JP2013084039A - Container with ic tag and cover member with ic tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a container with an IC tag that can easily detecting forgery, substitution, etc.SOLUTION: There is provided the container with an IC tag constituted by sticking a cover member 102 with the IC tag on a container member 101 having a storage part 101a for article. The cover member 102 has the IC tag including an IC chip 103, and an antenna part 105 and a tamper line 104 connected to the IC chip 103, and a pattern of the tamper line 104 is provided zigzag straddling a border between a sticking plane between the container member 101 and the cover member 102, and the storage part a plurality of times.

Description

  The present invention relates to a container with an IC tag that detects and suppresses camouflaging, replacement and the like.

  As shown in FIG. 11, one base material (container member 1011) is provided with a storage portion 1011a, and the other base material (lid member 1012) is bonded to the bonding portion 1011b and bonded to the storage portion. There is a container for storing articles. When an expensive article is accommodated in such a container, concerns such as forgery and replacement arise. For example, it is desirable to provide some security means in order to prevent forgery of copying including the container, or the action of peeling the container member and the lid member and replacing the contents of the contents.

  For example, for preventing counterfeiting, a technology such as a hologram that is difficult to duplicate is used for the container, and distribution and the like are managed by a system using an IC tag.

  The IC tag used in the IC tag system is flat so that it can be used by being mounted on the surface of the article itself or a case containing the article. As an example, an IC tag including a dipole antenna can be given. Some dipole antennas and IC chips for transmitting and receiving radio signals are mounted on the surface of a thin dielectric sheet, or further covered with a protective sheet and then integrated by thermocompression bonding.

  Various information regarding the article to which the IC tag is attached is recorded and stored in the IC chip, and information can be exchanged between the reader / writer via an antenna connected to the IC chip.

  In order to cope with illegal use of IC tags, an anti-fraud technique is disclosed in which an antenna pattern, which is an essential component of an IC tag, is easily broken when an IC tag attached to an article is peeled off. (For example, refer to Patent Document 1 and Patent Document 2). As a specific means for forming the easily breakable portion, a slit or a U-shaped cut is provided in the dielectric sheet, or a place where the adhesive strength is strong and a weak place is provided at the boundary between these areas. There is a mode in which it breaks. In either case, the IC tag cannot be reused by simultaneously damaging the antenna pattern when the sheet base material is broken.

JP 2006-159830 A JP 2010-128516 A

  However, in the case of the container shown in FIG. 1, a cut is made from the lid member side at the boundary between the housing portion 1001a and the bonding portion 1001b so as not to stand out, and the antenna pattern is taken out from the article without being broken and replaced. There is a fear.

  In view of such problems, it is an object of the present invention to provide a container with an IC tag that can be easily detected when forgery or replacement is performed.

A first invention according to claim 1 for achieving the above object is a container with an IC tag formed by bonding a lid member provided with an IC tag to a container member provided with a container for an article. The member includes the IC tag including an IC chip and an antenna portion and a tamper wire connected to the IC chip, and the pattern of the tamper wire is a boundary between the bonding surface of the container member and the lid member and the accommodating portion. It is a container with an IC tag characterized by being meandering so as to straddle a plurality of times.
Further, in a second invention according to claim 2, in the first invention, the lid member is laminated in the order of a pattern adhesive layer, an IC tag, and an adhesive layer in which an adhesive part is partially provided on a substrate, It is a container with an IC tag, which is bonded to a container member via an adhesive layer.
According to a third aspect of the present invention, there is provided the IC tag according to the second aspect, wherein a brittle functional layer is formed between the pattern adhesive layer and the layer in which the IC tag is laminated. It is a container.
A fourth invention according to claim 4 is the container with an IC tag according to the third invention, wherein the brittle functional layer comprises a concealing layer and an OVD layer.
According to a fifth aspect of the present invention, there is provided an IC tag according to any one of the first to fourth aspects, wherein the member that reacts when the peeling solvent contacts is disposed between the container member and the lid member. It is a container.
The invention according to claim 6 is a lid member with an IC tag in which a pattern adhesive layer, an IC tag, and an adhesive layer, which are partially provided with an adhesive portion, are laminated in this order. A lid member with an IC tag comprising a chip and an antenna portion and a tamper wire connected to the IC chip, and being provided meandering so as to surround a region corresponding to an article storage portion.

According to the first aspect of the invention, since the tamper wire is provided so that the portion corresponding to the boundary between the article housing portion and the bonding portion of the lid member is meandering and straddles a plurality of times, a cut is made toward the housing portion. When the article is extracted, the tamper wire is cut and can be detected by the IC chip.
Further, according to the second invention, by providing the pattern adhesive layer on the base material of the lid member, the tamper wire and the antenna portion are destroyed even when the container member and the lid member are peeled off.
Further, according to the third and fourth inventions, the adhesive layer and the pattern adhesive layer are provided on the brittle functional layer having the concealing layer or the OVD layer, so that the pattern adhesive layer pattern is formed when the lid member is peeled off. Since it can visually recognize, the trace which peeled can be shown effectively.

It is a cross-sectional schematic diagram which shows one Embodiment of the container with an IC tag of this invention. It is a plane schematic diagram which shows one Embodiment of the container with an IC tag of this invention. It is a plane schematic diagram which shows one Embodiment of the container with an IC tag of this invention. It is a partial plane schematic diagram which shows one Embodiment of the container with an IC tag of this invention. In embodiment of FIG. 4, it is a cross-sectional schematic diagram which shows the aspect at the time of peeling a cover member from a container member. It is a partial plane schematic diagram which shows one Embodiment of the container with an IC tag of this invention. In embodiment of FIG. 6, it is a cross-sectional schematic diagram which shows the mode at the time of peeling a cover member from a container member. In embodiment of FIG. 6, it is a plane schematic diagram which shows the aspect of a container member at the time of peeling a cover member from a container member. It is a partial cross-sectional schematic diagram which shows the form of the Example of the container with an IC tag of this invention. It is a cross-sectional schematic diagram which shows the form of the Example of the container with an IC tag of this invention. It is a schematic diagram which shows the example of the container which accommodates articles | goods.

  FIG. 11 is a schematic cross-sectional view showing an embodiment of a container with an IC tag according to the present invention. The container with an IC tag of the present invention is formed by laminating a container member 101 having an article accommodating portion 101a and a lid member 102 at a laminating portion 101b which is a contact surface thereof. The lid member includes an IC tag including an IC chip 103, an antenna unit 105 connected to the IC chip, and a tamper detection loop circuit 104 (hereinafter simply referred to as a tamper line). The tamper line pattern is provided in a meandering manner so as to straddle the boundary between the housing portion 101a and the bonding portion 101b when bonded to the container member.

  The base material constituting the container member 101 is not particularly limited as long as it is a material that can maintain the shape, but plastics that can particularly maintain visibility are suitable. For example, polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate, polyethylene, and polypropylene can be used. For forming the container member, a general plastic processing method such as injection molding can be used. In addition, when visual recognition of the article is unnecessary, a metal member such as aluminum or stainless steel may be formed by pressing or the like. In the case of a transparent container member, a concealing layer or a printing layer may be provided on the bonding portion 101b so that the tamper wire 104, the antenna portion 105, the IC chip, and the like are not visually recognized.

  As will be described in detail later, the lid member 102 is provided with an adhesive layer for bonding the container member 101 onto a base material on which an IC tag is formed. The substrate is not particularly limited as long as it can be bonded to the container member via an adhesive layer. Before the lid member is bonded to the container member, a separator that protects the adhesive layer is disposed on the adhesive layer. As the separator, paper or plastic film coated with a release coating can be used.

  FIG. 2 is a schematic plan view of the container with an IC tag of the present invention shown in FIG. In the embodiment shown in FIGS. 1 and 2, a dipole antenna circuit is formed as the antenna unit 105. The dipole antenna circuit includes a radiating element portion 105a (hereinafter also simply referred to as an antenna) as an antenna used for actual transmission / reception and a matching loop circuit 105b. In order to efficiently transmit and receive radio signals, it is desirable to optimize the antenna length of the radiating element unit and to make the complex impedance Zc of the IC chip 103 a complex conjugate relationship of the complex impedance Za of the radiating element unit.

  If the equivalent circuit of the IC chip 103 is regarded as a parallel connection of the resistor Rc and the capacitance Cc, and the equivalent circuit on the antenna side is regarded as a parallel connection of the resistor Ra and the inductance La, the system composed of the IC chip and the antenna becomes these parallel connections. If the two equivalent circuits resonate at the frequency fc (for example, 13.56 MHz or 2.45 GHz) of the transmission / reception radio wave, the reception power of the antenna is sufficiently supplied to the IC chip and the transmission power of the IC chip is sufficiently supplied to the antenna. Become.

  Therefore, the matching loop circuit 3 is a circuit that can apply the inductance component La to the antenna side and adjust the inductance component. Although the matching loop circuit 105b needs to be directly connected to the IC chip 103, the radiating element 105a may be directly connected as shown in FIG. 2 or indirectly coupled electromagnetically. It doesn't matter.

  In the present invention, in addition to the above configuration, a tamper wire 104 is further provided. Both ends of the tamper wire loop are connected to predetermined pins of the IC chip 103. The IC chip can detect a low resistance state in which the loop is closed and a high resistance state in which the loop is opened and opened. (E.g. UCODE G2iL + from NXP Semiconductors).

  That is, when the tamper line 104 is deliberately destroyed, a flag of a predetermined address in the on-chip memory is changed from OFF to ON, and this can be read by the reader / writer. It is a loop circuit laid for the purpose of breaking. As long as it is connected as a loop that can be energized, the shape and size of the pattern are not limited, but are appropriately set according to the use environment and purpose of use.

  In the present invention, since there are a tamper detection loop and a matching loop, it is necessary to arrange these loops so that the loops are not electromagnetically coupled to deteriorate the communication performance. Therefore, it is preferable to arrange the antenna unit 105 and the tamper wire 104 in different areas. The dipole antenna circuit can be arranged so as not to be affected by the cleavage of the tamper detection loop circuit, and so that the loops of both the circuits are separated from each other so as not to deteriorate the communication performance.

  Although the basic shape is such that the tamper detection loop and the matching loop are separated from each other by a predetermined distance, the present invention is not limited thereto. Since any loop circuit is connected to the IC chip 103, the IC chip is arranged on a line connecting the two loops. A pair of connection circuits are drawn out of each loop along a line connecting the two loops and connected to the IC chip. Further, by making the connection portion of the dipole antenna with the IC chip constricted, the matching loop can be kept away from the tamper detection loop so that the communication performance is not deteriorated.

  The position of the IC chip 103 on the connection circuit is as close as possible to the tamper detection loop circuit side rather than the matching loop circuit side by providing a slit which is a disconnection portion of the connection circuit close to the tamper detection loop circuit side. It is preferable to install them. The reason for this is that if the tamper loop is broken and opened, if the distance between the tamper loop and the IC chip is long, there is room for shorting the pair of connection circuits 5 at the site. This is because the repair procedure is difficult to recognize. This is because such clever repairs are difficult if they are close. For this reason, as shown in FIG. 2, it is more preferable that the tamper wire 104 has a shape in which a leg is started from a connection portion with the IC chip without providing a connection portion on the tamper detection loop circuit side.

  Further, the tamper wire 104 is formed by meandering so as to straddle the boundary between the accommodating portion 101a and the mating portion 101b a plurality of times when the tamper wire 104 is bonded to the container member so that the article cannot be extracted from the container accommodating portion 101a. . This is because it is difficult to make an incision with a cutter or the like from the central part of the container member or the lid member and to remove the article without being detected because the incision trace is easy to visually recognize. Since it is not conspicuous at the boundary, camouflaging such as removing an article and replacing it with a basket can occur. Therefore, the tamper wire is meandered so as to straddle at least the boundary between the accommodating portion on the lid member and the mating portion 101b, so that when the cut is made in the boundary, the tamper wire is broken and the loop is broken to detect the extraction. can do. By making the tamper line a bent pattern rather than a straight line, it becomes difficult to make a cut without cutting the tamper line. In particular, if a tamper wire is formed on the container member side of the base material constituting the lid member, even if a cut is made in the boundary portion from the container member side, the blade enters the lid member surface, the tamper wire is cut, and the loop Can be cleaved and removal can be detected.

  Further, as shown in FIG. 3, the tamper line 104 may form a meandering pattern on the entire surface of the housing portion 101a in addition to the boundary portion between the housing portion 101a and the mating portion 101b. Any part of the lid member can be detected.

  The antenna unit 105 and the tamper wire 104 are not limited as long as they are conductive patterns. However, if the printed pattern is a metal foil such as copper or aluminum, or a conductive coating liquid such as silver paste, the antenna unit 105 and the tamper wire 104 are broken when cut. It is suitable because it is easy. The antenna portion 105 and the tamper wire 104 can form a pattern simultaneously by etching or printing.

  FIG. 4 is a schematic partial sectional view of a container with an IC tag according to another embodiment of the present invention. As shown in FIG. 4, a pattern adhesive layer 403 partially provided with an adhesive portion is provided on a base material 401 constituting the lid member 102, and a wiring pattern 404 including an antenna portion and a tamper line is formed thereon, Furthermore, it is good also as a structure which provided the adhesion layer 402 on it. According to such a container with an IC tag of the present invention, as shown in FIG. 5, when the lid member 102 is peeled off from the container member 101, a part of the wiring pattern 404 is adhered to the container member side, Since the IC tag is destroyed by remaining on the lid member, it cannot be restored after the lid member is peeled off from the container member. This is because the adhesive force between the wiring pattern 404 and the adhesive layer is smaller than the adhesive force between the wiring pattern and the pattern adhesive layer region on the substrate side, and the adhesive force between the wiring pattern and the region where the pattern adhesive layer is not formed. It is because it is larger than. The pattern adhesive layer may be formed by partially providing an adhesive layer as shown in FIG. 4, or by forming an adhesive layer once on the entire surface and then partially providing a non-adhesive layer on the adhesive layer. A pattern adhesive layer may be formed.

  FIG. 6 is a schematic partial sectional view of a container with an IC tag according to another embodiment of the present invention. In addition to the configuration of the embodiment of FIG. 4, a concealing layer is provided between the wiring pattern 404 and the pattern adhesive layer 403. 601 and / or an OVD (Optically Variable Device) layer 602 such as a hologram or a diffraction grating is provided. These are brittle functional layers 611 having brittleness, and are easily broken by peeling. As shown in FIG. 7, when the lid member 102 is peeled off from the container member 101, in addition to the wiring pattern, a brittle functional layer in a region where the pattern adhesive layer 403 is not formed is attached to the container member 101 side, The brittle functional layer in the region where the pattern adhesive layer is formed remains on the lid member. This is because the adhesive force between the brittle functional layer, the adhesive layer 402 and the wiring layer is smaller than the adhesive force with the pattern adhesive layer region, and larger than the adhesive force with the region where the pattern adhesive layer is not formed. . Moreover, the adhesive force of a brittle functional layer and a wiring pattern should just be larger than the adhesive force of an adhesion layer and a wiring pattern. FIG. 8 is a plan view of the container member 101 ′ after the lid member 102 is peeled from the container member 101 in the container with an IC tag of the present invention shown in FIG. 6, as viewed from the bonding surface side with the lid member. Since the pattern of the pattern adhesive layer 403 can be visually recognized when the lid member is peeled off by the masking layer 601 and / or the OVD layer 602, the peeled trace can be effectively shown.

  The hiding layer 601 can visually prevent the IC tag from being visually recognized from the lid member 102 side. For this reason, when a notch is made from the lid member, it is possible to prevent cutting by avoiding the tamper wire. As for visual recognition from the container member 101 side, a shielding layer may be provided on the container member side as described above. The concealing layer can be formed by mixing a coloring material such as carbon black with an adhesive material such as an epoxy resin. Moreover, it is preferable that the hardening | curing agent mixed with resin is 5 to 15% of solid content mass of a concealing layer in order to provide brittleness.

  The OVD layer 602 can be provided on the lid member 102 so as to have a aesthetic appearance of the container and to suppress counterfeiting by providing an optical expression that is difficult to imitate. As an example of the OVD layer, a structure in which a reflective layer made of a metal foil film such as aluminum having a thickness of 10 to 100 nm is provided on the uneven surface of the resin layer provided with fine unevenness. The reflective layer may be provided with a fine pattern by etching (demetalization) of a metal thin film. In order to impart brittleness to the OVD layer, a release agent is added to the resin layer material. Alternatively, a brittle layer may be provided on the embossed resin layer and the base material 401 and the pattern formation layer 403. The easy embossability of the OVD layer may be compatible with the peeling / adhesion control of the base material and the pattern forming layer.

  As described above, the container with the IC tag according to the present invention is provided so that the tamper wire snakes over the portion corresponding to the boundary between the article housing portion and the bonding portion of the lid member so as to straddle a plurality of times. When the cut is made toward the object and the article is extracted, the tamper wire is cut and can be detected by the IC chip. Further, by providing the pattern adhesive layer on the base material of the lid member, the tamper wire and the antenna portion are destroyed even when the container member and the lid member are peeled off. In addition, by providing a brittle functional layer with a concealing layer or an OVD layer with an adhesive layer and a pattern adhesive layer, the pattern adhesive layer pattern can be visually recognized when the lid member is peeled off. Can be shown.

  Furthermore, as an application, for peeling of the container member and the lid member using a solvent, by placing or attaching a member that reacts when a peeling solvent such as solvent coloring paper comes into contact with a part of the container, Can be detected. Such a member is particularly preferably arranged or attached between the container member and the lid member.

  As an embodiment of the present invention, a container for storing a jewel will be described in detail with reference to FIGS. 9 and 10.

<Production of lid member with IC tag>
On a substrate 401 made of PET having a film thickness of about 50 μm, a coating liquid for a pattern adhesive layer having the following composition 1 is printed in a pattern in which a plurality of “VOID” characters are outlined, and the film thickness is about 0.2 μm. A pattern adhesive layer 403 was formed. Next, the brittle layer 903 having the composition 2 shown below was applied and dried on the pattern adhesive layer and the substrate to form the brittle layer 903. Further, a thermoplastic resin solution having the following composition 3 was applied onto a substrate, dried, and then embossed by hot pressing the thermoplastic resin with an embossing roll to form an embossed layer 602a having a fine uneven shape. Further, aluminum was deposited on the concavo-convex surface to form a reflective layer 602b. Subsequently, the reflective layer was subjected to demetalization by etching to form an embossed hologram layer (OVD layer).

・ Composition 1
Byron 245 (Toyobo) 100 parts Tetrahydrofuran 7 parts Composition 2
MCS504 (manufactured by DIC) 100 parts MEK 20 parts, composition 3
VH311A (manufactured by Washin Chemical) 700 parts VH311B (manufactured by Washin Chemical) 300 parts MEK 60 parts

  Next, a coating solution for a concealing layer having the following composition 4 was applied on the OVD layer to form a black concealing layer 601 having a thickness of about 4 μm. Next, a silver paste was printed on the concealing layer by a screen printing method to form a tamper wire 104 and an antenna portion 105 having a thickness of about 7 μm in the same pattern as the pattern shown in FIG. Thereafter, an IC tag layer was formed by mounting an IC chip (UCODE G2iL + manufactured by NXP Semiconductors) so that each terminal of the tamper wire and the antenna portion was connected to the IC chip 103.

・ Composition 4
710 Black (manufactured by Seiko Advance) 100 parts Quick-drying curing agent No. 5 (manufactured by Seiko Advance) 10 parts cyclohexanone 40 parts

  Next, an adhesive layer 402 was formed on the entire surface of the substrate on the side where the IC tag layer was formed, and a separator made of release paper was laminated on the adhesive layer. Finally, the thickness of the lid substrate is adjusted by sequentially laminating an adhesive layer 901 mainly composed of an acrylic resin of about 50 μm and a PET substrate 902 of about 100 μm in thickness on the substrate 401, and the lid with an IC tag A member was prepared.

<Production of containers with IC tags>
As shown in FIG. 10, a container member 101 having a jewel storage portion 101a and an appraisal placement portion 1001 was formed by embossing PET. The thickness of the container member at the flat portion is about 500 μm. Next, a white concealing layer and a pattern printing layer were sequentially laminated on the bonding surface between the housing part and the lid member excluding the arrangement part of the certificate.

  Place the appraisal made of gemstone and solvent color paper on the container 101a and the appraisal placement portion 1001 of the produced container member 101, peel off the separator of the lid member 102 with IC tag produced earlier, By arranging the meandering wires so as to straddle the boundary between the container member and the lid member and the accommodating portion, and bonding them together via the adhesive layer 402, a container with an IC tag for jewelry was produced.

  When the lid member 102 was peeled from the manufactured container with an IC tag, the characters “VOID” appeared on the peeled surface of the container member 101, and the tamper wire 104 and the antenna portion 105 were disconnected.

DESCRIPTION OF SYMBOLS 101 ... Container member 102 ... Lid member 103 ... IC chip 104 ... Tamper wire 105 ... Antenna part 611 ... Brittle functional layer

Claims (6)

A container with an IC tag formed by bonding a lid member with an IC tag to a container member with an article storage unit,
The lid member includes the IC tag including an IC chip and an antenna unit and a tamper wire connected to the IC chip,
The container with an IC tag, wherein the tamper line pattern is provided so as to meander a plurality of times across the boundary between the bonding surface of the container member and the lid member and the accommodating portion.   The lid member is laminated in the order of a pattern adhesive layer, an IC tag, and an adhesive layer in which an adhesive part is partially provided on a substrate, and is bonded to a container member via the adhesive layer. The container with an IC tag according to claim 1.   The container with an IC tag according to claim 2, wherein a brittle functional layer is formed between the pattern adhesive layer and the layer on which the IC tag is laminated.   4. The container with an IC tag according to claim 3, wherein the brittle functional layer comprises a concealing layer and an OVD layer.   The container with an IC tag according to any one of claims 1 to 4, wherein a member that reacts when the peeling solvent comes into contact is disposed between the container member and the lid member.   The antenna part in which the IC tag is connected to the IC chip and the IC chip in the lid member with the IC tag, which is laminated in the order of the pattern adhesive layer, the IC tag, and the adhesive layer partially provided with the adhesive part on the substrate And a tamper wire, and a meandering cover member provided so as to meander around a region corresponding to an article storage portion.

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