2 is a functional layer that functions according to control information. 11, a communication layer 12 that can communicate with an external device, a control layer 13 that controls the functional layer 11 and the communication layer 12, and a power supply layer 14 that supplies power to the functional layer 11, the communication layer 12, and the control layer 13. Including.

The functional layer 11 includes a shutter 11a that adjusts the amount of light to the pupil and a piezo element 11b that drives the shutter 11a. The shutter 11a is a MEMS (Mems, Micro
This is a movable shutter manufactured by Electro Mechanical Systems). The piezo element 11b is filled with the shutter 11a so that it can be opened and closed. As a piezo element material, berlinite, barium titanate, polyvinylidene fluoride, gallium arsenide, or the like can be used.

  The communication layer 12 can communicate with the external device 100 by radio, and the external device 100 is a personal computer, a medical dedicated device, or the like.

  The control layer 13 includes a storage unit 13a and a control unit 13b. The storage unit 13a stores data for controlling the functional layer 11 and the communication layer 12 in the RAM, and data obtained from the functional layer 11 Is stored in the ROM and transmitted to the external device 100.

  The control unit 13b obtains operation information from the external device 100 via the communication layer 12, controls the piezo element 11b, drives the shutter 11a, and adjusts the amount of light to the pupil. That is, at the time of OFF, the piezo element 11b contracts and the shutter 11a is open and does not disturb the light reception of the pupil. At the time of ON, the piezo element 11b expands and the shutter 11a adjusts the amount of light to the pupil. Pinpoint light reception.

  This ON / OFF operation is performed by a manual ON / OFF signal from the external device 100 such as a mobile phone by utilizing the communication layer 12, and the received light amount adjustment operation is performed by a digital signal based on the number of times a button or switch is pressed. You may do it. It is also possible to automatically turn on / off according to the amount of light received by the power supply layer 14. That is, in a dark place where the amount of received light is small, it is shrunk and opened by OFF, and in a bright place, it is expanded and closed by ON. Further, “automatic” and “manual” can be selected by the user, and the selection operation may be performed from the PC of the external device 100 through the communication layer 12, or may be set at the time of purchase. Thus, the presbyopia is corrected by the pinpoint effect by reducing the amount of light of the pupil by closing the shutter 11a using the property of contracting when a voltage is applied to the piezo element 11b.

  The power supply layer 14 includes a power generation unit 14a that generates electric power by converting the amount of light into electricity, and a battery unit 14b that stores electric power obtained by the power generation unit 14a. The power generation unit 14a converts, for example, the amount of light entering the eyeball into electricity by the photodiode 14a1, and stores the electricity in the battery unit 14b. As the material of the photodiode 14a1, a light-emitting semiconductor such as gallium arsenide can be used. The shape of the photodiode 14a1 is not a flat shape but a saw blade shape, so that the light quantity capturing efficiency can be increased. In addition, the efficiency of capturing the amount of light can be further increased by covering the surface of the photodiode 14a1 with a thin reflective film.

  In addition, the power generation unit 14a connects, for example, the power transmission coil 14a2 and the power reception coil 14a3 to the photodiode 14a1, and a current flows through the power transmission coil 14a2 to generate a magnetic field, and the current flowing through the power reception coil 14a3 that is magnetically coupled. Inductive current is generated in the power receiving coil 14a3. This induced current occurs in a direction that prevents the change in magnetic flux through the coil that makes it.

  Therefore, when the eyes blink, while the eyes are closed, the current of the power receiving coil 14a3 is generated in a direction that prevents the change in the magnetic field due to the decrease of the current of the power transmitting coil 14a2. While the eyes are opened, the current of the power receiving coil 14a3 is generated in a direction that prevents the change of the magnetic field due to the increase of the current of the power transmitting coil 14a2. As described above, not only the power generation by the photodiode 14a1 is performed when the light is taken in from the eyes, but also the power supply can be prevented from being cut off even when blinking.

  In addition, the function contact lens 1 according to this embodiment is urgently transmitted to the PC of the external device 100 or a nearby service station when an error occurs in the function or an accidental “battery low” occurs. On the contrary, information guidance from the service station can be received.

(Second Embodiment)
This embodiment will be described with reference to FIGS. FIG. 6 is a diagram illustrating the use of a functional contact lens, FIG. 7 is a diagram illustrating the configuration of a semiconductor element, and FIG. 8 is a diagram illustrating the operation of the semiconductor element.

  The contact lens 1 with a function of this embodiment is a contact lens capable of guiding light to a pupil, and a semiconductor element 2 is provided in the contact lens 1 with a function. The semiconductor element 2 is a functional layer that functions according to control information. 21, a communication layer 22 capable of communicating with the external device 100, a control layer 23 for controlling the functional layer 21 and the communication layer 22, a power supply layer 24 for supplying power to the functional layer 21, the communication layer 22 and the control layer 23, including.

  The functional layer 21 includes an image sensor 21 a that captures an image. The control layer 23 controls the image sensor 21 a and transmits image information obtained by the image sensor 21 a to the external device 100. The image sensor 21 a uses a CCD or a CMOS, captures an image, and transmits the obtained image data to the external device 100 via the communication layer 22 wirelessly. The external device 100 performs image reproduction, storage, editing, and the like. As the image pickup element 21a, a CMOS that consumes less power than a CCD is preferable.

  The communication layer 22 can communicate with the external device 100 by radio, and the external device 100 is a personal computer, a medical dedicated device, or the like. Further, the communication layer 22 is used to capture an image by manually turning on / off the external device 100 from a mobile phone or the like, and the obtained image data is wirelessly transmitted to the external device 100 such as a mobile phone through the communication layer 22. You may make it do.

  The control layer 23 includes a storage unit 23a and a control unit 23b. The storage unit 23a stores data for controlling the functional layer 21 and the communication layer 22 in the RAM, and data obtained from the functional layer 21. Is stored in the ROM and transmitted to the external device 100. This function-equipped contact lens 1 can be applied to remote surgery and on-site investigation into a dangerous area.

  In addition, the function contact lens 1 according to this embodiment is urgently transmitted to the PC of the external device 100 or a nearby service station when an error occurs in the function or an accidental “battery low” occurs. On the contrary, information guidance from the service station can be received.

  The power supply layer 24 includes a power generation unit 24a that generates electric power by converting the amount of light into electricity, and a battery unit 24b that stores electric power obtained by the power generation unit 24a, and is configured in the same manner as in the first embodiment. .

(Third embodiment)
This embodiment will be described with reference to FIGS. 9 is a diagram illustrating the use of a contact lens with a function, FIG. 10 is a diagram illustrating the configuration of a semiconductor element, and FIG. 11 is a diagram illustrating the operation of the semiconductor element.

  The contact lens 1 with a function of this embodiment is a contact lens capable of guiding light to a pupil, and a semiconductor element 2 is provided in the contact lens 1 with a function. The semiconductor element 2 is a functional layer that functions according to control information. 31, a communication layer 32 that can communicate with the external device 100, a control layer 33 that controls the functional layer 31 and the communication layer 32, a power supply layer 34 that supplies power to the functional layer 31, the communication layer 32, and the control layer 33, including.

  The functional layer 31 includes a laser oscillation element 31a that oscillates a laser, and a gyro sensor 31b that obtains positional information of the symmetrical object 90 by the oscillated laser, and the control layer 33 controls the gyro sensor 31b. The positional information of the symmetric object 90 obtained by the gyro sensor 31b is transmitted to the external device 100.

  The communication layer 32 can communicate with the external device 100 by radio, and the external device 100 is a personal computer, a medical dedicated device, or the like.

  The control layer 33 includes a storage unit 33a and a control unit 33b. The storage unit 33a stores data for controlling the functional layer 31 and the communication layer 32 in the RAM, and data obtained from the functional layer 31. Is stored in the ROM and transmitted to the external device 100.

  In the contact lens 1 with this function, the symmetrical object 90 on the display unit of the personal computer is directly viewed, and the laser is oscillated to the symmetrical object 90 on the display unit of the personal computer by the laser oscillation element 31a when the operation device 100 is turned on. This laser excites the portion of the symmetric object 90 that receives the laser in the display portion of the personal computer, and the energy level increases. As the energy level increases in this way, position information of the symmetrical object 90 is obtained by the gyro sensor 31b. In the control layer 33, the gyro sensor 31b is controlled, and the position information of the symmetric object 90 obtained by the gyro sensor 31b is transmitted to the external device 100 through the communication layer 32. Can be used for alternative operations. Further, the control layer 33 can urgently transmit the status to the PC of the external device 100 or a nearby service station in the event of an error in function or an unexpected “battery low”, and conversely from the service station. It is also possible to receive information guidance.

  The power supply layer 34 includes a power generation unit 34a that converts the amount of light into electricity and generates power, and a battery unit 34b that stores the power obtained by the power generation unit 34a, and is configured in the same manner as in the first embodiment. .

(Fourth embodiment)
In this embodiment, the three forms of the first embodiment, the second embodiment, and the third embodiment may be arbitrarily combined, or all three forms may be provided.

[Method of manufacturing contact lens with function]
(First embodiment)
This embodiment will be described with reference to FIGS. FIG. 12 is a diagram illustrating a manufacturing process of a functional contact lens, FIGS. 13 and 14 are diagrams illustrating a semiconductor element manufacturing process, FIG. 15 is a diagram illustrating a state of a wafer in a photolithography process, and FIG. FIG. 17 is a diagram illustrating a contact lens manufacturing process, FIG. 17 is a diagram illustrating a functional contact lens, and FIG. 18 is a diagram illustrating an embodiment of the functional contact lens. The method for manufacturing a contact lens with a function according to this embodiment includes a semiconductor element manufacturing process A1, a lens molding process A2, and a cover process A3. The semiconductor element 2 forms the aperture transparent portion 3 at the center of the lens.

"Semiconductor element manufacturing process A1"
In this semiconductor element manufacturing process A1, a functional layer that functions according to the control information described in the first to fourth embodiments of the contact lens 1 with function, a communication layer that can communicate with an external device, and a function A semiconductor element 2 including a control layer that controls the layer and the communication layer, and a power supply layer that supplies power to the functional layer, the communication layer, and the control layer is manufactured.

  In this semiconductor device manufacturing, ingot pulling / cutting, wafer polishing, wafer surface oxidation, photoresist coating, patterning on wafer surface, etching, oxidation / diffusion / CVD / ion implantation, planarization (CMP), electrode formation Perform wafer inspection.

<Ingot lifting / cutting>
A disk cut out of a semiconductor material is called a wafer and used as an IC substrate. The wafer is made by growing a single crystal lump (ingot) from a high-purity silicon seed used as a raw material to produce a single crystal rod (ingot) of the required thickness. After cutting off the upper and lower ends, the ingot is cut into a disk shape one by one with a diamond blade.

<Wafer polishing>
As a finish, the wafer surface is polished and cleaned into a mirror surface.

<Oxidation of wafer surface>
A circuit pattern is formed on the wafer. First, an oxide film is grown on the wafer surface by inserting the wafer into a high-temperature furnace (900 ° C to 1,100 ° C) and reacting oxygen or water vapor with silicon to form a gate insulating film for transistors and an insulating film between wiring layers. (Thermal oxidation method). Refer to FIG.

<Photoresist application>
In the pattern formation procedure, a “photolithography” technique in which light is irradiated through a photomask is used. In preparation for this, a resin called a photoresist is applied very thinly and uniformly on the entire wafer to provide photosensitivity. Refer to FIG. 15 (2).

<Pattern formation on wafer surface>
A photomask is superimposed on the wafer and irradiated with light to transfer the circuit diagram. Align the position of the wafer with the mask and irradiate the mask with ultraviolet rays. Ultraviolet rays are transmitted only through portions not masked by the photomask, and the photoresist is chemically changed. The photoresist has a structure in which only a portion of the circuit that is not particularly masked in the “exposure process” undergoes a chemical reaction and dissolves in the developer (positive type). The portion of the photoresist that has been chemically changed by exposure is dissolved by the developer, and after development, the photoresist remains on the wafer surface according to the mask pattern (resist pattern). See FIGS. 15 (3) and 15 (4).

<Etching>
The oxide film is partially removed by etching, and then unnecessary resist is also removed. Etching is physical or chemical processing of an oxide film or a metal film using a resist pattern as a mask, and includes wet etching using a chemical solution and dry etching using a gas. The oxide film is etched by placing it in chemicals and the metal film in a plasma state. See FIGS. 15 (5) and (6).

<Oxidation / Diffusion / CVD / Ion implantation>
First, an element isolation layer (field oxide film) is formed around an active region where elements are formed in order to electrically isolate elements from each other. After growing an oxide film and a nitride film on the silicon substrate, a resist pattern is formed in a region to be an element isolation layer, and ion implantation is performed using the resist pattern as a mask to form a P-type diffusion layer. Next, the oxide film and nitride film on the diffusion layer are etched, and an oxide film serving as an element isolation layer is grown using the nitride film pattern as a mask. The nitride film and oxide film remaining on the active region where the element is to be formed are etched. As described above, when ions are implanted into the wafer (boron / phosphorus) or high-temperature diffusion is performed, only the portion where silicon is exposed becomes a semiconductor. See FIGS. 15 (7) to (12).

<Planarization (CMP)>
The surface of the wafer is polished to flatten the unevenness of the pattern.

<Electrode formation>
An aluminum target is sputtered with an inert gas plasma to form an aluminum metal film for electrode wiring on the wafer surface.

<Wafer inspection>
Each IC on the completed wafer is electrically inspected by a tester. An electrical signal is sent from the tester to the bonding pads (electrodes) of the IC chip using a probe called a prober, and the quality of the operation of the IC chip is judged.

  For the lamination of semiconductor elements, techniques such as wire bonding, solder bumps, silicon through electrodes, and wireless electromagnetic coupling are used.

"Lens molding process A2"
In this lens molding step A2, a lens material 51 is filled in a mold 50 for molding a contact lens. The mold 50 is formed in the shape of a contact lens to be molded, and various known materials can be used as the lens material 51. MMA (metal methacrylate) of oxygen non-permeable hard contact lens, oxygen permeable SMA (siloxanyl methacrylate) and FMA (fluoromethacrylate) for water-resistant hard contact lenses, HEMA (hydroxyethyl methacrylate), N-VP (N-vinylpyrrolidone), DMAA (dimethylacrylamide), GMA for hydrous soft contact lenses (Glycerol methacrylate), non-hydrous soft contact lens silicone rubber, butyl acrylate, dimethylsiloxane, biocompatible contact lens collagen, amino acid copolymer, and the like.

  In addition, as the polymerizable monomer for contact lenses, generally used radically polymerizable compounds are conceivable, such as compounds containing at least one vinyl group, allyl group, acrylic group, or methacryl group in the molecule. Any material usually used as a hard contact lens or soft contact lens material can be used. Specifically, acrylic esters such as alkyl acrylate, siloxanyl acrylate, fluoroalkyl acrylate, hydroxyalkyl acrylate, polyethylene glycol acrylate, vinyl acrylate, styrene derivatives, N-vinyl lactam, vinyl (polyvalent) carboxylate A vinyl compound such as can be considered. More specifically, for example, styrene, acrylic acid, methyl acrylate, ethyl acrylate, n-butyl acrylate, phenyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, methacrylic acid, methyl methacrylate, ethyl methacrylate, n- Butyl methacrylate, 2-ethylhexyl methacrylate, isobornyl methacrylate, benzyl methacrylate, phenyl methacrylate, 2-methacryloyloxyethyl succinic acid, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, fumaric acid and their Use esters, methacrylonitrile, N, N-dimethylacrylamide, N-vinyl-2-pyrrolidone, etc. Rukoto is possible.

  Further, as a crosslinking agent, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, propylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, 1,4-butanediol diacrylate, 1,6- Polyfunctional monomers such as hexanediol diacrylate, glycerin diacrylate, divinylbenzene diallyl phthalate, and diethylene glycol bisallyl carbonate can be used.

  In addition, as the polymer, in particular, a functional group (for example, a hydroxyl group) is included on the polymer chain, a functional group (for example, an imino group) is included in the polymer chain, or a functional group bonded to the polymer skeleton through a crosslinking group. Polymers based on raw polymer containing groups can be used. These starting polymers are in particular polyhydroxyl compounds having a 1,2- and / or 1,3-diol structure, such as polyvinyl alcohol, or hydrolyzed copolymers of vinyl acetate (for example vinyl chloride, N-vinylpyrrolidone). Copolymer).

"Cover process A3"
In the cover step A3, the semiconductor element 2 is positioned on the filled lens material 51. The semiconductor element 2 is precisely positioned at the center of the contact lens. A cover material 52 is provided on the lens material 51 so as to cover the semiconductor element 2. The cover material 52 is preferably more hydrophilic and biocompatible and smoother than the monomer or polymer of the lens material, and is a polyacrylic acid (PAA) surface composite, or a hydrocarbon or polymer coat, or a polymer. A carbon first coat or the like can be used.

  In this way, the semiconductor element 2 is provided on the contact lens 1, and the circular aperture transparent portion 3 that is not colored at the center of the lens is formed by the semiconductor element 2 with precise dimensional accuracy, precise position accuracy, and a sharp outline. Is possible.

<Contact lenses with functions>
As shown in FIG. 17, the contact lens 1 with this function has a semiconductor element 2 positioned on a lens material 51 filled in a mold for molding a contact lens, and a cover material 52 so as to cover the semiconductor element 2. Is formed on the lens material 51, and the circular aperture transparent portion 3 that is not colored at the center of the lens by the semiconductor element 2 is formed.

  This contact lens with function 1 can be formed as shown in FIG. The first embodiment (FIG. 18A) is a contact lens having a circular outer periphery, the center of the semiconductor element 2 is a circular shape, the outer periphery is a hexagon, and the circular shape is the aperture transparent portion 3. The second embodiment (FIG. 18B) is a contact lens having a circular outer periphery, the center of the semiconductor element 2 is circular, the outer periphery is circular, and the circular shape is the aperture transparent portion 3. The third embodiment (FIG. 18C) is a contact lens having a circular outer periphery, and the semiconductor element 2 has 19 circles, the outer periphery is circular, and the 19 circles are the aperture transparent portion 3. The fourth embodiment (FIG. 18D) is a contact lens having a circular outer periphery, the center of the semiconductor element 2 is a star shape, the outer periphery is a 24 square shape, and the star shape is the aperture transparent portion 3. Embodiment 5 (FIG. 18E) is a contact lens having a hexagonal outer periphery, the center of the semiconductor element 2 is circular, the outer periphery is hexagonal, and the circular shape is the aperture transparent portion 3. In the sixth embodiment (FIG. 18F), the outer periphery is a heart-shaped contact lens, the center of the semiconductor element 2 is circular, the outer periphery is circular, and the circle is the aperture transparent portion 3. The shape of the presbyopia correction contact lens and the shape of the semiconductor element 2 shown in the first to sixth embodiments are examples, and the combination of the shapes is not limited to this.

(Second Embodiment)
The manufacturing method of the contact lens with a function of 2nd Embodiment is demonstrated based on FIG. 19 thru | or FIG. 19 is a diagram for explaining a manufacturing process of a functional contact lens, FIG. 20 is a diagram for explaining a spin casting method, FIG. 21 is a diagram for explaining a molding method, and FIG. 22 is a diagram for explaining a race cut method.

  As shown in FIG. 19, the contact lens with function of this embodiment has a semiconductor element manufacturing process B1, a lens molding process B2, and a sandwiching and bonding process B3. Part 3 is formed.

"Semiconductor element manufacturing process B1"
Since the semiconductor element manufacturing process B1 is configured in the same manner as the semiconductor element manufacturing process A1 of the first embodiment, the description thereof is omitted.
"Lens molding process B2"
In the lens molding step B2, a pair of split contact lenses is molded. As a method for manufacturing this divided contact lens, a spin casting method (FIG. 20) in which a lens material of a contact lens is injected into a rotating mold and expanded by centrifugal force (FIG. 20). There is known a molding method (FIG. 21) or the like in which casting is carried out to form a convex mold. Further, in recent years, there are manufacturing methods in which the front surface is formed by a mold and the rear surface is lace cut, and conversely, there is a lace cut manufacturing method (FIG. 22) in which the rear surface is formed by a mold and the front surface is lace cut. Any method of manufacturing a lens can be employed.

“Pinching process B3”
In the sandwiching and joining step B3, joining is performed by sandwiching the semiconductor element 2 between the pair of divided contact lenses. In this bonding, the semiconductor element 2 is sandwiched and pasted between a pair of divided contact lenses.

  In this way, the ring-shaped semiconductor element 2 is provided in the contact lens 1 with a function, and the circular aperture transparent portion 3 that is not colored by the semiconductor element 2 at the center of the lens has a precise dimensional accuracy, a precise position accuracy, and a clear outline. It is possible to form with.

(Third embodiment)
The manufacturing method of the contact lens with a function of 3rd Embodiment is demonstrated based on FIG. FIG. 23 is a diagram for explaining a manufacturing process of a contact lens with a function.

  As shown in FIG. 23, the contact lens with function of this embodiment has a semiconductor element manufacturing process C1, a lens molding process C2, and a cover process C3, and the contact lens 1 with function is provided with the semiconductor element 2. A circular aperture transparent portion 3 that is not colored is formed at the center of the lens.

"Semiconductor element manufacturing process C1"
Since the semiconductor element manufacturing process C1 is configured in the same manner as the semiconductor element manufacturing process A1 of the first embodiment, the description thereof is omitted.

"Lens molding process C2"
In the lens molding step C2, a contact lens is molded. This contact lens is manufactured in the same manner as in the second embodiment.

"Cover process C3"
In the cover process C3, the semiconductor element 2 is provided on the contact lens and covered with the cover material 53. The cover material 53 is preferably a member that is more hydrophilic, biocompatible, and smoother than the monomer or polymer of the lens material, such as a polyacrylic acid (PAA) surface composite, a hydrocarbon coat or a polymer coat, or a polymer A carbon first coat or the like is used.

  In this way, the semiconductor element 2 is provided on the contact lens 1 with a function, and the circular aperture transparent portion 3 that is not colored at the center of the lens is formed by the semiconductor element 2 with precise dimensional accuracy, precise position accuracy, and a sharp outline. Is possible.

  This invention is a contact lens with a function which has various convenience, and a manufacturing method of a contact lens with a function.

DESCRIPTION OF SYMBOLS 1 Contact lens 2 with function Semiconductor element 3 Diaphragm transparent part 11,21,31 Functional layer 12,22,32 Communication layer 13,23,33 Control layer 14,24,34 Power supply layer A1, B1, C1 Semiconductor element manufacturing process A2 , B2, C2 Lens molding process A3, C3 Cover process B3 Nipping and joining process

Claims (7)

It is a contact lens that can guide light to the pupil,
A semiconductor element is provided on the contact lens,
The semiconductor element is
A functional layer that functions according to control information;
A communication layer capable of communicating with external devices;
A control layer for controlling the functional layer and the communication layer;
A power supply layer for supplying power to the functional layer, the communication layer, and the control layer;
The contact lens with a function characterized by including. The functional layer is
A shutter that adjusts the amount of light to the pupil,
A piezo element for driving the shutter;
The control layer is
The contact lens with a function according to claim 1, wherein the piezo element is controlled, and the amount of light to the pupil is adjusted by driving the shutter. The functional layer is
Having an image sensor for imaging,
The control layer is
The contact lens with a function according to claim 1, wherein the image sensor is controlled, and image information obtained by the image sensor is transmitted to the external device. The functional layer is
A laser oscillation element for oscillating a laser;
A gyro sensor that obtains position information of a symmetrical object by an oscillated laser, and
The control layer is
The contact lens with a function according to claim 1, wherein the gyro sensor is controlled, and position information obtained by the gyro sensor is transmitted to the external device. The power supply layer is
A power generation unit that converts the amount of light into electricity to generate electricity;
The contact lens with a function according to claim 1, further comprising: a battery unit that stores electric power obtained by the power generation unit. A functional layer that functions according to control information, a communication layer that can communicate with an external device, a control layer that controls the functional layer and the communication layer, and a power supply layer that provides power to the functional layer, the communication layer, and the control layer A semiconductor element manufacturing process for manufacturing a semiconductor element including:
A lens molding process for molding contact lenses;
A cover step of providing the semiconductor element on the contact lens and covering the contact lens with a cover material,
A method of manufacturing a contact lens with a function, wherein the aperture transparent portion is formed at the center of the lens by the semiconductor element. A functional layer that functions according to control information, a communication layer that can communicate with an external device, a control layer that controls the functional layer and the communication layer, and a power supply layer that provides power to the functional layer, the communication layer, and the control layer A semiconductor element manufacturing process for manufacturing a semiconductor element including:
A lens molding process for molding a pair of split contact lenses;
A sandwich bonding step of sandwiching the semiconductor element between the pair of divided contact lenses,
A method of manufacturing a contact lens with a function, wherein the aperture transparent portion is formed at the center of the lens by the semiconductor element.