JP2013201511A - Vehicle antenna integrated wireless communication module, vehicle wireless communication device, and manufacturing method for vehicle wireless communication device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vehicle antenna integrated wireless communication module in which degradation of antenna performance is minimized while minimizing the planar mounting area and mounting height for a substrate, and ensuring the shield effect, and to provide a manufacturing method therefor.SOLUTION: A substrate 8 with a built-in component incorporates a wireless communication element 9. The wireless communication element 9 can achieve shield effect because the upper and lower surfaces of that are covered with conductive surfaces 8a, 8b, respectively. A sheet-metal antenna 10 is mounted on one surface of the substrate 8 with a built-in component. Since the wireless communication element 9 is mounted in the substrate 8 with a built-in component, and the sheet-metal antenna 10 is mounted on one surface of the substrate 8 with a built-in component, planar mounting area can be minimized.

Description

  The present invention relates to a vehicular antenna-integrated radio communication module, a vehicular radio communication device, and a method for manufacturing a vehicular radio communication device.

  Since this type of vehicle antenna-integrated module is manufactured for mounting on-vehicle devices with many restrictions on the mounting position and radio wave environment, it is desired to reduce the outer shape. For example, when this type of module is incorporated as a Bluetooth (registered trademark) module of a vehicle navigation device, it is possible to reliably communicate with a Bluetooth-compatible device that the user has brought into the vehicle or the like. desired.

  Therefore, when the vehicle antenna integrated module is mounted on, for example, a navigation device, it is preferable that the vehicle antenna integrated module be disposed at a position (for example, the front surface of the instrument panel) where radio signals can be efficiently transmitted and received. For example, when mounting in a narrow space between a liquid crystal display device (LCD) and an outer frame case, it is necessary to reduce the mounting space of the integrated antenna module as thin as possible, considering the clearance during assembly. is there.

JP 2002-353841 A JP 2005-184615 A

  According to the configuration of Patent Document 1, since the wireless communication module unit and the antenna unit are provided on one side of the substrate, the arrangement height can be reduced, but a flat mounting space is required. Further, a chip antenna is mounted to reduce the mounting area (and cost), but the chip antenna is inferior to the patch antenna in terms of antenna performance. Therefore, the antenna performance is inferior in communication processing between the vehicle-mounted device and the terminal in the vehicle interior.

  In addition, since the double-sided substrate is used in the configuration described in Patent Document 2, a planar space can be reduced as compared with the above technical idea. Further, since the antenna uses a patch antenna, the antenna performance can be improved. However, since it is necessary to mount a patch antenna and a shield case on each of both surfaces of the substrate, the mounting height of the components becomes high.

  An object of the present invention is to provide a vehicular antenna-integrated wireless communication module that prevents the antenna performance from degrading as much as possible while obtaining a shielding effect while suppressing the planar mounting area and mounting height of the substrate as much as possible. An object of the present invention is to provide a vehicular radio communication device equipped with an integrated radio communication module and a method of manufacturing the vehicular radio communication device.

  According to the first aspect of the present invention, the wireless communication element is mounted on the kth (1 <k <n) layer of the component-embedded substrate composed of a multilayer substrate having n (n is an integer of 3 or more) layers. It can be configured without mounting a wireless communication element on the surface of the substrate. In addition, the first and second conductive plate surfaces are formed on the k−a layer and the k + b layer of the component built-in substrate, respectively, and the wireless communication elements are mounted above and below the conductive plate surface. Therefore, a shielding effect can be obtained.

  Since it is not necessary to mount a shield case on the surface of the substrate, the height can be suppressed as much as possible. In addition, since the antenna electrically connected to the wireless communication element is mounted on one side of the component-embedded substrate, it is possible to improve the transmission / reception efficiency of the wireless communication signal and not to deteriorate the antenna performance as much as possible. Can be configured. Since the wireless communication element is mounted in the component built-in substrate and the antenna is mounted on one side of the component built-in substrate, the planar mounting area can be suppressed as much as possible.

The figure which shows the installation state of the radio | wireless communication apparatus for vehicles about 1st Embodiment of this invention. The perspective view showing the external shape of the radio | wireless communication apparatus for vehicles An exploded perspective view showing the structure of the front side of the housing Rear view showing the structure of the front side of the housing Electrical configuration diagram of antenna-integrated wireless communication module External perspective view of wireless communication module with integrated antenna (A) Vertical side view schematically showing the structure in the component built-in substrate, (B) Vertical side view specifically showing the structure in the component built-in substrate, (C) Vertical side view showing the respective layers in an exploded manner Plan view showing the pattern of each layer and component layout of the component built-in board Cross-sectional view showing the arrangement state of components in the vehicle wireless communication device Rear view showing the mounting state of the antenna integrated wireless communication module Development view of sheet metal antenna The perspective view showing the attachment method of an antenna integrated radio | wireless communication module (A) FIG. 6 equivalent figure, (B) FIG. 11 equivalent figure shown about 2nd Embodiment of this invention. Fig. 10 equivalent 3 equivalent figure FIG. 6 equivalent view showing a third embodiment of the present invention. Fig. 7 (A) equivalent Fig. 9 equivalent

  Hereinafter, several embodiments in which the vehicle antenna integrated wireless communication module is mounted on the vehicle navigation device (wireless communication device) will be described. In the following description, an embodiment in which a module compliant with the Bluetooth (registered trademark) standard is mounted on the vehicle navigation apparatus 1 will be described. Various wireless communication technologies such as WiFi (registered trademark) are applied as the wireless communication technology. May be. The application can be applied to various applications for vehicles such as hands-free devices and Bluetooth audio.

(First embodiment)
FIG. 1 shows an installation state of the vehicle navigation device 1 according to the present embodiment. This navigation apparatus 1 is assembled to, for example, a 2DIN slot of an instrument panel 2 of a vehicle. As shown in FIG. 2, the navigation device 1 includes a rectangular box-shaped housing 3. The height and width dimensions of the housing 3 are predetermined standard dimensions. The housing 3 includes a front housing portion 3a and a rear housing portion 3b attached to the rear surface side of the front housing portion 3a.

  FIG. 3 is an exploded perspective view showing the structure on the front side of the housing. The navigation device 1 is a metal member attached to the front housing part 3a made of a resin molded into a rectangular frame shape, a liquid crystal display device (LCD: equivalent to a display device) 4, and a liquid crystal display device 4 from the front side of the housing 3. And the printed wiring board 6 for mounting various control circuits are assembled in this order. A display control circuit C (see FIGS. 4, 9, 10, etc.) for controlling the liquid crystal display device 4 is mounted on the printed wiring board 6. Further, the liquid crystal display device 4 is fixed to the frame 5, and the liquid crystal display device 4 is disposed between the front housing part 3 a and the frame 5.

  As shown in the rear view of the schematic structure of the front side of the housing in FIG. 4, the outer dimensions of the rectangular frame of the front housing portion 3a are larger than the outer shape of the frame 5 for mounting the liquid crystal display device 4. It is fixed to the center side of 3a. Thereby, the liquid crystal display device 4 projects the display screen forward through the rectangular frame opening window 3w (window: see FIG. 3) of the front casing 3a.

  As shown in FIG. 4, the vehicle antenna-integrated wireless communication module (hereinafter referred to as a module) 7 is installed outside the frame 5 and in a narrow space within the rectangular frame of the front casing 3 a. A fitted portion 3c is integrally formed at the left front corner of the front casing portion 3a. The fitted portion 3c is provided with a slit in the vertical direction so that the module 7 is fitted on the rear surface side of the front housing portion 3a, for example. The fitted portion 3c is preliminarily formed with a fitted width in the vertical direction and the horizontal direction that is greater than or equal to the width and height of the module 7, respectively. Arranged along the direction.

  FIG. 5 schematically shows a longitudinal sectional structure of the module 7, and FIG. 6 shows a perspective view. As shown in FIG. 5, the module 7 includes a component built-in substrate 8 and incorporates a wireless communication element 9 for wireless communication with other wireless terminals located outside and inside the vehicle interior in the component built-in substrate 8. A sheet metal antenna 10 electrically connected to the wireless communication element 9 at a feeding point is provided. The installation method of the module 7 will be described later.

  The wireless communication element 9 is an element for short-range wireless data communication conforming to, for example, the Bluetooth standard, and performs data communication in a short-distance area of about 10 m or 100 m in the 2.4 GHz band (ISM band) through the sheet metal antenna 10. Element.

  The wireless communication element 9 includes a reception unit such as a low noise amplifier (LNA) and a transmission unit such as a transmission amplifier, a front end unit, a local reference signal generator, a correlator, a band pass filter, a back end unit (communication processing) Part) etc. The back-end unit transmits and receives a baseband signal in a predetermined frequency (for example, 25 MHz) band lower than the radio communication frequency band to and from the printed wiring board 6. When the wireless communication element 9 is made into an IC, the operation parts of the front end part and the back end part (IF (intermediate frequency) band) may be made into one chip or may be made into two chips.

  The component-embedded substrate 8 incorporates the wireless communication element 9 as a bare chip. A sheet metal antenna 10 is mounted on the surface of the component built-in substrate 8. As shown in FIG. 6, the sheet metal antenna 10 is provided with solder 10a on the component-embedded substrate 8 at a plurality of points. It is connected to the. In addition, since a space is provided between the surface of the component built-in substrate 8 and the element of the sheet metal antenna 10, the chip component 11 is mounted on the surface of the component built-in substrate 8 in order to effectively use the space region.

  In this spatial region, a circuit (baseband circuit, power supply circuit, etc.) that operates in a frequency band lower than the frequency band of the wireless communication signal is preferably arranged. As shown in a perspective view of the antenna-integrated wireless communication module in FIG. 6, the sheet metal antenna 10 adopts a well-known antenna pattern structure and is made of a metal such as nickel.

  FIG. 7A schematically shows the structure inside the component-embedded substrate. 7B shows a configuration example of elements, wirings, and vias in the component built-in substrate, and FIG. 7C shows an example of a method for manufacturing the component built-in substrate in FIG. 7B.

  As shown in FIG. 7A or 7B, the wireless communication element 9 is electrically connected to the sheet metal antenna 10 through a surface mounting line, a via 8c, or the like provided in the component built-in substrate 8. . Thus, the wireless communication element 9 can transmit a radio signal to the outside through the sheet metal antenna 10 using a predetermined frequency band (2.4 GHz band) and can receive a radio signal through the sheet metal antenna 10.

  Generally, when the wireless communication element 9 is mounted on a module, a wireless communication IC chip or the like is mounted on the surface of the surface mounting substrate. Since the IC chip for wireless communication causes an oscillation phenomenon corresponding to the feedback signal through the antenna, it is necessary to cover the wireless communication element 9 with a shield case (not shown) in order to prevent the oscillation. .

  In the present embodiment, as an alternative to this shield case, the wireless communication element 9 is housed in the layer of the component built-in substrate 8, and the upper and lower surfaces of the wireless communication element 9 are covered with a conductive plate surface. The aspect which surrounds the side surface with the via 8c is adopted.

  As schematically shown in FIG. 7 (A), the component built-in substrate 8 includes n layers (n is 3 or more) that can form various lines. The component-embedded substrate 8 uses a multilayer substrate called a so-called PALAP (Patterned prepreg Lay up Process) substrate.

This PALAP is a method of press-molding a patterned sheet substrate at a time, and is a multilayer substrate manufacturing technique using a three-dimensional collective connection technique using a thermoplastic resin and a fired metal paste. The component-embedded substrate 8 is not limited to the PALAP substrate, and a multilayer substrate (for example, B ² it (registered trademark) substrate manufactured by Dai Nippon Printing Co., Ltd.) that can incorporate a WLCSP (Wafer Level Chip Size Package) may be used.

  The first layer is the back surface and the nth layer is the front surface. For convenience of explanation, reference numeral “A1” is assigned to the first layer, “Ak” is assigned to the kth layer, “Ak-1” is assigned to the k−1th layer, “Ak + 1” is assigned to the k + 1th layer, and “Ak + 1” is assigned to the nth layer. A description will be given with reference to “An”.

  A wiring pattern P is formed on the nth layer An, and the chip component 11 is mounted on the wiring pattern P. A wiring pattern P is processed in the kth (1 <k <n) layer of the component-embedded substrate 8. In this embodiment, the resin formation layer on the wiring pattern P and the area of the k + 1th layer or more (FIG. 7A The wireless communication element 9 is mounted using the (k + 1) th layer region in the example shown in FIG.

  In the ka layer (1 ≦ a ≦ k−1: the k−1 layer Ak-1 region in the example shown in FIG. 7A) of the component built-in substrate 8, along the lower surface of the wireless communication element 9. Thus, the conductive plate surface 8a is formed as a ground surface. In addition, in the k + b layer (1 ≦ b ≦ n−k: the k + 2 layer Ak + 2 region in the example shown in FIG. 7B) layer of the component built-in substrate 8 above the mounting region of the wireless communication element 9, A conductive plate surface 8 b is formed as a ground surface along the upper surface of the wireless communication element 9. Therefore, the conductive plate surfaces 8a and 8b cover the lower surface and the upper surface of the wireless communication element 9, respectively. A connector 13 for connecting the cable 12 is mounted on the surface of the component built-in substrate 8.

  The component-embedded substrate 8 is formed with a via 8c that penetrates at least the k−a layer to the k + b layer. As shown in each layer pattern of the component built-in substrate 8 in FIG. 8, the via 8 c is disposed so as to surround the mounting surface of the wireless communication element 9 in a plane.

  In principle, it is desirable to cover all sides of the wireless communication element 9 with a metal surface because the shielding effect can be improved. In this embodiment, a plurality of vias 8c are used for wireless communication as shown in FIG. By providing so as to surround the side of the element 9, an effect substantially equivalent to the shielding effect is obtained. Here, the plurality of vias 8c are preferably provided with an interval W of about 1/4 or less of the frequency band (2.4 GHz band) of the Bluetooth wireless communication signal. Then, the plurality of vias 8c can be regarded as substantial ground planes.

  If a shield case is placed on a surface-mounted component mounted on a board like a conventional product, it is necessary to provide a gap between the mounted component and the shield case. In particular, it was difficult to suppress the thickness.

  According to the inventors, when the Bluetooth wireless communication module 7 is configured as shown in FIG. 7A of the present embodiment, the horizontal 20 mm is included even if the mounting height of the sheet metal antenna 10 is included in the component-embedded substrate 8. It has been confirmed that it can be accommodated in a size of not more than 12 mm in length and 2.6 mm in thickness (2.0 mm in height of the sheet metal antenna 10 +0.6 mm in thickness of the component-embedded substrate 8). The size in the board thickness direction shown in FIG. 7A indicates the internal structure of the component-embedded substrate 8, and thus the thickness of the component-embedded substrate 8 is increased. The ratio is not accurate. As a result, the thickness can be reduced by about 2 mm compared to the conventional product without increasing the mounting area in the plane direction.

  When the height of the sheet metal antenna 10 is 3 mm, it has been confirmed that a gain number dBi (approximately −5 dBi) can be secured. This is an antenna gain that can sufficiently realize general wireless communication using the 2.4 GHz band (Bluetooth and WiFi (both are registered trademarks) communication).

  When the height of the sheet metal antenna 10 is reduced and the thickness thereof is reduced, there is a possibility that the antenna gain cannot be obtained according to the degree of thinness. The reason why the height of the sheet metal antenna 10 is set to 2.0 mm in the present embodiment is that the wireless communication element 9 reduces the frequency of the wireless communication signal to be a baseband signal, and the back end portion is printed by the baseband signal. This is because the module 7 can sufficiently communicate with the control circuit C even if the antenna gain cannot be increased more than necessary.

  FIG. 7B shows a specific structural example in the component-embedded substrate. The structure of FIG. 7B shows the structure of a multilayer substrate in which the structure shown in FIG. As shown in FIG. 7C, the inner layer substrate 100 constituting the multilayer substrate is provided for forming the wiring pattern P. In the inner layer substrate 100, the copper foil 102 is etched on one or both sides of the base material 101 to form a wiring pattern P. The base material 101 is laser processed to provide a through hole, and the metal paste 103 is applied to the through hole. By embedding, electrical connection between the wiring patterns P of each layer is achieved. As the base material 101, a polyether ether ketone (PEEK) which is a crystalline polymer / polyether imide (PEI) which is an amorphous polymer is mixed with a filler (filler material). ing.

  An adhesive layer 200 is provided between the two inner layer substrates 100. The adhesive layer 200 is formed by forming a through hole in a film 201 in which a fusion layer is provided on a polyimide film, and embedding a metal paste 202 in the through hole. As shown in FIG. 7B, the wiring pattern P of the inner layer substrate 100 is formed. The wiring pattern P and the bump 9a disposed on the upper surface of the wireless communication element 9 are electrically connected to each other.

  In addition, the wireless communication element 9 such as a chip part or LSI chip used for wireless communication is embedded in a part of the resin that is the same as the base material 101 or does not use a filler. It is covered with resin (see between A3 and A4 in FIG. 7C). The bumps 9a of the wireless communication element 9 are in contact with the wiring pattern P formed on the fifth layer A5 above the component placement layer (fourth layer A4).

  The first layer A1 to the eighth layer A8 shown in FIG. 7B and FIG. 7C respectively show the formation layers of the wiring pattern P made of copper foil. Of these layers, the first layer A2 Corresponds to the k−a layer, the third layer A3 corresponds to the kth layer, and the seventh layer A7 corresponds to the k + b layer.

  As shown in a cross-sectional view of the navigation device in FIG. 9, the front housing portion 3 a includes a fitted portion (engagement portion, fixed piece, slit) 3 c located inside the left front. The rear housing part 3 b is provided with a projection 3 d toward the inside of the housing 3. The protrusion 3d includes a pressing portion 3e that presses the module 7 forward from the rear side in a state where the module 7 is fitted to the fitted portion 3c. A cushioning material is used for the pressing portion 3e and provides a buffering action. Further, the rear housing part 3b includes a projecting part 3d provided with a clamping part 3f for clamping the module 7 in the left-right direction in FIG.

  As shown in the rear view of the main part in FIG. 10, a connector 14 is mounted on the printed wiring board 6. The connector 14 and the connector 13 are connected by a cable 12. As described above, the module 7 and the printed wiring board 6 are connected by the cable 12, and the control circuit C of the printed wiring board 6 communicates with the wireless communication element 9 in the module 7 through the cable 12 through the baseband frequency. A baseband signal of a band (for example, 25 MHz band) is transmitted and received.

  The cable 12 uses, for example, FFC (Flexible Flat Cable). You may mount chip parts etc. using FPC (Flexible Print Circuit). The cable 12 transmits power, ground, and various signals. Specifically, the cable 12 transmits a signal whose upper limit is a frequency signal (25 MHz) lower than the frequency band (2.4 GHz band) of the wireless communication signal. . Therefore, for example, it can be configured at low cost as compared with a configuration in which connectors 13 and 14 are connected using a coaxial cable and a signal in a frequency band (2.4 GHz band) of a wireless communication signal is transmitted.

  Hereinafter, the manufacturing method of the front part structure of the navigation apparatus 1 is demonstrated. First, in order to manufacture the module 7, the component built-in substrate 8 is first manufactured. This component built-in substrate 8 is manufactured as follows. The wiring pattern P is etched using the copper-clad thermoplastic resin film as the base material 100. Then, the via 8c is processed. In the process of forming the via 8c, all the layers are processed at once, and a hole is opened by a laser in a region where the layers are connected. Then, the metal pastes 102 and 202 are embedded in the holes. Thereby, substrate patterns (wiring pattern P + via 8c + wiring connection pattern) for n layers can be prepared. In parallel with this, a bare chip and a chip component are mounted as the wireless communication element 9 on the k-th layer.

  Then, these n-layer substrate patterns are stacked while being aligned, and press-molded at a time, so that wiring pattern connection, connection between wiring patterns, and adhesion can be formed almost simultaneously. Then, the chip component 11, the connector 13, and the like are mounted on the front surface or the back surface of the component built-in substrate 8.

  Next, the sheet metal antenna 10 is formed. As shown in the antenna development view in FIG. 11, the pattern of the sheet metal antenna 10 can be formed by punching the sheet metal antenna 10 through the punching process to form the pattern of the antenna element and bending it several times at the broken line portion shown in the figure. Then, the sheet metal antenna 10 is mounted on the component built-in substrate 8 using the solder 10a. Thereby, the structure shown in FIG. 6 can be configured.

  Next, as shown in FIG. 12, one end of the module 7 is fitted into the fitted portion 3c. Then, one side end of the module 7 is fixed to the front casing portion 3a by fitting into the fitted portion 3c. At this time, the fitted portion 3c holds the module 7 in the vertical and horizontal directions, so that the module 7 is restricted in the vertical and horizontal directions of the navigation device 1. After fixing the module 7 to the front housing part 3 a, the cable 12 is inserted into the connector 13 of the module 7. The cable 12 connected to the connector 13 extends rearward.

  As shown in FIG. 12, the rear housing part 3b includes a plurality of protrusions 3d at the top and bottom, but when the rear housing part 3b is mounted, the cable 12 extends backward through the plurality of protrusions 3d. And the rear housing part 3b is fixed to the front housing part 3a. At this time, the other end of the module 7 on both the upper and lower sides of the cable 12 is pressed by the pressing portion 3e.

  Then, both ends (one side end and the other side end) of the module 7 can be sandwiched in the front-rear direction in the navigation device 1. Moreover, since the clamping part 3f provided in the projection part 3d clamps the other side end of the module 7 in the left-right direction, the movement of the module 7 in the left-right direction is also restricted. Then, the module 12 and the printed wiring board 6 are electrically connected by inserting the cable 12 extending rearward into the connector 14 of the printed wiring board 6 (see FIG. 9). In this way, the front structure of the navigation device 1 can be manufactured.

  According to the present embodiment, since the component built-in substrate 8 contains the wireless communication element 9 and the upper and lower surfaces of the wireless communication element 9 are covered with the conductive plate surfaces 8a and 8b, respectively, a shielding effect can be realized. . Therefore, it is not necessary to mount a shield case on the surface of the component built-in substrate 8, and the height can be suppressed as much as possible.

  Further, since the sheet metal antenna 10 is mounted on the front surface or the back surface (one surface) of the component-embedded substrate 8, it is possible to increase the efficiency of transmitting and receiving wireless communication signals and to prevent the antenna performance from being deteriorated as much as possible. Since the wireless communication element 9 is mounted in the component built-in substrate 8 and the sheet metal antenna 10 can be mounted on the front surface or the back surface of the component built-in substrate 8, the planar mounting area can be suppressed as much as possible.

  When the component built-in substrate 8 is configured, the wireless communication element 9 is built in the substrate, and the substrate is patterned and press-molded, so that the component built-in substrate 8 is made as thin as a single-layer substrate. it can. A component with a small height (for example, less than 0.6 mm) can be built in the component built-in substrate 8.

  Since the sheet metal antenna 10 has a space between the element and the component-embedded substrate 8, a component having a large height (for example, a chip component 11 of 0.6 mm or more and less than 2.0 mm) is placed in the space. Can be installed. Then, the overall height dimension of the module 7 can be reduced.

  Since the module 7 can be fixed by fitting the module 7 to the fitted portion 3c, it can be easily attached as compared to the fixing method of the embodiment described later. Moreover, since the pressing part 3e presses the module 7 from back and the clamping part 3f clamps the module 7, a fixed state can be stabilized.

(Second Embodiment)
FIG. 13 to FIG. 15 show a second embodiment. The difference from the previous embodiment is that the module is attached to a metal member. The same or similar parts as those of the above-described embodiment are denoted by the same or similar reference numerals, and the description thereof will be omitted. Hereinafter, different parts will be described.

  As shown in FIG. 13, a module 17 that replaces the module 7 includes a sheet metal antenna 20 that replaces the sheet metal antenna 10 and a component-embedded substrate 8. The sheet metal antenna 20 is located on the surface of the component-embedded substrate 8 and is molded into a known element shape that is substantially the same as in the above-described embodiment. The sheet metal antenna 20 shown in FIG. 13 schematically shows the characteristics (mounting structure) of the ground portion, and may be any shape as long as it is a monopole type, and the antenna shape is shown in the figure. Not limited to.

  A screw hole 20 a is formed in the ground element of the monopole antenna of the sheet metal antenna 20. This screw hole 20 a is a hole for attaching to the frame 5. A screw hole 5a (see FIG. 14) is formed in the frame 5 at a position corresponding to the screw hole 20a in advance, and the sheet metal antenna 10 is fastened to the frame 5 with screws 21 (see FIGS. 14 and 15). Fixed.

  The reason for fixing the module 7 to the frame 5 is to reinforce the ground of the sheet metal antenna 10. That is, if such a structure is adopted, the sheet metal antenna 20 can provide a wider ground space for impedance matching than the sheet metal antenna 10 of the above-described embodiment.

  The frame 5 is made of metal. For this reason, impedance can be reduced by bringing the sheet metal antenna 20 into contact with a wide metallic member. By bringing the ground element of the sheet metal antenna 10 into contact with the frame 5 having a large area, the ground can be enhanced and the antenna characteristics can be improved.

  As shown in a schematic rear view of the mounting state of the module 17 in FIG. 14, the module 17 is attached to the side end of the mounting frame 5 of the liquid crystal display device 4 using screws 21. As shown in a perspective view of how the module 17 is attached in FIG. 15, the module 17 is attached to the rear side of the liquid crystal display device 4 together with the frame 5 with screws 21. Thereafter, the liquid crystal display device 4 and the frame 5 can be fixed to the front casing portion 3a.

  According to this embodiment, since the module 17 is attached to the frame 5 of the liquid crystal display device 4, the impedance of the ground element can be reduced and the ground can be enhanced. Since the module 17 is attached to the frame 5, it is not necessary to provide the fitted portion 3c for fixing the module 7 in the front housing portion 3a.

(Third embodiment)
FIGS. 16 to 18 show the third embodiment. The difference from the previous embodiment is that the cable is provided integrally with the module. The same or similar parts as those of the above-described embodiment are denoted by the same or similar reference numerals, and the description thereof will be omitted. Hereinafter, different parts will be mainly described.

  As shown in a perspective view of the module in FIG. 16, a cable 22 instead of the cable 12 is provided integrally with the module 27. As shown schematically in FIG. 17, a longitudinal section of the module 27, a cable 22 is hot-pressed on the module 27. The cable 22 is configured using an FPC (Flexible Print Circuit) or the like. This structure can be manufactured by simultaneously hot-pressing the end portion 22a of the cable 22 when each layer (first layer A1 to n-th layer An) of the component-embedded substrate 8 is manufactured by hot pressing.

  In particular, the layer for pressing the cable 22 is preferably set to a layer below the (k−1) -th layer below the component mounting layer (k-th layer) with many signal wirings. This is because it is easy to ensure a wider crimping area and to improve the crimping property. Thereby, it can comprise, without providing the connector 13 compared with the above-mentioned embodiment. Since the end of the cable 22 is crimped in advance, when the module 27 is assembled, the other end of the cable 22 may be connected to the connector 14 as shown in FIG.

Also according to this embodiment, there are substantially the same functions and effects as in the previous embodiment. In addition, since one end of the cable 22 is integrally formed with the module 27, it is easy to assemble.
(Other embodiments)
The present invention is not limited to the embodiment described above or illustrated in the drawings, and the following modifications or expansions are possible. Although a form in which the chip component 11 is surface-mounted on the component built-in substrate 8 is shown, all elements may be arranged in the component built-in substrate 8.

  Although the form to which the to-be-fitted part 3c was provided in the front housing part 3a and the side end of the module 7 was fitted to the said to-be-fitted part 3c was shown, in the aspect fixed to fixing pieces, such as the front housing part 3a and the rear housing part 3b. Any fixed form may be used.

  In the above-described embodiment, the embodiment using the sheet metal antennas 10 and 20 is shown. However, in the invention, other antennas such as a patch antenna may be applied.

  In the drawings, 1 is a vehicle navigation device (vehicle wireless communication device), 3a is a front housing portion, 3b is a rear housing portion, 3c is a fitted portion (engaging portion), 3w is a window portion, and 4 is a liquid crystal display. Device (display device), 5 is a frame (metallic member), 6 is a printed wiring board, 7 is a vehicle-integrated wireless communication module, 8 is a component built-in board, 8c is a via, 8a and 8b are conductive plate surfaces, 9 is a wireless communication element, 10 and 20 are sheet metal antennas (antennas), and 22 is a cable.

Claims (11)

A wireless communication element (9);
The wireless communication element (9) is formed of a multilayer substrate composed of n (n is an integer of 3 or more) layers, and the wireless communication element (9) is mounted on the kth (1 <k <n) layer. Is mounted above the first conductive plate surface (8a) formed in the ka-th (1 ≦ a ≦ k−1) layer of the multilayer substrate, and the wireless communication element (9) is mounted on the multilayer substrate. A component-embedded substrate (8) mounted below the second conductive plate surface (8b) formed in the k + b (1 ≦ b ≦ n−k) layer of the substrate;
An antenna (10, 20) electrically connected to the wireless communication element (9) built in the component built-in substrate (8) and mounted on one side of the component built-in substrate (8); And a vehicular antenna integrated radio communication module. A plurality of vias (8c) that connect the first conductive plate surface (8a) and the second conductive plate surface (8b) and that surround the mounting surface of the wireless communication element (9). With
The plurality of vias (8c) are provided at intervals of 1/4 or less of a cycle of a wireless communication signal in which the wireless communication element (9) wirelessly communicates with the outside via the antenna (10). The vehicle-mounted antenna integrated wireless communication module according to claim 1.   3. The vehicular antenna integrated wireless communication module according to claim 1, wherein the multilayer substrate is formed by press molding a patterned substrate.   The vehicle antenna according to any one of claims 1 to 3, wherein the antenna (10, 20) is a sheet metal antenna having a space between the element and the component-embedded substrate (8). Body type wireless communication module.   5. The cable according to claim 1, further comprising a cable (22) that communicates between the wireless communication element (9) and the outside and is provided integrally with the component-embedded substrate (8). The vehicle antenna integrated wireless communication module according to claim.   6. The vehicular antenna according to claim 5, wherein the cable (22) is formed by pressing a layer below the component mounting layer of the component-embedded board (8) and below the (k-1) th layer. Integrated wireless communication module. A vehicular radio communication device equipped with the vehicular antenna integrated radio communication module (7, 17, 27) according to any one of claims 1 to 6,
A printed wiring board (6) on which the control circuit (C) is mounted;
The wireless communication element (9) includes a communication processing unit that operates using a signal having a lower operating frequency than a wireless communication signal that communicates with the outside via the antenna (8).
A vehicular wireless communication apparatus comprising a cable (12, 22) for communication between the communication processing unit and the printed wiring board (6). A vehicular radio communication device equipped with the vehicular antenna integrated radio communication module (7, 17, 27) according to any one of claims 1 to 6,
A front casing portion (3a) formed into a rectangular frame shape and having an engaging portion (3c) formed on the rear surface side of the rectangular frame;
The front housing part (3a) is disposed on the rear side of the front housing part (3a) and more centrally than the engaging part (3c) of the front housing part (3a), and has an outer shape that is larger than the rectangular frame of the front housing part (3a). A display device (4) that is narrowly shaped and displays a display screen through a window (3w) on the center side of the rectangular frame of the front casing (3a);
A printed wiring board (6) disposed on the rear side of the display device (4);
The vehicular antenna integrated wireless communication module (7, 17, 27) engaged with the engaging portion (3c) of the front housing portion (3a) and electrically connected to the printed wiring board (6). And a wireless communication device for vehicles. The display device (4) has an outer shape surrounded by a metal member (5),
The vehicular wireless communication apparatus according to claim 8, wherein a ground element of the antenna (20) is configured to contact the metal member (5). A manufacturing method for manufacturing a vehicular radio communication device by attaching the vehicular antenna integrated radio communication module (7, 17, 27) according to any one of claims 1 to 6,
Engaging the antenna-integrated wireless communication module (7, 17, 27) containing the wireless communication element (9) with the engaging portion (3c) of the front housing portion (3);
Assembling the display device (4) and the printed wiring board (6) in this order on the rear surface side of the front housing part (3);
Connecting a cable (12, 22) between the wireless communication element (9) in the antenna-integrated wireless communication module (7, 17, 27) and the printed wiring board (6). A method of manufacturing a vehicular wireless communication device. A manufacturing method for manufacturing a vehicular radio communication device by attaching the vehicular antenna integrated radio communication module according to claim 1,
The ground element of the antenna (20) of the antenna-integrated wireless communication module (17) in which the wireless communication element (9) is built is brought into contact with the metallic member (5) provided on the outer shape of the display device (4). Fixing the antenna-integrated wireless communication module (17) to the metal member (5) by fixing
Assembling the display device (4), the metallic member (5) to which the antenna-integrated wireless communication module (17) is fixed, and the printed wiring board (6) in this order on the rear surface side of the front casing (3a);
Connecting a cable (12, 22) between the wireless communication element (9) in the antenna integrated wireless communication module (17) and the printed wiring board (6). A method for manufacturing a vehicle wireless communication device.

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