JP2014016144A - Plate for heat exchanger, heat exchanger, and air cooler comprising heat exchanger - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve heat exchange of a plate for a stacked plate type heat exchanger.SOLUTION: A plate for a heat exchanger includes a first side A and an opposing side B. The first side A is configured with at least one heat transferring elevation 2 and with at least one heat transfer surface 4 surrounding the elevation. Dimples 5, 7 are provided at either or both of the heat transferring elevation 2 and the heat transfer surface 4 to permit provision of a through-flow duct X for a first medium. The second side B is configured with at least one heat transferring depression 3 corresponding to the elevation 2. The depression is configured to define a part of a through-flow duct Y for a second medium. The second side of the plate is further configured with at least one bonding surface 6 corresponding to the heat transfer surface 4 and surrounding the depression. A heat exchanger including a stack of the plates and an air cooler including such a heat exchanger are also provided.

Description

  The present invention relates to a heat exchanger plate for heat exchange between a first medium and a second medium. The plate has a first surface and a second surface opposite the first surface. The first surface of the plate is formed with at least one thermally conductive ridge and is configured to allow for the provision of a flow-through duct for the first medium. The second surface of the plate includes at least one thermally conductive concavity that conforms to a ridge on the first surface and defines a portion of a flow-through duct for a second medium. It is formed.

  The present invention further relates to a heat exchanger, which includes a laminate of the plates. The plates are arranged such that the first side of each plate is joined and combined with the first side of an adjacent plate in the stack, thereby providing a first medium between the first sides of the plates. A once-through duct for is defined. As a result, the plates are also arranged such that the second side of each plate is joined and combined with the second side of an adjacent plate in the stack, so that the second side of the plates is between the second side. At least one flow-through duct is defined for the two media.

  The present invention further relates to an air cooling apparatus including the heat exchanger.

  Heat exchangers are used, for example, in the food processing industry, building heating and cooling systems, gas turbines, boilers and many other different fields. Improvements in the heat exchange capacity of heat exchangers are always of interest and even small improvements are appreciated.

  The object of the present invention is to provide a plate for a heat exchanger and a heat exchanger for improving the primary and secondary heat exchange.

  The above as well as other objects are formed such that the first surface of the plate not only includes at least one thermally conductive ridge, but also includes at least one thermally conductive surface surrounding the ridge. Dimples are provided on one or both of the heat transfer surface and the heat transfer ridge to allow for the provision of a once-through duct for the other medium, and the second surface of the plate is at least one heat transfer member. This is achieved by a plate that is not only provided with a low recess, but is adapted to be adapted to the heat conducting surface and also to include at least one coupling surface surrounding the low recess.

  Thus, the heat conductive ridge on the first surface of the plate defines a primary heat conductive region for the first medium, and the heat conductive surface surrounding the ridge is a secondary medium that makes the first medium. A heat conduction area is defined, and a heat conduction depression on the second side of the plate defines a primary heat conduction area for the second medium. Thereby for a heat exchanger defining a larger heat transfer area for the first medium, which is the medium having the smallest heat transfer coefficient, for example air to water, and to be passed at a lower speed / pressure Plates are provided.

  Heat conduction ridges and corresponding heat conduction depressions are many times larger in width than their height / depth and two or more linear, parallel, or substantially parallel By providing an extension having a portion, the primary heat transfer area for the first and second media is enlarged respectively.

  The above and other objects include not only arranging the plates so that the first surface of each plate is joined to the first surface of an adjacent plate in the stack, but also two adjacent plates in the stack Providing a flow-through duct for the first medium between the first surface of the plate by dimples on one or both of the heat conductive surface and the heat conductive ridge on the first surface of the plate; And not only placing the plate so that the second surface of each plate is joined to the second surface of an adjacent plate in the stack, but also on the second surface of two adjacent plates in the stack. This is achieved by configuring the plate to also define at least one flow-through duct for the second medium between the second surfaces of the plate by means of a heat conduction depression.

  Accordingly, opposed dimples on the heat conducting surface on the first side of two adjacent plates in the stack provide a flow-through duct for the first medium and also for the second medium. Since the flow-through duct is defined by opposing heat conduction depressions on the second side of two adjacent plates in the stack, a larger capacity flow-through duct for the first medium is defined. A heat exchanger is provided.

  It has a width several times larger than the depth, that is, the heat conducting surface of the once-through duct is larger than its volume, and two or more straight, parallel or substantially parallel portions are formed. Since the through-flow duct for the second medium is defined by the opposing heat conduction depressions with extensions having, the primary heat exchange capacity of the heat exchanger is improved.

  As described above, a heat exchanger is provided in which the total heat exchange capacity is improved and its manufacturing cost is reduced.

  Furthermore, as described above, the heat exchanger can be used, for example, to provide an improved air cooling device by using one medium as air and the other medium as a liquid.

  The present invention will be described in detail below with reference to the accompanying drawings.

FIG. 3 is a three-dimensional view schematically showing a plate according to the present invention. FIG. 3 is another three-dimensional view showing the plate of FIG. 1. FIG. 3 is a schematic plan view showing one face of the embodiment of the plate of FIGS. 1 and 2. It is the schematic plan view which showed the surface on the opposite side of the plate of FIG. It is the schematic side view which showed a part of plate of FIG. FIG. 5 is a three-dimensional view schematically showing two plates of FIGS. 1 to 4 in a ready state for assembly. It is the schematic side view which showed the plate of FIG. 6 of 2 sheets after the assembly. FIG. 5 is a schematic view showing four plates shown in FIGS. 1 to 4 in an assembled state. FIG. 9 is a three-dimensional view schematically illustrating a heat exchanger according to the present invention including a stack of plates illustrated in FIGS. 1 to 8. FIG. 9a is an explanatory diagram schematically showing how the heat exchanger of FIG. 9a is arranged in the refrigerated display case and how the first and second media flow through the heat exchanger. It is. It is the three-dimensional view which showed schematically the 2nd Example of the plate which concerns on this invention. It is the three-dimensional view which showed roughly a part of 3rd Example of the plate which concerns on this invention.

  As described above, the present invention relates to a plate for a heat exchanger for heat exchange between a first medium and a second medium.

  The first and second media for heat exchange can be the same, for example gas / gas (air etc.) or liquid / liquid (water etc.). The first and second media may be two different media, for example gas / liquid, or two different gases, or two different liquids.

  As shown in particular in FIGS. 1 to 6, the plate 1 has a first surface A and a second surface B. The first surface A of the plate 1 is formed with at least one heat conducting ridge 2. The first surface A of the plate 1 is further formed to allow the provision of a flow-through duct X for the first medium (see FIG. 8). The second surface B of the plate 1 is formed with at least one heat conducting recess 3 that substantially conforms to the ridge A on the first surface A, i.e. this recess is said A ridge 2 on the first side of the plate is defined and has substantially the same length and width and a depth comparable to the height of the ridge. The heat conduction depression 3 is formed so as to define a part of the flow-through duct Y (see FIGS. 7 and 8) for the second medium. The heat conduction ridge 2 and the heat conduction depression 3 are adapted to each other by, for example, stamping or punching the plate 1. If necessary, more than one raised portion 2 and corresponding low depressions 3 can be provided on the first surface A and the second surface B of the plate 1, respectively.

  As is apparent from FIGS. 1, 3 and 6, the first surface A of the plate 1 is further formed with at least one heat conducting surface 4 surrounding the heat conducting ridge 2. The heat conducting surface 4 is provided with dimples 5, which make it possible to provide a flow-through duct X for the first medium. The ridges 2 on the first surface A of the plate 1 define a primary heat conduction area for the first medium, and the heat conduction surface 4 surrounding the ridges is a secondary heat for the first medium. Define the conduction region. The primary and secondary heat conduction regions, i.e., the region of the raised portion 2 and the region 4 of the heat conduction surface 4, together, are substantially equal to the entire region of the first surface A of the plate 1. Thus, as shown in FIGS. 2, 4 and 6, the second surface B of the plate 1 is further formed with at least one coupling surface 6, which provides heat conduction on the first surface A. Corresponds to the surface 4, that is, has the same extension and surrounds the heat conduction depression 3. The low depression 3 defines a primary heat conduction area for the second medium. This primary heat transfer area, i.e. the area of the low depression 3, is substantially equal to the total area of the second surface of the plate minus the area of the coupling surface 6. From the above it is clear that the combined heat transfer area for the first medium is larger than the heat transfer area for the second medium. This feature is due to the fact that the first medium has a smaller heat transfer coefficient, eg air to water, and a lower velocity / pressure compared to the second medium to provide optimal heat transfer. It is advantageous when it is to flow through. A heat exchanger including a plate configured as described above has an improved heat exchange capacity.

  Thus, the primary heat transfer area described above is provided by a surface on a member of the plate that is in direct contact with one medium, where the opposite surface of that member is in direct contact with another medium, and The secondary heat transfer area is provided by a surface on the plate member that is in direct contact with one medium, with the opposite surface of the member not in direct contact with another medium.

  In order to be able to provide a flow-through duct X for the first medium, the heat-conducting ridge 2 on the first surface A of the plate 1 is formed with a first height h1, and said The dimples 5 on the heat conducting surface 4 on the first surface are formed to have a second height h2 that is larger than the first height (see part of FIG. 5). Accordingly, the dimple 5 protrudes from the raised portion 2. Corresponding to the raised portion 2, the heat conduction depression 3 on the second surface B of the plate 1 is formed so as to have a depth substantially corresponding to the first height h 1 as a result. . The thermally conductive ridge 2 on the first surface A of the plate 1 comprises an additional dimple 7 to allow the provision of a flow-through duct X for the first medium in the illustrated plate embodiment. Formed as follows. Therefore, the additional dimple 7 has a height that is greater than the first height together with the (first) height h1 of the raised portion 2. In the illustrated embodiment, the height of the dimple 7 and the height h 1 of the raised portion 2 substantially correspond to the second height h 2, that is, the height of the dimple 5 on the heat conducting surface 4. Therefore, the height of the dimple 7 is h1 minus h1. In the embodiment of the plate illustrated in FIGS. 1 to 8, the heat conductive ridge 2 on the first surface A of the plate has a first height h1 from the heat conductive surface 4 of about 0.5 to 1 mm. The corresponding heat conduction depression 3 on the second surface B of the plate has a depth from the coupling surface 6 substantially corresponding to the first height, and the heat conduction of the surface A The dimples 5 on the surface have a second height h2 from the heat conducting surface of about 2 to 2.5 mm. However, their height can vary in terms of the intended application and size of the heat exchanger using plates. The dimples 5 and 7 on the first surface A of the plate 1 can be formed by an appropriate method such as stamping or punching treatment similar to the heat conduction raised portion 2 / the low recessed portion 3, and therefore the corresponding low recessed portion. Are formed in the coupling surface 6 as well as in the low depressions on the second surface B of the plate, respectively, and at the same time with raised / low depressions. The size, shape, and number of the dimples 5 and 7 can also be changed in view of the intended application and size of the heat exchanger, and the pattern in which they are arranged can also be changed. The larger the plate 1, the more the spacing between the dimples 5, 7 and the supporting points are required in order to be able to provide a flow-through duct X for the first medium. However, according to the invention, it is also possible to provide a flow-through duct X for the first medium only by the dimples 5 on the heat conducting surface 4 or only by the dimples 7 on the heat conducting ridge 2. In the illustrated embodiment, the dimples 5 and 7 are substantially round.

  The dimples 5 and 7 on the first surface A of the plate 1 are suitable for joining and combining with corresponding dimples on the first surface of another plate so that the dimples are first Allows provision of a once-through duct X for the medium (FIG. 8). The coupling surface 6 on the second surface B of the plate 1 is likewise suitable for joining to a corresponding coupling surface on the second surface of another plate and mounting in a suitable manner without leakage. Therefore, the heat conduction depression 3 on the plate defines a flow-through duct Y for the second medium (FIGS. 7 and 8). However, the dimples 5, 7 on the first side A of the plate 1 can also be arranged to avoid joining and mounting to the corresponding dimples on the first side of another plate, so that both plates The upper dimples are arranged somewhat offset from each other. Similarly, the heat conduction depression 3 on the second surface B of the plate 1 can be arranged so as to be shifted with respect to the heat conduction depression on the second surface of another plate.

  The heat conduction depression 3 defining a part of the flow-through duct Y for the second medium on the second surface B of the plate and the corresponding heat conduction ridge 2 on the first surface A of the plate are: It can vary with respect to shape, size, number and position. Therefore, the low depression 3 and the corresponding raised portion 2 can be, for example, U-shaped having two parallel or substantially parallel linear portions. However, in order to extend the time for heat exchange between the first and second media, the ridges 2 corresponding to the low depressions 3 are replaced by three or more parallel or substantially parallel straight lines. It can also have a sinusoidal shape with portions, ie, odd (FIG. 10) or even (FIGS. 1-8) parallel or substantially parallel straight portions. In order to maximize the heat exchange between the first and second media, the heat sink regions of the depressions 3 as well as the corresponding ridges 2 are possible with respect to the volume of the flow-through duct Y for the second media. It is preferable to make it as large as possible. Accordingly, in the illustrated embodiment, the width w of the raised portion 2 corresponding to the low depression 3 is substantially greater than the depth of the low depression and the height of the corresponding raised portion, for example at least about 5 Doubled, preferably about 50 to 70 times larger as in the illustrated embodiment. Accordingly, in the illustrated embodiment, the heat conduction ridge 2 has a first height h1 of about 0.5 to 1 mm, and the corresponding heat conduction depression 3 has a depth corresponding to the first height. The width w of the low depression corresponding to the raised portion is at least about 2.5 mm, preferably about 25 to 70 mm. The width w of the raised portion 2 corresponding to the low depression 3 is constant or varies along its length, as particularly shown in FIGS. 1 to 4, 6 and 10. You can also. FIGS. 1-4, 6 and 10 show how the widths of the parallel straight portions first shrink and then increase again to the original width. Accordingly, the depth corresponding to the first height h1 is about 0.5 mm, and the width w of the heat conduction raised portion 3 corresponding to the heat conduction raised portion 2 is first reduced from about 35 mm to about 25 mm, and then again about 35 mm. Increase to. In the portion of the raised portion 2 corresponding to the low depression 3 to which the parallel straight portions are connected, the width w is significantly smaller than the straight portion, and in the illustrated embodiment, the height h1 and the corresponding depth. About 20 times larger than Furthermore, the low depressions 3 and the corresponding ridges 2 extend in a direction perpendicular or substantially perpendicular to the longitudinal direction of the plate, as in the embodiment with the illustrated rectangular plate 1. Have parallel straight portions. If necessary, the parallel straight portions can instead extend in the longitudinal direction of the plate 1 or in any other direction.

  In order to prevent compression of the flow-through duct Y for the second medium, the heat conduction depression 3 on the second surface B of the plate 1 is formed with a pressure-resistant dimple 8. The pressure-resistant dimple 8 has substantially the height h1 in the illustrated embodiment, i.e. the height corresponding to the height of the heat conduction ridge 2 and consequently the depth of the corresponding heat conduction depression. Thus, the dimple 8 ends substantially at the same level where the low depression projects. By terminating at the same level as the coupling surface 6 on the second surface B of the plate 1, the dimple 8 has a second plate of another plate to prevent compression of the flow-through duct Y for the second medium. Can be engaged with corresponding dimples on the surface, and contribute to the safe and effective attachment of the second surface and the second surface of another plate by coupling the dimples together in an appropriate manner can do. Further, the dimple 8 promotes the flow of the second medium through the flow-through duct Y by forming a turbulent flow in the flow, and thus the heat exchange action is improved. However, if necessary, the height of the dimple 8 can be made smaller than the first height h1. In the illustrated embodiment, the dimple 8 has a circular shape as well as an oval shape. Some of the oval dimples are further bent. The dimple 8 can be configured in any suitable pattern to optimize the heat exchange action.

  According to one embodiment schematically shown in FIG. 11, the pressure-resistant dimples 8 are stretched and slanted through the heat conduction recesses 3, preferably further extending parallel to each other. And when the second surfaces B of the plates 1 are connected to each other, they are inclined through the flow-through duct Y for the second medium, preferably over the entire width of the heat conduction recess / flow-through duct. The extended dimples extend and are spaced apart from each other in the longitudinal direction of the heat conducting recess / through duct. The heat conduction raised portion 2 / the low depression 3 can branch at a specific point between the extended dimples 8 and can be joined again immediately thereafter, so that the dimple 7 protruding from the heat conduction raised portion 2 can be formed. Instead, a space is provided for the dimples 5 protruding from the heat conducting surface 4, so that only the dimples 5 having a height h 2 are present on the first surface A of the plate 1. The elongated dimple 8 preferably has a triangular cross-section, but may have any required cross-sectional shape, such as a frustoconical cross-section as shown in FIG. When the second surfaces B of the two plates 1 are joined, the dimples 8 are joined to each other, and the dimples preferably extend perpendicularly to each other, and a plurality of engagements between the dimples And provide points for possible combinations.

  On the first surface A on the opposite side of the plate 1, the heat conduction ridge 2 is consequently blocked by the extended dimples 8 in the heat conduction depression 3 on the second surface B of the plate, Defines a "groove" 8a in which the dimples are appropriately formed in the heat conducting ridge, which forms part of the flow-through duct X for the first medium. Accordingly, these “grooves” 8a preferably extend obliquely from one side to the other side via the heat conduction ridges 2, and each of the “rib-like” portions 2a of the heat conduction ridges is formed. Separate from each other while defining. As mentioned above, in order to provide a space for the dimple 5, some of the "rib-like" portions 2a are preferably blocked in the middle of their longitudinal extension. As shown in FIG. 11, this embodiment further extends the heat conduction ridges on the first surface A of the plate 1 to extend parallel and obliquely and between them. It can be regarded as including a plurality of thermally conductive ridges having portions of the surface 4 (defined by "grooves" 8a).

  The embodiment described above and shown schematically in FIG. 11 provides a strong flow-through duct Y for the second medium in part, but if the dimples 8 stretched from the above description are required, they are mutually connected. It is clear that it is possible to extend in non-parallel directions and to provide dimples 7 protruding from the “rib-like” part 2a of the heat conducting ridge 2.

  Therefore, in order to reinforce the flow-through duct to facilitate the flow of the first medium through the flow-through duct X and to prevent collapse, the heat conducting surface 4 on the first surface A of the plate 1 is similar. Reinforcing dimples 9 are provided in a manner. The reinforcing dimple 9 has a height substantially equal to the height h1, that is, the height of the heat conducting ridge 2 in the illustrated embodiment, so that the dimple is substantially the same as the ridge 2. End at level. However, if necessary, the height of the dimple 9 is made smaller than the first height h1, and the pressure effect of the first medium flow in the flow-through duct X is minimized to further maintain the dimple strengthening capability. It is preferable to make it as small as possible. The height of the dimple 9 can be made larger than the first height in a range not exceeding the height h2 (second height) of the dimple 5. In the illustrated embodiment, the dimple 9 has an elongated shape. The dimples 9 can also be configured in any appropriate pattern to optimize the heat exchange action.

  As in the case of the dimples 5 and 7, which enable the provision of the heat-conducting ridge 2 / low depression 3 and the above-mentioned flow-through duct X for the first medium, the dimples 8 and 9 can also be stamped, punched, or It can be formed by other appropriate methods, and can be formed at the same time as the raised portion / recessed portion and the dimples 5 and 7. Accordingly, corresponding low depressions are respectively formed on the opposing surfaces A and B of the plate 1, i.e. in the raised portions 2 on the surface A and in the coupling surface 6 on the surface B, respectively.

  As described above, the plate 1 can have a rectangular shape composed of two short sides 1c and 1d facing two long sides 1a and 1b facing each other, and one of both long sides can be formed. First and second port holes 10 and 11 for the second medium can be provided in the vicinity and / or in the vicinity of one of both short sides. The positions of the port holes 10 and 11 depend on the shape of the plate 1 and the shape and position of the heat conduction ridge 2 and the corresponding heat conduction depression 3 on the plate. In the illustrated embodiment of a rectangular plate 1 with raised portions 2 and correspondingly recessed portions 3 having even parallel straight portions, each porthole 10, 11 has the same long side 1a and short side. In proximity to one of 1c and 1d, it is arranged in a corner defined by the long side and the corresponding short side (see FIGS. 1 to 4). In the case of the raised portion 2 and the corresponding low depression portion 3 having an odd number of parallel straight portions, each of the port holes 10 and 11 is, for example, one of the long sides 1a and 1b and one of the short sides 1c and 1d. In close proximity, they are arranged in the corner defined by the corresponding long side and the corresponding short side, that is, on the plate 1 at another position on the diagonal line (see FIG. 10). Each of the port holes 10 and 11 is formed on the first surface A of the plate with edge portions 10a and 11a surrounding the port holes. Each edge portion 10a, 11a forms part of the raised portion 2, and in the illustrated embodiment, a height corresponding to the second height h2, that is, the height of the dimple 5 and the raised portion 2 (h1) and the dimple. 7 (h2-h1), each having a height corresponding to the combined height and having the same function as the dimple, that is, it is possible to provide a flow-through duct X for the first medium. The function as well as the function of preventing the second medium from flowing into the flow-through duct X for the first medium can be provided. On the other hand, the plate 1 has a square shape with four equally long sides, or any other suitable quadrilateral, triangle, polygon, circle, diamond, ellipse, or intended application or use It can have any other shape according to the form.

  In the embodiment shown in FIGS. 1-8, where the intended use of the plate 1 is a heat exchanger for a refrigerated display case, the plate 1 can have a length of about 270 mm and a width of about 150 mm. . However, the plate 1 can have any other size optimized according to the intended application. Therefore, the length of the plate 1 may exceed 1 m, for example, and the width may exceed 0.5 m. The size of the plate 1 can also be smaller than that of the illustrated embodiment, and for example how the plate is arranged in the heat exchanger and / or for the first and second media Based on how the flow-through ducts X, Y are oriented, what is considered as the width of the plate can be made larger than what is considered as the length.

  As described above, the present invention further relates to a heat exchanger for exchanging heat between the first and second media, wherein the heat exchanger has a laminate of the plates 1 having the above-described configuration. Thus, the stack of plates 1 can be arranged in a frame structure 12 with opposed plate elements 13 and 14 as shown in FIG. At least one of them (plate element 13 in FIG. 9a) is provided with pipe connections 15 and 16 for the second medium, and a top panel 17 and a partially open bottom panel 18 are provided. The stack of plates 1 can be placed in the frame structure 12 in the figure, which consists of 360 plates, with each plate having a total height of about 2.5 mm for a total height of about 900 mm. . However, the number of plates 1 in the stack can be changed, and thus the size of the heat exchanger can be changed according to the intended application or usage.

  As shown in FIG. 9b, heat is generated in a refrigerated display case with a bottom plate 18 facing down the frame structure 12, a top plate facing up the frame structure, and plate elements 13, 14 facing the frame structure. When the exchanger is arranged, the plates 1 in the stack extend sequentially in a substantially parallel vertical plane so that the first medium (eg cooled air) is substantially horizontally in the heat exchanger. As well as through a heat exchanger. Thus, the first medium flows, for example, substantially horizontally from the left side of the heat exchanger through the heat exchanger in the right direction and flows out of the heat exchanger on the right side, or is illustrated in FIG. 9b. As shown, from the right side of the heat exchanger through the heat exchanger in a substantially horizontal left direction (indicated by arrow D2 in FIG. 9b) and out of the heat exchanger on the left side Can do. The second medium (eg water for cooling the air) flows into the heat exchanger via one of the pipe connections 15, 16 provided in the plate element 13, and is substantially sinusoidal. A horizontal flow through the heat exchanger along the path, with the parallel or substantially parallel straight portions of the sinusoidal path extending substantially vertically (indicated by arrow D1 in FIG. 9b). In addition, the second medium flows out of the heat exchanger via the other of the pipe connections 15, 16 of the plate element. In the embodiment shown in FIG. 9b, the second medium flows into the heat exchanger via the pipe connection 15 on the left side of the plate element 13 and flows out of the heat exchanger via the pipe connection 16 on the right side. To do. Thus, in FIG. 9b, the first medium flows through the heat exchanger in a substantially horizontal direction, and the second medium undergoes heat exchange along a substantially vertical and substantially sinusoidal path. The first medium to be cooled and the second medium for cooling are heated when both of them have the highest temperature. Encountered in a manner that transfers or exchanges heat, so that the first medium is progressively cooled by a second medium that is progressively cooler. A second cooling medium that passes through a first medium to be cooled in a horizontal direction opposite to the first medium via heat exchange along a substantially vertical and substantially sinusoidal path; Multi-step counter-current is achieved by contact with the medium. The condensate of the first medium flows out through a bottom plate 18 that is partially open at the bottom of the heat exchanger. A drain (not shown) is provided at the bottom of the heat exchanger to collect the condensate. Thus, the heat exchanger frame structure 12 facilitates the discharge of condensate from the heat exchanger. Also, inspection, cleaning and repair of the heat exchanger is facilitated by the illustrated frame structure 12.

  As described above, the plates 1 in the stack in the heat exchanger are arranged such that the first surface A of each plate joins the first surface A of an adjacent plate in the stack, and thus heat conduction. First between the first surfaces of each plate by dimples 5 on the surface 4 and / or by dimples 7 on the heat conductive ridges 2 on the first surface of two adjacent plates in the stack. A once-through duct X for the medium is provided. In addition, the plate 1 is arranged such that the second side B of each plate joins the second side B of the adjacent plate in the stack, and thus on the second side of the two adjacent plates A heat conducting depression 3 defines at least one flow-through duct Y for the second medium between the second surfaces of each plate.

  As described above, for example, the second height is greater than the depth of the heat conduction depression 3 on the second surface B of the plate (corresponding to the first height h1 of the heat conduction raised portion). The dimple 5 on the first surface A of the plate has h2, and the region of the heat conductive ridge 2 and the heat conductive surface 4 on the first surface of the plate is the heat conduction on the second surface of the plate. By forming each plate 1 so as to be larger than the region of the low depression part, the first surface A of the two adjacent plates 1 and the second surface B of the two adjacent plates are mutually connected. When combined, the volume of the flow-through duct X for the first medium can be larger than the volume of the flow-through duct Y for the second medium. This is true even when the dimples and the raised / recessed parts are arranged offset. As shown in FIGS. 7 and 8, the opposing dimples 5 on the heat conducting surface 4 and / or the ridges 2 on the first surface A of the two adjacent plates in the stack. When the dimple 7 is used to provide a flow-through duct for the first medium, and because of the opposed low depressions 3 on the second surface B of the two adjacent plates in the stack, the second medium When the flow-through duct for the first medium is defined, the volume of the flow-through duct X for the first medium relative to the volume of the flow-through duct Y of the second medium is further increased.

  In order to provide a safe and lasting stack of plates 1, the first side A of two adjacent plates in the stack will be on that first side, regardless of whether they are placed at an offset or not. Combined on dimples 5 on the heat conducting surface 4, the second surface B of two adjacent plates in the stack is combined on the bonding surface 6 on that second surface. The first surfaces A of two adjacent plates 1 in the laminate can also or alternatively be combined on the dimples 7 on the ridges 2 if present. Thus, as a result of the combined heat conduction area on the first side A of the plate 1 being larger than the heat conduction area on the second side B of the plate, the total coupling on the first side of the plate The area is smaller than the bonding area on the second side of the plate. Adjacent plates 1 can be assembled, for example, by brazing or other suitable attachment methods. At least the opposing coupling surface 6 on the second surface B of each of the two adjacent plates 1 in the stack and the port hole 10 on the first surface A of the two adjacent plates in the stack. , 11 of the opposing edge portions 10a, 11a is required to be assembled without leakage.

  From the above, different heights of the dimple 5 and the heat conduction raised portion 2 / the low recessed portion 3 are given to the flow-through duct X for the first medium, and the height of the flow-through duct X is changed. That is, it is understood that the first medium changes when flowing from left to right or right to left in FIG. 8 or when flowing from right to left as shown in FIG. 9b. This changing height changes the speed / pressure of the first medium while flowing through the flow-through duct X. Accordingly, in the embodiment shown in FIGS. 1 to 8, the flow-through duct X for the first medium is a third between the heat conducting ridges 2 on the first face A of the two adjacent plates. And a fourth height that is greater than the third height h3 and between the heat conducting surface 4 surrounding the raised portion on the first surface of the two adjacent plates. h4 is provided. Therefore, the fourth height h4 is substantially equal to twice the height h2 (second height) of the dimple 5 on the heat conducting surface 4 on the first surface A of each plate 1, and The third height h3 is equal to the fourth height minus two times the height h1 (first height) of the raised portion 2 on the first surface of each plate (particularly the figure). 8).

  In the embodiment shown in FIGS. 1 to 8, the flow-through duct Y for the second medium has a depth of the heat conduction depression 3 on the second surface B of each plate 1 (heat conduction ridge). And a fifth height h5 that is substantially equal to twice the height h1 (corresponding to the first height) (see particularly FIG. 7).

  The laminate of the plates 1 in the heat exchanger can include one type of plate. This is because the heat conduction ridges 2 on the first surface A of each plate and the corresponding heat conduction depressions 3 on the second surface B of each plate are even parallel or substantially parallel straight portions. This may correspond to a case having a substantially sinusoidal shape (similar to the plate embodiment of FIGS. 1-8). Alternatively, the stack of plates 1 can include two types of plates. This includes, for example, straight portions where the ridges 2 on the first surface A of each plate and the corresponding heat conduction depressions 3 on the second surface B of each plate are odd parallel or substantially parallel. However, this may correspond to a case having a substantially sinusoidal shape (similar to the plate embodiment of FIG. 10). The two types of plates 1 are, for example, when the dimples 5 and / or the heat-conducting ridges 2 / the low depressions 3 on the two adjacent plates are arranged offset from each other and on the first surface A of the plates This is also required if the height of the ridge and / or the dimple is different from the height of the ridge and / or the dimple on the first side A of another plate. The height of these dimples 5 and / or ridges 2 and / or low depressions 3 can be varied in a very wide range, but in the latter embodiment having the two types of plates described above, In order to provide a flow-through duct X for the first medium between the first side A of the plate, it is important that at least the total height of the facing dimples is always greater than the height of the facing ridges. is there.

  The heat exchanger according to the invention can be of the cross-flow type, in which case the heat conduction on the second face B of the two adjacent plates 1 defining the through-flow duct Y for the second medium. A substantially parallel straight portion of the low depression 3 extends in the first direction D1 of the plate, and the first medium provided between the first surfaces A of two adjacent plates. The flow-through duct X for the plate extends in a second direction substantially perpendicular to the first direction of the plate. The aforementioned heat exchanger can in principle be of the type described above. Instead, the heat exchanger according to the present invention can be of a different type from the cross-flow type.

  Reduce the energy consumption for cooling by about 20%, especially when using water to cool the air of a refrigerated display case, for example, by using the above-mentioned heat exchanger including a stack of plates as described above. Can do. The first reason for this favorable result is that it is not necessary to lower the temperature of the cooling water as in conventional structures in order to provide sufficient air cooling. This is then due to extended and more extensive direct and indirect air and water contact.

  Those skilled in the art will appreciate that the plates and heat exchangers of the present invention may be modified within the scope of the appended claims without departing from the spirit and objectives of the present invention. That is, the plate 1 is preferably made of aluminum, but can be made of any other material. The stack of plates in the heat exchanger can be placed in a more open frame structure compared to the embodiment shown in FIG. 9a, and the frame structure can also be formed from any suitable material. it can. In addition, it is clear that the heat exchanger can be placed in any suitable location according to the intended application, and if necessary or desired, it can be placed horizontally as in the illustrated embodiment. It can be arranged vertically, or it can be inclined. The above-described heat exchanger is suitable for use in an air cooling device because the first medium, which is the medium to be cooled, can be air.

Claims (15)

A heat exchanger plate for heat exchange between the first and second media,
The plate (1) has a first surface (A) and an opposite second surface (B);
The first surface (A) of the plate (1) is formed to comprise at least one thermally conductive ridge (2) and at least one thermally conductive surface (4) surrounding the ridge,
A dimple (5; 7) is provided on one or both of the heat conduction ridge (2) and the heat conduction surface (4) to enable the provision of a once-through duct (X) for the first medium. Provided,
The second surface (B) of the plate (1) is formed to include at least one heat conducting low depression (3) that conforms to the raised portion (2), and the low depression is a second depression. Defining a part of a flow-through duct (Y) for the medium, wherein the second surface of the plate is further adapted to the heat-conducting surface (4) and surrounds the depressions ( 6)
The first heat conduction ridge (2) on the first surface (A) of the plate (1) corresponds to the depth of the heat conduction depression (3) on the second surface (B) of the plate. Having a height (h1) and a width (w) corresponding to the width of the heat conduction depression (3),
The heat conduction low depression (3) on the second surface (B) of the plate (1) is the first height (h1) of the heat conduction ridge (2) and the corresponding depth of the low depression. A plate provided with pressure-resistant dimples (8) having a height corresponding to.   The dimple (5) provided on the heat conducting surface (4) on the first surface (A) of the plate (1) has a second height (h2) greater than the first height (h1). And / or the dimples (7) provided on the heat conduction ridge (2) on the first surface (A) of the plate (1) are aligned with the height (h1) of the ridge. 2. A plate according to claim 1, having a height (h2-h1) which is greater than a height (h1) of 1.   The width (w) of the heat conduction raised portion (2) and the corresponding heat conduction raised portion (3) is compared to the height (h1) of the heat conduction raised portion and the depth of the corresponding heat conduction raised portion. 3. A plate according to claim 1 or 2, wherein the plate is at least 5 times larger.   There are two or more heat conduction ridges (2) on the first surface (A) of the plate (1) and corresponding heat conduction depressions (3) on the second surface (B) of the plate (1). 4. A plate according to any one of claims 1 to 3 configured to comprise parallel or substantially parallel straight portions.   The pressure-resistant dimples (8) are extended so as to extend obliquely through the heat conduction depressions (3) and are arranged so as to be separated from each other in the longitudinal direction of the heat conduction depressions (3). 5. The plate according to any one of 4 to 4.   6. A plate according to any one of the preceding claims, wherein the heat conducting surface (4) on the first surface (A) of the plate (1) comprises reinforced dimples (9).   The plate (1) comprises first and second port holes (10 and 11) for a second medium, each of the port holes (10, 11) being a first surface of the plate (1) ( A) is provided with an edge portion (10a, 11a) surrounding the port hole on the upper side, and the edge portion forms a part of the heat conduction raised portion (2) and the second of the dimple (5). The height (h1) of the heat conduction ridge is equal to the height (h2) and / or the height (h2-h1) of the dimple (7) provided on the heat conduction ridge (2). The plate according to any one of claims 2 to 6, which has a height corresponding to the sum of the two. A heat exchanger for heat exchange between the first and second media;
The heat exchanger comprises a laminate of plates (1) according to any of claims 1 to 6,
The first surface (A) of each plate joins the first surface (A) of the adjacent plate (1) in the stack, and thus the first surface of two adjacent plates in the stack ( A) The dimples (5; 7) on one or both of the heat conductive surface (4) and the heat conductive ridge (2) on the first medium between the first surfaces of each plate Providing a once-through duct (X) for
The second side (B) of each plate (1) joins the second side (B) of the adjacent plate (1) in the stack, and thus the second of the two adjacent plates in the stack. In such a manner that at least one flow-through duct (Y) for the second medium is defined between the second side of each plate by means of a heat conduction depression (3) on the side (B) of the plate. A heat exchanger in which the plate (1) is arranged.   Each of the first surfaces (A) of two adjacent plates (1) in the laminate is either one of the heat conduction surface (4) and the heat conduction ridge (2) on each first surface. Or opposite edges that are combined on opposing dimples (5; 7) on both of them and surround the port hole (10, 11) for the second medium on the first side in the plate 9. A heat exchanger according to claim 8, wherein the heat exchangers are combined by a leak-free connection between the edges on (10a, 11a).   When the second surfaces (B) of the two adjacent plates (1) in the laminate are bonded to each other, the second surfaces (2) of the two adjacent plates (1) in the laminate ( The heat exchanger according to claim 8 or 9, wherein the pressure-resistant dimples (8) in the heat conduction low depression (3) on B) are configured to fit each other.   Each second surface (B) of two adjacent plates (1) in the stack is combined with each other by a leak-free connection of the opposing bonding surfaces (6) on each said second surface; 11. A heat exchanger according to claim 10, wherein the heat exchangers are combined on opposing dimples (8) in a heat conduction depression (3) on each second surface. Parallel or substantially parallel of the heat conduction depression (3) on the second surface (B) of the two adjacent plates (1) defining the flow-through duct (Y) for the second medium. Each straight line portion extends in the first direction (D1) of the plate, and
The through-flow duct (X) for the first medium provided between the first surfaces (A) of two adjacent plates (1) extends in the second direction (D2) of the plates. The heat exchanger according to any one of claims 8 to 11, wherein the second direction is substantially perpendicular to the first direction (D1).   13. A heat exchanger according to any one of claims 8 to 12, wherein the stack of plates (1) of the heat exchanger is arranged in a frame structure (12) with plate elements (13 and 14) facing each other.   14. A heat exchanger according to claim 13, wherein at least one of the plate elements (13, 14) facing each other comprises a pipe connection (15 and 16) for the second medium.   15. An air cooling device comprising the heat exchanger according to claim 8, wherein the first medium is air and the second medium is liquid.

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