JP2013069576A - Light emitting module and lighting device - Google Patents

Light emitting module and lighting device Download PDF

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JP2013069576A
JP2013069576A JP2011208042A JP2011208042A JP2013069576A JP 2013069576 A JP2013069576 A JP 2013069576A JP 2011208042 A JP2011208042 A JP 2011208042A JP 2011208042 A JP2011208042 A JP 2011208042A JP 2013069576 A JP2013069576 A JP 2013069576A
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light emitting
wiring board
side electrode
electrode pads
emitting panel
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JP5838299B2 (en
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Osamu Tanahashi
理 棚橋
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Panasonic Corp
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Panasonic Corp
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  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

PROBLEM TO BE SOLVED: To make a light emitting module using EL elements hardly short-circuited even in case of wire break.SOLUTION: The light emitting module 3 includes a flat light emitting panel 2 and a wiring board 6 for power feeding. The light emitting panel 2 includes light emitting panel-side electrode pads 23a, 23b, and the wiring board 6 includes wiring board-side electrode pads 62a, 62b, all of which are connected with wires 8. The electrode pads 23a, 23b, together with their joint ends with the wires 8, are coated with sealing resin members 7 of the wire 8, and the electrode pads 62a, 62b are so arranged that their interval is to be longer than a length L1 of a part not covered with the sealing resin member 7. With this structure, even if a wire 8 is broken at a part not coated with the sealing resin member 7, ends of the wire 8 hardly get in contact with other electrode pads and therefore, hardly short-circuit, since an interval D between the electrode pads 62a, 62b is longer than a length of the broken wire 8.

Description

本発明は、光源にＥＬ素子を用いた発光モジュール及びそれを用いた照明装置に関する。   The present invention relates to a light emitting module using an EL element as a light source and an illumination device using the light emitting module.

有機ＥＬ素子は、低電圧で高輝度の発光が可能であり、有機化合物の種類によって様々な発光色が得られ、また、平面状の発光パネルとしての製造が容易である。そのため、近年、有機ＥＬ素子を用いた発光パネルを備えた発光モジュールが注目されている。   The organic EL element can emit light with high luminance at a low voltage, can obtain various emission colors depending on the type of organic compound, and can be easily manufactured as a planar light-emitting panel. Therefore, in recent years, attention has been paid to a light emitting module including a light emitting panel using an organic EL element.

この種の発光モジュールを図８に示す。発光モジュール１０３は、透光性を有する基板１２１上に透明電極１２１ａを介して発光部１２２が形成された発光パネル１０２と、この発光パネル１０２に給電するための配線基板１０６と、を備える（例えば、特許文献１参照）。発光パネル１０２は、発光部１２２から透明電極１２２ａを介して導出された電極パッド１２３と、発光部１２２を封止する封止缶１２４と、を有する。配線基板１０６は、接着テープ等の固定部１０９によって発光パネル１０２に固定される。発光パネル１０２は、電極パッド１２３と配線基板１０６上に設けられた電極パッド１６２とがボンディングワイヤ（以下、ワイヤ１０８）によって結線されることによって配線基板１０６と電気的に接続される。   This type of light emitting module is shown in FIG. The light emitting module 103 includes a light emitting panel 102 in which a light emitting unit 122 is formed on a transparent substrate 121 via a transparent electrode 121a, and a wiring substrate 106 for supplying power to the light emitting panel 102 (for example, , See Patent Document 1). The light emitting panel 102 includes an electrode pad 123 led out from the light emitting unit 122 through the transparent electrode 122 a and a sealing can 124 that seals the light emitting unit 122. The wiring board 106 is fixed to the light emitting panel 102 by a fixing portion 109 such as an adhesive tape. The light-emitting panel 102 is electrically connected to the wiring substrate 106 by connecting the electrode pads 123 and the electrode pads 162 provided on the wiring substrate 106 with bonding wires (hereinafter, wires 108).

また、図９（ａ）（ｂ）に示すように、複数のパネル側の電極パッド１２３を発光部２２の周囲に分散して配置し、これらと近接する位置に夫々基板側の電極パッド１６２を配置することにより、発光部１２２に流れる電流を均一化し、発光部１２２の面発光輝度を均一化することができる。また、図例のように、ワイヤ１０８を複数本とすれば、いずれかのワイヤ８が断線した場合でも、他のものが断線されなければ各パッド間の電気的接続は切断されないので、発光部１２２を均一に発光させることができる。   Further, as shown in FIGS. 9A and 9B, a plurality of panel-side electrode pads 123 are distributed and arranged around the light-emitting portion 22, and the substrate-side electrode pads 162 are respectively disposed at positions close to these. By disposing, the current flowing through the light emitting unit 122 can be made uniform, and the surface emission luminance of the light emitting unit 122 can be made uniform. Also, as shown in the figure, if a plurality of wires 108 are used, even if any one of the wires 8 is disconnected, the electrical connection between the pads is not disconnected unless the other is disconnected. 122 can emit light uniformly.

特開２００７−２００６２７号公報JP 2007-200267 A

しかしながら、上記のような発光モジュール１０３においては、図９（ｂ）に示すように、ある電極パッド１６２に接合されたワイヤ１０８が断線したときに、このワイヤ１０８が隣り合う電極パッド１６２に接触して、ショートを起こすことがある。   However, in the light emitting module 103 as described above, when the wire 108 bonded to a certain electrode pad 162 is disconnected as shown in FIG. 9B, the wire 108 contacts the adjacent electrode pad 162. May cause a short circuit.

本発明は、上記課題を解決するためになされたものであり、電極パッド間を接続するボンディングワイヤが断線したときでも、ショートを起こし難く、発光部を均一に発光させることができる発光モジュール及びそれを用いた照明装置を提供することを目的とする。   The present invention has been made to solve the above-described problems, and a light emitting module capable of causing a light emitting section to emit light uniformly without causing a short circuit even when a bonding wire connecting between electrode pads is disconnected. It aims at providing the illuminating device using.

本発明の発光モジュールは、平板状の発光パネルと、この発光パネルの一面側に設けられ該発光パネルに給電するための配線基板と、を備えた発光モジュールであって、前記発光パネルは、前記配線基板が設けられる面の該配線基板よりも外方に形成された複数の発光パネル側電極パッドを有し、前記配線基板は、前記発光パネルと対向する面とは反対側の面の前記発光パネル側電極パッドに近接した位置に形成された複数の配線基板側電極パッドを有し、前記発光パネル側電極パッド及び前記配線基板側電極パッドはボンディングワイヤにより互いに電気的に接続され、前記発光パネル側電極パッドは、該発光パネル側電極パッドと接合されたボンディングワイヤの接合端部と共に封止樹脂によって被覆されており、前記複数の配線基板側電極パッドは、該配線基板側電極パッド同士の間隔が、前記ボンディングワイヤの前記封止樹脂によって被覆されていない部分の長さよりも長くなるように配置されていることを特徴とする。   The light emitting module of the present invention is a light emitting module comprising a flat light emitting panel and a wiring board provided on one side of the light emitting panel for supplying power to the light emitting panel, A plurality of light emitting panel side electrode pads formed outside the wiring substrate on a surface on which the wiring substrate is provided, and the wiring substrate emits the light on the surface opposite to the surface facing the light emitting panel; A plurality of wiring board side electrode pads formed at positions close to the panel side electrode pad, and the light emitting panel side electrode pad and the wiring board side electrode pad are electrically connected to each other by a bonding wire; The side electrode pads are covered with a sealing resin together with bonding ends of bonding wires bonded to the light emitting panel side electrode pads, and the plurality of wiring board sides Pole pad spacing between wiring substrate-side electrode pad, characterized in that it is arranged to be longer than the length of the not covered with the sealing resin portion of the bonding wire.

上記発光モジュールにおいて、前記配線基板側電極パッド同士の間隔のうち、最も短い間隔が、前記ボンディングワイヤの全長よりも短いことが好ましい。   In the light emitting module, it is preferable that the shortest interval among the intervals between the wiring substrate side electrode pads is shorter than the total length of the bonding wires.

上記発光モジュールにおいて、前記複数の配線基板側電極パッドは、陽極及び陰極が交互に並ぶように配置されていることが好ましい。   In the light emitting module, the plurality of wiring board side electrode pads are preferably arranged so that anodes and cathodes are alternately arranged.

この発光モジュールにおいて、前記配線基板側電極パッドは、該配線基板側電極パッドと接合された前記ボンディングワイヤの接合端部と共に封止樹脂によって被覆されていることが好ましい。   In this light emitting module, it is preferable that the wiring board side electrode pad is covered with a sealing resin together with a bonding end portion of the bonding wire bonded to the wiring board side electrode pad.

上記発光モジュールは照明装置に用いられることが好ましい。   The light emitting module is preferably used for a lighting device.

本発明によれば、封止部材によって被覆されていない部分でワイヤが断線しても、配線基板側電極パッド同士の間隔が、断線したワイヤの長さよりも長いので、ワイヤが他の電極パッドに接触し難い。従って、ワイヤが断線したときでも、ショートを起こし難く、発光部を均一に発光させることができる。   According to the present invention, even if the wire is disconnected at a portion not covered with the sealing member, the distance between the wiring board side electrode pads is longer than the length of the disconnected wire, so that the wire is connected to the other electrode pads. Hard to touch. Therefore, even when the wire is disconnected, it is difficult to cause a short circuit, and the light emitting unit can emit light uniformly.

本発明の一実施形態に係る発光モジュールを用いた照明装置の分解斜視図。The disassembled perspective view of the illuminating device using the light emitting module which concerns on one Embodiment of this invention. 同発光モジュールの発光パネル及び回路基板の斜視図。The perspective view of the light emission panel and circuit board of the light emitting module. 同発光モジュールの発光パネル及び回路基板の正面図。The front view of the light emission panel and circuit board of the light emission module. 同発光モジュールの発光パネル及び回路基板の一部拡大斜視図。The partial expansion perspective view of the light emission panel and circuit board of the light emission module. 図３のＡ−Ａ線側断面図。AA line side sectional view of FIG. （ａ）（ｂ）は、図３の一点鎖線で囲われたＢ領域の拡大図。(A) and (b) are the enlarged views of the B region surrounded by the alternate long and short dash line in FIG. 上記実施形態の変形例に係る発光モジュールの側断面図。The sectional side view of the light emitting module which concerns on the modification of the said embodiment. 従来の発光モジュールの側断面図。The sectional side view of the conventional light emitting module. 従来の発光モジュールの電極パッドの結線部分の拡大正面図。The enlarged front view of the connection part of the electrode pad of the conventional light emitting module.

本発明の一実施形態に係る発光モジュール及びこの発光モジュールを用いた照明装置について、図１乃至図６を参照して説明する。図１に示すように、本実施形態の照明装置１は、有機ＥＬ素子を用いた平面状の発光パネル２を有する発光モジュール３（光源部）と、この発光モジュール３と着脱自在となるように構成された装着部４と、を備える。装着部４は、取付面４ａを介して天井や壁に取り付けられ、発光モジュール３は、この装着部４に装着されて居住空間等に対して光を照射する。   A light emitting module according to an embodiment of the present invention and a lighting device using the light emitting module will be described with reference to FIGS. As shown in FIG. 1, the illuminating device 1 of this embodiment is light-emitting module 3 (light source part) which has the planar light emission panel 2 using an organic EL element, and this light-emitting module 3 is detachable. And a configured mounting portion 4. The mounting portion 4 is attached to the ceiling or wall via the mounting surface 4a, and the light emitting module 3 is mounted on the mounting portion 4 and irradiates light to a living space or the like.

発光モジュール３は、発光パネル２の発光面側（図１の下方向）に設けられて光を出射する透光性を有するカバー５１と、発光パネル２の非発光面側（図１の上方向）に設けられてカバー５１を保持するケース５２と、を備える。これらカバー５１及びケース５２はパッケージ５を構成する。このパッケージ５に、発光パネル２と、発光パネル２の非発光面側に載置されて発光パネル２に給電するための配線基板６とが収納される。装着部４は、発光パネル２を点灯制御するための回路基板４１と、この回路基板４１を収容するハウジング４２と、を備える。   The light emitting module 3 includes a light-transmitting cover 51 provided on the light emitting surface side of the light emitting panel 2 (downward in FIG. 1) and emitting light, and the non-light emitting surface side of the light emitting panel 2 (upward in FIG. 1). ) And a case 52 for holding the cover 51. The cover 51 and the case 52 constitute the package 5. The package 5 houses the light emitting panel 2 and a wiring board 6 that is placed on the non-light emitting surface side of the light emitting panel 2 and supplies power to the light emitting panel 2. The mounting portion 4 includes a circuit board 41 for controlling the lighting of the light emitting panel 2 and a housing 42 that houses the circuit board 41.

発光パネル２は、図２乃至図４に示すように、透光性を有する矩形状の基板２１と、この基板２１上に、所定形状にパターニングされた透明電極（不図示）を介して発光機能を有する発光層、光反射性を有する陰極を積層した発光部２２と、を有する。これら基板、透明電極（陽極）、発光層、陰極には、有機ＥＬ素子の製造において汎用される材料が適宜に用いられる。   As shown in FIGS. 2 to 4, the light emitting panel 2 has a light emitting function through a rectangular substrate 21 having translucency and a transparent electrode (not shown) patterned in a predetermined shape on the substrate 21. And a light emitting part 22 in which a cathode having light reflectivity is stacked. For these substrate, transparent electrode (anode), light emitting layer, and cathode, materials generally used in the production of organic EL elements are appropriately used.

また、基板２１上には、配線基板６が設けられる面であって、配線基板６よりも外方の位置に、複数の発光パネル側電極パッド２３ａ，２３ｂが形成されている。発光パネル側電極パッド２３ａ，２３ｂは、基板２１の両端部に沿って夫々複数形成され、透明電極２２ａ（後述する図５参照）等を介して発光部２２と電気的に接続され、陽極に相当するパッド２３ａ及び陰極に相当するパッド２３ｂが交互に並ぶように配置される。このように、複数の発光パネル側電極パッド２３ａ，２３ｂを発光部２２の周囲に分散して配置することにより、発光部２２に流れる電流を均一化し、発光部２２の面発光輝度を均一化することができる。発光部２２は、水分や酸素等から有機材料を含む発光部２２の発光層等を保護する封止缶２４（後述する図５も参照）に覆われている。この封止缶２４は、発光部２２の陰極側の外形に対応した箱状となるように、ガラス等の材料から形成されている。また、発光パネル側電極パッド２３ａ，２３ｂは、封止樹脂部材７によって被覆されている。   On the substrate 21, a plurality of light emitting panel side electrode pads 23 a and 23 b are formed on the surface on which the wiring substrate 6 is provided and at a position outside the wiring substrate 6. A plurality of light emitting panel side electrode pads 23a and 23b are formed along both end portions of the substrate 21, and are electrically connected to the light emitting portion 22 through a transparent electrode 22a (see FIG. 5 to be described later) and correspond to an anode. Pads 23a corresponding to the cathodes and pads 23b corresponding to the cathodes are alternately arranged. As described above, by arranging the plurality of light emitting panel side electrode pads 23a and 23b to be distributed around the light emitting unit 22, the current flowing through the light emitting unit 22 is made uniform, and the surface emission luminance of the light emitting unit 22 is made uniform. be able to. The light emitting unit 22 is covered with a sealing can 24 (see also FIG. 5 described later) that protects the light emitting layer and the like of the light emitting unit 22 containing an organic material from moisture and oxygen. The sealing can 24 is made of a material such as glass so as to have a box shape corresponding to the outer shape of the light emitting unit 22 on the cathode side. The light emitting panel side electrode pads 23 a and 23 b are covered with the sealing resin member 7.

配線基板６には、難燃性及び低導電率を両立した基材が中央が開口した枠型状になるように形成された部材が用いられる。この基材には、ガラス繊維布にエポキシ樹脂等を含侵させて硬化させたガラス繊維板、例えば、ＦＲ−４等が用いられる。配線基板６には、ケース５２（図１参照）と対向する面に、配線基板６と装着部４の回路基板４１とを電気的に接続する端子部６１が設けられている。端子部６１は、配線基板６に接合される固定部６１ａ及びこの固定部６１ａから立設された平刃型の接触部６１ｂから構成される。この接触部６１ｂが、ケース５２に形成された溝部５３（上記図１参照）を通して、装着部４側に露出する。本例においては、一対の端子部６１が、配線基板６の一方の端部に設けられている。   The wiring board 6 is made of a member formed such that a base material that achieves both flame retardancy and low electrical conductivity has a frame shape with an open center. As the base material, a glass fiber plate made of glass fiber cloth impregnated with an epoxy resin or the like and cured, for example, FR-4 is used. The wiring board 6 is provided with a terminal portion 61 for electrically connecting the wiring board 6 and the circuit board 41 of the mounting portion 4 on the surface facing the case 52 (see FIG. 1). The terminal portion 61 includes a fixed portion 61a that is joined to the wiring board 6 and a flat blade type contact portion 61b that is erected from the fixed portion 61a. The contact portion 61b is exposed to the mounting portion 4 side through a groove portion 53 (see FIG. 1) formed in the case 52. In the present example, a pair of terminal portions 61 are provided at one end of the wiring board 6.

また、配線基板６上には、上面視において発光パネル側電極パッド２３ａ，２３ｂと近接する位置に形成された複数の配線基板側電極パッド６２ａ，６２ｂが形成されている。更に、配線基板６には、端子部６１と電気的に接続された陽極線及び陰極線（不図示）が形成されている。これら電極線が絶縁材料によって被覆されると共に、発光パネル２と対向する面とは反対側の面において、それらの一部が露出して配線基板側電極パッド６２ａ，６２ｂと接続される。配線基板側電極パッド６２ａ，６２ｂは、発光パネル２の陽極及び陰極に夫々電気的に接続された発光パネル側電極パッド２３ａ，２３ｂと夫々導電性を有するボンディングワイヤ（以下、ワイヤ８）によって結線される。発光パネル２と配線基板６とは、耐熱性、耐湿性及び応力緩和性に優れる芯材入りのアクリル系両面接着テープ等の固定部９（後述する図５も参照）によって接着固定される。   On the wiring board 6, a plurality of wiring board side electrode pads 62a and 62b formed at positions close to the light emitting panel side electrode pads 23a and 23b in a top view are formed. Furthermore, an anode line and a cathode line (not shown) electrically connected to the terminal portion 61 are formed on the wiring board 6. These electrode lines are covered with an insulating material, and part of them are exposed on the surface opposite to the surface facing the light emitting panel 2 and are connected to the wiring board side electrode pads 62a and 62b. The wiring board side electrode pads 62a and 62b are connected to the light emitting panel side electrode pads 23a and 23b respectively electrically connected to the anode and the cathode of the light emitting panel 2 by conductive bonding wires (hereinafter referred to as wires 8). The The light emitting panel 2 and the wiring board 6 are bonded and fixed by a fixing portion 9 (see also FIG. 5 described later) such as an acrylic double-sided adhesive tape containing a core material excellent in heat resistance, moisture resistance and stress relaxation.

発光モジュール３のパッケージ５（カバー５１及びケース５２）及び装着部４の構成について、上述した図１を参照して説明する。カバー５１は、ケース５２側の面が開口した箱状に形成されており、発光パネル２からの光を出射する光出射面５１ａと、この光出射面５１ａの外周縁から立設されて発光パネル２の外周面を覆う側壁５１ｂと、を有する。側壁５１ｂは、その内周面が、発光パネル２の外周面に適合するように形成されている。こうすれば、カバー５１に発光パネル２を嵌め込むだけで、発光パネル２及び配線基板６の位置決めを容易に行なうことができる。カバー５１の側壁５１ｂは、その外周面にカバー５１をケース５２に係合させるための複数の嵌合爪５１ｃを有する。これら嵌合爪５１ｃは、光出射面５１ａの外周方向に突出するように形成され、側壁５１ｂの外周面に所定間隔で設けられている。カバー５１の構成材料としては、例えば、透明なＡＢＳ樹脂やアクリル樹脂、ポリスチレン樹脂等のプラスチック材料等が用いられる。   The configuration of the package 5 (the cover 51 and the case 52) and the mounting portion 4 of the light emitting module 3 will be described with reference to FIG. The cover 51 is formed in a box shape with an open surface on the case 52 side. The light emitting surface 51a that emits light from the light emitting panel 2 and a light emitting panel that stands up from the outer periphery of the light emitting surface 51a. 2 and a side wall 51b covering the outer peripheral surface. The side wall 51 b is formed so that its inner peripheral surface matches the outer peripheral surface of the light emitting panel 2. In this way, the light emitting panel 2 and the wiring board 6 can be easily positioned simply by fitting the light emitting panel 2 into the cover 51. The side wall 51b of the cover 51 has a plurality of fitting claws 51c for engaging the cover 51 with the case 52 on the outer peripheral surface thereof. These fitting claws 51c are formed so as to protrude in the outer peripheral direction of the light emitting surface 51a, and are provided at predetermined intervals on the outer peripheral surface of the side wall 51b. As a constituent material of the cover 51, for example, a transparent ABS resin, an acrylic resin, a plastic material such as a polystyrene resin, or the like is used.

ケース５２は、カバー５１側の面（裏面側）が開口した箱形状に形成されている。また、ケース５２は、凹形状の主面５２ａと、この主面５２ａの外周縁から立設されてカバー５１の側壁５１ｂの外周を覆う側壁５２ｂと、を有する。側壁５２ｂは、その内周面にカバー５１の嵌合爪５１ｃが嵌合される複数の嵌合溝（不図示）を有する。これら嵌合溝は、側壁５２ｂにおいて嵌合爪５１ｃに対応する位置に設けられている。   The case 52 is formed in a box shape with an open surface (back side) on the cover 51 side. The case 52 has a concave main surface 52a and a side wall 52b that stands from the outer peripheral edge of the main surface 52a and covers the outer periphery of the side wall 51b of the cover 51. The side wall 52b has a plurality of fitting grooves (not shown) in which the fitting claws 51c of the cover 51 are fitted on the inner peripheral surface thereof. These fitting grooves are provided at positions corresponding to the fitting claws 51c on the side wall 52b.

また、ケース５２は、その表面側の周部が装着部４側に凸状となるように形成され、凸状となった部分の裏面側において配線基板６を収容する凹状の配線基板収容部５４を有する。この配線基板収容部５４は、配線基板６に対応する枠状に形成されている。また、ケース５２は、その非発光面側の一端部に一対の係合部５５を有する。係合部５５は、装着部４の発光モジュール３が装着される装着面４ｂに設けられた被係合部（不図示）と係合する。係合部５５は先端が外側に向いたフック形状に形成され、装着部４の被係合部は係合部５５に対応した形状に形成されている。係合部５５が被係合部に係合された状態で、発光モジュール３は装着部４に対して回動自在とされる。また、ケース５２は、主面５２ａのうち係合部５５が設けられている一端部とは他方側の端部に保持部５６を有する。保持部５６は、装着部４の装着面４ｂに設けられている被保持部４３に保持される。保持部５６は係合部５５と同様に先端が外側に向いたフック形状に形成され、被保持部４３は保持部５６に対応した形状に形成されている。これら保持部５６及び被保持部４３は、発光モジュール３を装着部４へ装着した状態で保持する。つまり、発光モジュール３は、係合部５５を装着部４の被係合部に係止させ、この係止された端部を軸として、他方側の端部を回動させ、保持部５６を被保持部４３に係止させることで、装着部４に装着される。   Further, the case 52 is formed so that a peripheral portion on the front surface side thereof is convex toward the mounting portion 4 side, and a concave wiring board housing portion 54 that houses the wiring board 6 on the back surface side of the convex portion. Have The wiring board housing portion 54 is formed in a frame shape corresponding to the wiring board 6. The case 52 has a pair of engaging portions 55 at one end on the non-light emitting surface side. The engaging portion 55 engages with an engaged portion (not shown) provided on the mounting surface 4b on which the light emitting module 3 of the mounting portion 4 is mounted. The engaging portion 55 is formed in a hook shape with the tip facing outward, and the engaged portion of the mounting portion 4 is formed in a shape corresponding to the engaging portion 55. The light emitting module 3 is rotatable with respect to the mounting portion 4 in a state where the engaging portion 55 is engaged with the engaged portion. Further, the case 52 has a holding portion 56 at an end portion on the other side of the main surface 52a with respect to one end portion where the engaging portion 55 is provided. The holding part 56 is held by the held part 43 provided on the mounting surface 4 b of the mounting part 4. The holding portion 56 is formed in a hook shape with the tip facing outward like the engaging portion 55, and the held portion 43 is formed in a shape corresponding to the holding portion 56. The holding portion 56 and the held portion 43 hold the light emitting module 3 in a state where the light emitting module 3 is attached to the attachment portion 4. That is, the light emitting module 3 locks the engaging portion 55 to the engaged portion of the mounting portion 4, rotates the other end portion around the locked end portion, and moves the holding portion 56. By being engaged with the held portion 43, the attachment portion 4 is attached.

ケース５２の構成材料には、カバー５１の構成材料と同様のものの他、表面に絶縁処理が施されたアルミニウム等の金属材料等の透明性がない材料が用いられてもよく、側壁６ｂが僅かに撓むように所定の弾性を有する材料が好適に用いられる。なお、ケース５２の主面５２ａと側壁５２ｂとを接続する角部は、図例のように、一部面取りされていることが好ましい。こうすれば、発光モジュール３の外観をスリム化することができる。   As the constituent material of the case 52, in addition to the same constituent material as the cover 51, a non-transparent material such as a metal material such as aluminum whose surface is subjected to insulation treatment may be used. A material having a predetermined elasticity is preferably used so as to be bent. In addition, it is preferable that the corner | angular part which connects the main surface 52a and the side wall 52b of case 52 is partially chamfered like the example of a figure. If it carries out like this, the external appearance of the light emitting module 3 can be slimmed.

装着部４は、上述した回路基板４１及びハウジング４２に加え、端子部６１（図２参照）と回路基板４１とを電気的に接続する一対の端子受部４４を備える。ハウジング４２は、発光モジュール３側に凸状に形成されて、回路基板４１を収容する凹状の回路基板収容部４５を有する。また、ハウジング４２には、端子部６１を挿通させる貫通溝４６が設けられている。なお、回路基板４１上には、回路基板４１を保護するための保護部材４７が載置される。回路基板４１には、配線基板６と同様の基材が用いられ、矩形状に形成された基材の発光モジュール３側の面に、発光パネル２を点灯駆動するための駆動ドライバ等の各種素子（不図示）が実装される。また、回路基板４１には、端子受部４４との接合部及び外部給電用端子４８が設けられ、これら接合部、外部給電用端子４８及び駆動ドライバ等が回路基板４１に設けられた配線パターンによって電気的に接続される。端子受部４４は、所定形状に屈曲した一対の略Ｌ字形状の金属片であり、一方の端部が回路基板４１に固定され、他方の端部が発光モジュール３側へ立設されて接触部を成し、この接触部がクリップ状に形成されて、貫通溝４６を挿通した端子部６１を挟持する。これにより、端子受部４４と端子部６１との電気的な接続がなされる。   The mounting portion 4 includes a pair of terminal receiving portions 44 that electrically connect the terminal portion 61 (see FIG. 2) and the circuit board 41 in addition to the circuit board 41 and the housing 42 described above. The housing 42 is formed in a convex shape on the light emitting module 3 side and has a concave circuit board housing portion 45 for housing the circuit board 41. Further, the housing 42 is provided with a through groove 46 through which the terminal portion 61 is inserted. A protective member 47 for protecting the circuit board 41 is placed on the circuit board 41. The circuit board 41 uses the same base material as that of the wiring board 6, and various elements such as a drive driver for driving the light emitting panel 2 to light on the light emitting module 3 side surface of the base material formed in a rectangular shape. (Not shown) is implemented. Further, the circuit board 41 is provided with a joint portion with the terminal receiving portion 44 and an external power feeding terminal 48, and the joint portion, the external power feeding terminal 48, a drive driver, and the like are provided by a wiring pattern provided on the circuit board 41. Electrically connected. The terminal receiving portion 44 is a pair of substantially L-shaped metal pieces bent into a predetermined shape, one end is fixed to the circuit board 41, and the other end is erected on the light emitting module 3 side to be in contact. The contact portion is formed in a clip shape and sandwiches the terminal portion 61 inserted through the through groove 46. Thereby, the electrical connection of the terminal receiving part 44 and the terminal part 61 is made.

次に、発光パネル２及び配線基板６の接合構造について、上述した図４に加えて、図５及び図６を参照して説明する。図５は、図３に示す陽極に相当する各電極パッド２３ａ，６２ａを通るＡ−Ａ線断面である。陰極に相当する各電極パッド２３ｂ，６２ｂを通る断面は、発光部２２から発光パネル側電極パッド２３ｂへの電極取り出し構造が異なるが、各電極パッド２３ｂ，６２ｂの接合構造は、陽極側の接合構造と同様であり、図示を省略した。配線基板６は、封止缶２４上に接着テープ等の固定部９によって接着固定されている。固定部９は、配線基板６の封止缶２４と対向する面において、配線基板側電極パッド６２ａ，６２ｂが形成された箇所の直下位置に設けられている。この固定部９は、配線基板側電極パッド６２ａ，６２ｂの夫々に対応するように点状に配されていてもよいし、各配線基板側電極パッド６２ａ，６２ｂに沿う線状に配されていてもよい（図３も参照）。発光パネル２と配線基板６が固定された状態で、配線基板側電極パッド６２ａ，６２ｂと発光パネル側電極パッド２３ａ，２３ｂとがワイヤ８により結線される。   Next, the joining structure of the light emitting panel 2 and the wiring board 6 will be described with reference to FIGS. 5 and 6 in addition to FIG. 4 described above. FIG. 5 is a cross-sectional view taken along line AA passing through the electrode pads 23a and 62a corresponding to the anode shown in FIG. The cross-section passing through the electrode pads 23b and 62b corresponding to the cathode differs in the electrode extraction structure from the light emitting portion 22 to the light emitting panel side electrode pad 23b, but the bonding structure of the electrode pads 23b and 62b is the bonding structure on the anode side. The illustration is omitted. The wiring substrate 6 is bonded and fixed on the sealing can 24 by a fixing portion 9 such as an adhesive tape. The fixing portion 9 is provided at a position directly below the portion where the wiring board side electrode pads 62a and 62b are formed on the surface of the wiring board 6 facing the sealing can 24. The fixing portion 9 may be arranged in a dot shape so as to correspond to each of the wiring board side electrode pads 62a and 62b, or is arranged in a line shape along each wiring board side electrode pad 62a and 62b. (See also FIG. 3). In a state where the light emitting panel 2 and the wiring board 6 are fixed, the wiring board side electrode pads 62 a and 62 b and the light emitting panel side electrode pads 23 a and 23 b are connected by the wire 8.

ワイヤ８は、各パッド間に複数本（図例では３本）結線されることが望ましい。こうすれば、いずれかのワイヤ８が断線した場合でも、他のものが断線されなければ、各パッド間の電気的接続は切断されないので、発光部２２を均一に発光させることができる。ワイヤ８には、例えば、純アルミニウム線が用いられる。この純アルミニウム線は、超音波接合により、常温かつ短時間で、各電極端子を構成する導電層とを接合することができる。ワイヤ８の径は、発光パネル２の消費電流や材質等を考慮して決定される。例えば、消費電流が１Ａである場合、安全率５０％を考慮に入れて、溶断電流が２Ａの１００μｍ線径以上のワイヤが用いられる。なお、アルミニウムの他に、銅や金のワイヤも用いてもよい。   It is desirable that a plurality of wires 8 (three in the illustrated example) are connected between the pads. In this way, even if any one of the wires 8 is disconnected, the electrical connection between the pads is not disconnected unless the other is disconnected, so that the light emitting unit 22 can emit light uniformly. For the wire 8, for example, a pure aluminum wire is used. This pure aluminum wire can be bonded to the conductive layer constituting each electrode terminal by ultrasonic bonding at room temperature and in a short time. The diameter of the wire 8 is determined in consideration of the current consumption and material of the light emitting panel 2. For example, when the consumption current is 1 A, taking into consideration a safety factor of 50%, a wire having a fusing current of 2 A and a wire diameter of 100 μm or more is used. In addition to aluminum, copper or gold wire may also be used.

ワイヤ８のボンディングが完了した後、発光部２２を封止する封止缶２４の側端部から発光パネル側電極パッド２３ａ，２３ｂを被覆するように封止樹脂部材７が設けられる。この封止樹脂部材７には、例えば、シリコーン樹脂やエポキシ樹脂等が用いられる。封止樹脂部材７は、上記樹脂材料が、封止缶２４の側端部から発光パネル側電極パッド２３ａ，２３ｂを被覆するように、ディスペンサ等によって塗布されることにより形成される。つまり、発光パネル側電極パッド２３ａ，２３ｂは、接合されたワイヤ８の接合端部と共に封止樹脂部材７によって被覆されている。このとき、封止樹脂部材７は、樹脂材料を塗布した際に、封止缶２４の側端部側及びワイヤ８の近傍において流動性が低くなるので、これらの近傍において厚みが厚くなり、基板２１の周縁側へ向かうほど、厚みが薄くなる。そのため、封止樹脂部材７のケース５２に対向する面は、周縁方向に傾斜する斜面となる。また、ワイヤ８は、発光パネル側電極パッド２３ａ，２３ｂとの接合箇所を含む、ワイヤ８の全長Ｌ２（図６（ａ）参照）の３０〜６０％が封止樹脂部材７によって被覆される。一方、ワイヤ８の配線基板側電極パッド６２ａ，６２ｂ側の部分は、封止樹脂部材７によって被覆されない。   After the bonding of the wire 8 is completed, the sealing resin member 7 is provided so as to cover the light emitting panel side electrode pads 23 a and 23 b from the side end portion of the sealing can 24 that seals the light emitting portion 22. For example, a silicone resin or an epoxy resin is used for the sealing resin member 7. The sealing resin member 7 is formed by applying the resin material from a side end portion of the sealing can 24 with a dispenser or the like so as to cover the light emitting panel side electrode pads 23a and 23b. That is, the light emitting panel side electrode pads 23 a and 23 b are covered with the sealing resin member 7 together with the joined end portions of the joined wires 8. At this time, when the resin material is applied, the sealing resin member 7 has low fluidity in the vicinity of the side end portion of the sealing can 24 and in the vicinity of the wire 8, so that the thickness increases in the vicinity of the substrate. The thickness decreases toward the peripheral side of 21. Therefore, the surface of the sealing resin member 7 that faces the case 52 is an inclined surface that is inclined in the peripheral direction. In addition, the wire 8 is covered with the sealing resin member 7 at 30 to 60% of the entire length L2 (see FIG. 6A) of the wire 8 including the joint portions with the light emitting panel side electrode pads 23a and 23b. On the other hand, the wiring board side electrode pads 62 a and 62 b side portions of the wires 8 are not covered with the sealing resin member 7.

配線基板側電極パッド６２ａ，６２ｂは、図５及び図６（ａ）に示したように、これら電極パッド６２ａ，６２ｂ同士の間隔Ｄが、ワイヤ８の封止樹脂部材７によって被覆されていない部分の長さＬ１よりも長くなるように配置されている。この構成によれば、ワイヤ８と発光パネル側電極パッド２３ａ，２３ｂとの接合箇所は、それらがボンディングされているだけでなく、封止樹脂部材７によって固定されるので、ワイヤ８の封止樹脂部材７で覆われた部分においてワイヤ８が断線することは殆ど無い。一方、図６（ｂ）に示したように、ワイヤ８は、配線基板側電極パッド６２ａ，６２ｂ側の封止樹脂部材７によって被覆されていない部分において、衝撃等によって断線することがある。これに対して、配線基板側電極パッド６２ａ，６２ｂ同士の間隔Ｄが、断線したワイヤ８の長さよりも長いので、断線したワイヤ８の端部が、他の電極パッド（図例では配線基板側電極パッド６２ｂ）に接触し難い。そのため、この発光モジュール３によれば、ワイヤ８が断線したときでも、ショートを起こし難く、発光部２２を均一に発光させることができる。   As shown in FIG. 5 and FIG. 6A, the wiring board side electrode pads 62a and 62b are portions in which the distance D between the electrode pads 62a and 62b is not covered with the sealing resin member 7 of the wire 8. It arrange | positions so that it may become longer than length L1. According to this configuration, the bonding portion between the wire 8 and the light emitting panel side electrode pads 23a and 23b is not only bonded but also fixed by the sealing resin member 7. The wire 8 is hardly disconnected at the portion covered with the member 7. On the other hand, as shown in FIG. 6B, the wire 8 may be broken by an impact or the like in a portion not covered with the sealing resin member 7 on the wiring board side electrode pads 62a and 62b side. On the other hand, since the distance D between the wiring board side electrode pads 62a and 62b is longer than the length of the disconnected wire 8, the end of the disconnected wire 8 is connected to another electrode pad (in the illustrated example, the wiring board side). It is difficult to contact the electrode pad 62b). Therefore, according to the light emitting module 3, even when the wire 8 is disconnected, it is difficult to cause a short circuit, and the light emitting unit 22 can emit light uniformly.

配線基板側電極パッド６２ａ，６２ｂ同士の間隔のうち、最も短い間隔（図示した間隔Ｄ）は、ワイヤ８の封止樹脂部材７によって被覆されていない部分の長さＬ１より長ければ、ワイヤ８の全長Ｌ２よりも短くてもよい。配線基板側電極パッド６２ａ，６２ｂ同士の間隔が短ければ、ワイヤボンディングに用いられるボンディングツールの移動距離が短くなるので、隣り合う電極パッドにおいて、ボンディングを連続的に行なうことができ、生産性が良くなる。   Of the intervals between the wiring board side electrode pads 62a and 62b, the shortest interval (the interval D shown in the figure) is longer than the length L1 of the portion of the wire 8 that is not covered with the sealing resin member 7, and It may be shorter than the total length L2. If the distance between the wiring board side electrode pads 62a and 62b is short, the moving distance of the bonding tool used for wire bonding becomes short. Therefore, bonding can be continuously performed on adjacent electrode pads, and productivity is improved. Become.

上記実施形態の変形例に係る発光モジュールについて、図７を参照して説明する。この変形例に係る発光モジュール３においては、配線基板側電極パッド６２ａ，６２ｂが、これらと接合されたワイヤ８の接合端部と共に封止樹脂７’によって被覆されている。この構成によれば、封止樹脂７’が配線基板側電極パッド６２ａ，６２ｂを保護すると共に、これら配線基板側電極パッド６２ａ，６２ｂと、ワイヤ８との断線を防止することができる。また、ワイヤ８は、封止樹脂部材７等によって被覆されていない部分が少なくなるので、断線したワイヤ８の端部が僅かな範囲でしか移動できない。そのため、例えば、隣り合う配線基板側電極パッド６２ａ，６２ｂに結線された夫々のワイヤ８が断線しても、各ワイヤ８同士が接触し難くなる。なお、この樹脂部材７’は、上述した発光パネル側電極パッド２３ａ，２３ｂを被覆する封止樹脂部材７と一体的に形成されていてもよい。また、封止樹脂７’は、その高さがアーチ状に結線されたワイヤ８の頂頭部よりも低くなるように形成されることが望ましい。こうすれば、発光パネル２の厚みが増すことなく、発光モジュール３をスリム化することができる。   A light emitting module according to a modification of the above embodiment will be described with reference to FIG. In the light emitting module 3 according to this modification, the wiring board side electrode pads 62a and 62b are covered with the sealing resin 7 'together with the joining end portions of the wires 8 joined thereto. According to this configuration, the sealing resin 7 ′ can protect the wiring board side electrode pads 62 a and 62 b and can prevent the wiring board side electrode pads 62 a and 62 b from being disconnected from the wire 8. In addition, since the wire 8 is less covered with the sealing resin member 7 or the like, the end portion of the disconnected wire 8 can move only in a small range. Therefore, for example, even if each wire 8 connected to the adjacent wiring board side electrode pads 62a and 62b is disconnected, the wires 8 are difficult to contact each other. The resin member 7 ′ may be formed integrally with the sealing resin member 7 that covers the light emitting panel side electrode pads 23 a and 23 b described above. Further, it is desirable that the sealing resin 7 ′ is formed such that its height is lower than the top of the wire 8 connected in an arch shape. In this way, the light emitting module 3 can be slimmed without increasing the thickness of the light emitting panel 2.

本発明は上記実施形態の構成に限られず、発明の趣旨を変更しない範囲で種々の変更が可能である。例えば、封止樹脂部材７は、透光性又は光反射性を有する樹脂材料から形成されていてもよい。この構成によれば、発光部２２から出射された一部の光が、正面方向に出射されることなく、基板２１の側方方向に導光された場合であっても、この光が封止樹脂部材７に入射する。そして、封止樹脂部材７に入射した光が、封止樹脂部材７の非発光面側の面で全反射される、又は基板２１と封止樹脂部材７との界面で反射されて、基板２１から発光モジュール３の正面方向に出射される。その結果、発光モジュール３の光利用効率を向上させることができる。   The present invention is not limited to the configuration of the embodiment described above, and various modifications can be made without departing from the spirit of the invention. For example, the sealing resin member 7 may be formed from a resin material having translucency or light reflectivity. According to this configuration, even if a part of the light emitted from the light emitting unit 22 is guided in the lateral direction of the substrate 21 without being emitted in the front direction, the light is sealed. Incident on the resin member 7. Then, the light incident on the sealing resin member 7 is totally reflected on the surface on the non-light emitting surface side of the sealing resin member 7 or reflected on the interface between the substrate 21 and the sealing resin member 7, and the substrate 21. Is emitted in the front direction of the light emitting module 3. As a result, the light use efficiency of the light emitting module 3 can be improved.

１ 照明装置
２ 発光パネル
２１ 基板
２２ 発光部
２３ａ 発光パネル側電極パッド（陽極）
２３ｂ 発光パネル側電極パッド（陰極）
３ 発光モジュール
６ 配線基板
６２ａ 配線基板側電極パッド（陽極）
６２ｂ 配線基板側電極パッド（陰極）
７ 封止樹脂部材（封止樹脂）
８ ワイヤ（ボンディングワイヤ） DESCRIPTION OF SYMBOLS 1 Illumination device 2 Light emission panel 21 Board | substrate 22 Light emission part 23a Light emission panel side electrode pad (anode)
23b Light emitting panel side electrode pad (cathode)
3 Light Emitting Module 6 Wiring Board 62a Wiring Board Side Electrode Pad (Anode)
62b Wiring board side electrode pad (cathode)
7 Sealing resin member (sealing resin)
8 wire (bonding wire)

Claims (5)

平板状の発光パネルと、この発光パネルの一面側に設けられ該発光パネルに給電するための配線基板と、を備えた発光モジュールであって、
前記発光パネルは、前記配線基板が設けられる面の該配線基板よりも外方に形成された複数の発光パネル側電極パッドを有し、
前記配線基板は、前記発光パネルと対向する面とは反対側の面の前記発光パネル側電極パッドに近接した位置に形成された複数の配線基板側電極パッドを有し、
前記発光パネル側電極パッド及び前記配線基板側電極パッドはボンディングワイヤにより互いに電気的に接続され、
前記発光パネル側電極パッドは、該発光パネル側電極パッドと接合されたボンディングワイヤの接合端部と共に封止樹脂によって被覆されており、
前記複数の配線基板側電極パッドは、該配線基板側電極パッド同士の間隔が、前記ボンディングワイヤの前記封止樹脂によって被覆されていない部分の長さよりも長くなるように配置されていることを特徴とする発光モジュール。 A light emitting module comprising a flat light emitting panel and a wiring board provided on one side of the light emitting panel for supplying power to the light emitting panel,
The light-emitting panel has a plurality of light-emitting panel-side electrode pads formed outside the wiring board on the surface on which the wiring board is provided,
The wiring board has a plurality of wiring board side electrode pads formed at positions close to the light emitting panel side electrode pads on the surface opposite to the surface facing the light emitting panel;
The light emitting panel side electrode pad and the wiring board side electrode pad are electrically connected to each other by a bonding wire,
The light emitting panel side electrode pad is covered with a sealing resin together with a bonding end of a bonding wire bonded to the light emitting panel side electrode pad,
The plurality of wiring board side electrode pads are arranged such that an interval between the wiring board side electrode pads is longer than a length of a portion of the bonding wire not covered with the sealing resin. The light emitting module. 前記配線基板側電極パッド同士の間隔のうち、最も短い間隔が、前記ボンディングワイヤの全長よりも短いことを特徴とする発光モジュール。   The light emitting module characterized in that the shortest interval among the intervals between the wiring substrate side electrode pads is shorter than the total length of the bonding wires. 前記複数の配線基板側電極パッドは、陽極及び陰極が交互に並ぶように配置されていることを特徴とする請求項１又は請求項２に記載の発光モジュール。   The light emitting module according to claim 1, wherein the plurality of wiring board side electrode pads are arranged so that anodes and cathodes are alternately arranged. 前記配線基板側電極パッドは、該配線基板側電極パッドと接合された前記ボンディングワイヤの接合端部と共に封止樹脂によって被覆されていることを特徴とする請求項１乃至請求項３のいずれか一項に記載の発光モジュール。   4. The wiring board side electrode pad is covered with a sealing resin together with a bonding end portion of the bonding wire joined to the wiring board side electrode pad. The light emitting module according to item. 請求項１乃至請求項４のいずれか一項に記載の発光モジュールを用いた照明装置。   The illuminating device using the light emitting module as described in any one of Claims 1 thru | or 4.
JP2011208042A 2011-09-22 2011-09-22 Light emitting module and lighting device Expired - Fee Related JP5838299B2 (en)

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
JP2013182867A (en) * 2012-03-05 2013-09-12 Konica Minolta Inc Planar light emitter and lighting device
JP2014090036A (en) * 2012-10-29 2014-05-15 Kaneka Corp Organic el device
KR20150028470A (en) * 2013-09-06 2015-03-16 엘지이노텍 주식회사 The light device
JP2015079737A (en) * 2013-09-11 2015-04-23 パナソニックＩｐマネジメント株式会社 Light emitting module

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JPS58182837A (en) * 1982-04-21 1983-10-25 Hitachi Ltd Manufacture of resin sealed semiconductor device
JP2001143864A (en) * 1999-11-16 2001-05-25 Fuji Photo Film Co Ltd Luminous element and its manufacturing method
JP2010232286A (en) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd Method for feeding electric power to planar light-emitting element

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JPS58182837A (en) * 1982-04-21 1983-10-25 Hitachi Ltd Manufacture of resin sealed semiconductor device
JP2001143864A (en) * 1999-11-16 2001-05-25 Fuji Photo Film Co Ltd Luminous element and its manufacturing method
JP2010232286A (en) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd Method for feeding electric power to planar light-emitting element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013182867A (en) * 2012-03-05 2013-09-12 Konica Minolta Inc Planar light emitter and lighting device
JP2014090036A (en) * 2012-10-29 2014-05-15 Kaneka Corp Organic el device
KR20150028470A (en) * 2013-09-06 2015-03-16 엘지이노텍 주식회사 The light device
KR102107622B1 (en) 2013-09-06 2020-05-07 엘지이노텍 주식회사 The light device
JP2015079737A (en) * 2013-09-11 2015-04-23 パナソニックＩｐマネジメント株式会社 Light emitting module

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