JP2013186984A - Composite substrate structure, manufacturing method of the same, and organic electroluminescent element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite substrate structure which is manufactured without causing defects on cutting surfaces between substrates and enables an organic electric element effectively inhibiting water intrusion and suppressing the deterioration to be formed, and to provide an organic electroluminescent element which achieves good manufacturability, has excellent light extraction properties, and effectively inhibits water intrusion thereby reducing the deterioration and achieving high reliability.SOLUTION: A composite substrate structure is a structure of a composite substrate 3 which includes: a moistureproof substrate 1; and a resin substrate 2 bonded to a surface of the moistureproof substrate 1. The resin substrate 2 is formed so as to be smaller than the moistureproof substrate 1 in a plane view. An end part side surface 2b of the resin substrate 2 is formed as an inclination surface inclining inward. In an organic electroluminescent element, an organic light emitting laminate body 10 is provided on a surface of the resin substrate 2 and is sealed by a sealing material 7. A portion of the resin substrate 2, which protrudes from the sealing material 7, is covered by a moistureproof film 6.

Description

  The present invention relates to a structure of a composite substrate used for an organic electric element and a method for manufacturing the same. The present invention also relates to an organic electroluminescence element.

  In recent years, organic electroluminescence elements (hereinafter also referred to as “organic EL elements”) have been applied to uses such as lighting panels. As an organic EL element, a translucent first electrode (anode), an organic layer composed of a plurality of layers including a light emitting layer, and a second electrode (cathode) are arranged in this order on the translucent substrate. A laminate formed on the surface is known. In the organic EL element, by applying a voltage between the anode and the cathode, light emitted from the light emitting layer is extracted to the outside through the translucent electrode and the substrate.

  In an organic EL element, the light amount of the light emitted from the light-emitting layer is generally reduced by absorption at the substrate or total reflection at the layer interface, so that the amount of light extracted outside is less than the theoretical light emission amount. For example, when glass is used as a substrate material, since glass generally has a refractive index lower than that of an organic layer, total reflection occurs at this interface, and light extraction efficiency decreases. Therefore, in the organic EL element, increasing the light extraction efficiency for increasing the brightness is one of the problems. As a measure for this, it is conceivable that the substrate is composed of a composite substrate of a plastic material and a glass material in order to improve light extraction performance. In this case, by arranging the plastic material on the light extraction side, total reflection at the interface between the substrate and the electrode is reduced, and more light can be extracted to the outside.

  Such a composite substrate can also be applied to organic electric elements other than organic EL elements. Examples of organic electric elements include organic solar cells, organic display elements (organic displays), and other organic semiconductor elements. If it is a composite substrate, a substrate material corresponding to each organic electric element can be obtained, for example, a mixed substrate of a substrate suitable for improving the properties of the laminate and a substrate suitable for protecting the laminate. If a flexible base material is used in combination, a flexible substrate can be obtained.

JP 2007-317671 A

  In an organic electric element, it is usually required that moisture does not enter inside. An organic electric element is an element containing an organic substance, and when moisture enters the organic element, the organic substance changes in quality and causes deterioration of the element.

  In particular, in an organic EL element, since the light emitting layer is easily deteriorated by moisture, it is important to prevent moisture from entering the element. When the light emitting layer deteriorates due to moisture, it causes light emission failure and the like, and reduces the reliability of the organic EL element. When the composite substrate is formed using a material having a relatively high moisture permeability, such as plastic or resin, as a base material for improving the light extraction property, the penetration of moisture into the inside through this material is further increased. This is a problem (see Patent Document 1). Therefore, in the case of using a resin substrate, it is required to suppress the ingress of moisture from the resin substrate by covering with a highly moisture-proof film or disposing a highly moisture-proof substrate on the outside side. However, if even a part of the resin substrate is exposed to the outside, moisture may enter the inside through the exposed portion.

  By the way, in manufacture of an organic electrical element, after forming a several element (laminated body) on a board | substrate, a board | substrate is cut | disconnected and individualized, and one element may be formed. In some cases, a composite substrate having a large area on which a plurality of elements can be formed is individualized, and the composite substrate is cut into one element. Here, the composite substrate is formed by bonding at least two kinds of materials. Therefore, when cutting a composite substrate, such as when individualizing a large-area composite substrate or individualizing elements, different forces act on each material at the cut portion of the composite substrate, so that the cut portion of the composite substrate There is a risk that the substrates may be displaced or the cut surface between the substrates may be defective. If the interface between the substrates is shifted or the shape of the cut end face of the composite substrate is not good, the element cannot be formed satisfactorily, which may result in a product defect.

  The present invention has been made in view of the above circumstances, and can be manufactured without defects in the cut surface between the substrates, and can form an organic electric element that effectively suppresses moisture ingress and reduces deterioration. It is an object of the present invention to provide a composite substrate structure that can be used. Another object of the present invention is to provide a composite substrate structure that is highly manufacturable, has excellent light extraction properties, effectively suppresses the ingress of moisture, and forms a highly reliable organic electroluminescence element with reduced deterioration. It is. It is another object of the present invention to provide a highly reliable organic electroluminescence device having good manufacturability, excellent light extraction properties, effectively suppressing moisture intrusion, and reducing deterioration.

  A composite substrate structure according to the present invention is a composite substrate structure that includes a moisture-proof substrate and a resin substrate bonded to the surface of the moisture-proof substrate, and the resin substrate has the moisture-proof substrate in a plan view. The side surface of the resin substrate is formed as an inclined surface that is inclined inward.

  In the above composite substrate structure, it is preferable that the end portion of the resin substrate has rounded corners from the surface to the side surface. Further, an organic laminate is provided on the surface of the resin substrate, the organic laminate is sealed with a sealing material, and a portion of the resin substrate protruding from the sealing material is covered with a moisture-proof film. Preferably it is.

  A method for producing a composite substrate structure according to the present invention is a method for producing a composite substrate structure including a moisture-proof substrate and a resin substrate bonded to the surface of the moisture-proof substrate, and a plurality of the moisture-proof substrates. Using a composite plate material in which a moisture-proof plate material for forming a conductive substrate and a resin material for forming a plurality of the resin substrates are bonded together, the resin material of the composite plate material is divided and divided. The resin substrate is manufactured by a step having a resin dividing and tilting step in which an end portion side surface of the resin substrate is inclined and a moisture-proof plate cutting step in which the moisture-proof plate material is divided.

  In the above method for producing a composite substrate structure, it is preferable to have a step of coating the outer peripheral end of the resin substrate with a moisture-proof film. Moreover, it is preferable that the said resin parting inclination process is what is performed by laser irradiation. In this case, the laser irradiation is preferably performed by condensing the laser with an objective lens having a numerical aperture of 0.5 or more. Moreover, it is preferable that the manufacturing method of the composite substrate structure includes a residue removing step of removing a processing residue generated by the resin dividing step. In that case, it is preferable that the said residue removal process is what is performed by spraying of gas.

  In the composite substrate structure manufacturing method, the composite plate material is obtained by bonding a sealing plate material for forming a plurality of sealing substrates to the surface on the resin material side. It is a preferable embodiment that the laser beam passing through the sealing plate material is irradiated and the sealing plate material is divided in the moisture-proof plate dividing step.

  The organic electroluminescence device according to the present invention is provided with an organic light emitting laminate on the surface of the resin substrate in a composite substrate including a moisture proof substrate and a resin substrate bonded to the surface of the moisture proof substrate. An organic electroluminescence element in which the organic light emitting laminate is sealed with a sealing material, wherein the resin substrate is formed smaller than the moisture-proof substrate in plan view, and an end portion of the resin substrate The side surface is formed as an inclined surface inclined inward, and a portion of the resin substrate that protrudes from the sealing material is covered with a moisture-proof film.

  According to the composite substrate structure of the present invention, a composite that can be manufactured without defects in the cut surface between the substrates and that can effectively suppress the intrusion of moisture and reduce the deterioration can be formed. A substrate structure can be obtained. In addition, it is possible to obtain a composite substrate structure that is excellent in manufacturability, excellent in light extraction properties, effectively suppresses the ingress of moisture, and forms a highly reliable organic electroluminescence element with reduced deterioration.

  According to the method for manufacturing a composite substrate structure according to the present invention, it is possible to easily manufacture a composite substrate structure capable of forming an organic electric element that effectively suppresses the intrusion of moisture and reduces deterioration.

  According to the organic electroluminescent element according to the present invention, a highly reliable organic electroluminescent element having good manufacturability, excellent light extraction performance, effectively suppressing moisture intrusion, and reducing deterioration can be obtained. .

It is sectional drawing which shows an example of the organic electrical element using the composite substrate structure of this invention. It is an example of embodiment of a composite substrate structure, (a) is a top view, (b) is sectional drawing, (c) is an expanded sectional view. It is sectional drawing which shows an example of embodiment of an organic electroluminescent element. (A)-(d) is sectional drawing which shows an example of the cutting | disconnection of a composite substrate. (A)-(d) is sectional drawing which shows an example of the cutting | disconnection of a composite substrate. (A)-(e) is sectional drawing which shows an example of the cutting | disconnection of a composite substrate. (A)-(d) is sectional drawing which shows an example of the method of cut | disconnecting a composite substrate and manufacturing an organic electroluminescent element. It is sectional drawing which shows an example of a laser. It is an example of embodiment of a composite substrate structure, and is an expanded sectional view.

  FIG. 1 shows an example of an organic electric element using the composite substrate structure of the present invention. In this organic electric element, a composite substrate 3 including a moisture-proof substrate 1 and a resin substrate 2 is used as a substrate for forming the organic laminate 5. The organic laminate 5 is provided on the surface of the resin substrate 2 in the composite substrate 3 and is sealed with a sealing material 7.

  FIG. 2 is an example of a composite substrate structure used for the organic electric element having the form as shown in FIG. 1, and the composite substrate 3 is extracted and illustrated. That is, in the composite substrate structure, an appropriate organic laminate 5 (electric device) is formed on the surface of the composite substrate 3 to form an organic electrical element. In FIG. The composite substrate 3 is taken out and shown. Of course, as shown in FIG. 2, the composite substrate 3 itself in which the organic laminate 5 is not formed is also included in the composite substrate structure. In that case, the organic laminated body 5 can be formed in the composite substrate 3, and an organic electrical element can be formed.

  The composite substrate 3 includes a moisture-proof substrate 1 and a resin substrate 2 bonded to the surface of the moisture-proof substrate 1. The moisture-proof substrate 1 and the resin substrate 2 are bonded and bonded together by an adhesive layer 4.

  As shown in FIG. 2A, in the composite substrate 3, the resin substrate 2 is formed smaller than the moisture-proof substrate 1 in a plan view (when viewed from a direction perpendicular to the substrate surface). Thereby, the surface 1a of the outer peripheral end portion of the moisture-proof substrate 1 is exposed. Thus, when the resin substrate 2 is smaller than the moisture-proof substrate 1, the edges (outer peripheral edges) of the moisture-proof substrate 1 and the resin substrate 2 are not aligned. Therefore, when the composite substrate 3 (composite plate material 13 to be described later) having a plurality of composite substrates 3 is cut to produce the individual composite substrate 3, the resin substrate 2 and the moisture-proof substrate 1 are combined. They will be cut separately (see FIG. 4 etc.). Therefore, the resin substrate 2 and the moisture-proof substrate 1 are not cut at the same time, and it is possible to prevent a defect from occurring on the cut surface.

  As shown in FIGS. 2B and 2C, the end side surface (circumferential side surface) 2b of the resin substrate 2 is formed as an inclined surface inclined inward. That is, the resin substrate 2 has a substantially trapezoidal cross section, and is bonded to the moisture-proof substrate 1 on the lower side of the trapezoid with the upper side of the trapezoid as the outer surface. When the end side surface 2b of the resin substrate 2 is an inclined surface, the layer is laminated on the inclined surface when a layer such as a moisture-proof film 6 is formed on the end surface of the resin substrate 2, so that the resin substrate 2 Therefore, it is possible to form a layer without any defective separation. Further, since the area of the resin substrate 2 is smaller than that of the moisture-proof substrate 1 in plan view, the moisture-proof substrate 1 protrudes from the resin substrate 2 at the outer peripheral portion, and the surface 1a of the moisture-proof substrate 1 is exposed. When forming a layer, it is possible to form a layer on the surface 1a of the moisture-proof substrate 1 as well. Therefore, the layers can be formed by layering over the boundary portion between the resin substrate 2 and the moisture-proof substrate 1, and the layers are laminated so that the interface between the resin substrate 2 and the moisture-proof substrate 1 does not communicate with the outside. And can be coated.

  The inclination angle φ at the end side surface 2b of the resin substrate 2 that has become an inclined surface is smaller than 90 degrees, but is more preferably 80 degrees or less, 75 degrees or less, or 70 degrees or less. When the inclination angle φ is within this range, layer breakage can be effectively reduced. In order to further reduce the step break, the inclination angle φ may be set to 60 degrees or less or 45 degrees or less. However, if the inclination angle φ is too small, the end side surface 2b is close to the side-down state and the region of the end side surface 2b may be excessively widened. Therefore, the inclination angle φ is 30 degrees or more, 45 degrees or more, or It can be in an appropriate range such as 60 degrees or more.

  In this embodiment, the resin substrate 2 has rounded corners 2c from the surface 2a to the side surface 2b at the end. That is, at the end of the resin substrate 2, the edge (boundary portion) between the surface 2a and the side surface 2b is curved from the surface 2a to the side surface 2b. The corner portion 2c is a boundary portion between the surface 2a of the resin substrate 2 and the inclined side surface 2b. If the corner portion 2c is sharp, the layer is cut off when the layers are stacked. May be disrupted. However, if the corner 2c at the end of the resin substrate 2 is rounded, a layer is smoothly formed across the corner 2c, so that the layer breakage at the corner 2c can be reduced. The layers can be stacked without any separation failure.

  As the moisture-proof substrate 1, a transparent substrate that is moisture-proof and has light transmittance can be used. Among these, it is preferable to use a glass substrate as the moisture-proof substrate 1. When the moisture-proof substrate 1 is composed of a glass substrate, since glass has low moisture permeability, it is possible to prevent moisture from entering the sealed region when the organic electric element is sealed. Further, a moisture-proof resin may be used as the material of the moisture-proof substrate 1.

  Further, a flexible substrate may be used as the moisture-proof substrate 1. For example, flexible glass and moisture-proof resin are exemplified. When the moisture-proof substrate 1 has flexibility, a flexible organic electric element can be obtained.

  The resin substrate 2 can be constituted by, for example, a plastic substrate. As the plastic substrate, a molded plate (sheet, film, etc.) obtained by molding and curing a synthetic resin as a plastic raw material can be used. Examples of the plastic material include those formed of a plastic material such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate). The forming may be rolling forming.

  The resin substrate 2 preferably has flexibility. Since the resin substrate 2 has flexibility, the roll-shaped resin substrate 2 (resin material 12 described later) can be sent out to produce the composite substrate 3 (composite plate material 13), and the composite substrate 3 can be manufactured with good manufacturability. Can be produced. Further, when the resin substrate 2 having flexibility is used, a flexible organic electric element can be obtained.

  The resin substrate 2 and the moisture-proof substrate 1 may be bonded together with an appropriate adhesive. The resin substrate 2 may be attached to the moisture-proof substrate 1 by thermocompression bonding. In that case, the adhesive layer 4 may be formed by a part of the resin substrate 2 (part to which adhesiveness is imparted by heat).

  In the organic electric element of FIG. 1, an organic laminate 5 is provided on the surface of the resin substrate 2 in the composite substrate 3 as shown in FIG. 2, and the organic laminate 5 is sealed with a sealing material 7. The surface of the portion of the resin substrate 2 that protrudes from the sealing material 7 is covered with a moisture-proof film 6. As described above, when the resin substrate 2 is not exposed to the outside by being covered with the moisture-proof film 6, it is possible to suppress moisture from entering the inside from the resin substrate 2. Therefore, it becomes difficult for moisture to reach the organic laminate 5 provided inside the sealing region, and deterioration of the element can be effectively reduced. In this embodiment, since the moisture-proof film 6 is formed across the boundary between the resin substrate 2 and the moisture-proof substrate 1, the interface between the resin substrate 2 and the moisture-proof substrate 1 does not communicate with the outside. Therefore, it is possible to suppress moisture from entering through the interface between the resin substrate 2 and the moisture-proof substrate 1 and to suppress deterioration of the element due to moisture penetration.

  In the organic electric element of FIG. 1, the sealing material 7 is formed on the surface of the moisture-proof film 6. That is, the organic laminate 5 is sealed with the sealing material 7 after the moisture-proof film 6 is formed, and the moisture-proof film 6 straddles the edge of the sealing material 7 (the edge of the sealing region). Is formed. As described above, when the moisture-proof film 6 is formed across the edge of the sealing region, the resin substrate 2 can be covered with the moisture-proof film 6 from the outside to the inside of the sealing region. Water intrusion can be suppressed to a higher level. Alternatively, the moisture-proof film 6 may be formed after sealing with the sealing material 7, and the resin substrate 2 protruding from the sealing material 7 may be covered with the moisture-proof film 6.

  The moisture-proof film 6 is lower in moisture permeability than the resin substrate 2. Thereby, it is possible to suppress moisture from entering the resin substrate 2. Therefore, the moisture-proof film 6 can be formed of a material having a moisture permeability lower than that of the resin substrate 2. Moreover, it is preferable that the moisture-proof film 6 has an insulating property. In an organic electric element, it is necessary to provide electrode terminals (plus and minus) for electrical connection with the organic laminate 5, but in that case, the electrode terminals may be provided in contact with the moisture-proof film 6. If it does not have insulation, there is a risk of short circuit. Therefore, the moisture-proof film 6 can be formed of a material having insulating properties and moisture-proof properties.

The moisture-proof film 6 can be formed of, for example, a material mainly containing an inorganic component. Since the inorganic component is the main component, the intrusion of moisture can be suppressed to a high level. The material containing an inorganic component as a main component may contain an organic component or a resin for the purpose of a binder or the like, but more preferably does not contain an organic component or a resin. Thereby, the suppression effect of moisture permeation can be further enhanced. As the inorganic component, for example, at least one selected from SiO ₂ , SiN, MoO ₃ , and SiC can be used. By using these materials, the barrier property against moisture can be improved.

  Moreover, it is also preferable that the moisture-proof film 6 is composed of a glass particle-containing composition or coated glass. The glass particle-containing composition is obtained by dispersing glass particles in a fluid medium. The coated glass is a flowable glass material. The moisture-proof film 6 can be formed by solidifying the flowable glass material or glass composition. If glass is used as the material, the moisture-proof film 8 having low moisture permeability can be easily formed. If the moisture-proof film 6 is a glass material in the case of manufacturing an organic electric element by a method of dividing and individualizing as described later, the material to be divided can be aligned with the glass material, so that individualization is easy. can do.

  The moisture-proof film 6 can also be formed of a moisture-proof resin composition. The moisture-proof resin composition may contain a desiccant or a filler. When a paste-like resin composition is used, the moisture-proof film 8 can be easily formed by coating. As the resin, a thermosetting resin or an ultraviolet curable resin can be used. When using a thermosetting resin, the curing temperature is preferably lower than the heat-resistant temperature of the resin substrate 2. Examples of the thermosetting resin include epoxy resins. Examples of the ultraviolet curable resin include acrylic resins.

  In the organic electric element, it is necessary to provide an electrode terminal for connecting to an external electric wiring in order to pass electricity through the organic laminated body 5 or to take out electricity from the organic laminated body 5. The electrode terminal must be electrically connected to the organic laminate 5 in a region (sealing region) sealed with the sealing material 7 and exposed outside the sealing region. A plurality of electrode terminals (at least two of the anode and the cathode) are necessary to conduct with the anode and the cathode in the organic laminate 5. In the organic electric element of FIG. 1, an electrode terminal is provided by cutting out a part of the moisture-proof film 6, an electrode terminal is provided along the surface of the moisture-proof film 6, or between the moisture-proof film 6 and the moisture-proof substrate 1. An electrode terminal can be provided by protruding from the end. In this case, it is preferable to have a structure in which the resin substrate 2 is not exposed to the outside. If the resin substrate 2 is exposed to the outside, moisture may easily enter from the exposed portion.

  A preferred example of the organic electric element is an organic electroluminescence element (organic EL element). In the organic EL element, the organic stacked body 5 is composed of the organic light emitting stacked body 10 including the first electrode 14, the organic layer 15, and the second electrode 16.

  FIG. 3 shows an example of the organic EL element. In this organic EL element, the composite substrate 3 described above is used as a substrate for forming the organic light emitting laminate 10. The composite substrate 3 includes a moisture-proof substrate 1 and a resin substrate 2 bonded to the surface of the moisture-proof substrate. On the surface of the resin substrate 2 in the composite substrate 3, an organic light emitting laminate 10 having a first electrode 14, an organic layer 15, and a second electrode 16 in this order is provided. The organic light emitting laminate 10 is sealed with a sealing material 7. A region sandwiched between the sealing materials 7 becomes a sealing region.

  The structure of the composite substrate 3 is the same as the structure shown in FIG. That is, the resin substrate 2 is formed smaller than the moisture-proof substrate 1 in plan view. Moreover, the edge part side surface 2b of the resin substrate 2 is formed as an inclined surface inclined inward. Moreover, the corner | angular part 2c of the resin substrate 2 has roundness. In the organic EL element, the portion of the resin substrate 2 that protrudes from the sealing material 7 is covered with a moisture-proof film 6.

  The moisture-proof substrate 1 and the resin substrate 2 are transparent light-transmitting substrates, and the first electrode 14 of the organic light emitting laminate 10 is a transparent light-transmitting electrode. Therefore, light emitted from the organic layer 15 in the organic light emitting laminate 10 is extracted outside through the resin substrate 2 and the moisture-proof substrate 1. Normally, the first electrode 14 constitutes an anode and the second electrode 16 constitutes a cathode, but the reverse may be possible. The second electrode 16 may be a light reflective electrode. In that case, the light generated in the organic layer 15 can be reflected by the second electrode 16 and extracted outside. Alternatively, the second electrode 16 may be a light transmissive electrode, and a reflective layer may be provided on the surface of the second electrode 16 opposite to the organic layer 15.

  The organic layer 15 is a layer having a function of causing light emission, and includes a plurality of layers appropriately selected from a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, an intermediate layer, and the like. It is.

  The sealing material 7 is bonded to the composite substrate 3 by the dam material 18 that surrounds the outer periphery of the organic light emitting laminate 10, the filler 19 that fills the region surrounded by the dam material 18, and the dam material 18 and the filler 19. And the sealing substrate 9 to be formed. The dam material 18 is formed of a moisture-proof material, and is made of, for example, glass or moisture-proof resin. The sealing substrate 9 is formed of a moisture-proof material, and is made of, for example, glass or moisture-proof resin. The filler 19 can be formed of a moisture-proof resin.

  In the organic EL element, the organic light emitting laminate 10 is provided on the surface of the composite substrate 3, and light generated in the organic layer 15 enters the moisture-proof substrate 1 through the first electrode 13 and the resin substrate 2, and then The light is emitted from the moisture-proof substrate 1 to the outside. Therefore, when light passes through the resin substrate 2, more light can be extracted to the outside. The light emitted from the light emitting layer reaches the substrate directly or reflected, but if the refractive index difference at this interface is large, a large amount of light cannot be extracted by total reflection. Here, in the case where the first electrode 14 is directly provided on the surface of the moisture-proof substrate 1, the difference in refractive index increases, and the amount of light extracted outside decreases. Therefore, in this embodiment, the substrate is composed of the composite substrate 3 of the moisture-proof substrate 1 and the resin substrate 2, and the resin substrate 2 having a refractive index close to that of the first electrode 14 is disposed on the light extraction side of the first electrode 14. I am doing so. Therefore, the refractive index difference between the first electrode 14 and the composite substrate 3 can be relaxed, and the total light can be suppressed and the light extraction property can be improved.

  The resin substrate 2 preferably has the same refractive index as that of the first electrode 14 in order to improve the light extraction property. When the refractive index of the resin substrate 2 approaches the refractive index of the first electrode 14, total reflection due to a difference in refractive index can be suppressed. For example, the difference in refractive index between the resin substrate 2 and the first electrode 14 can be made 1 or less. In order to reduce the difference in refractive index, the resin substrate 2 may be formed of a high refractive index plastic base material.

  A light extraction structure may be provided at the interface between the moisture-proof substrate 1 and the resin substrate 2. For example, in the form of FIG. 3, the light diffusion layer 20 is provided as a light extraction structure on the surface of the resin substrate 2 on the moisture-proof substrate 1 side. By providing the light diffusing layer 20, the light incident on the light diffusing layer 20 is diffused to change the traveling direction of the light, so that total reflection can be suppressed and more light can be extracted. The light diffusion layer 20 can be provided by forming surface irregularities or forming a layer containing light diffusion particles. The light extraction structure may be formed by providing fine surface irregularities on the surface of the moisture-proof substrate 1. When fine surface irregularities are provided, light incident on the surface is scattered and the traveling direction of the light changes, so that total reflection is suppressed and more light can be extracted.

  In the organic EL element, a voltage is applied to the first electrode 14 and the second electrode 16, and holes and electrons are combined in the organic layer 15 to cause light emission. Therefore, it is necessary to provide an electrode terminal that is electrically connected to each of the first electrode 14 and the second electrode 16 so as to be drawn outside the sealing region. The electrode terminal is a terminal for electrically connecting to the external electrode. In the form of FIG. 3, an electrode terminal is configured by an electrode lead portion 21 that is electrically connected to each electrode. The electrode lead portion 21 includes a first electrode lead portion 21 a that is electrically connected to the first electrode 14, and a second electrode 16. And a second electrode lead portion 21b that is electrically connected. The first electrode lead portion 21a and the second electrode lead portion 21b are electrically insulated so as not to be short-circuited.

  In this embodiment, the electrode lead-out portion 21 is exposed to the outside as an electrode terminal by cutting out a part of the moisture-proof film 6 or providing a hole that penetrates the moisture-proof film 6 outside the sealing region. Has been. The voltage can be applied by exposing the electrode terminal to the outside. At this time, the electrode terminals are preferably exposed to the outside so that the resin substrate 2 is not exposed to the outside. If the resin substrate 2 is exposed to the outside, moisture may easily enter from the exposed portion. For example, when the moisture-proof film 6 is formed by being laminated, if the moisture-proof film 6 is formed in a pattern that exposes a part of the electrode lead portion 21, the electrode terminal can be exposed and the resin substrate 2 can be formed. The resin substrate 2 can be coated without being exposed.

  In the organic EL element of this embodiment, the portion of the resin substrate 2 that protrudes from the sealing region formed by sealing the sealing material 7 is covered with the moisture-proof film 6. The organic light-emitting laminated body 10 is sandwiched and sealed between a moisture-proof substrate 1 having moisture resistance and a sealing substrate 9, but when the composite substrate 3 has the resin substrate 2, the resin substrate 2. The intrusion of moisture through the wall becomes a problem. That is, when the resin substrate 2 is exposed to the outside, moisture enters the inside of the resin substrate 2 from the exposed portion of the outside, and the entered moisture passes through the resin substrate 2 and the organic layer 15 inside the sealing region. There is a risk of reaching. Therefore, in the organic EL element of this embodiment, the portion that protrudes outside the sealing region of the resin substrate 2 is covered with the moisture-proof film 6. Thereby, since the resin substrate 2 is not exposed to the outside, it is possible to suppress entry of moisture from the outside. The moisture-proof film 6 may be provided at least in the region of the resin substrate 2 exposed to the outside when it is assumed that the moisture-proof film 6 does not exist outside the sealing region. When the resin substrate 2 is not exposed outside the sealing region, the resin substrate 2 is not in direct contact with the external space, so that moisture can be effectively prevented from entering.

  It is preferable that the moisture-proof film 6 covers the boundary portion between the resin substrate 2 and the moisture-proof substrate 1. In that case, since the resin substrate 2 is smaller than the moisture-proof substrate 1 in plan view, the moisture-proof film 6 is formed in contact with the surface 1 a of the outer peripheral end of the moisture-proof substrate 1. If the boundary between the moisture-proof substrate 1 and the resin substrate 2 is exposed to the outside, moisture may enter from the interface between the moisture-proof substrate 1 and the resin substrate 2, but the resin substrate 2 and the moisture-proof substrate. 2 is covered with the moisture-proof film 6, the interface between the moisture-proof substrate 1 and the resin substrate 2 is not exposed to the outside, so that the entry of moisture from the outside can be further suppressed.

  The moisture-proof film 6 need not be provided in the central region of the composite substrate 3 in plan view. The central region of the composite substrate 3 is a region where a light emitting region is formed by providing the organic light emitting laminate 10, and if the moisture-proof film 6 is provided in this portion, the light extraction property may not be improved. . Further, if the moisture-proof film 6 is provided only on the outer peripheral end portion of the composite substrate 3, the moisture-proof film 6 is not formed in the light emitting region, so that the moisture-proof film 6 can be easily formed.

  In the organic EL element of this embodiment, the resin substrate 2 is not exposed to the outside and is blocked from the external space. That is, the surface of the resin substrate 2 opposite to the organic light emitting laminate 10 is covered with the moisture-proof substrate 1 and is blocked from the external space. Further, the surface of the resin substrate 2 on the organic light emitting laminate 10 side is blocked from the external space by sealing the central region with the sealing material 7 in a plan view. Further, the outer peripheral end of the resin substrate 2 outside the sealing region is covered with the prevention film 6 and the electrode lead-out portion 21 at the surface and side surfaces, and is blocked from the external space. Therefore, the resin substrate 2 is not exposed to the outside as a whole. Therefore, the resin substrate 2 does not come into contact with the external space, and it is possible to effectively suppress moisture from entering the resin substrate 2 from the outside.

  Next, a method for manufacturing a composite substrate structure will be described. 4 to 7 show one example of a method for producing the structure of the composite substrate 3.

  The composite substrate 3 may be manufactured by manufacturing the composite substrate 3 itself (the composite substrate 3 as a substrate material on which the organic laminate 5 or the like is not provided), or manufacturing an organic electric element. In doing so, the structure of the composite substrate 3 may be formed. For example, if the structure of the composite substrate 3 is manufactured while individualizing the elements by laminating a plurality of organic laminates 5 on the surface of the substrate and then dividing, the organic electric elements can be formed efficiently.

  In producing the composite substrate 3, a composite plate material in which a moisture-proof plate 11 for forming a plurality of moisture-proof substrates 1 and a resin material 12 for forming a plurality of resin substrates 2 are bonded together with an adhesive layer 4. 13 is used. That is, the composite substrate 3 having a size capable of forming a plurality of organic electric elements is used as the composite plate material 13. For example, the composite substrate 3 can be formed by individually manufacturing a moisture-proof substrate 1 and a resin substrate 2 each having the size of one organic electric element, and bonding them together. Becomes complicated and the production efficiency may be reduced. However, when the composite substrate 3 (composite plate material 13) having a large area is prepared in advance and is individually formed to form the composite substrate 3 of each element, a plurality of composite substrates 3 can be formed simultaneously. The composite substrate 3 can be manufactured efficiently. Further, a plurality of organic laminates 5 are formed on the surface of the large-area composite substrate 3 (composite plate material 13) to form a connection body of elements, and then the composite plate material 13 is cut to form an organic electric element. In this case, since a plurality of elements can be obtained at the same time, an organic electric element can be produced efficiently.

  The structure of the composite substrate 3 is that the resin material 12 of the composite plate material 13 is divided, and the resin dividing and tilting step in which the side surface 2b of the resin substrate 2 formed by being divided is inclined, and the moisture-proof property of dividing the moisture-proof plate material 11 It can be manufactured by a step having a plate cutting step. That is, the moisture-proof board | plate material 11 and the resin material 12 are divided separately in steps. When the moisture-proof board | plate material 11 and the resin material 12 are cut | disconnected in a lump, interface peeling will occur easily between the moisture-proof board | plate material 11 and the resin material 12, and there exists a possibility that a yield may fall. However, by cutting the composite substrate 3 step by step for each material, the stress at the time of cutting can be relaxed, the occurrence of defective cutting can be suppressed, and the yield can be improved. Further, by cutting in stages, the size of the resin substrate 2 can be easily made smaller than the size of the moisture-proof substrate 1. Usually, the resin cutting step is the first cutting step, and the moisture-proof plate cutting step is the second cutting step.

  The form of FIG. 4 is an example in which the structure of the composite substrate 3 is produced by cutting the composite plate material 13 provided with a plurality of organic laminates 5 on the surface.

  FIG. 4A is an example of a resin dividing slope step. The resin material 12 may be divided (cut) by a cutting tool such as a cutter. However, as shown in FIG. 4A, the resin material 12 is cut by a laser beam that irradiates a position where the resin material 12 is cut. Is preferred. Thereby, the resin which comprises the resin material 12 is burned, the resin material 12 is parted, and each resin substrate 2 can be formed. Further, according to laser irradiation, for example, when a glass substrate is used as the moisture-proof substrate 1 (moisture-proof plate material 11), only the resin material 12 is easily cut and the moisture-proof plate material 11 is not cut. can do. Further, since the resin is baked by laser irradiation, the surface of the moisture-proof substrate 1 (moisture-proof plate material 11) can be easily exposed and the resin material 12 can be divided. Further, according to the laser irradiation, the laser L can be easily tapered toward the tip by condensing the laser L, and can be cut with an inclination angle. Therefore, the resin substrate formed by dividing the resin material 12 2 end side surface 2b can be easily inclined at the same time as cutting. Further, since the resin material is burned and divided by laser irradiation, the corner portion 2c of the resin substrate 2 can be easily rounded by heat load. In the case of cutting with a cutter or the like, an inclined surface can be formed by cutting the resin material 12 in an oblique direction with respect to the surface. Further, after the resin material 12 is cut perpendicularly to the surface, a process of making the end side surface 2b an inclined surface or a process of rounding the corners 2c may be performed.

  In the resin dividing slope step, it is preferable that the adhesive layer 4 does not remain in the portion where the resin is divided. In the case of laser irradiation, the adhesive layer 4 can also be burned out simultaneously to remove the adhesive layer 4. When the adhesive layer 4 is removed by cutting with a cutter or the like, the adhesive layer 4 often has a stronger adhesive force to the resin material 12 than the moisture-proof plate material 11, and therefore can be removed together with the resin material 12.

  As shown in FIG.4 (b), it is preferable that the parting groove | channel 8 is formed in the location where the resin material 12 was cut | disconnected as a groove | channel with a width | variety. By forming the dividing groove 8, a gap is formed between the adjacent resin substrates 2, 2, so that the moisture-proof plate 1 can be easily divided. Further, the dividing groove 8 is preferably a groove having a substantially trapezoidal cross section with a width decreasing toward the back of the groove. In the case of a trapezoidal groove, the side surface 2b of the resin base material 2 becomes an inclined surface, and the surface of the moisture-proof plate 11 is exposed. Therefore, when the composite substrate 3 is formed by dividing, the outer periphery of the moisture-proof substrate 1 The surface can be easily exposed.

  After the resin dividing step, it is preferable to perform a residue removing step for removing processing residues generated in the resin dividing step. The processing residue is derived from the resin material 12 and the adhesive layer 4. The removal of the processing residue may be performed by removing at least the processing residue on the surface of the resin material 12 in the vicinity of the dividing groove 8 and the dividing groove 8. If the processing residue remains, there is a risk of causing a device defect. In particular, when the moisture-proof film 6 is formed, if a processing residue remains, there may be a defect such as a hole (pinhole) opened in the moisture-proof film 6, but by removing the processing residue, The moisture-proof film 6 can be reliably formed.

  The residue removing step is preferably performed by gas blowing. It is possible to wash by flowing a liquid. However, in the case of spraying a gas, a treatment such as drying is not necessary as compared with the case of a liquid, and the treatment after the residue removal is simplified. Moreover, it is hard to damage the organic laminated body 5. Therefore, according to the blowing of gas, a processing residue can be easily removed, and a substrate surface suitable for forming the moisture-proof film 6 can be easily formed. Further, the residue can be removed without damaging the organic laminate 5.

  Next, as shown in FIG.4 (c), the moisture-proof board | plate material 11 is cut | disconnected and cut | disconnected with cutting tools, such as scriber S. FIG. At this time, the moisture-proof plate 11 is cut at a position where the resin material 12 is divided (a position where the resin base material 2 is not formed). Cutting with the scriber S may be performed in a direction perpendicular to the substrate surface (the surface of the moisture-proof plate 11). The scriber S is preferably applied to the moisture-proof plate 11 from the surface where the organic laminate 5 is not formed. When it cuts from the surface in which the organic laminated body 5 is formed, there exists a possibility that the organic laminated body 5 may become easy to get dirt and a damage | wound. Thereby, as shown in FIG. 4D, a structure of the composite substrate 3 in which the resin substrate 2 is provided on the surface of the moisture-proof substrate 1 can be obtained. In the form of FIG. 4D, the structure of the composite substrate 3 having the organic laminate 5 provided on the surface is produced.

  The form of FIG. 5 is an example in which the composite substrate 3 itself is manufactured by cutting the composite plate material 13 on which the organic laminate 5 is not provided on the surface. Except that the organic laminate 5 is not provided, the structure of the composite substrate 3 can be formed by a method similar to the method of FIG.

  FIG. 5A shows an example of the resin dividing and tilting step. Similarly to FIG. 4A, the resin material 12 is divided by laser irradiation that irradiates the laser L at a position where the resin material 12 is divided. it can. Thereby, the resin material 12 can be easily divided and the end side surface 2b can be inclined. Moreover, the trapezoidal dividing groove 8 can be easily formed, and the surface of the moisture-proof plate 11 can be exposed. After the resin dividing step, a residue removing step can be performed. Further, the residue removing step can be performed by gas blowing.

  Next, as shown in FIG.5 (c), the moisture-proof board | plate material 1 is cut | disconnected and cut | disconnected with cutting tools, such as scriber S. As shown in FIG. Thereby, as shown in FIG. 5D, a structure of the composite substrate 3 in which the resin substrate 2 is provided on the surface of the moisture-proof substrate 1 can be obtained. In the form of FIG. 5D, a composite substrate 3 that can be used as a substrate material is produced.

  6 is an example in which the structure of the composite substrate 3 in which the outer peripheral end portion of the resin substrate 2 is covered with the moisture-proof film 6 is produced. In this example, the organic laminate 5 is sealed with a sealing material 7. As a specific method of cutting, the structure of the composite substrate 3 can be formed by a method similar to the method of FIG.

  FIG. 6A is an example of the resin dividing and tilting step, and can be performed by laser irradiation that irradiates the laser L to the position where the resin material 12 is divided, as in FIG. 4A. Then, as shown in FIG. 6B, a resin material 12 is divided and a plurality of resin substrates 2 are formed. It is preferable to perform a residue removing step after the resin dividing step. Moreover, it is preferable to perform a residue removal process by spraying of gas.

  Next, as shown in FIG. 6 (c), a moisture-proof film 6 is formed in the part of the dividing groove 8 formed between the adjacent resin substrates 2 and 2 so as to cover the dividing groove 8, and then moisture-proofing is performed. The organic laminate 5 is sealed with a sealing material 7 so as to cover a part of the surface of the film 6.

  As shown in FIG. 6 (c), it is preferable to have a step of coating the outer peripheral end portion of the resin substrate 2 with a moisture-proof film 6 when producing an organic electric element. Accordingly, the resin substrate 2 can be prevented from being exposed to the outside, and moisture can be effectively prevented from entering through the resin substrate 2. If the moisture-proof film 6 is provided so as to straddle the adjacent resin substrates 2 and 2 as in this embodiment, the end of the resin substrate 2 can be efficiently and reliably covered with the moisture-proof film 6.

  Next, as shown in FIG. 6D, the moisture-proof plate 1 is cut and divided by a cutting tool such as a scriber S. Thereby, as shown in FIG.6 (e), the structure of the composite substrate 3 by which the resin substrate 2 was provided in the surface of the moisture-proof board | substrate 1 can be obtained. In the form of FIG. 6 (e), the organic laminated body 5 is sealed, and the outer peripheral end of the resin substrate 2 is covered with the moisture-proof film 6 so that an organic electric element that is not exposed to the outside is obtained.

  Here, in forming an organic electrical element, it is necessary to form the organic laminated body 5 on the surface of the resin substrate 2, and the organic laminated body 5 is formed on the surface of the composite substrate 3 (composite plate material 13) at an appropriate timing. It may be formed.

  For example, as shown in FIGS. 5A and 5B, after the resin material 12 is divided in a state where the organic laminated body 5 is not provided, the organic laminated body 5 is formed in this state, as shown in FIG. 4B. After that, the moisture-proof plate 11 can be cut as shown in FIGS. 4C and 4D.

  Further, as shown in FIGS. 5A and 5B, after the resin material 12 is divided without providing the organic laminate 5, the organic laminate 5 is formed in this state, as shown in FIG. 6B. It may be in any state. Thereafter, according to FIGS. 6C to 6E, the moisture-proof film 6 is formed, the sealing material 7 is sealed, and the moisture-proof plate 11 is cut to form a composite that constitutes a part of the organic electric element. The structure of the substrate 3 can be formed.

  Further, as shown in FIGS. 5A and 5B, after the resin material 12 is divided in a state where the organic laminated body 5 is not provided, the moisture-proof film 6 is formed in this state, and then the organic laminated body 5 is formed. It may be formed. And if the organic laminated body 5 is sealed with the sealing material 7, it will be in the state of FIG.6 (c), and after that, according to FIG.6 (d), (e), the moisture-proof board | plate material 11 is cut | disconnected, and a composite substrate Three structures can be formed. Or you may perform sealing of the organic laminated body 5 after cut | disconnecting the moisture-proof board | plate material 11. FIG.

  By the way, after forming the composite substrate 3 for one element as shown in FIG. 5D, the organic laminate 5 can be formed into the form as shown in FIG. Further, after forming the composite substrate 3 for one element as shown in FIG. 5D, the moisture-proof film 6 and the organic laminate 5 are formed, and further sealed, as shown in FIG. It can also be made into a form. However, the method of cutting the moisture-proof plate 11 after forming the organic laminate 5 can simultaneously form a plurality of organic electric elements, so that the productivity can be improved.

  The form of FIG. 7 is an example in which the structure of the composite substrate 3 is manufactured by dividing an organic EL element coupling body to manufacture an organic EL element. As a specific method of cutting, the structure of the composite substrate 3 can be formed by a method similar to the method of FIG. However, in this embodiment, the laser L is irradiated after the organic laminated body 5 (organic light emitting laminated body 10) is sealed.

  FIG. 7A is an example of a combined organic EL element in which a plurality of organic EL elements are connected. In the organic EL element assembly, the composite plate material 13 has a sealing plate material 17 for forming a plurality of sealing substrates 9 bonded to the surface on the resin material 12 side. In addition, the organic EL element connection body is formed by arranging a plurality of organic light emitting laminates 10 in parallel between the composite plate material 13 and the sealing plate material 17. The parallel may be planar parallel or linear parallel. The composite plate 13 is composed of a moisture-proof plate 11 and a resin material 12. In the organic light emitting laminate 10, a first electrode 14, an organic layer 15, and a second electrode 16 are formed on the surface of the composite plate 13 in this order. A dam material 18 is provided around the outer periphery of the organic light emitting laminate 10, and a region surrounded by the dam material 18 is filled with a filler 19. The composite plate material 17 is bonded to the composite plate material 13 by a dam material 18 and a filler 19. The organic light emitting laminate 10 is sealed by the dam material 18, the filler 19, and the sealing plate material 17. It is possible to manufacture an organic EL element having a form as shown in FIG. 3 by dividing and individualizing such a combined organic EL element.

  FIG.7 (b) is an example of the resin parting inclination process. In the resin dividing and tilting step, similarly to FIG. 4A, it can be performed by laser irradiation that irradiates the laser L to the position where the resin material 12 is divided. At this time, in this embodiment, it is possible to divide the resin material 12 by irradiating the laser L that passes through the sealing plate material 17. Since the laser L is set so as to be focused on the resin material 12, the sealing plate material 17 is not cut. Further, if a glass material is used as the sealing plate material 17, the laser L can be easily transmitted and the resin material 12 can be irradiated. In this embodiment, since the laser L is irradiated after sealing, it is possible to reduce the damage of the organic light emitting laminate 10 due to the processing residue, and it is possible to manufacture the element more safely.

  By irradiation with the laser L, as shown in FIG. 7C, the resin material 12 is divided and a plurality of resin substrates 2 are formed. Between the adjacent resin substrates 2 and 2, a dividing groove 8 is formed in which an end surface (end side surface 2 b) of the resin substrate 2 formed by being divided is an inclined surface. Moreover, the corner | angular part 2c of the resin substrate 2 has roundness. The dividing groove 8 may be the same as that shown in FIG.

  Next, as shown in FIG.7 (c), the moisture-proof board | plate material 11 and the sealing board | plate material 17 are cut | disconnected and cut | disconnected by a cutting tool, such as scriber S, in an appropriate position. The cutting position of the moisture-proof plate 11 can be set to the position of the dividing groove 8. The cutting position of the sealing plate material 17 can be set to the position of the outer edge of the dam material 18 or a position slightly outside it. Thereby, as shown in FIG.7 (d), the individualized organic EL element is obtained. In this organic EL element, a structure of a composite substrate 3 in which a resin substrate 2 is provided on the surface of a moisture-proof substrate 1 is formed.

  Preferably, as shown in FIG. 3, after the state of FIG. 7D, the outer peripheral end portion that protrudes from the sealing region in the resin substrate 2 is covered with a moisture-proof film 6. Thereby, it is possible to prevent the resin substrate 2 from being exposed to the outside by being covered with the moisture-proof film 6 having high moisture resistance. At this time, in the composite substrate 3 of this embodiment, since the end side surface 2b of the resin substrate 2 is an inclined surface, the moisture-proof film 6 can be formed without disconnection. Further, since the end surface 1 a of the moisture-proof substrate 1 is exposed, the resin substrate 2 can be covered with the moisture-proof film 6 so as to cover the boundary portion between the resin substrate 2 and the moisture-proof substrate 1. Thereby, it is possible to effectively prevent moisture from entering the inside through the resin substrate 2 and to form a highly moisture-proof structure. Through the above steps, an organic EL element as shown in FIG. 3 is obtained.

  In addition, although the example which manufactures an organic EL element was shown in FIG. 7, organic electric elements other than an organic EL element can also be manufactured by the same method.

  FIG. 8 is an example of the laser L used in each embodiment described above. The laser L can be condensed by the objective lens 30. At this time, the laser irradiation is preferably performed by condensing the laser L with the objective lens 30 having a numerical aperture of 0.5 or more. Thereby, the laser L is condensed in a conical shape (isosceles cross section), and the laser L can be incident obliquely from both sides with respect to the dividing position on the substrate surface. The cut side surface 2b can be easily formed into an inclined surface. The emission direction of the laser L may be a direction perpendicular to the substrate surface. Even if the laser L travels perpendicularly to the substrate surface, it is condensed toward the focal point by the objective lens 30, so that it is possible to perform a taper process that produces an inclined surface.

  The condensing angle θ of the laser L is preferably 30 degrees or more. When the condensing angle θ is 30 degrees or more, the processing accuracy and processing efficiency of the taper processing are improved, and the inclined surface can be reliably and efficiently formed. The condensing angle θ is an angle at which the outer edge of the laser L is inclined by condensing. As shown in FIG. 8, the angle formed between the traveling direction of the emitted laser L and the outer edge of the laser L condensed by the objective lens 30. It is. Here, the numerical aperture (NA) is expressed by an expression “NA = nSinθ”. In this equation, n is the refractive index of the medium between the lens and the workpiece. In the case of air, the refractive index n = 1. The upper limit of the numerical aperture is as close as possible to 1.0, but may be substantially 0.9 or less or 0.8 or less. Further, the condensing angle θ may be 45 degrees or more, or 60 degrees or more. Further, the condensing angle θ may be 75 degrees or less, 60 degrees or less, or 45 degrees or less.

  FIG. 9 is another example of the embodiment of the structure of the composite substrate 3. The same components as those in the embodiment of FIG.

  In the form of FIG. 9, the end side surface 1 b of the outer periphery of the moisture-proof substrate 1 is formed as an inclined surface that is inclined inward. That is, the moisture-proof substrate 1 has a trapezoidal shape. The inclination angle λ of the side surface 1b of the moisture-proof substrate 1 only needs to be smaller than 90 degrees, and can be 80 degrees or less, 70 degrees or less, or 60 degrees or less. Moreover, since the area | region of the edge part 1b of the moisture-proof board | substrate 1 will spread too much if inclination | tilt angle (lambda) becomes small, it may be 45 degree | times or more, 60 degree | times or more, or 70 degree | times or more. The inclination angle λ is an angle formed between the surface 1d of the moisture-proof substrate 1 opposite to the resin substrate 2 and the end side surface 1b of the moisture-proof substrate 1. When the side surface 1b of the moisture-proof substrate 1 is an inclined surface, the element can be easily attached to the housing of the lighting device.

  In this embodiment, the inclination angle φ at which the side surface 2b of the resin substrate 2 is inclined is preferably smaller than the inclination angle λ at which the side surface 1b of the moisture-proof substrate 1 is inclined. That is, the side surface 2b of the resin substrate 2 is in a state of approaching a sideways fall compared to the side surface 1b of the moisture-proof substrate 1. By making the side surface 2b of the resin substrate 2 an inclined surface with a smaller inclination angle, the moisture-proof film 6 can be formed without being divided when the moisture-proof film 6 is formed.

  The structure of the composite substrate 3 in FIG. 9 is manufactured by processing the side surface 1b of the moisture-proof substrate 1 into an inclined surface after cutting with the scriber S in the method for manufacturing the structure of the composite substrate 3 described above. Can do. Alternatively, it can be produced by cutting the scriber S against the moisture-proof substrate 1 in an oblique direction.

  The structure of the composite substrate 3 in the form of FIG. 9 can be used as a substrate structure of an organic electric element (organic EL element) as in the form of FIG.

DESCRIPTION OF SYMBOLS 1 Moisture-proof substrate 2 Resin substrate 2a Resin substrate surface 2b Resin substrate side surface 2c Resin substrate corner 3 Composite substrate 4 Adhesive layer 5 Organic laminate 6 Moisture-proof film 7 Sealing material 8 Dividing groove 9 Sealing substrate 10 Organic light emission Laminate 11 Moisture-proof plate 12 Resin 13 Composite plate 14 First electrode 15 Organic layer 16 Second electrode 17 Seal plate 18 Dam material 19 Filler 20 Light diffusion layer 21 Electrode extraction portion 30 Objective lens L Laser

Claims (11)

A composite substrate structure including a moisture-proof substrate and a resin substrate bonded to the surface of the moisture-proof substrate,
The resin substrate is formed smaller than the moisture-proof substrate in plan view,
The composite substrate structure is characterized in that an end side surface of the resin substrate is formed as an inclined surface inclined inward.   The composite substrate structure according to claim 1, wherein an end portion of the resin substrate has a rounded corner from a surface to a side surface. An organic laminate is provided on the surface of the resin substrate, and the organic laminate is sealed with a sealing material,
The composite substrate structure according to claim 1 or 2, wherein a portion of the resin substrate that protrudes from the sealing material is covered with a moisture-proof film. A method for producing a composite substrate structure including a moisture-proof substrate and a resin substrate bonded to the surface of the moisture-proof substrate,
Using a composite plate material in which a moisture-proof plate material for forming the plurality of moisture-proof substrates and a resin material for forming the plurality of resin substrates are bonded together, the resin material of the composite plate material is divided and divided A resin-slicing and tilting step in which an end side surface of the resin substrate is formed into an inclined surface;
A method for producing a composite substrate structure, comprising: a moisture-proof plate dividing step of dividing the moisture-proof plate material.   The method for producing a composite substrate structure according to claim 4, further comprising a step of covering an outer peripheral end portion of the resin substrate with a moisture-proof film.   6. The method of manufacturing a composite substrate structure according to claim 4, wherein the resin dividing and tilting step is performed by laser irradiation.   7. The method of manufacturing a composite substrate structure according to claim 6, wherein the laser irradiation is performed by condensing the laser with an objective lens having a numerical aperture of 0.5 or more.   The method for manufacturing a composite substrate structure according to any one of claims 4 to 7, further comprising a residue removing step of removing a processing residue generated by the resin dividing step.   9. The method of manufacturing a composite substrate structure according to claim 8, wherein the residue removing step is performed by gas blowing. The composite plate material is obtained by bonding a sealing plate material for forming a plurality of sealing substrates on the surface on the resin material side,
The resin dividing inclination step is performed by irradiating a laser that passes through the sealing plate material,
The method for producing a composite substrate structure according to claim 4, wherein the sealing plate material is divided in the moisture-proof plate dividing step. An organic light-emitting laminate is provided on the surface of the resin substrate in a composite substrate that includes a moisture-proof substrate and a resin substrate bonded to the surface of the moisture-proof substrate, and the organic light-emitting laminate is sealed An organic electroluminescence element sealed with a material,
The resin substrate is formed smaller than the moisture-proof substrate in plan view,
The side surface of the end portion of the resin substrate is formed as an inclined surface inclined inward,
The portion of the resin substrate that protrudes from the sealing material is covered with a moisture-proof film.

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