JP2013026160A - Socket for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for an electronic component to which an electronic component such as an IC chip is mounted, and in which an electronic element conducted to a terminal can be arranged in a small space.SOLUTION: A fitting part 15a of an insulative holding member 15 is fitted with a through hole of a metal plate provided on a housing, and plural terminals 10 are embedded in the holding member 15. A recess 15f is formed at the fitting part 15a of the holding member 15, and an electronic element 16 such as a capacitor are housed in the recess 15f. Two electrode parts 16a, 16a provided on the electronic element 16 are soldered to intermediate pieces 11, 11 appearing inside the recess 15f. The recess 15f is positioned inside the through hole, and therefore, there is no need of a space for arranging the electronic element 16.

Description

  The present invention relates to an electronic component socket including a plurality of terminals that come into contact with electrode parts of an electronic component such as an IC chip, and more particularly to an electronic component socket in which an electronic element such as a capacitor is connected to the terminals.

  Patent Documents 1 and 2 disclose sockets that support electronic components such as IC chips.

  In the socket described in the cited document 1, a contact is provided on the surface of the semiconductor substrate, and an IC installed on the semiconductor substrate is connected to the contact. A decoupling capacitor formed by overlapping metal plates is placed on the IC, and a heat sink is placed on the decoupling capacitor.

  The IC socket described in Patent Document 2 is one in which the terminal portion of the IC is inserted, but is described as a capacitor built in the IC socket. Further, there is disclosed a structure in which an IC socket adapter into which an IC terminal is inserted and a terminal of the IC socket adapter is inserted into the IC socket, a resistor is built in the IC socket adapter.

Japanese Patent No. 4050700 CD-ROM of Japanese Patent Application No. 3-75841 (Japanese Utility Model Application Publication No. 5-28048)

  The socket described in Patent Document 1 has a large size because the decoupling capacitor is installed on the IC. Further, since the decoupling capacitor is formed by overlapping metal plates, it is difficult to adjust the capacitance value.

  Since the IC socket described in Patent Document 2 has a capacitor built in the IC socket, the structure of the entire IC socket must be changed when there is a change in the arrangement or capacitance value of the capacitor in the IC socket. is necessary. Similarly, when it is necessary to change the arrangement of resistors or the resistance value, it is necessary to change the entire structure of the IC socket adapter.

  The present invention solves the above-mentioned conventional problems, and does not increase the size of the structure even when an electronic element such as a capacitor is incorporated, and an electronic component socket having a structure that can cope with changes in the installation location and capacitance value of the capacitor. It is intended to provide.

The present invention provides a socket for an electronic component provided with a housing in which an electronic component is installed, and a terminal provided in the housing and in contact with a plurality of component electrode portions provided on the bottom surface of the electronic component.
A through hole is formed in the housing, and a holding member formed of an insulating material is fitted in the through hole,
A plurality of the terminals are held on the holding member, and an electronic element connected to the plurality of terminals is provided.

  In the electronic component socket of the present invention, since the electronic element is provided together with the terminal on the holding member attached to the housing, the socket does not become extremely large even if the electronic element is attached. Further, by selecting a holding member having an electronic element and a holding member not provided with the electronic element and attaching the holding member to the housing, it is possible to freely select or change a terminal to which the electronic element is to be connected. .

  The present invention preferably has a structure in which a plurality of recesses for exposing the plurality of terminals are formed in the holding member, and an electrode portion of the electronic element is connected to the terminals inside the recess.

  With the above structure, it is possible to attach an electronic element such as a capacitor by a simple operation of mounting and connecting the electronic element in the recess of the holding member. Note that an electronic element in this specification is an element such as a capacitor, a resistor, a diode, or a transistor, and a small chip type is preferably used.

  According to the present invention, the terminal includes: an elastic piece that extends from the holding member to one side and contacts the component electrode portion; a base end piece that extends from the holding member to the other; and the elastic piece and the base end piece. And an intermediate piece exposed inside the recess, and the electrode portion of the electronic element is connected to the intermediate piece.

In the present invention, the depth dimension of the recess is deeper than the thickness dimension of the electronic element, the electronic element does not protrude from the recess, and the recess is located inside the through hole. .
In the above configuration, the height of the holding member and the terminal can be reduced, and a thin socket can be easily formed.

  Alternatively, according to the present invention, the depth dimension of the recess is shallower than the thickness dimension of the electronic element, the electronic element protrudes from the recess, and the recess is located outside the through hole. is there.

  In the above configuration, since the arrangement pitch of the holding members can be narrowed, it is easy to configure a socket with a high density arrangement.

  In the present invention, the electrode portion of the electronic element is soldered to the terminal, and the electronic element is fixed to the inside of the concave portion with an adhesive. Or the holding convex part holding the said electronic element is provided in the said recessed part.

  If the electronic element is housed in the recess formed in the holding member, the electronic element remains in the recess even if the solder fixing the electronic element is melted by heat when the terminal is soldered to the relay member or the like. It becomes difficult to come off from the inside, and it becomes easy to prevent the electronic element from falling off. Furthermore, by providing the adhesive and the holding convex portion, the electronic element is more difficult to drop off.

  In the present invention, a part of the housing is formed of a metal plate, and the through hole into which the holding member is fitted is formed in the metal plate.

  In the present invention, since the electronic element is provided on the holding member that holds the terminal, it is easy to prevent the socket from becoming extremely large by providing the electronic component.

  Further, it is possible to flexibly cope with the change of the circuit by changing the arrangement location of the holding member having the electronic component and the holding member not having the electronic component.

The perspective view of the socket for electronic components of the 1st Embodiment of this invention, The electronic component socket and relay member of the 1st Embodiment of this invention are shown, The sectional view of the II-II line of FIG. Sectional drawing which shows the state by which the relay member was mounted | worn with the socket for electronic components of the 1st Embodiment of this invention, An exploded perspective view showing a relay member and three metal plates, A plan view of the first metal plate; An exploded perspective view showing a holding member holding a plurality of terminals and a through hole into which the holding member is fitted, FIG. 2 is an enlarged view of a part of FIG. 2 showing details of the holding member and the terminal fitted in the through hole; An enlarged view showing a state where the component electrode part of the electronic component is in contact with the terminal, The side view which shows the state in which the electronic element was accommodated in the recessed part of the holding member, The side view which shows the other example of the state by which the electronic element was accommodated in the recessed part of the holding member, A side view showing an example in which an electronic element is mounted vertically in a recess, The perspective view which shows the fitting hole in the socket for electronic components of the 2nd Embodiment of this invention, a holding member, and a terminal, The side view which shows the mounting state of the holding member in the socket for electronic components of the 3rd Embodiment of this invention, a terminal, and an electronic element, The side view which shows the state in which the electronic component was mounted | worn with the socket for electronic components of the 3rd Embodiment of this invention, The perspective view which shows the fitting hole in the socket for electronic components of the 4th Embodiment of this invention, a holding member, and a terminal, Sectional drawing which shows the socket for electronic components of the 5th Embodiment of this invention,

  As shown in FIG. 1 to FIG. 3, an electronic component socket 1 according to an embodiment of the present invention has a housing 2, which includes a first metal plate 3 and a second metal plate 4A. A third metal plate 4B is included. That is, the housing 2 in this specification includes a portion formed of a synthetic resin, the first metal plate 3, the second metal plate 4A, and the third metal plate 4B. In the housing 2, the synthetic resin and the three metal plates 3, 4A, 4B are integrated by a so-called insert molding method. In a state where the first metal plate 3, the second metal plate 4A, and the third metal plate 4B are combined and supported inside the cavity of the mold, molten resin is injected into the cavity, and the three metal plates The housing 2 in which 3, 4A and 4B are embedded is molded.

  As shown in FIGS. 1 to 3, a support side wall 2 a is formed on the upper portion of the housing 2, and an upper recess 5 having four sides surrounded by the support side wall 2 a is formed. A step bottom 2b is formed on each inner side surface of the four support side walls 2a, and the upper recess 5 is a part support 5a at a portion above the step bottom 2b, and is located below the step bottom 2b. The portion is a terminal deformation space 5b. The first metal plate 3, the second metal plate 4A, and a part of the third metal plate 4B are located at the bottom of the upper recess 5, that is, at the bottom of the terminal deformation space 5b.

  As shown in FIGS. 2 and 3, the housing 2 is formed with a ceiling wall portion 2 c that extends further outward in four directions from the support side wall portion 2 a, and the mounting sidewall portion extends downward from the periphery of the ceiling wall portion 2 c. 2d is integrally formed, and a lower concave portion 6 is formed in which four surfaces are surrounded by the mounting side wall portion 2d. In the lower concave portion 6, a portion below the lower surface 2e of the ceiling wall portion 2c is a relay member mounting portion 6a, and a portion above the lower surface 2e is a terminal connection space 6b. The housing 2 has a structure in which the relay member mounting portion 6a projects outward from the component support portion 5a.

  The upper concave portion 5 and the lower concave portion 6 communicate with each other inside the portion formed of the synthetic resin of the housing 2, and the upper concave portion 5 and the lower concave portion 6 are connected to the first metal plate 3 and the second concave portion 6. In this structure, the metal plate 4A and the third metal plate 4B are partitioned.

  The first metal plate 3, the second metal plate 4 </ b> A, and the third metal plate 4 </ b> B are made of a relatively low resistance metal plate such as a steel plate.

  As shown in FIGS. 4 and 5, the first metal plate 3 has a rectangular shape when viewed in plan. A rectangular central opening 3a having a small area is formed in the central portion of the first metal plate 3, and a rectangular region surrounding the central opening 3a is a terminal holding portion 3b. A plurality of through-holes 7 are regularly arranged in the entire rectangular region that is the terminal holding portion 3b. The through hole 7 is a rectangular hole that penetrates the first metal plate 3.

  As shown in FIGS. 4 and 5, the first metal plate 3 is provided with a ceiling shield surface 3d that is flush with the terminal holding portion 3b and extends laterally in four directions from the terminal holding portion 3b. The through hole 7 is not formed in the ceiling shield surface 3d. Four side shield surfaces 3c that are bent substantially perpendicularly from the ceiling shield surface 3d are formed at positions away from the terminal holding portions 3b in the four directions.

  As shown in FIG. 4, the second metal plate 4A and the third metal plate 4B are flat plates, and the two metal plates 4A and 4B have the same structure. The second metal plate 4 </ b> A and the third metal plate 4 </ b> B have the same shape and the same size as those obtained by removing the side shield surface 3 c from the first metal plate 3. The second metal plate 4A and the third metal plate 4B have a rectangular center opening 4a formed at the center. A rectangular region around the central opening 4a is a terminal holding portion 4b, and a ceiling shield surface 4d is integrally formed on the outer periphery thereof. The shape and size of the central opening 4a and the terminal holding part 4b are the same as the central opening 3a and the terminal holding part 3b of the first metal plate 3.

  As shown in FIGS. 2 and 3, a plurality of through holes 8 are formed in the terminal holding portions 4b of the second metal plate 4A and the third metal plate 4B. The opening area, shape, and arrangement state of the through holes 8 are the same as those of the through holes 7 formed in the terminal holding portion 3 b of the first metal plate 3.

  The second metal plate 4A and the third metal plate 4B are overlapped on the lower surface side of the first metal plate 3, the central opening 3a and the central opening 4a coincide, and the plurality of through holes 7 and the plurality of through holes The holes 8 are individually overlapped and held in the mold cavity in electrical communication with each other. Then, the molten resin is injected into the cavity to mold the housing 2.

  As shown in FIGS. 1 to 3, the electronic component socket 1 molded in the above process includes a central opening 3 a and a terminal holding portion 3 b of the first metal plate 3, a second metal plate 4 A and a third metal plate 3. The central opening 4a and the terminal holding portion 4b of the metal plate 4B are located at the boundary between the upper concave portion 5 and the lower concave portion 6.

  The ceiling shield surface 3d of the first metal plate 3 and the ceiling shield surfaces 4d of the second metal plate 4A and the third metal plate 4B are located on the ceiling wall portion 2c of the housing 2, and the first metal The ceiling shield surface 3d of the plate 3 appears on the outermost surface of the ceiling wall 2c. Further, the side shield surface 3c of the first metal plate 3 appears on the surface of the mounting side wall 2d. In the relay member mounting portion 6a having a shape projecting to the periphery of the component support portion 5a, the ceiling portion and the four side portions are all covered with a metal plate.

  The housing 2 is provided with a plurality of terminals 10. The terminals 10 are arranged in the entire region of the terminal holding portion 3b and the terminal holding portion 4b. However, in FIG. 2 and FIG. 3 and the like, only some of the terminals 10 are shown for convenience of illustration.

  As shown in FIG. 6, the plurality of terminals 10 are held by a holding member 15 made of a synthetic resin material.

  As for the holding member 15, the fitting part 15a located in the base part side, and the support part 15b which stands | starts up from the fitting part 15a are integrally formed. The fitting portions 15a have a longitudinal dimension of W1 and are arranged with an interval W2 in the longitudinal direction. The support portion 15b is formed continuously in the longitudinal direction, and has a structure in which three fitting portions 15a are connected by the support portion 15b. A flat wall surface 15c that rises perpendicularly to the surface of the first metal plate 3 is formed on the support portion 15b, and an edge portion (substantially perpendicular corner) of the upper surface of the wall surface 15c serves as an intermediate fulcrum portion 15d. Yes.

  The plurality of terminals 10 held by the holding member 15 are arranged at a constant pitch in the longitudinal direction. Three terminals 10 are held in each fitting portion 15a. The plurality of terminals 10 and the holding member 15 are integrated by an insert molding method. Or the some terminal 10 is press-fitted in the fitting part 15a.

  As shown in FIG. 6, the through hole 7 formed in the terminal holding part 3b of the first metal plate 3, and the through hole formed in the terminal holding part 4b of the second metal plate 4A and the third metal plate 4B. The holes 8 coincide with each other to form fitting holes that penetrate the three metal plates. Each fitting portion 15 a of the holding member 15 is press-fitted into each through hole, and the holding member 15 is fixed to the housing 2. A plurality of holding members 15 are regularly arranged in the housing 2 by fitting the fitting portions 15a into the plurality of through holes 7 and 8 formed in the terminal holding portion 3b and the terminal holding portion 4b. The plurality of terminals 10 held and held by the holding members 15 are arranged in a regular manner.

  Each terminal 10 is formed of a spring material such as a phosphor bronze plate, a nickel plating layer is formed on the surface, and a gold plating layer is further formed on the surface.

  As shown in enlarged views in FIGS. 7 and 8, the intermediate pieces 11 of the plurality of terminals 10 are embedded and held in the fitting portion 15 a of the holding member 15. The terminal 10 is provided with an elastic piece 12 extending continuously upward from the intermediate piece 11, and the elastic piece 12 is a boundary portion 15 e that is a step portion between the fitting portion 15 a and the support portion 15 b in the holding member 15. Projecting upward from As shown in FIG. 7, when an external force is not acting on the plurality of terminals 10, at least a part of the lower portion of the elastic piece 12 is in contact with the wall surface 15 c of the holding member 15.

  As shown in FIGS. 7 and 8, the plurality of terminals 10 are integrally provided with a base end piece 13 protruding downward from the fitting portion 15a, and the lower end portion of the base end piece 13 is bent at a right angle. The conductive piece 13a is formed. The conductive piece 13 a is located inside the terminal connection space 6 b of the housing 2.

  As shown in FIGS. 6 to 8, the fitting portion 15a is integrally formed with a recess 15f that opens to the side wall surface 15g that rises vertically from the surface of the first metal plate 3 and that is recessed from the side wall surface 15g in the thickness direction. Is formed. The electronic element 16 is accommodated in the recess 15f. As shown in FIG. 9, the electronic element 16 is a chip-type element, and electrode portions 16a and 16a are provided at both ends. The electrode portions 16a and 16a of the electronic element 16 are joined to each of the intermediate pieces 11 of the two adjacent terminals 10 exposed at the bottom of the recess 15f.

  The electronic element 16 is, for example, a decoupling capacitor that connects between a power supply terminal 10 to which a predetermined voltage is applied and a ground terminal 10 set to a ground potential. The decoupling capacitor suppresses fluctuations in the power supply voltage. Alternatively, the electronic element 16 may be a noise removing capacitor that connects the signal transmission terminal 10 and the ground terminal 10 set to the ground potential.

  The electronic element 16 can be used for various purposes such as a resistor, a diode, and a transistor.

  As shown in FIG. 6, the recessed portions 15 f are formed in all the fitting portions 15 a of all the holding members 15, and any one of the recessed portions 15 f is selected, and the electronic element 16 is mounted as necessary. . By selecting any one of the plurality of recesses 15f to mount the electronic element 16, and further changing the arrangement location of the holding member 15 on which the electronic element 16 is mounted and the holding member 15 on which the electronic element 16 is not mounted, It is possible to flexibly cope with any circuit.

  In the example shown in FIGS. 6 and 9, the intermediate piece 11 of the two terminals 10 out of the three terminals 10 held by the fitting portion 15a appears at the bottom of the recess 15f. It is preferable to increase the area so that the intermediate pieces 11 of all the terminals 10 appear at the bottom of the recess 15f. In this structure, the terminal 10 to which the electrode portion 16a of the electronic element 16 should be soldered can be selected from the many terminals 10, and the selection range for installing the electronic element 16 can be widened.

  As shown in FIGS. 7 and 8, the depth dimension of the recess 15f from the side wall surface 15g of the fitting part 15a is sufficiently deeper than the thickness dimension of the electronic element 16 located inside thereof, The electrode portion 16a has a dimensional relationship that does not protrude outward from the side wall surface 15g. As shown in FIGS. 7 and 8, at least a part of the recess 15f is formed by the first metal plate 3, the second metal plate 4A, and the through holes 7 and 8 of the third metal plate 4B. Located inside the hole. Since the electrode portion 16a of the electronic element 16 does not protrude from the side wall surface 15g, the electrode portion 16a can be prevented from coming into contact with one of the three metal plates 3, 4A, 4B and short-circuiting.

  Since at least a part of the recess 15f and the electronic element 16 in the recess 15f is located within the thickness dimension of the three metal plates 3, 4A, 4B, that is, located within the fitting hole, the fitting portion The elastic piece 12 extending upward from 15a can be secured sufficiently long, and even if the electronic element 16 is provided, it is easy to prevent the thickness of the socket 1 from increasing.

  In addition, at least one of the plurality of grounding terminals 10 set to the ground potential is in contact with and conductive with any of the three metal plates 3, 4A, 4B, and the three metal plates 3, 4A, 4B is set to the ground potential.

  As a process of assembling the plurality of terminals 10, the first metal plate 3, the second metal plate 4 </ b> A, and the third metal plate 4 </ b> B are first overlapped, and the holding member 15 is fitted into the through holes 7, 8, 8. In the state where the first metal plate 3, the second metal plate 4A and the third metal plate 4B holding the holding member 15 are held in the cavity of the mold after the joint portion 15a is press-fitted. Is injected to form the housing 2. Alternatively, in the process after the housing 2 in which the first metal plate 3, the second metal plate 4 </ b> A, and the third metal plate 4 </ b> B are embedded is molded, the holding member 15 is inserted into the through holes 7, 8, 8. The fitting part 15a may be press-fitted.

  As shown in FIGS. 2 and 3, the relay member 20 is held by the relay member mounting portion 6 a of the electronic component socket 1.

  The relay member 20 has a plurality of upper connection electrode portions 21 arranged on the upper surface 20a and a plurality of lower connection electrode portions 22 arranged on the lower surface 20b. The upper connection electrode portion 21 has a spherical solder layer on the surface. The lower connection electrode portion 22 also has a spherical solder layer on the surface.

  As shown in FIG. 4, a rectangular electrode array region 20c is formed on the upper surface 20a of the relay member 20, and a plurality of upper connection electrode portions 21 are regularly arrayed in the electrode array region 20c. The shape and area of the electrode array region 20c are equivalent to the shape and area of the terminal holding portion 3b of the first metal plate 3 and the region of the terminal holding portion 4b of the second and third metal plates 4A and 4B. Further, the arrangement state of the upper connection electrode portions 21 matches the arrangement state of the terminals 10, and the arrangement pitch P <b> 1 of the upper connection electrode portions 21 matches the arrangement pitch P <b> 1 of the terminals 10.

  The relay member 20 is a so-called multilayer substrate, and is composed of a plurality of insulating layers stacked in the thickness direction. As shown in FIG. 2, the internal wiring layer 23 is patterned on the surface of each layer inside the relay member 20, and the upper connection electrode portion 21 and the lower connection electrode portion 22 are paired via the internal wiring layer 23. Conducted in one relationship. The arrangement pitch P <b> 2 of the lower connection electrode portion 22 is formed wider than the arrangement pitch P <b> 1 of the upper connection electrode portion 21.

  As shown in FIG. 3, the relay member 20 is inserted into the relay member mounting portion 6 a of the housing 2. The relay member 20 is inserted into the mounting side wall portion 2d and abutted against the lower surface 2e of the ceiling wall portion 2c, whereby the relay member 20 is positioned with respect to the housing 2, and the conductive piece 13a and the relay member of each terminal 10 are positioned. 20 upper connection electrode portions 21 are brought into contact with each other. When supplied to the heating furnace in this state, the solder layer on the surface of the upper connection electrode portion 21 is melted, and the upper connection electrode portion 21 and the conductive piece 13a of the terminal 10 are individually soldered and relayed to the housing 2 The member 20 is held.

  Alternatively, a spherical solder layer is previously attached to the portion of the conductive piece 13a facing the upper connection electrode portion 21, and the solder layer and the upper connection electrode portion 21 are in contact with each other and supplied to the heating furnace. Then, the upper connection electrode portion 21 and the conductive piece 13a may be soldered by melting the solder layer.

  When the conductive piece 13 a of the terminal 10 and the upper connection electrode portion 21 are soldered, the heat of the solder is transmitted to the intermediate piece 11 of the terminal 10. This heat may melt the solder connecting the electrode portion 16a of the electronic element 16, but if the solder connecting the electrode portion 16a and the intermediate piece 11 is set to a predetermined amount or more, It is easy to prevent the electronic element 16 from falling off the intermediate piece 11 due to the surface tension of the molten solder. Even if the solder melts and the electronic element 16 moves slightly downward due to gravity, the electronic element 16 may be moved down a long distance because the electronic element 16 is housed inside the recess 15f. Therefore, when the amount of heat transmitted to the intermediate piece 11 is reduced, the solder is hardened, and it is possible to maintain a conductive connection between the electrode portion 16a of the electronic element 16 and the intermediate piece 11.

  In addition, when soldering the electrode part 16a of the electronic element 16 to the intermediate piece 11, if the adhesive for fixing the electronic element 16 to the bottom part of the recessed part 15f or the intermediate piece 11 is used together, the conductive piece 13a of the terminal 10 and It is possible to further eliminate the anxiety that the electronic element 16 will drop off due to the transfer of heat when soldering the upper connection electrode portion 21. The adhesive in this case is preferably a thermosetting adhesive.

  Also, as shown in FIG. 10, holding convex portions 15h and 15h for holding the electronic element 16 are formed inside the concave portion 15f, and the electronic element 16 is press-fitted between the holding convex portions 15h and 15h to form the electrode portion. By soldering 16a and the intermediate piece 11, it is possible to more reliably prevent the electronic element 16 from falling off. The holding protrusions 15h and 15h are minute protrusions protruding from the inner wall of the recess 15f. The holding convex portions 15h and 15h may be structured to be elastically deformable.

  Alternatively, as shown in FIG. 11, the electronic element 16 may be installed vertically in the recess 15f. In this case, the conducting portions 11 a and 11 a to which the electrode portions 16 a and 16 a of the electronic element 16 are soldered are formed integrally with the intermediate piece 11 of the terminal 10. Alternatively, the metal piece separate from the intermediate piece 11 may be embedded in the bottom of the recess 15f. When the electronic element 16 is in the vertical orientation, the soldering portions for soldering the two electrode portions 16a are positioned side by side, so that when the solder is melted, the surface tension of the solder is used in two locations at the top and bottom. The element 16 can be held, and the electronic element 16 is difficult to drop off.

Next, a method for mounting the electronic component socket 1 will be described.
The main board (motherboard) on which the electronic component socket 1 is mounted has a main electrode portion on the surface thereof, and the main electrode portion has the same pitch as the arrangement pitch P2 of the lower connection electrode portions 22 of the relay member 20. Has been placed. The lower connection electrode part 22 and the main electrode part are individually soldered by causing the lower connection electrode part 22 of the relay member 20 and the main electrode part to face each other and melting the solder layer of the lower connection electrode part 22. Then, the electronic component socket 1 is mounted on the main board via the relay member 20.

  Since the arrangement pitch P2 of the lower connection electrode portions 22 is wider than the arrangement pitch P1 of the plurality of terminals 10, the pitch of the main electrode portions of the main substrate can be increased, and the number of layers of the main substrate which is a multilayer substrate can be reduced. It is possible to reduce the manufacturing cost of the main board.

  As shown in FIGS. 3 and 8, the electronic component 30 is mounted on the electronic component socket 1 mounted on the main board. The electronic component 30 is an IC bare chip or an IC package. A plurality of component electrode portions 31 are formed on the bottom surface 30 a of the electronic component 30. The component electrode part 31 is formed of a metal layer having a flat surface. The arrangement region of the component electrode portions 31 on the bottom surface 30a of the electronic component 30 is the same as the region where the plurality of terminals 10 are arranged. The arrangement pitch P1 of the component electrode portions 31 is the same as the arrangement pitch P1 of the plurality of terminals 10.

  The electronic component 30 is inserted into the component support portion 5a of the electronic component socket 1 and positioned so as not to move in the plane direction by being surrounded by the support side wall portion 2a, and the component electrode portion 31 and the terminal 10 are vertically moved. Face each other individually. Then, the electronic component 30 is pressed and fixed from above by a pressing member (not shown).

  If the electronic component 30 is positioned by the component support part 5a, the component electrode part 31 of the electronic component 30 will contact the front part of the elastic piece 12 which protrudes in the component support part 5a. When the electronic component 30 is pushed into the component support portion 5a, a downward load F is applied to the elastic piece 12, and the boundary 15e between the fitting portion 15a and the support portion 15b is first applied to the elastic piece 12. A bending moment in the α direction is given as a fulcrum.

  Due to this bending moment, the elastic piece 12 is bent in the α direction. However, since the base of the elastic piece 12 is in contact with the vertical wall surface 15c of the holding member 15 in a no-load state, as shown in FIG. As soon as the piece 12 starts to deform in the α direction, the intermediate fulcrum portion 15d, which is the edge portion of the support portion 15b, comes into contact with the elastic piece 12. Thereafter, when the elastic piece 12 is pushed downward, the upper portion of the elastic piece 12 is further bent in the α direction with the contact portion with the intermediate fulcrum portion 15d as the second fulcrum.

  The elastic piece 12 is bent and deformed between the boundary portion 15e and the intermediate fulcrum portion 15d, and is also bent and deformed from the intermediate fulcrum portion 15d to the tip portion. In this structure, the free length from the boundary portion 15e of the elastic piece 12 can be lengthened to prevent an excessive stress from acting on the elastic piece 12, and the falling distance in the α direction can be shortened. The positional deviation amount between the part and the component electrode part 31 can be set to a minimum.

  In the electronic component socket 1, at least one of the plurality of grounding terminals 10 set to the ground potential is electrically connected to one of the three metal plates 3, 4A, 4B, and the metal plates 3, 4A, 4B functions as a shield plate. Since the plurality of terminals 10 pass through the insides of the plurality of through holes 7 and 8 formed in the three metal plates 3, 4 </ b> A and 4 </ b> B, the plurality of terminals 10 are shielded from each other and transmitted by the plurality of terminals 10. External noise is less likely to be superimposed on the generated signal.

  Since the relay member 20 has a structure in which the upper surface is covered with the three metal plates 3, 4 </ b> A, 4 </ b> B and the four sides are covered with the side shield surface 3 c, the upper connection electrode portion 21 of the relay member 20 and the terminal 10, the connection portion between the lower connection electrode portion 22 and the main electrode portion of the main board, and the internal wiring layer 23 can be shielded, and the signal transmitted via the relay member 20 can be transmitted as external noise. It becomes easy to protect from.

  The electronic component socket 101 according to the second embodiment shown in FIG. 12 has an opening width W3 of the through hole 107 formed in the first metal plate 103 and the through hole formed in the second and third metal plates. Is smaller than the opening width of the through holes 7 and 8 shown in FIG. 6, and the pitch Pa of the adjacent through holes 107 is also shorter than the pitch of the through holes 7 and 8 shown in FIG.

  The holding member 115 has a fitting portion 115 a whose vertical dimension is longer than that of the fitting portion 15 a shown in FIG. 6, and a lower portion of the fitting portion 115 a is fitted inside the through hole 107. And the recessed part 115f is formed in the part which protrudes from the surface of the metal plate 103 among the fitting parts 115a, and the electronic element 16 is accommodated in the inside of the recessed part 115f.

  The depth dimension of the recess 115f from the sidewall surface 115g is shallower than the thickness dimension of the electronic element 16, and a part of the electronic element 16 protrudes from the recess 115f and protrudes outside the sidewall surface 115g.

  In the electronic component socket 101 shown in FIG. 12, the thickness of the fitting portion 115a can be reduced by disposing the recess 115f above the surface of the first metal plate 103. As a result, the through hole 107 It is possible to increase the mounting density of the plurality of terminals 10 by reducing the arrangement pitch Pa, that is, the arrangement pitch Pa of the terminals 10.

13 and 14 show an electronic component socket 201A of the third embodiment.
This electronic component socket 201A is provided with two metal plates 3 and 4 that constitute a part of the housing 2, and through holes 7 and 8 formed in the two metal plates 3 and 4 are overlapped to form a fitting hole. Is formed. A holding member 215 is inserted and held in this fitting hole.

  A plurality of terminals 210 are held by the holding member 215. The terminal 210 has a structure in which two metal terminals are stacked, and is embedded and held in the holding member 215 in a state where the two intermediate pieces 211a and 211b are in close contact with each other. Two elastic pieces 212 a and 212 b extend upward from the holding member 215, and two base end pieces 213 a and 213 b extend downward from the holding member 215. Then, the base end pieces 213a of the respective terminals 210 are soldered to the upper connection electrode portion 21 of the relay member 20.

  A concave portion 215f is formed in a portion of the holding member 215 inserted into the through holes 7 and 8, and the electronic element 16 is mounted in the concave portion 215f. Electrode portions 16a and 16a of electronic element 16 are soldered to two adjacent intermediate pieces 211a and 211a.

  In the electronic component socket 201A, as shown in FIG. 13, when an external force is not applied to the terminal 210, the two elastic pieces 212a and 212b are separated from each other. As shown in FIG. 14, when the electronic component 30 is installed on the component support portion 5a, one elastic piece 212a is pushed and deformed in the component electrode portion 31, and thereafter, as shown in FIG. The two elastic pieces 212a and 212b come into contact with each other and bend and deform together.

  Since the stress acting on the terminal 210 when the electronic component 30 is installed can be shared by the two elastic pieces 212a and 212b, the life of the terminal 210 can be extended.

  In the electronic component socket 201 </ b> B of the fourth embodiment shown in FIG. 15, the same two-piece structure terminal 210 as shown in FIGS. 13 and 14 is held by the holding member 215. Then, similarly to the embodiment shown in FIG. 12, a recess 215f is formed in a portion of the holding member 215 protruding from the surface of the metal plate 3, and the electronic element 16 is accommodated therein. Also in this embodiment, the electronic element 16 slightly protrudes from the opening of the recess 215f, and the width dimension of the holding member 215 is small, and the arrangement pitch can be shortened.

  In an electronic component socket 301 of the fifth embodiment shown in FIG. 16, an upper recess 305 is formed in a synthetic resin housing 302, and the inside thereof is a component support portion 305a and a terminal deformation space 305b. The first metal plate 303, the second metal plate 304A, and the third metal plate 304B are overlapped and installed at the bottom of the housing 102, and the three metal plates 303, 104A, and 104B are part of the housing 102. It is fixed integrally. A through hole 307 is formed in the first metal plate 303, a through hole 108 is formed in the second and third metal plates 304 </ b> A and 304 </ b> B, and the holding member 15 is held in both the through holes 307 and 308.

  The structure of the terminal 10 held by the holding member 15 is the same as that shown in FIGS. 6 to 8, and the electronic element 16 is accommodated in the recess 15f. Further, a conductive piece 13 a formed integrally with the lower end of the terminal 10 protrudes downward from the first metal plate 103.

  In the electronic component socket 301 shown in FIG. 16, the relay member mounting portion 6a is not provided, and the third metal plate 304B appears on the bottom surface of the socket. The electronic component socket 301 is installed directly on the main board (motherboard) without using the relay member 20, and the conductive piece 13a is individually soldered to the main electrode portion provided on the main board. Is done.

  Further, in the present invention, the housing 2 is not provided with the three metal plates 3, 4 </ b> A, 4 </ b> B, and the terminal 10 is held in the through hole (fitting hole) formed in the synthetic resin housing 2. The member 15 and the fitting part 15a may be inserted and held.

1, 101, 201A, 201B, 301 Electronic component socket 2, 102, 302 Housing 3, 103 First metal plate 4A, 304A Second metal plate 4B, 304B Third metal plate 5a, 305a Component support portion 5b , 305b Terminal deformation space 6a Relay member mounting portion 6b Terminal connection space 7, 8, 107, 108, 307, 308 Through hole 10, 210 Terminals 11, 211a, 211b Intermediate pieces 12, 212a, 212b Elastic pieces 13, 213a, 213b Base end piece 15, 115, 215 Holding member 15a Fitting portion 15b Support portion 15c Wall surface 15d Intermediate fulcrum portion 15f Recess 16 Electronic element 16a Electrode portion 20 Relay member 20c Electrode arrangement region 21 Upper connection electrode portion 22 Lower connection electrode portion 23 Inside Wiring layer 30 Electronic component 31 Component electrode part

Claims (8)

In an electronic component socket provided with a housing in which an electronic component is installed, and a terminal provided in the housing and in contact with a plurality of component electrode portions provided on the bottom surface of the electronic component,
A through hole is formed in the housing, and a holding member formed of an insulating material is fitted in the through hole,
A plurality of terminals are held by the holding member, and an electronic element connected to the plurality of terminals is provided.   2. The electronic component socket according to claim 1, wherein the holding member is formed with a recess for exposing the plurality of terminals, and an electrode portion of the electronic element is connected to the terminal inside the recess.   The terminal is an elastic piece that extends from the holding member to one side and contacts the component electrode portion, a base end piece that extends from the holding member to the other side, and a portion between the elastic piece and the base end piece. The electronic component socket according to claim 2, further comprising an intermediate piece exposed inside the recess, wherein an electrode portion of the electronic element is connected to the intermediate piece.   The depth dimension of the said recessed part is deeper than the thickness dimension of the said electronic element, the said electronic element does not protrude from the said recessed part, and the said recessed part is located inside the said through-hole. Socket for electronic parts.   The electron according to claim 2 or 3, wherein a depth dimension of the recess is shallower than a thickness dimension of the electronic element, the electronic element protrudes from the recess, and the recess is located outside the through hole. Socket for parts.   6. The electronic component socket according to claim 2, wherein an electrode portion of the electronic element is soldered to the terminal, and the electronic element is fixed to the inside of the concave portion with an adhesive.   The electronic component socket according to claim 2, wherein a holding convex portion that holds the electronic element is provided in the concave portion.   The electronic component socket according to claim 1, wherein a part of the housing is formed of a metal plate, and the through hole into which the holding member is fitted is formed in the metal plate.

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