JP2013016578A - Led module manufacturing method - Google Patents

Led module manufacturing method Download PDF

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JP2013016578A
JP2013016578A JP2011147258A JP2011147258A JP2013016578A JP 2013016578 A JP2013016578 A JP 2013016578A JP 2011147258 A JP2011147258 A JP 2011147258A JP 2011147258 A JP2011147258 A JP 2011147258A JP 2013016578 A JP2013016578 A JP 2013016578A
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led module
led
substrate material
circuit board
manufacturing
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Takafumi Ohata
孝文 大畠
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Sharp Corp
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Sharp Corp
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Priority to JP2011147258A priority Critical patent/JP2013016578A/en
Priority to CN2012100905279A priority patent/CN102856480A/en
Priority to TW101111744A priority patent/TW201304130A/en
Priority to KR1020120036035A priority patent/KR20130004057A/en
Publication of JP2013016578A publication Critical patent/JP2013016578A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an LED module manufacturing method which can cut down costs and can also eliminate shortage of supply.SOLUTION: A manufacturing method of an LED module 10 having a plurality of LEDs 11 mounted on a circuit board 12 extending in one direction comprises: an LED mounting step 33 in which a board raw material 21 having a same circuit pattern 17 formed repeatedly in the longer direction on a long base material 13 corresponding to each of the LEDs 11 is provided and a prescribed number of LEDs 11 are mounted on the board raw material 21; and a cutting step 39 in which the board raw material 21 is cut to a prescribed length to form the circuit board 12.

Description

本発明は、回路基板上に複数のＬＥＤを実装したＬＥＤモジュールの製造方法に関する。   The present invention relates to a method for manufacturing an LED module in which a plurality of LEDs are mounted on a circuit board.

図８は従来のＬＥＤモジュールの平面図を示している。ＬＥＤモジュール１０は液晶表示装置の液晶パネルを照明するバックライト等に搭載され、回路基板１２上に複数のＬＥＤ１１が実装される。   FIG. 8 shows a plan view of a conventional LED module. The LED module 10 is mounted on a backlight or the like that illuminates the liquid crystal panel of the liquid crystal display device, and a plurality of LEDs 11 are mounted on the circuit board 12.

回路基板１２は一方向に延びたバー状に形成され、ガラスエポキシ等の基材上に銅箔等の配線層が積層される。回路基板１２の配線層には所定の配線１６ａを伴う回路１６が形成され、複数のＬＥＤ１１が長手方向に並設して実装される。回路基板１２の一端には外部のコネクタに接続される端子部１８が設けられる。   The circuit board 12 is formed in a bar shape extending in one direction, and a wiring layer such as a copper foil is laminated on a base material such as glass epoxy. A circuit 16 with a predetermined wiring 16a is formed on the wiring layer of the circuit board 12, and a plurality of LEDs 11 are mounted side by side in the longitudinal direction. One end of the circuit board 12 is provided with a terminal portion 18 connected to an external connector.

端子部１８から外部電力が供給されると、回路１６を介してＬＥＤ１１に電力が供給される。これにより、ＬＥＤ１１が発光して液晶パネル等を照明する。   When external power is supplied from the terminal portion 18, power is supplied to the LED 11 through the circuit 16. Thereby, LED11 light-emits and illuminates a liquid crystal panel etc.

国際公開第２００９／１４２１９２号International Publication No. 2009/142192

しかしながら、上記従来のＬＥＤモジュール１０によると、液晶表示装置等のサイズに応じて実装されるＬＥＤ１１の数量が異なり、回路基板１２の長さも異なる。このため、液晶表示装置の型式等に応じて複数機種のＬＥＤモジュール１０の製造を行う必要がある。   However, according to the conventional LED module 10 described above, the number of LEDs 11 to be mounted differs depending on the size of the liquid crystal display device or the like, and the length of the circuit board 12 also differs. For this reason, it is necessary to manufacture a plurality of types of LED modules 10 according to the type of the liquid crystal display device.

これにより、設計工数、金型費用や機種切替え等の製造工数、多機種の管理工数等が大きくなるとともに、市場動向による在庫リスクが大きくなる。従って、ＬＥＤモジュール１０のコストが大きくなるとともに特定の機種の需要が大きくなると供給不足になる問題があった。  As a result, design man-hours, mold costs, manufacturing man-hours such as model switching, management man-hours for multiple models, etc., and inventory risk due to market trends increase. Therefore, there is a problem that supply becomes insufficient when the cost of the LED module 10 is increased and the demand for a specific model is increased.

本発明は、コストを削減できるとともに供給不足を解消できるＬＥＤモジュールの製造方法を提供することを目的とする。   An object of this invention is to provide the manufacturing method of the LED module which can eliminate a shortage of supply while being able to reduce cost.

上記目的を達成するために本発明は、一方向に延びた回路基板上に複数のＬＥＤを実装したＬＥＤモジュールの製造方法において、長尺の基材上に前記ＬＥＤに対応する同一の回路パターンが長手方向に繰り返し形成された基板素材を設け、前記基板素材に所定数の前記ＬＥＤを実装するＬＥＤ実装工程と、前記基板素材を所定の長さに切断して前記回路基板を形成する切断工程とを備えることを特徴としている。   In order to achieve the above object, the present invention provides a method for manufacturing an LED module in which a plurality of LEDs are mounted on a circuit board extending in one direction, and the same circuit pattern corresponding to the LEDs is formed on a long substrate. An LED mounting step of providing a substrate material repeatedly formed in the longitudinal direction, and mounting a predetermined number of the LEDs on the substrate material; and a cutting step of cutting the substrate material into a predetermined length to form the circuit board; It is characterized by having.

この構成によると、長尺の基材上に同一の回路パターンが繰り返し形成された基板素材上に機種に応じた数のＬＥＤがＬＥＤ実装工程で実装される。切断工程では基板素材が機種に応じた長さに切断される。ＬＥＤ実装工程の後に切断工程を行ってもよく、切断工程の後にＬＥＤ実装工程を行ってもよい。   According to this configuration, the number of LEDs corresponding to the model is mounted in the LED mounting process on the substrate material in which the same circuit pattern is repeatedly formed on the long base material. In the cutting process, the substrate material is cut to a length corresponding to the model. A cutting process may be performed after an LED mounting process, and an LED mounting process may be performed after a cutting process.

また本発明は、上記構成のＬＥＤモジュールの製造方法において、各前記回路パターンがそれぞれ端子部を有し、コネクタに接続される一の前記回路パターンの前記端子部を除く他の前記端子部を前記切断工程で除去したことを特徴としている。この構成によると、複数の回路パターンに対応して複数の端子部が形成され、切断工程で一の回路パターンの端子部を残して他の端子部が除去される。ＬＥＤモジュールに実装されたＬＥＤには残された端子部を介して電力が供給される。   Moreover, in the manufacturing method of the LED module having the above-described configuration, each of the circuit patterns has a terminal portion, and the other terminal portions other than the terminal portion of the one circuit pattern connected to the connector are It is characterized by having been removed in the cutting process. According to this configuration, a plurality of terminal portions are formed corresponding to the plurality of circuit patterns, and the other terminal portions are removed while leaving the terminal portions of one circuit pattern in the cutting process. Electric power is supplied to the LEDs mounted on the LED module via the remaining terminal portions.

また本発明は、上記構成のＬＥＤモジュールの製造方法において、前記切断工程で前記回路パターンに含まれる不要な配線を分断する貫通孔を形成したことを特徴としている。   According to the present invention, in the method for manufacturing an LED module having the above-described configuration, a through hole that divides unnecessary wiring included in the circuit pattern is formed in the cutting step.

また本発明は、上記構成のＬＥＤモジュールの製造方法において、前記基板素材がロール状に形成され、前記ＬＥＤ実装工程の後に前記切断工程が行われることを特徴としている。この構成によると、ロール状の基板素材が複数の工程を順に設けたＬＥＤモジュールの製造ライン上に一端を引き出して配される。ＬＥＤ実装工程では基板素材上にＬＥＤが実装される。その後、切断工程で基板素材が所定の長さに切断される。これにより、所定長さの回路基板上にＬＥＤを実装したＬＥＤモジュールが得られる。   According to the present invention, in the method for manufacturing an LED module having the above-described configuration, the substrate material is formed in a roll shape, and the cutting step is performed after the LED mounting step. According to this configuration, the roll-shaped substrate material is arranged with one end pulled out on the LED module manufacturing line in which a plurality of steps are sequentially provided. In the LED mounting process, LEDs are mounted on the substrate material. Thereafter, the substrate material is cut into a predetermined length in a cutting step. Thereby, the LED module which mounted LED on the circuit board of predetermined length is obtained.

また本発明は、上記構成のＬＥＤモジュールの製造方法において、前記基材がポリイミドまたは厚みが０．０６ｍｍ以下のガラスエポキシにより形成されることを特徴としている。この構成によると、ロール状の基板素材を容易に形成することができる。   The present invention is also characterized in that, in the LED module manufacturing method of the above configuration, the base material is formed of polyimide or glass epoxy having a thickness of 0.06 mm or less. According to this configuration, it is possible to easily form a roll-shaped substrate material.

本発明によると、長尺の基材上にＬＥＤに対応して同一の回路パターンが長手方向に繰り返し形成された基板素材を設け、ＬＥＤ実装工程で基板素材にＬＥＤを実装して切断工程で基板素材を所定の長さに切断するので、ＬＥＤの数量及び回路基板の長さが異なる複数機種のＬＥＤモジュールを同一の基板素材を用いて容易に形成することができる。従って、ＬＥＤモジュールのコストを削減できるとともに供給不足を解消することができる。   According to the present invention, a substrate material in which the same circuit pattern is repeatedly formed in the longitudinal direction corresponding to the LED is provided on a long base material, the LED is mounted on the substrate material in the LED mounting process, and the substrate is cut in the cutting process. Since the material is cut into a predetermined length, a plurality of types of LED modules having different numbers of LEDs and different circuit board lengths can be easily formed using the same substrate material. Therefore, the cost of the LED module can be reduced and supply shortage can be solved.

本発明の第１実施形態の表示装置を示す平面図The top view which shows the display apparatus of 1st Embodiment of this invention. 本発明の第１実施形態の表示装置のＬＥＤモジュールを示す平面図The top view which shows the LED module of the display apparatus of 1st Embodiment of this invention. 本発明の第１実施形態の表示装置のＬＥＤモジュールの回路基板を示す側面断面図Side surface sectional drawing which shows the circuit board of the LED module of the display apparatus of 1st Embodiment of this invention. 本発明の第１実施形態の表示装置のＬＥＤモジュールの製造ラインで用いる基板素材を示す斜視図The perspective view which shows the board | substrate raw material used with the manufacturing line of the LED module of the display apparatus of 1st Embodiment of this invention. 本発明の第１実施形態の表示装置のＬＥＤモジュールの製造ラインで用いる基板素材を示す平面図The top view which shows the board | substrate raw material used with the manufacturing line of the LED module of the display apparatus of 1st Embodiment of this invention. 本発明の第１実施形態の表示装置のＬＥＤモジュールの製造ラインを示す図The figure which shows the production line of the LED module of the display apparatus of 1st Embodiment of this invention. 本発明の第２実施形態の表示装置を示す平面図The top view which shows the display apparatus of 2nd Embodiment of this invention. 従来のＬＥＤモジュールを示す平面図Plan view showing a conventional LED module

以下に本発明の実施形態を図面を参照して説明する。図１は第１実施形態の表示装置の平面図を示している。表示装置１は液晶テレビやモバイル端末等を構成し、液晶パネル等の表示パネル２の背面にバックライト３が配される。バックライト３は導光板４及びＬＥＤモジュール１０を備えた所謂エッジライト型に構成される。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of the display device of the first embodiment. The display device 1 constitutes a liquid crystal television, a mobile terminal, and the like, and a backlight 3 is disposed on the back surface of the display panel 2 such as a liquid crystal panel. The backlight 3 is configured as a so-called edge light type including the light guide plate 4 and the LED module 10.

導光板４は平面視矩形の樹脂成形品から成り、表示パネル２に出射面４ｂを対向して配される。ＬＥＤモジュール１０は導光板４の周面の入射面４ａに沿って一方向に延びて設けられ、回路基板１２上に複数のＬＥＤ１１が実装される。ＬＥＤ１１の出射光が入射面４ａから導光板４に入射して導光し、出射面４ｂから照明光が出射される。これにより、表示パネル２上に画像が表示される。   The light guide plate 4 is made of a resin molded product having a rectangular shape in a plan view, and is disposed on the display panel 2 with the emission surface 4b facing the display panel 2. The LED module 10 is provided to extend in one direction along the incident surface 4 a on the peripheral surface of the light guide plate 4, and a plurality of LEDs 11 are mounted on the circuit board 12. Light emitted from the LED 11 enters the light guide plate 4 from the incident surface 4a and is guided, and illumination light is emitted from the output surface 4b. As a result, an image is displayed on the display panel 2.

図２はＬＥＤモジュール１０の平面図を示している。説明の便宜上、前述の図８に示す従来例と同様の部分には同一の符号を付している。ＬＥＤモジュール１０は一方向に延びたバー状の回路基板１２の一面に配線１６ａを伴う回路１６が形成され、複数のＬＥＤ１１が長手方向に並設して実装される。   FIG. 2 shows a plan view of the LED module 10. For convenience of explanation, the same reference numerals are assigned to the same parts as those in the conventional example shown in FIG. In the LED module 10, a circuit 16 with wiring 16a is formed on one surface of a bar-shaped circuit board 12 extending in one direction, and a plurality of LEDs 11 are mounted side by side in the longitudinal direction.

また、回路基板１２上には各ＬＥＤ１１に対応して所望の方向に光を出射させるレンズ（不図示）が実装される場合もある。回路基板１２の一端にはＬＥＤ１１の駆動回路側のコネクタに接続される端子部１８が形成される。   In addition, a lens (not shown) that emits light in a desired direction corresponding to each LED 11 may be mounted on the circuit board 12. At one end of the circuit board 12, a terminal portion 18 connected to the connector on the drive circuit side of the LED 11 is formed.

図３は回路基板１２の側面断面図を示している。回路基板１２は基材１３の一面に回路１６（図２参照）を形成する配線層１５が積層され、他面に放熱層１４が積層される。基材１３は約２５μｍの厚みのポリイミドにより形成される。基材１３を０．０６ｍｍ以下の厚みのガラスエポキシにより形成してもよい。基材１３としてポリイミドやガラスエポキシを用いると薄型化しても強度を確保することができる。   FIG. 3 is a side sectional view of the circuit board 12. In the circuit board 12, a wiring layer 15 for forming a circuit 16 (see FIG. 2) is laminated on one surface of a base material 13, and a heat dissipation layer 14 is laminated on the other surface. The base material 13 is formed of polyimide having a thickness of about 25 μm. The substrate 13 may be formed of glass epoxy having a thickness of 0.06 mm or less. When polyimide or glass epoxy is used as the base material 13, the strength can be ensured even if the thickness is reduced.

配線層１５は例えば、３５μｍの厚みの銅箔等により形成される。放熱層１４は例えば、厚みが３５μｍの銅箔や、厚みが０．３ｍｍ以下のアルミニウム箔により形成される。ＬＥＤ１１の発熱は基材１３を介して放熱層１４に伝えられ、放熱層１４から放熱される。   For example, the wiring layer 15 is formed of a copper foil having a thickness of 35 μm. The heat dissipation layer 14 is formed of, for example, a copper foil having a thickness of 35 μm or an aluminum foil having a thickness of 0.3 mm or less. The heat generated by the LED 11 is transmitted to the heat dissipation layer 14 via the base material 13 and is radiated from the heat dissipation layer 14.

基材１３、配線層１５及び放熱層１４の厚みが薄いため、回路基板１２は可撓性を有するフィルム状に形成されたフレキシブル基板になっている。   Since the substrate 13, the wiring layer 15, and the heat dissipation layer 14 are thin, the circuit board 12 is a flexible board formed in a flexible film shape.

図４はＬＥＤモジュール１０の製造ライン３０（図６参照）で用いられる基板素材２１の斜視図を示している。基板素材２１は長尺の基材１３上に配線層１５及び放熱層１４が積層され、可撓性を有するため巻回してロール状に形成される。後述するように基板素材２１を切断して回路基板１２が得られる。   FIG. 4 is a perspective view of the substrate material 21 used in the production line 30 (see FIG. 6) of the LED module 10. The substrate material 21 has a wiring layer 15 and a heat dissipation layer 14 laminated on a long base material 13 and is wound to be flexible and formed into a roll shape. As described later, the circuit board 12 is obtained by cutting the substrate material 21.

ポリイミドを基材１３とする基板素材２１の製造時には、まずポリイミドから成る基材１３の表面にポリイミドの前駆体であるポリアミック酸が塗布される。次に、配線層１５及び放熱層１４を形成する金属箔を熱ラミネートした後、熱硬化処理される。これにより、基材１３の両面の直上にそれぞれ配線層１５及び放熱層１４が形成される。   When manufacturing the substrate material 21 using polyimide as the base material 13, first, polyamic acid, which is a precursor of polyimide, is applied to the surface of the base material 13 made of polyimide. Next, the metal foil that forms the wiring layer 15 and the heat dissipation layer 14 is heat-laminated and then heat-cured. Thereby, the wiring layer 15 and the heat radiating layer 14 are respectively formed immediately above both surfaces of the base material 13.

配線層１５及び放熱層１４の一方の金属箔上にポリイミドの前駆体を塗布し、他方を熱ラミネートした後に熱硬化処理してもよい。これにより、ポリイミドの前駆体が熱硬化してポリイミドから成る基材１３を形成することができる。   A polyimide precursor may be applied on one of the metal foils of the wiring layer 15 and the heat dissipation layer 14, and the other may be heat-laminated and then thermoset. Thereby, the precursor of polyimide can be thermally cured to form the base material 13 made of polyimide.

ガラスエポキシを基材１３とする基板素材２１を形成する場合は、基材１３の両面に接着剤が塗布される。次に、配線層１５及び放熱層１４を形成する金属箔を熱ラミネートした後、熱硬化処理される。これにより、基材１３の両面にそれぞれ接着剤を介して配線層１５及び放熱層１４が形成される。   When forming the substrate material 21 having the glass epoxy as the base material 13, an adhesive is applied to both surfaces of the base material 13. Next, the metal foil that forms the wiring layer 15 and the heat dissipation layer 14 is heat-laminated and then heat-cured. Thereby, the wiring layer 15 and the heat dissipation layer 14 are formed on both surfaces of the base material 13 via the adhesive, respectively.

基材１３をポリイミドにより形成すると、配線層１５や放熱層１４と基材１３との間に基材１３と材質の異なる接着層が形成されない。このため、回路基板１２の熱伝導性の低下を抑制することができる。   When the base material 13 is formed of polyimide, an adhesive layer having a material different from that of the base material 13 is not formed between the wiring layer 15 or the heat dissipation layer 14 and the base material 13. For this reason, a decrease in the thermal conductivity of the circuit board 12 can be suppressed.

図５は基板素材２１の平面図を示している。基板素材２１は配線層１５をエッチングして配線１６ａを伴う回路１６が形成される。回路１６は基板素材２１上に実装されるＬＥＤ１１に対応する同一の回路パターン１７が長手方向に繰り返されている。各回路パターン１７には外部のコネクタとの接続を行う端子部１８が設けられる。後述するように、基板素材２１を切断して回路基板１２（図中、一点鎖線で示す）を形成する際に、一の回路パターン１７の端子部１８を残して他の回路パターン１７の端子部１８が除去される。   FIG. 5 shows a plan view of the substrate material 21. Substrate material 21 etches wiring layer 15 to form circuit 16 with wiring 16a. In the circuit 16, the same circuit pattern 17 corresponding to the LED 11 mounted on the substrate material 21 is repeated in the longitudinal direction. Each circuit pattern 17 is provided with a terminal portion 18 for connection to an external connector. As will be described later, when the substrate material 21 is cut to form the circuit board 12 (indicated by the alternate long and short dash line in the drawing), the terminal portions 18 of one circuit pattern 17 are left, leaving the terminal portions 18 of the other circuit patterns 17. 18 is removed.

図６はＬＥＤモジュール１０の製造ラインを示す図である。製造ライン３０はクリーム半田工程３１、第１検査工程３２、ＬＥＤ実装工程３３、リフロー半田工程３４、第２検査工程３５、レンズ実装工程３６、熱硬化工程３７、粘着テープ貼着工程３８、切断工程３９が順に配される。製造ライン３０の先頭にはロール状の基板素材２１が配され、先端を引き出された基板素材２１が製造ライン３０上に送り出される。   FIG. 6 is a diagram showing a production line for the LED module 10. The production line 30 includes a cream soldering process 31, a first inspection process 32, an LED mounting process 33, a reflow soldering process 34, a second inspection process 35, a lens mounting process 36, a thermosetting process 37, an adhesive tape attaching process 38, and a cutting process. 39 are arranged in order. A roll-shaped substrate material 21 is arranged at the head of the production line 30, and the substrate material 21 with the leading end pulled out is sent onto the production line 30.

クリーム半田形成工程３１は基板素材２１の配線部１５上の所定位置にクリーム半田を印刷等により形成する。第１検査工程３２は基板素材２１上のクリーム半田の外観等を検査する。ＬＥＤ実装工程３３はクリーム半田上にＬＥＤ１１（図１参照）を載置して仮接着する。リフロー半田工程３４はクリーム半田を溶融してＬＥＤ１１を半田付けする。第２検査工程３５はＬＥＤ１１を半田付けした基板素材２１の外観等を検査する。   In the cream solder forming step 31, cream solder is formed at a predetermined position on the wiring portion 15 of the substrate material 21 by printing or the like. In the first inspection step 32, the appearance of the cream solder on the substrate material 21 is inspected. In the LED mounting step 33, the LED 11 (see FIG. 1) is placed on the solder paste and temporarily bonded. The reflow soldering process 34 melts cream solder and solders the LED 11. The second inspection step 35 inspects the appearance and the like of the substrate material 21 to which the LED 11 is soldered.

レンズ実装を行う場合はレンズ実装工程３６が行われ、接着剤を塗布したレンズ（不図示）を基板素材２１上に仮接着する。熱硬化工程３７はレンズの接着剤を熱硬化して基板素材２１にレンズを固着する。粘着テープ貼着工程３８は基板素材２１の放熱層１４の一面に粘着テープを貼着する。   When performing lens mounting, a lens mounting step 36 is performed, and a lens (not shown) coated with an adhesive is temporarily bonded onto the substrate material 21. In the thermosetting step 37, the lens adhesive is thermoset to fix the lens to the substrate material 21. In the adhesive tape attaching process 38, an adhesive tape is attached to one surface of the heat radiation layer 14 of the substrate material 21.

切断工程３９は金型の打ち抜きによって基板素材２１を機種に応じて所定長さに切断する。これにより、一方向に延びた回路基板１２上に複数のＬＥＤ１１を実装したＬＥＤモジュール１０（図２参照）が得られる。この時、前述の図２に示すように、一の回路パターン１７の端子部１８を残して他の回路パターン１７の端子部１８が除去される。また、回路パターン１７に含まれる不要な配線１６ａが貫通孔１９により分断される。そして、順に基板素材２１が送り出され、ＬＥＤモジュール１０が順に形成される。   In the cutting step 39, the substrate material 21 is cut into a predetermined length according to the model by punching a mold. Thereby, the LED module 10 (refer FIG. 2) which mounted several LED11 on the circuit board 12 extended in one direction is obtained. At this time, as shown in FIG. 2 described above, the terminal portions 18 of the other circuit patterns 17 are removed while leaving the terminal portions 18 of the one circuit pattern 17. Further, unnecessary wiring 16 a included in the circuit pattern 17 is divided by the through hole 19. And the board | substrate raw material 21 is sent out in order and the LED module 10 is formed in order.

本実施形態によると、長尺の基材１３上にＬＥＤ１１に対応して同一の回路パターンが長手方向に繰り返し形成された基板素材２１を設け、ＬＥＤ実装工程３３で基板素材２１にＬＥＤ１１を実装して切断工程３９で基板素材２１を所定の長さに切断するので、ＬＥＤ１１の数量及び回路基板１２の長さが異なる複数機種のＬＥＤモジュール１０を同一の基板素材２１を用いて容易に形成することができる。   According to this embodiment, the substrate material 21 in which the same circuit pattern is repeatedly formed in the longitudinal direction corresponding to the LED 11 is provided on the long base material 13, and the LED 11 is mounted on the substrate material 21 in the LED mounting step 33. Since the substrate material 21 is cut to a predetermined length in the cutting step 39, a plurality of types of LED modules 10 having different numbers of LEDs 11 and different circuit board 12 lengths can be easily formed using the same substrate material 21. Can do.

従って、ＬＥＤモジュール１０の設計工数、製造工数及び管理工数を削減してコストを削減することができる。また、複数の機種のＬＥＤモジュール１０を迅速に製造できるため特定の機種の需要が大きくなった際に供給不足を解消することができる。   Therefore, the design man-hours, manufacturing man-hours, and management man-hours of the LED module 10 can be reduced to reduce costs. Moreover, since the LED module 10 of a some model can be manufactured rapidly, when the demand of a specific model becomes large, a supply shortage can be eliminated.

また、一の回路パターン１７に設けた端子部１８を除く他の端子部１８を切断工程３９で除去したので、外部のコネクタに接続される端子部１８を容易に形成することができる。   Further, since the other terminal portions 18 except for the terminal portions 18 provided in the one circuit pattern 17 are removed in the cutting step 39, the terminal portions 18 connected to the external connectors can be easily formed.

また、切断工程３９で回路パターン１７に含まれる不要な配線１６ａを分断する貫通孔１９を形成したので、ＬＥＤ１１が実装される回路基板１２上に所望の回路１６を容易に形成することができる。   Moreover, since the through-hole 19 that divides the unnecessary wiring 16a included in the circuit pattern 17 is formed in the cutting step 39, the desired circuit 16 can be easily formed on the circuit board 12 on which the LED 11 is mounted.

また、基板素材２１がロール状に形成され、ＬＥＤ実装工程３３の後に切断工程３９が行われるので、基板素材２１を製造ライン３０上に送り出してＬＥＤ１１を実装し、基板素材２１を所定の長さに切断してＬＥＤモジュール１０を容易に得ることができる。また、製造ライン３０上に回路基板１２を搬送する搬送パレットを必要とせず、ＬＥＤモジュール１０のコストをより削減することができる。加えて、短冊状の回路基板１２上にＬＥＤ１１を実装する際に生じる回路基板１２の捩れによる歩留り低下や工数の増加を回避することができる。   In addition, since the substrate material 21 is formed in a roll shape, and the cutting step 39 is performed after the LED mounting step 33, the substrate material 21 is sent onto the production line 30 to mount the LED 11, and the substrate material 21 has a predetermined length. The LED module 10 can be obtained easily. Moreover, the conveyance pallet which conveys the circuit board 12 on the production line 30 is not required, and the cost of the LED module 10 can be further reduced. In addition, it is possible to avoid a decrease in yield and an increase in the number of man-hours caused by twisting of the circuit board 12 that occurs when the LEDs 11 are mounted on the strip-shaped circuit board 12.

尚、基板素材２１を機種に応じた長さに切断して回路基板１２を形成した後、回路基板１２上にＬＥＤ１１を実装してもよい。これにより、本実施形態よりもコスト削減効果が低下するが、複数の機種のＬＥＤモジュール１０を容易に製造することができる。   The LED 11 may be mounted on the circuit board 12 after the circuit board 12 is formed by cutting the substrate material 21 into a length corresponding to the model. Thereby, although the cost reduction effect falls rather than this embodiment, the LED module 10 of a some model can be manufactured easily.

また、基板素材２１の基材１３がポリイミドまたは厚みが０．０６ｍｍ以下のガラスエポキシにより形成されるので、基板素材３１を容易にロール状に形成することができる。   Moreover, since the base material 13 of the substrate material 21 is formed of polyimide or glass epoxy having a thickness of 0.06 mm or less, the substrate material 31 can be easily formed in a roll shape.

本実施形態において、基板素材２１の長手方向に直交する幅方向にも回路パターン１７を並設して回路パターン１７をマトリクス状に形成してもよい。これにより、切断工程で基板素材２１の長手方向及び幅方向に切断して複数列のＬＥＤモジュール１０を同時に形成することができる。   In the present embodiment, the circuit pattern 17 may be formed in a matrix by arranging the circuit patterns 17 in the width direction orthogonal to the longitudinal direction of the substrate material 21. Thereby, it can cut | disconnect in the longitudinal direction and the width direction of the board | substrate raw material 21 at a cutting process, and can form the LED module 10 of multiple rows simultaneously.

次に、図７は第２実施形態の表示装置の平面図を示している。説明の便宜上、前述の図１〜図６に示す第１実施形態と同様の部分には同一の符号を付している。表示装置１は液晶パネル等の表示パネル２の背面にバックライト３が配される。バックライト３は表示パネル２に面して一方向に延びる複数のＬＥＤモジュール１０を並設した所謂直下型に構成される。ＬＥＤ１１の出射光により表示パネル２を照明して表示パネル２上に画像が表示される。   Next, FIG. 7 shows a plan view of the display device of the second embodiment. For convenience of explanation, the same reference numerals are given to the same parts as those in the first embodiment shown in FIGS. The display device 1 is provided with a backlight 3 on the back surface of a display panel 2 such as a liquid crystal panel. The backlight 3 has a so-called direct type in which a plurality of LED modules 10 facing the display panel 2 and extending in one direction are arranged in parallel. The display panel 2 is illuminated by the light emitted from the LED 11 and an image is displayed on the display panel 2.

各ＬＥＤモジュール１０は第１実施形態と同様に構成される。即ち、長尺の基材１３上にＬＥＤ１１に対応した同一の回路パターン１７が長手方向に繰り返し形成された基板素材２１（図５参照）を切断してＬＥＤモジュール１０が形成される。従って、第１実施形態と同様に、ＬＥＤ１１の数量及び回路基板１２の長さが異なる複数機種のＬＥＤモジュール１０を同一の基板素材２１を用いて容易に形成することができる。   Each LED module 10 is configured similarly to the first embodiment. That is, the LED module 10 is formed by cutting the substrate material 21 (see FIG. 5) in which the same circuit pattern 17 corresponding to the LED 11 is repeatedly formed in the longitudinal direction on the long base material 13. Therefore, as in the first embodiment, a plurality of types of LED modules 10 having different numbers of LEDs 11 and different lengths of the circuit board 12 can be easily formed using the same substrate material 21.

本発明によると、液晶テレビやモバイル端末等の液晶表示パネルのバックライト等に利用することができる。   According to the present invention, it can be used for a backlight of a liquid crystal display panel such as a liquid crystal television or a mobile terminal.

１ 表示装置
２ 表示パネル
３ バックライト
４ 導光板
１０ ＬＥＤモジュール
１１ ＬＥＤ
１２ 回路基板
１３ 基材
１４ 放熱層
１５ 配線層
１６ 回路
１６ａ 配線
１７ 回路パターン
１８ 端子部
１９ 貫通孔
２１ 基板素材
３１ クリーム半田工程
３２ 第１検査工程
３３ ＬＥＤ実装工程
３４ リフロー半田工程
３５ 第２検査工程
３６ レンズ実装工程
３７ 熱硬化工程
３８ 粘着テープ貼着工程
３９ 切断工程 DESCRIPTION OF SYMBOLS 1 Display apparatus 2 Display panel 3 Backlight 4 Light guide plate 10 LED module 11 LED
DESCRIPTION OF SYMBOLS 12 Circuit board 13 Base material 14 Heat radiation layer 15 Wiring layer 16 Circuit 16a Wiring 17 Circuit pattern 18 Terminal part 19 Through-hole 21 Substrate material 31 Cream solder process 32 1st inspection process 33 LED mounting process 34 Reflow solder process 35 2nd inspection process 36 Lens mounting process 37 Thermosetting process 38 Adhesive tape attaching process 39 Cutting process

Claims (5)

一方向に延びた回路基板上に複数のＬＥＤを実装したＬＥＤモジュールの製造方法において、長尺の基材上に前記ＬＥＤに対応する同一の回路パターンが長手方向に繰り返し形成された基板素材を設け、前記基板素材に所定数の前記ＬＥＤを実装するＬＥＤ実装工程と、前記基板素材を所定の長さに切断して前記回路基板を形成する切断工程とを備えることを特徴とするＬＥＤモジュールの製造方法。   In a manufacturing method of an LED module in which a plurality of LEDs are mounted on a circuit board extending in one direction, a substrate material in which the same circuit pattern corresponding to the LED is repeatedly formed in a longitudinal direction on a long base material is provided. An LED module manufacturing method comprising: an LED mounting step of mounting a predetermined number of the LEDs on the substrate material; and a cutting step of cutting the substrate material into a predetermined length to form the circuit board. Method. 各前記回路パターンがそれぞれ端子部を有し、コネクタに接続される一の前記回路パターンの前記端子部を除く他の前記端子部を前記切断工程で除去したことを特徴とする請求項１に記載のＬＥＤモジュールの製造方法。   The said circuit pattern has a terminal part, respectively, The said other terminal part except the said terminal part of the said one circuit pattern connected to a connector was removed by the said cutting process. LED module manufacturing method. 前記切断工程で前記回路パターンに含まれる不要な配線を分断する貫通孔を形成したことを特徴とする請求項１または請求項２に記載のＬＥＤモジュールの製造方法。   3. The method of manufacturing an LED module according to claim 1, wherein a through-hole that divides unnecessary wiring included in the circuit pattern is formed in the cutting step. 4. 前記基板素材がロール状に形成され、前記ＬＥＤ実装工程の後に前記切断工程が行われることを特徴とする請求項１〜請求項３のいずれかに記載のＬＥＤモジュールの製造方法。   The method for manufacturing an LED module according to any one of claims 1 to 3, wherein the substrate material is formed in a roll shape, and the cutting step is performed after the LED mounting step. 前記基材がポリイミドまたは厚みが０．０６ｍｍ以下のガラスエポキシにより形成されることを特徴とする請求項４に記載のＬＥＤモジュールの製造方法。   The method for producing an LED module according to claim 4, wherein the base material is formed of polyimide or glass epoxy having a thickness of 0.06 mm or less.
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WO2016170621A1 (en) * 2015-04-22 2016-10-27 堺ディスプレイプロダクト株式会社 Light source device, display device, substrate unit manufacturing method, and light source device manufacturing method
JPWO2016170621A1 (en) * 2015-04-22 2018-02-15 堺ディスプレイプロダクト株式会社 LIGHT SOURCE DEVICE, DISPLAY DEVICE, SUBSTRATE UNIT MANUFACTURING METHOD, AND LIGHT SOURCE DEVICE MANUFACTURING METHOD
JP2018056397A (en) * 2016-09-29 2018-04-05 日亜化学工業株式会社 Method for manufacturing metal base substrate, method for manufacturing semiconductor device, metal base substrate, and semiconductor device
US11018288B2 (en) 2016-09-29 2021-05-25 Nichsa Corporation Metal-base substrate and semiconductor device

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