JP2013257195A - Substrate checkup jig and substrate checkup apparatus - Google Patents

Substrate checkup jig and substrate checkup apparatus Download PDF

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JP2013257195A
JP2013257195A JP2012132560A JP2012132560A JP2013257195A JP 2013257195 A JP2013257195 A JP 2013257195A JP 2012132560 A JP2012132560 A JP 2012132560A JP 2012132560 A JP2012132560 A JP 2012132560A JP 2013257195 A JP2013257195 A JP 2013257195A
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substrate
unit
probe
continuous
board
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Yasuto Kurihara
靖人 栗原
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Nidec Read Corp
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Nidec Read Corp
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Priority to JP2012132560A priority Critical patent/JP2013257195A/en
Priority to CN201310228424.9A priority patent/CN103487608A/en
Priority to TW102120570A priority patent/TW201403088A/en
Priority to KR1020130065604A priority patent/KR20130139172A/en
Publication of JP2013257195A publication Critical patent/JP2013257195A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0046—Arrangements for measuring currents or voltages or for indicating presence or sign thereof characterised by a specific application or detail not covered by any other subgroup of G01R19/00
    • G01R19/0069—Arrangements for measuring currents or voltages or for indicating presence or sign thereof characterised by a specific application or detail not covered by any other subgroup of G01R19/00 measuring voltage or current standards

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a substrate checkup jig and a substrate checkup apparatus that can substantially reduce the length of time required to check up the insulating performance of capacitors provided on a continuous substrate composed by consecutively arranging a plurality of unit substrates.SOLUTION: A continuous substrate 2, which is the object of checkup with this substrate checkup apparatus 1, is configured by consecutively arranging a plurality of unit substrates 3 each provided with at least one capacitor 4a or 4b. The tips of a plurality of probes P of a substrate checkup jig 11 can be brought into contact with contact pieces 5 electrically connected to electrode terminals of capacitors 4, one provided in each of two or more corresponding unit substrates 3 within the continuous substrate 2. Currents flowing through the capacitors 4a and 4b of two or more unit substrates 3 of the continuous substrate 2 are individually detected by a plurality of current detectors AM, and the insulating performance of the capacitors 4a and 4b of the two or more unit substrates 3 of the continuous substrate 2 is checked up on the basis of the results of checkup.

Description

本発明は、基板に設けられたコンデンサの絶縁特性を検査する基板検査装置に備えられる基板検査治具及び基板検査装置に関する。   The present invention relates to a substrate inspection jig and a substrate inspection apparatus provided in a substrate inspection apparatus for inspecting the insulation characteristics of a capacitor provided on a substrate.

基板検査装置は、基板の電気的特性を検査するために、電気信号を供給するための電源や、基板の電気信号を検出するための電流計を備える制御部を備えている。この制御部には、電源や電流計は１つしか備えられていないことが通常である。このため、複数のコンデンサが設けられた基板（例えば、複数の単位基板が連なってなる連続基板）に対して検査を行う場合には、コンデンサを１つずつ順番に検査する必要があり、検査に長時間を要するという問題があった。   The substrate inspection apparatus includes a control unit including a power source for supplying an electrical signal and an ammeter for detecting the electrical signal of the substrate in order to inspect the electrical characteristics of the substrate. This control unit is usually provided with only one power source and ammeter. For this reason, when inspecting a substrate provided with a plurality of capacitors (for example, a continuous substrate in which a plurality of unit substrates are connected), it is necessary to inspect the capacitors one by one in order. There was a problem that it took a long time.

なお、この種の基板検査装置に関する先行技術文献としては、特許文献１が挙げられる。   Patent Document 1 is given as a prior art document relating to this type of substrate inspection apparatus.

特開２００８−３０５８９１号公報JP 2008-305891 A

そこで、本発明の解決すべき課題は、複数の単位基板が連なってなる連続基板に設けられたコンデンサの絶縁特性の検査に要する時間を大幅に短縮できる基板検査治具及び基板検査装置を提供することである。   Therefore, the problem to be solved by the present invention is to provide a substrate inspection jig and a substrate inspection apparatus capable of greatly reducing the time required for inspecting the insulation characteristics of a capacitor provided on a continuous substrate in which a plurality of unit substrates are connected. That is.

上記課題を解決するため、本発明の第１の局面では、複数の単位基板が連なってなり、前記各単位基板に、少なくとも１つのコンデンサが設けられるとともに、前記各単位基板の表面に前記各コンデンサの２つの電極端子と配線を介して接続された複数の接触点が設けられた連続基板について、その連続基板内の前記各単位基板に設けられた前記コンデンサの絶縁特性を検査する基板検査装置に備えられる基板検査治具であって、その先端部が、前記連続基板の２つ以上の前記単位基板の前記接触点にそれぞれ接触可能に配置された複数のプローブと、前記複数のプローブを保持するプローブ保持部材と、前記プローブ保持部材によって保持された前記各プローブの後端部がそれぞれ電気的に接触される複数の電極部と、前記複数の電極部を保持する電極保持部材と、前記各電極部を、前記各プローブと前記基板検査装置の装置本体側との間の電気的な接続関係を切り替える接続切替部に接続する複数の導線部と、を備える。   In order to solve the above problems, in the first aspect of the present invention, a plurality of unit substrates are connected, and each unit substrate is provided with at least one capacitor, and each capacitor is provided on the surface of each unit substrate. A substrate inspection apparatus for inspecting the insulation characteristics of the capacitor provided on each unit substrate in the continuous substrate with respect to the continuous substrate provided with a plurality of contact points connected to the two electrode terminals via wiring A substrate inspection jig provided, the tip of which holds a plurality of probes arranged to be in contact with the contact points of two or more unit substrates of the continuous substrate, respectively, and the plurality of probes A probe holding member, a plurality of electrode portions each of which is electrically contacted with a rear end portion of each probe held by the probe holding member, and the plurality of electrode portions. An electrode holding member to be held, and a plurality of wire portions that connect each electrode portion to a connection switching portion that switches an electrical connection relationship between each probe and the apparatus main body side of the substrate inspection apparatus. .

また、本発明の第２の局面では、上記第１の局面に係る基板検査治具と、前記基板検査治具の前記プローブ及び前記連続基板の前記接触点を介して、前記連続基板の前記２つ以上の単位基板の前記コンデンサに絶縁特性の検査のための電力を供給する電源部と、前記基板検査治具の前記プローブ及び前記連続基板の前記接触点を介して、前記連続基板の前記２つ以上の単位基板の前記コンデンサに流れる電流をそれぞれ検出する複数の電流検出部と、前記基板検査治具の前記プローブと、前記電源部及び前記電流検出部との間の電気的な接続関係を切り替える接続切替部と、前記電流検出部の検出結果に基づいて、前記連続基板の前記２つ以上の単位基板の前記コンデンサの絶縁特性を検査する判定処理部と、を備える。   According to a second aspect of the present invention, the substrate inspection jig according to the first aspect, the probe of the substrate inspection jig, and the contact point of the continuous substrate, the 2 of the continuous substrate. The power supply unit that supplies power for inspecting insulation characteristics to the capacitors of two or more unit substrates, the probe of the substrate inspection jig, and the contact point of the continuous substrate, the 2 of the continuous substrate An electrical connection relationship between a plurality of current detection units that respectively detect currents flowing in the capacitors of two or more unit substrates, the probe of the substrate inspection jig, the power supply unit, and the current detection unit A connection switching unit for switching, and a determination processing unit for inspecting the insulating characteristics of the capacitors of the two or more unit substrates of the continuous substrate based on a detection result of the current detection unit.

また、本発明の第３の局面では、上記第２の局面に係る基板検査装置において、前記接続切替部は、前記基板検査治具の前記プローブと前記電源部及び前記電流検出部との間の電気的な接続関係を切り替える複数のスイッチング素子と、その複数のスイッチング素子が設けられた基板部材とを備え、前記複数の電流検出部は、前記接続切替部の前記基板部材に設けられる。   In the third aspect of the present invention, in the substrate inspection apparatus according to the second aspect, the connection switching unit is provided between the probe of the substrate inspection jig, the power supply unit, and the current detection unit. A plurality of switching elements for switching the electrical connection relationship and a substrate member provided with the plurality of switching elements are provided, and the plurality of current detection units are provided on the substrate member of the connection switching unit.

本発明の第１の局面に係る基板検査治具によれば、複数のプローブの先端部を、連続基板内の２つ以上の単位基板について、その単位基板に設けられたコンデンサの電極端子と電気的に接続された接触子にそれぞれ接触させることができる。そのため、連続基板内に設けられた複数の端子基板について、その単位基板に設けられたコンデンサの絶縁特性に関する検査を同時に行うことができ、コンデンサの絶縁特性の検査に要する時間を大幅に短縮できる。   According to the substrate inspection jig according to the first aspect of the present invention, the tip portions of the plurality of probes are electrically connected to the electrode terminals of the capacitors provided on the unit substrates with respect to two or more unit substrates in the continuous substrate. Can be brought into contact with each connected contact. Therefore, it is possible to simultaneously inspect the insulation characteristics of the capacitor provided on the unit substrate for a plurality of terminal boards provided in the continuous substrate, and the time required for the inspection of the insulation characteristics of the capacitor can be greatly reduced.

本発明の第２の局面に係る基板検査装置によれば、上記の第１の局面に係る基板検査治具と、連続基板の２つ以上の単位基板のコンデンサに流れる電流をそれぞれ検出する複数の電流検出部とが備えられている。それ故、連続基板内に設けられた複数の端子基板について、その単位基板に設けられたコンデンサの絶縁特性に関する検査を同時に行うことができ、コンデンサの絶縁特性の検査に要する時間を大幅に短縮できる。   According to the substrate inspection apparatus according to the second aspect of the present invention, a plurality of currents flowing through the substrate inspection jig according to the first aspect and the capacitors of two or more unit substrates of the continuous substrate are detected. And a current detection unit. Therefore, it is possible to simultaneously inspect the insulation characteristics of the capacitor provided on the unit board for a plurality of terminal boards provided in the continuous board, and the time required for the inspection of the insulation characteristics of the capacitor can be greatly reduced. .

本発明の第３の局面に係る基板検査装置によれば、複数の電流検出部が、接続切替部の複数のスイッチング素子が設けられる基板部材に設けられている。それ故、電流検出部とプローブとの間の配線経路を短縮でき、ノイズ（例えば、配線経路の抵抗値による影響等）を抑制して正確にコンデンサに供給される電流を検出できる。   According to the substrate inspection apparatus according to the third aspect of the present invention, the plurality of current detection units are provided on the substrate member provided with the plurality of switching elements of the connection switching unit. Therefore, the wiring path between the current detection unit and the probe can be shortened, and the current supplied to the capacitor can be accurately detected while suppressing noise (for example, the influence of the resistance value of the wiring path).

また、電流検出部の設置数等は、基板検査治具のプローブ及び接続切替部のスイッチング素子の設置状況（設置数等）との関係が強いため、電流検出部を接続切替部の基板部材に設けることにより、検査装置本体の構成を維持しながら、検査対象の基板の仕様変更等に容易に対応できる。   In addition, the number of current detection units installed is closely related to the installation status (number of installations, etc.) of the probe of the board inspection jig and the switching element of the connection switching unit. By providing, it is possible to easily cope with a change in the specification of the substrate to be inspected while maintaining the configuration of the inspection apparatus main body.

本発明の一実施形態に係る基板検査装置の部分的構成を模式的に示す図である。It is a figure which shows typically the partial structure of the board | substrate inspection apparatus which concerns on one Embodiment of this invention. 図１の基板検査装置に備えられる基板検査治具の部分的構成を示す断面図である。It is sectional drawing which shows the partial structure of the board | substrate inspection jig | tool with which the board | substrate inspection apparatus of FIG. 1 is equipped. 図１の基板検査装置の電気的構成を示す図である。It is a figure which shows the electrical structure of the board | substrate inspection apparatus of FIG. 図１の基板検査装置の検査対象である連続基板を示す図である。It is a figure which shows the continuous board | substrate which is a test object of the board | substrate inspection apparatus of FIG. 図１の基板検査装置により検査が行われる際の回路構成を示す図である。It is a figure which shows the circuit structure at the time of test | inspection by the board | substrate test | inspection apparatus of FIG. 検査時にコンデンサに供給される電流の時間変化等を示す図である。It is a figure which shows the time change etc. of the electric current supplied to a capacitor | condenser at the time of a test | inspection.

図１ないし図６を参照して、本発明の一実施形態に係る基板検査装置について説明する。この基板検査装置１は、図１に示すように、基板検査治具１１、接続切替ユニット１２及び検査処理ユニット１３を備えて構成されており、図４に示す連続基板２内の２つ以上の単位基板３に設けられたコンデンサ４ａ，４ｂ（これらを総称する場合は符号「４」を用いる）（図５参照）の絶縁特性に関する検査を行う。図３に示すように、接続切替ユニット１２には、接続切替部１４及び複数の電流検出部ＡＭ１〜ＡＭｎ（これらを総称する場合は符号「ＡＭ」を用いる）が設けられている。また、検査処理ユニット１３には、電源部１５、電圧検出部ＶＭ、及び判定処理部としての制御部１６が備えられている。   A substrate inspection apparatus according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the substrate inspection apparatus 1 includes a substrate inspection jig 11, a connection switching unit 12, and an inspection processing unit 13, and includes two or more in the continuous substrate 2 shown in FIG. The capacitors 4a and 4b provided on the unit substrate 3 are inspected for insulation characteristics (refer to FIG. 5). As shown in FIG. 3, the connection switching unit 12 is provided with a connection switching unit 14 and a plurality of current detection units AM <b> 1 to AMn (when these are collectively referred to as “AM”). The inspection processing unit 13 includes a power supply unit 15, a voltage detection unit VM, and a control unit 16 as a determination processing unit.

連続基板２は、図４に示すように、同じ構成を有する複数の単位基板３が連続的（例えば、マトリクス状）に連なったものであり、最終的に連続基板２を複数に分割することにより、複数の単位基板３が得られるようになっている。各単位基板３には、図５に示すように、少なくとも１つ（本実施形態では、複数）のコンデンサ４ａ，４ｂが設けられる。本実施形態では、各単位基板３に２つのコンデンサ４ａ，４ｂが設けられている。例えば、各単位基板３は内部にコンデンサ４が内蔵された部品内蔵基板である。   As shown in FIG. 4, the continuous substrate 2 is a unit in which a plurality of unit substrates 3 having the same configuration are continuously connected (for example, in a matrix shape), and finally the continuous substrate 2 is divided into a plurality of pieces. A plurality of unit substrates 3 can be obtained. As shown in FIG. 5, each unit substrate 3 is provided with at least one (in this embodiment, a plurality of) capacitors 4a and 4b. In this embodiment, two capacitors 4 a and 4 b are provided on each unit substrate 3. For example, each unit board 3 is a component built-in board in which a capacitor 4 is built.

また、各単位基板３の表面には、各コンデンサ４の２つの電極端子と配線を介して接続された複数の接触点５ａ〜５ｃ（これらを総称する場合は符号「５」を用いる）が設けられている。接触点５ａは、２つのコンデンサ４の第１の電極端子と配線を介して電気的に接続されており、接触点５ｂ，５ｃはコンデンサ４の第２の電極端子と配線を介して個別に電気的に接続されている。なお、変形例として、コンデンサ４の第１の電極端子についても、コンデンサ４と同数の接触点５ａを設け、その接触点５ａを個別に電気的に接続するようにしてもよい。ここで、接触点５ａ〜５ｂは、単位基板３に設けられた配線パターンのランド部又はそのランド部に付与されたハンダボール等により構成される。また、本実施形態では、簡単化のため各単位基板３に設けられた構成のうち、２つのコンデンサ４及びそれに関連する配線等についてのみ説明するが、実際には各単位基板３には他の電子部品及びそれに関連する配線等も設けられている。   Further, on the surface of each unit substrate 3, a plurality of contact points 5a to 5c connected to the two electrode terminals of each capacitor 4 through wiring (reference numeral “5” is used to collectively refer to them) are provided. It has been. The contact point 5a is electrically connected to the first electrode terminals of the two capacitors 4 via wiring, and the contact points 5b and 5c are electrically connected individually to the second electrode terminal of the capacitor 4 via wiring. Connected. As a modification, the first electrode terminal of the capacitor 4 may be provided with the same number of contact points 5a as the capacitor 4, and the contact points 5a may be electrically connected individually. Here, the contact points 5 a to 5 b are configured by a land portion of a wiring pattern provided on the unit substrate 3 or a solder ball or the like applied to the land portion. Further, in the present embodiment, only two capacitors 4 and wirings related thereto among the configurations provided on each unit substrate 3 will be described for the sake of simplicity. Electronic components and associated wiring are also provided.

基板検査治具１１は、図１及び図２に示すように、複数のプローブＰ１〜Ｐｎ（これらを総称する場合は符号「Ｐ」を用いる）と、先端側及び後端側プローブ保持部材１１１，１１２と、複数の電極部１１３と、電極保持部材１１４と、複数の導線部１１５とを備えている。なお、簡単化のため、本実施形態では連続基板２の上側面に接触される上側の検査治具１１しか記載していないが、通常の場合は連続基板２の下側面に接触される下側の検査治具も設けられる。   As shown in FIG. 1 and FIG. 2, the substrate inspection jig 11 includes a plurality of probes P1 to Pn (in the case of generic name, “P” is used), a front end side and rear end side probe holding member 111, 112, a plurality of electrode portions 113, an electrode holding member 114, and a plurality of conductive wire portions 115. For simplification, only the upper inspection jig 11 that is in contact with the upper side surface of the continuous substrate 2 is described in the present embodiment, but the lower side that is in contact with the lower side surface of the continuous substrate 2 in a normal case. An inspection jig is also provided.

複数のプローブＰ１〜Ｐｎは、その先端部が、連続基板２の２つ以上（本実施形態では、連続基板２の全て）の単位基板３の接触点にそれぞれ接触可能に配置されている。先端側及び後端側プローブ保持部材１１１，１１２には、プローブＰの先端側の部分及び後端側の部分がそれぞれ挿通されて保持される保持孔１１１ａ，１１２ａが設けられている。先端側及び後端側プローブ保持部材１１１，１１２は、プローブＰの先端部が連続基板２の接触点５ａ〜５ｃに当接された際に、プローブＰが負荷により湾曲（バックリング）するのを許容するように、互いに間隔をあけた状態で連結部材１１６により連結固定されている。   The tips of the plurality of probes P1 to Pn are arranged so as to be in contact with contact points of two or more unit substrates 3 of the continuous substrate 2 (in this embodiment, all of the continuous substrates 2). The front end side and rear end side probe holding members 111 and 112 are provided with holding holes 111a and 112a through which the front end side portion and the rear end side portion of the probe P are inserted and held, respectively. The front end side and rear end side probe holding members 111 and 112 prevent the probe P from being bent (buckling) by a load when the front end portion of the probe P is brought into contact with the contact points 5 a to 5 c of the continuous substrate 2. In order to allow, the connecting members 116 are connected and fixed in a state of being spaced apart from each other.

電極部１１３は、先端側及び後端側プローブ保持部材１１１，１１２によって保持された各プローブＰにそれぞれ対応する位置に配置され、対応する各プローブＰの後端部が接触されて電気的に接続される。電極保持部材１１４には、上下に貫通する複数の保持孔１１４ａが設けられており、その保持孔１１４ａによって電極部１１３が保持される。導線部１１５は、各電極部１１３とそれぞれ接続され、あるいは各電極部１１３とそれぞれ連続的に連なってなり、各電極部１１３を接続切替ユニット１２の接続切替部１４に接続する。なお、本実施形態では、電極部１１３は、ワイヤ状の導線部１１５の導体部分の先端によって構成されている。   The electrode portion 113 is disposed at a position corresponding to each probe P held by the front end side and rear end side probe holding members 111 and 112, and the rear end portions of the corresponding probes P are contacted to be electrically connected. Is done. The electrode holding member 114 is provided with a plurality of holding holes 114a penetrating vertically, and the electrode portion 113 is held by the holding holes 114a. The conducting wire portion 115 is connected to each electrode portion 113 or continuously connected to each electrode portion 113, and connects each electrode portion 113 to the connection switching portion 14 of the connection switching unit 12. In the present embodiment, the electrode portion 113 is constituted by the tip of the conductor portion of the wire-like conducting wire portion 115.

接続切替ユニット１２の接続切替部１４は、複数のスイッチ群ＳＷＧ１〜ＳＷＧｎを備えて構成される。各スイッチグ素子ＳＷＧ１〜ＳＷＧｎには、制御部１６の制御によりオン、オフ動作される第１及び第２の２つのスイッチング素子（例えば、半導体スイッチング素子）ＳＷ１，ＳＷ２が設けられている。スイッチ群ＳＷＧ１〜ＳＷＧｎは、例えばプローブＰごとに１組ごと設けられている。そして、接続切替部１４の各スイッチ群ＳＷＧ１〜ＳＷＧｎの各スイッチング素子ＳＷ１，ＳＷ２がオン、オフに切り替えられることにより、各プローブ１と、後述する電源部１５、電流検出部ＡＭ及び電圧検出部ＶＭとの間の電気的な接続関係が切り替えられる。第１のスイッチング素子ＳＷ１がオンされた場合は、対応するプローブＰがスイッチング素子ＳＷ１を介して電源部１５の第１出力端子１５ａに接続される。第２のスイッチング素子ＳＷ２がオンされた場合は、対応するプローブＰがスイッチング素子ＳＷ２を介して電源部１５の第２出力端子１５ｂに接続される。   The connection switching unit 14 of the connection switching unit 12 includes a plurality of switch groups SWG1 to SWGn. Each of the switching elements SWG1 to SWGn is provided with first and second switching elements (for example, semiconductor switching elements) SW1 and SW2 that are turned on and off under the control of the control unit 16. One set of switch groups SWG1 to SWGn is provided for each probe P, for example. Then, the switching elements SW1 and SW2 of the switch groups SWG1 to SWGn of the connection switching unit 14 are switched on and off, whereby each probe 1, the power supply unit 15, the current detection unit AM, and the voltage detection unit VM, which will be described later. The electrical connection relationship between and is switched. When the first switching element SW1 is turned on, the corresponding probe P is connected to the first output terminal 15a of the power supply unit 15 via the switching element SW1. When the second switching element SW2 is turned on, the corresponding probe P is connected to the second output terminal 15b of the power supply unit 15 via the switching element SW2.

電源部１５は、制御部１６の制御により、対を為す第１及び第２出力端子１５ａ，１５ｂを介して、コンデンサ４の絶縁検査用の電力（例えば、直流電流）を出力する。また、第１及び第２出力端子１５ａ，１５ｂの極性については、第１出力端子１５ａがプラス側に設定され、第２出力端子１５ｂがマイナス側に設定されている。   The power supply unit 15 outputs electric power (for example, direct current) for insulation inspection of the capacitor 4 through the first and second output terminals 15a and 15b that make a pair under the control of the control unit 16. Regarding the polarities of the first and second output terminals 15a and 15b, the first output terminal 15a is set to the plus side, and the second output terminal 15b is set to the minus side.

電流検出部ＡＭ１〜ＡＭｎは、複数（連続基板２内に設けられる同時に検査を行うべきコンデンサ４の数と同数）設けられ、接続切替ユニット１２内における複数のスイッチ群ＳＷＧ１〜ＳＷＧｎが設けられる図示しない基板部材に配設されている。回路的には、電流検出部ＡＭは、各スイッチ群ＳＷＧ１〜ＳＷＧｎの第２のスイッチング素子ＳＷ２と電源部１５の第２出力端子１５ｂとを接続する配線に介挿されている。そして、各プローブＰ及び接触点５を介して、電源部１５から連続基板２内の複数の各コンデンサ４に供給される電流を検出し、その検出結果を制御部１６に与える。   A plurality of current detection units AM1 to AMn are provided (the same number as the number of capacitors 4 to be inspected simultaneously provided in the continuous substrate 2), and a plurality of switch groups SWG1 to SWGn in the connection switching unit 12 are not shown. Arranged on the substrate member. In terms of circuit, the current detection unit AM is inserted in a wiring that connects the second switching element SW2 of each of the switch groups SWG1 to SWGn and the second output terminal 15b of the power supply unit 15. Then, the current supplied from the power supply unit 15 to each of the plurality of capacitors 4 in the continuous substrate 2 is detected via each probe P and the contact point 5, and the detection result is given to the control unit 16.

電圧検出部ＶＭは、プローブＰ及び連続基板２の接触点５を介して、連続基板２内の各コンデンサ４に与えられた電圧を検出し、その検出結果を制御部１６に与える。なお、この電圧検出部ＶＭについては省略可能である。   The voltage detection unit VM detects the voltage applied to each capacitor 4 in the continuous substrate 2 via the probe P and the contact point 5 of the continuous substrate 2 and supplies the detection result to the control unit 16. The voltage detection unit VM can be omitted.

制御部１６は、この基板検査装置１の制御を行うとともに、連続基板２内の複数の単位基板３に設けられたコンデンサ４の絶縁特性に関する検査を行う。以下、制御部１６による検査について説明する。   The control unit 16 controls the board inspection apparatus 1 and performs inspection on the insulating characteristics of the capacitors 4 provided on the plurality of unit boards 3 in the continuous board 2. Hereinafter, the inspection by the control unit 16 will be described.

検査では、基板検査治具１１の各プローブＰの先端部が連続基板２の各単位基板３の対応する接触点５に接触されるとともに、接続切替部１４の各スイッチ群ＳＷＧ１〜ＳＷＧｎのうち、各単位基板３の接触点５ａに接触されたプローブＰに対応するスイッチ群ＳＷＧ１〜ＳＷＧｎの第１のスイッチング素子ＳＷ１がオンされ、第２のスイッチング素子ＳＷ２がオフされる。また、各単位基板３の接触点５ｂ，５ｃに接触されたプローブＰに対応するスイッチ群ＳＷＧ１〜ＳＷＧｎの第２のスイッチング素子ＳＷ２がオンされ、第１のスイッチング素子ＳＷ１がオフされる。これにより、図５に示すように、電源部１５が出力する電流が、連続基板２内の各単位基板３のコンデンサ４ａ，４ｂに接触点５ａ〜５ｃを介して同時に供給可能となっているとともに、各コンデンサ４ａ，４ｂに供給される電流が電流検出部ＡＭにより個別に検出可能となっている。   In the inspection, the tip of each probe P of the substrate inspection jig 11 is brought into contact with the corresponding contact point 5 of each unit substrate 3 of the continuous substrate 2, and among the switch groups SWG1 to SWGn of the connection switching unit 14, The first switching element SW1 of the switch group SWG1 to SWGn corresponding to the probe P that is in contact with the contact point 5a of each unit substrate 3 is turned on, and the second switching element SW2 is turned off. Further, the second switching elements SW2 of the switch groups SWG1 to SWGn corresponding to the probes P that are in contact with the contact points 5b and 5c of each unit substrate 3 are turned on, and the first switching elements SW1 are turned off. As a result, as shown in FIG. 5, the current output from the power supply unit 15 can be simultaneously supplied to the capacitors 4a and 4b of the unit substrates 3 in the continuous substrate 2 via the contact points 5a to 5c. The currents supplied to the capacitors 4a and 4b can be individually detected by the current detector AM.

そして、各コンデンサ４の絶縁検査は、例えば、電源部１５による各コンデンサ４への電流供給の開始時から所定時間が経過した時点で、各コンデンサ４へ供給されている電流の状態(例えば、電流値）が各電流検出部ＡＭを介して検出され、その検出結果に基づいて各コンデンサ４の絶縁特性に関する良否判定が行われる。コンデンサ４の絶縁特性の良否判定のより具体的な内容について、図６を参照して以下に記載する。   The insulation test of each capacitor 4 is performed, for example, when the predetermined time has elapsed from the start of the current supply to each capacitor 4 by the power supply unit 15 (for example, the current state supplied to each capacitor 4 (for example, current Value) is detected via each current detection unit AM, and quality determination regarding the insulation characteristics of each capacitor 4 is performed based on the detection result. More specific contents of the quality determination of the insulation characteristics of the capacitor 4 will be described below with reference to FIG.

コンデンサ４の絶縁特性に問題がない場合は、図６のグラフＧ１で示すように、時刻Ｔ１で電源部１５による電流供給が開始されると、その直後にコンデンサ４への供給電流値が定格値まで上昇し、コンデンサ４の電極間への充電が行われる。そして、時刻Ｔ２でコンデンサ４の充電がほぼ完了すると、それに伴ってコンデンサ４へ供給される電流の値が急速にゼロに向けて低下していく。これに対し、コンデンサ４にその電極間がショートしている等の絶縁性に問題がある場合は、図６のグラフＧ２で示すように、ショートによりコンデンサ４への充電が進まないため、時刻Ｔ２を経過してもコンデンサ４へ供給される電流の値が低下せずほぼ一定値に維持される。   When there is no problem in the insulation characteristics of the capacitor 4, as shown by the graph G1 in FIG. 6, when the current supply by the power supply unit 15 is started at the time T1, the supply current value to the capacitor 4 immediately follows the rated value. And charging between the electrodes of the capacitor 4 is performed. Then, when the charging of the capacitor 4 is almost completed at time T2, the value of the current supplied to the capacitor 4 rapidly decreases toward zero accordingly. On the other hand, when there is a problem in insulation such as a short circuit between the electrodes of the capacitor 4, charging to the capacitor 4 does not proceed due to the short as shown by a graph G2 in FIG. Even after elapses, the value of the current supplied to the capacitor 4 does not decrease and is maintained at a substantially constant value.

このため、各コンデンサ４への電流供給開始時から所定時間が経過した時刻Ｔ３（時刻Ｔ２を過ぎたタイミング）で、各コンデンサ４へ供給されている電流の値を各電流検出部ＡＭを介して検出し、その検出電流値が例えば所定の判定基準値Ｉａ以下であるか否かを判定することにより、各コンデンサ４の絶縁特性の良否判定を行うことができる。この場合、時刻Ｔ３での検出電流値が判定基準値Ｉａ以下であればコンデンサ４が正常と判定され、検出電流値が判定基準値Ｉａを上回っていればコンデンサ４が異常と判定される。   For this reason, the value of the current supplied to each capacitor 4 is passed through each current detection unit AM at a time T3 (a timing after time T2) when a predetermined time has elapsed from the start of current supply to each capacitor 4. By detecting and determining whether or not the detected current value is equal to or less than a predetermined determination reference value Ia, it is possible to determine whether the insulation characteristics of each capacitor 4 are good or bad. In this case, if the detected current value at time T3 is equal to or less than the determination reference value Ia, the capacitor 4 is determined to be normal, and if the detected current value exceeds the determination reference value Ia, the capacitor 4 is determined to be abnormal.

以上のように、本実施形態に係る基板検査装置１によれば、基板検査治具１１の複数のプローブＰの先端部を、連続基板２内の２つ以上の単位基板３について、その単位基板３に設けられたコンデンサ４の電極端子と電気的に接続された接触子５にそれぞれ接触させることができる。これとともに、複数の電流検出部ＡＭにより、連続基板２の２つ以上の単位基板３のコンデンサ４に流れる電流をそれぞれ個別に検出することができる。それ故、連続基板２内に設けられた複数の端子基板３について、その単位基板３に設けられたコンデンサ４の絶縁特性に関する検査を同時に行うことができ、コンデンサ４の絶縁特性の検査に要する時間を大幅に短縮できる。   As described above, according to the substrate inspection apparatus 1 according to the present embodiment, the tip portions of the plurality of probes P of the substrate inspection jig 11 are connected to two or more unit substrates 3 in the continuous substrate 2. 3 can be brought into contact with the contacts 5 that are electrically connected to the electrode terminals of the capacitor 4 provided in 3. At the same time, the currents flowing through the capacitors 4 of the two or more unit substrates 3 of the continuous substrate 2 can be individually detected by the plurality of current detection units AM. Therefore, for the plurality of terminal boards 3 provided in the continuous board 2, it is possible to simultaneously inspect the insulation characteristics of the capacitors 4 provided on the unit board 3, and the time required for the inspection of the insulation characteristics of the capacitors 4. Can be greatly shortened.

また、複数の電流検出部ＡＭが、接続切替部１４の複数のスイッチング素子ＳＷ１，ＳＷ２が設けられる基板部材に設けられている。それ故、電流検出部ＡＭとプローブＰとの間の配線経路を短縮でき、ノイズ（例えば、配線経路の抵抗値による影響等）を抑制して正確にコンデンサ４に供給される電流を検出できる。   In addition, a plurality of current detection units AM are provided on the substrate member on which the plurality of switching elements SW1 and SW2 of the connection switching unit 14 are provided. Therefore, the wiring path between the current detector AM and the probe P can be shortened, and the current supplied to the capacitor 4 can be accurately detected while suppressing noise (for example, the influence of the resistance value of the wiring path).

また、電流検出部ＡＭの設置数等は、基板検査治具１１のプローブＰ及び接続切替部１４のスイッチング素子ＳＷ１，ＳＷ２の設置状況（設置数等）との関係が強いため、電流検出部ＡＭを接続切替部１４の基板部材に設けることにより、検査処理ユニット１３の構成を維持しながら、検査対象の基板の仕様変更等に容易に対応できる。   Further, since the number of installed current detection units AM is strongly related to the installation status (number of installations, etc.) of the probe P of the board inspection jig 11 and the switching elements SW1, SW2 of the connection switching unit 14, the current detection unit AM. Is provided on the board member of the connection switching unit 14, and it is possible to easily cope with a change in the specification of the board to be inspected while maintaining the configuration of the inspection processing unit 13.

１ 基板検査装置、２ 連続基板、３ 単位基板、４，４ａ，４ｂ コンデンサ、５，５ａ〜５ｃ 接触点、１１ 基板検査治具、１１１ 先端側プローブ保持部材、１１２ 後端側プローブ保持部材、１１３ 電極部、１１４ 電極保持部材、１１５ 配線部、１２ 接続切替ユニット、１３ 検査処理ユニット、１４ 接続切替部、１５ 電源部、１６ 制御部、ＡＭ，ＡＭ１〜ＡＭｎ 電流検出部、Ｐ，Ｐ１〜Ｐｎ プローブ、ＳＷ１ 第１のスイッチング素子、ＳＷ２ 第２のスイッチング素子、ＳＷＧ１〜ＳＷＧｎ スイッチ群、ＶＭ 電圧検出部。   DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus, 2 continuous board | substrate, 3 unit board | substrate, 4,4a, 4b capacitor | condenser, 5,5a-5c contact point, 11 board | substrate inspection jig, 111 front end side probe holding member, 112 rear end side probe holding member, 113 Electrode unit, 114 electrode holding member, 115 wiring unit, 12 connection switching unit, 13 inspection processing unit, 14 connection switching unit, 15 power supply unit, 16 control unit, AM, AM1-AMn current detection unit, P, P1-Pn probe , SW1 first switching element, SW2 second switching element, SWG1 to SWGn switch group, VM voltage detection unit.

Claims (3)

複数の単位基板が連なってなり、前記各単位基板に、少なくとも１つのコンデンサが設けられるとともに、前記各単位基板の表面に前記各コンデンサの２つの電極端子と配線を介して接続された複数の接触点が設けられた連続基板について、その連続基板内の前記各単位基板に設けられた前記コンデンサの絶縁特性を検査する基板検査装置に備えられる基板検査治具であって、
その先端部が、前記連続基板の２つ以上の前記単位基板の前記接触点にそれぞれ接触可能に配置された複数のプローブと、
前記複数のプローブを保持するプローブ保持部材と、
前記プローブ保持部材によって保持された前記各プローブの後端部がそれぞれ電気的に接触される複数の電極部と、
前記複数の電極部を保持する電極保持部材と、
前記各電極部を、前記各プローブと前記基板検査装置の装置本体側との間の電気的な接続関係を切り替える接続切替部に接続する複数の導線部と、
を備えることを特徴とする基板検査治具。 A plurality of unit substrates are connected, and each unit substrate is provided with at least one capacitor, and a plurality of contacts connected to the surface of each unit substrate via two electrode terminals of each capacitor via wiring A board inspection jig provided in a board inspection apparatus for inspecting the insulation characteristics of the capacitor provided on each unit board in the continuous board for the continuous board provided with points,
A plurality of probes whose tip portions are arranged so as to be in contact with the contact points of the two or more unit substrates of the continuous substrate,
A probe holding member for holding the plurality of probes;
A plurality of electrode portions each of which is electrically contacted with a rear end portion of each probe held by the probe holding member;
An electrode holding member for holding the plurality of electrode portions;
A plurality of conductive wire portions for connecting each electrode portion to a connection switching portion for switching an electrical connection relationship between each probe and the apparatus main body side of the substrate inspection device;
A board inspection jig comprising: 請求項１に記載された基板検査治具と、
前記基板検査治具の前記プローブ及び前記連続基板の前記接触点を介して、前記連続基板の前記２つ以上の単位基板の前記コンデンサに絶縁特性の検査のための電力を供給する電源部と、
前記基板検査治具の前記プローブ及び前記連続基板の前記接触点を介して、前記連続基板の前記２つ以上の単位基板の前記コンデンサに流れる電流をそれぞれ検出する複数の電流検出部と、
前記基板検査治具の前記プローブと、前記電源部及び前記電流検出部との間の電気的な接続関係を切り替える接続切替部と、
前記電流検出部の検出結果に基づいて、前記連続基板の前記２つ以上の単位基板の前記コンデンサの絶縁特性を検査する判定処理部と、
を備えることを特徴とする基板検査装置。 A substrate inspection jig according to claim 1;
A power supply unit that supplies power for inspecting insulation characteristics to the capacitors of the two or more unit substrates of the continuous substrate through the probe of the substrate inspection jig and the contact points of the continuous substrate;
A plurality of current detectors for respectively detecting currents flowing through the capacitors of the two or more unit substrates of the continuous substrate via the probe of the substrate inspection jig and the contact points of the continuous substrate;
A connection switching unit that switches an electrical connection relationship between the probe of the substrate inspection jig and the power source unit and the current detection unit;
A determination processing unit that inspects insulation characteristics of the capacitors of the two or more unit substrates of the continuous substrate based on a detection result of the current detection unit;
A board inspection apparatus comprising: 請求項２に記載の基板検査装置において、
前記接続切替部は、前記基板検査治具の前記プローブと前記電源部及び前記電流検出部との間の電気的な接続関係を切り替える複数のスイッチング素子と、その複数のスイッチング素子が設けられた基板部材とを備え、
前記複数の電流検出部は、前記接続切替部の前記基板部材に設けられることを特徴とする基板検査装置。 The substrate inspection apparatus according to claim 2,
The connection switching unit includes a plurality of switching elements that switch an electrical connection relationship between the probe of the substrate inspection jig, the power supply unit, and the current detection unit, and a substrate on which the plurality of switching elements are provided. With members,
The substrate inspection apparatus, wherein the plurality of current detection units are provided on the substrate member of the connection switching unit.
JP2012132560A 2012-06-12 2012-06-12 Substrate checkup jig and substrate checkup apparatus Pending JP2013257195A (en)

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