JP2013187509A - Positional information acquiring method of mounting members, positional information acquiring device of the same and manufacturing method of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To acquire positional information such as positions, inclinations and components mounting positions of respective mounting members formed on a member divided into the multiple mounting members at a high speed.SOLUTION: A positional information acquiring method of mounting members comprises the steps of: imaging each of product substrates 11 frame-by-frame while relatively moving a CCD camera 4 with respect to a board divided into multiple product substrates 10 made of a ceramic material; setting a recognition image of each of the product substrates 11 such that the entire product substrate 11 set as an imaging object fits into a substantially center inside an image frame and the product substrates 11 adjacent thereto are partially imaged inside the image frame; performing image processing of each of the recognition images and calculating feature points of the product substrate 11 set as the imaging object and the product substrates 11 adjacent thereto partially imaged; and superimposing two recognition images in which the product substrates 11 set as the imaging objects adjacent to each other such that the feature points in common therewith coincide with each other, synthesizing an image of the entire board divided into the multiple product substrates 10 and acquiring positional information of all the product substrates 11 from a synthetic image acquired.

Description

  The present invention relates to a method of manufacturing an electronic device, and more particularly to a method and apparatus for acquiring information on dimensions, positions, shapes, component mounting positions, etc. of individual mounting members for a multi-cavity member such as a multi-chip board. About.

  Conventionally, in a manufacturing process of an electronic device, a method of determining a mounting position of an electronic component using an image obtained by capturing a mounting member such as a substrate with a camera has been used. For example, in order to mount a large number of electronic components on a single circuit board in a fully automatic manner at a desired location, a mounting method is known in which an electronic component mounting position on the circuit board is imaged and detected by a television camera. (For example, refer to Patent Document 1). In the method described in Patent Document 1, a positional deviation amount is calculated by comparing the imaging output of a television camera and a prestored standard pattern of the attachment position to recognize the actual attachment position. Yes.

  Similarly, there is known a method of inspecting the presence / absence of a component, positional deviation, and the like using an image obtained by imaging a component mounting board (see, for example, Patent Document 2). In this method, an entire image is created in advance for a substrate to be inspected, an imaging target region of the substrate is imaged at the time of inspection to obtain a processing target image, and an inspection region is added to the processing target image using a deviation amount from the entire image. It is set. In addition, the entire image of the board can be created by dividing the board into a plurality of areas and connecting the images of the areas. At this time, an appropriate whole image is created by providing overlapping portions of a predetermined number of pixels corresponding to the mechanical error that occurs in the movement amount of the X-axis and Y-axis table portions between adjacent regions.

  Further, in order to increase production efficiency, a multi-sided board in which a large number of printed boards are formed on one board and electronic components are mounted on each printed board and can be divided is widely adopted. In such a multi-sided board, there is an electronic component mounting method for obtaining the component mounting position of the printed circuit board from the result of recognizing the board mark of each printed circuit board by the camera and the information of the relative position detected by the component supply unit. It is known (see, for example, Patent Document 3).

JP-A-61-36941 JP 2007-184589 A JP 2003-69288 A

  However, in any of the conventional methods, after the camera is relatively moved to the attachment position or region to be imaged, the image is captured in a stationary state to acquire an image. Therefore, when there are a large number of imaging targets such as a multi-sided board on which a large number of printed boards are formed, there is a problem that it takes a long time to image all of them. Furthermore, since the table on which the mounting member such as the camera or the board is mounted is mechanically moved, an error occurs in the imaging position due to the mechanical error or the delay of the control signal, and the position and shape of the imaging target are accurately recognized. There is a possibility that it cannot be done.

  Naturally, these problems can be solved by driving a high-performance camera at high speed and with high accuracy. However, such a camera and driving means are expensive and unsuitable for industrial use.

  In the method described in Patent Document 3, the mounting member is a printed circuit board, and its component mounting position is determined in advance, and does not vary as long as the multi-chip board is accurately positioned during mounting. However, when a multi-sided substrate is made of a ceramic material often used for surface-mount type piezoelectric devices, the entire substrate contracts due to firing. Therefore, there is a possibility that the size and position of each product board and each component mounting position may deviate from the original design position, and the deviation in size and position may vary for each multi-sided board.

  If an electronic component is mounted on each product substrate as it is, a defective product is generated, resulting in a problem that the yield is lowered. In order to solve this problem, it is necessary to acquire information such as the position and component mounting position of each product board formed on each multi-sided board before mounting the electronic component. .

  Therefore, the present invention has been made in view of the above-described conventional problems, and the purpose of the present invention is to provide individual multi-members on which a large number of mounting members such as a substrate and a base for mounting electronic components are formed. It is an object of the present invention to provide a method and apparatus capable of acquiring position information such as the position, inclination, and component mounting position of a mounting member at high speed.

  It is a further object of the present invention to implement such a method and apparatus at low cost.

  Another object of the present invention is to automatically and accurately mount an electronic component on each mounting member using the mounting member position information acquisition method and apparatus of the present invention, whereby a large number of electronic devices can be mounted. Is to manufacture with good yield.

In order to achieve the above object, the mounting member position information acquisition method of the present invention provides:
While moving the camera relative to a multi-piece member in which a plurality of mounting members are arranged, the entire at least one mounting member and other ones arranged next to the at least one mounting member Capturing a plurality of recognition images by imaging so that at least a part of the mounting member fits within one image frame; and
A plurality of recognition images are combined so that the feature points of the at least one mounting member and the other mounting member included in each recognition image are matched, and position information of the plurality of mounting members is obtained from the combined image. And a process of
It is characterized by including.

  As described above, since a plurality of recognition images are captured so that a part of the mounting member adjacent to each other is captured in addition to the mounting member to be imaged, the camera is imaged even when the camera is moved. Even if positioning is not performed with high accuracy with respect to the target mounting member, accurate position information of the mounting member can be acquired from the composite image. And since it can image without stopping a camera, the imaging time which all the mounting members require about the whole member for multiple acquisition can be reduced significantly. Further, the camera can be moved by a relatively inexpensive driving means, and the cost can be reduced.

  In an embodiment, the step of acquiring a plurality of recognition images and the step of acquiring the position information of the mounting member are sequentially performed. Thereby, each recognition image captured and captured by the camera is sequentially subjected to image processing, the feature points of the at least one mounting member and other mounting members included in each recognition image are extracted, and the composite image Can be created. Therefore, the position information of the mounting member can be acquired at higher speed.

  In some embodiments, the individual mounting members are made of a ceramic material. In this case, although the individual mounting members are shrunk from the design dimensions by firing, the position information of the mounting members can be obtained at high speed by the method of the present invention, which is advantageous.

  In another embodiment, the mounting member has a recess for mounting an electronic component. The boundary of the recess causes a difference in density that can be clearly recognized from the height difference in the recognition image of the mounting member. Therefore, it is advantageous for image processing of the recognition image to extract feature points, and the position information of the mounting member can be acquired more accurately.

  In another embodiment, the mounting member is a flat substrate for mounting electronic components. On the surface of such a substrate, an electrode pad for mounting an electronic component and a metallization layer for wiring are usually provided. Edges or outer edges of these electrode pads or the like cause a difference in shading that can be clearly recognized in the recognition image of the mounting member. Accordingly, it is advantageous for image processing of the recognition image to extract feature points, and the position information of the mounting member can be accurately acquired.

According to another aspect of the present invention, with respect to a multi-piece member in which a plurality of mounting members are arranged, a step of obtaining positional information of each mounting member by the method of the present invention described above,
Determining a component mounting position of each mounting member based on the acquired position information;
A step of mounting an electronic component at each component mounting position of each determined mounting member;
A method for manufacturing an electronic device is provided.
As a result, an electronic device can be manufactured by accurately mounting electronic components, and the yield can be improved by reducing the occurrence of defective products.

In one embodiment, a method for manufacturing an electronic device of the present invention includes:
Determining a cutting line of the mounting member based on the acquired position information;
Cutting a plurality of members according to the determined cutting line, and separating the mounting member on which the electronic component is mounted;
Is further included. As a result, the generation of defective products in the production of electronic devices can be further reduced, and the yield can be further improved.

According to yet another aspect of the invention,
A camera for imaging the mounting member while moving relatively with respect to the multi-members on which a plurality of mounting members are arranged;
A processing control unit for performing image processing on a recognition image of the mounting member captured by the camera, and for controlling movement and imaging of the camera and image processing of the image processing unit;
The camera includes a plurality of the plurality of at least one mounting member and at least a part of the other mounting members arranged next to the at least one mounting member within the image frame of each recognition image. Take a recognition image,
The processing control unit synthesizes a plurality of recognition images so that the feature points of the at least one mounting member and the other mounting member respectively included in each recognition image are matched, and a plurality of mountings are performed from the combined image. Get the position information of the member,
A mounting member position information acquisition device configured as described above is provided.

  By configuring in this way, the camera does not need to be positioned with high accuracy with respect to the mounting member to be imaged, and therefore a highly accurate and expensive drive mechanism is not required for the movement. Therefore, the mounting member position information acquisition method of the present invention described above can be realized at a relatively low cost.

Schematic which shows the structure of the positional information acquisition apparatus of the mounting member of this invention. FIG. 5A is a plan view of a multi-cavity substrate, and FIG. 5B is a diagram illustrating an imaging path of each product substrate of the multi-cavity substrate. (A) A figure is a recognition image of a product board, (B) A figure explaining calculation of a center position and inclination of a product board. FIGS. 4A to 4D are recognition images of four adjacent product substrates. The image which synthesize | combined the recognition image of Fig.4 (A)-(D). The top view of another multi-cavity board | substrate.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the accompanying drawings, the same or similar components are denoted by the same or similar reference numerals.

  FIG. 1 schematically shows a configuration of a preferred embodiment of a mounting member position information acquisition apparatus according to the present invention. The position information acquisition device 1 includes an assembly table 2 on which multiple members are placed, a table driving device 3, a CCD camera 4, a camera driving device 5, a CPU 6, an image processing unit 7, and a storage. A device 8 and a monitor 9 are provided. The CCD camera 4 is vertically arranged above the assembly table 2 with the objective lens facing the upper surface of the table. In this embodiment, controlled by the CPU 6, the CCD camera 4 is driven in the ± X axis direction by the camera driving device 5, and the assembly table 2 is driven in the ± Y axis direction by the table driving device 3.

  In another embodiment, the CCD camera 4 can be fixed and the assembly table 2 can be driven in the ± XY axis directions. Conversely, the assembly table 2 can be fixed and the CCD camera 4 can be driven in the ± XY axis directions.

  In this embodiment, a rectangular multi-cavity substrate 10 is placed on the assembly table 2 as a multi-cavity member. As shown in FIG. 2A, the multi-substrate 10 is a multi-layer substrate obtained by laminating and firing thin ceramic materials, and a large number of product substrates 11 having the same rectangular shape and dimensions are arranged side by side in a matrix. Is formed. As will be described later, the product substrate 11 has a box-type structure in which a recess for defining a space for mounting an electronic component is formed in the center. The multi-chip substrate 10 is not limited to a ceramic material, and can be formed of a glass eboxy material, a glass material, and various other materials.

According to the present invention, each product substrate 11 of the multi-substrate 10 is imaged one frame at a time by the CCD camera 4. The imaging path can be set, for example, as shown by an arrow in FIG. Starting at S the product substrate 11 ₁ in the top row left in the figure, + X-axis direction to move to the right edge of the product substrate 11 _4, after moving from there to product substrates 11 ₅ of a row under the -Y direction, - moves in the X-axis direction to the left edge of the product substrate 11 _8. Moves further to the product substrate 11 ₉ of a row under the -Y direction, and moves from there + after moving in the X-axis direction to the right end of the product substrate 11 _12, a row under the -Y direction, i.e. to the product substrate 11 ₁₃ bottom row , further moves in the -X direction until the product substrate _{11 16} the left end position E. Thus, by relatively moving the CCD camera 4 in a zigzag manner along the XY axis direction, all product substrates 11 can be imaged efficiently and at high speed. In another example, move to the lowest of the leftmost column in the vertical as the same product substrate 11 ₁ Start position S, it moves to the uppermost vertically moved in a row right, top row to thereafter move similarly in a zigzag to move to the right end of the product substrate 11 _4, it is also possible to set the imaging path.

CCD camera 4 is placed into the first starting position S, imaging the first product substrate 11 _1. From there, the CCD camera 4 images the product substrates one by one in order while moving without stopping to the end point position E along the imaging path. Since the CCD camera 4 does not need to be stationary for each product substrate, the total imaging time can be greatly shortened compared to the conventional technique. For example, a multi-chip substrate in which 26 × 24 product substrates 11 arranged horizontally and vertically has a total imaging time shortened to about 1/10 as compared with a case where images are taken stationary for each product substrate.

Each recognition image is imaged so that the entire target product substrate 11 is reflected in the center of the image frame, and a part of one or more other product substrates 11 adjacent in the XY direction is reflected in the image frame. The FIG. 3 (A) shows a recognition image I1 of the first product substrate 11 _1. On the upper surface of each product substrate 11, a metallized layer 13 is provided for bonding the lid in a later assembly process. The metallized layer 13 is formed in a substantially rectangular shape so as to surround the generally rectangular central recess 12 described above. A pair of electrode pads 14 are provided on the bottom surface of the recess 12 so as to be electrically connected to the electronic component to be mounted.

As shown in FIG. 3A, the edges of the metallized layer 13 and the electrode pad 14 can be clearly recognized from the difference in density from the surface of the product substrate 11 in the recognition image. In this embodiment, by detecting the inner edges of the metallization layer 13 by a known image processing, it is possible to determine the position and the inclination of the product substrate 11 _1.

First, as shown in FIG. 3B, approximate straight lines L1 to L4 are obtained for the four sides of the rectangle of the metallized layer 13, respectively. Next, the coordinate positions of the intersection points K1 to K4 of the adjacent approximate lines L1 to L4 are obtained as feature points. Furthermore, from the line connecting the straight line and the intersection K2 and K3 connecting the intersections K1 and K4 respectively positioned in a diagonal direction of the rectangular, we obtain the coordinates of the center position C of the product substrate 11 _1. Furthermore, the slope of a straight line connecting the intersection point K1 and K3, the average value of the slope of the straight line connecting the intersection point K2 and K4, the inclination of the product substrate 11 _1. Further in the same manner, for the same production of next recognition are crowded appear in the image I1 substrate 11 _2, 11 _8, by detecting the edge of their metallization layer within the recognition image I1, one side of each of the rectangular From the corresponding approximate straight lines, their intersections K22, K32, K18, and K28 are obtained as feature points.

In this way, from the recognition image acquired by the CCD camera 4, the metallized layer for the target product substrate 11 located in the center and the other product substrate 11 that is partially reflected next to the target product substrate 11. By detecting this edge, the coordinate position of the feature point is obtained for all the product substrates, and the position and inclination can be obtained therefrom. Note that recognition image I1 of the first product substrate 11 ₁ is used as a reference recognized image to be combined with other recognition image of the product substrate for imaging later.

Next, a process of synthesizing the recognition images of all the product substrates 11 to create a recognition image of the entire multi-chip substrate 10 will be described. 4A to 4D show recognition images I1, I2, I7, and I8 of four product substrates 11 ₁ , 11 ₂ , 11 ₇ , and 11 ₈ that are adjacent in the XY direction. These recognition images are obtained by the above-described image processing to obtain respective intersections, that is, feature points of approximate straight lines with respect to one side of the rectangle of the metallized layer for the target product substrate and the adjacent product substrate partially reflected. ing.

  The recognition image I1 and the recognition image I2 can be synthesized by overlapping the feature points K21, K41, K12, and K32 common to them. Similarly, the recognition image I1 and the recognition image I8 are synthesized by overlapping the feature points K31, K41, K18, K28 common to them so as to match each other. The recognition image I2 and the recognition image I7 are synthesized by overlapping the feature points K32, K42, K17, K27 common to them. The recognition image I8 and the recognition image I8 are synthesized by overlapping the feature points K28, K48, K17, and K37 common to them.

  In this way, a composite image of the recognized images I1, I2, I7, and I8 can be obtained as shown in FIG. By performing this image processing on the recognition images of all product substrates, it is possible to obtain accurate position information of each product substrate 11 for the entire multi-substrate 10. In the above-described embodiment, one product substrate 11 is set as an imaging target for each recognition image, but two or more product substrates can be set as an imaging target. In this case, each recognition image is such that the entire two or more target product substrates and a part of at least one other product substrate arranged next to each other are within one image frame. To be imaged. In this way, it is possible to cover the product substrate 11 of the entire multi-chip substrate 10 by acquiring at least two recognition images. In addition, when position information is not required for all product substrates 11 of the multi-chip substrate 10, at least two recognition images including a recognition image for the product substrate 11 for which position information is required are acquired. That's fine.

  The image processing for acquiring the position information of the product substrate 11 is executed while the image processing unit 7 is controlled by the CPU 6 together with the imaging processing of the CCD camera 4 for acquiring the recognition image of the product substrate 11. In this embodiment, the image processing unit 7 sequentially processes image signals continuously input from the CCD camera. By sequentially performing image processing in this manner, it is possible to obtain a composite image and position information of the mounting member at a higher speed. The obtained position information of each product substrate 11 of the multi-substrate 10 is stored in the storage device 8. The position information can be confirmed by outputting it to the monitor 9.

  Further, the position information is output from the image processing unit 7 directly or from the storage device 8 to the outside as needed or requested. The output position information can be used, for example, in a process of manufacturing an electronic device by mounting electronic components on the multi-chip substrate 10. That is, since the component mounting position can be accurately determined from the position information of each product substrate, the electronic component can be automatically and accurately mounted on each product substrate. In particular, by accurately determining the position and inclination of the metallized layer of each product substrate, the lid can be bonded and sealed to each product substrate after mounting the electronic component with high accuracy. After that, by accurately determining the cutting line from the position information of each product substrate and cutting out the individual electronic devices along the cutting line, it is possible to obtain individual pieces with high yield.

  The present invention can be similarly applied to a multi-chip substrate in which a plurality of electronic components are mounted on one product substrate. In that case, the same effect can be obtained by imaging each product substrate in the same manner and processing the recognition image.

  FIG. 6 shows a multi-chip substrate 20 on which one crystal resonator and an IC for driving it are mounted on one product substrate. Each product substrate 21 has a recess 22 in the center for housing the crystal resonator and IC, and a metallized layer 23 is provided so as to surround the recess. In the recess 22, a pair of electrode pads 25 are provided in the crystal resonator mounting region 24, and a plurality of connection terminals 27 are provided in the IC mounting region 26.

  According to the present embodiment, each product substrate 21 is imaged while moving the CCD camera 4 in the same manner as the multi-chip substrate 10 of FIG. The recognition image of each product substrate 21 is imaged so that the product substrate to be imaged fits in the center and the product substrate adjacent to it is partially reflected. The recognition image is subjected to image processing in the same manner as in the case of the product substrate 11 described with reference to FIG. That is, the inner edges of the metallized layer 23 are detected, their approximate straight lines are obtained, and their four intersections are calculated as feature points. Further, the coordinate position of the center C0 of the product substrate 21 is obtained from two diagonal lines connecting these four intersections.

  Next, since the outer shape and dimensions of the crystal resonator to be mounted are known, the intersection of the two diagonal lines is calculated, and the coordinate position of the center C1 with respect to the positions of the four corners of the crystal resonator is obtained. By setting the center C1 of the crystal resonator so that the center C0 of the product substrate 21 is offset from the design external dimension of the crystal resonator, that is, located outside the mounting region 24 of the crystal resonator, The mounting position of the vibrator can be obtained. Similarly, since the outline and dimensions of the IC are known, the intersection of the two diagonal lines is calculated, and the coordinate position of the center C2 with respect to the positions of the four corners of the IC is obtained. The mounting position of the IC is obtained by setting the center C2 of the IC so that the center C0 of the product substrate 21 is offset from the designed external dimension of the IC, that is, located outside the mounting area 26 of the IC. It is done.

  The present invention is not limited to the above embodiments, and can be implemented with various modifications or changes within the technical scope thereof. For example, the position information of the product substrate can be obtained in the same manner by performing image processing in the same manner as the difference in shading caused by the outer edge of the metallized layer, the electrode pad, and other uneven portions on the substrate. The CCD camera of the above embodiment for imaging the product substrate can be replaced with another type of camera capable of image processing in the same manner. Further, the multi-cavity substrate of each of the above embodiments may be a flat substrate in which no recess is provided. Furthermore, the present invention can be similarly applied to a mounting member other than a substrate and a multi-member.

DESCRIPTION OF SYMBOLS 1 ... Position information acquisition device, 2 ... Assembly table, 3 ... Table drive device, 4 ... CCD camera, 5 ... Camera drive device, 6 ... CPU, 7 ... Image processing part, 8 ... Storage device, 9 ... Monitor, 10, DESCRIPTION OF SYMBOLS 20 ... Multiple pick-up board | substrate, 11, 21 ... Product board | substrate, 12, 22 ... Recess, 13, 23 ... Metallization layer, 14, 25 ... Electrode pad, 24, 26 ... Mounting area | region, 27 ... Connection terminal.

Claims (8)

A plurality of mounting members are arranged, and the camera is moved relatively with respect to the multiple-taking member, and the whole of the at least one mounting member and the other disposed next to the at least one mounting member. Capturing at least a part of the mounting member within a single image frame to obtain a plurality of recognition images;
The plurality of recognition images are combined so that the feature points of the at least one mounting member and the other mounting member respectively included in each of the recognition images are matched, and a plurality of the mounting members are obtained from the combined image. Obtaining location information;
The position information acquisition method of the mounting member characterized by including.   The mounting member position information acquisition method according to claim 1, wherein the step of acquiring the plurality of recognition images and the step of acquiring the position information of the mounting member are sequentially performed.   The mounting member position information acquisition method according to claim 1, wherein the mounting member is formed of a ceramic material.   The mounting member positional information acquisition method according to claim 1, wherein the mounting member has a recess for mounting an electronic component.   4. The mounting member position information acquisition method according to claim 1, wherein the mounting member is a flat substrate for mounting an electronic component. A step of obtaining positional information of each mounting member by a method according to any one of claims 1 to 5, with respect to a multi-piece member in which a plurality of mounting members are arranged;
Determining a component mounting position of each mounting member based on the acquired position information;
Mounting electronic components at the component mounting positions of the determined mounting members,
The manufacturing method of the electronic device characterized by the above-mentioned. Determining a cutting line of the mounting member based on the position information;
Cutting the multi-members according to the determined cutting line, and singulating the mounting member on which the electronic component is mounted;
The method of manufacturing an electronic device according to claim 6, further comprising: A camera for imaging the mounting member while moving relatively with respect to a multi-piece member in which a plurality of mounting members are arranged;
A processing control unit for performing image processing on a recognition image of the mounting member captured by the camera, and for controlling movement and imaging of the camera and image processing of the image processing unit;
The camera is arranged such that the entire at least one mounting member and at least a part of the other mounting members arranged next to the at least one mounting member are accommodated in an image frame of each recognition image. And capturing the plurality of recognition images,
The processing control unit synthesizes the plurality of recognition images so that the feature points of the at least one mounting member and the other mounting member respectively included in the respective recognition images are matched, and from the combined image A mounting member position information acquisition apparatus, which acquires position information of a plurality of the mounting members.

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