JP2013057720A - Optical module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical module which achieves improved optical coupling efficiency either in a configuration for receiving a light signal from an optical fiber with a light receiving element or in a configuration for receiving a light signal from a light emission element with an optical fiber.SOLUTION: The optical module includes a substrate 1 in which a first groove 1a and a second groove 1b which is deeper than the first groove 1a and has a substantially trapezoidal shape are continuously formed on its surface, a mirror 15 for converting an optical path and arranged at a tip end of the first groove 1a, an internal waveguide 16 arranged in the first groove 1a of the substrate 1, a light emission element 12a which is mounted on the surface of the substrate 1 so as to face the mirror 15 and emits the light signal to a core 17 of the internal waveguide 16 via the mirror 15, and an optical fiber 2 which has a fiber clad 22 arranged in the second groove 1b, and a fiber core 21 optically coupled to the core 17 of the internal waveguide 16.

Description

  The present invention relates to an optical module that transmits or receives an optical signal.

  As a conventional optical module, an optical module described in Patent Document 1 is known. In this optical module, as shown in FIG. 20, two V grooves 31 and 32 having different shapes are formed on a substrate 30. In one V-groove 31, a clad portion 33b of an optical fiber 33 is fixed. The clad portion 33b is positioned by the rising slope portion 36 at the boundary portion between the V grooves 31 and 32. A mirror (reflection surface) 34 is formed at the tip of the other V-groove 32. The mirror 34 changes the optical axis of the core portion 33 a of the optical fiber 33. The light receiving element 35 mounted on the substrate 30 receives an optical signal from the optical fiber 33.

Japanese Patent Application Laid-Open No. 9-54228

  However, in the above optical module, the distance from the tip 33c of the core portion 33a of the optical fiber 33 to the mirror 34 is long. For this reason, the luminous flux emitted from the core portion 33a spreads, and there is a problem that the optical coupling efficiency is lowered.

  The present invention has been made to solve the above problems. An object of the present invention is to provide an optical module in which the optical coupling efficiency is improved regardless of whether the optical signal from the optical fiber is received by the light receiving element or the optical signal from the light emitting element is received by the optical fiber. is there.

  In order to solve the above-described problems, the present invention provides a substrate in which at least one first groove and a second groove deeper than the first groove are continuously formed on the surface, and in the first groove of the substrate. Mounted on the surface of the substrate so as to be opposed to the mirror portion, and an internal waveguide provided on the front end of the first groove, and a mirror portion for optical path conversion provided at the tip of the first groove. And an optical element that emits an optical signal to the core portion of the internal waveguide or receives an optical signal from the core portion of the internal waveguide via the mirror portion, and is installed in the second groove. And an optical fiber having a fiber core portion optically connected to the core portion of the internal waveguide, and the second groove has a bottom surface formed with a predetermined width, and a width of the bottom surface The fiber connected to each end of the direction There is provided an optical module characterized in that it comprises an inclined surface which supports the outer periphery of the cladding portion.

  In the core portion of the internal waveguide, when the optical element is a light emitting element, the width of the core portion gradually narrows from the mirror portion toward the connection end portion of the optical fiber with the fiber core portion. It can be set as the structure which has such a slope.

  In the core portion of the internal waveguide, when the optical element is a light receiving element, the width of the core portion gradually narrows from the connection end portion of the optical fiber to the fiber core portion toward the mirror portion. It can be set as the structure which has such a slope.

  The width of the core portion of the internal waveguide can be configured to be narrower than the width of the upper end of the first groove. Preferably, the width is substantially the same as the width of the fiber core portion. it can.

  The first groove may have a substantially trapezoidal cross section, and the bottom surface of the first groove may be wider than the core portion of the internal waveguide.

  A third groove having a substantially V-shaped cross-section deeper than the second groove is formed on the surface of the substrate continuously to the second groove, and the third groove is formed with a predetermined width. And an inclined surface that is connected to both ends in the width direction of the bottom surface of the third groove and supports the outer periphery of the coating portion of the optical fiber.

  The substrate may be installed on another substrate having a size larger than that of the substrate, and the optical fiber coating may be fixed to the other substrate.

  Further, a third groove having a substantially V-shaped cross section deeper than the second groove is formed on the surface of the substrate continuously to the second groove, and the third groove is covered with an optical fiber. In the configuration in which the portion is installed, the optical fiber can be installed on another substrate having a size larger than that of the substrate, and the coating portion of the optical fiber can be fixed to the other substrate.

  The substrate is installed on another substrate having a size larger than that of the substrate, a covering is fixed to the outer periphery of the coating portion of the optical fiber, and the covering of the optical fiber is fixed on the separate substrate. be able to.

  Each of the plurality of first grooves may be arranged on the substrate separately from each other.

  According to the present invention, an internal waveguide having a core portion is provided in the first groove of the substrate, and the fiber core portion of the optical fiber installed in the second groove of the substrate is optically connected to the core portion of the internal waveguide. I have to. When the optical element is a light emitting element, an optical signal is emitted to the core part of the internal waveguide via the mirror part. When the optical element is a light receiving element, the optical element is output from the core part of the internal waveguide via the mirror part. The optical signal is received.

  As described above, since the internal waveguide is interposed between the tip of the fiber core portion of the optical fiber and the mirror portion, both of the light flux emitted from the light emitting element and the light flux emitted from the fiber core portion of the optical fiber. Does not spread. Accordingly, optical signal transmission loss between the tip of the fiber core portion of the optical fiber and the mirror portion is almost eliminated, and the optical coupling efficiency is improved.

  For example, in flip chip mounting where the light emitting surface of the optical element is on the substrate side, it is desirable to bring the optical fiber close to the optical element, but depending on the outer diameter of the fiber, it is difficult to approach the optical element and the groove is deep. Then, the distance from the optical element becomes longer. Even in such a case, since the internal waveguide is interposed as described above, it is possible to eliminate almost no optical signal propagation loss between the tip of the fiber core portion of the optical fiber and the mirror portion. Efficiency can be improved.

  Further, since the second groove has a bottom surface, it is not necessary to deepen the groove and lengthen the inclined surface as in a V-shaped cross section. For example, when the second groove is formed by etching It can be easily formed in a short time as compared with the V-shaped cross section.

1 is a schematic side view of an optical module according to an embodiment of the present invention. 2A is a side cross-sectional view of FIG. 2A, FIG. 2B is a cross-sectional view taken along the line II of FIG. 2A, and FIG. c) is a sectional view taken along line II-II in FIG. FIG. 3A is a perspective view showing a first substrate, and FIG. 3B is a perspective view in which an internal waveguide is formed. 4A and 4B are diagrams illustrating a first substrate, in which FIG. 4A is a perspective view in which a light emitting element is mounted, and FIG. 4B is a perspective view in which an optical fiber is inserted. FIG. 5A is a perspective view in which the holding block is fixed to the first substrate, and FIG. 5B is a perspective view of the optical fiber. It is front sectional drawing which shows the relationship between the bottom face of a 1st groove | channel, and the core part of an internal waveguide. It is a figure which shows the 1st board | substrate of a 1st modification, Fig.7 (a) is a perspective view, FIG.7 (b) is front sectional drawing. It is front sectional drawing of the 1st board | substrate of a 2nd modification. It is a figure which shows the 1st board | substrate of a 3rd modification, Fig.9 (a) is a perspective view, FIG.9 (b) is side sectional drawing. It is a figure which shows the modification of the core part of the internal waveguide by the side of a light emitting element, Fig.10 (a) is a top view, FIG.10 (b) is front sectional drawing of Fig.10 (a), FIG.10 (c), (D) is a top view of another modification, respectively. It is a figure which shows the modification of the core part of the internal waveguide by the side of a light receiving element, Fig.11 (a) is a top view, FIG.11 (b) is front sectional drawing of Fig.11 (a), FIG.11 (c), (D) is a top view of another modification, respectively. It is side surface sectional drawing of the 1st example which adhered and fixed the coating | coated part of the optical fiber to the 2nd board | substrate. It is side surface sectional drawing of the 2nd example which adhered and fixed the coating | coated part of the optical fiber to the 2nd board | substrate. It is a figure which shows the 1st board | substrate which is other embodiment of this invention, Fig.14 (a) is a perspective view, FIG.14 (b) is front sectional drawing. It is a figure which shows the 1st board | substrate which is further another embodiment of this invention, and is sectional drawing of the 1st board | substrate with which the oxide film layer was formed in the whole substrate surface. It is a figure which shows the 1st board | substrate which is further another embodiment of this invention, and is the 1st by which the removal part was formed by partially removing only the surface of the shielding part from the oxide film layer formed in the surface of a board | substrate. It is sectional drawing of a board | substrate. It is a figure which shows the 1st board | substrate which is further another embodiment of this invention, and is sectional drawing of the 1st board | substrate with which the light absorber is arrange | positioned at the shielding part. (A) is sectional drawing of other embodiment of a 2nd groove | channel, (b) is sectional drawing of other embodiment of 2nd groove | channel. In other embodiments of the optical module, (a) is a sectional view in which a connector is disposed on the upper surface of the second substrate, and (b) is a sectional view in which an electrical terminal is disposed on the upper surface of the second substrate. . It is a figure which shows the optical module of patent document 1, Fig.20 (a) is side sectional drawing, FIG.20 (b) is front sectional drawing.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic side view of an optical module according to the present invention. 2A to 2C are views showing the first substrate 1 of the optical module on the light emitting side in FIG. 1, FIG. 2A is a side sectional view, and FIG. 2B is FIG. FIG. 2C is a cross-sectional view taken along the line II-II of FIG. 2A. 3A and 3B are views showing the first substrate 1, FIG. 3A is a perspective view, and FIG. 3B is a perspective view in which an internal waveguide is formed. 4A and 4B are views showing the first substrate 1, FIG. 4A is a perspective view in which the light emitting element 12 a is mounted, and FIG. 4B is a perspective view in which the optical fiber 2 is inserted. . FIG. 5 is a perspective view in which the holding block 24 is fixed.

  In FIG. 1, an optical module includes a first substrate (mount substrate) 1 that is a substrate on the light emitting side, a first substrate (mount substrate) 3 that is a substrate on the light receiving side, and the first substrates 1 and 3 optically. And an optical fiber 2 coupled to the optical fiber. In the following description, the vertical direction (the direction of arrow Y) in FIG. 1 is the vertical direction (height direction), the direction orthogonal to the paper surface is the left-right direction (width direction), the left side in FIG. It is called the back.

  In order to avoid the influence of heat during mounting and the influence of stress due to the use environment, the first substrates 1 and 3 need to have rigidity. In addition, in the case of optical transmission, an efficiency of a predetermined ratio or more is required for the optical transmission from the light emitting element to the light receiving element, so that the optical element can be mounted with high accuracy and position fluctuation during use can be suppressed as much as possible. There is a need to. For this reason, a silicon (Si) substrate is employed as the first substrates 1 and 3 in this embodiment.

  If the first substrates 1 and 3 are silicon substrates, the first substrates 1 and 3 can be etched on the surface with high precision using the crystal orientation of silicon. Using this groove, it is possible to form a highly accurate mirror portion 15 (described later). An internal waveguide 16 (described later) can be formed inside the groove. Moreover, the flatness of the silicon substrate is good.

  The first substrates 1 and 3 are respectively installed on the surface (upper surface) of a second substrate (another substrate, for example, an interposer substrate) 6 having a larger size. Connectors 7 for electrically connecting to other circuit devices are respectively attached to the back surface (lower surface) of each second substrate 6.

  On the surface (upper surface) of the first substrate 1, a light emitting element 12a that converts an electrical signal into an optical signal is mounted with bumps 12c (see FIG. 2) with the light emitting surface facing downward. An IC substrate (signal processing unit) 4a on which an IC circuit for transmitting an electrical signal to the light emitting element 12a is formed is mounted on the surface of the second substrate 6.

  In the present embodiment, a surface emitting laser (VCSEL (Vertical Cavity Surface Emitting Laser)) that is a semiconductor laser is employed as the light emitting element 12a. The light emitting element 12a may be an LED or the like.

  The IC substrate 4a is a driver IC that drives the VCSEL, and is disposed in the vicinity of the light emitting element 12a. The light emitting element 12 a and the IC substrate 4 a are connected to a wiring pattern formed on the surface of the first substrate 1 and the surface of the second substrate 6.

  On the surface (upper surface) of the first substrate 1, as shown in FIG. 3A, a first groove (waveguide forming groove) 1a having a substantially trapezoidal cross section and a deeper groove than the first groove 1a. Two grooves 1b are formed continuously in the front-rear direction.

  The second groove 1b includes a bottom surface 1f formed with a predetermined width and two inclined surfaces 1e supported in contact with an outer periphery of a fiber clad portion 22 of the optical fiber 2 described later. These inclined surfaces 1e are respectively connected to both ends in the width direction of the bottom surface 1f, and the distance from each of the both ends of the first substrate 1 is increased obliquely upward so that the distance from each other gradually increases toward the upper side. It extends to the surface (upper surface). By bringing the outer periphery of the fiber clad portion 22 of the optical fiber 2 into contact with these inclined surfaces 1e, the fiber clad portion 22 can be centered.

  Further, the bottom surface 1 f is formed so as not to be in contact with the outer periphery of the fiber cladding portion 22 when the inclined surface 1 e and the outer periphery of the fiber cladding portion 22 of the optical fiber 2 are in contact with each other.

  At the tip of the first groove 1a, an optical path changing mirror 15 for bending the optical path by 90 degrees is formed at a position directly below the light emitting element 12a.

  As shown in FIG. 3B, an internal waveguide 16 that is optically coupled to the light emitting element 12a of the first substrate 1 is provided in the first groove 1a of the first substrate 1. The internal waveguide 16 extends from the mirror portion 15 in the direction of the second groove 1b, and is slightly retracted from the rear end portion 1d of the first groove 1a to the mirror portion 15 side.

  The internal waveguide 16 includes a core portion 17 having a substantially square cross section with a high refractive index through which light propagates, and a cladding portion 18 having a refractive index lower than that.

  As shown in FIG. 2C, the left and right surfaces (both side surfaces) of the core portion 17 are covered with the cladding portion 18. Although not shown, the upper surface of the core portion 17 is also thinly covered with the cladding portion 18.

  As shown in FIG. 4A, a light emitting element 12a is mounted at a predetermined position on the surface of the first substrate 1 on which the internal waveguide 16 is provided. The space between the light emitting element 12a and the core portion 17 is filled with an adhesive optical transparent resin 13 as shown in FIG.

  Here, a method of manufacturing the light emitting side optical module will be described. Since the light-emitting side optical module and the light-receiving side optical module can be manufactured separately, and their manufacturing methods are the same, a method for manufacturing the light-emitting side optical module will be described as a representative.

  A plurality of mount substrates 1 are simultaneously formed using a silicon wafer (silicon substrate), and finally the silicon wafer is cut to separate the mount substrates 1 shown in FIG. As a silicon wafer, one having a selected crystal orientation is prepared for etching in the next process.

  Next, a 45 ° inclined surface for forming the first groove (waveguide forming groove) 1a and the mirror portion 15 is formed on the silicon wafer. These are formed by anisotropic etching utilizing the difference in etching rate of silicon crystals. In order to form the 45 ° inclined surface, the etching mask shape, the etchant concentration, and the composition are adjusted. In addition to anisotropic etching, there is a dry etching forming method such as reactive ion etching for forming the first groove 1a.

  When forming the 1st groove | channel 1a simultaneously with a 45 degree inclined surface, the cross-sectional shape of the 1st groove | channel 1a becomes a substantially trapezoid shape, and the groove width of the 1st groove | channel 1a becomes large. Since the first groove 1a is not a problem unless it is attached to the bonding pad for the light emitting element 12a to be formed in the next process, it is also possible to do this.

  The second groove 1b can be formed by the anisotropic etching, but the second groove 1b may be formed simultaneously with the formation of the first groove 1a or may be performed separately from the first groove 1a. .

  A wiring pattern (not shown) for mounting the light emitting element 12a is formed on the silicon wafer. The wiring is patterned by depositing gold on a silicon wafer. At this time, gold is also vapor-deposited on the 45 ° inclined surface to form the mirror portion 15. Although depending on the wavelength to be used, it is possible to use the 45 ° inclined surface as it is as the mirror part 15 without depositing gold on the 45 ° inclined surface. For example, when using a near infrared light source, If gold is vapor-deposited on a 45 ° inclined surface, the reflectance increases and the optical coupling efficiency increases. In addition to gold, a multilayer structure such as titanium, nickel, gold, aluminum or chromium, nickel, gold or the like is formed on the mounting substrate as a wiring material from the viewpoint of ease of solder mounting in the subsequent process and connection reliability. Sometimes. The thickness at the time of multilayer is, for example, 0.5 μm, 1 μm, and 0.2 μm, respectively.

  Next, as shown in FIG. 3, the internal waveguide 16 is formed in the first groove 1a. First, the core material and the first substrate 1 are applied, and the core material is flattened on the first substrate 1 using a flat mold. Thereafter, only the core portion is irradiated with ultraviolet rays using a mask to cure the core portion, and unnecessary portions other than the core portion are developed and removed. Next, a clad material having a refractive index lower than that of the core material is applied to the first groove 1a in which the core portion is formed, and the clad material is flattened on the first substrate 1 like the core material. In the flattened state, the clad material is hardened by using a mask to shield the first groove 1a from being irradiated with ultraviolet rays. The mask is adjusted so as to cure only the region covering the outer periphery of the core portion, and is designed so that the clad material does not cover the circuit of the mounting portion of the optical element 12a.

  Then, the light emitting element 12a is mounted on the silicon wafer as shown in FIG. Bumps are formed on the light emitting element 12a by stud bump bonding, and the silicon wafer and the light emitting element 12a are heated to 200 ° C. to perform ultrasonic bonding.

  Although illustration is omitted, after the light emitting element 12a is mounted, an underfill material is filled between the light emitting element 12a and the first substrate 1 to reinforce the bonding strength between the light emitting element 12a and the first substrate 1. I do. In addition, the funder fill material also has an effect of eliminating the air layer between the optical element and the internal waveguide and increasing the optical coupling efficiency. Moreover, in order to improve environmental resistance, you may seal the whole with an elastic sealing material.

  As shown in FIG. 1, the first substrate 1 on which the light emitting element 12 a is mounted is mounted on the surface (upper surface) of the second substrate 6, and the IC substrate 4 a is mounted. A connector 7 is attached to the lower surface.

  As described above, in this embodiment, the light emitting element 12a is mounted on the upper surface of the first substrate 1 mounted on the upper surface of the second substrate 6, and the IC substrate 4a is mounted on the upper surface of the second substrate 6. The connector 7 is mounted on the lower surface.

  Thereby, before mounting the 1st board | substrate 1 on the upper surface of the 2nd board | substrate 6, it becomes easy to test | inspect separately the IC board | substrate 4a of the 1st board | substrate 6, and the light emitting element 12a of the 1st board | substrate 1. FIG. .

  Even if one of the light emitting element 12a and the IC substrate 4a is defective, only one of the second substrate 6 and the first substrate 1 is defective, so that the entire substrate is not lost.

  Furthermore, the light emitting element 12a is mounted on the first substrate 1, not the second substrate 6 on which the IC substrate 4a is mounted, and the mirror portion 15 and the internal waveguide 16 are formed. As a result, the thermal influence from the IC substrate 4a hardly reaches the light emitting element 12a, and the light emission characteristics are stabilized.

  Returning to FIG. 1, the first substrate 3 on the light receiving side will be described. The basic structure of the first substrate 3 on the light receiving side is the same as that of the first substrate 1 on the light emitting side. However, a light receiving element 12b that converts an optical signal into an electrical signal is mounted on the surface (upper surface) of the first substrate 3 on the light receiving side with bumps with the light receiving surface facing downward. In addition, on the surface of the second substrate 6, an IC substrate (signal processing unit) 4b on which an IC circuit for transmitting an electric signal to the light receiving element 12b is formed is mounted. Different from 1. PD is adopted as the light receiving element 12b, and the IC substrate 4b is an element such as a TIA (Trans-impedance Amplifier) that performs current / voltage conversion.

  The first substrate 1 on the light emitting side, the first substrate 3 on the light receiving side, and the IC substrates 4 a and 4 b are respectively shielded by a shield case 8 attached to the surface of the second substrate 6. The optical fiber 2 passes through the through hole 8 a of the shield case 8.

  Next, the optical fiber 2 will be described. As shown in FIGS. 1 and 5, the optical fiber 2 optically connects the core portion 17 of the internal waveguide 16 of the first substrate 1 on the light emitting side and the core portion 17 of the internal waveguide 16 of the first substrate 3 on the light receiving side. It has a fiber core portion 21 that can be connected to the inside. The optical fiber 2 is a cord type that includes a fiber core portion 21, a fiber cladding portion 22 that surrounds the outer periphery of the fiber core portion 21, and a covering portion 23 that covers the outer periphery of the fiber cladding portion 22. The fiber core portion 21, the fiber clad portion 22, and the covering portion 23 are arranged concentrically, and the optical fiber 2 constituted by these has a circular cross section.

  As shown in FIG. 1, the optical fiber 2 passes through the through hole 8 a of the shield case 8, and the covering portion 23 is peeled off in the vicinity of the second groove 1 b of the first substrate 1. Therefore, the fiber clad portion 22 is exposed in the peeled portion.

  As shown in FIGS. 2A and 2C and FIG. 4B, a fiber cladding portion 22 of the optical fiber 2 is installed in the second groove 1b of the first substrate 1, and the boundary with the first groove 1a. The fiber clad part 22 is positioned by the rising slope part. At this time, optical coupling is performed in a positioning state in which the optical axes of the core portion 17 of the internal waveguide 16 of the first substrate 1 and the fiber core portion 21 of the optical fiber 2 coincide.

  The gap between the end face of the core portion 17 of the internal waveguide 16 of the first substrate 1 and the end face of the fiber core portion 21 of the optical fiber 2 is in the range of 0 to 200 μm. The preferred range depends on the size of both core portions 17 and 21, but in general, the gap is preferably 0 to 60 μm.

  On the upper side of the first substrate 1, as shown in FIG. 2A and FIG. 5, a holding block 24 is disposed on the upper portion of the fiber cladding portion 22 of the optical fiber 2. The space between the presser block 24 and the second groove 1b is filled with the adhesive 14.

  In this way, the tip side portion of the fiber clad portion 22 of the optical fiber 2 is in a state of being pressed against the second groove 1 b by the press block 24. This tip side portion is bonded and fixed to the first substrate 1 together with the pressing block 24 by the adhesive 14.

  In the optical module configured as described above, the internal waveguide 16 including the core portion 17 and the clad portion 18 is provided in the first groove 1 a of the first substrate 1. Further, the fiber core portion 21 of the optical fiber 2 installed in the second groove 1 b of the first substrate 1 is optically connected to the core portion 17 of the internal waveguide 16. Then, in the first substrate 1 on the light emitting side in which the optical element is the light emitting element 12a, an optical signal is emitted to the core part 17 of the internal waveguide 16 through the mirror part 15, and the light receiving side in which the optical element is the light receiving element 12b. In the first substrate 3, the optical signal from the core portion 17 of the internal waveguide 16 is received via the mirror portion 15.

  As described above, since the internal waveguide 16 is interposed between the tip of the fiber core portion 21 of the optical fiber 2 and the mirror portion 15, the light flux emitted from the light emitting element 12 a and the fiber core portion 21 of the optical fiber 2. None of the emitted light beam spreads. Therefore, the optical signal transmission loss between the tip of the fiber core portion 21 of the optical fiber 2 and the mirror portion 15 is almost eliminated, and the optical coupling efficiency is improved.

  Further, if the bottom surface of the first groove 1a is wider than the core portion 17 of the internal waveguide 16, the core portion 17 of the internal waveguide 16 is formed when the core portion 17 is formed, as shown in FIG. When patterning (photocuring), unnecessary reflection on the bottom surface is eliminated. Therefore, in this case, a highly accurate core shape can be obtained.

  In the internal waveguide 16 of the embodiment shown in FIGS. 1 to 6, the first groove 1 a which is a waveguide forming groove of the first substrate 1 has a substantially trapezoidal cross section, and the core portion 17 has a substantially square cross section. The left and right surfaces of the core portion 17 are covered with the clad portion 18.

  However, the internal waveguide 16 is not limited to this type. For example, as in the internal waveguide 16 shown in FIGS. 7A and 7B, the first groove 1a of the first substrate 1 has a substantially V-shaped cross section that is shallower than the second groove 1b. The part 17 may be formed in a substantially pentagonal cross-sectional shape adapted to the first groove 1 a, and both the left and right sides of the core part 17 may be covered with the clad part 18.

  Further, when a silicon oxide film 40 for insulation is formed on the surface of the first groove 1a as well as the surface of the first substrate 1 as in the internal waveguide 16 shown in FIG. The film 40 functions as the cladding portion 18 having a refractive index lower than that of the core portion 17. Therefore, the core portion 17 having a substantially inverted triangular cross section may be formed by filling the entire first groove 1a in which the silicon oxide film (corresponding to the clad portion 18) 40 is filled with the core resin.

  In the internal waveguide 16 shown in FIG. 8, since the entirety of the first groove 1a becomes the core portion 17, the light beam from the light emitting element 12a spreads in the width direction at the core portion 17, and a part of the light beam is an optical fiber. There is a possibility that the second fiber core portion 21 may not be reached.

  Therefore, as shown in FIG. 7B, by setting the width W <b> 1 of the core portion 17 to be substantially the same as the width W <b> 2 of the fiber core portion 21, almost all of the light flux reaches the fiber core portion 21 of the optical fiber 2. Therefore, the optical coupling efficiency is improved. The width W1 of the core portion 17 does not necessarily have to be substantially the same as the width W2 of the fiber core portion 21, and may be narrower than the width W3 of the upper end of the first groove 1a. These are the same even when the core portion 17 has a substantially square cross section as shown in FIG.

  As shown in FIGS. 10A and 10B, the core portion 17 of the internal waveguide 16 is a fiber core of the optical fiber 2 from the mirror portion 15 in the first substrate 1 on the light emitting side whose optical element is the light emitting element 12a. The width W (distance between both side surfaces 17a) can be formed in a slope shape that gradually decreases linearly toward the connection end with the portion 21. Further, the both side surfaces 17a can be formed in a stepped straight slope shape as shown in FIG. 10C or a curved slope shape as shown in FIG. 10D.

  On the contrary, in the first substrate 3 on the light receiving side where the optical element is the light receiving element 12b, the core portion 17 of the internal waveguide 16 is the fiber core portion of the optical fiber 2 as shown in FIGS. 21, the width W (distance between both side surfaces 17 a) can be formed in a slope shape so that the width W (distance between both side surfaces 17 a) gradually decreases from the connecting end portion to the mirror portion 15. Moreover, the both side surfaces 17a can be formed in a stepped straight slope shape as shown in FIG. 11C or a curved slope shape as shown in FIG.

  In this way, when the optical element is the light emitting element 12a, the core portion 17 of the internal waveguide 16 is tapered (that is, the shape becomes narrower toward the front), and is emitted from the light emitting element 12a. The luminous flux is converged. Further, when the optical element is the light receiving element 12b, the core part 17 of the internal waveguide 16 is narrowed backward (that is, a shape that becomes narrower toward the rear) to be emitted from the fiber core part 21 of the optical fiber 2. Converged light flux. Accordingly, in any case, the optical coupling efficiency is further improved.

  As shown in FIGS. 9A and 9B, on the surface (upper surface) of the first substrate 1, there is a third trapezoidal cross section that is continuous with the second groove 1b and deeper than the second groove 1b. A groove 1c is formed. The covering portion 23 of the optical fiber 2 can be installed in the third groove 1c.

  Specifically, the third groove 1c of this embodiment includes a bottom surface 1h formed with a predetermined width, and two inclined surfaces 1g that are in contact with and supported by the outer periphery of the covering portion 23 of the optical fiber 2. The inclined surfaces 1g of the third grooves are respectively connected to both ends in the width direction of the bottom surface 1h of the third groove 1c so as to gradually increase from the both ends as the distance from each other increases upward. It extends to the surface of the first substrate 1 toward the upper side. Further, the bottom surface 1h of the third groove 1c is formed so as not to contact the outer periphery of the covering portion 23 when the inclined surface 1g contacts the outer periphery of the covering portion 23 of the optical fiber 2.

  In this way, since the covering portion 23 of the optical fiber 2 can also be installed in the third groove 1c of the first substrate 1, the stress from the optical fiber 2 is concentrated on the boundary portion with the covering portion 23 of the fiber cladding portion 22. Can be prevented. Further, the outer periphery of the covering portion 23 of the optical fiber 2 is brought into contact with the inclined surface 1g of the third groove 1c, whereby the centering of the covering portion 23 of the optical fiber 2 can be performed.

  Similarly to the fiber clad part 22, if the covering part 23 is bonded and fixed to the third groove 1c with an adhesive, the fixing strength of the optical fiber 2 is improved. Even if a bending force or a pulling force is applied to the optical fiber 2 from the outside of the module, the optical coupling efficiency with the internal waveguide 16 is not affected, so that the optical coupling efficiency does not decrease.

  Further, when the covering portion 23 is not bonded and fixed to the third groove 1c, as shown in FIG. 12, the adhesive 20 is built up on the surface of the second substrate 6 (that is, provided so as to protrude upward). Thus, the covering portion 23 of the optical fiber 2 can be fixed to the second substrate 6.

  In this way, since the covering portion 23 of the optical fiber 2 can be installed and fixed on the second substrate 6, the fixing strength of the optical fiber 2 is improved. Further, even if a bending force or a pulling force acts on the optical fiber 2 from the outside of the module, the optical coupling efficiency with the internal waveguide 16 is not affected, so that the optical coupling efficiency does not decrease. Furthermore, if a structure in which the covering portion 23 of the optical fiber 2 is installed and fixed in the third groove 1c of the first substrate 1 is used in combination, the fixing strength is further improved.

  As shown in FIG. 13, when the tube-shaped covering 25 is fitted into the covering portion 23 of the optical fiber 2, the covering portion 23 and the covering body 25 of the optical fiber 2 are fixed to the second substrate 6 with the adhesive 20. can do. The covering 25 is set to have an outer diameter capable of maintaining the optical fiber 2 in parallel with the substrates 1 and 6. Note that the covering 25 is not limited to the one fitted into the covering 23 as long as it covers the outer periphery of the covering 23.

  Further, the covering body 25 may be bonded at the third groove 1c portion of the first substrate 1 (not shown).

  The covering portion 23 is a layer having a thickness of about 5 to 100 μm formed of, for example, a UV curable resin, and the covering body 25 is made of, for example, PVC, nylon, or a thermoplastic polyester elastomer (for example, Hytrel (registered trademark)). The single core is formed with an outer diameter of about 900 microns.

  If comprised in this way, the coating | coated body 25 can be installed in the 2nd board | substrate 6, and can be fixed to the 2nd board | substrate 6 with the coating | coated part 23 of the optical fiber 2. FIG. Thereby, the fixing strength of the optical fiber 2 is improved. Further, even if a bending force or a pulling force acts on the optical fiber 2 from the outside of the module, the optical coupling efficiency with the internal waveguide 16 is not affected, so that the optical coupling efficiency does not decrease. Furthermore, if a structure in which the covering portion 23 of the optical fiber 2 is installed and fixed in the third groove 1c of the first substrate 1 is used in combination, the fixing strength is further improved. In addition, the bending of the optical fiber 2 due to its own weight can be suppressed by the thickness of the covering 25, and the optical fiber 2 can be fixed in parallel to the substrates 1 and 6. As a result, stress is unlikely to occur in the optical coupling portion between the optical fiber 2 and the internal waveguide 16, so that the optical coupling efficiency is unlikely to decrease. Even if only the covering 25 is fixed to the second substrate 6 with the adhesive 20, the same effect can be obtained.

  The covering body 25 is a short type (for example, 20 to 40 mm) that fits into the covering portion 23 at the front and rear portions of the through-hole 8a in order to protect against bending of the covering portion 23 of the optical fiber 2 that exits from the through-hole 8a of the shield case 8. Length). Moreover, the covering 25 has a long type that covers the entire length of the covering 23 that connects the modules in order to protect the entire strength of the optical fiber 2 and to cope with flame retardancy.

  In the embodiment, when the tilt angle of the mirror portion 15 is 45 degrees, the optical coupling efficiency is improved.

  If the first substrate 1 is made of silicon (Si), the first groove 1a and the second groove 1b can be formed by anisotropic etching of silicon. According to this, groove processing utilizing the crystal orientation of silicon is possible, the first groove 1a can form a highly accurate mirror shape, and the second groove 1b can reduce misalignment of the installation of the optical fiber 2. Can do.

  A photosensitive resin can be used as the material of the internal waveguide 16. According to this, compared with the inorganic internal waveguide formed repeatedly by ion doping or deposition, it is cheap and easy to form.

  Furthermore, a silicon oxide film can be formed on the surface of the first substrate 1 including the inside of the first groove 1a, so that the refractive index of the core portion 17 of the internal waveguide 16 can be made larger than that of the silicon oxide film. According to this, the internal waveguide 16 can be easily formed by filling the first groove 1 a with the material that becomes the core portion 17 of the internal waveguide 16.

  In the above embodiment, an example in which one first groove and one second groove are formed on one substrate is shown, but the present invention is not limited to this, and FIG. As shown in a) and FIG. 14 (b), a plurality of first grooves 1a and a plurality of second grooves 1b are formed, and a plurality of first grooves 1a are arranged in parallel and a plurality of second grooves. You may make it arrange | position 1b in parallel.

  In the optical module shown in FIGS. 14A and 14B, a plurality of first grooves having a substantially trapezoidal cross section are formed on the surface of the first substrate 1 as shown in FIG. Waveguide-forming grooves) 1 a are arranged in parallel in a state where they are separated from each other by the material of the first substrate 1.

  Furthermore, a plurality of second grooves 1b having a substantially V-shaped cross section deeper than the first groove 1a are formed on the surface of the first substrate 1 continuously from the end of each first groove 1a in the front-rear direction. Has been.

  As shown in FIG. 14 (a), an optical path converting mirror 15 is formed at the tip of each first groove 1a. As shown in FIG. 14B, an internal waveguide 16 that optically couples with the light emitting element 12a corresponding to each first groove 1a is provided inside each first groove 1a.

  The internal waveguide 16 includes a core portion 17 having a substantially square cross section with a high refractive index through which light propagates, and a cladding portion 18 having a refractive index lower than that. As shown in FIG. 14B, the left and right surfaces (both side surfaces) of the core portion 17 are covered with the cladding portion 18. Further, the clad portion 18 is thinly covered on the upper surface of the core portion 17.

  In the configuration shown in FIG. 14A and FIG. 14B, since the plurality of first grooves 1a are arranged in a state separated from each other by the material of the first substrate 1, each of the first grooves 1a is formed. It is possible to suppress leakage (crosstalk) of the optical signal passing through to the adjacent first groove 1a.

  Further, as shown in FIG. 14B, the interval P between the core portions 17 of the adjacent internal waveguides 16 is not particularly limited in the present invention, and can be arbitrarily set. For example, considering that the optical fibers of a conventionally known optical fiber array are often arranged at intervals of 250 μm, the interval P between the core portions 17 may be set to about 250 μm.

  The size of the second groove 1b is not particularly limited in the present invention. Considering that the outer diameter of the most commonly used thin optical fiber is 125 μm, the size of the second groove 1 b is the size corresponding to the optical fiber having the outer diameter of the cladding portion 22 of about 125 μm. It may be set. In order to suppress crosstalk, it is desirable to separate the second groove 1b from the adjacent second groove 1b as shown in FIG.

  Furthermore, as still another embodiment of the present invention, in the optical module shown in FIG. 15, in the structure in which a plurality of first grooves 1a are arranged, the entire surface of the substrate 1 (that is, the surface of the first groove 1a and the shielding). An oxide film layer 34 is formed on the entire surface of the portion 30. The shielding part 30 is a part that protrudes upward between the first grooves 1a in the substrate 1 and shields the scattered component a of the reflected light of the mirror part 15 between the first grooves 1a from leaking.

  The oxide film layer 34 can reflect the optical signal so as not to leak out of the first groove 1a, and can also suppress the leakage of the scattered component a of the reflected light from the mirror unit 15. According to this configuration, since the oxide film layer 34 becomes a reflection layer that reflects an optical signal, leakage (crosstalk) of the optical signal can be further suppressed. Strictly speaking, an optical signal composed of infrared light or the like has a property of passing through the substrate 1 composed of silicon while being attenuated, but the optical signal is reflected by the oxide film layer 34 as described above. As a result, the crosstalk suppression effect can be improved.

  In FIG. 15, the gap between the optical element 11 having the light emitting portion 12a and the substrate 1 is exaggerated and enlarged so that the light path can be easily seen, but in reality, this gap is very small. And no large crosstalk occurs. The same applies to FIGS.

  Furthermore, as still another embodiment of the present invention, the optical module shown in FIG. 16 includes a shielding portion protruding upward in the structure in which the oxide film layer 34 is formed on the surface of the substrate 1 as shown in FIG. The removal portion 32 is formed by partially removing the oxide film layer 34 on the surface of 30. According to this configuration, in the case where leaked light d that is multiply reflected between the optical element 11 having the light emitting part 12a and the clad part 18 is generated, the leaked light d is removed from the removed portion 32 of the oxide film layer 34 to the first substrate. 1 can be absorbed.

  Furthermore, as still another embodiment of the present invention, in the optical module shown in FIG. 17, the light absorber 35 along the shielding part 30 is arranged on the surface of the shielding part 30 protruding upward from the first substrate 1. Has been. As the light absorber 35, for example, opaque acrylic or epoxy resin is used. According to this configuration, when the leaked light d that is multiple-reflected between the optical element 11 having the light emitting part 12a and the clad part 18 is generated, the leaked light d is absorbed by the light absorber 35 and the light leakage is prevented. Can be blocked.

  Further, the optical element 11 is not limited to an integrated array, and the light emitting element 12a may be separated, or the light emitting element 12a and the light receiving element 12b may be mounted together. Further, the plurality of mirror portions 15 are not necessarily arranged on the same line. For example, the length of the first groove 1a and the internal waveguide 16 is different from that of the adjacent channel, and the mirror portion 15 and the light emitting element 12a or 12b are arranged. By arranging them offset, the crosstalk suppression effect can be further improved.

  Moreover, in the said embodiment, although the bottom face of the 2nd groove | channel of the 1st board | substrate was formed in planar shape, it can change suitably not only in the thing of this form. For example, as shown in FIG. 18A, the bottom surface 100f of the second groove 100b of the first substrate 100 is curved, and the inclined surface 100e is formed from both ends in the width direction of the curved bottom surface 100f. May be formed obliquely upward.

  Moreover, in the said embodiment, although the bottom face and inclined surface of the 2nd groove | channel of the 1st board | substrate were mutually connected, it can change suitably not only in this form. For example, as shown in FIG. 18 (b), the inclined surface 200e and the bottom surface 200f may be indirectly connected via a connecting portion 200i.

  Specifically, the second groove 200b of the first substrate 200 is provided with connecting portions 200i extending in the vertical direction from both ends in the width direction of the bottom surface 200f, and the inclined surfaces 200e are respectively It is assumed that the connection portions 200i are formed obliquely upward. As for the third groove, similarly to the second groove, the bottom surface may have a curved shape, and the bottom surface and the inclined surface may be indirectly connected via a connecting portion. Can change.

  Furthermore, in the said embodiment, although the connector 7 was attached to the back surface (lower surface) of the 2nd board | substrate 6, it is not restricted to the thing of this form, For example, as shown in FIG. It is also possible to arrange on the surface (upper surface) of the two substrates 6 and can be changed as appropriate.

  Further, instead of the connector 7, electrical terminals 207 may be provided on the surface of the second substrate 6. Then, for example, another connector 207a that is detachably fitted to the end of the second substrate 6 is provided with an electrical terminal 207b that is connected to the electrical terminal 207, and the other connector 207a is fitted to the second substrate 6. Let Thereby, you may enable it to connect the electrical terminal 207 to the electrical terminal 207b of the other connector 207a.

  As described above, the optical module of the present embodiment has a substrate on the surface of which at least one first groove and a second groove deeper than the first groove are continuously formed, and the first of the substrate. An internal waveguide provided in the groove, an optical path converting mirror provided at the tip of the first groove, and mounted on the surface of the substrate so as to face the mirror, and the internal through the mirror An optical element that emits an optical signal to the core portion of the waveguide or receives an optical signal from the core portion of the internal waveguide through a mirror portion, and a cladding portion and an internal waveguide installed in the second groove An optical fiber having a fiber core portion optically connected to the core portion, and the second groove is connected to each of a bottom surface formed with a predetermined width and both ends of the bottom surface in the width direction. And an inclined surface supporting the outer periphery of the part And it is characterized in and.

  According to this, an internal waveguide having a core portion is provided in the first groove of the substrate, and the fiber core portion of the optical fiber installed in the second groove of the substrate is optically connected to the core portion of the internal waveguide. ing. When the optical element is a light emitting element, an optical signal is emitted to the core part of the internal waveguide via the mirror part. When the optical element is a light receiving element, the optical element is output from the core part of the internal waveguide via the mirror part. The optical signal is received.

  As described above, since the internal waveguide is interposed between the tip of the fiber core portion of the optical fiber and the mirror portion, both of the light flux emitted from the light emitting element and the light flux emitted from the fiber core portion of the optical fiber. Does not spread. Therefore, the optical signal propagation loss between the tip of the fiber core portion of the optical fiber and the mirror portion is almost eliminated in any direction, so that the optical coupling efficiency is improved.

  For example, in flip chip mounting in which the light emitting surface of the optical element is on the substrate side, it is desirable to bring the optical fiber close to the optical element, but it is difficult to bring it close to the optical element depending on the outer diameter of the fiber. Further, when the groove is deepened, the distance from the optical element becomes longer. Even in such a case, since the internal waveguide is interposed as described above, it is possible to eliminate almost no optical signal propagation loss between the tip of the fiber core portion of the optical fiber and the mirror portion. Efficiency can be improved.

  Further, since the second groove has a bottom surface, it is not necessary to deepen the groove and lengthen the inclined surface as in a V-shaped cross section. For example, when the second groove is formed by etching It can be easily formed in a short time as compared with the V-shaped cross section.

  In addition, the core portion of the internal waveguide is such that when the optical element is a light emitting element, the width of the core portion gradually decreases from the mirror portion toward the connection end portion with the fiber core portion of the optical fiber. It can be set as the structure which has a slope.

  According to this, when the optical element is a light emitting element, the light beam emitted from the light emitting element is converged by tapering the core portion of the internal waveguide. Therefore, the optical coupling efficiency is further improved.

  Further, the core portion of the internal waveguide is such that the width of the core portion gradually narrows from the connecting end portion of the optical fiber to the mirror portion when the optical element is a light receiving element. It can be set as the structure which has a slope.

  According to this, when the optical element is a light receiving element, the light beam emitted from the fiber core part of the optical fiber is converged by making the core part of the internal waveguide thinner. Therefore, the optical coupling efficiency is further improved.

  The width of the core portion of the internal waveguide may be narrower than the width of the upper end of the first groove.

  According to this, when the width of the core portion of the internal waveguide is the same as the width of the upper end of the first groove, the light beam from the optical element spreads in the width direction at the core portion, and a part of the light beam is an optical fiber. There is a risk that it will not reach the fiber core. Therefore, the width of the core portion is narrower than the width of the upper end of the first groove, preferably approximately the same width as the width of the fiber core portion, so that almost all of the light beam can reach the fiber core portion of the optical fiber. As a result, the optical coupling efficiency is improved.

  The first groove may have a substantially trapezoidal cross section, and the bottom surface of the first groove may be wider than the core portion of the internal waveguide.

  According to this, since the bottom surface of the first groove is made wider than the core portion of the internal waveguide, it is unnecessary at the bottom surface when patterning (photocuring) the core portion of the internal waveguide when forming the core portion. Therefore, a highly accurate core shape can be obtained. Incidentally, when the V groove is as shown in Patent Document 1, there is a concern that the light is reflected and the patterning accuracy is significantly lowered.

  Further, a third groove deeper than the second groove is formed on the surface of the substrate continuously to the second groove, and the third groove has a bottom surface formed with a predetermined width, and the third groove. An inclined surface that is connected to each of both ends in the width direction of the bottom surface and supports the outer periphery of the coating portion of the optical fiber can be provided.

  According to this, since the coating portion of the optical fiber can also be installed in the third groove of the first substrate, it is possible to prevent stress from the optical fiber from concentrating on the boundary portion with the coating portion of the fiber cladding portion.

  Further, since the third groove has a bottom surface, it is not necessary to deepen the groove and lengthen the inclined surface like a V-shaped cross section. For example, when the third groove is formed by etching It can be easily formed in a short time as compared with the V-shaped cross section.

  Moreover, the said board | substrate can be set as the structure by which the board | substrate of the said optical fiber is fixed to this another board | substrate installed in another board | substrate with a larger size than this board | substrate.

  According to this, since the coating portion of the optical fiber can be installed and fixed on the separate substrate, the fixing strength of the optical fiber is improved. Also, even if bending force or tensile force acts on the optical fiber from the outside of the module, the optical coupling efficiency with the internal waveguide is not lowered because the optical coupling portion with the internal waveguide is not affected.

  Further, the substrate is installed on another substrate having a size larger than the substrate, a covering body is fixed to the outer periphery of the coating portion of the optical fiber, and the covering body is fixed to the another substrate. be able to.

  According to this, since the covering can be installed and fixed on another substrate, the fixing strength of the optical fiber is improved. Also, even if bending force or tensile force acts on the optical fiber from the outside of the module, the optical coupling efficiency with the internal waveguide is not lowered because the optical coupling portion with the internal waveguide is not affected. In addition, the optical fiber can be fixed in parallel to each substrate by suppressing the deflection due to the weight of the optical fiber by the thickness of the covering. As a result, stress is hardly generated in the optical coupling portion with the internal waveguide, so that the optical coupling efficiency is not easily lowered.

  In addition, each of the plurality of first grooves may be separated from each other and disposed on the substrate.

  According to this, since the plurality of first grooves 1a are arranged in a state of being separated from each other, an optical signal passing through each of the first grooves 1a leaks and affects an optical signal passing through the adjacent first groove 1a. It is possible to suppress the occurrence of so-called crosstalk. Moreover, the optical coupling efficiency in each 1st groove | channel 1a becomes high by it.

DESCRIPTION OF SYMBOLS 1 1st board | substrate 1a 1st groove | channel 1b, 100b 2nd groove | channel 1c 3rd groove | channel 1e, 100e Inclined surface 1f of 2nd groove | channel, 100f Bottom face of 2nd groove | channel 2 Optical fiber 6 2nd board | substrate (separate board | substrate)
12a Light emitting element (optical element)
12b Light receiving element (optical element)
15 Mirror part 16 Internal waveguide 17 Core part 18 Clad part 21 Fiber core part 22 Fiber clad part 23 Covering part 25 Covering bodies W1 to W3 Width

Claims (10)

A substrate on the surface of which at least one first groove and a second groove deeper than the first groove are continuously formed;
An internal waveguide provided in the first groove of the substrate;
A mirror part for optical path conversion provided at the tip of the first groove;
It is mounted on the surface of the substrate so as to face the mirror part, emits an optical signal to the core part of the internal waveguide through the mirror part, or of the internal waveguide through the mirror part An optical element for receiving an optical signal from the core portion;
An optical fiber having a fiber core part that is optically connected to the fiber clad part installed in the second groove and the core part of the internal waveguide;
The second groove includes a bottom surface formed with a predetermined width, and an inclined surface that is connected to both ends of the bottom surface in the width direction and supports the outer periphery of the fiber clad portion. module.   In the core portion of the internal waveguide, when the optical element is a light emitting element, the width of the core portion gradually narrows from the mirror portion toward the connection end portion of the optical fiber with the fiber core portion. The optical module according to claim 1, further comprising an inclined surface.   In the core portion of the internal waveguide, when the optical element is a light receiving element, the width of the core portion gradually narrows from the connection end portion of the optical fiber to the fiber core portion toward the mirror portion. The optical module according to claim 1, further comprising an inclined surface.   4. The optical module according to claim 1, wherein a width of the core portion of the internal waveguide is narrower than a width of an upper end of the first groove.   The cross section of the first groove is substantially trapezoidal, and the bottom surface of the first groove is wider than the core portion of the internal waveguide. The optical module as described. A third groove deeper than the second groove is formed on the surface of the substrate continuously to the second groove,
The third groove has a bottom surface formed with a predetermined width, and an inclined surface that is connected to both ends of the bottom surface of the third groove in the width direction and supports the outer periphery of the coating portion of the optical fiber. The optical module according to any one of claims 1 to 5, wherein:   The said board | substrate is installed in another board | substrate with a larger size than the said board | substrate, and the coating | coated part of the said optical fiber is being fixed to the said another board | substrate, The Claim 1 characterized by the above-mentioned. Optical module.   The optical module according to claim 6, wherein the substrate is installed on another substrate having a size larger than that of the substrate, and the covering portion of the optical fiber is fixed to the separate substrate.   The substrate is installed on another substrate having a size larger than that of the substrate, a covering body is fixed to an outer periphery of the coating portion of the optical fiber, and the covering body is fixed to the another substrate. The optical module as described in any one of Claims 1-6.   The optical module according to claim 1, wherein each of the plurality of first grooves is disposed on the substrate separately from each other.

Images