JP2013048128A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To protect an electronic component so that a cap reliably covers a mounted case.SOLUTION: A recognition-processing device recognizes an image taken by a substrate recognition camera 17 to recognize a position of a shield case 20 mounted on a printed circuit board P. Based on such recognition results, a suction nozzle 18 is corrected and moved, so that the suction nozzle 18 is moved downward until an outward inclination face inclined outward of each V-shaped holding part 22B2 of a case cap 22 comes into contact with an outer peripheral portion of an upper wall 20B of the shield case 20. Then, vacuum suction with the suction nozzle 18 is canceled to move the suction nozzle 18 upward. Under a non vacuum-suction state, the suction nozzle 18 is merely moved downward to move the case cap 22 downward and push it. Each holding part 22B2 of a holding claw 22B is fitted with each mounting opening 21 opened on a peripheral wall 20A of the shield case 20, so as to mount the case cap 22 to the shield case 20.

Description

  The present invention relates to an electronic component protection device for protecting an electronic component mounted on a printed circuit board.

  An electronic component mounting apparatus that mounts an electronic component on a printed circuit board is disclosed in, for example, Patent Document 1 and the like. In order to cut off and protect the case, it is conceivable that a case for protecting the electronic component mounted on the substrate is also mounted on the substrate.

JP 2011-77205 A

  However, in order to protect the electronic component mounted on the substrate, a rectangular tube-shaped case having a side surface surrounding the electronic component and an upper surface having an opening and holding the surface open is held by a holder on the substrate. In the case where the cap is put on the case and the cap is put on the case, the case is easily moved by the soft solder paste when mounting on the substrate via the solder paste, and when the mounting position shift occurs, the cap is then put on the case. There may be situations where it cannot be covered.

  Therefore, in order to solve the above-described problems, an object of the present invention is to protect an electronic component by reliably covering the mounted case with a cap.

  For this reason, the protection device for an electronic component according to the first invention is mounted on the printed circuit board via solder so that the side surface surrounds the electronic component mounted on the printed circuit board with a space therebetween, and is connected to the ground. A shield case having an upper surface and a lower surface opened, and a case cap having a holding claw fitted and attached to a mounting opening provided on a side surface of the shield case so as to cover the shield case from above. To do.

  According to a second aspect of the present invention, there is provided the electronic component protecting apparatus, wherein the electronic component mounted on the printed circuit board is mounted on the printed circuit board via solder so that the side surface surrounds the printed circuit board with a space therebetween. A shield case having an upper surface and a lower surface opened; a recognition processing device for recognizing a position of the shield case mounted on the printed circuit board; and the holding based on a recognition result taken out from a supply device by a holder. It is characterized by comprising a case cap fitted with a holding claw fitted to a mounting opening formed on a side surface of the shield case so as to cover the shield case from above by correcting and moving the tool.

  The present invention can protect an electronic component by reliably covering the mounted case with a cap.

It is a schematic system diagram of a mounting line for electronic components. It is a top view of an electronic component mounting apparatus. It is a top view of a shield case. It is a figure which shows the image which imaged the shield case. It is a longitudinal cross-sectional view which shows the state which mounted the case cap in the shield case. It is explanatory drawing which shows the order in which the case cap is pushed in by the suction nozzle. It is a vertical side view of the state which attached the case cap to the shield case. It is a side view of the state which attached the case cap to the shield case.

  FIG. 1 is a schematic system diagram of an electronic component mounting line, and A1 is an electronic component mounting apparatus on a printed circuit board P as a substrate inherited from a screen printing machine and an adhesive application apparatus as an upstream apparatus (not shown). In addition, the electronic component D is mounted via cream solder and an adhesive, and a shield case 20 to be described later for protecting the electronic component D mounted on the printed circuit board P is mounted. B is an inspection machine that inspects the positional relationship between the wiring pattern (cream solder) of the printed circuit board P and the mounted electronic component D, and the position of the wiring pattern (cream solder) of the printed circuit board P and the shield case 20. Check the relationship. That is, it is inspected whether the positional relationship between the cream solder on the wiring pattern and the electrode of the electronic component D is correct and whether the positional relationship between the cream solder and the shield case 20 is correct.

  C is a reflow oven which irradiates the ultraviolet curable cream solder with ultraviolet rays to cure the cream solder and fix the positions of the electronic component D and the shield case 20. A2 is an electronic component mounting apparatus, which has the same structure as the electronic component mounting apparatus A1 and performs the same function, but a case cap 22 is mounted on the shield case 20 fixed on the printed circuit board P.

  FIG. 2 is a plan view of the electronic component mounting apparatus A1. The electronic component mounting apparatus body 1 includes a machine base 2, a conveyor unit 3 extending in the left-right direction at the center of the machine base 2, and the machine base 2. Two sets of component mounting units 4 and 4 and two sets of component supply units 5 and 5 are provided respectively at the front (lower side in the figure) and rear (upper side in the figure). In each of the component supply units 5, a plurality of component supply units 6 as electronic component supply devices are incorporated side by side and detachably on the feeder base 19 to constitute an electronic component mounting device. The feeder base 19 may be simply fixed to the electronic component mounting apparatus main body 1 or may be attached to the electronic component mounting apparatus main body 1 in a detachable manner with a carriage.

  The conveyor unit 3 includes a central set table 8, a left supply conveyor 9, and a right discharge conveyor 10. The printed circuit board P as a substrate is supplied from the supply conveyor 9 to the set table 8, and is fixedly set at a predetermined height on the set table 8 so as to receive mounting of electronic components. Then, the printed circuit board P on which the mounting of the electronic components is completed is discharged from the set table 8 to the downstream device via the discharge conveyor 10.

  Each component mounting portion 4 is provided with an XY stage 12 on which a head unit 13 is movably mounted, as well as a component recognition camera 14 and a nozzle stocker 15. Mounted on the head unit 13 are a mounting head 16 for sucking and mounting electronic components, and a substrate recognition camera 17 for recognizing the position of the printed circuit board P.

  In each XY stage 12, the beam 12A is moved in the Y direction by the Y axis drive motor, and the head unit 13 is moved in the X direction along the beam 12 by the X axis drive motor. As a result, the head unit 13 is moved in the XY direction. Will move.

  The component supply unit 6 is equipped with a storage tape that covers a large number of electronic components D with cover tapes that are stored at regular intervals in each storage section formed of a concave portion of the carrier tape. By peeling the cover tape from the tape, the electronic components D are supplied one by one to the component extraction position of the component supply unit 6 and are taken out by the head unit 13 from each storage unit.

  Further, the component supply unit 6 is not limited to supplying the electronic component D stored in the storage portion of the storage tape as described above, but protects the electronic component D mounted on the printed circuit board P from physical collision. In addition, in order to cut off and protect electrical noise, the component supply unit 6 for supplying the shield case 20 for protecting the electronic component D mounted on the printed circuit board P, or the shield case 20 is attached. There is also a component supply unit 6 for supplying the case cap 22. That is, a component supply unit 6 for supplying the shield case 20 is disposed in the electronic component mounting apparatus A1, and a component supply unit 6 for supplying the case cap 22 is disposed in the electronic component mounting apparatus A2.

  In the operation based on the mounting data stored in the storage unit of the electronic component mounting apparatus main body 1, first, the XY stage 12 is driven and the head unit 13 is made to face the component supply unit 6. The desired electronic component D, shield case 20 and the like are taken out by lowering the arbitrary suction nozzle (holding tool) 18. Subsequently, after raising the suction nozzle 18, the XY stage 12 is driven to move the electronic component D, the shield case 20, etc. directly above the component recognition camera 14, and the electronic component D sucked and held by the suction nozzle 18. And the shielding case 20 and the like, and the recognition processing device recognizes the suction posture and the positional deviation with respect to the suction nozzle 18. Next, the mounting head 16 is moved to the position of the substrate P on the set table 8, the recognition mark of the substrate P is imaged by the substrate recognition camera 17, and the recognition processing apparatus recognizes the position of the printed circuit board P. Thereafter, the X-axis drive motor of the XY stage 12, the Y-axis motor, and the θ-axis drive motor of the suction nozzle 18 are corrected and moved based on the recognition results by the component recognition camera 14 and the board recognition camera 17, and the electronic component D and the shield case. 20 or the like is mounted on the printed circuit board P.

  As shown in FIG. 3, the shield case 20 includes four peripheral walls 20A, four upper walls 20B extending from the center of the upper end of each peripheral wall 20A toward the opposing peripheral walls 20A, A suction wall 20C that is formed at the center position in plan view and is held by suction by the suction nozzle 18 is provided. Each of the peripheral side walls 20A is provided with, for example, six rectangular attachment openings 21 at predetermined intervals. The shield case 20 is made of a metal such as aluminum.

  Similarly, the case cap 22 made of a metal material such as aluminum has a flat upper wall 22A having an area larger than the maximum area of the outer surface of the shield case 20 in plan view, and each of the upper wall 22A. Six holding claws 22B are formed on the outer peripheral end portion so as to extend downward. That is, each holding claw 22B corresponds to each mounting opening 21 formed in the peripheral side wall 20A of the shield case 20, and this holding claw 22B is bent downward at right angles from each outer peripheral end of the upper wall 22A. And a holding portion 22B2 formed by bending inwardly into a "<" shape continuously to the lower end of the flat portion 22B1.

  With the above configuration, the mounting operation of the electronic component on the printed circuit board P in the electronic component mounting apparatus A1 will be described. First, the printed circuit board P is supplied from the supply conveyor 9 to the set table 8 and is positioned and fixed by the set table 8. Then, according to the mounting data, the XY stage 12 is driven so that the head unit 13 faces the component supply unit 6, and then the suction nozzle 18 provided on the mounting head 16 is lowered to move a desired electronic component to the component supply unit 6. Take out more.

  In this case, the control device sends a feed command to the component supply unit 6 that supplies the electronic component having the first step number in the mounting order according to the mounting data, and the control device feeds the component supply unit 6 and removes the cover tape. The electronic component D in the storage portion of the carrier tape from which the collecting cover tape has been peeled off is sent to the component extraction position. The electronic component D sent to the component extraction position is extracted by the suction nozzle 18.

  Similarly, according to the mounting data, the shield case 20 is taken out from the other component supply unit 6 by the suction nozzle 18 by sucking the suction wall 20C.

  Subsequently, after the mounting head 16 is raised, the XY stage 12 is driven to move the electronic component to a position directly above the component recognition camera 14 to image the electronic component and the shield case 20 that are sucked and held by the suction nozzle 18. .

  Next, the mounting head 16 is moved to the position of the board P on the set table 8, and the board recognition camera 17 images the position recognition mark of the printed board P, and then the component recognition camera 14 and the board recognition camera 17 take an image. Based on the result of recognition processing by the recognition processing device, the X-axis drive motor of the XY stage 12, the Y-axis drive motor, and the θ-axis drive motor of the suction nozzle 18 are corrected and moved, and the vertical axis drive motor is driven. The suction nozzle 18 is lowered, and the shield case 20 is mounted on the printed circuit board P so as to surround the electronic component and the electronic component. When all the electronic components and the shield case 20 are mounted on the printed circuit board P, they are discharged from the set table 8 to the inspection machine B via the discharge conveyor 10.

  In the inspection machine B, the positional relationship between the wiring pattern (cream solder) of the printed board P and the mounted electronic component D is inspected, and the wiring pattern (cream solder) of the printed board P and the shield case 20 Check the positional relationship. If each positional relationship is correct, the inspection machine B conveys the printed circuit board P to the downstream reflow furnace D, and in this reflow furnace D, the ultraviolet curable cream solder is irradiated with ultraviolet rays. Is fixed to fix the position of the electronic component D and the shield case 20.

  Next, the printed circuit board P is transported from the reflow furnace D to the electronic component mounting apparatus A2, and the case cap 22 is attached to the shield case 20 in the electronic component mounting apparatus A2. That is, the suction nozzle 18 takes out the center position of the upper wall 22A of the case cap 22 from the component supply unit 6 by vacuum suction, and the shield case in which the board recognition camera 17 is fixed to the printed board P as shown in FIG. The corners at the 20 diagonal positions are respectively imaged (in FIG. 4, a rectangular camera field of view VF is shown in the upper right part and the lower left part). Then, the recognition processing device recognizes the image captured by the substrate recognition camera 17 to recognize the position of the shield case 20, and based on the recognition result by the recognition processing device, the X-axis drive motor of the XY stage 12, The case cap 22 is securely attached to the shield case 20 by correcting and moving the Y-axis motor and the θ-axis drive motor of the suction nozzle 18.

  In this case, based on the recognition result by the recognition processing device, the suction nozzle 18 is corrected and moved, and the outwardly inclined surface is inclined toward the outside of each of the “<”-shaped holding portions 22 </ b> B <b> 2 of the case cap 22. The suction nozzle 18 is lowered and placed until it comes into contact with the outer peripheral portion of the upper wall 20B of the shield case 20 (see FIG. 5). Next, the vacuum suction by the suction nozzle 18 is released and raised, and then the case cap 22 is lowered and pushed in by simply lowering the suction nozzle 18 without vacuum suction, and the holding portions 22B2 of the holding claws 22B. The case cap 22 is attached to the shield case 20 (see FIGS. 7 and 8) by being fitted to each attachment opening 21 provided in the peripheral side wall 20A of the shield case 20. In addition, the case cap 22 is arranged so that the upper surface of the shield case 20 except the upper wall 20B of the shield case 20 is closed so that the lower surface of the upper wall 22A of the case cap 22 is in contact with the upper wall 20B of the shield case 20. The shield case 20 is securely attached so as to cover it from above.

  In this pushing method, the suction nozzle 18 repeatedly descends and rises. However, the pushing positions of the suction nozzle 18 are pushed in the order of positions L1, L2, L3, and L4 in FIG. Other orders may be used, and the number of times is not limited to four. For example, the pushing operation may be performed only once at the central portion of the upper wall 22A of the case cap 22 or at two locations on the opposite corners.

  Accordingly, the case cap 22 can be securely attached to the shield case 20, and the case cap 22 and the shield case 20 protect the electronic component D mounted on the printed circuit board P from physical collision. Alternatively, the shield case 20 can be grounded through a wiring pattern formed on the printed circuit board P, and can be protected by blocking electrical noise.

  The position recognition result of the shield case 20 obtained by the board recognition camera 17 imaging the shield case 20 and recognized by the recognition processing device, and the part recognition camera 14 images the case cap 22 and recognized by the recognition processing device. Considering the processed position recognition result of the case cap 22, the suction cap 18 may be corrected and moved to attach the case cap 22 to the shield case 20.

  In the electronic component mounting apparatus A2, as described above, when the case caps 22 are respectively attached to the necessary number of the shield cases 20, they are transported to the downstream apparatus of the electronic component mounting apparatus A2. .

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus main body 6 Component supply unit 18 Adsorption nozzle 20 Shield case 20A Peripheral side wall 20B Upper wall 21 Mounting opening 22 Case cap 22B Holding claw 22B2 Holding part

The present invention relates to an electronic component mounting apparatus for mounting moves taken out by holding the electronic parts holder provided on the XY stage on a substrate.

For this reason, the electronic component mounting apparatus according to the first aspect of the present invention is an electronic component mounting apparatus in which an electronic component is held by a holder provided on an XY stage, is removed, moved, and mounted on a substrate.
A recognition process for recognizing the position of a shield case having an upper surface and a lower surface that are mounted on the substrate and connected to ground so that the side surfaces of the electronic component mounted on the substrate are surrounded by a gap. A drive source for the XY stage, wherein the holder holds a case cap attached to the shield case, and the case cap is attached to the shield case from above based on a recognition result of the recognition processing device. A feature of having been configured to move the correction .

An electronic component mounting apparatus according to a second aspect of the present invention is an electronic component mounting apparatus for holding an electronic component by a holder provided on an XY stage, taking it out, moving it, and mounting it on a substrate.
The upper surface and the lower surface that are mounted on the substrate via solder so as to surround the electronic component mounted on the substrate with a space therebetween and are connected to the ground are located at diagonal positions of the open shield case. A recognition processing device for recognizing the position of the corner, the holding tool holding a case cap attached to the shield case with a holding claw formed downward, and based on a recognition result of the recognition processing device The shield case is covered from above, and the drive source of the XY stage and the θ-axis drive source of the holder are corrected so that the holding claw is fitted and attached to a mounting opening formed on a side surface of the shield case. It is characterized by being configured to move .

Claims (2)

  A shield case having an upper surface and a lower surface that are mounted on the printed circuit board via solder so as to surround the electronic components mounted on the printed circuit board with a space therebetween and connected to the ground, and the shield case. An electronic component protection device comprising: a case cap which is attached by fitting a holding claw to a mounting opening provided on a side surface of the shield case so as to cover from above.   A shield case having an upper surface and a lower surface that are mounted on the printed circuit board via solder so that side surfaces surround the electronic component mounted on the printed circuit board with a space therebetween and are grounded; and the printed circuit board A recognition processing device for recognizing the position of the attached shield case, and a holder that is taken out from the supply device by the holder and corrected to move based on the recognition result by the recognition processing device so as to cover the shield case from above. And a case cap fitted with a holding claw fitted into a mounting opening provided on a side surface of the shield case.

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