JP2012223969A - Method for manufacturing card and card - Google Patents
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Abstract
Description
本発明は、カード製造方法、および、該カード製造方法を用いて製造されたカードに関する。 The present invention relates to a card manufacturing method and a card manufactured using the card manufacturing method.
従来、カードは広範な分野に広く利用されている。例えば、クレジットカード、キャッシュカード、個人識別カード、などが挙げられる。 Conventionally, cards are widely used in a wide range of fields. For example, a credit card, a cash card, a personal identification card, etc. are mentioned.
カードの表面には、意匠、機能付加、偽造防止、などの観点から印刷を用いて印刷層を形成し、図柄（写真、図形、文字、ロゴ、バーコードなど）を描画することが行われている。このため、カード表面には印刷適性が求められる。特に、カード表面の平滑性は好適に印刷を施すために重視される。 On the surface of the card, a printing layer is formed using printing from the viewpoints of design, function addition, forgery prevention, etc., and a pattern (photograph, figure, character, logo, barcode, etc.) is drawn. Yes. For this reason, printability is required on the card surface. In particular, the smoothness of the card surface is emphasized in order to suitably perform printing.
例えば、カードの印刷適性向上のため、カード表面に樹脂を塗布し、カード表面の平滑性を向上させることが提案されている（特許文献１参照）。 For example, in order to improve the printability of a card, it has been proposed to apply a resin to the card surface to improve the smoothness of the card surface (see Patent Document 1).
しかしながら、カード表面の平滑性を向上させるためカード表面に樹脂を塗布した場合、充分な平滑性を得るためにはカード表面の樹脂膜厚を厚くする必要があり、充分な膜厚を得るためには複数回の塗布が必須であった。例えば、カード表面の平滑のため乾燥膜厚３０μｍとなる樹脂を塗布する場合、印刷方式の中でも高粘度インキを使用かつ厚盛が可能なスクリーン印刷を使用したとしても、乾燥膜厚３０μｍを形成するには２度塗りや３度塗りが必須である。このため、カードの製造にあたり、工程数が増え高コストになる問題があった。 However, when a resin is applied to the card surface to improve the smoothness of the card surface, it is necessary to increase the resin film thickness on the card surface in order to obtain sufficient smoothness. Multiple applications were essential. For example, when a resin having a dry film thickness of 30 μm is applied to smooth the card surface, a dry film thickness of 30 μm is formed even if screen printing capable of thickening and using high viscosity ink is used among printing methods. In order to paint, it is essential to paint twice or three times. For this reason, in manufacturing the card, there is a problem that the number of processes is increased and the cost is increased.
特に、カード基材にパルプ繊維を主成分とした紙系の材料を用いた場合、１）紙系の材料は、表面が多孔質であり凹凸があり粗いため、充分に平滑とするには塗布する樹脂膜厚を厚くする必要がある、２）紙系の材料の内部へ樹脂が浸透する、などの理由から、充分な平滑性を得るために必要な樹脂の塗布回数は多くなる傾向があった。 In particular, when a paper-based material containing pulp fiber as the main component is used for the card substrate, 1) the paper-based material is porous and rough and rough, so it can be applied sufficiently smoothly. It is necessary to increase the thickness of the resin to be used. 2) The number of times the resin is applied to obtain sufficient smoothness tends to increase because the resin penetrates into the paper-based material. It was.
そこで、本発明は、上述の課題を解決するためになされたものであり、簡便にカード表面の平滑性に優れたカードを製造することの出来るカード製造方法を提供することを目的とする。 Accordingly, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a card manufacturing method that can easily manufacture a card having excellent card surface smoothness.
本発明の一実施形態は、基材フィルムに、受像層を積層し、該受像層の上部に接着層を積層し、転写箔フィルムを形成する転写箔フィルム形成工程と、カード基材と前記転写箔フィルムとを接触し、加熱し、熱転写する熱転写工程と、前記転写箔フィルムが熱転写されたカード基材から、基材フィルムを剥離する剥離工程と、を備えたことを特徴とするカード製造方法である。 One embodiment of the present invention includes a transfer foil film forming step in which an image receiving layer is stacked on a base film, an adhesive layer is stacked on top of the image receiving layer, and a transfer foil film is formed. A card manufacturing method comprising: a thermal transfer step of contacting, heating and thermally transferring a foil film; and a peeling step of peeling the base film from the card base on which the transfer foil film is thermally transferred. It is.
また、前記転写箔フィルム形成工程にあって、前記受像層と前記接着層との間に少なくとも１層以上の中間層を積層し、前記中間層は、前記受像層および前記接着層よりもガラス転移温度が高く、かつ、硬度が高い材料を用いてもよい。 Further, in the transfer foil film forming step, at least one intermediate layer is laminated between the image receiving layer and the adhesive layer, and the intermediate layer has a glass transition more than the image receiving layer and the adhesive layer. A material having a high temperature and a high hardness may be used.
また、前記接着層は、樹脂を含み、該樹脂分に対して５重量％以上２０重量％以下の多孔質シリカフィラーを含有する材料を用いて形成された接着層であってもよい。 The adhesive layer may be an adhesive layer formed using a material containing a resin and containing a porous silica filler in an amount of 5 wt% to 20 wt% with respect to the resin content.
また、前記受像層は、樹脂を含み、該樹脂分に対して２重量％以上１５重量％以下のポリエチレンワックスを含有し、該樹脂は、塩化ビニル樹脂または塩化ビニル酢酸ビニル共重合樹脂を主成分とする樹脂である材料を用いて形成された受像層であってもよい。 Further, the image receiving layer contains a resin and contains 2 to 15% by weight of polyethylene wax with respect to the resin content, and the resin is mainly composed of vinyl chloride resin or vinyl chloride vinyl acetate copolymer resin. The image receiving layer may be formed using a material that is a resin.
また、前記カード基材は、少なくとも２層以上のパルプ繊維を主成分としたパルプ繊維層を有し、該パルプ繊維層同士に挟まれる位置に非接触型ＩＣインレットを内蔵しているカード基材であってもよい。 The card substrate has a pulp fiber layer containing at least two or more layers of pulp fibers as a main component, and has a non-contact IC inlet built in a position sandwiched between the pulp fiber layers. It may be.
本発明の一実施形態は、カード基材と、前記カード基材上に積層された接着層と、前記接着層より外面側に積層された受像層と、を備え、前記カード基材は、パルプ繊維を主成分としたパルプ繊維層を有するカード基材であり、前記接着層は、樹脂を含み、該樹脂分に対して５重量％以上２０重量％以下の多孔質シリカフィラーを含有する材料を用いて形成された接着層であり、前記受像層は、樹脂を含み、該樹脂分に対して２重量％以上１５重量％以下のポリエチレンワックスを含有し、該樹脂は、塩化ビニル樹脂または塩化ビニル酢酸ビニル共重合樹脂を主成分とする樹脂である材料を用いて形成された受像層であり、 前記受像層表面の算術平均粗さＲａは、５ｎｍ≦Ｒａ≦５００ｎｍの範囲にあることを特徴とするカードである。 One embodiment of the present invention comprises a card substrate, an adhesive layer laminated on the card substrate, and an image receiving layer laminated on the outer surface side of the adhesive layer, and the card substrate is a pulp A card base material having a pulp fiber layer mainly composed of fibers, wherein the adhesive layer contains a resin, and a material containing a porous silica filler in an amount of 5% by weight to 20% by weight with respect to the resin content. The image-receiving layer contains a resin and contains 2 wt% or more and 15 wt% or less of polyethylene wax with respect to the resin content, and the resin is a vinyl chloride resin or vinyl chloride An image receiving layer formed using a material that is a resin mainly composed of a vinyl acetate copolymer resin, wherein the arithmetic average roughness Ra of the surface of the image receiving layer is in a range of 5 nm ≦ Ra ≦ 500 nm. Card.
また、上述のカードにあって、更に、前記受像層上に積層された印刷層と、を備え、前記印刷層は直接昇華により形成された印刷層であってもよい。 The above-mentioned card may further include a printed layer laminated on the image receiving layer, and the printed layer may be a printed layer formed by direct sublimation.
本発明のカード製造方法は、「受像層および接着層を備えた転写箔フィルムを形成し、カード基材に転写箔フィルムを熱転写し、転写箔フィルムの基材フィルムを剥離すること」から、製造されたカードのカード表面は、基材フィルム上に積層されていた受像層となる。このとき、受像層は平滑な基材フィルムからの転移となるため、形成されたカード表面は優れた平滑性を備える。 The card manufacturing method of the present invention is produced from “forming a transfer foil film having an image receiving layer and an adhesive layer, thermally transferring the transfer foil film to the card substrate, and peeling the substrate film of the transfer foil film”. The card surface of the obtained card becomes an image receiving layer laminated on the base film. At this time, since the image receiving layer is transferred from a smooth base film, the formed card surface has excellent smoothness.
以下、本発明のカード製造方法について説明を行う。 The card manufacturing method of the present invention will be described below.
＜転写箔フィルム形成工程＞
まず、基材フィルムに、受像層を積層し、該受像層の上部に接着層を積層し、転写箔フィルムを形成する。
<Transfer foil film formation process>
First, an image receiving layer is laminated on a base film, and an adhesive layer is laminated on the image receiving layer to form a transfer foil film.
基材フィルムは、＜熱転写工程＞における熱耐性を有し、表面が平滑なフィルムに成型可能な材料を用いればよい。例えば、ポリプロピレン、ポリエチレンテレフタレト、ナイロン、セロファンなどのフィルムを用いてよい。 The base film may be made of a material that has heat resistance in the <thermal transfer step> and can be molded into a film having a smooth surface. For example, a film of polypropylene, polyethylene terephthalate, nylon, cellophane, or the like may be used.
受像層は、カード表面の図柄の描写に用いる印刷方法に適した印刷適性を備えた材料を適宜公知の材料から選択して用いてよい。例えば、直接昇華方式で図柄を描写する場合、塩化ビニル樹脂、塩化ビニル酢酸ビニル樹脂、ポリエステル樹脂、ブチラール樹脂、エポキシ樹脂、ポリウレタン樹脂、などを用いてよい。特に、塩化ビニル樹脂および塩化ビニル酢酸ビニル共重合は、１）直接昇華染料の受像にあって優れた発色性、２）基材フィルムからの剥離性、に優れ、本発明に用いる材料として好ましい。 As the image receiving layer, a material having printability suitable for a printing method used for drawing a pattern on the card surface may be appropriately selected from known materials. For example, when a pattern is drawn by a direct sublimation method, vinyl chloride resin, vinyl chloride vinyl acetate resin, polyester resin, butyral resin, epoxy resin, polyurethane resin, or the like may be used. In particular, vinyl chloride resin and vinyl chloride vinyl acetate copolymer are preferred as materials used in the present invention, because they are 1) excellent in color developability in direct sublimation dye image reception and 2) excellent in releasability from a substrate film.
また、受像層には離型剤を添加してもよい。離型剤を添加することにより、印刷プリンターの昇華リボンとカード表面との貼り付き不具合を解消することが出来る。例えば、離型剤として、ポリエチレンワックス、シリコーンオイル、シリコーンフィラー、ポリテトラフルオロエチレンフィラーなどを用いてもよい。特に、ポリエチレンワックスは上塗り性に優れ、本発明のカード製造方法に用いる離型剤として好ましい。 Further, a release agent may be added to the image receiving layer. By adding a release agent, it is possible to eliminate the problem of sticking between the sublimation ribbon of the printing printer and the card surface. For example, polyethylene wax, silicone oil, silicone filler, polytetrafluoroethylene filler or the like may be used as a release agent. In particular, polyethylene wax is excellent in top coatability and is preferable as a release agent used in the card manufacturing method of the present invention.
また、受像層は、樹脂を含み、該樹脂分に対して２重量％以上１５重量％以下のポリエチレンワックスを含有し、該樹脂は、塩化ビニル樹脂または塩化ビニル酢酸ビニル共重合樹脂を主成分とする樹脂である材料を用いて形成された受像層であることが好ましい。 受像層に、「塩化ビニル樹脂または塩化ビニル酢酸ビニル共重合樹脂を主成分とする樹脂」を含む材料を用いた場合、ポリエチレンワックスを添加することにより、印刷プリンターの昇華リボンとカード表面との貼り付き不具合を解消することが出来る。このとき、ポリエチレンワックスの割合が少ないと貼り付きを抑制できず、ポリエチレンワックスの割合が多いと受像性が低下し好ましくない。よって、ポリエチレンワックスの添加は、２重量％以上１５重量％以下程度の範囲内にあることが好ましい。
また、「塩化ビニル樹脂または塩化ビニル酢酸ビニル共重合樹脂を主成分とする樹脂」を用いた場合、剥離性や発色性を保つために、受像層の厚みは０．２μｍ以上２．０μｍ以下程度の範囲にあることが好ましい。なお、「塩化ビニル樹脂または塩化ビニル酢酸ビニル共重合樹脂を主成分とする樹脂」において、主成分とは、受像層に用いる材料において塩化ビニル樹脂または塩化ビニル酢酸ビニル共重合樹脂の割合が９０重量％以上であることをいう。
Further, the image receiving layer contains a resin and contains 2 to 15% by weight of polyethylene wax with respect to the resin content, and the resin is mainly composed of vinyl chloride resin or vinyl chloride vinyl acetate copolymer resin. It is preferable that the image receiving layer be formed using a material that is a resin to be used. When a material containing “resin consisting mainly of vinyl chloride resin or vinyl chloride vinyl acetate copolymer resin” is used for the image receiving layer, it is possible to attach the sublimation ribbon of the printer to the card surface by adding polyethylene wax. You can solve the problem. At this time, if the ratio of the polyethylene wax is small, sticking cannot be suppressed, and if the ratio of the polyethylene wax is large, the image receiving property is lowered, which is not preferable. Therefore, the addition of polyethylene wax is preferably in the range of about 2 wt% or more and 15 wt% or less.
In addition, in the case of using “resin mainly composed of vinyl chloride resin or vinyl chloride vinyl acetate copolymer resin”, the thickness of the image receiving layer is about 0.2 μm or more and 2.0 μm or less in order to maintain the peelability and color developability. It is preferable that it exists in the range. In the “resin mainly composed of vinyl chloride resin or vinyl chloride vinyl acetate copolymer resin”, the main component means that the ratio of vinyl chloride resin or vinyl chloride vinyl acetate copolymer resin in the material used for the image receiving layer is 90% by weight. % Or more.
接着層は、カード基材と転写箔フィルムを接着するために設ける。このため、カード基材に選択した材料に対し適した接着性を備える材料を用いればよい。例えば、接着層として、ポリオレフィン、エチレン酢酸ビニル共重合体、ポリウレタン、ポリエステル、塩化ビニル酢酸ビニル共重合体などの樹脂を用いてもよい。 The adhesive layer is provided for adhering the card substrate and the transfer foil film. For this reason, what is necessary is just to use the material provided with the adhesiveness suitable for the material selected for the card | curd base material. For example, a resin such as polyolefin, ethylene vinyl acetate copolymer, polyurethane, polyester, vinyl chloride vinyl acetate copolymer may be used as the adhesive layer.
接着層の厚みは、５μｍ以上２０μｍ以下程度、より好ましくは１０μｍ以上２０μｍ以下程度の範囲にあることが好ましい。接着層の厚みが小さいと接着できず好ましくない。また、接着層の厚みが大きいと塗工方式も限られ、材料コストも高いため、好ましくない。 The thickness of the adhesive layer is preferably in the range of about 5 μm to 20 μm, more preferably about 10 μm to 20 μm. If the thickness of the adhesive layer is small, it is not preferable because it cannot be adhered. Also, if the thickness of the adhesive layer is large, the coating method is limited and the material cost is high, which is not preferable.
また、接着層は、樹脂を含み、該樹脂分に対して５重量％以上２０重量％以下の多孔質シリカフィラーを含有する材料を用いて形成された接着層であることが好ましい。
多孔質シリカフィラーを含有することにより、接着層が熱溶融しカード基材と接着する＜熱転写工程＞において、多孔質のシリカフィラーの嵩高さ及びチクソ性により、接着層に用いた樹脂が過度にカード基材内部に浸透することを抑制することが出来る。このため、カード基材表面の凹凸が最終的に製造されるカードの表面に反映されること抑制することが出来、平滑性を向上させることが出来る。また、カード基材内部に浸透することを抑制することから、カード基材の目止めにも効果的である。
このとき、多孔質シリカフィラーの割合が少ないと樹脂が過度にカード基材内部に浸透することを抑制できず、多孔質シリカフィラーの割合が多いとカード基材との接着性が低下し好ましくない。よって、多孔質シリカフィラーの添加は、５重量％以上２０重量％以下程度の範囲内にあることが好ましい。また、多孔質シリカフィラーは選択した接着層の樹脂および接着層の積層方法などに応じて適宜粒径などの物性を調整して配合することが好ましい。例えば、グラビア印刷方法にて接着層を積層する場合、シリカフィラーの粒径は、１μｍ以上３０μｍ以下程度、より好ましくは、５μｍ以上１５μｍ以下程度の範囲にあることが好ましい。
Moreover, it is preferable that an adhesive layer is an adhesive layer formed using the material which contains resin and contains 5 to 20 weight% of porous silica filler with respect to this resin part.
By containing the porous silica filler, in the <thermal transfer step> in which the adhesive layer is thermally melted and adhered to the card substrate, the resin used in the adhesive layer is excessive due to the bulkiness and thixotropy of the porous silica filler. It is possible to suppress penetration into the card base. For this reason, it can suppress that the unevenness | corrugation of the card | curd base-material surface is reflected on the surface of the card | curd finally manufactured, and can improve smoothness. Moreover, since it suppresses permeation into the card base material, it is also effective for sealing the card base material.
At this time, if the proportion of the porous silica filler is small, it is not possible to suppress the resin from penetrating into the card substrate excessively, and if the proportion of the porous silica filler is large, the adhesiveness to the card substrate is lowered, which is not preferable. . Therefore, the addition of the porous silica filler is preferably in the range of about 5 wt% to 20 wt%. The porous silica filler is preferably blended by appropriately adjusting the physical properties such as the particle size according to the selected resin of the adhesive layer and the method of laminating the adhesive layer. For example, when laminating the adhesive layer by a gravure printing method, the particle size of the silica filler is preferably in the range of about 1 μm to 30 μm, more preferably about 5 μm to 15 μm.
また、前記転写箔フィルム形成工程にあって、前記受像層と前記接着層との間に前記受像層および前記接着層よりもガラス転移温度が高く、かつ、硬度が高い材料を用いた少なくとも１層以上の中間層を設けてもよい。中間層を設けることにより、接着層が熱溶融しカード基材と接着する＜熱転写工程＞において、カード基材表面の凹凸が最終的に製造されるカードの表面に反映されること抑制することが出来、カード表面の平滑性を向上させることが出来る。なお、中間層はカード基材の表面が平滑であれば必ずしも設ける必要はない。 Further, in the transfer foil film forming step, at least one layer using a material having a glass transition temperature higher than the image receiving layer and the adhesive layer and having a high hardness between the image receiving layer and the adhesive layer. The above intermediate layer may be provided. By providing the intermediate layer, in the <thermal transfer step> in which the adhesive layer is thermally melted and bonded to the card base, it is possible to suppress the irregularities on the surface of the card base from being reflected on the surface of the finally manufactured card. The smoothness of the card surface can be improved. The intermediate layer is not necessarily provided as long as the surface of the card base is smooth.
中間層は、受像層および接着層にて選択した材料よりもガラス転移温度が高く、かつ、硬度が高い材料を用いる。例えば、中間層として、熱可塑性アクリル樹脂、アクリル系紫外線硬化樹脂、などを用いてもよい。 For the intermediate layer, a material having a glass transition temperature higher than that of the material selected in the image receiving layer and the adhesive layer and a higher hardness is used. For example, a thermoplastic acrylic resin, an acrylic ultraviolet curable resin, or the like may be used as the intermediate layer.
基材フィルムに、受像層、接着層、中間層、などを積層する方法としては、適宜公知の塗工方法を用いてよい。例えば、グラビア印刷、マイクログラビア印刷、ロールコート、コンマコート、ダイコート、カーテンコート、などを用いて積層してよい。 As a method of laminating an image receiving layer, an adhesive layer, an intermediate layer, and the like on the base film, a known coating method may be appropriately used. For example, gravure printing, micro gravure printing, roll coating, comma coating, die coating, curtain coating, etc. may be used for lamination.
＜熱転写工程＞
次に、カード基材と前記転写箔フィルムとを接触し、加熱し、熱転写する。
<Thermal transfer process>
Next, the card substrate and the transfer foil film are contacted, heated, and thermally transferred.
カード基材は、仕様・用途などに適した材料を適宜公知の材料から選択して用いてよい。例えば、ポリ塩化ビニル（ＰＶＣ）、ＰＥＴ−Ｇ、ポリ乳酸、紙系の材料、などが挙げられる。特に、紙系の材料は、環境負荷の少ない材料であり好ましい。 As the card base material, a material suitable for the specification and application may be appropriately selected from known materials. For example, polyvinyl chloride (PVC), PET-G, polylactic acid, paper-based materials, and the like can be given. In particular, a paper-based material is preferable because it is a material with a low environmental load.
紙系の材料は、パルプ繊維を主成分とする。例えば、木材、草、藁、竹、などを主原料としたパルプ繊維を主成分としてもよい。特に、木材は調達が容易でありコスト面からパルプ繊維の主原料として好ましい。また、紙系の材料は、パルプ繊維を細かくしてサイズプレスされた上質紙程度の品質があることが好ましい。 The paper-based material is mainly composed of pulp fibers. For example, pulp fibers made mainly of wood, grass, firewood, bamboo, etc. may be the main component. In particular, timber is easy to procure and is preferable as a main raw material for pulp fibers from the viewpoint of cost. Moreover, it is preferable that the paper-based material has a quality equivalent to that of high-quality paper obtained by size-pulverizing pulp fibers.
従来、紙系の材料を用いたカードは、１）紙系の材料は、表面が多孔質であり凹凸があり粗いため、充分に平滑とするには塗布する樹脂膜厚を厚くする必要がある、２）紙系の材料の内部へ樹脂が浸透する、などの理由から、充分な平滑性を得ることは困難であった。
しかしながら、本発明のカード製造方法によれば、「パルプ繊維を主成分とした紙系の材料」であっても充分なカード表面の平滑性を得ることが出来る。ここで、「パルプ繊維を主成分とした紙系の材料」において主成分とは、パルプ繊維がカード基材全体に対し９０重量％以上を占めることをいう。
Conventionally, cards using paper-based materials are 1) Paper-based materials have a porous surface and are uneven and rough, so it is necessary to increase the thickness of the resin film to be applied in order to be sufficiently smooth 2) It was difficult to obtain sufficient smoothness because the resin penetrated into the paper-based material.
However, according to the card manufacturing method of the present invention, sufficient smoothness of the card surface can be obtained even with a “paper-based material mainly composed of pulp fibers”. Here, in the “paper-based material containing pulp fiber as a main component”, the main component means that the pulp fiber occupies 90% by weight or more with respect to the entire card substrate.
また、カード基材は、少なくとも２層以上のパルプ繊維を主成分としたパルプ繊維層を有し、該パルプ繊維層同士に挟まれる位置に非接触型ＩＣインレットを内蔵しているカード基材であることが好ましい。非接触型ＩＣインレットは、ＩＣチップとアンテナとを有するデバイス部位をいう。非接触型ＩＣインレットをパルプ繊維層同士で挟み込むことにより、外部衝撃などから非接触型ＩＣインレットを保護することが出来る。 Further, the card substrate is a card substrate having a pulp fiber layer mainly composed of at least two layers of pulp fibers, and a non-contact type IC inlet built in a position sandwiched between the pulp fiber layers. Preferably there is. A non-contact type IC inlet refers to a device part having an IC chip and an antenna. By sandwiching the non-contact type IC inlet between the pulp fiber layers, the non-contact type IC inlet can be protected from an external impact or the like.
パルプ繊維層同士に挟まれる位置に非接触型ＩＣインレットを内蔵する場合、パルプ繊維層に非接触型ＩＣインレットを保持する凹部を形成し、パルプ繊維層同士をホットメルト接着剤にて接着する。ホットメルト接着剤としては、例えば、ポリエチレン、ポリエステル、ポリウレタンなどを用いてよい。 When a non-contact type IC inlet is built in a position sandwiched between pulp fiber layers, a concave portion for holding the non-contact type IC inlet is formed in the pulp fiber layer, and the pulp fiber layers are bonded to each other with a hot melt adhesive. As the hot melt adhesive, for example, polyethylene, polyester, polyurethane or the like may be used.
また、カード基材に転写箔フィルムを熱転写するにあたり、１）カード基材の片面に転写箔フィルムを熱転写、２）カード基材の両面に熱転写、のいずれを行ってもよい。 Moreover, in thermally transferring the transfer foil film to the card substrate, either 1) thermal transfer of the transfer foil film to one side of the card substrate or 2) thermal transfer to both sides of the card substrate may be performed.
＜剥離工程＞
前記転写箔フィルムが熱転写されたカード基材から、基材フィルムを剥離する。
以上より、本発明のカード製造方法を実施し、カードを製造することが出来る。
<Peeling process>
The base film is peeled from the card base material on which the transfer foil film is thermally transferred.
From the above, the card manufacturing method of the present invention can be carried out to manufacture a card.
図１に、本発明のカード製造方法の具体的な実施の一例を概略工程図にて示す。
図１（ａ）では＜熱転写工程＞、図１（ｂ）では＜剥離工程＞の概略を示す。
FIG. 1 is a schematic process diagram showing an example of a specific implementation of the card manufacturing method of the present invention.
FIG. 1A shows an outline of the <thermal transfer step>, and FIG. 1B shows an outline of the <peeling step>.
図１（ａ）では、ホットメルト接着剤８を塗布したパルプ繊維層７同士を対向して配置し、片面のパルプ繊維層７にはＩＣチップ１１を保持する凹部を形成し、パルプ繊維層７同士に挟まれた部位にアンテナシート１０およびＩＣチップ１１を配置し、カード基材１３としている。また、基材フィルム９に受像層４、中間層５、接着層６をこの順で積層し転写箔フィルム１２とし、カード基材１３を挟むように両面に転写箔フィルム１２配置し、転写箔フィルム１２の両面から熱プレスを行う＜熱転写工程＞を示している。 In FIG. 1A, the pulp fiber layers 7 coated with the hot melt adhesive 8 are arranged to face each other, and a concave portion for holding the IC chip 11 is formed in the pulp fiber layer 7 on one side. The antenna sheet 10 and the IC chip 11 are arranged at a portion sandwiched between each other to form a card substrate 13. Further, the image receiving layer 4, the intermediate layer 5, and the adhesive layer 6 are laminated on the base film 9 in this order to form a transfer foil film 12, and the transfer foil film 12 is arranged on both sides so as to sandwich the card base material 13. 12 shows a <thermal transfer step> in which hot pressing is performed from both sides.
図１（ｂ）では、図１（ａ）での熱転写後、最外表面の基材フィルム９を剥離し、受像層４を表出させ、本発明のカード１を得る＜剥離工程＞を示している。 FIG. 1B shows a <peeling step> in which the base film 9 on the outermost surface is peeled off after the thermal transfer in FIG. 1A to expose the image receiving layer 4 to obtain the card 1 of the present invention. ing.
本発明のカード製造方法によって製造されたカード優れた平滑性を備える。このため、好適にカード表面に印刷を施すことが出来る。具体的には、例えば、従来のスクリーン印刷の直接塗布による平滑化の場合、３０μｍ厚以上必要とするところ、５μｍ以上１０μｍ以下程度の接着厚みでも十分平滑な表面が得られるようになった。 The card manufactured by the card manufacturing method of the present invention has excellent smoothness. For this reason, printing can be suitably performed on the card surface. Specifically, for example, in the case of smoothing by direct application of conventional screen printing, a thickness of 30 μm or more is required, but a sufficiently smooth surface can be obtained even with an adhesive thickness of about 5 μm to 10 μm.
また、カード表面に図柄などを描画する場合、印刷方法としては適宜公知の印刷方法を用いて行ってよい。例えば、１）熱溶融転写方式、２）昇華リボンから直接カード上へ印字させる直接昇華方式、３）昇華リボンを中間転写箔へ印字後、その転写箔をカードへ転写する間接転写方式、などの印刷方法が挙げられる。 Moreover, when drawing a pattern etc. on the card | curd surface, you may carry out using a well-known printing method suitably as a printing method. For example, 1) a hot melt transfer method, 2) a direct sublimation method for printing directly on a card from a sublimation ribbon, and 3) an indirect transfer method for printing the sublimation ribbon on an intermediate transfer foil and then transferring the transfer foil to a card. The printing method is mentioned.
特に、直接昇華方式は、簡便に写真などのフルカラー画像をカード上へ好適に形成することができるが、他の方式よりもより平滑性を必要とすることが知られている。このため、従来の紙系の材料を用いたカードは、平滑性、接着性および受像性の点から直接昇華方式に用いるのは不適合であった。
本発明のカード製造方法によれば、カード基材にパルプ繊維を主成分とした紙系の材料を用いたカードであっても、直接昇華方式が必要とする平滑性を備えたカードを製造することが出来る。ここで、一般的に「直接昇華方式が必要とする平滑性」は、算術平均粗さＲａが、５ｎｍ≦Ｒａ≦５００ｎｍ程度の範囲、より好ましくは１０ｎｍ≦Ｒａ≦１００ｎｍ程度の範囲である。また、「パルプ繊維を主成分とした紙系の材料」において主成分とは、パルプ繊維がカード基材全体に対し９０重量％以上を占めることをいう。
よって、本発明を利用することで、環境負荷の少ない自然由来材料を使用し、かつ、工程コスト及び材料コストの安い直接昇華方式に対応可能な紙製カードを提供することができる。
In particular, the direct sublimation method can conveniently form a full color image such as a photograph on a card, but is known to require smoothness more than other methods. For this reason, the card | curd using the conventional paper-type material was unsuitable for using for a direct sublimation system from the point of smoothness, adhesiveness, and image receiving property.
According to the card manufacturing method of the present invention, a card having the smoothness required by the direct sublimation method is manufactured even if the card base material is a paper-based material mainly composed of pulp fibers. I can do it. Here, the “smoothness required by the direct sublimation method” is generally such that the arithmetic average roughness Ra is in the range of about 5 nm ≦ Ra ≦ 500 nm, more preferably in the range of about 10 nm ≦ Ra ≦ 100 nm. In the “paper-based material containing pulp fibers as a main component”, the main component means that the pulp fibers occupy 90% by weight or more with respect to the entire card substrate.
Therefore, by using the present invention, it is possible to provide a paper card that uses a naturally-derived material with a low environmental load and can be used for a direct sublimation method with low process costs and low material costs.
図２に、本発明のカードの具体的な一例を示す。
図２（ａ）は概略上面図であり、図２（ｂ）は図２（ａ）におけるＡの線で示す部位における断面概略図である。
FIG. 2 shows a specific example of the card of the present invention.
2A is a schematic top view, and FIG. 2B is a schematic cross-sectional view taken along a line A in FIG. 2A.
図２（ａ）では、アンテナシート２およびＩＣチップ３が内蔵されたカード１を示す。 FIG. 2A shows a card 1 in which an antenna sheet 2 and an IC chip 3 are built.
図２（ｂ）では、受像層４、中間層５、接着層６、パルプ繊維層７、が外面側から積層され、パルプ繊維層７同士を挟んでアンテナシート１０およびＩＣチップ１１を配置し、パルプ繊維層７同士をホットメルト接着剤８で接着した構造を示す。 In FIG.2 (b), the image receiving layer 4, the intermediate | middle layer 5, the contact bonding layer 6, and the pulp fiber layer 7 are laminated | stacked from the outer surface side, the antenna sheet 10 and the IC chip 11 are arrange | positioned on both sides of the pulp fiber layer 7, A structure in which pulp fiber layers 7 are bonded to each other with a hot-melt adhesive 8 is shown.
＜実施例１＞
まず、基材フィルムに、受像インキを塗布し受像層、中間インキを塗布し中間層、接着インキを塗布し接着層、をこの順で積層し、転写箔フィルムを得た。
このとき、基材フィルムとして、東レ製ＰＥＴフィルムＴ６０（厚み：２５μｍ、表面粗さＲａ：６ｎｍ）を用いた。
また、受像層の厚みはドライ１．０μｍ厚であった。
また、中間層の厚みはドライ２．０μｍ厚であった。
また、接着層の厚みはドライ１０．０μｍ厚であった。
本実施例１における受像インキ、中間インキ、接着インキの組成を以下に示す。
<Example 1>
First, the image receiving ink was applied to the base film, the image receiving layer, the intermediate ink was applied, the intermediate layer, the adhesive ink was applied, and the adhesive layer was laminated in this order to obtain a transfer foil film.
At this time, Toray PET film T60 (thickness: 25 μm, surface roughness Ra: 6 nm) was used as the base film.
The thickness of the image receiving layer was 1.0 μm dry.
The intermediate layer had a dry thickness of 2.0 μm.
The adhesive layer had a dry thickness of 10.0 μm.
The composition of the image receiving ink, intermediate ink and adhesive ink in Example 1 is shown below.
（受像インキ：実施例１）
新第一塩ビ製塩化ビニル樹脂（ＺＥＳＴ１０００Ｚ）：１０重量部
東洋インキ製造製ポリエチレンワックス１５重量％分散液（添加剤１８０）：１０重量部
テトラヒドロフラン：１００重量部
(Image receiving ink: Example 1)
New first vinyl chloride resin made of polyvinyl chloride (ZEST1000Z): 10 parts by weight Polyethylene wax manufactured by Toyo Ink Co., Ltd. 15% by weight dispersion (additive 180): 10 parts by weight Tetrahydrofuran: 100 parts by weight
（中間インキ：実施例１）
三菱レイヨン製ダイヤナールＢＲ８７：１０重量部
メチルエチルケトン：５０重量部
トルエン：５０重量部
(Intermediate ink: Example 1)
Mitsubishi Rayon Dianal BR87: 10 parts by weight Methyl ethyl ketone: 50 parts by weight Toluene: 50 parts by weight
（接着インキ：実施例１）
東洋紡績製ポリエステル（バイロン２４０）：２０重量部
富士シリシア製シリカ（サイロホービック４００４）：２重量部
メチルエチルケトン：５０重量部
トルエン：５０重量部
(Adhesive ink: Example 1)
Polyester manufactured by Toyobo (Byron 240): 20 parts by weight Silica manufactured by Fuji Silysia (Silo Hovic 4004): 2 parts by weight Methyl ethyl ketone: 50 parts by weight Toluene: 50 parts by weight
次に、パルプ繊維層の片面にＩＣチップを保持する凹部を設け、ＩＣチップおよびアンテナシートをパルプ繊維層同士に挟まるように配置し、基材シートを得た。
このとき、パルプ繊維層として、ポリエチレンコートしてあるケント紙（連重２６５ｋｇ）を用いた。
Next, a concave portion for holding the IC chip was provided on one side of the pulp fiber layer, and the IC chip and the antenna sheet were arranged so as to be sandwiched between the pulp fiber layers to obtain a base sheet.
At this time, as a pulp fiber layer, polyethylene-coated Kent paper (continuous weight: 265 kg) was used.
次に、上述した基材シートの両面に、上述した転写箔フィルムを重ね合わせ、両面の転写箔フィルムから熱プレスを行った。
このとき、熱プレスは、５０ｋｇｆ／ｃｍ２の圧力、温度１４０℃、３０分間保持、の条件で行った。
Next, the above-mentioned transfer foil film was superimposed on both surfaces of the above-mentioned base material sheet, and hot pressing was performed from the transfer foil films on both sides.
At this time, the hot press was performed under the conditions of a pressure of 50 kgf / cm 2 , a temperature of 140 ° C., and holding for 30 minutes.
次に、両面の転写箔フィルムから基材フィルムを剥離した。 Next, the base film was peeled from the transfer foil films on both sides.
次に、ＩＳＯ規格のカードに沿うように、所定の打ち抜き機でトリミングし、本発明のカードを得た。このとき、製造されたカードの表面粗さＲａは２０ｎｍであった。 Next, the card of the present invention was obtained by trimming with a predetermined punching machine so as to follow the ISO standard card. At this time, the surface roughness Ra of the manufactured card was 20 nm.
実施例１にて製造したカードを直接昇華プリンターＣＰ１７５０（凸版印刷株式会社製）で印字したところ、発色良く、印字されたことを目視観察にて確認した。 When the card manufactured in Example 1 was directly printed with a sublimation printer CP1750 (manufactured by Toppan Printing Co., Ltd.), it was confirmed by visual observation that the color was printed with good color.
＜参考例１＞
まず、パルプ繊維層の片面にＩＣチップを保持する凹部を設け、ＩＣチップおよびアンテナシートをパルプ繊維層同士に挟まるように配置し、基材シートを得た。
このとき、パルプ繊維層として、ポリエチレンコートしてあるケント紙（連重２６５ｋｇ）を用いた。
<Reference Example 1>
First, a concave portion for holding the IC chip was provided on one side of the pulp fiber layer, and the IC chip and the antenna sheet were arranged so as to be sandwiched between the pulp fiber layers to obtain a base sheet.
At this time, as a pulp fiber layer, polyethylene-coated Kent paper (continuous weight: 265 kg) was used.
次に、上述した基材シートの両面に熱プレスを行った。
このとき、熱プレスは、５０ｋｇｆ／ｃｍ２の圧力、温度１４０℃、３０分間保持、の条件で行った。
Next, hot pressing was performed on both surfaces of the base material sheet described above.
At this time, the hot press was performed under the conditions of a pressure of 50 kgf / cm 2 , a temperature of 140 ° C., and holding for 30 minutes.
次に、基材シートの両面にスクリーン印刷を用いて受像インキを３回塗布し、受像層を形成した。
このとき、受像層の厚みはドライ２０μｍ厚であった。
参考例１における受像インキの組成を以下に示す。
Next, image receiving ink was applied three times on both surfaces of the base sheet using screen printing to form an image receiving layer.
At this time, the thickness of the image receiving layer was 20 μm dry.
The composition of the image receiving ink in Reference Example 1 is shown below.
（受像インキ：参考例１）
日信化学製塩酢ビ（ソルバインＣＮ）：２５重量部
富士シリシア製シリカ（サイロホービック４００４）：３重量部
東洋インキ製造製ポリエチレンワックス１５重量％分散液（添加剤１８０）：２５重量部
シクロヘキサノン：５０重量部
キシレン：５０重量部
(Image receiving ink: Reference Example 1)
Nishin Chemical's PVC (Solvine CN): 25 parts by weight Fuji Silysia Silica (Silo Hovic 4004): 3 parts by weight Polyethylene wax 15% by weight manufactured by Toyo Ink (additive 180): 25 parts by weight cyclohexanone: 50 parts by weight xylene: 50 parts by weight
次に、受像層を塗布した基材シートを鏡面ステンレス板で挟みこみ、熱プレスを行った。
このとき、熱プレスは、５０ｋｇｆ／ｃｍ２の圧力、温度１４０℃、３０分間保持、の条件で行った。
Next, the base sheet coated with the image receiving layer was sandwiched between mirror surface stainless steel plates and subjected to hot pressing.
At this time, the hot press was performed under the conditions of a pressure of 50 kgf / cm 2 , a temperature of 140 ° C., and holding for 30 minutes.
次に、ＩＳＯ規格のカードに沿うように、所定の打ち抜き機でトリミングし、カードを得た。 Next, the card was obtained by trimming with a predetermined punching machine so as to follow the ISO standard card.
参考例１にて製造したカードを直接昇華プリンターＣＰ１７５０（凸版印刷株式会社製）で印字したところ、表面の平滑性が悪いため白抜けが多発し、貼り付き欠陥も全体に見られた。 When the card manufactured in Reference Example 1 was directly printed with a sublimation printer CP1750 (manufactured by Toppan Printing Co., Ltd.), the surface smoothness was poor, so that white spots occurred frequently, and sticking defects were also observed throughout.
１……カード
２……アンテナシート
３……ＩＣチップ
４……受像層
５……中間層
６……接着層
７……パルプ繊維層
８……ホットメルト接着剤
９……基材フィルム
１０……アンテナシート
１１……ＩＣチップ
１２……転写箔フィルム
１３……カード基材
DESCRIPTION OF SYMBOLS 1 ... Card 2 ... Antenna sheet 3 ... IC chip 4 ... Image-receiving layer 5 ... Intermediate layer 6 ... Adhesive layer 7 ... Pulp fiber layer 8 ... Hot melt adhesive 9 ... Base film 10 ... ... Antenna sheet 11 ... IC chip 12 ... Transfer foil film 13 ... Card substrate
Claims (7)
カード基材と前記転写箔フィルムとを接触し、加熱し、熱転写する熱転写工程と、
前記転写箔フィルムが熱転写されたカード基材から、基材フィルムを剥離する剥離工程と、
を備えたことを特徴とするカード製造方法。 A transfer foil film forming step of laminating an image receiving layer on the base film, laminating an adhesive layer on top of the image receiving layer, and forming a transfer foil film;
A thermal transfer step in which the card substrate and the transfer foil film are contacted, heated, and thermally transferred;
From the card substrate on which the transfer foil film is thermally transferred, a peeling step for peeling the base film,
A card manufacturing method comprising:
前記中間層は、前記受像層および前記接着層よりもガラス転移温度が高く、かつ、硬度が高い材料を用いること
を特徴とする請求項１に記載のカード製造方法。 In the transfer foil film forming step, at least one intermediate layer is laminated between the image receiving layer and the adhesive layer,
2. The card manufacturing method according to claim 1, wherein the intermediate layer is made of a material having a glass transition temperature higher than that of the image receiving layer and the adhesive layer and higher hardness.
を特徴とする請求項１または２のいずれかに記載のカード製造方法。 The adhesive layer is an adhesive layer formed using a material containing a resin and containing a porous silica filler in an amount of 5 wt% to 20 wt% based on the resin content. Or the card manufacturing method in any one of 2.
を特徴とする請求項１から３のいずれかに記載のカード製造方法。 The image receiving layer contains a resin and contains 2 to 15% by weight of polyethylene wax with respect to the resin content, and the resin is mainly composed of vinyl chloride resin or vinyl chloride vinyl acetate copolymer resin. The card manufacturing method according to any one of claims 1 to 3, wherein the card receiving layer is formed using a resin material.
を特徴とする請求項１から４のいずれかに記載のカード製造方法。 The card substrate is a card substrate having a pulp fiber layer composed mainly of at least two or more layers of pulp fibers and having a non-contact IC inlet built in a position sandwiched between the pulp fiber layers. The card manufacturing method according to any one of claims 1 to 4, wherein:
前記カード基材上に積層された接着層と、
前記接着層より外面側に積層された受像層と、を備え、
前記カード基材は、パルプ繊維を主成分としたパルプ繊維層を有するカード基材であり、
前記接着層は、樹脂を含み、該樹脂分に対して５重量％以上２０重量％以下の多孔質シリカフィラーを含有する材料を用いて形成された接着層であり、
前記受像層は、樹脂を含み、該樹脂分に対して２重量％以上１５重量％以下のポリエチレンワックスを含有し、該樹脂は、塩化ビニル樹脂または塩化ビニル酢酸ビニル共重合樹脂を主成分とする樹脂である材料を用いて形成された受像層であり、
前記受像層表面の算術平均粗さＲａは、５ｎｍ≦Ｒａ≦５００ｎｍの範囲にあること
を特徴とするカード。 A card substrate;
An adhesive layer laminated on the card substrate;
An image receiving layer laminated on the outer surface side from the adhesive layer,
The card substrate is a card substrate having a pulp fiber layer mainly composed of pulp fibers,
The adhesive layer is an adhesive layer formed using a material containing a resin and containing 5% by weight or more and 20% by weight or less porous silica filler with respect to the resin content;
The image receiving layer contains a resin and contains 2 to 15% by weight of polyethylene wax with respect to the resin content, and the resin is mainly composed of vinyl chloride resin or vinyl chloride vinyl acetate copolymer resin. An image receiving layer formed using a resin material,
The arithmetic average roughness Ra of the image receiving layer surface is in a range of 5 nm ≦ Ra ≦ 500 nm.
前記受像層上に積層された印刷層と、を備え、
前記印刷層は直接昇華により形成された印刷層であること
を特徴とする請求項６に記載のカード。 Furthermore,
A printed layer laminated on the image receiving layer,
The card according to claim 6, wherein the print layer is a print layer formed by direct sublimation.
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| JP2011093031A JP5810600B2 (en) | 2011-04-19 | 2011-04-19 | Card manufacturing method |
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| JP2011093031A JP5810600B2 (en) | 2011-04-19 | 2011-04-19 | Card manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019064143A (en) * | 2017-09-29 | 2019-04-25 | 大日本印刷株式会社 | Laminated body and card manufactured using the same |
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| JP7008274B2 (en) | 2017-09-29 | 2022-01-25 | 大日本印刷株式会社 | Laminates and cards made using them |
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| JP5810600B2 (en) | 2015-11-11 |
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