JP2012208799A - Non-contact type information medium and non-contact type information medium attached booklet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact type information medium structured especially to suppress decomposition using heat and unauthorized reuse in order to improve the false alternation preventing function of the non-contact type information medium.SOLUTION: A non-contact type information medium is configured such that the adhesive force of an adhesive layer 14 between a conductor 12 patterned so as to be used as an antenna and an antenna base material sheet 11 is smaller than the adhesive force of an adhesive layer 23 between the conductor 12 and an exterior base material 21, and/or that the adhesive force of an adhesive layer 15 between a conductor 13 patterned so as to be used as a jumper line and the antenna base material sheet 11 is smaller than the adhesive force of an adhesive layer 24 between the conductor 13 and an exterior base material 22.

Description

  The present invention relates to a non-contact type information medium that includes an antenna coil and an IC chip and can record information on the IC chip in a non-contact manner, and particularly has a function of preventing alteration using heat. Type information media.

  In recent years, systems using non-contact IC cards and non-contact IC tags have been widely used. A non-contact type information medium that has a card shape by sandwiching an IC inlet consisting of a non-contact IC chip and an antenna connected to it with an exterior base material is used as an ID card for the purpose of identifying an individual such as a driver's license or employee ID card. ing. Electronic passports are also widespread, and recent passports have the non-contact type information medium bound between booklet pages or a non-contact type information medium sandwiched between cover cloth and internal paper. Is used. These features include the ability to refer to data such as printed face photos and names at the time of normal authentication, and in some cases to read and refer to IC chip data. You can do it.

There are various methods for producing a non-contact type information medium. For example, as in Patent Document 1, a resin sheet is laminated as an exterior base material on both sides of an IC inlet to which an IC chip and an antenna are connected, and hot pressure is applied. There is a glued one. In addition, as a bonding method, there are cases where the exterior base sheet itself is melted by heat, or a thermoplastic adhesive is applied to the exterior base sheet and then heated and bonded, but heat treatment is applied. Therefore, smoothing is often performed at the same time.

A personal authentication medium using such a non-contact type information medium is always subject to falsification. Taking an electronic passport that is a booklet with a non-contact information medium as an example, many counterfeits and alterations have been reported, and in order to prevent these counterfeits, it is possible to add a counterfeit prevention function to the booklet. It is done. In order to prevent forgery of booklets, commonly used anti-counterfeiting techniques can be used, such as ink (OVI) whose color changes depending on the viewing angle, UV fluorescent ink that reacts to UV light, etc. , Printing a special fluorescent thread on the paper itself, and inserting a security thread. In recent years, for example, printing of infrared absorbing ink having an absorption peak at a special wavelength has been performed in order to discriminate falsification by machine detection.

In addition, taking a personal authentication medium such as an ID card as an example, in order to prevent alteration of personal information such as names and face photos, for example, a hologram film is laminated, or personal information is obtained by laser engraving. Or recorded.

However, as described above, in personal authentication media such as booklets and ID cards with attached non-contact information media, although measures against alteration of the personal information recording part have been made, the non-contact information media itself is not limited to cards or No measures were taken to remove it from the booklet. For example, it is difficult to alter only the face photo of an ID card with an IC chip and an antenna sandwiched between them, but the ID card is separated into an exterior base material and an IC inlet, and the IC inlet is sandwiched between different base materials. There is a risk of forgery such as creating a new face photo. In addition, as described above, such a non-contact type information medium is mainly manufactured by a heat laminating method. Therefore, it is easy to separate the exterior base material by applying heat in the same manner. There is a problem that the antenna and the IC chip can be taken out without impairing the function.

Japanese Patent No. 4442094

  The present invention solves the problems of the prior art, and in order to improve the function of preventing forgery and alteration of a non-contact type information medium, in particular, it has a structure that suppresses decomposition using heat and unauthorized reuse. It is an object to provide a contact information medium.

As means for solving the above problems, claim 1 of the present invention comprises at least an IC chip and an antenna connected to the IC chip and capable of communicating with an external communication device in a contactless manner.
Produced by laminating an IC inlet composed of an antenna base sheet for mounting the IC chip and forming the antenna on the surface thereof, and an exterior base material for adhering to the front and back surfaces of the IC inlet Non-contact information medium,
A patterned conductor for use as an antenna is formed on one surface of the IC inlet via a thermoplastic adhesive layer A, and the same surface as the thermoplastic adhesive layer A is formed on the other surface. Patterned conductors are formed for use as antenna jumper wires through the material's thermoplastic adhesive layer,
A thermoplastic adhesive layer B different from the thermoplastic adhesive layer A is formed on the side facing the IC inlet of each of the two exterior substrates to be attached to the front and back surfaces of the IC inlet. And
The adhesive strength between the patterned conductor a for use as the antenna and the antenna base sheet is smaller than the adhesive strength between the conductor a and the exterior base material and / or used as the jumper wire. The non-contact type information medium is characterized in that the adhesive strength between the patterned conductor b and the antenna base sheet is smaller than the adhesive strength between the conductor b and the exterior base material.

  A second aspect of the present invention is the non-contact type information medium according to the first aspect, wherein a porous thermoplastic sheet is used as the exterior base material.

  The third aspect is the non-contact type information medium according to the first or second aspect, wherein photolithography is used as a method for forming the patterned conductor.

  According to a fourth aspect of the present invention, the non-contact type information medium according to any one of the first to third aspects is sandwiched and bonded between a cover member of a booklet and an inner sheet. It is a booklet attached to a non-contact information medium.

  According to the first aspect of the invention, if an attempt is made to separate the contactless information medium of the present invention into an exterior base material and an antenna base material sheet, the adhesive strength between the antenna coil and the exterior base material is Since it is higher than the adhesive strength of the antenna base material, the antenna is separated from the antenna base material while being adhered to the exterior base material side. As a result, the connection between the antenna coil and the jumper wire of the antenna is disconnected, and the function as a non-contact information medium is lost. Therefore, unauthorized reuse and alteration can be prevented. In addition, illegal reuse can be prevented by providing similar characteristics with respect to the jumper wire of the antenna provided on the opposite side of the antenna substrate.

According to a second aspect of the present invention, the present invention relates to a non-contact information medium characterized in that a porous thermoplastic sheet provided with a thermoplastic adhesive is used as an exterior base material. The thermoplastic adhesive used in such a configuration has a tendency that the adhesive strength is lowered by heating. Therefore, the adhesive strength between the antenna coil and the antenna base sheet is more than the adhesive strength between the antenna coil and the exterior base material. Can also prevent unauthorized reuse.

It is a conceptual diagram of the top view explaining an example of the IC inlet used for the non-contact type information medium of the present invention. It is the conceptual diagram of the cross section of IC inlet along the cut surface A of FIG. 1, and its partial enlarged view. It is the conceptual diagram which showed an example of the cross section of the stage of a process in order to demonstrate the manufacturing method of the non-contact-type information medium of this invention. It is a conceptual diagram of the section which shows one example of the non-contact type information medium of the present invention. It is a conceptual diagram of a cross section showing a state in which the anti-deformation effect of the non-contact type information medium of the present invention is exhibited.

  The best mode for carrying out the present invention will be described below in detail with reference to the drawings.

The non-contact type information medium of the present invention comprises an IC inlet 10 and an exterior base material. As shown in FIGS. 1 and 2, the IC inlet 10 includes an antenna sheet and an IC in which an antenna coil 12 is formed on one surface of an antenna base sheet 11 and an antenna jumper wire 13 is formed on the other surface. The chip 16 is configured, and the IC chip 16 and the antenna coil 12 are connected. The antenna coil 12 can be formed by an etching type or printing type antenna. As shown in claim 4 of the present invention, the antenna coil manufactured using the etching method has the highest durability and reliability. Therefore, it is used a lot. Aluminum and copper are most often used as the material for the antenna coil formed by etching and the jumper wire of the antenna. In the case of a printing type antenna, the antenna is formed by printing ink containing silver or carbon.

Hereinafter, an antenna by an etching method is taken as an example, and this cross section is shown in a partially enlarged view of FIG. As the antenna base sheet 11, a plastic film such as PET or PEN is often used. A metal thin film is formed on these substrates by plating, vapor deposition, bonding, or the like. In the partially enlarged view of FIG. 2, a metal film is formed by a bonding method. This is based on a metal foil such as aluminum or copper having a thickness of about 20 μm to 40 μm via an adhesive. This is a manufacturing method to be applied on a material.

The antenna coil 12 is formed by printing a resin in a necessary pattern on the base material with the metal foil thus obtained, and etching the resin as an etching mask. Further, an antenna jumper wire 13 is required on the surface opposite to the surface on which the antenna coil 12 is formed. This is performed by simultaneously providing a metal foil on both surfaces and a printed pattern of a resin on the both surfaces in advance and performing an etching process simultaneously. Alternatively, the antenna coil pattern can be formed on one side and then only the antenna jumper wire 13 is attached. The antenna coil 12 thus obtained is bonded to the antenna base sheet 11 via the antenna coil adhesive layer 14, and the antenna jumper wire 13 is connected to the antenna jumper wire adhesive layer 15. The antenna base sheet 11 is adhered.

For example, a thermoplastic resin sheet such as PVC or PET-G (copolymerized PET) is generally used as the exterior base material, but a porous thermoplastic sheet can also be used. The porous thermoplastic sheet is generally marketed as a resin sheet or a synthetic paper imparted with printability for inkjet or offset. By using such a porous thermoplastic sheet as an antenna base sheet, it becomes possible to form a flexible non-contact type information medium, and this non-contact type information medium can be used as another medium such as a booklet. In the case of bonding together, it is possible to obtain good adhesiveness with the adhesive, which is a method with excellent workability.

When the above-described porous thermoplastic sheet is used as the antenna substrate sheet 11, two exterior substrates (exterior substrate (antenna coil side) 21 and exterior substrate (antenna jumper wire) are used as shown in FIG. Side) 22), the thermoplastic adhesive layer (the thermoplastic adhesive layer (antenna coil side) 23 and the thermoplastic adhesive layer (antenna jumper wire side) 24) is applied in advance to the inner part to be bonded. A non-contact type information medium as shown in FIG. 4 can be obtained by laminating the IC inlets 10 and bonding them by applying hot pressure B. The thermoplastic adhesive layer (antenna coil side) 23 and the thermoplastic adhesive layer (antenna jumper wire side) 24 that can be used here are an ethylene-vinyl acetate copolymer system, an ethylene-methacrylic acid copolymer system, and a polyester system. Various general thermoplastic resins such as acrylic resins, nylon resins, polyamide resins, polyurethane resins, and polyolefin resins can be used.

Among these, a resin that forms a coating film that is particularly resistant to moisture and suppresses permeation of oxygen and chloride ions, and a resin that deteriorates due to heat and humidity and does not peel off at the bonded portion are used. In order to achieve both of these performances, two or more kinds of resins can be mixed or applied to two layers. In addition, from the viewpoint of the post-process and workability, coating is easy, blocking after drying is less likely to occur, and highly durable ones are suitable for use. For example, it is possible to obtain suitable performance by coating an ethylene-methacrylic acid copolymer aqueous emulsion adhesive with an epoxy crosslinking agent, or applying a polyolefin or acrylic adhesive with a gravure coater. I can do it. On the other hand, in general, a polyester-based adhesive may be hydrolyzed by humidity, and an ethylene-vinyl acetate copolymer-based adhesive is likely to deteriorate over time, so care must be taken.

The non-contact type information medium-attached booklet is a non-contact type information medium that is processed into a booklet shape by sandwiching and bonding the non-contact type information medium between a cover member and an inner sheet. The non-contact type information medium is bonded to the inner sheet by an adhesive, and this adhesive often uses a water-based emulsion adhesive from the viewpoint of workability and environment. The reason for this is that equipment for producing a general booklet often performs bonding of paper and paper or cloth and paper. If the non-contact type information medium used for the booklet attached to the non-contact type information medium is produced using an exterior base material such as PVC or PET-G used for general IC cards, existing equipment and adhesion In addition, the inner sheet cannot be bonded with the agent, and there is a problem that the rigidity is high. In order to solve such a problem, by using the porous thermoplastic substrate sheet according to claim 3 as an exterior substrate, various types of adhesives and good adhesion are shown, and there are no irregularities. A flexible non-contact information medium-attached booklet can be produced.

  When bonding the non-contact type information medium and the cover member, a reaction curable adhesive with a small volume change can be suitably used. If a dry-curing type adhesive with a large volume change is used, assuming that a part of the non-contact information medium is recessed, the amount of adhesive used increases, so the volume decrease after dry-curing increases. Since a dent is generated on the outside of the cover member, this is a problem in appearance. In order to solve such a problem, it is desirable to use an adhesive having a small volume change after drying and curing. For example, a two-component mixed epoxy adhesive, a moisture curable silicone adhesive, a one-component curable urethane adhesive, and the like can be suitably used. In addition, various hot melt adhesives such as an ethylene-vinyl acetate copolymer system, an ethylene-methacrylic acid copolymer, a polyester series, a polyamide series, a polyurethane series, and a polyolefin series can be used.

An object of the present invention is to prevent an act of forging an ID card or an electronic passport by disassembling the non-contact type information medium, taking out an IC chip or an antenna, and sandwiching it in another base material. Hereinafter, FIG. 4 will be described as an example. This FIG. 4 shows a thermoplastic adhesive layer (antenna coil side) 23 on an exterior base material (antenna coil side) 21 and an exterior base material (antenna jumper wire side) 22. And a thermoplastic adhesive layer (antenna jumper wire side) 24 are applied as an example. If the exterior base material itself has adhesiveness, the thermoplastic adhesive layer is not necessary. In some cases, the thermoplastic adhesive layer portion may be read as an adhesive portion between the exterior substrate and the antenna. Similarly, the antenna coil 12 and the antenna jumper wire 13 are bonded to the antenna substrate sheet 11 via the antenna coil adhesive layer 14 and the antenna jumper wire adhesive layer 15. When the is formed, the adhesive layer portion may be read as the adhesive portion between the antenna coil and the antenna base sheet.

In FIG. 4, the antenna coil 12 is bonded to an exterior base material (antenna coil side) 21 via a thermoplastic adhesive layer (antenna coil side) 23, and the antenna base material sheet 11 via an antenna coil adhesive layer 14. Is adhered. If the exterior substrate (antenna coil side) 21 is peeled off and the IC inlet 10 is taken out, the adhesive strength between the antenna coil 12 and the exterior substrate (antenna coil side) 21 is such that the antenna coil 12 and the antenna substrate are bonded. When it is lower than the adhesive strength of the sheet 11, the exterior base material can be removed without impairing the function as a non-contact type information medium. On the other hand, when the adhesive strength between the antenna coil 12 and the exterior base material (antenna coil side) 21 is higher than the adhesive strength between the antenna coil 12 and the antenna base material sheet 11, as shown in FIG. Since it peels off from the antenna substrate sheet 11 while being adhered to the exterior substrate (antenna coil side) 21 and the antenna coil 12 is disconnected, the function as a non-contact information medium is impaired. Can be prevented.

The above effect is the same for the jumper wire 13 of the antenna. When the adhesive strength between the antenna jumper wire 13 and the exterior base material (antenna jumper wire side) 22 is higher than the adhesive strength between the antenna jumper wire 13 and the antenna base material sheet 11, as shown in FIG. Since the wire 13 is peeled off from the antenna substrate sheet 11 while being adhered to the exterior substrate (antenna jumper wire side) 22 and the antenna coil is disconnected, the function as a non-contact information medium is impaired. Can be prevented.

The results of verifying the effects of the invention by preparing two types of samples (Sample 1 and Sample 2) are shown below.
The same EVA adhesive was used as the adhesive for bonding the antenna base sheet and the antenna coil. As the adhesive provided on the exterior base material, the same EVA adhesive was used in Sample 1, and the EAA (ethylene acrylic acid copolymer) adhesive was used in Sample 2. The melting point of the EVA adhesive used here is 110 degrees, and the melting point of the EAA adhesive is 140 degrees.

When a peeling test assuming counterfeiting was performed on the obtained samples 1 and 2, none of the samples could be peeled off at room temperature. Damaged. For this reason, when this sample was heated and peeled, only the exterior substrate could be peeled off in sample 1, whereas in sample 2, the antenna coil peeled off from the antenna substrate sheet and was damaged. . This is because the adhesive strength between the exterior substrate and the antenna coil is higher than the adhesive strength between the antenna coil and the antenna substrate sheet. As a result, it was evaluated that sample 1 was not forgery resistant because sample 1 was able to peel the exterior base material without impairing the communication function, but sample 2 was impaired in the process of peeling work assuming forgery. Therefore, it was possible to evaluate that it has anti-counterfeiting properties. The above results are summarized in Table 1.

Next, an embodiment of the present invention will be described with reference to FIG. 2, FIG. 3, and FIG.
<Production of IC inlet using etching antenna> (see FIG. 2)
A 38 μm polyethylene terephthalate (PET) sheet is used as an antenna base sheet 11, a thermoplastic adhesive is applied to both sides, an aluminum film is bonded, and an antenna coil-shaped etching mask layer is printed on one side. The antenna jumper-shaped etching mask layer was printed on the other surface, and the antenna coil 12 was formed on the front surface and the antenna jumper wire 13 was formed on the rear surface by pattern etching. As the thermoplastic adhesive, one having EVA as a main component and a melting temperature of 110 degrees was used. Further, the antenna coil 12 and the jumper wire 13 of the antenna were joined by laser welding, and the IC chip 16 was welded to the connection terminal portion of the antenna coil 12. The outer circumference of the antenna coil 12 is 80 mm × 48 mm, and the inner circumference is 67 mm × 37 mm. Further, the inside of the antenna coil 12 was removed by punching out with a size of 65 mm × 35 mm. Further, the outer periphery of the antenna coil 12 and the outline 2 mm away from the IC chip 16 were taken, and the antenna base sheet on the outside was punched and removed to obtain the IC inlet 10.

<Production of non-contact type information medium> (see FIG. 3)
A “TESLIN sheet” (manufactured by PPG Industry) having a thickness of 380 μm is prepared as an exterior substrate (antenna coil side) 21 and an exterior substrate (antenna jumper wire side) 22, and a thermoplastic adhesive is provided on one side of the sheet. Was coated with 10 μm and dried, and then cut into two sheets of 150 mm × 200 mm. As the thermoplastic adhesive, one having ethylene acrylic acid as a main component and a melting temperature of 140 degrees was used. The IC inlet 10 is overlaid on the adhesive surface side of one of the exterior substrates prepared above, and the other exterior substrate is laminated with the surface of the adhesive layer facing inward. The sheet was sandwiched between two SUS plates and bonded by heating and pressing. A smooth non-contact type information medium could be obtained by processing under conditions of a heating part temperature of 150 ° C., a pressure of 20 kgf / cm ² and a processing time of 60 seconds.

<Confirmation of effect> (See Fig. 5)
By applying heat at 160 ° C. to the obtained non-contact type information medium, the adhesive layer provided on the exterior base material was softened, and an attempt was made to separate the exterior base material from the IC inlet. By this operation, the exterior substrate (antenna coil side) 21 and the antenna substrate sheet 11 were able to be peeled, but the antenna coil 12 was adhered to the exterior substrate (antenna coil side) 21 side while the antenna substrate sheet was adhered. 11 peeled off. This is because the adhesive strength of the antenna coil 12 and the antenna coil adhesive layer 14 portion of the antenna base sheet 11 is the thermoplastic adhesive layer (antenna coil side) 23 of the antenna coil 12 and the exterior base material (antenna coil side) 21. This is because it was smaller than the adhesive strength. Thus, when the antenna coil 12 peeled from the antenna base sheet 11, the connection between the antenna jumper wire 13 and the antenna coil 12 was also disconnected, and the function as a non-contact information medium was lost. Thereby, unauthorized reuse of the IC inlet 10 can be prevented, and the effect of the invention was confirmed.

10 IC inlet 11 Antenna substrate sheet 12 Antenna coil 13 Jumper wire 14 Antenna coil adhesive layer 15 Antenna jumper wire adhesive layer 16 IC chip 21 Exterior substrate (antenna coil side)
22 ... Exterior substrate (jumper wire side of antenna)
23 ... Thermoplastic adhesive layer (antenna coil side)
24 .. Thermoplastic adhesive layer (antenna jumper wire side)
A ... Section line B ... Hot pressure

Claims (4)

At least with an IC chip,
An antenna connected to the IC chip and capable of communicating without contact with an external communication device;
Produced by laminating an IC inlet composed of an antenna base sheet for mounting the IC chip and forming the antenna on the surface thereof, and an exterior base material for adhering to the front and back surfaces of the IC inlet Non-contact information medium,
A patterned conductor for use as an antenna is formed on one surface of the IC inlet via a thermoplastic adhesive layer A, and the same surface as the thermoplastic adhesive layer A is formed on the other surface. Patterned conductors are formed for use as antenna jumper wires through the material's thermoplastic adhesive layer,
A thermoplastic adhesive layer B different from the thermoplastic adhesive layer A is formed on the side facing the IC inlet of each of the two exterior substrates to be attached to the front and back surfaces of the IC inlet. And
The adhesive strength between the patterned conductor a for use as the antenna and the antenna base sheet is smaller than the adhesive strength between the conductor a and the exterior base material and / or used as the jumper wire. A non-contact type information medium characterized in that an adhesive force between the patterned conductor b and the antenna substrate sheet is smaller than an adhesive force between the conductor b and the exterior substrate.   The non-contact type information medium according to claim 1, wherein a porous thermoplastic sheet is used as an exterior base material.   The non-contact type information medium according to claim 1, wherein photolithography is used as a method for forming the patterned conductor.   The non-contact type information medium according to any one of claims 1 to 3, wherein the non-contact type information medium is attached by being sandwiched and bonded between a cover member of a booklet and an inner sheet. booklet.