JP2013115304A - Charged particle beam lithography apparatus and charged particle beam lithography method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lithography apparatus capable of correcting a position dependent error of shadowing effects caused by an exposure device employing an oblique incidence reflection optical system.SOLUTION: A lithography apparatus 100 comprises a storage device 142, an acquisition section 12, a resizing section 14 and a lithography unit 150. The storage device 142 stores a correction table in which a correction value is defined for correcting a position dependent error of shadowing effects in an exposure device. The exposure device transfers to an exposed substrate a pattern formed on a mask substrate while using reflection light from the mask substrate by making illumination light obliquely incident to the mask substrate. On the mask substrate, the pattern is formed by using an oblique incidence reflection optical system. The acquisition section 12 inputs pattern data in which a position, a shape and a size are defined for each of a plurality of graphics, and acquires a corresponding correction value from the correction table for each graphic based on the position of the graphic. The resizing section 14 uses the correction value for each graphic to resize the graphic. The lithography unit 150 uses a charged particle beam to render the resized graphic on the mask substrate before pattern formation.

Description

  The present invention relates to a charged particle beam drawing apparatus and a charged particle beam drawing method, and, for example, to a technique for resizing a pattern in a drawing apparatus.

  Lithography technology, which is responsible for the progress of miniaturization of semiconductor devices, is an extremely important process for generating a pattern among semiconductor manufacturing processes. In recent years, with the high integration of LSI, circuit line widths required for semiconductor devices have been reduced year by year. In order to form a desired circuit pattern on these semiconductor devices, a highly accurate original pattern (also referred to as a reticle or a mask) is required. Here, the electron beam (electron beam) drawing technique has an essentially excellent resolution, and is used for producing a high-precision original pattern.

FIG. 13 is a conceptual diagram for explaining the operation of the variable shaped electron beam drawing apparatus.
The variable shaped electron beam (EB) drawing apparatus operates as follows. In the first aperture 410, a rectangular opening 411 for forming the electron beam 330 is formed. Further, the second aperture 420 is formed with a variable shaping opening 421 for shaping the electron beam 330 having passed through the opening 411 of the first aperture 410 into a desired rectangular shape. The electron beam 330 irradiated from the charged particle source 430 and passed through the opening 411 of the first aperture 410 is deflected by the deflector, passes through a part of the variable shaping opening 421 of the second aperture 420, and passes through a predetermined range. The sample 340 mounted on a stage that continuously moves in one direction (for example, the X direction) is irradiated. That is, the drawing area of the sample 340 mounted on the stage in which the rectangular shape that can pass through both the opening 411 of the first aperture 410 and the variable shaping opening 421 of the second aperture 420 is continuously moved in the X direction. Drawn on. A method of creating an arbitrary shape by passing both the opening 411 of the first aperture 410 and the variable shaping opening 421 of the second aperture 420 is referred to as a variable shaping method (VSB method).

  In a drawing apparatus, for example, when manufacturing an EUV mask used in an EUV exposure apparatus that obliquely enters EUV (Extreme Ultra-Violet) light and transfers a pattern using a reflection optical system, the pattern is drawn on the EUV mask substrate. (For example, refer to Patent Document 1). In such an exposure apparatus, since the incident light to the mask is obliquely incident, a shadow (shadow wing) is generated depending on the direction of the pattern, and an anisotropic error of the dimension occurs. Since such a shadow wing effect is an anisotropic error, it is difficult to correct it using electron beam dose modulation inside the drawing apparatus. Therefore, the pattern dimensions are corrected in accordance with the pattern direction at the design data stage. In addition, since the shadow wing effect largely depends on the incident angle, the shadow wing effect is generally corrected uniformly by the same correction formula within the mask surface.

  However, the shadow wing effect causes a position-dependent error in the slit of the exposure apparatus although it is minute. With the recent miniaturization of patterns, errors in the position dependency in the slit, and hence the position dependency in the mask surface, cannot be ignored.

JP 2011-198783 A

  As described above, with the recent miniaturization of patterns, for example, when a pattern is transferred by an exposure apparatus using an oblique incidence reflection optical system such as the above-described EUV exposure apparatus, a shadow wing effect occurs. The shadow wing effect causes a position-dependent error in the slit of the exposure apparatus. Such a position-dependent error changes as the exposure apparatus changes. Therefore, it is difficult to correct at the stage of creating design data.

  Accordingly, the present invention provides a drawing apparatus and method capable of overcoming the above-described problems and correcting, in particular, a position-dependent error among shadow wing effects generated in an exposure apparatus using an oblique incidence reflection optical system. With the goal.

A charged particle beam drawing apparatus according to one embodiment of the present invention includes:
Shadow in an exposure apparatus that obliquely enters illumination light onto a mask substrate on which a pattern is formed using an oblique incidence reflection optical system, and transfers the pattern formed on the mask substrate to the exposure substrate using reflected light from the mask substrate. A storage unit for storing a correction table in which a correction value for correcting a position-dependent error of the wing effect is defined;
An input unit that inputs pattern data in which positions, shapes, and sizes are defined for a plurality of figures, and acquires corresponding correction values from the correction table based on the positions of the figures for each figure;
For each figure, using a correction value, the resizing processing unit resizing the figure,
A drawing unit that draws a resized figure on a mask substrate before pattern formation using a charged particle beam;
It is provided with.

The pattern data defines, for each figure, information that identifies whether the side is a movable side that allows movement or a non-movable side that does not allow movement in order to resize a plurality of sides constituting the figure. ,
It is preferable that the resizing processing unit is configured to move to resize the movable side without moving the non-movable side.

  In addition, the resizing processing unit does not move the side extending in the same direction as the incident direction on the mask substrate when the illumination light is obliquely incident on the mask substrate, and resizes the side extending in a direction different from the incident direction. It is preferable to configure to move.

The storage unit stores a plurality of correction tables corresponding to the plurality of exposure apparatuses,
It is preferable to further comprise a selection unit that inputs information for identifying the exposure apparatus and selects a corresponding correction table from the plurality of correction tables according to the input exposure apparatus.

The charged particle beam drawing method of one embodiment of the present invention includes:
Shadow in an exposure apparatus that obliquely enters illumination light onto a mask substrate on which a pattern is formed using an oblique incidence reflection optical system, and transfers the pattern formed on the mask substrate to the exposure substrate using reflected light from the mask substrate. Storing a correction table in which a correction value for correcting a position-dependent error of the wing effect is defined in a storage device;
Inputting pattern data in which positions, shapes and sizes are defined for a plurality of figures, and obtaining corresponding correction values from the correction table based on the positions of the figures for each figure;
For each figure, using the correction value, resizing the figure,
Drawing a resized figure on a mask substrate before pattern formation using a charged particle beam;
It is provided with.

  According to one aspect of the present invention, it is possible to correct a position-dependent error in the shadow wing effect that occurs in an exposure apparatus that uses an oblique incidence reflection optical system. As a result, a highly accurate pattern can be drawn.

1 is a conceptual diagram illustrating a configuration of a drawing apparatus according to Embodiment 1. FIG. 6 is a diagram illustrating an example of a shadow wing effect depending on an incident angle according to Embodiment 1. FIG. 6 is a diagram illustrating a comparative example of a shadow wing effect depending on an incident angle in the first embodiment. FIG. 6 is a conceptual diagram for explaining a shadow wing effect depending on a position in the first embodiment. FIG. 6 is a conceptual diagram illustrating an example of a correction table indicating a position-dependent error of a shadow wing effect according to Embodiment 1. FIG. FIG. 4 is a flowchart showing main steps of the drawing method according to Embodiment 1. 6 is a conceptual diagram illustrating an example of a resizing process of a pattern extending in a direction of 90 degrees with respect to an incident direction in the first embodiment. FIG. 6 is a conceptual diagram illustrating an example of resizing processing of a plurality of patterns connected in a direction of 0 degree with respect to an incident direction in Embodiment 1. FIG. 6 is a conceptual diagram illustrating an example of resizing processing of a plurality of patterns connected in a direction of 135 degrees with respect to an incident direction in Embodiment 1. FIG. 6 is a conceptual diagram illustrating an example of a resizing process of a pattern extending in an arbitrary angle direction excluding an integer multiple of 45 degrees with respect to an incident direction in the first embodiment. FIG. 10 is a conceptual diagram illustrating an example of pattern resizing processing in Embodiment 2. FIG. FIG. 10 is a conceptual diagram showing another example of pattern resizing processing in the second embodiment. It is a conceptual diagram for demonstrating operation | movement of a variable shaping type | mold electron beam drawing apparatus.

  Hereinafter, in the embodiment, a configuration using an electron beam will be described as an example of a charged particle beam. However, the charged particle beam is not limited to an electron beam, and a beam using charged particles such as an ion beam may be used. Further, a variable shaping type drawing apparatus will be described as an example of the charged particle beam apparatus.

Embodiment 1 FIG.
FIG. 1 is a conceptual diagram illustrating a configuration of a drawing apparatus according to the first embodiment. In FIG. 1, the drawing apparatus 100 includes a drawing unit 150 and a control unit 160. The drawing apparatus 100 is an example of a charged particle beam drawing apparatus. In particular, it is an example of a variable shaping type drawing apparatus. The drawing unit 150 includes an electron column 102 and a drawing chamber 103. In the electron column 102, there are an electron gun 201, an illumination lens 202, a first aperture 203, a projection lens 204, a deflector 205, a second aperture 206, an objective lens 207, a main deflector 208, and a sub deflector 209. Has been placed. An XY stage 105 is disposed in the drawing chamber 103. On the XY stage 105, a mask substrate 101 to be drawn at the time of drawing is arranged. The mask substrate 101 includes an exposure mask used in an exposure apparatus using an oblique incidence reflection optical system. For example, an EUV mask is included. Further, the mask substrate 101 includes mask blanks to which a resist is applied and nothing is drawn yet.

  The control unit 160 includes a control computer 110, a memory 112, a control circuit 120, and storage devices 140, 142, and 144 such as a magnetic disk device. The control computer 110, the memory 112, the control circuit 120, and the storage devices 140, 142, and 144 are connected to each other via a bus (not shown).

  In the control computer 110, a selection unit 10, an input unit 11, a correction value P ′ (x) acquisition unit 12, a resize processing unit 14, a determination unit 16, a drawing data processing unit 18, and a drawing control unit 20 are arranged. . Functions such as the selection unit 10, the input unit 11, the correction value P ′ (x) acquisition unit 12, the resizing processing unit 14, the determination unit 16, the drawing data processing unit 18, and the drawing control unit 20 are hardware such as an electric circuit. It may be configured, or may be configured by software such as a program for executing these functions. Alternatively, it may be configured by a combination of hardware and software. Information input to and output from the selection unit 10, input unit 11, correction value P ′ (x) acquisition unit 12, resize processing unit 14, determination unit 16, drawing data processing unit 18, and drawing control unit 20 Is stored in the memory 112 each time. In the resize processing unit 14, a setting unit 30, determination units 32, 34, and 38, and a movement processing unit 36 are arranged. Functions such as the setting unit 30, the determination units 32, 34, and 38 and the movement processing unit 36 may be configured by hardware such as an electric circuit, or may be configured by software such as a program that executes these functions. Good. Alternatively, it may be configured by a combination of hardware and software. Information input / output to / from the setting unit 30, the determination units 32, 34, and 38 and the movement processing unit 36 and information being calculated are stored in the memory 112 each time.

  Here, FIG. 1 shows a configuration necessary for explaining the first embodiment. The drawing apparatus 100 may normally have other necessary configurations. For example, the main deflector 208 and the sub-deflector 209, which are the main and sub two-stage multi-stage deflectors, are used for position deflection, but the position deflection is performed by one stage deflector or three or more stages of multi-stage deflectors. It may be the case.

  In the storage device 140 (storage unit), pattern data (drawing data) composed of a plurality of graphic patterns is input from the outside and stored. The pattern data defines data such as the shape, arrangement coordinates, and size of each figure. The pattern data further defines an identifier for identifying a movable side that may be moved and a non-movable side that is allowed to move when performing a resizing process to be described later for each figure.

  FIG. 2 is a diagram showing an example of the shadow wing effect depending on the incident angle in the first embodiment. FIG. 2 shows an example of a 1: 1 line and space pattern arranged in the x direction. Further, FIG. 2 shows a case where the illumination light is irradiated obliquely from above on the mask on which the pattern is formed by the oblique incidence reflection optical system exposure apparatus, and the x direction is the illumination light incident direction on the mask. Yes. In such a case, the illumination light applied to the space portion is partially blocked by the pattern having the thickness d in front, and a shadow is formed on the space portion. Therefore, an error occurs in the dimension L1 that is actually exposed with respect to the design dimension L of the space portion (the main effect of the shadow wing effect). The difference (error) between the design dimension L of the space portion and the actually exposed dimension L1 is defined as Δ = L−L1 = 2d · tan θ · s, where s is the reduction ratio of the exposure apparatus. Thus, it can be seen that the main effect Se of the shadow wing effect causes a dimensional variation of −2d · tan θ · s.

  FIG. 3 is a diagram showing a comparative example of the shadow wing effect depending on the incident angle in the first embodiment. FIG. 3 shows an example of a 1: 1 line and space pattern arranged in the y direction. Further, FIG. 3 shows a case where the illumination light is irradiated obliquely from above on the mask on which the pattern is formed by the oblique incidence reflection optical system exposure apparatus, and the x direction is the illumination light incident direction on the mask. Yes. In such a case, the illumination light applied to the space portion is not blocked by the pattern having the thickness d. Therefore, no shadow is generated, and no error as a main effect of the shadow wing effect occurs in the dimension L2 that is actually exposed with respect to the design dimension L of the space portion.

  Thus, the main effect of the shadow wing effect depends on the thickness d of the pattern formed on the mask and the incident angle θ of the illumination light. However, in addition to the main effect, the shadow wing effect has a position-dependent error P (x) unique to the exposure apparatus.

  FIG. 4 is a conceptual diagram for explaining the shadow wing effect depending on the position in the first embodiment. In the exposure apparatus 500 (scanner) using the oblique incidence reflection optical system, the illumination light is obliquely incident on the mask substrate 101 on which the pattern is formed using the oblique incidence reflection optical system, and the reflected light from the mask substrate 101 is used. The pattern formed on the mask substrate 101 is transferred to the substrate to be exposed. In such an exposure apparatus 500 (scanner), the illumination light from the light source 502 is irradiated obliquely from above to the substrate 101 serving as a mask as described above. For example, irradiation is performed obliquely from above so that the x direction on the substrate 101 is the incident direction of illumination light (for example, the x direction). In general, the pattern is transferred to a semiconductor substrate such as a wafer by scanning and moving in a direction orthogonal to the incident direction (for example, the y direction). At this time, the transferred pattern has an error P (x) depending on the position in the illumination slit extending in the same direction as the incident direction of the exposure apparatus 500 with respect to the design dimension. If the error P (x) = 0 at the center position of the slit, for example, a negative (−) error at a position on the near side (− side) in the incident direction, for example, at a position on the back side (+ side) in the incident direction. A positive (+) error occurs. In this way, an error of an amount proportional to the position with respect to the incident direction occurs.

  As described above, the shadow wing effect generated in the exposure apparatus 500 (scanner) using the oblique incidence reflection optical system is the main effect Se + position-dependent error P (x) described above. Since the main effect Se of the shadow wing effect does not depend on the apparatus, it may be corrected at the design stage. Alternatively, the drawing apparatus 100 may input the correction value of the main effect Se and correct it together with the position-dependent error P (x). In the first embodiment, among the main effects Se and the position-dependent error P (x) described above, the case where the position-dependent error P (x) unique to the apparatus is corrected will be described. When the main effect Se is also corrected, the position-dependent error P (x) may be read as a value obtained by adding the value of the main effect Se to the position-dependent error P (x).

  First, in the first embodiment, a correction table for the position-dependent error P (x) is created in advance before starting the drawing process. Each correction value may be obtained in advance by simulation or experiment.

  FIG. 5 is a conceptual diagram showing an example of a correction table showing the position-dependent error of the shadow wing effect in the first embodiment. In FIG. 5, in the correction table 50 indicating the position-dependent error of the shadow wing effect, the correlation (correlation data) between the position x and the correction value P ′ (x) for correcting the position-dependent error P (x) is defined. Is done. Alternatively, a function P ′ (x) depending on the position x indicating a correction value P ′ (x) for correcting the position-dependent error P (x) may be defined as a correction table (or correlation function). Such a correction table 50 is created for each exposure apparatus 500 with respect to a plurality of exposure apparatuses 500 (scanners) using an oblique incidence reflection optical system, and the plurality of correction tables can be identified by the corresponding exposure apparatuses 500. Are stored (stored) in the storage device 142 (storage unit). Here, x represents a position in the direction of the incident direction of the illumination light on the substrate 101.

  FIG. 6 is a flowchart showing main steps of the drawing method according to the first embodiment. 6, the drawing method according to the first embodiment includes a scanner selection step (S102), a pattern data input step (S104), a correction value P ′ (x) acquisition step (S106), and a resize processing step (S108). Then, a series of steps of a determination step (S120), a shot data generation step (S122), and a drawing step (S124) are performed. Further, as an internal process of the resizing process (S108), a series of a side setting process (S110), a determination process (S112), a determination process (S114), a side movement process (S116), and a determination process (S118). The process of is implemented.

  In the scanner selection step (S102), the selection unit 10 inputs information for identifying the exposure apparatus 500, and performs a corresponding correction from a plurality of correction tables stored in the storage device 142 in accordance with the input exposure apparatus 500. Select a table. The information for identifying the exposure apparatus 500 is information for identifying the exposure apparatus 500 that uses the substrate 100 to be drawn this time as a mask in the drawing apparatus 100.

  As the pattern data input step (S104), the input unit 11 inputs pattern data from the storage device 140. Here, data may be input for each figure, or data of a plurality of figures may be input collectively.

  As the correction value P ′ (x) acquisition step (S106), the correction value P ′ (x) acquisition unit 12 inputs pattern data in which positions, shapes, and sizes are defined for a plurality of figures, and for each figure, Based on the position of the figure, the corresponding correction value is acquired from the selected correction table. The P ′ (x) acquisition unit 12 is an example of an acquisition unit. Specifically, the position x of the figure is acquired from the arrangement coordinates of the figure indicated by the input pattern data, and the correction value P ′ (x) corresponding to the position x is referenced with reference to the selected correction table 50. To get.

  As the resizing processing step (S108), the resizing processing unit 14 resizes the figure using the acquired correction value P '(x) for each figure. The contents of the resizing process are shown below.

  As the side setting step (S110), the setting unit 30 selects one of a plurality of sides constituting the graphic to be resized and sets it as the resize target.

  As a determination step (S112), the determination unit 32 determines whether the set side is a side having an angle of 0 degrees with respect to the incident direction of the illumination light in the exposure apparatus 500. In other words, it is determined whether the side extends in the incident direction (x direction). In the case of a side with an angle of 0 degrees, the process proceeds to the determination step (S118). If it is not a side with an angle of 0 degrees, the process proceeds to the determination step (S114).

  As a determination step (S114), the determination unit 34 determines whether or not the set side is a movable side that permits movement in order to resize. As described above, in the pattern data, for each figure, information for identifying whether the side is a movable side that allows movement or a non-movable side that does not allow movement in order to resize a plurality of sides constituting the figure. Is defined. Therefore, the determination unit 34 may refer to such information and determine whether the set side is a movable side that permits movement in order to resize. When the said side is a movable side, it progresses to a side movement process (S116). When the said side is not a movable side, it progresses to determination process (S118).

  As the side movement step (S116), the movement processing unit 36 does not move the non-moving side, but the correction value P ′ (x) acquired by the correction value P ′ (x) acquisition step (S106) for the movable side. Move to resize based on.

  As a determination step (S118), the determination unit 38 determines whether all sides of the graphic have been completed. When all sides are completed, the process proceeds to the determination step (S120). If all sides are not completed, the process returns to the side setting step (S110). Then, the next side is set in the side setting step (S110). Then, the process from the side setting step (S110) to the determination step (S118) is repeated until all sides are completed. Specifically, the sides are moved as follows.

  FIG. 7 is a conceptual diagram showing an example of a resizing process of a pattern extending in a direction of 90 degrees with respect to the incident direction in the first embodiment. In FIG. 7B, the drawing is scheduled at a position 53 on the near side with respect to the incident direction (for example, the x direction) of the illumination light of the exposure apparatus 500 on the drawing region 52 of the substrate 101 shown in FIG. The case where the figure 60 is resized is shown. As shown in FIG. 7B, the figure 60 is an example of a rectangular pattern extending long in a direction (y direction) of 90 degrees with respect to the incident direction (x direction). The figure 60 is composed of four sides 62, 64, 66 and 68. The sides 62 and 66 are sides having an angle of 0 degrees with respect to the incident direction. The sides 62 and 66 are defined as non-moving sides. The sides 64 and 68 are sides having an angle of 90 degrees with respect to the incident direction. Sides 64 and 68 are defined as movable sides. In such a case, the movement processing unit 36 does not move the sides of the non-moving sides 62 and 66. The movement processing unit 36 moves the sides in order to resize the movable sides 64 and 68. The side is moved by one half of the obtained correction value P ′ (x) with respect to one side. In the example of FIG. 7B, the movable side 64 is moved to the −x side, and the movable side 68 is moved to the + x side by 1/2 of the correction value P ′ (x). Thereby, it is possible to resize the two sides 64 and 68 constituting the dimension in the x direction by the correction value P ′ (x). 7B is drawn at a position 53 on the near side with respect to the incident direction (for example, the x direction), the position dependent error P (x) has a negative (−) value, for example. Become. Therefore, the correction value P ′ (x) is a positive (+) value having a reverse polarity so as to correct the position-dependent error P (x).

  On the other hand, in FIG.7 (c), it draws in the position 54 of the back | inner side with respect to the incident direction (for example, x direction) of the illumination light of the exposure apparatus 500 on the drawing area | region 52 of the board | substrate 101 shown to Fig.7 (a). The case of resizing the planned figure 60 is shown. Since the figure 60 shown in FIG. 7C is drawn at a position 54 on the back side with respect to the incident direction (for example, the x direction), the position-dependent error P (x) is, for example, a positive (+) value. Therefore, the correction value P ′ (x) is a negative (−) value having a reverse polarity so as to correct the position-dependent error P (x). Therefore, the movement processing unit 36 does not move the sides of the non-moving sides 62 and 66. The movement processing unit 36 moves the sides in order to resize the movable sides 64 and 68. In the example of FIG. 7C, the movable side 64 is moved to the + x side, and the movable side 68 is moved to the −x side by 1/2 of the correction value P ′ (x). Thereby, it is possible to resize the two sides 64 and 68 constituting the dimension in the x direction by the correction value P ′ (x).

  FIG. 8 is a conceptual diagram showing an example of resizing processing of a plurality of patterns connected in a direction of 0 degrees with respect to the incident direction in the first embodiment. In FIG. 8B, the drawing is scheduled at a position 53 on the near side with respect to the incident direction (for example, the x direction) of the illumination light of the exposure apparatus 500 on the drawing region 52 of the substrate 101 shown in FIG. A case is shown in which three figures 69, 70, 71 are resized. As shown in FIG. 8B, the figure 69 is an example of a rectangular pattern extending long in the direction of 0 degrees with respect to the incident direction (x direction). The figure 69 is composed of four sides 58, 59, 75 and 78. The sides 58 and 59 are sides having an angle of 0 degrees with respect to the incident direction. Sides 58 and 59 are defined as movable sides. The sides 75 and 78 are sides having an angle of 90 degrees with respect to the incident direction. Sides 75 and 78 are defined as non-moving sides.

  The figure 70 is composed of four sides 72, 74, 76 and 78. The side 78 is shared with the graphic 69. The sides 72 and 76 are sides having an angle of 0 degrees with respect to the incident direction. Further, the sides 72 and 76 are defined as movable sides. The sides 74 and 78 are sides having an angle of 90 degrees with respect to the incident direction. The side 74 is defined as a movable side. Side 78 is defined as a non-moving side.

  The figure 71 is composed of four sides 73, 75, 77 and 79. The side 75 is shared with the figure 69. The sides 73 and 77 are sides having an angle of 0 degrees with respect to the incident direction. Sides 73 and 77 are defined as movable sides. The sides 75 and 79 are sides having an angle of 90 degrees with respect to the incident direction. The side 79 is defined as a movable side. Side 75 is defined as a non-moving side.

  In this case, the movement processing unit 36 does not move the side of the graphic 69 because the movable sides 58 and 59 are sides with an angle of 0 degrees with respect to the incident direction (x direction). Also, since the sides 75 and 78 are immovable sides, the sides are not moved. Therefore, the figure 69 is not resized.

  Further, the movement processing unit 36 does not move the side of the figure 70 because the movable sides 72 and 76 are sides with an angle of 0 degrees with respect to the incident direction (x direction). Further, since the side 78 is a non-moving side, the side is not moved. However, since the movable side 74 is a side having an angle of 90 degrees with respect to the incident direction (x direction), the movable side 74 is moved by a value that is ½ of the acquired correction value P ′ (x). Since the graphic 70 shown in FIG. 8B is drawn at a position 53 on the near side with respect to the incident direction (for example, the x direction), the position-dependent error P (x) has a negative (−) value, for example. Therefore, the correction value P ′ (x) is a positive (+) value having a reverse polarity so as to correct the position-dependent error P (x). Therefore, in the example of FIG. 8B, the movable side 74 is moved to the −x side by ½ of the correction value P ′ (x).

  Further, the movement processing unit 36 does not move the side of the graphic 71 because the movable sides 73 and 77 are sides with an angle of 0 degrees with respect to the incident direction (x direction). Also, since the side 75 is a non-moving side, the side is not moved. However, since the movable side 79 is a side having an angle of 90 degrees with respect to the incident direction (x direction), the movable side 79 is moved by a value half that of the acquired correction value P ′ (x). Since the graphic 71 shown in FIG. 8B is drawn at a position 53 on the near side with respect to the incident direction (for example, the x direction), the position-dependent error P (x) is, for example, a negative (−) value. Therefore, the correction value P ′ (x) is a positive (+) value having a reverse polarity so as to correct the position-dependent error P (x). Therefore, in the example of FIG. 8B, the movable side 79 is moved to the + x side by ½ of the correction value P ′ (x).

  With the above resizing process, the figure 70 can be resized by the correction value P ′ (x) for the side 74 out of the two sides 74 and 78 constituting the dimension in the x direction. Further, it is possible to resize the figure 71 by the correction value P ′ (x) for the side 79 out of the two sides 75 and 79 constituting the dimension in the x direction. As a result, the three graphics 69, 70, 71 connected in the direction of 0 degrees with respect to the incident direction can be resized without a gap between the graphics and without an overlapping region.

  FIG. 9 is a conceptual diagram illustrating an example of resizing processing of a plurality of patterns connected in a direction of 135 degrees with respect to the incident direction in the first embodiment. In FIG. 9B, the drawing is scheduled at a position 53 on the near side with respect to the incident direction (for example, the x direction) of the illumination light of the exposure apparatus 500 on the drawing region 52 of the substrate 101 shown in FIG. 9A. In this example, resizing is performed on a parallelogram (figure 80) and a right-angled isosceles triangle (figure 87) connected to the parallelogram (figure 80). As shown in FIG. 9B, the figure 80 is an example of a parallelogram pattern extending long in a direction (y direction) of 90 degrees with respect to the incident direction (x direction). The figure 80 is composed of four sides 83, 86, 84, 85, that is, bases 83, 86 and hypotenuses 84, 85. The sides 83 and 86 are sides having an angle of 0 degrees with respect to the direction of the incident direction. Further, the side 86 is defined as a movable side. Further, the side 83 is defined as a non-moving side. The sides 84 and 85 are sides having an angle of 135 degrees with respect to the direction of the incident direction. The sides 84 and 85 are defined as movable sides.

  The figure 87 includes three sides 81, 82, and 83, which are two sides 81 and 83 that are orthogonal to each other and a hypotenuse 82. The side 83 is shared with the figure 80. The side 83 is a side having an angle of 0 degrees with respect to the incident direction. Further, the side 83 is defined as a non-moving side. The side 81 is a side having an angle of 90 degrees with respect to the incident direction. The side 81 is defined as a movable side. The side 82 is a side having an angle of 135 degrees with respect to the incident direction. The side 82 is defined as a movable side.

  In this case, the movement processing unit 36 does not move the side of the graphic 80 because the movable side 86 is a side having an angle of 0 degrees with respect to the incident direction (x direction). Since the side 83 is a non-moving side, the side is not moved. However, since the movable sides 84 and 85 are sides having an angle of 135 degrees with respect to the incident direction (x direction), the movable sides 84 and 85 are moved by a value half that of the acquired correction value P ′ (x). Since the figure 80 shown in FIG. 9B is drawn at a position 53 on the near side with respect to the incident direction (for example, the x direction), the position-dependent error P (x) has a negative (−) value, for example. Therefore, the correction value P ′ (x) is a positive (+) value having a reverse polarity so as to correct the position-dependent error P (x). Therefore, in the example of FIG. 9B, the movable side 84 is moved to the −x side, and the movable side 85 is moved to the + x side by 1/2 of the correction value P ′ (x).

  The movement processing unit 36 does not move the side of the graphic 87 because the side 83 is a non-moving side. However, since the movable sides 81 and 82 are sides with an angle of 90 degrees and an angle of 135 degrees with respect to the incident direction (x direction), they are ½ of the acquired correction value P ′ (x). Move by value. Since the figure 87 shown in FIG. 8B is drawn at a position 53 on the near side with respect to the incident direction (for example, the x direction), the position-dependent error P (x) has a negative (−) value, for example. Therefore, the correction value P ′ (x) is a positive (+) value having a reverse polarity so as to correct the position-dependent error P (x). Therefore, in the example of FIG. 9B, the movable side 81 is moved to the −x side, and the movable side 82 is moved to the + x side by 1/2 of the correction value P ′ (x).

  With the above resizing processing, the figure 80 can be resized by the correction value P ′ (x) for each of the two sides 84 and 85 constituting the dimension in the x direction. Further, the figure 87 can be resized by the correction value P ′ (x) for each of the two sides 81 and 82 constituting the dimension in the x direction. As a result, the two graphics 80 and 87 connected in the direction of 135 degrees with respect to the incident direction can be resized without a gap between the graphics and without an overlapping region.

  FIG. 10 is a conceptual diagram illustrating an example of a resizing process of a pattern extending in an arbitrary angle direction excluding an integer multiple of 45 degrees with respect to the incident direction in the first embodiment. An arbitrary angle pattern excluding an integer multiple of 45 degrees is divided into a plurality of patterns having an angle of an integer multiple of 45 degrees before being input to the drawing apparatus 100. In the example of FIG. 10, as illustrated in FIG. 10B, an example is illustrated in which the image is divided into a plurality of rectangles (graphics 91, 93, 95, and 96) that are slightly shifted in the x method. The upper rectangle (graphic 91) shares a stationary side 98a with an angle of 0 degrees with respect to the incident rectangle (graphic 93). Further, the rectangle (figure 93) shares a fixed side 98b with an angle of 0 degrees with respect to the incident direction with the following rectangle (figure 95). Further, the rectangle (figure 95) shares a non-moving side 98c with an angle of 0 degrees with respect to the incident direction with the following rectangle (figure 96). A plurality of rectangles (figures 91, 93, 95, 96) are in front of the incident direction (for example, the x direction) of the illumination light of the exposure apparatus 500 on the drawing region 52 of the substrate 101 as shown in FIG. A case where drawing is performed at the position 53 on the side is shown.

  As shown in FIG. 10B, the figures 91, 93, 95, and 96 are all examples of a rectangular pattern that extends long in the direction of 0 degrees with respect to the incident direction (x direction).

  The figure 91 is composed of four sides 92a, 94a, 97, and 98a. The sides 97 and 98a are sides having an angle of 0 degrees with respect to the incident direction. The side 98a is defined as a non-moving side. Side 97 is defined as a movable side. The sides 92a and 94a are sides having an angle of 90 degrees with respect to the incident direction. The sides 92a and 94a are defined as movable sides.

  The figure 93 includes four sides 92b, 94b, 98a, and 98b. The sides 98a and 98b are sides having an angle of 0 degrees with respect to the incident direction. Also, the sides 98a and 98b are defined as non-moving sides. The sides 92b and 94b are sides having an angle of 90 degrees with respect to the incident direction. The sides 92b and 94b are defined as movable sides.

  The figure 95 is composed of four sides 92c, 94c, 98b, and 98c. The sides 98b and 98c are sides having an angle of 0 degrees with respect to the incident direction. The sides 98b and 98c are defined as non-moving sides. The sides 92c and 94c are sides having an angle of 90 degrees with respect to the incident direction. The sides 92c and 94c are defined as movable sides.

  The figure 96 is composed of four sides 92d, 94d, 98c, and 98d. The sides 98c and 98d are sides having an angle of 0 degrees with respect to the incident direction. The side 98c is defined as a non-moving side. The side 98d is defined as a movable side. The sides 92d and 94d are sides having an angle of 90 degrees with respect to the incident direction. The sides 92d and 94d are defined as movable sides.

  In this case, the movement processing unit 36 does not move the side of the graphic 91 because the movable side 97 is a side having an angle of 0 degrees with respect to the incident direction (x direction). Since the side 98a is a non-moving side, the side is not moved. However, since the movable sides 92a and 94a are sides having an angle of 90 degrees with respect to the incident direction (x direction), the movable sides 92a and 94a are moved by a value half that of the acquired correction value P ′ (x). Since the figure 91 shown in FIG. 10B is drawn at a position 53 on the near side with respect to the incident direction (for example, the x direction), the position-dependent error P (x) has a negative (−) value, for example. Therefore, the correction value P ′ (x) is a positive (+) value having a reverse polarity so as to correct the position-dependent error P (x). Therefore, in the example of FIG. 10B, the movable side 92a is moved to the −x side, and the movable side 94a is moved to the + x side by 1/2 of the correction value P ′ (x).

  Further, the movement processing unit 36 does not move the sides of the graphic 93 because the sides 98a and 98b are non-moving sides. However, since the movable sides 92b and 94b are sides having an angle of 90 degrees with respect to the incident direction (x direction), the movable sides 92b and 94b are moved by a value that is ½ of the acquired correction value P ′ (x). Since the figure 93 shown in FIG. 10B is drawn at a position 53 on the near side with respect to the incident direction (for example, the x direction), the position-dependent error P (x) has a negative (−) value, for example. Therefore, the correction value P ′ (x) is a positive (+) value having a reverse polarity so as to correct the position-dependent error P (x). Therefore, in the example of FIG. 10B, the movable side 92b is moved to the −x side, and the movable side 94b is moved to the + x side by 1/2 of the correction value P ′ (x).

  The movement processing unit 36 does not move the sides of the graphic 95 because the sides 98b and 98c are non-moving sides. However, since the movable sides 92c and 94c are sides having an angle of 90 degrees with respect to the incident direction (x direction), the movable sides 92c and 94c are moved by a value that is ½ of the acquired correction value P ′ (x). Since the figure 95 shown in FIG. 10B is drawn at a position 53 on the near side with respect to the incident direction (for example, the x direction), the position-dependent error P (x) has a negative (−) value, for example. Therefore, the correction value P ′ (x) is a positive (+) value having a reverse polarity so as to correct the position-dependent error P (x). Therefore, in the example of FIG. 10B, the movable side 92c is moved to the −x side, and the movable side 94c is moved to the + x side by 1/2 of the correction value P ′ (x).

  Further, the movement processing unit 36 does not move the side of the figure 96 because the movable side 98d is a side having an angle of 0 degrees with respect to the incident direction (x direction). Since the side 98c is a non-moving side, the side is not moved. However, since the movable sides 92d and 94d are sides having an angle of 90 degrees with respect to the incident direction (x direction), the movable sides 92d and 94d are moved by a value half that of the acquired correction value P ′ (x). Since the figure 96 shown in FIG. 10B is drawn at a position 53 on the near side with respect to the incident direction (for example, the x direction), the position-dependent error P (x) has a negative (−) value, for example. Therefore, the correction value P ′ (x) is a positive (+) value having a reverse polarity so as to correct the position-dependent error P (x). Therefore, in the example of FIG. 10B, the movable side 92d is moved to the −x side, and the movable side 94d is moved to the + x side by 1/2 of the correction value P ′ (x).

  As described above, the resize processing unit 14 does not move on the side extending in the same direction as the incident direction on the mask substrate when the illumination light is incident obliquely on the mask substrate, and on the side extending in a direction different from the incident direction. Move to resize. And when moving a side, 1/2 of the acquired correction value is moved.

  As a determination step (S120), the determination unit 16 determines whether or not the processing has been completed for all the figures. If all the figures have been completed, the process proceeds to the shot data generation step (S122). If all the figures have not been completed, the process returns to the pattern data input step (S104). Then, the process from the pattern data input process (S104) to the determination process (S120) is repeated until all figures are finished.

  As described above, the position-dependent error P (x) unique to the apparatus of the shadow wing effect can be corrected. By correcting the position-dependent error P (x) inherent to the exposure apparatus 500 with the drawing apparatus 100, the pattern data (drawing data) can be reused.

  As the shot data generation step (S122), the drawing data processing unit 18 performs a plurality of stages of data conversion processing on the resized graphic data to generate shot data for the drawing apparatus 100. In order to draw a figure pattern by the drawing apparatus 100, it is necessary to divide each figure pattern defined in the pattern data (drawing data) into a size that can be irradiated with one beam shot. Therefore, the drawing data processing unit 18 divides each resized graphic pattern into a size that can be irradiated with one shot of the beam to generate a shot graphic for actual drawing. Then, shot data is generated for each shot figure. In the shot data, for example, graphic data such as a graphic type, a graphic size, and an irradiation position are defined. The generated shot data is stored in the storage device 144.

  As the drawing step (S124), the control circuit 120 controlled by the drawing control unit 20 inputs shot data from the storage device 144 and controls the drawing unit 150. The drawing unit 150 uses the electron beam 200 to perform patterning. The resized figure is drawn on the mask substrate 101 before formation. Specifically, it operates as follows.

  The electron beam 200 emitted from the electron gun 201 (emission unit) illuminates the entire first aperture 203 having a rectangular hole, for example, a rectangular hole, by the illumination lens 202. Here, the electron beam 200 is first formed into a rectangle, for example, a rectangle. Then, the electron beam 200 of the first aperture image that has passed through the first aperture 203 is projected onto the second aperture 206 by the projection lens 204. The deflector 205 controls the deflection of the first aperture image on the second aperture 206, and can change (variably shape) the beam shape and dimensions. The electron beam 200 of the second aperture image that has passed through the second aperture 206 is focused by the objective lens 207, deflected by the main deflector 208 and the sub deflector 209, and continuously moved. The desired position of the sample 101 arranged in the above is irradiated. FIG. 1 shows a case in which multi-stage deflection of main and sub two stages is used for position deflection. In such a case, the electron beam 200 of the corresponding shot is deflected while following the stage movement to the reference position of the sub-field (SF) where the stripe region is further virtually divided by the main deflector 208, and the sub-deflector 209 deflects the inside of the SF. What is necessary is just to deflect the beam of the shot concerning each irradiation position.

  As described above, according to the first embodiment, it is possible to correct the position dependency error in the shadow wing effect generated in the exposure apparatus using the oblique incidence reflection optical system. As a result, a highly accurate pattern can be drawn.

Embodiment 2. FIG.
In the first embodiment, the case where an identifier for identifying a movable side that may be moved and a non-moving side that is not moved when performing a resizing process to be described later is defined for each pattern in the pattern data. In the second embodiment, a case will be described in which information about the resize direction is further added for each movable side. The points not particularly described below are the same as those in the first embodiment.

  FIG. 11 is a conceptual diagram illustrating an example of pattern resizing processing according to the second embodiment. FIG. 11 shows a pattern in which two rectangles long in the x direction are arranged at upper and lower positions so as to be sandwiched between rectangles at both ends long in the y direction. In such a case, the left sides of the two rectangles that are long in the x direction are shared with a part of the right side of the rectangle that is long in the y direction on the left side. Similarly, the right sides of two rectangles long in the x direction are shared with a part of the left side of the rectangle long in the y direction on the right side. For each of these figures, when the movable side is moved by a value half that of the correction value P ′ (x) acquired in the x direction, the left and right sides of the rectangle that is long in the y direction are both shown as dotted lines. The side may be moved to the thicker side (positive (+) side). However, it is necessary to move the movable sides 301 and 302 corresponding to the left sides of the two rectangles long in the x direction on the opposite side (negative (−) side). Similarly, it is necessary to move the movable sides 303 and 304 corresponding to the right sides of two rectangles long in the x direction on the opposite side (negative (−) side). Therefore, in the second embodiment, in addition to the identifier for identifying the movable side and the non-movable side, information on the resizing direction for each movable side is added to the pattern data. In the resizing direction, positive (+) information may be defined when the size is increased, and negative (−) information may be defined when the size is decreased. When the side is moved, the movement processing unit 36 moves the movable side by a half of the correction value P ′ (x) according to the resizing direction.

  FIG. 12 is a conceptual diagram illustrating another example of the pattern resizing process according to the second embodiment. FIG. 12 shows a pattern in which right triangles sharing a base extending in the y direction of a parallelogram as a side in the height direction are arranged. In such a case, the height side of the right triangle needs to be moved by a value that is ½ of the correction value P ′ (x) acquired in the x direction, as indicated by the dotted line. However, for the parallelogram, the movable side 305 serving as the bottom side needs to be moved to the side to be narrowed (negative (−) side). Therefore, the movement processing unit 36 moves the movable side by a half of the correction value P ′ (x) according to the resizing direction when the side is moved. With this configuration, the parallelogram movable side 305 can be moved to the narrowing side (negative (−) side).

  The embodiments have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. The exposure apparatus using the oblique incidence reflection optical system is not limited to the EUV exposure apparatus, and may be an exposure apparatus using another oblique incidence reflection optical system.

  In addition, although descriptions are omitted for parts and the like that are not directly required for the description of the present invention, such as a device configuration and a control method, a required device configuration and a control method can be appropriately selected and used. For example, although the description of the control unit configuration for controlling the drawing apparatus 100 is omitted, it goes without saying that the required control unit configuration is appropriately selected and used.

  In addition, all charged particle beam writing apparatuses and methods that include elements of the present invention and that can be appropriately modified by those skilled in the art are included in the scope of the present invention.

DESCRIPTION OF SYMBOLS 10 Selection part 11 Input part 12 P '(x) acquisition part 14 Resize processing part 16 Determination part 18 Drawing data processing part 20 Drawing control part 30 Setting part 32,34,38 Determination part 36 Movement processing part 50 Correction table 52 Drawing area 53, 54 Position 58, 59 Side 60, 69, 70, 71, 80, 87, 91, 93, 95, 96 Graphic 62, 64, 66, 68 Side 72, 73, 74, 75, 76, 77, 78, 79 Sides 81, 82, 83, 84, 85, 86 Sides 92, 94, 97, 98 Side 100 Drawing apparatus 101 Substrate 102 Electron barrel 103 Drawing chamber 105 XY stage 110 Control computer 112 Memory 120 Control circuits 140, 142, 144 Storage device 150 Drawing unit 160 Control unit 200 Electron beam 201 Electron gun 202 Illumination lenses 203 and 410 First aperture 204 Projection 205 Deflectors 206, 420 Second aperture 207 Objective lens 208 Main deflector 209 Sub deflectors 301, 302, 303, 304, 305 Side 330 Electron beam 340 Sample 411 Opening 421 Variable shaping opening 430 Charged particle source 500 Exposure apparatus 502 Light source

Claims (5)

An exposure apparatus for obliquely illuminating illumination light onto a mask substrate on which a pattern is formed using an oblique incidence reflection optical system and transferring the pattern formed on the mask substrate to the substrate to be exposed using reflected light from the mask substrate A storage unit for storing a correction table in which a correction value for correcting a position-dependent error of the shadow wing effect is defined;
An input unit that inputs pattern data in which positions, shapes, and sizes are defined for a plurality of figures, and obtains corresponding correction values from the correction table based on the positions of the figures for each figure;
For each figure, using the correction value, a resize processing unit for resizing the figure,
A drawing unit that draws a resized figure on a mask substrate before pattern formation using a charged particle beam;
A charged particle beam drawing apparatus comprising: In the pattern data, for each figure, information for identifying whether the movable side is allowed to move in order to resize each of the plurality of sides constituting the figure, or the non-moving side that is not allowed to move, is defined.
The charged particle beam drawing apparatus according to claim 1, wherein the resizing processing unit moves to resize the movable side without moving the non-movable side.   The resize processing unit does not move about a side extending in the same direction as the incident direction on the mask substrate when the illumination light is obliquely incident on the mask substrate, and resizes a side extending in a direction different from the incident direction. The charged particle beam drawing apparatus according to claim 1, wherein the charged particle beam drawing apparatus moves for the purpose. The storage unit stores a plurality of correction tables corresponding to a plurality of exposure apparatuses,
4. The information processing apparatus according to claim 1, further comprising a selection unit that inputs information for identifying an exposure apparatus and selects a corresponding correction table from the plurality of correction tables according to the input exposure apparatus. A charged particle beam drawing apparatus according to claim 1. An exposure apparatus for obliquely illuminating illumination light onto a mask substrate on which a pattern is formed using an oblique incidence reflection optical system and transferring the pattern formed on the mask substrate to the substrate to be exposed using reflected light from the mask substrate Storing a correction table in which a correction value for correcting a position-dependent error of the shadow wing effect is defined in a storage device;
Inputting pattern data in which positions, shapes, and sizes are defined for a plurality of figures, and for each figure, obtaining a corresponding correction value from the correction table based on the position of the figure;
For each figure, using the correction value, resizing the figure,
Drawing a resized figure on a mask substrate before pattern formation using a charged particle beam;
A charged particle beam drawing method comprising:

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